TWI484590B - - Google Patents
Info
- Publication number
- TWI484590B TWI484590B TW101143731A TW101143731A TWI484590B TW I484590 B TWI484590 B TW I484590B TW 101143731 A TW101143731 A TW 101143731A TW 101143731 A TW101143731 A TW 101143731A TW I484590 B TWI484590 B TW I484590B
- Authority
- TW
- Taiwan
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110456419.4A CN103187224B (en) | 2011-12-30 | 2011-12-30 | A kind of slide holder for plasma processing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201332054A TW201332054A (en) | 2013-08-01 |
| TWI484590B true TWI484590B (en) | 2015-05-11 |
Family
ID=48678335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101143731A TW201332054A (en) | 2011-12-30 | 2012-11-22 | Substrate sustaining platform for plasma processing apparatus |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103187224B (en) |
| TW (1) | TW201332054A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030085206A1 (en) * | 2001-11-08 | 2003-05-08 | Sumitomo Osaka Cement Co., Ltd. | Susceptor with built-in plasma generation electrode and manufacturing method therefor |
| US20100192542A1 (en) * | 2006-09-14 | 2010-08-05 | Hung Sik Min | Plasma Reactor |
| US20110048683A1 (en) * | 2007-09-28 | 2011-03-03 | Foxconn Technology Co., Ltd. | Heat pipe with composite wick structure |
| US20110121736A1 (en) * | 2008-06-11 | 2011-05-26 | Tokyo Electron Limited | Plasma processing apparatus and plasma processing method |
| US20110309050A1 (en) * | 2009-02-06 | 2011-12-22 | Canon Anelva Corporation | Plasma processing device, plasma processing method and method of manufacturing element including substrate to be processed |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100495654C (en) * | 2003-02-03 | 2009-06-03 | 日本奥特克株式会社 | Plasma processing apparatus, electrode plate for plasma processing apparatus, and electrode plate manufacturing method |
| US7525787B2 (en) * | 2005-09-30 | 2009-04-28 | Lam Research Corporation | Electrostatic chuck assembly with dielectric material and/or cavity having varying thickness, profile and/or shape, method of use and apparatus incorporating same |
| US8157953B2 (en) * | 2006-03-29 | 2012-04-17 | Tokyo Electron Limited | Plasma processing apparatus |
| JP5513104B2 (en) * | 2009-12-28 | 2014-06-04 | 東京エレクトロン株式会社 | Plasma processing equipment |
| CN201751976U (en) * | 2010-03-12 | 2011-02-23 | 中微半导体设备(上海)有限公司 | Processing device with plasma |
-
2011
- 2011-12-30 CN CN201110456419.4A patent/CN103187224B/en active Active
-
2012
- 2012-11-22 TW TW101143731A patent/TW201332054A/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030085206A1 (en) * | 2001-11-08 | 2003-05-08 | Sumitomo Osaka Cement Co., Ltd. | Susceptor with built-in plasma generation electrode and manufacturing method therefor |
| US20100192542A1 (en) * | 2006-09-14 | 2010-08-05 | Hung Sik Min | Plasma Reactor |
| US20110048683A1 (en) * | 2007-09-28 | 2011-03-03 | Foxconn Technology Co., Ltd. | Heat pipe with composite wick structure |
| US20110121736A1 (en) * | 2008-06-11 | 2011-05-26 | Tokyo Electron Limited | Plasma processing apparatus and plasma processing method |
| US20110309050A1 (en) * | 2009-02-06 | 2011-12-22 | Canon Anelva Corporation | Plasma processing device, plasma processing method and method of manufacturing element including substrate to be processed |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201332054A (en) | 2013-08-01 |
| CN103187224A (en) | 2013-07-03 |
| CN103187224B (en) | 2015-09-09 |