TWI483099B - 相變化散熱裝置 - Google Patents

相變化散熱裝置 Download PDF

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TWI483099B
TWI483099B TW101120756A TW101120756A TWI483099B TW I483099 B TWI483099 B TW I483099B TW 101120756 A TW101120756 A TW 101120756A TW 101120756 A TW101120756 A TW 101120756A TW I483099 B TWI483099 B TW I483099B
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heat
working medium
phase change
casing
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TW201351108A (zh
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Rung An Chen
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Foxconn Tech Co Ltd
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Priority to JP2013117604A priority patent/JP2013257136A/ja
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

相變化散熱裝置
本發明涉及一種散熱裝置，尤其涉及一種運用相變化原理散發電子元件所產生熱量的相變化散熱裝置。
近年來電子技術迅速發展，電子元件的高頻、高速運行以及積體電路的密集及微型化，使得電子元件在工作過程中持續產生熱量，因此需要在電子元件處貼附一散熱裝置，將電子元件工作時所產生的熱量帶走，以確保電子元件能穩定運轉。
傳統的散熱方式係在發熱電子元件上方設置一金屬材質的散熱器，該散熱器具有基座，基座下表面與電子元件接觸，而其上表面則設有複數散熱鰭片，基座吸收電子元件產生的熱量並傳遞給散熱鰭片，藉由鰭片將熱量散發至周圍空氣中。但針對一些間歇性高負荷運行的電子裝置，其高負荷運行的時間較短，而其待機或低負荷運行的時間相對較長，因此，該種電子裝置高負荷運行時發熱元件產生的熱量會在短時間內經由散熱鰭片傳至電子裝置外殼體內的空氣中，從而導致外殼體的溫度在短時間內過高，使得工作人員操作時會產生不適感；而待機或低負荷運行時，發熱元件產生熱量較少而並不會導致外殼體溫度升高，此時散熱鰭片又得不到充分的利用。故，需進一步改進。
本發明旨在提供一種避免電子裝置高負荷運作時外殼體溫度過高、且在電子裝置低負荷運作時利用效率較高的相變化散熱裝置。
一種相變化散熱裝置，用以對發熱元件散熱，其包括殼體、設置於所述殼殼體內的工作介質及與該殼體連接的熱管，所述熱管包括蒸發端及冷凝端，所述工作介質為在常溫呈現固態的相變化絕緣物質，所述殼體***述發熱元件，所述熱管的蒸發端伸入該殼體內，且與所述工作介質接觸，所述殼體包括一上蓋及與該上蓋相對的一下蓋，所述工作介質設置在該上蓋與下蓋之間，所述下蓋周緣彎折向上延伸形成側壁，所述上蓋邊緣抵觸該側壁上端與該下蓋配合形成該腔體，所述發熱元件位於該下蓋上，所述工作介質覆蓋所述發熱元件。
與現有技術相比，本發明中相變化散熱裝置的殼體***述發熱元件與工作介質，所述熱管的蒸發端伸入該殼體內，且與所述工作介質接觸，且該工作介質為在常溫下呈現固態的相變化絕緣物質。因此，該工作介質可直接與發熱元件接觸，高負荷運行時，發熱元件產生的熱量會先被直接轉移至該工作介質，促使該工作介質液化以暫態儲熱，減緩熱量由電子裝置內部傳導至外部殼體的速度，使得發熱元件表面維持在較低的範圍內的同時，避免電子裝置外部殼體的溫度升高過快；當發熱元件待機或低負荷運行時，工作介質逐漸降溫釋放熱量，工作介質繼續進行熱量的傳遞與交換並藉由熱管傳導至外部，利用效率較高。
10‧‧‧相變化散熱裝置
20‧‧‧發熱元件
30‧‧‧殼體
40‧‧‧工作介質
50‧‧‧熱管
31‧‧‧上蓋
32‧‧‧下蓋
33‧‧‧側壁
34‧‧‧腔體
51‧‧‧蒸發端
52‧‧‧冷凝端
圖1為本發明一實施例的相變化散熱裝置的立體示意圖。
圖2為圖1所示相變化散熱裝置的剖面示意圖。
以下將結合附圖對本發明的相變化散熱裝置作進一步的詳細說明。
請同時參閱圖1至圖2，本發明一較優實施例的相變化散熱裝置10，用於對電子裝置(圖未示)內的發熱元件20進行散熱，其包括一殼體30、設置於該殼體30內的工作介質40及與該殼體30連接的熱管50。
具體的，所述殼體30包括一上蓋31、與該上蓋31相對的一下蓋32及連接上蓋31與下蓋32的側壁33。該上蓋31與下蓋32均呈平板狀且上蓋31尺寸略大於該下蓋32的尺寸，該側壁33自該下蓋周緣彎折向上一體延伸而成，該上蓋31邊緣抵觸該側壁33上端與該下蓋32配合形成密封的腔體34。所述上蓋31、下蓋32及側壁33均採用傳導性較佳的材料，如鋁、銅等金屬製成。可以理解的，所述上蓋31、下蓋32可為電子裝置的外部殼體或者電子裝置內部的其他元件(圖未示)的板體。
該工作介質40設置於該腔體34中，該工作介質40為在常溫下呈現固態的絕緣物質，其可在一定的溫度環境下液化成液體，該工作介質40為相變化材料，其熔點介於發熱元件20待機/低負荷運行時的表面溫度和發熱元件20高負荷運行時所能承受的最高溫度之間，如結晶水合鹽類、有機酸或酯類等。
所述熱管50穿設過該側壁33而與該殼體30相連接，所述熱管50呈扁平狀，其包括一蒸發端51和一冷凝端52，所述冷凝端52用於與設於殼體30外的一散熱器(圖未示)熱連接，所述蒸發端51位於該腔體34中並與所述發熱元件20相隔，該熱管50與工作介質40相 接觸，用於將腔體34內的熱量傳導至散熱器進行散發。
組裝時，所述發熱元件20藉由印刷電路板或導線與電子裝置內的其他元件形成電性連接，該腔體34罩設***述發熱元件20，本實施例中，該發熱元件20位於該下蓋32上，所述工作介質40覆蓋該發熱元件20，所述熱管50的蒸發端51位於該工作介質40上並與該發熱元件20相間隔。工作時，發熱元件20產生熱量並將熱量快速轉移至工作介質40，靠近發熱元件20的工作介質40由於距離熱源最近而逐漸受熱液化，最終當所有工作介質40均變為液態時，熱量才能傳遞至腔體34的內壁及熱管50，從而達成暫態儲熱的效果，減緩熱量由電子裝置內部傳導至外部殼體的速度，保證發熱元件20的表面維持在較低的溫度範圍內的同時，避免電子裝置外部殼體的溫度升高過快，而降低工作人員操作時的不適感。當電子裝置待機或者低負荷運作而使得發熱元件20的發熱能力小於外部殼體向外界的散熱能力時，工作介質40逐漸降溫釋放熱量，並藉由熱管50均勻散熱，從而逐漸固化至固態以備進行下一次的暫態儲熱，以達迴圈利用。上述高負荷運作以及待機/低負荷運行的過程中，工作介質40都在進行熱量的傳遞與交換，作為散熱介質，該工作介質40的利用效率較高。由於工作介質40的絕緣性，其在促使發熱元件20表面溫度均勻降低的同時並不會影響該發熱元件20的工作特性。
上述上蓋31、下蓋32不限於平板狀，也可為其他形狀，如三棱柱狀等。該工作介質40的可根據形成腔體34的形狀進行相應改變，只要達到收容於該腔體34即可。
與現有技術相比，本發明中相變化散熱裝置10的殼體30***述 發熱元件20與工作介質40，所述熱管50的蒸發端51伸入該殼體30內，且與所述工作介質40接觸，且該工作介質40為在常溫下呈現固態的相變化絕緣物質。因此，該工作介質40可直接與發熱元件20接觸，高負荷運行時，發熱元件20產生的熱量會先被直接轉移至該工作介質40，促使該工作介質40液化以暫態儲熱，減緩熱量由電子裝置內部傳導至外部殼體的速度，使得發熱元件20表面維持在較低的範圍內的同時，避免電子裝置外部殼體的溫度升高過快；當發熱元件20待機或低負荷運行時，工作介質40逐漸降溫釋放熱量，工作介質40繼續進行熱量的傳遞與交換並藉由熱管50傳導至外部，利用效率較高。
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。
10‧‧‧相變化散熱裝置
20‧‧‧發熱元件
30‧‧‧殼體
40‧‧‧工作介質
50‧‧‧熱管
31‧‧‧上蓋
32‧‧‧下蓋
33‧‧‧側壁
34‧‧‧腔體
51‧‧‧蒸發端
52‧‧‧冷凝端

Claims (4)

  1. 一種相變化散熱裝置，用以對發熱元件散熱，其包括殼體、設置於所述殼殼體內的工作介質及與該殼體連接的熱管，所述熱管包括蒸發端及冷凝端，其改進在於：所述工作介質為在常溫呈現固態的相變化絕緣物質，所述殼體***述發熱元件，所述熱管的蒸發端伸入該殼體內，且與所述工作介質接觸，所述殼體包括一上蓋及與該上蓋相對的一下蓋，所述工作介質設置在該上蓋與下蓋之間，所述下蓋周緣彎折向上延伸形成側壁，所述上蓋邊緣抵觸該側壁上端與該下蓋配合形成該腔體，所述發熱元件位於該下蓋上，所述工作介質覆蓋所述發熱元件。
  2. 如申請專利範圍第1項所述的相變化散熱裝置，其中，所述工作介質為結晶水合鹽類、有機酸或酯類等。
  3. 如申請專利範圍第1項所述的相變化散熱裝置，其中，所述發熱元件藉由印刷電路板或導線與外界電源形成電性連接。
  4. 如申請專利範圍第1項所述的相變化散熱裝置，其中，所述熱管的蒸發端與發熱元件間隔設置，所述冷凝端用於與設於殼體外的一散熱器熱連接。
TW101120756A 2012-06-08 2012-06-08 相變化散熱裝置 TWI483099B (zh)

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US13/631,764 US9046305B2 (en) 2012-06-08 2012-09-28 Phase change type heat dissipating device
JP2013117604A JP2013257136A (ja) 2012-06-08 2013-06-04 相変化放熱装置

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