TWI477219B - Electromagnetism inducing apparatus, electromagnetic carrier and method for disposing embedded component - Google Patents
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Description
本發明是有關於一種電磁性誘發裝置、電磁性載板及內埋元件的設置方法，且特別是有關於一種電磁性誘發裝置、電磁性載板及應用其之內埋元件的設置方法。The present invention relates to an electromagnetic induction device, an electromagnetic carrier, and a method of installing an embedded component, and more particularly to an electromagnetic induction device, an electromagnetic carrier, and a method of installing an embedded component using the same.
一般而言，線路基板主要是由多層經過圖案化的線路層(patterned circuit layer)以及介電層(dielectric layer)交替疊合所構成。其中，圖案化線路層是由銅箔層(copper foil)經過微影與蝕刻製程定義形成，而介電層配置於圖案化線路層之間，用以隔離圖案化線路層。此外，相疊之圖案化線路層之間是透過貫穿介電層的鍍通孔(plating through hole，PTH)或導電孔道(conductive via)而彼此電性連接。最後，在線路基板的表面配置各種電子元件(主動元件、被動元件)，並藉由內部線路之電路設計而達到電子訊號傳遞(electrical signal propagation)之目的。In general, the circuit substrate is mainly composed of a plurality of patterned patterned circuit layers and a dielectric layer alternately stacked. Wherein, the patterned circuit layer is formed by a copper foil layer through a lithography and etching process, and a dielectric layer is disposed between the patterned circuit layers for isolating the patterned circuit layer. In addition, the stacked patterned circuit layers are electrically connected to each other through a plated through hole (PTH) or a conductive via that penetrates the dielectric layer. Finally, various electronic components (active components, passive components) are disposed on the surface of the circuit substrate, and the circuit design of the internal circuit achieves the purpose of electrical signal propagation.
然而，隨著市場對於電子產品需具有輕薄短小且攜帶方便的需求，因此在目前的電子產品中，係將原先焊接於線路基板的電子元件設計為可埋設於線路基板之內部的一內埋元件，如此可以增加基板表面之佈局面積，以達到電子產品薄型化之目的。但是在習知使用內埋式電子元件的技術中，需先在基板上形成貫孔，再將具有貫孔之基板貼附至膠帶上，再將電子元件設置於貫孔內並貼附於膠帶上 固定。之後，再進行填充絕緣材料的步驟。最後再將膠帶移除，以使電子元件內埋於基板中。然而，上述之膠帶屬於耗材而無法重複使用，對於生產成本無疑是一種浪費。此外，在將膠帶移除的過程中，容易因膠帶的黏性太強而導致電子元件或基板上留有殘膠，甚至可能造成電子元件或基板的翹曲，因而影響內埋式電子元件的製造良率。However, as the market needs to be light, short, and portable for electronic products, in the current electronic products, the electronic components originally soldered to the circuit substrate are designed as an embedded component that can be buried inside the circuit substrate. In this way, the layout area of the substrate surface can be increased to achieve the purpose of thinning the electronic product. However, in the conventional technique of using embedded electronic components, it is necessary to form a through hole on the substrate, attach the substrate having the through hole to the tape, and then place the electronic component in the through hole and attach it to the tape. on fixed. Thereafter, the step of filling the insulating material is performed. Finally, the tape is removed to embed the electronic components in the substrate. However, the above-mentioned tape is a consumable and cannot be reused, which is undoubtedly a waste of production cost. In addition, in the process of removing the tape, it is easy to leave residual glue on the electronic component or the substrate due to the adhesiveness of the tape, and may even cause warpage of the electronic component or the substrate, thereby affecting the embedded electronic component. Create yield.
本發明提供一種內埋元件的設置方法，其可提高電子元件內埋於基板的製造良率。The present invention provides a method of installing an embedded component, which can improve the manufacturing yield of the embedded component in the electronic component.
本發明提供一種電磁性誘發裝置，其可應用於內埋元件的設置方法，用以誘發一電磁性載板產生電磁性來固定設置於其上之電子元件。The present invention provides an electromagnetic induction device that can be applied to a method of installing an embedded component for inducing an electromagnetic carrier to generate electromagnetic properties to fix an electronic component disposed thereon.
本發明提供一種電磁性載板，其可應用於內埋元件的設置方法，用以產生電磁性來固定設置於其上之電子元件。The present invention provides an electromagnetic carrier plate that can be applied to a method of arranging embedded components for generating electromagnetic properties to fix electronic components disposed thereon.
本發明提出一種內埋元件的設置方法，其包括下列步驟。設置電磁性載板於傳送裝置上，使電磁性載板透過傳送裝置沿傳送路徑移動。電磁性載板之上表面具有離型膜。誘發電磁性載板產生一電磁性。設置基板於離型膜上。基板具有容置槽。容置槽暴露部分離型膜。設置磁性壓條於基板上。磁性壓條暴露容置槽。磁性壓條與電磁性載板受到彼此之電磁性相互吸引。設置電子元件於容置槽內。電子元件受電磁性載板之電磁性吸引而定位於容置槽內。填入填充膠體於容置槽內將電子元件固定後，消除電磁性 載板之電磁性。令離型膜與基板、電子元件以及填充膠體分離。The present invention proposes a method of arranging an embedded component, which comprises the following steps. An electromagnetic carrier is disposed on the conveyor to move the electromagnetic carrier through the conveyor along the transport path. The upper surface of the electromagnetic carrier has a release film. The induced electromagnetic carrier produces an electromagnetic property. The substrate is placed on the release film. The substrate has a receiving groove. The accommodating groove exposes a separation type film. A magnetic bead is placed on the substrate. The magnetic bead exposes the receiving groove. The magnetic bead and the electromagnetic carrier are attracted to each other by electromagnetic interaction. Set the electronic components in the receiving slots. The electronic component is attracted to the accommodating groove by the electromagnetic attraction of the electromagnetic carrier. Eliminate electromagnetic properties by filling the filling gel in the receiving groove to fix the electronic components The electromagnetic properties of the carrier. The release film is separated from the substrate, the electronic component, and the filled colloid.
本發明提出一種電磁性誘發裝置，其包括一傳送帶以及一線圈。傳送帶適於承載一電磁性載板，使其沿一傳送路徑移動而通過一磁場施加區。線圈位於磁場施加區內，適於接收一電流而產生一磁場，以誘發電磁性載板產生一電磁性。The invention provides an electromagnetic induction device comprising a conveyor belt and a coil. The conveyor belt is adapted to carry an electromagnetic carrier plate that moves along a transport path through a magnetic field application zone. The coil is located in the magnetic field application zone and is adapted to receive a current to generate a magnetic field to induce an electromagnetic property of the electromagnetic carrier.
本發明提出一種電磁性載板，包括一本體、一線圈以及一電流供應單元。本體具有電磁性。線圈設置於本體內。電流供應單元設置於本體內，且適於提供一電流於線圈，使線圈產生一磁場，以誘發本體產生一電磁性。The invention provides an electromagnetic carrier board comprising a body, a coil and a current supply unit. The body is electromagnetic. The coil is placed in the body. The current supply unit is disposed in the body and is adapted to provide a current to the coil to cause the coil to generate a magnetic field to induce the body to generate an electromagnetic property.
在本發明之一實施例中，上述之傳送裝置包括一傳送帶、一線圈以及一磁場施加區。磁場施加區位於傳送路徑上。線圈位於磁場施加區內。傳送帶沿傳送路徑移動而通過磁場施加區。誘發電磁性載板產生電磁性的步驟更包括下列步驟。令一電流通過線圈，以產生一磁場。透過傳送帶傳送電磁性載板通過磁場施加區，以使磁場誘發電磁性載板產生電磁性。In an embodiment of the invention, the transfer device comprises a conveyor belt, a coil and a magnetic field application zone. The magnetic field application zone is located on the transport path. The coil is located within the magnetic field application zone. The conveyor belt moves along the transport path through the magnetic field application zone. The step of inducing electromagnetic properties of the electromagnetic carrier further includes the following steps. A current is passed through the coil to create a magnetic field. The electromagnetic carrier is transmitted through the conveyor belt through the magnetic field application zone to cause the magnetic field to induce electromagnetic properties of the electromagnetic carrier.
在本發明之一實施例中，上述之消除電磁性載板之電磁性的步驟包括令電流停止通過線圈。In one embodiment of the invention, the step of eliminating the electromagnetic properties of the electromagnetic carrier comprises stopping the current from passing through the coil.
在本發明之一實施例中，上述之電磁性載板包括一本體、一線圈以及一電流供應單元。電流供應單元及線圈設置於本體內，誘發電磁性載板產生電磁性的步驟更包括：透過電流供應單元施加一電流於線圈，使線圈產生一磁 場，以誘發電磁性載板產生電磁性。In an embodiment of the invention, the electromagnetic carrier board comprises a body, a coil and a current supply unit. The current supply unit and the coil are disposed in the body, and the step of inducing electromagnetic property of the electromagnetic carrier further comprises: applying a current to the coil through the current supply unit, causing the coil to generate a magnetic Field to induce electromagnetic properties of the electromagnetic carrier.
在本發明之一實施例中，上述之消除電磁性載板之電磁性的步驟包括令電流供應單元停止施加電流於線圈。In an embodiment of the invention, the step of eliminating the electromagnetic properties of the electromagnetic carrier comprises the step of causing the current supply unit to stop applying current to the coil.
在本發明之一實施例中，上述之填入填充膠體於容置槽內的步驟更包括熱壓合填充膠體於容置槽內，以固化填充膠體。In an embodiment of the invention, the step of filling the filling gel into the receiving groove further comprises thermally pressing the filling gel into the receiving groove to cure the filling gel.
在本發明之一實施例中，上述之線圈的材料包括漆包線或銅線。In an embodiment of the invention, the material of the coil described above comprises an enameled wire or a copper wire.
在本發明之一實施例中，上述之電流包括直流電流。In an embodiment of the invention, the current comprises a direct current.
在本發明之一實施例中，上述之電磁性載板更包括一控制面板，設置於本體上，以控制電流的強度。In an embodiment of the invention, the electromagnetic carrier board further includes a control panel disposed on the body to control the intensity of the current.
在本發明之一實施例中，上述之電磁性載板更包括一顯示燈組，包括多個顯示燈，分別設置於本體上，以分別顯示電流供應單元的不同供電狀態。In an embodiment of the present invention, the electromagnetic carrier board further includes a display light group, and includes a plurality of display lights respectively disposed on the body to respectively display different power supply states of the current supply unit.
基於上述，本發明以電磁性載板取代習知的膠帶於其上進行內埋元件的製程，利用電磁性載板的電磁性在製程中將基板以及設置於基板的容置槽內之電子元件定位，並在填充膠體填入容置槽內以固定電子元件時，去除電磁性載板的電磁性。如此，即可輕易將完成之具有內埋元件的基板結構與電磁性載板分離。本發明之電磁性載板可重複利用，因而可節省生產成本。此外，電磁性載板的消磁容易，而不會有習知中載板移除不易的問題，甚而在強行移除時造成基板或電子元件的損壞。並且，電磁性載板的磁性大小更可依電流的強弱而自行控制。因此，本發明不但 可節省設置內埋元件的製程成本，更可有效提高設置內埋元件的製程良率。Based on the above, the present invention replaces a conventional adhesive tape with a conventional carrier tape for the process of embedding the component, and uses the electromagnetic property of the electromagnetic carrier to process the substrate and the electronic component disposed in the receiving groove of the substrate. Positioning and removing the electromagnetic properties of the electromagnetic carrier when the filling gel is filled into the receiving groove to fix the electronic component. In this way, the completed substrate structure having the embedded component can be easily separated from the electromagnetic carrier. The electromagnetic carrier of the present invention can be reused, thereby saving production costs. In addition, the demagnetization of the electromagnetic carrier is easy, and there is no problem that the carrier is not easily removed, and the substrate or the electronic component is damaged even when forcibly removed. Moreover, the magnetic size of the electromagnetic carrier can be controlled by itself according to the strength of the current. Therefore, the present invention is not only The process cost of setting the embedded component can be saved, and the process yield of the embedded component can be effectively improved.
為讓本發明之上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
圖1A至圖1F是依照本發明之一實施例之一種內埋元件的設置方法的流程示意圖。請先參照圖1A，本實施例之內埋元件的設置方法包括下列步驟：首先，如圖1A所示，設置一電磁性載板110於一傳送裝置120上，使電磁性載板110透過傳送裝置120沿一傳送路徑TP移動。值得注意的是，圖1A至圖1F分別繪示設置內埋元件的生產線上的不同製程區域，本實施例之內埋元件的設置方法係透過傳送裝置120沿傳送路徑TP依序經過圖1A至圖1F所繪示之不同製程區域，以依序進行各製程區域所負責之製程。在本實施例中，設置於傳送裝置120上之電磁性載板110具有一遠離傳送裝置120之上表面112，其上表面112設置有一離型膜130。電磁性載板110的材料包括鐵或鋼等可產生電磁性材料。1A to 1F are schematic flow charts showing a method of arranging embedded components according to an embodiment of the present invention. Referring to FIG. 1A, the method for setting the embedded component of the embodiment includes the following steps. First, as shown in FIG. 1A, an electromagnetic carrier 110 is disposed on a conveyor 120 to transmit the electromagnetic carrier 110. The device 120 moves along a transport path TP. It is to be noted that FIG. 1A to FIG. 1F respectively illustrate different process areas on the production line on which the embedded components are disposed. The method for setting the buried components in this embodiment is sequentially passed through the transport device 120 along the transport path TP through FIG. 1A. The different process areas shown in FIG. 1F are sequentially processed by the process areas. In the present embodiment, the electromagnetic carrier 110 disposed on the transfer device 120 has a surface 112 away from the transfer device 120, and the upper surface 112 is provided with a release film 130. The material of the electromagnetic carrier 110 includes iron or steel to produce an electromagnetic material.
承上述，接著誘發電磁性載板110產生一電磁性。在本實施例中，誘發電磁性載板110產生電磁性的方法可例如透過傳送裝置120之特殊設計來達成。圖2是依照本發明之一實施例之一種電磁性誘發裝置的示意圖。請參照圖2，本實施例之傳送裝置即為圖2所示之電磁性誘發裝置 200。電磁性誘發裝置200可包括一傳送帶210、一線圈220以及一磁場施加區230。磁場施加區230位於傳送路徑TP上。線圈220位於磁場施加區230內。圖1A所示之電磁性載板110即可設置於傳送帶210上。此時，若對線圈220施加一電流，使電流通過線圈220，則依弗萊明右手定則(Fleming’s right-hand rule)，載有電流的線圈220會產生一磁場。如此，當如圖1A所示之電磁性載板110透過傳送帶210的傳送而進入磁場施加區230時，線圈220產生之磁場即誘發電磁性載板110產生電磁性。在本實施例中，線圈220的材料例如為漆包線或銅線，而電流則為直流電流。In view of the above, the electromagnetic carrier 110 is then induced to generate an electromagnetic property. In the present embodiment, the method of inducing electromagnetic properties of the electromagnetic carrier 110 can be achieved, for example, by the special design of the conveyor 120. 2 is a schematic diagram of an electromagnetic induction device in accordance with an embodiment of the present invention. Referring to FIG. 2, the transmitting device of this embodiment is the electromagnetic induction device shown in FIG. 2. 200. The electromagnetic induction device 200 can include a conveyor belt 210, a coil 220, and a magnetic field application zone 230. The magnetic field application zone 230 is located on the transport path TP. The coil 220 is located within the magnetic field application zone 230. The electromagnetic carrier 110 shown in FIG. 1A can be disposed on the conveyor belt 210. At this time, if a current is applied to the coil 220 to pass the current through the coil 220, the Fleming's right-hand rule generates a magnetic field. Thus, when the electromagnetic carrier 110 as shown in FIG. 1A enters the magnetic field application region 230 through the transfer of the conveyor belt 210, the magnetic field generated by the coil 220 induces electromagnetic attraction of the electromagnetic carrier 110. In the present embodiment, the material of the coil 220 is, for example, an enameled wire or a copper wire, and the current is a direct current.
在本發明之另一實施例中，誘發電磁性載板產生電磁性的方法可例如透過電磁性載板本身的特殊設計來達成，而本實施例之傳送裝置則可為一般生產線所使用之傳送裝置。圖3是依照本發明之一實施例之一種電磁性載板的示意圖。請參照圖3，本實施例之電磁性載板300包括一本體310、一線圈320以及一電流供應單元330。電流供應單元330及線圈320設置於本體310內。誘發電磁性載板300產生電磁性的方法例如為透過電流供應單元330施加一電流於線圈320，使線圈320產生一磁場，以誘發電磁性載板300產生電磁性。而消除電磁性載板300之電磁性的方法則為控制電流供應單元330停止施加電流該線圈320。在本實施例中，電磁性載板300更可包括一電流供應單元330以及一顯示燈組350。電流供應單元330設置於本體 310上，用以控制電流的強度。因此，電磁性載板300的電磁性大小可依電流的強弱而自行控制。顯示燈組350則可包括多個顯示燈352、354、356，其分別設置於本體310上，以分別顯示電流供應單元330的不同供電狀態。例如：顯示燈352燈亮時顯示電流供應單元330的電源充足，顯示燈354燈亮時顯示電流供應單元330的電源耗弱，而顯示燈356燈亮時顯示電流供應單元330需進行更換。在此，電流供應單元330例如為鋰電池，而電磁性載板300的材料包括鐵或鋼等可產生電磁性材料。In another embodiment of the present invention, the method of inducing the electromagnetic property of the electromagnetic carrier can be achieved, for example, by a special design of the electromagnetic carrier itself, and the transfer device of the embodiment can be used for the transmission of the general production line. Device. 3 is a schematic view of an electromagnetic carrier in accordance with an embodiment of the present invention. Referring to FIG. 3 , the electromagnetic carrier 300 of the embodiment includes a body 310 , a coil 320 , and a current supply unit 330 . The current supply unit 330 and the coil 320 are disposed in the body 310. The method of inducing electromagnetic property of the electromagnetic carrier 300 is, for example, applying a current to the coil 320 through the current supply unit 330, and causing the coil 320 to generate a magnetic field to induce the electromagnetic carrier 300 to generate electromagnetic properties. The method of eliminating the electromagnetic property of the electromagnetic carrier 300 is to control the current supply unit 330 to stop applying the current to the coil 320. In this embodiment, the electromagnetic carrier 300 further includes a current supply unit 330 and a display light group 350. The current supply unit 330 is disposed on the body On 310, used to control the intensity of the current. Therefore, the electromagnetic magnitude of the electromagnetic carrier 300 can be controlled by itself depending on the strength of the current. The display light group 350 may include a plurality of display lights 352, 354, 356 respectively disposed on the body 310 to respectively display different power supply states of the current supply unit 330. For example, when the indicator light 352 is on, the power supply of the current supply unit 330 is sufficient. When the indicator light 354 is on, the power supply of the current supply unit 330 is weak, and when the indicator light 356 is on, the current supply unit 330 is required to be replaced. Here, the current supply unit 330 is, for example, a lithium battery, and the material of the electromagnetic carrier 300 includes iron or steel or the like to generate an electromagnetic material.
透過上述之任一方法誘發電磁性載板產生電磁性後，接著如圖1B所示，設置一基板140於離型膜130上。基板140具有容置槽142。容置槽142暴露部分離型膜130。在本實施例中，容置槽142為一貫孔。接著再如圖1C所示，設置一磁性壓條150於基板140上。磁性壓條150暴露容置槽142，且磁性壓條150與電磁性載板110受到彼此之電磁性而相互吸引。如此，磁性壓條150與電磁性載板110因磁性相吸而能將基板140固定於電磁性載板110上。在本實施例中，磁性壓條150可為永久性磁鐵，也就是說，磁性壓條150具有永久性磁性。After the electromagnetic carrier is induced to generate electromagnetic properties by any of the above methods, a substrate 140 is placed on the release film 130 as shown in FIG. 1B. The substrate 140 has a receiving groove 142. The accommodating groove 142 exposes the portion separation film 130. In this embodiment, the receiving groove 142 is a consistent hole. Next, as shown in FIG. 1C, a magnetic bead 150 is disposed on the substrate 140. The magnetic bead 150 exposes the receiving groove 142, and the magnetic bead 150 and the electromagnetic carrier 110 are electromagnetically attracted to each other. In this manner, the magnetic bead 150 and the electromagnetic carrier 110 can be magnetically attracted to fix the substrate 140 to the electromagnetic carrier 110. In the present embodiment, the magnetic bead 150 can be a permanent magnet, that is, the magnetic bead 150 has permanent magnetism.
接著，請參照圖1D，設置一電子元件160於容置槽142內，且電子元件160受電磁性載板110之電磁性吸引而可被定位於容置槽142內。接著再如圖1E所示，填入一填充膠體170於容置槽142內並覆蓋電子元件160，以將電子元件160固定後，消除電磁性載板110之電磁性。 在本實施例中，填充膠體170例如為半固化樹脂(resin gel)等介電材料。而填入填充膠體170於容置槽142內的步驟更包括熱壓合填充膠體170於容置槽142內以固化填充膠體170。如此，填充膠體170固定了電子元件160的位置，即可消除電磁性載板110之電磁性。在本實施例中，消除電磁性載板110之電磁性的方法包括令電流停止通過線圈320，以消除線圈320產生的磁場，電磁性載板110之電磁性即可因此消除。Next, referring to FIG. 1D , an electronic component 160 is disposed in the accommodating groove 142 , and the electronic component 160 is electromagnetically attracted by the electromagnetic carrier 110 to be positioned in the accommodating groove 142 . Then, as shown in FIG. 1E, a filling gel 170 is filled in the receiving groove 142 and covers the electronic component 160 to fix the electronic component 160 to eliminate the electromagnetic property of the electromagnetic carrier 110. In the present embodiment, the filling colloid 170 is, for example, a dielectric material such as a resin gel. The step of filling the filling gel 170 into the receiving groove 142 further includes thermally pressing the filling compound 170 into the receiving groove 142 to cure the filling gel 170. Thus, the filling gel 170 fixes the position of the electronic component 160, thereby eliminating the electromagnetic property of the electromagnetic carrier 110. In the present embodiment, the method of eliminating the electromagnetic properties of the electromagnetic carrier 110 includes stopping the current from passing through the coil 320 to eliminate the magnetic field generated by the coil 320, and the electromagnetic properties of the electromagnetic carrier 110 can be eliminated.
接著，如圖1F所示，令離型膜130與基板140、電子元件160以及填充膠體170分離，即可完成內埋元件的設置。在本實施例中，離型膜130的材料包括聚乙烯對苯二甲酸酯(polyethylene terephthalate，PET)、聚乙烯(polyethylene，PE)、聚丙烯(Polypropylene，PP)、定向聚丙烯(oriented polypropylene，OPP)。離型膜130通常為表面具有分離性之薄膜，其與特定的材料在特定的條件下接觸後不具有黏性或僅具有輕微的黏性。本實施例將離型膜130設置於電磁性載板110上，利用離型膜130易於與基板140脫離的特性，使基板140在完成內埋元件的設置後，可如圖1F所示與離型膜130分離，而形成具有內埋元件之基板結構100。Next, as shown in FIG. 1F, the release film 130 is separated from the substrate 140, the electronic component 160, and the filling gel 170 to complete the placement of the embedded component. In this embodiment, the material of the release film 130 includes polyethylene terephthalate (PET), polyethylene (PE), polypropylene (PP), oriented polypropylene (oriented polypropylene). , OPP). The release film 130 is generally a film having a separation surface which does not have a viscosity or only a slight viscosity after contact with a specific material under specific conditions. In this embodiment, the release film 130 is disposed on the electromagnetic carrier 110, and the release film 130 is easily separated from the substrate 140. After the substrate 140 is disposed, the substrate 140 can be separated from the substrate as shown in FIG. 1F. The film 130 is separated to form a substrate structure 100 having embedded components.
綜上所述，本發明以電磁性載板取代習知的膠帶於其上進行內埋元件的製程，利用電磁性載板的電磁性在製程中將基板以及設置於基板的容置槽內之電子元件定位，並在填充膠體填入容置槽內以固定電子元件時，去除電磁性 載板的電磁性。如此，即可輕易將完成之具有內埋元件的基板結構與電磁性載板分離。本發明之電磁性載板可重複利用，因而可節省生產成本。此外，電磁性載板的消磁容易，而不會有習知中載板移除不易的問題，甚而在強行移除時造成基板或電子元件的損壞。並且，電磁性載板的磁性大小更可依電流的強弱而自行控制。因此，本發明不但可節省設置內埋元件的製程成本，更可有效提高設置內埋元件的製程良率。In summary, the present invention replaces a conventional adhesive tape with a conventional carrier tape, and uses the electromagnetic property of the electromagnetic carrier to process the substrate and the receiving groove in the substrate. Positioning the electronic components and removing the electromagnetic properties when the filling gel is filled into the receiving groove to fix the electronic components The electromagnetic properties of the carrier. In this way, the completed substrate structure having the embedded component can be easily separated from the electromagnetic carrier. The electromagnetic carrier of the present invention can be reused, thereby saving production costs. In addition, the demagnetization of the electromagnetic carrier is easy, and there is no problem that the carrier is not easily removed, and the substrate or the electronic component is damaged even when forcibly removed. Moreover, the magnetic size of the electromagnetic carrier can be controlled by itself according to the strength of the current. Therefore, the invention not only saves the process cost of installing the embedded component, but also effectively improves the process yield of the embedded component.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
100‧‧‧具有內埋元件之基板結構100‧‧‧Substrate structure with embedded components
110、300‧‧‧電磁性載板110,300‧‧‧Electromagnetic carrier board
112‧‧‧上表面112‧‧‧ upper surface
120‧‧‧傳送裝置120‧‧‧Transfer device
130‧‧‧離型膜130‧‧‧ release film
140‧‧‧基板140‧‧‧Substrate
142‧‧‧容置槽142‧‧‧ accommodating slots
150‧‧‧磁性壓條150‧‧‧Magnetic beading
160‧‧‧電子元件160‧‧‧Electronic components
170‧‧‧填充膠體170‧‧‧filled colloid
200‧‧‧電磁性誘發裝置200‧‧‧Electromagnetic induction device
210‧‧‧傳送帶210‧‧‧Conveyor belt
220、320‧‧‧線圈220, 320‧‧‧ coil
230‧‧‧磁場施加區230‧‧‧Magnetic field application area
310‧‧‧本體310‧‧‧ Ontology
330‧‧‧電流供應單元330‧‧‧current supply unit
340‧‧‧控制面板340‧‧‧Control panel
350‧‧‧顯示燈組350‧‧‧ display light group
352、354、356‧‧‧顯示燈352, 354, 356‧‧‧ display lights
TP‧‧‧傳送路徑TP‧‧‧ transmission path
圖1A至圖1F是依照本發明之一實施例之一種內埋元件的設置方法的流程示意圖。1A to 1F are schematic flow charts showing a method of arranging embedded components according to an embodiment of the present invention.
圖2是依照本發明之一實施例之一種電磁性誘發裝置的示意圖。2 is a schematic diagram of an electromagnetic induction device in accordance with an embodiment of the present invention.
圖3是依照本發明之一實施例之一種電磁性載板的示意圖。3 is a schematic view of an electromagnetic carrier in accordance with an embodiment of the present invention.
110‧‧‧電磁性載板110‧‧‧Electromagnetic carrier board
120‧‧‧傳送裝置120‧‧‧Transfer device
130‧‧‧離型膜130‧‧‧ release film
140‧‧‧基板140‧‧‧Substrate
142‧‧‧容置槽142‧‧‧ accommodating slots
150‧‧‧磁性壓條150‧‧‧Magnetic beading
160‧‧‧電子元件160‧‧‧Electronic components
170‧‧‧填充膠體170‧‧‧filled colloid
Claims (13)
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