TWI476874B - Glass pad with circuit trace and method of making the same - Google Patents
Glass pad with circuit trace and method of making the same Download PDFInfo
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- TWI476874B TWI476874B TW100127066A TW100127066A TWI476874B TW I476874 B TWI476874 B TW I476874B TW 100127066 A TW100127066 A TW 100127066A TW 100127066 A TW100127066 A TW 100127066A TW I476874 B TWI476874 B TW I476874B
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Description
本發明涉及一種玻璃板，尤指一種具有導電線路的玻璃板。 The present invention relates to a glass sheet, and more particularly to a glass sheet having electrically conductive lines.
請參閱中國大陸專利公告第201132817號所揭示的一種玻璃板鍍膜製造方法，其採用蒸鍍工藝，主要步驟為：一、將玻璃放入置有鍍料的真空室；二、加熱，使鍍料蒸發或昇華；三、鍍料沉積在玻璃表面凝聚成鍍膜。然而，此種工藝中玻璃與鍍膜的依附力較弱，易磨損脫落，且受損後鍍膜不易修復。 Please refer to the method for manufacturing a glass plate coating disclosed in Chinese Patent Publication No. 201132817, which adopts an evaporation process, and the main steps are as follows: 1. Putting the glass into a vacuum chamber provided with a plating material; 2. Heating to make the plating material Evaporation or sublimation; Third, the deposition of the coating on the surface of the glass condenses into a coating. However, in this process, the adhesion of the glass to the coating is weak, and it is easy to wear and fall off, and the coating is not easily repaired after being damaged.
鑒於以上缺失，確有必要提供一種改進之技術方案，以克服上述缺陷。 In view of the above deficiencies, it is indeed necessary to provide an improved technical solution to overcome the above drawbacks.
本發明之目的在於提供一種具有導電線路的玻璃板，其不易磨損脫落，且受損後鍍膜容易修復。 It is an object of the present invention to provide a glass sheet having a conductive line which is less prone to wear and tear and which is easily repaired after damage.
為實現上述目的，本發明提供了一種具有導電線路的玻璃板，其包括玻璃基材和金屬鍍層，前述玻璃板還包括擴散於玻璃基材表面的金屬擴散層，所述金屬鍍層附著於金屬擴散層的表面形成導電線路。 In order to achieve the above object, the present invention provides a glass plate having a conductive line, comprising a glass substrate and a metal plating layer, the glass plate further comprising a metal diffusion layer diffused on a surface of the glass substrate, the metal plating layer being attached to the metal diffusion The surface of the layer forms a conductive line.
本發明還提供了一種具有導電線路之玻璃板的製作方法，其包括 ：準備玻璃基材，並在玻璃基材上塗佈具一定路徑的奈米金屬粉末；將塗佈有奈米金屬粉末的玻璃基材進行高溫烘烤；去除奈米金屬粉末，得到具有金屬擴散層的玻璃基材；在金屬擴散層上經表面鍍工藝形成導電線路。 The invention also provides a method for manufacturing a glass plate with conductive lines, which comprises : preparing a glass substrate, and coating a nano metal powder having a certain path on the glass substrate; baking the glass substrate coated with the nano metal powder at a high temperature; removing the nano metal powder to obtain metal diffusion a layer of glass substrate; a conductive line formed on the metal diffusion layer by a surface plating process.
與先前技術相比，本發明利用金屬擴散原理形成與玻璃板融為一體的金屬擴散層，不僅結合牢固，而且當金屬鍍層損害時，具有較佳的可修復性。 Compared with the prior art, the present invention utilizes the metal diffusion principle to form a metal diffusion layer which is integrated with the glass plate, which is not only firmly bonded, but also has better repairability when the metal plating layer is damaged.
100‧‧‧玻璃板 100‧‧‧ glass plate
10‧‧‧玻璃基材 10‧‧‧Glass substrate
12‧‧‧奈米金屬粉末 12‧‧‧Nano metal powder
13‧‧‧金屬擴散層 13‧‧‧Metal diffusion layer
14‧‧‧金屬鍍層 14‧‧‧Metal plating
第一圖係本發明具有導電線路的玻璃板之製造步驟示意圖；及第二圖係與第一圖製造步驟相對應的剖面示意圖。 The first drawing is a schematic view showing the manufacturing steps of the glass plate having the conductive line of the present invention; and the second drawing is a schematic cross-sectional view corresponding to the manufacturing step of the first figure.
下面結合圖式來詳細說明本發明具有導電線路的玻璃板及其製造方法。 Hereinafter, a glass plate having a conductive line of the present invention and a method of manufacturing the same will be described in detail with reference to the drawings.
本發明主要利用了原子的擴散原理，故先對擴散過程作一個簡單的介紹。因為原子具有熱能，它們可以在材料中運動。原子在材料內部運動的現象稱為擴散。例如，如果將一銅片和一鎳片焊在一起或者靠得足夠近，鎳原子就會逐漸向銅片內擴散，而銅原子也會向鎳片內擴散。原子在材料中的運動能力稱為原子的穩定性，溫度越高，原子具有的熱能越高，不穩定性越高，擴散越快。因而，環境溫度和時間等要求也對擴散的過程和效果產生影響。 The invention mainly utilizes the principle of atom diffusion, so a brief introduction to the diffusion process is first made. Because atoms have thermal energy, they can move through the material. The phenomenon of atoms moving inside a material is called diffusion. For example, if a copper piece and a piece of nickel are welded together or close enough, the nickel atoms will gradually diffuse into the copper piece, and the copper atoms will also diffuse into the nickel piece. The ability of an atom to move in a material is called the stability of the atom. The higher the temperature, the higher the thermal energy of the atom, the higher the instability, and the faster the diffusion. Therefore, environmental temperature and time requirements also affect the process and effect of diffusion.
請參閱第一圖和第二圖，本發明為一種具有導電線路的玻璃板100，其包括玻璃基材10和金屬鍍層14，前述玻璃板100還包括擴散於玻璃基材10表面的金屬擴散層13，所述金屬鍍層14附著於金 屬擴散層13的表面形成導電線路。 Referring to the first and second figures, the present invention is a glass plate 100 having a conductive line comprising a glass substrate 10 and a metal plating layer 14, the glass plate 100 further comprising a metal diffusion layer diffused on the surface of the glass substrate 10. 13, the metal plating layer 14 is attached to gold The surface of the diffusion layer 13 forms a conductive line.
下面詳細介紹上述玻璃板100的製造方法：首先，準備好玻璃基材10，並在所述玻璃基材上塗佈奈米金屬粉末12，本實施例中較佳採用了奈米銅粉末。前述奈米金屬粉末在塗佈至玻璃基材前混合有凝膠(未圖示)，以更好地黏附於玻璃基材10表面。奈米金屬粉末的塗佈方式除了普通的刷佈外，亦可通過移印等方式複製到玻璃基材10上。此部份一個總的目的在於：將奈米金屬粉末按照一定的導電路徑黏佈於玻璃基材上。 Next, the manufacturing method of the above glass plate 100 will be described in detail. First, the glass substrate 10 is prepared, and the nano metal powder 12 is coated on the glass substrate. In this embodiment, nano copper powder is preferably used. The aforementioned nano metal powder is mixed with a gel (not shown) before being applied to the glass substrate to better adhere to the surface of the glass substrate 10. The coating method of the nano metal powder can be copied onto the glass substrate 10 by pad printing or the like in addition to the ordinary brush. A general purpose of this part is to adhere the nano metal powder to a glass substrate according to a certain conductive path.
接著，將塗佈有奈米金屬粉末12的玻璃基材10放入高溫爐進行高溫烘烤，以加速表層的奈米金屬粉末擴散至玻璃基材的表層，進而形成穩定的滲透結合層。其中的高溫烘烤溫度較佳設置在600~700攝氏度之間，烘烤時間較佳為20~40分鐘。 Next, the glass substrate 10 coated with the nano metal powder 12 is placed in a high temperature furnace and baked at a high temperature to accelerate the diffusion of the surface layer of the nano metal powder to the surface layer of the glass substrate to form a stable permeation bonding layer. The high temperature baking temperature is preferably set between 600 and 700 degrees Celsius, and the baking time is preferably 20 to 40 minutes.
然後，退火並去除奈米金屬粉末，得到具有金屬擴散層13的玻璃基材。此部份主要係將退火後的玻璃基材10用溶液洗淨，所述金屬擴散層13即去除玻璃基材上的奈米金屬粉末和凝膠碳渣殘留後穩定形成於玻璃基材表層的滲透結合層。本實施例在前述條件下得到的金屬擴散層13呈透明或半透明狀，且此時印製的電路尚未具有導電功能。當然，在環境條件滿足的情況下，同樣可具備基本的導電性。 Then, the nano metal powder is annealed and removed to obtain a glass substrate having the metal diffusion layer 13. In this part, the annealed glass substrate 10 is mainly washed with a solution, and the metal diffusion layer 13 is formed by removing the nano metal powder and the gel carbon residue on the glass substrate and stably forming on the surface layer of the glass substrate. Penetrate the bonding layer. The metal diffusion layer 13 obtained under the foregoing conditions in this embodiment is transparent or translucent, and the printed circuit at this time does not yet have a conductive function. Of course, basic environmental conductivity can also be obtained when environmental conditions are met.
最後，使所述玻璃基材10經表面鍍工藝形成附著於金屬擴散層13上的金屬鍍層14，亦即導電線路。這裡的表面鍍工藝較佳選用化學鍍，鍍液較佳選用具有良好導電性以及與奈米銅粉末具有良好結合性的金。所述導電線路因在金屬擴散層13上進行了充分的沉 積而具備導電功能。此外，導電線路的透明度和導電性能之間可以做一定的平衡，以使導電線路在具備必要導電性能的同時，亦具有透明或半透明的可透光性，從而可以更好地滿足市場上一些創新簡約的產品設計要求。 Finally, the glass substrate 10 is subjected to a surface plating process to form a metal plating layer 14, which is a conductive line, attached to the metal diffusion layer 13. The surface plating process here is preferably electroless plating, and the plating solution is preferably gold having good electrical conductivity and good bonding with the nano copper powder. The conductive line is sufficiently sinked on the metal diffusion layer 13 It has a conductive function. In addition, the transparency and conductivity of the conductive line can be balanced to ensure that the conductive line has the necessary conductive properties, and also has transparent or translucent transparency, so that it can better meet some of the market. Innovative and simple product design requirements.
值得一提的是，本發明的金屬擴散層13已嵌入玻璃板100內部，結合牢固，當金屬鍍層14損害時，僅需再重複最後一個表面鍍工藝即可恢復功能，具有較佳的可修復性。 It is worth mentioning that the metal diffusion layer 13 of the present invention has been embedded in the interior of the glass plate 100, and the bonding is firm. When the metal plating layer 14 is damaged, the last surface plating process needs to be repeated to restore the function, and the repair is better. Sex.
綜上前述，上述描述的是本發明的較佳實施例，當然並不限於此。即凡是依本發明權利要求書及說明書內容所作的簡單的等效變化與修飾，皆應仍屬本發明專利涵蓋的範圍內。 In view of the foregoing, the above description is a preferred embodiment of the present invention, and is of course not limited thereto. That is, the simple equivalent changes and modifications made in the claims and the description of the present invention are still within the scope of the present invention.
100‧‧‧玻璃板 100‧‧‧ glass plate
10‧‧‧玻璃基材 10‧‧‧Glass substrate
12‧‧‧奈米金屬粉末 12‧‧‧Nano metal powder
13‧‧‧金屬擴散層 13‧‧‧Metal diffusion layer
14‧‧‧金屬鍍層 14‧‧‧Metal plating
Claims (8)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100127066A TWI476874B (en) | 2011-07-29 | 2011-07-29 | Glass pad with circuit trace and method of making the same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100127066A TWI476874B (en) | 2011-07-29 | 2011-07-29 | Glass pad with circuit trace and method of making the same |
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| Publication Number | Publication Date |
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| TW201306187A TW201306187A (en) | 2013-02-01 |
| TWI476874B true TWI476874B (en) | 2015-03-11 |
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| TW100127066A TWI476874B (en) | 2011-07-29 | 2011-07-29 | Glass pad with circuit trace and method of making the same |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201028060A (en) * | 2009-01-09 | 2010-07-16 | Hon Hai Prec Ind Co Ltd | Method for making conductive line |
| TW201117231A (en) * | 2009-09-16 | 2011-05-16 | Hitachi Chemical Co Ltd | Ink for printing, metal nanoparticle utilized in ink, wiring, circuit substrate and semiconductor package |
| TW201121086A (en) * | 2009-06-22 | 2011-06-16 | Applied Materials Inc | Enhanced vision system for screen printing pattern alignment |
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2011
- 2011-07-29 TW TW100127066A patent/TWI476874B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201028060A (en) * | 2009-01-09 | 2010-07-16 | Hon Hai Prec Ind Co Ltd | Method for making conductive line |
| TW201121086A (en) * | 2009-06-22 | 2011-06-16 | Applied Materials Inc | Enhanced vision system for screen printing pattern alignment |
| TW201117231A (en) * | 2009-09-16 | 2011-05-16 | Hitachi Chemical Co Ltd | Ink for printing, metal nanoparticle utilized in ink, wiring, circuit substrate and semiconductor package |
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| TW201306187A (en) | 2013-02-01 |
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