TWI476660B - Touch screen panel for display device and method of manufacturing the same - Google Patents
Touch screen panel for display device and method of manufacturing the same Download PDFInfo
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Description
本發明係關於一種用於一顯示裝置之觸控螢幕面板,以及尤其係關於一種在一製造製程中具有降低的厚度和重量以及提高的產量之觸控螢幕面板。The present invention relates to a touch screen panel for a display device, and more particularly to a touch screen panel having reduced thickness and weight and increased throughput in a manufacturing process.
諸如一鍵盤、一滑鼠、一軌跡球、一操縱杆以及一數位轉換器之各種輸入裝置在各種家用電器或通訊裝置上被提供以接收用戶輸入。但是,在多種類型輸入裝置中,一用戶不得不學會如何使用輸入裝置,使得對於用戶與難以操作產品。而且,輸入裝置佔據一單獨空間,單獨空間增加了合併這些輸入裝置之電器或裝置之總尺寸。因此,已經具有對於簡單和便捷的輸入裝置之一增加的需求。Various input devices such as a keyboard, a mouse, a trackball, a joystick, and a digitizer are provided on various home appliances or communication devices to receive user input. However, in many types of input devices, a user has to learn how to use the input device, making it difficult for the user to operate the product. Moreover, the input device occupies a separate space that increases the overall size of the appliances or devices that incorporate the input devices. Therefore, there has been an increased demand for one of the simple and convenient input devices.
一觸控螢幕面板係為減輕或消除在其他類型輸入裝置中之這樣的缺點之一輸入裝置。觸控螢幕面板允許用戶透過直接使用用戶之手指或一筆觸控螢幕而提供用戶輸入。觸控螢幕面板由於其簡單結構和強健操作目前被應用至各種顯示裝置。A touch screen panel is one that reduces or eliminates one of the disadvantages of other types of input devices. The touch screen panel allows the user to provide user input by directly using the user's finger or a touch screen. Touch screen panels are currently being applied to various display devices due to their simple structure and robust operation.
通常使用兩種類型觸控螢幕面板。一個係為一電 阻式,另一個係為一電容式。電阻式觸控螢幕面板基於一電壓梯度感測觸控和觸控螢幕面板之觸控部份之位置。電壓梯度取決於形成在一上基板或一下基板上之一金屬電極中之阻抗。相反,基於由於觸控螢幕面板之觸控在電極之間之電容之變化,電容式觸控螢幕面板感測觸控螢幕面板之觸控部份之觸控和一觸控位置。Two types of touch screen panels are commonly used. One department is one Resistive, the other is a capacitive type. The resistive touch screen panel senses the position of the touch portion of the touch and touch screen panel based on a voltage gradient. The voltage gradient depends on the impedance formed in one of the metal electrodes on an upper substrate or a lower substrate. On the contrary, based on the change of the capacitance between the electrodes of the touch screen panel, the capacitive touch screen panel senses the touch and a touch position of the touch portion of the touch screen panel.
實施例係關於提供聚合物材料層於電極所形成之一基板之兩側。一種觸控螢幕面板包括位於基板之第一表面上之一第一聚合物層。在基板之第二表面上沿著一第一方向延伸之複數個第一電極係形成在基板上。一第二聚合物層係形成在第一電極上和基板之第二表面上。複數個第二電極在第二聚合物層上沿著一第二方向延伸,第二電極和第一電極之間之電容之變化被偵測用於感測在第一聚合物層上之觸控。Embodiments relate to providing a layer of polymeric material on either side of a substrate formed by an electrode. A touch screen panel includes a first polymer layer on a first surface of a substrate. A plurality of first electrode lines extending along a first direction on the second surface of the substrate are formed on the substrate. A second polymer layer is formed on the first electrode and on the second surface of the substrate. A plurality of second electrodes extend along a second direction on the second polymer layer, and a change in capacitance between the second electrode and the first electrode is detected for sensing a touch on the first polymer layer .
在一個實施例中,第二聚合物層係形成有接觸孔以暴露第一電極之每個至一路由線。In one embodiment, the second polymer layer is formed with contact holes to expose each of the first electrodes to a routing line.
在一個實施例中,路由線係形成在第二聚合物層上,並且位於一對應接觸孔中。In one embodiment, the routing circuitry is formed on the second polymer layer and is located in a corresponding contact hole.
在一個實施例中,觸控螢幕面板更包含形成在對應接觸孔中之路由線之一部份上之一導電輔助層。In one embodiment, the touch screen panel further includes a conductive auxiliary layer formed on a portion of the routing line in the corresponding contact hole.
在一個實施例中,路由線係由從鋁(Al)、鋁釹(AlNd)、鉬(Mo)、鉬鈦(MoTi)、銅(Cu)、鉻(Cr)、銀(Ag)、以及銀基合金之金屬所構成之組所選擇之金屬所製成。In one embodiment, the routing circuitry is from aluminum (Al), aluminum germanium (AlNd), molybdenum (Mo), molybdenum titanium (MoTi), copper (Cu), chromium (Cr), silver (Ag), and silver. The metal of the base alloy is made of a metal selected from the group.
在一個實施例中,第一聚合物層和第二聚合物層係由一相同材料所製成。In one embodiment, the first polymer layer and the second polymer layer are made of a single material.
在一個實施例中,第一聚合物層和第二聚合物層係由一紫外線固化樹脂或一熱固樹脂所形成。In one embodiment, the first polymer layer and the second polymer layer are formed from an ultraviolet curable resin or a thermosetting resin.
在一個實施例中,基板係由一聚合物材料所形成。In one embodiment, the substrate is formed from a polymeric material.
在一個實施例中,第一電極和第二電極係由從氧化銦錫(ITO)、氧化銦鋅(IZO)、鎵摻雜氧化鋅(GZO)、金屬奈米線(metal nanowires)、及碳基透明電極所構成之組所選擇之一透明導電材料所製成。In one embodiment, the first electrode and the second electrode are made of indium tin oxide (ITO), indium zinc oxide (IZO), gallium-doped zinc oxide (GZO), metal nanowires, and carbon. A transparent conductive material is selected from the group consisting of a transparent electrode.
在一個實施例中,第一電極之每個具有複數個交叉網線,第二電極之每個具有複數個交叉網線。In one embodiment, each of the first electrodes has a plurality of crossover wires, each of the second electrodes having a plurality of crossover wires.
10‧‧‧透明基板10‧‧‧Transparent substrate
100‧‧‧基板100‧‧‧Substrate
131‧‧‧第一節點131‧‧‧first node
132‧‧‧第一連接部份132‧‧‧ first connection
133‧‧‧第二節點133‧‧‧second node
134‧‧‧第二連接部份134‧‧‧Second connection
200‧‧‧基板200‧‧‧Substrate
5‧‧‧顯示裝置組件5‧‧‧Display device components
A‧‧‧電極部份A‧‧‧electrode part
A1‧‧‧第一粘結劑A1‧‧‧ first binder
A2‧‧‧第二粘結劑A2‧‧‧Second binder
B‧‧‧路由線部份B‧‧‧Route line section
C‧‧‧接墊部份C‧‧‧Patch part
CH‧‧‧接觸孔CH‧‧‧Contact hole
CP‧‧‧導電輔助層CP‧‧‧ conductive auxiliary layer
DP‧‧‧顯示裝置DP‧‧‧ display device
HC1‧‧‧聚合物層HC1‧‧‧ polymer layer
HC2‧‧‧硬覆層HC2‧‧‧hard coating
RP1‧‧‧第一接墊RP1‧‧‧first mat
RP2‧‧‧第二接墊RP2‧‧‧second mat
RS‧‧‧第一電極RS‧‧‧first electrode
RW1‧‧‧第一路由線RW1‧‧‧first route line
RW1a‧‧‧第一層RW1a‧‧‧ first floor
RW1b‧‧‧第二層RW1b‧‧‧ second floor
RW2‧‧‧第二路由線RW2‧‧‧Second routing line
RX1‧‧‧金屬線RX1‧‧‧ metal wire
SF‧‧‧犧牲薄膜SF‧‧‧ sacrificial film
TH‧‧‧通孔TH‧‧‧through hole
TP‧‧‧觸控螢幕面板TP‧‧‧ touch screen panel
TS‧‧‧驅動電極TS‧‧‧ drive electrode
TX1‧‧‧金屬線TX1‧‧‧metal wire
TX2‧‧‧金屬線TX2‧‧‧ metal wire
W‧‧‧窗蓋W‧‧ ‧ window cover
第1圖為包含一電容式觸控螢幕面板和一顯示裝置之一顯示裝置組件之一剖視圖。1 is a cross-sectional view of a display device assembly including a capacitive touch screen panel and a display device.
第2A圖為依照一個實施例之用於一顯示裝置之一觸控螢幕面板之一俯 視圖。2A is a diagram of one of the touch screen panels for a display device according to an embodiment view.
第2B圖為沿著第2A圖之觸控螢幕面板之線I-I’之一剖視圖。Fig. 2B is a cross-sectional view taken along line I-I' of the touch screen panel of Fig. 2A.
第3A圖為依照另一實施例之用於一顯示裝置之一觸控螢幕面板之一俯視圖。3A is a top plan view of one of the touch screen panels for a display device in accordance with another embodiment.
第3B圖為沿著第3A圖之觸控螢幕面板之線I-I’之一剖視圖。Fig. 3B is a cross-sectional view of the line I-I' along the touch screen panel of Fig. 3A.
第4A圖為依照另一實施例之用於一顯示裝置之一觸控螢幕面板之一俯視圖。4A is a top plan view of one of the touch screen panels for a display device in accordance with another embodiment.
第4B圖為沿著第4A圖之觸控螢幕面板之線II-II’之一剖視圖。Figure 4B is a cross-sectional view taken along line II-II' of the touch screen panel of Figure 4A.
第5A圖為依照第2A圖和第2B圖之實施例之用於形成用於顯示裝置之觸控螢幕面板之驅動電極之一製程之一俯視圖。Figure 5A is a top plan view of one of the processes for forming a drive electrode for a touch screen panel for a display device in accordance with an embodiment of Figures 2A and 2B.
第5B圖和第5C圖為依照一個實施例之沿著第5A之線I-I’之剖視圖,闡述依照第2A圖和第2B圖之實施例之用於形成用於顯示裝置之觸控螢幕面板之感測電極之一製程。5B and 5C are cross-sectional views along line I-I' of line 5A, illustrating a touch screen for forming a display device in accordance with embodiments of FIGS. 2A and 2B, in accordance with an embodiment. One of the sensing electrodes of the panel.
第6A圖為依照一個實施例之用於形成一絕緣層之一製程之一俯視圖,此絕緣層具有暴露觸控螢幕面板之感測電極之部份之第一接觸孔。6A is a top plan view of a process for forming an insulating layer having a first contact hole exposing a portion of the sensing electrode of the touch screen panel, in accordance with an embodiment.
第6B圖至第6D圖為依照一個實施例之沿著第6A圖之線I-I’之剖視圖,闡述用於形成一絕緣層之一製程,此絕緣層具有暴露觸控螢幕面板之感測電極之部份之第一接觸孔。6B through 6D are cross-sectional views along line II' of FIG. 6A, illustrating a process for forming an insulating layer having an exposed touch panel panel, in accordance with an embodiment. a first contact hole of a portion of the electrode.
第7A圖為依照一個實施例之用於形成用於顯示裝置之觸控螢幕面板之第一路由線、驅動電極、第二路由線、以及一硬覆層之一製程之一俯視圖。7A is a top plan view of one of a first routing line, a drive electrode, a second routing line, and a hard coating for forming a touch screen panel for a display device in accordance with one embodiment.
第7B圖和第7C圖為依照一個實施例之沿著第7A圖之線I-I’之剖視圖,闡述用於形成用於顯示裝置之觸控螢幕面板之第一路由線、驅動電極、以及第二路由線之一製程。7B and 7C are cross-sectional views along line II' of FIG. 7A, illustrating a first routing line, a driving electrode, and the like for forming a touch screen panel for a display device, in accordance with an embodiment. One of the second routing lines.
第8A圖為依照一個實施例之用於形成用於顯示裝置之觸控螢幕面板之一硬覆層之一製程之一俯視圖。8A is a top plan view of one of the processes for forming a hard coating of a touch screen panel for a display device in accordance with one embodiment.
第8B圖為依照一個實施例之沿著第8圖之線I-I’之一剖視圖,闡述用於形成用於顯示裝置之觸控螢幕面板之一硬覆層之製程。Figure 8B is a cross-sectional view along line I-I' of Figure 8 illustrating a process for forming a hard coating of a touch screen panel for a display device in accordance with one embodiment.
第9圖為依照一個實施例在接觸孔透過第6B圖至第6D圖之製程形成之後所額外形成之一導電輔助層CP之一剖視圖。Figure 9 is a cross-sectional view showing one of the conductive auxiliary layers CP additionally formed after the contact holes are formed through the processes of Figs. 6B to 6D in accordance with one embodiment.
在下文中,本發明之典型實施例將參考附圖而詳細描述。在整個說明書中,同樣參考標號實質代表同樣元件。Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Throughout the specification, the same reference numerals will be used to refer to the same elements.
第1圖係為包含一電容式觸控螢幕面板TP和一顯示裝置DP之一示例顯示裝置組件5之一剖視圖。觸控螢幕面板TP包含複數個驅動電極TS和複數個感測電極RS。驅動電極TS係形成在一透明基板10之一個表面上。感測電極RS係形成在透明基板10之另一表面上,並且與驅動電極TS交叉。1 is a cross-sectional view of an exemplary display device assembly 5 including a capacitive touch screen panel TP and a display device DP. The touch screen panel TP includes a plurality of driving electrodes TS and a plurality of sensing electrodes RS. The driving electrode TS is formed on one surface of a transparent substrate 10. The sensing electrode RS is formed on the other surface of the transparent substrate 10 and intersects the driving electrode TS.
一窗蓋W透過第一粘結劑A1係附著於感測電極RS所形成之觸控螢幕面板TP之上表面。窗蓋W通常由薄膜製成,提供剛度至顯示裝置組件5。為了提供足夠的剛度至顯示裝置組件5,窗蓋W通常具有一定厚度。顯示裝置DP透過第二粘結劑A2係附著於觸控螢幕面板TP之下表面(驅動電極TS所形成之地方)。A window cover W is attached to the upper surface of the touch screen panel TP formed by the sensing electrode RS through the first adhesive A1. The window cover W is typically made of a film that provides rigidity to the display device assembly 5. In order to provide sufficient rigidity to the display device assembly 5, the window cover W typically has a certain thickness. The display device DP is attached to the lower surface of the touch screen panel TP through the second adhesive A2 (where the drive electrodes TS are formed).
但是,蓋窗W之重量和厚度,有助於顯示裝置組件5之總重量和總厚度。而且,結合蓋窗W至感測電極RS和透明基板之製程可能造成降低顯示裝置組件5之產量之缺陷。However, the weight and thickness of the cover window W contribute to the total weight and total thickness of the display unit assembly 5. Moreover, the process of combining the cover window W to the sensing electrode RS and the transparent substrate may cause defects in reducing the yield of the display device assembly 5.
實施例係關於在一電容式觸控螢幕面板中,提供聚合物層於一透明基板之兩側。透過用一更薄和更輕兩個聚合物層更換一較厚和較重窗蓋,在保持觸控螢幕面板之剛度之同時,觸控螢幕面板之總重可以被降低。而且,形成聚合物層之製程消除了使用粘結劑以保護一蓋窗至透明基板之需要,造成觸控螢幕面板之更少缺陷和增加的產量。Embodiments relate to providing a polymer layer on both sides of a transparent substrate in a capacitive touch screen panel. By replacing a thicker and heavier window cover with a thinner and lighter polymer layer, the total weight of the touch screen panel can be reduced while maintaining the stiffness of the touch screen panel. Moreover, the process of forming a polymer layer eliminates the need to use an adhesive to protect a cover window to a transparent substrate, resulting in fewer defects and increased throughput of the touch screen panel.
第2A圖係為依照一實施例之用於一顯示裝置之一觸控螢幕面板之一俯視圖。第2B圖係為沿著第2A圖之觸控螢幕面板之線I-I’之一剖視圖。第2A圖和第2B圖之觸控螢幕面板被劃分為三個主要部份:一電極部份A、一路由線部份B、以及一接墊部份C。2A is a top plan view of one of the touch screen panels for a display device in accordance with an embodiment. Fig. 2B is a cross-sectional view taken along line I-I' of the touch screen panel of Fig. 2A. The touch screen panels of FIGS. 2A and 2B are divided into three main parts: an electrode portion A, a routing line portion B, and a pad portion C.
除了其他部件以外,觸控螢幕面板之電極部份A可以包含:一基板100、用作感測電極之複數個第一電極RS(下文稱為“第一電極RS”)、用作驅動電極之複數個第二電極TS(下文稱為“第二電極TS”)、形成在基板100之一個表面上之一聚合物層HC1(下文稱為“絕緣層HC1”)、形成在基板之另一表面上之另一聚合物層HC2(下文稱為“絕 緣層HC2”)。The electrode portion A of the touch screen panel may include, among other components, a substrate 100, a plurality of first electrodes RS (hereinafter referred to as "first electrodes RS") serving as sensing electrodes, and used as driving electrodes. A plurality of second electrodes TS (hereinafter referred to as "second electrodes TS"), one polymer layer HC1 (hereinafter referred to as "insulating layer HC1") formed on one surface of the substrate 100, formed on the other surface of the substrate Another polymer layer on the HC2 (hereinafter referred to as "absolute Edge layer HC2").
第一電極RS係形成在基板100之一個表面上,並且沿著平行於一第一方向(例如Y軸方向)延伸。複數個第二電極TS係形成在配置以覆蓋第一電極RS之絕緣層HC1上,並且沿著不同於第一方向之一第二方向(例如X軸方向)延伸,進而第一電極RS和第二電極TS交叉。構成觸控螢幕面板之第一電極RS和第二電極TS係形成在基板100之一側,並且透過絕緣層HC1互相電絕緣。與絕緣層HC1相同材料所製成之硬覆層HC2係形成在基板100之另一側。The first electrode RS is formed on one surface of the substrate 100 and extends in parallel to a first direction (for example, the Y-axis direction). A plurality of second electrodes TS are formed on the insulating layer HC1 disposed to cover the first electrode RS, and extend in a second direction (for example, an X-axis direction) different from the first direction, and further the first electrodes RS and The two electrodes TS cross. The first electrode RS and the second electrode TS constituting the touch screen panel are formed on one side of the substrate 100, and are electrically insulated from each other by the insulating layer HC1. A hard coating layer HC2 made of the same material as the insulating layer HC1 is formed on the other side of the substrate 100.
基板100可以由諸如聚對苯二甲酸乙二醇酯(PET)之一柔性聚合物材料所形成。第一電極RS和第二電極TS可以由諸如氧化銦錫(ITO)、氧化銦鋅(IZO)、鎵摻雜氧化鋅(GZO)、金屬奈米線、或碳基透明電極之一透明導電材料所形成。絕緣層HC1和硬覆層HC2係由諸如具有極好固化性之一典型紫外線(UV)固化樹脂、一奈米二氧化矽複合材料UV固化樹脂、以及一倍半矽氧烷(SSQ)基UV固化樹脂之一UV固化樹脂所形成。典型UV固化樹脂具有下列公式(1)中所示之一化學結構,奈米二氧化矽複合材料UV固化樹脂具有在公式(2)中所示之一化學結構,以及SSQ基UV固化樹脂具有下列公式(3)中所示之一化學結構。The substrate 100 may be formed of a flexible polymer material such as polyethylene terephthalate (PET). The first electrode RS and the second electrode TS may be made of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), gallium-doped zinc oxide (GZO), a metal nanowire, or a carbon-based transparent electrode. Formed. The insulating layer HC1 and the hard coating layer HC2 are composed of, for example, a typical ultraviolet (UV) curing resin having excellent curability, a nanometer cerium oxide composite UV curing resin, and a sesquioxane (SSQ) based UV. One of the cured resins is formed of a UV curable resin. A typical UV curable resin has one of the chemical structures shown in the following formula (1), the nano cerium oxide composite UV curable resin has one of the chemical structures shown in the formula (2), and the SSQ-based UV curable resin has the following One of the chemical structures shown in formula (3).
除了其他部件以外,路由線部分B可以包含,在基板100之電極部份A之外部周圍形成在絕緣層HC1上之複數個第一路由線RW1和複數個第二路由線RW2。複數個第一路由線RW1經由絕緣層HC1之接觸孔CH連接至暴露的複數個第一電極RS。複數個第二路由線RW2係直接連接至形成在絕緣層HC1上之複數個第二電極TS。硬覆層HC2係形成在對應於第一路由線RW1和第二路由線RW2所形成之區域之基板100之另一表面上。第一路由線RW1和第二路由線RW2係由諸如鋁(Al)、鋁釹(AlNd)、鉬(Mo)、鉬鈦(MoTi)、銅(Cu)、鉻(Cr)、銀(Ag)、以及銀基合金之金屬所形成。The routing line portion B may include, among other components, a plurality of first routing lines RW1 and a plurality of second routing lines RW2 formed on the insulating layer HC1 around the outside of the electrode portion A of the substrate 100. A plurality of first routing lines RW1 are connected to the exposed plurality of first electrodes RS via contact holes CH of the insulating layer HC1. A plurality of second routing lines RW2 are directly connected to a plurality of second electrodes TS formed on the insulating layer HC1. The hard coating layer HC2 is formed on the other surface of the substrate 100 corresponding to the region formed by the first routing line RW1 and the second routing line RW2. The first routing line RW1 and the second routing line RW2 are made of, for example, aluminum (Al), aluminum germanium (AlNd), molybdenum (Mo), molybdenum titanium (MoTi), copper (Cu), chromium (Cr), silver (Ag). And the formation of a metal of a silver-based alloy.
接墊部份C可以包含,除了其他部件之外,形成在基板100之路由線部份B之附近之複數個第一接墊RP1和 複數個第二接墊RP2。第一接墊RP1之每個透過一第一路由線RW1係連接至一第一電極RS。複數個第二接墊RP2之每個透過一第二路由線RW2係連接至一第二電極TS。第一接墊RP1和第二接墊RP2係同樣由諸如鋁(Al)、鋁釹(AlNd)、鉬(Mo)、鉬鈦(MoTi)、銅(Cu)、鉻(Cr)、銀(Ag)、以及銀基合金之金屬所形成。The pad portion C may include, among other components, a plurality of first pads RP1 formed in the vicinity of the routing line portion B of the substrate 100. A plurality of second pads RP2. Each of the first pads RP1 is connected to a first electrode RS through a first routing line RW1. Each of the plurality of second pads RP2 is connected to a second electrode TS through a second routing line RW2. The first pad RP1 and the second pad RP2 are also composed of, for example, aluminum (Al), aluminum lanthanum (AlNd), molybdenum (Mo), molybdenum titanium (MoTi), copper (Cu), chromium (Cr), silver (Ag). ), and the formation of a metal of a silver-based alloy.
第3A圖係為依照另一實施例之用於一顯示裝置之一觸控螢幕面板之一俯視圖。第3B圖係為沿著第3A圖之觸控螢幕面板之線I-I’之一剖視圖。第3A圖和第3B圖之用於顯示裝置之觸控螢幕面板被分割為:一電極部份A、一路由線部份B、以及一接墊部份C。3A is a top plan view of one of the touch screen panels for a display device in accordance with another embodiment. Fig. 3B is a cross-sectional view taken along line I-I' of the touch screen panel of Fig. 3A. The touch screen panel for the display device of FIGS. 3A and 3B is divided into an electrode portion A, a routing line portion B, and a pad portion C.
除了其他部件以外,電極部份A可以包含:形成在一基板100之一個表面上之複數個第一電極RS、與複數個第一電極RS交叉之複數個第二電極TS、具有***在第一電極RS和第二電極TS兩者之間之一絕緣層HC1、以及形成在基板之另一表面上之另一硬覆層HC2。第一電極RS係形成在基板100之一個表面上,並且沿著平行於一第一方向(例如Y軸方向)延伸。複數個第二電極TS係形成在配置以覆蓋第一電極RS之絕緣層HC1上,並且沿著平行於一第二方向(例如X軸方向)延伸以與第一電極RS交叉。構成觸控螢幕面板之第一電極RS和第二電極TS係形成在基板100之一側,以及 透過絕緣層HC1互相電絕緣,與絕緣層HC1相同材料製成之硬覆層HC2係形成在基板100之另一側。The electrode portion A may include, among other components, a plurality of first electrodes RS formed on one surface of the substrate 100, and a plurality of second electrodes TS crossing the plurality of first electrodes RS, having the first insertion An insulating layer HC1 between the electrode RS and the second electrode TS and another hard coating layer HC2 formed on the other surface of the substrate. The first electrode RS is formed on one surface of the substrate 100 and extends in parallel to a first direction (for example, the Y-axis direction). A plurality of second electrodes TS are formed on the insulating layer HC1 disposed to cover the first electrode RS, and extend in parallel with a second direction (for example, the X-axis direction) to cross the first electrode RS. The first electrode RS and the second electrode TS constituting the touch screen panel are formed on one side of the substrate 100, and The hard coating layer HC2 made of the same material as the insulating layer HC1 is electrically insulated from each other through the insulating layer HC1, and is formed on the other side of the substrate 100.
複數個第一電極RS之每個係形成為包含複數個與垂直金屬線Rx2交叉之複數個水平金屬線Rx1之一網。複數個第二電極TS之每個係形成為與複數個垂直金屬線Tx2交叉之複數個水平金屬線Tx1之一網。Each of the plurality of first electrodes RS is formed to include a plurality of nets of a plurality of horizontal metal lines Rx1 crossing the vertical metal lines Rx2. Each of the plurality of second electrodes TS is formed as a net of a plurality of horizontal metal wires Tx1 crossing a plurality of vertical metal wires Tx2.
在第3A圖和第3B圖之實施例中,既然網圖案可以透過電極線之一組合而形成,透過第一電極RS和第二電極TS之金屬線所形成之網可以以各種形狀而被製造。儘管第3A圖之網圖案係為條紋形狀,網圖案可以具有諸如一三角、一矩形、一菱形、一多邊形、一圓形、一橢圓形或一蜻蜓形狀、或其組合之其他形狀。In the embodiments of FIGS. 3A and 3B, since the mesh pattern can be formed by a combination of one of the electrode lines, the mesh formed by the metal wires passing through the first electrode RS and the second electrode TS can be manufactured in various shapes. . Although the mesh pattern of Fig. 3A is a stripe shape, the mesh pattern may have other shapes such as a triangle, a rectangle, a diamond, a polygon, a circle, an ellipse or a dome shape, or a combination thereof.
在第3A圖和第3B圖之觸控螢幕面板中,基板100係由諸如聚對苯二甲酸乙二醇酯(PET)之一柔性聚合物所形成。第一電極RS之金屬線Rx1和Rx2和第二電極TS之金屬線Tx1和Tx2係由諸如鋁(Al)、鋁釹(AlNd)、鉬(Mo)、鉬鈦(MoTi)、銅(Cu)、鉻(Cr)、銀(Ag)、以及銀基合金之金屬所形成。如在第2A圖和第2B圖之實施例中,絕緣層HC1和硬覆層HC2係由諸如具有極好固化性之一典型紫外線(UV)固化樹脂、一奈米二氧化矽複合材料UV固化樹脂、以及一倍半矽氧烷(SSQ)基UV固化樹脂之一UV固化樹脂 所形成。作為一種選擇,絕緣層HC1和硬覆層HC2可以有一熱固樹脂所形成。In the touch screen panels of FIGS. 3A and 3B, the substrate 100 is formed of a flexible polymer such as polyethylene terephthalate (PET). The metal lines Rx1 and Rx2 of the first electrode RS and the metal lines Tx1 and Tx2 of the second electrode TS are made of, for example, aluminum (Al), aluminum lanthanum (AlNd), molybdenum (Mo), molybdenum titanium (MoTi), copper (Cu). , chromium (Cr), silver (Ag), and metal based on silver-based alloys. As in the embodiments of FIGS. 2A and 2B, the insulating layer HC1 and the hard coating layer HC2 are cured by a typical ultraviolet (UV) curing resin such as one having excellent curability, and a nanometer cerium oxide composite. Resin, and UV curable resin, one of the sesquioxalate (SSQ) based UV curing resins Formed. Alternatively, the insulating layer HC1 and the hard coating layer HC2 may be formed of a thermosetting resin.
除了其他部件以外,路由線部份B可以包含在基板100之電極部份A之外部周圍形成在絕緣層HC1上之複數個第一路由線RW1和複數個第二路由線RW2。複數個第一路由線RW1之每個經由絕緣層HC1之接觸孔CH係連接至金屬線Rx1、Rx2之至少一個。複數個第二路由線RW2之每個係直接連接至形成在絕緣層HC1上之第二電極TS之金屬線Tx1、Tx2之至少一個。從電極部份A延伸之硬覆層HC2係形成在第一路由線RW1和第二路由線RW2所形成之基板100之另一表面上。第一路由線RW1和第二路由線RW2係由諸如鋁(Al)、鋁釹(AlNd)、鉬(Mo)、鉬鈦(MoTi)、銅(Cu)、鉻(Cr)、銀(Ag)、以及銀基合金之金屬所形成。The routing line portion B may include a plurality of first routing lines RW1 and a plurality of second routing lines RW2 formed on the insulating layer HC1 around the outside of the electrode portion A of the substrate 100, among other components. Each of the plurality of first routing lines RW1 is connected to at least one of the metal lines Rx1, Rx2 via a contact hole CH of the insulating layer HC1. Each of the plurality of second routing lines RW2 is directly connected to at least one of the metal lines Tx1, Tx2 of the second electrode TS formed on the insulating layer HC1. A hard coating layer HC2 extending from the electrode portion A is formed on the other surface of the substrate 100 formed by the first routing line RW1 and the second routing line RW2. The first routing line RW1 and the second routing line RW2 are made of, for example, aluminum (Al), aluminum germanium (AlNd), molybdenum (Mo), molybdenum titanium (MoTi), copper (Cu), chromium (Cr), silver (Ag). And the formation of a metal of a silver-based alloy.
接墊部份C可以包含,除了其他部件之外,形成在基板100之路由線部份B之附近之複數個第一接墊RP1和複數個第二接墊RP2。複數個第一接墊RP1之每個透過複數個第一路由線RW1係連接至一電極RS之金屬線Rx1和Rx2之至少一個。複數個第二接墊RP2之每個透過複數個第二路由線RW2係連接至第二電極TS之金屬線Tx1、Tx2之至少一個。第一接墊RP1和第二接墊RP2係同樣由諸如鋁(Al)、鋁釹(AlNd)、鉬(Mo)、鉬鈦(MoTi)、銅(Cu)、鉻(Cr)、 銀(Ag)、以及銀基合金之金屬所形成。The pad portion C may include, among other components, a plurality of first pads RP1 and a plurality of second pads RP2 formed in the vicinity of the routing line portion B of the substrate 100. Each of the plurality of first pads RP1 is connected to at least one of the metal lines Rx1 and Rx2 of one electrode RS through a plurality of first routing lines RW1. Each of the plurality of second pads RP2 is connected to at least one of the metal lines Tx1, Tx2 of the second electrode TS through a plurality of second routing lines RW2. The first pad RP1 and the second pad RP2 are also made of, for example, aluminum (Al), aluminum lanthanum (AlNd), molybdenum (Mo), molybdenum titanium (MoTi), copper (Cu), chromium (Cr), Silver (Ag), and a metal of a silver-based alloy.
在第3A圖和第3B圖之觸控螢幕面板中,觸控電極係由低電阻率之金屬所形成。因此,可以降低觸控螢幕面板之阻抗和電容。這降低時間常數,因此獲得改善的觸控敏感度。並且,當使觸控螢幕面板之尺寸更大時這會提供一優勢。In the touch screen panels of FIGS. 3A and 3B, the touch electrodes are formed of a low resistivity metal. Therefore, the impedance and capacitance of the touch screen panel can be reduced. This reduces the time constant and thus results in improved touch sensitivity. Also, this provides an advantage when the size of the touch screen panel is made larger.
第4A圖係為依照另一實施例之用於一顯示裝置之一觸控螢幕面板之一俯視圖。第4B圖係為沿著第4A圖之觸控螢幕面板之線II-II’之一剖視圖。第4A圖和第4B圖之顯示裝置之觸控螢幕面板被分割為:一電極部份A、一路由線部份B、以及一接墊部份C。4A is a top plan view of one of the touch screen panels for a display device in accordance with another embodiment. Figure 4B is a cross-sectional view taken along line II-II' of the touch screen panel of Figure 4A. The touch screen panel of the display device of FIGS. 4A and 4B is divided into an electrode portion A, a routing line portion B, and a pad portion C.
除了其他部件以外,電極部份A可以包含:形成在一基板200之一個表面上之複數個第一電極RS、與複數個第一電極RS交叉之複數個第二電極TS、具有***在第一電極RS和第二電極TS兩者之間之一絕緣層HC1、以及形成在基板之另一表面上之另一硬覆層HC2。The electrode portion A may include, among other components, a plurality of first electrodes RS formed on one surface of a substrate 200, and a plurality of second electrodes TS crossing the plurality of first electrodes RS, having the first insertion An insulating layer HC1 between the electrode RS and the second electrode TS and another hard coating layer HC2 formed on the other surface of the substrate.
複數個第一電極RS係形成在基板100上,並且沿著一第一方向(例如Y軸方向)延伸。第一電極RS之每個可以被形成以具有形狀為一三角、一矩形、一菱形、一多邊形、一圓形、一橢圓形或其之一組合之第一節點131。第一連接部份132連接鄰近電極節點131。第一節點131和第一連接 部份132共同形成一第一電極RS。儘管在第4A圖中之第一電極RS用作感測電極,第一電極RS也可以被配置為驅動電極。A plurality of first electrodes RS are formed on the substrate 100 and extend along a first direction (for example, the Y-axis direction). Each of the first electrodes RS may be formed to have a first node 131 having a shape of a triangle, a rectangle, a diamond, a polygon, a circle, an ellipse, or a combination thereof. The first connection portion 132 is connected to the adjacent electrode node 131. First node 131 and first connection The portions 132 together form a first electrode RS. Although the first electrode RS in FIG. 4A is used as a sensing electrode, the first electrode RS may also be configured as a driving electrode.
複數個第二電極TS係形成在配置以覆蓋第一電極RS之絕緣層HC1上,並且沿著一第二方向(例如X軸方向)延伸以與第一電極RS交叉。第二電極TS之每個包含形狀為一三角、一矩形、一菱形、一多邊形、一圓形、一橢圓形或其之一組合形狀之第二節點133。類似於第一節點131和第一連接部份132,第二連接部份134連接鄰近第二節點133。第二節點133和第二連接部份134連接鄰近第二節點133。第二節點133和第二連接部份134共同形成一第二電極TS。儘管在第4A圖中之複數個第二電極TS用作感測電極,第二電極TS也可以用作驅動電極。如果複數個第一電極RS用作感測電極,複數個第二電極TS用作驅動電極。如果複數個第一電極RS用作驅動電極,複數個第二電極TS用作感測電極。A plurality of second electrodes TS are formed on the insulating layer HC1 disposed to cover the first electrode RS, and extend along a second direction (for example, the X-axis direction) to cross the first electrode RS. Each of the second electrodes TS includes a second node 133 having a shape of a triangle, a rectangle, a diamond, a polygon, a circle, an ellipse or a combination thereof. Similar to the first node 131 and the first connection portion 132, the second connection portion 134 is connected adjacent to the second node 133. The second node 133 and the second connection portion 134 are connected adjacent to the second node 133. The second node 133 and the second connection portion 134 together form a second electrode TS. Although the plurality of second electrodes TS in the FIG. 4A are used as the sensing electrodes, the second electrodes TS can also function as the driving electrodes. If a plurality of first electrodes RS are used as the sensing electrodes, a plurality of second electrodes TS are used as the driving electrodes. If a plurality of first electrodes RS are used as the driving electrodes, the plurality of second electrodes TS function as sensing electrodes.
第一電極RS和第二電極TS係形成在基板200之相同側,並且透過絕緣層HC1互相電絕緣。與絕緣層HC1相同材料製成之硬覆層HC2係形成在基板200之另一側。The first electrode RS and the second electrode TS are formed on the same side of the substrate 200, and are electrically insulated from each other by the insulating layer HC1. A hard coating layer HC2 made of the same material as the insulating layer HC1 is formed on the other side of the substrate 200.
如在第2A圖和第2B圖之實施例中,基板200可以由諸如聚對苯二甲酸乙二醇酯(PET)之一柔性聚合物所形成。第一電極RS和第二電極TS可以由諸如氧化銦錫 (ITO)、氧化銦鋅(IZO)、鎵摻雜氧化鋅(GZO)、金屬奈米線、或碳基透明電極之一透明導電材料所形成。絕緣層HC1和硬覆層HC2係由諸如具有極好固化性之一典型紫外線(UV)固化樹脂、一奈米二氧化矽複合材料UV固化樹脂、以及一倍半矽氧烷(SSQ)基UV固化樹脂之一UV固化樹脂所形成。As in the embodiments of FIGS. 2A and 2B, the substrate 200 may be formed of a flexible polymer such as polyethylene terephthalate (PET). The first electrode RS and the second electrode TS may be made of, for example, indium tin oxide (ITO), indium zinc oxide (IZO), gallium-doped zinc oxide (GZO), metal nanowire, or a transparent conductive material of one of carbon-based transparent electrodes. The insulating layer HC1 and the hard coating layer HC2 are composed of, for example, a typical ultraviolet (UV) curing resin having excellent curability, a nanometer cerium oxide composite UV curing resin, and a sesquioxane (SSQ) based UV. One of the cured resins is formed of a UV curable resin.
除了其他部件以外,路由線部份B可以包含在基板200之電極部份A之外部周圍形成在絕緣層HC1上之複數個第一路由線RW1和複數個第二路由線RW2。複數個第一路由線RW1經由絕緣層HC1之接觸孔CH係連接至金屬線Rx1、Rx2之至少一個,以及複數個第二路由線RW2係直接連接至形成在絕緣層HC1上之第二電極TS之金屬線Tx1、Tx2之至少一個。從電極部份A延伸之硬覆層HC2係形成在第一路由線RW1和第二路由線RW2所形成之基板200之另一表面上。第一路由線RW1和第二路由線RW2係由諸如鋁(Al)、鋁釹(AlNd)、鉬(Mo)、鉬鈦(MoTi)、銅(Cu)、鉻(Cr)、銀(Ag)、以及銀基合金之金屬所形成。The routing line portion B may include a plurality of first routing lines RW1 and a plurality of second routing lines RW2 formed on the insulating layer HC1 around the outside of the electrode portion A of the substrate 200, among other components. A plurality of first routing lines RW1 are connected to at least one of the metal lines Rx1, Rx2 via a contact hole CH of the insulating layer HC1, and a plurality of second routing lines RW2 are directly connected to the second electrode TS formed on the insulating layer HC1. At least one of the metal wires Tx1, Tx2. The hard coating layer HC2 extending from the electrode portion A is formed on the other surface of the substrate 200 formed by the first routing line RW1 and the second routing line RW2. The first routing line RW1 and the second routing line RW2 are made of, for example, aluminum (Al), aluminum germanium (AlNd), molybdenum (Mo), molybdenum titanium (MoTi), copper (Cu), chromium (Cr), silver (Ag). And the formation of a metal of a silver-based alloy.
接墊部份C可以包含,除了其他部件之外,形成在基板200之路由線部份B之附近之複數個第一接墊RP1和複數個第二接墊RP2。複數個第一接墊RP1之每個透過一第一路由線RW1係連接至一第一電極RS。複數個第二接墊RP2之每個透過一第二路由線RW2係連接至一第二電極TS。第一 接墊RP1和第二接墊RP2可以由鋁(Al)、鋁釹(AlNd)、鉬(Mo)、鉬鈦(MoTi)、銅(Cu)、鉻(Cr)、銀(Ag)、以及銀基合金之金屬所形成。The pad portion C may include, among other components, a plurality of first pads RP1 and a plurality of second pads RP2 formed in the vicinity of the routing line portion B of the substrate 200. Each of the plurality of first pads RP1 is connected to a first electrode RS through a first routing line RW1. Each of the plurality of second pads RP2 is connected to a second electrode TS through a second routing line RW2. the first The pad RP1 and the second pad RP2 may be made of aluminum (Al), aluminum lanthanum (AlNd), molybdenum (Mo), molybdenum titanium (MoTi), copper (Cu), chromium (Cr), silver (Ag), and silver. The metal of the base alloy is formed.
第5A圖係為依照第2A圖和第2B圖之實施例之用於形成用於顯示裝置之觸控螢幕面板之驅動電極之一製程之一俯視圖。第5B圖和第5C圖係為沿著第5A之線I-I’之剖視圖,闡述依照第2A圖和第2B圖之實施例之用於形成用於顯示裝置之觸控螢幕面板之感測電極之一製程。一第一透明導電層係形成在由諸如由諸如聚對苯二甲酸乙二醇酯(PET)之一聚合物材料所製成之基板100之一個表面上。然後,複數個第一電極RS或感測電極RS(下文稱為第一電極)被圖案化,以如第5A圖所示沿著平行於一第一方向(例如Y軸方向)延伸。在一個實施例中,複數個第一電極RS可以透過使用一噴墨設備透過注射金屬而形成在基板100之一個表面上。Figure 5A is a top plan view of one of the processes for forming a drive electrode for a touch screen panel for a display device in accordance with the embodiments of Figures 2A and 2B. 5B and 5C are cross-sectional views taken along line I-I' of the 5A, illustrating the sensing for forming a touch screen panel for a display device according to the embodiments of FIGS. 2A and 2B. One of the processes of the electrode. A first transparent conductive layer is formed on one surface of the substrate 100 made of, for example, a polymer material such as polyethylene terephthalate (PET). Then, a plurality of first electrodes RS or sensing electrodes RS (hereinafter referred to as first electrodes) are patterned to extend in parallel to a first direction (for example, the Y-axis direction) as shown in FIG. 5A. In one embodiment, the plurality of first electrodes RS may be formed on one surface of the substrate 100 by injecting metal using an inkjet device.
如第5C中所示,一犧牲薄膜SF係形成在第一電極RS之一預定區域中。犧牲薄膜SF係形成在接觸孔即將形成在一絕緣層中之一位置,以避免在接觸孔之形成中第一電極RS之損害。應當注意犧牲薄膜SF可以被省略。As shown in FIG. 5C, a sacrificial film SF is formed in a predetermined region of the first electrode RS. The sacrificial film SF is formed at a position where the contact hole is to be formed in an insulating layer to avoid damage of the first electrode RS in the formation of the contact hole. It should be noted that the sacrificial film SF can be omitted.
第6A圖係為依照第2A圖和第2B圖之實施例之用於形成一絕緣層之一製程之一俯視圖,絕緣層具有暴露用 於顯示裝置之觸控螢幕面板之感測電極之部份之第一接觸孔。第6B圖至第6D圖係為依照第2A圖和第2B圖之實施例之沿著第6A圖之線I-I’之剖視圖,闡述用於形成一絕緣層之一製程,絕緣層具有暴露用於顯示裝置之觸控螢幕面板之感測電極之部份之第一接觸孔。6A is a top view of a process for forming an insulating layer in accordance with the embodiments of FIGS. 2A and 2B, the insulating layer having an exposure a first contact hole of a portion of the sensing electrode of the touch screen panel of the display device. 6B to 6D are cross-sectional views taken along line II' of FIG. 6A according to the embodiment of FIGS. 2A and 2B, illustrating a process for forming an insulating layer, the insulating layer being exposed. a first contact hole for sensing a portion of the sensing electrode of the touch screen panel of the device.
具有接觸孔CH之一絕緣層HC1係形成在第一電極RS所形成之基板100之一整個表面上,進而第一電極RS之部份暴露。特別地,如第6B圖所示,諸如具有極好固化性之一典型紫外線(UV)固化樹脂、一奈米二氧化矽複合材料UV固化樹脂、以及一倍半矽氧烷(SSQ)基UV固化樹脂、或者一熱固樹膠之一UV固化樹脂被塗覆作為第一電極RS和一犧牲層SF所形成之基板100之前表面上之絕緣層。An insulating layer HC1 having a contact hole CH is formed on the entire surface of one of the substrates 100 formed by the first electrode RS, and a portion of the first electrode RS is exposed. Specifically, as shown in FIG. 6B, such as a typical ultraviolet (UV) curing resin having excellent curability, a nanometer cerium oxide composite UV curing resin, and a sesquioxane (SSQ) based UV A curing resin, or a thermosetting resin, one of UV curable resins is coated as an insulating layer on the front surface of the substrate 100 formed by the first electrode RS and a sacrificial layer SF.
如第6C圖中所示,接觸孔CH係形成以暴露第一電極RS之部份,或者通過絕緣層、第一電極和基板100之通孔TH係形成。第6C圖示出犧牲薄膜SF在接觸孔CH或通孔TH之形成中被移除。在形成如第6D圖中所示之通孔TH之情況下,犧牲薄膜SF可以最初不被形成。As shown in FIG. 6C, the contact hole CH is formed to expose a portion of the first electrode RS, or is formed by the insulating layer, the first electrode, and the through hole TH of the substrate 100. FIG. 6C shows that the sacrificial film SF is removed in the formation of the contact hole CH or the through hole TH. In the case where the through holes TH as shown in FIG. 6D are formed, the sacrificial film SF may not be initially formed.
儘管一光刻方法可以被用以形成接觸孔CH或通孔TH於絕緣層HC1中。也可以透過使用一二氧化碳(CO2)鐳射鑽孔方法、一螢幕印刷方法、一銘印(imprinting)方法、一干膜抗蝕劑層壓方法、以及一電液-動力(EHD)方法,形 成接觸孔CH於絕緣層HC1中。Although a photolithography method can be used to form the contact hole CH or the via hole TH in the insulating layer HC1. It is also possible to use a carbon dioxide (CO2) laser drilling method, a screen printing method, an imprinting method, a dry film resist lamination method, and an electro-hydraulic-dynamic (EHD) method. The contact hole CH is formed in the insulating layer HC1.
第7A圖係為依照第2A圖和第2B圖之實施例之用於形成用於顯示裝置之觸控螢幕面板之第一路由線、驅動電極、第二路由線、以及一硬覆層之一製程之一俯視圖。第7B圖和第7C圖係為依照第2A圖和第2B圖之實施例之沿著第7A圖之線I-I’之剖視圖,闡述用於形成用於顯示裝置之觸控螢幕面板之第一路由線、驅動電極、以及第二路由線之一製程。由諸如Al、AlNd、Mo、MoTi、Cu或Cr之金屬所製成之一第一導電層係沉積在具有接觸孔CH之一絕緣層CH1上,以及第一導電層使用一掩膜而使用工藝光刻製程而被圖案化。因此,如第7A圖和第7B圖所示,經由接觸孔CH分別連接至複數個第一電極RS之複數個第一路由線RW1和分別連接至複數個第一路由線RW1之複數個第一接墊RP1係形成絕緣層HC1上。7A is a first routing line, a driving electrode, a second routing line, and a hard coating layer for forming a touch screen panel for a display device according to the embodiments of FIGS. 2A and 2B. A top view of the process. 7B and 7C are cross-sectional views taken along line I-I' of FIG. 7A in accordance with the embodiments of FIGS. 2A and 2B, illustrating a second embodiment for forming a touch screen panel for a display device. A routing line, a drive electrode, and a second routing line process. A first conductive layer made of a metal such as Al, AlNd, Mo, MoTi, Cu or Cr is deposited on one of the insulating layers CH1 having the contact holes CH, and the first conductive layer is processed using a mask. The lithography process is patterned. Therefore, as shown in FIGS. 7A and 7B, a plurality of first routing lines RW1 respectively connected to the plurality of first electrodes RS via the contact holes CH and a plurality of first ones connected to the plurality of first routing lines RW1, respectively The pad RP1 is formed on the insulating layer HC1.
參考第7A圖至第7C圖,一第二透明導電層係形成在配置以覆蓋第一電極RS之絕緣層HC1上,然後圖案化。因此,複數個第二電極TS沿著與一第一方向(例如Y軸方向)交叉之一第二方向(例如X軸方向)而形成。經由接觸孔CH接觸暴露的第一電極RS之第一路由線RW1之第一層RW 1a、從第一路由線之第一層延伸之第一接墊RP1之一第一層(未示出)、從第二電極TS延伸之第二路由線RW2之一第 一層(未示出)、以及從第二路由線RW2之第一層(未示出)延伸之第二接墊RP2之一第一層(未示出)也係形成。第一路由線RW1之一第二層RW1b係形成在第一層RW1a上。第一接墊RP1之一第二層(未示出)也形成在第一接墊RP1之第一層上,第二路由線RW2之一第二層(未示出)也形成在第二路由線RW2之第一層上,以及第二接墊RP2之一第二層(未示出)也形成在第二接墊RP2之第一層上。Referring to FIGS. 7A to 7C, a second transparent conductive layer is formed on the insulating layer HC1 disposed to cover the first electrode RS, and then patterned. Therefore, the plurality of second electrodes TS are formed along a second direction (for example, the X-axis direction) crossing a first direction (for example, the Y-axis direction). a first layer RW 1a of the first routing line RW1 contacting the exposed first electrode RS via the contact hole CH, and a first layer (not shown) of the first pad RP1 extending from the first layer of the first routing line One of the second routing lines RW2 extending from the second electrode TS A layer (not shown), and a first layer (not shown) of a second pad RP2 extending from a first layer (not shown) of the second routing line RW2 are also formed. A second layer RW1b of one of the first routing lines RW1 is formed on the first layer RW1a. A second layer (not shown) of one of the first pads RP1 is also formed on the first layer of the first pads RP1, and a second layer (not shown) of the second routing line RW2 is also formed on the second route. A first layer of the wire RW2 and a second layer (not shown) of the second pad RP2 are also formed on the first layer of the second pad RP2.
第8A圖係為依照一個實施例之用於形成觸控螢幕面板之一硬覆層之一製程之一俯視圖。第8B圖係為沿著第8圖之線I-I’之一剖視圖,闡述依照一個實施例之用於形成觸控螢幕面板之一硬覆層之製程。第二電極TS所形成之基板100被倒置,然後一硬覆層HC2係形成在基板100之另一表面上。硬覆層HC2係由與絕緣層HC1相同材料所形成。Figure 8A is a top plan view of one of the processes for forming a hard coating of a touch screen panel in accordance with one embodiment. Figure 8B is a cross-sectional view along line I-I' of Figure 8, illustrating a process for forming a hard coating of a touch screen panel in accordance with one embodiment. The substrate 100 formed by the second electrode TS is inverted, and then a hard coating layer HC2 is formed on the other surface of the substrate 100. The hard coating layer HC2 is formed of the same material as the insulating layer HC1.
第9圖係為參考第6B圖至第6D圖,在接觸孔透過上面描述之製程形成之後所額外形成之一導電輔助層CP之一剖視圖。導電輔助圖案CP可以透過一螢幕印刷方法、一配置方法、一噴墨方法、或一電鍍方法,透過填充金屬油墨於接觸孔CH或通孔TH中而形成,導電輔助圖案CP可以由Ag、Cu等所形成。通常,一毛刺在形成接觸CH或通孔TH之製程中可以被形成。當毛刺形成時,水分可以沿著接觸孔CH或通孔TH之介面滲入。這樣的水分滲透可以引起第一路 由線RW1之腐蝕或中斷,從而降低第一路由線RW1和第一電極RS之接觸性能。導電輔助圖案CP係形成在第一路由線RW1上,第一路由線RW1形成在接觸孔CH或通孔TH中,以及此導電輔助圖案CP可以避免從外側之水分滲透。因此,導電輔助層CP避免由於水分之滲入之接觸性能之降低。Figure 9 is a cross-sectional view showing one of the conductive auxiliary layers CP additionally formed after the contact holes are formed through the processes described above with reference to Figs. 6B to 6D. The conductive auxiliary pattern CP may be formed by a screen printing method, a configuration method, an inkjet method, or an electroplating method, by filling a metal ink in the contact hole CH or the through hole TH, and the conductive auxiliary pattern CP may be made of Ag or Cu. Waiting for it to form. Generally, a burr can be formed in a process of forming a contact CH or a via TH. When the burrs are formed, moisture can penetrate along the interface of the contact hole CH or the through hole TH. Such moisture penetration can cause the first road Corroded or interrupted by the line RW1, thereby reducing the contact performance of the first routing line RW1 and the first electrode RS. The conductive auxiliary pattern CP is formed on the first routing line RW1, the first routing line RW1 is formed in the contact hole CH or the through hole TH, and the conductive auxiliary pattern CP can avoid moisture permeation from the outside. Therefore, the conductive auxiliary layer CP avoids a decrease in contact performance due to penetration of moisture.
除了在第3A圖和第3B圖之實施例中第一電極和第二電極使用金屬線電極之差別以外,參考第5A圖至第9圖上面所描述之製程可以應用至第3A和第3B之實施例。而且,除了第一電極和第二電極包含節點和連接部份之差別以外,參考第5A圖至第9圖上面所描述之製程可以應用至第4A和第4B之實施例。The processes described above with reference to FIGS. 5A to 9 can be applied to the 3A and 3B except for the difference between the first electrode and the second electrode using the metal wire electrodes in the embodiments of FIGS. 3A and 3B. Example. Moreover, the processes described above with reference to FIGS. 5A to 9 can be applied to the embodiments of FIGS. 4A and 4B, except that the first electrode and the second electrode include the difference between the node and the connection portion.
實施例有利形成聚合物材料於驅動電極和感測電極所形成之一基板之兩側。透過形成聚合物材料之層於基板之兩側,在避免由於存在使用在傳統觸控螢幕面板中之一窗蓋之厚度和重量上之增加之同時,觸控面板之剛度可以被增加。而且,用於結合窗蓋之粘結劑可以被省略,更降低觸控面板之總厚度和總重量。Embodiments advantageously form a polymeric material on either side of a substrate formed by the drive and sense electrodes. By forming a layer of polymeric material on both sides of the substrate, the stiffness of the touch panel can be increased while avoiding the increase in thickness and weight of one of the window covers used in conventional touch screen panels. Moreover, the adhesive for bonding the window cover can be omitted, and the total thickness and total weight of the touch panel are further reduced.
依照本發明之一典型實施例之觸控螢幕面板可以被應用至包含一液晶顯示裝置LCD、一場發射顯示器FED、一電漿顯示面板PDP、一場致發光裝置EL、以及一電泳顯示器之顯示器。The touch screen panel according to an exemplary embodiment of the present invention can be applied to a display including a liquid crystal display device LCD, a field emission display FED, a plasma display panel PDP, an electroluminescence device EL, and an electrophoretic display.
在本發明已經參考一限定數量實施例而被描述時,具有上述描述之有益效果,本領域之技術人員將意識到其他實施例可以不脫離這裡所揭露之本發明之範圍而被設計。因此,本發明之範圍應該僅限於所申附之請求項。While the invention has been described with reference to a particular embodiment of the embodiments of the present invention, it will be understood that Therefore, the scope of the invention should be limited only to the claimed claims.
100‧‧‧基板100‧‧‧Substrate
A‧‧‧電極部份A‧‧‧electrode part
B‧‧‧路由線部份B‧‧‧Route line section
C‧‧‧接墊部份C‧‧‧Patch part
CH‧‧‧接觸孔CH‧‧‧Contact hole
HC2‧‧‧硬覆層HC2‧‧‧hard coating
RP1‧‧‧第一接墊RP1‧‧‧first mat
RP2‧‧‧第二接墊RP2‧‧‧second mat
RS‧‧‧第一電極RS‧‧‧first electrode
RW1‧‧‧第一路由線RW1‧‧‧first route line
RW2‧‧‧第二路由線RW2‧‧‧Second routing line
TS‧‧‧驅動電極TS‧‧‧ drive electrode
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