TWI476032B - Game machine - Google Patents

Description

遊戲機Game machine

本發明涉及彈珠遊戲機及片子遊戲機等遊戲機，特別是涉及具有發現併防止非法行為的非法行為防止手段的遊戲機。The present invention relates to a game machine such as a marble game machine and a game console, and more particularly to a game machine having an illegal behavior prevention means for detecting and preventing illegal behavior.

彈珠遊戲機及片子遊戲機等遊戲機，通過搭載著CPU及ROM等電子元件的主控制基板和遊戲顯示用控制基板等各種控制基板來控制其遊戲動作。各種控制基板分別收容併封閉在特定的基板殼體內，然後安裝在遊戲機內，以便無法從外部看到。Game machines such as a marble game machine and a game machine are controlled by various control boards such as a main control board and an electronic display control board on which electronic components such as a CPU and a ROM are mounted. The various control substrates are respectively housed and enclosed in a specific substrate housing, and then mounted in the gaming machine so as not to be seen from the outside.

在過去的遊戲機中，作為封閉上述基板殼體併禁止開關基板殼體的手段，採用在背面塗抹著糊狀材料的封條(密封紙)，通過糊狀材料將封條粘貼在基板殼體的開關部分。然而，由於其只是靠糊狀材料的粘合力將封條粘貼在基板殼體上，所以存在著非法行為的問題，諸如非法行為者能夠無損壞地將封條從基板殼體上揭下，然後打開基板殼體，實施將搭載在控制基板上的正規ROM更換為非法的ROM等非法的改造，再將揭下的封條粘貼在基板殼體的原來部分，在他人不知曉的情況下實施遊戲行為。In the conventional game machine, as a means for closing the substrate case and prohibiting the switch substrate case, a seal (sealing paper) to which a paste material is applied on the back side, and a switch for pasting the seal to the substrate case by a paste material is used. section. However, since it merely sticks the seal to the substrate casing by the adhesive force of the paste material, there is a problem of illegal behavior, such as an illegal actor capable of uncovering the seal from the substrate casing without damage and then opening it. In the substrate case, an illegal modification such as replacing the regular ROM mounted on the control substrate with an illegal ROM is performed, and the removed seal is attached to the original portion of the substrate case, and the game behavior is performed without being known to others.

為了更有效地發現併防止這樣的非法行為，提出了將稱為IC標簽的片狀的電子元件作為封條來使用的方法(參照專利文獻1)。In order to more effectively detect and prevent such illegal behavior, a method of using a sheet-like electronic component called an IC tag as a seal has been proposed (see Patent Document 1).

然後，當非法行為者為了對控制基板等實施非法改造而打開基板殼體時，專利文獻1所公開的IC標簽會遭到不可逆的破壞，遊戲機管理者等看到被破壞的IC標簽後，就能容易地發現非法行為。Then, when the illegal actor opens the substrate casing in order to carry out an illegal modification of the control substrate or the like, the IC tag disclosed in Patent Document 1 is irreversibly destroyed, and the game machine manager or the like sees the damaged IC tag. It is easy to find illegal behavior.

【專利文獻1】日本專利特開2007-296239號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-296239

【發明欲解決的技術問題】[Technical problems to be solved by the invention]

然而，因為上述的IC標簽是形成電子電路的片狀電子元件，所以，若將IC標簽作為非法行為防止手段使用，則存在成本高等問題。However, since the IC tag described above is a chip-shaped electronic component that forms an electronic circuit, if the IC tag is used as an illegal behavior preventing means, there is a problem of high cost.

本發明是鑒於上述問題而完成的，其目的在於提供一種具有能夠廉價地製造的非法行為防止手段的遊戲機。並且，其目的還在於提供一種具有能夠容易地發現非法行為的非法行為防止手段的遊戲機。The present invention has been made in view of the above problems, and an object thereof is to provide a game machine having an illegal behavior preventing means that can be manufactured at low cost. Further, it is another object of the invention to provide a game machine having an illegal behavior preventing means capable of easily detecting an illegal act.

【解決問題的技術手段】[Technical means to solve the problem]

本發明是一種遊戲機，其具備一種具有非法行為防止手段，併收容著控制基板的基板殼體，該遊戲機的特徵在於，上述基板殼體具有互相封閉後即可收容上述控制基板的第1殼體部和第2殼體部，上述非法行為防止手段具有微芯片，其在封閉上述第1殼體部和第2殼體部後，安放在上述第1殼體部與第2殼體部之間，上述微芯片具有一迭層結構，其在固定在上述第2殼體部上的透明基板上，迭層著記錄信息的記錄層、反射層、保護層及粘合在上述第1殼體部上的粘合層，一旦打開上述第1殼體部和第2殼體部，則在上述微芯片上形成的上述記錄層和反射層會剝離、破損。The present invention relates to a game machine comprising: a substrate casing having an illegal behavior preventing means and accommodating a control substrate, wherein the game board is characterized in that the substrate casing has a first state in which the control substrate can be accommodated In the case portion and the second case portion, the illegal behavior preventing means includes a microchip that is placed in the first case portion and the second case portion after closing the first case portion and the second case portion The microchip has a laminated structure in which a recording layer, a reflective layer, a protective layer, and a first shell which are recorded with information are laminated on a transparent substrate fixed to the second casing portion. When the first casing portion and the second casing portion are opened by the adhesive layer on the body, the recording layer and the reflective layer formed on the microchip are peeled off and damaged.

並且，本發明是一種遊戲機，其具備一種具有非法行為防止手段，併收容著控制基板的基板殼體，該遊戲機的特徵在於，上述基板殼體具有互相封閉後即可收容上述控制基板的第1殼體部和第2殼體部，上述非法行為防止手段具有微芯片，其在封閉上述第1殼體部和第2殼體部後，安放在被第1殼體部所收容的上述控制基板所搭載的電子元件與上述第2殼體部之間，上述微芯片具有一迭層結構，其在固定在上述第1殼體部上的透明基板上，迭層著記錄信息的記錄層、反射層、保護層及粘合在上述第2殼體部上的粘合層，一旦打開上述第1殼體部和第2殼體部，則在上述微芯片上形成的上述記錄層和反射層會剝離、破損。Further, the present invention is a game machine comprising: a substrate casing having an illegal behavior preventing means and accommodating a control substrate, wherein the game board is characterized in that the substrate casing has a mutual closure to accommodate the control substrate. In the first case portion and the second case portion, the illegal behavior preventing means includes a microchip that is placed in the first case portion and the second case portion, and is housed in the first case portion The microchip has a laminated structure between the electronic component mounted on the control substrate and the second case portion, and a recording layer on which information is recorded is laminated on the transparent substrate fixed to the first case portion. a reflective layer, a protective layer, and an adhesive layer adhered to the second case portion, the recording layer and the reflection formed on the microchip when the first case portion and the second case portion are opened The layer will peel off and break.

此外，本發明是一種遊戲機，其具備一種具有非法行為防止手段，併收容著控制基板的基板殼體，該遊戲機的特徵在於，上述基板殼體具有互相封閉後即可收容上述控制基板的第1殼體部和第2殼體部，上述非法行為防止手段具有微芯片，其在封閉上述第1殼體部和第2殼體部後，安放在被第1殼體部所收容的上述控制基板的板面與上述第2殼體部之間，上述微芯片具有一迭層結構，其在固定在上述第1殼體部上的透明基板上，迭層著記錄信息的記錄層、反射層、保護層及粘合在上述第2殼體部上的粘合層，一旦打開上述第1殼體部和第2殼體部，則在上述微芯片上形成的上述記錄層和反射層會剝離、破損。Further, the present invention is a game machine comprising: a substrate casing having an illegal behavior preventing means and accommodating a control substrate, wherein the gaming machine is characterized in that the substrate casing has a closed state to accommodate the control substrate. In the first case portion and the second case portion, the illegal behavior preventing means includes a microchip that is placed in the first case portion and the second case portion, and is housed in the first case portion The microchip has a laminated structure between the plate surface of the control substrate and the second case portion, and a recording layer for recording information and reflection are laminated on the transparent substrate fixed to the first case portion. a layer, a protective layer, and an adhesive layer adhered to the second case portion, when the first case portion and the second case portion are opened, the recording layer and the reflective layer formed on the microchip are Peeled and damaged.

【發明效果】[effect of the invention]

依據本發明，在互相封閉後即可收容控制基板的第1殼體部和第2殼體部上，在第2殼體部上固定著微芯片的透明基板，在第1殼體部上粘合著微芯片的粘合層，該微芯片安放在第1殼體部與第2殼體部之間，一旦打開第1殼體部和第2殼體部，則在微芯片上形成的記錄層和反射層會剝離、破損，以此可知其被實施了非法行為。也就是說，一旦看到破損的部分，即可容易地發現其被實施了非法行為。再者，能夠廉價地製造微芯片，非法行為防止手段的結構也能夠實現廉價的結構。此外，由於能夠通過在第1殼體部與第2殼體部之間安放微芯片而實現非法行為防止手段的結構，故能夠提供可得心應手地使用的非法行為防止手段。According to the present invention, the first case portion and the second case portion of the control board can be housed after being closed, and the transparent substrate of the microchip is fixed to the second case portion, and is adhered to the first case portion. The adhesive layer of the microchip is placed, and the microchip is placed between the first case portion and the second case portion, and when the first case portion and the second case portion are opened, the record formed on the microchip is formed. The layer and the reflective layer are peeled off and damaged, so that it is illegally acted upon. That is to say, once you see the damaged part, you can easily find that it has been illegal. Furthermore, the microchip can be manufactured at low cost, and the structure of the illegal behavior preventing means can also realize an inexpensive structure. Further, since the micro-chip can be placed between the first casing portion and the second casing portion to realize the structure of the illegal behavior preventing means, it is possible to provide an illegal behavior preventing means that can be used with ease.

並且，依據本發明，在互相封閉後即可收容控制基板的第1殼體部和第2殼體部上，在第2殼體部上固定著微芯片的透明基板，一旦封閉第1殼體部和第2殼體部，則微芯片的粘合層即與控制基板上搭載的電子元件粘合，構成非法行為防止手段。一旦打開第1殼體部和第2殼體部，則在微芯片上形成的記錄層和反射層會剝離、破損，以此可知其被實施了非法行為。再者，能夠廉價地製造微芯片，非法行為防止手段的結構也能夠實現廉價的結構。此外，由於能夠通過在第2殼體部與電子元件之間安放微芯片而實現非法行為防止手段的結構，故能夠提供可得心應手地使用的非法行為防止手段。Further, according to the present invention, the first case portion and the second case portion of the control board can be housed after being closed, and the transparent substrate of the microchip is fixed to the second case portion, and the first case is closed. In the second portion and the second case portion, the adhesive layer of the microchip is bonded to the electronic component mounted on the control substrate to constitute an illegal behavior preventing means. When the first case portion and the second case portion are opened, the recording layer and the reflective layer formed on the microchip are peeled off and damaged, and it is understood that the illegal operation is performed. Furthermore, the microchip can be manufactured at low cost, and the structure of the illegal behavior preventing means can also realize an inexpensive structure. Further, since the structure of the illegal behavior preventing means can be realized by placing the microchip between the second casing portion and the electronic component, it is possible to provide an illegal behavior preventing means that can be used with ease.

此外，依據本發明，在互相封閉後即可收容控制基板的第1殼體部和第2殼體部上，在第2殼體部上固定著微芯片的透明基板，一旦封閉第1殼體部和第2殼體部，則微芯片的粘合層即與控制基板上搭載的電子元件粘合，構成非法行為防止手段。一旦打開第1殼體部和第2殼體部，則在微芯片上形成的記錄層和反射層會剝離、破損，以此可知其被實施了非法行為。也就是說，一旦看到破損的部分，即可容易地發現其被實施了非法行為。再者，能夠廉價地製造微芯片，非法行為防止手段的結構也能夠實現廉價的結構。此外，由於能夠通過在第2殼體部與電子元件之間安放微芯片而實現非法行為防止手段的結構，故能夠提供可得心應手地使用的非法行為防止手段。Further, according to the present invention, the first case portion and the second case portion of the control board can be housed after being closed, and the transparent substrate of the microchip is fixed to the second case portion, and the first case is closed. In the second portion and the second case portion, the adhesive layer of the microchip is bonded to the electronic component mounted on the control substrate to constitute an illegal behavior preventing means. When the first case portion and the second case portion are opened, the recording layer and the reflective layer formed on the microchip are peeled off and damaged, and it is understood that the illegal operation is performed. That is to say, once you see the damaged part, you can easily find that it has been illegal. Furthermore, the microchip can be manufactured at low cost, and the structure of the illegal behavior preventing means can also realize an inexpensive structure. Further, since the structure of the illegal behavior preventing means can be realized by placing the microchip between the second casing portion and the electronic component, it is possible to provide an illegal behavior preventing means that can be used with ease.

以下參照圖1至圖19說明本發明的最佳實施方式。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a preferred embodiment of the present invention will be described with reference to Figs.

圖1是概略地顯示出本發明第1實施方式的彈珠遊戲機的外觀的立體圖，圖2是概略地顯示出將彈珠遊戲機分解後的外觀的分解立體圖。1 is a perspective view schematically showing an appearance of a marble game machine according to a first embodiment of the present invention, and FIG. 2 is an exploded perspective view schematically showing an appearance of the marble game machine.

在圖1中，彈珠遊戲機1具備：機框1a，其安裝在遊戲場的遊戲島內；內框1c，其通過支撐部1b可旋轉地支撐在機框1a的前面；前門1d，其通過支撐部1b可旋轉地支撐在內框1c的前面，在機框1a的下側部分，設有收容遊戲球的接盤1e和發射遊戲球的手柄1f等。In Fig. 1, a marble game machine 1 includes a machine frame 1a installed in a game island of a game field, an inner frame 1c rotatably supported at a front surface of the machine frame 1a via a support portion 1b, and a front door 1d. The support portion 1b is rotatably supported by the front surface of the inner frame 1c, and a lower portion of the casing 1a is provided with a tray 1e for accommodating a game ball, a handle 1f for emitting a game ball, and the like.

在遊戲場內，通過上鎖部(圖示省略)將內框1c和前門1d鎖在機框1a上，只有在遊戲機管理者進行維修保養時將鎖打開，內框1c和前門1d才能從機框1a向前面旋轉而打開。In the game field, the inner frame 1c and the front door 1d are locked to the frame 1a by a locking portion (not shown), and the lock is opened only when the game machine manager performs maintenance, and the inner frame 1c and the front door 1d can be The frame 1a is rotated to the front to open.

此外，如圖2的分解立體圖所示，在前門1d上，固定著透明的玻璃板1g，通過該玻璃板1g，遊戲者能夠看到設在內框1c內的遊戲盤1h。另外，關於前門1d和遊戲盤1h的結構，省略了詳細說明，但是在前門1d的兩側部分和上部，設有用於提高視覺效果和音響效果的遊戲顯示用指示燈和揚聲器等，在遊戲盤1h的盤面上，設有複數的入賞口、多個遊戲釘、用於提高視覺效果的遊戲顯示用指示燈及液晶顯示面板、用於將通過手柄發射的遊戲球引導向遊戲盤1h的盤面上方的導軌等。Further, as shown in the exploded perspective view of Fig. 2, a transparent glass plate 1g is fixed to the front door 1d, and the player can see the game board 1h provided in the inner frame 1c by the glass plate 1g. In addition, although the detailed description of the structure of the front door 1d and the game board 1h is abbreviate|omitted, in the both sides part and the upper part of the front door 1 d, the display display indicator light and a speaker etc. which improve a visual effect and acoustic effect are provided in a game board. On the 1h disk surface, there are a plurality of prize-winning openings, a plurality of game nails, a game display indicator light for improving visual effects, and a liquid crystal display panel for guiding the game ball launched by the handle to the upper surface of the game disk 1h. Rails, etc.

此外，在內框1c的背面，換言之，在遊戲盤1h的背面，安裝著兩個基板殼體，其分別是：收容了用於對彈珠遊戲機1遊戲動作實施集中控制的主控制基板的基板殼體，和用於對提高視覺效果和音響效果的遊戲顯示用指示燈、液晶顯示面板及揚聲器實施控制的遊戲顯示用控制基板的基板殼體。並且，在遊戲盤1h的背面，除安裝著收容了主控制基板的基板殼體和收容了遊戲顯示用控制基板的基板殼體之外，還安裝著另外的基板殼體，其上收容了對於設在遊戲機1內的電源裝置和用於配發遊戲球的機構等進行控制的各種控制基板。Further, on the back surface of the inner frame 1c, in other words, two substrate casings are mounted on the back surface of the game board 1h, respectively, which accommodate the main control board for performing centralized control of the game play of the marble game machine 1. The substrate case and the substrate case of the game display control board for controlling the game display indicator light, the liquid crystal display panel, and the speaker for improving the visual effect and the sound effect. Further, on the back surface of the game board 1h, in addition to the substrate case in which the main control board is housed and the board housing in which the game display control board is housed, another board housing is attached, and the other board housing is mounted thereon. Various control boards that are controlled by a power supply device provided in the game machine 1 and a mechanism for dispensing a game ball.

並且，如圖1所示，在將內框1c和前門1d鎖在機框1a上之後，這些基板殼體內收容在遊戲機1內，無法從外部看到。Further, as shown in FIG. 1, after the inner frame 1c and the front door 1d are locked to the casing 1a, the substrate casings are housed in the game machine 1, and are not visible from the outside.

接著參照圖3、圖4說明上述基板殼體的結構。圖3是收容控制基板後封閉的狀態下的基板殼體外觀的立體圖，圖4是基板殼體打開狀態下的立體圖。並且，由於收容了上述主控制基板的基板殼體、收容了遊戲顯示用控制基板的基板殼體以及收容了其他各種控制基板的基板殼體基本上都是相同的結構，所以僅以收容了主控制基板3的基板殼體2的結構為代表進行說明。Next, the structure of the above substrate case will be described with reference to Figs. 3 and 4 . 3 is a perspective view showing an appearance of a substrate casing in a state in which the control substrate is housed, and FIG. 4 is a perspective view showing the substrate casing in an open state. Further, since the substrate case in which the main control board is housed, the substrate case in which the game display control board is housed, and the substrate case in which various other control boards are housed are basically the same structure, only the main body is housed. The structure of the substrate case 2 of the control substrate 3 will be described as a representative.

在圖3、圖4中，該基板殼體2是採用透明的丙烯酸樹脂及聚碳酸酯樹脂等所謂的硬質塑料材料成形的盒型殼體，其具有收容了主控制基板3的矩形的第1殼體部4、從上方覆蓋而與第1殼體部4嵌合的矩形的第2殼體部5以及可旋轉地支撐第1殼體部4和第2殼體部5的鉸鏈部6。在第1殼體部4上，形成有用於通過螺絲等固定在遊戲盤1h(參見圖2)背面的複數個固定部7，還在第1殼體部4的矩形的底部8上一體地成形有用於安放併固定主控制基板3的安放部9。另外，主控制基板3通過在具有絕緣性的電路基板上搭載CPU、ROM、布線用連接器、電阻、電容等電子元件，在形成於電路基板上的布線圖形上用錫焊料銲接著這些電子元件，以使其發揮特定的功能。In FIG. 3 and FIG. 4, the substrate case 2 is a box-shaped case formed of a so-called hard plastic material such as a transparent acrylic resin or a polycarbonate resin, and has a rectangular first shape in which the main control substrate 3 is housed. The case portion 4 includes a rectangular second case portion 5 that is fitted to the first case portion 4 from above, and a hinge portion 6 that rotatably supports the first case portion 4 and the second case portion 5. A plurality of fixing portions 7 for fixing to the back surface of the game board 1h (see FIG. 2) by screws or the like are formed in the first casing portion 4, and are integrally formed on the rectangular bottom portion 8 of the first casing portion 4. There is a mounting portion 9 for mounting and fixing the main control board 3. In the main control board 3, an electronic component such as a CPU, a ROM, a wiring connector, a resistor, or a capacitor is mounted on an insulating circuit board, and these are soldered on the wiring pattern formed on the circuit board by solder. Electronic components to make them perform their specific functions.

進而，在第1殼體部4的側壁(標號省略)，形成有複數的嵌合孔10，在第2殼體部5的側壁(標號省略)，形成有複數的舌片狀的嵌合突起11，如圖3所示，若將第2殼體部5對於第1殼體部4封閉，則牠們的嵌合孔10即與嵌合突起11牢固地嵌合住，使第1、第2殼體部4、5相互牢固地嵌合在一起，收容主控制基板3。Further, a plurality of fitting holes 10 are formed in the side wall (not shown) of the first casing portion 4, and a plurality of tongue-like fitting projections are formed on the side wall (not shown) of the second casing portion 5. As shown in FIG. 3, when the second case portion 5 is closed to the first case portion 4, the fitting holes 10 are firmly fitted to the fitting projections 11, so that the first and second portions are made. The case portions 4 and 5 are firmly fitted to each other to house the main control board 3.

此外，如圖4所示，在第1殼體部4的側壁和第2殼體部5的側壁上，一體地成形有平板狀的凸緣部12、13，在第2殼體部5的凸緣部13上，固定著後述的微芯片MC。並且，如圖3所示，若將第2殼體部5對於第1殼體部4封閉，則凸緣部12、13的相互對向的面接觸在一起，且形成於微芯片MC上的後述的粘合層MCe將與凸緣部12的面粘合，以此將凸緣部12、13固定在一起。Further, as shown in FIG. 4, flat side flange portions 12 and 13 are integrally formed on the side wall of the first case portion 4 and the side wall of the second case portion 5, and the second case portion 5 is formed. A microchip MC to be described later is fixed to the flange portion 13. Further, as shown in FIG. 3, when the second case portion 5 is closed to the first case portion 4, the opposing faces of the flange portions 12 and 13 are in contact with each other and formed on the microchip MC. The adhesive layer MCe to be described later is bonded to the surface of the flange portion 12 to fix the flange portions 12 and 13 together.

以下參照圖5、圖6說明微芯片MC的結構及其製造方法和微芯片MC對於凸緣部13進行安裝的結構。另外，圖5(a)是放大顯示微芯片MC的結構的立體圖，圖5(b)是放大顯示微芯片MC對於凸緣部13進行安裝的結構的立體圖。The structure of the microchip MC, the manufacturing method thereof, and the structure in which the microchip MC mounts the flange portion 13 will be described below with reference to FIGS. 5 and 6. 5(a) is a perspective view showing a configuration of the microchip MC in an enlarged manner, and FIG. 5(b) is a perspective view showing an enlarged structure in which the microchip MC is attached to the flange portion 13.

如圖5(a)所示，微芯片MC的結構是，其具有用聚碳酸酯樹脂形成的平板狀的透明基板MCa、迭層在透明基板MCa上的記錄層MCb、反射層MCc、保護層MCd及粘合層MCe。As shown in FIG. 5(a), the microchip MC has a structure in which a flat transparent substrate MCa formed of a polycarbonate resin, a recording layer MCb laminated on the transparent substrate MCa, a reflective layer MCc, and a protective layer are provided. MCd and adhesion layer MCe.

其中，微芯片MC厚度為0.6mm左右，縱橫大小分別為1cm左右。透明基板MCa具有相當於微芯片MC的大體一半的厚度，其厚度為0.5mm左右，縱橫大小分別為1cm左右。Among them, the thickness of the microchip MC is about 0.6 mm, and the vertical and horizontal dimensions are about 1 cm. The transparent substrate MCa has a thickness corresponding to substantially half of the microchip MC, and has a thickness of about 0.5 mm and a vertical and horizontal size of about 1 cm.

記錄層MCb由採用噴鍍法在透明基板MCa上形成薄膜的非晶金屬構成，經特定波長(在本實施方式中為650nm)的激光照射後，其狀態由結晶態變為非晶態，或者由非晶態變為結晶態，可通過激光反覆光學記錄併抹消信息。也就是說，若將基於應記錄的信息而調製的特定功率的激光照射記錄層MCb，該所照射的部分會結晶，使反射率改變，使記錄信息成為可能。並且，若在對使特定功率的激光結晶的部分進行照射、加熱後再冷卻，則能夠溶化結晶狀態，使之變為非晶態，通過該非晶狀態，能夠抹消信息。這樣一來，通過照射激光使由非晶金屬形成薄膜的記錄層MCb變為結晶態和非晶態，能夠多次地進行信息的記錄、抹消、再記錄、再抹消。另外，關於該記錄與抹消信息的裝置，將在後面敘述。The recording layer MCb is made of an amorphous metal formed on the transparent substrate MCa by a sputtering method, and after being irradiated with a laser beam having a specific wavelength (650 nm in the present embodiment), the state changes from a crystalline state to an amorphous state, or From the amorphous state to the crystalline state, the information can be optically recorded and erased by laser repetitive. In other words, when the laser light of a specific power modulated based on the information to be recorded is irradiated onto the recording layer MCb, the irradiated portion is crystallized, and the reflectance is changed to make it possible to record information. In addition, when the portion where the laser light of a specific power is crystallized, heated, and then cooled, the crystal state can be melted to be in an amorphous state, and information can be erased by the amorphous state. In this manner, by recording the recording layer MCb formed of an amorphous metal into a crystalline state and an amorphous state by irradiating a laser, information can be recorded, erased, re-recorded, and erased a plurality of times. Further, an apparatus for recording and erasing information will be described later.

反射層MCc由金及鋁等金屬薄膜構成，通過將其蒸發在由紫外線硬化樹脂成形的厚度為0.1mm左右的保護層MCd的面上，形成極薄的金屬薄膜。並且，通過使反射層MCc與記錄層MCb相接觸，從保護層MCd和透明基板MCa的兩側壓接，能夠使反射層MCc與記錄層MCb機械地無縫隙地粘合。The reflective layer MCc is made of a metal thin film such as gold or aluminum, and is evaporated on the surface of the protective layer MCd having a thickness of about 0.1 mm formed by the ultraviolet curable resin to form an extremely thin metal thin film. Further, by bringing the reflective layer MCc into contact with the recording layer MCb, the protective layer MCd and the transparent substrate MCa are pressed against each other, whereby the reflective layer MCc and the recording layer MCb can be mechanically bonded without gaps.

粘合層MCe使用具有高剝離強度的丙烯酸類粘合劑等粘合劑形成，塗抹在保護層MCd(與形成反射層MCc的面相反一側的面)上。The adhesive layer MCe is formed using a pressure-sensitive adhesive such as an acrylic pressure-sensitive adhesive having a high peel strength, and is applied to the protective layer MCd (the surface opposite to the surface on which the reflective layer MCc is formed).

如圖5(b)所示，具有上述結構的微芯片MC將透明基板MCa向上，將粘合層MCe向下，嵌入形成於凸緣部13的矩形的孔13a內，通過填充在透明基板MCa的周邊部與孔13a的壁面之間的紫外線硬化樹脂及熱硬化樹脂等粘合劑來固定。此外，為使向下***孔13a內的粘合層MCe不從孔13a突出出來，使粘合層MCe與凸緣部13的底面(與凸緣部12相對的面)處於同一個面上，透明基板MCa的周邊部和孔13a通過上述的紫外線硬化樹脂及熱硬化樹脂等粘合劑來固定。As shown in FIG. 5(b), the microchip MC having the above structure has the transparent substrate MCa upward, and the adhesive layer MCe is recessed into the rectangular hole 13a formed in the flange portion 13, and is filled in the transparent substrate MCa. The peripheral portion and the wall surface of the hole 13a are fixed by an adhesive such as an ultraviolet curable resin or a thermosetting resin. Further, in order that the adhesive layer MCe which is inserted into the hole 13a is not protruded from the hole 13a, the adhesive layer MCe and the bottom surface of the flange portion 13 (the surface opposite to the flange portion 12) are on the same surface. The peripheral portion of the transparent substrate MCa and the hole 13a are fixed by a binder such as the ultraviolet curable resin and the thermosetting resin described above.

然後，如圖3所示，若將第2殼體部5對於第1殼體部4封閉，則如圖6的剖視圖所示，凸緣部12、13的相互對向的面接觸在一起，且形成於微芯片MC上的後述的粘合層MCe將與凸緣部12的面粘合，以此將凸緣部12、13固定在一起，進而將透明基板MCa露出外部。Then, as shown in FIG. 3, when the second case portion 5 is closed to the first case portion 4, as shown in the cross-sectional view of Fig. 6, the mutually opposing faces of the flange portions 12 and 13 are in contact with each other. The adhesive layer MCe, which will be described later, formed on the microchip MC is bonded to the surface of the flange portion 12, whereby the flange portions 12 and 13 are fixed together, and the transparent substrate MCa is exposed to the outside.

然後，可通過微芯片MC與凸緣部12、13的結構實現非法行為防止手段。Then, the illegal behavior preventing means can be realized by the structure of the microchip MC and the flange portions 12, 13.

以下參照圖7說明對形成於微芯片MC的記錄層MCb上記錄併抹消信息的裝置(以下稱之為“信息記錄還原裝置”)。Next, an apparatus for recording and erasing information on the recording layer MCb formed on the microchip MC (hereinafter referred to as "information recording restoration apparatus") will be described with reference to FIG.

圖7所示的信息記錄還原裝置100除對記錄層MCb進行信息的記錄與抹消外，還具有光學讀取、還原已記錄在記錄層MCb上的信息的功能。此外，其形成為可由人手持操作的小型裝置。The information recording and restoration apparatus 100 shown in FIG. 7 has a function of optically reading and restoring information recorded on the recording layer MCb in addition to recording and erasing information on the recording layer MCb. Further, it is formed as a small device that can be operated by a person.

信息記錄還原裝置100具有激光二極管101，其發射特定波長(650nm)的激光；校直儀透鏡102；光束掃描用雙軸執行器103，其使校直儀透鏡102向與激光發射方向正交的面偏向；物鏡104；單軸執行器105，其使物鏡104進退移動自動進行聚焦；分光器(半透鏡)106，其設在校直儀透鏡102與物鏡104之間；集光鏡(校直儀透鏡)107以及CCD等受光元件108，此外，還通過未圖示的控制電路控制激光二極管101、雙軸執行器103、單軸執行器105及受光元件108。此外，在信息記錄還原裝置100上，還設有液晶顯示面板，在控制電路的控制下顯示後述的還原信息等。The information recording restoration device 100 has a laser diode 101 that emits laser light of a specific wavelength (650 nm); a collimator lens 102; a beam-scanning biaxial actuator 103 that makes the collimator lens 102 orthogonal to the laser emission direction Face deflection; objective lens 104; single-axis actuator 105, which causes objective lens 104 to move forward and backward automatically to focus; beam splitter (half lens) 106, which is disposed between collimator lens 102 and objective lens 104; The instrument lens 107 and the light receiving element 108 such as a CCD, and the laser diode 101, the biaxial actuator 103, the single-axis actuator 105, and the light receiving element 108 are also controlled by a control circuit (not shown). Further, the information recording and restoration device 100 is further provided with a liquid crystal display panel, and under the control of the control circuit, reduction information or the like to be described later is displayed.

然後，使收容物鏡104的鏡筒(圖示省略)接近微芯片MC的透明基板MCa，加以使用。Then, the lens barrel (not shown) of the storage objective lens 104 is brought close to the transparent substrate MCa of the microchip MC and used.

在信息記錄還原裝置100記錄信息時，從激光二極管101發射出設定為用於記錄信息的特定功率的、基於應記錄的信息進行調製的激光。進而，該激光經校直儀透鏡102轉變為平行光，經分光器106在物鏡104收斂，成為細微的光點，經由透明基板MCa照射在記錄層MCb上，通過該光點在記錄層MCb上記錄信息。When the information recording and reproducing apparatus 100 records information, laser light modulated based on the information to be recorded set to the specific power for recording information is emitted from the laser diode 101. Further, the laser light is converted into parallel light by the collimator lens 102, and is converged by the spectroscope 106 at the objective lens 104 to become a fine spot, which is irradiated onto the recording layer MCb via the transparent substrate MCa, and passes through the spot on the recording layer MCb. record information.

這裡，若光點照射在記錄層MCb上，則從記錄層MCb反射的反射光經由物鏡104、分光器106和集光鏡107入射至受光元件108，上述的控制電路基於在受光元件108檢測到的反射光的受光圖案，對物鏡104的聚焦狀態進行判斷，自動控制單軸執行器105。通過該自動控制，在物鏡104收斂的光點隨時與記錄層MCb聚焦。此外，雙軸執行器103使校直儀透鏡102每隔特定的間隔偏向，改變上述的平行光的角度，使光點對於記錄層MCb的照射位置偏向。也就是說，通過雙軸執行器103使光點偏向，對於記錄層MCb進行掃描，將信息依次記錄在記錄層MCb上。Here, when the light spot is irradiated onto the recording layer MCb, the reflected light reflected from the recording layer MCb is incident on the light receiving element 108 via the objective lens 104, the spectroscope 106, and the collecting mirror 107, and the above control circuit detects based on the light receiving element 108. The light receiving pattern of the reflected light determines the focus state of the objective lens 104, and automatically controls the single-axis actuator 105. By this automatic control, the spot where the objective lens 104 converges is focused with the recording layer MCb at any time. Further, the biaxial actuator 103 deflects the collimator lens 102 at a specific interval, and changes the angle of the above-described parallel light so that the spot is deflected toward the irradiation position of the recording layer MCb. That is, the light spot is deflected by the biaxial actuator 103, and the recording layer MCb is scanned, and information is sequentially recorded on the recording layer MCb.

接著，在信息記錄還原裝置100還原信息時，從激光二極管101發射出設定為用於還原信息的特定功率的激光。進而，該激光經校直儀透鏡102轉變為平行光，經分光器106在物鏡104收斂，成為細微的光點，經由透明基板MCa照射在記錄層MCb上。這裡，與上述的記錄信息的情形相同，進行單軸執行器105的聚焦和雙軸執行器103的掃描，包含有存儲在記錄層MCb上的信息的反射光入射至物鏡104，經由分光器106和集光鏡107入射至受光元件108。然後，上述的控制電路對在受光元件108時時刻刻檢測到的反射光的受光圖案進行分析，還原(解調)所存儲的信息，顯示在上述的液晶顯示面板上。Next, when the information recording and reproducing apparatus 100 restores the information, the laser light of the specific power set for the reduction information is emitted from the laser diode 101. Further, the laser light is converted into parallel light by the collimator lens 102, and is converged by the spectroscope 106 at the objective lens 104 to become a fine spot, and is irradiated onto the recording layer MCb via the transparent substrate MCa. Here, as in the case of the above-described recording information, the focusing of the uniaxial actuator 105 and the scanning of the biaxial actuator 103 are performed, and the reflected light including the information stored on the recording layer MCb is incident on the objective lens 104 via the spectroscope 106. The collecting mirror 107 is incident on the light receiving element 108. Then, the control circuit analyzes the light receiving pattern of the reflected light that is detected at the time of the light receiving element 108, and restores (demodulates) the stored information and displays it on the liquid crystal display panel described above.

接著，在信息記錄還原裝置100抹消信息時，從激光二極管101發射出設定為用於抹消信息的特定功率的激光。另外，為使由非晶金屬形成薄膜的記錄層MCb的已記錄信息的部分變為非晶態，必須有強功率的激光，所以，發射出比在上述的記錄或者還原時從激光二極管101發射的激光功率更強的激光。進而，與上述的信息記錄的情形相同，進行單軸執行器105的聚焦和雙軸執行器103的掃描，光點即經由透明基板MCa照射在記錄在案層MCb的已記錄信息的部分，使該已照射的部分變為非晶態，抹消信息。Next, when the information recording restoration device 100 erases the information, the laser light of the specific power set to erase the information is emitted from the laser diode 101. Further, in order to change the portion of the recorded information of the recording layer MCb formed of the amorphous metal into an amorphous state, it is necessary to have a laser of a high power, so that the emission is emitted from the laser diode 101 at the time of recording or reduction as described above. The laser power is stronger than the laser. Further, in the same manner as in the above-described information recording, the focus of the uniaxial actuator 105 and the scanning by the biaxial actuator 103 are performed, and the light spot is irradiated onto the portion of the recorded information recorded on the layer MCb via the transparent substrate MCa, so that The irradiated portion becomes amorphous, and the information is erased.

以下參照圖8說明記錄在微芯片MC的記錄層MCb上的信息。另外，圖8(a)是放大顯示記錄在微芯片MC的記錄層MCb上的微型條形碼的說明圖，圖8(b)是從透明基板MCa一側觀察記錄在微芯片MC的記錄層MCb上的可目視的信息的說明圖。Information recorded on the recording layer MCb of the microchip MC will be described below with reference to FIG. 8(a) is an explanatory view showing, in an enlarged manner, a micro bar code recorded on the recording layer MCb of the microchip MC, and FIG. 8(b) is recorded on the recording layer MCb of the microchip MC as viewed from the side of the transparent substrate MCa. An illustration of the visually identifiable information.

如圖8(a)所示，在微芯片MC的記錄層MCb上，記錄著由多個細微的條構成的微型條形碼。各個條的寬度確定為約1μm左右，相鄰的條與條的最小間隔為約2μm。然後，通過上述的激光以最小間隔的整數倍的間隔將多個條記錄在記錄層MCb上，微型條形碼即被記錄，再根據已記錄著條的部分與未記錄著條的部分的排列，記錄成有意義的信息。例如將遊戲機1、基板殼體2和主控制基板3各自的製造編號(ID編號)、製造商名稱、製造地點、製造年月日等作為微型條形碼加以記錄。然後，可使用上述的信息記錄還原裝置100讀取微型條形碼，遊戲機1的管理者看到設置在信息記錄還原裝置100上的液晶顯示面板所顯示的微型條形碼信息，即能夠判斷是否對於安裝在遊戲機1的主控制基板3和基板殼體2實施了非法的改造等。As shown in FIG. 8(a), a micro bar code composed of a plurality of fine strips is recorded on the recording layer MCb of the microchip MC. The width of each strip is determined to be about 1 μm, and the minimum spacing of adjacent strips to strip is about 2 μm. Then, a plurality of strips are recorded on the recording layer MCb at intervals of an integral multiple of the minimum interval by the above-described laser light, the micro barcode is recorded, and the recording is performed based on the arrangement of the portion where the strip has been recorded and the portion where the strip is not recorded. Become meaningful information. For example, the manufacturing number (ID number) of each of the game machine 1, the substrate casing 2, and the main control board 3, the manufacturer's name, the manufacturing location, the date of manufacture, and the like are recorded as micro bar codes. Then, the micro-barcode can be read by using the above-described information recording and restoring apparatus 100, and the manager of the gaming machine 1 can see the micro-barcode information displayed on the liquid crystal display panel provided on the information recording and restoring apparatus 100, that is, whether it can be mounted for The main control board 3 and the board housing 2 of the gaming machine 1 are subjected to illegal modification or the like.

此外，由於上述微型條形碼是細微的條的組合，所以即使人看到也無法讀取信息的含義。因此，如圖8(b)所示，在微芯片MC的記錄層MCb上，還記錄著人能夠通過目視識別的文字、符號、圖形等圖案。這裡，這些圖案由上述的信息記錄還原裝置100記錄，通過照射在記錄層MCb上的光點來描繪。也就是說，由於1個光點只能形成極細微的圖案，所以對光點進行二維掃描，使之生成多個細微的結晶部分，以此進行描繪，通過該多個細微的結晶部分的圖案的集合，將文字、符號、圖形等圖案記錄在記錄層MCb上。另外，在圖8(b)中，舉例說明瞭以能夠目視的尺寸記錄著遊戲機1、基板殼體2和主控制基板3各自的製造編號(ID編號)、製造商名稱、製造地點、製造年月日等的情形。Further, since the above-described micro barcode is a combination of fine strips, the meaning of the information cannot be read even if the person sees it. Therefore, as shown in FIG. 8(b), on the recording layer MCb of the microchip MC, a pattern of characters, symbols, graphics, and the like which can be visually recognized by a person is also recorded. Here, these patterns are recorded by the above-described information recording and restoring apparatus 100, and are drawn by the light spot irradiated on the recording layer MCb. That is to say, since one spot can only form a very fine pattern, the spot is scanned two-dimensionally to generate a plurality of fine crystal portions, thereby drawing through the plurality of fine crystal portions. A collection of patterns, and a pattern of characters, symbols, graphics, and the like is recorded on the recording layer MCb. In addition, in FIG. 8(b), the manufacturing number (ID number), manufacturer name, manufacturing location, and manufacturing of each of the game machine 1, the substrate casing 2, and the main control board 3 are recorded in a visually readable manner. Year, month, day, etc.

然後，如圖6所示，例如在封閉第1、第2殼體部4、5，凸緣部12、13相接觸，且微芯片MC的粘合層MCe與凸緣部12粘合的狀態下設置在遊戲機1內時，當非法行為者打開遊戲機1的鎖，強行撬開第1、第2殼體部4、5後，如圖9的剖視圖所示，微芯片MC的記錄層MCb會與反射層MCc剝離，記錄層MCb會破損。也就是說，由於記錄層MCb與反射層MCc是機械地壓接，保護層MCd是通過由粘合劑構成的粘合層MCe與凸緣部12的面牢固地粘合，透明基板MCa是通過紫外線硬化樹脂等粘合劑牢固地粘合在凸緣部13的孔13a上，所以，當非法行為者強行撬開第1、第2殼體部4、5後，粘合力最弱的記錄層MCb與反射層MCc會剝離、破損。Then, as shown in FIG. 6, for example, when the first and second case portions 4 and 5 are closed, the flange portions 12 and 13 are in contact with each other, and the adhesive layer MCe of the microchip MC is bonded to the flange portion 12, for example. When it is placed in the game machine 1, when the illegal player opens the lock of the game machine 1 and forcibly opens the first and second casing portions 4, 5, as shown in the cross-sectional view of Fig. 9, the recording layer of the microchip MC The MCb is peeled off from the reflective layer MCc, and the recording layer MCb is broken. That is, since the recording layer MCb and the reflective layer MCc are mechanically crimped, the protective layer MCd is firmly bonded to the face of the flange portion 12 by the adhesive layer MCe composed of an adhesive, and the transparent substrate MCa is passed. The adhesive such as the ultraviolet curable resin is firmly adhered to the hole 13a of the flange portion 13, so that when the illegal player forcibly opens the first and second case portions 4, 5, the record with the weakest adhesion is obtained. The layer MCb and the reflective layer MCc are peeled off and damaged.

然後，當記錄層MCb與反射層MCc破損後，記錄在記錄層MCb上的圖8(b)所例示的文字、符號、圖形等可目視的圖案也破損，遊戲機1的管理者看到該破損的圖案，即可知曉其被實施了非法行為。Then, when the recording layer MCb and the reflective layer MCc are broken, the visually visible pattern such as characters, symbols, and graphics illustrated in FIG. 8(b) recorded on the recording layer MCb is also damaged, and the manager of the gaming machine 1 sees the A broken pattern reveals that it has been illegally committed.

如上所述，依據本實施方式的遊戲機1，只要在第2殼體部5的一端(具體地說即凸緣部13)事先固定住微芯片MC的透明基板MCa，再封閉該第2殼體部5和收容著主控制基板3的第1殼體部4，即能使在微芯片MC上形成的粘合層MCe與第1殼體部4的一端(具體地說即凸緣部12)粘合，以此即構成了禁止基板殼體2開關的非法行為防止手段。然後，當非法行為者非法打開基板殼體2，即打開第1、第2殼體部4、5之後，在微芯片MC上形成的記錄層MCb與反射層MCc就會剝離，記錄層MCb就會破損。因此，只要遊戲機1的管理者通過透明基板MCa目視到該破損的記錄層MCb，即可容易地知曉其被實施了非法行為，能夠對於該非法行為采取防止對策。As described above, according to the game machine 1 of the present embodiment, the transparent substrate MCa of the microchip MC is fixed in advance at one end (specifically, the flange portion 13) of the second casing portion 5, and the second casing is closed. The body portion 5 and the first case portion 4 in which the main control board 3 is housed, that is, the adhesive layer MCe formed on the microchip MC and one end of the first case portion 4 (specifically, the flange portion 12) The bonding means that the illegal behavior preventing means for prohibiting the switching of the substrate casing 2 is constituted. Then, when the illegal player illegally opens the substrate casing 2, that is, after opening the first and second casing portions 4, 5, the recording layer MCb formed on the microchip MC and the reflective layer MCc are peeled off, and the recording layer MCb is Will be damaged. Therefore, as long as the manager of the game machine 1 visually recognizes the damaged recording layer MCb through the transparent substrate MCa, it is easy to know that the illegal behavior has been performed, and it is possible to take countermeasures against the illegal behavior.

並且，由於微芯片MC結構簡潔，且能夠不以複雜的製造工序來製造，因此能夠降低成本。例如，圖5顯示出了1個微芯片MC，但是還可以製造出在更大的透明基板MCa上迭層了記錄層MCb、反射層MCc、保護層MCd及粘合層MCe的中間產物，對該中間產物進行裁剪，即可大量生產許多微芯片MC，由此可謀求製造成本的降低。Further, since the structure of the microchip MC is simple and can be manufactured without complicated manufacturing processes, the cost can be reduced. For example, FIG. 5 shows one microchip MC, but it is also possible to manufacture an intermediate product in which a recording layer MCb, a reflective layer MCc, a protective layer MCd, and an adhesive layer MCe are laminated on a larger transparent substrate MCa. By cutting the intermediate product, a large number of microchips MC can be mass-produced, whereby the manufacturing cost can be reduced.

並且，只要將微芯片MC固定在第2殼體部5的一端，在封閉第1、第2殼體部4、5時，就能實現在該第1、第2殼體部4、5之間安放微芯片MC的非法行為防止手段的結構，使之在使用時更加得心應手。Further, when the microchip MC is fixed to one end of the second casing portion 5, the first and second casing portions 4 and 5 can be realized when the first and second casing portions 4 and 5 are closed. The structure of the illegal behavior prevention means of the microchip MC is placed to make it more convenient to use.

並且，只要事先在記錄層MCb上記錄具有特定信息的微型條形碼，再通過信息記錄還原裝置100將該微型條形碼讀取還原，即可查明是否被實施了非法行為。Further, if a micro bar code having specific information is recorded on the recording layer MCb in advance, and the micro bar code is read and restored by the information recording and restoring device 100, it is possible to ascertain whether or not an illegal act has been performed.

並且，由於在微芯片MC上形成的記錄層MCb能夠進行信息的記錄、抹消、再記錄、再抹消，所以，例如遊戲機1的管理者只要採用信息記錄還原裝置100適當更新微型條形碼的信息，或者適當更新可目視的文字、符號、圖形等圖案，就能夠對於非法行為者的非法行為實施更有效的預防對策。Further, since the recording layer MCb formed on the microchip MC can record, erase, re-record, and erase the information, for example, the manager of the game machine 1 simply updates the information of the micro-barcode by using the information recording and restoration device 100. Or, by appropriately updating the visually-readable characters, symbols, graphics, and the like, it is possible to implement more effective preventive measures against the illegal behavior of illegal actors.

另外，在以上說明中，雖然構成為事先將微芯片MC固定在第2基板殼體5的凸緣部13上，然後封閉第1、第2基板殼體4、5，則在微芯片MC上形成的粘合層MCe與第1基板殼體4的凸緣部12粘合，但是也可以構成為事先將微芯片MC固定在第1基板殼體4的凸緣部12上，然後封閉第1、第2基板殼體4、5，則在微芯片MC上形成的粘合層MCe與第2基板殼體5的凸緣部13粘合。也就是說，第1、第2基板殼體4、5是為敘述方便而定的名稱，第1基板殼體4可以是第2基板殼體，第2基板殼體5也可以是第1基板殼體。In the above description, the microchip MC is fixed to the flange portion 13 of the second substrate casing 5 in advance, and then the first and second substrate casings 4 and 5 are closed, and then on the microchip MC. The formed adhesive layer MCe is bonded to the flange portion 12 of the first substrate case 4, but the microchip MC may be fixed to the flange portion 12 of the first substrate case 4 in advance, and then the first portion may be closed. In the second substrate cases 4 and 5, the adhesive layer MCe formed on the microchip MC is bonded to the flange portion 13 of the second substrate case 5. In other words, the first and second substrate housings 4 and 5 are named for convenience of description. The first substrate housing 4 may be a second substrate housing, and the second substrate housing 5 may be a first substrate. case.

另外，在以上說明中，雖然以設置在收容了主控制基板3的基板殼體2上的非法行為防止手段的結構為代表進行了說明，但是由於在收容了遊戲顯示用控制基板的基板殼體、收容了其他各種控制基板的基板殼體也適用相同的非法行為防止手段的結構，所以若這些基板殼體與基板殼體2同樣地被打開，則能夠發現非法行為。In the above description, the configuration of the illegal behavior preventing means provided on the substrate casing 2 in which the main control board 3 is housed has been described as a representative. However, the substrate housing in which the game display control board is housed is used. Since the substrate housing in which various other control substrates are housed is also configured similarly to the illegal behavior preventing means, if these substrate housings are opened in the same manner as the substrate housing 2, illegal behavior can be found.

以下說明本發明第2實施方式的彈珠遊戲機。在第1實施方式中，作為非法行為防止手段，是在封閉第1殼體部和第2殼體部時，將微芯片安放在第1殼體部與第2殼體部之間，但是在第2實施方式中，作為非法行為防止手段，是在封閉第1殼體部和第2殼體部時，將微芯片安放在第1殼體部所收容的控制基板所搭載的電子元件與第2殼體部之間。在本實施方式中，除了非法行為防止手段以外，與第1實施方式相同，所以就非法行為防止手段進行說明，對與第1實施方式相同的構成要素，標示以相同的標號，省略其說明。Hereinafter, a marble game machine according to a second embodiment of the present invention will be described. In the first embodiment, when the first casing portion and the second casing portion are closed, the microchip is placed between the first casing portion and the second casing portion. In the second embodiment, when the first casing portion and the second casing portion are closed, the electronic component mounted on the control board housed in the first casing portion and the first component are closed. 2 between the housing parts. In the present embodiment, the same as the first embodiment, the same as the first embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

以下參照圖10、圖11說明本發明第2實施方式的彈珠遊戲机上的基板殼體的結構。圖10是用於說明收容併封閉著控制基板的狀態下基板殼體的外觀的立體圖，圖11是基板殼體打開狀態下的立體圖。並且，由於收容了上述主控制基板的基板殼體、收容了遊戲顯示用控制基板的基板殼體以及收容了其他各種控制基板的基板殼體基本上都是相同的結構，所以僅以收容了主控制基板3的基板殼體200的結構為代表進行說明。The structure of the substrate housing on the marble game machine according to the second embodiment of the present invention will be described below with reference to Figs. 10 and 11 . FIG. 10 is a perspective view for explaining an appearance of the substrate casing in a state in which the control board is housed and closed, and FIG. 11 is a perspective view showing the substrate case in an open state. Further, since the substrate case in which the main control board is housed, the substrate case in which the game display control board is housed, and the substrate case in which various other control boards are housed are basically the same structure, only the main body is housed. The structure of the substrate case 200 of the control substrate 3 will be described as a representative.

在圖10、圖11中，該基板殼體200是採用透明的丙烯酸樹脂及聚碳酸酯樹脂等所謂的硬質塑料材料成形的盒型殼體，其具有收容了主控制基板3的矩形的第1殼體部4、從上方覆蓋而與第1殼體部4嵌合的矩形的第2殼體部5以及可旋轉地支撐第1殼體部4和第2殼體部5的鉸鏈部6。在第1殼體部4上，形成有用於通過螺絲等固定在上述的遊戲盤1h(參見圖2)背面的複數個固定部7，還在第1殼體部4的矩形的底部8上一體地成形有用於安放併固定主控制基板3的安放部9。另外，主控制基板3通過在具有絕緣性的電路基板上搭載CPU、ROM、布線用連接器、電阻、電容等電子元件，在形成於電路基板上的布線圖形上用錫焊料銲接著這些電子元件，以使其發揮特定的功能。In FIG. 10 and FIG. 11, the substrate case 200 is a box-shaped case formed of a so-called hard plastic material such as a transparent acrylic resin or a polycarbonate resin, and has a rectangular first shape in which the main control board 3 is housed. The case portion 4 includes a rectangular second case portion 5 that is fitted to the first case portion 4 from above, and a hinge portion 6 that rotatably supports the first case portion 4 and the second case portion 5. The first casing portion 4 is formed with a plurality of fixing portions 7 for fixing to the back surface of the above-described game disk 1h (see FIG. 2) by screws or the like, and is also integrated on the rectangular bottom portion 8 of the first casing portion 4. A mounting portion 9 for mounting and fixing the main control board 3 is formed. In the main control board 3, an electronic component such as a CPU, a ROM, a wiring connector, a resistor, or a capacitor is mounted on an insulating circuit board, and these are soldered on the wiring pattern formed on the circuit board by solder. Electronic components to make them perform their specific functions.

進而，在第1殼體部4的側壁(標號省略)，形成有複數的嵌合孔10，在第2殼體部5的側壁(標號省略)，形成有複數的舌片狀的嵌合突起11，如圖10所示，若將第2殼體部5對於第1殼體部4封閉，則牠們的嵌合孔10即與嵌合突起11牢固地嵌合住，使第1、第2殼體部4、5相互牢固地嵌合在一起，收容主控制基板3。Further, a plurality of fitting holes 10 are formed in the side wall (not shown) of the first casing portion 4, and a plurality of tongue-like fitting projections are formed on the side wall (not shown) of the second casing portion 5. As shown in FIG. 10, when the second case portion 5 is closed to the first case portion 4, the fitting holes 10 are firmly fitted to the fitting projections 11, so that the first and second portions are made. The case portions 4 and 5 are firmly fitted to each other to house the main control board 3.

進而，如圖11所示，在第2殼體部5的頂板部220，一體地成形有固定著後述的微芯片MC的筒部230。這裡，若封閉第1、第2殼體部4、5，筒部230則形成於與收容在第1殼體部4內的主控制基板3所搭載的CPU的上面相接觸的高度，此外，在筒部230上，還形成有嵌合著微芯片MC的孔230a。並且，如下所述，微芯片MC嵌入孔230a內，通過填充在該微芯片MC的周邊部與孔230a的壁面之間的粘合劑來固定。Further, as shown in FIG. 11, the cylindrical portion 230 to which the microchip MC to be described later is fixed is integrally formed in the top plate portion 220 of the second casing portion 5. When the first and second case portions 4 and 5 are closed, the tubular portion 230 is formed at a height that is in contact with the upper surface of the CPU mounted on the main control board 3 housed in the first case portion 4, and A hole 230a into which the microchip MC is fitted is formed on the tubular portion 230. Further, as described below, the microchip MC is embedded in the hole 230a, and is fixed by an adhesive filled between the peripheral portion of the microchip MC and the wall surface of the hole 230a.

以下參照圖12、圖13說明微芯片MC對於筒部230進行安裝的結構。圖12(a)是放大顯示微芯片MC的結構的立體圖，圖12(b)是放大顯示微芯片MC對於筒部230進行安裝的結構的立體圖。另外，在圖12(b)中，顯示出了部分剖開第2殼體部5的頂板部220的狀態。The structure in which the microchip MC is attached to the tubular portion 230 will be described below with reference to Figs. 12 and 13 . Fig. 12 (a) is a perspective view showing an enlarged structure of the microchip MC, and Fig. 12 (b) is a perspective view showing an enlarged structure of the microchip MC for mounting the tubular portion 230. Further, in Fig. 12(b), the state in which the top plate portion 220 of the second casing portion 5 is partially cut away is shown.

首先，如圖12(a)所示，微芯片MC的結構是，其具有用聚碳酸酯樹脂形成的平板狀的透明基板MCa、迭層在透明基板MCa上的記錄層MCb、反射層MCc、保護層MCd及粘合層MCe。微芯片MC的結構及其製造方法與第1實施方式所說明者相同，故省略其說明。First, as shown in FIG. 12(a), the microchip MC has a flat-shaped transparent substrate MCa formed of a polycarbonate resin, a recording layer MCb laminated on the transparent substrate MCa, and a reflective layer MCc. Protective layer MCd and adhesive layer MCe. The structure of the microchip MC and the manufacturing method thereof are the same as those described in the first embodiment, and thus the description thereof will be omitted.

如圖12(b)所示，微芯片MC將透明基板MCa向上，將粘合層MCe向下，***形成於筒部230的孔230a內，通過填充在透明基板MCa的周邊部與孔230a的壁面之間的紫外線硬化樹脂及熱硬化樹脂等粘合劑來固定。此外，為使向下***孔230a內的粘合層MCe不從孔230a突出出來，使粘合層MCe與筒部230的底面(與CPU相對的面)處於同一個面上，透明基板MCa的周邊部和孔230a通過上述的紫外線硬化樹脂及熱硬化樹脂等粘合劑來固定。As shown in FIG. 12(b), the microchip MC has the transparent substrate MCa upward, and the adhesive layer MCe is inserted downward into the hole 230a formed in the cylindrical portion 230, and is filled in the peripheral portion of the transparent substrate MCa and the hole 230a. An adhesive such as an ultraviolet curable resin and a thermosetting resin between the walls is fixed. Further, in order to prevent the adhesive layer MCe which is inserted into the hole 230a from protruding from the hole 230a, the adhesive layer MCe and the bottom surface of the cylindrical portion 230 (the surface opposite to the CPU) are on the same surface, the transparent substrate MCa The peripheral portion and the hole 230a are fixed by a binder such as the ultraviolet curable resin and the thermosetting resin described above.

然後，若將第2殼體部5對於第1殼體部4封閉，則如圖13的剖視圖所示，筒部230的底面與CPU的上面接觸在一起，且形成於微芯片MC上的粘合層MCe將與CPU的上面粘合，進而將透明基板MCa露出外部。Then, when the second case portion 5 is closed to the first case portion 4, as shown in the cross-sectional view of Fig. 13, the bottom surface of the tube portion 230 is in contact with the upper surface of the CPU, and is formed on the microchip MC. The laminated MCe will be bonded to the upper surface of the CPU to expose the transparent substrate MCa to the outside.

然後，只要使設置在筒部230的微芯片MC與作為電子元件的CPU的上面相接觸地加以放置，即可通過在第2殼體部5與CPU之間安放微芯片MC的結構實現非法行為防止手段。Then, if the microchip MC provided in the tubular portion 230 is placed in contact with the upper surface of the CPU as the electronic component, the illegal behavior can be realized by arranging the structure of the microchip MC between the second housing portion 5 and the CPU. Preventive means.

向形成於微芯片MC的記錄層MCb上記錄併抹消信息，採用在第1實施方式說明的圖7所示的信息記錄還原裝置與第1實施方式同樣地進行。並且，記錄在微芯片MC的記錄層MCb上的信息與第1實施方式在圖8中所說明的相同。The information recording and reproducing apparatus shown in FIG. 7 described in the first embodiment is recorded and erased on the recording layer MCb formed on the microchip MC, and is performed in the same manner as in the first embodiment. Further, the information recorded on the recording layer MCb of the microchip MC is the same as that described in FIG. 8 in the first embodiment.

然後，如圖13所示，例如在封閉第1、第2殼體部4、5，筒部230與CPU相接觸，且微芯片MC的粘合層MCe與CPU的上面粘合的狀態下設置在遊戲機1內時，當非法行為者打開遊戲機1的鎖，強行撬開第1、第2殼體部4、5後，如圖14的剖視圖所示，微芯片MC的記錄層MCb會與反射層MCc剝離，記錄層MCb會破損。也就是說，由於記錄層MCb與反射層MCc是機械地壓接，保護層MCd是通過由粘合劑構成的粘合層MCe與CPU的上面牢固地粘合，透明基板MCa是通過紫外線硬化樹脂等粘合劑牢固地粘合在筒部230的孔230a上，所以，當非法行為者強行撬開第1、第2殼體部4、5後，粘合力弱的記錄層MCb與反射層MCc會剝離、破損。Then, as shown in FIG. 13, for example, when the first and second case portions 4, 5 are closed, the cylindrical portion 230 is in contact with the CPU, and the adhesive layer MCe of the microchip MC is bonded to the upper surface of the CPU. In the game machine 1, when the illegal player opens the lock of the gaming machine 1 and forcibly opens the first and second casing portions 4, 5, as shown in the cross-sectional view of Fig. 14, the recording layer MCb of the microchip MC will When it is peeled off from the reflective layer MCc, the recording layer MCb is broken. That is, since the recording layer MCb and the reflective layer MCc are mechanically crimped, the protective layer MCd is firmly bonded to the upper surface of the CPU by the adhesive layer MCe composed of an adhesive, and the transparent substrate MCa is cured by ultraviolet curing resin. Since the adhesive is firmly adhered to the hole 230a of the tubular portion 230, the recording layer MCb and the reflective layer having weak adhesion after the illegal actors forcibly split the first and second casing portions 4, 5 MCc will peel off and break.

然後，當記錄層MCb與反射層MCc破損後，記錄在記錄層MCb上的圖8(b)所例示的文字、符號、圖形等可目視的圖案也破損，遊戲機1的管理者看到該破損的圖案，即可知曉其被實施了非法行為。Then, when the recording layer MCb and the reflective layer MCc are broken, the visually visible pattern such as characters, symbols, and graphics illustrated in FIG. 8(b) recorded on the recording layer MCb is also damaged, and the manager of the gaming machine 1 sees the A broken pattern reveals that it has been illegally committed.

如上所述，依據本實施方式的遊戲機1，只要事先將微芯片MC的透明基板MCa固定在第2殼體部5的頂板部220上形成的筒部230，再封閉該第2殼體部5和收容著主控制基板3的第1殼體部4，即能使在微芯片MC上形成的粘合層MCe與CPU的上面粘合，以此即構成了禁止基板殼體200開關的非法行為防止手段。然後，當非法行為者非法打開基板殼體200，即打開第1、第2殼體部4、5之後，在微芯片MC上形成的記錄層MCb與反射層MCc就會剝離，記錄層MCb就會破損。因此，只要遊戲機1的管理者通過透明基板MCa目視到該破損的記錄層MCb，即可容易地知曉其被實施了非法行為，能夠對於該非法行為采取防止對策。As described above, according to the game machine 1 of the present embodiment, the transparent substrate MCa of the microchip MC is fixed to the tubular portion 230 formed on the top plate portion 220 of the second casing portion 5, and the second casing portion is closed. 5, and the first case portion 4 in which the main control board 3 is housed, that is, the adhesive layer MCe formed on the microchip MC can be bonded to the upper surface of the CPU, thereby constituting the prohibition of the switch of the substrate case 200. Means of prevention of behavior. Then, when the illegal player illegally opens the substrate casing 200, that is, after opening the first and second casing portions 4, 5, the recording layer MCb and the reflective layer MCc formed on the microchip MC are peeled off, and the recording layer MCb is Will be damaged. Therefore, as long as the manager of the game machine 1 visually recognizes the damaged recording layer MCb through the transparent substrate MCa, it is easy to know that the illegal behavior has been performed, and it is possible to take countermeasures against the illegal behavior.

並且，由於微芯片MC結構簡潔，且能夠不以複雜的製造工序來製造，因此能夠降低成本。例如，圖12顯示出了1個微芯片MC，但是還可以製造出在更大的透明基板MCa上迭層了記錄層MCb、反射層MCc、保護層MCd及粘合層MCe的中間產物，對該中間產物進行裁剪，即可大量生產許多微芯片MC，由此可謀求製造成本的降低。Further, since the structure of the microchip MC is simple and can be manufactured without complicated manufacturing processes, the cost can be reduced. For example, FIG. 12 shows one microchip MC, but it is also possible to manufacture an intermediate product in which a recording layer MCb, a reflective layer MCc, a protective layer MCd, and an adhesive layer MCe are laminated on a larger transparent substrate MCa. By cutting the intermediate product, a large number of microchips MC can be mass-produced, whereby the manufacturing cost can be reduced.

並且，只要將微芯片MC固定在形成於第2殼體部5上的筒部230，在封閉第1、第2殼體部4、5時，就能實現在第2殼體部5與CPU之間安放微芯片MC的非法行為防止手段的結構，使之在使用時更加得心應手。Further, when the microchip MC is fixed to the tubular portion 230 formed on the second casing portion 5, the second casing portion 5 and the CPU can be realized when the first and second casing portions 4 and 5 are closed. The structure of the illegal behavior prevention means of the microchip MC is placed to make it more convenient to use.

並且，只要事先在記錄層MCb上記錄具有特定信息的微型條形碼，再通過信息記錄還原裝置100將該微型條形碼讀取還原，即可查明是否被實施了非法行為。Further, if a micro bar code having specific information is recorded on the recording layer MCb in advance, and the micro bar code is read and restored by the information recording and restoring device 100, it is possible to ascertain whether or not an illegal act has been performed.

並且，由於在微芯片MC上形成的記錄層MCb能夠進行信息的記錄、抹消、再記錄、再抹消，所以，例如遊戲機1的管理者只要採用信息記錄還原裝置100適當更新微型條形碼的信息，或者適當更新可目視的文字、符號、圖形等圖案，就能夠對於非法行為者的非法行為實施更有效的預防對策。Further, since the recording layer MCb formed on the microchip MC can record, erase, re-record, and erase the information, for example, the manager of the game machine 1 simply updates the information of the micro-barcode by using the information recording and restoration device 100. Or, by appropriately updating the visually-readable characters, symbols, graphics, and the like, it is possible to implement more effective preventive measures against the illegal behavior of illegal actors.

另外，在以上說明中，雖然只要事先將微芯片MC固定在形成於第2基板殼體5的筒部230上，然後封閉第1、第2基板殼體4、5，則微芯片MC的粘合層MCe即與主控制基板3上搭載的CPU的上面粘合，就構成了非法行為防止手段，但是也可以在主控制基板3上搭載的ROM的上面粘合微芯片MC的粘合層MCe。在本變形例的情況下，若封閉第1、第2殼體部4、5，為使筒部230的底面與ROM的上面接觸，只要在頂板部220的特定位置形成筒部230，在該筒部230的孔230a內嵌入微芯片MC，用粘合劑固定即可。In addition, in the above description, if the microchip MC is fixed to the tubular portion 230 formed on the second substrate casing 5 in advance, and then the first and second substrate casings 4 and 5 are closed, the microchip MC is adhered. The laminated MCe is bonded to the upper surface of the CPU mounted on the main control board 3, and constitutes an illegal behavior preventing means. However, the adhesive layer MCe of the microchip MC may be bonded to the upper surface of the ROM mounted on the main control board 3. . In the case of the present modification, when the first and second case portions 4 and 5 are closed, in order to bring the bottom surface of the tubular portion 230 into contact with the upper surface of the ROM, the tubular portion 230 is formed at a specific position of the top plate portion 220. The microchip MC is embedded in the hole 230a of the tubular portion 230 and fixed by an adhesive.

並且，不僅將微芯片MC的粘合層粘合在控制基板3所搭載的電子元件即CPU及ROM上，而且還可以將微芯片MC的粘合層粘合在控制基板3所搭載的CPU及ROM之外的電子元件上。Further, not only the adhesive layer of the microchip MC is bonded to the CPU and the ROM which are electronic components mounted on the control board 3, but also the adhesive layer of the microchip MC can be bonded to the CPU mounted on the control board 3 and On the electronic components other than the ROM.

另外，在以上說明中，雖然以設置在收容了主控制基板3的基板殼體200上的非法行為防止手段的結構為代表進行了說明，但是由於在收容了遊戲顯示用控制基板的基板殼體、收容了其他各種控制基板的基板殼體也適用相同的非法行為防止手段的結構，所以若這些基板殼體與基板殼體200同樣地被打開，則能夠發現非法行為。In the above description, the configuration of the illegal behavior preventing means provided on the substrate casing 200 in which the main control board 3 is housed has been described as a representative. However, the substrate housing in which the game display control board is housed is used. Since the substrate case in which various other control substrates are housed is also configured similarly to the illegal behavior preventing means, if these substrate cases are opened in the same manner as the substrate case 200, illegal behavior can be found.

以下說明本發明第3實施方式的彈珠遊戲機。在第1實施方式中，作為非法行為防止手段，是在封閉第1殼體部和第2殼體部時，將微芯片安放在第1殼體部與第2殼體部之間，但是在第3實施方式中，作為非法行為防止手段，是在封閉第1殼體部和第2殼體部時，將微芯片安放在第1殼體部所收容的控制基板的板面與第2殼體部之間。在本實施方式中，除了非法行為防止手段以外，與第1實施方式相同，所以就非法行為防止手段進行說明，對與第1實施方式相同的構成要素，標示以相同的標號，省略其說明。A marble game machine according to a third embodiment of the present invention will be described below. In the first embodiment, when the first casing portion and the second casing portion are closed, the microchip is placed between the first casing portion and the second casing portion. In the third embodiment, when the first casing portion and the second casing portion are closed, the microchip is placed on the plate surface and the second casing of the control substrate housed in the first casing portion. Between the bodies. In the present embodiment, the same as the first embodiment, the same as the first embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

以下參照圖15、圖16說明本發明第3實施方式的彈珠遊戲机上的基板殼體的結構。另外，圖15是用於說明收容併封閉著控制基板的狀態下基板殼體的外觀的立體圖，圖16是基板殼體打開狀態下的立體圖。並且，由於收容了上述主控制基板的基板殼體、收容了遊戲顯示用控制基板的基板殼體以及收容了其他各種控制基板的基板殼體基本上都是相同的結構，所以僅以收容了主控制基板3的基板殼體300的結構為代表進行說明。The structure of the substrate housing on the marble game machine according to the third embodiment of the present invention will be described below with reference to Figs. 15 and 16 . In addition, FIG. 15 is a perspective view for explaining an appearance of the substrate case in a state in which the control board is housed and closed, and FIG. 16 is a perspective view showing the substrate case in an open state. Further, since the substrate case in which the main control board is housed, the substrate case in which the game display control board is housed, and the substrate case in which various other control boards are housed are basically the same structure, only the main body is housed. The structure of the substrate case 300 of the control substrate 3 will be described as a representative.

在圖15、圖16中，該基板殼體200是採用透明的丙烯酸樹脂及聚碳酸酯樹脂等所謂的硬質塑料材料成形的盒型殼體，其具有收容了主控制基板3的矩形的第1殼體部4、從上方覆蓋而與第1殼體部4嵌合的矩形的第2殼體部5以及可旋轉地支撐第1殼體部4和第2殼體部5的鉸鏈部6。在第1殼體部4上，形成有用於通過螺絲等固定在上述的遊戲盤1h(參見圖2)背面的複數個固定部7，還在第1殼體部4的矩形的底部8上一體地成形有用於安放併固定主控制基板3的安放部9。另外，主控制基板3通過在由玻璃環氧樹脂及酚醛樹脂等形成的具有絕緣性的電路基板3a上搭載CPU、ROM、布線用連接器、電阻、電容等電子元件，在形成於電路基板3a上的布線圖形上用錫焊料銲接著這些電子元件，以使其發揮特定的功能。並且，固定著後述的微芯片MC的筒部330與用標號AR標示的電路基板3a的板面區域相接觸。In FIG. 15 and FIG. 16, the substrate case 200 is a box-shaped case formed of a so-called hard plastic material such as a transparent acrylic resin or a polycarbonate resin, and has a rectangular first shape in which the main control board 3 is housed. The case portion 4 includes a rectangular second case portion 5 that is fitted to the first case portion 4 from above, and a hinge portion 6 that rotatably supports the first case portion 4 and the second case portion 5. The first casing portion 4 is formed with a plurality of fixing portions 7 for fixing to the back surface of the above-described game disk 1h (see FIG. 2) by screws or the like, and is also integrated on the rectangular bottom portion 8 of the first casing portion 4. A mounting portion 9 for mounting and fixing the main control board 3 is formed. In addition, the main control board 3 is mounted on a circuit board by mounting an electronic component such as a CPU, a ROM, a wiring connector, a resistor, or a capacitor on an insulating circuit board 3a made of a glass epoxy resin, a phenol resin, or the like. These electronic components are soldered with tin solder on the wiring pattern on 3a to perform a specific function. Further, the cylindrical portion 330 of the microchip MC to be described later is fixed in contact with the plate surface region of the circuit board 3a indicated by the reference numeral AR.

進而，在第1殼體部4的側壁(標號省略)，形成有複數的嵌合孔10，在第2殼體部5的側壁(標號省略)，形成有複數的舌片狀的嵌合突起11，如圖15所示，若將第2殼體部5對於第1殼體部4封閉，則牠們的嵌合孔10即與嵌合突起11牢固地嵌合住，使第1、第2殼體部4、5相互牢固地嵌合在一起，收容主控制基板3。Further, a plurality of fitting holes 10 are formed in the side wall (not shown) of the first casing portion 4, and a plurality of tongue-like fitting projections are formed on the side wall (not shown) of the second casing portion 5. As shown in FIG. 15, when the second case portion 5 is closed to the first case portion 4, the fitting holes 10 are firmly fitted to the fitting projections 11, so that the first and second portions are made. The case portions 4 and 5 are firmly fitted to each other to house the main control board 3.

進而，如圖16所示，在第2殼體部5的頂板部320，一體地成形有固定著後述的微芯片MC的筒部330。這裡，若第1、第2殼體部4、5封閉後，筒部330形成於與收容在第1殼體部5的主控制基板3所搭載的板面區域AR相接觸的高度，此外，在筒部330上，還形成有嵌合著微芯片MC的孔330a。並且，如下所述，微芯片MC嵌入孔330a內，通過填充在該微芯片MC的周邊部與孔330a的壁面之間的粘合劑來固定。Further, as shown in FIG. 16 , a cylindrical portion 330 to which a microchip MC to be described later is fixed is integrally formed in the top plate portion 320 of the second casing portion 5 . Here, when the first and second case portions 4 and 5 are closed, the tubular portion 330 is formed at a height in contact with the plate surface region AR mounted on the main control board 3 housed in the first case portion 5, and A hole 330a into which the microchip MC is fitted is formed on the tubular portion 330. Further, as described below, the microchip MC is embedded in the hole 330a, and is fixed by an adhesive filled between the peripheral portion of the microchip MC and the wall surface of the hole 330a.

以下參照圖17、圖18說明微芯片MC對於筒部330進行安裝的結構。圖17(a)是放大顯示微芯片MC的結構的立體圖，圖17(b)是放大顯示微芯片MC對於筒部330進行安裝的結構的立體圖。另外，在圖17(b)中，為了說明的方便，顯示出了部分剖開第2殼體部5的頂板部320的狀態。The structure in which the microchip MC is attached to the tubular portion 330 will be described below with reference to FIGS. 17 and 18. 17(a) is a perspective view showing an enlarged structure of the microchip MC, and FIG. 17(b) is a perspective view showing an enlarged structure of the microchip MC for mounting the cylindrical portion 330. In addition, in FIG. 17(b), for the convenience of explanation, the state in which the top plate portion 320 of the second casing portion 5 is partially cut away is shown.

首先，如圖17(a)所示，微芯片MC的結構是，其具有用聚碳酸酯樹脂形成的平板狀的透明基板MCa、迭層在透明基板MCa上的記錄層MCb、反射層MCc、保護層MCd及粘合層MCe。微芯片MC的結構及其製造方法與第1實施方式所說明者相同，故省略其說明。First, as shown in FIG. 17(a), the microchip MC has a flat-shaped transparent substrate MCa formed of a polycarbonate resin, a recording layer MCb laminated on the transparent substrate MCa, and a reflective layer MCc. Protective layer MCd and adhesive layer MCe. The structure of the microchip MC and the manufacturing method thereof are the same as those described in the first embodiment, and thus the description thereof will be omitted.

如圖17(b)所示，微芯片MC將透明基板MCa向上，將粘合層MCe向下，***形成於筒部330的孔330a內，通過填充在透明基板MCa的周邊部與孔330a的壁面之間的紫外線硬化樹脂及熱硬化樹脂等粘合劑來固定。此外，為使向下***孔330a內的粘合層MCe不從孔330a突出出來，使粘合層MCe與筒部330的底面(與板面區域AR相對的面)處於同一個面上，透明基板MCa的周邊部和孔330a通過上述的紫外線硬化樹脂及熱硬化樹脂等粘合劑來固定。As shown in Fig. 17 (b), the microchip MC has the transparent substrate MCa upward, and the adhesive layer MCe is inserted downward into the hole 330a formed in the cylindrical portion 330, and is filled in the peripheral portion of the transparent substrate MCa and the hole 330a. An adhesive such as an ultraviolet curable resin and a thermosetting resin between the walls is fixed. Further, in order that the adhesive layer MCe which is inserted into the hole 330a does not protrude from the hole 330a, the adhesive layer MCe and the bottom surface of the cylindrical portion 330 (the surface opposite to the plate surface area AR) are on the same surface, transparent The peripheral portion of the substrate MCa and the hole 330a are fixed by a binder such as the ultraviolet curable resin and the thermosetting resin described above.

然後，若將第2殼體部5對於第1殼體部4封閉，則如圖18的剖視圖所示，筒部330的底面與主控制基板3的板面區域AR接觸在一起，且形成於微芯片MC上的粘合層MCe將與板面區域AR粘合，進而將透明基板MCa露出外部。Then, when the second casing portion 5 is closed to the first casing portion 4, as shown in the cross-sectional view of Fig. 18, the bottom surface of the tubular portion 330 is in contact with the land area AR of the main control board 3, and is formed in The adhesive layer MCe on the microchip MC is bonded to the panel surface area AR, and the transparent substrate MCa is exposed to the outside.

然後，只要使設置在筒部330的微芯片MC與主控制基板3的板面區域AR接觸，即可通過在第2殼體部5與主控制基板3之間安放微芯片MC的結構實現非法行為防止手段。Then, if the microchip MC provided in the tubular portion 330 is brought into contact with the panel surface area AR of the main control substrate 3, it is possible to realize the illegal placement of the microchip MC between the second housing portion 5 and the main control substrate 3. Means of prevention of behavior.

向形成於微芯片MC的記錄層MCb上記錄併抹消信息，採用在第1實施方式說明的圖7所示的信息記錄還原裝置與第1實施方式同樣地進行。並且，記錄在微芯片MC的記錄層MCb上的信息與第1實施方式在圖8中所說明的相同。The information recording and reproducing apparatus shown in FIG. 7 described in the first embodiment is recorded and erased on the recording layer MCb formed on the microchip MC, and is performed in the same manner as in the first embodiment. Further, the information recorded on the recording layer MCb of the microchip MC is the same as that described in FIG. 8 in the first embodiment.

然後，如圖18所示，在第1、第2殼體部4、5封閉，筒部330與主控制基板3的板面區域AR接觸，且微芯片MC的粘合層MCe與板面區域AR粘合的狀態下，例如將第2殼體部300設置在遊戲機1內時，當非法行為者打開遊戲機1的鎖，強行撬開第1、第2殼體部4、5後，如圖19的剖視圖所示，微芯片MC的記錄層MCb會與反射層MCc剝離，記錄層MCb會破損。也就是說，由於記錄層MCb與反射層MCc是機械地壓接，保護層MCd是通過由粘合劑構成的粘合層MCe與板面區域AR牢固地粘合，透明基板MCa是通過紫外線硬化樹脂等粘合劑牢固地粘合在筒部330的孔330a上，所以，當非法行為者強行撬開第1、第2殼體部4、5後，粘合力弱的記錄層MCb與反射層MCc會剝離、破損。Then, as shown in FIG. 18, the first and second case portions 4, 5 are closed, and the cylindrical portion 330 is in contact with the plate surface area AR of the main control substrate 3, and the adhesive layer MCe and the plate surface area of the microchip MC are closed. In the state in which the AR is bonded, for example, when the second casing portion 300 is installed in the game machine 1, when the illegal player opens the lock of the game machine 1 and forcibly opens the first and second casing portions 4 and 5, As shown in the cross-sectional view of Fig. 19, the recording layer MCb of the microchip MC is peeled off from the reflective layer MCc, and the recording layer MCb is broken. That is, since the recording layer MCb and the reflective layer MCc are mechanically crimped, the protective layer MCd is firmly bonded to the panel surface area AR by the adhesive layer MCe composed of an adhesive, and the transparent substrate MCa is cured by ultraviolet rays. The adhesive such as a resin is firmly adhered to the hole 330a of the tubular portion 330. Therefore, when the illegal actor forcibly opens the first and second casing portions 4 and 5, the recording layer MCb having weak adhesion is reflected. The layer MCc will peel off and break.

然後，當記錄層MCb與反射層MCc破損後，記錄在記錄層MCb上的圖8(b)所例示的文字、符號、圖形等可目視的圖案也破損，遊戲機1的管理者看到該破損的圖案，即可知曉其被實施了非法行為。Then, when the recording layer MCb and the reflective layer MCc are broken, the visually visible pattern such as characters, symbols, and graphics illustrated in FIG. 8(b) recorded on the recording layer MCb is also damaged, and the manager of the gaming machine 1 sees the A broken pattern reveals that it has been illegally committed.

如上所述，依據本實施方式的遊戲機1，只要事先將微芯片MC的透明基板MCa固定在第2殼體部5的頂板部320上形成的筒部330，再封閉該第2殼體部5和收容著主控制基板3的第1殼體部4，即能使在微芯片MC上形成的粘合層MCe與主控制基板3的電路基板3a的面(具體地說即板面區域AR)粘合，以此即構成了禁止基板殼體200開關的非法行為防止手段。然後，當非法行為者非法打開基板殼體200，即打開第1、第2殼體部4、5之後，在微芯片MC上形成的記錄層MCb與反射層MCc就會剝離，記錄層MCb就會破損。因此，只要遊戲機1的管理者通過透明基板MCa目視到該破損的記錄層MCb，即可容易地知曉其被實施了非法行為，能夠對於該非法行為采取防止對策。As described above, according to the game machine 1 of the present embodiment, the transparent substrate MCa of the microchip MC is fixed to the cylindrical portion 330 formed on the top plate portion 320 of the second casing portion 5, and the second casing portion is closed. 5 and the first case portion 4 in which the main control board 3 is housed, that is, the surface of the circuit board 3a on the microchip MC and the circuit board 3a of the main control board 3 (specifically, the board area AR) The bonding means that the illegal behavior preventing means for prohibiting the switching of the substrate housing 200 is constructed. Then, when the illegal player illegally opens the substrate casing 200, that is, after opening the first and second casing portions 4, 5, the recording layer MCb and the reflective layer MCc formed on the microchip MC are peeled off, and the recording layer MCb is Will be damaged. Therefore, as long as the manager of the game machine 1 visually recognizes the damaged recording layer MCb through the transparent substrate MCa, it is easy to know that the illegal behavior has been performed, and it is possible to take countermeasures against the illegal behavior.

並且，由於微芯片MC結構簡潔，且能夠不以複雜的製造工序來製造，因此能夠降低成本。例如，圖17顯示出了1個微芯片MC，但是還可以製造出在更大的透明基板MCa上迭層了記錄層MCb、反射層MCc、保護層MCd及粘合層MCe的中間產物，對該中間產物進行裁剪，即可大量生產許多微芯片MC，由此可謀求製造成本的降低。Further, since the structure of the microchip MC is simple and can be manufactured without complicated manufacturing processes, the cost can be reduced. For example, FIG. 17 shows one microchip MC, but it is also possible to manufacture an intermediate product in which a recording layer MCb, a reflective layer MCc, a protective layer MCd, and an adhesive layer MCe are laminated on a larger transparent substrate MCa. By cutting the intermediate product, a large number of microchips MC can be mass-produced, whereby the manufacturing cost can be reduced.

並且，只要將微芯片MC固定在形成於第2殼體部5上的筒部330，在封閉第1、第2殼體部4、5時，就能實現在第2殼體部5與電路基板300a的面之間安放微芯片MC的非法行為防止手段的結構，使之在使用時更加得心應手。Further, when the microchip MC is fixed to the tubular portion 330 formed on the second casing portion 5, the second casing portion 5 and the circuit can be realized when the first and second casing portions 4 and 5 are closed. The structure of the illegal behavior preventing means of the microchip MC is placed between the faces of the substrate 300a, making it more convenient to use.

並且，只要事先在記錄層MCb上記錄具有特定信息的微型條形碼，再通過信息記錄還原裝置100將該微型條形碼讀取還原，即可查明是否被實施了非法行為。Further, if a micro bar code having specific information is recorded on the recording layer MCb in advance, and the micro bar code is read and restored by the information recording and restoring device 100, it is possible to ascertain whether or not an illegal act has been performed.

並且，由於在微芯片MC上形成的記錄層MCb能夠進行信息的記錄、抹消、再記錄、再抹消，所以，例如遊戲機1的管理者只要採用信息記錄還原裝置100適當更新微型條形碼的信息，或者適當更新可目視的文字、符號、圖形等圖案，就能夠對於非法行為者的非法行為實施更有效的預防對策。Further, since the recording layer MCb formed on the microchip MC can record, erase, re-record, and erase the information, for example, the manager of the game machine 1 simply updates the information of the micro-barcode by using the information recording and restoration device 100. Or, by appropriately updating the visually-readable characters, symbols, graphics, and the like, it is possible to implement more effective preventive measures against the illegal behavior of illegal actors.

另外，在以上說明中，以設置在收容了主控制基板3的基板殼體200上的非法行為防止手段的結構為代表進行了說明，但是由於在收容了遊戲顯示用控制基板的基板殼體、收容了其他各種控制基板的基板殼體也適用相同的非法行為防止手段，所以若這些基板殼體與基板殼體2同樣地被打開，則能夠發現非法行為。In the above description, the configuration of the illegal behavior preventing means provided on the substrate casing 200 in which the main control board 3 is housed has been described as a representative. However, the substrate case in which the game display control board is housed is Since the same illegal behavior preventing means is applied to the substrate case in which various other control substrates are housed, if these substrate cases are opened in the same manner as the substrate case 2, illegal behavior can be found.

並且，以上說明瞭彈珠遊戲機的實施方式，但是本發明能夠適用於在基板殼體內收容安裝各種控制基板的所有遊戲機，例如也能夠適用於片子遊戲機等。Further, although the embodiment of the marble game machine has been described above, the present invention can be applied to all game machines in which various control boards are housed and mounted in the substrate casing, and can be applied to, for example, a game machine.

1．．．遊戲機1. . . Game machine

2．．．基板殼體2. . . Substrate housing

3．．．主控制基板3. . . Main control substrate

4．．．第1殼體部4. . . First housing part

5．．．第2殼體部5. . . Second housing part

12、13．．．凸緣部12, 13. . . Flange

13a．．．孔13a. . . hole

MC．．．微芯片MC. . . Microchip

MCa．．．透明基板MCa. . . Transparent substrate

MCb．．．記錄層MCb. . . Recording layer

MCc．．．反射層MCc. . . Reflective layer

MCd．．．保護層MCd. . . The protective layer

MCe．．．粘合層MCe. . . Adhesive layer

200．．．基板殼體200. . . Substrate housing

220．．．頂板部220. . . Roof section

230．．．筒部230. . . Tube

230a．．．孔230a. . . hole

300．．．基板殼體300. . . Substrate housing

320．．．頂板部320. . . Roof section

330．．．筒部330. . . Tube

330a．．．孔330a. . . hole

圖1是概略地顯示出本發明第1實施方式的彈珠遊戲機的外觀的立體圖。FIG. 1 is a perspective view schematically showing an appearance of a marble game machine according to a first embodiment of the present invention.

圖2是概略地顯示出對圖1所示的彈珠遊戲機分解後的外觀的分解立體圖。Fig. 2 is an exploded perspective view schematically showing an appearance of the marble game machine shown in Fig. 1 in an exploded state.

圖3是收容控制基板後封閉的狀態下的基板殼體外觀的立體圖。3 is a perspective view of the appearance of the substrate casing in a state in which the control substrate is housed and closed.

圖4是基板殼體打開狀態下的立體圖。4 is a perspective view of the substrate housing in an open state.

圖5(a)是放大顯示微芯片的結構的立體圖，圖5(b)是放大顯示微芯片對於凸緣部進行安裝的結構的立體圖。Fig. 5 (a) is a perspective view showing an enlarged structure of a microchip, and Fig. 5 (b) is a perspective view showing an enlarged structure of a microchip mounted on a flange portion.

圖6是用於說明封閉第1殼體部和第2殼體部時微芯片的功能等的剖視圖。FIG. 6 is a cross-sectional view for explaining functions and the like of the microchip when the first case portion and the second case portion are closed.

圖7是用於說明信息記錄還原裝置的結構的說明圖。Fig. 7 is an explanatory diagram for explaining a configuration of an information recording and restoring apparatus.

圖8(a)是放大顯示微芯片的記錄層所記錄的微型條形碼的說明圖，圖8(b)是從透明基板一側觀察微芯片的記錄層所記錄的可目視的信息的說明圖。Fig. 8(a) is an explanatory view showing an enlarged micro-barcode recorded on a recording layer of the microchip, and Fig. 8(b) is an explanatory view of the visual information recorded on the recording layer of the microchip as viewed from the transparent substrate side.

圖9是用於說明第1殼體部和第2殼體部被強行撬開時的微芯片的狀態的剖視圖。FIG. 9 is a cross-sectional view for explaining a state of the microchip when the first case portion and the second case portion are forcibly opened.

圖10是用於說明收容併封閉著本發明第2實施方式的彈珠遊戲機的控制基板的狀態下基板殼體的外觀的立體圖。FIG. 10 is a perspective view for explaining an appearance of the substrate casing in a state in which the control board of the marble game machine according to the second embodiment of the present invention is housed and closed.

圖11是基板殼體打開狀態下的立體圖。Fig. 11 is a perspective view showing the substrate housing in an open state.

圖12(a)是放大顯示微芯片的結構的立體圖，圖12(b)是放大顯示微芯片對於筒部進行安裝的結構的立體圖。Fig. 12 (a) is a perspective view showing an enlarged structure of a microchip, and Fig. 12 (b) is a perspective view showing an enlarged structure of a microchip mounted on a cylindrical portion.

圖13是用於說明封閉第1殼體部和第2殼體部時微芯片的功能等的剖視圖。FIG. 13 is a cross-sectional view for explaining functions and the like of the microchip when the first case portion and the second case portion are closed.

圖14是用於說明第1殼體部和第2殼體部被強行撬開時的微芯片的狀態的剖視圖。FIG. 14 is a cross-sectional view for explaining a state of the microchip when the first case portion and the second case portion are forcibly opened.

圖15是用於說明收容併封閉著本發明第3實施方式的彈珠遊戲機的控制基板的狀態下基板殼體的外觀的立體圖。FIG. 15 is a perspective view for explaining an appearance of a substrate casing in a state in which a control board of a marble game machine according to a third embodiment of the present invention is housed and closed.

圖16是基板殼體打開狀態下的立體圖。Fig. 16 is a perspective view showing the substrate housing in an open state.

圖17(a)是放大顯示微芯片的結構的立體圖，圖17(b)是放大顯示微芯片對於筒部進行安裝的結構的立體圖。Fig. 17 (a) is a perspective view showing an enlarged structure of a microchip, and Fig. 17 (b) is a perspective view showing an enlarged structure of a microchip mounted on a cylindrical portion.

圖18是用於說明封閉第1殼體部和第2殼體部時微芯片的功能等的剖視圖。18 is a cross-sectional view for explaining functions and the like of the microchip when the first case portion and the second case portion are closed.

圖19是用於說明第1殼體部和第2殼體部被強行撬開時的微芯片的狀態的剖視圖。19 is a cross-sectional view for explaining a state of the microchip when the first case portion and the second case portion are forcibly opened.

4．．．第1殼體部4. . . First housing part

5．．．第2殼體部5. . . Second housing part

12、13．．．凸緣部12, 13. . . Flange

13a．．．孔13a. . . hole

MC．．．微芯片MC. . . Microchip

MCa．．．透明基板MCa. . . Transparent substrate

MCb．．．記錄層MCb. . . Recording layer

MCc．．．反射層MCc. . . Reflective layer

MCd．．．保護層MCd. . . The protective layer

MCe．．．粘合層MCe. . . Adhesive layer

Claims (10)

一種遊戲機，其具備一種具有非法行為防止手段、併收容著控制基板的基板殼體，其特徵在於，上述基板殼體具有互相封閉後即可收容上述控制基板的第1殼體部和第2殼體部，上述非法行為防止手段具有微芯片，上述微芯片嵌入在沿該第2殼體的封閉方向貫通的開口部內，其在上述第1殼體部和第2殼體部被封閉後立即處於上述第1殼體部與第2殼體部之間，上述微芯片具有一迭層結構，其在固定在上述第2殼體部上的透明基板上，迭層著記錄信息的記錄層、反射層、保護層及粘合在上述第1殼體部上的粘合層，該記錄層與該反射層是機械地壓接，一旦打開上述第1殼體部和第2殼體部，則在上述微芯片上形成的上述記錄層和反射層會剝離、破損。 A game machine comprising: a substrate housing having an illegal behavior preventing means and accommodating a control substrate, wherein the substrate housing has a first housing portion and a second housing that can accommodate the control substrate after being sealed from each other In the case portion, the illegal behavior preventing means includes a microchip, and the microchip is fitted into an opening penetrating in a closing direction of the second casing, and the first casing portion and the second casing portion are closed immediately after the first casing portion and the second casing portion are closed Between the first case portion and the second case portion, the microchip has a laminated structure, and a recording layer on which information is recorded is laminated on a transparent substrate fixed to the second case portion. a reflective layer, a protective layer, and an adhesive layer adhered to the first case portion, wherein the recording layer and the reflective layer are mechanically pressure-bonded, and when the first case portion and the second case portion are opened, the first case portion and the second case portion are opened The recording layer and the reflective layer formed on the above microchip are peeled off and damaged. 如申請專利範圍第1項所述的遊戲機，其特徵在於，上述微芯片位於分別形成於上述第1殼體部和第2殼體部的凸緣部之間。 The gaming machine according to claim 1, wherein the microchip is located between the flange portions formed in the first case portion and the second case portion, respectively. 如申請專利範圍第1或2項所述的遊戲機，其特徵在於，在上述微芯片的記錄層上，光學記錄著人的眼睛無法讀取的細微的微型條形碼。 The game machine according to claim 1 or 2, wherein a fine micro-barcode which is incapable of reading by a human eye is optically recorded on the recording layer of the microchip. 如申請專利範圍第1或2項所述的遊戲機，其特徵在於，在上述微芯片的記錄層上，記錄著人能夠目視的圖案。 The game machine according to claim 1 or 2, wherein a recording pattern on the recording layer of the microchip is recorded by a person. 一種遊戲機，其具備一種具有非法行為防止手段、併收容著控制基板的基板殼體，其特徵在於，上述基板殼體具有互相封閉後即可收容上述控制基板的第1殼體部和第2殼體部，上述非法行為防止手段具有微芯片，上述微芯片嵌入在沿該第2殼體的封閉方向貫通的開口部內，其在封閉上述第1殼體部和第2殼體部後，即可處於被第1殼體部所收容的上述控制基 板所搭載的電子元件與上述第2殼體部之間，上述微芯片具有一迭層結構，其在固定在上述第1殼體部上的透明基板上，迭層著記錄信息的記錄層、反射層、保護層及粘合在上述第2殼體部上的粘合層，該記錄層與該反射層是機械地壓接，一旦打開上述第1殼體部和第2殼體部，則在上述微芯片上形成的上述記錄層和反射層會剝離、破損。 A game machine comprising: a substrate housing having an illegal behavior preventing means and accommodating a control substrate, wherein the substrate housing has a first housing portion and a second housing that can accommodate the control substrate after being sealed from each other In the case portion, the illegal behavior preventing means includes a microchip, and the microchip is fitted into an opening penetrating in a closing direction of the second casing, and after closing the first casing portion and the second casing portion, The above control unit accommodated in the first housing portion The microchip has a laminated structure between the electronic component mounted on the board and the second casing portion, and a recording layer on which information is recorded is laminated on the transparent substrate fixed to the first casing portion. a reflective layer, a protective layer, and an adhesive layer adhered to the second case portion, wherein the recording layer and the reflective layer are mechanically pressure-bonded, and when the first case portion and the second case portion are opened, The recording layer and the reflective layer formed on the above microchip are peeled off and damaged. 如申請專利範圍第5項所述的遊戲機，其特徵在於，在上述微芯片的記錄層上，光學記錄著人的眼睛無法讀取的細微的微型條形碼。 The gaming machine according to claim 5, characterized in that the micro-micro barcode which is invisible to the human eye is optically recorded on the recording layer of the microchip. 如申請專利範圍第5或6項所述的遊戲機，其特徵在於，在上述微芯片的記錄層上，記錄著人能夠目視的圖案。 The gaming machine according to claim 5, wherein the recording layer of the microchip records a pattern that a person can visually view. 一種遊戲機，其具備一種具有非法行為防止手段、併收容著控制基板的基板殼體，其特徵在於，上述基板殼體具有互相封閉後即可收容上述控制基板的第1殼體部和第2殼體部，上述非法行為防止手段具有微芯片，上述微芯片嵌入在沿該第2殼體的封閉方向貫通的開口部內，其在封閉上述第1殼體部和第2殼體部後，即可處於被第1殼體部所收容的上述控制基板的板面與上述第2殼體部之間，上述微芯片具有一迭層結構，其在固定在上述第1殼體部上的透明基板上，迭層著記錄信息的記錄層、反射層、保護層及粘合在上述第2殼體部上的粘合層，該記錄層與該反射層是機械地壓接，一旦打開上述第1殼體部和第2殼體部，則在上述微芯片上形成的上述記錄層和反射層會剝離、破損。 A game machine comprising: a substrate housing having an illegal behavior preventing means and accommodating a control substrate, wherein the substrate housing has a first housing portion and a second housing that can accommodate the control substrate after being sealed from each other In the case portion, the illegal behavior preventing means includes a microchip, and the microchip is fitted into an opening penetrating in a closing direction of the second casing, and after closing the first casing portion and the second casing portion, The microchip may have a laminated structure and a transparent substrate fixed to the first casing portion between the plate surface of the control substrate housed in the first casing portion and the second casing portion. a recording layer, a reflective layer, a protective layer, and an adhesive layer adhered to the second casing portion, wherein the recording layer and the reflective layer are mechanically pressure-bonded, and the first layer is opened. In the case portion and the second case portion, the recording layer and the reflective layer formed on the microchip are peeled off and damaged. 如申請專利範圍第8項所述的遊戲機，其特徵在於，在上述微芯片的記錄層上，光學記錄著人的眼睛無法讀取的細微的微型條形碼。 A game machine according to claim 8 is characterized in that, on the recording layer of the microchip, a minute micro bar code which cannot be read by a human eye is optically recorded. 如申請專利範圍第8或9項所述的遊戲機，其特徵在於，在上述微芯片的記錄層上，記錄著人能夠目視的圖案。 The game machine according to the eighth or ninth aspect of the invention, characterized in that the recording layer of the microchip records a pattern that a person can visually view.