TWI468720B - Radiographic image detector, radiographic imaging apparatus, radiographic imaging system - Google Patents
Radiographic image detector, radiographic imaging apparatus, radiographic imaging system Download PDFInfo
- Publication number
- TWI468720B TWI468720B TW101149155A TW101149155A TWI468720B TW I468720 B TWI468720 B TW I468720B TW 101149155 A TW101149155 A TW 101149155A TW 101149155 A TW101149155 A TW 101149155A TW I468720 B TWI468720 B TW I468720B
- Authority
- TW
- Taiwan
- Prior art keywords
- pixel
- pixels
- radiographic image
- imaging
- charge
- Prior art date
Links
- 238000003384 imaging method Methods 0.000 title claims description 344
- 230000005855 radiation Effects 0.000 claims description 309
- 230000005484 gravity Effects 0.000 claims description 70
- 238000003860 storage Methods 0.000 claims description 60
- 239000003990 capacitor Substances 0.000 claims description 56
- 230000001678 irradiating effect Effects 0.000 claims description 19
- 238000001514 detection method Methods 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 14
- 238000006243 chemical reaction Methods 0.000 description 55
- 238000000034 method Methods 0.000 description 48
- 239000010410 layer Substances 0.000 description 46
- 230000008569 process Effects 0.000 description 40
- 239000010408 film Substances 0.000 description 26
- 230000010354 integration Effects 0.000 description 26
- 210000000481 breast Anatomy 0.000 description 22
- 230000003068 static effect Effects 0.000 description 22
- 238000010586 diagram Methods 0.000 description 19
- 238000003825 pressing Methods 0.000 description 18
- 238000004891 communication Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 239000011669 selenium Substances 0.000 description 10
- 238000003745 diagnosis Methods 0.000 description 9
- 239000011229 interlayer Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 8
- 229910052711 selenium Inorganic materials 0.000 description 8
- 230000035945 sensitivity Effects 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 6
- 238000009607 mammography Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005070 sampling Methods 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 5
- 230000003321 amplification Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000003199 nucleic acid amplification method Methods 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 229910004205 SiNX Inorganic materials 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000001727 in vivo Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- QVEIBLDXZNGPHR-UHFFFAOYSA-N naphthalene-1,4-dione;diazide Chemical compound [N-]=[N+]=[N-].[N-]=[N+]=[N-].C1=CC=C2C(=O)C=CC(=O)C2=C1 QVEIBLDXZNGPHR-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 238000002601 radiography Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 210000000779 thoracic wall Anatomy 0.000 description 1
- 238000003325 tomography Methods 0.000 description 1
- 238000010200 validation analysis Methods 0.000 description 1
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/02—Arrangements for diagnosis sequentially in different planes; Stereoscopic radiation diagnosis
- A61B6/025—Tomosynthesis
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/02—Arrangements for diagnosis sequentially in different planes; Stereoscopic radiation diagnosis
- A61B6/03—Computed tomography [CT]
- A61B6/032—Transmission computed tomography [CT]
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/04—Positioning of patients; Tiltable beds or the like
- A61B6/0407—Supports, e.g. tables or beds, for the body or parts of the body
- A61B6/0414—Supports, e.g. tables or beds, for the body or parts of the body with compression means
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/42—Arrangements for detecting radiation specially adapted for radiation diagnosis
- A61B6/4208—Arrangements for detecting radiation specially adapted for radiation diagnosis characterised by using a particular type of detector
- A61B6/4233—Arrangements for detecting radiation specially adapted for radiation diagnosis characterised by using a particular type of detector using matrix detectors
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/44—Constructional features of apparatus for radiation diagnosis
- A61B6/4429—Constructional features of apparatus for radiation diagnosis related to the mounting of source units and detector units
- A61B6/4452—Constructional features of apparatus for radiation diagnosis related to the mounting of source units and detector units the source unit and the detector unit being able to move relative to each other
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/50—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment specially adapted for specific body parts; specially adapted for specific clinical applications
- A61B6/502—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment specially adapted for specific body parts; specially adapted for specific clinical applications for diagnosis of breast, i.e. mammography
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
- G01N23/046—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using tomography, e.g. computed tomography [CT]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/30—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming X-rays into image signals
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
- H04N25/46—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by combining or binning pixels
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/32—Transforming X-rays
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Medical Informatics (AREA)
- Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- High Energy & Nuclear Physics (AREA)
- Molecular Biology (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Radiology & Medical Imaging (AREA)
- Veterinary Medicine (AREA)
- Optics & Photonics (AREA)
- Biomedical Technology (AREA)
- Heart & Thoracic Surgery (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- Public Health (AREA)
- Biophysics (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Pulmonology (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Mathematical Physics (AREA)
- Dentistry (AREA)
- Biochemistry (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Immunology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Apparatus For Radiation Diagnosis (AREA)
- Measurement Of Radiation (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Light Receiving Elements (AREA)
Description
本發明涉及一種射線照相圖像檢測器(radiographic image detector)、射線照相成像裝置(radiographic imaging apparatus)和射線照相成像系統(radiographic imaging system)。明確地說,本發明涉及一種射線照相圖像檢測器、射線照相成像裝置和射線照相成像系統,用於將輻射直接轉換為電荷。The present invention relates to a radiographic image detector, a radiographic imaging apparatus, and a radiographic imaging system. In particular, the present invention relates to a radiographic image detector, a radiographic imaging device, and a radiographic imaging system for converting radiation directly into electrical charges.
近來,已投入實踐的射線照相圖像檢測裝置使用例如平板檢測器(Flat Panel Detector;FPD)的輻射檢測器,所述檢測器具有:在薄膜電晶體(Thin Film Transistor;TFT)主動陣列基板(active matrix substrate)上方設置的X射線敏感層,且能夠直接將X射線數據轉換為數位數據。相比於例如傳統膠片螢幕,這樣的平板檢測器具有實現較快速圖像和視訊圖像確認的優勢,且其用途迅速擴展。提出了各種類型的輻射檢測器,例如,存在:直接轉換型,其中在半導體層中將輻射直接轉換為電荷、並積聚所述電荷;以及間接轉換型,其中,首先由例如CsI:Tl或GOS(Gd2 O2 S:Tb)的閃爍體(scintillator)將輻射轉換為光,且接著在半導體層中將所轉換的光轉換為電荷、並積聚所述電荷。Recently, a radiographic image detecting apparatus that has been put into practice uses a radiation detector such as a Flat Panel Detector (FPD) having: a Thin Film Transistor (TFT) active array substrate ( The X-ray sensitive layer is disposed above the active matrix substrate and is capable of directly converting X-ray data into digital data. Such flat panel detectors have the advantage of enabling faster image and video image validation than, for example, conventional film screens, and their use is rapidly expanding. Various types of radiation detectors are proposed, for example, there are: a direct conversion type in which radiation is directly converted into electric charges in a semiconductor layer, and the electric charges are accumulated; and an indirect conversion type, wherein, first, for example, CsI:Tl or GOS A scintillator of (Gd 2 O 2 S:Tb) converts the radiation into light, and then converts the converted light into a charge in the semiconductor layer and accumulates the charge.
在輻射檢測器中,例如,多條掃描線和多條信號線被設置為彼此交叉,且畫素被設置為:對應於所述掃描線和 所述信號線之間的每個交叉點的矩陣圖案。所述多條掃描線和多條信號線連接到外部電路,例如,放大器積體電路(amplidier Integrated Circuit;IC)或閘極積體電路(IC)。In the radiation detector, for example, a plurality of scanning lines and a plurality of signal lines are disposed to cross each other, and a pixel is set to correspond to the scanning line and A matrix pattern of each intersection between the signal lines. The plurality of scan lines and the plurality of signal lines are connected to an external circuit, such as an amplifier integrated circuit (IC) or a gate integrated circuit (IC).
減小輻射檢測器中畫素的大小,是提高平板檢測器的解析度的有效方式。尤其是在使用例如硒(Se)的直接轉換型的輻射檢測器中,針對高清晰度增強式圖像品質提出了各種輻射檢測器,這有助於在實際上並未改變畫素大小的同時提高解析度。例如,針對用於***造影術的平板檢測器,提出了具有小畫素大小(size)的產品,其中著重於解析度。Reducing the size of the pixels in the radiation detector is an effective way to increase the resolution of the flat panel detector. In particular, in a direct conversion type radiation detector using, for example, selenium (Se), various radiation detectors are proposed for high definition enhanced image quality, which contributes to the fact that the pixel size is not actually changed. Improve resolution. For example, for a flat panel detector for mammography, a product having a small pixel size is proposed, with emphasis on resolution.
然而,由於敏感度與輻射檢測設備中的表面積的比例關係,簡單地減小畫素大小可能導致敏感度降低。因此,提出了在輻射檢測裝置中使用六角形畫素,以便達到解析度和敏感度兩者的提高(參見例如日本專利申請案公開(JP-A)第2003-255049號)。此外,使用正方形畫素時,對角線方向上的解析度低於水平和垂直方向上的解析度。然而,使用六角形畫素可確保在水平、垂直和對角線方向中的每個方向上的高解析度。However, simply reducing the pixel size may result in reduced sensitivity due to the proportionality of sensitivity to surface area in the radiation detecting device. Therefore, it has been proposed to use hexagonal pixels in the radiation detecting device in order to achieve both improvement in resolution and sensitivity (see, for example, Japanese Patent Application Laid-Open (JP-A) No. 2003-255049). In addition, when square pixels are used, the resolution in the diagonal direction is lower than the resolution in the horizontal and vertical directions. However, the use of hexagonal pixels ensures high resolution in each of the horizontal, vertical, and diagonal directions.
當考慮在靜態成像和視訊成像(螢光成像(fluoroscopic imaging))中使用上文所描述的六角形畫素時,考慮同時從多個畫素讀取電荷、並對所獲得的值求和(合併)的方法,特別是,為了例如在視訊中維持高幀率(frame rate)。也考慮在感測器內執行此畫素求和。When considering the use of the hexagonal pixels described above in still imaging and video imaging (fluoroscopic imaging), it is considered to simultaneously read charges from a plurality of pixels and sum the obtained values ( The method of merging, in particular, is to maintain a high frame rate, for example, in video. It is also considered to perform this pixel summation within the sensor.
然而,在多個六角形畫素的畫素求和中,取決於求和 方法,求和前後可能出現畫素位置(將多個畫素作為一個畫素簇(pixel cluster)處理時,為重心位置)的不均勻。因此,求和之後,可能無法維持:已在求和之前確保的水平、垂直和對角線方向中的每個方向上的均勻解析度。However, in the summation of the pixels of multiple hexagonal pixels, depending on the summation In the method, the pixel position (the position of the center of gravity when multiple pixels are treated as a pixel cluster) may occur before and after the summation. Therefore, after summation, it may not be possible to maintain a uniform resolution in each of the horizontal, vertical, and diagonal directions that have been secured prior to summation.
本發明提供一種射線照相圖像檢測器、射線照相成像裝置與射線照相成像***,可在組合多個畫素的電荷前後,在水平、垂直和對角線方向中的每個方向上維持均勻解析度。The present invention provides a radiographic image detector, a radiographic imaging apparatus, and a radiographic imaging system capable of maintaining uniform resolution in each of horizontal, vertical, and diagonal directions before and after combining charges of a plurality of pixels. degree.
本發明的第一方面是一種射線照相圖像檢測器,包含:檢測部,所述檢測部包含多個畫素,所述畫素具有排列為蜂巢形圖案的六角形畫素區域,每個畫素包含根據所輻照的輻射產生電荷的感測器部分、讀出所產生的電荷的第一切換元件和讀出所產生的電荷的第二切換元件;多條第一掃描線,針對由沿著列方向彼此鄰近的多個畫素配置的多個畫素列的每個畫素列、而設置一條所述第一掃描線,所述第一掃描線連接到對應畫素列的每個畫素中的所述第一切換元件的控制端子;以及多條第二掃描線,針對各自由所述多個畫素中特定數量的互相鄰近畫素的組合配置的多個畫素群中的每個畫素群、而設置一條所述第二掃描線,所述第二掃描線連接到相應畫素群中的每個畫素中的所述第二切換元件的控制端子,以便按照畫素群單元組合和讀取所產生的電荷,其中,所述特定數量的畫素經組合,以使得在多個六角形區域放置為彼此鄰近時,所述多 個六角形區域排列為蜂巢形圖案,其中,通過包含所述多個畫素群的多個重心中位於內部的一個重心、以及將位於所述一個重心外圍的6個個別重心連接在一起的線段,來形成每個六角形區域。A first aspect of the invention is a radiographic image detector, comprising: a detecting portion, wherein the detecting portion includes a plurality of pixels, the pixels having hexagonal pixel regions arranged in a honeycomb pattern, each drawing The element includes a sensor portion that generates a charge according to the irradiated radiation, a first switching element that reads out the generated charge, and a second switching element that reads the generated charge; a plurality of first scan lines, Each of the pixel columns of the plurality of pixel columns of the plurality of pixel configurations adjacent to each other in the column direction is disposed, and one of the first scan lines is disposed, and the first scan line is connected to each of the corresponding pixel columns a control terminal of the first switching element in the prime; and a plurality of second scan lines for each of a plurality of pixel groups each configured by a combination of a plurality of mutually adjacent pixels of the plurality of pixels a pixel group, and one of the second scan lines is disposed, the second scan line is connected to a control terminal of the second switching element in each pixel in the corresponding pixel group, so as to follow the pixel group Unit combination and reading the generated charge, its The specific number of pixels combined, placed adjacent to each other such that a plurality of hexagonal regions, said plurality The hexagonal regions are arranged in a honeycomb pattern, wherein a center of gravity located inside the plurality of centers of gravity including the plurality of pixel groups, and a line segment connecting six individual centers of gravity located at a periphery of the one center of gravity To form each hexagonal area.
本發明的第二方面是一種射線照相圖像檢測器,包含:檢測部,所述檢測部包含多個畫素,所述畫素具有排列為蜂巢形圖案的六角形畫素區域,每個畫素包含根據所輻照的輻射產生電荷的感測器部分、讀出所產生的電荷的第一切換元件和讀出所產生的電荷的第二切換元件;多條第一掃描線,針對由沿著列方向彼此鄰近的多個畫素配置的多個畫素列中的每個畫素列、而設置一條所述第一掃描線,所述第一掃描線連接到對應畫素列的每個所述畫素中的所述第一切換元件的控制端子;多條第二掃描線,針對所述多個畫素列中的每個畫素列設置一條所述第二掃描線,所述第二掃描線分為多個線群,且連接到屬於每個相應群的畫素群的所述第二切換元件的控制端子,以使得當組合和讀取來自各自由所述多個畫素列中多個鄰近畫素配置而成的多個畫素群的電荷時,通過不同的相應資料線傳輸對應於從相應多個畫素群讀出的所組合的電荷量的電荷信號;以及多條資料線,設置為分別與所述多條第一掃描線和所述多條第二掃描線交叉,所述資料線傳輸第一電荷信號,所述第一電荷信號對應於由所述多個畫素中的每個畫素中的所述第一切換元件讀出的電荷,且所述資料線傳輸第二電荷信號,所述第二電荷信號對應於由所述相應多 個畫素群的所述第二切換元件讀取的所組合的電荷量。A second aspect of the present invention is a radiographic image detector, comprising: a detecting portion, wherein the detecting portion includes a plurality of pixels, the pixels having hexagonal pixel regions arranged in a honeycomb pattern, each drawing The element includes a sensor portion that generates a charge according to the irradiated radiation, a first switching element that reads out the generated charge, and a second switching element that reads the generated charge; a plurality of first scan lines, Each of the plurality of pixel columns of the plurality of pixel configurations adjacent to each other in the column direction is disposed, and one of the first scan lines is disposed, the first scan line being connected to each of the corresponding pixel columns a control terminal of the first switching element in the pixel; a plurality of second scan lines, wherein the second scan line is disposed for each pixel column of the plurality of pixel columns, The two scan lines are divided into a plurality of line groups, and are connected to control terminals of the second switching elements belonging to the pixel groups of each respective group, such that when combined and read from the respective plurality of pixel columns The charge of multiple pixel groups configured by multiple adjacent pixels Transmitting a charge signal corresponding to the combined amount of charge read from the corresponding plurality of pixel groups through different respective data lines; and a plurality of data lines disposed to respectively correspond to the plurality of first scan lines and a plurality of second scan lines intersect, the data line transmitting a first charge signal, the first charge signal corresponding to being read by the first switching element in each of the plurality of pixels a charge, and the data line transmits a second charge signal, the second charge signal corresponding to the corresponding The combined amount of charge read by the second switching element of the pixel group.
在根據所述第二方面的本發明的第三方面中,所述多個畫素群中的每個畫素群可由3個畫素配置而成,在列方向上彼此並排的所述多個畫素群中的相應畫素群中的每個所述畫素的所述第二切換元件的控制端子可分別連接到所述第二掃描線,且鄰近掃描線可作為單個線群而共同連接。In a third aspect of the invention according to the second aspect, each of the plurality of pixel groups may be configured by three pixels, the plurality of pixels juxtaposed in the column direction Control terminals of the second switching element of each of the pixels in the corresponding pixel group in the pixel group may be respectively connected to the second scan line, and the adjacent scan lines may be connected as a single line group .
在根據所述第三方面的本發明的第四方面中,所述3個畫素可為:經設置以使得每個所述畫素的兩條鄰邊分別與另外兩個畫素中的每個畫素的一條邊鄰近的3個畫素。In a fourth aspect of the present invention according to the third aspect, the three pixels may be set such that two adjacent sides of each of the pixels are respectively associated with each of the other two pixels 3 pixels adjacent to one side of a pixel.
在根據所述第二方面的本發明的第五方面中,所述多個畫素群可各自由4個畫素配置,所述第二掃描線可在由所述第二掃描線中的一對鄰近第二掃描線配置的線群中共同連接,所述第二掃描線的每一對是:由連接到在列方向上彼此並排的多個相應畫素群中的3個個別畫素的所述第二切換元件的控制端子的第二掃描線、以及連接到所述多個畫素群中的每個畫素群中的一個個別畫素的所述第二切換元件的所述控制端子的所述第二掃描線而配置。In a fifth aspect of the invention according to the second aspect, the plurality of pixel groups may each be configured by 4 pixels, and the second scan line may be in one of the second scan lines Cooperating in a line group disposed adjacent to the second scan line, each pair of the second scan lines being: connected to 3 individual pixels in a plurality of corresponding pixel groups side by side in the column direction a second scan line of the control terminal of the second switching element, and the control terminal of the second switching element connected to one of the individual pixels in each of the plurality of pixel groups The second scan line is configured.
在根據所述第五方面的本發明的第六方面中,所述4個畫素可按照由3個畫素和1個畫素構成的4個畫素而配置,其中,所述3個畫素經設置以使得每個所述畫素的兩條鄰邊分別與所述3個畫素中的另外2個畫素的一條邊鄰近,且所述1個畫素可經設置以使得兩條鄰邊分別與所述3個畫素中的2個畫素的一條邊鄰近。In the sixth aspect of the invention according to the fifth aspect, the four pixels may be configured in accordance with four pixels composed of three pixels and one pixel, wherein the three pixels are The primes are arranged such that two adjacent edges of each of the pixels are adjacent to one edge of the other two of the three pixels, and the one pixel can be set such that two The neighboring edges are respectively adjacent to one side of the two pixels of the three pixels.
在根據所述第二方面到所述第六方面的本發明的第七 方面中,連接到所述多條第二掃描線的所述第二切換元件可針對每個所述線群使用經移位的時序作為塊來控制。Seventh of the present invention according to the second aspect to the sixth aspect In aspects, the second switching element connected to the plurality of second scan lines can be controlled for each of the line groups using the shifted timing as a block.
在根據所述第二方面到所述第七方面的本發明的第八方面中,其中,配置相應畫素群的所述畫素的組合可經確定以使得,當多個六角形區域形成為彼此鄰近時,所述多個六角形區域導致蜂巢形圖案陣列,其中,通過在內部包含由所述相應3個畫素或所述相應4個畫素配置的所述多個畫素群的輪廓所環繞的區域的一個重心,且通過將位於所述一個重心外圍的6個個別重心連接在一起,可形成每個所述六角形區域。In an eighth aspect of the invention according to the second aspect to the seventh aspect, wherein the combination of the pixels configuring the respective pixel groups may be determined such that when a plurality of hexagonal regions are formed as The plurality of hexagonal regions result in an array of honeycomb patterns when adjacent to each other, wherein the outline of the plurality of pixel groups configured by the respective 3 pixels or the corresponding 4 pixels is internally contained A center of gravity of the surrounded area, and each of the hexagonal regions can be formed by joining together six individual centers of gravity at the periphery of the one center of gravity.
在根據上述方面的本發明的第九方面中,所述六角形畫素區域可形成為正六角形。In the ninth aspect of the invention according to the above aspect, the hexagonal pixel region may be formed in a regular hexagon shape.
在根據所述第一方面到所述第八方面的本發明的第十方面中,所述六角形畫素區域可形成為扁平的六角形。In a tenth aspect of the invention according to the first aspect to the eighth aspect, the hexagonal pixel region may be formed in a flat hexagon shape.
在根據所述第十方面的本發明的第十一方面中,所述六角形畫素區域可形成為扁平狀,以使得穿過每個所述畫素區域的中心的3條對角線中的一條對角線比另外兩條對角線短,且所述另外兩條對角線長度彼此相等。In an eleventh aspect of the invention according to the tenth aspect, the hexagonal pixel region may be formed in a flat shape such that three diagonal lines passing through the center of each of the pixel regions are One diagonal is shorter than the other two diagonals, and the other two diagonal lengths are equal to each other.
在根據上述方面的本發明的第十二方面中,所述多條資料線可佈局為:沿著所述六角形畫素區域外圍的一個部分而彎曲。In a twelfth aspect of the invention according to the above aspect, the plurality of data lines may be arranged to be curved along a portion of the periphery of the hexagonal pixel region.
在根據上述方面的本發明的第十三方面中,所述感測器部分可包含:半導體薄膜,接收具有所述輻射的輻照並產生電荷,且所述電荷可積聚在提供於所述多個畫素中的 每個畫素中的存儲電容器中,且所述存儲電容器中所積聚的所述電荷是由所述第一切換元件和所述第二切換元件而讀取。In a thirteenth aspect of the invention according to the above aspect, the sensor portion may include: a semiconductor film receiving radiation having the radiation and generating a charge, and the charge may be accumulated in the plurality of Among the pixels The storage capacitor in each pixel, and the charge accumulated in the storage capacitor is read by the first switching element and the second switching element.
在根據所述第一到所述第十二方面的本發明的第十四方面中,所述感測器部分可包含:閃爍體,將已輻照的所述輻射轉換為可見光,且,在所轉換的可見光已由半導體層轉換為電荷之後,所述電荷可由所述第一切換元件和所述第二切換元件讀出。In a fourteenth aspect of the invention according to the first to the twelfth aspect, the sensor portion may include: a scintillator that converts the irradiated radiation into visible light, and After the converted visible light has been converted into a charge by the semiconductor layer, the charge can be read by the first switching element and the second switching element.
在根據所述第十三方面的本發明的第十五方面中,還可包含多條公用線,將每個所述存儲電容器的一個電極連接在一起,且將所述電極固定在特定電勢。In a fifteenth aspect of the invention according to the thirteenth aspect, a plurality of common lines may be further included, one electrode of each of the storage capacitors is connected together, and the electrodes are fixed at a specific potential.
在根據所述第十五方面的本發明的第十六方面中,所述多條公用線可按直線形狀或按實質上直線形狀,而在所述多條資料線之間延伸。In a sixteenth aspect of the invention according to the fifteenth aspect, the plurality of common lines may extend between the plurality of data lines in a straight line shape or in a substantially straight line shape.
在根據所述第十六方面的本發明的第十七方面中,所述多條公用線可通過所述存儲電容器、所述第一切換元件和所述第二切換元件,而連接到所述多條資料線。In a seventeenth aspect of the invention according to the sixteenth aspect, the plurality of common lines are connectable to the storage capacitor, the first switching element, and the second switching element Multiple data lines.
在根據所述第十七方面的本發明的第十八方面中,所述多條第一掃描線、所述多條第二掃描線、所述多條資料線、所述多條公用線、所述第一切換元件以及所述第二切換元件設置在所述感測器部分的下層側。In an eighteenth aspect of the present invention, the plurality of first scanning lines, the plurality of second scanning lines, the plurality of data lines, the plurality of common lines, The first switching element and the second switching element are disposed on a lower layer side of the sensor portion.
本發明的第十九方面是一種射線照相成像裝置,包括:上述的射線照相圖像檢測器;以及輻射輻照部,被提供以面向所述射線照相圖像檢測器、且輻照輻射到成像主 體上,所述成像主體位於所述射線照相圖像檢測器的上方,其中,使用所述射線照相圖像檢測器使射線照相圖像成像。A nineteenth aspect of the invention is a radiographic imaging apparatus comprising: the above-described radiographic image detector; and a radiation irradiation portion provided to face the radiographic image detector and irradiated to the imaging the Lord In vivo, the imaging body is located above the radiographic image detector, wherein the radiographic image is imaged using the radiographic image detector.
在根據所述第十九方面的本發明的第二十方面中,所述輻射輻照部能夠從多個不同的成像角度的每個成像角度,而輻照輻射到所述成像主體。In a twentieth aspect of the invention according to the nineteenth aspect, the radiation irradiating portion is capable of irradiating radiation to the imaging body from each imaging angle of a plurality of different imaging angles.
本發明的第二十一方面是一種射線照相成像系統,包括:上述第十九方面或第二十方面所述的射線照相成像裝置;以及控制構件,指示所述射線照相成像裝置執行射線照相圖像的成像,且從所述射線照相成像裝置獲取射線照相圖像,其中,所述控制構件包含切換構件,所述切換構件基於外部指令,在第一射線照相圖像獲取模式和第二射線照相圖像獲取模式之間切換,其中,所述第一射線照相圖像獲取模式獲取第一射線照相圖像,所述第一射線照相圖像是由射線照相圖像檢測設備(radiographic image detection device)的單畫素單元中的圖像數據組態而成,且所述第二射線照相圖像獲取模式獲取第二射線照相圖像,所述第二射線照相圖像是由所述射線照相圖像檢測設備的多畫素單元中的圖像數據組態而成。A twenty-first aspect of the invention is the radiographic imaging system comprising: the radiographic imaging apparatus of the nineteenth aspect or the twentieth aspect; and a control member that instructs the radiographic imaging apparatus to perform a radiographic image Imaging of the image, and acquiring a radiographic image from the radiographic imaging device, wherein the control member includes a switching member that is based on an external command, in a first radiographic image acquisition mode and a second radiography Switching between image acquisition modes, wherein the first radiographic image acquisition mode acquires a first radiographic image, the first radiographic image being a radiographic image detection device The image data in the single pixel unit is configured, and the second radiographic image acquisition mode acquires a second radiographic image, the second radiographic image being the radiographic image The image data in the multi-pixel unit of the detection device is configured.
在根據所述第二十一方面的本發明的第二十二方面中,當被指示而執行成像以獲取所述第二射線照相圖像時,所述控制構件控制所述輻射輻照部,以致於輻照到所述成像主體上的所述輻射的量是:根據所述多畫素單元且小於當成像以獲取第一射線照相圖像的量。In a twenty-second aspect of the invention according to the twenty-first aspect, the control member controls the radiation irradiation portion when the imaging is instructed to acquire the second radiographic image, The amount of the radiation that is irradiated onto the imaging body is such that it is according to the multi-pixel unit and less than the amount that is imaged to acquire the first radiographic image.
本發明的第二十三方面是一種射線照相成像系統,包括:上述第二十方面所述的射線照相成像裝置;控制構件,指示所述射線照相成像裝置執行射線照相圖像的成像,且從所述射線照相圖像檢測器獲取多個射線照相圖像,所述射線照相圖像已經藉由所述射線照相圖像檢測器而在每個所述成像角度進行成像;以及斷層照相圖像產生構件,產生多個斷層照相圖像,所述斷層照相圖像是:基於由所述控制構件所獲取的多個所述射線照相圖像、且根據所述射線照相圖像檢測器的檢測面而重建;其中,所述控制構件包含切換構件,所述切換構件基於外部指令,在第一射線照相圖像獲取模式和第二射線照相圖像獲取模式之間切換,其中,所述第一射線照相圖像獲取模式獲取第一射線照相圖像,所述第一射線照相圖像是由射線照相圖像檢測設備的單畫素單元中的圖像數據組態而成,且所述第二射線照相圖像獲取模式獲取第二射線照相圖像,所述第二射線照相圖像是由所述射線照相圖像檢測設備的多畫素單元中的圖像數據組態而成,且其中,所述輻射輻照部具有:成像角度的範圍,用以輻照輻射到所述成像主體,當成像以獲取所述第一射線照相圖像時的成像角度的範圍,大於當成像以獲取所述第二射線照相圖像時的成像角度的範圍。A twenty-third aspect of the invention is the radiographic imaging system comprising: the radiographic imaging device according to the above twentieth aspect; the control member instructing the radiographic imaging device to perform imaging of the radiographic image, and The radiographic image detector acquires a plurality of radiographic images that have been imaged at each of the imaging angles by the radiographic image detector; and tomographic image generation a member, generating a plurality of tomographic images, the tomographic image being based on a plurality of the radiographic images acquired by the control member and according to a detection surface of the radiographic image detector Reconstruction; wherein the control member includes a switching member that switches between a first radiographic image acquisition mode and a second radiographic image acquisition mode based on an external command, wherein the first radiograph The image acquisition mode acquires a first radiographic image, which is in a single pixel unit of the radiographic image detecting apparatus Constructed like data, and the second radiographic image acquisition mode acquires a second radiographic image, which is in a multi-pixel unit of the radiographic image detecting apparatus Image data is configured, and wherein the radiation irradiation portion has a range of imaging angles for irradiating radiation to the imaging body when imaging to acquire the first radiographic image The range of the imaging angle is larger than the range of the imaging angle when imaging to acquire the second radiographic image.
在根據所述第二十三方面的本發明的第二十四方面中,基於所述第一射線照相圖像、而由所述斷層照相圖像產生構件產生的所述斷層照相圖像的厚度是:能夠小於基 於所述第二射線照相圖像而產生的所述斷層照相圖像的厚度。In a twenty-fourth aspect of the invention according to the twenty-third aspect, the thickness of the tomographic image generated by the tomographic image generating member based on the first radiographic image Yes: can be smaller than the base The thickness of the tomographic image produced by the second radiographic image.
這樣,根據上述方面,本發明可按快速率使射線照相圖像成像,且可在由多個畫素配置的畫素群的電荷合併前後,在水平、垂直和對角線方向中的每個方向上維持均勻解析度。Thus, according to the above aspect, the present invention can image a radiographic image at a rapid rate, and can be in each of the horizontal, vertical, and diagonal directions before and after the charge combination of the pixel groups configured by the plurality of pixels. Maintain uniform resolution in the direction.
接下來是參考所述圖式的、與本發明的示範性實施例有關的解釋。Next is an explanation related to an exemplary embodiment of the present invention with reference to the drawings.
圖1為說明根據本發明的第一示範性實施例的射線照相成像系統100的配置的方塊圖。射線照相成像系統100包含:成像裝置41(imaging apparatus),使射線照相圖像成像;圖像處理裝置50(imaging processing apparatus),對表示所成像的射線照相圖像的圖像數據執行圖像處理;以及顯示裝置80(display device),用於顯示由已經歷圖像處理的圖像數據所表示的圖像。FIG. 1 is a block diagram illustrating a configuration of a radiographic imaging system 100 in accordance with a first exemplary embodiment of the present invention. The radiographic imaging system 100 includes an imaging apparatus 41 for imaging a radiographic image, and an imaging processing apparatus 50 for performing image processing on image data representing the imaged radiographic image. And a display device 80 for displaying an image represented by image data that has undergone image processing.
成像裝置41包含:輻射輻照部24(radiation irradiation section);輻射檢測器42,檢測射線照相圖像;操作面板44,輸入有包含例如管電壓、管電流、輻照持續時間的數據的曝光條件、成像條件、各種操作數據和各種操作指令;成像裝置控制部46(imaging apparatus control section),整體控制裝置的操作;顯示器47,顯示了例如操作選單和各種信息的顯示;以及通信I/F部48(communication I/F section),連接到例如LAN的網路56,且向連接到網路56的其他設備傳輸各種數據、或從連接到網路56的其他設備接收各種數據。根據本示範性實施例的成像裝置41,配置成:能夠在連續使射線照相圖像成像(視訊成像)的視訊成像模式、與執行靜態成像的靜態成像模式之間進行切換。可將成像模式作為成像條件中的一個條件,從操作面板44輸入到成像裝置41。成像裝置41根據通過操作面板44輸入的成像模式,來執行視訊成像或靜態成像。The imaging device 41 includes: a radiation irradiation section 24; a radiation detector 42 that detects a radiographic image; and an operation panel 44 that inputs an exposure condition including data such as a tube voltage, a tube current, and an irradiation duration , imaging conditions, various operational data and various operational commands; imaging device control section 46, operation of the overall control device; display 47, for example, display of an operation menu and various information; and communication I/F section 48(communication I/F Section), connected to a network 56 such as a LAN, and transmitting various data to other devices connected to the network 56, or receiving various data from other devices connected to the network 56. The imaging device 41 according to the present exemplary embodiment is configured to be capable of switching between a video imaging mode in which a radiographic image is continuously imaged (video imaging) and a static imaging mode in which static imaging is performed. The imaging mode can be input from the operation panel 44 to the imaging device 41 as one of imaging conditions. The imaging device 41 performs video imaging or static imaging in accordance with an imaging mode input through the operation panel 44.
成像裝置控制部46包含:CPU 46A、ROM 46B、RAM 46C以及由HDD或快閃記憶體配置而成的非揮發性存儲部46D(non-volatile storage section)。成像裝置控制部46經由匯流排(圖式中未圖示)連接到輻射輻照部24、輻射檢測器42、操作面板44、顯示器47以及通信I/F部48。作為程式,例如由CPU 46A執行的程式,是被存儲在存儲部46D中。表示射線照相圖像的例如圖像數據(數位數據)的數據,是被存儲在存儲部46D中。例如,當本示範性實施例的成像裝置41用於***造影術時,通過使對象的***成像而獲得的射線照相圖像數據是被存儲在存儲部46D中。The imaging device control unit 46 includes a CPU 46A, a ROM 46B, a RAM 46C, and a non-volatile storage section 46D that is configured by an HDD or a flash memory. The imaging device control unit 46 is connected to the radiation irradiation unit 24, the radiation detector 42, the operation panel 44, the display 47, and the communication I/F unit 48 via a bus bar (not shown). As a program, for example, a program executed by the CPU 46A is stored in the storage unit 46D. Data such as image data (digital data) indicating a radiographic image is stored in the storage unit 46D. For example, when the imaging device 41 of the present exemplary embodiment is used for mammography, radiographic image data obtained by imaging a breast of a subject is stored in the storage portion 46D.
當根據曝光條件,使用來自輻射輻照部24的輻射源31的輻射進行輻照時,輻射檢測器42檢測所述輻射,並向成像裝置控制部46輸出表示射線照相圖像的圖像數據。稍後給出關於輻射檢測器42的配置的細節。When irradiation is performed using the radiation from the radiation source 31 of the radiation irradiation portion 24 in accordance with the exposure conditions, the radiation detector 42 detects the radiation, and outputs image data representing the radiographic image to the imaging device control portion 46. Details regarding the configuration of the radiation detector 42 are given later.
成像裝置控制部46能夠通過通信I/F部48和網路 56,而與圖像處理裝置50通信,且成像裝置控制部46執行向圖像處理裝置50傳輸各種數據,或從圖像處理裝置50接收各種數據。管理服務器57也連接到網路56。管理服務器57配置為:包含存儲特定管理數據的存儲部57A。成像裝置控制部46能夠通過通信I/F部48和網路56,而與管理服務器57通信。The imaging device control unit 46 can pass through the communication I/F unit 48 and the network 56, while communicating with the image processing apparatus 50, and the imaging apparatus control section 46 performs transmission of various data to the image processing apparatus 50, or receives various data from the image processing apparatus 50. Management server 57 is also connected to network 56. The management server 57 is configured to include a storage unit 57A that stores specific management data. The imaging device control unit 46 can communicate with the management server 57 via the communication I/F unit 48 and the network 56.
圖像處理裝置50配置為伺服器電腦(server computer),且包含顯示器52以顯示例如操作選單和各種數據,且配置操作輸入部54(operation input section),包含用於輸入各種數據和操作指令的多個鍵。圖像處理裝置50包含:CPU 60,用於整體控制裝置操作;ROM 62,預先存儲有包含控制程式的各種程式;RAM 64,用於各種數據的臨時存儲;HDD 66,用於存儲和保留各種數據的HDD 66;顯示驅動器68,用於控制各種數據在顯示器52上的顯示;操作輸入檢測部70(operation input detection section),用於檢測關於操作輸入部54的操作狀態;通信I/F部72,通過網路56連接到成像裝置41,並執行向成像裝置41傳輸各種數據、或從成像裝置41接收各種數據;以及圖像信號輸出部74(image signal output section),通過顯示電纜58向顯示裝置80輸出圖像數據。圖像處理裝置50經由通信I/F部72,從成像裝置41獲取表示存儲在存儲部46D中的射線照相圖像的圖像數據(數位數據)。The image processing apparatus 50 is configured as a server computer, and includes a display 52 to display, for example, an operation menu and various data, and an operation input section 54 (operation input section) for inputting various data and operation instructions. Multiple keys. The image processing apparatus 50 includes a CPU 60 for controlling the operation of the apparatus as a whole, a ROM 62 in which various programs including a control program are stored in advance, a RAM 64 for temporary storage of various data, and an HDD 66 for storing and retaining various kinds of programs. HDD 66 of data; display driver 68 for controlling display of various data on display 52; operation input detection section 70 for detecting an operation state with respect to operation input section 54; communication I/F section 72, connected to the imaging device 41 via the network 56, and performs transmission of various data to or from the imaging device 41; and an image signal output section 74 through the display cable 58 The display device 80 outputs image data. The image processing device 50 acquires image data (digital data) indicating the radiographic image stored in the storage unit 46D from the imaging device 41 via the communication I/F portion 72.
CPU 60、ROM 62、RAM 64、HDD 66、顯示驅動器68、操作輸入檢測部70、通信I/F部72和圖像信號輸出部 74是通過系統匯流排而互相連接。因此,CPU 60能夠存取ROM 62、RAM 64和HDD 66。CPU 60能夠執行各種控制,例如通過顯示驅動器68而控制各種數據在顯示器52上的顯示、通過通信I/F部72而控制向成像裝置41傳輸各種數據、或從成像裝置41接收各種數據,以及通過圖像信號輸出部74而控制顯示裝置80的顯示部80A上的圖像顯示。CPU 60也能夠通過操作輸入檢測部70,而對操作輸入部54確認用戶操作狀態。CPU 60, ROM 62, RAM 64, HDD 66, display driver 68, operation input detecting section 70, communication I/F section 72, and image signal output section 74 is connected to each other through a system bus. Therefore, the CPU 60 can access the ROM 62, the RAM 64, and the HDD 66. The CPU 60 can perform various controls such as controlling display of various data on the display 52 by the display driver 68, controlling transmission of various data to the imaging device 41 through the communication I/F portion 72, or receiving various data from the imaging device 41, and The image display on the display unit 80A of the display device 80 is controlled by the image signal output unit 74. The CPU 60 can also confirm the user operation state to the operation input unit 54 by operating the input detecting unit 70.
圖2說明根據本示範性實施例的成像裝置的輻射檢測器的電配置(electrical configuration)。圖2中所說明的輻射檢測器42的輻射檢測元件10配置有多個畫素20,畫素20具有:鄰近排列為二維蜂巢形圖案的六角形畫素區域,以便配置實質上整體為矩形的區域。每個畫素20配置為包含:感測器部分103,接收已輻照的輻射(X射線)並產生電荷;電荷存儲電容器5,積聚已在感測器部分103中產生的電荷;以及兩個薄膜電晶體(在下文稱為TFT開關)4a、4b,用於讀取電荷存儲電容器5中所積聚的電荷。因此,如稍後所描述,輻射檢測器42為直接轉換型輻射檢測器,其在光電轉換層中使用例如非晶硒的輻射-電荷轉換材料來吸收輻射,並將輻射轉換為電荷。FIG. 2 illustrates an electrical configuration of a radiation detector of an imaging device according to the present exemplary embodiment. The radiation detecting element 10 of the radiation detector 42 illustrated in Fig. 2 is provided with a plurality of pixels 20 having hexagonal pixel regions arranged adjacent to a two-dimensional honeycomb pattern so as to be substantially rectangular in shape. Area. Each pixel 20 is configured to include: a sensor portion 103 that receives irradiated radiation (X-rays) and generates a charge; a charge storage capacitor 5 that accumulates charges that have been generated in the sensor portion 103; and two Thin film transistors (hereinafter referred to as TFT switches) 4a, 4b for reading charges accumulated in the charge storage capacitor 5. Therefore, as described later, the radiation detector 42 is a direct conversion type radiation detector that absorbs radiation using a radiation-charge conversion material such as amorphous selenium in the photoelectric conversion layer, and converts the radiation into electric charges.
將畫素20設置為蜂巢形圖案,意謂著:具有彼此大小相同的六角形畫素區域的畫素20,排列成以列方向(row direction)(圖2中的水平方向)排列的多個第一畫素列,及多個第二畫素列,由畫素20所配置,所述畫素20具有 與以列方向排列的第一畫素列的畫素20大小相同的六角形畫素區域。所述第一畫素列和所述第二畫素列沿著與行方向(column direction)(圖2中的垂直方向)交叉的方向而交替排列。第二畫素列的畫素20設置為在第一畫素列的鄰近畫素之間對準,以使得第二畫素列的畫素20在列方向上相對於第一畫素列的畫素20位移達第一畫素列畫素20的排列間距(array pitch)的1/2。Setting the pixel 20 to a honeycomb pattern means that the pixels 20 having the hexagonal pixel regions of the same size are arranged in a plurality of rows arranged in the row direction (horizontal direction in FIG. 2). a first pixel sequence, and a plurality of second pixel columns, configured by a pixel 20, the pixel 20 having A hexagonal pixel region of the same size as the pixel 20 of the first pixel column arranged in the column direction. The first pixel column and the second pixel column are alternately arranged in a direction crossing the column direction (the vertical direction in FIG. 2). The pixels 20 of the second pixel array are arranged to be aligned between adjacent pixels of the first pixel column such that the pixels 20 of the second pixel column are drawn in the column direction relative to the first pixel column. The prime 20 is shifted by 1/2 of the array pitch of the first pixel array 20 .
輻射檢測器42包含:對應於每個畫素列而設置的第一掃描線G1-0到G1-7(也稱為第一掃描線G1,當一起提到下面所述的掃描線時,進一步也統稱為掃描線G)。提供於每個畫素20中的TFT開關4a的閘極電極是連接到第一掃描線G1,且TFT開關4a根據第一掃描線G1中流動的信號來進行接通/切斷控制。輻射檢測器42也配備有第二掃描線G2-0到G2-3(也稱為第二掃描線G2),設置成對應於配備有第一掃描線G1-0到G1-3的每個畫素列,且配備有第三掃描線G3-0到G3-3(也稱為第三掃描線G3),設置成對應於配備有第一掃描線G1-4到G1-7的每個畫素列。提供於配置畫素群(configuring pixel group)的畫素中的TFT開關4b的閘極電極是:被連接到第二掃描線G2和第三掃描線G3,且TFT開關4b根據第二掃描線G2和第三掃描線G3中流動的信號來進行接通/切斷控制。The radiation detector 42 includes: first scanning lines G1-0 to G1-7 (also referred to as a first scanning line G1) corresponding to each pixel column, when referring to the scanning lines described below, further Also collectively referred to as scan line G). The gate electrode of the TFT switch 4a provided in each pixel 20 is connected to the first scanning line G1, and the TFT switch 4a performs on/off control according to a signal flowing in the first scanning line G1. The radiation detector 42 is also equipped with second scanning lines G2-0 to G2-3 (also referred to as second scanning lines G2), which are arranged to correspond to each of the pictures equipped with the first scanning lines G1-0 to G1-3. a column, and is equipped with third scan lines G3-0 to G3-3 (also referred to as a third scan line G3), and is arranged to correspond to each pixel equipped with the first scan lines G1-4 to G1-7 Column. The gate electrode of the TFT switch 4b provided in the pixel of the configured pixel group is connected to the second scan line G2 and the third scan line G3, and the TFT switch 4b is according to the second scan line G2 On/off control is performed with a signal flowing in the third scanning line G3.
因此,輻射檢測器42的輻射檢測元件10配置為具有:與第一掃描線G1中的一條掃描線和第二掃描線G2中的一條掃描線一起設置的畫素列,且配置為具有:與第一掃描 線G1中的一條掃描線和第三掃描線G3中的一條掃描線一起設置的畫素列。輻射檢測器42也配備有:多條資料線D1到D6(也統稱為資料線D),用於讀取產生於每個畫素的感測器部分103中、並積聚在相應電荷存儲電容器5中的電荷,且配備有公用接地線30(common ground line)。Therefore, the radiation detecting element 10 of the radiation detector 42 is configured to have a pixel column disposed together with one of the one scan line G1 and the second scan line G2, and is configured to have: First scan A pixel column set by one scanning line of the line G1 and one scanning line of the third scanning line G3. The radiation detector 42 is also provided with a plurality of data lines D1 to D6 (also collectively referred to as data lines D) for reading in the sensor portion 103 generated for each pixel and accumulating in the corresponding charge storage capacitor 5 The charge in the middle is equipped with a common ground line 30 (common ground line).
應注意,每個畫素20的感測器部分103配置為連接到公用線(common line)(圖式中未圖示),以便通過所述公用線被施加來自電源供應器(圖式中未圖示)的偏壓電壓。另外,儘管圖2說明了第二掃描線G2-0到G2-3和第三掃描線G3-0到G3-3分別從自掃描信號控制部35(scan signal control section)延伸出的單條線路分支為四條線路的配置,但是不限於此。例如,可進行配置,以使得第二掃描線G2-0到G2-3和第三掃描線G3-0到G3-3獨立從掃描信號控制部35延伸出,且所述第二掃描線G2-0到G2-3同時受到驅動,且接著所述第三掃描線G3-0到G3-3同時受到驅動。It should be noted that the sensor portion 103 of each pixel 20 is configured to be connected to a common line (not shown in the drawing) so as to be applied from the power supply through the common line (not in the figure) The bias voltage shown in the figure). In addition, although FIG. 2 illustrates a single line branch extending from the scan signal control section of the second scan lines G2-0 to G2-3 and the third scan lines G3-0 to G3-3, respectively. It is a configuration of four lines, but is not limited to this. For example, configuration may be made such that the second scan lines G2-0 to G2-3 and the third scan lines G3-0 to G3-3 independently extend from the scan signal control portion 35, and the second scan line G2- 0 to G2-3 are simultaneously driven, and then the third scanning lines G3-0 to G3-3 are simultaneously driven.
也可使用獨立於掃描信號控制部35提供的第二掃描信號控制部進行配置,以使得從所述第二掃描信號控制部延伸出的1條線路分支為4條。此外,進行配置,以使得存在:從獨立於掃描信號控制部35提供的第二掃描信號控制部延伸出的、獨立的個別第二掃描線G2-0到G2-3和第三掃描線G3-0到G3-3,其中所述第二掃描線G2-0到G2-3同時受到驅動、且所述第三掃描線G3-0到G3-3同時受到驅動。應注意,儘管將單條線路分支為4條的配置中的驅 動負載大,但具有不必提供第二掃描信號控制部的優勢,且分別連接到獨立的第二掃描信號控制部的配置具有驅動負載小的優勢。The second scan signal control unit provided independently of the scan signal control unit 35 may be configured such that one line extending from the second scan signal control unit is branched into four. Further, configuration is made such that there are independent individual second scanning lines G2-0 to G2-3 and third scanning line G3- extending from the second scanning signal control section provided independently of the scanning signal control section 35. 0 to G3-3, wherein the second scanning lines G2-0 to G2-3 are simultaneously driven, and the third scanning lines G3-0 to G3-3 are simultaneously driven. It should be noted that although the drive splits a single line into four configurations The dynamic load is large, but has the advantage that it is not necessary to provide the second scan signal control portion, and the configuration respectively connected to the independent second scan signal control portion has an advantage of a small driving load.
在圖2中,為易於解釋和說明,圖示了佈局有14條掃描線和6條資料線的配置的實例。一般來說,例如,當存在分別在列方向和行方向上設置的m×n個別畫素20時(其中m和n是正整數),提供了2m條掃描線G和n條資料線D。In FIG. 2, for ease of explanation and explanation, an example of a configuration in which 14 scanning lines and 6 data lines are laid out is illustrated. In general, for example, when there are m × n individual pixels 20 respectively set in the column direction and the row direction (where m and n are positive integers), 2m scanning lines G and n data lines D are provided.
在輻射檢測器42中,掃描線G1到G3設置為與資料線D和公用接地線30交叉。資料線D沿著具有六角形畫素區域的畫素20的外圍邊緣,佈局為Z形(zigzag)圖案(以便蜿蜒而行),以便繞過這些畫素20。即,資料線D在行方向上延伸,同時沿著每個個別畫素20(individual pixel)的外圍邊緣(6條邊)的3條鄰邊伸展。In the radiation detector 42, the scanning lines G1 to G3 are disposed to cross the data line D and the common ground line 30. The data line D is arranged along the peripheral edge of the pixel 20 having the hexagonal pixel area, and is arranged in a zigzag pattern (to be smashed) so as to bypass the pixels 20. That is, the data line D extends in the row direction while extending along the three adjacent sides of the peripheral edge (six sides) of each individual pixel 20 (individual pixel).
在本示範性實施例的輻射檢測器45中,如果,例如公用接地線30也設置為Z形圖案(以便蜿蜒而行)以匹配資料線D,那麼可能出現各種問題,例如,在向左或向右蜿蜒而行的部分處出現畫素20中的TFT開關4a、4b之間的間隔狹窄的位置、公用接地線30和TFT開關4a、4b衝突,和/或資料線D和公用接地線30之間的電容增大。因此如圖2中所說明,本示範性實施例的輻射檢測器42佈局有沿著列方向(圖2中的水平方向)伸展而彼此平行排列的多條掃描線G1到G3,以及設置為沿著行方向(圖2中的垂直方向)延伸以便與掃描線G1到G3交叉並沿著畫素 20的外圍邊緣彎曲的多條資料線D1到D6。In the radiation detector 45 of the present exemplary embodiment, if, for example, the common ground line 30 is also provided in a zigzag pattern (to be smashed) to match the data line D, various problems may occur, for example, to the left. Or the portion to the right is present at a position where the interval between the TFT switches 4a, 4b in the pixel 20 is narrow, the common ground line 30 and the TFT switches 4a, 4b collide, and/or the data line D and the common ground The capacitance between lines 30 increases. Therefore, as illustrated in FIG. 2, the radiation detector 42 of the present exemplary embodiment is laid out with a plurality of scanning lines G1 to G3 which are arranged in parallel in the column direction (horizontal direction in FIG. 2) and arranged in parallel with each other, and are arranged along the edges. The row direction (the vertical direction in FIG. 2) extends so as to intersect the scan lines G1 to G3 and along the pixel A plurality of data lines D1 to D6 bent at the peripheral edge of 20.
每個畫素20內部的TFT開關4a、4b等也佈局為朝向一條邊,以便確保每個畫素20中的特定自由空間,且公用接地線30佈局為穿過這些自由空間。例如,TFT開關4a、4b等設置在以下區域中,所述區域是:由沿著行方向(圖2中的垂直方向)將每個畫素20分為兩半的線段、和所述每個畫素20外圍提供資料線D處的3條邊所環繞而成。即,針對給定畫素列中的畫素,將TFT開關4a、4b等佈局在右半邊區域中,且針對在行方向上位於所述給定畫素列上方及下方的畫素列中的畫素20,將TFT開關4a、4b等佈局在左半邊區域中。The TFT switches 4a, 4b, etc. inside each pixel 20 are also laid out toward one side to ensure a certain free space in each pixel 20, and the common ground line 30 is laid out through these free spaces. For example, the TFT switches 4a, 4b, and the like are disposed in a region which is a line segment which divides each pixel 20 into two halves in the row direction (the vertical direction in FIG. 2), and each of the above The periphery of the pixel 20 is surrounded by three sides at the data line D. That is, for the pixels in a given pixel column, the TFT switches 4a, 4b, etc. are laid out in the right half region, and for the pixels in the pixel direction above and below the given pixel column in the row direction. The element 20 has the TFT switches 4a, 4b and the like arranged in the left half area.
因此,公用接地線30可設置為直線,其在資料線D1到D6之間與掃描線G1到G3交叉,而不與資料線D1到D6交叉。因此,在直接轉換型射線照相圖像檢測器42中,每個畫素20的電荷存儲電容器5的存儲電容器下電極11是:可由最短的公用接地線30而互相連接在一起。也不需要使所述公用接地線30蜿蜒而行以匹配資料線D。由於資料線D與公用接地線30之間也沒有交叉,因此不會出現如資料線中的電感的影響所導致的雜訊(noise)增加,以及資料線D與公用接地線30之間的線間電容(interline capacitance)的增加。Therefore, the common ground line 30 can be set as a straight line that intersects the scan lines G1 to G3 between the data lines D1 to D6 without crossing the data lines D1 to D6. Therefore, in the direct conversion type radiographic image detector 42, the storage capacitor lower electrodes 11 of the charge storage capacitors 5 of each pixel 20 are connected to each other by the shortest common ground line 30. It is also not necessary to have the common ground line 30 twisted to match the data line D. Since there is no intersection between the data line D and the common ground line 30, there is no noise increase caused by the influence of the inductance in the data line, and the line between the data line D and the common ground line 30. An increase in interline capacitance.
也可在不使用直線公用接地線30的情況下,提高輻射檢測設備的解析度,所述公用接地線30阻礙了所述輻射檢測元件10的畫素20的較高清晰度。另外,在輻射檢測元 件10的製造過程中,可避免由於資料線D與公用接地線30之間的線間間隔(interline pitch)變窄而造成的所述輻射檢測設備的製造良率的下降。應注意,將公用接地線30設置為直線意謂著:直的狀態維持於一範圍內,所述範圍可在允許輻射檢測元件10的製造過程中出現製造誤差的同時而獲得。The resolution of the radiation detecting apparatus can also be improved without using the straight common ground line 30, which hinders the higher definition of the pixels 20 of the radiation detecting element 10. In addition, in the radiation detection element In the manufacturing process of the device 10, the decrease in the manufacturing yield of the radiation detecting device due to the narrowing of the interline pitch between the data line D and the common ground line 30 can be avoided. It should be noted that setting the common ground line 30 to a straight line means that the straight state is maintained within a range which can be obtained while allowing manufacturing errors in the manufacturing process of the radiation detecting element 10.
當使用輻射檢測器42使射線照相圖像成像時,在使用外部輻射(X射線)輻照期間,向第一掃描線G1輸出切斷信號且每個TFT開關4a切斷,並向第二掃描線G2和第三掃描線G3輸出切斷信號,且每個TFT開關4b切斷。因此,半導體層中產生的電荷積聚在每個電荷存儲電容器5中。When the radiographic image is imaged using the radiation detector 42, during the irradiation using external radiation (X-ray), a cut-off signal is output to the first scanning line G1 and each TFT switch 4a is turned off, and to the second scan The line G2 and the third scanning line G3 output a cutoff signal, and each of the TFT switches 4b is turned off. Therefore, charges generated in the semiconductor layer are accumulated in each of the charge storage capacitors 5.
當讀取圖像時,例如讀取靜態圖像時,一次一條線按順序向第一掃描線G1-0到G1-7輸出接通信號,從而接通每個畫素20中的TFT開關4a。或者,例如當讀取視訊圖像時,向第二掃描線G2-0到G2-3同時輸出接通信號,且接著向第三掃描線G3-0到G3-3同時輸出接通信號,從而接通畫素群中的多個畫素的TFT開關4b。由此將每個電荷存儲電容器5中所積聚的電荷作為電信號而讀取,且通過將所讀取的電信號轉換為數位數據而獲得射線照相圖像。When reading an image, for example, when reading a still image, one line at a time outputs an ON signal to the first scanning lines G1-0 to G1-7 in order, thereby turning on the TFT switch 4a in each pixel 20. . Alternatively, for example, when the video image is read, the ON signal is simultaneously outputted to the second scanning lines G2-0 to G2-3, and then the ON signal is simultaneously outputted to the third scanning lines G3-0 to G3-3, thereby The TFT switch 4b of the plurality of pixels in the pixel group is turned on. The electric charge accumulated in each of the charge storage capacitors 5 is thus read as an electric signal, and a radiographic image is obtained by converting the read electric signal into digital data.
信號處理部25(signal processing setion)包含:信號檢測器(圖式中未圖示),將從每條資料線D1到D6流出的電荷作為電信號來檢測,且使所檢測的電信號經歷特定處理。信號處理部25也向所述信號檢測器輸出表示信號檢 測時序的控制信號,並向掃描信號控制部35輸出表示掃描信號輸出時序的控制信號。因此,在從信號處理部25接收到所述控制信號時,掃描信號控制部35向第一掃描線G1-0到G1-7輸出信號以接通/切斷TFT開關4a。掃描信號控制部35也向第二掃描線G2-0到G2-3和第三掃描線G3-0到G3-3輸出信號以接通/切斷TFT開關4b。The signal processing unit 25 includes a signal detector (not shown in the drawing) that detects the electric charge flowing out from each of the data lines D1 to D6 as an electric signal, and subjects the detected electric signal to a specific one. deal with. The signal processing unit 25 also outputs a signal detection to the signal detector. The timing control signal is measured, and a control signal indicating the timing of the scan signal output is output to the scan signal control unit 35. Therefore, upon receiving the control signal from the signal processing section 25, the scan signal control section 35 outputs a signal to the first scanning lines G1-0 to G1-7 to turn on/off the TFT switch 4a. The scan signal control section 35 also outputs signals to the second scan lines G2-0 to G2-3 and the third scan lines G3-0 to G3-3 to turn on/off the TFT switch 4b.
由個別資料線D1到D3傳輸的電荷信號在信號處理部25中由放大器放大,且保持在抽樣保持電路(圖式中未圖示)中。由個別抽樣保持電路保持的電荷信號按順序輸入到多工器(multiplexer)(圖式中未圖示),且接著由A/D轉換器轉換為數位圖像數據。應注意,圖像記憶體90連接到信號處理部25,且從A/D轉換器輸出的數位圖像數據按順序存儲在圖像記憶體90中。例如,圖像記憶體90存儲多個幀的所成像的射線照相圖像的數位圖像數據。The charge signals transmitted from the individual data lines D1 to D3 are amplified by the amplifier in the signal processing unit 25 and held in the sample-and-hold circuit (not shown). The charge signals held by the individual sample-and-hold circuits are sequentially input to a multiplexer (not shown in the drawing), and then converted into digital image data by an A/D converter. It should be noted that the image memory 90 is connected to the signal processing section 25, and the digital image data output from the A/D converter is sequentially stored in the image memory 90. For example, the image memory 90 stores digital image data of an imaged radiographic image of a plurality of frames.
圖3說明包含根據第一示範性實施例的輻射檢測器42的輻射檢測元件的單個畫素10的部分截面圖。如圖3所示,輻射檢測器42的輻射檢測元件10為閘電極2、掃描線G(圖3中未圖示)以及存儲電容器下電極14在絕緣基板1上形成為閘極佈線層的結構。形成有源極電極9、汲極電極13、資料線D以及存儲電容器上電極16的佈線層(也稱為源極佈線層)是使用例如Al或Cu或主要是Al或Cu的層狀薄膜而形成。摻有雜質的半導體層(圖式中未圖示),例如摻有雜質的非晶矽是形成在半導體作用層8(semiconductor active layer)與源極電極9和汲極電極13 之間。應注意,根據下電極11所收集並積聚的電荷的極性,在TFT開關4a、4b中,顛倒源極電極9和汲極電極13。FIG. 3 illustrates a partial cross-sectional view of a single pixel 10 including a radiation detecting element of the radiation detector 42 in accordance with the first exemplary embodiment. As shown in FIG. 3, the radiation detecting element 10 of the radiation detector 42 is a gate electrode 2, a scanning line G (not shown in FIG. 3), and a structure in which the storage capacitor lower electrode 14 is formed as a gate wiring layer on the insulating substrate 1. . The wiring layer (also referred to as a source wiring layer) forming the source electrode 9, the drain electrode 13, the data line D, and the storage capacitor upper electrode 16 is a layered film using, for example, Al or Cu or mainly Al or Cu. form. A semiconductor layer doped with impurities (not shown in the drawings), for example, an amorphous germanium doped with impurities is formed on a semiconductor active layer 8 and a source electrode 9 and a drain electrode 13 between. It should be noted that the source electrode 9 and the drain electrode 13 are reversed in the TFT switches 4a, 4b in accordance with the polarity of the charge collected and accumulated by the lower electrode 11.
閘電極2的閘極佈線層是使用例如Al或Cu、或主要是Al或Cu的層狀薄膜而形成。絕緣薄膜15A形成在所述閘極佈線層的一個面上,且閘電極2上方的絕緣薄膜15A的位置充當TFT開關4a、4b的閘極絕緣薄膜。絕緣薄膜15A例如由SiNx配置而成,且例如通過化學氣相沉積(Chemical Vapor Deposition;CVD)薄膜形成方法而形成。半導體作用層8在每個閘電極2上方的絕緣薄膜15A上形成有島形狀。半導體作用層8是TFT開關4a、4b的通道(channel)部分,且,例如由非晶矽薄膜形成。The gate wiring layer of the gate electrode 2 is formed using a layered film of, for example, Al or Cu or mainly Al or Cu. An insulating film 15A is formed on one face of the gate wiring layer, and a position of the insulating film 15A above the gate electrode 2 serves as a gate insulating film of the TFT switches 4a, 4b. The insulating film 15A is formed, for example, of SiNx, and is formed, for example, by a chemical vapor deposition (CVD) film forming method. The semiconductor active layer 8 is formed in an island shape on the insulating film 15A above each of the gate electrodes 2. The semiconductor active layer 8 is a channel portion of the TFT switches 4a, 4b, and is formed, for example, of an amorphous germanium film.
源極電極9和汲極電極13形成在閘電極2上方的層中。在形成了源極電極9和汲極電極13的佈線層中,資料線D也與源極電極9和汲極電極13一起形成。存儲電容器上電極16也形成在絕緣薄膜15A上、對應於存儲電容器下電極14的位置處。汲極電極13連接到存儲電容器上電極16。資料線D設置為以上文描述的方式沿著畫素20的外圍邊緣伸展,彎曲以便在一個畫素和鄰近畫素之間繞過。資料線D連接到形成在每個畫素列中的畫素20中的源極電極9。The source electrode 9 and the drain electrode 13 are formed in a layer above the gate electrode 2. In the wiring layer in which the source electrode 9 and the drain electrode 13 are formed, the data line D is also formed together with the source electrode 9 and the drain electrode 13. The storage capacitor upper electrode 16 is also formed on the insulating film 15A at a position corresponding to the storage capacitor lower electrode 14. The drain electrode 13 is connected to the storage capacitor upper electrode 16. The data line D is arranged to extend along the peripheral edge of the pixel 20 in the manner described above, curved to bypass between a pixel and a neighboring pixel. The data line D is connected to the source electrode 9 formed in the pixel 20 in each pixel column.
TFT保護層15B形成在基板1上提供了畫素的區域的實質上整個表面(實質上所有區域)上,以便覆蓋源極佈線層。TFT保護層15B通過例如CVD薄膜形成方法,而 由例如SiNx的材料所形成。接著,在TFT保護層15B上形成經塗佈的層間絕緣薄膜12。層間絕緣薄膜12由薄膜厚度為1微米到4微米的低介電常數(比介電常數εr =2到4)的光敏有機材料形成(此等材料的實例包含正性光敏丙烯酸系樹脂材料,所述材料具有通過使甲基丙烯酸(methacrylic acid)和甲基丙烯酸縮水甘油脂(glycidyl methacrylate)共聚合而形成的原料聚合物,並與二疊氮萘醌(naphthoquinone diazide)正性光敏劑混合)。The TFT protective layer 15B is formed on substantially the entire surface (substantially all areas) of the region on which the pixel is provided on the substrate 1 so as to cover the source wiring layer. The TFT protective layer 15B is formed of a material such as SiNx by, for example, a CVD thin film forming method. Next, a coated interlayer insulating film 12 is formed on the TFT protective layer 15B. The interlayer insulating film 12 is formed of a photosensitive organic material having a low dielectric constant (specific dielectric constant ε r = 2 to 4) having a film thickness of 1 μm to 4 μm (examples of such materials include a positive photosensitive acrylic resin material, The material has a base polymer formed by copolymerizing methacrylic acid and glycidyl methacrylate, and is mixed with a naphthoquinone diazide positive photosensitizer. .
在根據本示範性實施例的輻射檢測器42的輻射檢測元件10中,設置在層間絕緣薄膜12上方與層間絕緣薄膜12下方的層中的金屬之間的金屬間電容是:由層間絕緣薄膜12而抑制得小。通常,層間絕緣薄膜12的材料也充當平坦化薄膜,呈現出使下層中的階梯變平的效果。在輻射檢測器42的輻射檢測元件10中,接觸孔17形成在層間絕緣薄膜12和TFT保護層15B中、對應於存儲電容器上電極16的位置處。In the radiation detecting element 10 of the radiation detector 42 according to the present exemplary embodiment, the inter-metal capacitance between the metal disposed above the interlayer insulating film 12 and the layer below the interlayer insulating film 12 is: by the interlayer insulating film 12 And the suppression is small. In general, the material of the interlayer insulating film 12 also functions as a planarizing film, exhibiting an effect of flattening the steps in the lower layer. In the radiation detecting element 10 of the radiation detector 42, a contact hole 17 is formed in the interlayer insulating film 12 and the TFT protective layer 15B at a position corresponding to the upper electrode 16 of the storage capacitor.
對於每個畫素20,每個感測器部分103的下電極11形成在所述層間絕緣薄膜12上,以便覆蓋畫素區域,同時也填充每個接觸孔17。所述下電極11由非晶透明導電氧化物薄膜(ITO)形成,並通過接觸孔17連接到存儲電容器上電極16。因此,下電極11和TFT開關4a、4b通過存儲電容器上電極16電連接。應注意,雖然下電極11優選形成為與畫素20的畫素區域的形狀匹配的形狀,但是不限於此。例如,當畫素20的畫素區域為正六角形時,下電極 11優選形成為略小的正六角形,以免觸碰鄰近畫素的下電極。類似地,當畫素20的畫素區域形成為扁平六角形時,下電極11優選形成為略小的六角形。只要下電極的畫素佈局配置為六角形柵格(lattice),可使用斜角六角形的或正方形的下電極11來配置。For each of the pixels 20, the lower electrode 11 of each of the sensor portions 103 is formed on the interlayer insulating film 12 so as to cover the pixel region while also filling each of the contact holes 17. The lower electrode 11 is formed of an amorphous transparent conductive oxide film (ITO) and is connected to the storage capacitor upper electrode 16 through a contact hole 17. Therefore, the lower electrode 11 and the TFT switches 4a, 4b are electrically connected through the storage capacitor upper electrode 16. It should be noted that although the lower electrode 11 is preferably formed in a shape matching the shape of the pixel region of the pixel 20, it is not limited thereto. For example, when the pixel area of the pixel 20 is a regular hexagon, the lower electrode 11 is preferably formed as a slightly smaller regular hexagon so as not to touch the lower electrode of the adjacent pixel. Similarly, when the pixel region of the pixel 20 is formed into a flat hexagon, the lower electrode 11 is preferably formed into a slightly smaller hexagon. As long as the pixel layout of the lower electrode is configured as a hexagonal lattice, it can be configured using a beveled hexagonal or square lower electrode 11.
光電轉換層6是:在基板1上提供畫素20的畫素區域的實質上整個表面上方,均勻地形成在下電極11上。在使用例如X射線的輻射輻照時,光電轉換層6在內部產生電荷(電子-電洞)。換句話說,光電轉換層6具有電導性質,且用於將圖像數據從輻射轉換為電荷數據。例如,光電轉換層6可由以硒作為主要成分且薄膜厚度為100微米到1000微米的非晶硒(a-Se)形成。應注意,所述主要成分意謂著:包含50%及以上的比例。上電極7形成在光電轉換層6上。上電極7連接到偏壓電源(圖式中未圖示),且從所述偏壓電源供應偏壓電壓(例如,若干千伏)。多條掃描線G1、G2、G3、資料線3、公用接地線30和TFT開關4a、4b設置在:由光電轉換層6配置的感測器部分103的下層側。The photoelectric conversion layer 6 is uniformly formed on the lower electrode 11 over substantially the entire surface of the pixel region on which the pixel 20 is provided on the substrate 1. The photoelectric conversion layer 6 internally generates charges (electrons-holes) when irradiated with radiation such as X-rays. In other words, the photoelectric conversion layer 6 has electrical conductivity properties and is used to convert image data from radiation to charge data. For example, the photoelectric conversion layer 6 may be formed of amorphous selenium (a-Se) having selenium as a main component and a film thickness of 100 μm to 1000 μm. It should be noted that the main component means: a ratio of 50% or more. The upper electrode 7 is formed on the photoelectric conversion layer 6. The upper electrode 7 is connected to a bias power source (not shown in the drawing), and a bias voltage (for example, several kilovolts) is supplied from the bias power source. A plurality of scanning lines G1, G2, G3, data lines 3, common ground lines 30, and TFT switches 4a, 4b are disposed on the lower layer side of the sensor portion 103 configured by the photoelectric conversion layer 6.
在輻射檢測器42的輻射檢測元件10中,閘電極2、第一到第三掃描線G1到G3和存儲電容器下電極14在基板1上形成為閘極佈線層,且公用接地線30形成在基板1上,例如與存儲電容器下電極14相同的金屬層中。In the radiation detecting element 10 of the radiation detector 42, the gate electrode 2, the first to third scanning lines G1 to G3, and the storage capacitor lower electrode 14 are formed as a gate wiring layer on the substrate 1, and the common ground line 30 is formed at The substrate 1 is, for example, in the same metal layer as the storage capacitor lower electrode 14.
接下來是與根據本示範性實施例的輻射檢測器42的操作有關的解釋。在跨越上電極7和存儲電容器下電極14 施加偏壓電壓的狀態下,當將X射線輻照到光電轉換層6上時,光電轉換層6中產生電荷(電子-電洞對)。光電轉換層6和電荷存儲電容器5串聯電連接,且因而光電轉換層6中產生的電子遷移到+(正)電極側,且電洞遷移到-(負)電極側。Next is an explanation related to the operation of the radiation detector 42 according to the present exemplary embodiment. Over the upper electrode 7 and the storage capacitor lower electrode 14 In a state where a bias voltage is applied, when X-rays are irradiated onto the photoelectric conversion layer 6, electric charges (electron-hole pairs) are generated in the photoelectric conversion layer 6. The photoelectric conversion layer 6 and the charge storage capacitor 5 are electrically connected in series, and thus electrons generated in the photoelectric conversion layer 6 migrate to the + (positive) electrode side, and the holes migrate to the - (negative) electrode side.
在圖像檢測期間,將切斷信號(例如,0伏)從掃描信號控制部35輸出到第一掃描線G1-0到G1-7、第二掃描線G2-0到G2-3和第三掃描線G3-0到G3-3,從而向TFT開關4a、4b的閘電極施加負偏壓。每個TFT開關4a、4b由此維持為切斷狀態。因此,光電轉換層6中產生的電子由下電極11收集,且積聚在電荷存儲電容器5中。光電轉換層6根據所輻照的輻射的量而產生電荷量,且因而根據輻射所攜帶的圖像數據的電荷積聚在每個畫素的電荷存儲電容器5中。應注意,由於上文參考的若干千伏的電壓跨越上電極7和存儲電容器下電極14而施加,所以提供給電荷存儲電容器5的電容需要大於光電轉換層6所形成的電容。During image detection, a cutoff signal (for example, 0 volt) is output from the scan signal control section 35 to the first scan lines G1-0 to G1-7, the second scan lines G2-0 to G2-3, and the third. The lines G3-0 to G3-3 are scanned to apply a negative bias to the gate electrodes of the TFT switches 4a, 4b. Each of the TFT switches 4a, 4b is thereby maintained in a cut-off state. Therefore, electrons generated in the photoelectric conversion layer 6 are collected by the lower electrode 11 and accumulated in the charge storage capacitor 5. The photoelectric conversion layer 6 generates an amount of charge according to the amount of the irradiated radiation, and thus charges accumulated in the charge storage capacitor 5 of each pixel according to the image data carried by the radiation. It should be noted that since a voltage of several kilovolts referred to above is applied across the upper electrode 7 and the storage capacitor lower electrode 14, the capacitance supplied to the charge storage capacitor 5 needs to be larger than the capacitance formed by the photoelectric conversion layer 6.
在圖像讀取期間,如上文所述,根據來自圖像處理裝置50的指令,輻射檢測器42在靜態成像模式或視訊成像模式中執行。當指令用於靜態成像模式時,信號處理部25控制掃描信號控制部35,以使得掃描信號從第二掃描線G2-0到G2-3、第三掃描線G3-0到G3-3輸出,以切斷每個畫素20中的TFT開關4b。信號處理部25也控制掃描信號控制部35,以從第一掃描線G1-0到G1-7按順序施加例 如+10伏到20伏的電壓的接通信號到每個TFT開關4a的閘極,以便接通每個畫素20中的TFT開關4a。由此針對每個畫素列,將每個畫素20中的TFT開關4a按順序切換到接通狀態,由TFT開關4a從感測器部分103讀取電荷,且將對應於這些電荷的信號輸出到資料線D。During image reading, as described above, the radiation detector 42 is executed in a static imaging mode or a video imaging mode in accordance with an instruction from the image processing device 50. When the instruction is for the static imaging mode, the signal processing section 25 controls the scan signal control section 35 to cause the scan signal to be output from the second scan lines G2-0 to G2-3 and the third scan lines G3-0 to G3-3, The TFT switch 4b in each pixel 20 is cut off. The signal processing unit 25 also controls the scanning signal control unit 35 to sequentially apply the examples from the first scanning lines G1-0 to G1-7. A turn-on signal such as a voltage of +10 volts to 20 volts is applied to the gate of each TFT switch 4a to turn on the TFT switch 4a in each pixel 20. Thus, for each pixel column, the TFT switches 4a in each pixel 20 are sequentially switched to the on state, the charges are read from the sensor portion 103 by the TFT switch 4a, and signals corresponding to these charges are Output to data line D.
因而,在輻射檢測器42中,在靜態成像模式中,對應於每個畫素列中的每個畫素20,電荷信號在所有資料線D1到D6中流動。因此,可獲得表示圖像的圖像數據,所述圖像表示輻照到輻射檢測器42的輻射檢測元件10上的輻射。在信號處理部25中,接著電荷信號轉換為數位信號,且基於對應於所述電荷信號的圖像數據,產生射線照相圖像。Thus, in the radiation detector 42, in the static imaging mode, the charge signal flows in all of the data lines D1 to D6 corresponding to each pixel 20 in each pixel column. Thus, image data representing an image representing radiation irradiated onto the radiation detecting element 10 of the radiation detector 42 is obtained. In the signal processing section 25, the charge signal is then converted into a digital signal, and a radiographic image is generated based on the image data corresponding to the charge signal.
接下來是與視訊成像模式有關的解釋。在根據本示範性實施例的輻射檢測器42中,圖2中所說明的多個畫素20中,例如,4個畫素P0到P3形成畫素群PG0,4個畫素P4到P7形成畫素群PG1,四個畫素P8到P11形成畫素群PG2,4個畫素P12到P15形成畫素群PG3,4個畫素P16到P19形成畫素群PG4。在這5個畫素群中,畫素群PG0的畫素P0、畫素群PG1的畫素P4以及畫素群PG2的畫素P8中的每個TFT開關4b的閘電極是連接到第二掃描線G2-0。畫素群PG0的畫素P1到P3、畫素群PG1的畫素P5到P7以及畫素群PG2的畫素P9到P11中的每個TFT開關4b的閘電極是連接到第二掃描線G2-1。Next is an explanation related to the video imaging mode. In the radiation detector 42 according to the present exemplary embodiment, among the plurality of pixels 20 illustrated in FIG. 2, for example, four pixels P0 to P3 form a pixel group PG0, and four pixels P4 to P7 are formed. The pixel group PG1, the four pixels P8 to P11 form the pixel group PG2, the four pixels P12 to P15 form the pixel group PG3, and the four pixels P16 to P19 form the pixel group PG4. In the five pixel groups, the pixel P0 of the pixel group PG0, the pixel P4 of the pixel group PG1, and the gate electrode of each TFT switch 4b of the pixel group PG2 are connected to the second electrode. Scan line G2-0. The pixels P1 to P3 of the pixel group PG0, the pixels P5 to P7 of the pixel group PG1, and the gate electrodes of each of the pixels P9 to P11 of the pixel group PG2 are connected to the second scanning line G2. -1.
類似地,畫素群PG3的畫素P12和畫素群PG4的畫 素P16中的每個TFT開關4b的閘電極是連接到第二掃描線G2-2,且畫素群PG3的畫素P13到P15和畫素群PG4的畫素P17到P19中的每個TFT開關4b的閘電極是連接到第二掃描線G2-3。在輻射檢測元件10中,由畫素P20到P23、畫素P24到P27、畫素P28到P31、畫素P32到P35和畫素P36到P39而配置的畫素群(PG5到PG9)與第三掃描線G3-0到G3-3的連接的圖案,與上文所述的從畫素群PG0到PG4到第二掃描線G2-0到G2-3的連接相似。Similarly, the pixel P12 of the pixel group PG3 and the picture of the pixel group PG4 The gate electrode of each of the TFT switches 4b in the pixel P16 is connected to the second scanning line G2-2, and each of the pixels P13 to P15 of the pixel group PG3 and the pixels P17 to P19 of the pixel group PG4 The gate electrode of the switch 4b is connected to the second scan line G2-3. In the radiation detecting element 10, pixel groups (PG5 to PG9) and pixels configured by pixels P20 to P23, pixels P24 to P27, pixels P28 to P31, pixels P32 to P35, and pixels P36 to P39 are arranged. The pattern of the connection of the three scanning lines G3-0 to G3-3 is similar to the connection from the pixel groups PG0 to PG4 to the second scanning lines G2-0 to G2-3 described above.
當指示對輻射檢測器42採用視訊成像模式時,信號處理部25控制掃描信號控制部35,以便切斷每個畫素20的TFT開關4a,並從第一掃描線G1-0到G1-7向每個畫素20的TFT開關4a的每個閘電極輸出切斷信號。When the video imaging mode is instructed to the radiation detector 42, the signal processing section 25 controls the scanning signal control section 35 to cut off the TFT switch 4a of each pixel 20, and from the first scanning line G1-0 to G1-7. A cutoff signal is output to each gate electrode of the TFT switch 4a of each pixel 20.
信號處理部25也控制掃描信號控制部35,以同時驅動第二掃描線G2-0到G2-3,而輸出掃描信號(接通信號)。當所述接通信號同時輸出到第二掃描線G2-0到G2-3時,接通畫素群PG0到PG4中的所有畫素20的TFT開關4b。結果是,組合畫素群PG0的四個個別畫素P0到P3的每個電荷存儲電容器5中所積聚的電荷,並將所組合的電荷信號輸出到資料線D2。類似地,畫素群PG3的四個個別畫素P12到P15的所組合的電荷信號輸出到資料線D3,畫素群PG1的四個個別畫素P4到P7的所組合的電荷信號輸出到資料線D4,畫素群PG4的四個個別畫素P16到P19的所組合的電荷信號輸出到資料線D5,且畫素群PG2的 四個個別畫素P8到P11的所組合的電荷信號輸出到資料線D6。The signal processing section 25 also controls the scan signal control section 35 to simultaneously drive the second scan lines G2-0 to G2-3 to output a scan signal (on signal). When the turn-on signal is simultaneously output to the second scan lines G2-0 to G2-3, the TFT switches 4b of all the pixels 20 in the pixel groups PG0 to PG4 are turned on. As a result, the charges accumulated in each of the charge storage capacitors 5 of the four individual pixels P0 to P3 of the pixel group PG0 are combined, and the combined charge signals are output to the data line D2. Similarly, the combined charge signals of the four individual pixels P12 to P15 of the pixel group PG3 are output to the data line D3, and the combined charge signals of the four individual pixels P4 to P7 of the pixel group PG1 are output to the data. Line D4, the combined charge signals of the four individual pixels P16 to P19 of the pixel group PG4 are output to the data line D5, and the pixel group PG2 The combined charge signals of the four individual pixels P8 to P11 are output to the data line D6.
接著信號處理部25控制掃描信號控制部35,以同時驅動第三掃描線G3-0到G3-3,且向其輸出掃描信號(接通信號)。當所述接通信號同時輸出到第三掃描線G3-0到G3-3時,接通畫素群PG5到PG9中的所有畫素20的TFT開關4b。結果是,來自畫素群PG5的四個畫素的所組合的電荷信號輸出到資料線D2,畫素群PG8的四個畫素的所組合的電荷信號輸出到資料線D3,畫素群PG6的四個畫素的所組合的電荷信號輸出到資料線D4,畫素群PG9的四個畫素的所組合的電荷信號輸出到資料線D5,畫素群PG7的四個畫素的所組合的電荷信號輸出到資料線D6。The signal processing section 25 then controls the scanning signal control section 35 to simultaneously drive the third scanning lines G3-0 to G3-3 and output a scanning signal (on signal) thereto. When the turn-on signal is simultaneously output to the third scan lines G3-0 to G3-3, the TFT switches 4b of all the pixels 20 in the pixel groups PG5 to PG9 are turned on. As a result, the combined charge signals of the four pixels from the pixel group PG5 are output to the data line D2, and the combined charge signals of the four pixels of the pixel group PG8 are output to the data line D3, and the pixel group PG6 The combined charge signals of the four pixels are output to the data line D4, and the combined charge signals of the four pixels of the pixel group PG9 are output to the data line D5, and the combination of the four pixels of the pixel group PG7 The charge signal is output to the data line D6.
因而,當在視訊成像模式中時,在多個畫素群中的每一個中,組合(合併)四個個別畫素中所積聚的電荷,且將對應於所合併的電荷的電荷信號輸出到相應資料線,其中,每一個畫素群是由來自於配置輻射檢測元件10的多個畫素20的四個預先指定的畫素而配置。這意謂著,當執行視訊成像時,由於以2畫素×2畫素執行合併處理,因此,可使用靜態成像模式的速率的4倍速率執行成像。Thus, when in the video imaging mode, in each of the plurality of pixel groups, the charges accumulated in the four individual pixels are combined (merged), and the charge signals corresponding to the combined charges are output to Corresponding data lines, wherein each pixel group is configured by four pre-specified pixels from a plurality of pixels 20 configuring the radiation detecting element 10. This means that when performing video imaging, since the merging process is performed with 2 pixels × 2 pixels, imaging can be performed at a rate 4 times the rate of the static imaging mode.
如上文所述,將合併掃描線G(G2與G3)分為多個群(G2與G3),並在針對每個所述群中的移位的時序,將用於所述TFT開關4b的掃描信號發送到屬於每個所述群中的掃描線G。因此,當在每個時序而組合及讀取多個畫素群的電荷時,不通過相同資料線D傳輸對應於從不同畫 素群讀取的所組合的電荷量的電荷信號。As described above, the merged scan lines G (G2 and G3) are divided into a plurality of groups (G2 and G3), and for the timing of shifting in each of the groups, the TFT switch 4b will be used. The scan signal is sent to the scan line G belonging to each of the groups. Therefore, when the charges of a plurality of pixel groups are combined and read at each timing, the transmission is not performed through the same data line D corresponding to the different pictures. The charge signal of the combined charge amount read by the prime group.
圖4說明上文所述的在視訊成像模式中經歷合併的畫素和畫素群的佈局。應注意,在圖4中,已針對鄰近畫素群中的每個畫素改變底紋圖案(shading pattern),以使得較易於將相應畫素群彼此區分。Figure 4 illustrates the layout of the pixels and pixel groups undergoing merging in the video imaging mode described above. It should be noted that in FIG. 4, the shading pattern has been changed for each pixel in the neighboring pixel group to make it easier to distinguish the respective pixel groups from each other.
在圖4中所說明的實例中,如上文所述,輻射檢測器42的輻射檢測元件10指定由4個鄰近畫素形成的畫素群A、B、C、D、E、F、G。每個畫素群由4個畫素配置而成,所述4個畫素是由:多個畫素中的第一畫素、位於與第一畫素列鄰近的列中的各自彼此鄰近的第二畫素和第三畫素、以及位於與第二畫素與第三畫素列鄰近的列中的第四畫素所配置而成。所述4個畫素經設置以使得第一畫素的兩條鄰邊和第四畫素的兩條鄰邊分別與第二畫素和第三畫素相應一條邊鄰近,以便位於第二畫素和第三畫素之間。In the example illustrated in FIG. 4, as described above, the radiation detecting element 10 of the radiation detector 42 specifies a pixel group A, B, C, D, E, F, G formed of 4 adjacent pixels. Each pixel group is configured by 4 pixels, and the 4 pixels are: a first pixel of the plurality of pixels, and each of the columns adjacent to the first pixel column is adjacent to each other. The second pixel and the third pixel are configured by a fourth pixel located in a column adjacent to the second pixel and the third pixel column. The four pixels are set such that two adjacent sides of the first pixel and two adjacent sides of the fourth pixel are adjacent to the corresponding side of the second pixel and the third pixel, respectively, so as to be located in the second picture. Between the prime and the third pixel.
換句話說,每個畫素群可定義為4個畫素的組合,所述4個畫素是由:經設置以使得每個畫素的兩條鄰邊分別與剩餘2個畫素的一條邊互相鄰近的3個畫素、和經設置以使得兩條鄰邊分別與所述3個畫素中的2個畫素的一條邊互相鄰近的1個畫素所配置而成。4個畫素的組合也可描述為:由彼此並排設置的2對互相鄰近的畫素所形成的4個畫素的組合,其中,第一對的1個畫素的2條鄰邊分別設置為與另一對的2個畫素中的每個畫素的1條邊互相鄰近。In other words, each pixel group can be defined as a combination of 4 pixels, which are set such that two adjacent edges of each pixel and one of the remaining two pixels are respectively The three pixels adjacent to each other are arranged such that the two adjacent sides are respectively adjacent to one pixel adjacent to one side of the two pixels of the three pixels. The combination of 4 pixels can also be described as a combination of 4 pixels formed by two pairs of mutually adjacent pixels arranged side by side, wherein the two adjacent sides of the first pair of pixels are respectively set. One edge of each of the two pixels of the other pair is adjacent to each other.
當如上所述,指示在本示範性實施例的輻射檢測器42 中使用靜態成像模式時,信號處理部25接通輻射檢測器42中的每個畫素20中的TFT開關4a,從每個所述畫素讀出電荷,且向資料線D輸出對應於所述電荷的信號。由於將具有六角形畫素區域的畫素用作本示範性實施例的輻射檢測器42的輻射檢測元件10中的個別畫素,因此,可在水平、垂直和對角線方向中的每個方向上確保高解析度。When the radiation detector 42 of the present exemplary embodiment is indicated as described above, When the static imaging mode is used, the signal processing section 25 turns on the TFT switch 4a in each of the pixels 20 in the radiation detector 42, reads out the charge from each of the pixels, and outputs the corresponding data to the data line D. The signal of the charge. Since a pixel having a hexagonal pixel region is used as an individual pixel in the radiation detecting element 10 of the radiation detector 42 of the present exemplary embodiment, each of the horizontal, vertical, and diagonal directions can be used. Ensure high resolution in the direction.
然而,在視訊成像模式中,由於如上所述信號處理部25接通配置每個畫素群的4個畫素內的TFT開關4b,所述4個畫素充當單個畫素,且執行合併以組合4個畫素的電荷。應注意,在圖4中,由4個畫素形成的畫素群A、B、C、D、E、F、G中的每個畫素群的重心的位置是以黑點來定位,且分別指示為a、b、c、d、e、f、g。However, in the video imaging mode, since the signal processing section 25 turns on the TFT switches 4b in the four pixels of each pixel group as described above, the four pixels serve as a single pixel, and the combination is performed. Combine the charge of 4 pixels. It should be noted that, in FIG. 4, the positions of the centers of gravity of each of the pixel groups A, B, C, D, E, F, and G formed by the four pixels are positioned with black dots, and Indicated as a, b, c, d, e, f, g, respectively.
在圖4中所指示的實例中,當針對每個畫素群執行4畫素合併時,通過將其他畫素群的重心a-b-e-g-f-c-a與位於中心的畫素群D的重心d進行連接,來形成正六角形。也可看出,這些畫素群的重心之間的距離,即在d到a、d到b、d到e、d到g、d到f、d到c這6個方向上的距離,彼此全部相等。因而,通過使每個畫素20成為六角形,在合併之前,可在水平、垂直和對角線方向中的每個方向上確保均勻解析度。另外,由於通過將畫素群的重心連接在一起也形成正六角形,因此,在合併之後,也可在水平、垂直和對角線方向中的每個方向上確保均勻解析度。In the example indicated in FIG. 4, when 4 pixel combination is performed for each pixel group, the positive sixth is formed by connecting the center of gravity abegfca of the other pixel group with the center of gravity d of the pixel group D located at the center. Angled. It can also be seen that the distance between the centers of gravity of these pixel groups, ie the distances in the six directions d to a, d to b, d to e, d to g, d to f, d to c, All equal. Thus, by making each pixel 20 hexagonal, uniform resolution can be ensured in each of the horizontal, vertical, and diagonal directions before merging. In addition, since the hexagonal shape is also formed by connecting the centers of gravity of the pixel groups together, even after the merging, uniform resolution can be ensured in each of the horizontal, vertical, and diagonal directions.
即,確定每個畫素群中的每個畫素的組合,以使得多個六角形區域排列為蜂巢形圖案。通過使用例如畫素群 A、B、C、D、E、F、G的輪廓所環繞而成的每個區域的重心a、b、c、d、e、f、g,每個六角形區域形成為包含:內部的1個重心d、以及由連接位於重心d外圍的6個個別重心a、b、e、g、f、c的線段形成的六角形區域。因此,本示範性實施例可抑制合併之後,畫素位置(畫素群的重心位置)在水平、垂直和對角線方向中的每個方向上的不均勻,且可使得在相應方向中的每個方向上能夠確保均勻解析度(類似於在合併之前的圖像中)。That is, the combination of each pixel in each pixel group is determined such that a plurality of hexagonal regions are arranged in a honeycomb pattern. By using, for example, a pixel group The center of gravity a, b, c, d, e, f, g of each region surrounded by the contours of A, B, C, D, E, F, G, each hexagonal region is formed to include: internal One center of gravity d, and a hexagonal region formed by connecting line segments of six individual centers of gravity a, b, e, g, f, c located at the periphery of the center of gravity d. Therefore, the present exemplary embodiment can suppress the unevenness of the pixel position (the center of gravity of the pixel group) in each of the horizontal, vertical, and diagonal directions after the merging, and can be made in the corresponding direction. Uniform resolution is guaranteed in each direction (similar to the image before the merge).
由於合併之前所排列的重心、以及由合併之後所排列的重心形成的六角形區域都排列為蜂巢形圖案,因此,在合併之後執行畫素密度轉換時,可使用類似於未進行合併的情況下、執行畫素密度轉換時所使用的算法來執行處理。即,用於畫素密度轉換處理的算法可為合併前和合併後兩種情況下通用的,而不用準備用於合併後進行畫素密度轉換處理的另一獨立算法。在圖像處理裝置50中,用於對表示輻射檢測器42所檢測的射線照相圖像的圖像數據執行畫素密度轉換的程式是:存儲在ROM 62和/或HDD 66上。因此,輸出到顯示裝置80的圖像數據為執行畫素密度轉換之後的圖像數據。Since the center of gravity arranged before the merging and the hexagonal regions formed by the center of gravity arranged after the merging are arranged in a honeycomb pattern, when the pixel density conversion is performed after the merging, it is possible to use a case similar to the case where the merging is not performed. The algorithm used to perform the pixel density conversion is performed to perform processing. That is, the algorithm for the pixel density conversion processing can be common for both the pre-merging and post-merging cases without preparing another independent algorithm for performing the pixel density conversion processing after the combining. In the image processing apparatus 50, a program for performing pixel density conversion on image data representing a radiographic image detected by the radiation detector 42 is stored on the ROM 62 and/or the HDD 66. Therefore, the image data output to the display device 80 is image data after the pixel density conversion is performed.
圖5為圖示在根據本示範性實施例的射線照相成像系統100的圖像處理裝置50中、執行的成像處理順序的實例的流程圖。在圖5的步驟S100中,在成像裝置41的輻射檢測器42中檢測從輻射輻照部24輻照的輻射的量。接著在步驟S102中,確定輻射量是否已超過預定的閾值。當 確定所輻照的輻射量已超過閾值時,便確定針對成像可獲得充分的敏感性(圖像S/N將充分)。接著處理進行到步驟S104,一次一條線按順序向第一掃描線G1-0到G1-7輸出接通信號,掃描信號傳輸到相應的多個畫素20,且執行讀取每個畫素20的存儲電容器5中所積聚的電荷信號的這一正常處理(normal processing)(靜態成像模式)。FIG. 5 is a flowchart illustrating an example of an imaging processing sequence performed in the image processing device 50 of the radiographic imaging system 100 according to the present exemplary embodiment. In step S100 of FIG. 5, the amount of radiation irradiated from the radiation irradiating portion 24 is detected in the radiation detector 42 of the imaging device 41. Next in step S102, it is determined whether the amount of radiation has exceeded a predetermined threshold. when When it is determined that the amount of radiation that has been irradiated has exceeded a threshold, it is determined that sufficient sensitivity is obtained for imaging (image S/N will be sufficient). The process then proceeds to step S104, in which one line sequentially outputs an ON signal to the first scanning lines G1-0 to G1-7, the scanning signals are transmitted to the corresponding plurality of pixels 20, and reading of each pixel 20 is performed. This normal processing of the charge signal accumulated in the storage capacitor 5 (static imaging mode).
然而,當在步驟S102中確定所輻照的輻射量為閾值或低於閾值時,將所獲得的圖像的S/N視為不充分,處理進行到步驟S106,執行使高S/N圖像成像這一處理。明確來說,如上文所述,設置由特定的4個畫素形成的畫素群A、B、C、D、E等。在步驟S108中,由掃描信號控制部35向第二掃描線G2和第三掃描線G3輸出掃描信號(接通信號),以接通畫素群A、B、C、D、E等中所設置的每個畫素的TFT開關4b,且執行合併處理(binning process),以將每個畫素群的4個畫素作為單個畫素來處理。因而,如果所輻照的輻射量為閾值或低於閾值,那麼由於考慮到原本成像敏感性不充分,通過組合多個畫素的電荷這一處理(合併),而獲得具有良好S/N的射線照相圖像。However, when it is determined in step S102 that the irradiated radiation amount is the threshold value or lower than the threshold value, the S/N of the obtained image is regarded as insufficient, the processing proceeds to step S106, and the high S/N map is performed. Like imaging this treatment. Specifically, as described above, pixel groups A, B, C, D, E, and the like formed of a specific four pixels are set. In step S108, the scan signal control unit 35 outputs a scan signal (on signal) to the second scan line G2 and the third scan line G3 to turn on the pixel groups A, B, C, D, E, and the like. The TFT switch 4b of each pixel is set, and a binning process is performed to process the four pixels of each pixel group as a single pixel. Therefore, if the amount of the irradiated radiation is a threshold value or lower than the threshold value, since the original imaging sensitivity is insufficient considering the processing (merging) of the charges of the plurality of pixels, a good S/N is obtained. Radiographic image.
應注意,在圖5中所示的成像處理中,考慮將根據所輻照的輻射量而獲得的射線照相圖像的S/N執行處理。然而不限於此。例如,可進行配置,以便不考慮所輻照的輻射量,根據針對靜態成像模式或視訊成像模式的指令,在不進行合併的正常處理和進行合併的處理之間進行切換。可進行配置,以根據用於成像的所需要的解析度來執行上 文的切換。It should be noted that in the imaging processing shown in FIG. 5, it is considered that the S/N of the radiographic image obtained according to the amount of irradiated radiation is performed. It is not limited to this. For example, it may be configured to switch between normal processing without merging and processing for merging according to an instruction for a static imaging mode or a video imaging mode regardless of the amount of radiation irradiated. Can be configured to perform on the required resolution for imaging Text switching.
因而,在本示範性實施例中,在輻射檢測器42的所述輻射檢測元件10中,針對連接到具有排列為蜂巢形圖案的六角形畫素區域的多個畫素20的每個畫素20中的TFT開關4a的每個畫素列來設置掃描線G1,且針對由4個畫素配置而成的預定的多個畫素群的每一個,而對於每個畫素列來設置掃描線G2與G3,以通過在相同時序讀取及組合4個畫素的電荷來執行合併處理。接著合併處理掃描線G2與G3輸出信號,以同時接通特定多個畫素群的畫素中的TFT開關4b,且進行配置以使得針對相應多個畫素群中的每個畫素群的所組合電荷的電荷信號,在獨立的相應資料線中流動。Thus, in the present exemplary embodiment, in the radiation detecting element 10 of the radiation detector 42, for each pixel connected to a plurality of pixels 20 having hexagonal pixel regions arranged in a honeycomb pattern Each pixel column of the TFT switch 4a in 20 sets the scanning line G1, and sets a scan for each pixel column for each of a predetermined plurality of pixel groups configured by 4 pixels. Lines G2 and G3 perform the merging process by reading and combining the charges of 4 pixels at the same timing. Then, the scan lines G2 and G3 are combined to output signals to simultaneously turn on the TFT switches 4b in the pixels of the specific plurality of pixel groups, and are configured such that for each pixel group in the corresponding plurality of pixel groups The charge signals of the combined charges flow in separate respective data lines.
通過此舉,當通過針對多個畫素群同時讀取和組合4個畫素的電荷來執行合併處理時,相比於不進行合併處理而從個別畫素讀取電荷信號時,能夠以4倍速率執行成像。因此,在本示範性實施例中,S/N可通過增加所收集的電荷量而提高,可實現在需要高幀率的視訊成像模式中的應用、以及在通過輻照少量輻射而產生的低敏感性圖像中的應用。By doing so, when the merging process is performed by simultaneously reading and combining the charges of 4 pixels for a plurality of pixel groups, when the charge signal is read from the individual pixels without performing the merging process, it is possible to Imaging is performed at a multiple rate. Therefore, in the present exemplary embodiment, S/N can be improved by increasing the amount of charge collected, realizing application in a video imaging mode requiring a high frame rate, and low in radiation by irradiating a small amount of radiation. Application in sensitive images.
即,當執行視訊成像時,將由4個畫素配置而成的畫素群作為單個畫素來處理,從多個畫素群同時讀取電荷,且執行合併處理,以組合配置這些畫素群的每個畫素中所積聚的電荷。因此,儘管解析度低於用於靜態圖像的解析度,但是可達到靜態成像模式的幀率的4倍(1/4的幀持 續時間)的幀率,以用於從每個畫素列連續讀取電荷。That is, when performing video imaging, a pixel group configured by four pixels is processed as a single pixel, charges are simultaneously read from a plurality of pixel groups, and a merging process is performed to collectively configure the pixel groups. The charge accumulated in each pixel. Therefore, although the resolution is lower than that for the still image, it can reach 4 times the frame rate of the static imaging mode (1/4 frame holding) The frame rate of the continuation time) is used to continuously read the charge from each pixel column.
另外,確定每個畫素群中的4個畫素的組合,以使得多個六角形區域排列為蜂巢形圖案。通過包含畫素群的輪廓所環繞的區域內部的1個重心、以及連接位於所述1個重心外圍的6個個別重心的線段,而形成所述多個六角形區域中的每個六角形區域。因此,可抑制合併之後,在水平、垂直和對角線方向中的每個方向上的畫素位置(當將多個畫素作為單個畫素叢(single pixel clump)來處理時,為重心位置)的不均勻,且可在相應方向中的每個方向上確保均勻解析度(類似於在合併之前的圖像中)。因此,在合併前後,通用積體電路(integrated circuit;IC)可用於畫素密度轉換。此外,即使是由例如FPGA的可編程設備以及軟體,而非使用具有固定電路的IC執行的處理中,也可使用相同算法執行處理。In addition, a combination of 4 pixels in each pixel group is determined such that a plurality of hexagonal regions are arranged in a honeycomb pattern. Each hexagonal region of the plurality of hexagonal regions is formed by a center of gravity inside an area surrounded by a contour including a pixel group, and a line segment connecting six individual centers of gravity located at a periphery of the one center of gravity . Therefore, the pixel position in each of the horizontal, vertical, and diagonal directions after the merging can be suppressed (the center of gravity position when a plurality of pixels are handled as a single pixel clump) Non-uniformity, and uniform resolution can be ensured in each of the corresponding directions (similar to the image before the merge). Therefore, before and after merging, a general integrated circuit (IC) can be used for pixel density conversion. Further, even in a process performed by a programmable device such as an FPGA and software instead of using an IC having a fixed circuit, the same algorithm can be used to perform processing.
接下來是與根據本發明的第二示範性實施例的射線照相成像系統100有關的解釋。應注意,根據第二示範性實施例的射線照相成像系統100與根據圖1中所說明的第一示範性實施例的射線照相成像系統100類似,所以將省略說明及進一步解釋。Next is an explanation related to the radiographic imaging system 100 according to the second exemplary embodiment of the present invention. It should be noted that the radiographic imaging system 100 according to the second exemplary embodiment is similar to the radiographic imaging system 100 according to the first exemplary embodiment illustrated in FIG. 1, and thus the description and further explanation will be omitted.
圖6說明根據本示範性實施例的射線照相成像系統100的成像裝置41的輻射檢測器142的電配置。圖6中所說明的輻射檢測器142的輻射檢測元件110配置有多個畫素20,畫素20具有鄰近排列為二維蜂巢形圖案的六角形 畫素區域,以使得排列為蜂巢形圖案的畫素20配置成矩形的畫素區域。每個畫素20與圖2中所說明的輻射檢測器42的輻射檢測元件10中的畫素類似地進行配置。FIG. 6 illustrates an electrical configuration of the radiation detector 142 of the imaging device 41 of the radiographic imaging system 100 according to the present exemplary embodiment. The radiation detecting element 110 of the radiation detector 142 illustrated in FIG. 6 is configured with a plurality of pixels 20 having hexagons arranged adjacent to a two-dimensional honeycomb pattern. The pixel area is such that the pixels 20 arranged in a honeycomb pattern are arranged in a rectangular pixel area. Each pixel 20 is configured similarly to the pixels in the radiation detecting element 10 of the radiation detector 42 illustrated in FIG. 2.
輻射檢測器142包含:第四掃描線G4-1到G4-4(也稱為第四掃描線G4),第四掃描線G4-1到G4-4連接到提供於每個畫素20中的TFT開關4a的閘極電極,以用於對TFT開關4a進行接通/切斷控制;第五掃描線G5-1、G5-2(也稱為第五掃描線G5),第五掃描線G5-1、G5-2連接到TFT開關4b的閘極電極,以用於對TFT開關4b進行接通/切斷控制;多條資料線D1到D3(也稱為資料線D),資料線D1到D3讀取在感測器部分103中產生且在電荷存儲電容器5中積聚的電荷;以及公用接地線30。The radiation detector 142 includes: fourth scan lines G4-1 to G4-4 (also referred to as fourth scan lines G4), and fourth scan lines G4-1 to G4-4 are connected to each of the pixels 20 provided a gate electrode of the TFT switch 4a for performing on/off control of the TFT switch 4a; a fifth scan line G5-1, G5-2 (also referred to as a fifth scan line G5), and a fifth scan line G5 -1, G5-2 is connected to the gate electrode of the TFT switch 4b for on/off control of the TFT switch 4b; a plurality of data lines D1 to D3 (also referred to as data line D), data line D1 The charge generated in the sensor portion 103 and accumulated in the charge storage capacitor 5 is read to D3; and the common ground line 30 is read.
在圖6中,為易於解釋和說明,圖示佈局有第四掃描線G4的4條線、第五掃描線G5的2條線、資料線D的3條線以及公用接地線30的3條線的配置的實例。例如,當存在分別在列方向和行方向上設置的m×n個別畫素20時(其中m和n是正整數),提供了第四掃描線G4的m條線和資料線D的n條線。在此等情況下,第五掃描線G5的數量是第四掃描線G4的數量的一半,即提供了m/2條線。如稍後所述,在直接將輻射轉換為電荷的配置中,輻射檢測器142的輻射檢測元件110使用例如非晶硒的輻射-電荷轉換材料。應注意,在通過公用線施加來自電源(圖式中未圖示)的偏壓電壓的配置中,公用線(圖式中未圖示)連接到每個畫素20的感測器部分103。In FIG. 6, for ease of explanation and explanation, the illustrated layout has four lines of the fourth scanning line G4, two lines of the fifth scanning line G5, three lines of the data line D, and three lines of the common ground line 30. An example of a line configuration. For example, when there are m × n individual pixels 20 respectively set in the column direction and the row direction (where m and n are positive integers), m lines of the fourth scanning line G4 and n lines of the data line D are provided. In this case, the number of the fifth scanning lines G5 is half the number of the fourth scanning lines G4, that is, m/2 lines are provided. As described later, in a configuration that directly converts radiation into electric charges, the radiation detecting element 110 of the radiation detector 142 uses a radiation-charge converting material such as amorphous selenium. It should be noted that in a configuration in which a bias voltage from a power source (not shown in the drawing) is applied through a common line, a common line (not shown in the drawing) is connected to the sensor portion 103 of each pixel 20.
在輻射檢測器142中,掃描線G4、G5設置為與資料線D和公用接地線30交叉。資料線D沿著具有六角形畫素區域的畫素20的外圍邊緣,佈局為Z形圖案(以便蜿蜒而行),以便繞過這些畫素20。即,資料線D在行方向上延伸,同時沿著個別畫素20中的每個畫素的外圍邊緣(6條邊)的3條鄰邊伸展。公用接地線30也設置為Z形圖案(以便蜿蜒而行),以便與每個畫素20的TFT開關4a、4b保持距離。In the radiation detector 142, the scanning lines G4, G5 are disposed to cross the data line D and the common ground line 30. The data line D is arranged along the peripheral edge of the pixel 20 having the hexagonal pixel area in a zigzag pattern (to be bypassed) to bypass the pixels 20. That is, the data line D extends in the row direction while extending along three adjacent edges of the peripheral edge (six sides) of each pixel in the individual pixels 20. The common ground line 30 is also arranged in a zigzag pattern (to be bypassed) to maintain a distance from the TFT switches 4a, 4b of each pixel 20.
TFT開關4a的閘電極連接到第四掃描線G4,且TFT開關4b的閘電極連接到第五掃描線G5。TFT開關4a、4b的汲極電極或源極電極中的一個或另外一個連接到電荷存儲電容器5的一個電極,且汲極電極或源極電極中的另外一個連接到資料線D。當使用輻射檢測器142使射線照相圖像成像時,在使用外部輻射(X射線)輻照期間,向第四掃描線G4輸出切斷信號且每個TFT開關4a切斷,並向第五掃描線G5輸出切斷信號,且每個TFT開關4b切斷。因此,半導體層中產生的電荷積聚在每個電荷存儲電容器5中。The gate electrode of the TFT switch 4a is connected to the fourth scan line G4, and the gate electrode of the TFT switch 4b is connected to the fifth scan line G5. One or the other of the drain electrode or the source electrode of the TFT switch 4a, 4b is connected to one electrode of the charge storage capacitor 5, and the other of the drain electrode or the source electrode is connected to the data line D. When the radiographic image is imaged using the radiation detector 142, during the irradiation using external radiation (X-ray), a cut signal is output to the fourth scanning line G4 and each TFT switch 4a is turned off, and is turned to the fifth scan. The line G5 outputs a cutoff signal, and each of the TFT switches 4b is turned off. Therefore, charges generated in the semiconductor layer are accumulated in each of the charge storage capacitors 5.
當讀取圖像時,例如讀取靜態圖像時,一次一條線按順序向第四掃描線G4輸出接通信號,從而接通每個畫素20中的TFT開關4a。或者,例如當讀取視訊圖像時,一次一條線按順序向第五掃描線G5輸出接通信號,從而接通畫素群中的多個畫素的TFT開關4b。由此將每個電荷存儲電容器5中所積聚的電荷作為電信號而讀取,且通過將 所讀取的電信號轉換為數位數據而獲得射線照相圖像。When an image is read, for example, when a still image is read, one line at a time outputs an ON signal to the fourth scanning line G4 in order, thereby turning on the TFT switch 4a in each pixel 20. Alternatively, for example, when the video image is read, one line at a time outputs an ON signal to the fifth scanning line G5 in order, thereby turning on the TFT switches 4b of the plurality of pixels in the pixel group. Thereby, the charge accumulated in each of the charge storage capacitors 5 is read as an electrical signal, and The read electrical signal is converted into digital data to obtain a radiographic image.
信號處理部125包含:信號檢測器(圖式中未圖示),將從每條資料線D1到D3流出的電荷作為電信號來檢測,且使所檢測的電信號經歷特定處理。信號處理部125也分別向信號檢測器和掃描信號控制部35a、35b中的每一者、輸出表示信號檢測時序的控制信號和表示掃描信號輸出時序的控制信號。結果是,在從信號處理部125接收到所述控制信號時,掃描信號控制部35a向第四掃描線G4-1到G4-4輸出掃描信號,以接通/切斷TFT開關4a。掃描信號控制部35b也向第五掃描線G5-1、G5-2輸出掃描信號,以接通/切斷TFT開關4b。The signal processing unit 125 includes a signal detector (not shown in the drawing) that detects electric charges flowing from each of the data lines D1 to D3 as electrical signals, and subjects the detected electric signals to a specific process. The signal processing unit 125 also outputs a control signal indicating the signal detection timing and a control signal indicating the timing of the scan signal output to each of the signal detector and the scan signal control units 35a and 35b. As a result, upon receiving the control signal from the signal processing unit 125, the scan signal control unit 35a outputs a scan signal to the fourth scan lines G4-1 to G4-4 to turn on/off the TFT switch 4a. The scan signal control unit 35b also outputs a scan signal to the fifth scan lines G5-1 and G5-2 to turn on/off the TFT switch 4b.
由個別資料線D1到D3傳輸的電荷信號在信號處理部125中由放大器放大,且保持在抽樣保持電路中,圖式中未圖示。由個別抽樣保持電路保持的電荷信號按順序輸入到多工器(圖式中未圖示),且接著由A/D轉換器轉換為數位圖像數據。應注意,從A/D轉換器輸出的數位圖像數據是,例如,作為多個幀的所成像的射線照相圖像的數位圖像數據,而按順序存儲在圖像記憶體90中。The charge signals transmitted from the individual data lines D1 to D3 are amplified by the amplifier in the signal processing unit 125 and held in the sample-and-hold circuit, which is not shown in the drawings. The charge signals held by the individual sample-and-hold circuits are sequentially input to the multiplexer (not shown in the drawing), and then converted into digital image data by the A/D converter. It should be noted that the digital image data output from the A/D converter is, for example, digital image data of the imaged radiographic image as a plurality of frames, and is sequentially stored in the image memory 90.
接下來是與根據本示範性實施例的輻射檢測器142的操作有關的解釋。在使用輻射檢測器142的圖像檢測期間,從掃描信號控制部35a、35b將切斷信號(例如,0伏)輸出到第四掃描線G4-1到G4-4和第五掃描線G5-1、G5-2,從而向TFT開關4a、4b的閘電極施加負偏壓。每個TFT開關4a、4b由此維持為切斷狀態。Next is an explanation related to the operation of the radiation detector 142 according to the present exemplary embodiment. During image detection using the radiation detector 142, a cut signal (for example, 0 volt) is output from the scan signal control sections 35a, 35b to the fourth scan lines G4-1 to G4-4 and the fifth scan line G5- 1. G5-2, thereby applying a negative bias to the gate electrodes of the TFT switches 4a, 4b. Each of the TFT switches 4a, 4b is thereby maintained in a cut-off state.
在圖像讀取期間,根據來自圖像處理裝置的指令,輻射檢測器142在靜態成像模式或視訊成像模式中執行。當指令用於靜態成像模式時,信號處理部125控制掃描信號控制部35b,以使得掃描信號從第五掃描線G5-1、G5-2輸出,以切斷每個畫素20中的TFT開關4b。信號處理部125也控制掃描信號控制部35a,以從第四掃描線G4-1到G4-4按順序施加例如+10伏到20伏的電壓的接通信號到每個TFT開關4a的閘極,以便接通每個畫素20中的TFT開關4a。由此針對每個畫素列,將每個畫素20中的TFT開關4a按順序切換到接通狀態,由TFT開關4a從感測器部分103讀取電荷,且將對應於這些電荷的信號輸出到資料線D。During image reading, the radiation detector 142 is executed in a static imaging mode or a video imaging mode in accordance with an instruction from the image processing device. When the instruction is for the static imaging mode, the signal processing section 125 controls the scan signal control section 35b so that the scan signal is output from the fifth scan lines G5-1, G5-2 to cut off the TFT switch in each pixel 20. 4b. The signal processing section 125 also controls the scan signal control section 35a to sequentially apply an ON signal of, for example, a voltage of +10 volts to 20 volts from the fourth scan lines G4-1 to G4-4 to the gate of each TFT switch 4a. In order to turn on the TFT switch 4a in each pixel 20. Thus, for each pixel column, the TFT switches 4a in each pixel 20 are sequentially switched to the on state, the charges are read from the sensor portion 103 by the TFT switch 4a, and signals corresponding to these charges are Output to data line D.
因而在輻射檢測器142中,在靜態成像模式中,對應於每個畫素列中的每個畫素20的電荷信號在資料線D1到D3中的每條資料線中流動。因此,可獲得表示圖像的圖像數據,所述圖像表示輻照到輻射檢測器142的輻射檢測元件110上的輻射。在信號處理部125中,接著電荷信號轉換為數位信號,且基於對應於所述電荷信號的圖像數據,產生射線照相圖像。Thus, in the radiation detector 142, in the static imaging mode, the charge signal corresponding to each pixel 20 in each pixel column flows in each of the data lines D1 to D3. Thus, image data representative of an image representative of the radiation irradiated onto the radiation detecting element 110 of the radiation detector 142 is obtained. In the signal processing section 125, the charge signal is then converted into a digital signal, and a radiographic image is generated based on the image data corresponding to the charge signal.
接下來是與視訊成像模式有關的解釋。在根據本示範性實施例的輻射檢測器142中,圖6中說明的多個畫素20中,例如,由虛線環繞的4個畫素P2、P3、P5、P6中的每個TFT開關4b的閘極電極是連接到第五掃描線G5-1。類似地,由虛線環繞的4個畫素P8、P9、P11、P12中的 每個TFT開關4b的閘極電極是連接到第五掃描線G5-2。畫素P2、P3、P5、P6一起稱為畫素群PG1,且畫素P8、P9、P11、P12一起稱為畫素群PG2。應注意,在輻射檢測元件110中的畫素群(雖然從圖6中的說明省略)也是由除了畫素群PG1、PG2之外的、各自由4個特定畫素形成的多個其他畫素群配置而成(參見圖7的實例)。Next is an explanation related to the video imaging mode. In the radiation detector 142 according to the present exemplary embodiment, among the plurality of pixels 20 illustrated in FIG. 6, for example, each of the four pixels P2, P3, P5, P6 surrounded by a broken line 4b The gate electrode is connected to the fifth scan line G5-1. Similarly, among the four pixels P8, P9, P11, and P12 surrounded by a broken line The gate electrode of each TFT switch 4b is connected to the fifth scan line G5-2. The pixels P2, P3, P5, and P6 are collectively referred to as a pixel group PG1, and the pixels P8, P9, P11, and P12 are collectively referred to as a pixel group PG2. It should be noted that the pixel group in the radiation detecting element 110 (although omitted from the explanation in FIG. 6) is also a plurality of other pixels each formed of four specific pixels except for the pixel groups PG1, PG2. The group is configured (see the example in Figure 7).
當指示對輻射檢測器142採用視訊成像模式時,信號處理部125控制掃描信號控制部35a,以便切斷每個畫素20的TFT開關4a,並從第四掃描線G4-1到G4-4向每個畫素20的TFT開關4a的每個閘電極輸出切斷信號。When the video imaging mode is instructed to the radiation detector 142, the signal processing section 125 controls the scanning signal control section 35a to cut off the TFT switch 4a of each pixel 20, and from the fourth scanning line G4-1 to G4-4. A cutoff signal is output to each gate electrode of the TFT switch 4a of each pixel 20.
信號處理部125也控制掃描信號控制部35b,以按順序驅動第五掃描線G5-1、G5-2,以輸出掃描信號(接通信號)。即,當從第五掃描線G5-1輸出接通信號時,接通畫素群PG1的四個個別畫素P2、P3、P5、P6的TFT開關4b。結果是,對四個個別畫素P2、P3、P5、P6的每個電荷存儲電容器5中積聚的電荷求和而組合的電荷信號輸出到資料線D2。接著,當從第五掃描線G5-2輸出接通信號時,接通畫素群PG2的四個個別畫素P8、P9、P11、P12的TFT開關4b。在此情況下,對四個個別畫素P8、P9、P11、P12中積聚的電荷求和而組合的電荷信號輸出到資料線D1。The signal processing unit 125 also controls the scan signal control unit 35b to sequentially drive the fifth scan lines G5-1 and G5-2 to output a scan signal (on signal). That is, when the ON signal is output from the fifth scanning line G5-1, the TFT switches 4b of the four individual pixels P2, P3, P5, and P6 of the pixel group PG1 are turned on. As a result, the charge signals combined and summed with the charges accumulated in each of the four charge cells P2, P3, P5, and P6 are output to the data line D2. Next, when the ON signal is output from the fifth scanning line G5-2, the TFT switches 4b of the four individual pixels P8, P9, P11, and P12 of the pixel group PG2 are turned on. In this case, the charge signals combined and summed with the charges accumulated in the four individual pixels P8, P9, P11, and P12 are output to the data line D1.
雖然從圖6的說明中省略,但當由第五掃描線G5-1、G5-2輸出接通信號時,在從畫素群PG1、PG2的畫素在列方向上延伸的其他多個畫素中,與畫素群PG1、PG2的情況類似,也將4個畫素單元中所求和的電荷信號輸出到資 料線。Although omitted from the description of FIG. 6, when the ON signal is output from the fifth scanning lines G5-1 and G5-2, the other plurality of paintings extending in the column direction from the pixels of the pixel groups PG1 and PG2. In the prime case, similar to the case of the pixel groups PG1 and PG2, the charge signals summed in the four pixel units are also output to the capital. Feed line.
因而,當在視訊成像模式中時,在由配置輻射檢測元件110的多個畫素20中、已捆綁在一起的四個預先指定的畫素配置而成的多個畫素群的每一個中,組合(合併)四個個別畫素中所積聚的電荷,且將對應於所合併的電荷的所組合的電荷信號輸出到相應資料線。這意謂著,當執行視訊成像時,對應於2畫素×2畫素的總數的電荷信號,在鄰近資料線D中交替流動(在圖6中,在偶數資料線D2和奇數資料線D1與D3中交替流動)。Thus, in the video imaging mode, in each of a plurality of pixel groups configured by four pre-specified pixels that have been bundled together among the plurality of pixels 20 configuring the radiation detecting element 110 And combining (merging) the charges accumulated in the four individual pixels, and outputting the combined charge signals corresponding to the combined charges to the corresponding data lines. This means that when performing video imaging, the charge signals corresponding to the total number of 2 pixels × 2 pixels alternately flow in the adjacent data line D (in Fig. 6, in the even data line D2 and the odd data line D1) Alternate flow with D3).
圖7說明在上述視訊成像模式中經歷合併的畫素和畫素群的佈局。應注意,在圖7中,在鄰近畫素群中的每個畫素改變底紋圖案,以使得較易於將相應畫素群彼此區分。Figure 7 illustrates the layout of pixels and pixel groups undergoing merging in the above described video imaging mode. It should be noted that in FIG. 7, the shading pattern is changed for each pixel in the adjacent pixel group to make it easier to distinguish the respective pixel groups from each other.
在圖7中所說明的實例中,如上文所述,輻射檢測器142的輻射檢測元件110指定由4個鄰近畫素形成的畫素群A、B、C、D、E、F、G、H。例如,畫素群A由總共4個畫素(所述4個畫素以垂直線圖案應用)配置而成,在沿著圖7中附有20a的列方向的第一畫素列中、有畫素20中的2個鄰近畫素;且在沿著圖7中附有20b的列方向、位於所述第一畫素列下方的列中的第二畫素列中、有畫素20中的2個互相鄰近的畫素,第二畫素列中的2個畫素相對於最初的2個畫素位移達第一畫素列排列間距的1/2。In the example illustrated in FIG. 7, as described above, the radiation detecting element 110 of the radiation detector 142 specifies a pixel group A, B, C, D, E, F, G formed of 4 adjacent pixels. H. For example, the pixel group A is configured by a total of 4 pixels (the 4 pixels are applied in a vertical line pattern), in the first pixel column along the column direction with 20a attached in FIG. 2 adjacent pixels in the pixel 20; and in the second pixel column in the column direction 20b in FIG. 7 in the column direction below the first pixel column, in the pixel 20 The two pixels adjacent to each other, the two pixels in the second pixel column are shifted by 1/2 of the first pixel arrangement interval with respect to the first two pixels.
每個畫素群可定義為4個畫素的組合,所述4個畫素是由:經設置以使得每個畫素的兩條鄰邊分別與剩餘2個畫素的一條邊互相鄰近的3個畫素、和經設置以使得兩條 鄰邊分別與所述3個畫素中的2個畫素的一條邊互相鄰近的1個畫素所配置而成。4個畫素的組合也可描述為:由彼此並排設置的2對互相鄰近的畫素所形成的4個畫素的組合,其中,第一對的1個畫素的2條鄰邊分別設置為與另一對的2個畫素中的每個畫素的1條邊互相鄰近。Each pixel group can be defined as a combination of 4 pixels, which are arranged such that two adjacent edges of each pixel are adjacent to one edge of the remaining two pixels, respectively. 3 pixels, and set to make two The neighboring edges are respectively arranged with one pixel adjacent to one side of the two pixels of the three pixels. The combination of 4 pixels can also be described as a combination of 4 pixels formed by two pairs of mutually adjacent pixels arranged side by side, wherein the two adjacent sides of the first pair of pixels are respectively set. One edge of each of the two pixels of the other pair is adjacent to each other.
當如上所述,指示輻射檢測器142中使用靜態成像模式時,信號處理部125接通輻射檢測器142中的每個畫素20中的TFT開關4a,從每個所述畫素讀取電荷,且向資料線D輸出對應於所述電荷的信號。由於將具有六角形畫素區域的畫素用作輻射檢測器142的輻射檢測元件110中的個別畫素,因此,可在水平、垂直和對角線方向中的每個方向上確保高解析度。When the static imaging mode is used in the indication radiation detector 142 as described above, the signal processing section 125 turns on the TFT switch 4a in each of the pixels 20 in the radiation detector 142, and reads the charge from each of the pixels. And outputting a signal corresponding to the electric charge to the data line D. Since a pixel having a hexagonal pixel region is used as an individual pixel in the radiation detecting element 110 of the radiation detector 142, high resolution can be ensured in each of the horizontal, vertical, and diagonal directions. .
然而,在視訊成像模式中,由於信號處理部125接通配置每個畫素群的相應4個畫素中的TFT開關4b,所述4個畫素充當單個畫素,且執行合併以組合4個畫素的電荷。由4個畫素形成的畫素群A、B、C、D、E、F、G、H中的每個畫素群的重心的位置是以黑點來定位,且分別指示為a、b、c、d、e、f、g、h。However, in the video imaging mode, since the signal processing section 125 turns on the TFT switch 4b in the corresponding four pixels of each pixel group, the four pixels serve as a single pixel, and the combination is performed to combine 4 The charge of a pixel. The position of the center of gravity of each of the pixel groups A, B, C, D, E, F, G, and H formed by the four pixels is positioned by black dots and indicated as a and b, respectively. , c, d, e, f, g, h.
在圖7中所指示的實例中,當針對每個畫素群執行4畫素合併時,通過將重心a-c-g-h-e-b-a與位於中心的畫素群D的重心d進行連接,來形成正六角形。也可看出,這些畫素群的重心之間的距離,即在d到a、d到c、d到g、d到h、d到e、d到b這6個方向上的距離,彼此全部相等。因而,在本示範性實施例中,通過使每個畫素20的畫 素區域成為六角形,在合併之前,可在水平、垂直和對角線方向中的每個方向上確保均勻解析度。另外,在本示範性實施例中,由於通過將畫素群的重心連接在一起也形成正六角形,因在合併之後,也可在水平、垂直和對角線方向中的每個方向上確保均勻解析度。In the example indicated in FIG. 7, when 4-pixel merging is performed for each pixel group, a positive hexagon is formed by connecting the center of gravity a-c-g-h-e-b-a with the center of gravity d of the pixel group D located at the center. It can also be seen that the distance between the centers of gravity of these pixel groups, that is, the distances in the six directions d to a, d to c, d to g, d to h, d to e, d to b, All equal. Thus, in the present exemplary embodiment, by making each picture of the picture 20 The prime regions are hexagonal, ensuring uniform resolution in each of the horizontal, vertical, and diagonal directions prior to merging. In addition, in the present exemplary embodiment, since the hexagonal shape is also formed by joining the centers of gravity of the pixel groups together, it is also possible to ensure uniformity in each of the horizontal, vertical, and diagonal directions after the merging. Resolution.
即,確定每個畫素群中的每個畫素的組合,以使得多個六角形區域排列為蜂巢形圖案。通過使用例如畫素群A、B、C、D、E、F、G、H的輪廓所環繞而成的每個區域的重心a、b、c、d、e、g、h,每個六角形區域形成為包含:內部的1個重心d、以及由連接位於重心d外圍的6個個別重心a、c、g、h、e、b的線段形成的六角形區域。因此,本示範性實施例可抑制合併之後,畫素位置(畫素群的重心位置)在水平、垂直和對角線方向中的每個方向上的不均勻,且可使得在相應方向中的每個方向上能夠確保均勻解析度(類似於在合併之前的圖像中)。That is, the combination of each pixel in each pixel group is determined such that a plurality of hexagonal regions are arranged in a honeycomb pattern. The center of gravity a, b, c, d, e, g, h of each region surrounded by the outlines of, for example, pixel groups A, B, C, D, E, F, G, H, each of six The angular region is formed to include: an inner center of gravity d, and a hexagonal region formed by connecting line segments of six individual centers of gravity a, c, g, h, e, b located at the periphery of the center of gravity d. Therefore, the present exemplary embodiment can suppress the unevenness of the pixel position (the center of gravity of the pixel group) in each of the horizontal, vertical, and diagonal directions after the merging, and can be made in the corresponding direction. Uniform resolution is guaranteed in each direction (similar to the image before the merge).
由於合併之前所排列的重心、以及合併之後所排列的重心,兩者都處在重心所形成的六角形區域排列為蜂巢形圖案的狀態下,因此,在合併之後執行畫素密度轉換時,可使用類似於未進行合併的情況下、執行畫素密度轉換時所使用的算法來執行處理。即,用於畫素密度轉換處理的算法可為合併前和合併後兩種情況下通用的,而不用準備用於合併後進行畫素密度轉換處理的另一獨立算法。Due to the center of gravity arranged before the merging and the center of gravity arranged after the merging, both of the hexagonal regions formed by the center of gravity are arranged in a honeycomb pattern, and therefore, when the pixel density conversion is performed after the merging, The processing is performed using an algorithm similar to that used when performing pixel density conversion, in the case where no merging is performed. That is, the algorithm for the pixel density conversion processing can be common for both the pre-merging and post-merging cases without preparing another independent algorithm for performing the pixel density conversion processing after the combining.
應注意,由於在根據本示範性實施例的射線照相成像系統100的成像裝置41中執行的成像處理、與由根據圖5 中所說明的第一示範性實施例的成像裝置41所執行的成像處理類似,因此,省略對其的進一步解釋。It should be noted that the imaging processing performed in the imaging device 41 of the radiographic imaging system 100 according to the present exemplary embodiment, and the image processing according to FIG. 5 The imaging process performed by the imaging device 41 of the first exemplary embodiment explained in the above is similar, and therefore, further explanation thereof is omitted.
因而,如上文所解釋,在本示範性實施例中,對於輻射檢測器中,各自由具有排列為蜂巢形圖案的六角形畫素區域的多個畫素中的4個畫素配置而成的、相應預定多個畫素群中的每個畫素群而言,通過同時讀取和組合輻射檢測器142的輻射檢測元件110中的4個畫素的電荷,來執行合併處理。因此,在本示範性實施例中,S/N可通過增加所收集的電荷量而提高,且可實現在需要高幀率的視訊成像模式中的應用、以及在通過輻照少量輻射而產生的低敏感性圖像中的應用。Thus, as explained above, in the present exemplary embodiment, for the radiation detector, each of the four pixels of the plurality of pixels having the hexagonal pixel regions arranged in a honeycomb pattern is configured. The merging process is performed by simultaneously reading and combining the charges of the four pixels in the radiation detecting element 110 of the radiation detector 142 for each pixel group in the predetermined plurality of pixel groups. Therefore, in the present exemplary embodiment, S/N can be improved by increasing the amount of charge collected, and can be applied in a video imaging mode requiring a high frame rate, and generated by irradiating a small amount of radiation. Application in low sensitivity images.
另外,確定每個畫素群中的每個畫素的組合,以使得多個六角形區域排列為蜂巢形圖案。通過包含畫素群的輪廓所環繞的區域內部的1個重心、以及連接位於所述1個重心外圍的6個個別重心的線段,而形成所述多個六角形區域中的每個六角形區域。因此,可抑制合併之後,在水平、垂直和對角線方向中的每個方向上的畫素位置(當將多個畫素作為單個畫素叢來處理時,為重心位置)的不均勻,且可在相應方向中的每個方向上確保均勻解析度(類似於在合併之前圖像中)。因此,在合併前後,通用積體電路(IC)可用於畫素密度轉換。In addition, a combination of each pixel in each pixel group is determined such that a plurality of hexagonal regions are arranged in a honeycomb pattern. Each hexagonal region of the plurality of hexagonal regions is formed by a center of gravity inside an area surrounded by a contour including a pixel group, and a line segment connecting six individual centers of gravity located at a periphery of the one center of gravity . Therefore, unevenness of the pixel position (the center of gravity position when a plurality of pixels are treated as a single pixel cluster) in each of the horizontal, vertical, and diagonal directions after the merging can be suppressed, And uniform resolution can be ensured in each of the corresponding directions (similar to in the image before merging). Therefore, the general integrated circuit (IC) can be used for pixel density conversion before and after the combination.
另外,當執行視訊成像時,由2畫素×2畫素配置而成的畫素群作為單個畫素來讀取,且組合配置每個畫素群的每個畫素中所積聚的電荷,來執行合併處理。因此,儘管 解析度低於用於靜態圖像的解析度,但是可達到用於在靜態成像模式中,從每個畫素列讀取電荷的幀率的2倍(1/2的幀持續時間)的幀率。In addition, when performing video imaging, a pixel group configured by 2 pixels×2 pixels is read as a single pixel, and the charges accumulated in each pixel of each pixel group are combined and configured. Perform the merge process. So despite The resolution is lower than the resolution for the still image, but a frame for doubling the frame rate of the charge from each pixel column (1/2 frame duration) in the static imaging mode can be achieved. rate.
另外,通過這樣為多個畫素列中的每一對鄰近畫素列提供一條用於合併的掃描線G5,相比為經歷合併的每個畫素列而提供一條掃描線G的情況,掃描線G的數量可減少到經歷合併的畫素列的數量的1/2。即,相比根據圖2中所說明的第一示範性實施例的輻射檢測器42,掃描線G的數量可大大減少。另外,在圖6中所說明的輻射檢測器142的配置中,相比未執行合併時所需要的4條掃描線G1,掃描畫素(包含伴隨著合併而執行掃描)所需要的掃描線的總數量在之前是4條線的兩倍,即8條線。然而,在本示範性實施例中,僅需要4條線的1.5倍,即6條線。In addition, by providing a scan line G5 for merging for each pair of adjacent pixel columns in the plurality of pixel columns, compared to providing a scan line G for each pixel column subjected to merging, scanning The number of lines G can be reduced to 1/2 of the number of pixel columns undergoing merging. That is, the number of scanning lines G can be greatly reduced compared to the radiation detector 42 according to the first exemplary embodiment illustrated in FIG. 2. In addition, in the configuration of the radiation detector 142 illustrated in FIG. 6, the scan lines required for scanning pixels (including scanning performed with merging) are compared with the four scanning lines G1 required when the merging is not performed. The total number was twice as long as 4 lines, or 8 lines. However, in the present exemplary embodiment, only 1.5 times of 4 lines, that is, 6 lines are required.
接下來是與根據本發明的第三示範性實施例的射線照相成像系統100有關的解釋。應注意,根據第三示範性實施例的射線照相成像系統100與根據圖1中所說明的第一示範性實施例的射線照相成像系統100類似,所以將省略說明及進一步解釋。Next is an explanation related to the radiographic imaging system 100 according to the third exemplary embodiment of the present invention. It should be noted that the radiographic imaging system 100 according to the third exemplary embodiment is similar to the radiographic imaging system 100 according to the first exemplary embodiment illustrated in FIG. 1, and thus the description and further explanation will be omitted.
圖8說明根據第三示範性實施例的成像裝置41的輻射檢測器342的電配置。圖8中所說明的輻射檢測器342的輻射檢測元件310、與根據圖2中所說明的第一示範性實施例的輻射檢測器42類似,配置有多個畫素20,畫素20具有鄰近排列為二維蜂巢形圖案的六角形畫素區域,以使 得排列為蜂巢形圖案的畫素20配置成矩形的畫素區域。FIG. 8 illustrates an electrical configuration of a radiation detector 342 of the imaging device 41 according to the third exemplary embodiment. The radiation detecting element 310 of the radiation detector 342 illustrated in FIG. 8 is similar to the radiation detector 42 according to the first exemplary embodiment illustrated in FIG. 2, and is configured with a plurality of pixels 20 having pixels adjacent thereto Arrange the hexagonal pixel regions of the two-dimensional honeycomb pattern so that The pixels 20 arranged in a honeycomb pattern are arranged in a rectangular pixel region.
輻射檢測器342包含:平行於列方向(圖8中的水平方向)排列的多條掃描線G6-0到G6-12、G7-0到G7-11,以及多條資料線D1到D6,所述資料線與掃描線交叉,且所述資料線提供為圍繞畫素20的外圍彎曲而沿著行方向(圖8中的垂直方向)延伸。為了簡單起見,下文中掃描線G6-0到G6-12稱為第六掃描線G6,且掃描線G7-0到G7-11稱為第七掃描線G7。The radiation detector 342 includes: a plurality of scanning lines G6-0 to G6-12, G7-0 to G7-11 arranged in parallel to the column direction (horizontal direction in FIG. 8), and a plurality of data lines D1 to D6, The data line intersects the scan line, and the data line is provided to extend around the periphery of the pixel 20 and to extend in the row direction (the vertical direction in FIG. 8). For the sake of simplicity, the scanning lines G6-0 to G6-12 are hereinafter referred to as a sixth scanning line G6, and the scanning lines G7-0 to G7-11 are referred to as a seventh scanning line G7.
與根據第一示範性實施例的輻射檢測器42中的類似,公用接地線30設置為:在多條資料線D1到D6之間作為直線與掃描線G6與G7交叉,而不與資料線D1到D6交叉。應注意,將公用接地線30設置為直線意謂著:直的狀態維持於一範圍內,所述範圍可在允許輻射檢測元件310的製造過程中出現製造誤差的同時而獲得。Similar to the radiation detector 42 according to the first exemplary embodiment, the common ground line 30 is disposed to intersect the scanning lines G6 and G7 as a straight line between the plurality of data lines D1 to D6, and not to the data line D1. Cross to D6. It should be noted that setting the common ground line 30 to a straight line means that the straight state is maintained within a range that can be obtained while allowing manufacturing errors in the manufacturing process of the radiation detecting element 310.
輻射檢測元件310中的每個畫素20配置為包含:感測器部分103,接收已輻照的輻射(X射線)並產生電荷;電荷存儲電容器5,積聚已在感測器部分103中產生的電荷;以及兩個TFT開關4a、4b,用於讀取電荷存儲電容器5中所積聚的電荷。因此,輻射檢測器342為直接轉換型輻射檢測器342,其在光電轉換層中使用例如非晶硒的輻射-電荷轉換材料來吸收輻射,並將輻射轉換為電荷。Each of the pixels 20 in the radiation detecting element 310 is configured to include: a sensor portion 103 that receives the irradiated radiation (X-rays) and generates a charge; and a charge storage capacitor 5 that has been generated in the sensor portion 103 And a charge of the two TFT switches 4a, 4b for reading the charge accumulated in the charge storage capacitor 5. Therefore, the radiation detector 342 is a direct conversion type radiation detector 342 which uses a radiation-charge conversion material such as amorphous selenium in the photoelectric conversion layer to absorb radiation and convert the radiation into electric charges.
接下來是與使用根據第三示範性實施例的輻射檢測器342來使射線照相圖像成像時的操作有關的解釋。例如,在靜態成像模式中,從掃描信號控制部335向第六掃描線 G6-0到G6-12輸出掃描信號,以便按照畫素列按順序接通每個畫素20的TFT開關4a,且從掃描信號控制部335向第七掃描線G7-0到G7-11輸出掃描信號,以接通每個畫素20的TFT開關4b。因此,從每個畫素中的感測器部分103讀出電荷,且將對應於這些電荷的信號輸出到資料線D1到D6。由此從對應於每個畫素20的電荷信號獲得表示圖像的圖像數據,所述圖像表示已輻照到輻射檢測器342上的輻射。Next is an explanation related to the operation when the radiographic image is imaged using the radiation detector 342 according to the third exemplary embodiment. For example, in the static imaging mode, from the scan signal control section 335 to the sixth scan line G6-0 to G6-12 output scan signals to turn on the TFT switches 4a of each pixel 20 in order according to the pixel sequence, and output from the scan signal control section 335 to the seventh scan lines G7-0 to G7-11. The signal is scanned to turn on the TFT switch 4b of each pixel 20. Therefore, charges are read out from the sensor portion 103 in each pixel, and signals corresponding to these charges are output to the data lines D1 to D6. Image data representing the image is thus obtained from the charge signal corresponding to each pixel 20, the image representing the radiation that has been irradiated onto the radiation detector 342.
當在視訊成像模式中時,從掃描信號控制部335向第六掃描線G6-0到G6-12輸出掃描信號,以接通每個畫素20的TFT開關4a,且向第七掃描線G7-0到G7-11輸出掃描信號,以接通每個畫素20的TFT開關4b,如下文所述。When in the video imaging mode, the scan signal is output from the scan signal control section 335 to the sixth scan lines G6-0 to G6-12 to turn on the TFT switch 4a of each pixel 20, and to the seventh scan line G7. -0 to G7-11 output a scan signal to turn on the TFT switch 4b of each pixel 20 as described below.
根據本示範性實施例的輻射檢測器342的輻射檢測元件310配置有:分別由3個預定畫素配置而成的多個畫素群。例如,如圖8中所示,3個畫素P0到P2形成畫素群PG0,3個畫素P3到P5形成畫素群PG1,3個畫素P6到P8形成畫素群PG2,3個畫素P9到P11形成畫素群PG3,3個畫素P12到P14形成畫素群PG4,3個畫素P15到P17形成畫素群PG5,3個畫素P18到P20形成畫素群PG6,以及3個畫素P21到P23形成畫素群PG7。The radiation detecting element 310 of the radiation detector 342 according to the present exemplary embodiment is configured with a plurality of pixel groups each configured by three predetermined pixels. For example, as shown in FIG. 8, three pixels P0 to P2 form a pixel group PG0, three pixels P3 to P5 form a pixel group PG1, and three pixels P6 to P8 form a pixel group PG2, three The pixels P9 to P11 form the pixel group PG3, the three pixels P12 to P14 form the pixel group PG4, the three pixels P15 to P17 form the pixel group PG5, and the three pixels P18 to P20 form the pixel group PG6. And three pixels P21 to P23 form a pixel group PG7.
在第七掃描線中,掃描線G7-0連接到配置畫素群PG0的畫素P0到P2中的每個TFT開關4b的閘電極,以及畫素群PG1的畫素P3到P5中的每個TFT開關4b的閘電極。在第七掃描線中,掃描線G7-1連接到配置畫素群PG2的 畫素P6到P8中的每個TFT開關4b的閘電極,以及畫素群PG3的畫素P9到P11中的每個TFT開關4b的閘電極。掃描線G7-0和掃描線G7-1配置為從掃描信號控制部335延伸出的單條線的分支。In the seventh scanning line, the scanning line G7-0 is connected to the gate electrode of each of the pixels P0 to P2 of the pixel group PG0, and each of the pixels P3 to P5 of the pixel group PG1 The gate electrode of the TFT switch 4b. In the seventh scan line, the scan line G7-1 is connected to the set pixel group PG2 The gate electrodes of each of the TFT switches 4b of the pixels P6 to P8, and the gate electrodes of each of the pixels P9 to P11 of the pixel group PG3. The scanning line G7-0 and the scanning line G7-1 are arranged as branches of a single line extending from the scanning signal control unit 335.
因此,當由掃描信號控制部335向掃描線G7-0、G7-1輸出掃描信號(接通信號)時,接通畫素群PG0到PG3中的所有畫素20的TFT開關4b。因此,對配置相應畫素群PG0到PG3的3個個別畫素中的每個電荷存儲電容器5中所積聚的電荷進行組合(合併),且向資料線D1輸出畫素群PG0的所組合的電荷信號,向資料線D4輸出畫素群PG1的所組合的電荷信號,向資料線D3輸出畫素群PG2的所組合的電荷信號,且向資料線D6輸出畫素群PG3的所組合的電荷信號。Therefore, when the scan signal control unit 335 outputs the scan signal (on signal) to the scanning lines G7-0 and G7-1, the TFT switches 4b of all the pixels 20 in the pixel groups PG0 to PG3 are turned on. Therefore, the charges accumulated in each of the three individual pixels configuring the respective pixel groups PG0 to PG3 are combined (combined), and the combined combination of the pixel groups PG0 is output to the data line D1. The charge signal outputs the combined charge signal of the pixel group PG1 to the data line D4, outputs the combined charge signal of the pixel group PG2 to the data line D3, and outputs the combined charge of the pixel group PG3 to the data line D6. signal.
配置畫素群PG4到PG7的每個畫素中的每個TFT開關4b與掃描線G7-2、G7-3之間的連接的圖案,與上文所述的畫素群PG0到PG3與掃描線G7-O、G7-1之間的連接類似。因此,當由掃描信號控制部335向掃描線G7-2、G7-3輸出掃描信號(接通信號)時,接通畫素群PG4到PG7中的所有畫素20的TFT開關4b。因此,向資料線D1輸出畫素群PG4的所組合的電荷信號(所合併的信號),向資料線D4輸出畫素群PG5的所組合的電荷信號,向資料線D3輸出畫素群PG6的所組合的電荷信號,且向資料線D6輸出畫素群PG7的所組合的電荷信號。A pattern of a connection between each of the TFT switches 4b and the scanning lines G7-2, G7-3 in each pixel of the pixel groups PG4 to PG7, and the pixel groups PG0 to PG3 and the scanning described above are arranged. The connections between lines G7-O and G7-1 are similar. Therefore, when the scan signal control unit 335 outputs the scan signal (on signal) to the scanning lines G7-2 and G7-3, the TFT switches 4b of all the pixels 20 in the pixel groups PG4 to PG7 are turned on. Therefore, the combined charge signals (combined signals) of the pixel group PG4 are output to the data line D1, the combined charge signals of the pixel group PG5 are output to the data line D4, and the pixel group PG6 is output to the data line D3. The combined charge signals output the combined charge signals of the pixel group PG7 to the data line D6.
上文內容同樣適用於其他畫素群。明確來說,例如, 畫素群PG8到PG11從掃描線G7-4、G7-5接收掃描信號,畫素群PG12到PG15從掃描線G7-6、G7-7接收掃描信號,畫素群PG16到PG19從掃描線G7-8、G7-9接收掃描信號,以及畫素群PG20到PG23從掃描線G7-10、G7-11接收掃描信號。The above also applies to other pixel groups. Specifically, for example, The pixel groups PG8 to PG11 receive scan signals from the scan lines G7-4, G7-5, and the pixel groups PG12 to PG15 receive scan signals from the scan lines G7-6, G7-7, and the pixel groups PG16 to PG19 are from the scan line G7. -8. G7-9 receives the scan signal, and the pixel groups PG20 to PG23 receive the scan signals from the scan lines G7-10, G7-11.
因而,在輻射檢測器342中,當畫素群PG0到PG3、PG8到PG11、PG16到PG19稱為偶數塊(block)、且畫素群PG4到PG7、PG12到PG15、PG20到PG23稱為奇數塊時,輻射檢測器342中的3畫素單元中所求和的電荷的電荷信號,針對偶數塊和奇數塊,而交替地流出到資料線D1、D3、D4、D6中。在合併期間,電荷信號不在資料線D2、D5中流動,且處在浮動狀態(floating state)。Thus, in the radiation detector 342, when the pixel groups PG0 to PG3, PG8 to PG11, PG16 to PG19 are referred to as even blocks, and the pixel groups PG4 to PG7, PG12 to PG15, PG20 to PG23 are called odd numbers. At the time of the block, the charge signals of the charges summed in the three pixel units in the radiation detector 342 alternately flow out to the data lines D1, D3, D4, D6 for the even blocks and the odd blocks. During the merge, the charge signal does not flow in the data lines D2, D5 and is in a floating state.
如上文所述,將合併掃描線G7分為多個群,並在針對每個所述群移位的時序,將用於TFT開關4b的掃描信號發送到屬於這些群的掃描線G7。因此,當在每個時序組合及讀取多個畫素群的電荷時,不通過相同資料線傳輸對應於從不同畫素群讀取的所組合的電荷量的電荷信號。As described above, the merged scan line G7 is divided into a plurality of groups, and the scan signals for the TFT switches 4b are transmitted to the scan lines G7 belonging to these groups at the timing of shifting for each of the groups. Therefore, when charges of a plurality of pixel groups are combined and read at each timing, charge signals corresponding to the combined charge amounts read from different pixel groups are not transmitted through the same data line.
應注意,對於合併處理期間處在浮動狀態下的資料線D2、D5而言,可進行配置,以使得例如通過將TFT開關4b的源極電極或汲極電極連接到:固定於特定電勢(electrical potential)的資料線D2、D5或連接到附近的線的資料線D2、D5,來避免浮動狀態。It should be noted that for the data lines D2, D5 in the floating state during the merging process, configuration may be made such that, for example, by connecting the source electrode or the drain electrode of the TFT switch 4b to: a specific potential (electrical The data line D2, D5 of the potential) or the data lines D2, D5 connected to the nearby line to avoid floating state.
另外,雖然在圖8中,掃描線G7-0到G7-1、G7-2到G7-3等配置為:分別從掃描信號控制部335延伸的單條線 分出的2個分支。然而,不限於此。例如,掃描線G7-0到G7-1可獨立從掃描信號控制部335延伸,且可同時受到驅動,且接著掃描線G7-2到G7-3可同時受到驅動。也可使用獨立於掃描信號控制部335提供的第二掃描信號控制部進行配置,其中,從所述第二掃描信號控制部延伸出的1條線分支為2條。也可進行配置,以使得掃描線G7-0到G7-3獨立從與掃描信號控制部335相互獨立的第二掃描信號控制部延伸出,且掃描線G7-0、G7-1同時受到驅動,且接著掃描線G7-2、G7-3同時受到驅動。In addition, in FIG. 8, the scanning lines G7-0 to G7-1, G7-2 to G7-3, and the like are configured as a single line extending from the scanning signal control portion 335, respectively. 2 branches that are separated. However, it is not limited to this. For example, the scanning lines G7-0 to G7-1 can be independently extended from the scanning signal control portion 335, and can be simultaneously driven, and then the scanning lines G7-2 to G7-3 can be simultaneously driven. It is also possible to use a second scanning signal control unit provided independently of the scanning signal control unit 335, wherein one line branch extending from the second scanning signal control unit is two. It is also possible to configure such that the scanning lines G7-0 to G7-3 are independently extended from the second scanning signal control section independent of the scanning signal control section 335, and the scanning lines G7-0, G7-1 are simultaneously driven. And then the scanning lines G7-2, G7-3 are simultaneously driven.
在圖8中所說明的實例中,為易於解釋和說明,圖示佈局有25條掃描線G和6條資料線D的配置的實例。例如,當存在分別在列方向和行方向上設置的m×n個別畫素20時(其中m和n是正整數),提供了2m條掃描線和n條資料線。In the example illustrated in FIG. 8, for ease of explanation and explanation, the illustrated layout has an example of a configuration of 25 scanning lines G and 6 data lines D. For example, when there are m × n individual pixels 20 respectively set in the column direction and the row direction (where m and n are positive integers), 2m scanning lines and n data lines are provided.
圖9說明上文所述的在視訊成像模式中經歷合併的畫素和畫素群的佈局。針對鄰近畫素群中的每個畫素改變底紋圖案,以使得較易於將相應畫素群彼此區分。在圖9中所說明的實例中,如上文所述,輻射檢測器342的輻射檢測元件310指定:由鄰近的3個畫素形成的每一個畫素群A、B、C、D、E、F、G。此處每個畫素群由3個畫素配置而成,所述3個畫素為多個畫素中的第一畫素、以及在與第一畫素列鄰近的列中彼此鄰近的2個其他畫素,即,第二畫素和第三畫素。三個個別畫素經設置以使得第一畫素的兩條鄰邊分別與第二畫素和第三畫素中的每個畫素的 一條邊鄰近。即,每個畫素群可定義為3個畫素的組合,由3個畫素構成,所述3個畫素經設置以使得每個畫素的兩條鄰邊分別與另外2個畫素中的每個畫素的一條邊鄰近。Figure 9 illustrates the layout of the pixels and pixel groups undergoing merging in the video imaging mode described above. The shading pattern is changed for each pixel in the neighboring pixel group to make it easier to distinguish the respective pixel groups from each other. In the example illustrated in FIG. 9, as described above, the radiation detecting element 310 of the radiation detector 342 specifies: each pixel group A, B, C, D, E formed by the adjacent three pixels. F, G. Here, each pixel group is configured by three pixels, the first pixel of the plurality of pixels, and the two adjacent to each other in the column adjacent to the first pixel column. Other pixels, namely, the second pixel and the third pixel. The three individual pixels are set such that the two adjacent sides of the first pixel are respectively associated with each of the second and third pixels One side is adjacent. That is, each pixel group can be defined as a combination of 3 pixels, composed of 3 pixels, and the 3 pixels are set such that two adjacent sides of each pixel are respectively separated from the other two pixels. One side of each pixel in the vicinity is adjacent.
在本示範性實施例的輻射檢測器342中,當如上文所述,指示使用靜態成像模式時,信號處理部325接通輻射檢測器342的每個畫素20中的TFT開關4a,從每個所述畫素讀取電荷,且向資料線D輸出對應於所述電荷的信號。由於將具有六角形畫素區域的畫素用作為輻射檢測器342的輻射檢測元件310中的個別畫素,因此,可在水平、垂直和對角線方向的每個方向上確保高解析度。然而,在視訊成像模式中,由於信號處理部325接通配置每個畫素群的相應3個畫素中的TFT開關4b,所述3個畫素充當單個畫素,且執行合併,以組合3個畫素的電荷。In the radiation detector 342 of the present exemplary embodiment, when the static imaging mode is instructed as described above, the signal processing section 325 turns on the TFT switch 4a in each of the pixels 20 of the radiation detector 342, from each Each of the pixels reads a charge, and outputs a signal corresponding to the charge to the data line D. Since the pixels having the hexagonal pixel area are used as the individual pixels in the radiation detecting element 310 of the radiation detector 342, high resolution can be ensured in each of the horizontal, vertical, and diagonal directions. However, in the video imaging mode, since the signal processing section 325 turns on the TFT switch 4b in the corresponding three pixels of each pixel group, the three pixels serve as a single pixel, and perform merging to combine The charge of 3 pixels.
在圖9中,由3個畫素形成的畫素群A、B、C、D、E、F、G中的每個畫素群的重心的位置是以黑點來定位,且分別指示為a、b、c、d、e、f、g。在圖9中所指示的實例中,當針對每個畫素群執行3畫素合併時,通過連接其他畫素群的重心a-b-c-e-f-a,形成了中心具有畫素群D的重心d的正六角形。也可看出,這些畫素群的重心之間的距離,即在d到a、d到b、d到c、d到e、d到f、d到g這6個方向上的距離,彼此全部相等。因而,通過使每個畫素20的畫素區域成為六角形,在合併之前,可在水平、垂直和對角線方向中的每個方向上確保均勻解析度。另 外,由於通過將畫素群的重心連接在一起也形成正六角形,因此,在合併之後,也可在水平、垂直和對角線方向中的每個方向上確保均勻解析度。In FIG. 9, the positions of the centers of gravity of each of the pixel groups A, B, C, D, E, F, and G formed by the three pixels are positioned by black dots, and are respectively indicated as a, b, c, d, e, f, g. In the example indicated in FIG. 9, when 3 pixel combination is performed for each pixel group, a positive hexagon having a center of gravity d of the pixel group D is formed by connecting the centers of gravity a-b-c-e-f-a of the other pixel groups. It can also be seen that the distance between the centers of gravity of these pixel groups, that is, the distances in the six directions d to a, d to b, d to c, d to e, d to f, d to g, All equal. Thus, by making the pixel area of each pixel 20 hexagonal, uniform resolution can be ensured in each of the horizontal, vertical, and diagonal directions before merging. another In addition, since the hexagonal shape is also formed by connecting the centers of gravity of the pixel groups together, even after the merging, uniform resolution can be ensured in each of the horizontal, vertical, and diagonal directions.
即,確定每個畫素群中的每個畫素的組合,以使得多個六角形區域排列為蜂巢形圖案。通過使用例如畫素群A、B、C、D、E、F、G的輪廓所環繞而成的每個區域的重心a、b、c、d、e、f、g,每個六角形區域形成為包含:內部的1個重心d、以及由連接位於重心d外圍的6個個別重心a、b、e、g、f、c的線段形成的六角形區域。因此,本示範性實施例可抑制合併之後,畫素位置(畫素群的重心位置)在水平、垂直和對角線方向中的每個方向上的不均勻,且可使得在相應方向中的每個方向上能夠確保均勻解析度(類似於在合併之前的圖像中)。That is, the combination of each pixel in each pixel group is determined such that a plurality of hexagonal regions are arranged in a honeycomb pattern. Each hexagonal region is centered by the center of gravity a, b, c, d, e, f, g of each region surrounded by contours of, for example, pixel groups A, B, C, D, E, F, G It is formed to include one inner center of gravity d and a hexagonal region formed by connecting line segments of six individual centers of gravity a, b, e, g, f, c located at the periphery of the center of gravity d. Therefore, the present exemplary embodiment can suppress the unevenness of the pixel position (the center of gravity of the pixel group) in each of the horizontal, vertical, and diagonal directions after the merging, and can be made in the corresponding direction. Uniform resolution is guaranteed in each direction (similar to the image before the merge).
在本示範性實施例中,與上文所述的第一示範性實施例中的類似,由於合併之前所排列的重心、以及合併之後所排列的重心,兩者都處在重心所形成的六角形區域排列為蜂巢形圖案的狀態下,因此,在合併之後執行畫素密度轉換時,可使用類似於不進行合併的情況下、執行畫素密度轉換時所使用的算法來執行處理。因此,用於畫素密度轉換處理的算法可為合併前和合併後兩種情況下通用的,而不用準備用於合併後進行畫素密度轉換處理的另一獨立算法。In the present exemplary embodiment, similar to that in the first exemplary embodiment described above, due to the center of gravity arranged before the merging, and the center of gravity arranged after the merging, both are at the center of gravity formed by the six The angular regions are arranged in a honeycomb pattern, and therefore, when performing pixel density conversion after merging, processing can be performed using an algorithm similar to that used when performing pixel density conversion without merging. Therefore, the algorithm for pixel density conversion processing can be used for both pre-merging and post-merging cases without preparing another independent algorithm for performing pixel density conversion processing after merging.
如上文所述,在第三示範性實施例中,針對每個畫素列將掃描線G7設置在輻射檢測器342的輻射檢測元件310 中,以便執行合併處理,而針對各自由3個畫素配置而成預定的多個畫素群、讀取及組合相應3個畫素的電荷,且向特定的合併處理掃描線G7輸出信號,以同時接通多個畫素群的每個畫素中的TFT開關4b。接著,進行配置,以使得針對多個畫素群的每個畫素群中所組合的電荷的電荷掃描信號,在獨立的資料線中流動。As described above, in the third exemplary embodiment, the scanning line G7 is disposed at the radiation detecting element 310 of the radiation detector 342 for each pixel column. In order to perform the merging process, the predetermined three pixel groups are respectively configured by three pixels, the charges of the corresponding three pixels are read and combined, and the signals are output to the specific merge processing scan line G7. The TFT switch 4b in each pixel of the plurality of pixel groups is simultaneously turned on. Next, configuration is performed such that the charge scan signals for the charges combined in each of the pixel groups of the plurality of pixel groups flow in the independent data lines.
由於上述配置,本示範性實施例可在合併處理期間,針對多個畫素群同時讀取及組合3個畫素的電荷,相比於不進行合併而從個別畫素20讀出電荷信號時,能夠以2倍速率執行成像。因此,本示範性實施例可通過增加所收集的電荷量來提高S/N,可實現在需要高幀率的視訊成像模式中的應用、以及實現在通過輻照少量輻射而產生的低敏感性圖像中的應用。Due to the above configuration, the present exemplary embodiment can simultaneously read and combine the charges of 3 pixels for a plurality of pixel groups during the merging process, compared to when the charge signals are read from the individual pixels 20 without merging It is possible to perform imaging at a rate of 2 times. Therefore, the present exemplary embodiment can increase the S/N by increasing the amount of charge collected, can realize application in a video imaging mode requiring a high frame rate, and achieve low sensitivity generated by irradiating a small amount of radiation. The application in the image.
即,當執行視訊成像時,將由3個畫素配置而成的畫素群作為單個畫素來處理,從多個畫素群同時讀取電荷,且執行合併處理,以組合配置這些畫素群的每個畫素中所積聚的電荷。因此,儘管解析度低於用於靜態圖像的解析度,但是可達到用於從每個畫素列連續讀取電荷的靜態成像模式幀率的2倍(1/2的幀持續時間)的幀率。That is, when performing video imaging, a pixel group configured by three pixels is processed as a single pixel, charges are simultaneously read from a plurality of pixel groups, and a combining process is performed to collectively configure the pixel groups. The charge accumulated in each pixel. Therefore, although the resolution is lower than that for the still image, it is possible to achieve twice the frame rate of the static imaging mode (1/2 frame duration) for continuously reading charges from each pixel column. Frame rate.
接下來是與根據本發明的第四示範性實施例的射線照相成像系統100有關的解釋。應注意,根據第四示範性實施例的射線照相成像系統100與根據上文所述的第一示範性實施例的射線照相成像系統100類似,所以將省略說明 及進一步解釋。Next is an explanation related to the radiographic imaging system 100 according to the fourth exemplary embodiment of the present invention. It should be noted that the radiographic imaging system 100 according to the fourth exemplary embodiment is similar to the radiographic imaging system 100 according to the first exemplary embodiment described above, so the description will be omitted And further explanation.
圖10說明根據第四示範性實施例的射線照相成像系統100的成像裝置中的輻射檢測器442的電配置。圖10中所說明的輻射檢測器442的輻射檢測元件410、與根據圖2中所說明的第一示範性實施例的輻射檢測器42類似,配置有多個畫素20,畫素20具有鄰近排列為二維蜂巢形圖案的六角形畫素區域,從而配置成整體為矩形的區域。FIG. 10 illustrates an electrical configuration of a radiation detector 442 in an imaging device of the radiographic imaging system 100 according to the fourth exemplary embodiment. The radiation detecting element 410 of the radiation detector 442 illustrated in FIG. 10 is similar to the radiation detector 42 according to the first exemplary embodiment illustrated in FIG. 2, and is configured with a plurality of pixels 20 having pixels adjacent thereto The hexagonal pixel regions arranged in a two-dimensional honeycomb pattern are arranged in a rectangular region as a whole.
輻射檢測器442包含:第八掃描線G8-1到G8-5(也稱為第八掃描線G8),第八掃描線G8-1到G8-5連接到提供於每個畫素20中的TFT開關4a的閘極電極,以用於對TFT開關4a進行接通/切斷控制;第九掃描線G9-1、G9-2(也稱為第九掃描線G9),第九掃描線G9-1、G9-2連接到TFT開關4b的閘極電極,以用於對TFT開關4b進行接通/切斷控制;多條資料線D1到D3(也稱為資料線D),資料線D1到D3讀取感測器部分103中產生的且在電荷存儲電容器5中積聚的電荷;以及公用接地線30。The radiation detector 442 includes: eighth scanning lines G8-1 to G8-5 (also referred to as an eighth scanning line G8), and eighth scanning lines G8-1 to G8-5 are connected to each of the pixels 20 provided. a gate electrode of the TFT switch 4a for performing on/off control of the TFT switch 4a; a ninth scan line G9-1, G9-2 (also referred to as a ninth scan line G9), and a ninth scan line G9 -1, G9-2 is connected to the gate electrode of the TFT switch 4b for on/off control of the TFT switch 4b; a plurality of data lines D1 to D3 (also referred to as data line D), data line D1 The charge generated in the sensor portion 103 and accumulated in the charge storage capacitor 5 is read to D3; and the common ground line 30.
應注意,多個畫素20中的畫素,例如畫素P6、P12等,各自由於其與用於在成像模式中讀取電荷的時序的關係,而只具有TFT開關4a,作為用於讀取每個畫素中的電荷存儲電容器5中所積聚的電荷的電晶體。It should be noted that the pixels in the plurality of pixels 20, such as pixels P6, P12, etc., each have only the TFT switch 4a as a function for reading due to its relationship with the timing for reading the charge in the imaging mode. A transistor of electric charge accumulated in the charge storage capacitor 5 in each pixel is taken.
在圖10中,為易於解釋和說明,圖示佈局有第八掃描線G8的5條線、第九掃描線G9的2條線、資料線D的4條線以及公用接地線30的4條線的配置的實例。一般來說,例如,當存在分別在列方向和行方向上設置的m×n個 別畫素20時(其中m和n是正整數),提供了第八掃描線G8的m條線和n條資料線。輻射檢測器442的輻射檢測元件410使用直接將輻射轉換為電荷的、例如非晶硒的輻射-電荷轉換材料。應注意,公用線(圖式中未圖示)連接到每個畫素20的感測器部分103,其中,通過公用線而施加來自電源(圖式中未圖示)的偏壓電壓。In FIG. 10, for ease of explanation and explanation, the illustrated layout has five lines of the eighth scanning line G8, two lines of the ninth scanning line G9, four lines of the data line D, and four lines of the common ground line 30. An example of a line configuration. In general, for example, when there are m × n which are respectively set in the column direction and the row direction When the pixel is 20 (where m and n are positive integers), m lines and n data lines of the eighth scanning line G8 are provided. Radiation detecting element 410 of radiation detector 442 uses a radiation-charge converting material, such as amorphous selenium, that directly converts radiation into electrical charge. It should be noted that a common line (not shown in the drawing) is connected to the sensor portion 103 of each pixel 20, wherein a bias voltage from a power source (not shown in the drawing) is applied through a common line.
在輻射檢測器442中,掃描線G8、G9設置為與資料線D和公用接地線30交叉。資料線D沿著具有六角形畫素區域的畫素20的外圍邊緣,佈局為Z形圖案(以便蜿蜒而行),以便繞過這些畫素20。即,資料線D在行方向上延伸,同時沿著每個畫素20的外圍邊緣(6條邊)的3條鄰邊伸展。公用接地線30也設置為Z形圖案(以便蜿蜒而行),以便與每個畫素20的TFT開關4a、4b保持距離。In the radiation detector 442, the scanning lines G8, G9 are disposed to cross the data line D and the common ground line 30. The data line D is arranged along the peripheral edge of the pixel 20 having the hexagonal pixel area in a zigzag pattern (to be bypassed) to bypass the pixels 20. That is, the data line D extends in the row direction while extending along three adjacent sides of the peripheral edge (six sides) of each pixel 20. The common ground line 30 is also arranged in a zigzag pattern (to be bypassed) to maintain a distance from the TFT switches 4a, 4b of each pixel 20.
TFT開關4a的閘電極連接到第八掃描線G8,且TFT開關4b的閘電極連接到第九掃描線G9。TFT開關4a、4b的汲極電極或源極電極中的一個或另外一個連接到電荷存儲電容器5的一個電極,且汲極電極或源極電極中的另外一個連接到資料線D。The gate electrode of the TFT switch 4a is connected to the eighth scanning line G8, and the gate electrode of the TFT switch 4b is connected to the ninth scanning line G9. One or the other of the drain electrode or the source electrode of the TFT switch 4a, 4b is connected to one electrode of the charge storage capacitor 5, and the other of the drain electrode or the source electrode is connected to the data line D.
輻射檢測器442的控制部150(control section)向掃描信號控制部435a、435b輸出:表示信號檢測時序的控制信號、和表示掃描信號輸出時序的控制信號。在從控制部150接收到所述控制信號時,掃描信號控制部435a向第八掃描線G8-1到G8-5輸出掃描信號,以接通/切斷TFT開 關4a。掃描信號控制部435b也向第九掃描線G9-1、G9-2輸出掃描信號,以接通/切斷TFT開關4b。The control section 150 (control section) of the radiation detector 442 outputs, to the scan signal control sections 435a and 435b, a control signal indicating the signal detection timing and a control signal indicating the timing of the scan signal output. Upon receiving the control signal from the control unit 150, the scan signal control unit 435a outputs a scan signal to the eighth scan lines G8-1 to G8-5 to turn on/off the TFT. Off 4a. The scan signal control unit 435b also outputs a scan signal to the ninth scan lines G9-1 and G9-2 to turn on/off the TFT switch 4b.
當使射線照相圖像成像時,在使用外部輻射(X射線)輻照期間,向第八掃描線G8輸出切斷信號,且每個TFT開關4a切斷,並向第九掃描線G9輸出切斷信號,且每個TFT開關4b切斷。因此,半導體層中產生的電荷積聚在每個電荷存儲電容器5中。When the radiographic image is imaged, the cutting signal is output to the eighth scanning line G8 during the irradiation using the external radiation (X-ray), and each of the TFT switches 4a is turned off, and the cut is output to the ninth scanning line G9. The signal is broken and each TFT switch 4b is turned off. Therefore, charges generated in the semiconductor layer are accumulated in each of the charge storage capacitors 5.
當讀取圖像時,例如讀取靜態圖像時,一次一條線按順序向第八掃描線G8輸出接通信號,從而接通每個畫素20中的TFT開關4a。另一方面,例如當讀取視訊圖像時,一次一條線按順序向第九掃描線G9輸出接通信號,從而接通畫素群中的多個畫素的TFT開關4b,如下文所述,且向特定第八掃描線G8輸出接通信號,以接通畫素20中的TFT開關4a。由此將每個電荷存儲電容器5中所積聚的電荷作為電信號而讀取,且通過將所讀取的電信號轉換為數位數據而獲得射線照相圖像。When an image is read, for example, when a still image is read, one line at a time outputs an ON signal to the eighth scanning line G8 in order, thereby turning on the TFT switch 4a in each pixel 20. On the other hand, for example, when reading a video image, one line at a time outputs an ON signal to the ninth scanning line G9 in order, thereby turning on the TFT switches 4b of a plurality of pixels in the pixel group, as described below. And an ON signal is output to the specific eighth scanning line G8 to turn on the TFT switch 4a in the pixel 20. The electric charge accumulated in each of the charge storage capacitors 5 is thus read as an electric signal, and a radiographic image is obtained by converting the read electric signal into digital data.
如圖10中所說明,輻射檢測器442配備有可變增益前置放大器(也稱為電荷放大器或積分放大器)CA1到CA3,可變增益前置放大器CA1到CA3各對應於資料線D1到D3中的一條資料線。抽樣保持(sample-and-hold;SH)電路97A到97D也位在每個電荷放大器CA1到CA3的輸出側處、而設置於輻射檢測器442中。輻射檢測器442配置有多條資料線,設置在資料線D1到D3的重複單元中,且多個電荷放大器設置在與其對應的電荷放大器CA1到 CA3的重複單元中。電荷放大器CA1到CA3各自配置為包含:具有接地的正輸入側的運算放大器92a、跨越運算放大器92a的負輸入側和輸出側而並聯連接的電容器92b以及重置開關92c。重置開關92c由控制部150切換。輻射檢測器442也配備有多工器98、和類比/數位(A/D)轉換器99。As illustrated in FIG. 10, the radiation detector 442 is equipped with variable gain preamplifiers (also referred to as charge amplifiers or integrating amplifiers) CA1 to CA3, and the variable gain preamplifiers CA1 to CA3 correspond to the data lines D1 to D3, respectively. A data line in the middle. Sample-and-hold (SH) circuits 97A to 97D are also disposed at the output side of each of the charge amplifiers CA1 to CA3, and are disposed in the radiation detector 442. The radiation detector 442 is configured with a plurality of data lines, which are disposed in the repeating unit of the data lines D1 to D3, and a plurality of charge amplifiers are disposed in the corresponding charge amplifier CA1 to In the repeat unit of CA3. The charge amplifiers CA1 to CA3 are each configured to include an operational amplifier 92a having a grounded positive input side, a capacitor 92b connected in parallel across a negative input side and an output side of the operational amplifier 92a, and a reset switch 92c. The reset switch 92c is switched by the control unit 150. The radiation detector 442 is also equipped with a multiplexer 98, and an analog/digital (A/D) converter 99.
應注意,抽樣保持電路97A到97D的抽樣時序、和提供給多工器98的開關98a到98d的選擇輸出,也由控制部150切換。在圖10中,多工器98配置為將4個畫素捆綁為1個。然而,不限於此。例如,多工器98可經配置,以將上文所述的資料線D1到D3的重複單元、與捆綁為1個的3個畫素進行匹配。It should be noted that the sampling timing of the sample-and-hold circuits 97A to 97D and the selection output of the switches 98a to 98d supplied to the multiplexer 98 are also switched by the control portion 150. In FIG. 10, the multiplexer 98 is configured to bundle four pixels into one. However, it is not limited to this. For example, multiplexer 98 can be configured to match the repeating units of data lines D1 through D3 described above with the three pixels bundled into one.
接下來是與根據本示範性實施例的輻射檢測器442的操作有關的解釋。在使用輻射檢測器442的圖像檢測期間,從掃描信號控制部435a、435b將切斷信號(例如,0伏)輸出到第八掃描線G8-1到G8-5和第九掃描線G9-1、G9-2,從而向TFT開關4a、4b的閘電極施加負偏壓。每個TFT開關4a、4b由此維持為切斷狀態。Next is an explanation related to the operation of the radiation detector 442 according to the present exemplary embodiment. During image detection using the radiation detector 442, a cut signal (for example, 0 volt) is output from the scan signal control sections 435a, 435b to the eighth scan lines G8-1 to G8-5 and the ninth scan line G9- 1. G9-2, thereby applying a negative bias to the gate electrodes of the TFT switches 4a, 4b. Each of the TFT switches 4a, 4b is thereby maintained in a cut-off state.
在圖像讀取期間,如上文所述,根據來自圖像處理裝置50的指令,輻射檢測器442在靜態成像模式或視訊成像模式中執行成像。當指令用於靜態成像模式時,控制部150控制掃描信號控制部435b,以使得掃描信號從第九掃描線G9-1、G9-2輸出,以切斷每個畫素20中的TFT開關4b。控制部150也控制掃描信號控制部435a,以從第八掃描線 G8-1到G8-5按順序施加例如+10伏到20伏的電壓的接通信號到每個TFT開關4a的閘極,以便接通每個畫素20中的TFT開關4a。由此針對每個畫素列,將每個畫素20中的TFT開關4a按順序切換到接通狀態,由TFT開關4a從感測器部分103讀出電荷,且將對應於這些電荷的信號輸出到資料線D。During image reading, as described above, the radiation detector 442 performs imaging in the still imaging mode or the video imaging mode in accordance with an instruction from the image processing device 50. When the instruction is for the static imaging mode, the control section 150 controls the scan signal control section 435b so that the scan signal is output from the ninth scan lines G9-1, G9-2 to cut off the TFT switch 4b in each pixel 20. . The control unit 150 also controls the scan signal control unit 435a to be from the eighth scan line. G8-1 to G8-5 sequentially apply an ON signal of, for example, a voltage of +10 volts to 20 volts to the gate of each TFT switch 4a to turn on the TFT switch 4a in each pixel 20. Thus, for each pixel column, the TFT switches 4a in each of the pixels 20 are sequentially switched to the on state, the charges are read out from the sensor portion 103 by the TFT switches 4a, and signals corresponding to the charges are inputted. Output to data line D.
因而在靜態成像模式中,在輻射檢測器442中,對應於每個畫素20的電荷信號,按照畫素列在資料線D1到D3中的每條資料線中流動。因此,可獲得表示圖像的圖像數據,所述圖像表示輻照到輻射檢測器442的輻射檢測元件410上的輻射。接著在信號處理部425中,將電荷信號轉換為數位信號,且基於對應於所述電荷信號的圖像數據,產生射線照相圖像。Thus, in the static imaging mode, in the radiation detector 442, the charge signal corresponding to each pixel 20 flows in each of the data lines D1 to D3 in accordance with the pixel sequence. Accordingly, image data representing an image representing radiation irradiated onto the radiation detecting element 410 of the radiation detector 442 can be obtained. Next, in the signal processing section 425, the charge signal is converted into a digital signal, and a radiographic image is generated based on the image data corresponding to the charge signal.
接下來是參考圖11中所說明的操作時序圖的、與根據本示範性實施例的輻射檢測器中的視訊成像模式的操作有關的解釋。在本示範性實施例的輻射檢測器442的多個畫素20中,例如,圖10中虛線所環繞的3個畫素P1到P3中設置的每個TFT開關4b的閘極電極是連接到第九掃描線G9-1。同樣,由虛線環繞的畫素P4到P6中的畫素P4、P5中設置的TFT開關4b的閘極電極也連接到第九掃描線G9-1。Next is an explanation related to the operation of the video imaging mode in the radiation detector according to the present exemplary embodiment with reference to the operation timing chart illustrated in FIG. In the plurality of pixels 20 of the radiation detector 442 of the present exemplary embodiment, for example, the gate electrodes of each of the TFT switches 4b provided in the three pixels P1 to P3 surrounded by the broken line in FIG. 10 are connected to Ninth scanning line G9-1. Similarly, the gate electrode of the TFT switch 4b provided in the pixels P4, P5 in the pixels P4 to P6 surrounded by the broken line is also connected to the ninth scanning line G9-1.
類似地,畫素P7到P9中設置的每個TFT開關4b的閘極電極是連接到第九掃描線G9-2,且畫素P10到P12中的畫素P10、P11中設置的TFT開關4b的閘極電極也連 接到第九掃描線G9-2。Similarly, the gate electrodes of each of the TFT switches 4b provided in the pixels P7 to P9 are connected to the ninth scanning line G9-2, and the TFT switches 4b provided in the pixels P10, P11 in the pixels P10 to P12 Gate electrode Received the ninth scan line G9-2.
此處,畫素P1到P3稱為畫素群PG1、畫素P4到P6稱為畫素群PG2、畫素P7到P9稱為畫素群PG3,且畫素P10到P12稱為畫素群PG4。應注意,雖然從圖10的說明中省略,輻射檢測元件410也由與畫素群PG1、PG2等互相鄰近的多個其他畫素群配置而成,其他畫素群各自由作為配置畫素的3個特定畫素形成。將畫素群PG1、PG2作為實例,這些畫素群使用畫素群PG1的3個畫素(P1到P3)以及由畫素群PG2的2個畫素(P4、P5)和畫素群PG2的1個畫素(P6)構成的3個畫素,來配置畫素群重複單元(每個單元中總共6個畫素)。重複單元包含:在同一畫素列方向上的3個連續的畫素(在此情況下為P1、P4、P5);沿著畫素列方向的2個連續的畫素,其設置為在畫素行方向上、在所述3個連續畫素下方鄰近(在此情況下為P2、P3);以及設置為在畫素行方向上、在所述3個連續畫素上方鄰近的1個畫素(在此情況下為P6)。相應畫素群PG1、PG2的3個畫素中的每個畫素經設置,以使得每個畫素的兩條鄰邊分別與剩餘2個畫素中的每個畫素的1條邊鄰近。Here, the pixels P1 to P3 are called pixel groups PG1, pixels P4 to P6 are called pixel groups PG2, pixels P7 to P9 are called pixel groups PG3, and pixels P10 to P12 are called pixel groups. PG4. It should be noted that although omitted from the description of FIG. 10, the radiation detecting element 410 is also configured by a plurality of other pixel groups adjacent to each other, such as the pixel groups PG1, PG2, and the like, and the other pixel groups are each configured as a pixel. Three specific pixels are formed. Taking the pixel groups PG1 and PG2 as examples, these pixel groups use the three pixels (P1 to P3) of the pixel group PG1 and the two pixels (P4, P5) and the pixel group PG2 of the pixel group PG2. The three pixels composed of one pixel (P6) are used to configure the pixel group repeating unit (a total of six pixels in each unit). The repeating unit contains: 3 consecutive pixels in the direction of the same pixel column (in this case, P1, P4, P5); 2 consecutive pixels along the direction of the pixel column, which are set to draw In the normal direction, adjacent to the three consecutive pixels (in this case, P2, P3); and one pixel disposed adjacent to the three consecutive pixels in the direction of the pixel ( In this case it is P6). Each of the three pixels of the corresponding pixel group PG1, PG2 is set such that two adjacent sides of each pixel are respectively adjacent to one side of each of the remaining two pixels.
在本示範性實施例的輻射檢測器442中,將上文所述的畫素P1到P6作為單個畫素群單元來處理,通過沿著圖10的水平和垂直方向連續設置此等畫素群單元,來配置輻射檢測元件410。換句話說,在輻射檢測器442中,將畫素P1到P5和畫素P12作為單個畫素群單元來處理,且通 過沿著圖10的水平和垂直方向連續設置此等畫素群單元,來配置輻射檢測元件410。In the radiation detector 442 of the present exemplary embodiment, the above-described pixels P1 to P6 are processed as a single pixel group unit, and these pixel groups are successively arranged by the horizontal and vertical directions in FIG. The unit is configured to configure the radiation detecting element 410. In other words, in the radiation detector 442, the pixels P1 to P5 and the pixel P12 are processed as a single pixel group unit, and The radiation detecting elements 410 are disposed by continuously arranging the pixel groups in the horizontal and vertical directions of FIG.
當指示輻射檢測器442使用視訊成像模式時,控制部150最初控制掃描信號控制部435a,以便從第八掃描線G8-1到G8-5向每個畫素20的TFT開關4a的每個閘電極輸出切斷信號,以切斷每個畫素20的TFT開關4a。When the indication radiation detector 442 uses the video imaging mode, the control section 150 initially controls the scan signal control section 435a so as to switch from the eighth scan lines G8-1 to G8-5 to each gate of the TFT switch 4a of each pixel 20. The electrode outputs a cutoff signal to cut off the TFT switch 4a of each pixel 20.
接著控制部150輸出重置信號,以使電荷放大器中的重置開關短路。例如,如圖11的(5)和(6)中所說明,向電荷放大器CA1、CA2輸出重置信號,且接著電荷放大器CA1、CA2的電容器中積聚的電荷放電(重置)。The control unit 150 then outputs a reset signal to short the reset switch in the charge amplifier. For example, as explained in (5) and (6) of FIG. 11, the reset signals are output to the charge amplifiers CA1, CA2, and then the charges accumulated in the capacitors of the charge amplifiers CA1, CA2 are discharged (reset).
接著,控制部150控制掃描信號控制部435b,以向第九掃描線G9-1輸出掃描信號(接通信號)。明確來說,如圖11的(1)所說明的,由第九掃描線G9-1輸出接通信號歷時特定時段。由此接通畫素群PG1的3個個別畫素P1到P3的TFT開關4b。因此,畫素P1到P3的每個電荷存儲電容器5中已積聚的電荷的電荷信號在輻射檢測元件410內部組合,且此3個畫素的所組合的電荷信號通過資料線D1流出。Next, the control unit 150 controls the scan signal control unit 435b to output a scan signal (on signal) to the ninth scan line G9-1. Specifically, as illustrated in (1) of FIG. 11, the ON signal is output by the ninth scanning line G9-1 for a certain period of time. Thereby, the TFT switches 4b of the three individual pixels P1 to P3 of the pixel group PG1 are turned on. Therefore, the charge signals of the accumulated charges in each of the charge storage capacitors 5 of the pixels P1 to P3 are combined inside the radiation detecting element 410, and the combined charge signals of the three pixels flow out through the data line D1.
將由資料線D1傳輸的電信號(3個畫素的所組合的電荷信號)在電荷放大器CA1中,以預定放大率放大歷時圖11的(7)中所說明的時段(稱為積分週期T1-1),且保持在抽樣保持電路97B中。隨著積分週期T1-1逝去,電荷信號的抽樣停止。The electric signal (the combined charge signal of three pixels) transmitted by the data line D1 is amplified in the charge amplifier CA1 at a predetermined amplification rate for a period of time (indicated in (7) of FIG. 11 (referred to as an integration period T1- 1) and held in the sample and hold circuit 97B. As the integration period T1-1 elapses, sampling of the charge signal is stopped.
當由第九掃描線G9-1輸出接通信號時(圖11中的 (1)),接通畫素群PG2的畫素P4、P5中的TFT開關4b。因此,畫素P4、P5的每個電荷存儲電容器5中所積聚的電荷的所組合的電荷信號通過資料線D2流出。資料線D2所傳輸的電信號(畫素P4、P5的所組合的電荷信號)由電荷放大器CA2放大歷時了:在積分週期T2-1內與上述積分週期T1-1相等的時段,如圖11的(8)中所示,並保持在抽樣保持電路97C中。當來自第九掃描線G9-1的輸出信號從接通變為切斷時,控制部150結束積分週期T1-1,然而,繼續積分週期T2-1,並處在電荷信號可繼續在電荷放大器CA2中積聚和放大(積分)的狀態中。When the ON signal is output by the ninth scanning line G9-1 (in FIG. 11 (1)), the TFT switch 4b in the pixels P4 and P5 of the pixel group PG2 is turned on. Therefore, the combined charge signals of the charges accumulated in each of the charge storage capacitors 5 of the pixels P4, P5 flow out through the data line D2. The electric signal (the combined charge signal of the pixels P4 and P5) transmitted by the data line D2 is amplified by the charge amplifier CA2 for a period of time equal to the above-mentioned integration period T1-1 in the integration period T2-1, as shown in FIG. It is shown in (8) and is held in the sample and hold circuit 97C. When the output signal from the ninth scanning line G9-1 changes from on to off, the control section 150 ends the integration period T1-1, however, the integration period T2-1 continues, and the charge signal can continue in the charge amplifier. In the state of accumulation and amplification (integration) in CA2.
在將來自第九掃描線G9-1的輸出信號切換為切斷後,接著如圖11的(2)中所說明,控制部150控制掃描信號控制部435a,以使得來自第八掃描線G8-1的輸出信號變為接通。因此,接通對應於第八掃描線G8-1的畫素列的畫素中的TFT開關4a,且從這些畫素讀出的電荷信號通過資料線中的每條資料線流出。當發生這一情況時,電荷放大器CA2處在如上文所述的能夠積聚和放大(積分)電荷信號的狀態,然而,電荷放大器CA1處在非操作狀態。應注意,在視訊成像模式中(合併驅動期間),由於沒有信號通過資料線D3流動,因此如圖11的(9)中所說明,控制部150將電荷放大器CA3置於持續非操作狀態。After switching the output signal from the ninth scanning line G9-1 to the cutoff, the control section 150 controls the scanning signal control section 435a so as to be from the eighth scanning line G8-1, as explained in (2) of FIG. The output signal turns on. Therefore, the TFT switches 4a in the pixels corresponding to the pixel columns of the eighth scanning line G8-1 are turned on, and the charge signals read out from these pixels flow out through each of the data lines in the data lines. When this occurs, the charge amplifier CA2 is in a state capable of accumulating and amplifying (integrating) the charge signal as described above, however, the charge amplifier CA1 is in an inoperative state. It should be noted that in the video imaging mode (during the combined driving period), since no signal flows through the data line D3, the control section 150 places the charge amplifier CA3 in the continuous inoperative state as illustrated in (9) of FIG.
因此,如圖11的(8)中所說明,在積分週期T1-1的時段已逝去之後的積分週期T2-1中,畫素群PG2的畫素P6的電荷信號通過資料線D2流出,且畫素P6的電荷 信號在連接到資料線D2的電荷放大器CA2中積聚和放大(積分)。因此,在積分週期T2-1中,電荷放大器CA2將畫素P6的電荷信號與畫素P4、P5的先前積聚和放大(積分)的電荷信號相加。接著,畫素P4到P6的所組合的電荷信號保持在抽樣保持電路97C中,且,隨著積分週期T2-1逝去,抽樣結束。Therefore, as illustrated in (8) of FIG. 11, in the integration period T2-1 after the period of the integration period T1-1 has elapsed, the charge signal of the pixel P6 of the pixel group PG2 flows out through the data line D2, and Pixel P6 charge The signal is accumulated and amplified (integrated) in the charge amplifier CA2 connected to the data line D2. Therefore, in the integration period T2-1, the charge amplifier CA2 adds the charge signal of the pixel P6 to the previously accumulated and amplified (integrated) charge signals of the pixels P4, P5. Next, the combined charge signals of the pixels P4 to P6 are held in the sample-and-hold circuit 97C, and the sampling ends as the integration period T2-1 elapses.
如上文所述,當由第九掃描線G9-1輸出接通信號且由第八掃描線G8-1輸出接通信號時,與畫素群PG1、PG2的情況類似,在從畫素群PG1、PG2的畫素在列方向上延伸的多個其他畫素中,將3個特定畫素的所組合的電荷信號輸出到資料線。As described above, when the ON signal is outputted by the ninth scanning line G9-1 and the ON signal is output by the eighth scanning line G8-1, similarly to the case of the pixel groups PG1, PG2, in the pixel group PG1 Among the plurality of other pixels in which the pixels of PG2 extend in the column direction, the combined charge signals of the three specific pixels are output to the data line.
控制部150繼續上文的處理,且針對在行方向上與畫素群PG1、PG2等鄰近的畫素群(在圖10中所說明的實例中,畫素群PG3、PG4)執行合併處理。即,如圖11的(5)和(6)中所說明,控制部150向電荷放大器CA1、CA2發送重置信號,以便使這些放大器的電容器中已積聚的電荷放電(重置)。如圖11的(3)中所說明,控制部150控制掃描信號控制部435b,以便使用第九掃描線G9-2輸出掃描信號(接通信號)。由此接通畫素群PG3的3個個別畫素P7到P9的TFT開關4b,在輻射檢測元件410中組合畫素P7到P9的每個電荷存儲電容器5中積聚的電荷的電荷信號,且3個畫素(P7到P9)的所組合的電荷信號在資料線D1中流出。The control section 150 continues the above processing, and performs a merge process for the pixel groups adjacent to the pixel groups PG1, PG2, and the like in the row direction (in the example illustrated in FIG. 10, the pixel groups PG3, PG4). That is, as explained in (5) and (6) of FIG. 11, the control section 150 transmits a reset signal to the charge amplifiers CA1, CA2 to discharge (reset) the accumulated charges in the capacitors of these amplifiers. As explained in (3) of FIG. 11, the control section 150 controls the scan signal control section 435b to output a scan signal (on signal) using the ninth scan line G9-2. Thereby, the TFT switches 4b of the three individual pixels P7 to P9 of the pixel group PG3 are turned on, and the charge signals of the charges accumulated in each of the charge storage capacitors 5 of the pixels P7 to P9 are combined in the radiation detecting element 410, and The combined charge signals of the three pixels (P7 to P9) flow out in the data line D1.
3個畫素的所組合的電荷信號在積分週期T1-2期間由 電荷放大器CA1放大,如圖11的(7)中所說明,且由抽樣保持電路97B保持。隨著積分週期T1-2逝去,電荷信號的抽樣結束。The combined charge signal of the three pixels is during the integration period T1-2 The charge amplifier CA1 is amplified as illustrated in (7) of FIG. 11 and held by the sample hold circuit 97B. As the integration period T1-2 elapses, the sampling of the charge signal ends.
當由第九掃描線G9-2輸出接通信號時,接通畫素群4的畫素P10、P11中的TFT開關4b,且畫素P10、P11中所積聚的電荷的所組合的電荷信號在資料線D2中流出。所組合的電荷信號由電荷放大器CA2放大歷時了:在積分週期T2-2內與積分週期T1-2相等的時段,如圖11的(8)中所說明,且保持在抽樣保持電路97C中。同樣在此情況下,當來自第九掃描線G9-2的輸出信號變為切斷時,控制部150結束積分週期T1-2,但是積分週期T2-2並未結束,且電荷信號可繼續在電荷放大器CA2中積聚和放大(積分)的狀態繼續。When the ON signal is outputted from the ninth scanning line G9-2, the TFTs 4b in the pixels P10 and P11 of the pixel group 4 are turned on, and the combined charge signals of the charges accumulated in the pixels P10 and P11 are turned on. Flow out in data line D2. The combined charge signal is amplified by the charge amplifier CA2 for a period of time equal to the integration period T1-2 during the integration period T2-2, as illustrated in (8) of FIG. 11, and held in the sample-and-hold circuit 97C. Also in this case, when the output signal from the ninth scanning line G9-2 becomes off, the control section 150 ends the integration period T1-2, but the integration period T2-2 does not end, and the charge signal can continue at The state of accumulation and amplification (integration) in the charge amplifier CA2 continues.
在來自第九掃描線G9-2的輸出信號變為切斷之後,如圖11的(4)中所說明,接通來自第八掃描線G8-3的輸出信號。由此接通對應於第八掃描線G8-3的畫素列的畫素中的TFT開關4a。當發生這一情況時,如上文所述,電荷放大器CA1不處在操作狀態中,然而電荷放大器CA2維持在能夠積聚和放大(積分)電荷信號的狀態中。應注意,如上文所述,在視訊成像模式中(合併驅動期間)信號不在資料線D3中流動。因此,如圖11的(9)中所說明,在合併驅動期間,電荷放大器CA3持續處在非操作狀態中。After the output signal from the ninth scanning line G9-2 becomes off, as illustrated in (4) of FIG. 11, the output signal from the eighth scanning line G8-3 is turned on. Thereby, the TFT switch 4a in the pixel corresponding to the pixel column of the eighth scanning line G8-3 is turned on. When this occurs, as described above, the charge amplifier CA1 is not in the operating state, but the charge amplifier CA2 is maintained in a state capable of accumulating and amplifying (integrating) the charge signal. It should be noted that, as described above, the signal does not flow in the data line D3 in the video imaging mode (during the combined driving). Therefore, as explained in (9) of FIG. 11, during the merge driving, the charge amplifier CA3 continues to be in the non-operation state.
因此,如圖11的(8)中所說明,對於積分週期T2-2 中積分週期T1-2已逝去之後的時段而言,畫素群PG4的畫素P12的電荷信號在資料線D2中流動,且畫素P12的電荷信號在連接到資料線D2的電荷放大器CA2中積聚和放大(積分)。因此,在電荷放大器CA2中,在積分週期T2-2期間,畫素P12的電荷信號與先前在電荷放大器CA2中積聚和放大(積分)的畫素P10、P11的電荷信號相加。接著,畫素P10到P12的所組合的電荷信號保持在抽樣保持電路97C中,且隨著積分週期T2-2逝去,抽樣結束。Therefore, as explained in (8) of FIG. 11, for the integration period T2-2 In the period after the integration period T1-2 has elapsed, the charge signal of the pixel P12 of the pixel group PG4 flows in the data line D2, and the charge signal of the pixel P12 is in the charge amplifier CA2 connected to the data line D2. Accumulation and amplification (integration). Therefore, in the charge amplifier CA2, during the integration period T2-2, the charge signal of the pixel P12 is added to the charge signals of the pixels P10, P11 which were previously accumulated and amplified (integrated) in the charge amplifier CA2. Next, the combined charge signals of the pixels P10 to P12 are held in the sample-and-hold circuit 97C, and the sampling ends as the integration period T2-2 elapses.
當由第九掃描線G9-2和第八掃描線G8-3輸出接通信號時,與畫素群PG3、PG4的情況類似,將3個特定畫素的所組合的電荷信號從多個其他畫素輸出到資料線,所述多個其他畫素從畫素群PG3、PG4在列方向上延伸。When the ON signal is output from the ninth scanning line G9-2 and the eighth scanning line G8-3, similarly to the case of the pixel groups PG3, PG4, the combined charge signals of the three specific pixels are from a plurality of other The pixels are output to the data line, and the plurality of other pixels extend in the column direction from the pixel groups PG3 and PG4.
通過控制部150驅動抽樣保持電路97A到97D歷時特定時段,已由可變增益電荷放大器CA1到CA3放大的電信號的信號電平被保持在所述抽樣保持電路中。分別保持在個別抽樣保持電路中的電荷信號,在由多工器98按順序選擇之後,被A/D轉換器99轉換為數位圖像數據。應注意,從A/D轉換器99輸出的數位圖像數據按順序存儲在圖像記憶體90中。例如,圖像記憶體90將多個幀的所成像的射線照相圖像作為數位圖像數據來存儲。The signal level of the electric signal that has been amplified by the variable gain charge amplifiers CA1 to CA3 is held in the sample hold circuit by the control section 150 driving the sample hold circuits 97A to 97D for a certain period of time. The charge signals respectively held in the individual sample-and-hold circuits are converted into digital image data by the A/D converter 99 after being sequentially selected by the multiplexer 98. It should be noted that the digital image data output from the A/D converter 99 is sequentially stored in the image memory 90. For example, the image memory 90 stores the imaged radiographic image of a plurality of frames as digital image data.
應注意,雖然圖10中未說明,但當由第九掃描線G9-1、G9-2輸出接通信號時,與畫素群PG1、PG2的情況類似,將3畫素單元中所求和的電荷信號從多個其他畫素輸出到資料線,所述多個其他畫素從畫素群PG1、PG2在 列方向上延伸。It should be noted that although not illustrated in FIG. 10, when the ON signal is outputted from the ninth scanning lines G9-1, G9-2, similarly to the case of the pixel groups PG1, PG2, the summation in the 3 pixel units is performed. The charge signal is output from a plurality of other pixels to the data line, and the plurality of other pixels are from the pixel groups PG1, PG2 Extends in the column direction.
因而,在視訊成像模式中,在由配置輻射檢測元件410的多個畫素中的3個預先指定的畫素的畫素束配置而成的相應的多個畫素群中,組合(合併)3個個別畫素中所積聚的電荷,且將對應於通過合併而組合的電荷的電荷信號輸出到資料線。接著,在控制第九掃描線G9之後,通過從圖10的第八掃描線G8中的奇數掃描線(G8-1、G8-3等)輸出接通信號,已獲得2個畫素的所組合的電荷信號的畫素群中的、剩餘單個畫素的電荷信號在資料線中流動。在視訊成像模式中,從第八掃描線G8中的偶數掃描線(G8-2、G8-4等)持續輸出切斷信號。Therefore, in the video imaging mode, in the corresponding plurality of pixel groups configured by the pixel bundles of the three pre-specified pixels of the plurality of pixels in which the radiation detecting element 410 is disposed, the combination (merging) The charge accumulated in the three individual pixels, and the charge signal corresponding to the charge combined by the combination is output to the data line. Next, after the ninth scanning line G9 is controlled, the combination of the two pixels has been obtained by outputting the ON signal from the odd scanning lines (G8-1, G8-3, etc.) in the eighth scanning line G8 of FIG. The charge signal of the remaining single pixels in the pixel group of the charge signal flows in the data line. In the video imaging mode, the cut-off signal is continuously output from the even-numbered scanning lines (G8-2, G8-4, etc.) in the eighth scanning line G8.
因此,在根據本示範性實施例的輻射檢測器中,通過使用相同電荷放大器將配置每個畫素群的3個畫素的2個畫素的電荷信號、以及利用了經移位的積分時序的剩餘1個畫素的電荷信號相加在一起並組合,來針對特定畫素群的畫素(PG2、PG4等)執行3畫素合併處理。Therefore, in the radiation detector according to the present exemplary embodiment, the charge signals of the two pixels of the three pixels of each pixel group are configured by using the same charge amplifier, and the shifted integration timing is utilized. The charge signals of the remaining one pixel are added together and combined to perform a three-pixel merging process for the pixels of the specific pixel group (PG2, PG4, etc.).
應注意,同樣在根據本示範性實施例的輻射檢測器442的視訊成像模式中,與在根據圖8中所說明的第三示範性實施例的輻射檢測器342中類似,將由3個畫素配置而成的畫素群中的一個畫素群的重心作為中心,通過將其他畫素群的重心連接在一起來形成正六角形,且這些畫素群重心間的距離在6個方向上彼此全部相等。因而,在本示範性實施例中,合併前後,可在水平、垂直和對角線方向中的每個方向上確保均勻解析度。因而,在本示範性實 施例中,可在合併之後抑制畫素位置(畫素群的重心位置)的不均勻,從而使得在相應方向中的每個方向上能夠確保均勻解析度(類似於在合併之前的圖像中)。It should be noted that also in the video imaging mode of the radiation detector 442 according to the present exemplary embodiment, similarly to the radiation detector 342 according to the third exemplary embodiment illustrated in FIG. 8, three pixels will be used. The center of gravity of one pixel group in the configured pixel group is centered, and the hexagons are formed by connecting the centers of gravity of other pixel groups, and the distance between the centers of gravity of these pixel groups is mutually exclusive in six directions. equal. Thus, in the present exemplary embodiment, uniform resolution can be ensured in each of the horizontal, vertical, and diagonal directions before and after merging. Thus, in this exemplary reality In the embodiment, the unevenness of the pixel position (the position of the center of gravity of the pixel group) can be suppressed after the combination, so that the uniform resolution can be ensured in each of the corresponding directions (similar to the image before the merge). ).
因而在本示範性實施例中,由於合併之前所排列的重心以及合併之後所排列的重心,兩者都處在重心所形成的六角形區域排列為蜂巢形圖案的狀態下,因此,在合併之後執行畫素密度轉換時,可使用類似於未進行合併的情況下、執行畫素密度轉換時所使用的算法來執行處理。因此,用於畫素密度轉換處理的算法可為合併前和合併後兩種情況下都通用的,而不用準備用於合併後進行畫素密度轉換處理的獨立算法。Therefore, in the present exemplary embodiment, since the center of gravity arranged before the merging and the center of gravity arranged after the merging are both in a state in which the hexagonal regions formed by the center of gravity are arranged in a honeycomb pattern, therefore, after the merging When performing pixel density conversion, processing can be performed using an algorithm similar to that used when performing pixel density conversion without merging. Therefore, the algorithm for pixel density conversion processing can be used for both pre-merging and post-merging cases without preparing an independent algorithm for performing pixel density conversion processing after merging.
在本示範性實施例中,對於輻射檢測器442中,各自由具有排列為蜂巢形圖案的六角形畫素區域的多個畫素中的3個畫素配置而成的、相應預定多個畫素群中的每個畫素群而言,通過同時讀取和組合輻射檢測器442的輻射檢測元件410中的3個畫素的電荷來執行合併處理。另外,通過使用相同電荷放大器,將配置畫素群中的每個畫素群的3個畫素的2個畫素的電荷信號、以及利用了經移位的積分時序的剩餘1個畫素的電荷信號相加在一起,來針對特定畫素群執行3畫素的合併處理。因此,在本示範性實施例中,S/N可通過增加所收集的電荷量而提高,且可實現在需要高幀率的視訊成像模式中的應用、以及在通過輻照少量輻射而產生的低敏感性圖像中的應用。In the present exemplary embodiment, for the radiation detector 442, each of the plurality of pixels having a hexagonal pixel region arranged in a honeycomb pattern is configured to be a predetermined plurality of pictures. For each pixel group in the prime group, the merging process is performed by simultaneously reading and combining the charges of the three pixels in the radiation detecting element 410 of the radiation detector 442. In addition, by using the same charge amplifier, the charge signals of the two pixels of the three pixels of each pixel group in the pixel group and the remaining one pixel using the shifted integration timing are arranged. The charge signals are added together to perform a combination of 3 pixels for a particular pixel group. Therefore, in the present exemplary embodiment, S/N can be improved by increasing the amount of charge collected, and can be applied in a video imaging mode requiring a high frame rate, and generated by irradiating a small amount of radiation. Application in low sensitivity images.
另外,確定每個畫素群中的每個畫素的組合,以使得 多個六角形區域排列為蜂巢形圖案。通過包含畫素群的輪廓所環繞的區域內部的1個重心、以及連接位於所述1個重心外圍的6個個別重心的線段,而形成所述多個六角形區域中的每個六角形區域。因此,可抑制合併之後,在水平、垂直和對角線方向中的每個方向上的畫素位置(當將多個畫素作為單個畫素叢來處理時,為重心位置)的不均勻,且可在相應方向中的每個方向上確保均勻解析度(類似於在合併之前圖像中)。因此,在合併前後,通用積體電路(IC)可用於畫素密度轉換。In addition, determine the combination of each pixel in each pixel group so that A plurality of hexagonal regions are arranged in a honeycomb pattern. Each hexagonal region of the plurality of hexagonal regions is formed by a center of gravity inside an area surrounded by a contour including a pixel group, and a line segment connecting six individual centers of gravity located at a periphery of the one center of gravity . Therefore, unevenness of the pixel position (the center of gravity position when a plurality of pixels are treated as a single pixel cluster) in each of the horizontal, vertical, and diagonal directions after the merging can be suppressed, And uniform resolution can be ensured in each of the corresponding directions (similar to in the image before merging). Therefore, the general integrated circuit (IC) can be used for pixel density conversion before and after the combination.
另外,當執行視訊成像時,通過將由3個相應畫素配置而成的每個畫素群作為單個畫素處理來獲得電荷,且通過組合配置每個畫素群中的每個畫素中所積聚的電荷來執行合併處理。因此,儘管解析度低於用於靜態圖像的解析度,但是可在靜態成像模式中達到用於從每個畫素列讀取電荷的幀率的2倍(1/2的幀持續時間)的幀率。另外,相比於為經歷合併的每個畫素提供一條掃描線G9的情況,掃描線G9的數量可減少為經歷合併的畫素列的數量的1/2。即,相比於根據圖8中所說明的第三示範性實施例的輻射檢測器342,掃描線G的數量可大大減少。另外,在圖10中所說明的輻射檢測器442的配置中,相比於未執行合併時所需要的5條掃描線G8,掃描畫素(包含伴隨著合併而執行掃描)所需要的掃描線的總數量在之前是5條線的兩倍,即10條線。然而,在本示範性實施例中僅需要7條線。In addition, when performing video imaging, a charge is obtained by treating each pixel group configured by three corresponding pixels as a single pixel, and each pixel in each pixel group is configured by combination. The accumulated charge is used to perform the merge process. Therefore, although the resolution is lower than that for the still image, the frame rate for reading the charge from each pixel column can be doubled in the static imaging mode (1/2 frame duration) Frame rate. In addition, the number of scanning lines G9 can be reduced to 1/2 of the number of pixel columns undergoing merging, as compared with the case where one scanning line G9 is provided for each pixel undergoing merging. That is, the number of scanning lines G can be greatly reduced as compared with the radiation detector 342 according to the third exemplary embodiment illustrated in FIG. In addition, in the configuration of the radiation detector 442 illustrated in FIG. 10, the scanning pixels required for scanning pixels (including scanning performed with merging) are compared with the five scanning lines G8 required when the merging is not performed. The total number is twice as long as 5 lines, that is, 10 lines. However, only 7 lines are required in the present exemplary embodiment.
在每個上文示範性實施例中,輻射檢測元件410的六角形畫素可包含正六角形畫素,以及具有斜角的實質上六角形畫素。另外,也可包含,例如在圖2頁面的上下方向上被壓扁的扁平六角形畫素,以及在平面圖上觀看時實質上六角形畫素。即,可使用具有形成為扁平狀的六角形畫素區域的畫素進行配置,以使得穿過每個畫素中心的3條對角線中的一條對角線比另外兩條對角線短,且所述另外兩條對角線長度彼此相等。因而,儘管使用了扁平六角形的畫素,在合併處理前後,也可維持重心間隔與六個水平、垂直和對角線方向的關係。In each of the above exemplary embodiments, the hexagonal pixels of the radiation detecting element 410 may include a regular hexagonal pixel, and a substantially hexagonal pixel having an oblique angle. In addition, it may include, for example, a flat hexagonal pixel that is flattened in the up and down direction of the page of FIG. 2, and a substantially hexagonal pixel when viewed in a plan view. That is, a pixel having a hexagonal pixel region formed in a flat shape may be used such that one of the three diagonal lines passing through the center of each pixel is shorter than the other two diagonals And the other two diagonal lengths are equal to each other. Thus, despite the use of flat hexagonal pixels, the relationship between the center of gravity spacing and the six horizontal, vertical, and diagonal directions can be maintained before and after the merging process.
在上文示範性實施例中的每個示範性實施例中,給出了對於本發明應用於直接轉換型輻射檢測器410的情況的解釋,所述直接轉換型輻射檢測器在光電轉換層中使用了:吸收輻射並將所述輻射轉換為電荷的例如非晶硒的輻射-電荷轉換材料。然而,本發明不限於此。例如,本發明也可應用於間接轉換型輻射檢測器,所述間接轉換型輻射檢測器配備有:將所輻照的輻射轉換為可見光的閃爍體。In each of the above exemplary embodiments, an explanation is given of a case where the present invention is applied to a direct conversion type radiation detector 410 in a photoelectric conversion layer A radiation-charge conversion material such as amorphous selenium that absorbs radiation and converts the radiation into a charge is used. However, the invention is not limited thereto. For example, the present invention is also applicable to an indirect conversion type radiation detector equipped with a scintillator that converts the irradiated radiation into visible light.
圖12說明應用於間接轉換型輻射檢測器的第一示範性實施例的輻射檢測器42的簡化實例。圖13說明應用於間接轉換型輻射檢測器的第三示範性實施例的輻射檢測器342的簡化實例。應注意,圖12和圖13中所說明的間接轉換型輻射檢測器的操作,分別與第一示範性實施例的輻射檢測器和第三示範性實施例的輻射檢測器的操作類似,且因此省略其解釋。Figure 12 illustrates a simplified example of a radiation detector 42 applied to a first exemplary embodiment of an indirect conversion type radiation detector. Figure 13 illustrates a simplified example of a radiation detector 342 of a third exemplary embodiment applied to an indirect conversion type radiation detector. It should be noted that the operations of the indirect conversion type radiation detectors illustrated in FIGS. 12 and 13 are similar to those of the radiation detectors of the first exemplary embodiment and the radiation detectors of the third exemplary embodiment, respectively, and thus Omit the explanation.
在每個上文示範性實施例中,已揭露公用接地線30設置在絕緣基板1上的情況。然而,不限於此。例如,公用接地線30可設置在作為畫素電極的下電極11下方的任何層中,所述畫素電極收集在光電轉換層6中產生的電荷。在此情況下,可防止公用接地線30降低輻照到感測器部分103上的輻射的輻照效率。In each of the above exemplary embodiments, the case where the common ground line 30 is disposed on the insulating substrate 1 has been disclosed. However, it is not limited to this. For example, the common ground line 30 may be disposed in any layer below the lower electrode 11 as a pixel electrode that collects charges generated in the photoelectric conversion layer 6. In this case, the common ground line 30 can be prevented from reducing the irradiation efficiency of the radiation irradiated onto the sensor portion 103.
在第二示範性實施例和第四示範性實施例中,已描述掃描信號控制部(35a與35b、或435a與435b)分別沿著行方向設置在輻射檢測器(142與442)的輻射檢測元件(110與410)的多條邊的情況。然而,掃描信號控制部的佈置不限制於此。例如,在***造影術應用中,掃描信號控制部(35a與35b、或435a與435b)可沿行方向提供在輻射檢測元件(110與410)的一條邊處,而所述元件的另一條邊沿行方向設置在對象的胸壁側。在此等情況下,在層狀結構(雙層)中可將兩個通用閘極IC用作掃描信號控制部(35a與35b、或435a與435b),其中掃描線G分別從所述掃描信號控制部延伸,或者掃描線從單個定製(custom)的閘極IC延伸。In the second exemplary embodiment and the fourth exemplary embodiment, the radiation detection by the scanning signal control sections (35a and 35b, or 435a and 435b) respectively disposed in the radiation detectors (142 and 442) in the row direction has been described. The case of multiple sides of components (110 and 410). However, the arrangement of the scan signal control section is not limited thereto. For example, in a mammography application, scan signal control portions (35a and 35b, or 435a and 435b) may be provided at one edge of the radiation detecting elements (110 and 410) in the row direction, and the other edge of the element The row direction is set on the chest wall side of the object. In these cases, two general-purpose gate ICs can be used as the scanning signal control sections (35a and 35b, or 435a and 435b) in the layered structure (double layer), wherein the scanning lines G are respectively from the scanning signals The control extends, or the scan lines extend from a single custom gate IC.
關於示範性實施例的具體說明如下,其中,每個上述的示範性實施例的輻射檢測器(42、142、342、442)被應用於***造影術(mammography)中,所述***造影術是藉由斷層合成成像(tomosynthesis imaging)來執行。A detailed description regarding an exemplary embodiment is as follows, wherein the radiation detectors (42, 142, 342, 442) of each of the above-described exemplary embodiments are applied to mammography, which is Performed by tomosynthesis imaging.
圖14為說明目前的示範性實施例中、應用於***造 影術的成像裝置41的配置的示意配置圖。圖15為說明在成像時,目前的示範性實施例的成像裝置41的配置的配置圖。圖16為解釋在成像時,目前的示範性實施例的成像裝置41的解釋圖。Figure 14 is a diagram showing the application to the breast in the present exemplary embodiment. A schematic configuration diagram of the configuration of the imaging device 41 of the shadow. Fig. 15 is a configuration diagram illustrating the configuration of the imaging device 41 of the present exemplary embodiment at the time of imaging. Fig. 16 is an explanatory diagram for explaining the imaging device 41 of the present exemplary embodiment at the time of imaging.
如圖14到圖16所繪示,目前示範性實施例的所述成像裝置41是以下的裝置:當主體W以直立姿態站立時,對於主體W的***N以輻射(例如X射線)進行成像。注意到,在下文中,在成像期間,當主體W面對成像裝置41,靠近主體W的前側是被稱為成像裝置41的”裝置前側”;且當主體W面對成像裝置41,位於遠離主體W的遠側是被稱為成像裝置41的”裝置後側”。再者,在所述說明中,當主體W面對成像裝置41,主體W的左-右方向是被稱為成像裝置41的”裝置左-右方向”(請參照圖14到圖16的每一個箭頭)。As shown in FIGS. 14 to 16, the imaging device 41 of the present exemplary embodiment is a device that images the breast N of the subject W with radiation (for example, X-rays) when the body W stands in an upright posture. . Note that, hereinafter, during imaging, when the main body W faces the imaging device 41, the front side close to the main body W is the "device front side" referred to as the imaging device 41; and when the main body W faces the imaging device 41, is located away from the main body The far side of W is the "device rear side" called the imaging device 41. Furthermore, in the above description, when the main body W faces the imaging device 41, the left-right direction of the main body W is the "device left-right direction" called the imaging device 41 (please refer to each of FIGS. 14 to 16). An arrow).
如圖14所示,所述成像裝置41包括:測量部(measurement section)500,被提供到所述裝置前側,且側視時實質上為C形狀;以及基座台部(base stand section)502,從所述裝置背側而支撐所述測量部500。As shown in FIG. 14, the imaging device 41 includes a measurement section 500 provided to the front side of the apparatus and substantially C-shaped when viewed from the side; and a base stand section 502 The measuring portion 500 is supported from the back side of the device.
測量部500包括:成像台(imaging table)510,形成有平面形狀的成像表面512用以和呈直立姿態站立的主體W的***N接觸;押壓板(pressing plate)514,用以在押壓板514和成像台510的成像表面512之間押壓所述***N;以及保持部506(holder section),支撐所述成像台510與所述押壓板514。The measuring portion 500 includes an imaging table 510 formed with a planar shaped imaging surface 512 for contacting the breast N of the body W standing in an upright posture, and a pressing plate 514 for pressing the pressing plate 514 and The breast N is pressed between the imaging surfaces 512 of the imaging table 510; and a holder section 506 supports the imaging table 510 and the pressing plate 514.
測量部500被提供有:例如為管的輻射源31;輻射輻照部24,用以從輻射源31朝向成像表面512而輻照輻射以進行探測;以及支撐部507(support section),與保持部506為分離,且支撐部507支撐所述輻射輻照部24。The measuring portion 500 is provided with: a radiation source 31 such as a tube; a radiation irradiation portion 24 for irradiating radiation from the radiation source 31 toward the imaging surface 512 for detection; and a support portion 507, and holding The portion 506 is separated, and the support portion 507 supports the radiation irradiating portion 24.
旋轉軸504由基座台部502所支撐以致於能夠進行旋轉,所述旋轉軸504被提供到測量部500。旋轉軸504被固定到支撐部507,以致於旋轉軸504與支撐部507如同一體進行旋轉。The rotating shaft 504 is supported by the base table portion 502 so as to be rotatable, and the rotating shaft 504 is supplied to the measuring portion 500. The rotating shaft 504 is fixed to the support portion 507 such that the rotating shaft 504 rotates integrally with the supporting portion 507.
旋轉軸504能夠在:耦接到保持部506且與保持部506如同一體進行旋轉的狀態、和旋轉軸504為分離且自由地旋轉的狀態之間進行切換。特別是,將齒輪分別地提供到旋轉軸504和保持部506,所述齒輪被配置成能夠在彼此為嚙合狀態(meshed state)、與非嚙合狀態(unmeshed state)之間進行切換。注意到,能夠使用各種機械元件來達成:旋轉軸504的旋轉力的傳輸與非傳輸之間的切換。The rotating shaft 504 can be switched between a state in which it is coupled to the holding portion 506 and rotates integrally with the holding portion 506, and a state in which the rotating shaft 504 is separated and freely rotated. In particular, the gears are separately supplied to the rotating shaft 504 and the holding portion 506 which are configured to be switchable between a meshed state and an unmeshed state. It is noted that various mechanical components can be used to achieve the switching between the transmission of the rotational force of the rotating shaft 504 and the non-transmission.
保持部506支撐成像台510與輻射輻照部24,以致於成像表面512與輻射輻照部24以特定間距(specific separation)而彼此分離,且可滑動地保持押壓板514以致於押壓板514與成像表面512之間的間距為可變動。注意到,目前的示範性實施例是配置成:押壓板514的位置(押壓板514與成像表面512之間的間距)是可檢測的。例如,傳感器(sensor)(未顯示於圖中)可被提供到押壓板514的滑動機制(sliding mechanism),且押壓板514的位置是由所述傳感器來檢測。在目前示範性實施例中採用所述配 置,使得由押壓板514所押壓的***N的厚度能夠被檢測。The holding portion 506 supports the imaging table 510 and the radiation irradiating portion 24 such that the imaging surface 512 and the radiation irradiating portion 24 are separated from each other by a specific separation, and slidably holds the pressing plate 514 so that the pressing plate 514 is The spacing between imaging surfaces 512 is variable. It is noted that the present exemplary embodiment is configured such that the position of the pressing plate 514 (the spacing between the pressing plate 514 and the imaging surface 512) is detectable. For example, a sensor (not shown) may be provided to the sliding mechanism of the pressing plate 514, and the position of the pressing plate 514 is detected by the sensor. Adopting the match in the current exemplary embodiment The thickness of the breast N pressed by the pressing plate 514 can be detected.
從輻射透射率(transmissivity)與強度的觀點,與***N接觸的成像面512例如是由碳複合材料(carbon composite)所形成。輻射檢測器542設置在成像台510內,輻射被輻照而通過***N,且成像表面512被輻射檢測器542所檢測。注意到,目前示範性實施例中的輻射檢測器542可以是上述示範性實施例的任一個輻射檢測器(42、142、342、442),且可以根據所述成像而由使用者進行選擇(改變)。From the viewpoint of radiation transmissivity and strength, the imaging surface 512 that is in contact with the breast N is formed, for example, of a carbon composite. Radiation detector 542 is disposed within imaging station 510, radiation is irradiated through breast N, and imaging surface 512 is detected by radiation detector 542. It is noted that the radiation detector 542 in the present exemplary embodiment may be any of the radiation detectors (42, 142, 342, 442) of the above-described exemplary embodiments, and may be selected by the user according to the imaging ( change).
目前示範性實施例的成像裝置41是以下的裝置:相對於作為成像主體的***N而能夠執行從多個方向的成像。圖15與圖16分別地說明在成像期間的成像裝置41的方位,且在成像期間的輻射輻照部24的位置。如圖15與圖16所示,以支撐部507傾斜來執行成像。The imaging device 41 of the present exemplary embodiment is a device capable of performing imaging from a plurality of directions with respect to the breast N as an imaging subject. 15 and 16 respectively illustrate the orientation of the imaging device 41 during imaging, and the position of the radiation irradiation portion 24 during imaging. As shown in FIG. 15 and FIG. 16, imaging is performed with the support portion 507 tilted.
在成像裝置41中,如圖16所示,當相對於***N而從多個方向執行成像(斷層合成成像)時,旋轉軸504相對於保持部506而自由旋轉,且只有輻射輻照部24以圓弧狀移動,這是由支撐部507旋轉、且沒有成像台510或押壓板514的移動而導致。在斷層合成成像中,如圖16所繪示,成像位置是從角度α每次以特定角度θ而移動,且執行成像的輻射輻照部24的位置是位在N個位置P1到PN。In the imaging device 41, as shown in FIG. 16, when imaging (tomographic imaging) is performed from a plurality of directions with respect to the breast N, the rotating shaft 504 is freely rotated with respect to the holding portion 506, and only the radiation irradiating portion 24 is provided. The movement is performed in an arc shape, which is caused by the rotation of the support portion 507 without the movement of the imaging table 510 or the pressing plate 514. In tomosynthesis imaging, as illustrated in Fig. 16, the imaging position is moved from the angle α every time at a specific angle θ, and the position of the radiation irradiation portion 24 performing imaging is located at N positions P1 to PN.
在目前的示範性實施例中,作為特定的例子,提供診斷模式(diagnosis mode)與成像模式(imaging mode)來作為多個成像模式,這些可由使用者如醫生來選擇。所述 診斷模式是以下的模式,其中,使用者執行成像主體的粗糙成像(rough imaging)以作為診斷目的或進行診斷。作為特定的例子,在目前的示範性實施例中,以1度的特定角度在-10度到+10度的範圍內執行成像。所述成像模式是以下的模式,即:以比所述診斷模式的成像更高的清晰度(definition)來執行成像。作為特定的例子,在目前的示範性實施例中,以1度的特定角度在-20度到+20度的範圍內執行成像。因此,在目前的示範性實施例中,當執行成像以獲取高清晰度圖像時,藉由在大範圍角度的擺動(swinging)以增加數據的體積(圖像數據體積,image data volume),而執行成像。In the present exemplary embodiment, as a specific example, a diagnosis mode and an imaging mode are provided as a plurality of imaging modes, which can be selected by a user such as a doctor. Said The diagnostic mode is a mode in which a user performs rough imaging of an imaging subject for diagnostic purposes or for diagnosis. As a specific example, in the present exemplary embodiment, imaging is performed in a range of -10 degrees to +10 degrees at a specific angle of 1 degree. The imaging mode is a mode in which imaging is performed with a higher definition than imaging of the diagnostic mode. As a specific example, in the present exemplary embodiment, imaging is performed in a range of -20 degrees to +20 degrees at a specific angle of 1 degree. Therefore, in the present exemplary embodiment, when imaging is performed to acquire a high-definition image, the volume of data (image data volume) is increased by swinging at a wide range of angles, And performing imaging.
接下來解釋關於目前示範性實施例的成像裝置41的操作。圖17為說明根據目前示範性實施例的,進行圖像成像的處理順序的流程圖。當執行成像時,根據成像裝置41內的成像菜單(imaging menu)而執行成像。當成像裝置41被輸入成像指示以執行頭尾(Cranial與Caudal,CC)成像時,保持部506的方位被調整以致於成像表面512是面向上的狀態,且支撐部507的方位被調整以致於輻射輻照部24位於成像表面512的上方。當指示是用於斜位向(Mediolateral-Oblique,MLO)成像時,成像台510以特定角度旋轉,且保持部506的方位被調整以使押壓板514傾斜。Next, the operation of the imaging device 41 relating to the present exemplary embodiment will be explained. FIG. 17 is a flowchart illustrating a processing sequence of performing image imaging according to the current exemplary embodiment. When imaging is performed, imaging is performed in accordance with an imaging menu in the imaging device 41. When the imaging device 41 is input with an imaging indication to perform head and tail (Cranial and Caudal, CC) imaging, the orientation of the holding portion 506 is adjusted such that the imaging surface 512 is in an upwardly facing state, and the orientation of the support portion 507 is adjusted so that The radiation irradiation portion 24 is located above the imaging surface 512. When the indication is for Mediolateral-Oblique (MLO) imaging, the imaging table 510 is rotated at a specific angle, and the orientation of the holding portion 506 is adjusted to tilt the pressing plate 514.
在圖17的步驟S200,無論是所述診斷模式或所述成像模式被設定。對於設定方法並沒有特定的限制,且當存 在數據來指示哪個模式被包含在成像菜單時,可基於成像菜單而進行上述設定。再者,當使用者使用例如操作面板44與操作輸入部54來進行指示時,可基於該指示而進行設定。In step S200 of Fig. 17, either the diagnosis mode or the imaging mode is set. There are no specific restrictions on the setting method, and When the data indicates which mode is included in the imaging menu, the above setting can be made based on the imaging menu. Further, when the user performs an instruction using, for example, the operation panel 44 and the operation input unit 54, the setting can be made based on the instruction.
使用者利用成像裝置41的成像表面512來接觸成像主體W的***N。當使用者給出操作指示而開始押壓的狀態,在接下來的步驟S202,成像裝置41移動該押壓板514以朝向成像表面512,進而押壓所述***N。The user uses the imaging surface 512 of the imaging device 41 to contact the breast N of the imaging subject W. When the user gives an operation instruction to start the pressing, in the next step S202, the image forming apparatus 41 moves the pressing plate 514 toward the imaging surface 512, thereby pressing the breast N.
當完成該***N的押壓時,使用者使用成像裝置41的操作面板44與圖像處理裝置50的操作輸入部54,進而指示成像開始。根據所述指示,圖像處理裝置50啟動成像裝置41而開始成像,從而使射線照相圖像進行成像。When the pressing of the breast N is completed, the user uses the operation panel 44 of the imaging device 41 and the operation input portion 54 of the image processing device 50, thereby instructing the start of imaging. In accordance with the instruction, the image processing device 50 activates the imaging device 41 to start imaging, thereby imaging the radiographic image.
在接下來的步驟S204,決定成像模式為:診斷模式或成像模式。對於決定方法並無特別的限制,且可基於步驟S200的設定來進行所述決定。In the next step S204, the imaging mode is determined to be: a diagnosis mode or an imaging mode. There is no particular limitation on the determination method, and the determination can be made based on the setting of step S200.
當所述模式為成像模式時,處理進行到步驟S206。在步驟S206,根據如上所述進行檢測的所述***N的厚度,來決定所述輻射量。由於到達輻射檢測器42(通過所述***N)的所述輻射量是根據***N的厚度而變化,在目前的示範性實施例中,預先決定***N的厚度與所輻照的輻射量之間的對應關係(correspondence relationship)。在步驟S206中,基於所述預定的關係,根據所述***N的厚度,而決定所輻照的輻射量。When the mode is the imaging mode, the process proceeds to step S206. In step S206, the amount of radiation is determined based on the thickness of the breast N detected as described above. Since the amount of radiation reaching the radiation detector 42 (through the breast N) varies according to the thickness of the breast N, in the present exemplary embodiment, the thickness of the breast N and the amount of radiation irradiated are predetermined. Correspondence relationship. In step S206, based on the predetermined relationship, the amount of radiation irradiated is determined according to the thickness of the breast N.
在接下來的步驟S208,基於成像角度範圍(imaging angle range)與特定角度,而決定用於成像的次數的數量。如上所述,在目前的示範性實施例中,作為一個特定的例子,在成像模式中的成像角度範圍是±20度且特定角度為1度,而獲取高清晰度圖像。個別的成像次數的數量相應地被決定為40次。In the next step S208, based on the imaging angle range (imaging Angle range) determines the number of times used for imaging with a specific angle. As described above, in the present exemplary embodiment, as a specific example, the imaging angle range in the imaging mode is ±20 degrees and the specific angle is 1 degree, and a high definition image is acquired. The number of individual imaging times is correspondingly determined to be 40 times.
在接下來的步驟S210中,支撐部507被移動到最大成像角度(在目前的示範性實施例中的位於左方的20度),且輻射輻照部24移動。隨後,在接下來的步驟S212,從輻射輻照部24來使輻射被輻照,且使***N被成像。注意到,在所述成像中,所執行的成像類似於第一示範性實施例(參見圖5的步驟S104)的、以正常處理進行成像的成像處理。亦即,為了從每個相應的畫素20讀出電荷,一次一條線按順序輸出接通信號(ON signal)到掃描線(第一示範性實施例中的第一掃描線G1-0到G1-7)。累積在每個畫素20的電荷存儲電容器5的相應電荷信號對應地被讀取,且藉由正常處理而取得射線照相圖像。In the next step S210, the support portion 507 is moved to the maximum imaging angle (20 degrees to the left in the present exemplary embodiment), and the radiation irradiating portion 24 is moved. Subsequently, in the next step S212, the radiation is irradiated from the radiation irradiating portion 24, and the breast N is imaged. Note that in the imaging, the imaging performed is similar to the imaging processing of imaging in the normal processing of the first exemplary embodiment (see step S104 of FIG. 5). That is, in order to read out the charge from each of the corresponding pixels 20, the ON signal is sequentially output to the scanning line one line at a time (the first scanning lines G1-0 to G1 in the first exemplary embodiment) -7). The respective charge signals accumulated in the charge storage capacitor 5 of each pixel 20 are correspondingly read, and the radiographic image is taken by normal processing.
對於在步驟S208所決定的用於成像次數的數量,在接下來的步驟S214中作出是否已經完成成像的決定。當沒有完成時,決定為負面的(negative),且處理進入到步驟S216。在步驟216,以特定角度即1度將支撐部507移動到右方,且在所述處理隨後回到步驟S212之前使輻射輻照部24被移動,且重複目前的處理。然而,當對於次數的決定數量而言已經完成成像時,決定為肯定的(affirmative)且處理進入到步驟S218。For the number of imaging times determined in step S208, a decision is made as to whether or not imaging has been completed in the next step S214. When it is not completed, it is decided to be negative, and the process proceeds to step S216. At step 216, the support portion 507 is moved to the right at a specific angle, that is, 1 degree, and the radiation irradiating portion 24 is moved before the process returns to step S212, and the current process is repeated. However, when imaging has been completed for the determined number of times, the decision is affirmative and the process proceeds to step S218.
在步驟S218,所述成像的射線照相圖像(價值40次)是從輻射檢測器42而輸出到圖像處理裝置50。注意到,即使在目前的示範性實施例中,在成像已經完成之後,價值射線照相圖像的次數的全部數量是從輻射檢測器42而輸出,但並不限於此。可以進行以下配置,以致於每次成像完成後,使射線照相圖像從輻射檢測器42輸出。In step S218, the imaged radiographic image (worth 40 times) is output from the radiation detector 42 to the image processing device 50. Note that even in the present exemplary embodiment, the total number of times of the value radiographic image is output from the radiation detector 42 after the imaging has been completed, but is not limited thereto. The following configuration can be made such that the radiographic image is output from the radiation detector 42 after each imaging is completed.
在接下來的步驟S220,基於從輻射檢測器42所獲得的射線照相圖像,圖像處理裝置50重建斷層照相圖像。對於斷層照相圖像重建的規格(specification)並沒有特別的限制,且可根據已知的重建方法來執行斷層照相圖像的重建。注意到,在目前的示範性實施例中,根據所述模式,而預先決定斷層照相圖像的重建時的切片厚度(slice thickness)(斷層照相圖像的厚度)。在斷層合成成像時,一般而言,擺動的角度越大,在深度方向的分辨率(resolution)越高,並且,在深度方向能夠得到更多細節的數據。在目前的示範性實施例中,於成像模式中獲得更多細節的深度方向數據,這是由於:相較於在診斷模式中,於成像模式中以較大的角度進行擺動而成像。當相較於診斷模式、在成像模式中的成像使用較薄切片厚度時,據此而執行重建。注意到,在成像模式中的切片厚度可以比在診斷模式中的切片厚度還薄,並且,在目前示範性實施例中的特定厚度為:在成像模式中的0.5毫米(mm)、與在診斷模式中的1毫米(mm)。然而,並不特別限定於此,且,例如,可以根據所述成像角度來決定切片厚度。再者, 對於上述並無限制,且當切片厚度為使用者所指示時,可以根據使用者指示來決定切片厚度。At the next step S220, based on the radiographic image obtained from the radiation detector 42, the image processing device 50 reconstructs the tomographic image. The specification of the tomographic image reconstruction is not particularly limited, and the reconstruction of the tomographic image can be performed according to a known reconstruction method. Note that in the present exemplary embodiment, the slice thickness (thickness of the tomographic image) at the time of reconstruction of the tomographic image is determined in advance according to the mode. In tomosynthesis imaging, in general, the larger the angle of the wobble, the higher the resolution in the depth direction, and the more detailed data can be obtained in the depth direction. In the present exemplary embodiment, more detailed depth direction data is obtained in the imaging mode due to imaging compared to swinging at a larger angle in the imaging mode than in the diagnostic mode. When a thin slice thickness is used for imaging in the imaging mode compared to the diagnostic mode, reconstruction is performed accordingly. It is noted that the slice thickness in the imaging mode can be thinner than the slice thickness in the diagnostic mode, and the specific thickness in the present exemplary embodiment is: 0.5 mm (mm) in the imaging mode, and in diagnosis 1 mm (mm) in the mode. However, it is not particularly limited thereto, and, for example, the slice thickness may be determined according to the imaging angle. Furthermore, There is no limitation on the above, and when the slice thickness is indicated by the user, the slice thickness can be determined according to the user's instruction.
在接下來的步驟S222,在指示之後,所述重建的斷層照相圖像被顯示在圖像處理裝置50的顯示器52與顯示器件80的顯示部80A,而結束目前的處理。In the next step S222, after the instruction, the reconstructed tomographic image is displayed on the display 52 of the image processing apparatus 50 and the display portion 80A of the display device 80, and the current processing is ended.
然而,當在步驟S204決定為診斷模式時,處理進入到步驟S224。在步驟S224,根據***N的厚度而決定輻射量,類似於成像模式的步驟S206。然而,在診斷模式中,根據合併處理(binning process)的內容,用於成像的每次輻照的輻射量比在成像模式中還小,在成像模式中不執行合併處理。例如,當以四個畫素20作為畫素群而執行合併處理時,如同第一示範性實施例與第二示範性實施例,每一畫素群被當作單一畫素,當藉由執行正常處理而成像時的輻射量是1/4的輻射量,以致於每單一畫素的輻射量等同於當執行正常處理時。再者,當以三個畫素20作為畫素群而執行合併處理時,如同第三示範性實施例與第四示範性實施例,每一畫素群被當作單一畫素,當藉由執行正常處理而成像時的輻射量是1/3的輻射量,以致於每單一畫素的輻射量等同於當執行正常處理時。However, when it is decided to the diagnosis mode in step S204, the processing proceeds to step S224. In step S224, the amount of radiation is determined according to the thickness of the breast N, similar to step S206 of the imaging mode. However, in the diagnosis mode, according to the content of the binning process, the amount of radiation per irradiation for imaging is smaller than in the imaging mode, and the combining process is not performed in the imaging mode. For example, when the merging process is performed with four pixels 20 as a pixel group, as in the first exemplary embodiment and the second exemplary embodiment, each pixel group is treated as a single pixel when executed by The amount of radiation at the time of normal processing and imaging is 1/4 of the amount of radiation, so that the amount of radiation per single pixel is equivalent to when normal processing is performed. Furthermore, when the merging process is performed with the three pixels 20 as the pixel group, as in the third exemplary embodiment and the fourth exemplary embodiment, each pixel group is treated as a single pixel by The amount of radiation when performing normal processing and imaging is 1/3 of the amount of radiation, so that the amount of radiation per single pixel is equivalent to when normal processing is performed.
在接下來的步驟S226中,類似於成像模式的步驟S208,基於成像角度範圍與特定角度,而決定成像次數的數量。如目前示範性實施例的特定例子,如上述所解釋的,在診斷模式中,成像角度範圍是±10度且特定角度為1度,以致於執行粗糙成像。用於成像的個別次數的數量相應地 被決定為20次。In the next step S226, similar to the step S208 of the imaging mode, the number of imaging times is determined based on the imaging angle range and the specific angle. As a specific example of the present exemplary embodiment, as explained above, in the diagnostic mode, the imaging angle range is ±10 degrees and the specific angle is 1 degree, so that rough imaging is performed. The number of individual times used for imaging is correspondingly It was decided to be 20 times.
在接下來的步驟S228,類似於成像模式的步驟S210,支撐部507被移動到最大成像角度(在目前的示範性實施例中的位於左方的10度),且輻射輻照部24移動。隨後,在接下來的步驟S230,從輻射輻照部24來使輻射被輻照,且使***N被成像,且輻射檢測器42也執行合併處理。注意到,以類似的方式執行此處的成像與合併處理(圖5的步驟S106)。亦即,為了從每個相應的畫素群讀出電荷,輸出接通信號(ON signal)到掃描線(例如,到第一示範性實施例中的第二掃描線G2與第三掃描線G3),且執行合併處理以將每個畫素群視為單一畫素。被視為單一畫素的每個所述畫素的相應的電荷信號是:被相應地讀取且在其上執行所述合併處理。在輻射檢測器42中相應地取得合併處理射線照相圖像(binning-processed radiographic image)。In the next step S228, similar to the step S210 of the imaging mode, the support portion 507 is moved to the maximum imaging angle (10 degrees on the left in the present exemplary embodiment), and the radiation irradiation portion 24 is moved. Subsequently, in the next step S230, the radiation is irradiated from the radiation irradiating portion 24, and the breast N is imaged, and the radiation detector 42 also performs a combining process. Note that the imaging and merging processing herein is performed in a similar manner (step S106 of FIG. 5). That is, in order to read out the charge from each corresponding pixel group, an ON signal is output to the scan line (for example, to the second scan line G2 and the third scan line G3 in the first exemplary embodiment). And perform a merge process to treat each pixel group as a single pixel. The corresponding charge signal of each of the pixels considered to be a single pixel is that it is read accordingly and the merge process is performed thereon. A binning-processed radiographic image is correspondingly taken in the radiation detector 42.
在接下來的步驟S232,類似於成像模式的步驟S214,對於在步驟S226所決定的用於成像次數的數量,作出是否已經完成成像的決定。當沒有完成時,決定為負面的,且處理進入到步驟S234。在步驟234,以特定角度即1度將支撐部507移動到右方,且在所述處理隨後回到步驟S230之前使輻射輻照部24被移動,且重複目前的處理。然而,當對於次數的決定數量而言已經完成成像時,決定 為肯定的且處理進入到步驟S236。在步驟S236,類似於步驟S218中的成像模式,所述成像的射線照相圖像(價值20次)是從輻射檢測器42而輸出到圖像處理裝置50。In the next step S232, similar to the step S214 of the imaging mode, a decision is made as to whether or not imaging has been completed for the number of imaging times determined in step S226. When it is not completed, the decision is negative, and the process proceeds to step S234. At step 234, the support portion 507 is moved to the right at a specific angle, that is, 1 degree, and the radiation irradiating portion 24 is moved before the process returns to step S230, and the current process is repeated. However, when the imaging has been completed for the determined number of times, it is decided It is affirmative and the process proceeds to step S236. In step S236, similar to the imaging mode in step S218, the imaged radiographic image (worth 20 times) is output from the radiation detector 42 to the image processing device 50.
在接下來的步驟S238,基於從輻射檢測器42所獲得的射線照相圖像,圖像處理裝置50重建斷層照相圖像。類似於成像模式的步驟S220,對於斷層照相圖像重建的規格並沒有特別的限制,且可根據已知的重建方法來執行斷層照相圖像的重建。注意到,如上所述,在目前的示範性實施例中,當重建斷層照相的切片厚度(斷層照相圖像的厚度)在診斷模式中為1毫米時,這比在成像模式中的切片後度還厚。At the next step S238, based on the radiographic image obtained from the radiation detector 42, the image processing device 50 reconstructs the tomographic image. Similar to the step S220 of the imaging mode, the specification of the tomographic image reconstruction is not particularly limited, and the reconstruction of the tomographic image can be performed according to a known reconstruction method. Note that, as described above, in the present exemplary embodiment, when the slice thickness (the thickness of the tomographic image) of the reconstructed tomography is 1 mm in the diagnosis mode, this is later than the slice after the imaging mode Still thick.
在接下來的步驟S240,在指示之後,所述重建的斷層照相圖像被顯示在圖像處理裝置50的顯示器52與顯示器件80的顯示部80A,結束目前的處理。In the next step S240, after the instruction, the reconstructed tomographic image is displayed on the display 52 of the image processing apparatus 50 and the display portion 80A of the display device 80, and the current processing is ended.
在目前示範性實施例中,當執行斷層合成成像時,由於用以執行粗糙成像的診斷模式具有:較小的成像角度範圍與較小的成像次數的數量,所以能執行高速的成像。再者,當執行合併處理時、由於具有用於輻照的較小的輻射量,更具體而言,在成像模式中,由於控制每個畫素群(視為一個畫素)的輻射量成為與每個畫素的輻射量相同的量,那麼對於成像主體W的輻射劑量可以減少。再者,在成像模式中,由於成像角度範圍變為較大(擺動了大成像角度),而可獲得大量的數據(圖像數據)。特別是,可在深度方向獲得細節數據。相應地,可得到高清晰度圖像。In the present exemplary embodiment, when performing tomosynthesis imaging, since the diagnosis mode for performing rough imaging has a smaller imaging angle range and a smaller number of imaging times, high-speed imaging can be performed. Furthermore, when the merging process is performed, since there is a small amount of radiation for irradiation, more specifically, in the imaging mode, since the amount of radiation for controlling each pixel group (serving as one pixel) becomes The amount of radiation for the imaging subject W can be reduced by the same amount of radiation as each pixel. Furthermore, in the imaging mode, since the imaging angle range becomes large (wobbled large imaging angle), a large amount of data (image data) can be obtained. In particular, detailed data can be obtained in the depth direction. Accordingly, a high definition image can be obtained.
注意到,雖然目前的示範性實施例解釋已經給出一個特定例子,即:應用到***造影術的、執行斷層合成成像的成像裝置41,但是並不限制於此。可注意到,用於成像圖像的處理與目前示範性實施例的圖像顯示處理,可以類似地應用到其他位置(sites)的、執行斷層合成成像的成像裝置41。It is to be noted that although the present exemplary embodiment explanation has given a specific example, that is, the imaging device 41 that performs tomosynthesis imaging applied to mammography, it is not limited thereto. It may be noted that the processing for imaging an image and the image display processing of the present exemplary embodiment can be similarly applied to other imaging apparatuses 41 performing tomosynthesis imaging.
再者,在目前的示範性實施例中,雖然解釋已經給出一個狀況,其中,使用者使用成像裝置41的操作面板44與圖像處理裝置50的操作輸入部54,來給出關於成像的指示,但並不限制於此。例如,使用者使用單獨提供的裝置,如控制台(console),來執行指示。Further, in the present exemplary embodiment, although the explanation has given a case in which the user uses the operation panel 44 of the imaging device 41 and the operation input portion 54 of the image processing device 50 to give an image about Instructions, but not limited to this. For example, the user uses a separately provided device, such as a console, to perform the indication.
另外,本示範性實施例中描述的輻射成像系統、輻射檢測器、畫素等的配置、操作等是實例,且,當然,在不背離本發明本質的範圍中,可依照狀況進行改變。In addition, the configuration, operation, and the like of the radiation imaging system, the radiation detector, the pixels, and the like described in the present exemplary embodiment are examples, and, of course, may be changed depending on the situation without departing from the essence of the invention.
此外,在本示範性實施例中,並不明確地限制本發明的輻射,且可使用X射線、γ射線等。Further, in the present exemplary embodiment, the radiation of the present invention is not explicitly limited, and X-rays, gamma rays, or the like can be used.
1‧‧‧基板1‧‧‧Substrate
2‧‧‧閘電極2‧‧‧ gate electrode
3‧‧‧資料線/信號線3‧‧‧Data line/signal line
4a、4b‧‧‧TFT開關4a, 4b‧‧‧ TFT switch
5‧‧‧電荷存儲電容器5‧‧‧ Charge storage capacitor
6‧‧‧光電轉換層6‧‧‧Photoelectric conversion layer
7‧‧‧上電極7‧‧‧Upper electrode
8‧‧‧半導體作用層8‧‧‧Semiconductor layer
9‧‧‧源極電極9‧‧‧Source electrode
10、110、310、410‧‧‧輻射檢測元件10, 110, 310, 410‧‧‧ radiation detecting components
11‧‧‧下電極11‧‧‧ lower electrode
12‧‧‧層間絕緣薄膜12‧‧‧Interlayer insulating film
13‧‧‧汲極電極13‧‧‧汲electrode
14‧‧‧存儲電容器下電極14‧‧‧ Storage capacitor lower electrode
15A‧‧‧絕緣薄膜15A‧‧‧Insulating film
15B‧‧‧TFT保護層15B‧‧‧TFT protective layer
16‧‧‧存儲電容器上電極16‧‧‧ Storage capacitor upper electrode
17‧‧‧接觸孔17‧‧‧Contact hole
20、P0~P39‧‧‧畫素20, P0~P39‧‧‧ pixels
20a、20b‧‧‧列方向20a, 20b‧‧‧ direction
24‧‧‧輻射輻照部24‧‧‧ Radiation Irradiation Department
25、125、325‧‧‧信號處理部25, 125, 325‧‧‧ Signal Processing Department
30‧‧‧公用接地線30‧‧‧Common grounding wire
35、335‧‧‧掃描信號控制部35, 335‧‧ ‧ Scanning Signal Control Department
35a、35b、435a、435b‧‧‧掃描信號控制部35a, 35b, 435a, 435b‧‧‧ scan signal control unit
31‧‧‧輻射源31‧‧‧radiation source
41‧‧‧成像裝置41‧‧‧ imaging device
42、142、342、442‧‧‧輻射檢測器42, 142, 342, 442‧‧ ‧ radiation detector
44‧‧‧操作面板44‧‧‧Operator panel
46‧‧‧成像裝置控制部46‧‧‧Image Device Control Department
46A、60‧‧‧CPU46A, 60‧‧‧ CPU
46B、62‧‧‧ROM46B, 62‧‧‧ROM
46C、64‧‧‧RAM46C, 64‧‧‧RAM
46D‧‧‧存儲部46D‧‧‧Storage Department
47、52‧‧‧顯示器47, 52‧‧‧ display
48、72‧‧‧通信I/F部48, 72‧‧‧Communication I/F Department
50‧‧‧圖像處理裝置50‧‧‧Image processing device
54‧‧‧操作輸入部54‧‧‧Operation Input Department
56‧‧‧網路56‧‧‧Network
57‧‧‧管理服務器57‧‧‧Management Server
58‧‧‧顯示電纜58‧‧‧Display cable
66‧‧‧HDD66‧‧‧HDD
68‧‧‧顯示驅動器68‧‧‧ display driver
70‧‧‧操作輸入檢測部70‧‧‧Operation Input Detection Department
74‧‧‧圖像信號輸出部74‧‧‧Image Signal Output Department
80‧‧‧顯示裝置80‧‧‧ display device
80A‧‧‧顯示部80A‧‧‧Display Department
90‧‧‧圖像記憶體90‧‧‧ image memory
92a‧‧‧運算放大器92a‧‧‧Operational Amplifier
92b‧‧‧電容器92b‧‧‧ capacitor
92c‧‧‧重置開關92c‧‧‧Reset switch
97A~97D‧‧‧抽樣保持電路97A~97D‧‧‧Sampling and holding circuit
98‧‧‧多工器98‧‧‧Multiplexer
98a~98d‧‧‧開關98a~98d‧‧‧ switch
99‧‧‧類比/數位轉換器99‧‧‧ Analog/Digital Converter
100‧‧‧射線照相成像系統100‧‧‧ Radiographic imaging system
103‧‧‧感測器部分103‧‧‧Sensor section
150‧‧‧控制部150‧‧‧Control Department
500‧‧‧測量部500‧‧‧Measurement Department
502‧‧‧基座台部502‧‧‧Base Station
504‧‧‧旋轉軸504‧‧‧Rotary axis
506‧‧‧保持部506‧‧‧ Keeping Department
507‧‧‧支撐部507‧‧‧Support
510‧‧‧成像台510‧‧‧ imaging station
512‧‧‧成像表面512‧‧‧ imaging surface
514‧‧‧押壓板514‧‧‧Pressing plate
542‧‧‧輻射檢測器542‧‧‧radiation detector
S100~S108、S200~S240‧‧‧步驟S100~S108, S200~S240‧‧‧ steps
A、B、C、D、E、F、G、H、PG0~PG23‧‧‧畫素群A, B, C, D, E, F, G, H, PG0~PG23‧‧‧ pixel groups
a、b、c、d、e、f、g、h‧‧‧重心a, b, c, d, e, f, g, h‧ ‧ center of gravity
CA1~CA3‧‧‧可變增益前置放大器/電荷放大器CA1~CA3‧‧‧Variable Gain Preamplifier/Charge Amplifier
D、D1~D6‧‧‧資料線D, D1~D6‧‧‧ data line
G1、G1-0~G1-7‧‧‧第一掃描線G1, G1-0~G1-7‧‧‧ first scan line
G2、G2-0~G2-3‧‧‧第二掃描線G2, G2-0~G2-3‧‧‧ second scan line
G3、G3-0~G3-3‧‧‧第三掃描線G3, G3-0~G3-3‧‧‧ third scan line
G4、G4-1~G4-4‧‧‧第四掃描線G4, G4-1~G4-4‧‧‧ fourth scan line
G5、G5-1~G5-2‧‧‧第五掃描線G5, G5-1~G5-2‧‧‧ fifth scan line
G6、G6-0~G6-12‧‧‧第六掃描線G6, G6-0~G6-12‧‧‧ sixth scan line
G7、G7-0~G7-11‧‧‧第七掃描線G7, G7-0~G7-11‧‧‧ seventh scan line
G8、G8-1~G8-5‧‧‧第八掃描線G8, G8-1~G8-5‧‧‧ eighth scan line
G9、G9-1~G9-2‧‧‧第九掃描線G9, G9-1~G9-2‧‧‧ ninth scan line
N‧‧‧***N‧‧‧ breasts
P1~PN‧‧‧位置P1~PN‧‧‧Location
T1-1、T1-2、T2-1、T2-2‧‧‧積分週期T1-1, T1-2, T2-1, T2-2‧‧‧ integration period
W‧‧‧主體W‧‧‧ Subject
將基於附圖詳細描述本發明的示範性實施例。Exemplary embodiments of the present invention will be described in detail based on the drawings.
圖1為說明根據本發明的第一示範性實施例的射線照相成像系統的配置的方塊圖。1 is a block diagram illustrating a configuration of a radiographic imaging system in accordance with a first exemplary embodiment of the present invention.
圖2為說明根據第一示範性實施例的成像裝置的輻射檢測器的電配置的圖式。2 is a diagram illustrating an electrical configuration of a radiation detector of an imaging device according to a first exemplary embodiment.
圖3為說明根據第一示範性實施例的輻射檢測器的輻射檢測設備的部分截面圖的圖式。3 is a diagram illustrating a partial cross-sectional view of a radiation detecting apparatus of a radiation detector according to a first exemplary embodiment.
圖4為說明第一示範性實施例中經歷合併的畫素和畫素群的佈局的圖式。4 is a diagram illustrating the layout of pixels and pixel groups undergoing merging in the first exemplary embodiment.
圖5為圖示根據第一示範性實施例的射線照相成像系統的成像處理順序的實例的流程圖。FIG. 5 is a flowchart illustrating an example of an imaging processing sequence of the radiographic imaging system according to the first exemplary embodiment.
圖6為說明根據本發明的第二示範性實施例的成像裝置的輻射檢測器的電配置的圖式。FIG. 6 is a diagram illustrating an electrical configuration of a radiation detector of an imaging device according to a second exemplary embodiment of the present invention.
圖7為說明第二示範性實施例中經歷合併的畫素和畫素群的佈局的圖式。FIG. 7 is a diagram illustrating a layout of pixels and pixel groups undergoing merging in the second exemplary embodiment.
圖8為說明根據本發明的第三示範性實施例的成像裝置的輻射檢測器的電配置的圖式。FIG. 8 is a diagram illustrating an electrical configuration of a radiation detector of an imaging device according to a third exemplary embodiment of the present invention.
圖9為說明第三示範性實施例中經歷合併的畫素和畫素群的佈局的圖式。FIG. 9 is a diagram for explaining a layout of a pixel and a pixel group subjected to merging in the third exemplary embodiment.
圖10為說明根據本發明的第四示範性實施例的成像裝置的輻射檢測器的電配置的圖式。FIG. 10 is a diagram illustrating an electrical configuration of a radiation detector of an imaging device according to a fourth exemplary embodiment of the present invention.
圖11為第四示範性實施例的合併處理期間的輻射檢測器的操作時序圖。Fig. 11 is an operation timing chart of the radiation detector during the merging process of the fourth exemplary embodiment.
圖12為說明應用於間接轉換型輻射檢測器的第一示範性實施例的輻射檢測器的簡化實例的圖式。FIG. 12 is a diagram illustrating a simplified example of a radiation detector applied to the first exemplary embodiment of the indirect conversion type radiation detector.
圖13為說明應用於間接轉換型輻射檢測器的第三示範性實施例的輻射檢測器的簡化實例的圖式。FIG. 13 is a diagram illustrating a simplified example of a radiation detector applied to a third exemplary embodiment of an indirect conversion type radiation detector.
圖14為說明本發明第五示範性實施例的用於***造影術(mammography)的成像裝置的配置的示意配置圖。Fig. 14 is a schematic configuration diagram illustrating a configuration of an imaging device for mammography according to a fifth exemplary embodiment of the present invention.
圖15為說明在成像時,根據第五示範性實施例的成像裝置的配置的配置圖。15 is a configuration diagram illustrating a configuration of an imaging device according to a fifth exemplary embodiment at the time of imaging.
圖16為解釋在成像時,根據第五示範性實施例的成像裝置的解釋圖。Fig. 16 is an explanatory diagram for explaining an image forming apparatus according to a fifth exemplary embodiment at the time of image formation.
圖17為說明根據第五示範性實施例的,在射線照相成像系統中進行圖像成像的處理順序的流程圖。FIG. 17 is a flowchart illustrating a processing sequence of performing image imaging in a radiographic imaging system, according to a fifth exemplary embodiment.
4a、4b‧‧‧TFT開關4a, 4b‧‧‧ TFT switch
5‧‧‧電荷存儲電容器5‧‧‧ Charge storage capacitor
10‧‧‧輻射檢測元件10‧‧‧radiation detection components
25‧‧‧信號處理部25‧‧‧Signal Processing Department
30‧‧‧公用接地線30‧‧‧Common grounding wire
35‧‧‧掃描信號控制部35‧‧‧Scan Signal Control Department
42‧‧‧輻射檢測器42‧‧‧radiation detector
90‧‧‧圖像記憶體90‧‧‧ image memory
103‧‧‧感測器部分103‧‧‧Sensor section
D1~D6‧‧‧資料線D1~D6‧‧‧ data line
G1、G1-0~G1-7‧‧‧第一掃描線G1, G1-0~G1-7‧‧‧ first scan line
G2、G2-0~G2-7‧‧‧第二掃描線G2, G2-0~G2-7‧‧‧ second scan line
P0~P39‧‧‧畫素P0~P39‧‧‧ pixels
Claims (22)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011282355 | 2011-12-22 | ||
JP2012267524A JP5497874B2 (en) | 2011-12-22 | 2012-12-06 | Radiation image detector, radiation image capturing apparatus, and radiation image capturing system |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201326873A TW201326873A (en) | 2013-07-01 |
TWI468720B true TWI468720B (en) | 2015-01-11 |
Family
ID=47623862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101149155A TWI468720B (en) | 2011-12-22 | 2012-12-21 | Radiographic image detector, radiographic imaging apparatus, radiographic imaging system |
Country Status (5)
Country | Link |
---|---|
US (2) | US8879686B2 (en) |
EP (3) | EP2608530B1 (en) |
JP (1) | JP5497874B2 (en) |
CN (2) | CN103169490B (en) |
TW (1) | TWI468720B (en) |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9276031B2 (en) | 2013-03-04 | 2016-03-01 | Apple Inc. | Photodiode with different electric potential regions for image sensors |
US9741754B2 (en) | 2013-03-06 | 2017-08-22 | Apple Inc. | Charge transfer circuit with storage nodes in image sensors |
JP2015043563A (en) * | 2013-07-25 | 2015-03-05 | 富士フイルム株式会社 | Radiation detection element substrate, inspection device for radiation detection element substrate and method for inspecting radiation detection element substrate |
JP2015043564A (en) * | 2013-07-25 | 2015-03-05 | 富士フイルム株式会社 | Radiation detection element substrate, inspection device for radiation detection element substrate and method for inspecting radiation detection element substrate |
JP6088382B2 (en) * | 2013-08-02 | 2017-03-01 | 富士フイルム株式会社 | Radiation detector and radiographic imaging apparatus |
FR3012710B1 (en) * | 2013-10-29 | 2017-02-10 | Commissariat Energie Atomique | PROCESS FOR PROCESSING SIGNALS DELIVERED BY PIXELS OF A DETECTOR |
KR102178335B1 (en) * | 2014-01-02 | 2020-11-12 | 삼성전자주식회사 | Method of binning pixels in image sensor and image sensor |
US10285626B1 (en) | 2014-02-14 | 2019-05-14 | Apple Inc. | Activity identification using an optical heart rate monitor |
JP6138754B2 (en) * | 2014-03-03 | 2017-05-31 | 富士フイルム株式会社 | Radiographic imaging system, radiographic imaging device, radiographic imaging device control method, and radiographic imaging device control program |
US9686485B2 (en) * | 2014-05-30 | 2017-06-20 | Apple Inc. | Pixel binning in an image sensor |
KR20150139375A (en) * | 2014-06-03 | 2015-12-11 | 삼성전자주식회사 | X-ray imaging apparatus and control method for the same |
CN106575436B (en) * | 2014-06-27 | 2020-08-21 | 皇家飞利浦有限公司 | Contour display for visual assessment of calcified costal-cartilaginous joints |
CN104079848A (en) * | 2014-07-02 | 2014-10-01 | 中国科学院长春光学精密机械与物理研究所 | Numeric field L-type pixel binning method |
JP6541313B2 (en) * | 2014-07-31 | 2019-07-10 | キヤノン株式会社 | Photoelectric conversion device and imaging system |
CN107113387B (en) * | 2014-11-12 | 2020-09-18 | 索尼公司 | Solid-state imaging device and electronic apparatus |
US10269839B2 (en) * | 2015-03-26 | 2019-04-23 | Carestream Health, Inc. | Apparatus and method using a dual gate TFT structure |
JP2017012408A (en) * | 2015-06-30 | 2017-01-19 | キヤノン株式会社 | Mamma imaging apparatus, mamma imaging apparatus control method, and program |
EP3833004A1 (en) | 2015-07-10 | 2021-06-09 | Panasonic Intellectual Property Management Co., Ltd. | Imaging device |
JP6719104B2 (en) * | 2015-08-28 | 2020-07-08 | パナソニックIpマネジメント株式会社 | Image output device, image transmission device, image reception device, image output method, and recording medium |
JP6730150B2 (en) | 2016-09-16 | 2020-07-29 | 株式会社東芝 | Photodetector and distance measuring device |
US10438987B2 (en) | 2016-09-23 | 2019-10-08 | Apple Inc. | Stacked backside illuminated SPAD array |
CN108886585B (en) | 2017-01-25 | 2022-01-11 | 松下知识产权经营株式会社 | Driving control system and driving control method |
JP6799690B2 (en) | 2017-01-25 | 2020-12-16 | アップル インコーポレイテッドApple Inc. | SPAD detector with modulation sensitivity |
US10656251B1 (en) | 2017-01-25 | 2020-05-19 | Apple Inc. | Signal acquisition in a SPAD detector |
US10962628B1 (en) | 2017-01-26 | 2021-03-30 | Apple Inc. | Spatial temporal weighting in a SPAD detector |
CN110418607B (en) * | 2017-02-28 | 2023-02-24 | 株式会社岛津制作所 | Image processing method |
US10622538B2 (en) | 2017-07-18 | 2020-04-14 | Apple Inc. | Techniques for providing a haptic output and sensing a haptic input using a piezoelectric body |
US10440301B2 (en) | 2017-09-08 | 2019-10-08 | Apple Inc. | Image capture device, pixel, and method providing improved phase detection auto-focus performance |
TWI692251B (en) | 2017-09-18 | 2020-04-21 | 荷蘭商Asml荷蘭公司 | Field programmable detector array |
CN116417313A (en) * | 2017-09-18 | 2023-07-11 | Asml荷兰有限公司 | Switch matrix design for beam image systems |
JP6921375B2 (en) * | 2017-09-29 | 2021-08-18 | 株式会社ニコン | Image sensor and image sensor |
JP7067912B2 (en) | 2017-12-13 | 2022-05-16 | キヤノン株式会社 | Radiation imaging device and radiation imaging system |
JP6611833B2 (en) | 2018-01-16 | 2019-11-27 | キヤノン株式会社 | Radiation imaging system, camera control device and control method thereof |
JP7083403B2 (en) * | 2018-04-20 | 2022-06-10 | エーエスエムエル ネザーランズ ビー.ブイ. | Wide active area fast detector pixel shape and section shape selection |
US10848693B2 (en) | 2018-07-18 | 2020-11-24 | Apple Inc. | Image flare detection using asymmetric pixels |
US11019294B2 (en) | 2018-07-18 | 2021-05-25 | Apple Inc. | Seamless readout mode transitions in image sensors |
US11233966B1 (en) | 2018-11-29 | 2022-01-25 | Apple Inc. | Breakdown voltage monitoring for avalanche diodes |
CN110353710A (en) * | 2019-07-18 | 2019-10-22 | 江苏康众数字医疗科技股份有限公司 | Composite material support plate and mammary gland X- optical detection equipment |
JP7362446B2 (en) * | 2019-11-22 | 2023-10-17 | キヤノンメディカルシステムズ株式会社 | mammography equipment |
US11284045B2 (en) * | 2020-04-22 | 2022-03-22 | OmniVision Technologies. Inc. | Image sensor with shifted color filter array pattern and bit line pairs |
SE2050777A1 (en) | 2020-06-26 | 2021-07-13 | Direct Conv Ab | Sensor unit, radiation detector, method of manufacturing sensor unit, and method of using sensor unit |
US11563910B2 (en) | 2020-08-04 | 2023-01-24 | Apple Inc. | Image capture devices having phase detection auto-focus pixels |
EP4251976A1 (en) * | 2020-11-25 | 2023-10-04 | Shenzhen Xpectvision Technology Co., Ltd. | Imaging systems |
CN112401912A (en) * | 2020-12-10 | 2021-02-26 | 杭州美诺瓦医疗科技股份有限公司 | Children bone age imaging method with lower radiation dose and imaging device thereof |
JP2022131968A (en) * | 2021-02-26 | 2022-09-07 | 富士フイルム株式会社 | Image processing apparatus, imaging control device, radiation image capturing system, image processing method and image processing program |
US11546532B1 (en) | 2021-03-16 | 2023-01-03 | Apple Inc. | Dynamic correlated double sampling for noise rejection in image sensors |
US11962919B2 (en) * | 2022-07-24 | 2024-04-16 | Tower Semiconductor Ltd. | Apparatus and system of analog pixel binning |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1994017493A1 (en) * | 1993-01-29 | 1994-08-04 | Q-Dot Photonics, Inc. | Methods and apparatus for image processing |
US5756981A (en) * | 1992-02-27 | 1998-05-26 | Symbol Technologies, Inc. | Optical scanner for reading and decoding one- and-two-dimensional symbologies at variable depths of field including memory efficient high speed image processing means and high accuracy image analysis means |
US6295026B1 (en) * | 1999-11-19 | 2001-09-25 | Trw Inc. | Enhanced direct radiating array |
JP2003023555A (en) * | 2001-07-05 | 2003-01-24 | Fuji Photo Film Co Ltd | Image photographing apparatus |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5864146A (en) * | 1996-11-13 | 1999-01-26 | University Of Massachusetts Medical Center | System for quantitative radiographic imaging |
US5812629A (en) * | 1997-04-30 | 1998-09-22 | Clauser; John F. | Ultrahigh resolution interferometric x-ray imaging |
JP4195169B2 (en) * | 2000-03-14 | 2008-12-10 | 富士フイルム株式会社 | Solid-state imaging device and signal processing method |
US6895077B2 (en) * | 2001-11-21 | 2005-05-17 | University Of Massachusetts Medical Center | System and method for x-ray fluoroscopic imaging |
JP3920085B2 (en) * | 2001-12-11 | 2007-05-30 | 富士フイルム株式会社 | Solid-state imaging device, smear correction method thereof, and digital still camera |
JP2003255049A (en) * | 2002-03-06 | 2003-09-10 | Canon Inc | Light-detecting apparatus and radiation-detecting apparatus |
JP4514182B2 (en) * | 2002-05-21 | 2010-07-28 | キヤノン株式会社 | Image forming apparatus and radiation detection apparatus |
US7304309B2 (en) * | 2005-03-14 | 2007-12-04 | Avraham Suhami | Radiation detectors |
US7598478B2 (en) * | 2005-04-26 | 2009-10-06 | Konica Minolta Holdings, Inc. | Image pickup device having a light shield element |
JP4582198B2 (en) * | 2008-05-30 | 2010-11-17 | ソニー株式会社 | Solid-state imaging device, imaging device, and driving method of solid-state imaging device |
EP2366172B1 (en) | 2008-11-26 | 2013-04-10 | Analogic Corporation | Method of and apparatus for continuous wave tomosynthesis using photon counting |
JP4760915B2 (en) * | 2009-01-08 | 2011-08-31 | ソニー株式会社 | Solid-state image sensor |
US20100252744A1 (en) * | 2009-04-06 | 2010-10-07 | Koninklijke Philips Electronics N.V. | Radiation detector with a plurality of electrode systems |
US8901541B2 (en) * | 2009-04-07 | 2014-12-02 | Rohm Co., Ltd. | Photoelectric conversion device and image pick-up device |
JP2011060611A (en) * | 2009-09-10 | 2011-03-24 | Fujifilm Corp | Organic electroluminescence device and method of manufacturing the same |
CA2813591C (en) | 2010-10-05 | 2020-09-22 | Hologic, Inc. | Upright x-ray breast imaging with a ct mode, multiple tomosynthesis modes, and a mammography mode |
WO2012132323A1 (en) | 2011-03-28 | 2012-10-04 | 富士フイルム株式会社 | Method and device for imaging radiological image of breast |
-
2012
- 2012-12-06 JP JP2012267524A patent/JP5497874B2/en active Active
- 2012-12-20 EP EP12198748.1A patent/EP2608530B1/en active Active
- 2012-12-20 EP EP16177350.2A patent/EP3096513B1/en active Active
- 2012-12-20 EP EP18156336.2A patent/EP3343902A1/en not_active Withdrawn
- 2012-12-20 US US13/722,510 patent/US8879686B2/en active Active
- 2012-12-21 CN CN201210563796.2A patent/CN103169490B/en active Active
- 2012-12-21 CN CN201410796134.9A patent/CN104605879B/en active Active
- 2012-12-21 TW TW101149155A patent/TWI468720B/en active
-
2014
- 2014-09-25 US US14/496,258 patent/US9055872B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5756981A (en) * | 1992-02-27 | 1998-05-26 | Symbol Technologies, Inc. | Optical scanner for reading and decoding one- and-two-dimensional symbologies at variable depths of field including memory efficient high speed image processing means and high accuracy image analysis means |
WO1994017493A1 (en) * | 1993-01-29 | 1994-08-04 | Q-Dot Photonics, Inc. | Methods and apparatus for image processing |
US6295026B1 (en) * | 1999-11-19 | 2001-09-25 | Trw Inc. | Enhanced direct radiating array |
JP2003023555A (en) * | 2001-07-05 | 2003-01-24 | Fuji Photo Film Co Ltd | Image photographing apparatus |
Also Published As
Publication number | Publication date |
---|---|
US9055872B2 (en) | 2015-06-16 |
US8879686B2 (en) | 2014-11-04 |
US20150049858A1 (en) | 2015-02-19 |
CN104605879B (en) | 2017-06-20 |
US20130163716A1 (en) | 2013-06-27 |
CN103169490A (en) | 2013-06-26 |
EP3096513B1 (en) | 2018-03-14 |
TW201326873A (en) | 2013-07-01 |
JP2013150304A (en) | 2013-08-01 |
EP2608530B1 (en) | 2016-10-19 |
EP2608530A2 (en) | 2013-06-26 |
CN103169490B (en) | 2015-01-21 |
EP3343902A1 (en) | 2018-07-04 |
EP3096513A1 (en) | 2016-11-23 |
JP5497874B2 (en) | 2014-05-21 |
EP2608530A3 (en) | 2015-08-26 |
CN104605879A (en) | 2015-05-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI468720B (en) | Radiographic image detector, radiographic imaging apparatus, radiographic imaging system | |
JP5430642B2 (en) | Radiation image detector, radiation image capturing apparatus, and radiation image capturing system | |
US9389320B2 (en) | Radiation detector, and radiation imaging apparatus provided with detector | |
US7391845B2 (en) | Semiconductor radiation detector with guard ring, and imaging system with this detector | |
JP5356078B2 (en) | X-ray detector and X-ray CT apparatus | |
JP5490084B2 (en) | Radiation image detector, radiation image capturing apparatus, and radiation image capturing system | |
US8487265B2 (en) | Imaging detector and method of manufacturing | |
JP6154021B2 (en) | Radiation image capturing apparatus, radiation image capturing method, and radiation image capturing program | |
CN103006244A (en) | Radiation detection element and radiographic image detection panel | |
JP2005223890A (en) | Split scan line and combined data line x-ray detectors | |
JP2004057816A (en) | Method and apparatus for acquiring a series of images utilizing solid state detector with alternating scan lines | |
JP6104337B2 (en) | Radiation imaging system | |
JP5784448B2 (en) | Radiation image capturing apparatus and radiation image capturing method |