TWI468651B - Optical measurement system, carrying structure for configuring the same, and optical measurement method - Google Patents

Description

光學量測系統、用以架設其之承載結構及光學量測方法 Optical measuring system, bearing structure for erecting the same, and optical measuring method

本發明是有關於一種量測系統、量測方法與承載結構，且特別是有關於一種光學量測系統、用以架設其之承載結構與光學量測方法。 The invention relates to a measuring system, a measuring method and a bearing structure, and in particular to an optical measuring system, a bearing structure for erecting the same and an optical measuring method.

隨著現代半導體科技的進步，發光二極體(light emitting diode,LED)已被大量使用，以提供交通號誌、大型看板、掃描器、液晶顯示器等電子裝置所需的光源。 With the advancement of modern semiconductor technology, light emitting diodes (LEDs) have been widely used to provide light sources for electronic devices such as traffic signs, large billboards, scanners, and liquid crystal displays.

在照明光源製作完成後出廠之前，通常需利用量測裝置來量測照明光源所發出的光的光強度，以判斷照明光源是否能夠正常運作。發光二極體光條(LED light bar)或發光二極體陣列光源通常具有多個發光二極體。當以傳統量測裝置於單一位置量測發光二極體光條或陣列光源時，由於位於不同位置的發光二極體貢獻於此單一位置的光強度，如輻照度(irradiance)，並不相同，因此通常無法藉由所測得的單一光強度值來判別有多少個發光二極體無法正常運作，或判別此發光二極體光條或陣列光源有多少光通量(luminous flux)或輻射通量(radiant flux)的損失。 Before the illumination source is manufactured, it is usually necessary to use a measuring device to measure the light intensity of the light emitted by the illumination source to determine whether the illumination source can operate normally. An LED light bar or a light emitting diode array light source typically has a plurality of light emitting diodes. When the light-emitting diode strip or the array light source is measured at a single position by a conventional measuring device, the light intensity contributed to the single position by the light-emitting diodes located at different positions, such as irradiance, is not the same. Therefore, it is generally impossible to determine how many light-emitting diodes are not functioning properly by the measured single light intensity value, or to determine how much luminous flux or radiant flux the light-emitting diode strip or array light source has. (radiant flux) loss.

此外，即使量測傳統日光燈管或平面光源，由於日光燈管或平面光源的不同的發光區貢獻於上述單一量測位置的光強度亦不相同，因此利用傳統的量測裝置量測傳統日光燈管或平面光源時，仍無法判別此發光二極體光條或陣列光源有多少光通量(luminous flux)或幅射通量(radiant flux)的損失。 In addition, even if the conventional fluorescent tube or the planar light source is measured, since the different light-emitting areas of the fluorescent tube or the planar light source contribute different light intensities to the single measurement position, the conventional measuring device is used to measure the conventional fluorescent tube or In the case of a planar light source, it is still impossible to discriminate the loss of luminous flux or radiant flux of the light-emitting diode strip or the array light source.

若採用積分球(integrating sphere)來測量照明光源，隨著照 明光源的長度愈長，所採用的積分球的體積也需愈大。當積分球用以量測燈管時，其直徑通常需為燈管長度的3倍。雖然積分球可測得準確的光通量或幅射通量，但體積大的積分球造價昂貴，維護也相當困難，這會增加量測設備的費用支出。此外，體積大的積分球將會佔用過多的空間，而使得產線的規劃較為困難。 If an integrating sphere is used to measure the illumination source, The longer the length of the light source, the larger the volume of the integrating sphere to be used. When the integrating sphere is used to measure the tube, its diameter usually needs to be three times the length of the tube. Although the integrating sphere can measure the exact luminous flux or radiation flux, the bulky integrating sphere is expensive and difficult to maintain, which increases the cost of the measuring equipment. In addition, the large size of the integrating sphere will take up too much space, making the planning of the production line more difficult.

本發明提供一種光學量測系統，其可測得將發光條件與光偵測條件所產生的整體光強度權重分佈均一化後所得到的整體光強度評估值。 The present invention provides an optical measurement system that measures an overall light intensity evaluation value obtained by homogenizing the overall light intensity weight distribution generated by the illumination condition and the light detection condition.

本發明提供一種光學量測方法，其可測得將發光條件與光偵測條件所產生的整體光強度權重分佈均一化後所得到的整體光強度評估值。 The present invention provides an optical measurement method capable of measuring an overall light intensity evaluation value obtained by homogenizing an overall light intensity weight distribution generated by a light-emitting condition and a light detection condition.

本發明之一實施例提出一種光學量測系統，包括一光偵測模組及一訊號整合單元。光偵測模組針對多個發光區在多個不同的偵測位置分別偵測至少部分這些發光區之光強度，以得到分別對應於這些偵測位置的多個光強度訊號。訊號整合單元整合這些光強度訊號，以得到與這些發光區相關的一整體光強度評估值。 An embodiment of the present invention provides an optical measurement system including a light detection module and a signal integration unit. The light detecting module detects the light intensity of at least some of the light emitting regions at a plurality of different detecting positions for the plurality of light emitting regions to obtain a plurality of light intensity signals respectively corresponding to the detected positions. The signal integration unit integrates these light intensity signals to obtain an overall light intensity assessment associated with these illumination zones.

本發明之一實施例提出一種光學量測方法，包括下列步驟。針對多個發光區，在多個不同的偵測位置分別偵測至少部分這些發光區之光強度，以得到分別對應於這些偵測位置的多個光強度訊號。整合這些光強度訊號，以得到與這些發光區相關的一整體光強度評估值。 An embodiment of the invention provides an optical metrology method comprising the following steps. For a plurality of illuminating regions, the light intensities of at least some of the illuminating regions are respectively detected at a plurality of different detecting positions to obtain a plurality of light intensity signals respectively corresponding to the detected positions. These light intensity signals are integrated to obtain an overall light intensity estimate associated with these illumination zones.

本發明之一實施例提出一種用以架設光學量測系統的承載結構，包括一支撐架及至少一安裝件。安裝件將光學量測系統的至 少一光偵測器可移動地或不可移動地安裝於支撐架上，以提供多個不同的偵測位置而讓光偵測器在這些偵測位置偵測而分別得到多個光強度訊號，其中光學量測系統的一訊號整合單元整合這些光強度訊號。 One embodiment of the present invention provides a load bearing structure for erecting an optical measurement system, including a support frame and at least one mounting member. Mounting parts will be optical measuring system to The less than one photodetector is movably or non-movably mounted on the support frame to provide a plurality of different detection positions for the photodetector to detect at the detection positions to obtain a plurality of light intensity signals respectively. A signal integration unit of the optical measurement system integrates the light intensity signals.

本發明之一實施例提出一種光學量測系統，用以量測一發光裝置。光學量測系統包括一光偵測模組及一訊號整合單元。光偵測模組針對發光裝置在多個不同的偵測位置分別偵測至少部分發光裝置的光強度，以得到分別對應於這些偵測位置的多個光強度訊號。訊號整合單元整合這些光強度訊號，以得到一與發光裝置相關的整體光強度評估值。 An embodiment of the invention provides an optical metrology system for measuring a lighting device. The optical measurement system includes a light detection module and a signal integration unit. The light detecting module detects the light intensity of at least a portion of the light emitting devices at a plurality of different detecting positions for the light emitting device to obtain a plurality of light intensity signals respectively corresponding to the detected positions. The signal integration unit integrates these light intensity signals to obtain an overall light intensity evaluation value associated with the illumination device.

基於上述，在本發明之實施例之光學量測系統與光學量測方法中，是在多個不同的偵測位置分別偵測這些發光區或發光裝置的光強度，且整合所得到的這些光強度訊號以得到整體光強度評估值。因此，此整體光強度評估值是在這些發光區或發光裝置的位置、這些偵測位置及其他可能的發光或偵測光條件所產生的整體光強度權重分佈較為均一化的情況下所測得的。如此一來，此整體光強度評估值有助於判別發光裝置或這些發光區是有多少個單位的光損失，或判別有多少數量的發光區無法正常運作。此外，在本發明之實施例之承載結構中，利用安裝件將光偵測器可移動地或不可移動地安裝於支撐架上，其有利於使光學量測系統實現準確度高的量測。 Based on the above, in the optical measuring system and the optical measuring method according to the embodiment of the present invention, the light intensity of the light emitting regions or the light emitting devices are respectively detected at a plurality of different detecting positions, and the obtained light is integrated. The intensity signal is used to obtain an overall light intensity evaluation value. Therefore, the overall light intensity evaluation value is measured in the case where the positions of the light-emitting areas or the light-emitting devices, the detection positions, and other possible light-emitting or detecting light conditions are uniform in the overall light intensity weight distribution. of. In this way, the overall light intensity evaluation value helps to determine how many units of light loss in the light-emitting device or the light-emitting areas, or to determine how many light-emitting areas are not functioning properly. In addition, in the load-bearing structure of the embodiment of the present invention, the photodetector is movably or non-movably mounted on the support frame by using the mounting member, which is advantageous for the optical measurement system to achieve highly accurate measurement.

為讓本發明之上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。 The above described features and advantages of the present invention will be more apparent from the following description.

圖1A為本發明之一實施例之光學量測系統及承載結構的側視示意圖，而圖1B繪示當圖1A的光學量測系統量測一正常運作的發光裝置時，各光偵測器之感光強度分佈函數及所有光偵測器之總感光強度分佈函數。圖1C繪示圖1A之光學量測系統中的光偵測器之邊界條件。請先參照圖1A，本實施例之光學量測系統100用以量測多個發光區52，例如是量測一發光裝置50的多個發光區52。然而，在其他實施例中，這些發光區52亦可各自獨立，而分別屬於不同的發光裝置。在本實施例中，光學量測系統100包括一光偵測模組110及一訊號整合單元120。光偵測模組110針對這些發光區52(或例如針對整個發光裝置50)在多個不同的偵測位置P分別偵測至少部分這些發光區52(或至少部分發光裝置50)之光強度，以得到分別對應於這些偵測位置P的多個光強度訊號G。在本實施例中，光偵測模組110在每一偵測位置P偵測所有的發光區52之光強度。 1A is a side elevational view of an optical measurement system and a load-bearing structure according to an embodiment of the present invention, and FIG. 1B illustrates each optical detector when the optical measurement system of FIG. 1A measures a normally operating illumination device. The light intensity distribution function and the total light intensity distribution function of all photodetectors. FIG. 1C illustrates boundary conditions of a photodetector in the optical metrology system of FIG. 1A. Referring to FIG. 1A , the optical measurement system 100 of the present embodiment is configured to measure a plurality of light-emitting regions 52 , for example, a plurality of light-emitting regions 52 of a light-emitting device 50 . However, in other embodiments, the illuminating regions 52 may also be independent of each other and belong to different illuminating devices. In this embodiment, the optical measurement system 100 includes a light detection module 110 and a signal integration unit 120. The light detecting module 110 detects the light intensity of at least a portion of the light emitting regions 52 (or at least portions of the light emitting devices 50) at the plurality of different detecting positions P for the light emitting regions 52 (or for example, for the entire light emitting device 50). A plurality of light intensity signals G respectively corresponding to the detected positions P are obtained. In this embodiment, the light detecting module 110 detects the light intensity of all the light emitting regions 52 at each detecting position P.

在本實施例中，每一發光區52由一發光元件54所貢獻，其中發光元件54例如為發光二極體，而這些發光二極體配置於一條狀承載器56上，以形成一發光二極體燈管。然而，在其他實施例中，發光元件54亦可以是其他適當的發光元件。在本實施例中，發光裝置50例如為一發光二極體光條(LED light bar)，亦即這些發光元件54沿著一直線排列。然而，在其他實施例中，這些發光元件54亦可以是沿著兩條以上的平行直線排列，或排成二維陣列。然而，在其他實施例中，這些發光區52亦可以是連續接合成一連續的發光線或發光面，亦即這些發光區52形成一連續的線光源或面光源。 In this embodiment, each of the light-emitting regions 52 is contributed by a light-emitting element 54, wherein the light-emitting elements 54 are, for example, light-emitting diodes, and the light-emitting diodes are disposed on the strip-shaped carrier 56 to form a light-emitting diode. Polar body lamp. However, in other embodiments, the light-emitting element 54 can also be other suitable light-emitting elements. In the present embodiment, the light-emitting device 50 is, for example, an LED light bar, that is, the light-emitting elements 54 are arranged along a straight line. However, in other embodiments, the light-emitting elements 54 may also be arranged along two or more parallel lines or arranged in a two-dimensional array. However, in other embodiments, the illuminating regions 52 may be continuously joined into a continuous illuminating line or illuminating surface, that is, the illuminating regions 52 form a continuous line source or surface source.

在本實施例中，光偵測模組110包括多個光偵測器112，其分別配置於這些偵測位置P上。此外，在本實施例中，這些光偵測器112例如各為一光譜儀，而其所測得的光強度例如為光譜中的光強度，亦即可測得不同波長的光強度。然而，在其他實施例中，這些光偵測器112亦可以是一光強度計，例如為輻照度計，而其所測得的光強度例如為輻照度(irradiance)。或者，在其他實施例中，光偵測器112所測得的光強度(light intensity)亦可以是其他種類的光強度，例如照度(illuminance)、輻射亮度(radiance)、輝度(luminance)、輻射強度(radiant intensity)、發光強度(luminous intensity)等。再者，訊號整合單元120整合這些光強度訊號G，以得到與這些發光區52相關(或與發光裝置50相關)的一整體光強度評估值。在本實施例中，每一光偵測器112的入光口配置有一擴散器113，例如為餘弦校正器(cosine corrector)，其可將各個方向入射的光都導引至光偵測器112內。在另一實施例中，亦可不採用餘弦校正器或其他擴散器，則光偵測器112可具有一有限的收光角度範圍。 In this embodiment, the photodetection module 110 includes a plurality of photodetectors 112 respectively disposed at the detection positions P. In addition, in the embodiment, the photodetectors 112 are each a spectrometer, and the measured light intensity is, for example, the light intensity in the spectrum, and the light intensities of different wavelengths can be measured. However, in other embodiments, the photodetectors 112 can also be a light intensity meter, such as an irradiance meter, and the measured light intensity is, for example, irradiance. Alternatively, in other embodiments, the light intensity measured by the photodetector 112 may be other types of light intensities, such as illuminance, radiance, luminance, and radiation. Radiant intensity, luminous intensity, and the like. Moreover, the signal integration unit 120 integrates the light intensity signals G to obtain an overall light intensity evaluation value associated with the light-emitting regions 52 (or associated with the light-emitting device 50). In this embodiment, the light entrance of each photodetector 112 is provided with a diffuser 113, such as a cosine corrector, which can guide the light incident in all directions to the photodetector 112. Inside. In another embodiment, the cosine corrector or other diffuser may not be used, and the photodetector 112 may have a limited range of light collection angles.

請再參照圖1A與圖1B，圖1B中的橫軸為位置，其中發光裝置50的中心點是落在位置為0處，而縱軸為感光強度。在本實施例中，感光強度例如為輻照度。當光偵測模組110在一偵測位置P偵測一正常運作的發光裝置50(其具有正常運作的多個發光區52)時，正常運作的發光裝置50之不同的發光區52(或正常運作的發光裝置50上的多個不同位置)貢獻給光偵測模組110的感光強度相對於這些不同的發光區52的位置(或相對於發光裝置50上的這些不同位置)具有一感光強度分佈函數(如曲線C1、C2、 C3及C4)。此外，這些偵測位置P的這些感光強度分佈函數(即曲線C1、C2、C3及C4)加總後成為一總感光強度分佈函數(即曲線CT)。 Referring again to FIGS. 1A and 1B, the horizontal axis in FIG. 1B is a position in which the center point of the light-emitting device 50 is at a position of 0, and the vertical axis is a photosensitive intensity. In the present embodiment, the photographic intensity is, for example, irradiance. When the light detecting module 110 detects a normally operating light emitting device 50 (having a plurality of normally operating light emitting regions 52) at a detecting position P, the different light emitting regions 52 of the normally operating light emitting device 50 (or The plurality of different locations on the normally functioning illumination device 50 contributes a sensitivity to the position of the photodetection module 110 relative to the locations of the different illumination zones 52 (or relative to the different locations on the illumination device 50). Intensity distribution function (such as curves C1, C2 C3 and C4). In addition, these photosensitivity distribution functions (ie, curves C1, C2, C3, and C4) of these detected positions P are summed to become a total photosensitive intensity distribution function (ie, curve CT).

在本實施例中，這些發光區52排列於一參考線R上。然而，在另一實施例中，這些發光區52亦可以是排列於一參考面上，其中參考面例如是包含參考線R且實質上垂直於圖1A之圖面的平面。當圖1A中的發光裝置50的長度L為120公分，光偵測器112至參考線R(或參考面)的垂直距離H為30公分，且光偵測器112的節距(pitch)T為30公分時，經由模擬計算可得到這些曲線C1、C2、C3及C4。這些曲線C1、C2、C3及C4(即代表感光強度分佈函數)是考慮了發光區52的輻射角度分佈與光偵測器112的感度角度分佈而計算出來的。此外，感光強度分佈函數的物理意義為發光裝置50上的不同位置貢獻給對應的光偵測器112的感光強度權重之分佈。換言之，至少部分發光裝置50上的不同位置貢獻給某一特定的光偵測器112的感光強度的權重並不相同。 In the present embodiment, the light-emitting regions 52 are arranged on a reference line R. However, in another embodiment, the light-emitting regions 52 may also be arranged on a reference surface, wherein the reference surface is, for example, a plane containing the reference line R and substantially perpendicular to the plane of FIG. 1A. When the length L of the light-emitting device 50 in FIG. 1A is 120 cm, the vertical distance H of the photodetector 112 to the reference line R (or the reference surface) is 30 cm, and the pitch of the photodetector 112 is T. At 30 cm, these curves C1, C2, C3, and C4 are obtained through simulation calculations. These curves C1, C2, C3, and C4 (i.e., representative photosensitivity distribution functions) are calculated in consideration of the radiation angle distribution of the light-emitting region 52 and the sensitivity angular distribution of the photodetector 112. In addition, the physical meaning of the photo-intensity distribution function is the distribution of the intensity intensity weights contributed to the corresponding photodetectors 112 at different locations on the illumination device 50. In other words, the weights of the photosensitivity of a particular photodetector 112 contributed by different locations on at least a portion of the illumination device 50 are not the same.

若只用一個光偵測器112在一個偵測位置P偵測發光裝置50所提供的光強度時，當此光偵測器112正下方的發光區52的亮度衰減或此發光區52損壞而無法發光時，光偵測器112所實際測得的光強度之衰減程度會較大，這是因為光偵測器112正下方的發光區52貢獻給光偵測器112的感光強度權重較重。反之，當此光偵測器112斜下方的發光區52的亮度衰減或此發光區52損壞而無法發光時，光偵測器112所實際測得的光強度之衰減程度會較小，這是因為光偵測器112斜下方的發光區52貢獻給光偵測器112的感光強度權重較輕。換言之，光偵測器112正下方的較少數量 之發光區52損壞或此發光區52較小程度之光強度衰減對光偵測器112所測得的光強度之衰減程度所產生的效力相當於光偵測器112斜下方的較多數量之發光區52損壞或此發光區52較大程度之光強度衰減所產生的效力。如此一來，單從光偵測器112所測得的光強度之衰減程度並無法判斷發光裝置50中有多少數量的發光區52損壞，或有多少單位的輻射通量(或光通量)的衰減。 If only one photodetector 112 detects the light intensity provided by the illuminating device 50 at a detecting position P, the brightness of the illuminating region 52 directly under the photodetector 112 is attenuated or the illuminating region 52 is damaged. When the light cannot be illuminated, the intensity of the light intensity actually measured by the light detector 112 is greater, because the light intensity of the light-emitting area 52 directly under the light detector 112 is relatively heavy to the light detector 112. . On the contrary, when the brightness of the light-emitting area 52 obliquely below the light detector 112 is attenuated or the light-emitting area 52 is damaged and cannot be illuminated, the intensity of the light intensity actually measured by the photodetector 112 is small, which is Because the light-emitting area 52 obliquely below the light detector 112 contributes light intensity to the photodetector 112 is lighter. In other words, a smaller number directly below the photodetector 112 The illuminating area 52 is damaged or the light intensity attenuation of the illuminating area 52 is less effective in attenuating the light intensity measured by the photodetector 112 than the slanting lower portion of the photodetector 112. The illuminating region 52 is damaged or the illuminating region 52 is more effective in attenuating the light intensity. As a result, the degree of attenuation of the light intensity measured by the photodetector 112 alone cannot determine how much of the illuminating region 52 in the illuminating device 50 is damaged, or how many units of radiant flux (or luminous flux) are attenuated. .

然而，在本實施例中，訊號整合單元120是整合來自光偵測模組110的這些光偵測器112的這些光強度訊號G，以得到整體光強度評估值，因此影響這個整體光強度評估值的是將曲線C1、C2、C3及C4所代表的感光強度分佈函數相加後所得到的總感光強度分佈函數(其曲線如曲線CT所示)。由圖1B可得知，總感光強度分佈函數(即曲線CT)的均勻度遠大於各別的曲線C1、C2、C3、C4之感光強度分佈函數的均勻度。如此一來，發光裝置50上不同的發光區52的位置對所有光偵測器112所量測到的整體光強度評估值所貢獻之權重會較為一致。所以，藉由整體光強度評估值之衰減程度便較容易判斷或推測發光裝置50整體而言是有多少數量的發光區52損壞，或較容易判斷或推測發光裝置50的這些發光區52整體而言是有多少單位的輻射通量(或光通量)之衰減。在本實施例中，每一光強度訊號G為一電訊號，而訊號整合單元120為一運算單元。運算單元將這些光強度訊號G作運算處理，以得到整體光強度評估值。具體而言，在本實施例中，運算單元將這些光強度訊號G加總，以得到整體光強度評估值。換言之，在本實施例中，整體光強度評估值的物理意義為在所有的偵測位置所測得的光強度之加總。 However, in this embodiment, the signal integration unit 120 integrates the light intensity signals G from the photodetectors 112 of the photodetection module 110 to obtain an overall light intensity evaluation value, thereby affecting the overall light intensity evaluation. The value is the total photosensitive intensity distribution function obtained by adding the photosensitive intensity distribution functions represented by the curves C1, C2, C3, and C4 (the curves are as shown by the curve CT). As can be seen from FIG. 1B, the uniformity of the total photosensitive intensity distribution function (ie, the curve CT) is much larger than the uniformity of the photosensitive intensity distribution functions of the respective curves C1, C2, C3, and C4. As a result, the positions of the different light-emitting regions 52 on the light-emitting device 50 will be more consistent with the weights of the overall light intensity evaluation values measured by all of the light detectors 112. Therefore, it is easier to judge or estimate the number of light-emitting regions 52 of the light-emitting device 50 as a whole by the attenuation degree of the overall light intensity evaluation value, or it is easier to judge or estimate the light-emitting regions 52 of the light-emitting device 50 as a whole. It is the attenuation of the number of units of radiant flux (or luminous flux). In this embodiment, each light intensity signal G is an electrical signal, and the signal integration unit 120 is an arithmetic unit. The arithmetic unit performs arithmetic processing on these light intensity signals G to obtain an overall light intensity evaluation value. Specifically, in the present embodiment, the arithmetic unit adds up the light intensity signals G to obtain an overall light intensity evaluation value. In other words, in the present embodiment, the physical meaning of the overall light intensity evaluation value is the sum of the light intensities measured at all of the detected positions.

在本實施例中，這些偵測位置P位於發光裝置50的同一側。舉例而言，從圖1A可看出，這些偵測位置P都同樣位於發光裝置50的上方。訊號整合單元120將光偵測模組110的這些光偵測器112所測得的這些光強度訊號加總的效應類似於積分球的積分效應，因此本實施例之光學量測系統100實現了類似於單側積分的效應，但本實施例之光學量測系統100的體積卻能夠比習知用以量測燈管或發光條的積分球的體積小。因此，採用本實施例之光學量測系統將有助於產線的規劃。再者，由於習知積分球的體積大，積分球的內表面的反射率要高，且為使積分球的內表面維持高反射率，因此積分球的製造成本與維護成本都高。相較之下，由於本實施例之光學量測系統100的體積較小，光學量測系統100可以不採用面積大且反射率高的反射面，且可以不用維持這個反射面的高反射率，因此本實施例之光學量測系統100的製造成本與維護成本都可以減少。 In the present embodiment, these detection positions P are located on the same side of the light-emitting device 50. For example, as can be seen from FIG. 1A, these detection positions P are also located above the illumination device 50. The signal integration unit 120 adds the effects of the light intensity signals measured by the light detectors 112 of the light detecting module 110 to the integration effect of the integrating sphere. Therefore, the optical measuring system 100 of the embodiment implements Similar to the effect of one-sided integration, the volume of the optical metrology system 100 of the present embodiment can be smaller than the volume of an integrating sphere that is conventionally used to measure a tube or a light strip. Therefore, the use of the optical measurement system of the present embodiment will contribute to the planning of the production line. Furthermore, since the volume of the conventional integrating sphere is large, the reflectance of the inner surface of the integrating sphere is high, and in order to maintain the high reflectance of the inner surface of the integrating sphere, the manufacturing cost and maintenance cost of the integrating sphere are high. In contrast, since the optical measuring system 100 of the present embodiment has a small volume, the optical measuring system 100 can not use a reflecting surface having a large area and a high reflectance, and can maintain the high reflectance of the reflecting surface. Therefore, the manufacturing cost and maintenance cost of the optical measuring system 100 of the present embodiment can be reduced.

另外，在本實施例中，是採用光譜儀作為光偵測器112，而光譜儀可測得不同頻率的光之光強度。因此，當發光區52有多種不同的顏色時，訊號整合單元120可分別整合光譜儀所測得的對應於多個不同頻率範圍之光強度。具體而言，當發光區52可發出紅光、綠光與藍光時，訊號整合單元120可將所有光譜儀所測得之紅光範圍的光強度整合，而得到一對應於紅光的整體光強度評估值，且將所有光譜儀所測得之綠光範圍的光強度整合，而得到一對應於綠光的整體光強度評估值，亦將所有光譜儀所測得之藍光範圍的光強度整合，而得到一對應於藍光的整體光強度評估值。如此一來，光學量測系統100便可判斷是哪種顏色的發光區 52之光強度有衰減且衰減多少單位，或者判斷是哪種顏色的發光區52有損壞或損壞幾個。 In addition, in the present embodiment, a spectrometer is used as the photodetector 112, and the spectrometer can measure the light intensity of light of different frequencies. Therefore, when the illuminating region 52 has a plurality of different colors, the signal integrating unit 120 can respectively integrate the light intensities corresponding to the plurality of different frequency ranges measured by the spectrometer. Specifically, when the light-emitting region 52 can emit red light, green light, and blue light, the signal integration unit 120 can integrate the light intensity of the red light range measured by all the spectrometers to obtain an overall light intensity corresponding to the red light. Evaluating the values and integrating the light intensities of the green light range measured by all the spectrometers to obtain an overall light intensity evaluation value corresponding to the green light, and integrating the light intensity of the blue light range measured by all the spectrometers to obtain An overall light intensity evaluation value corresponding to blue light. In this way, the optical measurement system 100 can determine which color of the light-emitting area The light intensity of 52 is attenuated and attenuated by a number of units, or it is judged which color of the light-emitting area 52 is damaged or damaged.

再者，當本實施例之光學量測系統100所量測的發光裝置50為發光二極體燈管時，由於發光二極體具有高指向性，其通常為單側發光，因此光學量測系統100的單側積分效果適合量測發光二極體燈管。此外，由於發光二極體燈管的每個發光區52例如是由一個發光二極體所提供，且這些發光區52的光學參數通常差異不大，因此以本實施例之光學量測系統100來量測時，便容易判斷出是有多少數量的發光二極體損壞。 Furthermore, when the illuminating device 50 measured by the optical measuring system 100 of the present embodiment is a light-emitting diode lamp, since the illuminating diode has high directivity, it is usually one-sided illuminating, so optical measurement The one-sided integration effect of system 100 is suitable for measuring light-emitting diode lamps. In addition, since each of the light-emitting regions 52 of the light-emitting diode lamp is provided by, for example, one light-emitting diode, and the optical parameters of the light-emitting regions 52 are generally not significantly different, the optical measuring system 100 of the present embodiment is used. When measuring, it is easy to determine how many LEDs are damaged.

在本實施例中，可利用一承載結構200來架設光學量測系統100，承載結構200包括一支撐架220及至少一安裝件230(圖1A中是以多個安裝件230為例)。安裝件230將光偵測器112可移動地或不可移動地安裝於支撐架220上，以提供這些偵測位置P而讓光偵測器112在這些偵測位置P偵測。在本實施例中，安裝件230例如為一固定件，其將這些光偵測器112不可移動地固定於支撐架220上，且固定於這些偵測位置P上。安裝件230例如夾具、鎖固構件或其他適當的固定件。此外，安裝件230可與支撐架220一體成型或各自成型。在本實施例中，承載結構200更包括一承載器210，其承載發光裝置50。在本實施例中，承載器210例如為一承載台或一承載板，而支撐架220可固定於承載器210上，但這僅是一種選擇實施例。在其他實施例中，承載器210例如是一輸送帶或其他輸送裝置，其可在不同的時間將不同的發光裝置50輸送至光偵測模組110下以供量測。如此一來，本實施例之光學量測系統100便可設置於產線上而實現大量量測。此外， 支撐架220亦可與承載器210分開設置。 In this embodiment, the optical measurement system 100 can be erected by using a load-bearing structure 200. The load-bearing structure 200 includes a support frame 220 and at least one mounting member 230 (the plurality of mounting members 230 are exemplified in FIG. 1A). The mounting member 230 mounts the photodetector 112 movably or immovably on the support frame 220 to provide the detection positions P for the photodetector 112 to detect at the detection positions P. In this embodiment, the mounting member 230 is, for example, a fixing member that non-movably fixes the photodetectors 112 to the support frame 220 and is fixed to the detecting positions P. Mounting member 230 is, for example, a clamp, a locking member, or other suitable fastener. In addition, the mounting members 230 may be integrally formed with the support frame 220 or formed separately. In this embodiment, the load bearing structure 200 further includes a carrier 210 that carries the light emitting device 50. In this embodiment, the carrier 210 is, for example, a carrier or a carrier, and the support frame 220 can be fixed to the carrier 210, but this is only an alternative embodiment. In other embodiments, the carrier 210 is, for example, a conveyor belt or other transport device that can deliver different illumination devices 50 to the light detection module 110 for measurement at different times. In this way, the optical measurement system 100 of the present embodiment can be placed on the production line to achieve a large amount of measurement. In addition, The support frame 220 can also be disposed separately from the carrier 210.

此外，請參照圖1A、圖1B與圖1C，在本實施例中，當光偵測模組110在這些偵測位置P中之位於邊緣的多個偵測位置P1的每一個上偵測一正常運作的發光裝置50時，正常運作的發光裝置50上的不同的發光區52貢獻給光偵測模組110的感光強度相對於這些不同的發光區52的位置具有一邊緣感光強度分佈函數(即圖1B所繪示的曲線C1與曲線C4，而圖1C中以曲線C1為例)。這些偵測位置P1使這些發光區52皆落在這些偵測位置P1的這些邊緣感光強度分佈函數(即曲線C1及C2)的最大值之一半所對應的多個邊界位置S1之內。舉例而言，曲線C1所代表的邊緣感光強度分佈函數的最大值即為曲線C1的波峰K之光強度，而此最大值之一半例如為曲線C1上之點N1之光強度。其中，每一邊界位置S1為邊緣感光強度分佈函數的最大值之一半(如曲線C1上的點N1及N2的光強度)所對應的多個位置(包括圖1C中S1與S2所標示的位置)中之最遠離這些發光區52之整體的中心者(即圖1C中S1所標示的位置)。換言之，邊界位置S1與位置S2之間的距離即為曲線C1的半高寬(full width at half maximum,FWHM)。當這些發光區52排列成二維陣列時，上述之一個邊緣感光強度分佈函數之最大值之一半所對應的位置不只是圖1C中S1與S2所標示的二個位置，而是這些最大值之一半所對應的位置在二維空間上會有無數個且連成一曲線。在此曲線上仍可找到至少一個點(即至少一個位置)是最遠離這些發光區52之整體的中心的，而這一點(即這個位置)即為邊界位置S1，且呈二維陣列排列的這些發光區皆位於所有的邊緣感光強度分佈函數之邊界 位置S1之內。 In addition, referring to FIG. 1A, FIG. 1B and FIG. 1C, in the embodiment, when the light detecting module 110 detects one of the plurality of detecting positions P1 located at the edge among the detecting positions P, In the normally operating illuminating device 50, the illuminating intensity of the different illuminating regions 52 on the normally operating illuminating device 50 to the photodetecting module 110 has an edge illuminance intensity distribution function relative to the positions of the different illuminating regions 52 ( That is, the curve C1 and the curve C4 are shown in FIG. 1B, and the curve C1 is taken as an example in FIG. 1C. The detection positions P1 cause the light-emitting regions 52 to fall within a plurality of boundary positions S1 corresponding to one-half of the maximum values of the edge photosensitive intensity distribution functions (ie, the curves C1 and C2) of the detection positions P1. For example, the maximum value of the edge photosensitive intensity distribution function represented by the curve C1 is the light intensity of the peak K of the curve C1, and one half of the maximum value is, for example, the light intensity of the point N1 on the curve C1. Wherein, each boundary position S1 is a plurality of positions corresponding to one-half of the maximum value of the edge photosensitive intensity distribution function (such as the light intensity of points N1 and N2 on the curve C1) (including the positions indicated by S1 and S2 in FIG. 1C). The farthest from the center of these illuminating regions 52 (i.e., the position indicated by S1 in Fig. 1C). In other words, the distance between the boundary position S1 and the position S2 is the full width at half maximum (FWHM) of the curve C1. When the light-emitting regions 52 are arranged in a two-dimensional array, the position corresponding to one of the maximum values of one of the edge photosensitive intensity distribution functions is not only the two positions indicated by S1 and S2 in FIG. 1C, but the maximum values. Half of the corresponding positions will have innumerable numbers in a two-dimensional space and form a curve. It can still be found on this curve that at least one point (i.e., at least one position) is farthest from the center of the entire illumination area 52, and this point (i.e., this position) is the boundary position S1 and is arranged in a two-dimensional array. These illuminating regions are located at the boundary of all edge illuminance intensity distribution functions. Within location S1.

在本實施例中，當發光裝置50的這些發光區52位於曲線C1與曲線C4的兩個邊界位置S1以內時，或者以另一個角度來看，當這些偵測位置P的配置而使得邊界位置S1位於所有這些發光區52以外時，總感光強度分佈函數(即曲線CT)的均勻度會較為理想，而能夠達到更為近似單側積分的效果。此外，當這些發光區52上方設置有擴散燈罩時，亦即發光區52與偵測位置P之間設有擴散燈罩時，本實施例之光學量測系統100亦可測得發光裝置50之整體光強度評估值。這是因為擴散燈罩將發光區52所發出的光擴散得更為均勻，而仍可達到均勻的總感光強度分佈函數，甚至可提升總感光強度分佈函數的均勻度。 In this embodiment, when the light-emitting regions 52 of the light-emitting device 50 are located within the two boundary positions S1 of the curve C1 and the curve C4, or at another angle, when the positions of the detection positions P are configured to make the boundary position When S1 is located outside of all of these illuminating regions 52, the uniformity of the total photographic intensity distribution function (i.e., curve CT) is ideal, and the effect of more unilateral integration can be achieved. In addition, when the diffusing lamp cover is disposed above the light-emitting area 52, that is, when the diffusing lamp cover is disposed between the light-emitting area 52 and the detecting position P, the optical measuring system 100 of the embodiment can also measure the whole of the light-emitting device 50. Light intensity evaluation value. This is because the diffusion lampshade diffuses the light emitted by the illuminating region 52 more uniformly, and still achieves a uniform total photographic intensity distribution function, and even improves the uniformity of the total photographic intensity distribution function.

在本實施例中，可使這些偵測位置P落在使總感光強度分佈函數(即曲線CT)大於這些感光強度分佈函數(即曲線C1、C2、C3及C4)中的任一個的均勻度，其中均勻度的定義為一總感光強度分佈函數(或一感光強度分佈函數)中的最小值除以最大值後所得到的比值。在本實施例中，為了達到良好的近似於單側積分的效果，可使這些偵測位置P落在使總感光強度分佈函數(即曲線CT)的均勻度大於等於80%的位置上。或者，從另一角度來看，在本實施例中，每一發光區52貢獻給所有的這些偵測位置P的光強度總和為一總合值，且這些發光區52之這些總合值彼此實質上相同。舉例而言，可點亮這些發光區52其中之一，但不點亮其他發光區52，此時所有的偵測位置P所測得的光強度加總後，即為這個被點亮的發光區52的總合值。然後，可點亮另一個發光區52，且不點亮其他發光區52，如此便可得到此另一個被點亮的發 光區之總合值。當所有的發光區52都被單獨點亮並偵測後，在本實施例中可發現這些發光區52的這些總合值彼此實質上相同。 In this embodiment, the detection positions P can be made to have a uniformity in which the total photosensitive intensity distribution function (ie, the curve CT) is greater than any of the photosensitive intensity distribution functions (ie, the curves C1, C2, C3, and C4). Where uniformity is defined as the ratio obtained by dividing the minimum value in a total photosensitive intensity distribution function (or a photosensitive intensity distribution function) by the maximum value. In the present embodiment, in order to achieve a good effect of approximating the one-sided integration, these detection positions P can be made to fall at a position where the uniformity of the total photosensitive intensity distribution function (i.e., the curve CT) is 80% or more. Or, from another point of view, in the present embodiment, the sum of the light intensities contributed to all of the detected positions P by each of the light-emitting regions 52 is a total value, and the total combined values of the light-emitting regions 52 are mutually Essentially the same. For example, one of the light-emitting regions 52 can be illuminated, but the other light-emitting regions 52 are not illuminated. At this time, the light intensity measured by all the detected positions P is added, that is, the lighted light is emitted. The total value of zone 52. Then, the other light-emitting area 52 can be illuminated, and the other light-emitting areas 52 are not lit, so that the other lighted light can be obtained. The total value of the light zone. When all of the light-emitting regions 52 are individually illuminated and detected, it is found in the present embodiment that these summed values of the light-emitting regions 52 are substantially identical to each other.

在本實施例中，安裝件230所提供的這些偵測位置P是落在使這些發光區52之這些總合值彼此實質上相同的位置上。當這些發光區52之這些總合值彼此實質上相同時，則每一個發光區52貢獻給整個光偵測模組110的光強度不隨著發光區52所在位置的不同而有實質上的變化。如此一來，當整體光強度評估值下降時，便有利於評估發光裝置50整體而言是有多少數量的發光區52損壞，或評估發光裝置50整體而言是有多少單位的輻射通量(或光通量)之衰減。此處這些總合值彼此實質上相同的意思並非表示這些總合值要完全相等，而是表示這些總合值的最大差異之容忍度要在仍然能夠評估發光裝置50整體而言是有多少數量的發光區52損壞或有多少單位的輻射通量(或光通量)之衰減的範圍內。舉例而言，這些總合值的最大差異是在這些總合值中的最大值之20%以內。 In the present embodiment, the detection positions P provided by the mounting member 230 fall at positions where the total values of the light-emitting regions 52 are substantially identical to each other. When the total values of the light-emitting regions 52 are substantially the same as each other, the light intensity contributed by each of the light-emitting regions 52 to the entire light detecting module 110 does not substantially change depending on the position of the light-emitting region 52. . As a result, when the overall light intensity evaluation value is decreased, it is advantageous to estimate how many light-emitting regions 52 are damaged by the light-emitting device 50 as a whole, or to estimate how many units of radiant flux the light-emitting device 50 has ( Or the attenuation of the luminous flux). The fact that these aggregate values are substantially identical to each other herein does not mean that the total values are to be completely equal, but rather that the tolerance of the maximum difference of these total values is still able to assess how much the illuminating device 50 as a whole is. The illuminating region 52 is damaged or has a range of attenuation of the radiant flux (or luminous flux). For example, the largest difference in these aggregate values is within 20% of the maximum of these aggregate values.

在本實施例中，這些發光區52的光學特性彼此實質上相同。舉例而言，這些發光區52的發光面積彼此實質上相同，且這些發光區52的發光強度、光通量及光形分佈彼此實質上相同。此外，在本實施例中，每一個發光區52至不同的這些偵測位置P的距離至少部分不相同。 In the present embodiment, the optical characteristics of these light-emitting regions 52 are substantially identical to each other. For example, the light-emitting areas of the light-emitting regions 52 are substantially identical to each other, and the light-emitting intensity, the light flux, and the light-shaped distribution of the light-emitting regions 52 are substantially identical to each other. In addition, in this embodiment, the distance from each of the light-emitting regions 52 to the different detection positions P is at least partially different.

在本實施例中，光學量測系統100包括一電源供應器140，電性連接至發光裝置50，以驅動發光裝置50的發光區52發光。本實施例之光學量測系統100還可用以量測發光裝置50的熱衰減程度。舉例而言，可在電源供應器140剛點亮發光裝置50後即立 刻量測發光裝置50的整體光強度評估值。然後，在發光裝置50點亮一段時間後(例如在點亮72小時後)，再量測其整體光強度評估值。前後兩個整體光強度評估值相減後，即可得知發光裝置50的熱衰減程度。為了使熱衰減程度的量測更為準確，兩次量測時，除了發光裝置50已點亮的時間不同外，其他條件均應盡量一致，例如發光裝置50的擺放位置均應一致。由於發光二極體所發出的光的熱衰減現象較為明顯，當發光裝置50包含發光二極體時，光學量測系統100便可量測出發光二極體的熱衰減。 In the present embodiment, the optical measurement system 100 includes a power supply 140 electrically connected to the illumination device 50 to drive the illumination region 52 of the illumination device 50 to emit light. The optical measurement system 100 of the present embodiment can also be used to measure the degree of thermal attenuation of the illumination device 50. For example, the power supply 140 can be placed immediately after the lighting device 50 is turned on. The overall light intensity evaluation value of the light-emitting device 50 is measured. Then, after the illumination device 50 is illuminated for a period of time (for example, after 72 hours of illumination), its overall light intensity evaluation value is measured. After the two overall light intensity evaluation values are subtracted, the degree of thermal attenuation of the light-emitting device 50 can be known. In order to make the measurement of the degree of thermal attenuation more accurate, in the two measurements, except for the time when the illuminating device 50 has been illuminated, other conditions should be as uniform as possible, for example, the position of the illuminating device 50 should be consistent. Since the thermal attenuation of the light emitted by the light-emitting diode is relatively obvious, when the light-emitting device 50 includes the light-emitting diode, the optical measurement system 100 can measure the thermal attenuation of the light-emitting diode.

此外，當正常的發光裝置50原本的設計是希望這些發光區52對稱，且其光形亦對稱，則這些偵測位置P亦可以是對稱配置。如此一來，正常的發光裝置50亦使任兩個相互對稱的偵測位置P所量到的光強度實質上一致。因此，當左右任兩個對稱的偵測位置P所量測到的光強度不同時，便可判斷出發光裝置50中已有部分發光區52無法正常運作。或者，當某一個或某些偵測位置P所偵測到的光強度異常下降時，亦可推斷此偵測位置P或這些偵測位置P附近的發光區52無法正常運作。 In addition, when the normal illumination device 50 is originally designed to be symmetrical with respect to the illumination regions 52, and the light shape is also symmetrical, the detection positions P may also be symmetrically arranged. In this way, the normal illumination device 50 also substantially equalizes the intensity of the light measured by any two mutually symmetric detection positions P. Therefore, when the light intensity measured by the two symmetric detection positions P is different, it can be determined that some of the light-emitting areas 52 in the light-emitting device 50 cannot operate normally. Alternatively, when the light intensity detected by one or some of the detection positions P drops abnormally, it can be inferred that the detection position P or the light-emitting area 52 near the detection positions P cannot operate normally.

以上之實施例是採用發光區52位於邊界位置S1內的方法來達到使總感光強度分佈函數的均勻度較為理想的效果，但這僅是一種選擇實施例。下述的實施樹或其他實施例亦可使總感光強度分佈函數均勻化，或使上述這些總合值彼此實質上相同。在其他實施例中，亦可採用其他任何可使總感光強度分佈函數的均勻度大於等於80%的設計方式或採用任何可使上述這些總合值彼此實質上相同的設計方式，而其仍屬本發明所保護的範圍。 The above embodiment achieves the effect of making the uniformity of the total photosensitive intensity distribution function ideal by using the method in which the light-emitting region 52 is located at the boundary position S1, but this is only an alternative embodiment. The implementation tree or other embodiments described below may also homogenize the total photosensitivity distribution function or cause the above-mentioned aggregate values to be substantially identical to each other. In other embodiments, any other design method that can make the uniformity of the total photosensitive intensity distribution function equal to or greater than 80% or any design that can make the above-mentioned total values substantially identical to each other can be used. The scope of protection of the present invention.

圖2A為本發明之另一實施例之光學量測系統及承載結構的 側視示意圖，而圖2B繪示當圖2A的光學量測系統量測一正常運作的發光裝置時，各光偵測器之感光強度分佈函數及所有光偵測器之總感光強度分佈函數。請參照圖2A與圖2B，本實施例之光學量測系統100a與圖1A之光學量測系統100類似，而兩者的差異如下所述。本實施例之光學量測系統100a更包括至少一反射器130(圖2A中是以兩個反射器130為例)，其配置於這些發光區52之整體的周邊，且例如配置於這些偵測位置P之整體的周邊。在本實施例中，所有的這些偵測位置P位於兩反射器130之間。此外，所有的這些發光區52位於此兩反射器130之間。在本實施例中，兩反射器130例如是鏡面反射器，亦即為鏡子(mirror)，因此兩反射器130可在發光區52的排列方向上形成無限個發光區52的虛像，則光偵測模組100a所偵測到的相當於是一個無限延伸的發光裝置50，而發光裝置50上的發光區52則有無數個而排列於發光裝置50的延伸方向上。如此一來，光偵測模組100a的總感光強度分佈函數的均勻度便可以提升。這是因為對於一個無限延伸的發光裝置50而言，無論光偵測器112是配置於平行於發光裝置50的延伸方向排列的多個偵測位置P的哪一個，其整個發光裝置50的所有發光區52對於此光偵測器112的光強度貢獻幾乎都沒有差異。亦即，位於中央的偵測位置P與位於邊緣的偵測位置P之光偵測器112所被貢獻的光強度幾乎是一樣的。換言之，在本實施例中，這些發光區52的這些總合值彼此幾乎一樣。由圖2B可知，分別對應於這些偵測位置P的這些光強度分佈函數(即曲線C1a、C2a、C3a及C4a)加總後所得到的總感光強度分佈函數(即曲線CTa)之均勻度約為97%，這是在發光裝置50的長度 L為120公分，光偵測器112至發光裝置50的垂直距離H為30公分，且光偵測器112的節距(pitch)T為30公分時所模擬出的結果。由此可知，反射器130的配置確實可大幅提升總感光強度分佈函數的均勻度。 2A is an optical measuring system and a load bearing structure according to another embodiment of the present invention; FIG. 2B is a schematic diagram showing the photosensitive intensity distribution function of each photodetector and the total photointensity distribution function of all photodetectors when the optical measuring system of FIG. 2A measures a normally operating illumination device. Referring to FIGS. 2A and 2B, the optical measurement system 100a of the present embodiment is similar to the optical measurement system 100 of FIG. 1A, and the differences between the two are as follows. The optical measuring system 100a of the present embodiment further includes at least one reflector 130 (for example, two reflectors 130 in FIG. 2A), which are disposed around the entire periphery of the light-emitting regions 52, and are configured, for example, for these detections. The perimeter of the location P as a whole. In this embodiment, all of the detection positions P are located between the two reflectors 130. In addition, all of these illuminating regions 52 are located between the two reflectors 130. In this embodiment, the two reflectors 130 are, for example, specular reflectors, that is, mirrors, so that the two reflectors 130 can form a virtual image of an infinite number of light-emitting regions 52 in the direction in which the light-emitting regions 52 are arranged. The detection module 100a detects an equivalent infinitely extending illumination device 50, and the illumination region 52 on the illumination device 50 has an infinite number of rows arranged in the direction in which the illumination device 50 extends. As a result, the uniformity of the total light intensity distribution function of the light detecting module 100a can be improved. This is because, for an infinitely extending illumination device 50, regardless of which of the plurality of detection positions P arranged in parallel with the direction in which the illumination device 50 extends, all of the entire illumination device 50 The illuminating region 52 has almost no difference in the light intensity contribution of the photodetector 112. That is, the light intensity of the photodetector 112 at the central detection position P and the detection position P at the edge is almost the same. In other words, in the present embodiment, these total values of these light-emitting regions 52 are almost the same as each other. As can be seen from FIG. 2B, the uniformity of the total light intensity distribution function (ie, the curve CTa) obtained by summing these light intensity distribution functions (ie, the curves C1a, C2a, C3a, and C4a) corresponding to the detected positions P, respectively. 97%, which is the length of the illuminating device 50 L is 120 cm, the vertical distance H of the photodetector 112 to the light-emitting device 50 is 30 cm, and the result of the simulation when the pitch T of the photodetector 112 is 30 cm. It can be seen from this that the configuration of the reflector 130 can substantially increase the uniformity of the total photosensitive intensity distribution function.

在其他實施例中，反射器130亦可以是擴散式反射器，亦即發光區52所發出的光在入射擴散式反射器後，會被擴散式反射器漫射。擴散式反射器仍可達到提升總感光強度分佈函數的均勻度的效果。 In other embodiments, the reflector 130 can also be a diffused reflector, that is, the light emitted by the light-emitting region 52 is diffused by the diffused reflector after being incident on the diffused reflector. The diffused reflector still achieves the effect of increasing the uniformity of the total photointensity distribution function.

在本實施例中，承載結構200a與圖1A之承載結構200類似，而兩者的差異在於本實施例之承載結構200a的支撐架220a更固定了反射器130。 In the present embodiment, the load-bearing structure 200a is similar to the load-bearing structure 200 of FIG. 1A, and the difference between the two is that the support frame 220a of the load-bearing structure 200a of the present embodiment further fixes the reflector 130.

圖3A為本發明之又一實施例之光學量測系統及承載結構的側視示意圖，而圖3B繪示當圖3A的光學量測系統量測一正常運作的發光裝置時，各光偵測器之感光強度分佈函數及所有光偵測器之總感光強度分佈函數。請參照圖3A與圖3B，本實施例之光學量測系統100b與圖2A之光學量測系統100a類似，而兩者的差異如下所述。本實施例之光學量測系統100b包括至少一反射器130(如圖3A中的中間那個反射器130)，其穿插於這些偵測位置P之間。具體而言，在本實施例之光學量測系統100b所包括的多個反射器130中，部分反射器130配置於這些發光區52之整體的周邊(圖3A中是以兩個反射器130配置於這些發光區52之整體的相對兩側為例)，且另一部分反射器130穿插於這些偵測位置P之間(圖3A中是以一個反射器130配置於位於中央的兩個偵測位置P之間為例，且此反射器130亦位於所有偵測位置P的中 央)。然而，在其他實施例中，光學量測系統亦可包括穿插於這些偵測位置P之間的反射器130，但不包括配置於這些發光區52之整體的周邊的反射器130。中間的那個反射器130將所有的發光區52分成了左與右兩部分，左邊的那一部分的發光區52所發出的光會被最左邊的反射器130與中間的反射器130所反射。因此，對於左邊兩個光偵測器112而言，此兩光偵測器112相當於是在偵測一無限延伸的發光裝置。同樣地，右邊的那一部分的發光區52所發出的光會被最右邊的反射器130與中間的反射器130所反射。因此，對於右邊兩個光偵測器112而言，此兩光偵測器112亦相當於是在偵測一無限延伸的發光裝置。在圖2A的光學量測系統100a中，每一個光偵測器112都偵測了所有的發光區52。然而，在本實施例之光學量測系統100b中，每一個光偵測器112則是偵測一部分的發光區52(圖3A中是以偵測了一半的發光區52為例)。 3A is a side elevational view of an optical measurement system and a load-bearing structure according to still another embodiment of the present invention, and FIG. 3B illustrates each light detection when the optical measurement system of FIG. 3A measures a normally operating illumination device. The light intensity distribution function of the device and the total light intensity distribution function of all photodetectors. Referring to FIGS. 3A and 3B, the optical measurement system 100b of the present embodiment is similar to the optical measurement system 100a of FIG. 2A, and the differences between the two are as follows. The optical metrology system 100b of the present embodiment includes at least one reflector 130 (such as the middle reflector 130 in FIG. 3A) interposed between the detection locations P. Specifically, in the plurality of reflectors 130 included in the optical measurement system 100b of the present embodiment, the partial reflectors 130 are disposed at the periphery of the entire of the light-emitting regions 52 (FIG. 3A is configured with two reflectors 130). The opposite sides of the entire light-emitting area 52 are exemplified, and another partial reflector 130 is interposed between the detection positions P (in FIG. 3A, one reflector 130 is disposed at two centrally located detection positions). For example, between P, and the reflector 130 is also located in all the detection positions P. Central). However, in other embodiments, the optical metrology system may also include a reflector 130 interposed between the detection locations P, but does not include a reflector 130 disposed at the periphery of the entirety of the illumination zones 52. The reflector 130 in the middle divides all of the light-emitting areas 52 into left and right portions, and the light emitted from the light-emitting area 52 of the left portion is reflected by the leftmost reflector 130 and the intermediate reflector 130. Therefore, for the two photodetectors 112 on the left side, the two photodetectors 112 are equivalent to detecting an infinitely extending illumination device. Similarly, the light emitted by the illuminated portion 52 of the right portion is reflected by the rightmost reflector 130 and the intermediate reflector 130. Therefore, for the two photodetectors 112 on the right side, the two photodetectors 112 are also equivalent to detecting an infinitely extending illumination device. In the optical metrology system 100a of FIG. 2A, each of the photodetectors 112 detects all of the illumination zones 52. However, in the optical measuring system 100b of the present embodiment, each of the photodetectors 112 detects a portion of the illuminating region 52 (in FIG. 3A, for example, a half of the illuminating region 52 is detected).

由於左邊兩個光偵測器112與右邊兩個光偵測器112都相當於是在偵測無限延伸的發光裝置，故所有光偵測器112的感光強度分佈函數(即曲線C1b、曲線C2b、曲線C3b及曲線C4b)所加總而成的總感光強度分佈函數(即曲線CTb)之均勻度亦可高達97%。在本實施例中，由於位於中間的反射器130將所有的光偵測器112與發光區52分成左右兩半部，因此總感光強度分佈函數(即曲線CTb)的左半部是由曲線C1b與曲線C2b所貢獻，而右半部則是由曲線C3b與曲線C4b所貢獻。 Since the two photodetectors 112 on the left side and the two photodetectors 112 on the right side are equivalent to detecting the infinitely extending illumination device, the light intensity distribution function of all the photodetectors 112 (ie, the curve C1b, the curve C2b, The uniformity of the total photosensitive intensity distribution function (ie, curve CTb) added by the curve C3b and the curve C4b) can also be as high as 97%. In this embodiment, since the reflector 130 located in the middle divides all the photodetectors 112 and the light-emitting region 52 into two halves, the left half of the total photo-intensity distribution function (ie, the curve CTb) is defined by the curve C1b. Contributed to curve C2b, and the right half is contributed by curve C3b and curve C4b.

本實施例之承載結構200b與圖2A之承載結構200a類似，而兩者的差異如下所述。本實施例之承載結構200b的支撐架220b除了固定光偵測器112及位於這些偵測位置P的邊緣的反射器130 之外，還固定了穿插於這些偵測位置P之間的反射器130(如圖3A中的中間的那個反射器130)。 The load bearing structure 200b of the present embodiment is similar to the load bearing structure 200a of FIG. 2A, and the differences between the two are as follows. In addition to the fixed photodetector 112 and the reflector 130 at the edge of the detection position P, the support frame 220b of the carrying structure 200b of this embodiment In addition, a reflector 130 (such as the reflector 130 in the middle of Fig. 3A) interposed between these detection positions P is also fixed.

利用反射器130來將這些發光區52及這些偵測位置P分成多個部分還有助於判斷是哪一部分的發光區52無法正常運作。由於在某一部分的偵測位置P只會偵測到與其對應的那一部分的發光區52所發出的光，因此藉由判斷是哪一部分的偵測位置P所量測到的光強度下降，便可推斷是哪個部分的發光區52無法正常運作。 The use of the reflector 130 to divide the illumination regions 52 and the detection locations P into a plurality of portions also helps to determine which portion of the illumination region 52 is not functioning properly. Since the detected position P of a certain portion only detects the light emitted by the corresponding portion of the light-emitting region 52, it is determined by which part of the detected position P the measured light intensity is decreased. It can be inferred which part of the illuminating area 52 is not functioning properly.

圖4A為本發明之再一實施例之光學量測系統及承載結構的側視示意圖，而圖4B繪示當圖4A的光學量測系統量測一正常運作的發光裝置時，各光偵測器之感光強度分佈函數及所有光偵測器之總感光強度分佈函數。請參照圖4A與圖4B，本實施例之光學量測系統100c與圖3A之光學量測系統100b類似，而兩者的差異如下所述。在本實施例之光學量測系統100c中，任兩相鄰光偵測器112之間皆配置有一反射器130。換言之，任兩相鄰反射器130之間配置有一個光偵測器112。因此，這些反射器130將所有發光區52分隔成多個部分，而每一光偵測器112各自量測對應的發光區52的部分。由於反射器130的作用，對於每個光偵測器112而言，其相當於量測一無限延伸的發光裝置，因此發光區52所被分隔的每個部分對其所對應的光偵測器112所貢獻的光強度會差不多，如此一來，相對於每個光偵測器112的感光強度分佈函數(即曲線C1c、C2c、C3c及C4c)所加總而成的總感光強度分佈函數CTc的均勻度亦可高達97%。 4A is a side elevational view of an optical measurement system and a load-bearing structure according to still another embodiment of the present invention, and FIG. 4B illustrates each light detection when the optical measurement system of FIG. 4A measures a normally operating illumination device. The light intensity distribution function of the device and the total light intensity distribution function of all photodetectors. 4A and 4B, the optical measuring system 100c of the present embodiment is similar to the optical measuring system 100b of FIG. 3A, and the difference between the two is as follows. In the optical measuring system 100c of the embodiment, a reflector 130 is disposed between any two adjacent photodetectors 112. In other words, a photodetector 112 is disposed between any two adjacent reflectors 130. Accordingly, these reflectors 130 divide all of the light-emitting regions 52 into a plurality of portions, and each of the photodetectors 112 each measures a portion of the corresponding light-emitting region 52. Due to the action of the reflector 130, for each photodetector 112, it is equivalent to measuring an infinitely extending illumination device, so that each portion of the illumination region 52 is separated by its corresponding photodetector. The intensity of the light contributed by 112 will be similar. Thus, the total photosensitive intensity distribution function CTc is added to the total intensity distribution function (ie, curves C1c, C2c, C3c, and C4c) of each photodetector 112. The uniformity can also be as high as 97%.

本實施例之承載結構200c與圖3A之承載結構200b類似，而兩者的差異如下所述。在本實施例之承載結構200c中，支撐架220c 固定了位於這些偵測位置P的邊緣的反射器130，且亦固定了每兩相鄰的偵測位置P之間的反射器130。 The load bearing structure 200c of the present embodiment is similar to the load bearing structure 200b of FIG. 3A, and the differences between the two are as follows. In the carrying structure 200c of the embodiment, the support frame 220c The reflector 130 at the edge of the detection position P is fixed, and the reflector 130 between each two adjacent detection positions P is also fixed.

在圖1A、圖2A、圖3A及圖4A的實施例中，這些偵測位置P例如是排列於一平行於這些發光區52的排列方向的直線上，且任兩相鄰偵測位置P之間的節距T例如是彼此實質上相等 In the embodiment of FIG. 1A, FIG. 2A, FIG. 3A and FIG. 4A, the detection positions P are arranged, for example, on a line parallel to the arrangement direction of the light-emitting areas 52, and any two adjacent detection positions P The pitches T between the two are, for example, substantially equal to each other.

圖5A為本發明之另一實施例之光學量測系統及承載結構的側視示意圖，而圖5B繪示當圖5A的光學量測系統量測一正常運作的發光裝置時，各光偵測器之感光強度分佈函數及所有光偵測器之總感光強度分佈函數。請參照圖5A與圖5B，本實施例之光學量測系統100d與圖1A之光學量測系統100類似，而兩者的差異如下所述。在本實施例之光學量測系統100d中，至少部分這些偵測位置Pd呈現不等節距分佈。當這些偵測位置Pd呈不等節距分佈時，可將這些偵測位置Pd調整至可使總感光強度分佈函數的均勻度提升的位置。 5A is a side elevational view of an optical measurement system and a load-bearing structure according to another embodiment of the present invention, and FIG. 5B illustrates each light detection when the optical measurement system of FIG. 5A measures a normally operating illumination device. The light intensity distribution function of the device and the total light intensity distribution function of all photodetectors. 5A and 5B, the optical measurement system 100d of the present embodiment is similar to the optical measurement system 100 of FIG. 1A, and the differences between the two are as follows. In the optical measurement system 100d of the present embodiment, at least some of the detected positions Pd exhibit an unequal pitch distribution. When the detection positions Pd are distributed in unequal pitches, the detection positions Pd can be adjusted to positions where the uniformity of the total photosensitive intensity distribution function can be improved.

舉例而言，這些偵測位置Pd的多個任兩相鄰的偵測位置Pd間的節距T’中，靠近發光裝置50的這些發光區52之整體的中央的節距T1大於遠離發光裝置50的這些發光區52之整體的中央的節距T2。如此之節距設定是考慮到當發光裝置50的長度L有限時，總感光強度分佈函數在位於中央位置附近的值有大於位於邊緣位置附近的值的趨勢。因此，當將位於中央的節距T1拉開時，可使中央兩個光偵測器112的感光強度分佈函數的波峰拉開，進而使總感光強度分佈函數在位於中央位置附件的值下降，而在位於邊緣位置附近的值上升。當節距T1為36公分，而節距T2為30公分時，這些光偵測器112的感光強度分佈函數(即曲線C1d、 C2d、C3d及C4d)所加總而成的總感光強度分佈函數(即曲線CTd)可提升至62%。 For example, in the pitch T′ between any two adjacent detection positions Pd of the detection positions Pd, the center pitch T1 of the whole of the light-emitting areas 52 near the light-emitting device 50 is greater than the distance from the light-emitting device. The central pitch T2 of the entirety of these illuminating regions 52 of 50. Such a pitch setting is such that, when the length L of the light-emitting device 50 is limited, the value of the total photosensitive intensity distribution function in the vicinity of the central position has a tendency to be larger than the value located near the edge position. Therefore, when the pitch T1 located at the center is pulled apart, the peak of the photosensitive intensity distribution function of the two central photodetectors 112 can be pulled apart, so that the total photosensitive intensity distribution function decreases in the value of the attachment at the central position. The value near the edge position rises. When the pitch T1 is 36 cm and the pitch T2 is 30 cm, the light intensity distribution function of the photodetectors 112 (ie, the curve C1d, The total photosensitive intensity distribution function (ie curve CTd) added by C2d, C3d and C4d) can be increased to 62%.

本實施例之承載結構200d與圖1A之承載結構200類似，而兩者的差異在於本實施例之承載結構200d的支撐架220d將這些光偵測器112固定在不等節距的偵測位置Pd上。 The support structure 200d of the present embodiment is similar to the load-bearing structure 200 of FIG. 1A, and the difference between the two is that the support frame 220d of the load-bearing structure 200d of the embodiment fixes the photodetectors 112 at the detection positions of the unequal pitches. Pd.

圖6A為本發明之又一實施例之光學量測系統及承載結構的側視示意圖，而圖6B繪示當圖6A的光學量測系統量測一正常運作的發光裝置時，各光偵測器之感光強度分佈函數及所有光偵測器之總感光強度分佈函數。請參照圖6A與圖6B，本實施例之光學量測系統100e與圖1A之光學量測系統100類似，而兩者的差異如下所述。在圖1A的實施例中，所有的偵測位置P至參考線R(或參考面)的垂直距離H皆實質上相等。然而，在其他實施例中，至少部分這些偵測位置P至參考線R(或參考面)的垂直距離亦可不相等。在本實施例之光學量測系統100e中，在這些偵測位置P中，靠近這些發光區52之整體的中央的偵測位置P2e至參考線R(或參考面)的垂直距離H2e大於遠離這些發光區52之整體的中央的偵測位置P1e至參考線R(或參考面)的垂直距離H1e。如此之垂直距離H1e與H2e的設定是考慮到當發光裝置50的長度L有限時，總感光強度分佈函數在位於中央位置附近的值有大於位於邊緣位置附近的值的趨勢。因此，當將位於兩側的垂直距離H1e縮短時，可使拉高位於邊緣的光偵測器112的感光強度分佈曲線，進而使總感光強度分佈函數在位於邊緣位置附近的值上升。當這些偵測位置P1e與P2e之與發光區52的排列方向垂直的方向上的節距T為30公分，垂直距離H1e為25公分，而垂直距 離H2e為30公分時，對應於這些偵測位置P1e與P2e的感光強度分佈函數(即曲線C1e、C2e、C3e及C4e)加總而成的總感光強度分佈函數(即曲線CTe)的均勻度可提升至57%。 6A is a side elevational view of an optical measurement system and a load-bearing structure according to still another embodiment of the present invention, and FIG. 6B illustrates each light detection when the optical measurement system of FIG. 6A measures a normally operating illumination device. The light intensity distribution function of the device and the total light intensity distribution function of all photodetectors. Referring to FIGS. 6A and 6B, the optical measurement system 100e of the present embodiment is similar to the optical measurement system 100 of FIG. 1A, and the differences between the two are as follows. In the embodiment of FIG. 1A, the vertical distances H of all the detected positions P to the reference line R (or the reference plane) are substantially equal. However, in other embodiments, the vertical distances of at least some of the detection positions P to the reference line R (or the reference plane) may also be unequal. In the optical measurement system 100e of the present embodiment, among the detection positions P, the vertical distance H2e from the detection position P2e to the reference line R (or the reference surface) near the center of the entire illumination area 52 is larger than the distance The vertical distance H1e of the detection position P1e from the center of the entire illumination area 52 to the reference line R (or reference plane). Such vertical distances H1e and H2e are set such that, when the length L of the light-emitting device 50 is limited, the value of the total photosensitive intensity distribution function in the vicinity of the central position has a tendency to be larger than the value located near the edge position. Therefore, when the vertical distance H1e located on both sides is shortened, the photosensitive intensity distribution curve of the photodetector 112 located at the edge can be raised, and the total photosensitive intensity distribution function can be increased in the vicinity of the edge position. When the detection positions P1e and P2e are perpendicular to the arrangement direction of the light-emitting regions 52, the pitch T is 30 cm, and the vertical distance H1e is 25 cm, and the vertical distance is When the H2e is 30 cm, the uniformity of the total photosensitive intensity distribution function (ie, the curve CTe) corresponding to the photosensitive intensity distribution functions (ie, the curves C1e, C2e, C3e, and C4e) of the detected positions P1e and P2e is added. Can be increased to 57%.

本實施例之承載結構200e與圖1A之承載結構200類似，而兩者的差異在於本實施例之承載結構200e的支撐架220e將這些光偵測器112固定在離發光裝置50的節距H1e、H2e不等的位置上。 The load-bearing structure 200e of the present embodiment is similar to the load-bearing structure 200 of FIG. 1A, and the difference between the two is that the support frame 220e of the load-bearing structure 200e of the present embodiment fixes the photodetectors 112 at a pitch H1e from the light-emitting device 50. H2e is not in the same position.

圖7A為本發明之又一實施例之光學量測系統及承載結構的側視示意圖，而圖7B繪示當圖7A的光學量測系統量測一正常運作的發光裝置時，各光偵測器之感光強度分佈函數及所有光偵測器之總感光強度分佈函數。請參照圖7A與圖7B，本實施例之光學量測系統100f與圖1A之光學量測系統100類似，而兩者的差異如下所述。在圖1A的光學量測系統100中，所有這些偵測位置P的偵測方向皆相同(如圖1A中所繪示的皆是向下)。然而，在其他實施例中，至少部分這些偵測位置P的偵測方向可以是彼此不平行。在本實施例之光學量測系統100f中，在這些偵測位置P1f及P2f中，較遠離這些發光區52之整體的中央的偵測位置P1f之偵測方向往靠近這些發光區52之整體的中央的方向傾斜。如圖7A所繪示，左右兩側之偵測位置P1f的偵測方向D1相對於垂直於發光裝置50的鉛直方向傾斜了θ角。此外，偵測方向D1即光偵測器112的光軸方向。此外，在本實施例中，偵測位置P2f的偵測方向D1則實質上垂直於發光裝置50。 7A is a side elevational view of an optical measurement system and a load-bearing structure according to still another embodiment of the present invention, and FIG. 7B illustrates each light detection when the optical measurement system of FIG. 7A measures a normally operating illumination device. The light intensity distribution function of the device and the total light intensity distribution function of all photodetectors. Referring to FIGS. 7A and 7B, the optical measurement system 100f of the present embodiment is similar to the optical measurement system 100 of FIG. 1A, and the differences between the two are as follows. In the optical measurement system 100 of FIG. 1A, the detection directions of all of the detection positions P are the same (both as shown in FIG. 1A). However, in other embodiments, the detection directions of at least some of the detection positions P may be non-parallel to each other. In the optical measurement system 100f of the present embodiment, among the detection positions P1f and P2f, the detection direction of the detection position P1f farther from the center of the entire illumination area 52 is closer to the whole of the illumination areas 52. The direction of the center is inclined. As shown in FIG. 7A, the detection direction D1 of the detection position P1f on the left and right sides is inclined by an angle θ with respect to the vertical direction perpendicular to the light-emitting device 50. In addition, the detection direction D1 is the optical axis direction of the photodetector 112. In addition, in the embodiment, the detecting direction D1 of the detecting position P2f is substantially perpendicular to the light emitting device 50.

在本實施例中，當偵測位置P1f的偵測方向D1往靠近發光裝置50的中央的方向傾斜時，偵測位置P1f所對應的感光強度分佈 函數(即曲線C1f與曲線C4f)的波峰會往下移，且會往靠近位置為0的方向移動。如此一來，便可提升偵測位置P1f及P2f的感光強度分佈函數(即曲線C1f、C2f、C3f及C4f)所加總而成的總感光強度分佈函數(即曲線CTf)的均勻度。當θ角為20度，節距T為30公分，且垂直距離H為30公分時，總感光強度分佈函數CTf可提升至63%。 In this embodiment, when the detection direction D1 of the detection position P1f is inclined toward the center of the light-emitting device 50, the photosensitive intensity distribution corresponding to the detection position P1f is detected. The peaks of the function (ie, curve C1f and curve C4f) move down and move toward a position near zero. In this way, the uniformity of the total photosensitive intensity distribution function (ie, the curve CTf) added by the photosensitive intensity distribution functions of the detection positions P1f and P2f (ie, the curves C1f, C2f, C3f, and C4f) can be improved. When the θ angle is 20 degrees, the pitch T is 30 cm, and the vertical distance H is 30 cm, the total photosensitive intensity distribution function CTf can be increased to 63%.

本實施例之承載結構200f與圖1A之承載結構200類似，而兩者的差異在於本實施例之承載結構200f的支撐架220f將這些光偵測器112固定在偵測位置P1f及P2f上。 The load-bearing structure 200f of the present embodiment is similar to the load-bearing structure 200 of FIG. 1A, and the difference between the two is that the support frame 220f of the load-bearing structure 200f of the present embodiment fixes the photodetectors 112 at the detection positions P1f and P2f.

在其他實施例中，隨著偵測位置P1f在水平方向的分佈的不同，偵測位置P1f的偵測方向D1亦可以設計為朝向遠離發光裝置50的中央的方向傾斜。 In other embodiments, the detection direction D1 of the detection position P1f may also be designed to be inclined toward a direction away from the center of the light-emitting device 50, as the distribution of the detection position P1f in the horizontal direction is different.

圖5A、圖6A及圖7A的實施例舉出了幾種偵測位置的設計方式之實施例，在其他實施例中，亦可同時採用圖5A及圖6A的設計方式，同時採用圖6A及圖7A的設計方式，同時採用圖5A及圖7A的設計方式，或同時採用圖5A、圖6A及圖7A的設計方式。以下舉出同時採用圖6A與圖7A的設計方式的實施例。 The embodiment of FIG. 5A, FIG. 6A and FIG. 7A exemplifies a design manner of several detection positions. In other embodiments, the design manners of FIG. 5A and FIG. 6A can also be used simultaneously, and FIG. 6A and The design of FIG. 7A adopts the design of FIG. 5A and FIG. 7A simultaneously or the design of FIG. 5A, FIG. 6A and FIG. 7A. An embodiment in which the design of FIGS. 6A and 7A is simultaneously employed will be described below.

圖8為本發明之再一實施例之光學量測系統及承載結構的側視示意圖。請參照圖8，本實施例之偵測位置的設計概念結合了圖6A及圖7A的設計概念。在本實施例之光學量測系統100g中，遠離發光裝置50的中央的偵測位置P1g的偵測方向D1往靠近發光裝置50的中央的方向傾斜。此外，遠離發光裝置50的中央的偵測位置P1g至發光裝置50的垂直距離H1g小於靠近發光裝置50的中央的偵測位置P2g至發光裝置50的垂直距離H2g。結合了兩 種設計概念後，經過適當的參數設計，可使總感光強度分佈函數的均勻度進一步地提升。 FIG. 8 is a side elevational view of an optical measurement system and a load-bearing structure according to still another embodiment of the present invention. Referring to FIG. 8, the design concept of the detection position of this embodiment combines the design concepts of FIG. 6A and FIG. 7A. In the optical measuring system 100g of the present embodiment, the detecting direction D1 of the detecting position P1g far from the center of the light emitting device 50 is inclined toward the center of the light emitting device 50. In addition, the vertical distance H1g from the detection position P1g of the central portion of the illumination device 50 to the detection device P2g near the center of the illumination device 50 is less than the vertical distance H2g of the illumination device 50. Combined two After the design concept, the uniformity of the total photosensitive intensity distribution function can be further improved by appropriate parameter design.

此外，本實施例之承載結構200g的支撐架220g將這些光偵測器112固定在偵測位置P1g及P2g上。 In addition, the support frame 220g of the carrying structure 200g of the embodiment fixes the photodetectors 112 at the detecting positions P1g and P2g.

圖9為本發明之另一實施例之光學量測系統及承載結構的側視示意圖。請參照圖9，本實施例之光學量測系統100h與圖2A之光學量測系統100a類似，而兩者的差異如下所述。在本實施例之光學量測系統100h中，光偵測模組110h包括至少一光偵測器112(圖9中是以一個光偵測器112為例)，光偵測器112在多個時間移動至這些偵測位置P1h、P2h、P3h及P4h，以分別測得至少部分這些發光區52之光強度。在本實施例中，偵測位置P1h、P2h、P3h及P4h例如與圖2A中的這些偵測位置P相同。在本實施例中，光偵測器112從偵測位置P1h依序移動至偵測位置P2h、P3h及P4h，並在每個偵測位置P1h、P2h、P3h、P4h上量測光強度，以產生光強度訊號G，而訊號整合單元120則整合了於不同的偵測位置P1h、P2h、P3h及P4h所得到的光強度訊號G，以得到整體光強度評估值。由於本實施例與圖2A之實施例都是在相同的偵測位置P上量測光強度，只是本實施例的光偵測器112是採用從偵測位置P1h掃描至偵測位置P4h的方式來獲得這些偵測位置P1h、P2h、P3h及P4h的光強度，因此本實施例之各偵測位置P1h、P2h、P3h及P4h的感光強度分佈函數及其加總而得的總感光強度分佈函數會與圖2B所繪示者一致。 9 is a side elevational view of an optical measurement system and a load bearing structure in accordance with another embodiment of the present invention. Referring to FIG. 9, the optical measuring system 100h of the present embodiment is similar to the optical measuring system 100a of FIG. 2A, and the difference between the two is as follows. In the optical measurement system 100h of the embodiment, the light detecting module 110h includes at least one light detector 112 (in FIG. 9 , an optical detector 112 is taken as an example), and the photodetector 112 is in multiple The time is moved to the detected positions P1h, P2h, P3h, and P4h to measure the light intensities of at least some of the light-emitting regions 52, respectively. In the present embodiment, the detection positions P1h, P2h, P3h, and P4h are, for example, the same as the detection positions P in FIG. 2A. In this embodiment, the photodetector 112 sequentially moves from the detection position P1h to the detection positions P2h, P3h, and P4h, and measures the light intensity at each of the detection positions P1h, P2h, P3h, and P4h. The light intensity signal G is generated, and the signal integration unit 120 integrates the light intensity signals G obtained at different detection positions P1h, P2h, P3h, and P4h to obtain an overall light intensity evaluation value. In this embodiment and the embodiment of FIG. 2A, the light intensity is measured at the same detection position P, but the photodetector 112 of the embodiment is scanned from the detection position P1h to the detection position P4h. To obtain the light intensities of the detected positions P1h, P2h, P3h, and P4h, the photosensitive intensity distribution functions of the detected positions P1h, P2h, P3h, and P4h in this embodiment and the total total photosensitive intensity distribution function It will be consistent with the one shown in Figure 2B.

在其他實施例中，亦可以採用多個光偵測器112來掃描，以縮短掃描的時間。舉例而言，可同時採用兩個光偵測器112，並先 將此兩光偵測器112配置於偵測位置P1h與P3h。接著，讓此兩光偵測器112分別從偵測位置P1h及P3h掃描至偵測位置P2h及P4h，以在偵測位置P1h、P2h、P3h及P4h都量測到光強度。如此一來，相較於圖9之實施例，便可縮短一半的掃描時間。換言之，當採用N個光偵測器來掃描時，便可將掃描時間縮短為採用一個光偵測器量測時的1/N，其中N為大於等於2的正整數。 In other embodiments, multiple photodetectors 112 may also be used to scan to shorten the scanning time. For example, two photodetectors 112 can be used simultaneously, and The two photodetectors 112 are disposed at the detection positions P1h and P3h. Then, the two photodetectors 112 are scanned from the detection positions P1h and P3h to the detection positions P2h and P4h, respectively, to measure the light intensity at the detection positions P1h, P2h, P3h and P4h. As a result, compared to the embodiment of FIG. 9, half of the scan time can be shortened. In other words, when scanning with N photodetectors, the scanning time can be shortened to 1/N when measured by a photodetector, where N is a positive integer greater than or equal to 2.

本實施例之承載結構200h與圖1A之承載結構200類似，而兩者的差異如下所述。在本實施例之承載結構200h中，安裝件230h將光偵測器112可移動地安裝於支撐架220h上。安裝件230h在一移動路徑A上移動，以在多個時間將光偵測器112移動至這些偵測位置P1h、P2h、P3h及P4h，而分別測得至少部分這些發光區52之光強度。在本實施例中，支撐架220h包括一滑軌224h，安裝件230h在滑軌224h上滑動，以沿著移動路徑A移動。舉例而言，承載結構200h可具有一致動器240，其帶動安裝件230h在滑軌224h上移動。致動器240使安裝件230h在移動路徑A上移動，以在多個時間將光偵測器112移動至這些偵測位置P1h、P2h、P3h及P4h，其中致動器240例如為馬達或其他致動器。此外，在本實施例中，支撐架220h亦固定反射器130。 The load bearing structure 200h of the present embodiment is similar to the load bearing structure 200 of FIG. 1A, and the differences between the two are as follows. In the load-bearing structure 200h of the present embodiment, the mounting member 230h movably mounts the photodetector 112 on the support frame 220h. The mounting member 230h moves on a moving path A to move the photodetector 112 to the detecting positions P1h, P2h, P3h, and P4h at a plurality of times, and the light intensities of at least a portion of the light-emitting regions 52 are respectively measured. In the present embodiment, the support frame 220h includes a slide rail 224h, and the mounting member 230h slides on the slide rail 224h to move along the movement path A. For example, the load bearing structure 200h can have an actuator 240 that drives the mounting member 230h to move over the slide rail 224h. The actuator 240 moves the mounting member 230h on the moving path A to move the photodetector 112 to the detecting positions P1h, P2h, P3h, and P4h at a plurality of times, wherein the actuator 240 is, for example, a motor or the like. Actuator. Further, in the present embodiment, the support frame 220h also fixes the reflector 130.

此外，上述圖1A、圖3A、圖4A、圖5A、圖6A、圖7A及圖8的實施例亦可採用本實施例之光偵測器掃描的概念，亦即利用光偵測器112掃描至這些實施例中的偵測位置上。 In addition, the embodiment of FIG. 1A, FIG. 3A, FIG. 4A, FIG. 5A, FIG. 6A, FIG. 7A and FIG. 8 can also use the concept of the photodetector scanning of the embodiment, that is, scanning by the photodetector 112. Up to the detection position in these embodiments.

圖10為本發明之又一實施例之光學量測系統及承載結構的側視示意圖。請參照圖10，本實施例之光學量測系統100i與圖1A之光學量測系統100類似，而兩者的差異如下所述。在本實施例 之光學量測系統100i中，每一光強度訊號Gi為一光訊號，訊號整合單元120i為一光訊號整合單元，以整合這些光訊號(即光強度訊號Gi)。在本實施例中，訊號整合單元120i為一積分球，光偵測模組110i包括多個光纖112i，每一光纖112i具有相對的一第一端E1與一第二端E2，這些光纖112i的這些第一端E1分別位於這些偵測位置P，且這些光纖112i的這些第二端E2連接至訊號整合單元120i(即積分球)。這些光訊號(即光強度訊號Gi)分別經由這些光纖112i傳遞至訊號整合單元120i(即積分球)，而訊號整合單元120i(即積分球)將這些光訊號積分，以得到整體光強度評估值。換言之，本實施例是採用光學的方式來將光訊號(即光強度訊號Gi)整合，而圖1A之實施例是採用電子運算的方式來將電訊號(即光強度訊號G)整合。 FIG. 10 is a side elevational view of an optical measurement system and a load bearing structure according to still another embodiment of the present invention. Referring to FIG. 10, the optical measurement system 100i of the present embodiment is similar to the optical measurement system 100 of FIG. 1A, and the differences between the two are as follows. In this embodiment In the optical measurement system 100i, each light intensity signal Gi is an optical signal, and the signal integration unit 120i is an optical signal integration unit to integrate the optical signals (ie, the light intensity signal Gi). In this embodiment, the signal integration unit 120i is an integrating sphere, and the optical detection module 110i includes a plurality of optical fibers 112i. Each of the optical fibers 112i has a first end E1 and a second end E2, and the optical fibers 112i The first ends E1 are respectively located at the detection positions P, and the second ends E2 of the optical fibers 112i are connected to the signal integration unit 120i (ie, the integrating sphere). The optical signals (ie, the light intensity signals Gi) are respectively transmitted to the signal integration unit 120i (ie, the integrating sphere) via the optical fibers 112i, and the signal integration unit 120i (ie, the integrating sphere) integrates the optical signals to obtain an overall light intensity evaluation value. . In other words, in this embodiment, the optical signal (ie, the light intensity signal Gi) is integrated optically, and the embodiment of FIG. 1A uses an electronic operation to integrate the electrical signal (ie, the light intensity signal G).

具體而言，在本實施例中，訊號整合單元120i(即積分球)包括一反射球體122i、一光纖126i及一光偵測器124i。反射球體122i為一內壁具有高反射率的空心球體，其內壁能將來自光纖112i的光強度訊號Gi(即光訊號)充分反射與混合，而光纖126i則將充分混合後的光訊號傳遞至光偵測器124i，如此光偵測器124i便能夠偵測到經過積分效果的光強度訊號。 Specifically, in this embodiment, the signal integration unit 120i (ie, the integrating sphere) includes a reflective sphere 122i, an optical fiber 126i, and a photodetector 124i. The reflecting sphere 122i is a hollow sphere having a high reflectivity on the inner wall, and the inner wall can sufficiently reflect and mix the light intensity signal Gi (ie, the optical signal) from the optical fiber 112i, and the optical fiber 126i transmits the fully mixed optical signal. To the photodetector 124i, the photodetector 124i can detect the integrated light intensity signal.

本實施例之承載結構200i與圖1A之承載結構200類似，而兩者的差異在於本實施例之承載結構200i的支撐架220i是將這些光纖112i的第一端E1分別固定在這些偵測位置P上。舉例而言，這些光纖112i的第一端E1可藉由安裝件230i安裝於支撐架220i上。 The load-bearing structure 200i of the present embodiment is similar to the load-bearing structure 200 of FIG. 1A, and the difference between the two is that the support frame 220i of the load-bearing structure 200i of the present embodiment fixes the first end E1 of the optical fibers 112i at the detection positions. P on. For example, the first end E1 of the fibers 112i can be mounted on the support frame 220i by the mounting member 230i.

在本實施例中，由於當反射球體122i能夠容置這些光纖112i 的第二端E2時，就可以達到良好的積分效果，而無需容置整個發光裝置50。因此，本實施例之光學量測系統100i的反射球體122i可以較小(亦即積分球可以較小)，所以能夠有效降低成本，且有利於產線的規劃。此外，由於每次量測發光裝置50時，都可以不用將發光裝置50放置於積分球中，因此本實施例之光學量測系統100i可提升生產流程的順暢度。 In this embodiment, since the reflective sphere 122i can accommodate these optical fibers 112i At the second end E2, a good integration effect can be achieved without having to accommodate the entire illumination device 50. Therefore, the reflective sphere 122i of the optical measurement system 100i of the present embodiment can be small (that is, the integrating sphere can be small), so that the cost can be effectively reduced, and the planning of the production line is facilitated. In addition, since the light-emitting device 50 can be placed in the integrating sphere each time the light-emitting device 50 is measured, the optical measuring system 100i of the present embodiment can improve the smoothness of the production process.

圖10之光訊號整合的概念亦可應用於圖2A、圖3A、圖4A、圖5A、圖6A、圖7A及圖8的實施例，亦即將光纖112i的第一端E1設置於這些實施例之偵測位置上。 The concept of optical signal integration of FIG. 10 can also be applied to the embodiments of FIGS. 2A, 3A, 4A, 5A, 6A, 7A, and 8, that is, the first end E1 of the optical fiber 112i is disposed in these embodiments. The detection position.

圖11為本發明之再一實施例之光學量測系統、承載結構及光學量測系統量測發光裝置的側視示意圖。請參照圖11，本實施例之光學量測系統100與圖1A之光學量測系統100相同，而在本實施例中，光學量測系統100亦可量測多個發光裝置50j。這些發光裝置50j可以是相同或不同類型的發光裝置50j，且彼此間是各自獨立的。換言之，發光裝置50j的發光區52j可以相同或不同。此外，電源供應器140電性連接至這些發光裝置50j，以驅動這些發光裝置50j發光。本實施例之光學量測系統100可量測所有的這些發光裝置50j的整體光強度評估值，因此可用以判斷這些發光裝置50j整體有多少單位的光損失。 11 is a side elevational view of an optical measuring system, a load bearing structure, and an optical measuring system measuring light emitting device according to still another embodiment of the present invention. Referring to FIG. 11, the optical measurement system 100 of the present embodiment is the same as the optical measurement system 100 of FIG. 1A. In the present embodiment, the optical measurement system 100 can also measure a plurality of illumination devices 50j. These illuminating devices 50j may be the same or different types of illuminating devices 50j and are independent of each other. In other words, the light-emitting regions 52j of the light-emitting device 50j may be the same or different. In addition, the power supply 140 is electrically connected to the light-emitting devices 50j to drive the light-emitting devices 50j to emit light. The optical measurement system 100 of the present embodiment can measure the overall light intensity evaluation values of all of the light-emitting devices 50j, and thus can be used to determine how many units of light loss are present in the entire light-emitting device 50j.

另外，上述實施例之發光裝置50是以發光條為例，亦即發光區52是排列於一直線上。當發光裝置50為一面光源時，亦即發光區52排成二維陣列、或連接成一平面時，上述這些實施例的偵測位置亦可在發光區52的上方排列成二維陣列，亦即偵測位置除了如圖1A、圖2A、圖3A、圖4A、圖5A、圖6A、圖7A及圖8 那樣排列之外，其在垂直於圖面的方向上亦有排列。此外，上述之光學量測系統亦可用以量測任何形狀的發光體(包含規則形狀的發光體與不規則形狀的發光體)，且所量測的發光體亦不限制只是單側發光，其亦可以是多側發光。舉例而言，上述之光學量測系統可用以量測在垂直於延伸方向的方向上可360度均發光的發光二極體光棒。雖然光學量測系統是採用單側積分的方式來量測，但對於此種發光二極體光棒可採用多次不同角度量測的方式來達到多方向均有量測的效果。舉例而言，可以相對於發光二極體光棒每120度量測一次，共量測三次，然後再綜合比較這三次所得到的結果，亦可判斷發光二極體光棒有多少單位的光損失。圖12為本發明之一實施例之光學量測方法的程流圖。本實施例之光學量測方法可利用上述實施例或其他實施例之光學量測系統來執行，以下先以圖1A的光學量測系統100來執行為例。請參照圖1A與圖12，本實施例之光學量測方法包括下列步驟。首先，執行步驟S110，其為針對這些發光區52，在多個不同的偵測位置P分別偵測至少部分這些發光區52之光強度，以得到分別對應於這些偵測位置P的多個光強度訊號G。如同圖1A的實施例所述，步驟S110可利用光偵測模組110來完成。接著，執行步驟S120，其為整合這些光強度訊號G，以得到與這些發光區52相關的整體光強度評估值。如同圖1A的實施例所述，步驟S120可利用訊號整合單元120來完成。 In addition, the light-emitting device 50 of the above embodiment is exemplified by a light-emitting strip, that is, the light-emitting area 52 is arranged on a straight line. When the illuminating device 50 is a light source, that is, when the illuminating regions 52 are arranged in a two-dimensional array or connected in a plane, the detecting positions of the above embodiments may be arranged in a two-dimensional array above the illuminating region 52, that is, The detection position is in addition to FIG. 1A, FIG. 2A, FIG. 3A, FIG. 4A, FIG. 5A, FIG. 6A, FIG. 7A and FIG. In addition to the arrangement, it is also arranged in a direction perpendicular to the plane of the drawing. In addition, the above optical measuring system can also be used to measure an illuminant of any shape (including a regularly shaped illuminant and an irregularly shaped illuminant), and the measured illuminant is not limited to only one-sided illuminating, It can also be multi-sided illumination. For example, the optical metrology system described above can be used to measure a light-emitting diode light bar that can emit 360 degrees in a direction perpendicular to the direction of extension. Although the optical measurement system is measured by means of one-sided integration, for such a light-emitting diode light bar, multiple different angle measurement methods can be used to achieve the multi-directional measurement effect. For example, it can measure once every 120 times with respect to the light-emitting diode light bar, measure three times in total, and then comprehensively compare the results obtained by the three times, and can also determine how many units of light of the light-emitting diode light bar loss. Figure 12 is a flow diagram of an optical metrology method in accordance with one embodiment of the present invention. The optical measurement method of the present embodiment can be performed by using the optical measurement system of the above embodiment or other embodiments. The following is exemplified by the optical measurement system 100 of FIG. 1A. Referring to FIG. 1A and FIG. 12, the optical measurement method of this embodiment includes the following steps. First, step S110 is performed to detect the light intensity of at least some of the light-emitting regions 52 at a plurality of different detection positions P for the light-emitting regions 52 to obtain a plurality of lights respectively corresponding to the detection positions P. Intensity signal G. As described in the embodiment of FIG. 1A, step S110 can be performed by using the light detecting module 110. Next, step S120 is performed to integrate the light intensity signals G to obtain an overall light intensity evaluation value associated with the light-emitting regions 52. As described in the embodiment of FIG. 1A, step S120 can be accomplished using signal integration unit 120.

此外，當光學量測方法應用於圖1A、圖2A、圖3A、圖4A、圖5A、圖6A、圖7A、圖8及圖11的實施例的光學量測裝置中時，是採用在至少部分這些偵測位置(例如在所有的偵測位置) 同時偵測至少部分發光區52的光強度的概念，亦即在這些偵測位置皆分別配置有光偵測器112，故可達到同時偵測的效果。然而，當光學量測方法應用於圖9的實施例時，則是利用至少一光偵測器112在多個時間移動至這些偵測位置，以測得至少部分這些發光區52之光強度。此外，當光學量測方法應用於圖2A、圖3A及圖4A的實施例時，則是利用反射器130來反射發光區52所發出的側向光。 In addition, when the optical measurement method is applied to the optical measuring device of the embodiment of FIGS. 1A, 2A, 3A, 4A, 5A, 6A, 7A, 8 and 11, it is adopted at least Some of these detection locations (eg at all detection locations) At the same time, the concept of the light intensity of at least part of the light-emitting area 52 is detected, that is, the light detectors 112 are respectively disposed at the detection positions, so that the simultaneous detection effect can be achieved. However, when the optical metrology method is applied to the embodiment of FIG. 9, at least one photodetector 112 is used to move to the detection locations for a plurality of times to measure the light intensity of at least a portion of the illumination regions 52. Further, when the optical metrology method is applied to the embodiment of FIGS. 2A, 3A, and 4A, the reflector 130 is used to reflect the lateral light emitted by the light-emitting region 52.

光學量測方法的其他細節已於上述實施例中詳細闡述，因此可參考上述實施例的說明，在此不再重述。 Other details of the optical measurement method have been described in detail in the above embodiments, so reference may be made to the description of the above embodiments, and will not be repeated here.

綜上所述，在本發明之實施例之光學量測系統與光學量測方法中，是在多個不同的偵測位置分別偵測這些發光區的光強度，且整合所得到的這些光強度訊號以得到整體光強度評估值。因此，此整體光強度評估值是在這些發光區的位置、這些偵測位置及其他可能的發光或偵測光條件所產生的整體光強度權重分佈較為均一化的情況下所測得的。如此一來，此整體光強度評估值有助於判別發光裝置或這些發光區是有多少個單位的光損失，或判別發光裝置中有多少數量的發光區無法正常運作。此外，在本發明之實施例之承載結構中，利用安裝件將光偵測器可移動地或不可移動地安裝於支撐架上，其有利於使光學量測系統實現準確度高的量測。 In summary, in the optical measuring system and the optical measuring method according to the embodiment of the present invention, the light intensities of the light emitting regions are respectively detected at a plurality of different detecting positions, and the obtained light intensities are integrated. Signal to get an overall light intensity evaluation value. Therefore, the overall light intensity evaluation value is measured in the case where the positions of the light-emitting regions, the detected positions, and other possible light-emitting or detecting light conditions are uniform in the overall light intensity weight distribution. In this way, the overall light intensity evaluation value helps to determine how many units of light loss in the light-emitting device or the light-emitting areas, or to determine how many light-emitting areas in the light-emitting device are not functioning properly. In addition, in the load-bearing structure of the embodiment of the present invention, the photodetector is movably or non-movably mounted on the support frame by using the mounting member, which is advantageous for the optical measurement system to achieve highly accurate measurement.

雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

50、50j‧‧‧發光裝置 50, 50j‧‧‧Lighting device

52、52j‧‧‧發光區 52, 52j‧‧‧Lighting area

54‧‧‧發光元件 54‧‧‧Lighting elements

100、100a、100b、100c、100d、100e、100f、100g、100h、100i‧‧‧光學量測系統 100, 100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h, 100i‧‧‧ optical measurement system

110、110i‧‧‧光偵測模組 110, 110i‧‧‧Light detection module

112‧‧‧光偵測器 112‧‧‧Photodetector

112i‧‧‧光纖 112i‧‧‧ fiber

113‧‧‧擴散器 113‧‧‧Diffuser

120、120i‧‧‧訊號整合單元 120, 120i‧‧‧ signal integration unit

122i‧‧‧反射球體 122i‧‧‧Reflecting sphere

124i‧‧‧光偵測器 124i‧‧‧Photodetector

126i‧‧‧光纖 126i‧‧‧ fiber

130‧‧‧反射器 130‧‧‧ reflector

200、200a、200b、200c、200d、200e、200f、200g、200h、200i‧‧‧承載結構 200, 200a, 200b, 200c, 200d, 200e, 200f, 200g, 200h, 200i‧‧‧ bearing structure

210‧‧‧承載器 210‧‧‧carrier

220、220a、220b、220c、220d、220e、220f、220g、220h、220i‧‧‧支撐架 220, 220a, 220b, 220c, 220d, 220e, 220f, 220g, 220h, 220i‧‧‧ support frame

224h‧‧‧滑軌 224h‧‧‧rails

230、230h、230i‧‧‧安裝件 230, 230h, 230i‧‧‧ mountings

240‧‧‧致動器 240‧‧‧Actuator

A‧‧‧移動路徑 A‧‧‧Moving path

C1、C1a、C1b、C1c、C1d、C1e、C1f、C2、C2a、C2b、C2c、C2d、C2e、C2f、C3、C3a、C3b、C3c、C3d、C3e、C3f、C4、 C4a、C4b、C4c、C4d、C4e、C4f、CT、CTa、CTb、CTc、CTd、CTe、CTf‧‧‧曲線 C1, C1a, C1b, C1c, C1d, C1e, C1f, C2, C2a, C2b, C2c, C2d, C2e, C2f, C3, C3a, C3b, C3c, C3d, C3e, C3f, C4, C4a, C4b, C4c, C4d, C4e, C4f, CT, CTa, CTb, CTc, CTd, CTe, CTf‧‧‧ curves

D1‧‧‧偵測方向 D1‧‧‧Detection direction

E1‧‧‧第一端 E1‧‧‧ first end

E2‧‧‧第二端 E2‧‧‧ second end

G、Gi‧‧‧光強度訊號 G, Gi‧‧‧ light intensity signal

H、H1e、H1g、H2e、H2g‧‧‧距離 H, H1e, H1g, H2e, H2g‧‧‧ distance

K‧‧‧波峰 K‧‧·Crest

L‧‧‧長度 L‧‧‧ length

N1、N2‧‧‧點 N1, N2‧‧ points

P、P1、P1e、P1f、P1g、P1h、P2e、P2f、P2g、P2h、P3h、P4h、Pd‧‧‧偵測位置 P, P1, P1e, P1f, P1g, P1h, P2e, P2f, P2g, P2h, P3h, P4h, Pd‧‧‧ detection position

R‧‧‧參考線 R‧‧‧ reference line

S1‧‧‧邊界位置 S1‧‧‧ boundary position

S110、S120‧‧‧步驟 S110, S120‧‧‧ steps

S2‧‧‧位置 S2‧‧‧ position

T、T’、T1、T2‧‧‧節距 T, T', T1, T2‧‧ ‧ pitch

θ‧‧‧角 Θ‧‧‧ corner

圖1A為本發明之一實施例之光學量測系統及承載結構的側視示意圖。 1A is a side elevational view of an optical metrology system and a load bearing structure in accordance with an embodiment of the present invention.

圖1B繪示當圖1A的光學量測系統量測一正常運作的發光裝置時，各光偵測器之感光強度分佈函數及所有光偵測器之總感光強度分佈函數。 FIG. 1B illustrates a photo-sensing intensity distribution function of each photodetector and a total photo-intensity distribution function of all photodetectors when the optical measuring system of FIG. 1A measures a normally operating illuminating device.

圖1C繪示圖1A之光學量測系統中的光偵測器之邊界條件。 FIG. 1C illustrates boundary conditions of a photodetector in the optical metrology system of FIG. 1A.

圖2A為本發明之另一實施例之光學量測系統及承載結構的側視示意圖。 2A is a side elevational view of an optical measurement system and a load bearing structure in accordance with another embodiment of the present invention.

圖2B繪示當圖2A的光學量測系統量測一正常運作的發光裝置時，各光偵測器之感光強度分佈函數及所有光偵測器之總感光強度分佈函數。 FIG. 2B illustrates the photo-sensing intensity distribution function of each photodetector and the total photo-intensity distribution function of all photodetectors when the optical measuring system of FIG. 2A measures a normally operating illuminating device.

圖3A為本發明之又一實施例之光學量測系統及承載結構的側視示意圖。 3A is a side elevational view of an optical measurement system and a load bearing structure in accordance with yet another embodiment of the present invention.

圖3B繪示當圖3A的光學量測系統量測一正常運作的發光裝置時，各光偵測器之感光強度分佈函數及所有光偵測器之總感光強度分佈函數。 FIG. 3B illustrates the photo-sensing intensity distribution function of each photodetector and the total photo-intensity distribution function of all photodetectors when the optical measuring system of FIG. 3A measures a normally operating illuminating device.

圖4A為本發明之再一實施例之光學量測系統及承載結構的側視示意圖。 4A is a side elevational view of an optical measurement system and a load bearing structure in accordance with still another embodiment of the present invention.

圖4B繪示當圖4A的光學量測系統量測一正常運作的發光裝置時，各光偵測器之感光強度分佈函數及所有光偵測器之總感光強度分佈函數。 FIG. 4B is a diagram showing the light intensity distribution function of each photodetector and the total light intensity distribution function of all photodetectors when the optical measuring system of FIG. 4A measures a normally operating light emitting device.

圖5A為本發明之另一實施例之光學量測系統及承載結構的側視示意圖。 5A is a side elevational view of an optical measurement system and a load bearing structure in accordance with another embodiment of the present invention.

圖5B繪示當圖5A的光學量測系統量測一正常運作的發光裝置時，各光偵測器之感光強度分佈函數及所有光偵測器之總感光強度分佈函數。 FIG. 5B illustrates the photosensitive intensity distribution function of each photodetector and the total photointensity distribution function of all photodetectors when the optical metrology system of FIG. 5A measures a normally operating illumination device.

圖6A為本發明之又一實施例之光學量測系統及承載結構的側視示意圖。 6A is a side elevational view of an optical measurement system and a load bearing structure in accordance with yet another embodiment of the present invention.

圖6B繪示當圖6A的光學量測系統量測一正常運作的發光裝置時，各光偵測器之感光強度分佈函數及所有光偵測器之總感光強度分佈函數。 FIG. 6B is a diagram showing the light intensity distribution function of each photodetector and the total light intensity distribution function of all photodetectors when the optical measuring system of FIG. 6A measures a normally operating light emitting device.

圖7A為本發明之又一實施例之光學量測系統及承載結構的側視示意圖。 7A is a side elevational view of an optical measurement system and a load bearing structure in accordance with yet another embodiment of the present invention.

圖7B繪示當圖7A的光學量測系統量測一正常運作的發光裝置時，各光偵測器之感光強度分佈函數及所有光偵測器之總感光強度分佈函數。 FIG. 7B is a diagram showing the light intensity distribution function of each photodetector and the total light intensity distribution function of all photodetectors when the optical measuring system of FIG. 7A measures a normally operating light emitting device.

圖8為本發明之再一實施例之光學量測系統及承載結構的側視示意圖。 FIG. 8 is a side elevational view of an optical measurement system and a load-bearing structure according to still another embodiment of the present invention.

圖9為本發明之另一實施例之光學量測系統及承載結構的側視示意圖。 9 is a side elevational view of an optical measurement system and a load bearing structure in accordance with another embodiment of the present invention.

圖10為本發明之又一實施例之光學量測系統及承載結構的側視示意圖。 FIG. 10 is a side elevational view of an optical measurement system and a load bearing structure according to still another embodiment of the present invention.

圖11為本發明之再一實施例之光學量測系統、承載結構及光學量測系統量測發光裝置的側視示意圖。 11 is a side elevational view of an optical measuring system, a load bearing structure, and an optical measuring system measuring light emitting device according to still another embodiment of the present invention.

圖12為本發明之一實施例之光學量測方法的程流圖。 Figure 12 is a flow diagram of an optical metrology method in accordance with one embodiment of the present invention.

50‧‧‧發光裝置 50‧‧‧Lighting device

52‧‧‧發光區 52‧‧‧Lighting area

54‧‧‧發光元件 54‧‧‧Lighting elements

100‧‧‧光學量測系統 100‧‧‧Optical measurement system

110‧‧‧光偵測模組 110‧‧‧Light detection module

112‧‧‧光偵測器 112‧‧‧Photodetector

120‧‧‧訊號整合單元 120‧‧‧Signal Integration Unit

200‧‧‧承載結構 200‧‧‧bearing structure

210‧‧‧承載器 210‧‧‧carrier

220‧‧‧支撐架 220‧‧‧Support frame

230‧‧‧安裝件 230‧‧‧Installation

G‧‧‧光強度訊號 G‧‧‧Light intensity signal

H‧‧‧垂直距離 H‧‧‧Vertical distance

L‧‧‧長度 L‧‧‧ length

P、P1‧‧‧偵測位置 P, P1‧‧‧ detection location

R‧‧‧參考線 R‧‧‧ reference line

T‧‧‧節距 T‧‧‧ pitch

Claims (40)

一種光學量測系統，包括：一光偵測模組，針對多個發光區，在多個不同的偵測位置分別偵測至少部分該些發光區之光強度，以得到分別對應於該些偵測位置的多個光強度訊號；以及一訊號整合單元，整合該些光強度訊號，以得到與該些發光區相關的一整體光強度評估值，其中，當該光偵測模組在一該偵測位置偵測正常運作的該些發光區時，正常運作的該些發光區貢獻給該光偵測模組的感光強度相對於該些不同的發光區的位置具有一感光強度分佈函數，該些偵測位置的該些感光強度分佈函數加總後成為一總感光強度分佈函數，且該些偵測位置落在使該總感光強度分佈函數的均勻度大於該些感光強度分佈函數中的任一個之均勻度的位置上。 An optical measuring system includes: a light detecting module that detects light intensity of at least a portion of the light emitting regions at a plurality of different detecting positions for a plurality of light emitting regions to obtain respectively corresponding to the plurality of detecting regions a plurality of light intensity signals at the measurement location; and a signal integration unit that integrates the light intensity signals to obtain an overall light intensity evaluation value associated with the light emitting regions, wherein the light detection module is in the When the position detection detects the normal operation of the light-emitting areas, the light-sensing areas of the light-emitting detection modules that are normally operated have a light-sensing intensity distribution function relative to the positions of the different light-emitting areas. The photosensitive intensity distribution functions of the detected positions are summed to become a total photosensitive intensity distribution function, and the detected positions fall such that the uniformity of the total photosensitive intensity distribution function is greater than the photosensitive intensity distribution functions. A uniformity position. 如申請專利範圍第1項所述之光學量測系統，其中每一該發光區貢獻給所有的該些偵測位置的光強度總和為一總合值，該些發光區之該些總合值彼此實質上相同。 The optical measuring system of claim 1, wherein each of the light-emitting areas contributes a sum of light intensities of all of the detected positions, and the total combined values of the light-emitting areas They are essentially identical to each other. 如申請專利範圍第2項所述之光學量測系統，其中該些發光區的光學特性彼此實質上相同。 The optical measuring system of claim 2, wherein the optical characteristics of the light emitting regions are substantially identical to each other. 如申請專利範圍第2項所述之光學量測系統，其中每一該發光區至不同的該些偵測位置的距離至少部分不相同。 The optical measuring system of claim 2, wherein the distance from each of the light-emitting areas to the different detected positions is at least partially different. 如申請專利範圍第1項所述之光學量測系統，其中每一該光強度訊號為一電訊號，該訊號整合單元為一運算單元，該運算單元將該些光強度訊號作運算處理，以得到該整體光強度評估值。 The optical measurement system of claim 1, wherein each of the light intensity signals is an electrical signal, and the signal integration unit is an operation unit, and the operation unit performs the operation on the light intensity signals to The overall light intensity evaluation value is obtained. 如申請專利範圍第5項所述之光學量測系統，其中該運算單元將該些光強度訊號加總，以得到該整體光強度評估值。 The optical measuring system of claim 5, wherein the computing unit sums the light intensity signals to obtain the overall light intensity evaluation value. 如申請專利範圍第1項所述之光學量測系統，其中每一該光強度訊號為一光訊號，該訊號整合單元為一光訊號整合單元，以整合該些光訊號。 The optical measurement system of claim 1, wherein each of the light intensity signals is an optical signal, and the signal integration unit is an optical signal integration unit to integrate the optical signals. 如申請專利範圍第7項所述之光學量測系統，其中該訊號整合單元為一積分球，該光偵測模組包括多個光纖，每一光纖具有相對的一第一端與一第二端，該些光纖的該些第一端分別位於該些偵測位置，且該些光纖的該些第二端連接至該積分球，該些光訊號分別經由該些光纖傳遞至該積分球，該積分球將該些光訊號積分，以得到該整體光強度評估值。 The optical measuring system of claim 7, wherein the signal integrating unit is an integrating sphere, the light detecting module comprises a plurality of optical fibers, each of the optical fibers having a first end and a second The first ends of the optical fibers are respectively located at the detecting positions, and the second ends of the optical fibers are connected to the integrating sphere, and the optical signals are respectively transmitted to the integrating sphere via the optical fibers. The integrating sphere integrates the optical signals to obtain the overall light intensity evaluation value. 如申請專利範圍第1項所述之光學量測系統，其中該光偵測模組包括多個光偵測器，分別配置於該些偵測位置上。 The optical measuring system of claim 1, wherein the light detecting module comprises a plurality of light detecting devices respectively disposed at the detecting positions. 如申請專利範圍第9項所述之光學量測系統，其中該些光偵測器呈間隔式排列。 The optical measuring system of claim 9, wherein the photodetectors are arranged in a space. 如申請專利範圍第9項所述之光學量測系統，其中該些光偵測器各為一光譜儀或一光強度計。 The optical measuring system of claim 9, wherein the photodetectors are each a spectrometer or a light intensity meter. 如申請專利範圍第1項所述之光學量測系統，其中該光偵測模組包括至少一光偵測器，上述光偵測器在多個時間移動至該些偵測位置，以分別測得至少部分該些發光區之光強度。 The optical measuring system of claim 1, wherein the light detecting module comprises at least one light detector, wherein the light detector moves to the detecting positions for a plurality of times to separately measure At least some of the light intensity of the light-emitting regions is obtained. 如申請專利範圍第12項所述之光學量測系統，其中所述光偵測器為光譜儀或光強度計。 The optical measuring system of claim 12, wherein the photodetector is a spectrometer or a light intensity meter. 如申請專利範圍第1項所述之光學量測系統，其中每一該發光區由一發光元件所貢獻。 The optical measuring system of claim 1, wherein each of the light emitting regions is contributed by a light emitting element. 如申請專利範圍第14項所述之光學量測系統，其中該發光元件為一發光二極體，且該些發光二極體配置於一條狀承載器上，以形成一發光二極體燈管。 The optical measuring system of claim 14, wherein the light emitting element is a light emitting diode, and the light emitting diodes are disposed on a strip carrier to form a light emitting diode tube. . 如申請專利範圍第1項所述之光學量測系統，其中該些發光區連續接合成一連續的發光線或發光面。 The optical measuring system of claim 1, wherein the illuminating regions are continuously joined to form a continuous illuminating line or illuminating surface. 如申請專利範圍第1項所述之光學量測系統，其中當該光偵測模組在該些偵測位置中之位於邊緣的多個偵測位置的每一個上偵測正常運作的該些發光區時，正常運作的該些不同的發光區貢獻給該光偵測模組的感光強度相對於該些不同的發光區的位置具有一邊緣感光強度分佈函數，該些偵測位置使該些發光區皆落在該些偵測位置的該些邊緣感光強度分佈函數的最大值之一半所對應的多個邊界位置之內，其中每一該邊界位置為該邊緣感光強度分佈函數的最大值之一半所對應的多個位置中之最遠離該發光裝置的中心者。 The optical measuring system of claim 1, wherein the light detecting module detects the normal operation of each of the plurality of detecting positions at the edge of the detecting positions In the illuminating zone, the illuminating intensity of the normal illuminating zone contributing to the photodetecting module has an edge illuminance intensity distribution function relative to the positions of the different illuminating zones, and the detecting positions enable the illuminating zones The illuminating regions are all within a plurality of boundary positions corresponding to one-half of the maximum values of the edge photosensitive intensity distribution functions of the detecting positions, wherein each of the boundary positions is a maximum value of the edge photosensitive intensity distribution function. The center of the plurality of positions corresponding to the half is farthest from the center of the illuminating device. 如申請專利範圍第1項所述之光學量測系統，更包括至少一反射器，配置於該些發光區之整體的周邊。 The optical measuring system of claim 1, further comprising at least one reflector disposed at a periphery of the entirety of the light emitting regions. 如申請專利範圍第1項所述之光學量測系統，更包括至少一反射器，穿插於該些偵測位置之間。 The optical measuring system of claim 1, further comprising at least one reflector interposed between the detecting positions. 如申請專利範圍第1項所述之光學量測系統，其中至少部分該些偵測位置呈現不等節距分佈。 The optical measuring system of claim 1, wherein at least some of the detected positions exhibit an unequal pitch distribution. 如申請專利範圍第20項所述之光學量測系統，其中在該些偵測位置的多個任兩相鄰的偵測位置間的節距中，靠近該些發光區之整體的中央的節距大於遠離該些發光區之整體的中央的節距。 The optical measuring system of claim 20, wherein among the pitches between any two adjacent detecting positions of the detecting positions, a central section close to the whole of the light emitting areas The distance is greater than the pitch of the center away from the entirety of the light-emitting areas. 如申請專利範圍第1項所述之光學量測系統，其中該些發光區排列於一參考線或一參考面上，且至少部分該些偵測位置至該參考線或該參考面之垂直距離不相等。 The optical measuring system of claim 1, wherein the light emitting regions are arranged on a reference line or a reference surface, and at least a portion of the detected positions are perpendicular to the reference line or the reference surface. not equal. 如申請專利範圍第22項所述之光學量測系統，其中在該些偵測位置中，靠近該些發光區之整體的中央的偵測位置至該參考線或參考面的垂直距離大於遠離該些發光區之整體的中央的偵測位置至該參考線或參考面的垂直距離。 The optical measuring system of claim 22, wherein in the detecting positions, a vertical distance from a detecting position of the center of the whole of the light emitting areas to the reference line or the reference surface is greater than The vertical distance from the central detection position of the entire illumination area to the reference line or reference plane. 如申請專利範圍第1項所述之光學量測系統，其中至少部分該些偵測位置的偵測方向彼此不平行。 The optical measuring system of claim 1, wherein the detecting directions of at least some of the detecting positions are not parallel to each other. 如申請專利範圍第24項所述之光學量測系統，其中在該些偵測位置中，較遠離該些發光區之整體的中央的偵測位置之偵測方向往靠近該些發光區之整體的中央的方向傾斜。 The optical measuring system of claim 24, wherein in the detecting positions, the detecting direction of the detecting position of the center farther away from the whole of the light emitting areas is closer to the whole of the light emitting areas. The direction of the center is tilted. 如申請專利範圍第1項所述之光學量測系統，其中該些偵測位置位於該發光裝置的同一側。 The optical measuring system of claim 1, wherein the detecting positions are located on the same side of the light emitting device. 一種光學量測方法，包括：針對多個發光區，在多個不同的偵測位置分別偵測至少部分該些發光區之光強度，以得到分別對應於該些偵測位置的多個光強度訊號；以及整合該些光強度訊號，以得到與該些發光區相關的一整體光強度評估值，其中，當在一該偵測位置偵測正常運作的該些發光區時，正常運作的該些發光區貢獻給該偵測位置的感光強度相對於該些不同的發光區的位置具有一感光強度分佈函數，該些偵測位置的該些感光強度分佈函數加總後成為一總感光強度分佈函數，且該些 偵測位置落在使該總感光強度分佈函數的均勻度大於該些感光強度分佈函數中的任一個之均勻度的位置上。 An optical measurement method includes: detecting, for a plurality of illumination regions, light intensities of at least a portion of the illumination regions at a plurality of different detection locations to obtain a plurality of light intensities respectively corresponding to the detection locations And integrating the light intensity signals to obtain an overall light intensity evaluation value associated with the light emitting regions, wherein when the light emitting regions that are normally operated are detected at the detecting position, the normal operation is performed The illuminating intensity of the illuminating area contributing to the detecting position has a sensible intensity distribution function with respect to the positions of the different illuminating areas, and the sensible intensity distribution functions of the detecting positions are summed to become a total illuminating intensity distribution. Function, and these The detection position falls at a position such that the uniformity of the total photosensitive intensity distribution function is greater than the uniformity of any of the photosensitive intensity distribution functions. 如申請專利範圍第27項所述之光學量測方法，其中在多個不同的偵測位置分別偵測至少部分該些發光區之光強度的方法為利用多個分別配置於該些偵測位置上的光偵測器偵測至少部分該些發光區之光強度，且該些光偵測器呈間隔式排列。 The optical measuring method of claim 27, wherein the method for detecting the light intensity of at least a portion of the light emitting regions at a plurality of different detecting positions is configured by using a plurality of the detecting positions respectively. The upper photodetector detects the light intensity of at least some of the light emitting regions, and the photodetectors are arranged in a space. 如申請專利範圍第27項所述之光學量測方法，其中在多個不同的偵測位置分別偵測至少部分該些發光區之光強度的方法為利用多個分別配置於該些偵測位置上的光偵測器偵測至少部分該些發光區之光強度，且該些光偵測器各為一光譜儀或一光強度計。 The optical measuring method of claim 27, wherein the method for detecting the light intensity of at least a portion of the light emitting regions at a plurality of different detecting positions is configured by using a plurality of the detecting positions respectively. The photodetector detects at least a portion of the light intensity of the light emitting regions, and each of the photodetectors is a spectrometer or a light intensity meter. 一種用以架設一光學量測系統的承載結構，包括：一支撐架；以及至少一安裝件，將該光學量測系統的至少一光偵測器可移動地或不可移動地安裝於該支撐架上，以提供多個不同的偵測位置而讓上述光偵測器在該些不同的偵測位置偵測而分別得到多個光強度訊號，其中該光學量測系統的一訊號整合單元整合該些光強度訊號，其中，上述光偵測器在該些偵測位置分別偵測至少部分該些發光區之光強度，每一該發光區貢獻給所有的該些偵測位置的光強度總和為一總合值，且該安裝件所提供的該些偵測位置是落在使該些發光區之該些總合值彼此實質上相同的位置上。 A load-bearing structure for erecting an optical measurement system, comprising: a support frame; and at least one mounting member, the at least one photodetector of the optical measurement system being movably or non-movably mounted to the support frame The plurality of light intensity signals are respectively detected by the light detectors at the different detection positions by providing a plurality of different detection positions, wherein a signal integration unit of the optical measurement system integrates the The light intensity signals respectively detect the light intensity of at least some of the light emitting regions at the detecting positions, and the sum of the light intensities that each of the light emitting regions contribute to all of the detecting positions is a total value, and the detection positions provided by the mounting member are at positions where the total values of the light-emitting regions are substantially identical to each other. 如申請專利範圍第30項所述之承載結構，其中上述光偵測器為多個光偵測器，且該些光偵測器呈間隔式排列。 The load-bearing structure of claim 30, wherein the photodetector is a plurality of photodetectors, and the photodetectors are arranged in a space. 如申請專利範圍第30項所述之承載結構，其中上述光偵測器為多個光偵測器，且該些光偵測器各為一光譜儀或一光強度計。 The load-bearing structure of claim 30, wherein the photodetector is a plurality of photodetectors, and each of the photodetectors is a spectrometer or a light intensity meter. 如申請專利範圍第30項所述之承載結構，其中上述光偵測器為多個光偵測器，該安裝件將該些光偵測器不可移動地固定於該支撐架上，且固定於該些偵測位置上。 The load-bearing structure of claim 30, wherein the photodetector is a plurality of photodetectors, the mounts are non-movably fixed to the support frame and fixed to the photodetector These detection locations. 如申請專利範圍第30項所述之承載結構，更包括一致動器，使該安裝件在一移動路徑上移動，以在多個時間將上述光偵測器移動至該些偵測位置。 The load bearing structure of claim 30, further comprising an actuator for moving the mounting member on a moving path to move the photodetector to the detecting positions for a plurality of times. 如申請專利範圍第34項所述之承載結構，其中該支撐架包括一滑軌，該安裝件在該滑軌上滑動，以沿著該移動路徑移動。 The load bearing structure of claim 34, wherein the support frame includes a slide rail on which the mount member slides to move along the movement path. 一種光學量測系統，用以量測一發光裝置，該光學量測系統包括：一光偵測模組，針對該發光裝置，在多個不同的偵測位置分別偵測至少部分該發光裝置的光強度，以得到分別對應於該些偵測位置的多個光強度訊號；以及一訊號整合單元，整合該些光強度訊號，以得到與該發光裝置相關的一整體光強度評估值，其中，當該光偵測模組在一該偵測位置偵測正常運作的該發光裝置時，正常運作的該發光裝置上的多個不同的位置貢獻給該光偵測模組的感光強度相對於該發光裝置上的該些不同的位置具有一感光強度分佈函數，該些偵測位置的該些感光強度分佈函數加總後成為一總感光強度分佈函數，且該些偵測位置落在使該總感光強度分佈函數的均勻度大於該些感光強度分佈函數中的任一 個之均勻度的位置上。 An optical measurement system for measuring a light-emitting device, the optical measurement system comprising: a light detection module, wherein the light-emitting device detects at least a portion of the light-emitting device at a plurality of different detection positions The light intensity is obtained to obtain a plurality of light intensity signals respectively corresponding to the detection positions; and a signal integration unit that integrates the light intensity signals to obtain an overall light intensity evaluation value associated with the light emitting device, wherein When the light detecting module detects the normally operating light emitting device at the detecting position, a plurality of different positions on the normally operating light emitting device contribute to the light detecting intensity of the light detecting module relative to the The different positions on the illumination device have a light intensity distribution function, and the light intensity distribution functions of the detection positions are summed to become a total light intensity distribution function, and the detection positions fall on the total The uniformity of the photosensitive intensity distribution function is greater than any of the photosensitive intensity distribution functions The position of the uniformity. 如申請專利範圍第36項所述之光學量測系統，其中該光偵測模組包括多個光偵測器，分別配置於該些偵測位置上，且該些光偵測器呈間隔式排列。 The optical measuring system of claim 36, wherein the light detecting module comprises a plurality of light detecting devices respectively disposed at the detecting positions, and the light detecting devices are spaced apart arrangement. 如申請專利範圍第36項所述之光學量測系統，其中其中該光偵測模組包括多個光偵測器，分別配置於該些偵測位置上，且該些光偵測器各為一光譜儀或一光強度計。 The optical measuring system of claim 36, wherein the light detecting module comprises a plurality of light detecting devices respectively disposed at the detecting positions, and the light detecting devices are respectively A spectrometer or a light intensity meter. 如申請專利範圍第36項所述之光學量測系統，更包括至少一反射器，配置於該些發光區之整體的周邊。 The optical measuring system of claim 36, further comprising at least one reflector disposed at a periphery of the entirety of the light emitting regions. 如申請專利範圍第36項所述之光學量測系統，更包括至少一反射器，穿插於該些偵測位置之間。 The optical measuring system of claim 36, further comprising at least one reflector interposed between the detecting positions.