TWI462193B - 指紋感測晶片封裝方法及其封裝結構 - Google Patents
指紋感測晶片封裝方法及其封裝結構 Download PDFInfo
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Description
本發明係有關一種半導體晶片封裝方法及其封裝結構,特別是一種指紋感測晶片封裝方法及其封裝結構。
在半導體製程領域所提供的晶片製造方式中,通常需考慮晶片所提供的電特性,並且須將晶片透過封裝的程序設置於封裝體中,以免除例如壓力及靜電等外力的任何可能的破壞。
然而隨著晶片應用領域的發展,新的應用必須使得部份之晶片表面裸露於環境中,例如晶片式的指紋感測器需要提供一與手指接觸的晶片表面,以讀取手指的紋路,作為身分識別使用。
圖1為習知的觸滑式指紋辨識器之封裝構造100之示意圖。主要包括一基板110、一半導體晶片120、複數個銲線130以及一封膠體140。半導體晶片120之背面係黏貼在基板110之上表面111,並以銲線130電性連接半導體晶片120至基板110,利用半導體晶片120下方之基板110做為半導體晶片120之機械結合與電性連接之介質,為了包覆銲線130,封膠體140係覆蓋至半導體晶片120之主動面121部份周邊與側面,但需顯露出半導體晶片120主動面121之感測區123,因此封膠時模具之壓合密合度顯得相當重要。此外,打線良率與封膠時是否因模流影響銲線130也是極為重要之因素。
為了解決上述問題,本發明目的之一係提供一種指紋感測晶片封裝方法及其封裝結構,利用導電膠體取代習用金屬銲線以提高產品良率並減少封裝厚度,同時省略習用之模壓製程。此外,利用導電薄膜層與基板地線連接,以消散靜電,達到保護晶片之目的。
為了達到上述目的,本發明一實施例之指紋感測晶片封裝方法,包括下列步驟:提供一基板,基板上具有一線路層;設置一感測晶片於基板上,其中感測晶片之一主動面朝上,且感測晶片的非主動面係直接設置於基板上;形成一導電膠電路層於感測晶片的主動面上,其中導電膠電路層係自感測晶片之主動面的周緣沿著感測晶片之側壁向下延伸並電性連接基板上之線路層,且導電膠電路層係以同一側電性連接主動面及基板上之線路層;形成一非導電薄膜覆蓋感測晶片、導電膠電路層與部份基板;以及形成一導電薄膜於非導電薄膜上。
本發明又一實施例之指紋感測晶片封裝結構,包括:一基板,具有一線路層;一感測晶片,設置於基板上,其中感測晶片之一主動面朝上,且感測晶片的非主動面係直接設置於基板上;一導電膠電路層,形成於感測晶片的主動面上,其中導電膠電路層係自感測晶片之主動面的週邊沿著感測晶片之側壁向下延伸至基板上之線路層,且導電膠電路層係以同一側電性連接主動面及基板上之線路層;一非導電薄膜,覆蓋感測晶片、導電膠電路層與部份基板;以及一導電薄膜,設置於非導電薄膜上,同時與基板之地線連接,以消散靜電。
以下藉由具體實施例配合所附的圖式詳加說明,當更容易瞭解本發明之目的、技術內容、特點及其所達成之功效。
其詳細說明如下,所述較佳實施例僅做一說明非用以限定本發明。
請參考圖2a到圖2e,圖2a至圖2e為本發明指紋感測晶片封裝方法之流程之結構剖視示意圖。指紋感測晶片封裝方法包括下列步驟。首先,參考圖2a,提供一基板210,基板210上具有一線路層(圖中未示)。參考圖2b,設置一感測晶片220於此基板210上,其中感測晶片220之一主動面222朝上且感測晶片220的非主動面係直接設置於基板210上。於一實施例中,感測晶片220可以利用黏貼的方式設置於基板210上。接著,參考圖2c,形成一導電膠電路層230於感測晶片220上,其中導電膠電路層230係自感測晶片220之主動面222的周緣沿著感測晶片220之側壁224向下延伸並電性連接基板210上之線路層,且導電膠電路層230以同一側電性連接主動面222及基板210上之線路層。再來,為保護感測晶片220不受使用者汗水汙染或外力破壞,形成一非導電薄膜240覆蓋感測晶片220、導電膠電路層230與部份基板210,如圖2d。以及,形成一導電薄膜250於非導電薄膜240上,如圖2e所示。
接續上述,於一實施例中,導電膠電路層230係利用灌模方式或是塗佈的方式形成於感測晶片220之主動面222的周緣。於又一實施例中,形成非導電薄膜240且/或導電薄膜250之方法係包括汽化冷卻沉積法、印刷方法、噴塗方法。為使接地效果良好,更包括開設一接地點212或接地面於基板210上,並於上述導電薄膜250覆蓋過程中一併覆蓋包含該接地位置的區域,達到連接之目的,以避免靜電放電(Electrostatic Discharge,ESD)對半導體元件造成的損害。此外,省略習用包覆銲線之模壓製程
(molding process),避免指紋感測晶片兩端的凸起部份以獲得更平坦之接觸面。
請繼續參考圖2e,本發明又一實施例之指紋感測晶片封裝結構,如圖所示,此指紋感測晶片封裝結構200包括:一基板210,含有一線路層(圖中未示)。一感測晶片220設置於基板210上,其中感測晶片220之一主動面222係朝上,且感測晶片220的非主動面係直接設置於基板210上。一導電膠電路層230,形成於感測晶片220上,其中導電膠電路層230係自感測晶片220之主動面222的周緣沿著感測晶片220之側壁224向下延伸至基板210上之線路層,且導電膠電路層230係以同一側電性連接主動面222及基板210上之線路層。其中導電膠電路層230係設置於感測晶片220之主動面222的周緣以曝露出感測區。一非導電薄膜240,覆蓋感測晶片220、導電膠電路層230與部份基板210。以及,一導電薄膜250,設置於非導電薄膜240上。
接續上述,基板210之材質包括金屬、玻璃、陶瓷或複合材料材質所構成。於一實施例中,導電膠電路層230之材料包括銀膠或其他導電膠體以完成電性連接感測晶片220與基板210,並改善因為打線會出現的良率問題,此外,導電膠電路層230之使用更可以縮小整體厚度,使產品更臻輕薄微小化。其中感測晶片220含有複數個導電接點設置於主動面222之周緣。導電膠電路層230則電性連接導電接點與基板210上之線路層。
接續說明,此實施例之指紋感測晶片封裝結構,其非導電薄膜240之材質包括塑膠或高分子材料以保護感測晶片與其上之電路或導電接點。於一實施例中,非導電薄膜240之厚度的範圍0.1~5μm。另,導電薄膜250之材質包括金屬材質。於一實施例中,導電薄膜250除可以作為接地作用;另外,為避免使用者長期觸模造成可能的損壞,
導電薄膜250最好具有耐刮、耐腐蝕之特性。故一實施例中,導電薄膜250之材質可包括鈦金屬及其合金。於一實施例中,導電薄膜250係與基板210上之一接地點212或接地面電性連接,以消散靜電,達到保護晶片之目的。於又一實施例中,為提供此封裝結構更好的保護,更包括一非導電薄膜260設置於導電薄膜250上以提供耐腐蝕與耐磨保護之功能,如圖2e所示。
綜合上述,本發明提供一種指紋感測晶片封裝方法及其封裝結構,利用導電膠體取代習用金屬銲線以提高產品良率並減少封裝厚度。另,省略習用之模壓製程,避免兩端的凸起部份以獲得更平坦之接觸面。此外,利用導電薄膜層與基板地線連接,以消散靜電,達到保護晶片之目的。
以上所述之實施例僅係為說明本發明之技術思想及特點,其目的在使熟習此項技藝之人士能夠瞭解本發明之內容並據以實施,當不能以之限定本發明之專利範圍,即大凡依本發明所揭示之精神所作之均等變化或修飾,仍應涵蓋在本發明之專利範圍內。
100‧‧‧觸滑式指紋辨識器之封裝構造
110‧‧‧基板
111‧‧‧上表面
120‧‧‧半導體晶片
121‧‧‧主動面
123‧‧‧感測區
130‧‧‧銲線
140‧‧‧封膠體
200‧‧‧指紋感測晶片封裝結構
210‧‧‧基板
212‧‧‧接地點
220‧‧‧感測晶片
222‧‧‧主動面
224‧‧‧側壁
230‧‧‧導電膠電路層
240,260‧‧‧非導電薄膜
250‧‧‧導電薄膜
圖1係習知觸滑式指紋辨識器之封裝構造之示意圖。
圖2a至圖2e為本發明指紋感測晶片封裝方法之流程之結構剖視示意圖。
200‧‧‧指紋感測晶片封裝結構
210‧‧‧基板
212‧‧‧接地點
220‧‧‧感測晶片
222‧‧‧主動面
224‧‧‧側壁
230‧‧‧導電膠電路層
240‧‧‧非導電薄膜
250‧‧‧導電薄膜
260‧‧‧非導電薄膜
Claims (14)
- 一種指紋感測晶片封裝方法,係包含下列步驟:提供一基板,該基板上具有一線路層;設置一感測晶片於該基板上,其中該感測晶片之一主動面朝上,且該感測晶片的非主動面係直接設置於該基板上;形成一導電膠電路層於該感測晶片的該主動面上,其中該導電膠電路層係自該感測晶片之該主動面的周緣沿著該感測晶片之側壁向下延伸並電性連接該基板上之該線路層,且該導電膠電路層係以同一側電性連接該主動面及該基板上之該線路層;形成一非導電薄膜覆蓋該感測晶片、該導電膠電路層與部份該基板;以及形成一導電薄膜於該非導電薄膜上。
- 如請求項1所述之指紋感測晶片封裝方法,其中形成該導電膠電路層之方法包含灌模、塗佈方法。
- 如請求項1所述之指紋感測晶片封裝方法,其中形成該非導電薄膜之方法係包含汽化冷卻沉積法、印刷方法、噴塗方法。
- 如請求項1所述之指紋感測晶片封裝方法,其中形成該導電薄膜之方法係包含汽化冷卻沉積法、印刷方法、噴塗方法。
- 如請求項1所述之指紋感測晶片封裝方法,更包含設置一接地點或一接地面於該基板上,並將該導電薄膜與該接地點或該接地面電性連接。
- 一種指紋感測晶片封裝結構,包含:一基板,具有一線路層;一感測晶片,設置於該基板上,其中該感測晶片之一主動面係朝上,且該感測晶片的非主動面係直接設置於該基板上; 一導電膠電路層,形成於該感測晶片的該主動面上,其中該導電膠電路層係自該感測晶片之該主動面的週邊沿著該感測晶片之側壁向下延伸至該基板上之該線路層,且該導電膠電路層係以同一側電性連接該主動面及該基板上之該線路層;一非導電薄膜,覆蓋該感測晶片、該導電膠電路層與部份該基板;以及一導電薄膜,設置於該非導電薄膜上。
- 如請求項6所述之指紋感測晶片封裝結構,其中該導電膠電路層之材料包含銀膠。
- 如請求項6所述之指紋感測晶片封裝結構,其中該非導電薄膜之材質包含塑膠或高分子材料。
- 如請求項6所述之指紋感測晶片封裝結構,其中該導電薄膜之材質包含金屬材質。
- 如請求項6所述之指紋感測晶片封裝結構,其中該導電薄膜之材質包含鈦金屬及其合金。
- 如請求項6所述之指紋感測晶片封裝結構,其中該感測晶片含有複數個導電接點設置於該主動面之周緣。
- 如請求項11所述之指紋感測晶片封裝結構,其中該導電膠電路層係電性連接該些導電接點與該基板上之該線路層。
- 如請求項6所述之指紋感測晶片封裝結構,其中該非導電薄膜之厚度的範圍0.1~5μm。
- 如請求項6所述之指紋感測晶片封裝結構,其中該導電薄膜係與該基板上之一接地點或一接地面電性連接。
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CN104766053B (zh) * | 2015-03-26 | 2018-10-30 | 业成光电(深圳)有限公司 | 指纹识别装置及其制造方法 |
CN105205473A (zh) * | 2015-10-19 | 2015-12-30 | 深圳市欧菲投资控股有限公司 | 指纹识别传感器及其制作方法 |
US9939920B2 (en) | 2016-03-03 | 2018-04-10 | Microsoft Technology Licensing, Llc | Keyset fingerprint sensor with backlight |
CN106972007A (zh) * | 2016-12-23 | 2017-07-21 | 创智能科技股份有限公司 | 具有抗静电结构的指纹感测辨识装置 |
CN106803079B (zh) * | 2017-01-20 | 2020-08-21 | Oppo广东移动通信有限公司 | 指纹模组及移动终端 |
KR101981247B1 (ko) * | 2017-03-02 | 2019-05-23 | 크루셜텍 (주) | 센서 패키지용 코팅 장치 |
CN108538733B (zh) * | 2017-03-02 | 2021-06-11 | 韩国科泰高科株式会社 | 传感器封装件用涂覆装置及利用其制造的传感器封装件 |
CN108960006B (zh) * | 2017-05-19 | 2021-11-30 | 致伸科技股份有限公司 | 指纹识别模块及其制作方法 |
CN107664868B (zh) * | 2017-10-23 | 2020-12-01 | 京东方科技集团股份有限公司 | 一种彩膜基板及其制备方法和显示面板 |
CN109379460B (zh) | 2018-10-15 | 2019-11-26 | 华为技术有限公司 | 镜头、主动发光模组及终端 |
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