TWI458034B - Cooling system for semiconductor manufacturing and testing processes - Google Patents
Cooling system for semiconductor manufacturing and testing processes Download PDFInfo
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- TWI458034B TWI458034B TW099126208A TW99126208A TWI458034B TW I458034 B TWI458034 B TW I458034B TW 099126208 A TW099126208 A TW 099126208A TW 99126208 A TW99126208 A TW 99126208A TW I458034 B TWI458034 B TW I458034B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
- F25B9/02—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effect; using vortex effect
- F25B9/04—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effect; using vortex effect using vortex effect
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- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
本發明是有關於一種冷卻系統，特別適用於半導體製程或測試系統之渦流冷卻系統，其用來提供一適合半導體製造與測試之環境溫度。This invention relates to a cooling system, particularly for eddy current cooling systems for semiconductor processes or test systems, for providing an ambient temperature suitable for semiconductor fabrication and testing.
半導體元件之製造與測試是一項花費人力的工作，因為製程的複雜性，高失效率可能會在製造元件時發生，因此，此半導體元件必須在設定參數下做廣泛的測試以確保運作正常，此外，半導體元件測試不只是需要測試半導體之性能，也需測試此性能在不同預期溫度下的運作狀況。The manufacture and testing of semiconductor components is a labor-intensive task. Because of the complexity of the process, high failure rates may occur during component manufacturing. Therefore, the semiconductor components must be extensively tested under set parameters to ensure proper operation. In addition, semiconductor component testing is not only required to test the performance of the semiconductor, but also to test the performance of this performance at different expected temperatures.
半導體元件可能會在一非常大範圍之溫度狀態下操作，從極高溫度至低溫，以及，其中使用者期望運作此半導體元件性能之任一預期溫度環境，因此，其會需要在此預期溫度範圍內來測試此半導體元件以確保其元件之耐用性。Semiconductor components may operate over a very wide range of temperatures, from very high temperatures to low temperatures, and any desired temperature environment in which the user desires to operate the performance of the semiconductor component, and therefore, would require an expected temperature range This semiconductor component is internally tested to ensure the durability of its components.
譬如，傳統測試半導體元件的方法包含有一渦流管，其用來冷卻此待製造或待測試之半導體元件在製造或測試時所需之環境溫度，其中一壓縮空氣被導入一渦流管，最後，冷空氣會排出到此待測試與製造元件周圍來冷卻其環境溫度。For example, a conventional method of testing a semiconductor device includes a vortex tube for cooling an ambient temperature required for manufacturing or testing a semiconductor component to be fabricated or to be tested, wherein a compressed air is introduced into a vortex tube, and finally, cold. Air is discharged to the area to be tested and manufactured to cool its ambient temperature.
然而，因為其渦流管之空氣冷卻管與其環境溫度的溫度差，水氣容易凝結在此空氣冷卻管之周圍，而此凝結之水氣容易從此渦流管之空氣冷卻管滴落到此待製造或待測試元件上，其容易造成此待測試或製造元件之失效，一般此渦流管常用一隔熱材料來包覆在其外圍，但是水氣凝結仍容易發生在此包覆之隔熱材料上，如此一來，即容易對此半導體製造與測試元件造成汙染與損害。However, because of the temperature difference between the air cooling tube of the vortex tube and its ambient temperature, the moisture easily condenses around the air cooling tube, and the condensed water vapor is easily dripped from the air cooling tube of the vortex tube to be manufactured or On the component to be tested, it is easy to cause failure of the component to be tested or manufactured. Generally, the vortex tube is usually coated with a heat insulating material on the periphery thereof, but moisture condensation is still likely to occur on the coated heat insulating material. As a result, it is easy to cause pollution and damage to the semiconductor manufacturing and test components.
因此，本發明的目的是提供一種冷卻系統，並提供此待測試與製造之半導體元件之環境溫度，其為一有效且低成本之方法，並且，不需要其他移動配件、電氣裝置與冷媒，而不會有水氣凝結的問題。Accordingly, it is an object of the present invention to provide a cooling system and to provide an ambient temperature of the semiconductor component to be tested and fabricated which is an efficient and low cost method and which does not require other moving parts, electrical devices and refrigerants. There will be no problem of condensation.
在此本發明中，一渦流管包含有：一接受壓縮空氣之入口；一熱空氣排氣管，其排氣溫度高於此接受之壓縮空氣；一冷空氣排氣管，其排氣溫度低於此接收壓縮空氣；一乾空氣管接至此隔熱系統，並且此乾空氣管內之乾空氣會至此渦流管之冷空氣排氣管之排氣口排出，此冷空氣排氣管連接至此半導體製程元件處，所以，此半導體製程元件可從此渦流管接收一冷空氣，此冷空氣可提供一適合此半導體製造與測試元件之環境溫度以運作其半導體功能，此乾空氣管在此冷空氣排氣管周圍可作為一隔熱層用，所以在此冷空氣排出管周圍不會有水氣凝結，如此一來，即不會對此半導體製造與測試元件造成汙染與損害。In the present invention, a vortex tube includes: an inlet for receiving compressed air; a hot air exhaust pipe having a discharge temperature higher than the compressed air received; and a cold air exhaust pipe having a low exhaust temperature Receiving compressed air; a dry air pipe is connected to the heat insulation system, and the dry air in the dry air pipe is discharged to the exhaust port of the cold air exhaust pipe of the vortex tube, and the cold air exhaust pipe is connected to the semiconductor process At the component, the semiconductor process component can receive a cold air from the vortex tube, and the cold air can provide an ambient temperature suitable for the semiconductor manufacturing and test component to operate its semiconductor function, and the dry air pipe is ventilated therein. The tube can be used as a heat insulation layer, so there is no moisture condensation around the cold air discharge pipe, which will not cause pollution and damage to the semiconductor manufacturing and test components.
參考圖一，其顯示本發明用一渦流單元(1)來作為冷卻系統用之示意圖，一渦流管(2)接收一壓縮空氣(3)且將其分為一熱氣流(4)與一冷氣流(5)，此壓縮空氣流(3)是從一壓縮機(12)或製程工廠中之一中央壓縮空氣系統而來，此渦流管(2)中之圓筒渦流產生器(6)會產生一第一旋轉氣流，此第一旋轉氣流沿著渦流管壁被送至此渦流管之尾端，此第一旋轉氣流部分之圓周層氣流(7)經過一控制閥(15)，會以熱空氣的形式排出，此第一旋轉氣流之其餘部分則從中央管路回流以形成一中央層氣流(8)，此第一旋轉氣流之中央層氣流(8)以相對於此圓周層氣流(7)反向且較慢的速度流動，其中，在此中央層氣流(8)之熱會被傳送至此較快移動之圓周層氣流(7)，如此，可降低此中央層氣流(8)之溫度，此中央層氣流(8)流過此圓筒渦流產生器(6)並從一冷氣流管(10)排出以形成一冷氣流(5)，為了冷卻的目的，此冷空氣流(5)被導入至此半導體製程或測試元件(9)上。其中，在此圓周層氣流(7)之角速度是非常慢而在此中央層氣流(8)中則是非常快是此渦流管(2)的運作機制，在此圓周層氣流(7)與此中央層氣流(8)之間的摩擦會使其降低相對的角速度以使形成一完整的流體，如此會使內層的中央層氣流(8)的角速度降低，且會使外層的圓周層氣流(7)的角速度增加，結果就是此中央層氣流(8)會失去其動能並轉移至此圓周層氣流(7)內，此中央層氣流(8)之溫度會降低，而此圓周層氣流(7)之溫度會升高，如此一來，即可在此冷氣流管(10)處形成該冷氣流(5)，此冷氣流管(10)在連接至一位於半導體製程或測試設備上之夾具(11)上以用來冷卻此半導體元件(9)之溫度。Referring to Figure 1, there is shown a schematic diagram of the present invention using a vortex unit (1) as a cooling system. A vortex tube (2) receives a compressed air (3) and divides it into a hot gas stream (4) and a cold air. Flow (5), the compressed air stream (3) is from a compressor (12) or a central compressed air system in a process plant, and the cylindrical vortex generator (6) in the vortex tube (2) Generating a first swirling airflow that is sent along the wall of the vortex tube to the trailing end of the vortex tube. The circumferential layer airflow (7) of the first swirling airflow portion passes through a control valve (15) and is heated Exhausted in the form of air, the remainder of the first swirling gas stream is recirculated from the central conduit to form a central layer of gas stream (8), the central layer of gas stream (8) of the first swirling gas stream being associated with the gas stream (7) a reverse and slower speed flow, wherein the heat in the central layer gas stream (8) is transferred to the faster moving circumferential layer gas stream (7), thus reducing the temperature of the central layer gas stream (8) The central layer gas stream (8) flows through the cylindrical vortex generator (6) and is discharged from a cold gas flow tube (10) to form a cold gas stream (5). Cooling purposes, the cooling air flow (5) is introduced into a semiconductor manufacturing process or test point element (9). Wherein, the angular velocity of the circumferential layer airflow (7) is very slow and in this central layer airflow (8) is very fast is the operating mechanism of the vortex tube (2), in which the circumferential layer airflow (7) and The friction between the central layer airflow (8) causes it to reduce the relative angular velocity so that a complete fluid is formed, which reduces the angular velocity of the inner layer airflow (8) of the inner layer and causes the outer layer of the outer layer to flow ( 7) The angular velocity increases, and as a result, the central layer airflow (8) loses its kinetic energy and is transferred to the circumferential layer airflow (7). The temperature of the central layer airflow (8) is lowered, and the circumferential layer airflow (7) The temperature will rise so that the cold gas stream (5) can be formed at the cold gas flow tube (10), which is connected to a fixture located on the semiconductor process or test equipment ( 11) Upper to cool the temperature of the semiconductor element (9).
參考圖一所示，本發明之渦流單元(1)之冷氣流管(10)外部包覆了一乾空氣管(14)，其內有一乾空氣流(13)是從一壓縮機(12)或製程工廠中之一中央壓縮空氣系統而來，此乾空氣流(13)之溫度介於此熱氣流(4)與此冷氣流(5)之間，此乾空氣流(13)環繞著此冷氣流管(10)外部流過，並從此冷氣流管(10)處導出，因為此乾空氣流(13)環繞著此冷氣流管(10)外部流過，故不會有水氣凝結在此冷氣流管(10)之外部以至於凝結滴落至此製造或測試區，因此，不會有汙染與損害至此半導體製造與測試元件(9)與此半導體製造與測試機台(19)，此在乾空氣管(14)內之乾空氣流(13)即形成一良好之溫度隔絕層，且此乾空氣管(14)可良好設計以至不會干擾此冷氣流管(10)之溫度特性。Referring to Figure 1, the cold flow tube (10) of the vortex unit (1) of the present invention is externally coated with a dry air tube (14) having a dry air flow (13) from a compressor (12) or a central compressed air system in the process plant, the temperature of the dry air stream (13) being between the hot gas stream (4) and the cold gas stream (5), the dry air stream (13) surrounding the cold air The flow tube (10) flows outside and is led out from the cold gas flow tube (10) because the dry air flow (13) flows around the outside of the cold gas flow tube (10), so that no moisture condensation occurs here. The outside of the cold gas flow tube (10) is so as to condense and drip into the manufacturing or test area, so there is no pollution and damage to the semiconductor manufacturing and testing component (9) and the semiconductor manufacturing and testing machine (19). The dry air stream (13) in the dry air tube (14) forms a good temperature barrier and the dry air tube (14) is well designed so as not to interfere with the temperature characteristics of the cold gas tube (10).
並且，位於此渦流管(2)之熱氣流出口之一控制閥(15)可用來控制此冷氣流的比例，此導至此冷氣流管(10)之冷氣流相對於此導入渦流管(2)之壓縮氣流是為該冷氣流的比例，如此，使用者藉由控制此控制閥(15)可以控制出渦流管(2)之熱氣流(4)與冷氣流(5)之流量，並且其可提供許多不同的比例，調整此熱流管出口之熱氣口(17)之流量可以設定此冷氣口(16)之流量與溫度，當此熱氣口(17)之氣流溫度因不同接受之壓縮氣體壓力變化而升高時，此冷氣口(16)之氣流溫度會下降，其原因是，當越多的熱氣流(4)從熱氣口(17)排出會使冷氣流(5)的排出比例降低，此即降低此冷氣流的比例，如此會更進一步降低此冷氣口(16)之冷氣流(5)溫度，當越少的熱氣流(4)從熱氣口(17)排出會使冷氣流(5)排出比例升高，此即提高此冷氣流的比例，此冷氣口(16)之冷氣流(5)溫度會降低的較少。在另一方面，改變此送入之壓縮氣體(3)之流量或壓力也會改變此冷氣流(5)與此熱氣流(4)之溫度，增加此壓縮氣體(3)之壓力並維持較低的冷氣流的比例可以使此冷氣流(5)之溫度降低更多且此熱氣流(4)之溫度並不會升高太多，相反地，增加此壓縮氣體(3)之壓力並維持較高的冷氣流的比例可以使此冷氣流(5)之溫度降低較少且此熱氣流(4)之溫度會升高較多，如此具有相當大的操作彈性。一控制器(18)連接至此壓縮機(12)與此半導體製造與測試機台(19)以控制此冷卻系統之運作，此控制閥(15)連接到在此半導體製造與測試機台(19)上之一溫度感測器(20)，如此連結可控制此控制閥(15)。And a control valve (15) located at the outlet of the hot gas flow (2) of the vortex tube (2) can be used to control the proportion of the cold air flow, and the cold air flow leading to the cold air flow pipe (10) is introduced into the vortex tube (2). The compressed air flow is the ratio of the cold air flow, so that the user can control the flow of the hot air flow (4) and the cold air flow (5) of the vortex tube (2) by controlling the control valve (15), and A plurality of different ratios are provided. The flow rate of the hot gas port (17) at the outlet of the heat pipe can be adjusted to set the flow rate and temperature of the cold gas port (16). When the temperature of the gas port of the hot gas port (17) varies due to different pressures of the compressed gas received, When rising, the temperature of the air flow of the cold air port (16) will decrease because the more hot air flow (4) is discharged from the hot air port (17), the lower the discharge rate of the cold air flow (5) is lowered. That is to reduce the proportion of the cold air flow, which will further reduce the cold air flow (5) temperature of the cold air port (16), when less hot air flow (4) is discharged from the hot air port (17), the cold air flow (5) The discharge ratio is increased, which increases the proportion of the cold gas flow, and the cold gas flow (5) of the cold gas port (16) is less reduced in temperature. On the other hand, changing the flow or pressure of the compressed gas (3) fed also changes the temperature of the cold gas stream (5) and the hot gas stream (4), increasing the pressure of the compressed gas (3) and maintaining the pressure. The ratio of the low cold gas flow can reduce the temperature of the cold gas stream (5) more and the temperature of the hot gas stream (4) does not rise too much. Conversely, the pressure of the compressed gas (3) is increased and maintained. The higher ratio of cold gas flow can reduce the temperature of the cold gas stream (5) less and the temperature of the hot gas stream (4) will increase more, thus having considerable operational flexibility. A controller (18) is coupled to the compressor (12) and the semiconductor manufacturing and testing machine (19) to control the operation of the cooling system. The control valve (15) is coupled to the semiconductor manufacturing and testing machine (19). A temperature sensor (20) is connected to control the control valve (15).
雖然本發明已以前述較佳實施例揭示，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與修改。因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。While the present invention has been described in its preferred embodiments, it is not intended to limit the scope of the invention, and various modifications and changes can be made without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.
1．．．渦流單元1. . . Eddy current unit
2．．．渦流管2. . . Vortex tube
3．．．壓縮空氣3. . . Compressed air
4．．．熱氣流4. . . Hot air flow
5．．．冷氣流5. . . Cold air flow
6．．．圓筒渦流產生器6. . . Cylinder vortex generator
7．．．圓周層氣流7. . . Circumferential layer airflow
8．．．中央層氣流8. . . Central layer airflow
9．．．半導體製造與測試元件9. . . Semiconductor manufacturing and test components
10．．．冷氣流管10. . . Cold air tube
11．．．夾具11. . . Fixture
12．．．壓縮機12. . . compressor
13．．．乾空氣流13. . . Dry air flow
14．．．乾空氣管14. . . Dry air tube
15．．．控制閥15. . . Control valve
16．．．冷氣口16. . . Cold air port
17．．．熱氣口17. . . Hot air port
18．．．控制器18. . . Controller
19．．．半導體製造與測試機台19. . . Semiconductor manufacturing and test machine
20．．．溫度感測器20. . . Temperature sensor
圖一係本發明之用於半導體製造與測試製程之冷卻系統示意圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic illustration of a cooling system for a semiconductor fabrication and test process of the present invention.
1．．．渦流單元1. . . Eddy current unit
2．．．渦流管2. . . Vortex tube
3．．．壓縮空氣3. . . Compressed air
4．．．熱氣流4. . . Hot air flow
5．．．冷氣流5. . . Cold air flow
6．．．圓筒渦流產生器6. . . Cylinder vortex generator
7．．．圓周層氣流7. . . Circumferential layer airflow
8．．．中央層氣流8. . . Central layer airflow
9．．．半導體製造與測試元件9. . . Semiconductor manufacturing and test components
10．．．冷氣流管10. . . Cold air tube
11．．．夾具11. . . Fixture
12．．．壓縮機12. . . compressor
13．．．乾空氣流13. . . Dry air flow
14．．．乾空氣管14. . . Dry air tube
15．．．控制閥15. . . Control valve
16．．．冷氣口16. . . Cold air port
17．．．熱氣口17. . . Hot air port
18．．．控制器18. . . Controller
19．．．半導體製造與測試機台19. . . Semiconductor manufacturing and test machine
20．．．溫度感測器20. . . Temperature sensor
Claims (4)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29526610P | 2010-01-15 | 2010-01-15 |
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| Publication Number | Publication Date |
|---|---|
| TW201125060A TW201125060A (en) | 2011-07-16 |
| TWI458034B true TWI458034B (en) | 2014-10-21 |
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| US (1) | US20110173994A1 (en) |
| CN (1) | CN102080897B (en) |
| TW (1) | TWI458034B (en) |
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| CN103278029B (en) * | 2013-06-03 | 2015-10-21 | 上海华虹宏力半导体制造有限公司 | The heat-exchange system of the board of high temperature semiconductors technique and method |
| CN105485803A (en) * | 2014-09-15 | 2016-04-13 | 张奠立 | Fan temperature adjusting device |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201125060A (en) | 2011-07-16 |
| CN102080897B (en) | 2012-11-21 |
| CN102080897A (en) | 2011-06-01 |
| US20110173994A1 (en) | 2011-07-21 |
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