TWI455897B - - Google Patents

Info

Publication number: TWI455897B
Authority: TW; Taiwan

Application number

TW100138047A

Other languages

Chinese (zh)

Other versions

TW201317187A (en

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2011-10-20

Filing date

2011-10-20

Publication date

2014-10-11

2011-10-20 Application filed filed Critical

2011-10-20 Priority to TW100138047A priority Critical patent/TW201317187A/en

2013-05-01 Publication of TW201317187A publication Critical patent/TW201317187A/en

2014-10-11 Application granted granted Critical

2014-10-11 Publication of TWI455897B publication Critical patent/TWI455897B/zh

Links

TW100138047A 2011-10-20 2011-10-20 Breaking device for hard brittle material and method thereof TW201317187A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
TW100138047A TW201317187A (en)	2011-10-20	2011-10-20	Breaking device for hard brittle material and method thereof

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
TW100138047A TW201317187A (en)	2011-10-20	2011-10-20	Breaking device for hard brittle material and method thereof

Publications (2)

Publication Number	Publication Date
TW201317187A TW201317187A (en)	2013-05-01
TWI455897B true TWI455897B (en)	2014-10-11

Family

ID=48871703

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW100138047A TW201317187A (en)	2011-10-20	2011-10-20	Breaking device for hard brittle material and method thereof

Country Status (1)

Country	Link
TW (1)	TW201317187A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN101544029A (en) *	2008-03-26	2009-09-30	东捷科技股份有限公司	Micro-vibration auxiliary cutting device and method for brittle material
CN102079057A (en) *	2009-11-26	2011-06-01	旭硝子株式会社	Processing method for glass substrate and device therefor

2011
- 2011-10-20 TW TW100138047A patent/TW201317187A/en unknown

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN101544029A (en) *	2008-03-26	2009-09-30	东捷科技股份有限公司	Micro-vibration auxiliary cutting device and method for brittle material
CN102079057A (en) *	2009-11-26	2011-06-01	旭硝子株式会社	Processing method for glass substrate and device therefor

Also Published As

Publication number	Publication date
TW201317187A (en)	2013-05-01

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