TWI455152B - 電路連接用接著膜及其用途、電路連接構造體及其製造方法、以及電路構件的連接方法 - Google Patents

電路連接用接著膜及其用途、電路連接構造體及其製造方法、以及電路構件的連接方法 Download PDF

Info

Publication number
TWI455152B
TWI455152B TW100120185A TW100120185A TWI455152B TW I455152 B TWI455152 B TW I455152B TW 100120185 A TW100120185 A TW 100120185A TW 100120185 A TW100120185 A TW 100120185A TW I455152 B TWI455152 B TW I455152B
Authority
TW
Taiwan
Prior art keywords
circuit
film
electrode
thickness
adhesive layer
Prior art date
Application number
TW100120185A
Other languages
English (en)
Chinese (zh)
Other versions
TW201222568A (en
Inventor
Satoru Mori
Kazuya Sato
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW201222568A publication Critical patent/TW201222568A/zh
Application granted granted Critical
Publication of TWI455152B publication Critical patent/TWI455152B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

Landscapes

  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW100120185A 2010-06-14 2011-06-09 電路連接用接著膜及其用途、電路連接構造體及其製造方法、以及電路構件的連接方法 TWI455152B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010135301 2010-06-14
JP2011111490A JP5441954B2 (ja) 2010-06-14 2011-05-18 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法

Publications (2)

Publication Number Publication Date
TW201222568A TW201222568A (en) 2012-06-01
TWI455152B true TWI455152B (zh) 2014-10-01

Family

ID=45777099

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100120185A TWI455152B (zh) 2010-06-14 2011-06-09 電路連接用接著膜及其用途、電路連接構造體及其製造方法、以及電路構件的連接方法

Country Status (4)

Country Link
JP (2) JP5441954B2 (ja)
KR (1) KR101380070B1 (ja)
CN (1) CN102382581B (ja)
TW (1) TWI455152B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI588237B (zh) * 2012-09-28 2017-06-21 住友金屬鑛山股份有限公司 導電性接著劑
JP2016011427A (ja) * 2015-09-07 2016-01-21 古河電気工業株式会社 接着フィルム、ウェハ加工用テープおよび接着フィルムの製造方法
CN105820769A (zh) * 2016-04-22 2016-08-03 合肥宝亿自动化科技有限公司 一种硅胶带无缝连接端结构
US10968373B2 (en) 2016-09-30 2021-04-06 Sekisui Chemical Co., Ltd. Epoxy adhesive composition
MY195455A (en) * 2016-11-18 2023-01-24 Furukawa Electric Co Ltd Joining Film, Tape for Wafer Processing, Method for Producing Joined Body, and Joined Body
JP2020164722A (ja) * 2019-03-29 2020-10-08 デクセリアルズ株式会社 接着剤組成物
JP2023165190A (ja) * 2022-05-02 2023-11-15 株式会社レゾナック 積層体、積層体の製造方法、及び、接続構造体の製造方法
WO2024091839A1 (en) * 2022-10-26 2024-05-02 Ppg Industries Ohio, Inc. Coating composition for use in high efficiency applicators

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200932861A (en) * 2007-10-18 2009-08-01 Hitachi Chemical Co Ltd Adhesive composition, circuit connecting material using the adhesive composition, method for connecting circuit member, and circuit connecting body
WO2010047374A1 (ja) * 2008-10-22 2010-04-29 日立化成工業株式会社 接着剤フィルム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63193883U (ja) * 1987-05-29 1988-12-14
JP3477367B2 (ja) * 1998-05-12 2003-12-10 ソニーケミカル株式会社 異方導電性接着フィルム
JP4627125B2 (ja) * 2001-07-27 2011-02-09 三井化学株式会社 異方性導電ペースト
US20120048606A1 (en) * 2007-08-08 2012-03-01 Hitachi Chemical Company, Ltd. Adhesive composition, film-like adhesive, and connection structure for circuit member

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200932861A (en) * 2007-10-18 2009-08-01 Hitachi Chemical Co Ltd Adhesive composition, circuit connecting material using the adhesive composition, method for connecting circuit member, and circuit connecting body
WO2010047374A1 (ja) * 2008-10-22 2010-04-29 日立化成工業株式会社 接着剤フィルム

Also Published As

Publication number Publication date
CN102382581A (zh) 2012-03-21
JP5441954B2 (ja) 2014-03-12
KR20130051461A (ko) 2013-05-20
JP2012023025A (ja) 2012-02-02
CN102382581B (zh) 2014-12-31
JP2013101942A (ja) 2013-05-23
KR101380070B1 (ko) 2014-04-01
TW201222568A (en) 2012-06-01

Similar Documents

Publication Publication Date Title
TWI455152B (zh) 電路連接用接著膜及其用途、電路連接構造體及其製造方法、以及電路構件的連接方法
TW200417576A (en) Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body
TWI452110B (zh) A circuit-connecting material, a connecting structure using it, and a method of temporarily pressing
JP2008111092A (ja) 回路接続材料及びそれを用いた接続構造体
JP6237855B2 (ja) 接着フィルム、回路部材の接続構造及び回路部材の接続方法
JP2012021140A (ja) 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
TWI554162B (zh) 電路連接用接著膜及其用途、電路連接構造體及其製造方法、以及電路構件的連接方法
TWI667287B (zh) 硬化性組合物、導電材料及連接構造體
KR101380043B1 (ko) 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
TWI452103B (zh) 電路連接用接著膜及其用途、電路連接構造體及其製造方法、以及電路構件的連接方法
JP2018104653A (ja) 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤
KR20110136731A (ko) 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
KR101314007B1 (ko) 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
KR101313972B1 (ko) 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
KR101313939B1 (ko) 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
KR20110136732A (ko) 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
JP2015183115A (ja) 回路部材接続用接着剤