TWI452316B - Thermal invalidation debug system and temperature control device thereof - Google Patents
Thermal invalidation debug system and temperature control device thereof Download PDFInfo
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Description
本發明係關於一種熱量失效除錯系統及其溫度控制裝置。 The present invention relates to a thermal fail-safe system and a temperature control device therefor.
電子設備的壽命與電子元器件工作時的溫度密切相關。電子元器件的工作時溫度過高或過低都會影響電子設備的工作性能及可靠性。故，幾乎所有的電子設備特別是通訊設備都有一些高低溫測試。業界在低溫測試時最為常見的故障現象是低溫時不能被啟動。測試常用的做法是在常溫下用製冷劑逐一噴射被懷疑的電子元器件，直至出現故障為止。惟，如此的做法不易確定電子元器件在哪個溫度時產生熱量失效，且在常溫的條件下噴射製冷劑無法使整個待測電子設備置於低溫條件。 The life of an electronic device is closely related to the temperature at which the electronic component operates. Excessive or too low temperature during operation of electronic components can affect the performance and reliability of electronic equipment. Therefore, almost all electronic devices, especially communication devices, have some high and low temperature tests. The most common failure phenomenon in the industry during low temperature testing is that it cannot be started at low temperatures. It is common practice to test suspected electronic components one by one with refrigerant at room temperature until a fault occurs. However, such a method is not easy to determine at which temperature the electronic component generates heat failure, and the injection of the refrigerant under normal temperature conditions cannot cause the entire electronic device to be tested to be placed in a low temperature condition.
鑒於以上內容，有必要提供一種熱量失效除錯系統，以使電子設備可在低溫條件下地進行熱量失效除錯，並可確定電子元器件在哪個溫度下產生熱量失效。 In view of the above, it is necessary to provide a thermal fail-safe system to enable electronic devices to perform thermal failure debugging at low temperatures and to determine at which temperature the electronic components generate heat failure.
還有必要提供一種溫度控制裝置。 It is also necessary to provide a temperature control device.
一種熱量失效除錯系統，用於對電子設備進行熱量失效除錯，該熱量失效除錯系統包括一電壓源、一分壓電路、一放大電路、一用於設置在一該電子設備內待測電子元器件上的溫度產生器、一 用於容置該電子設備及該溫度產生器的溫濕度測試櫃及一與該溫度產生器連接的溫度測試儀，該分壓電路包括一電阻及一與該電阻串聯連接在該電壓源與地之間的可變電阻器，該放大電路的輸入端連接在該電阻與該可變電阻器之間的節點上，該放大電路的輸出端透過該溫度產生器接地，透過改變該可變電阻器的阻值可改變輸入至該放大電路的電壓來改變該放大電路輸出至該溫度產生器的放大訊號，從而改變該溫度產生器產生的溫度，透過該溫度測試儀顯示該溫度產生器產生的溫度，在溫度產生器產生的不同溫度下啟動該電子設備，在該電子設備不能工作時判定待測電子元器件具有熱量失效功能。 A thermal failure debugging system for performing thermal failure debugging on an electronic device, the thermal failure debugging system comprising a voltage source, a voltage dividing circuit, an amplifying circuit, and a device for setting in the electronic device Measuring the temperature generator on the electronic component, one a temperature and humidity test cabinet for accommodating the electronic device and the temperature generator, and a temperature tester connected to the temperature generator, the voltage dividing circuit comprising a resistor and a resistor connected in series with the resistor a variable resistor between the ground, the input end of the amplifying circuit is connected to a node between the resistor and the variable resistor, and an output end of the amplifying circuit is grounded through the temperature generator, and the variable resistor is changed by The resistance of the device can change the voltage input to the amplifying circuit to change the amplification signal outputted by the amplifying circuit to the temperature generator, thereby changing the temperature generated by the temperature generator, and displaying the temperature generator through the temperature tester Temperature, the electronic device is activated at different temperatures generated by the temperature generator, and when the electronic device is inoperable, it is determined that the electronic component to be tested has a heat failing function.
一種溫度控制裝置，包括一電壓源、一分壓電路、一放大電路及一溫度產生器，該分壓電路包括一電阻及一與該電阻串聯連接在該電壓源與地之間的可變電阻器，該放大電路的輸入端連接在該電阻與該可變電阻器之間的節點上，該放大電路的輸出端透過該溫度產生器接地，該溫度產生器用於置於一電子元器件上，透過改變該可變電阻器的阻值可改變輸入至該放大電路的電壓來改變該放大電路輸出至該溫度產生器的放大訊號，從而改變該溫度產生器產生的溫度，進而改變該電子元器件的溫度。 A temperature control device includes a voltage source, a voltage dividing circuit, an amplifying circuit and a temperature generator. The voltage dividing circuit includes a resistor and a resistor connected in series between the voltage source and the ground. a variable resistor, an input end of the amplifying circuit is connected to a node between the resistor and the variable resistor, an output end of the amplifying circuit is grounded through the temperature generator, and the temperature generator is used for placing an electronic component The change of the resistance of the variable resistor can change the voltage input to the amplifier circuit to change the amplification signal outputted by the amplifier circuit to the temperature generator, thereby changing the temperature generated by the temperature generator, thereby changing the electron. The temperature of the components.
該熱量失效除錯系統透過改變該可變電阻器的阻值改變輸入至該放大電路的電壓來改變該放大電路輸出至該溫度產生器的放大訊號，從而改變該溫度產生器產生的溫度，進而改變該電子元器件的溫度，在溫度產生器產生的不同溫度下啟動該電子設備，在該電子設備不能工作時判定待測電子元器件具有熱量失效功能，從而對該電子設備進行熱量失效除錯。 The heat failing debugging system changes the voltage input to the temperature generator by changing the resistance of the variable resistor to change the voltage input to the temperature generator, thereby changing the temperature generated by the temperature generator, thereby Changing the temperature of the electronic component, starting the electronic device at different temperatures generated by the temperature generator, determining that the electronic component to be tested has a heat failure function when the electronic device is inoperable, thereby performing thermal failure debugging on the electronic device .
1‧‧‧熱量失效除錯系統 1‧‧‧ Thermal failure debugging system
2‧‧‧主機 2‧‧‧Host
3‧‧‧集成晶片 3‧‧‧Integrated wafer
4‧‧‧溫濕度測試櫃 4‧‧‧Warm and humidity test cabinet
5‧‧‧電源開關 5‧‧‧Power switch
6‧‧‧監視器 6‧‧‧Monitor
7‧‧‧溫度測試儀 7‧‧‧ Temperature Tester
8‧‧‧溫度控制裝置 8‧‧‧ Temperature control device
10‧‧‧電壓源 10‧‧‧voltage source
20‧‧‧電壓調整電路 20‧‧‧Voltage adjustment circuit
30‧‧‧分壓電路 30‧‧‧voltage circuit
40‧‧‧放大電路 40‧‧‧Amplification circuit
50‧‧‧溫度產生器 50‧‧‧ Temperature generator
52‧‧‧水泥電阻 52‧‧‧Cement resistance
54‧‧‧散熱片 54‧‧‧ Heat sink
56‧‧‧溫度感測器 56‧‧‧Temperature Sensor
T‧‧‧變壓器 T‧‧‧Transformer
D‧‧‧整流器 D‧‧‧Rectifier
U1‧‧‧穩壓器 U1‧‧‧ voltage regulator
U2‧‧‧運算放大器 U2‧‧‧Operational Amplifier
Q‧‧‧電晶體 Q‧‧‧Optocrystal
R1、R3‧‧‧電阻 R1, R3‧‧‧ resistance
C1、C2、C3‧‧‧電容 C1, C2, C3‧‧‧ capacitors
R2‧‧‧可變電阻器 R2‧‧‧Variable Resistors
圖1係本發明熱量失效除錯系統的較佳實施方式的框圖。 1 is a block diagram of a preferred embodiment of the thermal fail-safe system of the present invention.
圖2係圖1中的溫度產生器的示意圖。 Figure 2 is a schematic illustration of the temperature generator of Figure 1.
圖3係圖1的電路圖。 Figure 3 is a circuit diagram of Figure 1.
圖4係本發明熱量失效除錯系統的較佳實施方式在使用時的示意圖。 Figure 4 is a schematic illustration of a preferred embodiment of the thermal fail-safe system of the present invention in use.
請參考圖1，本發明熱量失效除錯系統1用於對一電子設備如一主機2(見圖4)由於其內的電子元器件如集成晶片的熱量失效而無法正常工作的進行熱量失效除錯。該熱量失效除錯系統1的較佳實施方式包括一溫度控制裝置8、一溫度測試儀7及一溫濕度測試櫃4。該溫度控制裝置8包括一電壓源10、一電壓調整電路20、一分壓電路30、一放大電路40及一溫度產生器50。該溫度產生器50設置在該溫濕度測試櫃4內。該電壓源10、該電壓調整電路20、該分壓電路30及該放大電路40設置在該溫濕度測試櫃4外部。在本實施方式中，該電壓源10用於輸出一交流電壓。該電壓調整電路20連接至該電壓源10，用於將該電壓源10輸出的交流電壓調整為一穩定的直流電壓。該分壓電路30連接在該電壓調整電路20與該放大電路40之間，用於對該電壓調整電路20輸出的直流電壓進行分壓，並輸出給該放大電路40，該放大電路40連接至該溫度產生器50以提供放大訊號至該溫度產生器50。該溫度產生器50用於根據該放大電路40提供的放大訊號產生相應的熱量。該集成晶片的熱量失效是指集成晶片在工作時若其溫度過高或過低便會停止工作。當該主機2在高溫或低溫環境下工作，其內的集成晶片便 工作在高溫或低溫下而產生熱量失效使該主機2無法正常工作。找出該主機2內的哪一或哪些集成晶片產生熱量失效而使該主機2無法正常工作的過程便是熱量失效除錯。 Referring to FIG. 1, the thermal fail-safe system 1 of the present invention is used for performing thermal failure debugging on an electronic device such as a host 2 (see FIG. 4) because the heat of the electronic components such as the integrated chip in the integrated circuit fails to work normally. . A preferred embodiment of the thermal fail-safe system 1 includes a temperature control device 8, a temperature tester 7, and a temperature and humidity test cabinet 4. The temperature control device 8 includes a voltage source 10, a voltage adjustment circuit 20, a voltage dividing circuit 30, an amplifying circuit 40, and a temperature generator 50. The temperature generator 50 is disposed in the temperature and humidity test cabinet 4. The voltage source 10, the voltage adjusting circuit 20, the voltage dividing circuit 30, and the amplifying circuit 40 are disposed outside the temperature and humidity test cabinet 4. In the present embodiment, the voltage source 10 is used to output an alternating voltage. The voltage adjustment circuit 20 is connected to the voltage source 10 for adjusting the AC voltage output by the voltage source 10 to a stable DC voltage. The voltage dividing circuit 30 is connected between the voltage adjusting circuit 20 and the amplifying circuit 40, and is used for dividing the DC voltage outputted by the voltage adjusting circuit 20, and outputs the DC voltage to the amplifying circuit 40. The amplifying circuit 40 is connected. The temperature generator 50 is provided to provide an amplification signal to the temperature generator 50. The temperature generator 50 is configured to generate corresponding heat according to the amplified signal provided by the amplifying circuit 40. The thermal failure of the integrated wafer means that the integrated wafer will stop working if its temperature is too high or too low during operation. When the host 2 is operated in a high temperature or low temperature environment, the integrated chip therein The heat failure caused by working at high temperature or low temperature makes the host 2 unable to work normally. The process of finding out which integrated chip or chips in the host 2 generate heat failure and the host 2 is not working properly is heat failing.
請參考圖2，該溫度產生器50包括一水泥電阻52、一散熱片54及一溫度感測器56。該水泥電阻52及該溫度感測器56均設置在該散熱片54上。該水泥電阻52的溫度隨功率的變化而變化，即隨其功率的增加溫度升高。該散熱片54用於傳遞該水泥電阻52產生的熱量。該溫度感測器56用於感測該散熱片54上的溫度。 Referring to FIG. 2 , the temperature generator 50 includes a cement resistor 52 , a heat sink 54 and a temperature sensor 56 . The cement resistor 52 and the temperature sensor 56 are both disposed on the heat sink 54. The temperature of the cement resistor 52 varies with power, i.e., as the power increases, the temperature increases. The heat sink 54 is used to transfer heat generated by the cement resistor 52. The temperature sensor 56 is used to sense the temperature on the heat sink 54.
請參考圖3，該電壓調整電路20包括一變壓器T、一整流器D、電容C1、C2、C3及一穩壓器U1。該分壓電路30包括一電阻R1及一可變電阻器R2。該放大電路40包括一電阻R3、一運算放大器U2、一作為電開關的電晶體Q。該變壓器T的兩輸入端連接至該電壓源10的兩輸出端。該變壓器T的兩輸出端連接至該整流器D的兩輸入端。該整流器D的兩輸出端分別連接該穩壓器U1的輸入端VIN及接地端GND。該兩電容C1、C2均連接於該穩壓器U1的輸入端VIN及接地端GND之間。該穩壓器U1的接地端GND接地。該電容C3連接在該穩壓器U1的輸出端VOUT與接地端GND之間。該穩壓器U1的輸出端VOUT依次透過該電阻R1及該可變電阻器R2接地。該運算放大器U2的同相輸入端(作為該放大電路40的輸入端)連接至該電阻R1與該可變電阻器R2的節點上。該運算放大器U2的反相輸入端連接至該電晶體Q的射極(作為該放大電路40的輸出端)。該運算放大器U2的輸出端透過該電阻R3連接至該電晶體Q的基極。該電晶體Q的射極透過該水泥電阻52接地，該電晶體Q的集極連接至該穩壓器U1的輸出端VOUT。 Referring to FIG. 3, the voltage adjustment circuit 20 includes a transformer T, a rectifier D, capacitors C1, C2, and C3, and a voltage regulator U1. The voltage dividing circuit 30 includes a resistor R1 and a variable resistor R2. The amplifying circuit 40 includes a resistor R3, an operational amplifier U2, and a transistor Q as an electrical switch. The two inputs of the transformer T are connected to the two outputs of the voltage source 10. The two outputs of the transformer T are connected to the two inputs of the rectifier D. The two output ends of the rectifier D are respectively connected to the input terminal VIN of the voltage regulator U1 and the ground terminal GND. The two capacitors C1 and C2 are connected between the input terminal VIN of the regulator U1 and the ground GND. The ground terminal GND of the regulator U1 is grounded. The capacitor C3 is connected between the output terminal VOUT of the regulator U1 and the ground GND. The output terminal VOUT of the regulator U1 is sequentially grounded through the resistor R1 and the variable resistor R2. The non-inverting input of the operational amplifier U2 (as the input of the amplifying circuit 40) is coupled to the node of the resistor R1 and the variable resistor R2. The inverting input of the operational amplifier U2 is coupled to the emitter of the transistor Q (as the output of the amplifying circuit 40). The output of the operational amplifier U2 is coupled to the base of the transistor Q through the resistor R3. The emitter of the transistor Q is grounded through the cement resistor 52, and the collector of the transistor Q is connected to the output terminal VOUT of the regulator U1.
在本實施方式中，該等電容C1、C2、C3產生濾波的作用。該穩壓器U1產生穩定電壓的作用。在其他實施方式中，該變壓器T、該等電容C1、C2、C3及該穩壓器U1均可以省略，只要使串聯的電阻R1及可變電阻器R2連接到一直流電源與地之間即可。該電晶體Q也可選用其他元件來代替，如場效應管。 In the present embodiment, the capacitors C1, C2, and C3 generate a filtering function. The regulator U1 produces a stable voltage. In other embodiments, the transformer T, the capacitors C1, C2, C3, and the regulator U1 may be omitted, as long as the series resistor R1 and the variable resistor R2 are connected between the DC power source and the ground. can. The transistor Q can also be replaced by other components, such as a field effect transistor.
請參考圖4，若該主機2在室溫條件下可以正常開機，但將其置於低溫環境如零下30度下卻無法正常開機，則需對該主機2進行熱量失效除錯。通常發生熱量失效的元件主要是主機上的集成晶片3，本實施方式可找出哪一集成晶片3產生了熱量失效。 Referring to FIG. 4, if the host 2 can be normally turned on at room temperature, but it is not normally turned on after being placed in a low temperature environment, such as minus 30 degrees, the host 2 needs to be thermally disabled. The components that normally cause heat failure are primarily integrated wafers 3 on the host. This embodiment can find out which integrated wafer 3 has incurred thermal failure.
對該主機2進行熱量失效除錯的過程如下：將該溫度產生器50的散熱片54透過散熱膏附著在該主機2的待測集成晶片3上。將該主機2放置在該溫濕度測試櫃4內，將該主機2的電源開關5引出至該溫濕度測試櫃4外，該主機2還連接一設置在該溫濕度測試櫃4外的監視器6，該散熱片54上的溫度感測器56連接該溫度測試儀7來顯示該該散熱片54的溫度，即該待測集成晶片3的溫度。調節該溫濕度測試櫃4的溫度使該主機2處於一低溫下，如使其無法正常開機的溫度零下30度。啟動該主機2的電源開關5，該監視器6顯示該主機2無法開機，調節該可變電阻器R2使其阻值增加，該運算放大器U2的同相輸入端的電壓增加，該運算放大器U2的輸出端的電壓增加，該電晶體Q的基極電流增加，該電晶體Q的射極電流隨之也增加，故該水泥電阻52上的電壓增加，其功率也增加。該水泥電阻52的溫度升高。等待該水泥電阻52的熱量積累一段時間如2分鐘後觀察該溫度測試儀7顯示的溫度是否升高了一個溫度差如5度，若未升高該溫度差繼續調節該可變電阻器R2直至使該溫 度測試儀7顯示該水泥電阻52的溫度升高了該溫度差，即該溫度測試儀7顯示的溫度為零下25度。再次啟動該主機2的電源開關5，觀察該監視器6是否顯示該主機2開機，若該監視器6顯示該主機2開機，則表明該集成晶片3具有熱量失效的特性，是導致該主機2在低溫環境無法開機的原因。若該監視器6顯示該主機2無法開機，則需繼續調節該可變電阻器R2的阻值使該溫度測試儀7顯示的溫度繼續以該溫度差升高，直至上升到室溫，同時在每次調節該可變電阻器R2使該水泥電阻52的溫度相較上一次的溫度升高了該溫度差後啟動該主機2，若在升溫期間出現了開機現象，則表明該待測集成晶片3具有熱量失效的特性。若直到上升到了啟動該主機2後該主機2仍然無法開機，則表明該待測集成晶片3不具有熱量失效特性，該待測集成晶片3不是導致該主機2在低溫下無法開機的元件。則按照同樣的方法來對其他的集成晶片依次進行確定是否具有熱量失效特性，從而對該主機2進行熱量失效除錯。 The process of performing thermal failure debugging on the host 2 is as follows: the heat sink 54 of the temperature generator 50 is attached to the integrated wafer 3 to be tested of the host 2 through a thermal grease. The host 2 is placed in the temperature and humidity test cabinet 4, and the power switch 5 of the host 2 is led out to the temperature and humidity test cabinet 4, and the host 2 is also connected to a monitor disposed outside the temperature and humidity test cabinet 4. 6. The temperature sensor 56 on the heat sink 54 is coupled to the temperature tester 7 to display the temperature of the heat sink 54, that is, the temperature of the integrated wafer 3 to be tested. Adjusting the temperature of the temperature and humidity test cabinet 4 causes the host 2 to be at a low temperature, such as a temperature of minus 30 degrees that prevents it from being normally turned on. Starting the power switch 5 of the host 2, the monitor 6 indicates that the host 2 cannot be turned on, adjusting the variable resistor R2 to increase its resistance value, the voltage of the non-inverting input terminal of the operational amplifier U2 is increased, and the output of the operational amplifier U2 is increased. As the voltage at the terminal increases, the base current of the transistor Q increases, and the emitter current of the transistor Q also increases, so that the voltage on the cement resistor 52 increases and its power also increases. The temperature of the cement resistor 52 rises. Waiting for the heat of the cement resistor 52 to accumulate for a period of time, such as 2 minutes, observe whether the temperature displayed by the temperature tester 7 is increased by a temperature difference such as 5 degrees, and if the temperature difference is not raised, continue to adjust the variable resistor R2 until Make the temperature The degree tester 7 shows that the temperature of the cement resistor 52 rises by the temperature difference, that is, the temperature displayed by the temperature tester 7 is minus 25 degrees. The power switch 5 of the host 2 is started again, and it is observed whether the monitor 6 displays that the host 2 is powered on. If the monitor 6 displays that the host 2 is powered on, it indicates that the integrated chip 3 has a heat failure characteristic, which results in the host 2 The reason why it cannot be turned on in a low temperature environment. If the monitor 6 indicates that the host 2 cannot be turned on, it is necessary to continue to adjust the resistance of the variable resistor R2 so that the temperature displayed by the temperature tester 7 continues to rise with the temperature difference until it rises to room temperature, while Each time the variable resistor R2 is adjusted such that the temperature of the cement resistor 52 is increased by the temperature difference from the previous temperature, the host 2 is activated. If the startup phenomenon occurs during the temperature rise, the integrated chip to be tested is indicated. 3 has the characteristics of heat failure. If the host 2 still fails to boot after the host 2 is started up, it indicates that the integrated chip 3 to be tested does not have a thermal failure characteristic, and the integrated chip 3 to be tested is not an element that causes the host 2 to fail to be turned on at a low temperature. Then, in the same way, the other integrated chips are sequentially determined to determine whether there is a heat failure characteristic, thereby performing thermal failure debugging on the host 2.
同理對於高溫失效的集成晶片也會導致該主機2在高溫環境無法工作。對該主機2進行熱量失效除錯的過程是在室溫環境下該主機2處於開機狀態時調節該可變電阻器R2使該水泥電阻52的溫度以該溫度差升值，在該水泥電阻52在室溫與一預設溫度如50度之間的一溫度時，即該待測集成晶片3的溫度等於該水泥電阻52的溫度，該主機2自動關機，則表明該待測集成晶片3具有熱量失效特性，是導致該主機在高溫條件下無法工作的原因。若在室溫與該預設溫度之間的任何溫度，該主機2不會自動關機，則表明該待測集成晶片3不具有熱量失效的特性，不是導致該主機無法在高溫條件下無法工作的原因。 Similarly, the integrated wafer for high temperature failure will also cause the host 2 to be inoperable in a high temperature environment. The process of performing thermal failure debugging on the host 2 is to adjust the variable resistor R2 to increase the temperature of the cement resistor 52 by the temperature difference when the host 2 is in the on state, and the cement resistor 52 is at When the temperature between the room temperature and a preset temperature, for example, 50 degrees, that is, the temperature of the integrated wafer 3 to be tested is equal to the temperature of the cement resistor 52, the host 2 is automatically turned off, indicating that the integrated wafer 3 to be tested has heat. The failure characteristics are responsible for the failure of the host to operate under high temperature conditions. If the host 2 does not automatically shut down at any temperature between the room temperature and the preset temperature, it indicates that the integrated chip 3 to be tested does not have the characteristics of heat failure, and does not cause the host to fail to operate under high temperature conditions. the reason.
該熱量失效除錯系統1透過改變該可變電阻器R2的阻值來改變該水泥電阻52上的電壓，改變該水泥電阻52的功率，從而改變該水泥電阻52產生的熱量，進而改變該待測集成晶片3的溫度。透過觀察該待測集成晶片3溫度的變化使該主機2出現的無法工作的狀況來確定該待測集成晶片3是否具有熱量失效的特性，從而實現對該主機2進行熱量失效除錯。 The heat failing debugging system 1 changes the voltage on the cement resistor 52 by changing the resistance of the variable resistor R2, changes the power of the cement resistor 52, thereby changing the heat generated by the cement resistor 52, thereby changing the waiting time. The temperature of the integrated wafer 3 was measured. The thermal failure of the host 2 is determined by observing the inoperable condition of the host 2 by observing the change of the temperature of the integrated chip 3 to be tested to determine whether the integrated chip 3 to be tested has a thermal failure characteristic.
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
2‧‧‧主機 2‧‧‧Host
3‧‧‧集成晶片 3‧‧‧Integrated wafer
4‧‧‧溫濕度測試櫃 4‧‧‧Warm and humidity test cabinet
5‧‧‧電源開關 5‧‧‧Power switch
6‧‧‧監視器 6‧‧‧Monitor
7‧‧‧溫度測試儀 7‧‧‧ Temperature Tester
10‧‧‧電壓源 10‧‧‧voltage source
20‧‧‧電壓調整電路 20‧‧‧Voltage adjustment circuit
30‧‧‧分壓電路 30‧‧‧voltage circuit
40‧‧‧放大電路 40‧‧‧Amplification circuit
52‧‧‧水泥電阻 52‧‧‧Cement resistance
54‧‧‧散熱片 54‧‧‧ Heat sink
56‧‧‧溫度感測器 56‧‧‧Temperature Sensor
Claims (8)
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200615556A (en) * | 2004-07-23 | 2006-05-16 | Advantest Corp | Electronic component testing apparatus and method for configuring electronic component testing apparatus |
| TW200706898A (en) * | 2005-07-12 | 2007-02-16 | Rohm Co Ltd | Current-voltage conversion circuit and power consumption detection circuit and electronic device using the same |
| TW200818208A (en) * | 2006-10-12 | 2008-04-16 | Hynix Semiconductor Inc | Circuit and method of outputting temperature data of semiconductor memory apparatus |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200615556A (en) * | 2004-07-23 | 2006-05-16 | Advantest Corp | Electronic component testing apparatus and method for configuring electronic component testing apparatus |
| TW200706898A (en) * | 2005-07-12 | 2007-02-16 | Rohm Co Ltd | Current-voltage conversion circuit and power consumption detection circuit and electronic device using the same |
| TW200818208A (en) * | 2006-10-12 | 2008-04-16 | Hynix Semiconductor Inc | Circuit and method of outputting temperature data of semiconductor memory apparatus |
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