TWI450805B - Cutting device and cutting method - Google Patents
Cutting device and cutting method Download PDFInfo
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- TWI450805B TWI450805B TW097149316A TW97149316A TWI450805B TW I450805 B TWI450805 B TW I450805B TW 097149316 A TW097149316 A TW 097149316A TW 97149316 A TW97149316 A TW 97149316A TW I450805 B TWI450805 B TW I450805B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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Description
本發明係關於切割裝置及切割方法，其將形成有半導體裝置或電子零件之晶圓等的工件分割成各個晶片。The present invention relates to a dicing apparatus and a dicing method for dividing a workpiece on which a wafer or the like of a semiconductor device or an electronic component is formed into individual wafers.
對形成有半導體裝置或電子零件之晶圓等的工件實施切斷或切槽加工之切割裝置，係至少設有藉由主軸而高速旋轉之被稱為刀片之薄型砂輪的旋轉切刀、保持工件之工件台、及用以使工件台與刀片之相對位置變化的X,Y,Z,θ之各移動軸。在加工工件時，冷卻或潤滑用之切削液係藉由噴嘴供給予旋轉之刀片、或工件與刀片相接觸之加工點，並藉由各移動軸之動作對工件實施切斷或切槽加工。A cutting device that performs cutting or grooving on a workpiece on which a wafer or the like of a semiconductor device or an electronic component is formed is provided with at least a rotary cutter called a thin blade of a blade that is rotated at a high speed by a spindle, and holds the workpiece The workpiece table and the moving axes of X, Y, Z, and θ for changing the relative positions of the workpiece table and the blade. When the workpiece is machined, the cutting fluid for cooling or lubricating is supplied to the rotating blade or the machining point where the workpiece is in contact with the blade by the nozzle, and the workpiece is cut or grooved by the action of each moving shaft.
第9圖顯示切割裝置之習知例。切割裝置70具有加工部75，加工部75具備：作為加工手段之高頻馬達內建型主軸72,72，其相互對向地配置且前端裝設有刀片71及輪罩(未圖示)；將工件W吸附保持之工件台73、及由拍攝工件W之顯微鏡或CCD照相機等所構成的攝影手段74。除上述構成外，切割裝置70還具備：洗淨部76，其以旋轉方式洗淨由加工部75所加工之已加工完成的工件W；載台77，其載置收容有多片被固定於工件架F上之工件W的匣盒；搬運工件W之搬運手段78；及控制各部件之動作的控制器79。Fig. 9 shows a conventional example of a cutting device. The cutting device 70 has a processing unit 75, and the processing unit 75 includes high-frequency motor built-in spindles 72 and 72 as processing means, which are disposed opposite to each other and have a blade 71 and a wheel cover (not shown) attached to the tip end; A workpiece stage 73 that sucks and holds the workpiece W, and a photographing means 74 composed of a microscope or a CCD camera that photographs the workpiece W. In addition to the above configuration, the cutting device 70 further includes a cleaning unit 76 that rotatably cleans the processed workpiece W processed by the processing unit 75, and a stage 77 on which the plurality of sheets are mounted and fixed. a cassette for the workpiece W on the workpiece holder F; a conveying means 78 for conveying the workpiece W; and a controller 79 for controlling the operation of each member.
如第10圖所示，加工部75之構造係具有：X工作台83，其由設於X基座80上之X導引機構81，81所導引，且藉線性馬達82而朝圖中之X-X所示方向驅動，並於X工作台83上隔著朝θ方向旋轉之轉台84而設置工件台85。As shown in FIG. 10, the structure of the processing portion 75 has an X table 83 guided by the X guiding mechanisms 81, 81 provided on the X base 80, and by the linear motor 82 toward the figure. Driven in the direction indicated by XX, the workpiece stage 85 is provided on the X table 83 via a turntable 84 that rotates in the θ direction.
另外，在Y基座86之側面設有Y工作台88,88，其由Y導引機構87,87所導引且藉由未圖示之步進馬達及滾珠螺桿而朝圖中之Y-Y所示之Y方向驅動。在各Y工作台88上設置Z工作台89，其藉由未圖示之驅動手段而朝圖中之Z-Z所示之Z方向驅動，並在Z工作台89之前端固定有安裝了刀片71的高頻馬達內建型之主軸72。因加工部74之構造成為上述那樣，所以，刀片71朝Y方向作分度進刀並朝Z方向作切入進刀，工件台73則朝X方向作切削送料。Further, a Y stage 88, 88 is provided on the side of the Y base 86, which is guided by the Y guide mechanisms 87, 87 and is turned to the YY in the figure by a stepping motor and a ball screw (not shown). The Y direction is shown. A Z stage 89 is provided on each Y stage 88, which is driven in the Z direction indicated by ZZ in the drawing by a driving means (not shown), and a blade 71 is attached to the front end of the Z stage 89. The main shaft 72 of the high frequency motor built-in type. Since the structure of the processing unit 74 is as described above, the blade 71 is indexed into the Y direction and cut into the Z direction, and the workpiece stage 73 is cut and fed in the X direction.
主軸72均以1,000rpm～80,000rpm進行高速旋轉，並於其旁邊側設置未圖示之供液噴嘴，其供給切削液，用以使工件W浸漬於切削液中。Each of the main shafts 72 is rotated at a high speed of 1,000 rpm to 80,000 rpm, and a liquid supply nozzle (not shown) is provided on the side of the main shaft 72, and a cutting liquid is supplied to immerse the workpiece W in the cutting fluid.
刀片71係可採用由鎳將金剛石砂粒或CBN砂粒電沉積而形成之電沉積刀片、或由混入金屬粉末之樹脂所結合而成的金屬樹脂黏結刀片等。刀片71之尺寸係依加工內容而可進行多種之選擇，但在將通常之半導體晶圓作為工件進行切割的情況，可採用直徑50mm，厚度30μm左右者。The blade 71 may be an electrodeposition blade formed by electrodepositing diamond grit or CBN grit by nickel, or a metal resin bonding blade formed by combining resin mixed with metal powder. The size of the blade 71 can be variously selected depending on the processing content. However, in the case of cutting a normal semiconductor wafer as a workpiece, a diameter of 50 mm and a thickness of about 30 μm can be used.
另外，控制切割裝置70之各部分的動作之控制器，係由CPU、記憶體、輸入輸出電路部、各種控制電路部等所構成，並被裝入切割裝置70之架台內部。作為此種之切割裝置，例如，提出有記載於專利文獻1之切割裝置。Further, the controller that controls the operation of each portion of the cutting device 70 is constituted by a CPU, a memory, an input/output circuit unit, various control circuit units, and the like, and is incorporated in the gantry of the cutting device 70. As such a cutting device, for example, a cutting device disclosed in Patent Document 1 is proposed.
另外，近年來，一種雷射切割裝置被用來取代此種刀片71的使用，而用於工件W之加工，該雷射切割裝置係將聚光點對準於工件W內部之雷射光射入工件W，於工件W內部形成複數個由多光子吸收所產生的改質區域後，將工件W擴展而分割成各個之晶片T。Further, in recent years, a laser cutting device has been used in place of the use of such a blade 71 for processing a workpiece W which is directed to align the condensed spot with the laser light incident inside the workpiece W. The workpiece W is formed into a plurality of modified regions generated by multiphoton absorption in the workpiece W, and then the workpiece W is expanded and divided into individual wafers T.
雷射切割裝置與切割裝置70相同，具備載台、搬運手段、工件台等，如第11圖所示，加工部75內與主軸72相同地對向設有雷射頭91。Similarly to the cutting device 70, the laser cutting device includes a stage, a conveying means, a workpiece stage, and the like. As shown in Fig. 11, the processing portion 75 is provided with the laser head 91 in the same direction as the main shaft 72.
雷射頭91係由雷射振盪器91A、準直透鏡91B、反射鏡91C及聚光鏡91D等所構成，從雷射振盪器91A所激發出之雷射光L，由準直透鏡91B整合成平行於水平方向的平行光線，並由反射鏡91C朝垂直方向反射，而由聚光鏡91D進行聚光(例如，參照專利文獻2)。The laser head 91 is composed of a laser oscillator 91A, a collimator lens 91B, a mirror 91C, a condensing mirror 91D, and the like, and the laser light L excited from the laser oscillator 91A is integrated by the collimator lens 91B in parallel with The parallel rays in the horizontal direction are reflected by the mirror 91C in the vertical direction, and are collected by the condensing mirror 91D (for example, refer to Patent Document 2).
當將雷射光L之聚光點設定於工件台73上所載置的工件W之厚度方向內部時，如第12(a)圖所示，穿透工件W表面之雷射光L的能量被集中在聚光點，於工件內部之聚光點附近形成由多光子吸收所產生的裂縫區域、熔化區域、折射率變化區域等的改質區域P。When the condensing point of the laser light L is set inside the thickness direction of the workpiece W placed on the workpiece stage 73, as shown in Fig. 12(a), the energy of the laser light L penetrating the surface of the workpiece W is concentrated. At the condensing point, a modified region P such as a crack region, a melting region, a refractive index change region, and the like which are generated by multiphoton absorption is formed in the vicinity of the condensing point inside the workpiece.
如第12(b)圖所示，改質區域P係藉由使工件W朝水平方向移動，而形成複數個並排於工件W內部。在此狀態下，工件W係以改質區域P作為起點而自然割斷、或是藉由施加極微小的外力而以改質區域P作為起點被割斷。在此情況時，不會在工件W表面或背面產生碎片而容易被分割成晶片。As shown in Fig. 12(b), the modified region P is formed by arranging a plurality of sheets in the horizontal direction by moving the workpiece W in the horizontal direction. In this state, the workpiece W is naturally cut by using the modified region P as a starting point, or is cut by using the modified region P as a starting point by applying a very small external force. In this case, no debris is generated on the surface or the back surface of the workpiece W, and it is easily divided into wafers.
在此種切割裝置70或雷射切割裝置中，在切割前，進行攝影手段74之拍攝位置與刀片71或雷射光之加工位置的相對距離之測量，並依需要進行攝影手段74、刀片71或雷射光之焦點位置的調整。在此種調整中，係藉由試驗性地進行工件W之切割加工，並利用攝影手段74來拍攝形成於工件W上之加工槽所進行。In such a cutting device 70 or a laser cutting device, the relative distance between the photographing position of the photographing means 74 and the processing position of the blade 71 or the laser beam is measured before cutting, and the photographing means 74, the blade 71 or the photographing means 74 or Adjustment of the focus position of the laser light. In such an adjustment, the cutting process of the workpiece W is experimentally performed, and the machining means 74 is used to image the machining groove formed on the workpiece W.
當新的需加工之工件W被載置於工件台73上時，藉由依上述方式而被對位之攝影手段74進行工件W之拍攝，以實施進行被加工之位置與加工手段的位置調整之對準動作。另外，在加工中亦依需要而隨時利用攝影手段74對工件W上進行拍攝，以進行加工狀況之檢查。When a new workpiece W to be processed is placed on the workpiece stage 73, the workpiece W is imaged by the photographing means 74 aligned in the above manner to perform position adjustment of the processed position and the processing means. Align the action. In addition, the workpiece W is photographed by the photographing means 74 at any time during processing to perform inspection of the processing conditions.
專利文獻1：日本特開2002-280328號公報Patent Document 1: Japanese Laid-Open Patent Publication No. 2002-280328
專利文獻2：日本特開2002-192367號公報Patent Document 2: Japanese Laid-Open Patent Publication No. 2002-192367
但是，在像此種切割裝置70那樣的裝置中，需要在每次調整刀片71與攝影手段74之位置時試驗性地進行工件W的加工，另外，為了進行試驗性之加工而需準備多片之虛擬工件，使得調整所需時間或費用增加，而成為造成切割裝置之效率大幅下降的原因。However, in a device such as the cutting device 70, it is necessary to experimentally perform the machining of the workpiece W every time the position of the blade 71 and the photographing means 74 is adjusted, and it is necessary to prepare a plurality of pieces for the experimental processing. The virtual workpiece increases the time or cost required for the adjustment, which is the cause of the significant decrease in the efficiency of the cutting device.
本發明正是針對上述問題點而完成者，其目的在於提供一種切割裝置及切割方法，其可縮短刀片或工件之調整時間，提高整個裝置之運轉率。The present invention has been made in view of the above problems, and an object thereof is to provide a cutting device and a cutting method which can shorten the adjustment time of a blade or a workpiece and improve the operation rate of the entire device.
為了達成上述目的，本發明第一態樣所涉及之切割裝置的特徵為具備：工件台，用以載置工件；加工手段，用以對該工件進行加工；移動手段，係使該工件台與該加工手段相對地移動；攝影手段，可同時對該工件台上之該工件及該加工手段進行拍攝；攝影手段移動軸，係使該攝影手段移動；及控制手段，係控制該加工手段、該移動手段、該攝影手段及該攝影手段移動軸。In order to achieve the above object, a cutting apparatus according to a first aspect of the present invention is characterized by comprising: a workpiece stage for placing a workpiece; a processing means for processing the workpiece; and a moving means for causing the workpiece stage The processing means relatively moves; the photographing means can simultaneously photograph the workpiece on the workpiece stage and the processing means; the photographing means moves the axis to move the photographing means; and the control means controls the processing means, The moving means, the photographing means, and the photographing means move the axis.
另外，本發明之第二態樣為，於第一態樣中，該攝影手段移動軸係使該該攝影手段位於該工件台與該加工手段之間，及使該該攝影手段從該工件台與該加工手段之間退出。In a second aspect of the present invention, in the first aspect, the photographing means moves the shaft so that the photographing means is located between the workpiece stage and the processing means, and the photographing means is taken from the workpiece stage Exit with this processing means.
又，本發明之第三態樣為，於第一或第二態樣中，該攝影手段具備：第1攝影部，係朝該加工手段之方向設置，用以拍攝該加工手段；及第2攝影部，係朝該工件台之方向設置，用以拍攝該工件台上之工件。Further, in a third aspect of the present invention, in the first or second aspect, the photographing means includes: a first photographing unit that is disposed in a direction of the processing means for photographing the processing means; and a second photographing means The photographing department is disposed in the direction of the workpiece table for photographing the workpiece on the workpiece stage.
為了達成上述目的，本發明其他態樣所涉及之切割方法乃係切割裝置所採用之切割方法，該切割裝置具備：工件台，用以載置工件；加工手段，用以對該工件進行加工；移動手段，係使該工件台與該加工手段相對地移動；攝影手段，可同時對該工件台上之該工件及該加工手段進行拍攝；攝影手段移動軸，係使該攝影手段移動；及控制手段，係控制該加工手段、該移動手段、該攝影手段及該攝影手段移動軸，該切割方法之特徵為：藉由該攝影手段移動軸使該攝影手段位於該工件台與該加工手段之間；藉由朝該加工手段之方向而設於該攝影手段上並用以拍攝該加工手段的第1攝影部、及朝該工件台之方向而設於該攝影手段上並用以拍攝該工件台上之工件的第2攝影部，同時拍攝該加工手段及該工件；藉由該控制手段處理所拍攝到之該加工手段的影像及該工件的影像，計算出該加工手段與該工件的相對位置座標；根據該計算出之該相對位置座標，進行該加工手段與該工件之位置對準，而進行該工件之加工。In order to achieve the above object, a cutting method according to another aspect of the present invention is a cutting method used in a cutting device, the cutting device comprising: a workpiece table for placing a workpiece; and a processing means for processing the workpiece; The moving means moves the workpiece table relative to the processing means; the photographing means can simultaneously photograph the workpiece on the workpiece stage and the processing means; the photographing means moves the axis to move the photographing means; and controls And means for controlling the processing means, the moving means, the photographing means and the moving means of the photographing means, wherein the cutting method is characterized in that the photographing means is moved by the photographing means to position the photographing means between the workpiece stage and the processing means Provided on the photographing means by the first photographing unit provided on the photographing means in the direction of the processing means and for photographing the processing means, and disposed on the photographing means in the direction of the workpiece stage for photographing the workpiece stage a second imaging unit of the workpiece simultaneously capturing the processing means and the workpiece; and processing the captured image of the processing means by the control means and An image member, the processing means calculates the position coordinates relative to the workpiece; according to the relative position coordinates of the calculated, the processing means for aligning the position of the workpiece, and the machining of the workpiece.
根據本發明之切割裝置及切割方法，載置有工件之工件台及藉由主軸而旋轉之刀片或雷射等之加工手段，係藉由控制手段所控制之移動手段而於XYZθ之各方向相對地移動，以進行工件之切割。According to the cutting apparatus and the cutting method of the present invention, the workpiece stage on which the workpiece is placed and the processing means such as a blade or a laser that is rotated by the main shaft are opposed to each other in the respective directions of XYZθ by the moving means controlled by the control means. Move the ground to cut the workpiece.
在切割裝置上設有可同時拍攝工件台上之工件及加工手段的攝影手段、及使該攝影手段移動之攝影手段移動軸。攝影手段具備：第1攝影部，係朝加工手段之方向而設，用以拍攝加工手段；及第2攝影部，係朝工件台之方向而設，用以拍攝工件台上之工件，並藉由攝影手段移動軸進行移動而位於工件台與加工手段之間。The cutting device is provided with a photographing means capable of simultaneously photographing a workpiece on the workpiece stage and a processing means, and a photographing means moving shaft for moving the photographing means. The photographing means includes a first photographing unit that is provided in the direction of the processing means for photographing processing means, and a second photographing section that is provided in the direction of the workpiece stage for photographing the workpiece on the workpiece stage and borrowing The moving axis moves by the photographing means and is located between the workpiece stage and the processing means.
在此狀態下，攝影手段係由第1攝影部拍攝刀片之前端等的加工手段的作為基準的位置，並由第2攝影部拍攝工件上之走道或對準標記等的作為基準的位置。拍攝到之二個影像係利用藉控制手段進行重合等的已知影像處理方法而進行處理，以計算出加工手段與工件的相對位置座標。加工手段與工件係根據計算出之相對位置座標進行位置對準。In this state, the first imaging unit captures a position as a reference for the processing means such as the front end of the blade, and the second imaging unit captures a reference position such as an aisle or an alignment mark on the workpiece. The two images captured are processed by a known image processing method such as superimposition by a control means to calculate the relative position coordinates of the processing means and the workpiece. The machining means and the workpiece are aligned according to the calculated relative position coordinates.
攝影手段係當加工手段與工件之拍攝結束時，藉由攝影手段移動軸而自工件台與該加工手段之間移動並退避，而不會妨礙加工手段對工件台上之工件的加工。The photographing means moves and retracts from the workpiece stage and the processing means by moving the axis by the photographing means when the processing means and the workpiece are finished, without hindering the processing means from processing the workpiece on the workpiece stage.
藉此，不用試驗性地加工虛擬工件，便可進行刀片與工件之調整，可縮短調整時間，削減花費於虛擬工件之費用，藉以提高整個裝置之運轉率。Thereby, the blade and the workpiece can be adjusted without experimentally processing the dummy workpiece, the adjustment time can be shortened, and the cost of the virtual workpiece can be reduced, thereby improving the operation rate of the entire device.
另外，攝影手段係藉由將焦點對準於刀片之前端，可取得刀片之高度方向的資訊。藉此，可了解刀片之外形形狀，能以非接觸方式測量刀片之磨損量。In addition, the photographic means can obtain the information of the height direction of the blade by focusing the front end of the blade. Thereby, the shape of the blade can be understood, and the amount of wear of the blade can be measured in a non-contact manner.
如以上說明，根據本發明之切割裝置及切割方法，不用試驗性地加工虛擬工件，便可進行刀片與工件之調整，可縮短調整時間，減少調整所需之費用，藉以提高整個裝置之運轉率。As described above, according to the cutting device and the cutting method of the present invention, the blade and the workpiece can be adjusted without experimentally processing the dummy workpiece, the adjustment time can be shortened, and the cost required for the adjustment can be reduced, thereby improving the operation rate of the entire device. .
以下，參照圖式詳細說明本發明所涉及之切割裝置及切割方法的較佳實施形態。Hereinafter, preferred embodiments of the cutting device and the cutting method according to the present invention will be described in detail with reference to the drawings.
首先一開始，說明本發明所涉及之切割裝置的構成。第1圖為切割裝置之整體立體圖。First, the configuration of the cutting device according to the present invention will be described. Figure 1 is an overall perspective view of the cutting device.
第1圖所示實施形態之切割裝置1，係由下列構件等所構成：載台2，係在與外部裝置之間來交付收容有多個工件的匣盒；搬運手段4，其具有吸附部3且將工件搬運至裝置各部分；加工部5；旋轉器6，其用以洗淨加工後之工件並進行乾燥；及作為控制手段的控制器7，其控制裝置各部分之動作。The cutting device 1 of the embodiment shown in Fig. 1 is composed of the following members: the stage 2 is a cassette that accommodates a plurality of workpieces between the external device and the external device; and the conveying means 4 has a suction portion 3, the workpiece is transported to each part of the device; the processing portion 5; the rotator 6 for washing the processed workpiece and drying; and a controller 7 as a control means for controlling the operation of each part of the device.
在加工部5設有相互對向地配置且前端安裝有刀片8的2根作為加工手段的主軸9,9；將工件吸附並裝載之2台相同形狀的工件台10,11；及可同時拍攝工件台10,11上之工件及刀片8的攝影手段12。The processing unit 5 is provided with two spindles 9 and 9 which are disposed opposite to each other with the blade 8 attached to the tip as a processing means, and two workpiece stages 10 and 11 of the same shape which are attached and loaded by the workpiece; and can be simultaneously photographed The workpiece on the workpiece stages 10, 11 and the photographic means 12 of the blade 8.
如第2圖所示，在工件台10,11之下方，以可充分地包圍工件台10,11的方式水平地配置箱狀之油槽20。在油槽20之左側面，沿圖中之箭頭X方向配設有2根一對之導軌(導引機構)22,22，在該等導軌22,22之間，構成驅動機構之滾珠螺桿24係與導軌22,22平行且沿油槽20之左側面配設。As shown in Fig. 2, the box-shaped oil groove 20 is horizontally disposed below the workpiece stages 10, 11 so as to sufficiently surround the workpiece stages 10, 11. On the left side of the oil groove 20, two pairs of guide rails (guide mechanisms) 22, 22 are arranged along the arrow X direction in the figure, and between these guide rails 22, 22, a ball screw 24 system constituting a drive mechanism is provided. It is parallel to the guide rails 22, 22 and is disposed along the left side surface of the oil groove 20.
另外，旋轉驅動該滾珠螺桿24之伺服馬達26係配置於油槽20之深度方向的裏側處。又，於縱方向配置有由導軌22,22所導引且利用伺服馬達26之滾珠螺桿24的旋轉而朝X方向所驅動的X工作台16。又，本發明之驅動機構除可為採用滾珠螺桿24之驅動機構以外，亦可為採用線性馬達之驅動機構。Further, the servo motor 26 that rotationally drives the ball screw 24 is disposed at the back side in the depth direction of the oil groove 20. Further, the X table 16 guided by the guide rails 22, 22 and driven by the rotation of the ball screw 24 of the servo motor 26 in the X direction is disposed in the longitudinal direction. Further, the driving mechanism of the present invention may be a driving mechanism using a linear motor in addition to a driving mechanism using the ball screw 24.
如第3圖所示，在X工作台16上，設有與滾珠螺桿24螺合之滾珠螺母28、及滑動自如地卡合於導軌22,22之滑塊30,30，並搭載有θ工作台(θ旋轉軸)32，其係以Z方向(參照第1圖)作為軸而作θ旋轉，在此θ工作台32上安裝有工件台10。θ工作台32之旋轉軸係將其底面固定於X工作台16上所安裝的L字型固定治具33上，以使工件台10可於水平面上朝θ方向旋轉。As shown in Fig. 3, the X table 16 is provided with a ball nut 28 that is screwed to the ball screw 24, and sliders 30 and 30 that are slidably engaged with the guide rails 22 and 22, and are mounted with θ work. The stage (theta rotation axis) 32 is rotated by θ in the Z direction (see FIG. 1) as an axis, and the workpiece stage 10 is attached to the θ table 32. The rotating shaft of the θ table 32 has its bottom surface fixed to the L-shaped fixing jig 33 mounted on the X table 16, so that the workpiece stage 10 can be rotated in the θ direction on the horizontal plane.
另外，隨著X工作台16之X方向的移動而進行伸縮動作以覆蓋導軌22,22及滾珠螺桿24的一對蛇腹(蛇腹構件)34,34，係配置於油槽20之左側面。一方之蛇腹34的一端係固定於油槽20之深度方向外側，另一端係固定於X工作台16之深度方向外側邊緣部。另一方之蛇腹34的一端係固定於油槽20之深度方向裏側處，另一端係固定於X工作台16之深度方向裏側邊緣部。又，在第2圖中省略了另一方之蛇腹34。Further, as the X table 16 moves in the X direction, the telescopic operation is performed to cover the guide rails 22, 22 and the pair of bellows (snake members) 34, 34 of the ball screw 24, which are disposed on the left side surface of the oil groove 20. One end of the bellows 34 is fixed to the outer side in the depth direction of the oil groove 20, and the other end is fixed to the outer side edge portion of the X table 16 in the depth direction. One end of the other bellows 34 is fixed to the inner side in the depth direction of the oil groove 20, and the other end is fixed to the inner side edge portion of the X table 16 in the depth direction. Further, in the second drawing, the other bellows 34 is omitted.
另一方面，如第2圖所示，在油槽20之右側面，亦同樣地沿第1圖中之箭頭X方向配設有2根一對之導軌(導引機構)36,36，在該等導軌36,36之間，構成驅動機構之滾珠螺桿38亦與導軌36,36平行且沿油槽20之右側面配設。On the other hand, as shown in Fig. 2, on the right side surface of the oil groove 20, two pairs of guide rails (guiding means) 36, 36 are arranged in the direction of the arrow X in the first drawing. Between the guide rails 36, 36, the ball screw 38 constituting the drive mechanism is also disposed parallel to the guide rails 36, 36 and along the right side surface of the oil groove 20.
另外，旋轉驅動該滾珠螺桿38之伺服馬達40係配置於油槽20之深度方向的裏側處。還配置有由導軌36,36所導引且利用伺服馬達40之滾珠螺桿38的旋轉而朝X方向驅動的X工作台18。Further, the servo motor 40 that rotationally drives the ball screw 38 is disposed at the back side in the depth direction of the oil groove 20. Also disposed is an X table 18 that is guided by the guide rails 36, 36 and that is driven in the X direction by the rotation of the ball screw 38 of the servo motor 40.
在X工作台18上，設有與滾珠螺桿38螺合之滾珠螺母(未圖示)、及滑動自如地卡合於導軌36,36之滑塊(未圖示)，並搭載有θ工作台(θ旋轉軸)44，其係以Z方向(參照第1圖)作為軸而作θ旋轉，在此θ工作台44上安裝有工件台11。θ工作台44之旋轉軸係將其底面固定於X工作台11上所安裝的未圖示之L字型固定治具上，以使工件台11可於水平面上朝θ方向旋轉。The X table 18 is provided with a ball nut (not shown) that is screwed to the ball screw 38, and a slider (not shown) that is slidably engaged with the guide rails 36 and 36, and is equipped with a θ table. The (θ rotation axis) 44 is rotated by θ in the Z direction (see Fig. 1) as an axis, and the workpiece stage 11 is attached to the θ table 44. The rotating shaft of the θ table 44 has its bottom surface fixed to an L-shaped fixing jig (not shown) mounted on the X table 11, so that the workpiece stage 11 can be rotated in the θ direction on a horizontal plane.
另外，隨著X工作台18之X方向的移動而進行伸縮動作以覆蓋導軌36,36及滾珠螺桿36的一對蛇腹(蛇腹構件)46,46，係配置於油槽20之右側面。一方之蛇腹46的一端係固定於油槽20之深度方向外側，另一端係固定於X工作台18之深度方向外側邊緣部。另一方之蛇腹46的一端係固定於油槽20之深度方向裏側，另一端係固定於X工作台18之深度方向裏側邊緣部。又，在第2圖中省略了另一方之蛇腹46。Further, as the X table 18 moves in the X direction, the telescopic operation is performed to cover the guide rails 36, 36 and the pair of bellows (petidal members) 46, 46 of the ball screw 36, which are disposed on the right side surface of the oil groove 20. One end of the bellows 46 is fixed to the outer side in the depth direction of the oil groove 20, and the other end is fixed to the outer side edge portion of the X table 18 in the depth direction. One end of the other bellows 46 is fixed to the inner side in the depth direction of the oil groove 20, and the other end is fixed to the inner side edge portion of the X table 18 in the depth direction. Further, in the second drawing, the other bellows 46 is omitted.
另外，如第4圖所示，在加工部5立設有門型形狀的導引基座48。在導引基座48之側面，朝圖中之箭頭Y方向水平地安裝有主軸Y導引機構50，並設置有2台主軸Y工作台52,52，其係被主軸Y導引機構50所導引且藉由未圖示之驅動機構而朝Y方向進行分度進刀。在各主軸Y工作台52,52上設有主軸Z工作台54，其係藉由未圖示之導軌及驅動機構而朝圖中之箭頭Z方向作切入進刀，在各個主軸Z工作台54上，透過保持器56安裝有主軸9。又，主軸Y工作台52及主軸Z工作台54之驅動機構，亦可使用線性馬達，係可使用伺服馬達及導螺桿。Further, as shown in Fig. 4, a guide base 48 having a gate shape is provided in the processed portion 5. On the side of the guide base 48, a spindle Y guide mechanism 50 is horizontally mounted in the direction of the arrow Y in the drawing, and two spindle Y stages 52, 52 are provided, which are guided by the spindle Y guide mechanism 50. The indexing feed is performed in the Y direction by a drive mechanism (not shown). A spindle Z table 54 is provided on each of the spindle Y stages 52, 52, and is cut into the direction of the arrow Z in the figure by a guide rail and a drive mechanism (not shown), and the table Z is placed on each of the spindles Z. The spindle 9 is mounted through the holder 56. Further, a linear motor may be used as the drive mechanism of the spindle Y table 52 and the spindle Z table 54, and a servo motor and a lead screw may be used.
主軸9,9係內建高頻馬達型之空氣軸承式或機械軸承式之主軸，且被相互對向地配置。在各主軸9之前端安裝有旋轉刀片8，其藉由主軸9而進行高速旋轉。The main shafts 9 and 9 are internally built with a high-frequency motor type air bearing type or a mechanical bearing type main shaft, and are disposed opposite to each other. A rotary blade 8 is mounted at the front end of each spindle 9 and is rotated at a high speed by the spindle 9.
刀片8係由近前側及下方開口之未圖示的法蘭罩所包圍，並從設於法蘭罩之研削噴嘴朝加工點供應研削水。另外，在法蘭罩上設有未圖示之洗淨噴嘴，從該洗淨噴嘴朝加工點供應洗淨水。The blade 8 is surrounded by a flange cover (not shown) which is open to the front side and the lower side, and the grinding water is supplied from the grinding nozzle provided in the flange cover toward the machining point. Further, a washing nozzle (not shown) is provided on the flange cover, and the washing water is supplied from the washing nozzle toward the processing point.
刀片8係薄圓盤狀之砂輪，其可採用由鎳將金剛石砂粒或CBN砂粒電沉積而形成之電沉積刀片、或由混入金屬粉末之樹脂所結合而成的金屬樹脂黏結的刀片等。刀片8之尺寸係依加工內容而可進行多種之選擇，但在將通常之半導體晶圓作為工件進行切割的情況，可採用直徑50mm，厚度30μm左右者。The blade 8 is a thin disc-shaped grinding wheel which can be an electrodeposited blade formed by electrodepositing diamond grit or CBN grit by nickel, or a blade bonded by a metal resin in which a resin mixed with metal powder is bonded. The size of the blade 8 can be variously selected depending on the processing content. However, in the case of cutting a normal semiconductor wafer as a workpiece, a diameter of 50 mm and a thickness of about 30 μm can be used.
藉由此種機構，2片之旋轉刀片8,8係構成為各自獨立並可進行圖中之Y方向之分度進刀及Z方向之切入進刀。With such a mechanism, the two rotating blades 8, 8 are configured to be independent and can perform the indexing infeed in the Y direction and the infeed in the Z direction.
另外，在導引基座48之底面設有攝影手段Y導引機構13,13以作為攝影手段移動軸。在攝影手段Y導引機構13,13安裝有固定攝影手段12之攝影手段移動台14，藉此，攝影手段12係設置成可沿Y方向移動。Further, the photographing means Y guide means 13, 13 are provided on the bottom surface of the guide base 48 to move the shaft as a photographing means. The photographing means moving means 14 is attached to the photographing means Y guiding means 13, 13 to which the photographing means 12 is fixed, whereby the photographing means 12 is provided to be movable in the Y direction.
如第5圖所示，攝影手段12具備：第一攝影部12A，係由顯微鏡或CCD相機等所構成且設置成朝向刀片8之方向；及第二攝影部12B，同樣由顯微鏡或CCD相機等所構成且設置成朝向工件台10,11之方向。As shown in Fig. 5, the photographing means 12 includes a first photographing unit 12A which is formed by a microscope or a CCD camera and is disposed in a direction toward the blade 8, and a second photographing unit 12B which is similarly a microscope or a CCD camera. It is constructed and arranged in the direction of the workpiece stages 10, 11.
攝影手段12係藉由使攝影手段移動台14移動於攝影手段Y導引機構13,13上，而被定位於工件台11(或工件台10)與刀片8之間，藉由第一攝影部12A拍攝刀片8之前端部，並藉由第二攝影部12B拍攝工件台11上之工件W上的走道或對準標記等之作為基準的位置。The photographing means 12 is positioned between the workpiece stage 11 (or the workpiece stage 10) and the blade 8 by moving the photographing means moving table 14 to the photographing means Y guiding means 13, 13, by the first photographing section The 12A photographs the front end portion of the blade 8, and the second photographing portion 12B photographs the position of the walkway or the alignment mark or the like on the workpiece W on the workpiece stage 11 as a reference.
藉由第一攝影部12A及第二攝影部12B所拍攝之二個影像，被傳送至控制器7，並藉由重合等之已知影像處理方法而進行處理，以計算出調整刀片8與工件W之位置的相對位置座標。刀片8與工件W係根據計算出之相對位置座標進行對準動作。藉此，不用試驗性地加工虛擬工件，便可進行刀片8與工件W之調整。The two images captured by the first photographing unit 12A and the second photographing unit 12B are transmitted to the controller 7 and processed by a known image processing method such as coincidence to calculate the adjustment blade 8 and the workpiece. The relative position coordinates of the position of W. The blade 8 and the workpiece W are aligned according to the calculated relative position coordinates. Thereby, the adjustment of the blade 8 and the workpiece W can be performed without experimentally machining the dummy workpiece.
其次，說明藉由如此構成之切割裝置1而實施的本發明之切割方法。Next, the cutting method of the present invention which is carried out by the cutting device 1 thus constructed will be described.
在本發明之切割方法中，首先，複數片收容於載置於切割裝置1之載台2上的匣盒內且透過切割帶而貼合於工件架上的工件W，係藉由搬運手段4而被一片片地被取出，並由工件台11(或工件台10)所吸附。In the cutting method of the present invention, first, a plurality of pieces of the workpiece W placed in a cassette placed on the stage 2 of the cutting device 1 and attached to the workpiece holder through the dicing tape are transported by the transport means 4 It is taken out piece by piece and sucked by the workpiece stage 11 (or the workpiece stage 10).
接著，如第6圖所示，吸附於工件台11上之工件W，隨工件台11朝X方向移動而被定位於安裝於一方之主軸9前端的刀片8的下方。在工件W被定位於刀片8的下方之後，攝影手段12被定位於工件台11與刀片8之間，如第5圖所示，藉由第一攝影部12A拍攝刀片8之前端部，並藉由第二攝影部12B拍攝工件台11上之工件W上的走道或對準標記等的作為基準的位置。Next, as shown in Fig. 6, the workpiece W adsorbed on the workpiece stage 11 is positioned below the blade 8 attached to the tip end of one of the spindles 9 as the workpiece stage 11 moves in the X direction. After the workpiece W is positioned below the blade 8, the photographing means 12 is positioned between the workpiece stage 11 and the blade 8, as shown in Fig. 5, the front end portion of the blade 8 is photographed by the first photographing portion 12A, and borrowed The second photographing unit 12B photographs a reference position such as a walkway or an alignment mark on the workpiece W on the workpiece stage 11.
藉由第一攝影部12A及第二攝影部12B所拍攝之二個影像，被傳送至控制器7。傳送至控制器7之二個影像，藉由重合等的已知影像處理方法而進行處理，以計算出調整刀片8與工件W之位置用的相對位置座標。刀片8與工件W係根據計算出之相對位置座標的値進行對準。The two images captured by the first imaging unit 12A and the second imaging unit 12B are transmitted to the controller 7. The two images transmitted to the controller 7 are processed by a known image processing method such as overlap to calculate the relative position coordinates for adjusting the position of the blade 8 and the workpiece W. The blade 8 and the workpiece W are aligned according to the calculated 位置 of the relative position coordinates.
又，在以安裝於對向設置之另一方的主軸9上的刀片8進行工件台11上之工件W的切割之情況，如第7圖所示，隨另一方之主軸9移動，將刀片8定位於工件台11上之工件W的上方，並使攝影手段12移動而位於另一方之主軸9前端所安裝的刀片8與工件台11之間。在此狀態下，與安裝於一方之主軸9上之刀片8相同，藉由第一攝影部12A拍攝刀片8之前端部，並藉由第二攝影部12B拍攝工件台11上之工件W，並藉由控制器7處理被傳送至控制器7之二個影像，以計算出調整刀片8與工件W之位置用的相對位置座標。刀片8與工件W係根據計算出之相對位置座標的値進行對準。Further, in the case where the workpiece W mounted on the spindle 9 on the other side of the oppositely disposed side is cut by the workpiece W on the workpiece stage 11, as shown in Fig. 7, the blade 8 is moved as the other spindle 9 is moved. The workpiece W is positioned above the workpiece table 11, and the photographing means 12 is moved to be positioned between the blade 8 and the workpiece stage 11 mounted on the tip end of the other spindle 9. In this state, similarly to the blade 8 mounted on one of the spindles 9, the first photographing portion 12A photographs the front end portion of the blade 8, and the second photographing portion 12B photographs the workpiece W on the workpiece table 11, and The two images transmitted to the controller 7 are processed by the controller 7 to calculate the relative position coordinates for adjusting the position of the blade 8 and the workpiece W. The blade 8 and the workpiece W are aligned according to the calculated 位置 of the relative position coordinates.
接著，結束所有之對準動作，在開始進行工件W之切割時，如第8圖所示，攝影手段12移動至不會妨礙刀片8,8加工工件W之位置。在進行工件台11上之工件W的加工期間，新的工件W被載置於工件台10上，隨著工件台11上之工件W的加工結束，同樣藉由攝影手段12進行刀片8,8與工件台10上之工件W的對準動作。Then, when all the alignment operations are completed, when the cutting of the workpiece W is started, as shown in Fig. 8, the photographing means 12 is moved to a position where the workpieces W are not hindered by the blades 8, 8. During the processing of the workpiece W on the workpiece stage 11, a new workpiece W is placed on the workpiece stage 10, and as the processing of the workpiece W on the workpiece stage 11 is completed, the blades 8, 8 are also performed by the photographing means 12. The alignment action with the workpiece W on the workpiece table 10.
藉此，不用試驗性地加工虛擬工件，便可進行刀片8與工件W之調整。Thereby, the adjustment of the blade 8 and the workpiece W can be performed without experimentally machining the dummy workpiece.
又，在最初載置於工件台11上之工件W的切割結束並載置了新的工件時，同樣藉由攝影手段12同時拍攝刀片8與工件W而進行對準。此時，可藉由將第一攝影部12A之焦點對準於刀片8的前端部時之焦距變化，來測量刀片8之Z方向高度變化，能以非接觸方式測量刀片8之磨損量。在刀片8之磨損量大於規定値的情況，藉由切割裝置1對操作者發出催促刀片交換之警告。Further, when the cutting of the workpiece W placed on the workpiece table 11 is completed and a new workpiece is placed, the blade 8 and the workpiece W are simultaneously imaged by the photographing means 12 to perform alignment. At this time, the change in the height of the blade 8 in the Z direction can be measured by aligning the focus of the first photographing portion 12A with the focal length of the blade 8, and the amount of wear of the blade 8 can be measured in a non-contact manner. In the case where the amount of wear of the blade 8 is larger than the prescribed enthalpy, the operator is prompted by the cutting device 1 to urge the blade exchange.
如以上說明，根據本發明之切割裝置及切割方法，不用試驗性地加工虛擬工件，便可進行刀片與工件之調整，可縮短調整時間，減少調整所需之費用，藉以提高整個裝置之運轉率。又，能以非接觸方式測量刀片之磨損量，可更進一步提高裝置之運轉率。As described above, according to the cutting device and the cutting method of the present invention, the blade and the workpiece can be adjusted without experimentally processing the dummy workpiece, the adjustment time can be shortened, and the cost required for the adjustment can be reduced, thereby improving the operation rate of the entire device. . Moreover, the wear amount of the blade can be measured in a non-contact manner, and the operation rate of the device can be further improved.
又，在本實施形態中，採用在對向之前端分別安裝有刀片8的對向之主軸9,9來作為加工手段，但本發明並不限定於此種構成，若為採用雷射等之已知加工手段的切割裝置，亦可較好地實施本發明。Further, in the present embodiment, the opposing main shafts 9, 9 to which the blades 8 are attached at the opposite ends are used as the processing means, but the present invention is not limited to such a configuration, and if a laser or the like is used, The present invention can also be preferably implemented by a cutting device of a known processing means.
另外，在本實施形態中，雖具備有多個加工手段及工件台，但本發明並不限定於此種構成，在單一之工件台或單一之加工手段的切割裝置中，亦可較好地實施本發明。又，在本實施形態中，切割裝置亦可具備複數個攝影部。Further, in the present embodiment, although a plurality of processing means and a workpiece stage are provided, the present invention is not limited to such a configuration, and may be preferably used in a single workpiece stage or a single cutting means for processing means. The invention is implemented. Further, in the present embodiment, the cutting device may include a plurality of imaging units.
1、70．．．切割裝置1, 70. . . Cutting device
2．．．載台2. . . Loading platform
3．．．吸附部3. . . Adsorption section
4．．．搬運手段4. . . Handling means
5．．．加工部5. . . Processing department
6．．．旋轉器6. . . Rotator
7．．．控制器(控制手段)7. . . Controller (control means)
8．．．刀片8. . . blade
9．．．主軸9. . . Spindle
10,11．．．工件台10,11. . . Workpiece table
12．．．攝影手段12. . . Photography means
13．．．攝影手段Y導引機構13. . . Photography means Y guide mechanism
14．．．攝影手段移動台14. . . Photography means mobile station
16,18．．．X工作台16,18. . . X workbench
20．．．油槽20. . . Oil tank
22．．．導軌twenty two. . . guide
24．．．滾珠螺桿twenty four. . . Ball screw
26．．．伺服馬達26. . . Servo motor
28．．．滾珠螺母28. . . Ball nut
30．．．滑塊30. . . Slider
32．．．θ工作台32. . . θ workbench
33．．．固定治具33. . . Fixed fixture
34．．．蛇腹34. . . Snake belly
36．．．導軌36. . . guide
38．．．滾珠螺桿38. . . Ball screw
40．．．伺服馬達40. . . Servo motor
44．．．θ工作台44. . . θ workbench
46．．．蛇腹46. . . Snake belly
48．．．導引基座48. . . Guide base
50．．．主軸Y導引機構50. . . Spindle Y guide mechanism
52．．．主軸Y工作台52. . . Spindle Y table
54．．．主軸54. . . Spindle
56．．．保持器56. . . Holder
第1圖為實施本發明之切割方法的切割裝置之外觀立體示意圖。Fig. 1 is a perspective view showing the appearance of a cutting device for carrying out the cutting method of the present invention.
第2圖為第1圖所示切割裝置之加工部的構造之立體示意圖。Fig. 2 is a perspective view showing the structure of a processing portion of the cutting device shown in Fig. 1.
第3圖為顯示第2圖所示加工部的要部構造之剖視圖。Fig. 3 is a cross-sectional view showing the structure of a main part of the processed portion shown in Fig. 2.
第4圖為顯示切割裝置之加工部的構造之俯視圖。Fig. 4 is a plan view showing the structure of a processing portion of the cutting device.
第5圖為顯示切割裝置之加工部的構造之側視圖。Fig. 5 is a side view showing the configuration of a processing portion of the cutting device.
第6圖為顯示由攝影裝置拍攝一方之刀片及工件的狀態之俯視圖。Fig. 6 is a plan view showing a state in which one of the blades and the workpiece is photographed by the photographing device.
第7圖為顯示由攝影裝置拍攝另一方之刀片及工件的狀態之俯視圖。Fig. 7 is a plan view showing a state in which the other blade and the workpiece are taken by the photographing device.
第8圖為顯示攝影裝置退避中之狀態的俯視圖。Fig. 8 is a plan view showing a state in which the photographing device is retracted.
第9圖為習知切割裝置之外觀立體示意圖。Figure 9 is a perspective view showing the appearance of a conventional cutting device.
第10圖為第8圖所示切割裝置之加工部的構造之立體示意圖。Fig. 10 is a perspective view showing the structure of a processing portion of the cutting device shown in Fig. 8.
第11圖為顯示藉由雷射進行切割之切割裝置的構成之側視圖。Fig. 11 is a side view showing the configuration of a cutting device for cutting by laser.
第12圖為顯示雷射切割之原理的側面剖視圖。Figure 12 is a side cross-sectional view showing the principle of laser cutting.
1．．．切割裝置1. . . Cutting device
2．．．載台2. . . Loading platform
3．．．吸附部3. . . Adsorption section
4．．．搬運手段4. . . Handling means
5．．．加工部5. . . Processing department
6．．．旋轉器6. . . Rotator
7．．．控制器(控制手段)7. . . Controller (control means)
8．．．刀片8. . . blade
9．．．主軸9. . . Spindle
10,11．．．工件台10,11. . . Workpiece table
Claims (4)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007330132 | 2007-12-21 |
Publications (2)
| Publication Number | Publication Date |
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| TW200936341A TW200936341A (en) | 2009-09-01 |
| TWI450805B true TWI450805B (en) | 2014-09-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097149316A TWI450805B (en) | 2007-12-21 | 2008-12-18 | Cutting device and cutting method |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TWI450805B (en) |
| WO (1) | WO2009081747A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5386276B2 (en) * | 2009-09-02 | 2014-01-15 | 株式会社ディスコ | Cutting equipment |
| TWI554374B (en) * | 2012-06-22 | 2016-10-21 | Motech Taiwan Automatic Corp | Cutting unit and its application equipment |
| JP6458983B2 (en) * | 2014-10-06 | 2019-01-30 | 株式会社東京精密 | Dicing machine |
| JP6601698B2 (en) * | 2018-12-27 | 2019-11-06 | 株式会社東京精密 | Imaging device |
| JP7478945B2 (en) * | 2020-01-17 | 2024-05-08 | 株式会社東京精密 | Wafer processing system and wafer processing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03161264A (en) * | 1989-08-21 | 1991-07-11 | Hitachi Ltd | Working method for video head by wire saw and wire saw working device |
| JPH05138504A (en) * | 1991-11-15 | 1993-06-01 | Hitachi Ltd | Processing method and device and vtr head thereof |
| JP2003163178A (en) * | 2001-11-28 | 2003-06-06 | Tokyo Seimitsu Co Ltd | Dicing apparatus |
| JP2007081317A (en) * | 2005-09-16 | 2007-03-29 | Disco Abrasive Syst Ltd | Cutting device |
-
2008
- 2008-12-11 WO PCT/JP2008/072515 patent/WO2009081747A1/en active Application Filing
- 2008-12-18 TW TW097149316A patent/TWI450805B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03161264A (en) * | 1989-08-21 | 1991-07-11 | Hitachi Ltd | Working method for video head by wire saw and wire saw working device |
| JPH05138504A (en) * | 1991-11-15 | 1993-06-01 | Hitachi Ltd | Processing method and device and vtr head thereof |
| JP2003163178A (en) * | 2001-11-28 | 2003-06-06 | Tokyo Seimitsu Co Ltd | Dicing apparatus |
| JP2007081317A (en) * | 2005-09-16 | 2007-03-29 | Disco Abrasive Syst Ltd | Cutting device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200936341A (en) | 2009-09-01 |
| WO2009081747A1 (en) | 2009-07-02 |
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