TWI448642B - Led light source - Google Patents
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- TWI448642B TWI448642B TW100126115A TW100126115A TWI448642B TW I448642 B TWI448642 B TW I448642B TW 100126115 A TW100126115 A TW 100126115A TW 100126115 A TW100126115 A TW 100126115A TW I448642 B TWI448642 B TW I448642B
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Description
本發明涉及一種照明裝置，尤其是一種發光二極體光源裝置。 The invention relates to a lighting device, in particular to a light emitting diode light source device.
發光二極體是一種節能、環保、長壽命之固體光源，因此近十幾年來對發光二極體技術之研究一直非常活躍，發光二極體也有漸漸取代日光燈、白熾燈等傳統光源之趨勢。在先前技術中，發光二極體光源裝置一般是將發光二極體設置在導線架(lead frame)上，然後利用摻雜螢光粉之封裝膠體封裝該發光二極體，所述發光二極體晶片發出之光激發螢光粉射出到光源外部。但是，傳統發光二極體光源裝置發出之光之色溫一般是固定不變之，無法進行調整，不能夠滿足實際需要。 The light-emitting diode is a kind of solid light source with energy saving, environmental protection and long life. Therefore, the research on the light-emitting diode technology has been very active in the past decade, and the light-emitting diode has gradually replaced the traditional light source such as fluorescent lamp and incandescent lamp. In the prior art, the light-emitting diode device generally has a light-emitting diode disposed on a lead frame, and then the light-emitting diode is encapsulated by a doped phosphor-containing encapsulant, the light-emitting diode The light emitted by the bulk wafer excites the phosphor powder to be emitted outside the light source. However, the color temperature of the light emitted by the conventional light-emitting diode light source device is generally fixed, and cannot be adjusted, and cannot meet the actual needs.
有鑒於此，有必要提供一種可改變色溫之發光二極體光源裝置。 In view of the above, it is necessary to provide a light-emitting diode light source device capable of changing the color temperature.
一種發光二極體光源裝置，其包括發光部、螢光片以及PWM調節裝置。該發光部包括基板以及設置在該基板上之若干發光二極體，該發光二極體是由至少一發光二極體晶片封裝在導線架上或使用COB(Chip on Board)方式直接設置在基板上，該螢光片遮擋在該發光二極體之出光光路上。所述螢光片內包含螢光粉含量不同之多個區域，所述發光二極體分別對應不同之區域。所述PWM調節裝置調節改變各發光二極體內晶片之點亮時間，以控制每個 區域內之螢光粉被照射激發之時間，從而改變整個發光二極體光源裝置之色溫。 A light emitting diode light source device includes a light emitting portion, a fluorescent sheet, and a PWM adjusting device. The light-emitting portion includes a substrate and a plurality of light-emitting diodes disposed on the substrate, and the light-emitting diodes are packaged on the lead frame by at least one light-emitting diode chip or directly disposed on the substrate by using a COB (Chip on Board) method. The fluorescent sheet is shielded from the light path of the light emitting diode. The phosphor sheet contains a plurality of regions having different phosphor powder contents, and the light emitting diodes respectively correspond to different regions. The PWM adjusting device adjusts a lighting time of the wafer in each of the light emitting diodes to control each The phosphor powder in the area is illuminated for a period of time, thereby changing the color temperature of the entire light-emitting diode light source device.
上述之發光二極體光源裝置之螢光片包含螢光粉含量不同之多個區域，而發光二極體分別對應螢光片之不同區域，藉由PWM調節裝置調節改變各發光二極體內晶片之點亮時間，從而控制螢光片中每個區域內之螢光粉被照射激發之時間，從而改變色溫。 The fluorescent sheet of the above-mentioned light-emitting diode light source device comprises a plurality of regions with different phosphor powder contents, and the light-emitting diodes respectively correspond to different regions of the fluorescent film, and the light-emitting diode chips are adjusted and adjusted by the PWM adjusting device. The lighting time is controlled to control the time during which the phosphor in each area of the phosphor is excited by the illumination, thereby changing the color temperature.
10‧‧‧發光二極體光源裝置 10‧‧‧Lighting diode light source device
100‧‧‧發光部 100‧‧‧Lighting Department
200‧‧‧螢光片 200‧‧‧Fluorescent film
300‧‧‧PWM調節裝置 300‧‧‧PWM adjustment device
400‧‧‧支撐桿 400‧‧‧Support rod
110‧‧‧基板 110‧‧‧Substrate
120‧‧‧發光二極體 120‧‧‧Lighting diode
210‧‧‧螢光粉層 210‧‧‧Fluorescent powder layer
220‧‧‧微透鏡 220‧‧‧Microlens
圖1為本發明之發光二極體光源裝置之結構示意圖。 1 is a schematic structural view of a light-emitting diode light source device of the present invention.
圖2為圖1中之發光二極體光源裝置之發光部俯視圖。 Fig. 2 is a plan view showing a light-emitting portion of the light-emitting diode light source device of Fig. 1.
圖3為圖1中之發光二極體光源裝置之另一種發光部俯視圖。 3 is a plan view showing another light-emitting portion of the light-emitting diode light source device of FIG. 1.
圖4為圖1中之發光二極體光源裝置之螢光片之剖面放大圖。 4 is an enlarged cross-sectional view showing a fluorescent sheet of the light-emitting diode light source device of FIG. 1.
以下將結合附圖對本發明作進一步之詳細說明。 The invention will be further described in detail below with reference to the accompanying drawings.
請參閱圖1以及圖2，本發明一較佳實施方式提供之一種發光二極體光源裝置10包括一發光部100、遮擋在該發光部100之出光光路上之螢光片200以及一PWM(Pulse Width Modulation，脈衝寬度調製)調節裝置300。 Referring to FIG. 1 and FIG. 2, a light-emitting diode light source device 10 according to a preferred embodiment of the present invention includes a light-emitting portion 100, a fluorescent sheet 200 blocking the light-emitting path of the light-emitting portion 100, and a PWM ( Pulse Width Modulation, adjustment device 300.
所述發光部100包括基板110以及設置在該基板110上之若干發光二極體120。所述基板110為圓形，該基板110表面中心垂直向上形成一支撐桿400。該若干發光二極體是由至少一發光二極體晶片封裝在導線架上或使用COB(Chip on Board)方式直接設置在基板110上。若干發光二極體120圍繞該支撐桿400設置。在本實施方式中，基板110上圍繞支撐桿400共設置有兩圈發光二極體 120，其中外圈之發光二極體120圍繞內圈之發光二極體120。該若干發光二極體120可以為紫外光、藍光、綠光、紅光或者白光發光二極體。發光二極體120可以是單一晶片或多晶片所組成，也可以是單波長或多波長所組成。 The light emitting portion 100 includes a substrate 110 and a plurality of light emitting diodes 120 disposed on the substrate 110. The substrate 110 is circular, and a support rod 400 is formed vertically upward in the center of the surface of the substrate 110. The plurality of light emitting diodes are packaged on the lead frame by at least one light emitting diode chip or directly disposed on the substrate 110 by using a COB (Chip on Board) method. A plurality of light emitting diodes 120 are disposed around the support bar 400. In the embodiment, two light-emitting diodes are disposed on the substrate 110 around the support rod 400. 120, wherein the light-emitting diode 120 of the outer ring surrounds the light-emitting diode 120 of the inner ring. The plurality of light emitting diodes 120 may be ultraviolet light, blue light, green light, red light or white light emitting diodes. The light emitting diode 120 may be composed of a single wafer or a multi wafer, or may be composed of a single wavelength or multiple wavelengths.
另外，請參閱圖3，所述基板110也可以由多塊燈板拼湊而成，如圖3所示，每個燈板為一扇形結構，每塊燈板表面設置有兩個發光二極體120，多塊扇形燈板共同構成一圓形基板110。 In addition, referring to FIG. 3, the substrate 110 may also be made up of a plurality of light panels. As shown in FIG. 3, each of the light panels is a fan-shaped structure, and two light-emitting diodes are disposed on the surface of each of the light panels. 120. A plurality of fan-shaped light panels collectively form a circular substrate 110.
可以理解之是，所述基板110之形狀並不限定於本實施方式中之圓形，還可以是一整塊或者多塊燈板構成之三角形、四邊形、多邊形等其他形狀。 It can be understood that the shape of the substrate 110 is not limited to the circular shape in the embodiment, and may be other shapes such as a triangle, a quadrangle, a polygon, or the like formed by one or a plurality of light plates.
請參閱圖4，所述螢光片200為一圓形片狀結構，其中心穿設固定在基板110上之支撐桿400上，遮擋在該若干發光二極體120之出光光路上，該螢光片200內分為多個區域，每個區域內之螢光粉之含量不同。在本實施方式中，所述多個區域為一連續區域，該螢光片200內包含有一螢光粉層210，該螢光粉層210之厚度在螢光片200內呈非均勻分佈，其厚度為從螢光片200之一側向相對之另一側逐漸遞減。基板110上之若干發光二極體120分別對應螢光片200中之螢光粉層210之不同厚度部分。所述螢光粉層210可選自硫化物螢光粉、矽酸鹽螢光粉、氮化物螢光粉、氮氧化物螢光粉、釔鋁石榴石螢光粉、(Sr，Ca)AlSiN3，SiAlON螢光粉或者上述螢光粉之混合。該螢光片200之出光面還形成有若干微透鏡220，該微透鏡220用於散射或者聚焦光線。另外，該螢光片200內還可含有光擴散粒子，用於增加發光二極體光源裝置10之出光率。 Referring to FIG. 4, the fluorescent sheet 200 is a circular sheet-like structure, and the center thereof is disposed on the support rod 400 fixed on the substrate 110 to block the light path of the plurality of LEDs 120. The light sheet 200 is divided into a plurality of regions, and the content of the phosphor powder in each region is different. In the embodiment, the plurality of regions are a continuous region, and the phosphor sheet 200 includes a phosphor layer 210. The thickness of the phosphor layer 210 is non-uniformly distributed in the phosphor sheet 200. The thickness gradually decreases from one side of the fluorescent sheet 200 to the opposite side. The plurality of light emitting diodes 120 on the substrate 110 respectively correspond to different thickness portions of the phosphor powder layer 210 in the fluorescent sheet 200. The phosphor powder layer 210 may be selected from the group consisting of sulfide phosphor powder, niobate phosphor powder, nitride phosphor powder, oxynitride phosphor powder, yttrium aluminum garnet phosphor powder, (Sr, Ca) AlSiN3, SiAlON. Fluorescent powder or a mixture of the above phosphors. The light exiting surface of the phosphor sheet 200 is also formed with a plurality of microlenses 220 for scattering or focusing light. In addition, the fluorescent sheet 200 may further contain light diffusing particles for increasing the light extraction rate of the light emitting diode light source device 10.
可以理解之是，所述螢光片200並不限定於本實施方式中之圓形 ，還可以為三角形、四邊形、多邊形等其他形狀。所述螢光片200內螢光粉層210之厚度並不限定於本實施方式中之分佈情況，也可以是隨著螢光片200之一定方向呈一週期性之分佈，例如螢光粉層210之厚度可以是圍繞螢光片200之中心呈波浪狀分佈。 It can be understood that the fluorescent sheet 200 is not limited to the circular shape in the embodiment. It can also be other shapes such as triangles, quadrilaterals, and polygons. The thickness of the phosphor layer 210 in the phosphor sheet 200 is not limited to the distribution in the embodiment, and may be a periodic distribution with a certain direction of the phosphor sheet 200, such as a phosphor layer. The thickness of 210 may be wavy around the center of the luminescent sheet 200.
另外，所述發光二極體120之排布方式並不限定於本實施方式提供之排布方式，還可以根據螢光片200中之螢光粉之分佈情況進行排布，使若干發光二極體分別對應螢光片200之不同區域，從而對應不同含量之螢光粉。 In addition, the arrangement of the light-emitting diodes 120 is not limited to the arrangement manner provided by the embodiment, and may be arranged according to the distribution of the phosphor powder in the fluorescent sheet 200 to make a plurality of light-emitting diodes. The bodies respectively correspond to different regions of the fluorescent sheet 200, thereby corresponding to different levels of phosphor powder.
所述PWM調節裝置300與基板110連接，其用於控制各發光二極體120之脈衝寬度，即控制各發光二極體120內晶片之脈衝電壓之寬度，調節各發光二極體120內晶片之點亮時間。在本實施方式中，所述PWM調節裝置300控制基板110上之兩圈發光二極體120順序點亮。 The PWM adjustment device 300 is connected to the substrate 110 for controlling the pulse width of each of the LEDs 120, that is, controlling the width of the pulse voltage of the wafers in each of the LEDs 120, and adjusting the wafers in each of the LEDs 120. The lighting time. In the present embodiment, the PWM adjusting device 300 controls the two-turn LEDs 120 on the substrate 110 to sequentially illuminate.
在使用時，由於螢光片200中之螢光粉層210之厚度呈非均勻分佈，而若干發光二極體120分別對應螢光片200之螢光粉層210不同厚度部分，藉由PWM調節裝置300控制各發光二極體120內晶片之點亮時間，以控制每個區域內之螢光粉被照射激發之時間，從而改變各發光二極體120激發螢光片200後混合光線之色溫。 In use, the thickness of the phosphor layer 210 in the phosphor sheet 200 is non-uniformly distributed, and the plurality of LEDs 120 respectively correspond to different thickness portions of the phosphor layer 210 of the phosphor sheet 200, and are adjusted by PWM. The device 300 controls the lighting time of the wafers in each of the LEDs 120 to control the time during which the phosphors in each region are excited by the illumination, thereby changing the color temperature of the mixed light after the LEDs 120 are excited by the LEDs 120. .
相較於先前技術，本發明之發光二極體光源裝置之螢光片包含螢光粉含量不同之多個區域，而發光二極體分別對應螢光片之不同區域，藉由PWM調節裝置調節改變各發光二極體內晶片之點亮時間，從而控制螢光片中每個區域內之螢光粉被照射激發之時間，從而改變色溫。 Compared with the prior art, the fluorescent sheet of the light-emitting diode light source device of the present invention includes a plurality of regions with different phosphor powder contents, and the light-emitting diodes respectively correspond to different regions of the fluorescent film, and are adjusted by a PWM adjusting device. The lighting time of the wafer in each of the light-emitting diodes is changed, thereby controlling the time during which the phosphor powder in each region of the phosphor sheet is excited by the irradiation, thereby changing the color temperature.
另外，本領域技術人員還可在本發明精神內做其他變化，當然，這些依據本發明精神所做之變化，都應包含在本發明所要求保護之範圍之內。 In addition, those skilled in the art can make other changes in the spirit of the present invention. Of course, the changes made in accordance with the spirit of the present invention should be included in the scope of the present invention.
10‧‧‧發光二極體光源裝置 10‧‧‧Lighting diode light source device
100‧‧‧發光部 100‧‧‧Lighting Department
200‧‧‧螢光片 200‧‧‧Fluorescent film
300‧‧‧PWM調節裝置 300‧‧‧PWM adjustment device
400‧‧‧支撐桿 400‧‧‧Support rod
110‧‧‧基板 110‧‧‧Substrate
120‧‧‧發光二極體 120‧‧‧Lighting diode
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100126115A TWI448642B (en) | 2011-07-25 | 2011-07-25 | Led light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100126115A TWI448642B (en) | 2011-07-25 | 2011-07-25 | Led light source |
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| Publication Number | Publication Date |
|---|---|
| TW201305481A TW201305481A (en) | 2013-02-01 |
| TWI448642B true TWI448642B (en) | 2014-08-11 |
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| TW100126115A TWI448642B (en) | 2011-07-25 | 2011-07-25 | Led light source |
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| TWI564504B (en) * | 2015-12-30 | 2017-01-01 | 興亮電子股份有限公司 | Light source of jewelry identification illuminator |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200419256A (en) * | 2002-12-18 | 2004-10-01 | Koninkl Philips Electronics Nv | Scrolling backlight device |
| JP2005079583A (en) * | 2003-08-28 | 2005-03-24 | Genesys Photonics Inc | Broad-spectrum al(1-x-y)inygaxn light emitting diode and solid white light emitting device |
| JP2006330176A (en) * | 2005-05-24 | 2006-12-07 | Olympus Corp | Light source device |
| TWM314819U (en) * | 2006-11-24 | 2007-07-01 | Arima Optoelectronics Corp | White light LED illuminating unit capable of adjusting brightness/darkness and color temperature |
| TW200811532A (en) * | 2006-08-18 | 2008-03-01 | Hon Hai Prec Ind Co Ltd | Optical plate and backlight module using the same |
| TWM334250U (en) * | 2007-11-27 | 2008-06-11 | Ying-Ji Su | Adjustment apparatus for light-emitting diode (LED) color temperature |
| US20080266864A1 (en) * | 2007-04-30 | 2008-10-30 | Ryder Brian D | Electronic device lighting system |
| US20090086475A1 (en) * | 2007-10-01 | 2009-04-02 | Intematix Corporation | Color tunable light emitting device |
| TW201021618A (en) * | 2008-11-24 | 2010-06-01 | Young Lighting Technology Corp | Light source control device and method |
| TW201022595A (en) * | 2008-12-05 | 2010-06-16 | Foxsemicon Integrated Tech Inc | Illuminating apparatus |
| TW201033544A (en) * | 2009-03-06 | 2010-09-16 | Foxsemicon Integrated Tech Inc | Illumination device |
| CN101960211A (en) * | 2008-03-07 | 2011-01-26 | 皇家飞利浦电子股份有限公司 | Color variable light emitting device |
| TW201124662A (en) * | 2009-12-23 | 2011-07-16 | Ind Tech Res Inst | Light action element module, illumination apparatus, and illumination system |
-
2011
- 2011-07-25 TW TW100126115A patent/TWI448642B/en not_active IP Right Cessation
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200419256A (en) * | 2002-12-18 | 2004-10-01 | Koninkl Philips Electronics Nv | Scrolling backlight device |
| JP2005079583A (en) * | 2003-08-28 | 2005-03-24 | Genesys Photonics Inc | Broad-spectrum al(1-x-y)inygaxn light emitting diode and solid white light emitting device |
| JP2006330176A (en) * | 2005-05-24 | 2006-12-07 | Olympus Corp | Light source device |
| TW200811532A (en) * | 2006-08-18 | 2008-03-01 | Hon Hai Prec Ind Co Ltd | Optical plate and backlight module using the same |
| TWM314819U (en) * | 2006-11-24 | 2007-07-01 | Arima Optoelectronics Corp | White light LED illuminating unit capable of adjusting brightness/darkness and color temperature |
| US20080266864A1 (en) * | 2007-04-30 | 2008-10-30 | Ryder Brian D | Electronic device lighting system |
| US20090086475A1 (en) * | 2007-10-01 | 2009-04-02 | Intematix Corporation | Color tunable light emitting device |
| TWM334250U (en) * | 2007-11-27 | 2008-06-11 | Ying-Ji Su | Adjustment apparatus for light-emitting diode (LED) color temperature |
| CN101960211A (en) * | 2008-03-07 | 2011-01-26 | 皇家飞利浦电子股份有限公司 | Color variable light emitting device |
| TW201021618A (en) * | 2008-11-24 | 2010-06-01 | Young Lighting Technology Corp | Light source control device and method |
| TW201022595A (en) * | 2008-12-05 | 2010-06-16 | Foxsemicon Integrated Tech Inc | Illuminating apparatus |
| TW201033544A (en) * | 2009-03-06 | 2010-09-16 | Foxsemicon Integrated Tech Inc | Illumination device |
| TW201124662A (en) * | 2009-12-23 | 2011-07-16 | Ind Tech Res Inst | Light action element module, illumination apparatus, and illumination system |
Non-Patent Citations (1)
| Title |
|---|
| 突破散熱/光學瓶頸 COB封裝催生LED照明，2007/11，新電子科技雜誌，網址http://www.mem.com.tw/article_content.asp?sn=0711020007 * |
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| TW201305481A (en) | 2013-02-01 |
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