TWI446064B - Display panel - Google Patents
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- TWI446064B TWI446064B TW100123634A TW100123634A TWI446064B TW I446064 B TWI446064 B TW I446064B TW 100123634 A TW100123634 A TW 100123634A TW 100123634 A TW100123634 A TW 100123634A TW I446064 B TWI446064 B TW I446064B
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Description
本發明係關於一種顯示面板及顯示面板之母板的切割方法，尤指一種具有複數組預定切割線而可依需求在切割製程中選擇形成大尺寸顯示面板單元或小尺寸顯示面板單元之顯示面板之母板的切割方法及其製作出之顯示面板。The invention relates to a method for cutting a mother panel of a display panel and a display panel, in particular to a display panel having a plurality of predetermined cutting lines and capable of selecting a large-sized display panel unit or a small-sized display panel unit in a cutting process according to requirements. The cutting method of the mother board and the display panel thereof.
液晶顯示面板主要包括一彩色濾光基板、一陣列基板(array substrate)以及位於兩基板之間的液晶層(liquid crystal layer)。習知液晶顯示面板的製作是先以一整片的陣列基板與一整片的彩色濾光基板進行組立，並將液晶層密封於其間，進而形成具有多個顯示面板單元的液晶顯示面板的母板。之後，再對液晶顯示面板的母板進行切割(cutting)，以形成多個獨立的液晶顯示單元(display panel chip)。The liquid crystal display panel mainly comprises a color filter substrate, an array substrate and a liquid crystal layer between the two substrates. The conventional liquid crystal display panel is formed by stacking a whole array of array substrates and a whole color filter substrate, and sealing the liquid crystal layer therebetween to form a mother of a liquid crystal display panel having a plurality of display panel units. board. Thereafter, the mother board of the liquid crystal display panel is cut to form a plurality of independent liquid crystal display units (display panel chips).
考量液晶顯示器的應用廣泛而常有不同的設計。舉例而言，對於相同的42吋液晶顯示面板而言，具有窄邊框設計的液晶顯示面板之周邊區即會小於具有寬邊框設計的液晶顯示面板的周邊區。在現行技術中，液晶顯示面板的製造商必須針對具有相同顯示區尺寸但不同周邊區尺寸的液晶顯示面板開發出不同的光罩，因此生產具有相同顯示區尺寸但不同周邊區尺寸的液晶顯示面板將大幅增加製作成本。Considering the wide range of applications of liquid crystal displays, there are often different designs. For example, for the same 42-inch liquid crystal display panel, the peripheral area of the liquid crystal display panel having a narrow bezel design is smaller than the peripheral area of the liquid crystal display panel having a wide bezel design. In the prior art, manufacturers of liquid crystal display panels must develop different masks for liquid crystal display panels having the same display area size but different peripheral area sizes, thus producing liquid crystal display panels having the same display area size but different peripheral area sizes. Will greatly increase production costs.
本發明之目的之一在於提供一種顯示面板及一種顯示面板之母板的切割方法，以減少顯示面板之製作成本及應用性。One of the objects of the present invention is to provide a display panel and a method for cutting a motherboard of the display panel to reduce the manufacturing cost and applicability of the display panel.
本發明之一較佳實施例提供一種顯示面板，包括一基板、複數條訊號線、複數個第一連接墊、複數條第一連接線、複數個第二連接墊、複數條第二連接線、一對向基板、一遮光圖案與一黏著材。基板包括一顯示區與一周邊區，周邊區鄰接顯示區，且周邊區包括至少一第一連接區與至少一第二連接區。訊號線設置於基板之顯示區內。第一連接墊設置於第一連接區內。第一連接線設置於第一連接區與顯示區之間，且各第一連接線之兩端分別與對應之第一連接墊與對應之訊號線電性連接。第二連接墊設置於第二連接區內。第二連接線設置於第一連接區與第二連接區之間，且各第二連接線之兩端分別與對應之第一連接墊與對應之第二連接墊電性連接。對向基板與基板對向設置。遮光圖案設置於對向基板上，且遮光圖案於一垂直投影方向上至少部分涵蓋基板之第一連接區。黏著材設置於基板與對向基板之間並環繞顯示區。顯示介質層設置於基板及對向基板之間。A preferred embodiment of the present invention provides a display panel including a substrate, a plurality of signal lines, a plurality of first connection pads, a plurality of first connection lines, a plurality of second connection pads, and a plurality of second connection lines, A pair of substrates, a light shielding pattern and an adhesive material. The substrate includes a display area and a peripheral area, the peripheral area is adjacent to the display area, and the peripheral area includes at least one first connection area and at least one second connection area. The signal line is disposed in the display area of the substrate. The first connection pad is disposed in the first connection area. The first connecting line is disposed between the first connecting area and the display area, and the two ends of each of the first connecting lines are electrically connected to the corresponding first connecting pads and the corresponding signal lines. The second connection pad is disposed in the second connection area. The second connecting line is disposed between the first connecting area and the second connecting area, and the two ends of each of the second connecting lines are electrically connected to the corresponding first connecting pads and the corresponding second connecting pads. The opposite substrate is disposed opposite to the substrate. The light shielding pattern is disposed on the opposite substrate, and the light shielding pattern at least partially covers the first connection region of the substrate in a vertical projection direction. The adhesive material is disposed between the substrate and the opposite substrate and surrounds the display area. The display medium layer is disposed between the substrate and the opposite substrate.
本發明之另一較佳實施例提供一種顯示面板之母板的切割方法，包括下列步驟。提供一母板，其包括一基板、一與基板對向設置之對向基板，以及一位於基板與對向基板之間的顯示介質層。於母板上定義出複數條第一預定切割線與複數條第二預定切割線。第一預定切割線彼此交叉而定義出至少一第一顯示面板單元預定區，第二預定切割線彼此交叉而定義出至少一第二顯示面板單元預定區，第一顯示面板單元預定區小於第二顯示面板單元預定區，且第一顯示面板單元預定區位於第二顯示面板單元預定區之內。進行一切割製程，沿第一預定切割線與第二預定切割線之其中一者切割該母板，以形成至少一顯示面板單元。Another preferred embodiment of the present invention provides a method of cutting a motherboard of a display panel, comprising the following steps. A motherboard is provided, comprising a substrate, an opposite substrate disposed opposite the substrate, and a display medium layer between the substrate and the opposite substrate. A plurality of first predetermined cutting lines and a plurality of second predetermined cutting lines are defined on the motherboard. The first predetermined cutting lines intersect each other to define at least one first display panel unit predetermined area, and the second predetermined cutting lines intersect each other to define at least one second display panel unit predetermined area, and the first display panel unit predetermined area is smaller than the second The panel unit predetermined area is displayed, and the first display panel unit predetermined area is located within the predetermined area of the second display panel unit. A cutting process is performed to cut the motherboard along one of the first predetermined cutting line and the second predetermined cutting line to form at least one display panel unit.
本發明之切割方法於顯示面板之母板之基板上預先設置有第一連接區與第二連接區，並可視需求選擇沿第一預定切割線切割基板與對向基板以形成窄邊框(小尺寸)的第一顯示面板單元，或是選擇沿第二預定切割線切割基板與對向基板以形成寬邊框(大尺寸)的第二顯示面板單元。藉此，本發明之方法可利用相同的光罩先於顯示面板的母板上定義出具有不同規格之顯示面板單元，並於切割製程時再決定出欲形成之顯示面板單元的規格，而可大幅縮減製作成本。The cutting method of the present invention is provided with a first connection area and a second connection area on the substrate of the mother board of the display panel, and the substrate and the opposite substrate are cut along the first predetermined cutting line to form a narrow frame (small size) as needed. The first display panel unit is either a second display panel unit that cuts the substrate and the opposite substrate along the second predetermined cutting line to form a wide bezel (large size). Therefore, the method of the present invention can define display panel units having different specifications before using the same photomask on the motherboard of the display panel, and determine the specifications of the display panel unit to be formed during the cutting process. Significantly reduce production costs.
為使熟習本發明所屬技術領域之一般技藝者能更進一步了解本發明，下文特列舉本發明之較佳實施例，並配合所附圖式，詳細說明本發明的構成內容及所欲達成之功效。The present invention will be further understood by those of ordinary skill in the art to which the present invention pertains. .
請參考第1圖至第7圖。第1圖至第7圖繪示了本發明之第一較佳實施例之顯示面板之母板的切割方法的示意圖。第1圖繪示了顯示面板之母板的立體示意圖；第2圖繪示了顯示面板之母板之基板的局部上視圖，且為了突顯本發明之特徵，第2圖未繪示出對向基板；第3圖至第7圖繪示了顯示面板之母板沿第2圖之剖線A-A’繪示之剖面示意圖。如第1圖所示，首先提供一顯示面板之母板10。母板10包括一基板20、一對向基板30與一顯示介質層40。基板20與對向基板30為對向設置，而顯示介質層40係位於基板20與對向基板30之間。在本實施例中，顯示面板係選用一液晶顯示面板作為說明之用，因此基板20可為液晶顯示面板之陣列基板，對向基板30可為液晶顯示面板之彩色濾光片基板，且顯示介質層40則可為液晶層，但不以此為限。例如，基板20亦可為一彩色濾光層在陣列層(color filter on array,COA)上之基板、陣列層在彩色濾光層(array on color filter,AOC)上之基板、或是黑矩陣在陣列層(black matrix on array,BOA)上之基板。其中，液晶層的液晶材料包含負型液晶材料，即介電係數小於零、正型液晶材料，即介電系數大於零、藍相液晶材料、具有光學折射的液晶材料、可聚合的液晶材料、或其它合適的材料、或上述之組合。另外，本發明之顯示面板之母板的切割方法並不限於應用在液晶顯示面板，而亦可應用在其它各種類型之顯示面板，例如有機電致發光顯示面板、無機電致發光顯示面板(例如：電漿顯示面板、場發射顯示面板、或其它合適的面板)、電潤濕顯示面板、或電泳顯示面板、其它合適的面板、或上述至少二種面板的組合。上述顯示面板的基本架構，即基板20、對向基板30與顯示介質層40。基板20與對向基板30為對向設置，而顯示介質層40係位於基板20與對向基板30之間。其中，上述顯示面板的基板20與對向基板30其中至少一者為玻璃、石英、金屬、塑膠、矽板、陶瓷、其它合適的材料、或上述具有可撓性、或上述至少二者之組合。接著，於母板10上定義出複數條第一預定切割線C1與複數條第二預定切割線C2。第一預定切割線C1彼此交叉而定義出至少一第一顯示面板單元預定區DP1，第二預定切割線C2彼此交叉而定義出至少一第二顯示面板單元預定區DP2。此外，第一顯示面板單元預定區DP1小於第二顯示面板單元預定區DP2，且第一顯示面板單元預定區DP1位於第二顯示面板單元預定區DP2之內。換句話說，在本實施例中，第一顯示面板單元預定區DP1的面積小於第二顯示面板單元預定區DP2，而在後續切割製程中，若沿第一預定切割線C1進行切割會形成具有窄邊框設計的液晶顯示面板，而若沿第二預定切割線C2進行切割會形成具有寬邊框設計的液晶顯示面板。又或者沿著其中一條第一預定切割線C1進行及其中一條第二預定切割線C2進行切割會形成具有部份窄邊框而另一部份寬邊框的設計。Please refer to Figures 1 to 7. 1 to 7 are schematic views showing a method of cutting a mother board of a display panel according to a first preferred embodiment of the present invention. 1 is a perspective view of a motherboard of a display panel; FIG. 2 is a partial top view of a substrate of a motherboard of the display panel, and in order to highlight the features of the present invention, FIG. 2 does not show the opposite direction. The substrate; FIG. 3 to FIG. 7 are schematic cross-sectional views of the mother board of the display panel taken along line AA′ of FIG. 2 . As shown in Fig. 1, a mother board 10 of a display panel is first provided. The motherboard 10 includes a substrate 20, a pair of substrates 30, and a display medium layer 40. The substrate 20 and the opposite substrate 30 are disposed opposite to each other, and the display medium layer 40 is disposed between the substrate 20 and the opposite substrate 30. In this embodiment, the display panel selects a liquid crystal display panel for illustrative purposes. Therefore, the substrate 20 can be an array substrate of the liquid crystal display panel, and the opposite substrate 30 can be a color filter substrate of the liquid crystal display panel, and the display medium The layer 40 can be a liquid crystal layer, but is not limited thereto. For example, the substrate 20 can also be a substrate with a color filter layer on a color filter on array (COA), a substrate with an array layer on an array on color filter (AOC), or a black matrix. A substrate on a black matrix on array (BOA). Wherein, the liquid crystal material of the liquid crystal layer comprises a negative liquid crystal material, that is, a dielectric constant of less than zero, a positive liquid crystal material, that is, a dielectric constant greater than zero, a blue phase liquid crystal material, a liquid crystal material having optical refraction, a polymerizable liquid crystal material, Or other suitable materials, or a combination of the above. In addition, the cutting method of the mother board of the display panel of the present invention is not limited to application to a liquid crystal display panel, but can be applied to other various types of display panels, such as an organic electroluminescence display panel, an inorganic electroluminescence display panel (for example, : a plasma display panel, a field emission display panel, or other suitable panel), an electrowetting display panel, or an electrophoretic display panel, other suitable panels, or a combination of at least two of the above. The basic structure of the above display panel, that is, the substrate 20, the opposite substrate 30, and the display medium layer 40. The substrate 20 and the opposite substrate 30 are disposed opposite to each other, and the display medium layer 40 is disposed between the substrate 20 and the opposite substrate 30. Wherein at least one of the substrate 20 and the opposite substrate 30 of the display panel is glass, quartz, metal, plastic, enamel, ceramic, other suitable materials, or the above-mentioned flexible, or a combination of at least two of the foregoing . Next, a plurality of first predetermined cutting lines C1 and a plurality of second predetermined cutting lines C2 are defined on the mother board 10. The first predetermined cutting lines C1 intersect each other to define at least one first display panel unit predetermined area DP1, and the second predetermined cutting lines C2 cross each other to define at least one second display panel unit predetermined area DP2. Further, the first display panel unit predetermined area DP1 is smaller than the second display panel unit predetermined area DP2, and the first display panel unit predetermined area DP1 is located within the second display panel unit predetermined area DP2. In other words, in the present embodiment, the area of the first display panel unit predetermined area DP1 is smaller than the second display panel unit predetermined area DP2, and in the subsequent cutting process, if the cutting along the first predetermined cutting line C1 is formed, A liquid crystal display panel with a narrow bezel design, and if cut along the second predetermined cutting line C2, a liquid crystal display panel having a wide bezel design is formed. Alternatively, cutting along one of the first predetermined cutting lines C1 and cutting one of the second predetermined cutting lines C2 forms a design having a partial narrow bezel and another partially wide bezel.
如第2圖與第3圖所示，基板20包括一顯示區20D與一周邊區20P。周邊區20P鄰接顯示區20D，且周邊區20P包括至少一第一連接區20P1與至少一第二連接區20P2。另外，顯示面板之母板10更包括複數條訊號線21、複數個第一連接墊22、複數條第一連接線23、複數條第二連接墊24與複數個第二連接線25設置於基板20上。訊號線21設置於基板20之顯示區20D內。第一連接墊22設置於第一連接區20P1內。第一連接線23設置於第一連接區20P1與顯示區20D之間，且各第一連接線23之兩端分別與對應之第一連接墊22與對應之訊號線21電性連接。第二連接墊24設置於第二連接區21P2內。第二連接線25設置於第一連接區21P1與第二連接區21P2之間，且各第二連接線25之兩端分別與對應之第一連接墊22與對應之第二連接墊24電性連接。另外，顯示面板之母板10更包括一遮光圖案32設置於對向基板30上且於一垂直投影方向上至少部分涵蓋基板20之第一連接區20P1與第二連接區20P2之其中一者，以及一黏著材34設置於基板20與對向基板30之間並環繞基板20之顯示區20D。在本實施例中，遮光圖案32例如為一黑色矩陣圖案，且遮光圖案32在垂直投影方向上係一併涵蓋基板20之第一連接區20P1與第二連接區20P2，用以遮蔽顯示時周邊區20P的漏光，但不以此為限。於其它實施例中，遮光圖案32可以至少部份涵蓋第一連接區20P1，而不涵蓋第二連接區20P2、或者是遮光圖案32可以全部涵蓋第一連接區20P1，而不涵蓋第二連接區20P2、或者是遮光圖案32涵蓋全部的第一連接區20P1，而涵蓋至少部份的第二連接區20P2、或者是遮光圖案32涵蓋部份的第一連接區20P1與部份的第二連接區20P2。黏著材34又或者稱為框膠，用以接合基板20與對向基板30。在本實施例中，黏著材34位於訊號線21與第一連接線23之間，並橫跨第一連接線23。As shown in FIGS. 2 and 3, the substrate 20 includes a display area 20D and a peripheral area 20P. The peripheral area 20P is adjacent to the display area 20D, and the peripheral area 20P includes at least one first connection area 20P1 and at least one second connection area 20P2. In addition, the motherboard 10 of the display panel further includes a plurality of signal lines 21, a plurality of first connection pads 22, a plurality of first connection lines 23, a plurality of second connection pads 24, and a plurality of second connection lines 25 disposed on the substrate. 20 on. The signal line 21 is disposed in the display area 20D of the substrate 20. The first connection pad 22 is disposed in the first connection region 20P1. The first connecting line 23 is disposed between the first connecting area 20P1 and the display area 20D, and the two ends of the first connecting lines 23 are electrically connected to the corresponding first connecting pads 22 and the corresponding signal lines 21 respectively. The second connection pad 24 is disposed in the second connection region 21P2. The second connecting line 25 is disposed between the first connecting portion 21P1 and the second connecting portion 21P2, and the two ends of the second connecting lines 25 are electrically connected to the corresponding first connecting pads 22 and the corresponding second connecting pads 24, respectively. connection. In addition, the motherboard 10 of the display panel further includes a light shielding pattern 32 disposed on the opposite substrate 30 and at least partially covering the first connection region 20P1 and the second connection region 20P2 of the substrate 20 in a vertical projection direction. And an adhesive material 34 is disposed between the substrate 20 and the opposite substrate 30 and surrounds the display area 20D of the substrate 20. In this embodiment, the light shielding pattern 32 is, for example, a black matrix pattern, and the light shielding pattern 32 is in the vertical projection direction and covers the first connection region 20P1 and the second connection region 20P2 of the substrate 20 for shielding the periphery of the display. Light leakage in the area 20P, but not limited to this. In other embodiments, the light shielding pattern 32 may at least partially cover the first connection region 20P1 without covering the second connection region 20P2, or the light shielding pattern 32 may all cover the first connection region 20P1 without covering the second connection region. 20P2, or the light-shielding pattern 32 covers all of the first connection regions 20P1, and covers at least a portion of the second connection region 20P2, or the first connection region 20P1 and a portion of the second connection region of the portion of the light-shielding pattern 32 20P2. The adhesive material 34 is also referred to as a sealant for bonding the substrate 20 and the opposite substrate 30. In the present embodiment, the adhesive material 34 is located between the signal line 21 and the first connection line 23 and spans the first connection line 23.
在本實施例中，訊號線21可包括複數條閘極線GL與複數條資料線DL。一部分的第一連接線23(例如位於第2圖之左側的第一連接線23)係與閘極線GL電性連接，藉此後續連接於第一連接墊22或第二連接墊24的可撓性電路板(圖未示)或驅動晶片(圖未示)可經由上述第一連接線23提供閘極訊號給閘極線GL。另一部分的第一連接線23(例如位於第2圖之下側的第一連接線23)係與資料線DL電性連接，藉此後續連接於第一連接墊22或第二連接墊24的可撓性電路板(圖未示)或驅動晶片(圖未示)可經由上述第一連接線23提供資料訊號給資料線DL。此外，訊號線21、第一連接線23、第一連接墊22、第二連接線25與第二連接墊24可由相同或不同的導電層構成，而且上述各者可為單層或多層結構所構成。再者，在本實施例中，第一連接區20P1之數目等於第二連接區20P2之數目，如第2圖所示，但不以此為限。另外，在本實施例中，第一連接區20P1與第二連接區20P2係設置在位於顯示區20D之兩側的周邊區20P內，但不以此為限。舉例而言，第一連接區20P1與第二連接區20P2亦可僅設置在位於顯示區20D之一側的周邊區20P內，或是設置在位於顯示區20D之三側的周邊區20P內，或是設置在位於顯示區20D之四側的周邊區20P內。In this embodiment, the signal line 21 may include a plurality of gate lines GL and a plurality of data lines DL. A part of the first connecting line 23 (for example, the first connecting line 23 on the left side of the second figure) is electrically connected to the gate line GL, thereby being subsequently connected to the first connecting pad 22 or the second connecting pad 24 A flexible circuit board (not shown) or a driving chip (not shown) can provide a gate signal to the gate line GL via the first connection line 23 described above. Another portion of the first connection line 23 (for example, the first connection line 23 located on the lower side of FIG. 2) is electrically connected to the data line DL, thereby being subsequently connected to the first connection pad 22 or the second connection pad 24. A flexible circuit board (not shown) or a driving chip (not shown) can provide a data signal to the data line DL via the first connection line 23 described above. In addition, the signal line 21, the first connection line 23, the first connection pad 22, the second connection line 25 and the second connection pad 24 may be composed of the same or different conductive layers, and each of the above may be a single layer or a multilayer structure. Composition. Furthermore, in the present embodiment, the number of the first connection regions 20P1 is equal to the number of the second connection regions 20P2, as shown in FIG. 2, but is not limited thereto. In addition, in the present embodiment, the first connection area 20P1 and the second connection area 20P2 are disposed in the peripheral area 20P located on both sides of the display area 20D, but are not limited thereto. For example, the first connection region 20P1 and the second connection region 20P2 may also be disposed only in the peripheral region 20P on one side of the display region 20D or in the peripheral region 20P on the three sides of the display region 20D. Or it is disposed in the peripheral area 20P located on the four sides of the display area 20D.
如第3圖所示，在本實施例中，第一預定切割線C1包括複數條第一下預定切割線C11與複數條第一上預定切割線C12，第一下預定切割線C11於基板20上定義出第一顯示面板單元預定區DP1之一第一下單元預定區DP11，且第一上預定切割線C12於對向基板30上定義出第一顯示面板單元預定區DP1之一第一上單元預定區DP12。第二預定切割線C2包括複數條第二下預定切割線C21與複數條第二上預定切割線C22，第二下預定切割線C21於基板20上定義出第二顯示面板單元預定區DP2之一第二下單元預定區DP21，第二上預定切割線C22於對向基板30上定義出第二顯示面板單元預定區DP2之一第二上單元預定區DP22。在本實施例中，第一下單元預定區DP11小於第二下單元預定區DP21，且第一下單元預定區DP11位於第二下單元預定區DP21之內，以及第一上單元預定區DP12小於第二上單元預定區DP22，且第二上單元預定區DP12位於第二上單元預定區DP22之內。此外，第一上單元預定區DP12小於第一下單元預定區DP11，且第一上單元預定區DP12對應第一下單元預定區DP11且被第一下單元預定區DP11所涵蓋；第二上單元預定區DP22小於第二下單元預定區DP21，且第二上單元預定區DP22對應第二下單元預定區DP21且被第二下單元預定區DP21所涵蓋。再者，第一連接區20P1係位於第一下單元預定區DP11之內，且第二連接區20P2係位於第一下單元預定區DP11之外與第二下單元預定區DP12之內。As shown in FIG. 3, in the embodiment, the first predetermined cutting line C1 includes a plurality of first lower predetermined cutting lines C11 and a plurality of first upper predetermined cutting lines C12, and the first lower predetermined cutting line C11 is on the substrate 20. A first lower unit predetermined area DP11 of the first display panel unit predetermined area DP1 is defined, and the first upper predetermined cutting line C12 defines one of the first display panel unit predetermined areas DP1 on the opposite substrate 30. The unit is reserved for the area DP12. The second predetermined cutting line C2 includes a plurality of second lower predetermined cutting lines C21 and a plurality of second upper predetermined cutting lines C22, and the second lower predetermined cutting line C21 defines one of the second display panel unit predetermined areas DP2 on the substrate 20. The second lower unit predetermined area DP21 defines a second upper unit predetermined area DP22 of the second display panel unit predetermined area DP2 on the opposite substrate 30. In the present embodiment, the first lower unit predetermined area DP11 is smaller than the second lower unit predetermined area DP21, and the first lower unit predetermined area DP11 is located within the second lower unit predetermined area DP21, and the first upper unit predetermined area DP12 is smaller than The second upper unit predetermined area DP22, and the second upper unit predetermined area DP12 is located within the second upper unit predetermined area DP22. Further, the first upper unit predetermined area DP12 is smaller than the first lower unit predetermined area DP11, and the first upper unit predetermined area DP12 corresponds to the first lower unit predetermined area DP11 and is covered by the first lower unit predetermined area DP11; the second upper unit The predetermined area DP22 is smaller than the second lower unit predetermined area DP21, and the second upper unit predetermined area DP22 corresponds to the second lower unit predetermined area DP21 and is covered by the second lower unit predetermined area DP21. Furthermore, the first connection region 20P1 is located within the first lower cell predetermined region DP11, and the second connection region 20P2 is located outside the first lower cell predetermined region DP11 and the second lower cell predetermined region DP12.
本發明之方法可視需要選擇沿第一預定切割線C1與第二預定切割線之其中一者切割母板10，以形成至少一顯示面板單元(display panel chip)。如第4圖所示，若欲形成具有窄邊框設計的第一顯示面板單元DPC1，則進行一切割製程，沿第一預定切割線C1切割母板10。沿第一預定切割線C1切割母板10的步驟包括沿第一下預定切割線C11切割基板20，以及沿第一上預定切割線C12切割對向基板30，藉此可形成具有窄邊框設計的第一顯示面板單元DPC1。如第5圖所示，在沿第一下預定切割線C11切割基板20之後，基板20之第二連接區20P2會被切除而僅保留基板20之第一連接區20P1，且在沿第一上預定切割線C12切割對向基板30之後，對向基板30會暴露出第一連接區20P1，而遮光圖案32則會位於對向基板30之邊緣，並對應基板20之部分的周邊區20D以遮蔽漏光，且暴露出第一連接區20P1。在切割製程完成後，接著可將至少一電路板42例如一可撓性印刷電路板(FPC)設置於第一連接區20P1內且使電路板42與對應的第一連接墊22電性連接，例如利用一導電膠43將電路板42與對應的第一連接墊22電性連接。此外，第一顯示面板單元DPC1可另包括至少一驅動晶片44與電路板42電性連接，並透過電路板42與第一連接墊22電性連接，藉此可提供驅動訊號至訊號線21。在本實施例中，驅動晶片44可壓合於電路板42上，亦即驅動晶片44與電路板42可形成一覆晶薄膜(chip on film,COF)，但不以此為限。例如，驅動晶片44亦可設置於另一電路板(圖未示)，並透過此電路板與電路板42電性連接。或者是，驅動晶片44壓合於對應的第一連接墊22上並與第一連接墊22電性連接，然後，另一電路板(圖未示)再電性連接驅動晶片44，並經由驅動晶片44電性連其對應的訊號線21(例如：掃描線或資料線)。又或者，如第6圖所示，若欲形成具有寬邊框設計的第二顯示面板單元DPC2，則進行一切割製程，沿第二預定切割線C2切割母板10。沿第二預定切割線C2切割母板10的步驟包括沿第二下預定切割線C21切割基板20，以及沿第二上預定切割線C22切割對向基板30，藉此可形成具有寬邊框設計的第二顯示面板單元DPC2。另外，在形成具有寬邊框設計的第二顯示面板單元DPC2之後，若發生規格變更或基於其它因素，亦可再沿第一下預定切割線C11切割基板20，以及沿第一上預定切割線C12切割對向基板30，而形成具有窄邊框設計的第一顯示面板單元DPC1。如第7圖所示，在沿第二下預定切割線C21切割基板20之後，基板20之第一連接區20P1與第二連接區20P2會被保留，且在沿第二上預定切割線C22切割對向基板30之後，對向基板30會暴露出第二連接區20P2，而遮光圖案32則會位於對向基板30之邊緣並對應基板20之第一連接區20P1以遮蔽漏光。在切割製程完成後，接著可將至少一電路板42例如一可撓性印刷電路板設置於第二連接區20P2內且使電路板42與對應的第二連接墊24電性連接。此外，第二顯示面板單元DPC2可另包括至少一驅動晶片44與電路板42電性連接，並透過電路板42與第二連接墊24電性連接，藉此可提供驅動訊號至訊號線21。在本實施例中，驅動晶片44可壓合於電路板42上，亦即驅動晶片44與電路板42可形成一覆晶薄膜，但不以此為限。例如，驅動晶片44亦可設置於另一電路板(圖未示)，並透過此電路板與電路板42電性連接。此外，在本實施例之一變化型中，電路板42亦可設置於第二連接區20P2與第一連接區20P1內，並同時與第二連接墊24與第一連接墊22電性連接。或者是，驅動晶片44壓合於對應的第二連接墊24上並與第二連接墊24電性連接，然後，另一電路板(圖未示)再電性連接驅動晶片44，並經由驅動晶片44電性連接其對應的訊號線21(例如：掃描線或資料線)。又或者是，驅動晶片44壓合於對應的第一連接墊22上，電路板42壓合於對應的第二連接墊24上，且被驅動晶片44壓合的第一連接墊22是對應於被電路板42壓合的第二連接墊24，第二連接墊24透過第二連接線25連接第一連接墊22，然後，第一連接墊22再連接對應的第一連接線23，且電性連接至對應的訊號線21(例如：掃描線或資料線)。The method of the present invention may optionally select one of the first predetermined cutting line C1 and the second predetermined cutting line to cut the mother board 10 to form at least one display panel chip. As shown in FIG. 4, if the first display panel unit DPC1 having a narrow bezel design is to be formed, a cutting process is performed to cut the mother board 10 along the first predetermined cutting line C1. The step of cutting the mother board 10 along the first predetermined cutting line C1 includes cutting the substrate 20 along the first lower predetermined cutting line C11, and cutting the opposite substrate 30 along the first upper predetermined cutting line C12, whereby a narrow frame design can be formed. The first display panel unit DPC1. As shown in FIG. 5, after the substrate 20 is cut along the first lower predetermined cutting line C11, the second connection region 20P2 of the substrate 20 is cut away to retain only the first connection region 20P1 of the substrate 20, and along the first After the predetermined cutting line C12 cuts the opposite substrate 30, the opposite substrate 30 exposes the first connection region 20P1, and the light shielding pattern 32 is located at the edge of the opposite substrate 30, and corresponds to the peripheral region 20D of the portion of the substrate 20 to shield Light is leaked and the first connection region 20P1 is exposed. After the cutting process is completed, at least one circuit board 42 such as a flexible printed circuit board (FPC) is disposed in the first connection region 20P1 and the circuit board 42 is electrically connected to the corresponding first connection pad 22, For example, the circuit board 42 is electrically connected to the corresponding first connection pad 22 by using a conductive adhesive 43. In addition, the first display panel unit DPC1 can further include at least one driving chip 44 electrically connected to the circuit board 42 and electrically connected to the first connecting pad 22 through the circuit board 42 , thereby providing the driving signal to the signal line 21 . In this embodiment, the driving wafer 44 can be pressed onto the circuit board 42, that is, the driving chip 44 and the circuit board 42 can form a chip on film (COF), but not limited thereto. For example, the driving chip 44 can also be disposed on another circuit board (not shown) and electrically connected to the circuit board 42 through the circuit board. Alternatively, the driving wafer 44 is press-fitted onto the corresponding first connection pad 22 and electrically connected to the first connection pad 22, and then another circuit board (not shown) is electrically connected to the driving chip 44, and is driven. The wafer 44 is electrically connected to its corresponding signal line 21 (for example, a scan line or a data line). Still alternatively, as shown in Fig. 6, if a second display panel unit DPC2 having a wide bezel design is to be formed, a cutting process is performed to cut the mother board 10 along the second predetermined cutting line C2. The step of cutting the mother board 10 along the second predetermined cutting line C2 includes cutting the substrate 20 along the second lower predetermined cutting line C21, and cutting the opposite substrate 30 along the second upper predetermined cutting line C22, whereby a wide bezel design can be formed. The second display panel unit DPC2. In addition, after forming the second display panel unit DPC2 having a wide bezel design, if a specification change occurs or based on other factors, the substrate 20 may be further cut along the first lower predetermined cutting line C11, and along the first upper predetermined cutting line C12. The opposite substrate 30 is cut to form a first display panel unit DPC1 having a narrow bezel design. As shown in FIG. 7, after the substrate 20 is cut along the second lower predetermined cutting line C21, the first connection region 20P1 and the second connection region 20P2 of the substrate 20 are retained, and are cut along the second upper predetermined cutting line C22. After the opposite substrate 30, the opposite connection substrate 30 exposes the second connection region 20P2, and the light shielding pattern 32 is located at the edge of the opposite substrate 30 and corresponds to the first connection region 20P1 of the substrate 20 to shield the light leakage. After the cutting process is completed, at least one circuit board 42 such as a flexible printed circuit board can be disposed in the second connection region 20P2 and the circuit board 42 is electrically connected to the corresponding second connection pad 24. In addition, the second display panel unit DPC2 can further include at least one driving chip 44 electrically connected to the circuit board 42 and electrically connected to the second connection pad 24 through the circuit board 42 , thereby providing the driving signal to the signal line 21 . In this embodiment, the driving wafer 44 can be pressed onto the circuit board 42, that is, the driving wafer 44 and the circuit board 42 can form a flip chip, but not limited thereto. For example, the driving chip 44 can also be disposed on another circuit board (not shown) and electrically connected to the circuit board 42 through the circuit board. In addition, in a variation of the embodiment, the circuit board 42 can also be disposed in the second connection region 20P2 and the first connection region 20P1, and at the same time electrically connected to the second connection pad 24 and the first connection pad 22. Alternatively, the driving die 44 is press-fitted onto the corresponding second connection pad 24 and electrically connected to the second connection pad 24. Then, another circuit board (not shown) is electrically connected to the driving chip 44, and is driven. The wafer 44 is electrically connected to its corresponding signal line 21 (for example, a scan line or a data line). Or, the driving die 44 is pressed onto the corresponding first connecting pad 22, the circuit board 42 is pressed onto the corresponding second connecting pad 24, and the first connecting pad 22 pressed by the driving die 44 corresponds to The second connection pad 24 is pressed by the circuit board 42 and the second connection pad 24 is connected to the first connection pad 22 through the second connection line 25. Then, the first connection pad 22 is connected to the corresponding first connection line 23, and is electrically connected. Connected to the corresponding signal line 21 (for example: scan line or data line).
請再參考第7圖。如第7圖所示，在進行切割之後，本實施例之第二顯示面板單元DPC2之周邊區20P包括至少一第一連接區20P1、至少一第二連接區20P2以及至少一黏著材34。其中，第一連接區20P1內之第一連接墊22係與第二連接區20P2內之第二連接墊24電性連接，而黏著材34係設置於顯示區20D與第一連接區20P1之間。本實施例之顯示面板單元之周邊區的配置係由於顯示面板之母板在切割時選擇形成具有寬邊框設計之顯示面板單元所產生，而不論是選擇形成具有寬邊框設計之顯示面板單元或是具有窄邊框設計之顯示面板單元，顯示區均具有相同配置。Please refer to Figure 7 again. As shown in FIG. 7, after the dicing, the peripheral region 20P of the second display panel unit DPC2 of the present embodiment includes at least one first connection region 20P1, at least one second connection region 20P2, and at least one adhesive material 34. The first connection pad 22 in the first connection region 20P1 is electrically connected to the second connection pad 24 in the second connection region 20P2, and the adhesive material 34 is disposed between the display region 20D and the first connection region 20P1. . The configuration of the peripheral area of the display panel unit of the present embodiment is generated by the selection of the display panel unit having a wide bezel design when the motherboard of the display panel is selected to be formed when cutting. A display panel unit having a narrow bezel design has the same configuration in the display area.
本發明之顯示面板之母板的切割方法及顯示面板並不以上述實施例為限。下文將依序介紹本發明之其它較佳實施例之顯示面板之母板的切割方法及顯示面板，且為了便於比較各實施例之相異處並簡化說明，在下文之各實施例中使用相同的符號標注相同的元件，且主要針對各實施例之相異處進行說明，而不再對重覆部分進行贅述。The method of cutting the mother board of the display panel of the present invention and the display panel are not limited to the above embodiments. Hereinafter, the cutting method and the display panel of the mother panel of the display panel according to other preferred embodiments of the present invention will be sequentially described, and in order to facilitate the comparison of the differences of the embodiments and simplify the description, the same is used in the following embodiments. The symbols are labeled with the same elements, and are mainly described for the differences between the embodiments, and the repeated parts are not described again.
請參考第8圖與第9圖。第8圖與第9圖繪示了本發明之第二較佳實施例之顯示面板之母板的切割方法的示意圖，其中第8圖繪示了顯示面板之母板之基板的局部上視圖，且為了突顯本發明之特徵，第8圖未繪示出對向基板；第9圖繪示了顯示面板之母板沿第8圖之剖線B-B’繪示之剖面示意圖。如第8圖與第9所示，不同於第一較佳實施例，在本實施例中，顯示面板之母板50的基板20具有至少一驅動電路整合於基板上，在本實施例中是以GOA為範例，亦即基板20之周邊區20P更包括一閘極驅動電路區20G，閘極驅動電路26係整合(integrated)製作於基板20上之閘極驅動電路區20G中。也就是說，製作驅動電路各元件所需要的膜層皆是相同於要製造出顯示區的訊號線、電晶體以及畫素電極等等元件所需要的膜層。其中遮光圖案32在垂直投影方向上涵蓋閘極驅動電路區20G。於其它實施例，其它的驅動電路亦可整合於基板的任意區域，例如：源極驅動電路(未圖示)整合製作於基板20上之源極驅動電路區(未圖示)、共同電壓控制電路(未圖示)整合製作於基板20上，且共同電壓控制電路(未圖示)可選擇性的設置於閘極驅動電路區20G內或者是閘極驅動電路區20G之外的區域、時脈控制電路(未圖示)可選擇性的設置於閘極驅動電路區20G內或者是閘極驅動電路區20G之外的區域、其它合適的驅動電路、或是上述任意二種電路的整合。在本實施例中，由於作為閘極線的訊號線21不需作外部電性連接，因此不論是選擇製作窄邊框設計的顯示面板單元或是寬邊框設計的顯示面板單元，閘極驅動電路區20G皆不需暴露出來，也就是說，在設置有閘極驅動電路區20G的周邊區20P，第一預定切割線C1與第二預定切割線C2均定義於閘極驅動電路區20G的外側，且第一預定切割線C1與第二預定切割線C2可重疊。另外，作為資料線的訊號線21則必須作外部電性連接，因此第一預定切割線C1與第二預定切割線C2則可如第一較佳實施例所教導的方式定義，並視需要選擇沿第一預定切割線C1或沿第二預定切割線C2進行切割。Please refer to Figure 8 and Figure 9. 8 and 9 are schematic views showing a method of cutting a mother board of a display panel according to a second preferred embodiment of the present invention, wherein FIG. 8 is a partial top view of the substrate of the motherboard of the display panel, In order to highlight the features of the present invention, FIG. 8 does not show the opposite substrate; FIG. 9 is a cross-sectional view of the mother board of the display panel taken along line B-B' of FIG. As shown in FIG. 8 and FIG. 9, unlike the first preferred embodiment, in the embodiment, the substrate 20 of the motherboard 50 of the display panel has at least one driving circuit integrated on the substrate, which is in this embodiment. Taking the GOA as an example, that is, the peripheral region 20P of the substrate 20 further includes a gate driving circuit region 20G, and the gate driving circuit 26 is integrated into the gate driving circuit region 20G formed on the substrate 20. That is to say, the film layers required for fabricating the components of the driver circuit are the same as those required for the components of the signal lines, the transistors, and the pixel electrodes to be fabricated. The light shielding pattern 32 covers the gate driving circuit region 20G in the vertical projection direction. In other embodiments, other driving circuits may be integrated in any area of the substrate. For example, a source driving circuit (not shown) integrates a source driving circuit region (not shown) fabricated on the substrate 20, and a common voltage control. A circuit (not shown) is integrally formed on the substrate 20, and a common voltage control circuit (not shown) is selectively disposed in the gate driving circuit region 20G or in a region other than the gate driving circuit region 20G. The pulse control circuit (not shown) can be selectively disposed in the gate drive circuit region 20G or in a region other than the gate drive circuit region 20G, other suitable drive circuits, or integration of any of the above two circuits. In this embodiment, since the signal line 21 as the gate line does not need to be electrically connected externally, the gate driving circuit area is selected whether the display panel unit of the narrow bezel design or the display panel unit of the wide bezel design is selected. 20G does not need to be exposed, that is, in the peripheral region 20P provided with the gate driving circuit region 20G, the first predetermined cutting line C1 and the second predetermined cutting line C2 are both defined outside the gate driving circuit region 20G. And the first predetermined cutting line C1 and the second predetermined cutting line C2 may overlap. In addition, the signal line 21 as the data line must be electrically connected externally, so the first predetermined cutting line C1 and the second predetermined cutting line C2 can be defined as taught in the first preferred embodiment, and can be selected as needed. Cutting is performed along the first predetermined cutting line C1 or along the second predetermined cutting line C2.
請參考第10圖與第11圖。第10圖與第11圖繪示了本發明之第三較佳實施例之顯示面板之母板的切割方法的示意圖，其中第10圖繪示了顯示面板之母板之基板的局部上視圖，且為了突顯本發明之特徵，第10圖未繪示出對向基板；第11圖繪示了顯示面板之母板沿第10圖之剖線C-C’繪示之剖面示意圖。如第10圖與第11所示，在本實施例中，可於顯示面板之母板60之基板20與對向基板30之間形成另一黏著材36，黏著材36環繞顯示區20D、且位於第一連接區20P1與第二連接區20P2之間並橫跨第二連接線25。當已決定欲製作具有寬邊框設計的顯示面板單元，則為了保護暴露出之第一連接墊22，藉此，可減少暴露出之第一連接墊22因氧化或腐蝕影響第一連接線23與第二連接線25的電性表現。接著，可如第一較佳實施例所教導的方式視需要選擇沿第一預定切割線C1進行切割以形成具有窄邊框設計的顯示面板單元，或是沿第二預定切割線C2進行切割以形成具有寬邊框設計的顯示面板單元。又或者沿著其中一條第一預定切割線C1進行及其中一條第二預定切割線C2進行切割會形成具有部份窄邊框而另一部份寬邊框的設計。Please refer to Figure 10 and Figure 11. 10 and 11 are schematic views showing a cutting method of a mother board of a display panel according to a third preferred embodiment of the present invention, wherein FIG. 10 is a partial top view of the substrate of the mother board of the display panel, In order to highlight the features of the present invention, FIG. 10 does not show the opposite substrate; FIG. 11 is a cross-sectional view of the mother board of the display panel taken along line C-C' of FIG. As shown in FIG. 10 and FIG. 11, in the embodiment, another adhesive material 36 may be formed between the substrate 20 of the mother board 60 of the display panel and the opposite substrate 30, and the adhesive material 36 surrounds the display area 20D, and Located between the first connection region 20P1 and the second connection region 20P2 and spanning the second connection line 25. When it is determined that a display panel unit having a wide bezel design is to be made, in order to protect the exposed first connection pad 22, the exposed first connection pad 22 can be reduced to affect the first connection line 23 due to oxidation or corrosion. The electrical performance of the second connecting line 25. Then, the cutting along the first predetermined cutting line C1 to form the display panel unit having the narrow bezel design or the cutting along the second predetermined cutting line C2 may be selected as needed in the first preferred embodiment. A display panel unit with a wide bezel design. Alternatively, cutting along one of the first predetermined cutting lines C1 and cutting one of the second predetermined cutting lines C2 forms a design having a partial narrow bezel and another partially wide bezel.
請參考第12圖。第12圖繪示了本發明之第四較佳實施例之顯示面板之母板的切割方法的示意圖。如第12圖所示，本實施例之顯示面板之母板70之第一連接區20P1之數目大於第二連接區20P2之數目，且位於各第二連接區20P2內之第二連接墊24之數目大於位於各第一連接區20P1內之第一連接墊22之數目。在本實施例中，位於所有第一連接區20P1內之第一連接墊22的總數會等於位於所有第二連接區20P2內之第二連接墊24之總數。也就是說，依照第12圖所示，一個第二連接區20P2內之第二連接墊24會分配給至少二個第一連接區20P1內之第一連接墊22，即一個第二連接區20P2內的部份第二連接墊24會對應至二個第一連接區20P1其中一個內之第一連接墊22，而一個第二連接區20P2內的另一部份第二連接墊24會對應至二個第一連接區20P1其中另一個內之第一連接墊22。但由於第二連接區20P2係位於周邊區20P的外側而具有較大的佈線空間，因此可將第二連接區20P2的數目縮減而在各第二連接區20P2內形成較多的第二連接墊24。在此狀況下，若選擇製作寬邊框設計的第二顯示面板單元，則可依例如第一較佳實施例所述會沿第二預定切割線C2進行切割並將電路板(圖未示)連接至第二連接墊24，此時同一個驅動晶片(圖未示)可與較多的第二連接墊24電性連接，故可減少驅動晶片的數目而節省成本。另外，若選擇製作窄邊框設計的第一顯示面板單元，則可依例如第一較佳實施例會沿第一預定切割線C1進行切割並將電路板(圖未示)連接至第一連接墊22。Please refer to Figure 12. FIG. 12 is a schematic view showing a cutting method of a mother board of a display panel according to a fourth preferred embodiment of the present invention. As shown in FIG. 12, the number of the first connection regions 20P1 of the motherboard 70 of the display panel of the present embodiment is greater than the number of the second connection regions 20P2, and the second connection pads 24 located in the second connection regions 20P2. The number is greater than the number of first connection pads 22 located in each of the first connection regions 20P1. In the present embodiment, the total number of first connection pads 22 located in all of the first connection regions 20P1 will be equal to the total number of second connection pads 24 located in all of the second connection regions 20P2. That is, according to Fig. 12, the second connection pads 24 in a second connection region 20P2 are distributed to the first connection pads 22 in the at least two first connection regions 20P1, that is, a second connection region 20P2. The inner second connecting pad 24 corresponds to the first connecting pad 22 in one of the two first connecting regions 20P1, and the other second connecting pad 24 in the second connecting portion 20P2 corresponds to The first connection pads 22 in the other of the two first connection regions 20P1. However, since the second connection region 20P2 is located outside the peripheral region 20P and has a large wiring space, the number of the second connection regions 20P2 can be reduced to form more second connection pads in each of the second connection regions 20P2. twenty four. In this case, if the second display panel unit of the wide bezel design is selected, the cutting may be performed along the second predetermined cutting line C2 and the circuit board (not shown) may be connected as described in the first preferred embodiment. To the second connection pad 24, the same driving chip (not shown) can be electrically connected to the plurality of second connection pads 24, so that the number of driving chips can be reduced and the cost can be saved. In addition, if the first display panel unit of the narrow bezel design is selected, the cutting may be performed along the first predetermined cutting line C1 and the circuit board (not shown) may be connected to the first connection pad 22 according to, for example, the first preferred embodiment. .
上述實施例中的顯示介質層40，較佳地，位於黏著材34所環繞的區域之內，即顯示區20D。一般而言，顯示介質層40並不會形成於第一連接區20P1與第二連接區20P2之間，即顯示介質層40並不會形成於黏著材34之預定區及黏著材36之預定區之間。就算有顯示介質層40會於上述之第一連接區20P1與第二連接區20P2之間也是被當作殘留物，而不具備可當作顯示功能的介質層。The display medium layer 40 in the above embodiment is preferably located within the area surrounded by the adhesive material 34, that is, the display area 20D. In general, the display medium layer 40 is not formed between the first connection region 20P1 and the second connection region 20P2, that is, the display dielectric layer 40 is not formed in a predetermined region of the adhesive material 34 and a predetermined region of the adhesive material 36. between. Even if the display medium layer 40 is regarded as a residue between the first connection region 20P1 and the second connection region 20P2 described above, it does not have a dielectric layer which can serve as a display function.
綜上所述，本發明之切割方法於顯示面板之母板之基板上預先設置有第一連接區與第二連接區，並可視需求選擇沿第一預定切割線切割基板與對向基板以形成窄邊框(小尺寸)的第一顯示面板單元，或是選擇沿第二預定切割線切割基板與對向基板以形成寬邊框(大尺寸)的第二顯示面板單元。藉此，本發明之方法可利用相同的光罩先於顯示面板的母板上定義出具有不同規格之顯示面板單元，並於切割製程時再決定出欲形成之顯示面板單元的規格，而可大幅縮減製作成本。值得說明的是，本發明之切割方法並不限定於製作出兩種邊框寬度的顯示面板單元的其中一者，例如若在基板上預先定義出更多的連接區，則亦可在多種邊框寬度(例如三種邊框寬度或更多)的顯示面板單元中依需求製作出所需之顯示面板單元。再者，在同一個顯示面板的母板上並不限定於切割出多個具有相同尺寸的周邊區的顯示面板單元，例如可沿部分顯示面板單元周圍的第一預定切割線切割出具有窄邊框設計的顯示面板單元，而沿部分顯示面板單元周圍的第二預定切割線切割出具有寬邊框設計的顯示面板單元，換句話說可在同一個顯示面板的母板上切割出具有不同尺寸的周邊區的顯示面板單元。In summary, the cutting method of the present invention is provided with a first connection area and a second connection area on the substrate of the motherboard of the display panel, and the substrate and the opposite substrate are cut along the first predetermined cutting line as needed. A first display panel unit having a narrow bezel (small size) or a second display panel unit that cuts the substrate and the opposite substrate along the second predetermined cutting line to form a wide bezel (large size). Therefore, the method of the present invention can define display panel units having different specifications before using the same photomask on the motherboard of the display panel, and determine the specifications of the display panel unit to be formed during the cutting process. Significantly reduce production costs. It should be noted that the cutting method of the present invention is not limited to one of the display panel units in which two kinds of frame widths are formed. For example, if more connection areas are predefined on the substrate, the width of the plurality of frames may also be The desired display panel unit is created as needed in the display panel unit (for example, three frame widths or more). Furthermore, the mother panel on the same display panel is not limited to cutting a plurality of display panel units having peripheral regions of the same size, for example, can be cut along a first predetermined cutting line around a portion of the display panel unit to have a narrow border. a display panel unit designed to cut a display panel unit having a wide bezel design along a second predetermined cutting line around the partial display panel unit, in other words, a peripheral having a different size can be cut on the mother panel of the same display panel The display panel unit of the area.
以上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.
10．．．母板10. . . motherboard
20．．．基板20. . . Substrate
20D．．．顯示區20D. . . Display area
20P．．．周邊區20P. . . Surrounding area
20P1．．．第一連接區20P1. . . First connection area
20P2．．．第二連接區20P2. . . Second connection zone
21．．．訊號線twenty one. . . Signal line
22．．．第一連接墊twenty two. . . First connection pad
23．．．第一連接線twenty three. . . First connection line
24．．．第二連接墊twenty four. . . Second connection pad
25．．．第二連接線25. . . Second connection line
30．．．對向基板30. . . Counter substrate
32．．．遮光圖案32. . . Shading pattern
34．．．黏著材34. . . Adhesive
36．．．黏著材36. . . Adhesive
C1．．．第一預定切割線C1. . . First predetermined cutting line
C11‧‧‧第一下預定切割線C11‧‧‧First scheduled cutting line
C12‧‧‧第一上預定切割線C12‧‧‧First scheduled cutting line
C2‧‧‧第二預定切割線C2‧‧‧second scheduled cutting line
C21‧‧‧第二下預定切割線C21‧‧‧Second scheduled cutting line
C22‧‧‧第二上預定切割線C22‧‧‧Second scheduled cutting line
DP1‧‧‧第一顯示面板單元預定區DP1‧‧‧First display panel unit reservation area
DP11‧‧‧第一下單元預定區DP11‧‧‧ first unit reservation area
DP12‧‧‧第一上單元預定區DP12‧‧‧ first upper unit booking area
DP2‧‧‧第二顯示面板單元預定區DP2‧‧‧second display panel unit reservation area
DP21‧‧‧第二下單元預定區DP21‧‧‧Second Unit Reservation Area
DP22‧‧‧第二上單元預定區DP22‧‧‧Second upper unit booking area
GL‧‧‧閘極線GL‧‧‧ gate line
DL‧‧‧資料線DL‧‧‧ data line
42‧‧‧電路板42‧‧‧ boards
44‧‧‧驅動晶片44‧‧‧Drive chip
26‧‧‧閘極驅動電路26‧‧‧ gate drive circuit
20G‧‧‧閘極驅動電路區20G‧‧‧ gate drive circuit area
50‧‧‧母板50‧‧‧ Motherboard
60‧‧‧母板60‧‧‧ mother board
70‧‧‧母板70‧‧‧ Motherboard
第1圖至第7圖繪示了本發明之第一較佳實施例之顯示面板之母板的切割方法的示意圖。1 to 7 are schematic views showing a method of cutting a mother board of a display panel according to a first preferred embodiment of the present invention.
第8圖與第9圖繪示了本發明之第二較佳實施例之顯示面板之母板的切割方法的示意圖。8 and 9 are schematic views showing a method of cutting a mother board of a display panel according to a second preferred embodiment of the present invention.
第10圖與第11圖繪示了本發明之第三較佳實施例之顯示面板之母板的切割方法的示意圖。10 and 11 are schematic views showing a method of cutting a mother board of a display panel according to a third preferred embodiment of the present invention.
第12圖繪示了本發明之第四較佳實施例之顯示面板之母板的切割方法的示意圖。FIG. 12 is a schematic view showing a cutting method of a mother board of a display panel according to a fourth preferred embodiment of the present invention.
10‧‧‧母板10‧‧‧ Motherboard
20‧‧‧基板20‧‧‧Substrate
20D‧‧‧顯示區20D‧‧‧ display area
20P‧‧‧周邊區20P‧‧‧ surrounding area
20P1‧‧‧第一連接區20P1‧‧‧ first connection area
20P2‧‧‧第二連接區20P2‧‧‧Second connection area
21‧‧‧訊號線21‧‧‧ Signal Line
22‧‧‧第一連接墊22‧‧‧First connection pad
23‧‧‧第一連接線23‧‧‧First connection line
24‧‧‧第二連接墊24‧‧‧Second connection pad
25‧‧‧第二連接線25‧‧‧second cable
34‧‧‧黏著材34‧‧‧Adhesive
C1‧‧‧第一預定切割線C1‧‧‧first scheduled cutting line
C11‧‧‧第一下預定切割線C11‧‧‧First scheduled cutting line
C12‧‧‧第一上預定切割線C12‧‧‧First scheduled cutting line
C2‧‧‧第二預定切割線C2‧‧‧second scheduled cutting line
C21‧‧‧第二下預定切割線C21‧‧‧Second scheduled cutting line
C22‧‧‧第二上預定切割線C22‧‧‧Second scheduled cutting line
GL‧‧‧閘極線GL‧‧‧ gate line
DL‧‧‧資料線DL‧‧‧ data line
Claims (10)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100123634A TWI446064B (en) | 2011-07-05 | 2011-07-05 | Display panel |
| CN 201110271363 CN102346321B (en) | 2011-07-05 | 2011-09-06 | Display panel and cutting method of mother board of display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100123634A TWI446064B (en) | 2011-07-05 | 2011-07-05 | Display panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201303428A TW201303428A (en) | 2013-01-16 |
| TWI446064B true TWI446064B (en) | 2014-07-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100123634A TWI446064B (en) | 2011-07-05 | 2011-07-05 | Display panel |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102346321B (en) |
| TW (1) | TWI446064B (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103439816A (en) * | 2013-09-05 | 2013-12-11 | 深圳市华星光电技术有限公司 | Display panel mother set, display panel made from display panel mother set and processing method of display panel |
| CN105573541A (en) * | 2014-11-06 | 2016-05-11 | 深圳莱宝高科技股份有限公司 | Panel structure, structure unit and fabrication methods therefor |
| CN105630221A (en) * | 2014-11-06 | 2016-06-01 | 深圳莱宝高科技股份有限公司 | Panel structure, panel unit and manufacturing methods of panel structure and panel unit |
| CN105529338A (en) * | 2016-02-06 | 2016-04-27 | 京东方科技集团股份有限公司 | Array base plate, COF, display panel and display device |
| CN106773388A (en) * | 2016-12-30 | 2017-05-31 | 深圳市华星光电技术有限公司 | The display panel of compatible various frame sizes and the lighting test method of display panel |
| US10600998B2 (en) | 2017-11-14 | 2020-03-24 | Boe Technology Group Co., Ltd. | Display apparatus and method of manufacturing thereof |
| CN109782938B (en) * | 2017-11-14 | 2021-01-15 | 京东方科技集团股份有限公司 | Display device manufacturing method and display device |
| CN108037624A (en) | 2017-12-28 | 2018-05-15 | 惠州市华星光电技术有限公司 | Display |
| CN109061964B (en) * | 2018-10-31 | 2021-10-01 | 上海天马微电子有限公司 | Display device and method thereof |
| CN111162113B (en) * | 2020-02-28 | 2022-11-15 | 武汉天马微电子有限公司 | Display panel and manufacturing method thereof |
| CN113934030B (en) * | 2020-06-29 | 2023-01-24 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and display device |
| CN114822274B (en) * | 2022-05-07 | 2023-12-19 | 深圳雷曼光电科技股份有限公司 | Display screen unit box, display unit and spliced display screen with changeable specification |
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| JP4881678B2 (en) * | 2006-09-04 | 2012-02-22 | 株式会社 日立ディスプレイズ | Liquid crystal display |
| JP5010907B2 (en) * | 2006-12-20 | 2012-08-29 | エルジー ディスプレイ カンパニー リミテッド | Display device |
| CN102074503B (en) * | 2010-10-19 | 2013-09-25 | 友达光电股份有限公司 | Array substrate of display panel and patching method thereof |
-
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Also Published As
| Publication number | Publication date |
|---|---|
| CN102346321A (en) | 2012-02-08 |
| TW201303428A (en) | 2013-01-16 |
| CN102346321B (en) | 2013-08-14 |
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