TWI444690B - Wafer level lens module and array thereof - Google Patents
Wafer level lens module and array thereof Download PDFInfo
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- TWI444690B TWI444690B TW97147325A TW97147325A TWI444690B TW I444690 B TWI444690 B TW I444690B TW 97147325 A TW97147325 A TW 97147325A TW 97147325 A TW97147325 A TW 97147325A TW I444690 B TWI444690 B TW I444690B
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Description
本發明涉及一種鏡頭模組，尤其涉及一種晶圓級(wafer level)鏡頭模組陣列。 The invention relates to a lens module, in particular to a wafer level lens module array.
常用鏡頭模組之變焦功能通常藉由採用驅動器來實現的。傳統之驅動器包括步進馬達等。對於採用此種傳統驅動器之鏡頭模組，其通常需要藉由設置複數傳動機構如兩至三個齒輪傳動機構，來將步進馬達之旋轉運動轉換成線性運動。 The zoom function of a common lens module is usually achieved by using a driver. Conventional drives include stepper motors and the like. For a lens module employing such a conventional actuator, it is generally required to convert a rotary motion of the stepping motor into a linear motion by providing a plurality of transmission mechanisms such as two to three gear transmission mechanisms.
隨著攝像技術之發展，鏡頭模組與各種便攜式電子裝置如行動電話、攝像機、電腦等之結合，更是得到眾多消費者之青睞，所以市場對小型化鏡頭模組之需求增加。 With the development of camera technology, the combination of lens modules and various portable electronic devices such as mobile phones, video cameras, computers, etc., has been favored by many consumers, so the market demand for miniaturized lens modules has increased.
惟，目前小型化鏡頭模組多採用晶圓級鏡片，其一般利用精密模具製造出微型鏡片陣列，然後與矽晶圓製成之影像感測器電連接、封裝，然後切割，得到的每一小單元均為一個晶圓級相機模組。雖然每個晶圓級鏡片之尺寸非常小，適用於一些便攜式電子裝置，但因為傳統之驅動器不能適用於晶圓級鏡頭模組，因此這樣之鏡頭模組之焦距無法調節，因此其成像效果一般，不能滿足消費者之拍照需求。 However, at present, the miniaturized lens module mostly uses a wafer-level lens, which generally uses a precision mold to manufacture a micro lens array, and then electrically connects, packages, and then cuts the image sensor made of the silicon wafer, and obtains each. The small units are all wafer level camera modules. Although each wafer level lens is very small in size and suitable for some portable electronic devices, since the conventional driver cannot be applied to the wafer level lens module, the focal length of such a lens module cannot be adjusted, so the imaging effect is generally Can not meet the needs of consumers for photography.
有鑒於此，有必要提供一種兼有體積小和可變焦功能之晶圓級鏡 頭模組陣列。 In view of this, it is necessary to provide a wafer level mirror that combines small size and zoom function. Head module array.
一種晶圓級鏡頭模組陣列，其包括疊置之第一鏡片陣列、第二鏡片陣列，該第一鏡片陣列包括複數第一鏡片，該第二鏡片陣列包括複數第二鏡片，一個第一鏡片對應一個第二鏡片，且該第一鏡片和該第二鏡片之光軸重合，該晶圓級鏡頭模組陣列還包括一電致變形層，該電致變形層夾設於該第一鏡片陣列與該第二鏡片陣列之間，該電致變形層具有複數通孔，每一通孔之中心軸和一個第一鏡片之光軸、第二鏡片之光軸重合，該電致變形層具有平行該第一鏡片陣列和第二鏡片陣列光軸之變形方向，該電致變形層用來調整該第一鏡片陣列和該第二鏡片陣列之間距，該電致變形層由人工肌肉材料製成。 A wafer level lens module array comprising a stacked first lens array and a second lens array, the first lens array comprising a plurality of first lenses, the second lens array comprising a plurality of second lenses, a first lens Corresponding to a second lens, and the optical axes of the first lens and the second lens are coincident, the wafer level lens module array further includes an electro-deformation layer, the electro-deformation layer being sandwiched between the first lens array Between the second lens array and the second lens array, the electro-deformation layer has a plurality of through holes, and a central axis of each of the through holes coincides with an optical axis of the first lens and an optical axis of the second lens, and the electro-deformation layer has a parallel Deformation directions of the optical axes of the first lens array and the second lens array, the electro-deformation layer is used to adjust the distance between the first lens array and the second lens array, the electro-deformation layer being made of artificial muscle material.
與先前技術相比，本發明提供之晶圓級鏡頭模組及其陣列之鏡片間夾設有電致變形層，該電致變形層加電壓後發生平行光軸方向之形變，使得與之上下連接之鏡片或鏡片陣列之位置發生移動，從而改變晶圓級鏡頭模組之焦距，本發明提供之晶圓級鏡頭模組兼有體積小、可變焦兩個特點，且結構簡單。 Compared with the prior art, the wafer level lens module and the array of the lens provided by the invention are provided with an electro-deformation layer, and the electro-deformation layer is deformed by a parallel optical axis direction after applying a voltage, so that the upper and lower sides are deformed. The position of the connected lens or lens array is moved to change the focal length of the wafer level lens module. The wafer level lens module provided by the invention has the characteristics of small size and zoomability, and has a simple structure.
10‧‧‧鏡頭模組 10‧‧‧Lens module
21、410‧‧‧第一鏡片 21, 410‧‧‧ first lens
22‧‧‧第二鏡片 22‧‧‧second lens
30、42‧‧‧電致變形層 30, 42‧‧‧Electromorphic layer
210、220‧‧‧光學部 210, 220‧‧‧Optical Department
211‧‧‧第一支撐部 211‧‧‧First support
221‧‧‧第二支撐部 221‧‧‧second support
31‧‧‧通孔 31‧‧‧through hole
301‧‧‧第一面 301‧‧‧ first side
302‧‧‧第二面 302‧‧‧ second side
40‧‧‧晶圓級鏡頭模組 40‧‧‧ Wafer-level lens module
41‧‧‧第一鏡片陣列 41‧‧‧First lens array
43‧‧‧第二鏡片陣列 43‧‧‧Second lens array
圖1係本發明第一實施例提供之晶圓級鏡頭模組之結構示意圖。 1 is a schematic structural view of a wafer level lens module according to a first embodiment of the present invention.
圖2係本發明第一實施例提供之晶圓級鏡頭模組之電致變形層加電壓之後之變化示意圖。 FIG. 2 is a schematic diagram showing changes after the voltage is applied to the electrodeposited layer of the wafer level lens module according to the first embodiment of the present invention.
圖3係本發明第二實施例提供之晶圓級鏡頭模組陣列之結構示意圖。 3 is a schematic structural view of a wafer level lens module array according to a second embodiment of the present invention.
下面將結合附圖對本發明作進一步詳細說明。 The invention will now be described in further detail with reference to the accompanying drawings.
請參閱圖1，本發明第一實施例提供之晶圓級鏡頭模組10包括第一鏡片21和第二鏡片22以及夾設於該第一鏡片21和該第二鏡片22之間之電致變形層30。 Referring to FIG. 1 , a wafer level lens module 10 according to a first embodiment of the present invention includes a first lens 21 and a second lens 22 , and an electrolysis between the first lens 21 and the second lens 22 . Deformed layer 30.
第一鏡片21和第二鏡片22係晶圓級鏡片。第一鏡片21具有光學部210和圍繞該光學部210之第一支撐部211。第二鏡片22具有光學部220和圍繞該光學部220之第二支撐部221。 The first lens 21 and the second lens 22 are wafer level lenses. The first lens 21 has an optical portion 210 and a first support portion 211 surrounding the optical portion 210. The second lens 22 has an optical portion 220 and a second support portion 221 surrounding the optical portion 220.
電致變形層30由人工肌肉材料製成，特別地，於下述材料中選擇其一製成：鐵電聚合物(ferroelectric polymers)或電介彈性體(dielectric elastomers)。人工肌肉材料之特點係通電後會產生可預期之變形，且該變形可恢復可重複、回應時間短，比壓電陶瓷(piezoceramics)材料之張力(strain)大。 The electromorphic layer 30 is made of an artificial muscle material, and in particular, one of the following materials is selected: ferroelectric polymers or dielectric elastomers. The characteristic of artificial muscle material is that it can produce a predictable deformation after being energized, and the deformation can be restored and repeatable, the response time is short, and the strain is larger than that of the piezoceramics material.
該電致變形層30中央設通孔31，以使經過第一鏡片21之光線能夠到達第二鏡片22。 A through hole 31 is provided in the center of the electrodeformed layer 30 so that light passing through the first lens 21 can reach the second lens 22.
第一鏡片21、電致變形層30和第二鏡片22之中心軸重合。 The central axes of the first lens 21, the electro-deformation layer 30, and the second lens 22 coincide.
電致變形層30具有相對之第一面301和第二面302，第一面301和第一支撐部211貼合，第二面302和該第二支撐部221貼合。第一面301和第二面302相互平行且垂直於鏡頭模組10之光軸。電致變形層30之第一面301和第二面302分別接電源(圖未示)之正負極。 The electro-deformation layer 30 has a first surface 301 and a second surface 302 opposite thereto. The first surface 301 and the first support portion 211 are attached, and the second surface 302 and the second support portion 221 are attached. The first face 301 and the second face 302 are parallel to each other and perpendicular to the optical axis of the lens module 10. The first surface 301 and the second surface 302 of the electro-deformation layer 30 are respectively connected to the positive and negative electrodes of a power source (not shown).
電致變形層30本身設有正負電極，將正負電極和外部電路連接，該外部電路寫有控制程式，該控制程式將根據鏡頭模組成像之清晰與否增加或減小施加於該電致變形層30上之電壓，從而實現自 動變焦。 The electro-deformation layer 30 itself is provided with positive and negative electrodes, and the positive and negative electrodes are connected to an external circuit. The external circuit is written with a control program, and the control program will increase or decrease the imaging deformation according to the lens module applied to the electro-deformation. The voltage on layer 30, thereby achieving Zoom in.
該電致變形層30所採用之材料於光軸方向施加電壓後所產生之變形發生於光軸方向，即電致變形層30之厚度增加或減小。 The deformation of the material used in the electro-deformation layer 30 after applying a voltage in the optical axis direction occurs in the optical axis direction, that is, the thickness of the electro-deformation layer 30 is increased or decreased.
可理解，電致變形層30之結構不限於本實施例所示，尤其是當上下鏡片之支撐部之結構是斜面、具有多層台階時，電致變形層30之結構要與上下鏡片之支撐部相配合，以使鏡片之間距於各處之位移相同，不會出現偏心。 It can be understood that the structure of the electro-deformation layer 30 is not limited to the embodiment, especially when the structure of the support portion of the upper and lower lenses is a sloped surface and has a plurality of steps, the structure of the electro-deformation layer 30 and the support portion of the upper and lower lenses are Matching so that the displacement between the lenses is the same everywhere, there will be no eccentricity.
請參閱圖2，向電致變形層30施加電壓前，鏡頭焦點於A點，向電致變形層30施加電壓後，電致變形層厚度變薄，第一鏡片21、第二鏡片22間距縮短，鏡頭焦點於B點，切斷電源後焦點回到A點。 Referring to FIG. 2, before applying a voltage to the electro-deformation layer 30, the lens focus is at point A, and after applying a voltage to the electro-deformation layer 30, the thickness of the electro-deformation layer is thinned, and the pitch of the first lens 21 and the second lens 22 is shortened. The focus of the lens is at point B. After the power is turned off, the focus returns to point A.
請參閱圖3，本發明第二實施例提供之晶圓級鏡頭模組40包括疊置之第一鏡片陣列41、電致變形層42和第二鏡片陣列43。電致變形層42夾設於該第一鏡片陣列41與該第二鏡片陣列43之間。 Referring to FIG. 3, a wafer level lens module 40 according to a second embodiment of the present invention includes a first lens array 41, an electro-deformation layer 42, and a second lens array 43 stacked. The electro-deformation layer 42 is interposed between the first lens array 41 and the second lens array 43.
該第一鏡片陣列41包括複數第一鏡片410，該第二鏡片陣列43包括複數第二鏡片(圖未示)，一第一鏡片410對應一第二鏡片，且該第一鏡片410和該第二鏡片之光軸重合，該電致變形層42夾設於該第一鏡片陣列41與該第二鏡片陣列43之間，該電致變形層42具有複數通孔，每一通孔之中心軸和一第一鏡片410之光軸、第二鏡片之光軸重合。 The first lens array 41 includes a plurality of first lenses 410, the second lens array 43 includes a plurality of second lenses (not shown), a first lens 410 corresponds to a second lens, and the first lens 410 and the first lens 410 The optical axes of the two lenses are overlapped. The electro-deformation layer 42 is interposed between the first lens array 41 and the second lens array 43. The electro-deformation layer 42 has a plurality of through holes, and a central axis of each of the through holes The optical axis of the first lens 410 and the optical axis of the second lens coincide.
於製造時，首先製造出第一鏡片陣列41及第二鏡片陣列43，然後將已經加工好之薄片狀之電致變形層42置於第一鏡片陣列41和第二鏡片陣列43之間，並使得鏡片光軸和電致變形層42之通孔中心軸重合，然後與矽晶圓製成之影像感測器壓合封裝，最後切割成 晶圓級相機模組。 At the time of manufacture, the first lens array 41 and the second lens array 43 are first fabricated, and then the processed sheet-like electromorphic layer 42 is placed between the first lens array 41 and the second lens array 43 and The optical axis of the lens and the central axis of the through hole of the electromorphic layer 42 are coincident, and then the image sensor made of the silicon wafer is pressed and packaged, and finally cut into Wafer level camera module.
電致變形層42由人工肌肉材料製成，特別地，於下述材料中選擇其一製成：鐵電聚合物或電介彈性體。 The electromorphic layer 42 is made of an artificial muscle material, and in particular, one of the following materials is selected: a ferroelectric polymer or a dielectric elastomer.
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
10‧‧‧鏡頭模組 10‧‧‧Lens module
21‧‧‧第一鏡片 21‧‧‧ first lens
22‧‧‧第二鏡片 22‧‧‧second lens
30‧‧‧電致變形層 30‧‧‧Electromorphic layer
210、220‧‧‧光學部 210, 220‧‧‧Optical Department
211‧‧‧第一支撐部 211‧‧‧First support
221‧‧‧第二支撐部 221‧‧‧second support
31‧‧‧通孔 31‧‧‧through hole
301‧‧‧第一面 301‧‧‧ first side
302‧‧‧第二面 302‧‧‧ second side
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| TW97147325A TWI444690B (en) | 2008-12-05 | 2008-12-05 | Wafer level lens module and array thereof |
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| TW97147325A TWI444690B (en) | 2008-12-05 | 2008-12-05 | Wafer level lens module and array thereof |
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| TW201022757A TW201022757A (en) | 2010-06-16 |
| TWI444690B true TWI444690B (en) | 2014-07-11 |
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