TWI440730B - An evaporation method by using a pattern mask supported byan electrostatic chuck and an evaporation apparatus thereof - Google Patents

Description

一種使用靜電板承載一金屬網板而進行蒸鍍的方法及其裝置Method and device for performing vapor deposition using electrostatic plate to carry a metal mesh plate

本發明係關於一種蒸鍍方法及其裝置，尤其涉及一種使用一靜電板承載一金屬網板來進行蒸鍍的方法及其裝置。The present invention relates to an evaporation method and apparatus thereof, and more particularly to a method and apparatus for performing vapor deposition using an electrostatic plate to carry a metal mesh plate.

有機發光二極體或有機電致發光顯示器，係屬於不需要背光之低耗電、輕薄型的顯示裝置，因此被廣泛地應用。一般來說，通常係藉由蒸鍍用金屬遮罩(以下簡稱為金屬遮罩)遮於基板中間表面上，來進行蒸鍍。這時候，金屬遮罩與基板的位置必須相當準確且在蒸鍍過程中不產生偏離。又，由於電致發光元件係採用陽極層與陰極層來夾住發光層，而使發光層受電激而發光，因此蒸鍍後所形成的發光層中，每一個畫素區的位置配置必須相當精準。是以，高精度的對位對於高顯示畫面的需求，佔有決定性的因子。再者，隨著顯示器大型化或者使用大型基板一次製作複數個小型顯示器的量產化等趨勢日益漸增，金屬遮罩也不可避免地亦須滿足高精細度的要求。An organic light-emitting diode or an organic electroluminescence display is a low-power, thin-light display device that does not require a backlight, and thus is widely used. In general, vapor deposition is usually performed by masking a metal mask for vapor deposition (hereinafter simply referred to as a metal mask) on the intermediate surface of the substrate. At this time, the position of the metal mask and the substrate must be quite accurate and there is no deviation during the evaporation process. Further, since the electroluminescent device uses the anode layer and the cathode layer to sandwich the light-emitting layer, and the light-emitting layer is excited by light, the position of each pixel region in the light-emitting layer formed after vapor deposition must be equivalent. Precision. Therefore, the high-precision alignment has a decisive factor for the demand for high display screens. Furthermore, as the size of the display increases or the mass production of a plurality of small displays is performed at a time using a large substrate, the metal mask is inevitably required to meet the high definition requirements.

傳統上，金屬遮罩係指固定在金屬框架上的金屬網板。於進行蒸鍍製程時，會先將金屬遮罩與基板進行對位。一般來說，金屬遮罩與基板的對位，係在與顯示區無關的端部區域標記至少一對位標記，以進行對位，便於後續進行蒸鍍。然，由於顯示器逐漸大型化的關係，所使用的金屬網板因自重而其中心部份自然下垂的情況越來嚴重，如第五圖所示。此時，即使金屬遮罩本身具有高精細度且也進行高精度對位，一旦發生自重下垂現象，不僅增加了對位的難度，而且金屬遮罩與基板之間無法完全密接，蒸鍍材料便無法精準地穿透過此等微細開孔而形成於基板上，進而影響蒸鍍結果。又，對此情況，倘若在基板的背側以例如永久磁鐵等強磁性的元件，使金屬遮罩受磁性吸引且完全密接於基板上，又可能因為金屬網板並非在相當平坦的情況下而受磁性吸引，因此即便是利用磁性吸引而使其完全密接，也可能會導致金屬薄板彎曲或者是Traditionally, metal masks refer to metal mesh panels that are fixed to a metal frame. When the vapor deposition process is performed, the metal mask is first aligned with the substrate. Generally, the alignment of the metal mask with the substrate marks at least one pair of mark marks in the end regions unrelated to the display area for alignment, so as to facilitate subsequent vapor deposition. However, due to the gradual enlargement of the display, the metal stencil used has a natural drooping of the center portion due to its own weight, as shown in the fifth figure. At this time, even if the metal mask itself has high definition and high-precision alignment, once the self-weight sagging phenomenon occurs, not only the difficulty of the alignment is increased, but also the metal mask and the substrate cannot be completely adhered, and the evaporation material is formed. It is impossible to accurately penetrate these fine openings and form on the substrate, thereby affecting the vapor deposition result. Moreover, in this case, if the metal mask is magnetically attracted and completely adhered to the substrate by a ferromagnetic element such as a permanent magnet on the back side of the substrate, the metal mesh may not be relatively flat. Magnetically attracted, so even if it is completely adhered by magnetic attraction, it may cause the metal sheet to bend or

此，該如何提高金屬遮罩之對位精準度及蒸鍍精準度，實為本領域者亟欲解決的問題。Therefore, how to improve the alignment accuracy and vapor deposition precision of the metal mask is a problem that the field is eager to solve.

本發明提供一種使用一靜電板承載一金屬網板的蒸鍍方法及其蒸鍍裝置，其能提高金屬網板與基板的對位精準度，縮短對位時間。The invention provides an evaporation method and an evaporation device for carrying a metal mesh plate by using an electrostatic plate, which can improve the alignment precision of the metal mesh plate and the substrate, and shorten the alignment time.

在本發明之一實施例中，首先，於靜電板之支撐面上配置一金屬網板。開啟靜電板，使靜電板的支撐面上產生靜電以吸住金屬網板。接著，將靜電板及其上的金屬網板一起搬運到蒸鍍室內的一個預定位置，以使該金屬網板位於一被蒸鍍對象的下表面下方及一蒸鍍材料的上方。其中蒸鍍室具有一磁性吸附裝置，且磁性吸附裝置位於被蒸鍍對象的上表面上方。進行對位步驟，以調整被蒸鍍對象與金屬網板之相對位置。隨後，開啟蒸鍍室內所設置的磁性吸附裝置，使磁性吸附裝置產生磁性，以將金屬網板吸附於被蒸鍍對象之下表面。於金屬網板吸附於被蒸鍍對象之後，將靜電板運送離開該預定位置。最後，進行蒸鍍步驟，使蒸鍍材料蒸鍍於被蒸鍍對象的下表面上。In an embodiment of the invention, first, a metal mesh plate is disposed on the support surface of the electrostatic board. Turn on the static board to generate static electricity on the support surface of the static board to attract the metal mesh. Next, the electrostatic board and the metal mesh plate thereon are transported together to a predetermined position in the vapor deposition chamber such that the metal mesh plate is positioned below a lower surface of the object to be vapor-deposited and above a vapor deposition material. The vapor deposition chamber has a magnetic adsorption device, and the magnetic adsorption device is located above the upper surface of the object to be vapor deposited. The alignment step is performed to adjust the relative position of the object to be vapor deposited and the metal mesh. Subsequently, the magnetic adsorption device provided in the evaporation chamber is turned on to magnetically cause the magnetic adsorption device to adsorb the metal mesh plate to the lower surface of the object to be vapor-deposited. After the metal mesh is adsorbed to the object to be vapor-deposited, the electrostatic plate is transported away from the predetermined position. Finally, a vapor deposition step is performed to deposit a vapor deposition material on the lower surface of the object to be vapor deposited.

在本發明之一實施例中，蒸鍍裝置包含有蒸鍍室與運送機構。蒸鍍室內部具有蒸鍍材料、用於承載一被蒸鍍對象之一承載裝置及一磁性吸附裝置，磁性吸附裝置係位於承載裝置所承載的被蒸鍍對象的上表面的上方。運送機構具有用於承載一金屬網板的一靜電板，且運送機構被配置成可將靜電板及其上的金屬網板運送至蒸鍍室中的一預定位置及運送離開此預定位置，其中預定位置位於承載裝置所承載的被蒸鍍對象的下表面的下方及蒸鍍材料的上方。其中，蒸鍍裝置更包含有一電腦控制裝置，且電腦控制裝置係被配置成能分別控制蒸鍍室之蒸鍍步驟的進行、磁性吸附裝置之開閉以及控制運送機構運送靜電板與金屬網板等作業。In an embodiment of the invention, the vapor deposition apparatus includes a vapor deposition chamber and a transport mechanism. The interior of the vapor deposition chamber has a vapor deposition material for carrying a carrier device for vapor deposition and a magnetic adsorption device, and the magnetic adsorption device is located above the upper surface of the object to be vapor deposited carried by the carrier device. The transport mechanism has an electrostatic plate for carrying a metal mesh plate, and the transport mechanism is configured to transport the electrostatic plate and the metal mesh plate thereon to a predetermined position in the vapor deposition chamber and to be transported away from the predetermined position, wherein The predetermined position is located below the lower surface of the object to be vapor deposited carried by the carrier and above the vapor deposition material. The vapor deposition device further includes a computer control device, and the computer control device is configured to separately control the evaporation step of the vapor deposition chamber, open and close the magnetic adsorption device, and control the transport mechanism to transport the electrostatic plate and the metal mesh plate. operation.

在本發明之另一實施例中，被蒸鍍對象亦可以藉由一組合式吸附裝置中的靜電吸附單元而吸附固定於蒸鍍室內。也就是說，蒸鍍室內可以設置有一組合式吸附裝置，組合式吸附裝置包含靜電吸附單元以及與靜電吸附單元組裝在一起的磁性吸附單元。靜電吸附單元係設置於磁性吸附單元之一面上，且靜電吸附單元受電能啟動而使其表面產生靜電，以靜電吸附被蒸鍍對象。而磁性吸附單元與前一實施例之磁性吸附裝置相同，係設置於靜電吸附單元一面上，磁性吸附單元可受電能啟動，而產生磁性，用以將金屬網板吸附於被蒸鍍對象上。In another embodiment of the present invention, the object to be vapor-deposited may be adsorbed and fixed in the vapor deposition chamber by an electrostatic adsorption unit in a combined adsorption device. That is to say, a combined adsorption device may be disposed in the evaporation chamber, and the combined adsorption device includes an electrostatic adsorption unit and a magnetic adsorption unit assembled with the electrostatic adsorption unit. The electrostatic adsorption unit is disposed on one surface of the magnetic adsorption unit, and the electrostatic adsorption unit is activated by electric energy to generate static electricity on the surface thereof to electrostatically adsorb the object to be vapor deposited. The magnetic adsorption unit is the same as the magnetic adsorption unit of the previous embodiment, and is disposed on one side of the electrostatic adsorption unit. The magnetic adsorption unit can be activated by electric energy to generate magnetism for adsorbing the metal mesh plate on the object to be vapor deposited.

因此，在本發明中，藉由靜電板之靜電吸引作用以及磁性吸附裝置的磁性吸引作用，使得金屬網板能在平坦且不彎曲的情況下，吸附於被蒸鍍對象的蒸鍍面上，以進行後續的蒸鍍作業。如此一來，不僅可縮短對位時間，大幅提高對位精準度以及蒸鍍精度，更可避免任何外力造成相對偏移的問題。Therefore, in the present invention, by the electrostatic attraction of the electrostatic plate and the magnetic attraction of the magnetic adsorption device, the metal mesh can be adsorbed on the vapor deposition surface of the object to be vapor-deposited without being bent flat. For subsequent vapor deposition operations. In this way, not only can the alignment time be shortened, the alignment accuracy and the vapor deposition precision can be greatly improved, and the problem of relative offset caused by any external force can be avoided.

至於本發明的其它發明內容與更詳細的技術及功能說明，將揭露於隨後的說明。Other inventive aspects and more detailed technical and functional descriptions of the present invention are disclosed in the following description.

第一圖，為本發明之一實施例中，在金屬網板上配置靜電板之剖面結構示意圖。第二圖，為本發明之一實施例中，靜電板吸附固定於金屬網板上之剖面結構示意圖。第三A圖至第三D圖，為本發明之第一實施例中，將金屬網板運送至蒸鍍室內並且進行蒸鍍的流程結構示意圖。蒸鍍製程係在真空環境下所進行。請先參照第三A圖，蒸鍍裝置包含蒸鍍室201、基板202、磁性吸附裝置204、運送機構(為繪示)以及對位機構(未繪示)。其中，運送機構具有可用於承載一金屬網板102的一靜電板104，如第一圖所示，且運送機構被配置成可以將靜電板104及其上的金屬網板102移送至所需的預定位置。需注意的是，上述之運送機構雖然未繪示於圖示中，但此運送機構為具有通常知識者可自行變化設計之機構，故不在此加以贅述。The first figure is a schematic cross-sectional view of an electrostatic board disposed on a metal mesh panel in an embodiment of the present invention. The second figure is a schematic cross-sectional view of an electrostatic plate adsorbed and fixed on a metal mesh plate according to an embodiment of the present invention. 3A to 3D are schematic structural views showing a flow of transporting a metal mesh plate into an evaporation chamber and performing vapor deposition in the first embodiment of the present invention. The evaporation process is carried out under vacuum. Referring to FIG. 3A first, the vapor deposition apparatus includes a vapor deposition chamber 201, a substrate 202, a magnetic adsorption device 204, a transport mechanism (shown), and a registration mechanism (not shown). Wherein, the transport mechanism has an electrostatic plate 104 that can be used to carry a metal mesh panel 102, as shown in the first figure, and the transport mechanism is configured to transfer the electrostatic plate 104 and the metal mesh plate 102 thereon to a desired Pre-determined location. It should be noted that although the above-mentioned transport mechanism is not shown in the drawings, the transport mechanism is a mechanism that can be changed by a person with ordinary knowledge, and therefore will not be described herein.

請繼續參考第一圖，金屬網板102係放置於靜電板104上。更具體來說，金屬網板102為一金屬薄板且具有多個圖案化開孔(未繪示)，以於後續蒸鍍過程中蒸鍍材料可以透過此等開孔而附著於玻璃基板上。而靜電板104具有一支撐面104a，支撐面104a用以承載金屬網板102於其上。其次，靜電板104可以例如為靜電吸附板(Electro-Static Chuck)，其係受電能開啟而使支撐面104a上產生靜電吸引作用，至於靜電板104內部材料等細節，並不用以限定本發明，故不在此加以贅述。Referring to the first figure, the metal mesh panel 102 is placed on the electrostatic board 104. More specifically, the metal mesh plate 102 is a metal thin plate and has a plurality of patterned openings (not shown) for the vapor deposition material to adhere to the glass substrate through the openings during the subsequent evaporation process. The electrostatic board 104 has a supporting surface 104a for supporting the metal mesh board 102 thereon. Secondly, the electrostatic board 104 can be, for example, an Electro-Static Chuck, which is electrostatically opened to cause electrostatic attraction on the support surface 104a, and details such as the internal material of the electrostatic board 104 are not intended to limit the present invention. Therefore, it will not be repeated here.

請繼續參照第一圖，當金屬網板102放置於靜電板104上時，金屬網板102與靜電板104的支撐面104a之間可能有空隙存在，如第一圖的區域A之部分放大圖所示。接著，開啟靜電板104之靜電開關，使靜電板104之支撐面104a上產生靜電，此時，金屬網板102便如第二圖所示平整地吸附於靜電板104上。Referring to the first figure, when the metal mesh plate 102 is placed on the static electricity plate 104, there may be a gap between the metal mesh plate 102 and the support surface 104a of the electrostatic plate 104, as shown in a partial enlarged view of the area A of the first figure. Shown. Next, the electrostatic switch of the electrostatic plate 104 is turned on to generate static electricity on the support surface 104a of the electrostatic plate 104. At this time, the metal mesh plate 102 is uniformly adsorbed on the electrostatic plate 104 as shown in the second figure.

請參照第三A圖，基板202為一被蒸鍍對象，例如為玻璃基板，且係藉由一承載裝置203所支撐而設置於蒸鍍室201內。其中，基板202具有兩相對的下表面與上表面，分別定義為蒸鍍面202a與非蒸鍍面202b。磁性吸附裝置204係設置於蒸鍍室201內，且位於基板202的非蒸鍍面202b的上方。再者，磁性吸附裝置204具有一表面204a，此表面204a與基板202之非蒸鍍面202b接觸。其中，磁性吸附裝置204可以例如為磁石或電磁鐵，但並不用以限定本發明。再者，磁性吸附裝置204電耦接電腦控制裝置，並受電腦控制裝置控制而啟動或關閉，使得磁性吸附裝置204的表面204a可以產生磁性吸引作用或無磁性吸引作用。至於磁性吸附裝置204內部材料等細節，並不用以限定本發明，故不在此加以贅述。其次，蒸鍍室201內更設有一蒸鍍材料206，藉由加熱蒸鍍材料206，使蒸鍍材料206可以蒸鍍而附著於基板202上。如第三A圖所示，蒸鍍材料206係設置於蒸鍍室201的中央位置，但此位置配置並非用以限定本發明，另外，也可以依需求配置多個以上的蒸鍍材料206。Referring to FIG. 3A, the substrate 202 is a vapor deposition object, for example, a glass substrate, and is disposed in the vapor deposition chamber 201 by being supported by a carrier device 203. The substrate 202 has two opposite lower surfaces and upper surfaces, which are defined as a vapor deposition surface 202a and a non-vapor deposition surface 202b, respectively. The magnetic adsorption device 204 is disposed in the vapor deposition chamber 201 and is located above the non-vapor deposition surface 202b of the substrate 202. Furthermore, the magnetic adsorption device 204 has a surface 204a that is in contact with the non-vapor-deposited surface 202b of the substrate 202. The magnetic adsorption device 204 can be, for example, a magnet or an electromagnet, but is not intended to limit the invention. Moreover, the magnetic adsorption device 204 is electrically coupled to the computer control device and is activated or deactivated by the computer control device, so that the surface 204a of the magnetic adsorption device 204 can generate magnetic attraction or non-magnetic attraction. The details of the materials and the like in the magnetic adsorption device 204 are not intended to limit the present invention, and therefore will not be described herein. Next, a vapor deposition material 206 is further provided in the vapor deposition chamber 201, and the vapor deposition material 206 is vapor-deposited and adhered to the substrate 202 by heating the vapor deposition material 206. As shown in FIG. 3A, the vapor deposition material 206 is disposed at the center of the vapor deposition chamber 201. However, this positional arrangement is not intended to limit the present invention, and a plurality of or more vapor deposition materials 206 may be disposed as needed.

請繼續參照第三A圖，將第二圖所示的靜電板104運送到蒸鍍室201內的一預定位置，並且令吸附於靜電板104上的金屬網板102朝向且接觸基板202之蒸鍍面202a。隨後，進行對位步驟，利用一對位機構，來調整基板202之蒸鍍面202a與金屬網板102之相對位置。一般來說，通常會在金屬網板102與基板202上設有對位標記，接著利用攝像裝置(未繪示)，如電荷耦合元件(Charge Coupled Device，CCD)以及如驅動件(未繪示)等機構，來調整其位置，以進行對準。至於此等對位機構(未繪示)，為本領域具有通常知識者可自行變化，故不在此加以贅述。Referring to FIG. 3A, the electrostatic plate 104 shown in the second figure is transported to a predetermined position in the vapor deposition chamber 201, and the metal mesh plate 102 adsorbed on the electrostatic plate 104 faces and contacts the steam of the substrate 202. Plated surface 202a. Subsequently, a registration step is performed to adjust the relative position of the vapor deposition surface 202a of the substrate 202 and the metal mesh panel 102 by using a pair of positioning mechanisms. Generally, an alignment mark is usually provided on the metal mesh plate 102 and the substrate 202, and then an image pickup device (not shown) such as a charge coupled device (CCD) and a driving member (not shown) are used. ) and other institutions to adjust their position for alignment. As for these matching organizations (not shown), those who have ordinary knowledge in the field can change their own and therefore will not be described here.

請參照第三B圖，於對位步驟之後，啟動磁性吸附裝置204，使磁性吸附裝置204產生磁性吸引作用，此時，金屬網板102會受磁性吸附裝置204之磁性吸引而吸附於基板202之蒸鍍面202a上。Referring to FIG. 3B, after the alignment step, the magnetic adsorption device 204 is activated to cause the magnetic adsorption device 204 to generate magnetic attraction. At this time, the metal mesh plate 102 is magnetically attracted by the magnetic adsorption device 204 and adsorbed on the substrate 202. On the vapor deposition surface 202a.

接著，請參照第三C圖，於金屬網板102緊密地貼合於基板202之蒸鍍面202a上之後，關閉靜電板104之靜電，使靜電板104之支撐面104a的靜電作用消失。此時，由於靜電板104與金屬網板102間的靜電吸引作用已消失，因此，金屬網板102不再受靜電板104之靜電吸引，故可將靜電板104運送離開預定位置。在另一實施例中，關閉靜電板104的步驟也可以與啟動磁性吸附裝置204的步驟同時進行。Next, referring to the third C diagram, after the metal mesh panel 102 is closely attached to the vapor deposition surface 202a of the substrate 202, the static electricity of the electrostatic panel 104 is turned off, and the electrostatic action of the support surface 104a of the electrostatic panel 104 is eliminated. At this time, since the electrostatic attraction between the electrostatic board 104 and the metal mesh 102 has disappeared, the metal mesh 102 is no longer electrostatically attracted by the electrostatic board 104, so that the electrostatic board 104 can be transported away from the predetermined position. In another embodiment, the step of turning off the electrostatic plate 104 can also be performed simultaneously with the step of activating the magnetic adsorption device 204.

請參照第三D圖，進行蒸鍍步驟，加熱蒸鍍材料206，使得蒸鍍材料206中的蒸鍍材料得以蒸鍍附著於基板202之蒸鍍面202a上。在完成蒸鍍步驟後，將靜電板104再次運送到蒸鍍室201內的預定位置，並使靜電板104之支撐面104a與金屬網板102接觸。隨後，關閉磁性吸附裝置204之磁性吸引作用，使金屬網板102不再受磁性吸附裝置204之吸引，接著，再開啟靜電板104之靜電作用，使金屬網板102靜電吸附於靜電板104上。最後，便將靜電板104及吸附於其上的金屬網板102運送離開蒸鍍室201中的預定位置。在另一實施例中，關閉磁性吸附裝置204之步驟也可以與開啟靜電板104之靜電作用之步驟同時進行。Referring to the third D diagram, the vapor deposition step is performed, and the vapor deposition material 206 is heated so that the vapor deposition material in the vapor deposition material 206 is vapor-deposited and adhered to the vapor deposition surface 202a of the substrate 202. After the vapor deposition step is completed, the electrostatic plate 104 is again transported to a predetermined position in the vapor deposition chamber 201, and the support surface 104a of the electrostatic plate 104 is brought into contact with the metal mesh plate 102. Subsequently, the magnetic attraction of the magnetic adsorption device 204 is turned off, so that the metal mesh plate 102 is no longer attracted by the magnetic adsorption device 204, and then the electrostatic action of the electrostatic plate 104 is turned on to electrostatically adsorb the metal mesh plate 102 on the electrostatic plate 104. . Finally, the electrostatic board 104 and the metal mesh plate 102 adsorbed thereon are transported away from a predetermined position in the vapor deposition chamber 201. In another embodiment, the step of turning off the magnetic adsorption device 204 can also be performed simultaneously with the step of turning on the electrostatic action of the electrostatic plate 104.

值得注意的是，上述靜電板104之運送以及靜電開閉、磁性吸附裝置204之磁性開閉以及驅動蒸鍍步驟的進行等作業，皆係由電腦控制裝置所控制。It is to be noted that the operation of the electrostatic plate 104, the electrostatic opening and closing, the magnetic opening and closing of the magnetic adsorption device 204, and the operation of driving the vapor deposition step are all controlled by the computer control device.

第四A圖至第四B圖，為本發明之第二實施例中，金屬網板運送至蒸鍍室內並且進行蒸鍍的流程結構示意圖。不同於第一實施例，此實施例的基板202係藉由一組合式吸附裝置207中的靜電吸附單元205的吸附而位於蒸鍍室201內。詳言之，如第四A圖所示，蒸鍍室201內設有一組合式吸附裝置207。組合式吸附裝置207包含靜電吸附單元205以及與靜電吸附單元205組裝在一起的磁性吸附單元204。靜電吸附單元205係設置於磁性吸附單元204之下表面，且靜電吸附單元205可受電能啟動，使其表面產生靜電。而磁性吸附單元204則相同於第一實施例中的磁性吸附裝置，係可受電能啟動，以產生磁性吸引作用。如圖所示，基板202可被運送到靜電吸附單元205的下表面下方，其後再受靜電吸附單元205之靜電吸引而吸附固定於其上。接著，便可將承載於靜電板104上的金屬網板102運送到蒸鍍室201內的一預定位置。隨後，如第四B圖所示，進行基板202與金屬網板102之對位步驟。於對位步驟之後，啟動磁性吸附單元204，使磁性吸附單元204產生磁性吸引作用，因而將金屬網板102吸附於基板202。最後，將靜電板104運送離開此預定位置後，便可以進行蒸鍍步驟。由於運送金屬網板至蒸鍍室的步驟、對位步驟、磁性吸引金屬板的步驟、蒸鍍步驟等皆與第一實施例相同，故不再此加以贅述。4A to 4B are schematic structural views showing the flow of the metal mesh plate to the vapor deposition chamber and vapor deposition in the second embodiment of the present invention. Unlike the first embodiment, the substrate 202 of this embodiment is located in the vapor deposition chamber 201 by adsorption of the electrostatic adsorption unit 205 in a combined adsorption device 207. In detail, as shown in FIG. 4A, a combined adsorption device 207 is provided in the vapor deposition chamber 201. The combined adsorption device 207 includes an electrostatic adsorption unit 205 and a magnetic adsorption unit 204 assembled with the electrostatic adsorption unit 205. The electrostatic adsorption unit 205 is disposed on the lower surface of the magnetic adsorption unit 204, and the electrostatic adsorption unit 205 can be activated by electric energy to generate static electricity on the surface thereof. The magnetic adsorption unit 204 is the same as the magnetic adsorption device of the first embodiment, and can be activated by electric energy to generate magnetic attraction. As shown in the figure, the substrate 202 can be transported below the lower surface of the electrostatic adsorption unit 205, and thereafter adsorbed and fixed thereto by electrostatic attraction of the electrostatic adsorption unit 205. Next, the metal mesh plate 102 carried on the electrostatic plate 104 can be transported to a predetermined position in the vapor deposition chamber 201. Subsequently, as shown in FIG. 4B, the alignment step of the substrate 202 and the metal mesh plate 102 is performed. After the alignment step, the magnetic adsorption unit 204 is activated to cause the magnetic adsorption unit 204 to generate a magnetic attraction, thereby adsorbing the metal mesh plate 102 to the substrate 202. Finally, after the electrostatic board 104 is transported away from the predetermined position, the vapor deposition step can be performed. Since the step of transporting the metal mesh plate to the vapor deposition chamber, the step of aligning, the step of magnetically attracting the metal plate, the step of vapor deposition, and the like are the same as those of the first embodiment, the description thereof will not be repeated.

綜上所述，在本發明中，首先，藉由靜電板之靜電吸引作用，使得金屬網板能在平坦且不彎曲的情況下，固定吸附於靜電板上，如此一來，不僅有利於後續進行基板與金屬網板的對位作業，進而可大幅提高對位精準度，而且更可避免任何外力造成相對偏移的問題。又，藉由磁性吸附裝置之磁性吸引作用，使得金屬網板能精準地而且不會產生對位偏離的情況下，吸附於基板的蒸鍍面上，以進行後續的蒸鍍作業。據此，本發明不僅不會發生對位偏離，而且藉由磁性吸引而提高金屬網板與基板間的密接性，從而大幅提高蒸鍍精度。In summary, in the present invention, firstly, by the electrostatic attraction of the electrostatic plate, the metal mesh plate can be fixedly adsorbed on the electrostatic plate under the condition of being flat and not bent, so that it is not only beneficial for subsequent The alignment operation between the substrate and the metal mesh plate is performed, thereby greatly improving the alignment accuracy, and further avoiding the problem of relative offset caused by any external force. Further, by the magnetic attraction of the magnetic adsorption device, the metal mesh plate can be adsorbed on the vapor deposition surface of the substrate accurately and without causing misalignment to perform subsequent vapor deposition operations. Accordingly, the present invention not only does not cause the alignment deviation, but also improves the adhesion between the metal mesh plate and the substrate by magnetic attraction, thereby greatly improving the vapor deposition precision.

無論如何，任何人都可以從上述例子的說明獲得足夠教導，並據而了解本發明內容確實不同於先前技術，且具有產業上之利用性，及足具進步性。是本發明確已符合專利要件，爰依法提出申請。In any event, anyone can obtain sufficient teaching from the description of the above examples, and it is understood that the present invention is indeed different from the prior art, and is industrially usable and progressive. It is the invention that has indeed met the patent requirements and has filed an application in accordance with the law.

102金屬網板　　　　104靜電板102 metal mesh plate 104 electrostatic plate

104a支撐面104a support surface

201蒸鍍室　　　　　202基板201 evaporation chamber 202 substrate

202a蒸鍍面　　　　 202b非蒸鍍面202a vapor deposition surface 202b non-vapor deposition surface

203承載裝置　　　　203 carrier

204磁性吸附裝置、磁性吸附單元204 magnetic adsorption device, magnetic adsorption unit

204a表面　　　　　 205靜電吸附單元204a surface 205 electrostatic adsorption unit

206蒸鍍材料　　　　207組合式吸附裝置206 evaporation material 207 combined adsorption device

A區域Area A

第一圖，為本發明之一實施例中，在金屬網板上配置靜電板之剖面結構示意圖。The first figure is a schematic cross-sectional view of an electrostatic board disposed on a metal mesh panel in an embodiment of the present invention.

第二圖，為本發明之一實施例中，靜電板吸附固定於金屬網板上之剖面結構示意圖。The second figure is a schematic cross-sectional view of an electrostatic plate adsorbed and fixed on a metal mesh plate according to an embodiment of the present invention.

第三A圖，為本發明之第一實施例中，將金屬網板運送至蒸鍍室內之剖面結構示意圖。FIG. 3A is a schematic cross-sectional view showing the metal mesh plate conveyed to the vapor deposition chamber in the first embodiment of the present invention.

第三B圖，為本發明之第一實施例中，金屬網板吸附於基板的蒸鍍面上之剖面結構示意圖。FIG. 3B is a schematic cross-sectional view showing the metal mesh plate adsorbed on the vapor deposition surface of the substrate in the first embodiment of the present invention.

第三C圖，為本發明之第一實施例中，移除靜電板後之剖面結構示意圖。FIG. 3C is a schematic cross-sectional view of the first embodiment of the present invention after the electrostatic board is removed.

第三D圖，為本發明之第一實施例中，進行蒸鍍製程之剖面結構示意圖。The third D diagram is a schematic cross-sectional structure of the vapor deposition process in the first embodiment of the present invention.

第四A圖，為本發明之第二實施例中，將金屬網板運送至蒸鍍室內之剖面結構示意圖。Figure 4A is a schematic cross-sectional view showing the transportation of the metal mesh to the evaporation chamber in the second embodiment of the present invention.

第四B圖，為本發明之第一實施例中，金屬網板吸附於基板的蒸鍍面上之剖面結構示意圖。FIG. 4B is a schematic cross-sectional view showing the metal mesh plate adsorbed on the vapor deposition surface of the substrate in the first embodiment of the present invention.

第五圖，為習知蒸鍍裝置中，金屬遮罩因自重而下垂的之剖面結構示意圖。The fifth figure is a schematic cross-sectional view of a metal mask that hangs down due to its own weight in a conventional vapor deposition device.

11外定位件　　　　12內定位件11 outer positioning parts 12 inner positioning parts

102金屬網板　　　　104靜電板102 metal mesh plate 104 electrostatic plate

201蒸鍍室　　　　　202基板201 evaporation chamber 202 substrate

202a蒸鍍面　　　　202b非蒸鍍面202a vapor deposition surface 202b non-vapor deposition surface

204磁性吸附單元　 205靜電吸附單元204 magnetic adsorption unit 205 electrostatic adsorption unit

206蒸鍍材料　　　 207組合式吸附裝置206 evaporation material 207 combined adsorption device

Claims (7)

一種使用一靜電板承載一金屬網板的蒸鍍方法，該方法包含：
開啟該靜電板，使該靜電板產生靜電以吸住該金屬網板；
將該靜電板及其上的該金屬網板一起運送至一蒸鍍室中的一個預定位置，以使該金屬網板位於一被蒸鍍對象的下表面下方及一蒸鍍材料的上方，其中該蒸鍍室內具有一磁性吸附裝置，且磁性吸附裝置位於該被蒸鍍對象的上表面上方；
進行一對位步驟，以調整該被蒸鍍對象與該金屬網板之相對位置；
啟動該磁性吸附裝置，使該磁性吸附裝置產生磁性，以將該金屬網板吸附於該被蒸鍍對象的下表面；
於該金屬網板吸附於該被蒸鍍對象之後，將該靜電板運送離開該預定位置；以及
進行一蒸鍍步驟，使該蒸鍍材料蒸鍍於該被蒸鍍對象的下表面。An evaporation method using an electrostatic plate to carry a metal mesh plate, the method comprising:
Opening the electrostatic plate to generate static electricity to attract the metal mesh plate;
Carrying the electrostatic plate and the metal mesh plate thereon together to a predetermined position in an evaporation chamber such that the metal mesh plate is located below a lower surface of the object to be vapor-deposited and above an evaporation material, wherein The vapor deposition chamber has a magnetic adsorption device, and the magnetic adsorption device is located above the upper surface of the object to be vapor-deposited;
Performing a one-way step to adjust the relative position of the vapor-deposited object and the metal mesh plate;
Activating the magnetic adsorption device to cause the magnetic adsorption device to generate magnetism to adsorb the metal mesh plate to the lower surface of the object to be vapor-deposited;
After the metal mesh plate is adsorbed on the object to be vapor-deposited, the electrostatic plate is transported away from the predetermined position; and a vapor deposition step is performed to deposit the vapor deposition material on the lower surface of the object to be vapor-deposited. 如申請專利範圍第1項所述之方法，更包含關閉該靜電板步驟，使該靜電板不再產生靜電，且關閉該靜電板步驟係於啟動該磁性吸附裝置步驟之後進行。The method of claim 1, further comprising the step of turning off the electrostatic plate so that the electrostatic plate no longer generates static electricity, and the step of closing the electrostatic plate is performed after the step of starting the magnetic adsorption device. 如申請專利範圍第1項所述之方法，更包含關閉該靜電板步驟，使該靜電板不再產生靜電，且關閉該靜電板步驟係與啟動該磁性吸附裝置步驟同時進行。The method of claim 1, further comprising the step of turning off the electrostatic plate so that the electrostatic plate no longer generates static electricity, and the step of closing the electrostatic plate is performed simultaneously with the step of activating the magnetic adsorption device. 一種蒸鍍裝置，該裝置包含：
一蒸鍍室，其內部有一蒸鍍材料、用於承載一被蒸鍍對象之一承載裝置及一磁性吸附裝置，該磁性吸附裝置位於該承載裝置所承載的該被蒸鍍對象的上表面的上方；以及
一運送機構，具有用於承載一金屬網板的一靜電板，該運送機構被配置成可將該靜電板及其上的該金屬網板運送至該蒸鍍室中的一預定位置及運送離開該預定位置，該預定位置位於該承載裝置所承載的該被蒸鍍對象的下表面的下方及該蒸鍍材料的上方。An evaporation device comprising:
An evaporation chamber having an evaporation material therein for carrying a carrier device for vapor deposition and a magnetic adsorption device, the magnetic adsorption device being located on an upper surface of the vapor-deposited object carried by the carrier device And a transport mechanism having an electrostatic plate for carrying a metal mesh plate, the transport mechanism being configured to transport the electrostatic plate and the metal mesh plate thereon to a predetermined position in the vapor deposition chamber And transporting away from the predetermined position, the predetermined position is located below the lower surface of the vapor-deposited object carried by the carrying device and above the vapor deposition material. 如申請專利範圍第4項所述之裝置，更包含一電腦控制裝置，且該電腦控制裝置係被配置成能分別控制該蒸鍍室、該磁性吸附裝置與該運送機構執行以下運作：
開啟該靜電板，以使該靜電板產生靜電以吸住該金屬網板；
將該靜電板及其上的該金屬網板一起運送至該蒸鍍室中的該預定位置；
啟動該磁性吸附裝置使其產生磁性，以將該金屬網板吸附於該被蒸鍍對象的下表面；
於該金屬網板吸附於該被蒸鍍對象之後，將該靜電板運送離開該預定位置；以及
驅使該蒸鍍室進行一蒸鍍步驟，以使該蒸鍍材料蒸鍍於該被蒸鍍對象的下表面。The device of claim 4, further comprising a computer control device, wherein the computer control device is configured to separately control the vapor deposition chamber, the magnetic adsorption device and the transport mechanism to perform the following operations:
Opening the electrostatic plate to generate static electricity to absorb the metal mesh plate;
Transporting the electrostatic plate and the metal mesh plate thereon to the predetermined position in the evaporation chamber;
Activating the magnetic adsorption device to generate magnetism to adsorb the metal mesh plate to the lower surface of the object to be vapor-deposited;
After the metal mesh plate is adsorbed on the object to be vapor-deposited, the electrostatic plate is transported away from the predetermined position; and the vapor deposition chamber is driven to perform an evaporation step to vapor-deposit the vapor deposition material on the vapor-deposited object. The lower surface. 一種蒸鍍裝置，該裝置包含：
一蒸鍍室，其內部有一蒸鍍材料及一組合式吸附裝置，該組合式吸附裝置包含一靜電吸附單元及與該靜電吸附單元組裝在一起的一磁性吸附單元，該靜電吸附單元用於吸附一被蒸鍍對象，磁性吸附單元位於靜電吸附單元相對該備蒸鍍對象的一面上；及
一運送機構，具有用於承載一金屬網板的一靜電板，該運送機構被配置成可將該靜電板及其上的金屬網板運送至該蒸鍍室中的一預定位置及運送離開該預定位置，該預定位置位於該靜電吸附單元所吸附的該被蒸鍍對象的下表面的下方及該蒸鍍材料的上方。An evaporation device comprising:
An evaporation chamber having an evaporation material and a combined adsorption device therein, the combined adsorption device comprising an electrostatic adsorption unit and a magnetic adsorption unit assembled with the electrostatic adsorption unit, the electrostatic adsorption unit being used for adsorption a vapor deposition target, the magnetic adsorption unit is located on a side of the electrostatic adsorption unit opposite to the vapor deposition target; and a transport mechanism having an electrostatic plate for carrying a metal mesh plate, the transport mechanism being configured to The electrostatic board and the metal mesh plate thereon are transported to a predetermined position in the vapor deposition chamber and transported away from the predetermined position, the predetermined position being located below the lower surface of the vapor-deposited object adsorbed by the electrostatic adsorption unit and Above the evaporation material. 如申請專利範圍第6項所述之裝置，更包含一電腦控制裝置，且該電腦控制裝置係被配置成能分別控制該蒸鍍室、該組合式吸附裝置與該運送機構執行以下運作：
開啟該靜電板，以使該靜電板產生靜電以吸住該金屬網板；
將該靜電板及其上的該金屬網板一起運送至該蒸鍍室中的該預定位置；
啟動該組合式吸附裝置中的該磁性吸附單元，使該磁性吸附單元產生磁性，以將該金屬網板吸附於該被蒸鍍對象的下表面；
於該金屬網板吸附於該被蒸鍍對象之後，將該靜電板運送離開該預定位置；以及
驅使該蒸鍍室進行一蒸鍍步驟，以使該蒸鍍材料蒸鍍於該被蒸鍍對象的下表面。The device of claim 6, further comprising a computer control device, wherein the computer control device is configured to separately control the vapor deposition chamber, the combined adsorption device and the transport mechanism to perform the following operations:
Opening the electrostatic plate to generate static electricity to absorb the metal mesh plate;
Transporting the electrostatic plate and the metal mesh plate thereon to the predetermined position in the evaporation chamber;
Activating the magnetic adsorption unit in the combined adsorption device to cause the magnetic adsorption unit to generate magnetism to adsorb the metal mesh plate to the lower surface of the object to be vapor-deposited;
After the metal mesh plate is adsorbed on the object to be vapor-deposited, the electrostatic plate is transported away from the predetermined position; and the vapor deposition chamber is driven to perform an evaporation step to vapor-deposit the vapor deposition material on the vapor-deposited object. The lower surface.