TWI436067B - Insert for test handler and apparatus for operating the same - Google Patents
Insert for test handler and apparatus for operating the same Download PDFInfo
- Publication number
- TWI436067B TWI436067B TW100121721A TW100121721A TWI436067B TW I436067 B TWI436067 B TW I436067B TW 100121721 A TW100121721 A TW 100121721A TW 100121721 A TW100121721 A TW 100121721A TW I436067 B TWI436067 B TW I436067B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor device
- insert
- operating
- pair
- loaded
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Environmental & Geological Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
本發明有關一種用來裝載並傳送測試分選機中半導體裝置的***件以及一種用於操作該***件使其準備好將半導體裝置裝載在***件上的設備。 The present invention relates to an insert for loading and transporting a semiconductor device in a test sorter and an apparatus for operating the insert to prepare it for loading a semiconductor device on an insert.
對於半導體裝置的測試而言,需要一種用於測試電連接的半導體裝置的測試器和一種用於將半導體裝置電連接至該測試器的測試分選機。 For testing semiconductor devices, there is a need for a tester for testing an electrically connected semiconductor device and a test sorter for electrically connecting the semiconductor device to the tester.
為了增加測試容量,測試分選機使用載板(也稱為「測試托盤」托盤)來同時裝載多個半導體裝置,其包括操作設備和用於將半導體裝置裝載在載板上的取放裝置。 To increase the test capacity, the test sorter uses a carrier (also referred to as a "test tray" tray) to simultaneously load a plurality of semiconductor devices including an operating device and pick and place devices for loading the semiconductor device on the carrier.
載板包括板框架和以矩陣形式安裝在板框架中的多個***件。 The carrier board includes a board frame and a plurality of inserts mounted in a matrix form in the board frame.
如在第一圖的橫截面圖中簡示的***件包括一對鎖閉裝置121和122,用於阻止裝載在***件100的裝載槽111中的半導體裝置D分開。 The insert as schematically illustrated in the cross-sectional view of the first figure includes a pair of latching means 121 and 122 for preventing the semiconductor device D loaded in the loading slot 111 of the insert 100 from being separated.
如在第二A圖中簡示的操作設備200包括藉由圓筒220提升和降下的操作板210。 The operating device 200 as illustrated in the second diagram A includes an operating panel 210 that is raised and lowered by a cylinder 220.
操作板210包括多對操作銷211和212。當操作板210被舉起時,該對操作銷211和212移動***件100的鎖閉裝置121和122以鬆開***件100,使得***件是打開的(「打開的」指的是允許裝載半導體裝置的***件鬆開),如第二B圖所示。 The operation panel 210 includes a plurality of pairs of operation pins 211 and 212. When the operation panel 210 is lifted, the pair of operation pins 211 and 212 move the locking devices 121 and 122 of the insert 100 to release the insert 100 so that the insert is opened ("open" refers to allowing loading The insert of the semiconductor device is loosened, as shown in Figure B.
如第三圖所示的用於傳送半導體裝置的取放裝置300包括多個拾取器310,多個拾取器310以矩陣形式提供並且用於拾取半導體裝置。 The pick and place device 300 for transporting a semiconductor device as shown in the third figure includes a plurality of pickers 310 that are provided in a matrix form and used to pick up semiconductor devices.
半導體裝置裝載入***件100中是按順序進行的,其中裝載在單獨的裝載部件,例如用戶托盤上的半導體裝置被取放裝置300揀取,傳送至***件100上方,然後從取放裝置300釋放,以使得其裝載在通過操作設備200打開的***件100上。 The loading of the semiconductor device into the interposer 100 is sequential, wherein the semiconductor device loaded on a separate loading component, such as a user tray, is picked up by the pick and place device 300, transferred over the insert 100, and then removed from the pick and place device The 300 is released such that it is loaded on the insert 100 that is opened by the operating device 200.
通常,在能夠同時測試512個半導體裝置的測試分選機中使用10至15片載板。由於單個半導體裝置通常被裝載在單個***件中,因此所需***件的數量為約2,560至3,840個。 Typically, 10 to 15 carrier plates are used in a test handler capable of testing 512 semiconductor devices simultaneously. Since a single semiconductor device is typically loaded in a single interposer, the number of interposers required is between about 2,560 and 3,840.
但是,由於半導體裝置具有不同尺寸,因此當待測試的半導體裝置改變時,載板和操作設備需要相應地更換。對於更換而言,這帶來了不想要的資源和時間的浪費。因此,需要在相同***件中裝載不同半導體裝置的技術。在以上需求上開發的技術之一是韓國專利申請公開第10-2009-0084007號之名稱為「一種用於測試分選機的載板的***件(Insert for carrier board of test handler)」(在下文中,被稱為「相關技術1」)。 However, since the semiconductor devices have different sizes, when the semiconductor device to be tested is changed, the carrier board and the operating device need to be replaced accordingly. For replacement, this creates a waste of unwanted resources and time. Therefore, there is a need for a technique of loading different semiconductor devices in the same interposer. One of the technologies developed in the above requirements is the Korean Patent Application Publication No. 10-2009-0084007 entitled "Insert for carrier board of test handler" (under In the text, it is called "Related Technology 1").
在相關技術1中,***件的主體(在相關技術1中被定義為「***件主體」)是重複使用的,並且僅更換***袋以使得可以獲得資 源的高再用性。 In the related art 1, the main body of the insert (defined as "insert main body" in Related Art 1) is reused, and only the insertion pocket is replaced so that the capital can be obtained. High reusability of the source.
相關技術1考慮到***件主體的再利用,產生了經濟效益。但是,必須執行用於檢測***袋是否很好地連接到主體的測試,並且這花費了許多時間以更換***袋。 Related Art 1 yields economic benefits in consideration of reuse of the insert body. However, a test for detecting whether the insertion pocket is well connected to the main body must be performed, and it takes a lot of time to replace the insertion pocket.
另一方面,當半導體裝置沒有很好地裝載在***件中時,半導體裝置會損壞或者在傳送載板時落下。另外,由於與半導體裝置不好的機械或者電接觸,測試器會損壞。因此,需要連續不斷地研究和開發將半導體裝置精確裝載入***件中的技術。 On the other hand, when the semiconductor device is not well loaded in the interposer, the semiconductor device may be damaged or dropped when the carrier is transferred. In addition, the tester can be damaged due to poor mechanical or electrical contact with the semiconductor device. Therefore, there is a need to continuously research and develop a technique for accurately loading a semiconductor device into an insert.
韓國專利申請公開第10-2009-0102167號之名稱為「一種用於打開測試托盤的***件的單元和使用該單元安裝半導體裝置的方法(Unit for opening insert for test tray and method of mounting semiconductor device using the same)」(在下文中,被稱為「相關技術2」)是將半導體裝置適當地裝載入***件的裝載槽內的技術示例之一。 The Korean Patent Application Publication No. 10-2009-0102167 is entitled "A unit for opening an insert for testing a test tray and a method for mounting a semiconductor device using the unit" (Unit for opening insert for test tray and method of mounting semiconductor device using The same) (hereinafter referred to as "Related Art 2") is one of technical examples in which a semiconductor device is appropriately loaded into a loading slot of an insert.
基於以上內容,本發明提供一種將不同尺寸半導體裝置精確地裝載在相同***件中的技術。 Based on the above, the present invention provides a technique for accurately loading semiconductor devices of different sizes in the same insert.
依照本發明的一個態樣,提供一種用於測試分選機的***件,其包括:主體,所述主體包括在其中裝入半導體裝置的裝載槽;及一對鎖閉裝置,用於保持被裝入所述裝載槽中的所述半導體裝置的兩端, 其中,在所述裝載槽的底部具有暴露孔和多個出入孔,所述暴露孔用於向下暴露所裝載的半導體裝置的端部,所述多個出入孔用於通過所述一對鎖閉裝置的操作引導所述半導體裝置的裝載。 According to an aspect of the present invention, an insert for testing a sorting machine is provided, comprising: a body including a loading slot in which a semiconductor device is housed; and a pair of locking devices for maintaining Loading both ends of the semiconductor device in the loading slot, Wherein the bottom of the loading slot has an exposed hole for downwardly exposing an end of the loaded semiconductor device, and a plurality of access holes for passing the pair of locks The operation of the shutdown device directs the loading of the semiconductor device.
依照本發明的另一態樣,此處提供一種與***件連用的操作設備,其中所述***件具有一對鎖閉裝置,所述一對鎖閉裝置配置成保持被裝載在其上的半導體裝置,所述操作設備包括:操作板,用於使所述半導體裝置能夠裝載在所述***件上;和提升裝置,用於提升和降下所述操作板,其中所述操作板包括:多個操作銷和多個引導銷,所述多個操作銷中的每兩個構成一組以操作所述***件的該對鎖閉裝置,所述多個引導銷中至少每兩個構成一組以引導半導體裝置裝載在所述***件中。 In accordance with another aspect of the present invention, there is provided an operating device for use with an insert, wherein the insert has a pair of latching devices configured to hold a semiconductor loaded thereon The operation device includes: an operation panel for enabling the semiconductor device to be loaded on the insert; and a lifting device for lifting and lowering the operation panel, wherein the operation panel includes: a plurality of An operating pin and a plurality of guiding pins, each of the plurality of operating pins forming a group to operate the pair of locking devices of the insert, at least two of the plurality of guiding pins forming a group A semiconductor device is guided to be loaded in the insert.
100‧‧‧***件 100‧‧‧ inserts
111‧‧‧裝載槽 111‧‧‧Loading trough
121‧‧‧閉鎖裝置 121‧‧‧Locking device
122‧‧‧閉鎖裝置 122‧‧‧Locking device
D‧‧‧半導體裝置 D‧‧‧Semiconductor device
200‧‧‧操作設備 200‧‧‧Operating equipment
210‧‧‧操作板 210‧‧‧Operator panel
211‧‧‧操作銷 211‧‧‧Operational sales
212‧‧‧操作銷 212‧‧‧Operational sales
220‧‧‧圓筒 220‧‧‧Cylinder
300‧‧‧取放裝置 300‧‧‧ pick and place device
310‧‧‧拾取器 310‧‧‧ Picker
400‧‧‧***件 400‧‧‧ Inserts
410‧‧‧主體 410‧‧‧ Subject
411‧‧‧裝載槽 411‧‧‧Loading trough
412‧‧‧暴露孔 412‧‧‧Exposing holes
413a‧‧‧出入孔 413a‧‧‧ access hole
413b‧‧‧出入孔 413b‧‧‧ access hole
413c‧‧‧出入孔 413c‧‧‧ access hole
413d‧‧‧出入孔 413d‧‧‧ access hole
413e‧‧‧出入孔 413e‧‧‧ access hole
413f‧‧‧出入孔 413f‧‧‧ access hole
414‧‧‧加固肋 414‧‧‧Reinforcement ribs
415a‧‧‧定位凹口 415a‧‧‧ positioning notch
415b‧‧‧定位凹口 415b‧‧‧ positioning notch
421‧‧‧鎖閉裝置 421‧‧‧Locking device
421a‧‧‧鎖閉部件 421a‧‧‧Locking parts
421b‧‧‧彈簧 421b‧‧ ‧ spring
422‧‧‧鎖閉裝置 422‧‧‧Locking device
422a‧‧‧鎖閉部件 422a‧‧‧Locking parts
422b‧‧‧彈簧 422b‧‧ ‧ spring
C‧‧‧中心 C‧‧‧ Center
D1‧‧‧半導體裝置 D1‧‧‧Semiconductor device
L1‧‧‧等分線 L1‧‧‧ bisector
L2‧‧‧等分線 L2‧‧‧ bisector
S1‧‧‧寬度 S1‧‧‧Width
S2‧‧‧寬度 S2‧‧‧Width
600‧‧‧操作設備 600‧‧‧Operating equipment
610‧‧‧操作板 610‧‧‧Operator
611a‧‧‧操作銷 611a‧‧‧Operational sales
611b‧‧‧操作銷 611b‧‧‧ operation pin
612a‧‧‧引導銷 612a‧‧‧Guidance pin
612b‧‧‧引導銷 612b‧‧‧Guidance pin
612c‧‧‧引導銷 612c‧‧‧Guidance pin
612d‧‧‧引導銷 612d‧‧‧ Guide pin
612e‧‧‧引導銷 612e‧‧‧Guidance pin
612f‧‧‧引導銷 612f‧‧‧Guidance pin
620‧‧‧提升裝置 620‧‧‧ lifting device
B‧‧‧距離 B‧‧‧ distance
S‧‧‧寬度 S‧‧‧Width
T‧‧‧距離 T‧‧‧ distance
900‧‧‧取放裝置 900‧‧‧ pick and place device
910‧‧‧拾取器 910‧‧‧ Picker
911‧‧‧吸入墊 911‧‧ Inhalation pad
912a‧‧‧定位銷 912a‧‧ Locating pin
912b‧‧‧定位銷 912b‧‧‧Locating pin
913‧‧‧阻擋器 913‧‧‧blocker
920‧‧‧主體 920‧‧‧ Subject
930‧‧‧固定條 930‧‧‧Fixed strip
940‧‧‧彈簧 940‧‧ ‧ spring
413a’‧‧‧出入孔 413a’‧‧‧ access hole
413b’‧‧‧出入孔 413b’‧‧‧ access hole
413c’‧‧‧出入孔 413c’‧‧‧ access hole
413d’‧‧‧出入孔 413d’‧‧‧ access hole
413e’‧‧‧出入孔 413e’‧‧‧ access hole
413f’‧‧‧出入孔 413f’‧‧‧ access hole
612a’‧‧‧引導銷 612a’‧‧‧ Guide pin
612b’‧‧‧引導銷 612b’‧‧‧ Guide pin
612c’‧‧‧引導銷 612c’‧‧‧ Guide pin
612d’‧‧‧引導銷 612d’‧‧‧ Guide pin
612e’‧‧‧引導銷 612e’‧‧‧ Guide pin
612f’‧‧‧引導銷 612f’‧‧‧ Guide pin
第一圖是習知***件的示意橫截面圖;第二A圖示意示出習知操作設備的透視圖;第二B圖係第二A圖中所示的操作設備執行***件的打開操作的參照性橫截面圖;第三圖是習知取放裝置的示意透視圖;第四圖是依照本發明之實施例的***件的示意俯視圖;第五A圖和第五B圖是第四圖中所示的***件的參照性俯視圖;第六圖是依照本發明之實施例的操作設備的示意透視圖; 第七圖和第八圖是用於描述第六圖中所示的操作設備的參照性視圖;第九圖是適合於第四圖中所示的***件的取放裝置的部分示意透視圖;第十圖至第十四圖是用於描述半導體裝置的裝載操作的參照性視圖,該半導體裝置的裝載操作由第四圖中所示的***件、第六圖中所示的操作設備、和第九圖中所示的取放裝置來執行;以及第十五A圖和第十五B圖是在關於半導體裝置尺寸改變情況的描述中將參考的參照性視圖。 The first figure is a schematic cross-sectional view of a conventional insert; the second A is a schematic view showing a perspective view of a conventional operating device; and the second B is an operating device shown in the second A showing the opening of the insert A cross-sectional view of the operation; a third is a schematic perspective view of a conventional pick-and-place device; a fourth view is a schematic plan view of the insert in accordance with an embodiment of the present invention; fifth and fifth B are a reference top view of the insert shown in the four figures; a sixth view is a schematic perspective view of the operating device in accordance with an embodiment of the present invention; 7 and 8 are reference views for describing the operating device shown in the sixth drawing; the ninth drawing is a partially schematic perspective view of the pick-and-place device suitable for the insert shown in the fourth figure; Tenth to fourteenth drawings are reference views for describing a loading operation of a semiconductor device, the loading operation of which is performed by the insert shown in the fourth figure, the operating device shown in the sixth figure, and The pick-and-place device shown in the ninth figure is executed; and the fifteenth A and fifteenth Bth drawings are reference views to be referred to in the description regarding the dimensional change of the semiconductor device.
在下文中,將參考構成本發明一部分的附圖來詳細地描述本發明的實施例。關於以上實施例,類似的元件係由類似的元件符號指定,並且這些元件的描述在本文中省略。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings which form a part of this invention. With respect to the above embodiments, like elements are designated by like element symbols, and the description of these elements is omitted herein.
第四圖是依照本發明之一實施例的***件400的示意俯視圖。 The fourth figure is a schematic top view of an insert 400 in accordance with an embodiment of the present invention.
多個***件400以矩陣形式被安裝到載板(未示出)上,並且如第四圖所示,***件400包括主體410和一對鎖閉裝置421和422。 A plurality of inserts 400 are mounted in a matrix form on a carrier (not shown), and as shown in the fourth figure, the insert 400 includes a body 410 and a pair of latching devices 421 and 422.
主體410具有在其中裝載半導體裝置的裝載槽411,其中裝載槽411的底部包括暴露孔412和多個出入孔,例如六個出入孔413a至413f。 The body 410 has a loading slot 411 in which a semiconductor device is loaded, wherein the bottom of the loading slot 411 includes an exposure hole 412 and a plurality of access holes, for example, six access holes 413a to 413f.
暴露孔412形成為向下暴露出已裝載的半導體裝置的電接觸端部。第四圖示例性示出能在其上裝載BGA(球柵陣列)半導體裝置 的***件。 The exposure hole 412 is formed to expose the electrical contact end of the loaded semiconductor device downward. The fourth figure exemplarily shows that a BGA (Ball Grid Array) semiconductor device can be mounted thereon Insert.
六個出入孔413a至413f形成為允許引導銷由此穿過。引導銷將稍後結合操作設備來描述。 The six access holes 413a to 413f are formed to allow the guide pin to pass therethrough. The guide pin will be described later in connection with the operating device.
如第五A圖和第五B圖所示,六個出入孔413a至413f在沿著經過裝載槽411的中心C並等分裝載槽411的等分線L1和L2的方向上縱向地形成,以使得不論半導體裝置D1和D2的寬度S1和S2(S1<S2)如何,底部的垂直開孔部分都可以位於半導體裝置D1和D2的側面。 As shown in FIGS. 5A and 5B, the six access holes 413a to 413f are longitudinally formed in the direction along the center line C passing through the loading groove 411 and equally dividing the bisectors L1 and L2 of the loading groove 411, So that the vertical opening portions of the bottom portion can be located on the sides of the semiconductor devices D1 and D2 regardless of the widths S1 and S2 (S1 < S2) of the semiconductor devices D1 and D2.
六個出入孔413a至413f之中,四個出入孔413a至413d是在沿著等分線L2方向上形成的縱向孔,並且用於加強底部強度的加固肋414形成在四個出入孔413a至413d和暴露孔412之間,如第四圖所示。但是,也有可能無須加固肋414,四個出入孔413a至413d與暴露孔412彼此相通。 Among the six access holes 413a to 413f, the four access holes 413a to 413d are longitudinal holes formed in the direction along the bisector L2, and reinforcing ribs 414 for reinforcing the strength of the bottom are formed in the four access holes 413a to 413d and the exposed hole 412, as shown in the fourth figure. However, it is also possible that the reinforcing ribs 414 are not required, and the four access holes 413a to 413d and the exposure holes 412 communicate with each other.
一對定位凹口415a和415b對角對稱地形成在主體410的上轉角處。此對定位凹口415a和415b用來精確地限定與取放裝置的拾取器的關係。 A pair of positioning recesses 415a and 415b are formed diagonally symmetrically at the upper corner of the body 410. The pair of positioning recesses 415a and 415b are used to precisely define the relationship with the pickup of the pick and place device.
此對鎖閉裝置421和422被提供以保持在裝載槽411中已裝載的半導體裝置的兩個端部,並且包括可旋轉的鎖閉部件421a和422a以及向鎖閉部件421a和422a提供彈性回復力的彈簧421b和422b。由於鎖閉裝置421和422是本領域眾所周知的,因此將省略它們的詳細描述。 The pair of locking devices 421 and 422 are provided to hold both ends of the loaded semiconductor device in the loading slot 411, and include rotatable locking members 421a and 422a and elastic return to the locking members 421a and 422a Forced springs 421b and 422b. Since the locking devices 421 and 422 are well known in the art, their detailed description will be omitted.
第六圖是依照本發明之實施例的操作設備600的示意透視圖。 The sixth drawing is a schematic perspective view of the operating device 600 in accordance with an embodiment of the present invention.
如第六圖,操作設備600包括:操作板610和提升裝置620。 As shown in the sixth figure, the operation device 600 includes an operation panel 610 and a lifting device 620.
操作板610是薄方形板並且具有操作銷611a和611b以及引導銷612a至612f。 The operation panel 610 is a thin square plate and has operation pins 611a and 611b and guide pins 612a to 612f.
兩個操作銷611a和611b組成一組並且用來操作***件400的鎖閉裝置對421和422。 The two operating pins 611a and 611b form a group and are used to operate the locking device pairs 421 and 422 of the insert 400.
六個引導銷612a至612f組成一組並被設在該對操作銷611a和611b之間。當操作板610升起時,六個引導銷612a至612f組成的組被升起並且被***六個出入孔413a至413f中,從而準備好引導半導體裝置精確地裝載到***件400中。 The six guide pins 612a to 612f are grouped together and disposed between the pair of operation pins 611a and 611b. When the operation panel 610 is raised, the group of the six guide pins 612a to 612f is raised and inserted into the six entrance holes 413a to 413f, so as to be ready to guide the semiconductor device to be accurately loaded into the insert 400.
該組引導銷612a至612f具有面向彼此的三對,其中的一對(612e,612f)被設置成平行於操作銷對611a和611b,其餘兩對(612a,612b)和(612c,612d)被設置成在垂直於操作銷對611a和611b面向彼此方向的P1和P2方向上面向彼此。如第七圖所示,引導銷612a至612f之間的距離被限定以使得半導體裝置D能夠被容納在由引導銷612a至612f限定的矩形區域中。 The set of guide pins 612a to 612f have three pairs facing each other, one of which (612e, 612f) is disposed parallel to the pair of operation pins 611a and 611b, and the remaining two pairs (612a, 612b) and (612c, 612d) are It is disposed to face each other in the directions of P1 and P2 perpendicular to the direction in which the pair of operation pins 611a and 611b face each other. As shown in the seventh diagram, the distance between the guide pins 612a to 612f is defined such that the semiconductor device D can be accommodated in a rectangular area defined by the guide pins 612a to 612f.
此外,如第八圖所示,引導銷612a至612f中的每個具有這樣的上部:隨著前往引導銷的下部,上部的直徑逐漸增加,以使得在半導體裝置的裝載期間,半導體裝置D能夠被精確地引導。另外,在引導銷612a至612f之中面向彼此的一對,例如612a和612b,其尖頭頂部之間的距離T大於半導體裝置D的寬度S,並且這對引導銷底部之間的距離B等於半導體裝置D的寬度S。在引導銷612a至612f之中,面向彼此的這對引導銷底部之間的距離B可以具有正 公差以使得半導體裝置D可平滑地下滑進由引導銷612a至612f限定的內部矩形區域。 Further, as shown in the eighth diagram, each of the guide pins 612a to 612f has an upper portion in which the diameter of the upper portion is gradually increased as going to the lower portion of the guide pin, so that the semiconductor device D can be mounted during loading of the semiconductor device Being accurately guided. In addition, a pair facing each other among the guide pins 612a to 612f, for example, 612a and 612b, the distance T between the tip tops thereof is larger than the width S of the semiconductor device D, and the distance B between the bottoms of the pair of guide pins is equal to The width S of the semiconductor device D. Among the guide pins 612a to 612f, the distance B between the pair of guide pin faces facing each other may have a positive The tolerance is such that the semiconductor device D can smoothly slide down into the inner rectangular area defined by the guide pins 612a to 612f.
提升裝置620提起和降下操作板610,並且提升裝置620可以由氣壓缸、液壓缸等形成。 The lifting device 620 lifts and lowers the operation panel 610, and the lifting device 620 may be formed of a pneumatic cylinder, a hydraulic cylinder, or the like.
第九圖是取放裝置900的部分示意透視圖。 The ninth diagram is a partial schematic perspective view of the pick and place device 900.
取放裝置900包括:多個拾取器910、其上安裝有多個拾取器910的主體920、固定條930和彈簧940。 The pick and place device 900 includes a plurality of pickers 910, a main body 920 on which a plurality of pickers 910 are mounted, a fixing bar 930, and a spring 940.
拾取器910中的每個包括:用於吸取半導體裝置的吸入墊911、用於限制吸入墊911被******件400的裝載槽411中的深度的阻擋器913、以及對角對稱地設在阻擋器913的底部的一對定位銷912a和912b。 Each of the pickups 910 includes a suction pad 911 for sucking up the semiconductor device, a stopper 913 for restricting the depth in which the suction pad 911 is inserted into the loading groove 411 of the insert 400, and a diagonally symmetrically disposed barrier A pair of positioning pins 912a and 912b at the bottom of the 913.
當拾取器910通過取放裝置900的下降而降下時,阻擋器913阻止拾取器910下降超過拾取器910的底側與***件400的頂側接觸所需的極限。 When the pickup 910 is lowered by the lowering of the pick-and-place device 900, the stopper 913 prevents the pickup 910 from falling beyond the limit required for the bottom side of the pickup 910 to contact the top side of the insert 400.
當拾取器910降下時,對應於定位凹口415a和415b的一對定位銷912a和912b被******件400的定位凹口415a和415b內,從而精確地定位拾取器910和***件400。為此,定位銷912a和912b的中心之間的距離等於定位凹口415a和415b的中心之間的距離。 When the pickup 910 is lowered, a pair of positioning pins 912a and 912b corresponding to the positioning notches 415a and 415b are inserted into the positioning notches 415a and 415b of the insert 400, thereby accurately positioning the pickup 910 and the insert 400. To this end, the distance between the centers of the positioning pins 912a and 912b is equal to the distance between the centers of the positioning notches 415a and 415b.
固定條930與拾取器910彼此連接以固定拾取器910,使得拾取器910不旋轉。 The fixing bar 930 and the pickup 910 are connected to each other to fix the pickup 910 such that the pickup 910 does not rotate.
彈簧940在主體920和拾取器910之間有彈性地支承主體920和拾取 器910,以便當取放裝置900下降時,拾取器910被阻擋器913阻止下降之後,彈簧940可以對超過下限的主體920的下降進行緩衝。 The spring 940 elastically supports the main body 920 and the pickup between the main body 920 and the pickup 910 The spring 940 can buffer the lowering of the body 920 that exceeds the lower limit after the picker 910 is prevented from descending by the stopper 913 when the pick-and-place device 900 is lowered.
隨後,將描述藉由***件400、操作設備600和取放裝置900來執行的半導體裝置的裝載。 Subsequently, the loading of the semiconductor device performed by the interposer 400, the operation device 600, and the pick and place device 900 will be described.
半導體裝置從裝載元件中被取放裝置900取出,在載板上方移動,然後停止在取放裝置900的拾取器910對應於安裝在載板上的***件400位置處,如第十圖所示。 The semiconductor device is taken out of the loading and unloading device 900 from the loading member, moved over the carrier, and then stopped at the position of the inserter 910 of the pick and place device 900 corresponding to the insert 400 mounted on the carrier, as shown in FIG. .
當操作設備600操作以舉起操作板610,操作銷611a和611b操作鎖閉裝置421和422以開啟***件400,而引導銷612a至612f上升並穿過六個出入孔413a至413f,如在第十一圖所示。操作設備600的操作可以與取放裝置900取出並傳送半導體裝置的操作同時、在其之前、或者在其之後執行。 When the operation device 600 operates to lift the operation panel 610, the operation pins 611a and 611b operate the lock devices 421 and 422 to open the insert 400, and the guide pins 612a to 612f rise and pass through the six access holes 413a to 413f, as in Figure 11 shows. The operation of the operation device 600 may be performed simultaneously with, before, or after the operation of the pick-and-place device 900 to take out and transfer the semiconductor device.
隨後,拾取器910從第十一圖所示狀態下降,然後如第十二圖,定位銷912a和912b***定位凹口415a和415b內,以使得拾取器910和***件400精確地定位。 Subsequently, the pickup 910 is lowered from the state shown in Fig. 11, and then, as in the twelfth figure, the positioning pins 912a and 912b are inserted into the positioning recesses 415a and 415b to accurately position the pickup 910 and the insert 400.
當取放裝置900從第十二圖所示狀態釋放已取出的半導體裝置D時,半導體裝置D落下。同時,半導體裝置D的側端部被引導落下同時與該組引導銷612a至612f的內側保持接觸,以使得半導體裝置D可以精確地放置在裝載槽411的底部上,如第十三圖。 When the pick-and-place device 900 releases the taken-out semiconductor device D from the state shown in the twelfth figure, the semiconductor device D falls. At the same time, the side end portions of the semiconductor device D are guided to fall while being kept in contact with the inner sides of the set of the guide pins 612a to 612f, so that the semiconductor device D can be accurately placed on the bottom of the loading groove 411 as in the thirteenth diagram.
換句話說,由於引導銷612a至612f的上部具有直徑隨著下降而增大的斜坡,因此半導體裝置D下落至精確的裝載位置,同時其位 置沿著斜坡得到適當地控制,甚至當半導體裝置D在早期狀態中並未落在精確位置時。因此,如第七圖所示,當半導體裝置D已經完全落下時,半導體裝置D被精確裝在由引導銷612a至612f的內側限定的矩形區域中。 In other words, since the upper portion of the guide pins 612a to 612f has a slope in which the diameter increases as it descends, the semiconductor device D falls to the precise loading position while its position The placement is appropriately controlled along the slope even when the semiconductor device D does not fall in the precise position in the early state. Therefore, as shown in the seventh figure, when the semiconductor device D has completely fallen, the semiconductor device D is accurately mounted in a rectangular region defined by the inner side of the guide pins 612a to 612f.
儘管第十二圖及其相關描述已經說明和解釋半導體裝置D下落在引導銷612a至612f上方,但是半導體裝置D可以特別地落在引導銷612a至612f的上部(其直徑隨著下降而增大)。因此,半導體裝置D的下落位置可以通過考慮操作設備600的結構和引導銷612a至612f的高度來選擇。 Although the twelfth figure and its related description have explained and explained that the semiconductor device D falls over the guide pins 612a to 612f, the semiconductor device D may particularly fall on the upper portion of the guide pins 612a to 612f (the diameter thereof increases as the diameter decreases) ). Therefore, the drop position of the semiconductor device D can be selected by considering the structure of the operation device 600 and the heights of the guide pins 612a to 612f.
當操作設備600從第十三圖所示狀態相反地操作以降低操作板610時,由操作銷611a和611b操控的鎖閉裝置421和422鬆開,並且鎖閉裝置421和422保持半導體裝置D,如第十四圖所示,從而完成半導體裝置D的裝載。 When the operation device 600 is reversely operated from the state shown in the thirteenth diagram to lower the operation panel 610, the lock devices 421 and 422 operated by the operation pins 611a and 611b are loosened, and the lock devices 421 and 422 hold the semiconductor device D As shown in FIG. 14, the loading of the semiconductor device D is completed.
與此同時,在待測試的半導體裝置的尺寸改變的情況下,例如,更大尺寸的半導體裝置將被測試,僅只需根據待測試的半導體裝置的尺寸來更換操作設備600的操作板610。 At the same time, in the case where the size of the semiconductor device to be tested is changed, for example, a semiconductor device of a larger size will be tested, and only the operation panel 610 of the operation device 600 needs to be replaced according to the size of the semiconductor device to be tested.
第十五A圖與第七圖一致,並且第十五B圖所示之待測試的半導體裝置D2尺寸大於第十五A圖示出的半導體裝置D1的情況。通過第十五A圖和第十五B圖的比較,當如第十五B圖中所示的測試具有比半導體裝置D1尺寸更大尺寸的半導體裝置D2時,操作板被另一操作板替代,其中替代的操作板的引導銷612a'至612f'之間的距離與半導體裝置D2的尺寸一致。在這種情況下,由於***件400的出入孔413a至413f從等分線到外部縱向地形成,因此甚至當面 向彼此的成對的引導銷612a至612f或者612a'至612f'之間的距離增加時,引導銷612a至612f或者612a'至612f'也必定可以穿過出入孔413a至413f。 The fifteenth A and seventh figures are identical, and the size of the semiconductor device D2 to be tested shown in the fifteenth B is larger than that of the semiconductor device D1 shown in the fifteenth A. By comparison of the fifteenth A picture and the fifteenth B picture, when the test as shown in the fifteenth B picture has the semiconductor device D2 having a size larger than that of the semiconductor device D1, the operation panel is replaced by another operation panel The distance between the guide pins 612a' to 612f' of the alternative operation panel coincides with the size of the semiconductor device D2. In this case, since the access holes 413a to 413f of the insert 400 are formed longitudinally from the bisector to the outside, even when When the distance between the pair of guide pins 612a to 612f or 612a' to 612f' of each other increases, the guide pins 612a to 612f or 612a' to 612f' must also pass through the entrance holes 413a to 413f.
於是,如果穿過暴露孔412待暴露的半導體裝置的端部至少是標準的話,那麼有可能僅通過更換操作板610而不更換***件400就可以支援具有不同尺寸的半導體裝置的測試。這裡,半導體裝置的標準化端部的術語僅指的是半導體裝置的最遠端部能夠位於暴露孔412的外部(參見第四圖,許多凹槽形成為對應於半導體裝置的最遠端部,以使得最遠端部能夠***其中預定深度),而不是指半導體裝置端部的數量是相同的。 Thus, if the end of the semiconductor device to be exposed through the exposure hole 412 is at least standard, it is possible to support the test of semiconductor devices having different sizes by merely replacing the operation panel 610 without replacing the interposer 400. Here, the term of the normalized end portion of the semiconductor device only means that the most distal end portion of the semiconductor device can be located outside the exposed hole 412 (see the fourth figure, a plurality of grooves are formed to correspond to the most distal end portion of the semiconductor device, It is possible to insert the most distal portion into a predetermined depth thereof, instead of referring to the number of semiconductor device ends being the same.
依照以上描述的本發明,不同尺寸的半導體裝置可以被裝載在***件中,從而提高資源的再利用。 According to the invention as described above, semiconductor devices of different sizes can be loaded in the interposer, thereby improving resource reuse.
此外,儘管待測試的半導體裝置會改變,由於僅更換操作設備的操作板,因此可減少用於更換所花費的時間,並且可增加測試分選機的工作效率。 Further, although the semiconductor device to be tested may be changed, since only the operation panel of the operation device is replaced, the time taken for replacement can be reduced, and the work efficiency of the test handler can be increased.
此外,能夠被******件的裝載槽中的任何半導體裝置都可以精確地裝載到位。 In addition, any semiconductor device that can be inserted into the loading slot of the insert can be accurately loaded into place.
雖然本發明參考實施例已經顯示和描述,但是本領域技術人員應該知道,可以作出不同的改變和修改而不偏離由所附申請專利範圍限定的本發明的範圍。 Although the present invention has been shown and described with reference to the embodiments of the present invention, it will be understood that various changes and modifications may be made without departing from the scope of the invention as defined by the appended claims.
400‧‧‧***件 400‧‧‧ Inserts
410‧‧‧主體 410‧‧‧ Subject
411‧‧‧裝載槽 411‧‧‧Loading trough
412‧‧‧暴露孔 412‧‧‧Exposing holes
413a‧‧‧出入孔 413a‧‧‧ access hole
413b‧‧‧出入孔 413b‧‧‧ access hole
413c‧‧‧出入孔 413c‧‧‧ access hole
413d‧‧‧出入孔 413d‧‧‧ access hole
413e‧‧‧出入孔 413e‧‧‧ access hole
413f‧‧‧出入孔 413f‧‧‧ access hole
414‧‧‧加固肋 414‧‧‧Reinforcement ribs
415a‧‧‧定位凹口 415a‧‧‧ positioning notch
415b‧‧‧定位凹口 415b‧‧‧ positioning notch
421‧‧‧鎖閉裝置 421‧‧‧Locking device
421a‧‧‧鎖閉部件 421a‧‧‧Locking parts
421b‧‧‧彈簧 421b‧‧ ‧ spring
422‧‧‧鎖閉裝置 422‧‧‧Locking device
422a‧‧‧鎖閉部件 422a‧‧‧Locking parts
422b‧‧‧彈簧 422b‧‧ ‧ spring
Claims (4)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100059349A KR101532952B1 (en) | 2010-06-23 | 2010-06-23 | Method for unloading semiconductor device in testhandler |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201221961A TW201221961A (en) | 2012-06-01 |
TWI436067B true TWI436067B (en) | 2014-05-01 |
Family
ID=45359403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100121721A TWI436067B (en) | 2010-06-23 | 2011-06-22 | Insert for test handler and apparatus for operating the same |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR101532952B1 (en) |
CN (1) | CN102299088B (en) |
TW (1) | TWI436067B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101990973B1 (en) * | 2012-07-30 | 2019-06-19 | 삼성전자 주식회사 | Transfer unit of test handler and method of operating the same |
KR101955194B1 (en) * | 2012-10-26 | 2019-03-08 | (주)테크윙 | Insert for test handler |
KR102102830B1 (en) * | 2014-04-10 | 2020-04-23 | (주)테크윙 | Test handler, pushing device and test tray for testhandler, interface board for tester |
KR102327772B1 (en) * | 2015-09-08 | 2021-11-19 | (주)테크윙 | Opener of handler for testing semiconductor |
EP3553534B1 (en) * | 2018-04-13 | 2024-07-10 | ams AG | Testing apparatus for singulated semiconductor dies with sliding layer |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100702587B1 (en) * | 2005-04-16 | 2007-04-04 | 주식회사 대성엔지니어링 | An insert apparatus with sliding latch for semiconductor test handler |
KR101039744B1 (en) * | 2006-12-30 | 2011-06-08 | (주)테크윙 | Insert module for test tray of test handler and test handler |
KR101039743B1 (en) * | 2006-12-30 | 2011-06-08 | (주)테크윙 | Insert module for test tray of test handler |
US8496113B2 (en) * | 2007-04-13 | 2013-07-30 | Techwing Co., Ltd. | Insert for carrier board of test handler |
KR200444066Y1 (en) * | 2007-04-19 | 2009-04-10 | (주)테크윙 | Insert for test handler |
KR100950327B1 (en) * | 2007-08-31 | 2010-03-31 | (주)테크윙 | Sop type insert for test handler |
KR100950798B1 (en) * | 2008-03-25 | 2010-04-02 | (주)테크윙 | Opening unit for insert of a test tray and method for mounting semiconductor devices thereof |
KR20110093456A (en) * | 2010-02-12 | 2011-08-18 | 삼성전자주식회사 | Insert containing apparatus of semiconductor package |
-
2010
- 2010-06-23 KR KR1020100059349A patent/KR101532952B1/en active IP Right Grant
-
2011
- 2011-06-20 CN CN201110170441.2A patent/CN102299088B/en active Active
- 2011-06-22 TW TW100121721A patent/TWI436067B/en active
Also Published As
Publication number | Publication date |
---|---|
CN102299088A (en) | 2011-12-28 |
KR20110139334A (en) | 2011-12-29 |
TW201221961A (en) | 2012-06-01 |
CN102299088B (en) | 2014-04-02 |
KR101532952B1 (en) | 2015-07-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI436067B (en) | Insert for test handler and apparatus for operating the same | |
US8794613B2 (en) | Device and method for aligning and holding a plurality of singulated semiconductor components in receiving pockets of a terminal carrier | |
US8277162B2 (en) | Unit for opening insert for test tray and method of mounting semiconductor device using the same | |
KR100959372B1 (en) | Transferring Semiconductor, Handler having the same, and Method of Manufacturing Semiconductor using the same | |
US7918641B2 (en) | Handling mechanism of trays with which electronic parts are fed and inspection device of the electronic parts using the mechanism | |
KR100942527B1 (en) | Electronic component testing apparatus | |
KR19990083190A (en) | A tray transfer arm, a tray transfer apparatus using the tray transfer arm, an IC testing apparatus and a tray handling method | |
KR20240026169A (en) | Handler for testing semiconductor | |
US20110265316A1 (en) | Opener for test handler | |
KR20240056701A (en) | Changing apparatus for automatically changing tray on which electronic component can be loaded | |
KR102490589B1 (en) | Insert assembly for receiving electronic device, test tray including the insert assembly and apparatus for opening latch of the insert assembly | |
WO2010134890A1 (en) | System and method for testing and managing camera modules | |
US20070013404A1 (en) | Apparatus, customer tray, and method for testing semiconductor packages | |
KR101304273B1 (en) | Carrier board opener and insert of carrier board for inspection equipment of electric device | |
KR101508507B1 (en) | Picker unit for vision inspection machine | |
KR20220103075A (en) | Stacker for electronic device test handler and electronic device test handler comprising that | |
KR20220103076A (en) | Stacker for electronic device test handler and electronic device test handler comprising that | |
KR101146683B1 (en) | An insert for semiconductor package | |
KR101559396B1 (en) | Method for unloading semiconductor device in testhandler | |
JP2021012121A (en) | Connector inserting/removing system | |
KR20200121192A (en) | Insert for test handler, test handler and method of ejecting an object of test handler | |
KR20080102514A (en) | A semiconductor device transferring apparatus | |
KR20190045106A (en) | Handler for testing semiconductor | |
KR100946695B1 (en) | Handler, Method of Transferring Test-tray, and Method of Manufacturing Semiconductor | |
JPH11321973A (en) | Ic transporting carrier |