TWI436064B - Accelerometer - Google Patents
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- TWI436064B TWI436064B TW97113336A TW97113336A TWI436064B TW I436064 B TWI436064 B TW I436064B TW 97113336 A TW97113336 A TW 97113336A TW 97113336 A TW97113336 A TW 97113336A TW I436064 B TWI436064 B TW I436064B
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Description
本發明涉及加速度計，尤其涉及一種光學式加速度計。 The present invention relates to accelerometers, and more particularly to an optical accelerometer.
近年來，手持遊戲機等消費性電子產品受到消費者之青睞。為了更好地實現人機互動，許多手持設備都引入了加速度計以感測外界加速度變化，而且，越來越多之微機電結構(Microelectronic Mechanical Structure,MEMS)電容式加速度計被應用於手持設備。關於微機電結構電容式加速度計請參閱Beliveau,A.等人於Design & Test of Computers，IEEE，Volume 16,Issue 4,Oct.-Dec.1999 Page(s)：48-56發表之文章“Evaluation of MEMS capacitive accelerometers”。 In recent years, consumer electronic products such as handheld game consoles have been favored by consumers. In order to better achieve human-computer interaction, many handheld devices have introduced accelerometers to sense changes in external acceleration, and more and more Microelectronic Mechanical Structure (MEMS) capacitive accelerometers are used in handheld devices. . For a MEMS accumulator, please refer to the article "Evaluation" by Beliveau, A. et al., Design & Test of Computers, IEEE, Volume 16, Issue 4, Oct.-Dec. 1999 Page(s): 48-56. Of MEMS capacitive accelerometers".
微機電結構電容式加速度計一般具有可動臂和固定臂，可動臂與固定臂之間平行板電容距離改變，而後通過電容-電壓轉換電路將電容變化訊號讀出。然而，可動臂和固定臂之間距畢竟有限，若要具有更高之靈敏度就需要增加可動臂和固定臂之間距，這將帶來體積增加之問題，因此電容式加速度計之靈敏度受限於體積。 The MEMS accelerometer generally has a movable arm and a fixed arm, and the parallel plate capacitance distance between the movable arm and the fixed arm is changed, and then the capacitance change signal is read by the capacitance-voltage conversion circuit. However, the distance between the movable arm and the fixed arm is limited after all. If the sensitivity is higher, the distance between the movable arm and the fixed arm needs to be increased, which causes a problem of volume increase, so the sensitivity of the capacitive accelerometer is limited by the volume. .
有鑒於此，提供一種靈敏度高且體積小之加速度計十分必要。 In view of this, it is necessary to provide an accelerometer with high sensitivity and small volume.
一種加速度計，該加速度計包括一基底、一蓋板、一光源、一具 有第一表面之襯底、一可動板及位於該第一表面之第一錨定件、第二錨定件、第一彈性連接部和第二彈性連接部，該基底與該蓋板構成一封閉空間，該基底承載該襯底，該封閉空間收容該光源，該光源用於提供檢測用光線，該可動板包括一第一透光區和若干非透光區，該可動板兩端分別與該第一彈性連接部和該第二彈性連接部相連，該第一彈性連接部、該第二彈性連接部分別由第一錨定件、第二錨定件錨接於該第一表面，該可動板懸於該第一表面上方且具有一平行於該第一表面之移動方向，該光線經由該可動板之第一透光區照射到該第一表面，該第一表面對應於該可動板之區域、沿該可動板之移動方向交替分佈有複數光電感測器及複數非光電感測區。 An accelerometer comprising a base, a cover, a light source, and a a substrate having a first surface, a movable plate, and a first anchor, a second anchor, a first elastic connecting portion and a second elastic connecting portion on the first surface, the base and the cover plate forming a An enclosed space, the substrate carrying the substrate, the closed space accommodating the light source, the light source is configured to provide light for detection, the movable plate comprises a first light transmissive area and a plurality of non-transparent areas, the movable plate has two ends respectively The first elastic connecting portion is connected to the second elastic connecting portion, and the first elastic connecting portion and the second elastic connecting portion are respectively anchored to the first surface by the first anchoring member and the second anchoring member. The movable plate is suspended above the first surface and has a moving direction parallel to the first surface, and the light is irradiated to the first surface via the first light transmitting area of the movable plate, the first surface corresponding to the movable plate In the region, a plurality of photo-electrical sensors and a plurality of non-photo-electrical sensing regions are alternately distributed along the moving direction of the movable plate.
相對於先前技術，該加速度計之可動板根據所受加速度大小而水準移動，具有光電轉換功能之區域所受之光強也隨可動板之移動而改變，從而影響輸出電流之大小，其靈敏度不受加速度計機械結構和體積之影響。 Compared with the prior art, the movable plate of the accelerometer moves horizontally according to the magnitude of the acceleration received, and the intensity of the light received by the photoelectric conversion function also changes with the movement of the movable plate, thereby affecting the magnitude of the output current, and the sensitivity is not Influenced by the mechanical structure and volume of the accelerometer.
10、60‧‧‧加速度計晶片 10, 60‧‧ ‧ accelerometer chip
12‧‧‧襯底 12‧‧‧Substrate
20、66‧‧‧光電感測區 20, 66‧‧‧Photoelectrically sensitive area
21‧‧‧非光電感測區 21‧‧‧ Non-optical inductance measurement area
30、70‧‧‧可動板 30, 70‧‧‧ movable plate
32‧‧‧第一錨定件 32‧‧‧First anchor
34‧‧‧第二錨定件 34‧‧‧Second anchor
31‧‧‧第一彈性連接部 31‧‧‧First flexible joint
33‧‧‧第二彈性連接部 33‧‧‧Second elastic connection
36、71、72、73‧‧‧透光區 36, 71, 72, 73‧‧ ‧ light transmission area
38‧‧‧不透光區 38‧‧‧Opacity zone
40、80‧‧‧電路 40, 80‧‧‧ circuits
121‧‧‧第一表面 121‧‧‧ first surface
14、15、16、17、18、19、61、62、63、64、65‧‧‧光電感測器 14, 15, 16, 17, 18, 19, 61, 62, 63, 64, 65‧‧‧ Optical Inductance Detectors
50‧‧‧加速度計 50‧‧‧Accelerometer
100‧‧‧基底 100‧‧‧Base
106‧‧‧內部光源 106‧‧‧Internal light source
102‧‧‧蓋板 102‧‧‧ cover
103‧‧‧封閉空間 103‧‧‧Enclosed space
101‧‧‧表面 101‧‧‧ surface
1021‧‧‧外表面 1021‧‧‧ outer surface
1022‧‧‧內表面 1022‧‧‧ inner surface
104‧‧‧反射膜 104‧‧‧Reflective film
圖1係本發明第一實施例提供之加速度計晶片立體示意圖。 1 is a perspective view of an accelerometer chip according to a first embodiment of the present invention.
圖2係圖1中沿II-II方向剖視圖。 Figure 2 is a cross-sectional view taken along line II-II of Figure 1.
圖3係本發明第二實施例提供之加速度計示意圖。 3 is a schematic diagram of an accelerometer according to a second embodiment of the present invention.
圖4係本發明第三實施例提供之加速度計晶片之示意圖。 4 is a schematic diagram of an accelerometer chip provided by a third embodiment of the present invention.
請一併參閱圖1和圖2，本發明第一實施例提供之加速度計晶片10包括襯底12，光電感測區20，非光電感測區21，可動板30，第一 錨定件32和第二錨定件34，第一彈性連接部31和第二彈性連接部33，透光區36，不透光區38和電路單元40。 Referring to FIG. 1 and FIG. 2 together, the accelerometer chip 10 according to the first embodiment of the present invention includes a substrate 12, a photo-sensing area 20, a non-photo-electrical sensing area 21, and a movable plate 30. The anchor member 32 and the second anchor member 34, the first elastic connecting portion 31 and the second elastic connecting portion 33, the light transmitting portion 36, the opaque region 38, and the circuit unit 40.
其中，襯底12之材料為矽或砷化鎵或其他半導體。襯底12具有一個第一表面121，於襯底12上利用互補金屬氧化物半導體(Complementary Metal Oxide Semiconductor,CMOS)工藝，製成光電感測區20，光電感測區20之表面和第一表面121重合。光電感測區20是一光電感測器陣列，具體地，可係電晶體陣列，光電二極體陣列或者光電倍增管陣列。 The material of the substrate 12 is germanium or gallium arsenide or other semiconductor. The substrate 12 has a first surface 121 on which a photo-inductance sensing region 20, a surface of the photo-electric sensing region 20, and a first surface are formed on a substrate 12 by a complementary metal oxide semiconductor (CMOS) process. 121 coincides. The photo-electric sensing region 20 is an array of photo-electrical sensors, and specifically, may be a transistor array, a photodiode array or a photomultiplier tube array.
光電感測區20包括相互平行排列之光電感測器14，15，16，17，18和19。每一光電感測器所於區域之截面大致為一長方形。 The photo-electric sensing region 20 includes photoinductors 14, 15, 16, 17, 18 and 19 arranged in parallel with each other. Each of the photodetectors has a substantially rectangular cross section in the area.
由於光電感測器16和光電感測器17之間距明顯大於光電感測器14和光電感測器15之間距，因此可認為光電感測器14，15和16形成一個分區，於該分區內，每相鄰兩個光電感測區之間，例如光電感測器14和光電感測器15之間，光電感測器15和光電感測器16之間被半導體材料隔開，且每相鄰兩個光電感測區之間距相等。 Since the distance between the photodetector 16 and the photodetector 17 is significantly larger than the distance between the photodetector 14 and the photodetector 15, the photoinductors 14, 15 and 16 can be considered to form a partition within the partition. Between each adjacent two photo-electric sensing regions, such as between the photo-inductor 14 and the photo-inductor 15, the photo-inductor 15 and the photo-inductor 16 are separated by a semiconductor material, and each phase The distance between adjacent two optical sensing areas is equal.
光電感測器17，18和19形成一分區，於該分區內，每相鄰兩個光電感測區之間距相等。 The photoinductors 17, 18 and 19 form a partition in which the distance between each adjacent two photo-electric sensing regions is equal.
當然，光電感測器16和光電感測器17之間距也可等於每個分區內之相鄰兩個光電感測器之間距。 Of course, the distance between the photodetector 16 and the photodetector 17 can also be equal to the distance between two adjacent photodetectors in each partition.
光電感測器14，15，16，17，18和19之間之區域為非光電感測區，其材料與襯底12相同。 The area between the photodetectors 14, 15, 16, 17, 18 and 19 is a non-photo-electrical sensing region, the material of which is the same as that of the substrate 12.
可動板30懸伸於第一表面121上方，且與襯底12平行，其移動方向與襯底12平行，還與光電感測器14之延伸方向垂直。可動板30 是利用微機電結構(Microelectronic Mechanical Structure,MEMS)製程加工形成。一般地，該可動板30之材料為金屬。透光區36和不透光區38設置於可動板30上。 The movable plate 30 is suspended above the first surface 121 and parallel to the substrate 12, and its moving direction is parallel to the substrate 12, and is also perpendicular to the extending direction of the photodetector 14. Movable plate 30 It is formed by Microelectronic Mechanical Structure (MEMS) process. Generally, the material of the movable plate 30 is metal. The light transmitting region 36 and the opaque region 38 are disposed on the movable plate 30.
透光區36是一個形狀大小和光電感測器14、15、16、17、18、19中任一個之寬度都相同之區域，即，是一個截面大致為長方形之狹孔。 The light transmitting region 36 is a region having the same size and the width of any one of the photodetectors 14, 15, 16, 17, 18, 19, that is, a slit having a substantially rectangular cross section.
當加速度計晶片沒有受到外界作用力時，透光區36和非光電感測區21對準，並且透光區36之垂直投影落於非光電感測區21之內。 When the accelerometer chip is not subjected to external forces, the light transmitting region 36 and the non-photo-electrical sensing region 21 are aligned, and the vertical projection of the light-transmitting region 36 falls within the non-photo-electrical sensing region 21.
第一錨定件32和第二錨定件34固定於第一表面121，可動板30兩端分別與第一彈性連接部31和第二彈性連接部33連接，第一彈性連接部31和第二彈性連接部33分別通過第一錨定件32和第二錨定件34錨接於第一表面121，且光電感測區20對應著可動板30之區域，即，位於第一彈性連接部31和第二彈性連接部33所限之範圍之內。第一錨定件32和第二錨定件34之作用在於使可動板30相對襯底12固定連接。第一彈性連接部31和第二彈性連接部33之作用在於：當加速度計晶片10受到外界作用力時，可動板30能沿平行於襯底12沿垂直光電感測器之延伸方向移動。 The first anchoring member 32 and the second anchoring member 34 are fixed to the first surface 121, and the two ends of the movable plate 30 are respectively connected with the first elastic connecting portion 31 and the second elastic connecting portion 33, and the first elastic connecting portion 31 and the first The two elastic connecting portions 33 are respectively anchored to the first surface 121 by the first anchoring member 32 and the second anchoring member 34, and the photo-electric sensing region 20 corresponds to the region of the movable panel 30, that is, at the first elastic connecting portion. 31 and the second elastic connecting portion 33 are limited to the range. The first anchor 32 and the second anchor 34 function to securely connect the movable plate 30 with respect to the substrate 12. The first elastic connecting portion 31 and the second elastic connecting portion 33 function to move the movable plate 30 along the extending direction of the vertical photodetector parallel to the substrate 12 when the accelerometer wafer 10 is subjected to an external force.
光電感測區20與電路40連接，且電路40通常為放大電路，以將光電感測器陣列20所產生之電訊號放大輸出。 The photo-electric sensing region 20 is connected to the circuit 40, and the circuit 40 is usually an amplifying circuit for amplifying and outputting the electrical signals generated by the photo-detector array 20.
加速度計晶片10之工作原理具體如下：當加速度計晶片10不受外力時，可動板30之透光區36位於第一表面121之光電感測區20以外，由於此時光電感測區20沒有感光，因此沒有電訊號輸出。 The working principle of the accelerometer chip 10 is specifically as follows: when the accelerometer chip 10 is not subjected to an external force, the light transmitting region 36 of the movable plate 30 is located outside the photo-electric sensing region 20 of the first surface 121, since the photo-electric sensing region 20 does not have Sensitive, so there is no electrical signal output.
當加速度計晶片10受外力時，根據牛頓第二定律(F=ma，其中F表示物體所受外力大小，m表示物體質量，a指物體所受加速度大小)，加速度計晶片10具有一定之加速度，使得可動板30相對襯底12水準移動，因此透光區36相對襯底12移動，光電感測區20之光電感測陣列將感測到外部之光訊號。 When the accelerometer chip 10 is subjected to an external force, according to Newton's second law (F=ma, where F represents the magnitude of the external force received by the object, m represents the mass of the object, and a refers to the magnitude of the acceleration of the object), the accelerometer wafer 10 has a certain acceleration. The movable plate 30 is moved relative to the substrate 12, so that the transparent region 36 moves relative to the substrate 12, and the photo-sensing array of the photo-sensing region 20 senses the external optical signal.
例如，於第一時刻，透光區36位於光電感測器18之上方，光電感測器18感光，因此只有光電感測器18有電訊號輸出；於第二時刻，透光區36位於光電感測器19之上方，光電感測器19感光，因此只有光電感測器19有電訊號輸出。 For example, at the first moment, the light transmissive region 36 is located above the photo-sensing device 18, and the photo-sensing device 18 is sensitive, so that only the photo-electrical sensor 18 has an electrical signal output; at the second moment, the light-transmitting region 36 is located at the optoelectronic device. Above the sensor 19, the photo-sensing device 19 is sensitized, so only the photo-sensing device 19 has an electrical signal output.
電路40記錄兩次電訊號之時間差，又由於光電感測器18及光電感測器19之間之距離是已知量，因此可計算出加速度計晶片10所受之加速度變化量。 Circuit 40 records the time difference between the two electrical signals, and since the distance between photodetector 18 and photodetector 19 is a known amount, the amount of acceleration variation experienced by accelerometer wafer 10 can be calculated.
當然，也可得到暫態加速度值，或該訊號作為其他功能性結構之指令。 Of course, the value of the transient acceleration can also be obtained, or the signal can be used as an instruction for other functional structures.
另外，每個光電探測器所接收之光訊號之性質，例如光強、頻率等隨著外界加速度之變化而變化，都會影響光電感測器陣列電訊號之輸出。 In addition, the nature of the optical signal received by each photodetector, such as light intensity, frequency, etc., varies with changes in external acceleration, which affects the output of the optical detector array electrical signal.
特別地，當可動板30受到外界作用力以固定頻率振動時，於第一時刻和第二時刻，透光區36都位於光電感測器18之上方使得光電感測器18輸出電訊號，即，於一個週期內，光電感測器18輸出兩次電訊號，由於光電感測器18與透光區36所能到達之最遠處之間距確定且已知，便可根據一個週期內之電訊號測得加速度變化量。若初始速度為0，則測得一個週期後之暫態加速度。 In particular, when the movable plate 30 is vibrated at a fixed frequency by an external force, the light transmitting region 36 is located above the photodetector 18 at the first time and the second time so that the photodetector 18 outputs an electrical signal, that is, In one cycle, the photo-sensing device 18 outputs two electrical signals, and the distance between the photo-inductance detector 18 and the farthest distance that the light-transmitting region 36 can reach is determined and known, and the telecommunication can be based on one cycle. The amount of acceleration measured is measured. If the initial velocity is 0, the transient acceleration after one cycle is measured.
請參看圖3，加速度計50包括基底100，內部光源106，蓋板102和加速度計晶片10。其中，基底100和蓋板102形成一封閉空間103，該封閉空間103容納加速度計晶片10和內部光源106，基底100和蓋板102可為該加速度計提供機械保護。 Referring to FIG. 3, the accelerometer 50 includes a substrate 100, an internal light source 106, a cover plate 102, and an accelerometer wafer 10. The substrate 100 and the cover plate 102 form a closed space 103 that houses the accelerometer chip 10 and the internal light source 106. The substrate 100 and the cover plate 102 provide mechanical protection for the accelerometer.
基底100具有一內表面101，加速度計晶片10之襯底12位於表面101且加速度計晶片10和基底100以引線鍵合(wire bonding)之方式進行電性相連。 The substrate 100 has an inner surface 101 on which the substrate 12 of the accelerometer wafer 10 is located and the accelerometer wafer 10 and the substrate 100 are electrically connected by wire bonding.
內部光源106位於基底表面101，且通過管芯鍵合(die bonding)之方式與該基底100進行電性相連。 The internal light source 106 is located on the substrate surface 101 and electrically connected to the substrate 100 by die bonding.
優選地，內部光源106採用發光效率較高耗電量低易封裝之發光二極體(LED)。內部光源可是一個或複數獨立封裝之發光單元，也可是一個發光單元陣列。 Preferably, the internal light source 106 adopts a light-emitting diode (LED) with high luminous efficiency and low power consumption and easy packaging. The internal light source can be one or a plurality of individually packaged light units or an array of light units.
蓋板102為一玻璃板，其具有一個外表面1021和內表面1022，外表面1021鍍有反射膜104。優選地，該反射膜104為高反射率反射膜，例如通過鍍一層金屬反射膜或絕緣膜(dielectric coating)來實現高反射率。反射膜104之作用在於使內部光源106發出之光經過反射膜104之反射到達加速度計晶片10。 The cover plate 102 is a glass plate having an outer surface 1021 and an inner surface 1022, and the outer surface 1021 is plated with a reflective film 104. Preferably, the reflective film 104 is a high reflectivity reflective film, for example, by plating a metal reflective film or a dielectric coating to achieve high reflectance. The function of the reflective film 104 is to cause the light emitted by the internal light source 106 to pass through the reflection of the reflective film 104 to reach the accelerometer wafer 10.
根據實際需要，蓋板102也可由不透明材料製成。另外，反射膜104既可鍍於外表面1021，也可鍍於內表面1022，也可兩面都鍍，以提高加速度計晶片10之受光量。 The cover plate 102 can also be made of an opaque material according to actual needs. In addition, the reflective film 104 may be plated on the outer surface 1021, or plated on the inner surface 1022, or plated on both sides to increase the amount of light received by the accelerometer wafer 10.
請參看圖4，本發明第三實施例提供之加速度計晶片60與第一實施例提供之加速度計晶片10基本相同，不同之處在於：加速度計晶片60為振幅型加速度計晶片； 可動板70包括三個透光區71，72和73，且透光區71、72、73之寬度相等。 Referring to FIG. 4, the accelerometer chip 60 provided by the third embodiment of the present invention is substantially the same as the accelerometer chip 10 provided by the first embodiment, except that the accelerometer chip 60 is an amplitude type accelerometer chip; The movable plate 70 includes three light transmitting regions 71, 72 and 73, and the widths of the light transmitting regions 71, 72, 73 are equal.
光電感測區66包括一個光電感測器陣列，其包括光電感測器61，62，63，64和65；其中，光電感測器61和光電感測器62之間距等於透光區71之寬度；光電感測器63和光電感測器64之間距等於透光區72之三倍寬度；光電感測器64和光電感測器65之間距等於透光區73之五倍寬度。 The photo-electrical sensing area 66 includes an array of photo-electrical sensors including photo-inductors 61, 62, 63, 64 and 65; wherein the distance between the photo-inductor 61 and the photo-inductor 62 is equal to the transmissive area 71 Width; the distance between the photodetector 63 and the photodetector 64 is equal to three times the width of the transparent region 72; the distance between the photodetector 64 and the photodetector 65 is equal to five times the width of the transparent region 73.
靜止時，透光區71位於光電感測器61和光電感測器62中間，透光區72位於光電感測器63和光電感測器64中間，透光區73位於光電感測器64和光電感測器65中間，且每個透光區之垂直投影區落於與之相鄰之兩個光電感測器之間，以保證測量之精確性。 When stationary, the light transmitting region 71 is located between the photodetector 61 and the photodetector 62, the light transmitting region 72 is located between the photodetector 63 and the photoinductor 64, and the light transmitting region 73 is located at the photodetector 64 and In the middle of the photo-sensing device 65, the vertical projection area of each of the light-transmissive areas falls between the two photo-sensing detectors adjacent thereto to ensure the accuracy of the measurement.
當加速度計晶片60受到外力時，於同一時刻，至少有一個透光區落於至少一個光電感測器上方，即，同一時刻，至少有一個光電感測器輸出電訊號。 When the accelerometer chip 60 is subjected to an external force, at least one of the light transmitting regions falls over the at least one photo-sensing device at the same time, that is, at least one photo-sensing device outputs an electric signal at the same time.
當可動板70受到外界作用力而移動時，由於受力大小不同，可動板70之移動幅度不同，對應地，不同位置之光電感測器有電訊號輸出。例如，可動板70之移動幅度較小時，光電感測器61或62輸出電訊號，若移動幅度進一步加大，則光電感測器63或64輸出電訊號，依此類推，再由電路80來判斷電訊號之輸出時間差，從而得到加速度變化量。 When the movable plate 70 is moved by the external force, the moving plate 70 has a different moving range due to the different force, and correspondingly, the optical detectors at different positions have an electrical signal output. For example, when the moving range of the movable plate 70 is small, the photo-sensing device 61 or 62 outputs an electric signal. If the moving amplitude is further increased, the photo-inductor 63 or 64 outputs a telecommunication signal, and so on, and then the circuit 80 To determine the output time difference of the electrical signal, thereby obtaining the amount of acceleration change.
可理解，還可進一步增設第四個透光區，第四個透光區之垂直投影區與相鄰之光電感測器之距離是透光區寬度之四倍。 It can be understood that a fourth light-transmissive region can be further added. The distance between the vertical projection region of the fourth light-transmissive region and the adjacent photo-electric detector is four times the width of the light-transmitting region.
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申 請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. please. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
10‧‧‧加速度計晶片 10‧‧‧Accelerometer chip
12‧‧‧襯底 12‧‧‧Substrate
121‧‧‧第一表面 121‧‧‧ first surface
14、15、16、17、18、19‧‧‧光電感測器 14, 15, 16, 17, 18, 19‧‧‧ Optical Inductance Detectors
20‧‧‧光電感測區 20‧‧‧Light Inductance Area
21‧‧‧非光電感測區 21‧‧‧ Non-optical inductance measurement area
30‧‧‧可動板 30‧‧‧ movable plate
32‧‧‧第一錨定件 32‧‧‧First anchor
31‧‧‧第一彈性連接部 31‧‧‧First flexible joint
33‧‧‧第二彈性連接部 33‧‧‧Second elastic connection
34‧‧‧第二錨定件 34‧‧‧Second anchor
36‧‧‧透光區 36‧‧‧Lighting area
38‧‧‧不透光區 38‧‧‧Opacity zone
40‧‧‧電路 40‧‧‧ Circuitry
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97113336A TWI436064B (en) | 2008-04-11 | 2008-04-11 | Accelerometer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97113336A TWI436064B (en) | 2008-04-11 | 2008-04-11 | Accelerometer |
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| Publication Number | Publication Date |
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| TW200942820A TW200942820A (en) | 2009-10-16 |
| TWI436064B true TWI436064B (en) | 2014-05-01 |
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| TW97113336A TWI436064B (en) | 2008-04-11 | 2008-04-11 | Accelerometer |
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| TW (1) | TWI436064B (en) |
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| TWI451089B (en) * | 2009-11-12 | 2014-09-01 | Pixart Imaging Inc | Optical detection method and optical mems detector, and method for making mems detector |
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| TW200942820A (en) | 2009-10-16 |
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