TWI435831B - Packaging assembly - Google Patents

Description

包裝串列Packing list

本發明係有關於一種包裝串列，特別是有關於一種具有複數個包裝組件之包裝串列。The present invention relates to a package string, and more particularly to a package series having a plurality of package components.

電子裝置(如筆記型電腦或平板電腦)的出貨包裝型式通常是以複數個子包裝同時置入一外箱中以方便運輸及搬運，然而此種方式常造成包裝材料與包裝空間的浪費。因此如何改善傳統的包裝型式，使電子裝置在運輸及搬運的過程中，不易因衝擊與振動等外力而造成損傷，同時減少包裝體積與包裝材料的浪費，始成為一重要之課題。The shipping package type of an electronic device (such as a notebook computer or a tablet computer) is usually placed in an outer box at the same time for convenient transportation and handling. However, this method often causes waste of packaging materials and packaging space. Therefore, how to improve the traditional packaging type, so that the electronic device in the process of transportation and handling, it is not easy to damage caused by external forces such as impact and vibration, and at the same time reduce the packaging volume and waste of packaging materials, has become an important issue.

本發明之一實施例提供一種包裝串列，包括複數個包裝組件，其中包裝組件相互連接，且每一包裝組件包括二個包裝單元以及一連接件，前述包裝單元用以分別容納一電子裝置，前述連接件連接二個包裝單元，其中連接件與二個包裝單元形成一ㄇ字型結構，且連接件大致垂直於二個包裝單元。An embodiment of the present invention provides a package series comprising a plurality of package components, wherein the package components are connected to each other, and each package component comprises two package units and a connector, wherein the package unit is configured to respectively receive an electronic device. The connecting member connects two packaging units, wherein the connecting member and the two packaging units form a U-shaped structure, and the connecting member is substantially perpendicular to the two packaging units.

於一實施例中，前述每一包裝單元包括一底板、一弧頂部以及一彎折部，前述弧頂部與底板相連接並形成一第一曲面，其中第一曲面與底板之間形成一開口，開口於一第一方向上具有一第一高度，且第一方向垂直於底板，前述彎折部與底板相連接且鄰近開口，且彎折部與弧頂部位在底板的同一側，其中彎折部於第一方向上具有一第二高度，且第二高度大於第一高度。In one embodiment, each of the packaging units includes a bottom plate, an arc top, and a bent portion. The top of the arc is connected to the bottom plate to form a first curved surface, wherein an opening is formed between the first curved surface and the bottom plate. The opening has a first height in a first direction, and the first direction is perpendicular to the bottom plate, the bent portion is connected to the bottom plate and adjacent to the opening, and the bent portion and the top of the arc are located on the same side of the bottom plate, wherein the bending is The portion has a second height in the first direction, and the second height is greater than the first height.

於一實施例中，前述每一包裝單元更包括一側板，且側板與底板以及弧頂部相連接。In one embodiment, each of the foregoing packaging units further includes a side panel, and the side panel is coupled to the bottom panel and the top of the arc.

於一實施例中，前述彎折部具有一第二曲面，且第二曲面遮蔽開口。In an embodiment, the bent portion has a second curved surface, and the second curved surface shields the opening.

於一實施例中，前述包裝組件之二個底板位於包裝組件的相反側。In one embodiment, the two bottom plates of the aforementioned package assembly are located on opposite sides of the package assembly.

於一實施例中，前述複數個包裝組件中的複數個彎折部相互抵接。In one embodiment, the plurality of bent portions of the plurality of package assemblies abut each other.

於一實施例中，前述連接件位在包裝串列的同一側。In one embodiment, the connectors are located on the same side of the package train.

於一實施例中，前述二個包裝單元與連接件之間分別形成有一刻痕線。In an embodiment, a score line is formed between the two packaging units and the connecting member.

於一實施例中，前述相鄰之複數個包裝組件之間形成有一刻痕線。In one embodiment, a score line is formed between the plurality of adjacent package components.

於一實施例中，前述包裝串列之材質為瓦楞紙。In an embodiment, the material of the packaging series is corrugated paper.

請一併參閱第1、2圖，本發明一實施例之包裝串列包括複數個包裝組件300，其材質可為瓦楞紙或其他紙材。前述的複數個包裝組件300相互連接，且每一個包裝組件300包括二個包裝單元100以及一連接件200，其中每個包裝單元100皆可用以容納一電子裝置108(第2圖)。此外，前述連接件200係連接二個包裝單元100，其中連接件200可相對於包裝單元100彎折並大致與包裝單元100相互垂直，使得連接件200與二個包裝單元100可形成一ㄇ字型結構。Please refer to FIGS. 1 and 2 together. The package series according to an embodiment of the present invention includes a plurality of packaging components 300, which may be made of corrugated paper or other paper materials. The foregoing plurality of package assemblies 300 are interconnected, and each package assembly 300 includes two packaging units 100 and a connector 200, wherein each of the packaging units 100 can be used to accommodate an electronic device 108 (Fig. 2). In addition, the connecting member 200 is connected to the two packaging units 100, wherein the connecting member 200 can be bent relative to the packaging unit 100 and substantially perpendicular to the packaging unit 100, so that the connecting member 200 and the two packaging units 100 can form a single character. Type structure.

在第2圖中之包裝單元100主要係由一底板101、一弧頂部102、一側板103以及一彎折部104所組成。如第2圖所示，前述弧頂部102與底板101相連接並形成一第一曲面107，其中一電子裝置108(例如為一筆記型電腦或平板電腦)可容置於底板101與弧頂部102之間，此外第一曲面107與底板101之間形成有一開口105，開口105於Z軸方向(第一方向)上具有一第一高度A1。在本實施例中，前述側板103與底板101以及弧頂部102相連接，且位在包裝單元100中相對於開口105的另一側。The packaging unit 100 in FIG. 2 is mainly composed of a bottom plate 101, an arc top 102, a side plate 103, and a bent portion 104. As shown in FIG. 2, the arc top 102 is connected to the bottom plate 101 and forms a first curved surface 107. An electronic device 108 (for example, a notebook computer or a tablet computer) can be placed on the bottom plate 101 and the arc top 102. Further, an opening 105 is formed between the first curved surface 107 and the bottom plate 101, and the opening 105 has a first height A1 in the Z-axis direction (first direction). In the present embodiment, the aforementioned side panel 103 is connected to the bottom plate 101 and the arc top 102, and is located on the other side of the packaging unit 100 with respect to the opening 105.

請繼續參閱第2圖，前述彎折部104與底板101相連接並鄰近開口105，且彎折部104與弧頂部102係位在底板101的同一側。特別地是，彎折部104於Z軸方向上具有一第二高度A2，且第二高度A2大於第一高度A1。此外，由第2圖可以看出彎折部104形成有一第二曲面106，其中第二曲面106可用以遮蔽開口105。Continuing to refer to FIG. 2, the aforementioned bent portion 104 is coupled to the bottom plate 101 and adjacent to the opening 105, and the bent portion 104 is tied to the arc top portion 102 on the same side of the bottom plate 101. In particular, the bent portion 104 has a second height A2 in the Z-axis direction, and the second height A2 is greater than the first height A1. In addition, it can be seen from FIG. 2 that the bent portion 104 is formed with a second curved surface 106, wherein the second curved surface 106 can be used to shield the opening 105.

需特別說明的是，藉由前述彎折部104遮蔽開口105可防止電子裝置108滑出包裝單元100。此外，當包裝單元100在運送時，透過底板101以及弧頂部102所形成之第一曲面107可吸收來自垂直方向(第2圖中的Z軸方向)的衝擊力，透過側板103以及彎折部104所形成的第二曲面106可吸收來自水平方向(第2圖中的Y軸方向)的衝擊力，透過底板101以及弧頂部102所形成的第一曲面107更可吸收來自另一水平方向(第2圖中的X軸方向)的衝擊力。如前所述，藉由包裝單元100之特殊造型以及瓦楞紙材本身所具有的緩衝特性，使得包裝單元100可以妥善的保護其內的電子裝置108。It should be particularly noted that the opening of the opening 105 by the bending portion 104 prevents the electronic device 108 from sliding out of the packaging unit 100. In addition, when the packaging unit 100 is being transported, the first curved surface 107 formed by the bottom plate 101 and the arc top portion 102 can absorb the impact force from the vertical direction (the Z-axis direction in FIG. 2), through the side plate 103 and the bent portion. The second curved surface 106 formed by 104 can absorb the impact force from the horizontal direction (the Y-axis direction in FIG. 2), and the first curved surface 107 formed through the bottom plate 101 and the arc top portion 102 can absorb from the other horizontal direction ( The impact force in the X-axis direction in Fig. 2). As described above, the packaging unit 100 can properly protect the electronic device 108 therein by the special shape of the packaging unit 100 and the cushioning characteristics of the corrugated paper itself.

再請一併參閱第1、3圖，前述每一個包裝組件300中的連接件200係連接二個包裝單元100，且前述二個包裝單元100中的底板101分別位於包裝組件300的相反側，藉由連接件200可使得二個包裝單元100之間間隔一固定的距離，以避免包裝單元100之間相互擠壓碰撞。由第1圖可以看出，複數個包裝組件300相互連接，且每個連接件200在彎折後均位在包裝串列的同一側；特別地是，由於包裝單元100的開口105均位在包裝串列的同一側，藉此可讓使用者方便拿取其中的電子裝置108。如第3圖所示，各包裝組件300中的彎折部104係彼此相向抵接，並可藉由第二曲面106有效地吸收衝擊力。Referring to FIG. 1 and FIG. 3 together, the connecting member 200 in each of the packaging assemblies 300 is connected to the two packaging units 100, and the bottom plates 101 of the two packaging units 100 are respectively located on opposite sides of the packaging assembly 300. The two packaging units 100 can be separated by a fixed distance by the connecting member 200 to prevent the packaging units 100 from colliding with each other. As can be seen from Fig. 1, a plurality of package assemblies 300 are connected to each other, and each of the connectors 200 is positioned on the same side of the package string after being bent; in particular, since the opening 105 of the package unit 100 is in position The same side of the package is packed, thereby allowing the user to conveniently access the electronic device 108 therein. As shown in FIG. 3, the bent portions 104 of the respective package assemblies 300 are abutting against each other, and the impact force can be effectively absorbed by the second curved surface 106.

需特別說明的是，在包裝單元100與連接件200之間另形成有刻痕線109(第1圖)，且相鄰之包裝組件300間亦形成有刻痕線109。請參考第3、4圖，當需要取出包裝串列中的任一個包裝單元100時，可撕開刻痕線109並使包裝單元100由包裝串列中分離。如第4圖所示，前述包裝串列可依不同尺寸的外箱400選擇適合之包裝單元100串連數量，並將包裝串列以使彎折部104鄰近外箱開口的方式放入外箱400之內。在運輸及搬運的過程中，藉由包裝單元100的特殊造型以及瓦楞紙材本身所具有的緩衝特性，使得每一包裝單元100可以妥善的保護其內的電子裝置108，同時各包裝單元100的彎折部104更可吸收來自外部的衝擊力。It should be particularly noted that a score line 109 (FIG. 1) is additionally formed between the packaging unit 100 and the connector 200, and a score line 109 is also formed between the adjacent package assemblies 300. Referring to Figures 3 and 4, when it is desired to remove any one of the packaging units 100, the score line 109 can be torn and the packaging unit 100 can be separated from the package series. As shown in FIG. 4, the foregoing packaging series can select a suitable number of packaging units 100 in series according to different sizes of the outer box 400, and arrange the packaging in a manner so that the bending portion 104 is placed in the outer box adjacent to the opening of the outer box. Within 400. In the process of transportation and transportation, by the special shape of the packaging unit 100 and the cushioning property of the corrugated paper itself, each packaging unit 100 can properly protect the electronic device 108 therein, while the bending of each packaging unit 100 The folded portion 104 can absorb the impact force from the outside.

綜上所述，本發明提供一種包裝串列，包含複數個相互連接的包裝組件，每一包裝組件包括二個包裝單元以及一連接件，其中連接件連接二個包裝單元，且連接件與二個包裝單元形成一ㄇ字型結構；其中，每一包裝單元可藉由一曲面造型吸收來自多方向的衝擊力，此外透過包裝串列與外箱結構相互搭配，則可更完善地保護其內的電子裝置，同時減少包裝體積與包裝材料的浪費。In summary, the present invention provides a packaging series comprising a plurality of interconnected packaging components, each packaging component comprising two packaging units and a connecting member, wherein the connecting member connects the two packaging units, and the connecting member and the second The packaging units form a ㄇ-shaped structure; wherein each packaging unit can absorb the impact force from multiple directions by a curved surface shape, and the inner packing structure and the outer box structure can be more perfectly protected. The electronic device reduces the waste of packaging volume and packaging materials.

雖然本發明以前述之實施例揭露如上，然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可做些許之更動與潤飾。因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. Those skilled in the art having the ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100．．．包裝單元100. . . Packing unit

101．．．底板101. . . Bottom plate

102．．．弧頂部102. . . Arc top

103．．．側板103. . . Side panel

104．．．彎折部104. . . Bending section

105．．．開口105. . . Opening

106．．．第二曲面106. . . Second surface

107．．．第一曲面107. . . First surface

108．．．電子裝置108. . . Electronic device

109．．．刻痕線109. . . Scoring line

200．．．連接件200. . . Connector

300．．．包裝組件300. . . Packaging component

400．．．外箱400. . . Outer box

A1．．．第一高度A1. . . First height

A2．．．第二高度A2. . . Second height

第1圖表示本發明一實施例之包裝串列示意圖；1 is a schematic view showing a package series according to an embodiment of the present invention;

第2圖表示本發明一實施例之包裝單元的示意圖。Fig. 2 is a schematic view showing a packaging unit according to an embodiment of the present invention.

第3圖表示本發明一實施例一包裝單元由包裝串列分離之示意圖；以及Figure 3 is a view showing a packaging unit separated from a package by an embodiment of the present invention;

第4圖表示本發明一實施例之包裝串列設置於外箱內的示意圖。Fig. 4 is a view showing a package series arranged in an outer casing according to an embodiment of the present invention.

100．．．包裝單元100. . . Packing unit

109．．．刻痕線109. . . Scoring line

200．．．連接件200. . . Connector

300．．．包裝組件300. . . Packaging component

Claims (6)

一種包裝串列，包括：複數個包裝組件，其中該些包裝組件相互連接，且每一該包裝組件包括：二個包裝單元，用以分別容納一電子裝置；以及一連接件，連接該些包裝單元，且該連接件大致垂直於該些包裝單元；其中每一該包裝單元包括：一底板；一弧頂部，與該底板相連接並形成一第一曲面，其中該第一曲面與該底板之間形成一開口，該開口於一第一方向上具有一第一高度，且該第一方向垂直於該底板；以及一彎折部，與該底板相連接且鄰近該開口，且該彎折部與該弧頂部位在該底板的同一側，其中該彎折部於該第一方向上具有一第二高度，且該第二高度大於該第一高度。 A packaging series comprising: a plurality of packaging components, wherein the packaging components are connected to each other, and each packaging component comprises: two packaging units for respectively accommodating an electronic device; and a connecting component connecting the packaging a unit, and the connecting member is substantially perpendicular to the packaging units; wherein each of the packaging units comprises: a bottom plate; an arc top portion connected to the bottom plate and forming a first curved surface, wherein the first curved surface and the bottom plate Forming an opening, the opening has a first height in a first direction, and the first direction is perpendicular to the bottom plate; and a bent portion is connected to the bottom plate and adjacent to the opening, and the bent portion The top of the arc is located on the same side of the bottom plate, wherein the bent portion has a second height in the first direction, and the second height is greater than the first height. 如申請專利範圍第1項所述之包裝串列，其中每一該包裝單元更包括一側板，且該側板與該底板以及該弧頂部相連接。 The packaging series of claim 1, wherein each of the packaging units further comprises a side panel, and the side panel is connected to the bottom panel and the top of the arc. 如申請專利範圍第1項所述之包裝串列，其中該彎折部形成一第二曲面，且該第二曲面遮蔽該開口。 The package series of claim 1, wherein the bent portion forms a second curved surface, and the second curved surface shields the opening. 如申請專利範圍第1項所述之包裝串列，其中該些包裝單元之該些底板位於該包裝組件的相反側。 The package of claim 1, wherein the bottom plates of the packaging units are located on opposite sides of the package assembly. 如申請專利範圍第1項所述之包裝串列，其中該些包裝組件中的該些彎折部相互抵接。 The packaging series of claim 1, wherein the bending portions of the packaging components abut each other. 如申請專利範圍第5項所述之包裝串列，其中該連 接件位在該包裝串列的同一側。 Such as the packaging series described in claim 5, wherein the company The connectors are located on the same side of the package.