TWI429391B - Backlight module and heat-dissipation assembly - Google Patents
Backlight module and heat-dissipation assembly Download PDFInfo
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- TWI429391B TWI429391B TW100105566A TW100105566A TWI429391B TW I429391 B TWI429391 B TW I429391B TW 100105566 A TW100105566 A TW 100105566A TW 100105566 A TW100105566 A TW 100105566A TW I429391 B TWI429391 B TW I429391B
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Description
本發明關於一種背光模組，且特別是有關於用於背光模組的一種散熱組件。The present invention relates to a backlight module, and more particularly to a heat dissipating assembly for a backlight module.
圖4為一習知背光模組的示意圖。如圖4所示，背光模組100包含一導光板102、一發光二極體燈條104、一背板106及一膠框108。背板106設置於導光板102的底側，且膠框108扣接至背板106以固定導光板102、發光二極體燈條104等元件。背板106具有一彎折部106a並且形成一L字型的截面外形，發光二極體燈條104貼附於彎折部106a的一側。於此一習知設計中，當膠框108扣接至背板106後，膠框108會覆蓋背板106的彎折部106a，使彎折部106a無法直接接觸空氣，導致發光二極體燈條104產生的熱能不易散逸，且背板106的彎折設計使背光模組100整體的厚度增加因此難以薄型化。另外，例如台灣專利公開第200801674號、第200743872號、台灣專利公告第M294189號及美國專利公告第US7591578號均揭露相關於光源固定件上設置散熱鰭片以提高散熱效果的設計，但這些設計無法有效降低整體的組裝厚度且其散熱效果仍需進一步提昇。4 is a schematic diagram of a conventional backlight module. As shown in FIG. 4 , the backlight module 100 includes a light guide plate 102 , a light-emitting diode light strip 104 , a back plate 106 , and a plastic frame 108 . The backplane 106 is disposed on the bottom side of the light guide plate 102, and the plastic frame 108 is fastened to the backplane 106 to fix components such as the light guide plate 102, the light emitting diode strip 104, and the like. The back plate 106 has a bent portion 106a and forms an L-shaped cross-sectional shape, and the light-emitting diode light strip 104 is attached to one side of the bent portion 106a. In this prior art design, after the plastic frame 108 is fastened to the back plate 106, the plastic frame 108 covers the bent portion 106a of the back plate 106, so that the bent portion 106a cannot directly contact the air, resulting in the light emitting diode lamp. The heat generated by the strip 104 is not easily dissipated, and the bending design of the backing plate 106 increases the thickness of the entire backlight module 100, so that it is difficult to be thinned. In addition, for example, Taiwan Patent Publication No. 200801674, No. 200743872, Taiwan Patent Publication No. M294189, and U.S. Patent Publication No. US7591578 disclose designs relating to providing heat dissipation fins on a light source fixing member to improve heat dissipation, but these designs cannot Effectively reduce the overall assembly thickness and its heat dissipation effect needs to be further improved.
本發明提供一種具有良好散熱效果及低組裝厚度的散熱組件及背光模組。The invention provides a heat dissipation component and a backlight module with good heat dissipation effect and low assembly thickness.
本發明的其他目的和優點可以從本發明所揭露的技術特徵中得到進一步的了解。Other objects and advantages of the present invention will become apparent from the technical features disclosed herein.
為達上述之一或部份或全部目的或是其他目的，本發明之一實施例提供一種散熱組件，包含一背板、一第一散熱結構及一第二散熱結構。第一散熱結構包含一基部與一側部，側部貼附一發光元件，基部與側部夾一角度且基部具有相對的一第一表面及一第二表面，第一表面面向背板且第二表面背向背板，其中背板疊合部分第一表面且側部疊合部分第二表面。第二散熱結構設置於未疊合背板的部分第一表面上。An embodiment of the present invention provides a heat dissipating component including a backing plate, a first heat dissipating structure, and a second heat dissipating structure for achieving one or a portion of the above or other objectives. The first heat dissipation structure includes a base portion and a side portion, the side portion is attached with a light-emitting element, the base portion and the side portion are at an angle, and the base portion has a first surface and a second surface opposite to each other, and the first surface faces the back plate and the first surface The two surfaces face away from the backing plate, wherein the backing plate overlaps a portion of the first surface and the side portions overlap a portion of the second surface. The second heat dissipation structure is disposed on a portion of the first surface of the unfolded backplane.
本發明之另一實施例提供一種背光模組，包含一導光板、一發光元件、一背板、一第一散熱結構、一第二散熱結構及一膠框。導光板具有一入光面，發光元件設置於鄰近入光面位置處，且背板設置於導光板的一底側。第一散熱結構包含一基部與一側部，側部貼附一發光元件，基部與側部夾一角度且基部具有相對的一第一表面及一第二表面，第一表面面向背板且第二表面背向背板，其中背板疊合部分第一表面且側部疊合部分第二表面。第二散熱結構設置於未疊合背板的部分第一表面上，膠框固定於背板上並覆蓋部分第一散熱結構，且膠框暴露第二散熱結構。Another embodiment of the present invention provides a backlight module including a light guide plate, a light-emitting element, a back plate, a first heat dissipation structure, a second heat dissipation structure, and a plastic frame. The light guide plate has a light incident surface, the light emitting element is disposed adjacent to the light incident surface, and the back plate is disposed on a bottom side of the light guide plate. The first heat dissipation structure includes a base portion and a side portion, the side portion is attached with a light-emitting element, the base portion and the side portion are at an angle, and the base portion has a first surface and a second surface opposite to each other, and the first surface faces the back plate and the first surface The two surfaces face away from the backing plate, wherein the backing plate overlaps a portion of the first surface and the side portions overlap a portion of the second surface. The second heat dissipation structure is disposed on a portion of the first surface of the unfolded backplane, the plastic frame is fixed on the backplane and covers a portion of the first heat dissipation structure, and the plastic frame exposes the second heat dissipation structure.
於一實施例中，第二散熱結構背向第一散熱結構的一側面實質上平齊背板背向第一散熱結構的一側面。In one embodiment, a side of the second heat dissipation structure facing away from the first heat dissipation structure is substantially flush with the back plate facing away from a side of the first heat dissipation structure.
於一實施例中，第二散熱結構包含複數散熱鰭片且發光元件為至少一發光二極體燈條，散熱鰭片相對基部的第一表面的高度與背板的厚度實質上相同，且散熱鰭片的長軸方向與發光二極體燈條的長軸方向實質上平行。In one embodiment, the second heat dissipation structure includes a plurality of heat dissipation fins and the light emitting element is at least one light emitting diode light strip. The height of the heat dissipation fin relative to the first surface of the base is substantially the same as the thickness of the back plate, and the heat dissipation The long axis direction of the fin is substantially parallel to the long axis direction of the light emitting diode strip.
於一實施例中，第一散熱結構及第二散熱結構為一鋁擠型材料所構成，且背板係由一鋁擠型材料及一鋼材的至少其中之一所構成。In one embodiment, the first heat dissipation structure and the second heat dissipation structure are formed of an aluminum extruded material, and the back plate is composed of at least one of an aluminum extruded material and a steel material.
於一實施例中，第一散熱結構的基部的厚度與導光板的厚度實質上相同。In an embodiment, the thickness of the base of the first heat dissipation structure is substantially the same as the thickness of the light guide plate.
綜上所述，本發明之實施例的散熱組件及背光模組至少具有下列其中一個優點：因第二散熱結構係設置於第一散熱結構的基部與背板界定出的一容置空間內，且第二散熱結構的高度可與背板實質上相同，故背板、第一散熱結構及第二散熱結構組裝後可獲得一具有良好平整度的平面狀散熱組件，不會因設置散熱件而額外增加厚度，使背光模組整體易於薄型化。再者，因背光模組組裝後膠框暴露第二散熱結構，因此第二散熱結構可直接與空氣接觸而獲得良好的散熱效果。In summary, the heat dissipating component and the backlight module of the embodiment of the present invention have at least one of the following advantages: the second heat dissipating structure is disposed in an accommodating space defined by the base of the first heat dissipating structure and the backboard, The height of the second heat dissipation structure can be substantially the same as that of the backplane. Therefore, the backplane, the first heat dissipation structure and the second heat dissipation structure can be assembled to obtain a planar heat dissipation component with good flatness, and the heat dissipation component is not disposed. The thickness is additionally increased, so that the backlight module as a whole is easily thinned. Furthermore, since the plastic frame exposes the second heat dissipation structure after the backlight module is assembled, the second heat dissipation structure can directly contact the air to obtain a good heat dissipation effect.
本發明的其他目的和優點可以從本發明所揭露的技術特徵中得到進一步的了解。為讓本發明之上述和其他目的、特徵和優點能更明顯易懂，下文特舉實施例並配合所附圖式，作詳細說明如下。Other objects and advantages of the present invention will become apparent from the technical features disclosed herein. The above and other objects, features, and advantages of the invention will be apparent from
有關本發明之前述及其他技術內容、特點與功效，在以下配合參考圖式之實施例的詳細說明中，將可清楚的呈現。以下實施例中所提到的方向用語，例如：上、下、左、右、前或後等，僅是參考附加圖式的方向。因此，使用的方向用語是用來說明並非用來限制本發明。The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the embodiments of the invention. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only directions referring to the additional drawings. Therefore, the directional terminology used is for the purpose of illustration and not limitation.
圖1為依本發明一實施例之背光模組的示意圖。於圖1中為清楚顯示背板與散熱結構的型態及連接關係，導光板係以虛線表示。如圖1所示，背光模組10包含一導光板12、一發光元件14、一背板16、一第一散熱結構18及一第二散熱結構22。導光板12具有一入光面12a，且發光元件14設置於鄰近入光面12a位置處。背板16設置於導光板12的一底側。第一散熱結構18包含一基部18a與一側部18b，側部18b貼附發光元件14，基部18a與側部18b夾一角度且具有相對的一第一表面P及一第二表面Q。第一表面P面向背板16且第二表面Q背向背板16，背板16疊合部分第一表面P且側部18b疊合部分第二表面Q。第二散熱結構22設置於未疊合背板16的部分第一表面P上。圖2為依本發明一實施例之散熱組件的示意圖，散熱組件包含背板16、第一散熱結構18及第二散熱結構22，且於圖2中為清楚顯示第一散熱結構18及第二散熱結構22的型態，背板16係以虛線表示。如圖2所示，第二散熱結構22可設置於第一散熱結構基部18a與背板16所界定的一階梯狀容置空間內，且當第二散熱結構22置入後，第二散熱結構22背向第一散熱結構18的一側面R可與背板16背向第一散熱結構18的一側面S實質上平齊，因此當背板16、第一散熱結構18及第二散熱結構22組裝後可獲得一具有良好平整度的平面狀散熱組件，故可有效減少組裝厚度並利於薄型化。於一實施例中，第二散熱結構22可包含複數散熱鰭片，且散熱鰭片相對基部18a的第一表面P的高度可與背板16的厚度實質上相同，且如圖1所示，第一散熱結構基部18a的厚度可與導光板12的厚度實質上相同，如此可使背光模組10整體更有效地薄型化。再者，如圖3所示，背光模組10可包含一膠框24(陰影線部分)，膠框24固定於背板16上且覆蓋部分第一散熱結構18，膠框24還暴露第二散熱結構22，因此例如散熱鰭片構成的第二散熱結構22可直接與空氣接觸以獲得良好的散熱效果。FIG. 1 is a schematic diagram of a backlight module according to an embodiment of the invention. In FIG. 1, the type and connection relationship between the back plate and the heat dissipation structure are clearly shown, and the light guide plate is indicated by a broken line. As shown in FIG. 1 , the backlight module 10 includes a light guide plate 12 , a light emitting element 14 , a back plate 16 , a first heat dissipation structure 18 , and a second heat dissipation structure 22 . The light guide plate 12 has a light incident surface 12a, and the light emitting element 14 is disposed adjacent to the light incident surface 12a. The back plate 16 is disposed on a bottom side of the light guide plate 12. The first heat dissipation structure 18 includes a base portion 18a and a side portion 18b. The side portion 18b is attached with the light-emitting element 14. The base portion 18a is at an angle with the side portion 18b and has a first surface P and a second surface Q opposite to each other. The first surface P faces the backing plate 16 and the second surface Q faces away from the backing plate 16, the backing plate 16 overlapping a portion of the first surface P and the side portions 18b overlapping a portion of the second surface Q. The second heat dissipation structure 22 is disposed on a portion of the first surface P of the unfolded back plate 16. 2 is a schematic diagram of a heat dissipating component according to an embodiment of the present invention. The heat dissipating component includes a backing plate 16, a first heat dissipating structure 18, and a second heat dissipating structure 22, and the first heat dissipating structure 18 and the second are clearly shown in FIG. The shape of the heat dissipation structure 22, the back plate 16 is indicated by a broken line. As shown in FIG. 2, the second heat dissipation structure 22 can be disposed in a stepped accommodating space defined by the first heat dissipation structure base 18a and the back plate 16, and when the second heat dissipation structure 22 is placed, the second heat dissipation structure A side surface R facing away from the first heat dissipation structure 18 can be substantially flush with the back surface 16 facing away from a side surface S of the first heat dissipation structure 18, so that the back panel 16, the first heat dissipation structure 18 and the second heat dissipation structure 22 are After assembly, a planar heat dissipating component with good flatness can be obtained, so that the assembly thickness can be effectively reduced and the thickness can be reduced. In an embodiment, the second heat dissipation structure 22 may include a plurality of heat dissipation fins, and the height of the heat dissipation fins relative to the first surface P of the base portion 18a may be substantially the same as the thickness of the back plate 16, and as shown in FIG. The thickness of the first heat dissipation structure base portion 18a can be substantially the same as the thickness of the light guide plate 12, so that the backlight module 10 as a whole can be more effectively thinned. Furthermore, as shown in FIG. 3, the backlight module 10 can include a plastic frame 24 (hatched portion). The plastic frame 24 is fixed on the back plate 16 and covers a portion of the first heat dissipation structure 18. The plastic frame 24 also exposes the second portion. The heat dissipation structure 22, so that the second heat dissipation structure 22 composed of, for example, heat dissipation fins can directly contact the air to obtain a good heat dissipation effect.
另外，第一散熱結構18及第二散熱結構22例如可由散熱特性良好的鋁擠型材料構成，且背板16例如可由鋁擠型材料或鋼材所構成。於一實施例中，發光元件14可為至少一發光二極體燈條，且第二散熱結構22的各個散熱鰭片的長軸方向可與發光二極體燈條的長軸方向實質上平行以便於加工。依發明人的實際量測結果，發光二極體燈條表面溫度可降至53℃，且第二散熱結構22的表面溫度可降至45℃，故於上述各個實施例中，由背板16、第一散熱結構18及第二散熱結構22組裝構成的散熱組件可提供良好的散熱效果。In addition, the first heat dissipation structure 18 and the second heat dissipation structure 22 may be formed of, for example, an aluminum extruded material having good heat dissipation characteristics, and the back plate 16 may be composed of, for example, an aluminum extruded material or a steel material. In one embodiment, the light-emitting element 14 can be at least one light-emitting diode light strip, and the long-axis direction of each heat-dissipating fin of the second heat-dissipating structure 22 can be substantially parallel to the long-axis direction of the light-emitting diode light strip. For processing. According to the actual measurement results of the inventor, the surface temperature of the LED strip can be reduced to 53 ° C, and the surface temperature of the second heat dissipating structure 22 can be lowered to 45 ° C. Therefore, in the above embodiments, the back panel 16 The heat dissipating component assembled by assembling the first heat dissipation structure 18 and the second heat dissipation structure 22 can provide a good heat dissipation effect.
綜上所述，本發明之實施例的散熱組件及背光模組至少具有下列其中一個優點：第二散熱結構係設置於第一散熱結構的基部與背板界定出的一容置空間內，且第二散熱結構的高度可與背板實質上相同，故背板、第一散熱結構及第二散熱結構組裝後可獲得一具有良好平整度的平面狀散熱組件，不會因設置散熱件而額外增加厚度，使背光模組整體易於薄型化。再者，因背光模組組裝後膠框暴露第二散熱結構，因此第二散熱結構可直接與空氣接觸而獲得良好的散熱效果。In summary, the heat dissipating component and the backlight module of the embodiment of the present invention have at least one of the following advantages: the second heat dissipating structure is disposed in an accommodating space defined by the base of the first heat dissipating structure and the backboard, and The height of the second heat dissipation structure can be substantially the same as that of the back plate. Therefore, the back plate, the first heat dissipation structure and the second heat dissipation structure can be assembled to obtain a planar heat dissipation component with good flatness, and no additional heat dissipation member is provided. The thickness is increased to make the backlight module as thin as possible. Furthermore, since the plastic frame exposes the second heat dissipation structure after the backlight module is assembled, the second heat dissipation structure can directly contact the air to obtain a good heat dissipation effect.
惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。另外本發明的任一實施例或申請專利範圍不須達成本發明所揭露之全部目的或優點或特點。此外，摘要部分和標題僅是用來輔助專利文件搜尋之用，並非用來限制本發明之權利範圍。The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. In addition, any of the objects or advantages or features of the present invention are not required to be achieved by any embodiment or application of the invention. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention.
10．．．背光模組10. . . Backlight module
12．．．導光板12. . . Light guide
12a．．．導光板入光面12a. . . Light guide plate
14．．．發光元件14. . . Light-emitting element
16．．．背板16. . . Backplane
18．．．第一散熱結構18. . . First heat dissipation structure
18a．．．第一散熱結構基部18a. . . First heat dissipation structure base
18b．．．第一散熱結構側部18b. . . Side of the first heat dissipation structure
22．．．第二散熱結構twenty two. . . Second heat dissipation structure
24．．．膠框twenty four. . . Plastic frame
100．．．背光模組100. . . Backlight module
102．．．導光板102. . . Light guide
104．．．發光二極體燈條104. . . LED light bar
106．．．背板106. . . Backplane
106a．．．背板彎折部106a. . . Back plate bending
108．．．膠框108. . . Plastic frame
P．．．基部第一表面P. . . Base first surface
Q．．．基部第二表面Q. . . Base second surface
R．．．第二散熱結構側面R. . . Second heat dissipation structure side
S．．．背板側面S. . . Back side
圖1為依本發明一實施例之背光模組的示意圖。FIG. 1 is a schematic diagram of a backlight module according to an embodiment of the invention.
圖2為依本發明一實施例之散熱組件的示意圖。2 is a schematic view of a heat dissipating assembly in accordance with an embodiment of the present invention.
圖3為依本發明另一實施例之背光模組的示意圖。3 is a schematic diagram of a backlight module according to another embodiment of the present invention.
圖4為一習知背光模組的示意圖。4 is a schematic diagram of a conventional backlight module.
10．．．背光模組10. . . Backlight module
12．．．導光板12. . . Light guide
12a．．．導光板入光面12a. . . Light guide plate
14．．．發光元件14. . . Light-emitting element
16．．．背板16. . . Backplane
18．．．第一散熱結構18. . . First heat dissipation structure
18a．．．第一散熱結構基部18a. . . First heat dissipation structure base
18b．．．第一散熱結構側部18b. . . Side of the first heat dissipation structure
22．．．第二散熱結構twenty two. . . Second heat dissipation structure
P．．．基部第一表面P. . . Base first surface
Q．．．基部第二表面Q. . . Base second surface
Claims (15)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105267171A CN102454967A (en) | 2010-10-20 | 2010-10-20 | Back light module and heat radiating component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201218937A TW201218937A (en) | 2012-05-01 |
| TWI429391B true TWI429391B (en) | 2014-03-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100105566A TWI429391B (en) | 2010-10-20 | 2011-02-21 | Backlight module and heat-dissipation assembly |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102454967A (en) |
| TW (1) | TWI429391B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106609957B (en) * | 2015-10-22 | 2019-08-02 | 瑞仪(广州)光电子器件有限公司 | Backlight module and display equipment with the backlight module |
| CN108838646B (en) * | 2018-05-14 | 2021-05-28 | 深圳市德仓科技有限公司 | Backlight module assembly method, device and system and assembly frame |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100498470C (en) * | 2007-07-24 | 2009-06-10 | 友达光电股份有限公司 | Backlight module |
| CN101338867B (en) * | 2008-09-01 | 2012-09-05 | 友达光电股份有限公司 | Backlight module and LCD device |
| TWI391752B (en) * | 2009-03-24 | 2013-04-01 | Au Optronics Corp | Display device and backlight module with thermal isolating layer |
| CN101614352B (en) * | 2009-07-08 | 2010-12-08 | 友达光电股份有限公司 | Backlight module and display module |
-
2010
- 2010-10-20 CN CN2010105267171A patent/CN102454967A/en active Pending
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2011
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201218937A (en) | 2012-05-01 |
| CN102454967A (en) | 2012-05-16 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |