TWI427255B - Evaporator and loop type heat pipe employing it - Google Patents
Evaporator and loop type heat pipe employing it Download PDFInfo
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- TWI427255B TWI427255B TW98101562A TW98101562A TWI427255B TW I427255 B TWI427255 B TW I427255B TW 98101562 A TW98101562 A TW 98101562A TW 98101562 A TW98101562 A TW 98101562A TW I427255 B TWI427255 B TW I427255B
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Description
本發明涉及一種散熱裝置，特別涉及一種蒸發器及應用該蒸發器之回路式熱管。 The invention relates to a heat dissipating device, in particular to an evaporator and a loop type heat pipe using the same.
隨著中央處理器(CPU)等電子元件功率之不斷提高，散熱問題越來越受到人們之重視。回路式熱管(loop heat pipe)由於其高效之熱傳導性能而被作為一種有效之傳熱元件應用於散熱領域中。 With the continuous improvement of the power of electronic components such as central processing units (CPUs), heat dissipation has received more and more attention. The loop heat pipe is used as an effective heat transfer element in the field of heat dissipation due to its high heat transfer performance.
傳統回路式熱管之毛細結構附著於回路式熱管之內管壁，並將蒸發腔與補償腔連成一體，當回路式熱管工作時，位於蒸發腔之毛細結構吸收熱量，蒸發腔之毛細結構上之熱量一部分被蒸發腔內之工作流體吸收，而其餘部分熱量傳遞至位於補償腔內之毛細結構上，使得補償腔內之工作流體蒸發，產生與預定工作方向反向之壓力，降低回路式熱管之有效壓差，同時，補償腔之毛細結構表面生成大量氣泡，該等氣泡影響補償腔內工作流體滲透率，造成蒸發腔工作流體燒乾，產生斷流現象，以致於回路式熱管失效。 The capillary structure of the traditional loop heat pipe is attached to the inner wall of the loop heat pipe, and the evaporation cavity is integrated with the compensation cavity. When the loop heat pipe works, the capillary structure located in the evaporation cavity absorbs heat, and the capillary structure of the evaporation cavity A part of the heat is absorbed by the working fluid in the evaporation chamber, and the rest of the heat is transferred to the capillary structure located in the compensation chamber, so that the working fluid in the compensation chamber evaporates, generating a pressure opposite to the predetermined working direction, and reducing the loop heat pipe. The effective pressure difference, at the same time, the surface of the capillary structure of the compensation cavity generates a large number of bubbles, which affect the permeability of the working fluid in the compensation cavity, causing the working fluid of the evaporation cavity to be dried and causing a flow interruption phenomenon, so that the loop heat pipe fails.
有鑒於此，有必要提供一種防止斷流之蒸發器及應用該蒸發器之 回路式熱管。 In view of this, it is necessary to provide an evaporator for preventing the flow interruption and applying the evaporator Loop type heat pipe.
一種蒸發器包括一中空殼體以及一具有一穿孔之隔板，該隔板設置在該中空殼體內，並將該蒸發器內部分隔形成一蒸發腔和一補償腔，該蒸發腔內設有毛細結構，該毛細結構具有一延伸部，該延伸部穿過該隔板上之穿孔伸入到該補償腔中。 An evaporator includes a hollow casing and a partition having a perforation disposed in the hollow casing, and separating the interior of the evaporator to form an evaporation chamber and a compensation chamber, wherein the evaporation chamber is provided There is a capillary structure having an extension that extends into the compensation chamber through a perforation in the spacer.
一種回路式熱管，包括一蒸發器及一連接該蒸發器相對兩端組成一回路之管路，該回路內填充有工作液體，該蒸發器包括一中空殼體，該中空殼體內設置一隔板，該隔板將蒸發器內部分成蒸發腔和補償腔，該蒸發腔內設有毛細結構，該毛細結構穿過隔板伸入補償腔內。 A loop type heat pipe includes an evaporator and a pipeline connecting the opposite ends of the evaporator to form a circuit, the circuit is filled with a working liquid, and the evaporator comprises a hollow casing, and a hollow casing is disposed in the casing A partition plate divides the interior of the evaporator into an evaporation chamber and a compensation chamber, and the evaporation chamber is provided with a capillary structure, and the capillary structure extends through the partition into the compensation chamber.
與習知技術相比，蒸發器之蒸發腔內之毛細結構穿過隔板伸入補償腔內，使暴露在補償腔內之毛細結構之面積減少，從而減少了傳入補償腔內之熱量，有效保證了回路式熱管之有效壓差，同時，減少補償腔之毛細結構表面生成之氣泡，有效保證補償腔內工作液體之滲透率，防止蒸發腔工作液體燒乾，延長了本發明回路式熱管之使用壽命，同時，提升了回路式熱管之工作效率。 Compared with the prior art, the capillary structure in the evaporation chamber of the evaporator extends through the partition into the compensation cavity, so that the area of the capillary structure exposed in the compensation cavity is reduced, thereby reducing the heat transferred into the compensation cavity. The effective pressure difference of the loop type heat pipe is effectively ensured, and the bubble generated on the surface of the capillary structure of the compensation cavity is reduced, the permeability of the working liquid in the compensation cavity is effectively ensured, and the working liquid of the evaporation cavity is prevented from being dried, thereby prolonging the loop type heat pipe of the present invention. The service life, at the same time, improves the working efficiency of the loop heat pipe.
10‧‧‧蒸發器 10‧‧‧Evaporator
11‧‧‧殼體 11‧‧‧Shell
12‧‧‧隔板 12‧‧‧Baffle
14‧‧‧蒸發腔 14‧‧‧Evaporation chamber
16‧‧‧補償腔 16‧‧‧Compensation chamber
18‧‧‧毛細結構 18‧‧‧Capillary structure
20‧‧‧管路 20‧‧‧pipe
30‧‧‧散熱鰭片 30‧‧‧Heat fins
110‧‧‧側壁 110‧‧‧ side wall
120‧‧‧圍壁 120‧‧‧Wall
140‧‧‧蒸氣通道 140‧‧‧Vapor passage
180‧‧‧基部 180‧‧‧ base
182‧‧‧壁部 182‧‧‧ wall
184‧‧‧延伸部 184‧‧‧Extension
圖1係本發明回路式熱管一較佳實施方式之立體圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a preferred embodiment of a loop heat pipe of the present invention.
圖2係圖1中回路式熱管之部分剖視圖。 2 is a partial cross-sectional view of the loop type heat pipe of FIG. 1.
圖3係圖1中回路式熱管工作原理之示意圖。 Figure 3 is a schematic view showing the working principle of the loop type heat pipe of Figure 1.
請參閱圖1，本發明一較佳實施方式之回路式熱管包括一蒸發器 10、連接該蒸發器10之相對兩端之管路20及套設於管路20上之複數散熱鰭片30。該管路20連接蒸發器10之相對兩端，使得蒸發器10和管路20組成一密封回路。該回路內填充有工作液體(如圖3所示)，該工作液體可係水、酒精等。所述管路20可由與工作液體相容之可撓性材料製成，如銅、鋁或不銹鋼等。該蒸發器10之一端吸收一發熱電子元件如CPU產生之熱量，並使工作液體蒸發，蒸氣沿管路20流出，經過散熱鰭片30冷卻，將蒸氣冷卻係液體，液體由管路20流入蒸發器10之另一端，如此，回路式熱管完成了工作液體由蒸氣到冷卻之過程。該等散熱鰭片30靠近蒸發器10吸熱之一端，以冷卻蒸氣。在本實施例中，散熱鰭片30所套設之部分管路20被壓扁。在其他實施例中，散熱鰭片30所套設之部分管路20可以不被壓扁。可以理解地，管路20上可以安裝其他散熱元件，用來冷卻管路20內之蒸氣。 Referring to FIG. 1, a loop type heat pipe according to a preferred embodiment of the present invention includes an evaporator. 10. A pipe 20 connecting the opposite ends of the evaporator 10 and a plurality of fins 30 disposed on the pipe 20. The line 20 is connected to opposite ends of the evaporator 10 such that the evaporator 10 and the line 20 form a sealed circuit. The circuit is filled with a working liquid (as shown in FIG. 3), which can be water, alcohol, or the like. The line 20 can be made of a flexible material that is compatible with the working fluid, such as copper, aluminum or stainless steel. One end of the evaporator 10 absorbs heat generated by a heat-generating electronic component such as a CPU, and evaporates the working liquid. The vapor flows along the pipe 20, is cooled by the heat-dissipating fins 30, cools the vapor, and flows the liquid from the pipe 20 to evaporate. At the other end of the device 10, the loop heat pipe completes the process of working the liquid from vapor to cooling. The heat dissipation fins 30 are adjacent to one end of the heat absorption of the evaporator 10 to cool the vapor. In the present embodiment, part of the pipe 20 that is disposed by the heat dissipation fins 30 is crushed. In other embodiments, a portion of the conduit 20 that the heat sink fins 30 are sleeved may not be crushed. It will be appreciated that other heat dissipating elements may be mounted on the line 20 for cooling the vapor within the line 20.
請一併參閱圖2和圖3，所述蒸發器10包括一中空殼體11及一設置在該中空殼體11內之隔板12，該隔板12將中空殼體11內部分隔形成一蒸發腔14及一補償腔16，蒸發腔14之內表面設置有毛細結構18，該毛細結構18穿過該隔板12延伸入補償腔16內。 Referring to FIG. 2 and FIG. 3 together, the evaporator 10 includes a hollow casing 11 and a partition 12 disposed in the hollow casing 11, and the partition 12 separates the interior of the hollow casing 11. An evaporation chamber 14 and a compensation chamber 16 are formed. The inner surface of the evaporation chamber 14 is provided with a capillary structure 18 through which the capillary structure 18 extends into the compensation chamber 16.
所述殼體11係一圓柱狀結構，其包括一呈圓筒形之圍壁120及由該圍壁120相對兩端垂直向內延伸之二側壁110，該二側壁110分別設有一通孔以供所述管路20穿設。該殼體11可由導熱性能良好之金屬材料製成，如銅等。 The housing 11 is a cylindrical structure, and includes a cylindrical surrounding wall 120 and two side walls 110 extending perpendicularly inwardly from opposite ends of the surrounding wall 120. The two side walls 110 are respectively provided with a through hole. The conduit 20 is passed through. The casing 11 can be made of a metal material having good thermal conductivity such as copper or the like.
所述隔板12上設置有一穿孔以供所述毛細結構18穿過。該隔板12之周緣與所述殼體11之圍壁120緊密結合。該隔板12垂直於所述 殼體11之圍壁120。在其他實施例中，該隔板12可以不垂直於所述殼體11之圍壁120。在本實施例中，該隔板12之穿孔開設於隔板之中心。在其他實施例中，該隔板12之穿孔開設於該隔板12之其他位置。 A through hole is formed in the partition 12 for the capillary structure 18 to pass through. The periphery of the partition 12 is tightly coupled to the surrounding wall 120 of the casing 11. The partition 12 is perpendicular to the The surrounding wall 120 of the housing 11. In other embodiments, the partition 12 may not be perpendicular to the surrounding wall 120 of the housing 11. In this embodiment, the perforations of the partition 12 are formed in the center of the partition. In other embodiments, the perforations of the partition 12 are formed at other locations of the partition 12.
所述蒸發腔14藉由所述殼體11之一側壁110與所述管路20連通，所述補償腔16藉由另一側壁110與該管路20連通。較佳地，該蒸發腔14之軸向長度大於補償腔16之軸向長度。該蒸發腔14所在之殼體11與上述發熱電子元件熱接觸。 The evaporation chamber 14 communicates with the pipeline 20 through a sidewall 110 of the casing 11 , and the compensation chamber 16 communicates with the pipeline 20 via another sidewall 110 . Preferably, the axial length of the evaporation chamber 14 is greater than the axial length of the compensation chamber 16. The housing 11 in which the evaporation chamber 14 is located is in thermal contact with the above-described heat-generating electronic component.
所述毛細結構18係多孔狀結構，其可係燒結粉末(sintered powder)、微細溝槽(fine grooves)、編織網目(mesh)、纖維(fiber)或上述型式之複合式毛細構造。該毛細結構18大致呈圓筒狀，包括與所述隔板12貼設之一圓盤狀之基部180、從該基部180之一側面周緣垂直延伸之一呈筒狀之週邊壁部182及由該基部180另一側面垂直延伸之一延伸部184。該壁部182和基部180貼附於所述蒸發腔14之內表面。該延伸部184穿過所述隔板12之穿孔伸入所述補償腔16內，並浸入存儲於該補償腔16內之工作液體中。該延伸部184與補償腔16內表面相隔設置。該基部180形成該毛細結構18之封閉端，該壁部182靠近管路20之一端形成開放端，從而在蒸發腔14中形成一蒸氣通道140。該蒸氣通道140沿毛細結構18之軸向延伸，且與管路20連通。該蒸氣通道140之橫截面積大於管路20之橫截面積，以便蒸發腔14內之工作液體蒸發後產生之蒸氣進入管路20內。 The capillary structure 18 is a porous structure which may be a sintered capillary, fine grooves, a mesh, a fiber, or a composite capillary structure of the above type. The capillary structure 18 has a substantially cylindrical shape, and includes a disk-shaped base portion 180 attached to the partition plate 12, and a cylindrical peripheral wall portion 182 extending perpendicularly from a side surface of one side of the base portion 180 and One side of the base 180 extends perpendicularly to one of the extensions 184. The wall portion 182 and the base portion 180 are attached to the inner surface of the evaporation chamber 14. The extension 184 extends through the perforations of the partition 12 into the compensation chamber 16 and is immersed in the working fluid stored in the compensation chamber 16. The extension 184 is spaced apart from the inner surface of the compensation chamber 16. The base portion 180 forms a closed end of the capillary structure 18 that forms an open end adjacent one end of the conduit 20 to form a vapor passage 140 in the evaporation chamber 14. The vapor passage 140 extends in the axial direction of the capillary structure 18 and is in communication with the conduit 20. The cross-sectional area of the vapor passage 140 is greater than the cross-sectional area of the conduit 20 so that vapor generated by evaporation of the working fluid within the evaporation chamber 14 enters the conduit 20.
可以理解地，所述蒸發器10之殼體11不限於圓柱狀結構，例如， 長方體結構亦通用。相應地，所述隔板12之外部輪廓即周緣隨著蒸發器10之殼體11之結構之改變而改變，只要保證隔板12之周緣與殼體11之圍壁120緊密結合即可，達到防止存儲於補償腔16內之工作液體與所述毛細結構18之基部180直接接觸之目的。當然，所述毛細結構18之基部180和壁部182之外部輪廓也隨之改變，只要保證該基部180和壁部182貼附於所述蒸發腔14之內表面即可。 It is to be understood that the housing 11 of the evaporator 10 is not limited to a cylindrical structure, for example, The cuboid structure is also common. Correspondingly, the outer contour of the partition 12, that is, the circumference, changes with the structure of the casing 11 of the evaporator 10, as long as the peripheral edge of the partition 12 is tightly coupled with the surrounding wall 120 of the casing 11, The purpose of preventing the working liquid stored in the compensation chamber 16 from coming into direct contact with the base portion 180 of the capillary structure 18 is prevented. Of course, the outer contours of the base portion 180 and the wall portion 182 of the capillary structure 18 are also changed as long as the base portion 180 and the wall portion 182 are attached to the inner surface of the evaporation chamber 14.
操作時，回路式熱管之蒸發腔14內工作液體從發熱電子元件吸熱蒸發成蒸氣，產生之蒸氣彙聚於蒸發腔14中之蒸氣通道140內，該等蒸氣在蒸發腔14產生較大之蒸氣壓，使得蒸發腔14和補償腔16產生有效壓差，該壓差促使蒸氣由蒸發腔14經管路20向補償腔16運動，在蒸氣藉由管路20向補償腔16運動過程中，蒸氣在散熱鰭片30所在之管路20處被冷卻係液體，由於蒸發腔14內仍然源源不斷地供應蒸氣，因此蒸發腔14和補償腔16之有效壓差仍然存在，該壓差迫使被散熱鰭片30冷卻之液體繼續向補償腔16運動，並存儲於補償腔16內，然後，由伸入補償腔16內之毛細結構18之延伸部184吸收工作液體，並藉由基部180及壁部182進入蒸發腔14內進行下一次迴圈。整個過程完成了發熱電子元件與散熱鰭片30間之熱量交換。藉由這種方式，工作液體反復蒸發、冷凝，不斷地吸熱、放熱，從而達到良好之熱交換之目的。 During operation, the working liquid in the evaporation chamber 14 of the loop-type heat pipe evaporates from the heat-generating electronic component to vapor, and the generated vapor converges in the vapor channel 140 in the evaporation chamber 14, which vapor generates a large vapor pressure in the evaporation chamber 14. The evaporation chamber 14 and the compensation chamber 16 are caused to generate an effective pressure difference, which causes the vapor to move from the evaporation chamber 14 through the pipeline 20 to the compensation chamber 16. During the movement of the vapor through the conduit 20 to the compensation chamber 16, the vapor is dissipated. The line 20 where the fins 30 are located is cooled by the liquid. Since the vapor is still continuously supplied in the evaporation chamber 14, the effective pressure difference between the evaporation chamber 14 and the compensation chamber 16 still exists, and the pressure difference forces the fins 30 to be dissipated. The cooled liquid continues to move toward the compensation chamber 16 and is stored in the compensation chamber 16, and then the working liquid is absorbed by the extension 184 of the capillary structure 18 extending into the compensation chamber 16, and is vaporized by the base 180 and the wall portion 182. The next loop is performed in the chamber 14. The entire process completes the heat exchange between the heat-generating electronic components and the heat sink fins 30. In this way, the working liquid is repeatedly evaporated, condensed, and continuously absorbs heat and exotherms, thereby achieving good heat exchange.
與習知技術相比，蒸發器10之殼體11內之隔板12有效阻擋毛細結構18之基部180與存儲於補償腔16內之工作液體直接接觸，減少了毛細結構18與工作液體接觸面積，即減少了毛細結構18之反向 蒸發面積，降低了補償腔16內之蒸氣壓力，有效保證了回路式熱管之有效壓差。另外，毛細結構18藉由延伸部184浸入補償腔16內之工作液體中，傳遞到延伸部184之熱量能夠被迅速冷卻，減少了延伸部184表面生成之氣泡，有效保證補償腔16內工作液體之滲透率，使延伸部184吸收補償腔16內之工作液體到基部180和壁部182，以防止蒸發腔14工作液體燒乾，造成斷流，延長了本發明回路式熱管之使用壽命，同時，提升了回路式熱管之工作效率。 Compared with the prior art, the partition 12 in the casing 11 of the evaporator 10 effectively blocks the base portion 180 of the capillary structure 18 from directly contacting the working liquid stored in the compensation chamber 16, reducing the contact area of the capillary structure 18 with the working fluid. That reduces the reversal of the capillary structure 18 The evaporation area reduces the vapor pressure in the compensation chamber 16, which effectively ensures the effective pressure difference of the loop type heat pipe. In addition, the capillary structure 18 is immersed in the working liquid in the compensation chamber 16 by the extending portion 184, and the heat transferred to the extending portion 184 can be rapidly cooled, reducing the bubble generated on the surface of the extending portion 184, and effectively ensuring the working liquid in the compensation chamber 16. The permeability causes the extension portion 184 to absorb the working liquid in the compensation chamber 16 to the base portion 180 and the wall portion 182 to prevent the working liquid of the evaporation chamber 14 from being dried, causing a current interruption and prolonging the service life of the loop type heat pipe of the present invention. Improve the working efficiency of the loop heat pipe.
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
10‧‧‧蒸發器 10‧‧‧Evaporator
11‧‧‧殼體 11‧‧‧Shell
12‧‧‧隔板 12‧‧‧Baffle
14‧‧‧蒸發腔 14‧‧‧Evaporation chamber
16‧‧‧補償腔 16‧‧‧Compensation chamber
18‧‧‧毛細結構 18‧‧‧Capillary structure
20‧‧‧管路 20‧‧‧pipe
110‧‧‧側壁 110‧‧‧ side wall
120‧‧‧圍壁 120‧‧‧Wall
180‧‧‧基部 180‧‧‧ base
182‧‧‧壁部 182‧‧‧ wall
184‧‧‧延伸部 184‧‧‧Extension
Claims (16)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98101562A TWI427255B (en) | 2009-01-16 | 2009-01-16 | Evaporator and loop type heat pipe employing it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98101562A TWI427255B (en) | 2009-01-16 | 2009-01-16 | Evaporator and loop type heat pipe employing it |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201028635A TW201028635A (en) | 2010-08-01 |
| TWI427255B true TWI427255B (en) | 2014-02-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98101562A TWI427255B (en) | 2009-01-16 | 2009-01-16 | Evaporator and loop type heat pipe employing it |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI427255B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102723316A (en) | 2011-03-29 | 2012-10-10 | 北京奇宏科技研发中心有限公司 | Loop heat pipe structure |
| CN102760709B (en) * | 2011-04-29 | 2015-05-13 | 北京奇宏科技研发中心有限公司 | Loop heat pipe structure |
| TWI530654B (en) | 2011-12-26 | 2016-04-21 | 鴻準精密工業股份有限公司 | Plate type heat pipe |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004053062A (en) * | 2002-07-17 | 2004-02-19 | Nec Toshiba Space Systems Ltd | Evaporator for loop heat pipe, and its heat exchange method |
| TWM246563U (en) * | 2003-11-11 | 2004-10-11 | Inventec Corp | Circuit heat tube |
| TWI285252B (en) * | 2006-02-14 | 2007-08-11 | Yeh Chiang Technology Corp | Loop type heat conduction device |
| US20070267180A1 (en) * | 2006-05-17 | 2007-11-22 | Julie Fatemeh Asfia | Multi-layer wick in loop heat pipe |
| CN101169583A (en) * | 2006-10-25 | 2008-04-30 | 中强光电股份有限公司 | Projecting apparatus |
| TWI304467B (en) * | 2006-09-22 | 2008-12-21 | Foxconn Tech Co Ltd | Loop heat pipe |
-
2009
- 2009-01-16 TW TW98101562A patent/TWI427255B/en not_active IP Right Cessation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004053062A (en) * | 2002-07-17 | 2004-02-19 | Nec Toshiba Space Systems Ltd | Evaporator for loop heat pipe, and its heat exchange method |
| TWM246563U (en) * | 2003-11-11 | 2004-10-11 | Inventec Corp | Circuit heat tube |
| TWI285252B (en) * | 2006-02-14 | 2007-08-11 | Yeh Chiang Technology Corp | Loop type heat conduction device |
| US20070267180A1 (en) * | 2006-05-17 | 2007-11-22 | Julie Fatemeh Asfia | Multi-layer wick in loop heat pipe |
| TWI304467B (en) * | 2006-09-22 | 2008-12-21 | Foxconn Tech Co Ltd | Loop heat pipe |
| CN101169583A (en) * | 2006-10-25 | 2008-04-30 | 中强光电股份有限公司 | Projecting apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201028635A (en) | 2010-08-01 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |