TWI418729B - Manufacturing method and manufacturing system of led light bar - Google Patents
Manufacturing method and manufacturing system of led light bar Download PDFInfo
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本發明係有關於一種發光二極體燈條結構之製造方法及其系統，尤指一種以自動化設備提升生產效率的發光二極體燈條結構之製造方法及其系統。The invention relates to a manufacturing method and a system for a light-emitting diode light bar structure, in particular to a manufacturing method and a system for a light-emitting diode light bar structure which improves production efficiency by an automatic device.
隨著發光二極體(Light-Emitting Diode，LED)技術的進步，其在光源領域之應用可展現的亮度、發光效率也越來越高，且因發光二極體具有壽命長、省電、安全及反應快等特點，應用領域相當廣泛。例如，發光二極體光條(LED light bar)之結構通常是在一長條形電路板上佈設多數個發光二極體晶片所構成，並採用發光二極體燈條來作為光源。With the advancement of Light-Emitting Diode (LED) technology, its application in the field of light source can show higher brightness and luminous efficiency, and the LED has long life and power saving. Features such as safety and quick response, and a wide range of applications. For example, a structure of an LED light bar is generally constructed by arranging a plurality of light-emitting diode chips on a long strip circuit board, and using a light-emitting diode strip as a light source.
對於發光二極體燈條結構之生產廠而言，長條狀的燈條結構在生產時出現以下問題：目前的製程均以人工方式進行，如第一圖所示，先以人工將基板貼合於載板上，而後進行基板之條碼列印；再以人工進行拆板；接著，再次以人工利用膠帶進行貼板，以將印有條碼之基板再次貼合於一載板，而後進行發光二極體之印刷/置件/迴焊等工序；接著，必須以人工進行撕膠帶的拆板作業，以獲得製作完成之發光二極體燈條結構；接下來，必須針對產品之外觀或LED的位置是否偏移進行初步檢測，之後才進行發光特性的檢測、分類。For the manufacturer of the light-emitting diode strip structure, the long strip-shaped strip structure has the following problems in production: the current process is carried out manually, as shown in the first figure, the substrate is manually applied first. Cooperating on the carrier board, and then performing barcode printing on the substrate; then manually disassembling the board; then, manually using the tape to perform the boarding, to reattach the printed board to a carrier board, and then illuminate The printing/storing/reflowing process of the diode; then, the tearing of the tape must be performed manually to obtain the finished light-emitting diode strip structure; next, it must be aimed at the appearance of the product or the LED Whether the position is offset or not is initially detected, and then the detection and classification of the luminescence characteristics are performed.
然而，上述傳統製程並未加以整合，故出現同一步驟必須執行多次的現象，如長條型基板需經過兩次的貼板/拆板作業，故在製程成本上並不具有經濟價值；另外，由於貼板係由人工進行，故在貼板時容易出現位置偏移等誤差，使得後續的LED置件可能出現打件位置錯誤等其他產品上的缺點；亦因於此，製程後端更必須安排人員進行產品之外觀或LED的位置是否偏移進行初步檢測。換言之，傳統製程所製作的產品出現缺點的情形十分普遍，故使生產效率低落，另外，由於人工的製作偏差大，使產線上更必須增添人工進行檢查，更造成製作成本的上升。However, the above-mentioned conventional processes are not integrated, so the phenomenon that the same step must be performed a plurality of times, for example, the long-type substrate needs to undergo two times of splicing/peeling work, so it has no economic value in process cost; Since the slats are manually performed, errors such as positional deviation are likely to occur during the splicing, which may cause defects in other products such as the position error of the subsequent LEDs; and because of this, the process backend is more Personnel must be arranged to perform a preliminary test on the appearance of the product or the position of the LED. In other words, the defects in the products produced by the traditional process are very common, so the production efficiency is low. In addition, due to the large deviation of the manual production, it is necessary to add manual inspections on the production line, which further increases the production cost.
本案發明人有鑑於上述習用的技術於實際施用時的缺失，且積累個人從事相關產業開發實務上多年之經驗，精心研究，終於提出一種設計合理且有效改善上述問題之結構。The inventor of the present invention has made a structure that is reasonable in design and effective in improving the above problems, in view of the lack of the above-mentioned conventional technology in actual application, and accumulating the experience of individuals engaged in relevant industry development practice for many years.
本發明之主要目的，在於提供一種發光二極體燈條結構之製造方法及其系統，其係利用機械化的自動生產設備進行長條型基板之貼板步驟，並可縮短精準貼板的整體時間，故在後續製程上可使用精準化之貼板進行印刷條碼、置件等步驟，以製作高精度的產品，並同時省去大量的人工。The main object of the present invention is to provide a method for manufacturing a light-emitting diode light bar structure and a system thereof, which use a mechanized automatic production device to perform a step of sticking a long-length substrate, and can shorten the overall time of the accurate plate. Therefore, in the subsequent process, the precise plate can be used to print bar code, set and other steps to produce high-precision products, and at the same time save a lot of labor.
本發明之另一目的，在於提供一種發光二極體燈條結構之製造方法及其系統，其製造方法及其系統可製作出精準之貼板，故可將後續製程進行調整，以有效提高整體產線的效率。Another object of the present invention is to provide a method for manufacturing a light-emitting diode light bar structure and a system thereof, and a manufacturing method and system thereof can produce a precise plate, so that subsequent processes can be adjusted to effectively improve the overall The efficiency of the production line.
為了達到上述目的，本發明係提供一種發光二極體燈條結構之製造方法，包含以下步驟：提供一定位貼板機，該定位貼板機係用於將多數個長條型基板高速地固定於一載板的正面，使兩兩相鄰之長條型基板之間具有高精度的相對距離，該載板上開設有裸露部分之該長條型基板的開槽；翻轉所述固定有該長條型基板之載板，使該長條型基板的部分裸露於該載板之背面；進行一條碼印刷步驟，以於裸露該載板之背面的該長條型基板上印刷形成條碼；進行第二次翻轉步驟，以翻轉該載板；提供多個發光二極體，依序將所述之發光二極體電性連接於該長條型基板；以及進行一檢測包裝步驟。In order to achieve the above object, the present invention provides a method for manufacturing a light-emitting diode light bar structure, comprising the steps of: providing a positioning and pasting machine for fixing a plurality of elongated substrates at a high speed Providing a high-precision relative distance between two adjacent elongated strip substrates on a front surface of a carrier plate, wherein the carrier plate is provided with a bare portion of the slot of the elongated substrate; a carrier of the elongated substrate, such that a portion of the elongated substrate is exposed on a back surface of the carrier; a one-step printing step is performed to print a barcode on the elongated substrate on which the back surface of the carrier is exposed; a second inverting step of inverting the carrier; providing a plurality of light emitting diodes, sequentially electrically connecting the light emitting diodes to the elongated substrate; and performing a test packaging step.
為了達到上述目的，本發明係提供一種發光二極體燈條結構之製造系統，包含：一定位貼板機，其係為該製造系統的起始站點，以將多數個長條型基板固定於一載板的正面，該載板上開設有裸露部分之該長條型基板的開槽；一位於該定位貼板機下游之第一翻板機，其係將固定有該長條型基板之該載板加以翻轉，以使該長條型基板的一部份由該開槽所裸露；一位於該第一翻板機下游之條碼印刷機，以將條碼印刷成型於裸露該載板之背面的該長條型基板上；一位於該條碼印刷機下游之第二翻板機，其係針對印刷條碼完成之該載板再次翻轉；一位於該第二翻板機下游之置件站點，其係將多個發光二極體電性連接於固定於該載板上之該長條型基板；一位於該置件模組下游之檢測包裝站點。In order to achieve the above object, the present invention provides a manufacturing system for a light-emitting diode light bar structure, comprising: a positioning and pasting machine, which is a starting station of the manufacturing system, for fixing a plurality of elongated substrates On the front side of a carrier board, the carrier board is provided with a bare portion of the slot of the elongated substrate; and a first flipping machine located downstream of the positioning and pasting machine, the strip type substrate is fixed The carrier is flipped so that a portion of the elongated substrate is exposed by the slot; a bar code printer located downstream of the first flipper to print the barcode onto the bare carrier a second type of substrate on the back side; a second flipper located downstream of the bar code printing machine, which is flipped again for the printed bar code; a placement site downstream of the second turning machine The plurality of light-emitting diodes are electrically connected to the elongated substrate fixed to the carrier; and a detection packaging station located downstream of the component module.
本發明具有以下有益的效果：本發明主要利用高速、高精度之定位貼板機將長條型基板形成高精度貼板，故後續製程即可信賴貼板的高精度而進行自動化的生產作業，相較之下，傳統必須以人工檢測LED是否固定於正確的長條型基板之位置上，因人工貼板可能出現無法預期的歪斜或錯誤，換言之，本發明將傳統的發光二極體之燈條結構的生產流程大幅改善，以機械化的設備取代人力，故可提升產品的生產效率及有效控制成本。The invention has the following beneficial effects: the invention mainly uses a high-speed, high-precision positioning and splicing machine to form a long-type substrate into a high-precision slab, so that the subsequent process can rely on the high precision of the slab to perform automated production operations. In contrast, the conventional method must manually detect whether the LED is fixed at the position of the correct elongated substrate, because the artificial patch may have unpredictable skew or error, in other words, the present invention will be a conventional light-emitting diode lamp. The production process of the strip structure has been greatly improved, and the manpower has been replaced by mechanized equipment, so that the production efficiency of the product can be improved and the cost can be effectively controlled.
為使能更進一步瞭解本發明之特徵及技術內容，請參閱以下有關本發明之詳細說明與附圖，然而所附圖式僅提供參考與說明用，並非用來對本發明加以限制者。For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.
本發明提出一種發光二極體燈條結構(LED LIGHT BAR)之製造方法及其製造系統，其有效地將生產系統加以整合為自動化的生產模式，以有效率地量產發光二極體燈條結構，且在人事成本上得到有效的管理，進而提高發光二極體燈條結構之產品的市場價值。The invention provides a manufacturing method of a light-emitting diode light bar structure (LED LIGHT BAR) and a manufacturing system thereof, which effectively integrates a production system into an automatic production mode, and efficiently mass-produces a light-emitting diode light bar. The structure is effectively managed in terms of personnel costs, thereby increasing the market value of the products of the light-emitting diode strip structure.
請參考第二圖，本發明所提出的發光二極體燈條結構之製造方法包括以下步驟：首先，請配合第三圖至第三B圖，步驟S101係提供一定位貼板機1，其係為本發明之製造系統的起始站點，利用定位貼板機1機械化、自動化且高精度地將多數個長條型基板20高精度地固定於載板15的正面，換言之，長條型基板20之間具有精準的相對位置，使後續製程得以轉換為機械化生產，以取代傳統的人力生產作業模式，且可達到提升整體產品良率、生產效率之功效。Referring to the second figure, the manufacturing method of the LED light bar structure proposed by the present invention comprises the following steps: First, please cooperate with the third to third B drawings, and step S101 provides a positioning and pasting machine 1 . The starting point of the manufacturing system of the present invention is a mechanized, automated and highly accurate positioning of a plurality of elongated substrates 20 on the front side of the carrier 15 by the positioning and bonding machine 1, in other words, a long strip type The precise relative position between the substrates 20 enables subsequent processes to be converted into mechanized production, replacing the traditional manual production mode, and achieving the effect of improving overall product yield and production efficiency.
具體而言，本發明之定位貼板機1至少包括定位區11B、搬移定位裝置13及至少兩個視覺裝置14，以將長條型基板20高速地固定於載板15的正面，進而提高整體生產效率，而為了達到貼板的精度可滿足後續將發光二極體固件於每一長條型基板20的需求，定位貼板機1可利用視覺裝置14進行分析、定位，以使兩相鄰長條型基板20之間具有高精度的距離，可達到高精度貼合於載板15上之需求，例如先將該長條型基板20由進料區被移動至該定位貼板機1之定位區11B；再利用該定位貼板機1之搬移定位裝置13的工形吸取頭130依序吸取位於該定位區11B上之該長條型基板20，並同時利用該定位貼板機1之至少兩個視覺裝置14擷取被該搬移定位裝置13所吸取之該長條型基板20的影像，以將被吸取之該長條型基板20加以定位；接著即可利用該搬移定位裝置13將上述經過定位之該長條型基板20高精度地固定於該載板15上。Specifically, the positioning and pasting machine 1 of the present invention includes at least a positioning area 11B, a moving positioning device 13 and at least two vision devices 14 for fixing the elongated substrate 20 to the front surface of the carrier 15 at a high speed, thereby improving the overall The production efficiency, and in order to achieve the precision of the splicing plate, can meet the requirements of the subsequent illuminating diode firmware on each strip substrate 20, and the locating and pasting machine 1 can be analyzed and positioned by the visual device 14 to make two adjacent The long-type substrate 20 has a high-precision distance between the strips, and can be attached to the carrier 15 with high precision. For example, the strip-shaped substrate 20 is first moved from the feeding zone to the positioning and pasting machine 1. The positioning area 11B; the work shape picking head 130 of the moving and positioning device 13 of the positioning and setting machine 1 sequentially sucks the long type substrate 20 located on the positioning area 11B, and simultaneously utilizes the positioning and pasting machine 1 The at least two vision devices 14 capture the image of the elongated substrate 20 sucked by the transfer positioning device 13 to position the elongated substrate 20 that is sucked; and then the moving positioning device 13 can be used The above-mentioned positioned strip type base The board 20 is fixed to the carrier 15 with high precision.
如第三圖所示，本發明之定位貼板機1可包含：一架體10、一設於架體10上之暫存區11A、一設於架體10上之定位區11B、一搬移定位裝置13、至少兩個設於該架體上之視覺裝置14及一承放於架體10上之載板15，而該定位貼板機1的功用在於將多數個長條型基板20高速地搬移於該載板15上以形成高精度的長條型基板20的組合，以利後續製程的進行；而在本具體實施例中，長條型基板20可為鋁合金基板等，該長條型基板20可用於承載多個發光二極體而形成一種發光二極體燈條結構(又稱LED LIGHT BAR)，但不以此為限，且該長條型基板20上設有複數個定位標誌201，以作為識別、定位之用，而上述定位標誌201大致設置於每一長條型基板20兩端之上表面。As shown in the third figure, the positioning and splicing machine 1 of the present invention may include: a frame body 10, a temporary storage area 11A disposed on the frame body 10, a positioning area 11B disposed on the frame body 10, and a moving body. The positioning device 13 includes at least two visual devices 14 disposed on the frame and a carrier 15 disposed on the frame 10. The positioning and bonding machine 1 functions to drive the plurality of elongated substrates 20 at a high speed. The ground plate is moved on the carrier 15 to form a combination of the high-precision elongated substrate 20 for the subsequent process. In the embodiment, the elongated substrate 20 can be an aluminum alloy substrate or the like. The strip substrate 20 can be used to carry a plurality of light emitting diodes to form a light emitting diode light bar structure (also referred to as LED LIGHT BAR), but not limited thereto, and the plurality of strip substrates 20 are provided with a plurality of The positioning mark 201 is used for identification and positioning, and the positioning mark 201 is disposed substantially on the upper surface of each of the elongated substrates 20.
以下將詳細說明本發明之定位貼板機1的結構。請復參考第三圖，並配合第三A圖及第三B圖，架體10係為本裝置的主體，換言之，定位貼板機1的構件、裝置係實質地架設於架體10。架體10上可包括有用以放置長條型基板20的儲存裝置(圖未示)等，儲存裝置係相當於進料區，其功能在於放置上述長條型基板20，而搬移裝置即可將長條型基板20由儲存裝置逐一(一次一條)取放且置於暫存區11A的移動平台110，移動平台110較佳地具有真空吸力，並可承載發光二極體之條形模組2在暫存區11A與定位區11B之間往返移動。The structure of the positioning and pasting machine 1 of the present invention will be described in detail below. Referring to the third figure, and in conjunction with the third A and third B drawings, the frame 10 is the main body of the device. In other words, the components and devices of the positioning and pasting machine 1 are substantially erected on the frame 10. The frame body 10 may include a storage device (not shown) or the like for placing the elongated substrate 20, and the storage device corresponds to a feeding zone, and its function is to place the elongated substrate 20, and the moving device can The strip substrate 20 is taken up by the storage device one by one and placed in the mobile platform 110 of the temporary storage area 11A. The mobile platform 110 preferably has a vacuum suction force and can carry the strip module 2 of the light emitting diode. The shuttle moves between the temporary storage area 11A and the positioning area 11B.
另外，暫存區11A的功能在於暫存長條型基板20，以縮短進料區與後述之定位區11B的距離。換言之，吸取頭111可先將長條型基板20存放於位於進料區與定位區11B之間的暫存區11A，由於暫存區11A的位置較接近上述之定位區11B，並利用移動平台110逐一地承載發光二極體之條形模組2在暫存區11A與定位區11B之間往返移動，故可提高工作的效率(移動行程距離較短)，使長條型基板20可高速地由暫存區11A傳送至定位區11B。在具體實施例中，由於搬移定位裝置13在吸取位於暫存區11A的發光二極體之條形模組2的同時即可進行定位的作業，故暫存區11A與定位區11B可為同一機台區域，本說明僅是在文字上加以定義以方便說明。Further, the function of the temporary storage area 11A is to temporarily store the long-length substrate 20 to shorten the distance between the feed zone and the positioning zone 11B which will be described later. In other words, the pick-up head 111 can first store the long-form substrate 20 in the temporary storage area 11A between the feeding area and the positioning area 11B, because the position of the temporary storage area 11A is closer to the above-mentioned positioning area 11B, and the mobile platform is utilized. The strip-shaped module 2 carrying the light-emitting diodes one by one moves back and forth between the temporary storage area 11A and the positioning area 11B, so that the work efficiency (short travel distance) can be improved, and the long-length substrate 20 can be high-speed. The ground is transferred from the temporary storage area 11A to the positioning area 11B. In the specific embodiment, since the positioning device 13 can perform the positioning operation while sucking the strip module 2 of the light emitting diode located in the temporary storage area 11A, the temporary storage area 11A and the positioning area 11B can be the same. In the machine area, this description is only textually defined for ease of explanation.
本發明之搬移定位裝置13係具有吸取頭、吸盤或其他具有搬移能力之裝置，其可適用於用以將長條型基板20的長條型基板20由定位區11B快速地搬移至載板15，且在搬移的同時，搬移定位裝置13可依據視覺裝置14的檢知訊號進行長條型基板20的定位，使長條型基板20可以高精度的方式置放於載板15上。在本具體實施例中，移動平台110可將發光二極體之條形模組2高速地移動至搬移定位裝置13/視覺裝置14的下方(較佳為正下方)，而搬移定位裝置13可上下移動吸取移動平台110上的發光二極體之條形模組2，搬移定位裝置13係可移動地設置在架體10上，而可使搬移定位裝置13能沿著架體10的X方向與Y方向移動，以將長條型基板20搬移至預定的區域，換言之，搬移定位裝置13之設計係為使長條型基板20之位置能於X軸、Y軸、Z軸及方位角等方向做一精細的調整，因而針對此目的而作的結構之變化並未超出本發明之範疇。The moving positioning device 13 of the present invention has a suction head, a suction cup or other device having a transporting capability, which is applicable to the rapid movement of the elongated substrate 20 of the elongated substrate 20 from the positioning portion 11B to the carrier 15 At the same time as the moving, the transport positioning device 13 can position the long substrate 20 in accordance with the detection signal of the visual device 14, so that the long substrate 20 can be placed on the carrier 15 with high precision. In this embodiment, the mobile platform 110 can move the strip module 2 of the light emitting diode to the lower side (preferably directly below) of the moving positioning device 13 / the visual device 14 at a high speed, and the moving positioning device 13 can The strip module 2 of the light emitting diode on the moving platform 110 is moved up and down, and the moving positioning device 13 is movably disposed on the frame body 10, so that the moving positioning device 13 can be along the X direction of the frame body 10. Moving in the Y direction to move the elongated substrate 20 to a predetermined area, in other words, the positioning device 13 is designed such that the position of the elongated substrate 20 can be X-axis, Y-axis, Z-axis, azimuth, etc. The direction is adjusted in a fine manner, and thus the structural changes made for this purpose are not beyond the scope of the present invention.
請配合第三A圖與第三B圖所示，該搬移定位裝置13包括一工形吸取頭130，其用於依序地吸附位於該移動平台110上之長條型基板20，具體而言，該工形吸取頭130包括一第一橫部131、一第二橫部132及連接該第一橫部131及該第二橫部132之縱向連接部133，該縱向連接部133係將該第一橫部131與該第二橫部132之間的空間區隔成第一空間130A及第二空間130B，後文將詳述第一空間130A及第二空間130B的作用；藉此，第二橫部132的下表面即可裝設所述的吸取頭、吸盤等裝置，以用於吸取長條型基板20，而第一橫部131則可連接於馬達等驅動裝置，以使該工形吸取頭130進行X軸、Y軸、Z軸及方位角等方向之位移，以調整所吸取之長條型基板20的位置；另外，該第二橫部132上更設有多個通孔134，該些通孔134係大致位於第二橫部132的兩端，以對應該些長條型基板20上的定位標誌201。故當搬移定位裝置13吸取移動平台110上之發光二極體之條形模組2而向上移動至運行高度時，即可使發光二極體之條形模組2的高度位於視覺裝置14的焦點位置。As shown in FIG. 3A and FIG. 3B, the moving positioning device 13 includes a work-shaped suction head 130 for sequentially adsorbing the elongated substrate 20 on the mobile platform 110, specifically The working-shaped suction head 130 includes a first lateral portion 131, a second lateral portion 132, and a longitudinal connecting portion 133 connecting the first lateral portion 131 and the second lateral portion 132. The longitudinal connecting portion 133 The space between the first lateral portion 131 and the second lateral portion 132 is divided into a first space 130A and a second space 130B. The functions of the first space 130A and the second space 130B will be described later in detail; The lower surface of the two lateral portions 132 may be provided with the suction head, the suction cup and the like for sucking the elongated substrate 20, and the first lateral portion 131 may be connected to a driving device such as a motor to enable the work. The shape picking head 130 performs displacement in the X-axis, the Y-axis, the Z-axis, and the azimuth direction to adjust the position of the elongated strip substrate 20; and the second horizontal portion 132 is further provided with a plurality of through holes. 134. The through holes 134 are substantially at opposite ends of the second lateral portion 132 to correspond to the positioning marks 201 on the elongated substrate 20. Therefore, when the moving positioning device 13 picks up the strip module 2 of the light emitting diode on the mobile platform 110 and moves up to the running height, the height of the strip module 2 of the light emitting diode is located at the visual device 14. Focus position.
視覺裝置14係可為一攝影機或掃瞄器，例如感光耦合元件(Charge Coupled Device，CCD)攝影機，其係對應該工形吸取頭130以用於擷取影像，故視覺裝置14可較佳地聚焦於被吸附之發光二極體之條形模組2，例如以分析、擷取長條型基板20的上表面影像，並利用上表面影像的定位標誌201/對位記號等標記，以掌握長條型基板20之間的相對位置並加以定位，而搬移定位裝置13可根據視覺裝置14所分析的位置將長條型基板20以高精度的方式放置於載板15上。換言之，視覺裝置14不需移動即可在搬移定位裝置13吸取移動平台110上之發光二極體之條形模組2向上位移的同時，進行影像擷取，故更可進一步節省作業時間。The vision device 14 can be a camera or a scanner, such as a Charge Coupled Device (CCD) camera, which is adapted to capture the image, so that the vision device 14 can preferably Focusing on the strip module 2 of the adsorbed light-emitting diode, for example, analyzing and capturing the upper surface image of the elongated substrate 20, and using the positioning mark 201/alignment mark of the upper surface image to grasp The relative position between the elongated substrates 20 is positioned and positioned, and the transport positioning device 13 can place the elongated substrate 20 on the carrier 15 in a highly precise manner according to the position analyzed by the vision device 14. In other words, the visual device 14 can perform image capturing while the moving positioning device 13 absorbs the upward displacement of the strip module 2 of the light-emitting diode on the moving platform 110 without moving, so that the working time can be further saved.
再一方面，由於應用面的不同，長條型基板20可具有不同長度，例如筆記型電腦之螢幕或一般電腦螢幕所使用之長條型基板20的長度約為212mm或299mm；而大尺寸電視產品所使用之長條型基板20的長度約為685mm，故視覺裝置14較佳地具有可調整特性，以針對不同長度之長條型基板20進行上表面影像的定位標誌201之分析，換言之，視覺裝置14係為可動地裝設於該架體10上，故該兩個設於該架體10上之視覺裝置14之間的相對距離可依照所吸取之長條型基板20的長度加以調整。On the other hand, the elongated substrate 20 can have different lengths depending on the application surface, for example, the length of the long substrate 20 used for the screen of a notebook computer or a general computer screen is about 212 mm or 299 mm; and the large size television The length of the strip substrate 20 used in the product is about 685 mm, so the vision device 14 preferably has an adjustable characteristic for performing analysis of the positioning mark 201 of the upper surface image for the elongated substrate 20 of different lengths, in other words, The visual device 14 is movably mounted on the frame body 10, so that the relative distance between the two vision devices 14 disposed on the frame body 10 can be adjusted according to the length of the elongated substrate 20 that is sucked. .
具體的說，本發明的兩個視覺裝置14係分別設置於該第一空間130A與第二空間130B中，故當搬移定位裝置13移動時並不會與視覺裝置14產生干涉，另外，當搬移定位裝置13進行一吸取/搬移步驟的同時，視覺裝置14透過該些通孔134以擷取被吸取之每一該長條型基板20的兩側端之影像，進而檢視/分析該些長條型基板20的定位標誌201，繼而評估長條型基板20的位置是否偏移或需要調整，若是，則控制搬移定位裝置13移動並調整該長條型基板20的位置。換言之，當搬移定位裝置13進行吸取/搬移步驟的同時，可根據視覺裝置14所分析的結果同步調整長條型基板20的位置，即搬移定位裝置13可依據該等定位標誌201之位置及方向，微調該長條型基板20之X軸、Y軸、Z軸及方位角等方向及位置，而移動並放置該基板20至載板15。Specifically, the two vision devices 14 of the present invention are respectively disposed in the first space 130A and the second space 130B, so that when the moving positioning device 13 moves, it does not interfere with the visual device 14, and when moving, The positioning device 13 performs a suction/transfer step, and the visual device 14 transmits the images of the two sides of each of the elongated substrate 20 through the through holes 134 to inspect and analyze the strips. The positioning mark 201 of the substrate 20 then evaluates whether or not the position of the elongated substrate 20 is shifted or needs to be adjusted. If so, the transfer positioning device 13 is controlled to move and adjust the position of the elongated substrate 20. In other words, while the moving and positioning device 13 performs the sucking/moving step, the position of the elongated substrate 20 can be synchronously adjusted according to the analysis result of the visual device 14, that is, the position and direction of the positioning and positioning device 13 can be determined according to the position and direction of the positioning mark 201. The direction and position of the X-axis, the Y-axis, the Z-axis, and the azimuth of the elongated substrate 20 are fine-tuned, and the substrate 20 is moved and placed on the carrier 15.
在一具體實施例中，該至少兩個視覺裝置14均可為一種上視覺檢測裝置，且其聚焦距離可滿足以下條件：能讓長條型基板20於吸取的狀態下，能同時檢知該長條型基板20上表面之定位標誌201之位置，以能根據檢測/分析之結果調整該長條型基板20，使其位置精度能合乎標準。In one embodiment, the at least two vision devices 14 can each be an upper vision detecting device, and the focusing distance thereof can satisfy the following conditions: the elongated substrate 20 can be simultaneously detected in the sucked state. The position of the positioning mark 201 on the upper surface of the elongated substrate 20 is such that the elongated substrate 20 can be adjusted according to the result of the detection/analysis so that the positional accuracy can be made standard.
如第四圖與第五圖所示，載板15係用以承載上述之長條型基板20，以使該些長條型基板20可高精度的排列於其上，而有效地進行後續製程。載板15上可開設有裸露部分之該長條型基板20的開槽151，以進行後續之條碼噴塗作業。另外，載板15上更可具有固定手段，例如磁力吸附手段(如第四圖利用磁鐵元件152將鐵磁性材料所製成的蓋板16將長條型基板20壓制於載板15上)、黏附手段(如第五圖利用主成份為矽膠的耐高溫之黏膠層將長條型基板20貼合於載板15)等等，以利用固定手段將長條型基板20穩定地固定於載板15上，故可維持該些長條型基板20的相對位置，以達成高精度之貼板。值得說明的是，第五圖僅繪製出三個長條型基板20固定、貼合於載板15上，但不以此為限，例如實際製程中，約有20個長條型基板20固定貼合於載板15。As shown in the fourth and fifth figures, the carrier 15 is used to carry the elongated substrate 20 described above, so that the elongated substrates 20 can be arranged thereon with high precision, and the subsequent processes can be effectively performed. . The carrier 15 may be provided with a bare portion of the slot 151 of the elongated substrate 20 for subsequent bar code spraying operations. In addition, the carrier 15 may further have a fixing means, such as a magnetic attraction means (such as the fourth figure, the cover 16 of the ferromagnetic material is pressed by the magnet element 152 to press the elongated substrate 20 on the carrier 15), Adhesive means (such as the fifth figure, the long-type substrate 20 is attached to the carrier 15 by using a high-temperature resistant adhesive layer whose main component is silicone), and the like, to stably fix the elongated substrate 20 to the carrier by a fixing means. On the board 15, the relative positions of the elongated substrates 20 can be maintained to achieve a high-precision patch. It should be noted that, in the fifth figure, only three elongated substrate 20 are fixed and attached to the carrier 15 , but not limited thereto. For example, in the actual process, about 20 elongated substrates 20 are fixed. It is attached to the carrier 15 .
接下來，步驟S102係翻轉所述固定有該長條型基板20之載板15。如第四A圖所示，在此步驟中，該固定有該長條型基板20之載板15係由步驟S101之定位貼板機1傳送之一位於其下游的翻板機3(即第一翻板機)，以利用第一翻板機將固定有該長條型基板20之載板15進行翻轉、翻面的動作，而藉由該載板上之磁力吸附手段或黏附手段，使該長條型基板20不致因該第一翻板機或後述之第二翻板機的翻板作業而脫落，以使該長條型基板20的一部份由該開槽151所裸露，換言之，該長條型基板20裸露於該開槽151一部份即為後續進行噴印條碼的區域(如第五A圖所示)，噴印條碼的目的主要在於控管原料、產線品質及產品追蹤等。Next, step S102 reverses the carrier 15 to which the elongated substrate 20 is attached. As shown in FIG. 4A, in this step, the carrier 15 to which the elongated substrate 20 is fixed is conveyed by the positioning and pasting machine 1 of step S101, and the flapper 3 located downstream thereof (ie, a flipper for inverting and flipping the carrier 15 to which the elongated substrate 20 is fixed by the first flipper, and magnetic attraction means or adhesion means on the carrier The elongated substrate 20 is not detached by the flipping operation of the first flipper or the second flipper described later, so that a portion of the elongated substrate 20 is exposed by the slot 151, in other words The portion of the strip substrate 20 exposed to the slot 151 is the area for subsequent printing of the bar code (as shown in FIG. 5A), and the purpose of the bar code is mainly to control the quality of the raw materials and the production line. Product tracking, etc.
當固定於載板15上之長條型基板20完成翻轉作業後，即傳送至位於第一翻板機下游之條碼印刷機，以於裸露該載板15之背面的該長條型基板20上印刷形成條碼(即步驟S103)，例如bar code等等，請同樣參考第五A圖。After the elongate substrate 20 fixed on the carrier 15 completes the flipping operation, it is transferred to the bar code printer located downstream of the first flipper to expose the strip substrate 20 on the back side of the carrier 15. The printing forms a barcode (ie, step S103), such as bar code, etc., please refer to the fifth A diagram as well.
接著，步驟S104係將噴有條碼之長條型基板20連同載板15傳送至位於該條碼印刷機下游之另一翻板機3(即第二翻板機)，以再次的翻轉該載板15，使長條型基板20之正面朝上(即印刷有條碼的為背面)，以準備進行發光二極體之置件作業。另外，第一、第二翻板機具有相同的翻板功能(如第四圖所示)，其具體的構造在此不予贅述；且步驟S104後更包括一緩衝步驟S105，以將翻轉為正面朝上之該載板15先行收集於一緩衝台車上，再視產線的狀況進行調整。Next, in step S104, the strip-shaped substrate 20 with the bar code is transferred together with the carrier 15 to another flipper 3 (ie, the second flipper) located downstream of the bar code printer to flip the carrier again. 15. The front side of the elongated substrate 20 is faced upward (i.e., the back side is printed with a bar code) to prepare for the mounting of the light emitting diode. In addition, the first and second flipping machines have the same flap function (as shown in the fourth figure), and the specific configuration thereof is not described herein; and the step S104 further includes a buffering step S105 to be flipped to The carrier plate 15 facing up is collected on a buffer trolley first, and then adjusted according to the condition of the production line.
接下來，長條型基板20連同載板15傳送至位於第二翻板機下游之置件站點，其主要將發光二極體置件、固定於長條型基板20上(步驟S106)，本發明並不限制將發光二極體固定於長條型基板20上的製程種類，例如在本具體實施例中，置件站點可進行一SMT製程，其可包括有印刷、置件、迴焊等相關設備/步驟。Next, the elongated substrate 20 and the carrier 15 are transferred to a placement site located downstream of the second flipper, and the LED assembly is mainly mounted on the elongated substrate 20 (step S106). The present invention does not limit the type of process for fixing the light emitting diode to the elongated substrate 20. For example, in the specific embodiment, the device site may perform an SMT process, which may include printing, placing, and returning. Welding and other related equipment / steps.
接著，當發光二極體固件於載板15上之長條型基板20後，即可進行選擇性地進行一拆板作業(步驟S107)，其主要將長條型基板20脫離於載板15，而拆板之後的長條型基板20上均已裝設有發光二極體，即構成發光二極體燈條結構。Then, after the LED body is soldered to the elongated substrate 20 on the carrier 15 , a stripping operation can be selectively performed (step S107 ), which mainly detaches the elongated substrate 20 from the carrier 15 . The strip-shaped substrate 20 after the board is removed has been provided with a light-emitting diode, that is, a light-emitting diode strip structure.
接著，進行一檢測包裝步驟(S108)，其主要將製作完成之發光二極體燈條結構傳送至位於該置件模組下游之檢測包裝站點，以進行檢測，例如進行點燈測試以及總檢等，並依據發光特性、PIN值等條件進行分類、裝盤等作業，再打包之後即可出貨。Next, a test packaging step (S108) is performed, which mainly transfers the completed light-emitting diode light bar structure to a test packaging site located downstream of the component module for detection, for example, lighting test and total Check and sort, and sort and load according to the characteristics of illuminating characteristics, PIN value, etc., and then ship them after packaging.
根據上述的步驟，本發明更提出一種發光二極體燈條結構之製造系統，其至少包含：定位貼板機1、(第一及第二)翻板機3、條碼印刷機、置件站點及檢測包裝站點；其中定位貼板機1係為本發明之製造系統的起始站點，其連接一進料區，以將長條型基板20固定於載板15的正面，該載板15上開設有裸露部分之該長條型基板20的開槽151，以用於印刷條碼之步驟；第一翻板機則位於該定位貼板機1之下游，其係用於將固定有該長條型基板20之載板15加以翻轉，以使該長條型基板20的一部份由該開槽151所裸露；條碼印刷機則位於該第一翻板機之下游，以將條碼印刷成型於裸露該載板15之背面的該長條型基板20上；第二翻板機則位於該條碼印刷機之下游，其係針對印刷條碼完成之該載板15再次翻轉，使長條型基板20的置件區域(即正面)朝上，以進行發光二極體之打件作業；置件站點則位於該第二翻板機之下游，其係將多個發光二極體電性連接於固定於該載板15上之該長條型基板20，以完成發光二極體燈條結構；檢測包裝站點則位於該置件模組之下游，以將完成之發光二極體燈條結構進行測試、分類、包裝等相關作業。According to the above steps, the present invention further provides a manufacturing system for a light-emitting diode light bar structure, which comprises at least: a positioning and pasting machine 1, (first and second) flipping machine 3, a bar code printing machine, and a placing station. Point and inspection packaging station; wherein the positioning and pasting machine 1 is the starting station of the manufacturing system of the present invention, which is connected to a feeding area for fixing the elongated substrate 20 to the front surface of the carrier 15 The plate 15 is provided with a bare portion of the slot 151 of the elongated substrate 20 for printing a barcode; the first flipper is located downstream of the positioning and pasting machine 1, and is used for fixing The carrier 15 of the elongated substrate 20 is flipped so that a portion of the elongated substrate 20 is exposed by the slot 151; a bar code printer is located downstream of the first flipper to place the barcode Printing is formed on the elongated substrate 20 on the back side of the carrier 15; the second flipper is located downstream of the barcode printing machine, and the carrier 15 is flipped again for the printed barcode to make a strip The mounting area (ie, the front side) of the type substrate 20 faces upward to perform the working of the light emitting diode The device is located downstream of the second flipper, and electrically connects the plurality of LEDs to the elongated substrate 20 fixed on the carrier 15 to complete the LED lamp. The strip structure; the test packaging station is located downstream of the set module to perform testing, sorting, packaging and the like on the completed light-emitting diode strip structure.
綜上所述，本發明具有下列諸項優點：In summary, the present invention has the following advantages:
1、本發明可有效解決發光二極體之燈條結構在生產上的問題，利用高速、高精度視覺定位裝置將長條型基板形成高精度貼板之後，可確保基板之定位品質，故可提升後續列印條碼、印刷與置件之精度，且可省略多種傳統人工生產所必須之檢驗程序，進而達到節省廠房、操作人員的效果，例如可參考附件一，傳統製程需使用3名員工進行貼板作業，在列印條碼之後更需要3名員工進行拆板，再將基板送入置件機，且置件製程之後更需要大量人員進行外觀檢查、或是檢查LED是否偏移(因人工貼板誤差所造成)，而本發明即可省去上述員工，經估算，本發明約可減少60%的員工人數。1. The invention can effectively solve the problem of production of the light bar structure of the light-emitting diode, and the high-speed, high-precision visual positioning device is used to form the high-precision plate after the long-type substrate is formed, thereby ensuring the positioning quality of the substrate, so Improve the accuracy of subsequent printing bar code, printing and placement, and omit the inspection procedures necessary for many traditional manual production, so as to save the effect of plant and operator. For example, refer to Appendix I. The traditional process requires 3 employees. For the slab job, after the bar code is printed, three employees are required to disassemble the board, and then the substrate is sent to the machine. After the process, a large number of people are required to perform visual inspection or check whether the LED is offset (by manual The problem is caused by the sticking error, and the present invention can save the above-mentioned employees. It is estimated that the invention can reduce the number of employees by about 60%.
2、另外，如上所述，本發明係將傳統需以人工方式進行長條型基板貼板之作業提升至機械化自動生產的應用，因此，對LED LIGHT BAR製造廠而言，可節省大量人工；另外，在工形吸取頭吸取長條型基板時，可同時進行視覺定位的作業，以大幅節省行程時間，並形成高精度的貼板，而將上述視覺定位作業後之高精度貼板送入列印條碼、印刷/置件/迴焊生產線中進行列印條碼、印刷/置件等製程，故其產品精度、位置均控制的相當精準。由於定位貼板機可高速的進行貼板，故如附件二所示，本發明之製造系統可取代傳統的三條人工產線，故本發明實能大幅提高產品的生產效率。例如本發明可將整體貼板時間控制約在1.5至2秒/片之間，且兩兩貼板之間的精度可達±20～50um。2. In addition, as described above, the present invention is to upgrade the operation of the long-length substrate sticking to the mechanized automatic production by a manual method, and therefore, a large amount of labor can be saved for the LED LIGHT BAR manufacturer; In addition, when the long suction type substrate is sucked by the shape suction head, the visual positioning operation can be simultaneously performed, thereby greatly reducing the travel time and forming a high-precision slab, and the high-precision slab after the above-mentioned visual positioning operation is fed. The printing bar code, printing / placing / reflowing production line in the printing bar code, printing / placement and other processes, so the product accuracy and position are controlled quite accurately. Since the positioning and pasting machine can perform the high-speed affixing, the manufacturing system of the present invention can replace the traditional three artificial production lines as shown in the second embodiment, so that the invention can greatly improve the production efficiency of the product. For example, the present invention can control the overall splicing time between about 1.5 and 2 seconds/piece, and the precision between the two slabs can reach ±20 to 50 um.
以上所述僅為本發明之較佳可行實施例，非因此侷限本發明之專利範圍，故舉凡運用本發明說明書及圖示內容所為之等效技術變化，均包含於本發明之範圍內。The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the equivalents of the present invention are intended to be included within the scope of the present invention.
1．．．定位貼板機1. . . Positioning board machine
10．．．架體10. . . Frame
11A．．．暫存區11A. . . storage cache
110．．．移動平台110. . . mobile platform
111．．．吸取頭111. . . Suction head
11B．．．定位區11B. . . Location area
13．．．搬移定位裝置13. . . Moving positioning device
130．．．工形吸取頭130. . . Work shape suction head
130A．．．第一空間130A. . . First space
130B．．．第二空間130B. . . Second space
131．．．第一橫部131. . . First transverse
132．．．第二橫部132. . . Second transverse
133．．．縱向連接部133. . . Longitudinal connection
134．．．通孔134. . . Through hole
14．．．視覺裝置14. . . Visual device
15．．．載板15. . . Carrier board
151．．．開槽151. . . Slotting
152．．．磁鐵元件152. . . Magnet element
16．．．蓋板16. . . Cover
2．．．發光二極體之條形模組2. . . Strip module of light emitting diode
20．．．長條型基板20. . . Long strip substrate
201．．．定位標誌201. . . Positioning mark
3．．．翻板機3. . . Flipper
S101～S108．．．步驟S101～S108. . . step
第一圖係顯示習知之發光二極體燈條結構之製造方法的流程示意圖。The first figure is a schematic flow chart showing a manufacturing method of a conventional light-emitting diode strip structure.
第二圖係為本發明之發光二極體燈條結構之製造方法的流程示意圖。The second figure is a schematic flow chart of the manufacturing method of the light-emitting diode light bar structure of the present invention.
第三圖係為本發明之定位貼板機的立體示意圖。The third figure is a perspective view of the positioning and pasting machine of the present invention.
第三A圖係為第三圖中之A部分的放大圖。The third A diagram is an enlarged view of the portion A in the third figure.
第三B圖係為本發明之工形吸取頭的示意圖。The third B diagram is a schematic view of the shaped suction head of the present invention.
第四圖係為本發明利用蓋板將長條型基板固定於載板的示意圖。The fourth figure is a schematic view of the present invention for fixing a long-type substrate to a carrier by a cover.
第四A圖係為本發明之翻板機的示意圖The fourth A picture is a schematic view of the flipper of the present invention
第五圖係為本發明將長條型基板貼合於載板的示意圖。The fifth figure is a schematic view of the present invention in which a long substrate is attached to a carrier.
第五A圖係顯示本發明之翻轉載板並印刷條碼的示意圖。Figure 5A is a schematic view showing the flip carrier of the present invention and printing a bar code.
S101～S108．．．步驟S101～S108. . . step
Claims (10)
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| Application Number | Priority Date | Filing Date | Title |
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| TW99135297A TWI418729B (en) | 2010-10-15 | 2010-10-15 | Manufacturing method and manufacturing system of led light bar |
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| Application Number | Priority Date | Filing Date | Title |
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| TW99135297A TWI418729B (en) | 2010-10-15 | 2010-10-15 | Manufacturing method and manufacturing system of led light bar |
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| TWI418729B true TWI418729B (en) | 2013-12-11 |
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|---|---|---|---|---|
| US5003251A (en) * | 1989-09-12 | 1991-03-26 | Grumman Aerospace Corporation | Bar code reader for printed circuit board |
| US5619416A (en) * | 1995-09-14 | 1997-04-08 | Ncr Corporation | Labeling system and method for an electronic price label |
| US6198525B1 (en) * | 1999-02-19 | 2001-03-06 | International Business Machines Corporation | System for contact imaging both sides of a substrate |
| US20040156028A1 (en) * | 2002-12-24 | 2004-08-12 | Shoichi Okada | Both side projection exposure apparatus |
| JP2005508055A (en) * | 2001-10-26 | 2005-03-24 | インターナショナル バーコード コーポレイション | Method and apparatus for providing bar code information to products in production process |
| TW200628030A (en) * | 2005-01-31 | 2006-08-01 | All Fine Technology Co Ltd | Automatically labeling and inspecting compound apparatus |
| CN1828633A (en) * | 2005-03-03 | 2006-09-06 | 欧颖国际有限公司 | Compounding machine for automatic indicating and interpreting |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5003251A (en) * | 1989-09-12 | 1991-03-26 | Grumman Aerospace Corporation | Bar code reader for printed circuit board |
| US5619416A (en) * | 1995-09-14 | 1997-04-08 | Ncr Corporation | Labeling system and method for an electronic price label |
| US6198525B1 (en) * | 1999-02-19 | 2001-03-06 | International Business Machines Corporation | System for contact imaging both sides of a substrate |
| JP2005508055A (en) * | 2001-10-26 | 2005-03-24 | インターナショナル バーコード コーポレイション | Method and apparatus for providing bar code information to products in production process |
| US20040156028A1 (en) * | 2002-12-24 | 2004-08-12 | Shoichi Okada | Both side projection exposure apparatus |
| TW200628030A (en) * | 2005-01-31 | 2006-08-01 | All Fine Technology Co Ltd | Automatically labeling and inspecting compound apparatus |
| CN1828633A (en) * | 2005-03-03 | 2006-09-06 | 欧颖国际有限公司 | Compounding machine for automatic indicating and interpreting |
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| TW201215801A (en) | 2012-04-16 |
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