TWI417166B - - Google Patents

Info

Publication number: TWI417166B
Authority: TW; Taiwan

Application number

TW101127427A

Other languages

Chinese (zh)

Other versions

TW201249590A (en

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2008-02-12

Filing date

2008-02-12

Publication date

2013-12-01

2008-02-12 Application filed filed Critical

2008-02-12 Priority to TW101127427A priority Critical patent/TW201249590A/en

2012-12-16 Publication of TW201249590A publication Critical patent/TW201249590A/en

2013-12-01 Application granted granted Critical

2013-12-01 Publication of TWI417166B publication Critical patent/TWI417166B/zh

Links

TW101127427A 2008-02-12 2008-02-12 Tools for polishing and associated methods TW201249590A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
TW101127427A TW201249590A (en)	2008-02-12	2008-02-12	Tools for polishing and associated methods

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
TW101127427A TW201249590A (en)	2008-02-12	2008-02-12	Tools for polishing and associated methods

Publications (2)

Publication Number	Publication Date
TW201249590A TW201249590A (en)	2012-12-16
TWI417166B true TWI417166B (en)	2013-12-01

Family

ID=48139062

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW101127427A TW201249590A (en)	2008-02-12	2008-02-12	Tools for polishing and associated methods

Country Status (1)

Country	Link
TW (1)	TW201249590A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0569341A (en) *	1991-06-28	1993-03-23	Mitsubishi Materials Corp	Diamond wrapping tape for super-percision grinding and its manufacture
TW544363B (en) *	2001-09-04	2003-08-01	Rikagaku Kenkyusho	Metal-less bond grindstone, electrolytic dressing grinding method and device using same
TW200626300A (en) *	2004-12-30	2006-08-01	Chien-Min Sung	Chemical mechanical polishing pad dresser

2008
- 2008-02-12 TW TW101127427A patent/TW201249590A/en not_active IP Right Cessation

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0569341A (en) *	1991-06-28	1993-03-23	Mitsubishi Materials Corp	Diamond wrapping tape for super-percision grinding and its manufacture
TW544363B (en) *	2001-09-04	2003-08-01	Rikagaku Kenkyusho	Metal-less bond grindstone, electrolytic dressing grinding method and device using same
TW200626300A (en) *	2004-12-30	2006-08-01	Chien-Min Sung	Chemical mechanical polishing pad dresser

Also Published As

Publication number	Publication date
TW201249590A (en)	2012-12-16

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Legal Events

Date	Code	Title	Description
2023-09-01	MM4A	Annulment or lapse of patent due to non-payment of fees