TWI415703B - Laser machining apparatus and method for detecting a substrate position - Google Patents
Laser machining apparatus and method for detecting a substrate position Download PDFInfo
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- TWI415703B TWI415703B TW099143916A TW99143916A TWI415703B TW I415703 B TWI415703 B TW I415703B TW 099143916 A TW099143916 A TW 099143916A TW 99143916 A TW99143916 A TW 99143916A TW I415703 B TWI415703 B TW I415703B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
Abstract
Description
本發明係有關一種雷射加工裝置及基板位置檢測方法，能算出基板對加工台之偏位量。The present invention relates to a laser processing apparatus and a substrate position detecting method capable of calculating a misalignment amount of a substrate to a processing table.
就加工印刷電路基板等工件(加工對象物)之裝置而言，有一種對工件照射雷射光作穿孔加工等之雷射加工裝置(微孔雷射加工機)。此等雷射加工裝置，係檢測設置在工件上之定位標記之位置，而依據檢測結果作雷射加工時之位置補正(偏位補正)。在檢測定位標記之位置時，例如使用照像機等攝像定位標記之圖像，對所攝像之圖像施行圖像處理則可檢測定位標記。In the apparatus for processing a workpiece (object to be processed) such as a printed circuit board, there is a laser processing apparatus (micropore laser processing machine) that irradiates a workpiece with laser light for punching or the like. These laser processing apparatuses detect the position of the positioning mark provided on the workpiece, and perform position correction (bias correction) in the laser processing according to the detection result. When the position of the positioning mark is detected, for example, an image of the image capturing positioning mark such as a camera is used, and image processing is performed on the imaged image to detect the positioning mark.
要施行雷射加工之工件，有時會在工件面內發生伸縮，因此為提高工件定位精確度，有設定多數定位標記之需要。例如專利文獻1之雷射加工裝置，係使照像機移動到定位標記上，用以進行定位標記之圖像處理。於是檢測定位標記之偏移量(位置)。對所有定位標記反覆作此等處理，而完成所有定位標記之檢測。隨後作定位補正。In order to perform laser processing, the workpiece sometimes expands and contracts in the surface of the workpiece. Therefore, in order to improve the positioning accuracy of the workpiece, it is necessary to set a plurality of positioning marks. For example, the laser processing apparatus of Patent Document 1 moves the camera to the positioning mark for image processing of the positioning mark. The offset (position) of the positioning mark is then detected. This process is repeated for all the positioning marks, and the detection of all the positioning marks is completed. Then make corrections for positioning.
又，專利文獻2之雷射加工裝置，係移動XY台，使1個定位標記移動至照像機下。隨後用照像機攝像定位標記，由圖像處理裝置求得攝像區域內之定位標記座標。於是，依據XY台之現在位置之座標，與攝像區域內之定位標記之座標，求得對機械原點之定位標記之偏移量。雷射加工裝置係對多數定位標記，分別求得偏移量。於是，NC裝 置依據偏移量，在加工時對基板作加工指令值之補正。Further, the laser processing apparatus of Patent Document 2 moves the XY stage to move one positioning mark to the lower side of the camera. Subsequently, the camera is used to capture the positioning mark, and the image processing device determines the positioning mark coordinates in the imaging area. Then, based on the coordinates of the current position of the XY stage and the coordinates of the positioning marks in the imaging area, the offset of the positioning mark to the mechanical origin is obtained. The laser processing apparatus determines the offset for each of the plurality of positioning marks. So, NC installed According to the offset, the processing command value of the substrate is corrected during processing.
專利文獻1：日本特開2000-176666號公報Patent Document 1: Japanese Laid-Open Patent Publication No. 2000-176666
專利文獻2：日本特開平10-328863號公報Patent Document 2: Japanese Patent Laid-Open No. Hei 10-328863
但是，上述前者或後者之以往技術，係在移動照像機到定位標記而停止後，才作取得圖像及圖像處理，隨後再度進行移動照像機至定位標記等之反覆處理。因此圖像處理所需時間，與定位標記之數量成正比增加。其結果，定位標記之位置檢測有花費多時之問題。However, the prior art of the former or the latter is to acquire image and image processing after the mobile camera stops moving to the positioning mark, and then repeats the processing of moving the camera to the positioning mark and the like. Therefore, the time required for image processing increases in proportion to the number of positioning marks. As a result, the position detection of the positioning mark has a problem that it takes a lot of time.
本發明係針對上述問題，提供一種雷射加工裝置及基板位置檢測方法，其目的為能在短時間內達成基板之偏位檢測。The present invention is directed to the above problems, and provides a laser processing apparatus and a substrate position detecting method, the object of which is to achieve offset detection of a substrate in a short time.
為解決上述問題而達成目的，本發明之雷射加工裝置係具備：加工台，裝載雷射加工對象之基板並能在和上述基板之主面平行之面內移動；攝像部，依序攝像設在上述基板上而用以檢測上述基板上之位置之定位用標記；移動指示部，對上述加工台輸出移動指令，使上述加工台不停止地移動俾使上述攝像部連續依序相對移動到上述定位用標記上；攝像指示部，在上述攝像部移動到上述定位用標記上時，對上述攝像部輸出攝像指示；標記位置算出部，在上述移動指示部在對上述加工台輸出移動指令之期間，依據上述攝像部所攝像之上述定位用標記之圖像，算出上 述定位標記之位置；偏位量算出部，使用上述標記位置算出部所算出之上述定位用標記之位置，算出上述基板之對上述加工台之偏位量；及雷射加工部，一面以上述偏位量算出部所算出之偏位量對上述基板之雷射加工位置進行位置偏移補正，一面進行雷射加工。In order to achieve the object, the laser processing apparatus of the present invention includes a processing table that mounts a substrate to be processed by laser processing and can move in a plane parallel to a main surface of the substrate, and an imaging unit sequentially displays the image. a positioning mark for detecting a position on the substrate on the substrate; and a movement instructing unit that outputs a movement command to the processing table to move the processing table without stopping, so that the imaging unit sequentially moves relative to the above The imaging instruction unit outputs an imaging instruction to the imaging unit when the imaging unit moves to the positioning mark, and the marker position calculating unit outputs the movement command to the processing unit when the movement instruction unit outputs a movement instruction to the processing unit. Calculating the image based on the image of the positioning mark imaged by the imaging unit a position of the positioning mark; the displacement amount calculation unit calculates a deviation amount of the substrate from the processing table using the position of the positioning mark calculated by the mark position calculation unit; and the laser processing unit The amount of deviation calculated by the deviation amount calculation unit is subjected to laser processing while performing positional offset correction on the laser processing position of the substrate.
依據本發明，具有能在短時間內達成基板之偏位檢測之效果。According to the present invention, it is possible to achieve the effect of detecting the deviation of the substrate in a short time.
以下依據圖式詳細說明本發明之雷射加工裝置及基板位置檢測方法有關之實施形態。但是本發明不受本實施形態之限制。Hereinafter, embodiments of the laser processing apparatus and the substrate position detecting method of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited by the embodiment.
第1圖為本發明之一實施形態之雷射加工裝置之構成圖。雷射加工裝置100係對被加工件之基板(工件)4照射雷射光L(脈衝雷射光)用以施行鑽孔加工之裝置。本實施形態之雷射加工裝置100，係同時進行使照像機39向定位用標記上移動之處理，及定位用標記之圖像處理(算出定位用標記之位置之處理)，而算出裝載基板4之位置之偏位量者。Fig. 1 is a view showing the configuration of a laser processing apparatus according to an embodiment of the present invention. The laser processing apparatus 100 is a device for irradiating a substrate (workpiece) 4 of a workpiece with laser light L (pulse laser light) for performing drilling processing. In the laser processing apparatus 100 of the present embodiment, the process of moving the camera 39 to the positioning mark and the image processing of the positioning mark (the process of calculating the position of the positioning mark) are simultaneously performed, and the loading substrate is calculated. The position of the 4 position is biased.
雷射加工裝置100係具備：雷射振盪器1，振盪(產生)雷射光L；雷射加工部3，對基板4進行雷射加工；及加工控制裝置2。雷射振盪器1為產生雷射光L而將雷射光送出至雷射加工部3。雷射加工部3具備：振鏡(galvano Mirror)35X、35Y；振鏡式掃描器(galvano scanner)36X、36Y；聚光透鏡(fθ透鏡)34；XY台(加工台)30；及照像機39。The laser processing apparatus 100 includes a laser oscillator 1 that oscillates (produces) laser light L, a laser processing unit 3 that performs laser processing on the substrate 4, and a processing control device 2. The laser oscillator 1 sends the laser light to the laser processing unit 3 to generate the laser light L. The laser processing unit 3 is provided with a galvanometer (galvano) Mirror) 35X, 35Y; galvano scanner 36X, 36Y; concentrating lens (fθ lens) 34; XY stage (processing table) 30; and camera 39.
振鏡式掃描器36X、36Y具有改變雷射光L之軌道向基板4之照射位置移動之功能，可使雷射光L對設定在基板4之各加工範圍內作2維掃描。振鏡式掃描器36X、36Y為使雷射光L向X-Y方向掃描，使振鏡35X、35Y向規定角度旋轉。The galvanometer scanners 36X and 36Y have a function of changing the irradiation position of the track of the laser light L to the substrate 4, and the laser light L can be scanned in two dimensions in each processing range of the substrate 4. The galvanometer scanners 36X and 36Y rotate the laser light L in the X-Y direction to rotate the galvanomirrors 35X and 35Y at a predetermined angle.
振鏡35X、35Y能反射雷射光L偏向規定角度。振鏡35X使雷射光L偏向X方向，而振鏡35Y使雷射光L偏向Y方向。The galvanometers 35X and 35Y can reflect the laser light L to a predetermined angle. The galvanometer 35X deflects the laser light L in the X direction, and the galvanometer 35Y biases the laser light L in the Y direction.
聚光透鏡34為遠心性(telecentric)之聚光透鏡。聚光透鏡34使雷射光L對基板4之主面偏向為垂直方向，並且使雷射光L聚光(照射)在基板4之加工位置(孔位置Hx)。The condensing lens 34 is a telecentric condensing lens. The condensing lens 34 deflects the laser light L toward the main surface of the substrate 4 in the vertical direction, and condenses (illuminates) the laser light L at the processing position (hole position Hx) of the substrate 4.
基板4為印刷佈線板(printed circuit board)等之加工對象件，實施多數鑽孔加工形成貫穿孔。基板4為例如為有銅箔(導電層)、樹脂(絕緣層)、銅箔(導電層)之三層構造。The substrate 4 is a workpiece to be processed such as a printed circuit board, and a plurality of drilling processes are performed to form a through hole. The substrate 4 has a three-layer structure of, for example, a copper foil (conductive layer), a resin (insulating layer), and a copper foil (conductive layer).
XY台30為裝載基板4，並且由後述之馬達42X、42Y驅動而在XY平面內移動。由此XY台30使基板4在面內之方向移動。The XY stage 30 is mounted on the substrate 4, and is driven by the motors 42X and 42Y, which will be described later, to move in the XY plane. Thereby, the XY stage 30 moves the substrate 4 in the in-plane direction.
在不移動XY台30之情形下，由振鏡式機構之動作(振鏡式掃描器36X、36Y之移動)雷射加工可能加工之範圍(掃 描可能區域)即為加工區域(掃描範圍)。於雷射加工裝置100使XY台30在XY平面內移動後，由振鏡式掃描器36X、36Y作2維掃描雷射光L。XY台30依序移動使各加工範圍之中心能在聚光透鏡34之中心正下面(振鏡原點)。振鏡式機構則動作為使加工範圍內所設定之各孔位置Hx能依序在雷射光L之照射位置。由XY台30在加工範圍間之移動與由振鏡式機構之在加工範圍內之雷射光L之2維掃描，就在基板4內依序進行。如是，基板4內所有孔位置Hx全受到雷射加工。In the case where the XY stage 30 is not moved, the range of possible processing by the action of the galvanometer mechanism (movement of the galvanometer scanners 36X, 36Y) The possible area is the processing area (scanning range). After the laser processing apparatus 100 moves the XY stage 30 in the XY plane, the galvanometer scanners 36X and 36Y scan the laser light L in two dimensions. The XY stage 30 is sequentially moved so that the center of each processing range can be directly below the center of the condensing lens 34 (origin of the galvanometer). The galvanometer mechanism operates so that the position Hx of each hole set in the processing range can be sequentially irradiated at the position of the laser light L. The two-dimensional scanning of the XY stage 30 between the processing ranges and the laser light L in the processing range by the galvanometer mechanism is sequentially performed in the substrate 4. If so, all hole positions Hx in the substrate 4 are all subjected to laser processing.
照像機(攝像部)39係設置在對基板4照射雷射光L之加工頭(無圖示)之附近。照像機39係對預先設在基板4之多數定位用標記(以下稱為標記6)進行攝像，再將所攝像之圖像送至加工控制裝置2。於本實施形態為使照像機39一面在基板4上移動之同時一面使照像機39攝像標記6之圖像。為此，照像機39係由快門功能等能在短時間取得圖像。The camera (image pickup unit) 39 is provided in the vicinity of a processing head (not shown) that irradiates the substrate 4 with the laser light L. The camera 39 captures a plurality of positioning marks (hereinafter referred to as marks 6) provided in advance on the substrate 4, and sends the imaged images to the processing control device 2. In the present embodiment, the camera 39 is caused to image the image of the mark 6 while moving the camera 39 on the substrate 4. For this reason, the camera 39 can acquire an image in a short time by a shutter function or the like.
標記6為補正基板4因伸縮所產生之基板4之偏位之對準標記(Alignment Mark)。照像機39之位置為固定者，於雷射加工裝置100係由XY台30使基板4之位置移動，而改變照像機39與基板4之間之相對位置。但是，以下為方便說明雷射加工裝置100之動作，假設係使照像機39之位置移動，而使照像機39與基板4之間之相對位置有所變化，以說明雷射加工裝置100之動作之情形。Reference numeral 6 is an alignment mark for correcting the offset of the substrate 4 due to expansion and contraction of the substrate 4. The position of the camera 39 is fixed. In the laser processing apparatus 100, the position of the substrate 4 is moved by the XY stage 30, and the relative position between the camera 39 and the substrate 4 is changed. However, in the following, in order to facilitate the description of the operation of the laser processing apparatus 100, it is assumed that the position of the camera 39 is moved, and the relative position between the camera 39 and the substrate 4 is changed to explain the laser processing apparatus 100. The situation of the action.
加工控制裝置2係連接在雷射振盪器1及雷射加工部 3(無圖示)，以控制雷射振盪器1及雷射加工部3。加工控制裝置2係依據標記6之實際位置(檢測結果)，及對機械原點(XY台30上之基準位置)之標記6之預測位置(無偏位時之理論值)雙方間之差值(後述之偏位量208)，用以補正基板4之雷射加工位置(座標)。換言之，加工控制裝置2係依據照像機39之標記位置檢測結果算出偏位量208，並為了補正偏位量208而控制基板4之雷射加工位置。The processing control device 2 is connected to the laser oscillator 1 and the laser processing unit 3 (not shown) to control the laser oscillator 1 and the laser processing unit 3. The machining control device 2 is based on the actual position of the mark 6 (detection result) and the difference between the predicted position of the mark 6 of the machine origin (the reference position on the XY stage 30) (the theoretical value when there is no deviation). (Deviation amount 208, which will be described later), for correcting the laser processing position (coordinate) of the substrate 4. In other words, the processing control device 2 calculates the offset amount 208 based on the mark position detection result of the camera 39, and controls the laser machining position of the substrate 4 in order to correct the offset amount 208.
加工控制裝置2在雷射加工基板4時，將設定在加工程式中之雷射加工條件，向雷射振盪器1與雷射加工部3指示。又，加工控制裝置2在對基板4雷射加工之前，依據標記6之檢測位置，算出基板4之面內偏位量208。於本實施形態之加工控制裝置2，在攝像標記6時，不必停止照像機39(XY台30)之移動，一面使照像機39依序移動到標記6上。於是加工控制裝置2一面使照像機39在XY平面內移動而當照像機39到達標記6上時，由照像機39攝像標記6。由此加工控制裝置2係同時進行照像機39之移動處理，及標記6之攝像圖像之圖像處理(算出標記6之位置之處理)。When the substrate 2 is laser-processed, the processing control device 2 instructs the laser processing conditions set in the machining program to the laser oscillator 1 and the laser processing unit 3. Further, the processing control device 2 calculates the in-plane offset amount 208 of the substrate 4 in accordance with the detection position of the mark 6 before the laser processing on the substrate 4. In the processing control device 2 of the present embodiment, when the marker 6 is imaged, the camera 39 is sequentially moved to the marker 6 without stopping the movement of the camera 39 (XY stage 30). Then, the processing control device 2 moves the camera 39 in the XY plane, and when the camera 39 reaches the mark 6, the camera 6 captures the mark 6. Thereby, the processing control device 2 simultaneously performs the moving processing of the camera 39 and the image processing of the captured image of the mark 6 (the processing of calculating the position of the mark 6).
加工控制裝置2係由電腦等所構成，以數值(NC)控制等方式控制雷射振盪器1及雷射加工部3。加工控制裝置2係備有中央處理機(CPU)、唯讀記憶體(ROM)、隨機存取記憶體(RAM)所構成。加工控制裝置2在控制雷射振盪器1與雷射加工部3時，CPU依自使用者之輸入部(不圖示)輸入之資料，讀取儲存在ROM內之加工程式，開展至RAM內 之程式儲存區域而進行各種處理。在此處理時所產生之各種數據，暫時儲存於RAM內所形成之數據儲存區域。如是，加工控制裝置2即控制雷射振盪器1與雷射加工部3。The processing control device 2 is constituted by a computer or the like, and controls the laser oscillator 1 and the laser processing unit 3 by numerical (NC) control or the like. The processing control device 2 is configured by a central processing unit (CPU), a read only memory (ROM), and a random access memory (RAM). When the processing control device 2 controls the laser oscillator 1 and the laser processing unit 3, the CPU reads the processing program stored in the ROM based on the data input from the input unit (not shown) of the user, and proceeds to the RAM. The program stores areas for various processing. The various data generated during this processing are temporarily stored in a data storage area formed in the RAM. If so, the machining control device 2 controls the laser oscillator 1 and the laser processing unit 3.
其次，說明加工控制裝置2與XY台30之構成。第2圖為加工控制裝置與XY台之構成圖。加工控制裝置2係連接在伺服放大器41X、41Y，而伺服放大器41X、41Y則分別連接於馬達42X、42Y。馬達42X、42Y又分別連接於編碼器43X、43Y，並且連接於XY台30。Next, the configuration of the machining control device 2 and the XY table 30 will be described. Fig. 2 is a view showing the configuration of the machining control device and the XY table. The machining control device 2 is connected to the servo amplifiers 41X and 41Y, and the servo amplifiers 41X and 41Y are connected to the motors 42X and 42Y, respectively. The motors 42X, 42Y are in turn connected to the encoders 43X, 43Y, respectively, and are connected to the XY stage 30.
加工控制裝置2係將用以控制XY台30之X方向位置之控制訊號(X方向控制指令)向伺服放大器41X輸出。加工控制裝置2係將用以控制XY台30之Y方向位置之控制訊號(Y方向控制指令)向伺服放大器41Y輸出。伺服放大器41X、41Y係將分別來自加工控制裝置2之X方向控制指令及Y方向控制指令放大，而送達馬達42X、42Y。The machining control device 2 outputs a control signal (X direction control command) for controlling the X-direction position of the XY table 30 to the servo amplifier 41X. The machining control device 2 outputs a control signal (Y-direction control command) for controlling the position of the XY stage 30 in the Y direction to the servo amplifier 41Y. The servo amplifiers 41X and 41Y amplify the X direction control command and the Y direction control command from the machining control device 2, respectively, and send them to the motors 42X and 42Y.
馬達42X係使XY台30在XY平面內(對基板4之主面平行之面)移動到X方向控制指令所指令之位置(X座標)。另外，馬達42Y也使XY台30在XY平面內移動到Y方向控制指令所指令之位置(Y座標)。The motor 42X moves the XY stage 30 in the XY plane (the surface parallel to the main surface of the substrate 4) to the position (X coordinate) commanded by the X direction control command. Further, the motor 42Y also moves the XY stage 30 in the XY plane to the position (Y coordinate) commanded by the Y direction control command.
XY台30具備：直線量尺(linear scale)40X，用以檢測XY台30之X方向之位置(座標)；及直線量尺40Y，用以檢測XY台30之Y方向位置。直線量尺40X、40Y將所檢測之XY台30在XY平面內之位置(以下稱為台位置101)送達加工控制裝置2。台位置101係表示照像機39與XY台30間之相對位置之資訊。The XY stage 30 includes a linear scale 40X for detecting the position (coordinate) of the XY stage 30 in the X direction, and a linear scale 40Y for detecting the Y direction position of the XY stage 30. The linear scales 40X and 40Y feed the detected position of the XY stage 30 in the XY plane (hereinafter referred to as the stage position 101) to the processing control device 2. The station position 101 indicates information on the relative position between the camera 39 and the XY unit 30.
再者，直線量尺40X、40Y可設置在XY台30附近，也可設置於非在XY台30之另一部位作為與XY台30不同之構成。Further, the linear scales 40X and 40Y may be provided in the vicinity of the XY stage 30, or may be provided in another part other than the XY stage 30 as a configuration different from the XY stage 30.
編碼器43X、43Y係連接於馬達42X、42Y及加工控制裝置2。編碼器43X檢測對應馬達42X之狀態(相應X方向控制指令之動作狀態)，將檢測結果送達加工控制裝置2。又，編碼器43Y檢測對應馬達42Y之狀態(相應Y方向控制指令之動作狀態)，將檢測結果送達加工控制裝置2。The encoders 43X and 43Y are connected to the motors 42X and 42Y and the machining control device 2. The encoder 43X detects the state of the corresponding motor 42X (the operation state of the corresponding X-direction control command), and sends the detection result to the machining control device 2. Further, the encoder 43Y detects the state of the corresponding motor 42Y (the operation state of the corresponding Y-direction control command), and sends the detection result to the machining control device 2.
照像機39將設置在基板4上之標記6攝像後，將攝像之圖像送到加工控制裝置2。加工控制裝置2具有加工位置算出部20。加工位置算出部20係依據照像機39所攝像之標記6之圖像、直線量尺40X、40Y所檢測之台位置101等，算出基板4之位置(XY平面內之座標)(以下稱為基板座標201)。加工位置算出部20使用XY台30之移動速度、與隨XY台30移動時之基板4之偏位量G的對應關係(後述之基板位置偏移資訊151)，用以補正基板座標201。The camera 39 images the mark 6 provided on the substrate 4, and then sends the imaged image to the processing control device 2. The machining control device 2 has a machining position calculation unit 20. The machining position calculation unit 20 calculates the position (coordinates in the XY plane) of the substrate 4 based on the image of the mark 6 captured by the camera 39, the stage position 101 detected by the linear scales 40X and 40Y, and the like (hereinafter referred to as Substrate coordinates 201). The machining position calculation unit 20 corrects the substrate coordinates 201 by using the correspondence relationship between the moving speed of the XY stage 30 and the offset amount G of the substrate 4 when moving along the XY stage 30 (substrate position shift information 151 to be described later).
加工位置算出部20，當在補正基板座標201後之基板座標202成為標記6之座標時，使照像機39攝像標記6之圖像，依據所攝像之圖像算出標記6之座標(後述之標記座標205)。加工位置算出部20使用XY台30之移動速度、與自發出標記6之攝像指令至實際攝像標記6所需時間的對應關係，補正標記座標205。加工位置算出部20將補正標記座標205所得之標記座標206，與標記6之在加工程式上之座標(後述之標記位置資訊152)間之差，算出作為 基板4之偏位量208。加工位置算出部20由每一標記6算出基板4之偏位量208。加工控制裝置2依據加工位置算出部20所算出之基板4之偏位量208，補正對基板4之雷射加工位置。When the substrate coordinate 202 after the substrate coordinates 201 is corrected becomes the coordinate of the mark 6, the image processing unit 39 causes the camera 39 to capture the image of the mark 6 and calculates the coordinates of the mark 6 based on the imaged image (described later). Mark coordinates 205). The machining position calculation unit 20 corrects the mark coordinates 205 by using the moving speed of the XY stage 30 and the correspondence relationship from the imaging command issued from the mark 6 to the time required for the actual image pickup mark 6. The machining position calculation unit 20 calculates the difference between the mark coordinates 206 obtained by the correction mark coordinates 205 and the coordinates of the mark 6 on the machining program (mark position information 152 described later). The offset amount 208 of the substrate 4. The machining position calculation unit 20 calculates the offset amount 208 of the substrate 4 from each mark 6. The machining control device 2 corrects the laser machining position of the substrate 4 in accordance with the offset amount 208 of the substrate 4 calculated by the machining position calculating unit 20.
其次，說明加工位置算出部20之構成。第3圖為實施形態有關之加工位置算出部之構成方塊圖。加工位置算出部20係具備：移動指令輸出部21；速度算出部22；台位置輸入部23；基板位置算出部24；攝像指令輸出部25；圖像輸入部26；圖像處理部27；座標補正部28；偏位量算出部29；基板位置偏移資訊儲存部M1；加工程式儲存部M2；及攝像所需時間儲存部M3。Next, the configuration of the machining position calculation unit 20 will be described. Fig. 3 is a block diagram showing the configuration of a machining position calculating unit according to the embodiment. The machining position calculation unit 20 includes a movement command output unit 21, a speed calculation unit 22, a table position input unit 23, a substrate position calculation unit 24, an imaging command output unit 25, an image input unit 26, an image processing unit 27, and coordinates. Correction unit 28; offset amount calculation unit 29; substrate position shift information storage unit M1; processing program storage unit M2; and imaging required time storage unit M3.
基板位置偏移資訊儲存部M1為用以儲存表示XY台30之移動速度與隨XY台30移動之基板4之偏位量G的對應關係之基板位置偏移資訊151之儲存部。基板位置偏移資訊151可由基板位置算出部24讀取。The substrate position shift information storage unit M1 is a storage unit for storing the substrate position shift information 151 indicating the correspondence relationship between the moving speed of the XY stage 30 and the offset amount G of the substrate 4 that moves with the XY stage 30. The substrate position shift information 151 can be read by the substrate position calculating unit 24.
加工程式儲存部M2為用以儲存使用於檢測基板4之雷射加工及偏位之加工程式之儲存部等。加工程式儲存部M2所儲存之加工程式，係包含顯示標記6之位置(在基板4內之座標)之標記位置資訊152。標記位置資訊152係由移動指令輸出部21，與攝像指令輸出部25所讀取。The processing program storage unit M2 is a storage unit for storing a processing program for laser processing and offset of the detection substrate 4. The machining program stored in the machining program storage unit M2 includes mark position information 152 indicating the position of the mark 6 (the coordinates in the substrate 4). The mark position information 152 is read by the movement command output unit 21 and the imaging command output unit 25.
攝像所需時間儲存部M3，為將自輸出標記6之攝像指令至照像機39攝像標記6之圖像所需時間，當作為攝像所需時間資訊153而儲存之儲存部等記憶體。攝像所需時間資訊153係由座標補正部28讀取。The imaging required time storage unit M3 is a storage unit such as a storage unit that stores the image pickup command from the output mark 6 to the image of the image of the image of the image pickup unit 6 and stores it as the imaging required time information 153. The imaging required time information 153 is read by the coordinate correction unit 28.
移動指令輸出部21，係依據對XY台30上之基準位置之基板4之原點座標、與標記位置資訊152，對伺服放大器41X、41Y輸出控制指令(X方向控制指令、Y方向控制指令)。X方向控制指令、及Y方向控制指令分別為指示基板4之X方向之移動量、Y方向之移動量之資訊。The movement command output unit 21 outputs a control command (X direction control command and Y direction control command) to the servo amplifiers 41X and 41Y based on the origin coordinates of the substrate 4 at the reference position on the XY stage 30 and the mark position information 152. . The X-direction control command and the Y-direction control command are information indicating the amount of movement of the substrate 4 in the X direction and the amount of movement in the Y direction, respectively.
移動指令輸出部21，係對設置在基板4上之各標記6，以使照像機39依序通過標記6上方之方式，對伺服放大器41X、41Y輸出控制指令。移動指令輸出部21也將輸出至伺服放大器41X、41Y之控制指令送達速度算出部22。The movement command output unit 21 pairs the respective marks 6 provided on the substrate 4 so that the camera 39 sequentially outputs the control commands to the servo amplifiers 41X and 41Y. The movement command output unit 21 also supplies the control command output to the servo amplifiers 41X and 41Y to the speed calculation unit 22.
速度算出部22係依據移動指令輸出部21所輸出之控制指令，算出XY台30之移動速度。速度算出部22將所算出之移動速度，當作為台移動速度Tv送達基板位置算出部24與座標補正部28。台位置輸入部23係將來自直線量尺40X、40Y之XY台30之位置(台位置101)輸入並送至基板位置算出部24。The speed calculation unit 22 calculates the moving speed of the XY stage 30 based on the control command output from the movement command output unit 21. The speed calculation unit 22 sends the calculated movement speed to the substrate position calculation unit 24 and the coordinate correction unit 28 as the table movement speed Tv. The stage position input unit 23 inputs and sends the position (stage position 101) of the XY stage 30 from the linear scales 40X and 40Y to the substrate position calculating unit 24.
基板位置算出部24係依據來自時時刻刻改變之台位置輸入部23之台位置101，與XY台30上之對於基準位置之基板4之原點座標，算出基板座標201。基板4及XY台30均為剛性體。因此照像機39與基板4之間之實際相對位置，及依據直線量尺40X、40Y所檢測之台位置101算出之基準座標201，雙方之間會有偏位(基板4之偏位)。為算出此偏位量Gv，於本實施形態係依據基板位置偏移資訊儲存部M1內之基板位置偏移資訊151，補正基板座標201、算出基板座標202。The substrate position calculating unit 24 calculates the substrate coordinates 201 based on the origin position 101 of the stage position input unit 23 that is changed from time to time, and the origin coordinates of the substrate 4 on the XY stage 30 with respect to the reference position. Both the substrate 4 and the XY stage 30 are rigid bodies. Therefore, the actual relative position between the camera 39 and the substrate 4 and the reference coordinate 201 calculated based on the stage position 101 detected by the linear scales 40X and 40Y are offset (the offset of the substrate 4). In order to calculate the offset amount Gv, in the present embodiment, the substrate coordinates 201 are corrected based on the substrate position shift information 151 in the substrate position shift information storage unit M1, and the substrate coordinates 202 are calculated.
基板位置算出部24係依據台移動速度Tv，與基板位置偏移資訊151，算出對應XY台30移動速度之基板4之偏位量Gv。基板位置算出部24係將算出之基板4之偏位量Gv加算至基板座標201，藉此算出基板座標202。基板位置算出部24將算出之基板座標202，當作為基板4之位置送達攝像指令輸出部25。The substrate position calculating unit 24 calculates the offset amount Gv of the substrate 4 corresponding to the moving speed of the XY stage 30 based on the table moving speed Tv and the substrate position shift information 151. The substrate position calculating unit 24 calculates the substrate coordinates 202 by adding the calculated offset amount Gv of the substrate 4 to the substrate coordinates 201. The substrate position calculating unit 24 sends the calculated substrate coordinates 202 to the imaging command output unit 25 as the position of the substrate 4.
攝像指令輸出部25依據標記位置資訊152，以及基板位置算出部24所算出之基板4之位置，對照像機39輸出攝像指令。攝像指令輸出部25在照像機39到達標記6上之際時，對照像機39輸出攝像指令。The imaging command output unit 25 outputs an imaging command to the camera 39 based on the marker position information 152 and the position of the substrate 4 calculated by the substrate position calculating unit 24. When the camera 39 reaches the mark 6, the imaging command output unit 25 outputs an imaging command to the camera 39.
圖像輸入部26將照像機39所攝像之標記6之圖像輸入而送達圖像處理部27。圖像處理部27依據標記6之圖像，而算出標記6之重心位置。圖像處理部27將所算出之重心位置作為標記座標205，送至座標補正部28。The image input unit 26 inputs an image of the mark 6 imaged by the camera 39 to the image processing unit 27. The image processing unit 27 calculates the position of the center of gravity of the marker 6 based on the image of the marker 6. The image processing unit 27 sends the calculated position of the center of gravity as the mark coordinates 205 to the coordinate correcting unit 28.
座標補正部28，係依據攝像所需時間資訊153，與來自速度算出部22之台移動速度Tv，補正標記座標205，由此算出標記座標206。具體而言，座標補正部28係依據攝像所需時間資訊153、與台移動速度Tv，算出對應XY台30之移動速度之標記座標205之偏位量。座標補正部28係藉由將算出之偏位量加算於標記座標205而算出標記座標206。座標補正部28就每一標記6算出標記座標206。座標補正部28將算出之標記座標206送達偏位量算出部29。The coordinate correcting unit 28 corrects the mark coordinates 205 based on the imaging required time information 153 and the table moving speed Tv from the speed calculating unit 22, thereby calculating the mark coordinates 206. Specifically, the coordinate correcting unit 28 calculates the amount of deviation of the mark coordinates 205 corresponding to the moving speed of the XY stage 30 based on the imaging required time information 153 and the table moving speed Tv. The coordinate correcting unit 28 calculates the mark coordinates 206 by adding the calculated offset amount to the mark coordinates 205. The coordinate correcting unit 28 calculates the mark coordinates 206 for each mark 6. The coordinate correction unit 28 sends the calculated mark coordinates 206 to the deviation amount calculation unit 29.
偏位量算出部29，係將依據標記座標206與加工程式 (標記位置資訊152)所算出之標記6之理想座標間之差，當作為基板4之偏位量208而算出。偏位量算出部29就每一標記6算出偏位量208。偏位量算出部29將算出之偏位量208儲存於加工程式儲存部M2。The offset amount calculation unit 29 is based on the mark coordinates 206 and the machining program. The difference between the ideal coordinates of the mark 6 calculated by the mark position information 152 is calculated as the offset amount 208 of the substrate 4. The offset amount calculation unit 29 calculates the offset amount 208 for each of the marks 6. The offset amount calculation unit 29 stores the calculated offset amount 208 in the machining program storage unit M2.
其次說明雷射加工裝置100之對基板4之偏位量算出處理(標記位置檢測處理)之處理程序。第4圖為表示於雷射加工裝置之對基板之偏位量算出處理程序之流程圖。Next, a processing procedure of the deflection amount calculation processing (marking position detection processing) for the substrate 4 of the laser processing apparatus 100 will be described. Fig. 4 is a flow chart showing a processing procedure for calculating the amount of deviation of the substrate on the laser processing apparatus.
在雷射加工裝置100之XY台30上裝載雷射加工對象之基板4之後，加工位置算出部20開始算出處理基板4之偏位量(從理想值之偏移量)。After the substrate 4 for laser processing is mounted on the XY stage 30 of the laser processing apparatus 100, the machining position calculation unit 20 starts calculating the amount of deviation of the processing substrate 4 (the amount of deviation from the ideal value).
移動指令輸出部21，自加工程式儲存部M2讀取加工程式內之標記位置資訊152。移動指令輸出部21依據標記位置資訊152對伺服放大器41X、41Y輸出控制指令。於本實施形態，無關照像機39之動作或由圖像處理部27之圖像處理，對伺服放大器41X、41Y輸出控制指令，使照像機39不停止動作而能依序通過標記6上方。由此照像機39就不停地在標記6上依序移動。移動指令輸出部21亦將對伺服放大器41X、41Y輸出之控制指令，送達速度算出部22。The movement command output unit 21 reads the mark position information 152 in the machining program from the machining program storage unit M2. The movement command output unit 21 outputs a control command to the servo amplifiers 41X and 41Y in accordance with the mark position information 152. In the present embodiment, regardless of the operation of the camera 39 or the image processing by the image processing unit 27, a control command is output to the servo amplifiers 41X and 41Y, so that the camera 39 can sequentially pass the mark 6 without stopping the operation. . As a result, the camera 39 is continuously moved on the mark 6 in sequence. The movement command output unit 21 also supplies the control commands output to the servo amplifiers 41X and 41Y to the speed calculation unit 22.
速度算出部22依據移動指令輸出部21輸出之控制指令，算出XY台30之移動速度。速度算出部22將算出之移動速度，作為台移動速度Tv送達基板位置算出部24。The speed calculation unit 22 calculates the moving speed of the XY stage 30 based on the control command output from the movement command output unit 21. The speed calculation unit 22 sends the calculated movement speed to the substrate position calculation unit 24 as the table movement speed Tv.
直線量尺40X、40Y在XY台30移動時，檢測XY台30之位置而送達台位置輸入部23。台位置輸入部23將直線 量尺40X、40Y送來之XY台30之位置當作台位置101而輸入，而送達基板位置算出部24。When the XY stage 30 moves, the linear scales 40X and 40Y detect the position of the XY stage 30 and send it to the stage position input part 23. The table position input unit 23 will straighten The position of the XY stage 30 sent from the scales 40X and 40Y is input as the stage position 101, and is sent to the board position calculating unit 24.
基板位置算出部24，依據來自台位置輸入部23之時時刻刻改變之台位置101，算出基板座標201。The substrate position calculating unit 24 calculates the substrate coordinates 201 based on the stage position 101 that is changed from the stage position input unit 23 at all times.
基板位置算出部24再依據台移動速度Tv與基板位置偏移資訊151，算出對應XY台30之移動速度之基板4之偏位量Gv。基板位置算出部24將所算出之基板4之偏位量Gv，加算於基板座標201，而算出照像機39與基板4上之間之相對位置之基板座標202。由此，基板位置算出部24能對XY台30向X方向與Y方向同時移動之角落部之標記6，也能算出基板4之正確位置。基板位置算出部24將算出之基板座標202，作為基板4之位置送達攝像指令輸出部25。The substrate position calculating unit 24 calculates the offset amount Gv of the substrate 4 corresponding to the moving speed of the XY stage 30 based on the stage moving speed Tv and the board position shift information 151. The substrate position calculating unit 24 adds the calculated offset amount Gv of the substrate 4 to the substrate coordinates 201, and calculates the substrate coordinates 202 at the relative positions between the camera 39 and the substrate 4. Thereby, the substrate position calculating unit 24 can calculate the correct position of the substrate 4 by the mark 6 of the corner portion in which the XY stage 30 is simultaneously moved in the X direction and the Y direction. The substrate position calculating unit 24 sends the calculated substrate coordinates 202 to the imaging command output unit 25 as the position of the substrate 4.
攝像指令輸出部25，依據標記位置資訊152，與基板位置算出部24所算出之基板座標202，算出至標記6之位置(攝像位置)之距離(步驟S10)。The imaging command output unit 25 calculates the distance to the position (imaging position) of the marker 6 from the substrate coordinates 202 calculated by the substrate position calculating unit 24 based on the marker position information 152 (step S10).
攝像指令輸出部25判斷照像機39是否到達標記位置(步驟S20)。攝像指令輸出部25在基板座標202在標記6之座標成為相同座標時，判斷為照像機39己到達標記位置。The imaging command output unit 25 determines whether or not the camera 39 has reached the mark position (step S20). When the coordinates of the mark 6 are the same coordinates on the substrate coordinates 202, the imaging command output unit 25 determines that the camera 39 has reached the mark position.
如攝像指令輸出部25判斷照像機39未到達標記位置時(步驟S20，No)，繼續算出標記6之至攝像位置之距離(步驟S10)。攝像指令輸出部25如判斷照像機39己到達標記位置時(步驟S20，Yes)，向照像機39輸出攝像指令。由 此，照像機39攝像標記6(步驟S30)。照像機39一面移動一面攝像標記6，因此照像機39乃用能夠攝像標記6之充分光量(照明)而攝像標記6。When the imaging command output unit 25 determines that the camera 39 has not reached the mark position (No in step S20), the distance from the mark position to the image pickup position is continuously calculated (step S10). When the imaging command output unit 25 determines that the camera 39 has reached the mark position (Yes in step S20), the imaging command output unit 25 outputs an imaging command to the camera 39. by Thereby, the camera 39 captures the mark 6 (step S30). Since the camera 39 moves the imaging mark 6 while moving, the camera 39 captures the mark 6 with a sufficient amount of light (illumination) capable of capturing the mark 6.
照像機39將所攝像之圖像送達圖像輸入部26。圖像輸入部26輸入照像機39所攝像之標記6之圖像而送至圖像處理部27。圖像處理部27將自圖像輸入部26送來之圖像進行圖像處理(步驟S40)。具體而言，圖像處理部27依據標記6之圖像，算出標記6之特徵量(例如標記6之重心位置)。圖像處理部27將所算出之重心位置作為標記座標205送至座標補正部28。The camera 39 sends the imaged image to the image input unit 26. The image input unit 26 receives an image of the mark 6 imaged by the camera 39 and sends it to the image processing unit 27. The image processing unit 27 performs image processing on the image sent from the image input unit 26 (step S40). Specifically, the image processing unit 27 calculates the feature amount of the marker 6 (for example, the position of the center of gravity of the marker 6) based on the image of the marker 6. The image processing unit 27 sends the calculated center of gravity position to the coordinate correcting unit 28 as the mark coordinates 205.
座標補正部28係由補正圖像處理之結果，算出標記位置(步驟S50)。具體而言，座標補正部28係依據攝像所需時間資訊153、與台移動速度Tv，補正標記座標205。由此，算出作為標記位置之標記座標206。The coordinate correcting unit 28 calculates the mark position as a result of the corrected image processing (step S50). Specifically, the coordinate correcting unit 28 corrects the mark coordinates 205 based on the imaging required time information 153 and the table moving speed Tv. Thereby, the mark coordinates 206 as the mark positions are calculated.
為了算出標記座標206，座標補正部28即依據攝像所需時間資訊153、與台移動速度Tv，算出對應XY台30之移動速度之標記座標205之偏位量。而且，將算出之偏位量加算至標記座標205，算出標記座標206。In order to calculate the mark coordinates 206, the coordinate correcting unit 28 calculates the offset amount of the mark coordinates 205 corresponding to the moving speed of the XY stage 30 based on the imaging required time information 153 and the table moving speed Tv. Then, the calculated offset amount is added to the mark coordinates 205, and the mark coordinates 206 are calculated.
第5圖為攝像標記之圖像之一例圖。標記6因基板4之伸縮等原因以致圖像8之中心部81，與標記6之重心部61不一定會重疊。於本實施形態，可由照像機39之視界中心之中心部81，與標記6之重心61之偏位量算出作為標記座標205。再者，此偏位量205係依據攝像所需時間資訊153而受補正，由此算出標記補正座標206。Fig. 5 is a view showing an example of an image of an image pickup mark. The mark 6 is caused by the expansion and contraction of the substrate 4, etc., so that the center portion 81 of the image 8 does not necessarily overlap with the center of gravity 61 of the mark 6. In the present embodiment, the center portion 81 of the center of the field of view of the camera 39 and the offset amount of the center of gravity 61 of the mark 6 can be calculated as the mark coordinates 205. Further, the offset amount 205 is corrected based on the imaging required time information 153, thereby calculating the mark correction coordinates 206.
在此說明標記6之設置位置與標記6之攝像順序。第6圖為標記之配置位置之例圖。第7圖為標記之攝像順序之一例圖。第6圖與第7圖係自基板4上方所看之圖。Here, the setting position of the mark 6 and the imaging order of the mark 6 will be described. Figure 6 is a diagram showing an example of the location of the mark. Fig. 7 is a view showing an example of the imaging sequence of the mark. Fig. 6 and Fig. 7 are views seen from above the substrate 4.
如第6圖所示，標記6係形成在基板4之四頂點附近，或形成加工孔之加工孔區域(加工孔圖案)5之周邊部附近(加工孔區域外邊)等。於第6圖中，在基板4上設定多數加工孔區域5，在各加工孔區域5之周邊部附近，設置各4個標記6之情形。As shown in Fig. 6, the mark 6 is formed in the vicinity of the four apexes of the substrate 4, or in the vicinity of the peripheral portion (the outer side of the processed hole region) of the processed hole region (machined hole pattern) 5 in which the hole is formed. In Fig. 6, a plurality of machined hole regions 5 are set on the substrate 4, and four marks 6 are provided in the vicinity of the peripheral portion of each of the machined hole regions 5.
第7圖為將標記6依序自標記61至68之順序攝像之情形。例如攝像基板4左上頂點附近之標記61之後，接著攝像設置在最接近此標記61之第1個加工區域5附近之標記62。進一步按順序攝像設置在第1個加工區域5周邊之標記63、標記64、標記65。Fig. 7 is a view showing the case where the mark 6 is sequentially imaged from the marks 61 to 68. For example, after the mark 61 near the upper left vertex of the imaging substrate 4, the mark 62 provided near the first processing region 5 closest to the mark 61 is imaged. Further, the marks 63, the marks 64, and the marks 65 provided around the first processing region 5 are imaged in order.
其次，按順序攝像設置在鄰接第1個加工孔區域5之第2個加工孔區域5周邊之標記66、標記67、標記68。標記6係依照像機39之移動距離最短之規定順序受到攝像。Next, the mark 66, the mark 67, and the mark 68 which are provided adjacent to the second processed hole region 5 of the first processed hole region 5 are sequentially imaged. The mark 6 is imaged in the order in which the moving distance of the camera 39 is the shortest.
座標補正部28按每一標記6算出標記座標206。座標補正部28將算出之標記座標206送達偏位量算出部29。偏位量算出部29，將標記座標206與標記6之在加工程式上之座標(標記位置資訊152)間之差值，算出作為基板4之偏位量208。偏位量算出部29將所算出之偏位量208，儲存在加工程式儲存部M2。The coordinate correcting unit 28 calculates the mark coordinates 206 for each mark 6. The coordinate correction unit 28 sends the calculated mark coordinates 206 to the deviation amount calculation unit 29. The offset amount calculation unit 29 calculates the offset amount 208 as the substrate 4 by the difference between the mark coordinates 206 and the coordinates (mark position information 152) of the mark 6 on the machining program. The offset amount calculation unit 29 stores the calculated offset amount 208 in the machining program storage unit M2.
攝像指令輸出部25係依據標記位置資訊152、與基板 位置算出部24所算出之基板座標202，判斷是否對照像機39就所有標記6輸出攝像指令。換言之，即判斷是否攝像所有標記6(步驟S60)。The imaging command output unit 25 is based on the mark position information 152 and the substrate. The substrate coordinates 202 calculated by the position calculating unit 24 determine whether or not the imaging command is output to all the markers 6 in accordance with the camera 39. In other words, it is judged whether or not all the marks 6 are captured (step S60).
如攝像指令輸出部25未就所有標記6對照像機39輸出攝像指令(步驟S60，No)，則對其次之標記6作步驟S10至S50之處理。攝像指令輸出部25即反覆步驟S10至S50，直到就所有標記6對照像機39輸出攝像指令為止。If the imaging command output unit 25 does not output an imaging command to all of the markers 6 against the camera 39 (step S60, No), the next flag 6 is subjected to the processing of steps S10 to S50. The imaging command output unit 25 repeats steps S10 to S50 until all the marks 6 are compared with the camera 39 to output an imaging command.
攝像指令輸出部25就所有標記6對照像機39輸出攝像指令後(步驟S60，Yes)，雷射加工裝置100完成對標記6之攝像處理。由此，設定在各加工孔區域5之所有標記6均由照像機39所攝像。標記6係設置在基板4上之各種位置，因此需由加工位置算出部20算出各標記6上之基板4之偏位量208，得以算出在基板4之偏位量208之在面內之分布。The imaging command output unit 25 outputs an imaging command to all the markers 6 against the camera 39 (Yes in step S60), and the laser processing apparatus 100 completes the imaging processing on the marker 6. Thereby, all the marks 6 set in the respective processed hole regions 5 are imaged by the camera 39. Since the marks 6 are provided at various positions on the substrate 4, the processing position calculating unit 20 calculates the offset amount 208 of the substrate 4 on each of the marks 6, and calculates the in-plane distribution of the offset amount 208 of the substrate 4. .
如此，於本實施形態，係分別作對XY台30之移動指令之輸出處理，及對標記6之圖像處理。換言之，移動指令輸出部21之動作(XY台30之移動)，與圖像處理部27之動作係分別獨立。As described above, in the present embodiment, the output processing of the movement command of the XY table 30 and the image processing of the mark 6 are performed. In other words, the operation of the movement command output unit 21 (movement of the XY stage 30) is independent of the operation of the image processing unit 27.
茲說明本實施形態之基板4之偏位量算出處理，與以往所採用之基板4之偏位量算出處理以及雙方之差異。第8圖為說明本實施形態之基板4之偏位量算出處理，及以往所採用之基板4之偏位量算出處理，雙方之差異之圖。The calculation of the amount of deviation of the substrate 4 of the present embodiment, the calculation of the amount of deviation of the substrate 4 used in the related art, and the difference between the two will be described. Fig. 8 is a view for explaining the difference between the calculation of the deviation amount of the substrate 4 of the present embodiment and the calculation processing of the deflection amount of the substrate 4 which has been conventionally used.
如第8圖(1)所示，以往係在XY台30移動71後，使XY台30之移動停止72，隨後進行標記6之圖像處理73。 以往在算出基板4之偏位量時，按移動71、停止72、圖像處理73之順序反覆進行。因此XY台30之移動71與移動71之間，進行XY台30之停止72與標記6之圖像處理73。如是，基板4之偏位量算出處理，需要相同於多少個標記6之次數之停止72與圖像處理73之時間。因此標記6之數量增加，則停止72增大，而降低生產性。As shown in Fig. 8 (1), in the related art, after the XY stage 30 is moved 71, the movement of the XY stage 30 is stopped 72, and then the image processing 73 of the mark 6 is performed. Conventionally, when calculating the amount of displacement of the substrate 4, the operations are repeated in the order of the movement 71, the stop 72, and the image processing 73. Therefore, between the movement 71 of the XY stage 30 and the movement 71, the image processing 73 of the stop 72 of the XY stage 30 and the mark 6 is performed. In the case of the offset amount calculation processing of the substrate 4, it is necessary to have the same number of times of the number of marks 6 between the stop 72 and the image processing 73. Therefore, the number of the marks 6 is increased, and the increase of the stop 72 is stopped, and the productivity is lowered.
另一方，於本實施形態，如第8圖(2)所示，不停止XY台30，連續進行XY台30之移動71。在一面移動XY台30之同時也一面進行標記6之圖像處理73。換言之，一面移動XY台30，一面進行取得標記圖像與圖像處理(抽出特徵量)。如此，於本實施形態，係將移動71之任務(task)，與圖像處理之任務分開，因此在移動71時可進行圖像處理73。On the other hand, in the present embodiment, as shown in Fig. 8 (2), the movement 71 of the XY stage 30 is continuously performed without stopping the XY stage 30. The image processing 73 of the mark 6 is also performed while moving the XY stage 30. In other words, while the XY stage 30 is moved, the mark image and the image processing (extraction feature amount) are acquired. As described above, in the present embodiment, since the task of the movement 71 is separated from the task of image processing, the image processing 73 can be performed when the movement 71 is performed.
所以即使需檢測位置之標記6數增加，為了抽出標記6之特徵量所需要之時間並不增大，僅會增加XY台30之移動所需之時間。因此有可能減少停止72、圖像處理73之處理時間，可縮短間隔時間。如是，於本實施形態，可較以往之方法在短時間內算出基板4之偏位量，在不致影響生產性之情形下進行基板4之雷射加工。Therefore, even if the number of marks 6 to be detected is increased, the time required to extract the feature amount of the mark 6 does not increase, and only the time required for the movement of the XY stage 30 is increased. Therefore, it is possible to reduce the processing time of the stop 72 and the image processing 73, and the interval time can be shortened. According to this embodiment, the amount of deflection of the substrate 4 can be calculated in a short time compared to the conventional method, and the laser processing of the substrate 4 can be performed without affecting productivity.
偏位量算出部29將所有標記6之偏位量208，儲存於加工程式儲存部M2之後，加工控制裝置2即開始基板4之雷射加工。在作基板4之雷射加工時，加工控制裝置2依據加工位置算出部20所算出之基板4之偏位量208，補正基板4之雷射加工位置。The offset amount calculation unit 29 stores the offset amount 208 of all the marks 6 in the machining program storage unit M2, and the machining control device 2 starts the laser processing of the substrate 4. At the time of the laser processing of the substrate 4, the processing control device 2 corrects the laser processing position of the substrate 4 based on the offset amount 208 of the substrate 4 calculated by the processing position calculating unit 20.
具體而言，移動指令輸出部21，自加工程式儲存部M2讀取加工程式與偏位量208。於是，移動指令輸出部21，將設定在加工程式之加工孔Hx之座標、依據加工孔Hx之每一位置之偏位量208加以補正。於是，將對應補正後之加工孔Hx之座標之移動指令輸出至伺服放大器41X、41Y。由此一面僅在補正加工孔Hx之座標對應於基板4之偏位量之位置，一面進行加工孔Hx之雷射加工。Specifically, the movement command output unit 21 reads the machining program and the offset amount 208 from the machining program storage unit M2. Then, the movement command output unit 21 corrects the coordinates of the machining hole Hx set in the machining program and the offset amount 208 at each position of the machining hole Hx. Then, the coordinate command corresponding to the corrected machining hole Hx is output to the servo amplifiers 41X and 41Y. On the other hand, the laser processing of the processing hole Hx is performed only at the position where the coordinate of the processing hole Hx corresponds to the amount of deviation of the substrate 4.
算出基板4之偏位量，係在每次將基板4裝載到XY台30時即進行。換言之，要對基板4進行雷射加工時，裝載基板4在XY台30而算出基板4之偏位量，而對基板4進行雷射加工。於是，對下一基板4進行雷射加工時，將下一基板4裝載在XY台30而算出下一基板4之偏位量。如是，雷射加工裝置100反覆進行在XY台30上裝載基板4、基板4之偏位量算出處理、對基板4進行雷射加工。The amount of displacement of the substrate 4 is calculated, which is performed every time the substrate 4 is loaded onto the XY stage 30. In other words, when the substrate 4 is subjected to laser processing, the substrate 4 is loaded on the XY stage 30 to calculate the amount of displacement of the substrate 4, and the substrate 4 is subjected to laser processing. Then, when the next substrate 4 is subjected to laser processing, the next substrate 4 is placed on the XY stage 30, and the amount of deflection of the next substrate 4 is calculated. In the laser processing apparatus 100, the offset amount calculation processing of loading the substrate 4 and the substrate 4 on the XY stage 30 is performed in reverse, and the substrate 4 is subjected to laser processing.
再者，雷射加工裝置100，亦可不使用直線量尺40X、40Y算出基板座標201。此時可由對馬達42X、42Y之指令值、與馬達42X、42Y之實際旋轉數之雙方之差值的偏差資訊(衰減量droop)，算出基板座標201。Further, the laser processing apparatus 100 may calculate the substrate coordinates 201 without using the linear scales 40X and 40Y. At this time, the substrate coordinates 201 can be calculated from the deviation information (attenuation amount droop) of the difference between the command values of the motors 42X and 42Y and the actual number of rotations of the motors 42X and 42Y.
具體而言，基板位置算出部24係將自移動指令輸出部21輸出之控制指令之積算值(合計值)減算上述偏差資訊，即可算出台位置101。對馬達42X、42Y之指令值，係對應於伺服放大器41X、41Y之控制指令。又，馬達42X、42Y之實際旋轉數，可由編碼器43X、43Y檢測。因此，偏差資訊為對伺服放大器41X、41Y之控制指令之現在值、與 編碼器43X、43Y所檢測之旋轉數(現在值)雙方的差值。XY台30之移動速度，係隨對伺服放大器41X、41Y之控制指令而改變，因此偏差資訊亦隨XY台30之移動速度而改變。因此使用偏差資訊算出之基板座標201亦隨XY台30之移動速度而改變。Specifically, the substrate position calculating unit 24 calculates the stage position 101 by subtracting the above-described deviation information from the integrated value (total value) of the control command output from the movement command output unit 21. The command values for the motors 42X and 42Y correspond to the control commands of the servo amplifiers 41X and 41Y. Further, the actual number of rotations of the motors 42X and 42Y can be detected by the encoders 43X and 43Y. Therefore, the deviation information is the current value of the control command to the servo amplifiers 41X, 41Y, and The difference between the number of rotations (current value) detected by the encoders 43X and 43Y. The moving speed of the XY stage 30 changes with the control commands of the servo amplifiers 41X and 41Y, so the deviation information also changes with the moving speed of the XY stage 30. Therefore, the substrate coordinates 201 calculated using the deviation information also change in accordance with the moving speed of the XY stage 30.
使用直線量尺40X、40Y算出基板座標201時，無需編碼器43X、43Y，而使用偏差資訊算出基板座標201時，則無需直線量尺40X、40Y。When the substrate coordinates 201 are calculated using the linear scales 40X and 40Y, the encoders 43X and 43Y are not required, and when the substrate coordinates 201 are calculated using the deviation information, the linear scales 40X and 40Y are not required.
再且，自標記座標205補正為標記座標206時，並不限於使用攝像所需時間資訊153與台移動速度Tv之補正。例如預先將應台移動速度Tv之自標記座標205至標記座標206之座標補正量，儲存於規定之數據庫即可。此時需使用攝像所需時間資訊153與台移動速度Tv，事先算出對應於台移動速度Tv之座標補正量。Further, when the mark coordinates 205 are corrected to the mark coordinates 206, the correction is not limited to the use of the imaging required time information 153 and the table moving speed Tv. For example, the coordinate correction amount from the mark coordinates 205 to the mark coordinates 206 of the table movement speed Tv may be stored in a predetermined database. At this time, it is necessary to calculate the coordinate correction amount corresponding to the table moving speed Tv in advance using the imaging required time information 153 and the table moving speed Tv.
在攝像所需時間資訊153包含照像機39之快門速度亦可。而且，攝像指令輸出部25，可考慮照像機39之快門速度，稍提早向照像機39輸出攝像指令亦可。又，照像機39不限為1台而可設置多數台。此時，可由多數台照像機39同時攝像多數標記6。並且，基板4(XY台30)之移動可為等速度運動，亦可為不等速運動。The time required for imaging 153 includes the shutter speed of the camera 39. Further, the imaging command output unit 25 may output an imaging command to the camera 39 a little earlier in consideration of the shutter speed of the camera 39. Further, the camera 39 is not limited to one, and a plurality of stations can be provided. At this time, the majority of the marks 6 can be simultaneously imaged by the plurality of camera cameras 39. Moreover, the movement of the substrate 4 (XY stage 30) may be a constant speed motion or a non-equal motion.
基板4之移動為等速運動時，自基板座標201補正為基板座標202至為容易。基板4之移動為等速運動時，自標記座標205補正為標記座標206至為容易。When the movement of the substrate 4 is at a constant speed, it is easy to correct the substrate coordinates 201 from the substrate coordinates 201. When the movement of the substrate 4 is at a constant speed, it is easy to correct the mark coordinates 205 from the mark coordinates 206.
XY台30之移動速度，並不限於依據對伺服放大器 41X、41Y之控制指令算出，亦可直接測量XY台30之移動速度而求得。The moving speed of the XY stage 30 is not limited to the servo amplifier The 41X and 41Y control commands are calculated, and the moving speed of the XY stage 30 can be directly measured and obtained.
依據如上所述實施形態，可在對標記6作移動處理之同時，進行攝像標記6之圖像之圖像處理(標記6之位置算出處理)，因此可在短時間內檢測裝載在XY台30之基板4之偏位量。According to the embodiment described above, the image processing of the image of the image pickup mark 6 (position calculation processing of the mark 6) can be performed while the mark 6 is moved, so that it can be detected and loaded on the XY stage 30 in a short time. The amount of offset of the substrate 4.
使用基板位置偏移資訊151與台移動速度Tv將基板座標201補正為基板座標202，可算出基板4上之正確位置。因此能以正確的基板4上位置攝像標記6之圖像。The substrate coordinates 201 are corrected to the substrate coordinates 202 using the substrate position shift information 151 and the table moving speed Tv, and the correct position on the substrate 4 can be calculated. Therefore, the image of the mark 6 can be imaged at the correct position on the substrate 4.
以攝像所需時間資訊153與台移動速度Tv將標記座標205補正為標記座標206，而可算出標記6之正確位置。因此可算出基板4之正確偏位量。The mark coordinates 205 are corrected to the mark coordinates 206 by the imaging required time information 153 and the table moving speed Tv, and the correct position of the mark 6 can be calculated. Therefore, the correct amount of offset of the substrate 4 can be calculated.
使用對馬達42X、42Y之指令值、與馬達42X、42Y之實際旋轉數之雙方之差值的偏差資訊，算出基板座標201時，因無需直線量尺40X、40Y，能以簡易構成算出基板座標201。When the substrate coordinates 201 are calculated using the deviation information between the command values of the motors 42X and 42Y and the actual number of rotations of the motors 42X and 42Y, the linear coordinates 40X and 40Y are not required, and the substrate coordinates can be calculated with a simple configuration. 201.
如上所述，本發明之雷射加工裝置及基板位置檢測方法，很適合於算出基板對加工台之偏位量。As described above, the laser processing apparatus and the substrate position detecting method of the present invention are suitable for calculating the amount of deflection of the substrate to the processing table.
1‧‧‧雷射振盪器1‧‧‧Laser oscillator
2‧‧‧加工控制裝置2‧‧‧Processing control device
3‧‧‧雷射加工部3‧‧ ‧ Laser Processing Department
3‧‧‧基板3‧‧‧Substrate
4‧‧‧加工孔區域4‧‧‧Mask hole area
5、6、61至68‧‧‧標記5, 6, 61 to 68 ‧ ‧ mark
20‧‧‧加工位置算出部20‧‧‧Processing position calculation unit
21‧‧‧移動指令輸出部21‧‧‧Moving Command Output Department
22‧‧‧速度算出部22‧‧‧Speed calculation department
23‧‧‧台位置輸入部23‧‧‧ Position input section
24‧‧‧基板位置算出部24‧‧‧Substrate position calculation unit
25‧‧‧攝像指令輸出部25‧‧‧ Camera Command Output Department
26‧‧‧圖像輸入部26‧‧‧Image Input Department
27‧‧‧圖像處理部27‧‧‧Image Processing Department
28‧‧‧座標補正部28‧‧‧Coordinates Correction Department
29‧‧‧偏位量算出部29‧‧‧Deviation calculation unit
30‧‧‧XY台30‧‧‧XY
35X、35Y‧‧‧振鏡35X, 35Y‧‧ ‧ galvanometer
36X、36Y‧‧‧振鏡式掃描器36X, 36Y‧‧‧ galvanometer scanner
39‧‧‧照像機39‧‧‧Photo Camera
40X,40Y‧‧‧直線量尺40X, 40Y‧‧‧ linear measuring ruler
41X,41Y‧‧‧伺服放大器41X, 41Y‧‧‧ servo amplifier
42X,42Y‧‧‧馬達42X, 42Y‧‧‧ motor
43X,43Y‧‧‧編碼器43X, 43Y‧‧‧ encoder
71‧‧‧移動71‧‧‧Mobile
72‧‧‧停止72‧‧‧Stop
73‧‧‧圖像處理73‧‧‧Image processing
100‧‧‧雷射加工裝置100‧‧‧ Laser processing equipment
151‧‧‧基板位置偏移資訊151‧‧‧Substrate position shift information
152‧‧‧標記位置資訊152‧‧‧Marking location information
153‧‧‧攝像所需時間資訊153‧‧‧Time information required for recording
201、202‧‧‧基板座標201, 202‧‧‧ substrate coordinates
205、206‧‧‧標記座標205, 206‧‧‧ mark coordinates
208‧‧‧偏位量208‧‧‧ bias
L‧‧‧雷射光L‧‧‧Laser light
M1‧‧‧基板位置偏移資訊儲存部M1‧‧‧Substrate Position Shift Information Storage Department
M2‧‧‧加工程式儲存部M2‧‧‧Processing Program Storage Department
M3‧‧‧攝像所需時間儲存部M3‧‧‧Photography time storage
第1圖係本發明實施形態之雷射加工裝置構成圖。Fig. 1 is a view showing the configuration of a laser processing apparatus according to an embodiment of the present invention.
第2圖係加工控制裝置與XY台之構成圖。Fig. 2 is a view showing the configuration of the machining control device and the XY table.
第3圖係實施形態有關之加工位置算出部之構成方塊圖。Fig. 3 is a block diagram showing a configuration of a machining position calculating unit according to an embodiment.
第4圖係基板之位置偏移量算出處理程序之流程圖。Fig. 4 is a flow chart showing a procedure for calculating the positional shift amount of the substrate.
第5圖係攝像標記之圖像之一例圖。Fig. 5 is a diagram showing an example of an image of an image pickup mark.
第6圖係標記之配置位置之一例圖。Fig. 6 is a diagram showing an example of the arrangement position of the mark.
第7圖係標記之攝像順序之一例圖。Fig. 7 is a diagram showing an example of the imaging sequence of the mark.
第8圖係為說明於實施形態之基板位置偏移量算出處理，與以往所用之基板偏位量算出處理兩者之相異點之圖。Fig. 8 is a view for explaining a difference between the substrate position shift amount calculation processing of the embodiment and the substrate offset amount calculation processing used in the related art.
20‧‧‧加工位置算出部20‧‧‧Processing position calculation unit
21‧‧‧移動指令輸出部21‧‧‧Moving Command Output Department
22‧‧‧速度算出部22‧‧‧Speed calculation department
23‧‧‧台位置輸入部23‧‧‧ Position input section
24‧‧‧基板位置算出部24‧‧‧Substrate position calculation unit
25‧‧‧攝像指令輸出部25‧‧‧ Camera Command Output Department
26‧‧‧圖像輸入部26‧‧‧Image Input Department
27‧‧‧圖像處理部27‧‧‧Image Processing Department
28‧‧‧座標補正部28‧‧‧Coordinates Correction Department
29‧‧‧偏位量算出部29‧‧‧Deviation calculation unit
39‧‧‧照像機39‧‧‧Photo Camera
40X,40Y‧‧‧直線量尺40X, 40Y‧‧‧ linear measuring ruler
41X,41Y‧‧‧伺服放大器41X, 41Y‧‧‧ servo amplifier
M1‧‧‧基板位置偏移資訊儲存部M1‧‧‧Substrate Position Shift Information Storage Department
M2‧‧‧加工程式儲存部M2‧‧‧Processing Program Storage Department
M3‧‧‧攝像所需時間儲存部M3‧‧‧Photography time storage
Claims (5)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2010/064948 WO2012029142A1 (en) | 2010-09-01 | 2010-09-01 | Laser processing apparatus and substrate position detecting method |
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| TW201210725A TW201210725A (en) | 2012-03-16 |
| TWI415703B true TWI415703B (en) | 2013-11-21 |
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| JP (1) | JP5383920B2 (en) |
| KR (1) | KR101435352B1 (en) |
| CN (1) | CN103079746A (en) |
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| JP6174906B2 (en) * | 2013-05-23 | 2017-08-02 | 中村留精密工業株式会社 | Self-diagnosis of machine and correction method of machine accuracy |
| DE102013217126B4 (en) | 2013-08-28 | 2015-09-03 | Trumpf Laser- Und Systemtechnik Gmbh | Method for determining deviations of an actual position of a laser processing head from a desired position, laser processing machine and computer program product |
| CN103528513B (en) * | 2013-09-30 | 2016-08-17 | 上海大学 | OLED glass substrate alignment methods and device |
| CN103852801A (en) * | 2014-01-10 | 2014-06-11 | 凯迈(洛阳)电子有限公司 | Infrared gun on-line measurement device |
| CN104439726B (en) * | 2014-11-19 | 2017-01-25 | 苏州德龙激光股份有限公司 | Laser real-time deviation correction device and deviation correction method thereof |
| JP5925390B1 (en) * | 2014-12-02 | 2016-05-25 | 三菱電機株式会社 | Displacement sensor, displacement detection device, and displacement detection method |
| CN104708158A (en) * | 2015-02-13 | 2015-06-17 | 佛山市中科源自动化设备有限公司 | Automatic circuit board welding method |
| JP2017113788A (en) * | 2015-12-24 | 2017-06-29 | 株式会社リコー | Optical processing device |
| TWI641933B (en) * | 2016-01-15 | 2018-11-21 | 施教競 | Processing method of processing machine |
| CN109475974B (en) * | 2016-07-14 | 2021-01-01 | 三菱电机株式会社 | Substrate measuring device and laser processing system |
| JP7084227B2 (en) * | 2018-06-22 | 2022-06-14 | 株式会社Ｓｃｒｅｅｎホールディングス | Mark position detection device, drawing device and mark position detection method |
| WO2020090075A1 (en) * | 2018-10-31 | 2020-05-07 | 株式会社ニコン | Processing system and processing method |
| EP3941676B1 (en) * | 2019-03-20 | 2024-02-14 | Bobst Mex Sa | Characterization method and system for a laser processing machine with a moving sheet or web |
| JP7344047B2 (en) * | 2019-08-22 | 2023-09-13 | 株式会社ジェーイーエル | How to align the board |
| CN113298076B (en) * | 2021-06-18 | 2022-08-26 | 蓝思智能机器人(长沙)有限公司 | Method, device, equipment and medium for collecting correction data of plane processing equipment |
| CN113532316B (en) * | 2021-07-05 | 2023-01-20 | 深圳市先地图像科技有限公司 | Device and method capable of simultaneously detecting shape and position deviations of multiple PCBs |
| TWI789068B (en) * | 2021-10-22 | 2023-01-01 | 健鼎科技股份有限公司 | Calculation method of expansion and contraction value of circuit board and hole forming method of multilayer circuit board |
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| KR20130042035A (en) | 2013-04-25 |
| KR101435352B1 (en) | 2014-08-28 |
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| TW201210725A (en) | 2012-03-16 |
| JPWO2012029142A1 (en) | 2013-10-28 |
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| WO2012029142A1 (en) | 2012-03-08 |
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