TWI415168B - Pellicle for lithography - Google Patents
Pellicle for lithography Download PDFInfo
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- TWI415168B TWI415168B TW098115307A TW98115307A TWI415168B TW I415168 B TWI415168 B TW I415168B TW 098115307 A TW098115307 A TW 098115307A TW 98115307 A TW98115307 A TW 98115307A TW I415168 B TWI415168 B TW I415168B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
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Abstract
Description
本發明係關於一種微影用防護薄膜組件，在製造LSI、超LSI等半導體裝置或液晶顯示板時當作微影用遮罩的防塵器使用。The present invention relates to a protective film assembly for lithography, which is used as a dustproof device for a lithographic mask when manufacturing a semiconductor device such as an LSI or a super LSI or a liquid crystal display panel.
在LSI、超LSI等半導體裝置或是液晶顯示板等產品的製造中，係用光照射半導體晶圓或液晶用原板以製作形成圖案，惟若此時所使用的曝光原版有灰塵附著的話，由於該灰塵會吸收光，使光反射，故除了會讓轉印的圖案變形、使邊緣變粗糙以外，還會使基底污黑，損壞尺寸、品質、外觀等。又，在本發明中，「曝光原版」是微影用遮罩以及初縮遮罩的總稱。In the manufacture of a semiconductor device such as an LSI or a super LSI or a liquid crystal display panel, the semiconductor wafer or the liquid crystal original plate is irradiated with light to form a pattern, but if the exposed original plate used at this time is dusty, The dust absorbs light and reflects the light, so that in addition to deforming the transferred pattern and roughening the edges, the substrate is stained black, and the size, quality, appearance, and the like are damaged. Further, in the present invention, the "exposure original plate" is a general term for a lithographic mask and a preliminary mask.
該等作業通常是在無塵室內進行，然而即使是在無塵室內進行，想要經常保持曝光原版清潔仍是相當困難，故吾人遂在曝光原版表面貼合透光性良好的防護薄膜組件作為防塵器使用。These operations are usually carried out in a clean room. However, even in a clean room, it is still very difficult to keep the original exposure clean. Therefore, we have attached a protective film assembly with good light transmission on the surface of the original plate. Use a dust protector.
此時，異物並非直接附著於曝光原版的表面上，而係附著於防護薄膜上，故只要在微影時將焦點對準曝光原版的圖案，防護薄膜上的異物就不會對轉印造成影響。At this time, the foreign matter is not directly attached to the surface of the exposure original plate, but is attached to the protective film, so that the foreign matter on the protective film does not affect the transfer as long as the focus is focused on the original pattern during the lithography. .
防護薄膜組件的基本構造，是由防護薄膜組件框架以及鋪設於其上的防護薄膜所構成。防護薄膜，是由硝化纖維素、醋酸纖維素或氟系聚合物等物質所構成的，其對曝光用光線(g線、i線、248nm、193nm、157nm等)具備良好的透光性。防護薄膜組件框架，是由符合日本工業規格(Japanese Industrial Standards；JIS)A7075、A6061、A5052的鋁合金、不銹鋼、聚乙烯等材料所構成的，其經過黑色氧皮鋁處理。在防護薄膜組件框架上部塗佈防護薄膜的良好溶劑，讓防護薄膜風乾並接合於該防護薄膜組件框架上部(參照專利文獻1)，或是用丙烯酸樹脂、環氧樹脂或氟樹脂等接合劑接合(參照專利文獻2)。接著，為了在防護薄膜組件框架下部鋪設曝光原版，遂設置由聚丁烯樹脂、聚醋酸乙烯酯樹脂、丙烯酸樹脂以及矽氧樹脂等物質所構成的黏著層，以及用 來保護黏著層的初縮遮罩黏著劑保護用墊片。The basic construction of the pellicle assembly consists of a pellicle frame and a pellicle film laid thereon. The pellicle film is made of a substance such as nitrocellulose, cellulose acetate or a fluorine-based polymer, and has excellent light transmittance for light for exposure (g-line, i-line, 248 nm, 193 nm, 157 nm, etc.). The pellicle frame is made of a material such as aluminum alloy, stainless steel, or polyethylene that conforms to Japanese Industrial Standards (JIS) A7075, A6061, and A5052, and is treated with black oxygen aluminum. A good solvent for applying a protective film on the upper portion of the pellicle frame, allowing the protective film to be air-dried and bonded to the upper portion of the pellicle frame (refer to Patent Document 1), or by bonding with an adhesive such as an acrylic resin, an epoxy resin or a fluororesin. (Refer to Patent Document 2). Next, in order to lay the exposure original plate under the protective film module frame, an adhesive layer composed of a material such as polybutylene resin, polyvinyl acetate resin, acrylic resin, and epoxy resin is provided, and To protect the adhesive layer from the initial shrink mask adhesive protection gasket.
防護薄膜組件會覆蓋形成於曝光原版表面上的圖案區域。防護薄膜組件係用來防止異物附著於曝光原版上而設置的構件，故能隔離該圖案區域與防護薄膜組件外部，防止防護薄膜組件外部灰塵附著到圖案表面上。The pellicle assembly covers the area of the pattern formed on the exposed original surface. The pellicle member is a member for preventing foreign matter from adhering to the exposure original plate, so that the pattern region and the outside of the pellicle assembly can be isolated to prevent dust from adhering to the surface of the pellicle assembly.
近年來，LSI的佈局規則向0.25微米以下微細化進展，隨之曝光光源也向短波長化進展，亦即，逐漸從原為主流的水銀燈的g線(436nm)、i線(365nm)，轉而使用KrF準分子雷射(248nm)、ArF準分子雷射(193nm)、F2 雷射(157nm)等雷射光。當曝光像這樣朝短波長化發展而曝光解析度變高時，以往不會造成問題的圖案歪曲或變形，都會變得有可能對良品率造成影響。圖案的歪曲或變形大多是因為曝光原版本身的歪曲或變形。上述不良情況的主要原因，例如像防護薄膜組件貼合時所造成的歪曲變形。In recent years, the layout rule of LSI has progressed to 0.25 μm or less, and the exposure light source has progressed to a shorter wavelength, that is, gradually shifts from the g line (436 nm) and the i line (365 nm) of the mercury lamp which is the mainstream. Laser light such as KrF excimer laser (248 nm), ArF excimer laser (193 nm), and F 2 laser (157 nm) is used. When the exposure progresses to a shorter wavelength and the exposure resolution becomes higher, the pattern which is not problematic in the past is distorted or deformed, and it is likely to affect the yield. The distortion or distortion of the pattern is mostly due to the distortion or distortion of the original version. The main causes of the above-mentioned problems are, for example, distortions caused by the bonding of the pellicle components.
已知防護薄膜組件本身的變形或歪曲，會在防護薄膜組件貼合時對曝光原版所造成的不良影響。It is known that the deformation or distortion of the pellicle assembly itself adversely affects the exposure of the original when the pellicle is attached.
[專利文獻1]日本特開昭58-219023號公報[Patent Document 1] JP-A-58-219023
[專利文獻2]美國專利第4861402號說明書[Patent Document 2] US Patent No. 4,861,402
為了解決上述問題，本發明提供一種能夠減少變形或歪曲程度的微影用防護薄膜組件。In order to solve the above problems, the present invention provides a lithographic protective film assembly capable of reducing the degree of deformation or distortion.
上述問題，可用以下(1)所記載的機構解決。The above problems can be solved by the mechanism described in (1) below.
本發明較佳實施態樣(2)~(7)也一併列記如下。Preferred embodiments (2) to (7) of the present invention are also listed below.
(1)一種微影用防護薄膜組件，其特徵為：設置在矩形防護薄膜組件框架的2個長邊的兩端附近的至少2個夾具孔，都係設置在距離各長邊的任一個端部10mm以內的位置上，(2)如(1)所記載的微影用防護薄膜組件，其中，該防護薄膜組件框架的長邊的長度在140mm以上300mm以下， (3)如(1)或(2)所記載的微影用防護薄膜組件，其中，該防護薄膜組件框架的長邊的長度為140mm以上230mm以下，(4)如(1)~(3)中任一項所記載的微影用防護薄膜組件，其中，設置在該防護薄膜組件框架的2個長邊的兩端附近的複數夾具孔的互相對向的1對夾具孔朝框架長邊方向形成長孔狀，(5)如(1)~(4)中任一項所記載的微影用防護薄膜組件，其中，該防護薄膜組件框架，係具備黑色氧皮鋁包覆膜的鋁合金製防護薄膜組件框架，(6)如(1)~(4)中任一項所記載的微影用防護薄膜組件，其中，該防護薄膜組件框架，係具備聚合物電沈積膜的鋁合金製防護薄膜組件框架，(7)如(1)~(6)中任一項所記載的微影用防護薄膜組件，其中，該防護薄膜組件框架的高度在5mm以下。(1) A protective film assembly for lithography, characterized in that at least two jig holes provided near both ends of two long sides of a rectangular pellicle frame are disposed at any one of the long sides (2) The protective film assembly for lithography according to (1), wherein the length of the long side of the frame of the pellicle assembly is 140 mm or more and 300 mm or less. (3) The protective film assembly for lithography according to the above aspect, wherein the length of the long side of the frame of the pellicle is 140 mm or more and 230 mm or less, (4) as (1) to (3) The photographic film assembly for lithography according to any one of the present invention, wherein a pair of jig holes of a plurality of jig holes provided in the vicinity of both ends of the two long sides of the pellicle frame are oriented toward a longitudinal direction of the frame The protective film assembly for lithography according to any one of (1) to (4), wherein the protective film assembly frame is an aluminum alloy having a black oxygen aluminum coating film. (6) The protective film assembly for lithography according to any one of (1) to (4), wherein the protective film assembly frame is made of an aluminum alloy having a polymer electrodeposited film. The protective film assembly according to any one of (1) to (6), wherein the protective film assembly frame has a height of 5 mm or less.
設置在矩形防護薄膜組件框架的2個長邊的兩端附近的至少2個夾具孔，都係設置在距離各長邊的任一個端部10mm以內的位置上，藉此，比起習知技術而言，更能減少在用防護薄膜組件製造用夾具固定防護薄膜組件框架時所產生的框架歪曲與變形。At least two jig holes provided near both ends of the two long sides of the rectangular pellicle frame are disposed at a position within 10 mm from either end of each of the long sides, thereby being compared with the prior art In particular, it is possible to reduce the distortion and deformation of the frame which is produced when the protective film module frame is fixed by the jig for manufacturing the pellicle.
本發明的微影用防護薄膜組件(以下僅稱「防護薄膜組件」)的特徵為：設置在矩形防護薄膜組件框架(以下僅稱「框架」)的2個長邊的兩端附近的至少2個夾具孔，都設置在距離各長邊的任一個端部10mm以內的位置上。The photographic film protective film assembly of the present invention (hereinafter simply referred to as "protective film member") is characterized in that at least two of the two long sides of the rectangular protective film module frame (hereinafter simply referred to as "frame") are provided. Each of the jig holes is disposed at a position within 10 mm from either end of each of the long sides.
亦即，本發明的微影用防護薄膜組件，在矩形防護薄膜組件框架的一端面上透過防護薄薄膜接合劑舖設防護薄膜，在另一端面上設置曝光原版接合劑，其特徵為：分別設置在該防護薄膜組件框架的2個長邊的兩端附近且在各長邊上至少2個的夾具孔，係設置在距離各長邊的任一個端部10mm以內的位置上。上述夾具孔，可有效使用於防護薄膜組件的製造以及其後貼合並剝離曝 光原版的處理中。夾具孔，宜距離各長邊的任一個端部相等的距離，宜設置在2~10mm的位置上。That is, the protective film assembly for lithography of the present invention has a protective film deposited on one end surface of the rectangular protective film module frame through a protective thin film bonding agent, and an exposed original bonding agent is disposed on the other end surface, which is characterized in that: At least two jig holes in the vicinity of both ends of the two long sides of the pellicle frame are placed at a position within 10 mm from either end of each of the long sides. The above clamp hole can be effectively used in the manufacture of the protective film component and the subsequent adhesion and peeling exposure The original light is processed. The clamp hole should be equidistant from any end of each long side and should be placed at a position of 2~10mm.
又，夾具孔設置在距離長邊的端部10mm以內的位置上，係意味著圓形夾具孔的中心，或是，長孔形夾具孔的長邊方向的中央部設置在10mm以下，夾具孔整體並非設置在10mm以內也沒有關係。Further, the jig hole is provided at a position within 10 mm from the end of the long side, which means the center of the circular jig hole, or the center portion of the long hole direction of the long hole jig hole is set to 10 mm or less, and the jig hole is provided. It doesn't matter if the whole is not set within 10mm.
再者，互相對向的1對夾具孔宜朝長邊方向形成長孔構造。更宜互相對向的2對夾具孔的其中1對為圓形夾具孔而另1對具有長孔構造。Further, it is preferable that the pair of jig holes facing each other form a long hole structure in the longitudinal direction. One pair of the pair of jig holes that are more preferably opposed to each other is a circular jig hole and the other pair has a long hole structure.
圓形以及長孔夾具孔均非貫通孔。圓形夾具孔宜在圓柱前端形成圓錐狀的連接凹部。Both circular and long hole clamp holes are not through holes. The circular jig hole preferably forms a conical connecting recess at the front end of the cylinder.
在本發明的防護薄膜組件中，該防護薄膜組件框架的長邊長度宜在140mm以上300mm以下，更宜在140mm以上230mm以下。又，防護薄膜組件框架的高度最好是在5mm以下。在本發明中，將夾具孔應用在這些防護薄膜組件上，比起習知技術而言，歪曲、變形的情況可大幅減少。In the pellicle of the present invention, the length of the long side of the pellicle frame is preferably from 140 mm to 300 mm, more preferably from 140 mm to 230 mm. Further, the height of the pellicle frame is preferably 5 mm or less. In the present invention, the jig holes are applied to these pellicle assemblies, and the distortion and deformation can be greatly reduced as compared with the prior art.
以下，參照圖面詳細説明本發明。Hereinafter, the present invention will be described in detail with reference to the drawings.
如圖1所示的，本發明之微影用防護薄膜組件10，其在防護薄膜組件框架3上端面設置防護薄膜貼合用接合層2以鋪設防護薄膜1，此時，用來將防護薄膜組件10貼合於曝光原版(光罩基板或是初縮遮罩)5上的接合用黏著層4通常係設置於防護薄膜組件框架3下端面，該初縮遮罩接合用黏著層4的下端面貼合著可剝離的墊片(未經圖示)。又，在防護薄膜組件框架3上設有氣壓調整孔(通氣口)6，另外亦可設置用來過濾灰塵微粒的除塵用過濾器7。As shown in FIG. 1, the lithographic protective film assembly 10 of the present invention is provided with a protective film bonding bonding layer 2 on the upper end surface of the protective film module frame 3 to lay the protective film 1, and at this time, the protective film is used. The bonding adhesive layer 4 to which the component 10 is attached to the exposure original plate (the reticle substrate or the priming mask) 5 is usually disposed on the lower end surface of the pellicle frame 3, and the embossed mask bonding under the adhesive layer 4 A peelable gasket (not shown) is attached to the end face. Further, a gas pressure adjusting hole (vent) 6 is provided in the pellicle frame 3, and a dust removing filter 7 for filtering dust particles may be provided.
此時，該等防護薄膜組件構成要件的大小跟通常的防護薄膜組件，例如半導體微影用防護薄膜組件、大型液晶顯示板製造微影步驟用防護薄膜組件等一樣，而且，材質也可使用上述習知材質。At this time, the size of the constituent elements of the protective film assembly is the same as that of a conventional protective film component, such as a protective film assembly for a semiconductor lithography, a protective film assembly for manufacturing a lithography step for a large liquid crystal display panel, and the like. Conventional material.
防護薄膜的種類並無特別限制，例如可使用習知準分子雷射 用的非晶質氟聚合物等。非晶質氟聚合物，例如：Cytop[旭硝子(股)公司製商品名]、鐵氟龍(登錄商標)AF(Du Pont公司製商品名)等。用該等聚合物製作防護薄膜時，可因應需要先將其溶解於溶媒中再使用，例如可將其適當溶解於氟系溶媒中。The type of the protective film is not particularly limited, and for example, a conventional excimer laser can be used. Amorphous fluoropolymer or the like used. The amorphous fluoropolymer is, for example, Cytop (trade name of Asahi Glass Co., Ltd.), Teflon (registered trademark) AF (trade name of Du Pont Co., Ltd.), and the like. When a protective film is produced from these polymers, it may be dissolved in a solvent and used as needed, and for example, it may be suitably dissolved in a fluorine-based solvent.
關於本發明所使用的防護薄膜組件框架的基材，可使用以往所使用的鋁合金基材，而宜使用JIS A7075、JIS A6061、JIS A5052等規格的基材，不過只要使用鋁合金基材就能確保所製作的防護薄膜組件框架具有足夠的強度，故對框架基材並無特別限制。防護薄膜組件框架表面，在設置聚合物包覆膜之前，宜利用噴砂處理或化學研磨使其粗糙化。在本發明中，使該框架表面粗糙化的方法可採用公開習知的方法。鋁合金基材宜利用不銹鋼、金鋼砂、玻璃細珠等對表面進行噴砂處理，且可利用NaOH等物質進行化學研磨，使表面粗糙化。As the base material of the pellicle frame for use in the present invention, a conventionally used aluminum alloy substrate can be used, and a substrate of JIS A7075, JIS A6061, JIS A5052 or the like is preferably used, but an aluminum alloy substrate is used. The frame of the protective film assembly can be ensured to have sufficient strength, so that the frame substrate is not particularly limited. The surface of the pellicle frame frame should be roughened by sand blasting or chemical grinding before the polymer coating film is placed. In the present invention, the method of roughening the surface of the frame may employ a publicly known method. The aluminum alloy substrate should be sandblasted with stainless steel, gold steel sand, glass beads, etc., and chemically ground using NaOH or the like to roughen the surface.
圖2係對防護薄膜組件框架的1個長邊從其正面觀察的圖示。在圖2所示的4個夾具孔中，外側2個夾具孔11、11A係本發明之夾具孔，內側2個夾具孔12、12係習知之夾具孔。圖2最右側的夾具孔11A朝長邊方向形成長孔形狀，惟若互相對向的1對夾具孔係長邊形狀的話，則設置在左邊或右邊都可以。長邊形狀，宜在矩形的兩端形成半圓接合的形狀。Fig. 2 is a view of a long side of the pellicle frame according to the front side thereof. Among the four jig holes shown in Fig. 2, the outer two jig holes 11, 11A are the jig holes of the present invention, and the inner two jig holes 12, 12 are conventional jig holes. The jig hole 11A on the far right side of Fig. 2 has a long hole shape in the longitudinal direction. However, if the pair of jig holes facing each other have a long side shape, they may be provided on the left or right side. The shape of the long side should preferably form a semicircular joint shape at both ends of the rectangle.
夾具孔的深度方向的形狀，並無特別限定，只要不是貫通的就好，即使是在圓柱前端設成推拔形狀的凹孔，也是可以。The shape of the jig hole in the depth direction is not particularly limited as long as it is not penetrated, and it is also possible to provide a recessed hole having a push-out shape at the tip end of the cylinder.
圖3係表示被固定在製造夾具上的防護薄膜組件框架的圖示。製造夾具13設置成藉由4個銷部14、15固定防護薄膜組件框架3的構造。製造夾具的銷部，設置成3mmφ的圓柱，且在前端形成45o 的推拔形狀。又，設置在一方長邊上的2個夾具孔11、11A宜被固定銷14固定在製造夾具13上，設置在另一方長邊上的2個夾具孔11、11A宜被具備彈簧機構的固定銷15固定在製造夾具13上。無論哪個固定銷均宜為推拔銷，其在前端形成推拔形狀。具備彈簧機構的銷部設計成可將朝防護薄膜組件框架的夾具孔的***方向施加的力量抑制在最小限度內。當防護薄膜組件框 架因為加熱等因素而膨脹時，可藉由該銷部的彈簧構造，避開朝短邊方向膨脹的因素，關於長邊方向的膨脹，在設置於框架上且互相對向的1對長孔內，推拔銷的前端可相對防護薄膜組件框架移動，故不會有多餘的力量施加於防護薄膜組件框架，而能夠保持住在製造夾具內部從兩側挾持防護薄膜組件框架的狀態。Figure 3 is a diagram showing the frame of the pellicle assembly fixed to the manufacturing jig. The manufacturing jig 13 is provided to fix the configuration of the pellicle frame 3 by the four pin portions 14, 15. The pin portion of the manufacturing jig was set to a cylinder of 3 mmφ, and a push-out shape of 45 o was formed at the front end. Further, the two jig holes 11 and 11A provided on one long side should be fixed to the manufacturing jig 13 by the fixing pin 14, and the two jig holes 11 and 11A provided on the other long side should be fixed by a spring mechanism. The pin 15 is fixed to the manufacturing jig 13. Regardless of which fixing pin is preferably a push pin, it forms a push-out shape at the front end. The pin portion having the spring mechanism is designed to suppress the force applied in the insertion direction of the jig hole of the pellicle frame to a minimum. When the pellicle frame is inflated due to heating or the like, the spring structure of the pin portion can avoid the factor of expansion in the short side direction, and the expansion in the longitudinal direction is disposed on the frame and opposed to each other. In the pair of long holes, the front end of the push pin can be moved relative to the frame of the protective film assembly, so that no extra force is applied to the frame of the pellicle assembly, and the inside of the manufacturing jig can be held to hold the pellicle frame from both sides. status.
本發明的防護薄膜組件，對於被採用的情況增加，長邊在140mm以上，框架高度在5mm以下的薄型防護薄膜組件特別能夠發揮其優越性能。框架高度，宜為1~5mm，更宜為2~5mm。防護薄膜組件框架長邊上限並無特別限制，惟如上述所述，宜在300mm以下，更宜在230mm以下。防護薄膜組件框架的短邊，其長度只要是在長邊以下即可，並無特別限制。由於該等防護薄膜組件框架的構造非常容易歪曲，故將處理用的夾具孔設置在角落附近，以在強度較高的部分握持框架。又框架長邊的長度越長，在例如受熱的時候，框架的膨脹越大，故確保有餘隙能夠吸收框架長邊方向的長度變化是很重要的。The pellicle module of the present invention is particularly useful in the case where it is used, and a thin pellicle having a long side of 140 mm or more and a frame height of 5 mm or less is particularly capable of exerting its superior performance. The height of the frame should be 1~5mm, more preferably 2~5mm. The upper limit of the long side of the pellicle frame is not particularly limited, but as described above, it should preferably be 300 mm or less, more preferably 230 mm or less. The short side of the pellicle frame is not particularly limited as long as it is longer than the long side. Since the construction of the pellicle frame is very easily distorted, the jig hole for processing is placed near the corner to hold the frame at a higher strength portion. Further, the longer the length of the long side of the frame, the greater the expansion of the frame, for example, when heated, so it is important to ensure that the clearance can absorb the change in the length of the longitudinal direction of the frame.
夾具孔的直徑，可選擇適當尺寸，宜為1~2mm，當設置成長孔時，橫長宜為1~2mm。The diameter of the clamp hole can be selected to be an appropriate size, preferably 1~2mm. When the growth hole is set, the horizontal length should be 1~2mm.
在本發明中，防護薄膜組件框架，宜具備黑色氧皮鋁包覆膜及/或聚合物包覆膜，更宜具備聚合物的電沈積膜。又，防護薄膜組件框架，宜為鋁合金製防護薄膜組件框架，若是具備黑色氧皮鋁包覆膜及/或聚合物的電沈積膜的鋁合金製防護薄膜組件框架則更佳。In the present invention, the pellicle frame is preferably provided with a black oxygen aluminum coating film and/or a polymer coating film, and more preferably has a polymer electrodeposited film. Further, the protective film module frame is preferably a frame of a protective film assembly made of an aluminum alloy, and is preferably a frame of an aluminum alloy protective film module having an electrodeposited film of a black oxygen-aluminum coating film and/or a polymer.
在防護薄膜組件框架表面形成黑色氧皮鋁包覆膜的方法，一般係先用NaOH等鹼性處理液進行數十秒的洗浴處理，之後置於稀硫酸水溶液中進行陽極氧化處理，接著進行黑色染色、封孔處理，這樣就能在表面上設置黑色氧化包覆膜。A method for forming a black oxygen aluminum coating film on the surface of a protective film module frame is generally performed by using an alkaline treatment solution such as NaOH for a tens of seconds of bathing treatment, followed by anodizing in a dilute sulfuric acid aqueous solution, followed by black Dyeing and sealing treatment, so that a black oxide coating film can be provided on the surface.
又，聚合物包覆膜(聚合物塗佈)可利用各種方法設置，例如一般的噴塗法、靜電塗裝法或電沈積法等方法。在本發明中宜利用電沈積法形成聚合物包覆膜。Further, the polymer coating film (polymer coating) can be provided by various methods, such as a general spraying method, an electrostatic coating method, or an electrodeposition method. In the present invention, it is preferred to form a polymer coating film by electrodeposition.
電沈積法，可使用熱硬化型樹脂或紫外線硬化型樹脂。又， 可分別對其使用陰離子電沈積法、陽離子電沈積法。由於在本發明中亦求耐紫外線性能，故熱硬化型樹脂的陰離子電沈積法，從塗佈穩定性、外觀、強度等觀點考量，是較佳的選擇。As the electrodeposition method, a thermosetting resin or an ultraviolet curing resin can be used. also, An anion electrodeposition method or a cationic electrodeposition method can be used separately. Since the ultraviolet resistance is also sought in the present invention, the anion electrodeposition method of the thermosetting resin is preferably selected from the viewpoints of coating stability, appearance, strength, and the like.
電沈積好的聚合物包覆膜的厚度，宜為5~30μm，更宜為5~20μm。The thickness of the electrodeposited polymer coating film is preferably 5 to 30 μm, more preferably 5 to 20 μm.
用於該等目的之塗裝裝置或電沈積用塗料可從某幾家日本公司購入市售產品使用之。例如，Shimizu(股)公司在市面上販售，商品名稱為Elecoat的電沈積塗料。「Elecoat Frosty W-2」或「Elecoat Frosty ST Satiner」係去光澤類型的熱硬化型陰離子類型的電沈積塗料，本發明宜使用之。A coating device or electrodeposition coating for such purposes can be purchased from a certain Japanese company for use in a commercially available product. For example, Shimizu Co., Ltd. is commercially available under the trade name Elecoat. "Elecoat Frosty W-2" or "Elecoat Frosty ST Satiner" is a de-gloss type thermosetting anion type electrodeposition coating which is preferably used in the present invention.
當聚合物包覆膜為黑色去光澤電沈積膜時，其發射係數宜在0.80~0.99為佳。在此，「發射係數」係指以黑體(吸收入射其表面的所有光，不反射也不透過的理想物體)為基準求出全部放射能量P與物體放射能量P1的比率(P1/P)，吾人可使用Japan Sensor(股)公司製的放射測量器TSS-5X測量數值。When the polymer coating film is a black de-gloss electrodeposited film, the emission coefficient is preferably from 0.80 to 0.99. Here, the "emission coefficient" refers to a ratio (P1/P) of all the radiant energy P to the object radiant energy P1 based on a black body (an ideal object that absorbs all light incident on the surface and does not reflect or transmit). We can measure the value using the radiation measuring device TSS-5X manufactured by Japan Sensor Co., Ltd.
以下藉由實施例具體例示説明本發明。又，在實施例以及比較例中，揭示「遮罩」作為「曝光原版」的例子，然而對初縮遮罩也同樣能夠適用，自不待言。The invention will be specifically illustrated by the following examples. Further, in the examples and the comparative examples, the "mask" is disclosed as an example of the "exposure original". However, the initial mask can also be applied, and it goes without saying.
準備框架外尺寸150mm×122mm×3.5mm，框架厚度2mm，且實施過黑色氧皮鋁處理的框架，作為防護薄膜組件框架。在框架長邊上，將處理用夾具孔的中心，設置在框架長邊中心點前後間距共135mm，且距離薄膜接合劑塗佈端面1.75mm的位置上，從防護薄膜組件框架外側，設置孔徑1.6mmφ、深度1.2mm的夾具孔(距離長邊兩端部7.5mm)。又讓互相對向的1對夾具孔各朝橫方向兩側擴大0.8mm，形成3.2mm×1.6mm的長孔。該框架的平坦度用Mitutoyo(股)公司製造的3次元測量器BH506進行測量，發現為6μm。在對應夾具孔間距為135mm的製造夾具上設置該框架，按照習知的防護薄膜組件製造步驟塗佈遮罩接合劑並靜置60 分，之後用高頻率感應加熱裝置進行加熱。在薄膜接合劑塗佈並乾燥之後，貼合防護薄膜，製成防護薄膜組件。從完成後的防護薄膜組件剝離遮罩接合劑，使用Mitutoyo(股)公司製造的3次元測量器BH506測量平坦度，發現為9μm。A frame having a frame outer dimension of 150 mm × 122 mm × 3.5 mm, a frame thickness of 2 mm, and a black oxygen aluminum treatment was prepared as a frame of the protective film assembly. On the long side of the frame, the center of the processing jig hole is set at a front-to-back distance of 135 mm at the center of the long side of the frame, and a distance of 1.75 mm from the end face of the film-bonding agent is applied. Mold hole with mmφ and depth of 1.2mm (7.5mm from both ends of the long side). Further, the pair of jig holes facing each other were expanded by 0.8 mm in the lateral direction to form a long hole of 3.2 mm × 1.6 mm. The flatness of the frame was measured using a 3-dimensional measuring device BH506 manufactured by Mitutoyo Co., Ltd., and found to be 6 μm. The frame is placed on a manufacturing jig corresponding to a jig hole pitch of 135 mm, and the mask bonding agent is applied and left to stand according to a conventional protective film module manufacturing step. The fraction is then heated by a high frequency induction heating device. After the film bonding agent is applied and dried, the protective film is attached to form a pellicle film assembly. The masking agent was peeled off from the finished pellicle film, and the flatness was measured using a 3-dimensional measuring device BH506 manufactured by Mitutoyo Co., Ltd., and found to be 9 μm.
又，上述的「平坦度」，係加上以防護薄膜組件框架假想平面為基準的凹凸的Max、Min差所定義出的大小。Further, the above-mentioned "flatness" is a size defined by the difference between Max and Min of the unevenness based on the virtual plane of the pellicle frame.
準備框架外尺寸149mm×115mm×3.5mm，框架厚度2mm，且實施過電沈積聚合物塗佈的框架，作為防護薄膜組件框架。在框架長邊上跟實施例1一樣設置處理用夾具孔。該框架的平坦度用Mitutoyo(股)公司製造的3次元測量器BH506測量，發現為8μm。在對應夾具孔間距為135mm的製造夾具上設置該框架，按照習知的防護薄膜組件製造步驟塗佈遮罩接合劑並靜置60分，之後用高頻率感應加熱裝置進行加熱。在薄膜接合劑塗佈並乾燥之後，貼合防護薄膜，製成防護薄膜組件。從完成後的防護薄膜組件剝離遮罩接合劑，用Mitutoyo(股)公司製造的3次元測量器BH506測量平坦度，發現為9μm。An outer frame size of 149 mm × 115 mm × 3.5 mm, a frame thickness of 2 mm, and an electrodeposition polymer coated frame were prepared as a shield film assembly frame. A processing jig hole is provided on the long side of the frame in the same manner as in the first embodiment. The flatness of the frame was measured with a 3-dimensional measuring device BH506 manufactured by Mitutoyo Co., Ltd. and found to be 8 μm. The frame was placed on a manufacturing jig corresponding to a jig hole pitch of 135 mm, and the mask bonding agent was applied and left standing for 60 minutes in accordance with a conventional protective film module manufacturing step, followed by heating with a high frequency induction heating device. After the film bonding agent is applied and dried, the protective film is attached to form a pellicle film assembly. The masking agent was peeled off from the finished pellicle film, and the flatness was measured with a 3-dimensional measuring device BH506 manufactured by Mitutoyo Co., Ltd., and found to be 9 μm.
準備框架外尺寸149mm×113mm×4.5mm，框架厚度2mm，且實施過黑色氧皮鋁處理的框架，作為防護薄膜組件框架。在框架長邊上跟實施例1一樣設置處理用夾具孔。該框架的平坦度用Mitutoyo(股)公司製造的3次元測量器BH506測量，發現為6μm。在對應夾具孔間距為135mm的製造夾具上設置該框架，按照習知的防護薄膜組件製造步驟塗佈遮罩接合劑並靜置60分，之後用高頻率感應加熱裝置進行加熱。在薄膜接合劑塗佈並乾燥之後，貼合防護薄膜，製成防護薄膜組件。從完成後的防護薄膜組件剝離遮罩接合劑，用Mitutoyo(股)公司製造的3次元測量器BH506測量平坦度，發現為6μm。A frame having a frame outer dimension of 149 mm × 113 mm × 4.5 mm, a frame thickness of 2 mm, and a black oxygen aluminum treatment was prepared as a frame of the protective film assembly. A processing jig hole is provided on the long side of the frame in the same manner as in the first embodiment. The flatness of the frame was measured with a 3-dimensional measuring device BH506 manufactured by Mitutoyo Co., Ltd., and found to be 6 μm. The frame was placed on a manufacturing jig corresponding to a jig hole pitch of 135 mm, and the mask bonding agent was applied and left standing for 60 minutes in accordance with a conventional protective film module manufacturing step, followed by heating with a high frequency induction heating device. After the film bonding agent is applied and dried, the protective film is attached to form a pellicle film assembly. The masking agent was peeled off from the finished pellicle film, and the flatness was measured with a 3-dimensional measuring device BH506 manufactured by Mitutoyo Co., Ltd., and found to be 6 μm.
準備框架外尺寸150mm×122mm×3.5mm，框架厚度2mm，且 實施過黑色氧皮鋁處理的框架，作為防護薄膜組件框架。在框架長邊上設置孔徑1.6mmφ、深度1.2mm的處理用夾具孔，該夾具孔的中心設置在框架長邊中心點前後間距共135mm且距離薄膜接合劑塗佈端面1.75mm的位置上。該框架的平坦度用Mitutoyo(股)公司製造的3次元測量器BH506進行測量，發現為6μm。在對應夾具孔間距135mm的製造夾具上設置該框架，按照習知的防護薄膜組件製造步驟塗佈遮罩接合劑並靜置60分，之後用高頻率感應加熱裝置進行加熱。在薄膜接合劑塗佈並乾燥之後，貼合防護薄膜，製成防護薄膜組件。從完成後的防護薄膜組件剝離遮罩接合劑，使用Mitutoyo(股)公司製造的3次元測量器BH506測量平坦度，發現為25μm。Prepare the outer dimensions of the frame 150mm × 122mm × 3.5mm, the frame thickness is 2mm, and A frame treated with black oxygen aluminum was used as a frame for the protective film assembly. A processing jig hole having a hole diameter of 1.6 mmφ and a depth of 1.2 mm was provided on the long side of the frame, and the center of the jig hole was set at a position of 135 mm in front and rear of the center point of the long side of the frame and at a position of 1.75 mm from the end face of the film bonding agent. The flatness of the frame was measured using a 3-dimensional measuring device BH506 manufactured by Mitutoyo Co., Ltd., and found to be 6 μm. The frame was placed on a manufacturing jig corresponding to a jig hole pitch of 135 mm, and the mask bonding agent was applied in accordance with a conventional protective film module manufacturing step and allowed to stand for 60 minutes, followed by heating with a high frequency induction heating device. After the film bonding agent is applied and dried, the protective film is attached to form a pellicle film assembly. The masking agent was peeled off from the finished pellicle film, and the flatness was measured using a 3-dimensional measuring device BH506 manufactured by Mitutoyo Co., Ltd., and found to be 25 μm.
準備框架外尺寸150mm×122mm×3.5mm，框架厚度2mm，且實施過黑色氧皮鋁處理的框架，作為防護薄膜組件框架。在框架長邊上設置孔徑1.6mmφ、深度1.2mm的處理用夾具孔，該夾具孔的中心設置在框架長邊中心點前後間距共104mm且距離薄膜接合劑塗佈端面1.75mm的位置上。該框架的平坦度用Mitutoyo(股)公司製造的3次元測量器BH506進行測量，發現為7μm。在對應夾具孔間距135mm的製造夾具上設置該框架，按照習知的防護薄膜組件製造步驟塗佈遮罩接合劑並靜置60分，之後用高頻率感應加熱裝置進行加熱。在薄膜接合劑塗佈並乾燥之後，貼合防護薄膜，製成防護薄膜組件。從完成後的防護薄膜組件剝離遮罩接合劑，用Mitutoyo(股)公司製造的3次元測量器BH506測量平坦度，發現為55μm。A frame having a frame outer dimension of 150 mm × 122 mm × 3.5 mm, a frame thickness of 2 mm, and a black oxygen aluminum treatment was prepared as a frame of the protective film assembly. A processing jig hole having a hole diameter of 1.6 mmφ and a depth of 1.2 mm was provided on the long side of the frame, and the center of the jig hole was set at a position of a total of 104 mm between the front and rear center points of the long side of the frame and a distance of 1.75 mm from the end face of the film bonding agent. The flatness of the frame was measured using a 3-dimensional measuring device BH506 manufactured by Mitutoyo Co., Ltd., and found to be 7 μm. The frame was placed on a manufacturing jig corresponding to a jig hole pitch of 135 mm, and the mask bonding agent was applied in accordance with a conventional protective film module manufacturing step and allowed to stand for 60 minutes, followed by heating with a high frequency induction heating device. After the film bonding agent is applied and dried, the protective film is attached to form a pellicle film assembly. The masking agent was peeled off from the finished pellicle film, and the flatness was measured with a 3-dimensional measuring device BH506 manufactured by Mitutoyo Co., Ltd., and found to be 55 μm.
1‧‧‧防護薄膜1‧‧‧Protective film
2‧‧‧接合層2‧‧‧ bonding layer
3‧‧‧防護薄膜組件框架3‧‧‧Protective membrane module frame
4‧‧‧粘著層4‧‧‧Adhesive layer
5‧‧‧曝光原版5‧‧‧Exposure original
6‧‧‧氣壓調整用孔(通氣口)6‧‧‧Air pressure adjustment hole (vent)
7‧‧‧除塵用過濾器7‧‧‧Dust filter
10‧‧‧防護薄膜組件10‧‧‧Protective film assembly
11‧‧‧夾具孔(圓形)(本發明)11‧‧‧Jig hole (circular) (present invention)
11A‧‧‧夾具孔(長孔)(本發明)11A‧‧‧Jig hole (long hole) (present invention)
12‧‧‧夾具孔(習知技術)12‧‧‧Jig hole (known technology)
13‧‧‧製造夾具13‧‧‧Manufacture fixture
14‧‧‧銷部(固定式)14‧‧‧Department (fixed)
15‧‧‧銷部(附彈簧機構)15‧‧‧ Pin department (with spring mechanism)
圖1係説明圖，表示防護薄膜組件的構造例。Fig. 1 is an explanatory view showing a configuration example of a pellicle assembly.
圖2係表示防護薄膜組件框架長邊與夾具孔的圖示。Figure 2 is a view showing the long side of the pellicle frame and the jig hole.
圖3係表示被設置在防護薄膜組件製造夾具上的防護薄膜組件框架的圖示。Fig. 3 is a view showing a frame of a pellicle assembly provided on a pellicle manufacturing jig.
3‧‧‧防護薄膜組件框架3‧‧‧Protective membrane module frame
11‧‧‧夾具孔(圓形)(本發明)11‧‧‧Jig hole (circular) (present invention)
11A‧‧‧夾具孔(長孔)(本發明)11A‧‧‧Jig hole (long hole) (present invention)
13‧‧‧製造夾具13‧‧‧Manufacture fixture
14‧‧‧銷部(固定式)14‧‧‧Department (fixed)
15‧‧‧銷部(附彈簧機構)15‧‧‧ Pin department (with spring mechanism)
Claims (7)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008137514A JP5134436B2 (en) | 2008-05-27 | 2008-05-27 | Pellicle for lithography |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200952043A TW200952043A (en) | 2009-12-16 |
| TWI415168B true TWI415168B (en) | 2013-11-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098115307A TWI415168B (en) | 2008-05-27 | 2009-05-08 | Pellicle for lithography |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5134436B2 (en) |
| KR (1) | KR101551309B1 (en) |
| TW (1) | TWI415168B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5481106B2 (en) * | 2009-06-24 | 2014-04-23 | 信越化学工業株式会社 | Pellicle frame and lithography pellicle |
| JP5411595B2 (en) * | 2009-06-24 | 2014-02-12 | 信越化学工業株式会社 | Pellicle frame and lithography pellicle |
| JP2012103638A (en) * | 2010-11-15 | 2012-05-31 | Shin Etsu Chem Co Ltd | Pellicle handling tool |
| JP5649134B2 (en) * | 2011-02-08 | 2015-01-07 | 信越化学工業株式会社 | Pellicle frame |
| JP5722760B2 (en) * | 2011-02-08 | 2015-05-27 | 信越化学工業株式会社 | Pellicle manufacturing kit |
| KR101303795B1 (en) * | 2011-12-26 | 2013-09-04 | 주식회사 에프에스티 | EUV pellicle and manufacturing method of the same |
| JP5795747B2 (en) * | 2012-04-04 | 2015-10-14 | 信越化学工業株式会社 | Pellicle frame and pellicle |
| JP5854511B2 (en) * | 2012-10-16 | 2016-02-09 | 信越化学工業株式会社 | Pellicle and pellicle attaching method |
| JP6551837B2 (en) * | 2015-08-17 | 2019-07-31 | 三井化学株式会社 | Pellicle frame and pellicle containing the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09204039A (en) * | 1996-01-25 | 1997-08-05 | Shin Etsu Chem Co Ltd | Pellicle frame holder |
| TW200638166A (en) * | 2005-04-25 | 2006-11-01 | Shinetsu Chemical Co | Pellicle frame |
| JP2007298870A (en) * | 2006-05-02 | 2007-11-15 | Shin Etsu Chem Co Ltd | Peeling jig for pericle |
| TW200801821A (en) * | 2006-06-14 | 2008-01-01 | Shinetsu Chemical Co | Pellicle |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH095982A (en) * | 1995-06-17 | 1997-01-10 | Mitsui Petrochem Ind Ltd | Method for peeling mask protective device |
| JP2002131892A (en) * | 2000-10-27 | 2002-05-09 | Asahi Kasei Electronics Co Ltd | Method for removing pellicle and apparatus for it |
| JP2003043670A (en) * | 2001-07-30 | 2003-02-13 | Asahi Glass Co Ltd | Pellicle |
| JP2004184705A (en) * | 2002-12-03 | 2004-07-02 | Semiconductor Leading Edge Technologies Inc | Pellicle for fluorine gas excimer laser and manufacturing method thereof |
| JP3717887B2 (en) * | 2002-12-24 | 2005-11-16 | 株式会社ルネサステクノロジ | Manufacturing method of semiconductor integrated circuit device |
| JP2007065583A (en) * | 2005-09-02 | 2007-03-15 | Shin Etsu Chem Co Ltd | Method for housing pellicle into pellicle container, method for taking out pellicle from pellicle container, method for transporting and storing pellicle, method for packaging pellicle container housing pellicle, and method for opening pellicle container housing pellicle |
| CN101689018B (en) * | 2007-07-06 | 2013-03-20 | 旭化成电子材料株式会社 | Frame of large pellicle and grasping method of frame |
-
2008
- 2008-05-27 JP JP2008137514A patent/JP5134436B2/en active Active
-
2009
- 2009-04-13 KR KR1020090031789A patent/KR101551309B1/en active IP Right Grant
- 2009-05-08 TW TW098115307A patent/TWI415168B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09204039A (en) * | 1996-01-25 | 1997-08-05 | Shin Etsu Chem Co Ltd | Pellicle frame holder |
| TW200638166A (en) * | 2005-04-25 | 2006-11-01 | Shinetsu Chemical Co | Pellicle frame |
| JP2007298870A (en) * | 2006-05-02 | 2007-11-15 | Shin Etsu Chem Co Ltd | Peeling jig for pericle |
| TW200801821A (en) * | 2006-06-14 | 2008-01-01 | Shinetsu Chemical Co | Pellicle |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5134436B2 (en) | 2013-01-30 |
| TW200952043A (en) | 2009-12-16 |
| KR20090123773A (en) | 2009-12-02 |
| JP2009288265A (en) | 2009-12-10 |
| KR101551309B1 (en) | 2015-09-08 |
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