TWI413585B - Method of manufacturing microelements using inkjet technology - Google Patents
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本發明是有關於一種製造微型元件的方法，且特別是有關於一種利用噴墨技術製造微型元件的方法。This invention relates to a method of making a microcomponent, and more particularly to a method of fabricating a microcomponent using inkjet technology.
為了達到輕薄的目的，現今的電子產品亦隨之微小化，使得消費者除了擁有電子產品的多功能之外，更享有攜帶上的便利性。因此，為了符合電子產品微小化的目的，目前業界亦開始運用各種不同的方法(例如微模造(Micro Molding)與微影蝕刻(photolithography))來製造微型元件，由此可知，微型元件的製造已經備受產業的矚目。In order to achieve the goal of thinness and lightness, today's electronic products are also miniaturized, making consumers more convenient to carry in addition to the versatility of electronic products. Therefore, in order to meet the purpose of miniaturization of electronic products, the industry has begun to use various methods (such as micro Molding and photolithography) to manufacture micro-components, and it is known that the manufacture of micro-components has been It has attracted the attention of the industry.
有鑑於此，本發明提供一種利用噴墨(Ink-Jet Printing)技術製造微型元件的方法。In view of this, the present invention provides a method of manufacturing a micro component by an inkjet (Ink-Jet Printing) technique.
依據上述之目的，本發明提供一種利用噴墨技術製造微型元件的方法，包含取得表面上具有凹陷圖案的疏水性基板；提供具有噴孔的噴印設備；驅動噴印設備以控制噴孔佈放在凹陷圖案中的微液滴之液量；固化凹陷圖案中的此微液滴使之成為微型元件；從凹陷圖案中取出微型元件。According to the above object, the present invention provides a method for manufacturing a micro component by using an ink jet technique, comprising: obtaining a hydrophobic substrate having a concave pattern on a surface; providing a printing device having a spray hole; and driving the printing device to control the discharge of the spray hole The amount of liquid droplets in the recessed pattern; the microdroplets in the cured recess pattern make it a micro-element; the micro-element is removed from the recessed pattern.
依照本發明的實施例所述之利用噴墨技術製造微型元件的方法，上述於驅動該噴印設備之步驟前更包含清潔此疏水性基板。A method of fabricating a micro-component using ink jet technology according to an embodiment of the invention further comprises cleaning the hydrophobic substrate prior to the step of driving the printing device.
依照本發明的實施例所述之利用噴墨技術製造微型元件的方法，上述疏水性基板由下列步驟取得：提供一基材；對此基材執行第一清潔程序；塗佈光阻於此基材上；利用光罩對此光阻進行一曝光程序以於此光阻形成圖案；對基材執行第二清潔程序；塗佈一抗沾層於此基材表面與此圖案上；澆覆一疏水性材料於此基材表面與此圖案上；固化此疏水性材料使之成為此疏水性基板；將此疏水性基板從基材脫離。According to a method of manufacturing a micro-component by using an ink-jet technique according to an embodiment of the present invention, the hydrophobic substrate is obtained by: providing a substrate; performing a first cleaning process on the substrate; applying a photoresist to the substrate On the material; using a photomask to perform an exposure process on the photoresist to form a pattern; performing a second cleaning process on the substrate; applying a resist layer on the surface of the substrate and the pattern; The hydrophobic material is on the surface of the substrate and the pattern; the hydrophobic material is cured to be the hydrophobic substrate; and the hydrophobic substrate is detached from the substrate.
依照本發明的實施例所述之利用噴墨技術製造微型元件的方法，上述疏水性基板的材質為聚二甲基矽氧烷、ABS樹脂或聚氨酯。According to a method of manufacturing a microcomponent by an inkjet technique according to an embodiment of the present invention, the material of the hydrophobic substrate is polydimethyl siloxane, ABS resin or polyurethane.
依照本發明的實施例所述之利用噴墨技術製造微型元件的方法，上述疏水性基板的該表面上包含多個凹陷圖案，其中這些凹陷圖案以一矩陣方式排列，且這些凹陷圖案的形狀能夠依需求設計而為相同或不同。According to the method of manufacturing a micro-component by using an ink-jet technique according to an embodiment of the present invention, the surface of the hydrophobic substrate includes a plurality of recess patterns, wherein the recess patterns are arranged in a matrix, and the shapes of the recess patterns are capable of Designed to be the same or different depending on the needs.
依照本發明的實施例所述之利用噴墨技術製造微型元件的方法，上述微型元件包含凹面鏡體、平面鏡體或凸面鏡體。A method of manufacturing a micro-element using an ink-jet technique according to an embodiment of the present invention, the micro-element comprising a concave mirror body, a plane mirror body or a convex mirror body.
依照本發明的實施例所述之利用噴墨技術製造微型元件的方法，上述微液滴包含高分子材料。According to a method of manufacturing a microcomponent by an inkjet technique according to an embodiment of the present invention, the microdroplet comprises a polymer material.
運用本發明之特點在於：The features of the invention are:
1.由於凹陷圖案是依據製造者對於所需的微型元件之結構不同所設計，並且加上微液滴的液量控制，因此製造者能夠更快速製造出各種不同結構的微型元件且大量產出，以大幅提升微型元件的製造效率。1. Since the recess pattern is designed according to the manufacturer's structure for the required micro-components, and the liquid amount control of the micro-droplets is added, the manufacturer can more quickly manufacture micro-components of various structures and mass-produce. In order to greatly improve the manufacturing efficiency of micro components.
2.由於疏水性基板的疏水特性，令凹陷圖案中的微液滴不會黏固在疏水性基板，使其固化成形後的微型元件能夠容易地從凹陷圖案中被取出。2. Due to the hydrophobic nature of the hydrophobic substrate, the micro-droplets in the recessed pattern are not adhered to the hydrophobic substrate, so that the micro-elements after solidification molding can be easily taken out from the recess pattern.
3.疏水性基板表面上凹陷圖案的形狀能夠依設計而不同，並且能夠為矩陣式排列，因此能夠同時製造出不同微型元件且大量產出微型元件。3. The shape of the recess pattern on the surface of the hydrophobic substrate can be different depending on the design, and can be arranged in a matrix, so that it is possible to simultaneously manufacture different micro-components and mass-produce the micro-components.
4.由於利用噴墨技術製程，因此能夠更快速製造微型元件。4. Due to the use of inkjet technology processes, it is possible to manufacture microcomponents more quickly.
5.疏水性基板能夠重複被使用，如此更能夠減少微型元件的製造成本且更符合環保的需求。5. The hydrophobic substrate can be repeatedly used, which can further reduce the manufacturing cost of the micro component and is more environmentally friendly.
為讓本發明之上述目的、特徵和特點能更明顯易懂，茲配合圖式將本發明相關實施例詳細說明如下。The above described objects, features, and characteristics of the present invention will become more apparent from the aspects of the invention.
請參閱圖1A，圖1A為本發明一實施例利用噴墨技術製造微型元件的方法流程圖。Referring to FIG. 1A, FIG. 1A is a flow chart of a method for manufacturing a micro component by using an inkjet technology according to an embodiment of the present invention.
如圖1A所示，利用噴墨(Ink-Jet Printing)技術製造微型元件的方法1包含下列步驟：取得表面上具有凹陷圖案的疏水性基板(步驟S10)；提供具有噴孔的噴印設備(步驟S11)；驅動噴印設備以控制噴孔佈放在凹陷圖案中的微液滴(Micro Fluidics)之液量(步驟S12)；固化凹陷圖案中的微液滴使之成為微型元件(步驟S13)；從凹陷圖案中取出微型元件(步驟S14)。As shown in FIG. 1A, a method 1 for manufacturing a micro component by an inkjet (Ink-Jet Printing) technique includes the steps of: obtaining a hydrophobic substrate having a concave pattern on a surface (step S10); and providing a printing apparatus having an orifice ( Step S11): driving the printing device to control the amount of liquid droplets of the microfluids placed in the concave pattern (step S12); curing the micro-droplets in the concave pattern to become micro-components (step S13) The micro-element is taken out from the recessed pattern (step S14).
請同時參閱圖1B~圖1E，以利理解上述之步驟，其中圖1B為圖1A疏水性基板的示意圖；圖1C為圖1A利用噴印設備的噴孔佈放出微液滴在疏水性基板之凹陷圖案的示意圖；圖1D為圖1A微液滴於凹陷圖案中固化成微型元件的示意圖；圖1E為圖1A從凹陷圖案中取出微型元件的示意圖。Please refer to FIG. 1B to FIG. 1E to understand the above steps, wherein FIG. 1B is a schematic view of the hydrophobic substrate of FIG. 1A; FIG. 1C is a flow chart of the printing device of FIG. 1A for discharging micro-droplets on a hydrophobic substrate. Schematic diagram of the recessed pattern; FIG. 1D is a schematic view of the micro-droplet of FIG. 1A solidified into a micro-element in a recessed pattern; FIG. 1E is a schematic view of the micro-element taken out from the recessed pattern of FIG. 1A.
如圖1B所示，當製造者欲利用噴墨技術製造微型元件時，能夠進行此步驟：取得表面上具有凹陷圖案的疏水性基板(步驟S10)。As shown in FIG. 1B, when the manufacturer wants to manufacture the micro-elements by the ink-jet technique, this step can be performed by taking a hydrophobic substrate having a concave pattern on the surface (step S10).
所述疏水性基板2的材質能夠為聚二甲基矽氧烷(poly-dimethylsiloxane,PDMS)、ABS樹脂或聚氨酯(polyurethanes,PU)。於此實施例，疏水性基板2的材質以聚二甲基矽氧烷為例。並且，依據所欲製造之微型元件結構的不同，製造者能夠預先於疏水性基板2的表面20上設計出所需的凹陷圖案21，其中凹陷圖案21的數量能夠為一或多個，於此實施例中以多個凹陷圖案21為例，但不限定於此。The material of the hydrophobic substrate 2 can be poly-dimethylsiloxane (PDMS), ABS resin or polyurethane (PU). In this embodiment, the material of the hydrophobic substrate 2 is exemplified by polydimethyl siloxane. Moreover, depending on the structure of the micro-component to be manufactured, the manufacturer can design a desired recess pattern 21 on the surface 20 of the hydrophobic substrate 2 in advance, wherein the number of the recess patterns 21 can be one or more. In the embodiment, the plurality of recess patterns 21 are exemplified, but are not limited thereto.
另外，於此實施例中，這些凹陷圖案21能夠以矩陣方式排列在疏水性基板的表面21上，且這些凹陷圖案21的形狀為相同。所述凹陷圖案21的形狀例如圓形、三角形或方形等幾何圖形，如圖1B所示，這些凹陷圖案21的形狀皆為相同的圓形。當然，隨著微型元件結構需求之不同，製造者亦能夠將這些凹陷圖案21的形狀設計為彼此不相同。In addition, in this embodiment, the recess patterns 21 can be arranged in a matrix on the surface 21 of the hydrophobic substrate, and the shapes of the recess patterns 21 are the same. The shape of the recess pattern 21 is, for example, a circular, triangular or square geometric shape, as shown in FIG. 1B, and the shapes of the recess patterns 21 are all the same circular shape. Of course, with the difference in the structural requirements of the micro-components, the manufacturer can also design the shapes of the recess patterns 21 to be different from each other.
接著，進行此步驟：提供具有噴孔的噴印設備(步驟S11)。Next, this step is performed: a printing apparatus having an orifice is provided (step S11).
於此步驟中，如圖1C所示，製造者能夠準備一噴印設備(Ink-Jet Printing Equipment)，所述噴印設備的一液滴佈放器3具有噴孔30，於實際運用時，液滴佈放器3能夠具有多個噴孔30(例如陣列式噴孔)，於圖1C中僅繪示一個噴孔30作說明，但不限定於此，並且製造者將疏水性基板2定位在噴印設備的工作平台上。In this step, as shown in FIG. 1C, the manufacturer can prepare a printing device (Ink-Jet Printing Equipment), and a droplet discharge device 3 of the printing device has an injection hole 30, in actual use, The droplet dispenser 3 can have a plurality of orifices 30 (for example, array orifices). Only one orifice 30 is illustrated in FIG. 1C, but is not limited thereto, and the manufacturer positions the hydrophobic substrate 2 On the working platform of the printing equipment.
之後，進行此步驟：驅動噴印設備以控制噴孔佈放在凹陷圖案中的微液滴之液量(步驟S12)：於此步驟中，當製造者啟動噴印設備的電源後，製造者能夠利用噴印設備的一液滴佈放程式，依據疏水性基板2表面20上的凹陷圖案21去控制噴孔30佈放在凹陷圖案21內之微液滴31的液量。所述微液滴31的液體成分包含具有光學特性的高分子材料(例如：聚氨酯(PU)、聚乙烯醇(PVA)或聚苯乙烯(PS)等)。於圖1D中，假設凹陷圖案21具有一高度H，因此利用例如此高度H以及凹陷圖案21的底面積210等相關數據，噴孔30便能夠精準控制佈放於凹陷圖案21中之微液滴31的液量，於此應特別說明的是，微液滴31被佈放於凹陷圖案21中時便能夠處於一穩定狀態，亦即利用物理特性使微液滴31穩定的位於凹陷圖案21中，如此更能夠提升微液滴31爾後成形為微型元件的品質。Thereafter, the step of: driving the printing device to control the amount of liquid droplets of the micro-droplets in the recessed pattern is controlled (step S12): in this step, when the manufacturer activates the power of the printing device, the manufacturer The liquid amount of the micro-droplets 31 in which the nozzle holes 30 are placed in the recess pattern 21 can be controlled by the recess pattern 21 on the surface 20 of the hydrophobic substrate 2 by a droplet discharge program of the printing apparatus. The liquid component of the microdroplet 31 contains a polymer material having optical properties (for example, polyurethane (PU), polyvinyl alcohol (PVA), or polystyrene (PS), etc.). In FIG. 1D, assuming that the recess pattern 21 has a height H, the nozzle hole 30 can precisely control the micro droplets placed in the recess pattern 21 by using, for example, the height H and the bottom area 210 of the recess pattern 21. In the liquid amount of 31, it should be particularly noted that when the micro-droplets 31 are placed in the recess pattern 21, they can be in a stable state, that is, the micro-droplets 31 are stabilized by the physical properties in the recess pattern 21. In this way, it is possible to improve the quality of the micro-droplets formed into micro-components.
舉例來說，當微液滴31a佈放於凹陷圖案21中的液量略為高於此高度H時，微液滴31a的上表面即成為凸出形狀，微液滴31a的下表面則具有凹陷圖案21的形狀(例如此實施例的圓形)；當微液滴31b佈放於凹陷圖案21中的液量略為低於此高度H時，微液滴31b的上表面即成為凹陷形狀，微液滴31b的下表面則具有凹陷圖案21的形狀；當微液滴31c佈放於凹陷圖案21中的液量等同於此高度H時，微液滴31c的上表面即成為平面形狀，微液滴31c的下表面則具有凹陷圖案21的形狀。For example, when the amount of liquid in which the micro-droplet 31a is placed in the recess pattern 21 is slightly higher than the height H, the upper surface of the micro-droplet 31a becomes a convex shape, and the lower surface of the micro-droplet 31a has a depression. The shape of the pattern 21 (for example, the circular shape of this embodiment); when the amount of liquid in which the micro-droplet 31b is placed in the recess pattern 21 is slightly lower than the height H, the upper surface of the micro-droplet 31b becomes a concave shape, and micro The lower surface of the liquid droplet 31b has a shape of the concave pattern 21; when the liquid amount of the micro-droplet 31c placed in the concave pattern 21 is equivalent to the height H, the upper surface of the micro-droplet 31c becomes a planar shape, and the micro-liquid The lower surface of the drop 31c has the shape of the recess pattern 21.
由此可知，利用液量的控制，製造者能夠直接調整位於凹陷圖案21中微液滴上表面的曲率，以符合製造者對不同結構之微型元件的需求。From this, it can be seen that with the control of the liquid amount, the manufacturer can directly adjust the curvature of the upper surface of the micro-droplet located in the recess pattern 21 to conform to the manufacturer's demand for the micro-components of different structures.
另外，於此驅動噴印設備以控制噴孔佈放在凹陷圖案中的微液滴之液量之步驟前(步驟S12前)更包含清潔疏水性基板2，以確保疏水性基板2在無髒汙的情況下，利用噴孔30佈放微液滴31於凹陷圖案21中，進而避免爾後影響微型元件成形的品質。In addition, before the step of driving the printing apparatus to control the amount of the liquid droplets of the micro-droplets in the recess pattern (before step S12), the cleaning hydrophobic substrate 2 is further included to ensure that the hydrophobic substrate 2 is dirty. In the case of contamination, the micro-droplets 31 are placed in the recess pattern 21 by the orifices 30, thereby avoiding the influence of the quality of the micro-components.
接著，進行此步驟：固化凹陷圖案中的微液滴使之成為微型元件(步驟S13)。Next, this step is performed: the micro-droplets in the recess pattern are cured to become micro-components (step S13).
承上述，當微液滴31a、31b與31c分別被佈放在凹陷圖案21後，微液滴31a、31b與31c便會依據此凹陷圖案21的形狀，於凹陷圖案21中固化成微型元件，其中由於疏水性基板2的疏水特性，微液滴31a、31b與31c固化後並不會黏固在凹陷圖案21中。另外，微液滴31a、31b與31c能夠於常溫下自然固化為微型元件。In the above, when the micro-droplets 31a, 31b, and 31c are respectively placed in the recess pattern 21, the micro-droplets 31a, 31b, and 31c are solidified into the micro-components in the recess pattern 21 according to the shape of the recess pattern 21. Among them, the micro-droplets 31a, 31b, and 31c do not adhere to the recess pattern 21 after being cured due to the hydrophobic property of the hydrophobic substrate 2. Further, the micro-droplets 31a, 31b, and 31c can be naturally solidified into microelements at normal temperature.
接著，進行此步驟：從凹陷圖案中取出微型元件(步驟S14)。Next, this step is performed: the micro-element is taken out from the recess pattern (step S14).
如圖1E所示，當液滴31a、31b與31c在凹陷圖案21中固化成微型元件後，製造者即可利用自動(例如機械手臂)或手動的方式，將液滴31a、31b與31c固化後分別成形的微型元件310a、310b與310c從凹陷圖案21中取出，即完成微型元件的製造。另外，應說明的是，當微型元件從凹陷圖案21中被取出後，疏水性基板2能夠繼續於下次製造微型元件時使用，如此更能夠減少微型元件的製造成本且更符合環保的需求。As shown in FIG. 1E, after the droplets 31a, 31b, and 31c are solidified into the micro-element in the recess pattern 21, the manufacturer can cure the droplets 31a, 31b, and 31c by automatic (for example, robotic arm) or manual means. The separately formed micro-elements 310a, 310b, and 310c are taken out from the recess pattern 21, that is, the manufacture of the micro-components is completed. In addition, it should be noted that after the micro component is taken out from the recess pattern 21, the hydrophobic substrate 2 can continue to be used in the next manufacture of the micro component, so that the manufacturing cost of the micro component can be reduced and the environmental protection requirement can be more satisfied.
因此，利用噴墨技術所製造出的微型元件，例如上述實施例的微型元件310a、310b與310c能夠分別作為凸面鏡體、凹面鏡體與平面鏡體。當然，從上述實施例的說明可知，由於凹陷圖案21是依據製造者對於所需的微型元件之結構不同所設計，並且加上微液滴31的液量控制，因此利用本發明所提供之方法能夠更快速製造出各種不同結構的微型元件且大量產出，以大幅提升微型元件的製造效率。Therefore, the micro-components manufactured by the ink-jet technique, for example, the micro-elements 310a, 310b, and 310c of the above-described embodiments can be used as a convex mirror body, a concave mirror body, and a plane mirror body, respectively. Of course, from the description of the above embodiments, since the recess pattern 21 is designed according to the manufacturer's structure for the required micro-components, and the liquid amount control of the micro-droplets 31 is added, the method provided by the present invention is utilized. The micro-components of various structures can be manufactured more quickly and produced in large quantities to greatly improve the manufacturing efficiency of the micro-components.
請參閱圖2A，圖2A為本發明圖1B疏水性基板之取得方法的流程圖。Please refer to FIG. 2A. FIG. 2A is a flowchart of a method for obtaining the hydrophobic substrate of FIG. 1B according to the present invention.
如圖2A所示，製造者能夠利用下列步驟取得疏水性基板2：提供基材(步驟S100)；對基材執行第一清潔程序(步驟S110)；塗佈光阻於基材上(步驟S120)；利用光罩對光阻進行曝光程序以於光阻形成圖案(步驟S130)；對基材執行第二清潔程序(步驟S140)；塗佈抗沾層於基材表面與圖案上(步驟S150)；澆覆疏水性材料於基材表面與圖案上(步驟S160)；固化疏水性材料使之成為疏水性基板(步驟S170)；將疏水性基板從基材脫離(步驟S180)。As shown in FIG. 2A, the manufacturer can obtain the hydrophobic substrate 2 by using the following steps: providing a substrate (step S100); performing a first cleaning process on the substrate (step S110); applying a photoresist to the substrate (step S120) The exposure process of the photoresist is performed by the photomask to form a pattern for the photoresist (step S130); the second cleaning process is performed on the substrate (step S140); and the anti-staining layer is coated on the surface and the substrate of the substrate (step S150) And coating the hydrophobic material on the surface and the pattern of the substrate (step S160); curing the hydrophobic material to form a hydrophobic substrate (step S170); and detaching the hydrophobic substrate from the substrate (step S180).
請同時參閱圖2B，圖2B為本發明一實施例取得疏水性基板的示意圖。Please refer to FIG. 2B at the same time. FIG. 2B is a schematic diagram of obtaining a hydrophobic substrate according to an embodiment of the present invention.
欲取得疏水性基板2時，首先進行此步驟：提供基材(步驟S100)。When the hydrophobic substrate 2 is to be obtained, this step is first performed: a substrate is provided (step S100).
於此步驟中，製造者能夠製備一基材201，例如矽基材或玻璃基材。In this step, the manufacturer can prepare a substrate 201, such as a tantalum substrate or a glass substrate.
接著，進行下列步驟：對基材執行第一清潔程序(步驟S110)；塗佈光阻於基材上(步驟S120)。Next, the following steps are performed: performing a first cleaning process on the substrate (step S110); applying a photoresist to the substrate (step S120).
於製備基材201後，對基材201執行第一清潔程序，以清除基材201上的髒污，之後將光阻202塗佈在基材201的表面上，例如利用旋轉塗佈的方式將SU-8光阻材料塗佈在基材201的表面上。After the substrate 201 is prepared, a first cleaning process is performed on the substrate 201 to remove the stain on the substrate 201, and then the photoresist 202 is coated on the surface of the substrate 201, for example, by spin coating. The SU-8 photoresist material is coated on the surface of the substrate 201.
接著，進行下列步驟：利用光罩對光阻進行一曝光程序以於光阻形成圖案(步驟S130)Next, the following steps are performed: performing an exposure process on the photoresist by the photomask to form a pattern of the photoresist (step S130)
於此步驟中，製造者能夠是依據所需的微型元件之結構不同而設計不同的光罩圖案，並利用此光罩203對光阻202進行曝光程序以於光阻202形成圖案204。In this step, the manufacturer can design different mask patterns according to the structure of the required micro-components, and expose the photoresist 202 by the mask 203 to form the pattern 204 in the photoresist 202.
之後，進行下列步驟：對基材執行第二清潔程序(步驟S140)；塗佈一抗沾層於基材表面與圖案上(步驟S150)；承上述，於光阻202形成圖案204後，對基材201執行第二清潔程序，以清除基材201與圖案204上的髒污，之後將一抗沾層205塗佈於基材201表面與圖案204上。Thereafter, the following steps are performed: performing a second cleaning process on the substrate (step S140); applying a resist layer on the surface of the substrate and the pattern (step S150); and after forming the pattern 204 on the photoresist 202, The substrate 201 performs a second cleaning process to remove dirt on the substrate 201 and the pattern 204, and then a resist layer 205 is applied to the surface of the substrate 201 and the pattern 204.
接著，進行此步驟：澆覆疏水性材料於基材表面與圖案上(步驟S160)。Next, this step is performed: the hydrophobic material is applied to the surface of the substrate and the pattern (step S160).
承上述，當塗佈抗沾層205於基材201表面與圖案204上後，製造者便能夠將疏水性材料澆覆於此基材201表面與圖案204上，其中疏水性材料的材質能夠為聚二甲基矽氧烷、ABS樹脂或聚氨酯(這些材質即為爾後製造疏水性基板2的材質)。In the above, when the anti-staining layer 205 is applied on the surface of the substrate 201 and the pattern 204, the manufacturer can apply a hydrophobic material on the surface of the substrate 201 and the pattern 204, wherein the material of the hydrophobic material can be Polydimethyl siloxane, ABS resin or polyurethane (these materials are materials for the hydrophobic substrate 2).
之後，進行此步驟：固化疏水性材料使之成為疏水性基板(步驟S170)。Thereafter, this step is carried out: the hydrophobic material is cured to become a hydrophobic substrate (step S170).
於此步驟中，製造者能夠利用例如烘烤的方式將疏水性材料固化，使冷卻固化後的疏水性材料成為疏水性基板2。In this step, the manufacturer can cure the hydrophobic material by, for example, baking, and the hydrophobic material after cooling and solidification becomes the hydrophobic substrate 2.
接著，進行此步驟：將疏水性基板從基材脫離(步驟S180)。Next, this step is performed: the hydrophobic substrate is detached from the substrate (step S180).
於此步驟中，製造者能夠利用一翻模作業將疏水性基板2從基材201脫離。其中由於基材201與疏水性基板2為對應的結構，使得疏水性基板2具有利用圖案204所形成的凹陷圖案21，此凹陷圖案21即為爾後微液滴被佈放的位置所在。In this step, the manufacturer can detach the hydrophobic substrate 2 from the substrate 201 by a mold turning operation. Since the substrate 201 and the hydrophobic substrate 2 have a corresponding structure, the hydrophobic substrate 2 has a recess pattern 21 formed by the pattern 204, and the recess pattern 21 is a position at which the micro droplets are disposed.
請參閱圖3與圖4，圖3為本發明另一實施例疏水性基板的示意圖；圖4為本發明另一實施例疏水性基板的示意圖。Please refer to FIG. 3 and FIG. 4. FIG. 3 is a schematic diagram of a hydrophobic substrate according to another embodiment of the present invention; FIG. 4 is a schematic diagram of a hydrophobic substrate according to another embodiment of the present invention.
如圖3所示，疏水性基板2表面20上的凹陷圖案，能夠依據製造者所需求的微型元件之結構，而設計成長條溝形狀凹陷圖案21a並以矩陣方式排列在疏水性基板2的表面21上；或者，如圖4所示，疏水性基板2表面20上的凹陷圖案能夠依據製造者所需求的微型元件之結構，而同時於疏水性基板2的表面20上設計有圓形凹陷圖案21、三角形凹陷圖案21b、方形凹陷圖案21c與長條溝形狀凹陷圖案21a彼此不相同形狀的幾何圖形，並以矩陣方式排列在疏水性基板的表面20上。As shown in FIG. 3, the recess pattern on the surface 20 of the hydrophobic substrate 2 can be designed to grow the groove-shaped recess pattern 21a and be arranged in a matrix on the surface of the hydrophobic substrate 2 in accordance with the structure of the micro-component required by the manufacturer. 21; or, as shown in FIG. 4, the concave pattern on the surface 20 of the hydrophobic substrate 2 can be designed with a circular concave pattern on the surface 20 of the hydrophobic substrate 2 according to the structure of the micro-component required by the manufacturer. 21. The triangular recessed pattern 21b, the square recessed pattern 21c, and the long groove-shaped recessed pattern 21a have geometric shapes different from each other, and are arranged in a matrix on the surface 20 of the hydrophobic substrate.
由此可知，利用預設的凹陷圖案以及爾後佈放於這些凹陷圖案之微液滴液量的控制，製造者能夠製造出各種不同結構的微型元件。並且，值得一提的是，疏水性基板2能夠重複被使用，如此更能夠減少微型元件的製造成本且更符合環保的需求。From this, it can be seen that the manufacturer can manufacture the micro-components of various structures by using the predetermined recess pattern and the control of the amount of the micro-droplet liquid disposed on the recess patterns. Moreover, it is worth mentioning that the hydrophobic substrate 2 can be repeatedly used, so that the manufacturing cost of the micro component can be reduced and the environmental protection requirement can be more satisfied.
承上述，本發明所提供利用噴墨技術製造微型元件的方法，具有下列之特點：In view of the above, the present invention provides a method for manufacturing a micro component using an ink jet technique, which has the following features:
1.由於凹陷圖案是依據製造者對於所需的微型元件之結構不同所設計，並且加上位於凹陷圖案中微液滴的液量控制(直接調整微液滴上表面的曲率)，因此製造者能夠更快速製造出各種不同結構的微型元件且大量產出，以大幅提升微型元件的製造效率。1. Since the recess pattern is designed according to the manufacturer's structure for the required micro-components, and the liquid amount control of the micro-droplets located in the recess pattern (directly adjusting the curvature of the upper surface of the micro-droplet), the manufacturer The micro-components of various structures can be manufactured more quickly and produced in large quantities to greatly improve the manufacturing efficiency of the micro-components.
2.由於疏水性基板的疏水特性，令凹陷圖案中的微液滴不會黏固在疏水性基板，使其固化成形後的微型元件能夠容易地從凹陷圖案中被取出。2. Due to the hydrophobic nature of the hydrophobic substrate, the micro-droplets in the recessed pattern are not adhered to the hydrophobic substrate, so that the micro-elements after solidification molding can be easily taken out from the recess pattern.
3.疏水性基板表面上凹陷圖案的形狀能夠依設計而不同，並且能夠為矩陣式排列，因此能夠同時製造出不同的微型元件且大量產出微型元件。3. The shape of the recess pattern on the surface of the hydrophobic substrate can be different depending on the design, and can be arranged in a matrix, so that different micro-elements can be simultaneously manufactured and a large number of micro-components can be produced.
4.微液滴被佈放於凹陷圖案中時便能夠處於一穩定狀態(此為物理特性的運用)，如此更能夠提升微型元件的品質。4. When the micro-droplets are placed in the recessed pattern, they can be in a stable state (this is the application of physical properties), which can improve the quality of the micro-components.
5.由於利用噴墨技術製程，因此能夠更快速製造微型元件。5. Due to the use of inkjet technology, it is possible to manufacture microcomponents more quickly.
6.疏水性基板能夠重複被使用，如此更能夠減少微型元件的製造成本且更符合環保的需求。6. The hydrophobic substrate can be repeatedly used, which can further reduce the manufacturing cost of the micro component and is more environmentally friendly.
綜上所述，乃僅記載本發明為呈現解決問題所採用的技術手段之較佳實施方式或實施例而已，並非用來限定本發明專利實施之範圍。即凡與本發明專利申請範圍文義相符，或依本發明專利範圍所做的均等變化與修飾，皆為本發明專利範圍所涵蓋。In summary, the present invention is only described as a preferred embodiment or embodiment of the technical means for solving the problem, and is not intended to limit the scope of the invention. That is, the equivalent changes and modifications made in accordance with the scope of the patent application of the present invention or the scope of the invention are covered by the scope of the invention.
2．．．疏水性基板2. . . Hydrophobic substrate
20．．．表面20. . . surface
201．．．基材201. . . Substrate
202．．．光阻202. . . Photoresist
203．．．光罩203. . . Mask
204．．．圖案204. . . pattern
205．．．抗沾層205. . . Anti-stick layer
21．．．凹陷圖案twenty one. . . Sag pattern
21a．．．長條溝形狀凹陷圖案21a. . . Long groove shape concave pattern
21b．．．三角形凹陷圖案21b. . . Triangle depression pattern
21c．．．方形凹陷圖案21c. . . Square depression pattern
210．．．底面積210. . . Bottom area
3．．．液滴佈放器3. . . Droplet dispenser
30．．．噴孔30. . . Spray hole
31，31a，31b，31c．．．微液滴31, 31a, 31b, 31c. . . Microdroplet
310a，310b，310c．．．微型元件310a, 310b, 310c. . . Micro component
H．．．高度H. . . height
步驟：S10~S14Step: S10~S14
步驟：S100~S180Step: S100~S180
圖1A為本發明一實施例利用噴墨技術製造微型元件的方法流程圖；1A is a flow chart of a method for manufacturing a micro component by using an inkjet technique according to an embodiment of the present invention;
圖1B為圖1A疏水性基板的示意圖；1B is a schematic view of the hydrophobic substrate of FIG. 1A;
圖1C為圖1A利用噴印設備的噴孔佈放出微液滴在疏水性基板之凹陷圖案的示意圖；1C is a schematic view showing the concave pattern of the micro-droplets on the hydrophobic substrate by using the orifice cloth of the printing apparatus of FIG. 1A;
圖1D為圖1A微液滴於凹陷圖案中固化成微型元件的示意圖；1D is a schematic view of the micro-droplet of FIG. 1A solidified into a micro-element in a recess pattern;
圖1E為圖1A從凹陷圖案中取出微型元件的示意圖；FIG. 1E is a schematic view of the micro-element taken out from the recess pattern in FIG. 1A; FIG.
圖2A為本發明圖1B疏水性基板之取得方法的流程圖；2A is a flow chart of a method for obtaining the hydrophobic substrate of FIG. 1B according to the present invention;
圖2B為本發明一實施例取得疏水性基板的示意圖；2B is a schematic view of a hydrophobic substrate according to an embodiment of the invention;
圖3為本發明另一實施例疏水性基板的示意圖；以及3 is a schematic view of a hydrophobic substrate according to another embodiment of the present invention;
圖4為本發明另一實施例疏水性基板的示意圖。4 is a schematic view of a hydrophobic substrate according to another embodiment of the present invention.
步驟：S10~S14Step: S10~S14
Claims (9)
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| TWI294402B (en) * | 2006-03-22 | 2008-03-11 | Ind Tech Res Inst | A method for fabricating a micro-optical element and an apparatus thereof |
| TW201004770A (en) * | 2008-07-18 | 2010-02-01 | Hon Hai Prec Ind Co Ltd | Method for making optical element |
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| JPH07100835A (en) * | 1993-09-30 | 1995-04-18 | Ricoh Co Ltd | Die for manufacturing optical parts, optical part manufacturing device using die and manufacture of optical parts |
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