TWI411031B - - Google Patents

Info

Publication number
TWI411031B
TWI411031B TW98131916A TW98131916A TWI411031B TW I411031 B TWI411031 B TW I411031B TW 98131916 A TW98131916 A TW 98131916A TW 98131916 A TW98131916 A TW 98131916A TW I411031 B TWI411031 B TW I411031B
Authority
TW
Taiwan
Prior art keywords
seats
saw
guiding component
crystals
platform
Prior art date
Application number
TW98131916A
Other languages
Chinese (zh)
Other versions
TW201112317A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW98131916A priority Critical patent/TW201112317A/en
Publication of TW201112317A publication Critical patent/TW201112317A/en
Application granted granted Critical
Publication of TWI411031B publication Critical patent/TWI411031B/zh

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  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A serial multi-thread saw crystal slicing device includes a plurality of seats, a plurality of guiding components, and a saw wire. The plurality of seats are alternatively allocated adjacent to each other, and each includes a platform. The plurality of guiding components respectively faces each other and corresponds to the platforms of the plurality of the seats. Each guiding component can move relatively with respect to the platform of the corresponded seat so that the guiding component and the platform move close to each other. Each guiding component includes two rollers, and the saw wire extends backward and forward between the two rollers of the guiding component; therefore a plurality of wire nets that respectively face and in parallel to the surfaces of the platforms of the plurality of seats are formed. This invention enables the saw wires to cut the crystals on the plurality of seats each time the saw wires roll; therefore the number of crystals cut for each time can be greatly increased, significantly improving the cutting efficiency of the crystals.
TW98131916A 2009-09-22 2009-09-22 Serial multi-thread saw crystal slicing device TW201112317A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW98131916A TW201112317A (en) 2009-09-22 2009-09-22 Serial multi-thread saw crystal slicing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW98131916A TW201112317A (en) 2009-09-22 2009-09-22 Serial multi-thread saw crystal slicing device

Publications (2)

Publication Number Publication Date
TW201112317A TW201112317A (en) 2011-04-01
TWI411031B true TWI411031B (en) 2013-10-01

Family

ID=44909229

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98131916A TW201112317A (en) 2009-09-22 2009-09-22 Serial multi-thread saw crystal slicing device

Country Status (1)

Country Link
TW (1) TW201112317A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109244037A (en) * 2017-07-10 2019-01-18 煜峰投资顾问有限公司 Brittle material substrate splitting device and splitting method using same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024002329A1 (en) * 2022-06-30 2024-01-04 青岛高测科技股份有限公司 Wire saw device, multi-wire cutting apparatus, and control method for multi-wire cutting apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0716910B1 (en) * 1994-12-15 2002-03-27 Sharp Kabushiki Kaisha Multi-wire saw device and slice method using the same
US20060249134A1 (en) * 2003-10-27 2006-11-09 Takafumi Kawasaki Multi-wire saw
WO2009001453A1 (en) * 2007-06-27 2008-12-31 Mitsubishi Electric Corporation Multi-wire saw and method of cutting ingot

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0716910B1 (en) * 1994-12-15 2002-03-27 Sharp Kabushiki Kaisha Multi-wire saw device and slice method using the same
US20060249134A1 (en) * 2003-10-27 2006-11-09 Takafumi Kawasaki Multi-wire saw
WO2009001453A1 (en) * 2007-06-27 2008-12-31 Mitsubishi Electric Corporation Multi-wire saw and method of cutting ingot

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109244037A (en) * 2017-07-10 2019-01-18 煜峰投资顾问有限公司 Brittle material substrate splitting device and splitting method using same

Also Published As

Publication number Publication date
TW201112317A (en) 2011-04-01

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