TWI408782B - Sliding type thin fingerprint sensor package - Google Patents

Sliding type thin fingerprint sensor package Download PDF

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Publication number
TWI408782B
TWI408782B TW096132635A TW96132635A TWI408782B TW I408782 B TWI408782 B TW I408782B TW 096132635 A TW096132635 A TW 096132635A TW 96132635 A TW96132635 A TW 96132635A TW I408782 B TWI408782 B TW I408782B
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Taiwan
Prior art keywords
package structure
contact
circuit layer
fingerprint reader
slip
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TW096132635A
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Chinese (zh)
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TW200910544A (en
Inventor
Yeh Shun Chen
Yung Jen Chen
Lin Hsin Chen
Hua Ping Chen
Heng Ting Liu
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Chipbond Technology Corp
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Priority to TW096132635A priority Critical patent/TWI408782B/en
Publication of TW200910544A publication Critical patent/TW200910544A/en
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Publication of TWI408782B publication Critical patent/TWI408782B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

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  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

A sliding type thin fingerprint sensor package which defines a sliding zone and a bending portion mainly includes a substrate, a fingerprint sensor chip and a metal plate. The fingerprint sensor chip is electrically connected to the substrate, a window of the dielectric layer of the substrate exposes a sensor zone of the fingerprint sensor chip, and the metal plate is electrically connected to the substrate. A sliding surface of the metal plate closes to the sensor zone of the fingerprint sensor chip and the window of the dielectric layer exposes the sensor zone and the sliding surface, and the sensor zone of the fingerprint sensor chip and sliding surface of the metal plate are located on the sliding zone, a plurality of outer pads of a circuit layer of the substrate are located on the bending portion.

Description

觸滑式薄型指紋辨識器封裝構造Touch-slip thin fingerprint reader package construction

本發明係有關於一種指紋辨識器封裝構造，特別係有關於一種觸滑式薄型指紋辨識器封裝構造。The present invention relates to a fingerprint identifier package construction, and more particularly to a touch-slip thin fingerprint reader package construction.

如第14圖所示，習知指紋辨識器封裝構造10係主要包含一基板11、一半導體晶片12以及一封膠體13，該基板11係具有一上表面11a及一下表面11b，該半導體晶片12係貼設於該基板11之該上表面11a並且電性連接至該基板11，該半導體晶片12係具有一指紋感測表面12a，該封膠體13係形成於該基板11之該上表面11a，並包覆部分之該半導體晶片12且顯露該半導體晶片12之該指紋感測表面12a。然而習知指紋辨識器封裝構造10並無設置靜電放電裝置，因此當手指接觸至該半導體晶片12之該指紋感測表面12a時，所產生之靜電無法靜電放電，容易造成習知指紋辨識器封裝構造10發生短路之情形。As shown in FIG. 14, the conventional fingerprint identifier package structure 10 mainly includes a substrate 11, a semiconductor wafer 12, and a gel body 13. The substrate 11 has an upper surface 11a and a lower surface 11b. The semiconductor wafer 12 Attached to the upper surface 11a of the substrate 11 and electrically connected to the substrate 11, the semiconductor wafer 12 has a fingerprint sensing surface 12a formed on the upper surface 11a of the substrate 11. A portion of the semiconductor wafer 12 is coated and the fingerprint sensing surface 12a of the semiconductor wafer 12 is exposed. However, the conventional fingerprint identifier package structure 10 is not provided with an electrostatic discharge device, so when the finger contacts the fingerprint sensing surface 12a of the semiconductor wafer 12, the generated static electricity cannot be electrostatically discharged, which easily causes the conventional fingerprint identifier package. The configuration 10 is short-circuited.

本發明之主要目的係在於提供一種觸滑式薄型指紋辨識器封裝構造，其係定義有一觸滑區及一導接部，其係包含一基板、一指紋辨識晶片以及一金屬板，該基板係包含有一介電層、一線路層以及一第一保護層，該介電層其係具有一上表面、一下表面及一貫穿該上表面與該下表面之窗口，該線路層係具有一第一表面、一第二表面、複數個內接墊及複數個外接墊，該些內接墊係形成於該介電層之該下表面，該第一保護層係形成於該線路層之該第一表面，該第一保護層係具有複數個第一開口，該些第一開口係顯露該些內接墊，該指紋辨識晶片係具有一主動面、一背面及一感測區，該指紋辨識晶片係電性連接該基板之該些內接墊，且該介電層之該窗口係顯露該感測區，該金屬板係電性連接該基板，該金屬板係具有一觸滑表面，該觸滑表面係鄰近該指紋辨識晶片之該感測區，且該介電層之該窗口係顯露該觸滑表面，其中該指紋辨識晶片之該感測區及該金屬板之該觸滑表面係位於該觸滑區，該線路層之該些外接墊係位於該導接部。由於本發明之該介電層之該窗口係顯露該感測區及該觸滑表面，且該指紋辨識晶片之該感測區及該金屬板之該觸滑表面係位於該觸滑區，因此當手指接觸該觸滑區時，可藉由該金屬板之該觸滑表面靜電放電，並且可降低該觸滑式薄型指紋辨識器封裝構造之厚度及製造成本。The main purpose of the present invention is to provide a touch-slip thin fingerprint reader package structure, which has a touch-sliding area and a guiding portion, which comprises a substrate, a fingerprint identification chip and a metal plate. The utility model comprises a dielectric layer, a circuit layer and a first protective layer, the dielectric layer having an upper surface, a lower surface and a window extending through the upper surface and the lower surface, the circuit layer having a first a surface, a second surface, a plurality of interconnect pads, and a plurality of external pads, the inner pads being formed on the lower surface of the dielectric layer, the first protective layer being formed on the first layer of the circuit layer The first protective layer has a plurality of first openings, the first openings exposing the inner pads, and the fingerprint identification chip has an active surface, a back surface and a sensing area, the fingerprint identification chip Electrically connecting the inner pads of the substrate, and the window of the dielectric layer reveals the sensing area, the metal plate is electrically connected to the substrate, the metal plate has a touch surface, the touch Sliding surface system adjacent to the fingerprint identification The sensing area of the chip, and the window of the dielectric layer reveals the touch-sliding surface, wherein the sensing area of the fingerprint recognition chip and the sliding surface of the metal plate are located in the touch-sliding area, the line The external pads of the layer are located at the guiding portion. Since the window of the dielectric layer of the present invention reveals the sensing region and the touch-slip surface, and the sensing region of the fingerprint recognition wafer and the sliding surface of the metal plate are located in the touch-sliding region, When the finger touches the touch-slip zone, the contact surface of the metal plate can be electrostatically discharged, and the thickness and manufacturing cost of the touch-slip thin fingerprint reader package structure can be reduced.

請參閱第1、2及3圖，依據本發明之一第一具體實施例係揭示一種觸滑式薄型指紋辨識器封裝構造100，其係定義有一觸滑區100a及一導接部100b，其係包含有一基板110、一指紋辨識晶片120以及一金屬板130，該基板110係可為印刷電路板或軟性電路板，在本實施例中，該基板110係為可撓性基板，該基板110係包含一介電層111、一線路層112以及一第一保護層113，該介電層111係具有一上表面111a、一下表面111b及一貫穿該上表面111a與該下表面111b之窗口111c，該線路層112係具有一第一表面112a、一第二表面112b、複數個內接墊112c及複數個外接墊112d，在本實施例中，該線路層112係包含有一第一線路層112’及一第二線路層112”，該第一線路層112’係形成於該介電層111之該下表面111b，該第一線路層112’係具有該第一表面112a、複數個靜電導接墊112e及該些內接墊112c，該些靜電導接墊112e係鄰近該介電層111之該窗口111c，該些內接墊112c係形成於該介電層111之該下表面111b，該第二線路層112”係形成於該介電層111之該上表面111a，該第二線路層112”係具有該第二表面112b，在本實施例中，該些外接墊112d係形成於該第二線路層112”。Referring to Figures 1, 2 and 3, a first embodiment of the present invention discloses a touch-slip thin fingerprint reader package structure 100 defining a touch-slip area 100a and a guiding portion 100b. The substrate 110 includes a substrate 110, a fingerprint identification chip 120, and a metal plate 130. The substrate 110 can be a printed circuit board or a flexible circuit board. In the embodiment, the substrate 110 is a flexible substrate. The system includes a dielectric layer 111, a wiring layer 112, and a first protective layer 113. The dielectric layer 111 has an upper surface 111a, a lower surface 111b, and a window 111c extending through the upper surface 111a and the lower surface 111b. The circuit layer 112 has a first surface 112a, a second surface 112b, a plurality of interconnect pads 112c, and a plurality of external pads 112d. In this embodiment, the circuit layer 112 includes a first circuit layer 112. 'and a second circuit layer 112', the first circuit layer 112' is formed on the lower surface 111b of the dielectric layer 111, the first circuit layer 112' has the first surface 112a, a plurality of electrostatic conduction The pad 112e and the inner pads 112c, the electrostatic leads The pad 112e is adjacent to the window 111c of the dielectric layer 111. The inner pads 112c are formed on the lower surface 111b of the dielectric layer 111. The second circuit layer 112" is formed on the dielectric layer 111. The upper surface 111a, the second circuit layer 112" has the second surface 112b. In the embodiment, the external pads 112d are formed on the second circuit layer 112".

請再參閱第2及3圖，該第一保護層113係形成於該第一線路層112”之該第一表面112a，該第一保護層113係具有複數個第一開口113a，該些第一開口113a係顯露該些內接墊112c，較佳地，該基板110係另包含有一第二保護層114，該第二保護層114係形成於該第二線路層112”之該第二表面112b，該第二保護層114係具有複數個第二開口114a，該些第二開口114a係顯露該些外接墊112d。該指紋辨識晶片120係電性連接該些內接墊112c，該指紋辨識晶片120係具有一主動面121、一背面122、一感測區123及複數個凸塊124，該感測區123係形成於該主動面121，且該介電層111之該窗口111c係顯露該感測區123，該些凸塊124係形成於該主動面121且該些凸塊124係位於該感測區123外側，該些凸塊124係電性連接該內接墊112c，其中該些凸塊124係可透過異方性導電膠(Antisotropic Conductive Paste,ACP)或非導電膠(Non－Conductive Paste,NCP)電性連接至該些內接墊112c，較佳地，該觸滑式薄型指紋辨識器封裝構造100係另包含有一底部填充膠140，該底部填充膠140係形成於該基板110與該指紋辨識晶片120之間且包覆該凸塊124。Referring to FIGS. 2 and 3, the first protective layer 113 is formed on the first surface 112a of the first circuit layer 112". The first protective layer 113 has a plurality of first openings 113a. An opening 113a is formed to expose the inner pads 112c. Preferably, the substrate 110 further includes a second protective layer 114. The second protective layer 114 is formed on the second surface of the second circuit layer 112". 112b, the second protective layer 114 has a plurality of second openings 114a, and the second openings 114a expose the external pads 112d. The fingerprint identification chip 120 is electrically connected to the inner pads 112c. The fingerprint identification chip 120 has an active surface 121, a back surface 122, a sensing area 123 and a plurality of bumps 124. The sensing area 123 is Formed on the active surface 121, the window 111c of the dielectric layer 111 is exposed to the sensing region 123. The bumps 124 are formed on the active surface 121 and the bumps 124 are located in the sensing region 123. The bumps 124 are electrically connected to the inner pads 112c, wherein the bumps 124 are permeable to an Antisotropic Conductive Paste (ACP) or a Non-Conductive Paste (NCP). The contact-type thin fingerprint reader package structure 100 further includes an underfill adhesive 140 formed on the substrate 110 and the fingerprint identification. The bumps 124 are wrapped between the wafers 120.

請參閱第2及4圖，該金屬板130係藉由銲料、凸塊或異方性導電膠電性連接該基板110之該些靜電導接墊112e，該金屬板130係具有一觸滑表面131，該觸滑表面131係鄰近該指紋辨識晶片120之該感測區123，且該介電層111之該窗口111c係顯露該觸滑表面131，其中該指紋辨識晶片120之該感測區123及該金屬板130之該觸滑表面131係位於該觸滑區100a，且該介電層111之該窗口111c係顯露該指紋辨識晶片120之該感測區123及該金屬板130之該觸滑表面131，該第二線路層112”之該些外接墊112d係位於該導接部100b，請參閱第1、2及5圖，在本實施例中，該金屬板130係具有一凹穴132，該凹穴132係形成於該觸滑表面131，該指紋辨識晶片120係容設於該凹穴132內，較佳地，該指紋辨識晶片120之該主動面121係與該金屬板130之該觸滑表面131平齊，以利手指接觸該觸滑式薄型指紋辨識器封裝構造100之該觸滑區100a與該指紋辨識晶片120之該感測區123時，可藉由觸摸該觸滑區100a內之該金屬板130之該觸滑表面131靜電放電。在本實施例中，請參閱第5及6圖，該凹穴132係貫穿該金屬板130，且該凹穴132係顯露該指紋辨識晶片120之該背面122，此外，請再參閱第1圖，該介電層111之該窗口111c係具有二長側邊111d，該些長側邊111d之間係具有一間距D，該金屬板130係具有一寬度W，該間距D係不大於該寬度W。Referring to FIGS. 2 and 4, the metal plate 130 is electrically connected to the electrostatic conductive pads 112e of the substrate 110 by solder, bumps or anisotropic conductive adhesive. The metal plate 130 has a sliding surface. The touch-sliding surface 131 is adjacent to the sensing region 123 of the fingerprint recognition chip 120, and the window 111c of the dielectric layer 111 exposes the touch-sliding surface 131, wherein the sensing area of the fingerprint recognition chip 120 The sliding surface 131 of the metal plate 130 is located in the touch-slip area 100a, and the window 111c of the dielectric layer 111 exposes the sensing area 123 of the fingerprint recognition chip 120 and the metal plate 130. The contact pad surface 131, the external pads 112d of the second circuit layer 112" are located in the guiding portion 100b, please refer to Figures 1, 2 and 5, in the embodiment, the metal plate 130 has a concave The hole 132 is formed on the touch surface 131, and the fingerprint recognition chip 120 is received in the cavity 132. Preferably, the active surface 121 of the fingerprint identification chip 120 is attached to the metal plate. The touch-sliding surface 131 of the 130 is flush to facilitate contact of the finger with the touch-slip thin fingerprint reader package structure 100 When the sliding zone 100a and the sensing area 123 of the fingerprint recognition chip 120 are electrostatically discharged by touching the sliding surface 131 of the metal plate 130 in the touch-slip zone 100a, in this embodiment, please refer to 5 and 6, the recess 132 extends through the metal plate 130, and the recess 132 reveals the back surface 122 of the fingerprint identification wafer 120. Further, please refer to FIG. 1, the window of the dielectric layer 111. The 111c has two long sides 111d, and the long sides 111d have a spacing D therebetween. The metal plate 130 has a width W, and the spacing D is not greater than the width W.

請參閱第7圖，該觸滑式薄型指紋辨識器封裝構造100係另包含有一殼體150，該殼體150係至少罩蓋該金屬板130，在本實施例中，該殼體150係同時罩蓋該指紋辨識晶片120之該背面122，該殼體150之材質係選自於高分子材料(如封膠體)或金屬材料(如金屬蓋)，該些外接墊112d係位於該基板110之二側，該觸滑式薄型指紋辨識器封裝構造100之該導接部100b係可雙邊彎折包覆該殼體150，且至少一外接墊112d係位於該殼體150下方。或，請參閱第8圖，該些外接墊112d係位於該基板110之同一側，該導接部100b係可單邊彎折包覆該殼體150。Referring to FIG. 7, the touch-slip thin fingerprint reader package structure 100 further includes a housing 150 that covers at least the metal plate 130. In the embodiment, the housing 150 is simultaneously Covering the back surface 122 of the fingerprint identification chip 120, the material of the housing 150 is selected from a polymer material (such as a sealant) or a metal material (such as a metal cover), and the external pads 112d are located on the substrate 110. On the two sides, the guiding portion 100b of the touch-slip thin fingerprint reader package structure 100 can be double-wrapped to cover the housing 150, and at least one external pad 112d is located below the housing 150. Or, referring to FIG. 8 , the external pads 112 d are located on the same side of the substrate 110 , and the guiding portion 100 b can be bent and wrapped around the casing 150 .

此外，請參閱第9圖，其係為本發明之一第二具體實施例之上視圖，係揭示另一種觸滑式薄型指紋辨識器封裝構造200，請參閱第9及10圖，該觸滑式薄型指紋辨識器封裝構造200係包含有一基板210、一指紋辨識晶片220以及一金屬板230，在本實施例中，該基板210係為單一線路層，該基板210係包含一介電層211、一第一線路層212以及一第一保護層213，該介電層211係具有一上表面211a、一下表面211b及一貫穿該上表面211a與該下表面211b之窗口211c，請參閱第9、10及11圖，該第一線路層212係具有一第一表面212a、複數個內接墊212b、複數個外接墊212c及複數個靜電導接墊212d，該些內接墊212b係形成於該介電層211之該下表面211b，該些靜電導接墊212d係鄰近該介電層211之該窗口211c，該第一保護層213係形成於該第一線路層212之該第一表面212a，該第一保護層213係具有複數個第一開口213a，該些第一開口213a係顯露該些內接墊212b，請參閱第12圖，該介電層211係具有複數個第三開口211d，該些第三開口211d係顯露該些外接墊212c。In addition, referring to FIG. 9 , which is a top view of a second embodiment of the present invention, another touch-slip thin fingerprint reader package structure 200 is disclosed. Please refer to FIGS. 9 and 10 for the touch-slip. The thin-type fingerprint identifier package structure 200 includes a substrate 210, a fingerprint identification wafer 220, and a metal plate 230. In the embodiment, the substrate 210 is a single circuit layer, and the substrate 210 includes a dielectric layer 211. a first circuit layer 212 and a first protective layer 213. The dielectric layer 211 has an upper surface 211a, a lower surface 211b, and a window 211c extending through the upper surface 211a and the lower surface 211b. The first circuit layer 212 has a first surface 212a, a plurality of inner pads 212b, a plurality of external pads 212c, and a plurality of electrostatic pads 212d. The inner pads 212b are formed on the first circuit layer 212. The lower surface 211b of the dielectric layer 211, the electrostatic conductive pads 212d are adjacent to the window 211c of the dielectric layer 211, and the first protective layer 213 is formed on the first surface of the first circuit layer 212. 212a, the first protective layer 213 has a plurality of first openings 21 3a, the first openings 213a expose the inner pads 212b. Referring to FIG. 12, the dielectric layer 211 has a plurality of third openings 211d, and the third openings 211d expose the external pads 212c. .

請再參閱第10圖，該指紋辨識晶片220係電性連接該些內接墊212b，該指紋辨識晶片220係具有一主動面221、一背面222、一感測區223及複數個凸塊224，該感測區223係形成於該主動面221，且該介電層211之該窗口211c係顯露該感測區223，請再參閱第10及11圖，該金屬板230係藉由銲料、凸塊或異方性導電膠電性連接該基板210之該些靜電導接墊212d，該金屬板230係具有一觸滑表面231，該觸滑表面231係鄰近該指紋辨識晶片220之該感測區223，且該介電層211之該窗口211c係顯露該觸滑表面231，請參閱第12及13圖，該金屬板230係具有一凹穴232，該凹穴232係形成於該觸滑表面231，且該凹穴232係貫穿該金屬板230，該指紋辨識晶片220係容設於該凹穴232內且該凹穴232係顯露該指紋辨識晶片220之該背面222，較佳地，該指紋辨識晶片220之該主動面221係與該金屬板230之該觸滑表面231平齊，以利手指接觸該指紋辨識晶片220之該感測區223時，可藉由觸摸該金屬板230之該觸滑表面231靜電放電。Referring to FIG. 10 , the fingerprint identification chip 220 is electrically connected to the inner pads 212 b . The fingerprint recognition chip 220 has an active surface 221 , a back surface 222 , a sensing region 223 , and a plurality of bumps 224 . The sensing region 223 is formed on the active surface 221, and the window 211c of the dielectric layer 211 exposes the sensing region 223. Referring to FIGS. 10 and 11, the metal plate 230 is soldered. The bump or the anisotropic conductive adhesive is electrically connected to the electrostatic conductive pads 212d of the substrate 210. The metal plate 230 has a touch surface 231 adjacent to the fingerprint recognition chip 220. The measuring area 223, and the window 211c of the dielectric layer 211 reveals the touch-sliding surface 231. Referring to Figures 12 and 13, the metal plate 230 has a recess 232 formed in the touch. Sliding surface 231, and the recess 232 is inserted through the metal plate 230. The fingerprint identification chip 220 is received in the recess 232 and the recess 232 exposes the back surface 222 of the fingerprint recognition wafer 220. Preferably, the recess 232 is formed. The active surface 221 of the fingerprint recognition wafer 220 is flush with the touch surface 231 of the metal plate 230 to facilitate Means contacting the wafer 220, the fingerprint sensing area 223 may be a metal plate 230 by touching the slide contact surface 231 of the electrostatic discharge.

本發明之保護範圍當視後附之申請專利範圍所界定者為準，任何熟知此項技藝者，在不脫離本發明之精神和範圍內所作之任何變化與修改，均屬於本發明之保護範圍。The scope of the present invention is defined by the scope of the appended claims, and any changes and modifications made by those skilled in the art without departing from the spirit and scope of the invention are within the scope of the present invention. .

10．．．指紋辨識器封裝構造10. . . Fingerprint reader package construction

11．．．基板11. . . Substrate

11a．．．上表面11a. . . Upper surface

11b．．．下表面11b. . . lower surface

12．．．半導體晶片12. . . Semiconductor wafer

12a．．．指紋感測表面12a. . . Fingerprint sensing surface

13．．．封膠體13. . . Sealant

100．．．觸滑式薄型指紋辨識器封裝構造100. . . Touch-slip thin fingerprint reader package construction

100a．．．觸滑區100a. . . Touch zone

100b．．．導接部100b. . . Guide

110．．．基板110. . . Substrate

111．．．介電層111. . . Dielectric layer

111a．．．上表面111a. . . Upper surface

111b．．．下表面111b. . . lower surface

111c．．．窗口111c. . . window

111d．．．長側邊111d. . . Long side

112．．．線路層112. . . Circuit layer

112’．．．第一線路層112’. . . First circuit layer

112”．．．第二線路層112"...second circuit layer

112a．．．第一表面112a. . . First surface

112b．．．第二表面112b. . . Second surface

112c．．．內接墊112c. . . Inner pad

112d．．．外接墊112d. . . External pad

112e．．．靜電導接墊112e. . . Electrostatic lead pad

113．．．第一保護層113. . . First protective layer

113a．．．第一開口113a. . . First opening

114．．．第二保護層114. . . Second protective layer

114a．．．第二開口114a. . . Second opening

120．．．指紋辨識晶片120. . . Fingerprint identification chip

121．．．主動面121. . . Active surface

122．．．背面122. . . back

123．．．感測區123. . . Sensing area

124．．．凸塊124. . . Bump

130．．．金屬板130. . . Metal plate

131．．．觸滑表面131. . . Sliding surface

132．．．凹穴132. . . Pocket

140．．．底部填充膠140. . . Underfill

150．．．殼體150. . . case

200．．．觸滑式薄型指紋辨識器封裝構造200. . . Touch-slip thin fingerprint reader package construction

210．．．基板210. . . Substrate

211．．．介電層211. . . Dielectric layer

211a．．．上表面211a. . . Upper surface

211b．．．下表面211b. . . lower surface

211c．．．窗口211c. . . window

211d．．．第三開口211d. . . Third opening

212．．．第一線路層212. . . First circuit layer

212a．．．第一表面212a. . . First surface

212b．．．內接墊212b. . . Inner pad

212c．．．外接墊212c. . . External pad

212d．．．靜電導接墊212d. . . Electrostatic lead pad

213．．．第一保護層213. . . First protective layer

213a．．．第一開口213a. . . First opening

220．．．指紋辨識晶片220. . . Fingerprint identification chip

221．．．主動面221. . . Active surface

222．．．背面222. . . back

223．．．感測區223. . . Sensing area

224．．．凸塊224. . . Bump

230．．．金屬板230. . . Metal plate

231．．．觸滑表面231. . . Sliding surface

232．．．凹穴232. . . Pocket

D．．．間距D. . . spacing

W．．．寬度W. . . width

第1圖：依據本發明之一第一具體實施例，一種觸滑式薄型指紋辨識器封裝構造之立體分解圖。1 is an exploded perspective view showing a package structure of a slide-slip thin fingerprint reader according to a first embodiment of the present invention.

第2圖：依據本發明之一第一具體實施例，該觸滑式薄型指紋辨識器封裝構造之上視圖。2 is a top view of the touch-slip thin fingerprint reader package structure according to a first embodiment of the present invention.

第3圖：依據本發明之一第一具體實施例，該觸滑式薄型指紋辨識器封裝構造沿第2圖A－A方向之截面示意圖。Figure 3 is a cross-sectional view of the touch-slip thin fingerprint reader package structure taken along line A-A of Figure 2, in accordance with a first embodiment of the present invention.

第4圖：依據本發明之一第一具體實施例，該觸滑式薄型指紋辨識器封裝構造沿第2圖B－B方向之截面示意圖。Figure 4 is a cross-sectional view of the touch-slip thin fingerprint reader package structure taken along line B-B of Figure 2, in accordance with a first embodiment of the present invention.

第5圖：依據本發明之一第一具體實施例，該觸滑式薄型指紋辨識器封裝構造沿第2圖C－C方向之另一截面示意圖。Figure 5 is a cross-sectional view of the touch-slip thin fingerprint reader package structure taken along line C-C of Figure 2, in accordance with a first embodiment of the present invention.

第6圖：依據本發明之一第一具體實施例，該觸滑式薄型指紋辨識器封裝構造沿第2圖D－D方向之另一截面示意圖。Figure 6 is a cross-sectional view of the touch-slip thin fingerprint reader package structure taken along line D-D of Figure 2, in accordance with a first embodiment of the present invention.

第7圖：依據本發明之一第一具體實施例，該觸滑式薄型指紋辨識器封裝構造之導接部雙邊彎折包覆殼體之截面示意圖。FIG. 7 is a cross-sectional view showing the guide portion of the touch-slip thin fingerprint reader package structure bilaterally bending the cover case according to the first embodiment of the present invention.

第8圖：依據本發明之一第一具體實施例，該觸滑式薄型指紋辨識器封裝構造之導接部單邊彎折包覆殼體之截面示意圖。FIG. 8 is a cross-sectional view showing the guide portion of the touch-slip thin fingerprint reader package structure unilaterally bending and covering the casing according to the first embodiment of the present invention.

第9圖：依據本發明之一第二具體實施例，另一種觸滑式薄型指紋辨識器封裝構造之上視圖。Figure 9 is a top plan view of another touch-slip thin fingerprint reader package configuration in accordance with a second embodiment of the present invention.

第10圖：依據本發明之一第二具體實施例，該觸滑式薄型指紋辨識器封裝構造沿第9圖E－E方向之截面示意圖。Figure 10 is a cross-sectional view of the touch-slip thin fingerprint reader package structure taken along the line E-E of Figure 9 in accordance with a second embodiment of the present invention.

第11圖：依據本發明之一第二具體實施例，該觸滑式薄型指紋辨識器封裝構造沿第9圖F－F方向之截面示意圖。11 is a cross-sectional view of the touch-slip thin fingerprint reader package structure taken along line F-F of FIG. 9 according to a second embodiment of the present invention.

第12圖：依據本發明之一第二具體實施例，該觸滑式薄型指紋辨識器封裝構造沿第9圖G－G方向之截面示意圖。Figure 12 is a cross-sectional view of the touch-slip thin fingerprint reader package structure taken along the line G-G of Figure 9 in accordance with a second embodiment of the present invention.

第13圖：依據本發明之一第二具體實施例，該觸滑式薄型指紋辨識器封裝構造沿第9圖H－H方向之截面示意圖。Figure 13 is a cross-sectional view of the touch-slip thin fingerprint reader package structure taken along the line H-H of Figure 9 in accordance with a second embodiment of the present invention.

第14圖：習知指紋辨識器封裝構造之截面示意圖。Figure 14: A schematic cross-sectional view of a conventional fingerprint identifier package construction.

100．．．觸滑式薄型指紋辨識器封裝構造100. . . Touch-slip thin fingerprint reader package construction

111c．．．窗口111c. . . window

112c．．．內接墊112c. . . Inner pad

112d．．．外接墊112d. . . External pad

112e．．．靜電導接墊112e. . . Electrostatic lead pad

113a．．．第一開口113a. . . First opening

114a．．．第二開口114a. . . Second opening

121．．．主動面121. . . Active surface

123．．．感測區123. . . Sensing area

131．．．觸滑表面131. . . Sliding surface

Claims (17)

一種觸滑式薄型指紋辨識器封裝構造，其係定義有一觸滑區及一導接部，其係包含：一基板，其係包含：一介電層，其係具有一上表面、一下表面及一貫穿該上表面與該下表面之窗口；一線路層，其係具有一第一表面、複數個內接墊及複數個外接墊，該些內接墊係形成於該介電層之該下表面；以及一第一保護層，其係形成於該線路層之該第一表面，該第一保護層係具有複數個第一開口，該些第一開口係顯露該些內接墊；一指紋辨識晶片，其係電性連接該些內接墊，該指紋辨識晶片係具有一主動面、一背面及一感測區，該感測區係形成於該主動面，且該介電層之該窗口係顯露該感測區；以及一金屬板，其係電性連接該基板，該金屬板係具有一觸滑表面，該觸滑表面係鄰近該指紋辨識晶片之該感測區，且該介電層之該窗口係顯露該觸滑表面；其中該指紋辨識晶片之該感測區及該金屬板之該觸滑表面係位於該觸滑區，該線路層之該些外接墊係位於該導接部。 A touch-slip thin fingerprint reader package structure defining a touch-slip area and a guiding portion, comprising: a substrate comprising: a dielectric layer having an upper surface, a lower surface, and a window extending through the upper surface and the lower surface; a circuit layer having a first surface, a plurality of interconnect pads, and a plurality of external pads formed under the dielectric layer And a first protective layer formed on the first surface of the circuit layer, the first protective layer having a plurality of first openings, the first openings exposing the inner pads; a fingerprint The identification chip is electrically connected to the inner pads. The fingerprint identification chip has an active surface, a back surface and a sensing area. The sensing area is formed on the active surface, and the dielectric layer is a window is exposed to the sensing region; and a metal plate electrically connected to the substrate, the metal plate having a touch surface that is adjacent to the sensing region of the fingerprint recognition chip, and the interface The window of the electrical layer reveals the touch-slip surface; wherein the finger Identification of the sensing area of the wafer and the metal plate contact surface of the slip-based sliding contact region located, the plurality of external pads are located in the circuit layer of the connecting portion. 如申請專利範圍第1項所述之觸滑式薄型指紋辨識器封裝構造，其中該線路層係包含有一第一線路層及一 第二線路層，該第一線路層係形成於該介電層之該下表面，該第二線路層係形成於該介電層之該上表面，該第二線路層係具有一第二表面，該第一線路層係具有該第一表面、至少一靜電導接墊及該些內接墊，該金屬板係電性連接該靜電導接墊。 The contact-slip thin fingerprint reader package structure according to claim 1, wherein the circuit layer comprises a first circuit layer and a a second circuit layer, the first circuit layer is formed on the lower surface of the dielectric layer, the second circuit layer is formed on the upper surface of the dielectric layer, and the second circuit layer has a second surface The first circuit layer has the first surface, at least one electrostatic conductive pad and the inner pads, and the metal plate is electrically connected to the electrostatic conductive pad. 如申請專利範圍第2項所述之觸滑式薄型指紋辨識器封裝構造，其中該些外接墊係形成於該第二線路層。 The contact-slip thin fingerprint reader package structure of claim 2, wherein the external pads are formed on the second circuit layer. 如申請專利範圍第3項所述之觸滑式薄型指紋辨識器封裝構造，其中該基板係另包含有一第二保護層，該第二保護層係形成於該第二線路層之該第二表面，該第二保護層係具有複數個第二開口，該些第二開口係顯露該些外接墊。 The contact-slip thin fingerprint reader package structure of claim 3, wherein the substrate further comprises a second protective layer, the second protective layer being formed on the second surface of the second circuit layer The second protective layer has a plurality of second openings, and the second openings expose the external pads. 如申請專利範圍第1項所述之觸滑式薄型指紋辨識器封裝構造，其中該線路層係包含有一第一線路層，該第一線路層係形成於該介電層之該下表面，該第一線路層係具有該第一表面、至少一靜電導接墊及該些內接墊，該金屬板係電性連接該靜電導接墊，該些外接墊係形成於該第一線路層。 The contact-slip thin fingerprint reader package structure of claim 1, wherein the circuit layer comprises a first circuit layer, the first circuit layer being formed on the lower surface of the dielectric layer, The first circuit layer has the first surface, at least one electrostatic conductive pad and the inner pads. The metal plate is electrically connected to the electrostatic conductive pads, and the external pads are formed on the first circuit layer. 如申請專利範圍第5項所述之觸滑式薄型指紋辨識器封裝構造，其中該介電層係具有複數個第三開口，該些第三開口係顯露該些外接墊。 The contact-slip thin fingerprint reader package structure of claim 5, wherein the dielectric layer has a plurality of third openings, and the third openings expose the external pads. 如申請專利範圍第2項所述之觸滑式薄型指紋辨識器封裝構造，其中該靜電導接墊係鄰近該介電層之該窗口。 The contact-slip thin fingerprint reader package structure of claim 2, wherein the electrostatic conductive pad is adjacent to the window of the dielectric layer. 如申請專利範圍第1項所述之觸滑式薄型指紋辨識器封裝構造，其中該指紋辨識晶片係具有至少一凸塊，該凸塊係形成於該主動面且該凸塊係位於該感測區外側，該凸塊係電性連接該內接墊。 The touch-slip thin fingerprint reader package structure of claim 1, wherein the fingerprint identification chip has at least one bump formed on the active surface and the bump is located in the sensing Outside the region, the bump is electrically connected to the inner pad. 如申請專利範圍第8項所述之觸滑式薄型指紋辨識器封裝構造，其另包含有一底部填充膠，該底部填充膠係形成於該基板與該指紋辨識晶片之間且包覆該凸塊。 The contact-slip thin fingerprint reader package structure of claim 8, further comprising an underfill glue formed between the substrate and the fingerprint recognition wafer and covering the bump . 如申請專利範圍第1項所述之觸滑式薄型指紋辨識器封裝構造，其中該金屬板係具有一凹穴，該凹穴係形成於該觸滑表面，該指紋辨識晶片係容設於該凹穴內。 The contact-slip thin fingerprint reader package structure of claim 1, wherein the metal plate has a recess, the recess is formed on the touch-sliding surface, and the fingerprint identification chip is received in the Inside the pocket. 如申請專利範圍第10項所述之觸滑式薄型指紋辨識器封裝構造，其中該凹穴係貫穿該金屬板，該凹穴係顯露該指紋辨識晶片之該背面。 The contact-slip thin fingerprint reader package structure of claim 10, wherein the recess extends through the metal plate, the recess revealing the back surface of the fingerprint recognition chip. 如申請專利範圍第1項所述之觸滑式薄型指紋辨識器封裝構造，其中該指紋辨識晶片之該主動面係與該金屬板之該觸滑表面平齊。 The contact-slip thin fingerprint reader package structure of claim 1, wherein the active surface of the fingerprint recognition wafer is flush with the touch surface of the metal plate. 如申請專利範圍第1項所述之觸滑式薄型指紋辨識器封裝構造，其中該介電層之該窗口係具有二長側邊，該些長側邊之間係具有一間距，該金屬板係具有一寬度，該間距係不大於該寬度。 The contact-slip thin fingerprint reader package structure of claim 1, wherein the window of the dielectric layer has two long sides, and the long sides have a spacing between the metal plates. There is a width which is not greater than the width. 如申請專利範圍第1項所述之觸滑式薄型指紋辨識器封裝構造，其另包含有一殼體，該殼體係至少罩蓋該 金屬板。 The contact-slip thin fingerprint reader package structure of claim 1, further comprising a housing that covers at least the cover Metal plate. 如申請專利範圍第14項所述之觸滑式薄型指紋辨識器封裝構造，其中該殼體係罩蓋該指紋辨識晶片之該背面。 The contact-slip thin fingerprint reader package construction of claim 14, wherein the housing covers the back side of the fingerprint recognition wafer. 如申請專利範圍第14項所述之觸滑式薄型指紋辨識器封裝構造，其中該殼體之材質係選自於高分子材料或金屬材料。 The contact-slip thin fingerprint reader package structure according to claim 14, wherein the material of the housing is selected from a polymer material or a metal material. 如申請專利範圍第14項所述之觸滑式薄型指紋辨識器封裝構造，其中該導接部係彎折包覆該殼體，且至少一外接墊係位於該殼體下方。The contact-slip thin fingerprint reader package structure of claim 14, wherein the guiding portion is bent to cover the housing, and at least one external pad is located below the housing.
TW096132635A 2007-08-31 2007-08-31 Sliding type thin fingerprint sensor package TWI408782B (en)

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TWI243437B (en) * 2004-04-14 2005-11-11 Advanced Semiconductor Eng Sliding type thin fingerprint sensor package
TWI250465B (en) * 2004-08-11 2006-03-01 Advanced Semiconductor Eng Fingerprint sensor package with electrostatic discharge on chip
TWI256141B (en) * 2005-06-06 2006-06-01 Chipmos Technologies Inc Optoelectronic chip package and method for manufacturing the same
TW200701094A (en) * 2005-06-29 2007-01-01 Lightuning Tech Inc Structure of sweep -type fingerprint sensing chip capable of resisting electrostatic discharge (esd) and method of fabricating the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW591769B (en) * 2003-05-20 2004-06-11 Advanced Semiconductor Eng Contact sensor package
TWI243437B (en) * 2004-04-14 2005-11-11 Advanced Semiconductor Eng Sliding type thin fingerprint sensor package
TWI250465B (en) * 2004-08-11 2006-03-01 Advanced Semiconductor Eng Fingerprint sensor package with electrostatic discharge on chip
TWI256141B (en) * 2005-06-06 2006-06-01 Chipmos Technologies Inc Optoelectronic chip package and method for manufacturing the same
TW200701094A (en) * 2005-06-29 2007-01-01 Lightuning Tech Inc Structure of sweep -type fingerprint sensing chip capable of resisting electrostatic discharge (esd) and method of fabricating the same

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