TWI408329B - Heat transfer micro-channel and heat sink and manufacturing method thereof - Google Patents
Heat transfer micro-channel and heat sink and manufacturing method thereof Download PDFInfo
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本發明係有關於一種微型熱交換管結構、散熱元件及其製造方法，且特別係有關於管內具有三角形凹孔的微型熱交換管結構、散熱元件及其製造方法。The present invention relates to a micro heat exchange tube structure, a heat dissipating member, and a method of manufacturing the same, and particularly to a micro heat exchange tube structure having a triangular recessed hole in the tube, a heat dissipating member, and a method of manufacturing the same.
請參照第1圖，其顯示依照現有之微型熱交換管900的剖面示意圖，其係由Kuo及Peles在Int. J. Heat and Mass Transfer中所發表。此微型熱交換管900可設置於欲散熱或冷卻的區域或元件的表面上，以進行熱交熱。熱交換管900的管徑寬度約為200μm，用以供一工作流體通過此微型熱交換管900，微型熱交換管900的管壁901形成有多個圓形凹孔902，其係利用通孔903來連通於微型熱交換管900中，圓形凹孔902的直徑約為50μm。當進行熱交熱時，微型熱交換管900的圓形凹孔902中可因高溫而產生氣泡，氣泡會由圓形凹孔902脫離至熱交換管900內，並由流動於熱交換管900內的工作流體來帶走氣泡，而達到熱交熱的效果。Referring to Fig. 1, there is shown a cross-sectional view of a conventional micro heat exchange tube 900, which is published by Kuo and Peles in Int. J. Heat and Mass Transfer. The micro heat exchange tube 900 may be disposed on a surface of an area or component to be cooled or cooled for heat exchange. The heat exchange tube 900 has a tube diameter of about 200 μm for supplying a working fluid through the micro heat exchange tube 900. The tube wall 901 of the micro heat exchange tube 900 is formed with a plurality of circular recessed holes 902, which utilize through holes. 903 is connected to the micro heat exchange tube 900, and the circular recess 902 has a diameter of about 50 μm. When hot heat is applied, bubbles may be generated in the circular recess 902 of the micro heat exchange tube 900 due to high temperature, and the bubbles may be detached from the circular recess 902 into the heat exchange tube 900 and flowed through the heat exchange tube 900. The working fluid inside takes away the air bubbles and achieves the effect of heat communication.
然而，相較於圓形凹孔902的直徑(50μm)，由於熱交換管900的管壁901及圓形凹孔902之間的通孔903過於狹長(約寬7.5μm、長27.8μm)，因此，在圓形凹孔902中所產生的氣泡不易脫離至熱交換管900內，使得氣泡容易在圓形凹孔902中堆積而產生過熱點，因而影響整體熱交熱和冷卻的效果。However, compared with the diameter (50 μm) of the circular recess 902, since the through hole 903 between the tube wall 901 of the heat exchange tube 900 and the circular recess 902 is too long (about 7.5 μm wide and 27.8 μm long), Therefore, the bubbles generated in the circular recessed holes 902 are not easily detached into the heat exchange tubes 900, so that the bubbles are easily accumulated in the circular recessed holes 902 to generate hot spots, thereby affecting the effect of overall heat exchange and cooling.
因此本發明之一方面係在於提供一種具有微型熱交換管結構，藉以形成三角形凹孔於管壁上，因而可促進氣泡的產生，並確保氣泡可順利地脫離至管內，而被工作流體帶走。Therefore, an aspect of the present invention is to provide a micro heat exchange tube structure, thereby forming a triangular recessed hole in the wall of the tube, thereby promoting the generation of air bubbles, and ensuring that the air bubbles can be smoothly detached into the tube, and the working fluid is carried. go.
本發明之另一方面係在於提供一種微型熱交換管結構的散熱元件，藉以對微型元件進行散熱或冷卻，並可大幅地提升熱傳效率。Another aspect of the present invention is to provide a heat dissipating member of a micro heat exchange tube structure, whereby heat dissipating or cooling the micro component, and greatly improving heat transfer efficiency.
本發明之另一方面係在於提供一種散熱元件的製造方法，藉以快速且簡易地形成微型熱交換管結構於散熱元件中。Another aspect of the present invention is to provide a method of manufacturing a heat dissipating member, whereby a micro heat exchange tube structure is formed in a heat dissipating member quickly and easily.
根據本發明之實施例，本發明之微型熱交換管結構包含管體和複數個三角形凹孔，三角形凹孔係形成於管體內的管壁上，其中每一三角形凹孔的開孔角度係小180度。According to an embodiment of the present invention, the micro heat exchange tube structure of the present invention comprises a tube body and a plurality of triangular recessed holes formed in the tube wall of the tube body, wherein each of the triangular recessed holes has a small opening angle 180 degree.
又，根據本發明之實施例，本發明之散熱元件包含底部、中間本體、上蓋及複數個熱交換管。中間本體係設置於底部上，上蓋係設置於中間本體上，熱交換管係形成於中間本體中，其中每一熱交換管包括複數個三角形凹孔，其形成於每一熱交換管的管壁上，每一三角形凹孔的開孔角度係小180度。Further, according to an embodiment of the present invention, the heat dissipating member of the present invention comprises a bottom portion, an intermediate body, an upper cover, and a plurality of heat exchange tubes. The intermediate system is disposed on the bottom, the upper cover is disposed on the intermediate body, and the heat exchange tube is formed in the intermediate body, wherein each heat exchange tube includes a plurality of triangular recesses formed in the wall of each heat exchange tube Above, the opening angle of each triangular recess is 180 degrees smaller.
又，根據本發明之實施例，本發明之散熱元件的製造方法包含下列步驟：提供底部；形成中間本體和上蓋，其中上蓋係設置於中間本體上，中間本體具有複數個微槽道；以及設置中間本體及上蓋於底部上，以形成複數個熱交換管於中間本體中，其中每一熱交換管包括複數個三角形凹孔，其形成於每一熱交換管的管壁上，每一三角形凹孔的開孔角度係小180度。Further, according to an embodiment of the present invention, a method of manufacturing a heat dissipating member of the present invention comprises the steps of: providing a bottom portion; forming an intermediate body and an upper cover, wherein the upper cover is disposed on the intermediate body, the intermediate body has a plurality of microchannels; and The intermediate body and the upper cover are on the bottom to form a plurality of heat exchange tubes in the intermediate body, wherein each heat exchange tube comprises a plurality of triangular recessed holes formed on the wall of each heat exchange tube, each triangular concave The opening angle of the hole is 180 degrees smaller.
因此，本發明的具有微型熱交換管結構的散熱元件可形成三角形凹孔於熱交換管的管壁上，以促進氣泡的產生，且氣泡可輕易由三角形凹孔脫離至熱交換管內，而可確實地被工作流體帶走，達到熱交換效果。且本發明更可利用高熱傳導係數的鑽石薄膜及摻有多壁奈米碳管的去離子水溶液來提升熱傳效率，以提升熱交換、冷卻及散熱效果。再者，本發明之散熱元件的製造方法可具有低製程成本以及步驟簡易的功效。Therefore, the heat dissipating member having the micro heat exchange tube structure of the present invention can form a triangular recessed hole on the wall of the heat exchange tube to promote the generation of bubbles, and the bubble can be easily separated from the triangular recessed hole into the heat exchange tube, and It can be surely carried away by the working fluid to achieve heat exchange. Moreover, the invention can utilize the diamond film with high thermal conductivity and the deionized water solution doped with multi-walled carbon nanotubes to improve the heat transfer efficiency, thereby improving the heat exchange, cooling and heat dissipation effects. Furthermore, the method of manufacturing the heat dissipating component of the present invention can have low process cost and simple steps.
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂，本說明書將特舉出一系列實施例來加以說明。但值得注意的係，此些實施例只係用以說明本發明之實施方式，而非用以限定本發明。The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood. It is to be understood that the embodiments are merely illustrative of the embodiments of the invention and are not intended to limit the invention.
請參照第2圖，其顯示依照本發明之一實施例之散熱元件的正面示意圖。本實施例之微型熱交換管結構110可形成於散熱元件100中，以進行熱交換。此散熱元件100可設置於特定的微型元件或區域的表面上及/或附近區域，以進行熱交換、散熱或冷卻。例如，散熱元件100可設置於電子元件(如處理器)的表面上及/或附近區域，以傳導電子元件所產生的熱量，確保電子元件的性能。因此，散熱元件100可作為散熱元件或冷卻元件。Please refer to FIG. 2, which shows a front view of a heat dissipating component in accordance with an embodiment of the present invention. The micro heat exchange tube structure 110 of the present embodiment may be formed in the heat dissipating member 100 for heat exchange. The heat dissipating component 100 can be disposed on and/or near a surface of a particular microcomponent or region for heat exchange, heat dissipation, or cooling. For example, the heat dissipating component 100 can be disposed on and/or near a surface of an electronic component (such as a processor) to conduct heat generated by the electronic component to ensure performance of the electronic component. Therefore, the heat dissipating member 100 can function as a heat dissipating member or a cooling member.
如第2圖所示，本實施例的散熱元件100包含微型熱交換管結構110、底部120、中間本體130及上蓋140。微型熱交換管結構110係形成於底部120、中間本體130及上蓋140之間，中間本體130開設有複數個微槽道或通孔，底部120與上蓋140係設置於中間本體130上下相對兩側，以形成微型熱交換管結構110。As shown in FIG. 2, the heat dissipating component 100 of the present embodiment includes a micro heat exchange tube structure 110, a bottom portion 120, an intermediate body 130, and an upper cover 140. The micro heat exchange tube structure 110 is formed between the bottom portion 120, the intermediate body 130 and the upper cover 140. The intermediate body 130 is provided with a plurality of micro channels or through holes. The bottom portion 120 and the upper cover 140 are disposed on the upper and lower sides of the intermediate body 130. To form a micro heat exchange tube structure 110.
如第2圖所示，本實施例的散熱元件100的底部120，可直接接觸於欲散熱之特定元件或區域的表面上及/或附近區域，以傳導熱量來進交換。底部120較佳係具有良好導熱效率的材料所製成，例如金屬。在本實施例中，底部120包括金屬層121和鑽石薄膜122，金屬層121可用以直接接觸於欲散熱之特定元件或區域的表面上及/或附近區域，鑽石薄膜122可接合於中間本體130。金屬層121例如為銅片，其厚度可約為200μm。鑽石薄膜122可利用化學氣相沈積法(CVD)來形成於金屬層121上，其厚度可小於等於10μm，較佳為2μm，以改善熱傳效果以及工作流體在底部120上的接觸角。相較於單一銅片的熱傳導係數約為400W/mK，本實施例之底部120的鑽石薄膜122的熱傳導係數可約為2300W/mK，因而可大幅提升底部120的熱傳導性。As shown in FIG. 2, the bottom portion 120 of the heat dissipating component 100 of the present embodiment can directly contact the surface and/or the vicinity of a particular component or region to be dissipated to conduct heat for exchange. The bottom portion 120 is preferably made of a material having good thermal conductivity, such as a metal. In the present embodiment, the bottom portion 120 includes a metal layer 121 and a diamond film 122 that can be used to directly contact a surface and/or a nearby region of a particular component or region to be dissipated, and the diamond film 122 can be bonded to the intermediate body 130. . The metal layer 121 is, for example, a copper sheet and may have a thickness of about 200 μm. The diamond film 122 may be formed on the metal layer 121 by chemical vapor deposition (CVD), and may have a thickness of 10 μm or less, preferably 2 μm, to improve the heat transfer effect and the contact angle of the working fluid on the bottom portion 120. Compared with the heat conductivity coefficient of a single copper sheet of about 400 W/mK, the diamond film 122 of the bottom portion 120 of the present embodiment may have a heat transfer coefficient of about 2300 W/mK, thereby greatly improving the thermal conductivity of the bottom portion 120.
如第2圖所示，本實施例的散熱元件100的中間本體130和上蓋140係形成於底部120上。在本實施例中，中間本體130和上蓋140可具有相同的材料，例如為聚雙甲基矽氧烷(Poly-dimethylsiloxane，PDMS)，並可為一體成型。然不限於此，在其他實施例中，中間本體130和上蓋140亦可分別為不同的材料，且亦可為個別單獨的結構。中間本體130的厚度可約為100μm，上蓋140的厚度可約為2mm。As shown in FIG. 2, the intermediate body 130 and the upper cover 140 of the heat dissipating member 100 of the present embodiment are formed on the bottom portion 120. In this embodiment, the intermediate body 130 and the upper cover 140 may have the same material, such as poly-dimethylsiloxane (PDMS), and may be integrally formed. However, in other embodiments, the intermediate body 130 and the upper cover 140 may also be different materials, and may also be individual structures. The intermediate body 130 may have a thickness of about 100 μm, and the upper cover 140 may have a thickness of about 2 mm.
請參照第3圖和第4圖，第3圖顯示依照本發明之一實施例之散熱元件的上視剖面圖，第4圖顯示依照本發明之一實施例之散熱元件的部分立體圖。本實施例之微型熱交換管結構110可應用於微型元件的熱交換或散熱中，因而微型熱交換管110之管徑的開口尺寸(管的寬度或高度)較佳係小於1mm，例如為數百微米(μm)。微型熱交換管結構110(管體)係開設於中間本體130中，並可由底部120、中間本體130及上蓋140來共同定義出微型熱交換管結構110的管體。在本實施例中，散熱元件100可例如具有75個熱交換管110，此些熱交換管110可為直線型矩形交換管，其可水平地排列於中間本體130的區域上，些熱交換管110之間的設置間距約為200μm。每一熱交換管110的長度約為30mm，寬度可約為200μm，高度可相同於中間本體130的厚度(100μm)。每一熱交換管110包括複數個三角形凹孔111，其形成於熱交換管110內的管壁112上，用以產生氣泡來進行熱交換，其中每一三角形凹孔111的開孔角度θ係小於180度，例如為60度、90度或120度，較佳為90度。此開孔角度θ為凹孔111的三角形頂角角度，凹孔111的三角形底邊係平行於熱交換管110內的管壁112。三角形凹孔111係位於中間本體130的區域上，且位於每一熱交換管110的相對兩側。在管壁112之相同一側上之三角形凹孔111之間的間距約為100μm，每一三角形凹孔111的開口寬度約為50μm。Referring to Figures 3 and 4, Figure 3 is a top cross-sectional view of a heat dissipating component in accordance with an embodiment of the present invention, and Figure 4 is a partial perspective view of a heat dissipating component in accordance with an embodiment of the present invention. The micro heat exchange tube structure 110 of the present embodiment can be applied to heat exchange or heat dissipation of the micro components, and thus the opening size (tube width or height) of the tube diameter of the micro heat exchange tube 110 is preferably less than 1 mm, for example, One hundred micrometers (μm). The micro heat exchange tube structure 110 (tube body) is formed in the intermediate body 130, and the tube body of the micro heat exchange tube structure 110 can be jointly defined by the bottom portion 120, the intermediate body 130 and the upper cover 140. In this embodiment, the heat dissipating component 100 can have, for example, 75 heat exchange tubes 110, which can be linear rectangular exchange tubes, which can be horizontally arranged on the area of the intermediate body 130, and some heat exchange tubes The setting pitch between 110 is about 200 μm. Each heat exchange tube 110 has a length of about 30 mm, a width of about 200 μm, and a height equal to the thickness of the intermediate body 130 (100 μm). Each heat exchange tube 110 includes a plurality of triangular recesses 111 formed in the wall 112 of the heat exchange tube 110 for generating bubbles for heat exchange, wherein the opening angle θ of each of the triangular recesses 111 is Less than 180 degrees, for example, 60 degrees, 90 degrees or 120 degrees, preferably 90 degrees. The opening angle θ is the triangular apex angle of the recess 111, and the triangular bottom of the recess 111 is parallel to the tube wall 112 in the heat exchange tube 110. The triangular recessed holes 111 are located on the area of the intermediate body 130 and are located on opposite sides of each of the heat exchange tubes 110. The pitch between the triangular recesses 111 on the same side of the tube wall 112 is about 100 μm, and the opening width of each of the triangular recesses 111 is about 50 μm.
請參照第5A圖至第6圖，第5A圖至第5D圖顯示依照本發明之一實施例之散熱元件的製造剖面圖，第6圖顯示依照本發明之一實施例之散熱元件的製造方法流程圖。當製造本實施例之散熱元件100時，首先，提供底部120(步驟S201)。在本實施例中，可沈積鑽石薄膜122於金屬層121(銅片)上，而形成底部120。接著，形成中間本體130和上蓋140(步驟S202)。此中間本體130和上蓋140可例如利用微鑄造來一體成型，此時，如第5A圖所示，可先提供一鑄模300，此鑄模300可具有凸狀結構310，其實質對應於散熱元件100的熱交換管110，亦即凸狀結構310的尺寸大小係相同於熱交換管110的長度、寬度及厚度。此鑄模300的凸狀結構310可利用例如微顯影技術來製造於一基材(如晶圓)上。接著，如第5B圖所示，倒入一高分子材料於鑄模300的凸狀結構310上，此時，此高分子材料較佳可具有流動狀態，其可利用摻入固化劑、溫度或光線來形成固化。此高分子材料例如為PDMS，其比重約為1.08，黏性約為3900mPas。當倒入流動狀態的PDMS於鑄模300上時，PDMS可充填於凸狀結構310之間，並覆蓋於凸狀結構310上，其中充填於凸狀結構310之間的PDMS可形成中間本體130，覆蓋於凸狀結構310上的PDMS可形成上蓋140。接著，倒在鑄模300上的PDMS可被進行固化，例如以70℃來加熱1小時(hr)。固化後的PDMS可由鑄模300來脫離，因而可形成具有微槽道(對應於熱交換管110)的中間本體130以及上蓋140，如第5C圖所示。接著，如第5D圖所示，設置中間本體130以及上蓋140於底部120上(步驟S203)，因而形成散熱元件100。此時，中間本體130的表面可貼合於底部120的鑽石薄膜122上，而形成熱交換管110於底部120與上蓋140之間。因此，藉由本實施例之散熱元件的製造方法，可簡易且快速地製造具有微型熱交換管結構110的散熱元件100。由於微型熱交換管結構110可利用微鑄造來形成，因而具有低製程成本和大量製造的功效。5A to 5D, FIG. 5A to FIG. 5D are cross-sectional views showing the manufacture of a heat dissipating component according to an embodiment of the present invention, and FIG. 6 is a view showing a method of manufacturing a heat dissipating component according to an embodiment of the present invention. flow chart. When the heat dissipating member 100 of the present embodiment is manufactured, first, the bottom portion 120 is provided (step S201). In the present embodiment, a diamond film 122 may be deposited on the metal layer 121 (copper sheet) to form the bottom portion 120. Next, the intermediate body 130 and the upper cover 140 are formed (step S202). The intermediate body 130 and the upper cover 140 can be integrally formed, for example, by micro-casting. At this time, as shown in FIG. 5A, a mold 300 can be provided first. The mold 300 can have a convex structure 310, which substantially corresponds to the heat dissipating component 100. The heat exchange tubes 110, that is, the convex structures 310 are the same size as the length, width and thickness of the heat exchange tubes 110. The convex structure 310 of the mold 300 can be fabricated on a substrate such as a wafer using, for example, micro-developing techniques. Next, as shown in FIG. 5B, a polymer material is poured onto the convex structure 310 of the mold 300. At this time, the polymer material preferably has a flowing state, which can be incorporated with a curing agent, temperature or light. To form a cure. The polymer material is, for example, PDMS having a specific gravity of about 1.08 and a viscosity of about 3900 mPas. When the PDMS in the flowing state is poured onto the mold 300, the PDMS may be filled between the convex structures 310 and covered on the convex structure 310, wherein the PDMS filled between the convex structures 310 may form the intermediate body 130. The upper cover 140 may be formed by the PDMS covering the convex structure 310. Next, the PDMS poured on the mold 300 can be cured, for example, at 70 ° C for 1 hour (hr). The cured PDMS can be detached from the mold 300, so that the intermediate body 130 having the microchannels (corresponding to the heat exchange tubes 110) and the upper cover 140 can be formed as shown in Fig. 5C. Next, as shown in FIG. 5D, the intermediate body 130 and the upper cover 140 are disposed on the bottom portion 120 (step S203), thereby forming the heat dissipating member 100. At this time, the surface of the intermediate body 130 can be attached to the diamond film 122 of the bottom portion 120, and the heat exchange tube 110 is formed between the bottom portion 120 and the upper cover 140. Therefore, with the method of manufacturing the heat dissipating member of the present embodiment, the heat dissipating member 100 having the micro heat exchange tube structure 110 can be easily and quickly manufactured. Since the micro heat exchange tube structure 110 can be formed using micro-casting, it has low process cost and mass production efficiency.
請參照第3圖和第7圖，第7圖顯示依照本發明之一實施例之散熱元件的方塊示意圖，當使用本實施例的散熱元件100來進行熱交換時，工作流體係注入於散熱元件100中，並流通於熱交換管110中，藉以帶走散熱元件100的熱量。此工作流體可例如為去離子水(De-ionized Water，DI Water)、摻有多壁奈米碳管(MCNT)的去離子水溶液、或冷媒(如介電液FC-72)，其中去離子水溶液可摻有0~30體積百分比濃度(vol. %)的多壁奈米碳管，例如去離子水溶液可摻有1vol. %的多壁奈米碳管。此工作流體可重複地循環使用於散熱元件100中。此時，工作流體的流動路徑可為封閉循環的流動路徑，如第7圖所示，散熱元件100更可包括管路150和加壓元件160，管路150的兩端可分別連接於熱交換管110的入口和出口，以形成封閉循環的流體路徑，加壓元件160(例如泵浦)可設置於管路150之間，用以對工作流體進行加壓，使工作流體可持續地流動於封閉循環路徑中。因此，散熱元件100所傳導的熱量可利用流動工作流體來帶走，並在管路150中散失熱量，達到熱交換和冷卻散熱的目的。Please refer to FIG. 3 and FIG. 7. FIG. 7 is a block diagram showing a heat dissipating component according to an embodiment of the present invention. When the heat dissipating component 100 of the embodiment is used for heat exchange, a workflow system is injected into the heat dissipating component. 100, and flows through the heat exchange tube 110, thereby taking away the heat of the heat dissipating component 100. The working fluid can be, for example, De-ionized Water (DI Water), a deionized water solution doped with a multi-walled carbon nanotube (MCNT), or a refrigerant (such as a dielectric liquid FC-72), wherein deionized The aqueous solution may be doped with 0 to 30 volume percent (vol. %) of multi-walled carbon nanotubes, for example, a deionized aqueous solution may be doped with 1 vol. % of multi-walled carbon nanotubes. This working fluid can be repeatedly recycled into the heat dissipating component 100. At this time, the flow path of the working fluid may be a closed loop flow path. As shown in FIG. 7, the heat dissipating component 100 may further include a pipeline 150 and a pressurizing component 160, and both ends of the pipeline 150 may be respectively connected to the heat exchange. The inlet and outlet of the tube 110 to form a closed loop fluid path, and a pressurizing element 160 (e.g., a pump) may be disposed between the lines 150 for pressurizing the working fluid to allow the working fluid to flow continuously Closed loop path. Therefore, the heat conducted by the heat dissipating component 100 can be carried away by the flowing working fluid, and the heat is dissipated in the pipeline 150 to achieve the purpose of heat exchange and cooling.
然不限於此，在其他實施例中，流經此散熱元件100之工作流體的流動路徑亦可為開放式的流動路徑，亦即流出的散熱元件100的工作流體亦可不需再循環利用。However, in other embodiments, the flow path of the working fluid flowing through the heat dissipating component 100 may also be an open flow path, that is, the working fluid flowing out of the heat dissipating component 100 may not be recycled.
因此，本實施例之具有微型熱交換管結構110的散熱元件100可應用於例如電子元件的散熱冷卻，當使用散熱元件100時，熱量可經由底部120之高熱傳導係數的鑽石薄膜122來有效地傳導至中間本體130。接著，氣泡可形成於熱交換管110的三角形凹孔111中，由於熱交換管110內之管壁上的凹孔111是呈三角形，亦即凹孔111的開口係朝熱交換管110內的工作流體來逐漸擴大，因而形成於凹孔111中的氣泡可輕易脫離至熱交換管110中，並藉由熱交換管110中的工作流體來帶走氣泡，確實地達到熱交換效果，因而可避免氣泡不易脫離而產生過熱點的問題。且本實施例之散熱元件100更可進一步藉由高熱傳導係數的鑽石薄膜122及摻有多壁奈米碳管的去離子水溶液來提升熱傳效果，以改善熱交換及冷卻散熱效果。Therefore, the heat dissipating component 100 having the micro heat exchange tube structure 110 of the present embodiment can be applied to, for example, heat dissipation cooling of the electronic component. When the heat dissipating component 100 is used, heat can be effectively transmitted through the diamond film 122 having a high thermal conductivity of the bottom portion 120. Conducted to the intermediate body 130. Then, bubbles may be formed in the triangular recess 111 of the heat exchange tube 110, since the recess 111 in the tube wall in the heat exchange tube 110 is triangular, that is, the opening of the recess 111 is directed into the heat exchange tube 110. The working fluid is gradually enlarged, so that the bubbles formed in the recessed holes 111 can be easily detached into the heat exchange tubes 110, and the bubbles are taken away by the working fluid in the heat exchange tubes 110 to surely achieve the heat exchange effect, thereby Avoid the problem that bubbles are not easily separated and cause hot spots. Moreover, the heat dissipating component 100 of the present embodiment can further improve the heat transfer effect by using the high thermal conductivity diamond film 122 and the deionized water solution doped with the multi-walled carbon nanotube to improve the heat exchange and cooling heat dissipation effect.
請參照第8圖，其顯示依照本發明之一實施例之工作流體於散熱元件中的熱通量圖。如第8圖所示，當本實施例之散熱元件100之微型熱交換管結構110的尺寸為長度30mm、寬度200μm、高度100μm，且工作流體為摻有1vol.%多壁奈米碳管的去離子水溶液時，約可得到最高熱通量614W/cm2 ，因此，相較於現有的微型熱交換管，本實施例之具有微型熱交換管結構110的散熱元件100可大幅地提升熱傳效率，進而改善熱交換及冷卻散熱效果。Referring to Figure 8, there is shown a heat flux diagram of a working fluid in a heat dissipating component in accordance with an embodiment of the present invention. As shown in FIG. 8, when the micro heat exchange tube structure 110 of the heat dissipating component 100 of the present embodiment has a size of 30 mm in length, 200 μm in width, and 100 μm in height, and the working fluid is doped with 1 vol.% of multi-walled carbon nanotubes. When the deionized water solution is used, the highest heat flux is about 614 W/cm 2 , so that the heat dissipating member 100 having the micro heat exchange tube structure 110 of the present embodiment can greatly improve the heat transfer compared to the existing micro heat exchange tubes. Efficiency, which in turn improves heat exchange and cooling.
如第3圖所示，在本發明之一實施例，位於熱交換管110之相對兩側的三角形凹孔111可相互對位，且三角形凹孔111之間的設置間距可為固定不變，此些三角形凹孔111的開孔角度θ、大小尺寸可皆為相同。As shown in FIG. 3, in one embodiment of the present invention, the triangular recessed holes 111 on opposite sides of the heat exchange tube 110 can be aligned with each other, and the arrangement pitch between the triangular recessed holes 111 can be fixed. The opening angles θ and sizes of the triangular recesses 111 may be the same.
請參照第9A圖，其顯示依照本發明之另一實施例之散熱元件的上視剖面圖。在本發明之另一實施例，位於熱交換管110之相對兩側的三角形凹孔111可相互錯位，亦即相對兩側的三角形凹孔111可不相互對齊。Referring to Figure 9A, there is shown a top cross-sectional view of a heat dissipating component in accordance with another embodiment of the present invention. In another embodiment of the present invention, the triangular recessed holes 111 on opposite sides of the heat exchange tube 110 may be misaligned with each other, that is, the triangular recessed holes 111 on opposite sides may not be aligned with each other.
請參照第9B圖和第9C圖，其顯示依照本發明之又一實施例之散熱元件的上視剖面圖。在本發明之又一實施例，熱交換管110的三角形凹孔111可具有不同的開孔角度θ、大小尺寸及/或設置位置，其可根據實際的需求和情況來任意地設計或變化。Referring to Figures 9B and 9C, there is shown a top cross-sectional view of a heat dissipating component in accordance with yet another embodiment of the present invention. In still another embodiment of the present invention, the triangular recessed holes 111 of the heat exchange tubes 110 may have different opening angles θ, sizes, and/or set positions, which may be arbitrarily designed or changed according to actual needs and circumstances.
由上述本發明的實施例可知，本發明之具有微型熱交換管結構的散熱元件可避免氣泡不易脫離而產生過熱點的問題，且更可利用高熱傳導係數的鑽石薄膜及摻有多壁奈米碳管的去離子水溶液來提升熱傳效率，因而可大幅地提升熱交換、冷卻及散熱效果。再者，本發明之散熱元件可利用微鑄造技術來製造，因而可具有低製程成本以及快速大量製造的功效。According to the embodiment of the present invention, the heat dissipating component having the micro heat exchange tube structure of the present invention can avoid the problem that the air bubbles are not easily detached and generate hot spots, and the diamond film with high thermal conductivity and the multi-walled nanometer can be utilized. The deionized water solution of the carbon tube improves the heat transfer efficiency, thereby greatly improving the heat exchange, cooling and heat dissipation effects. Furthermore, the heat dissipating component of the present invention can be fabricated using micro-casting techniques, and thus can have low process cost and rapid mass production.
綜上所述，雖然本發明已用較佳實施例揭露如上，然其並非用以限定本發明，本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。In view of the above, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the invention, and the present invention may be made without departing from the spirit and scope of the invention. Various modifications and refinements are made, and the scope of the present invention is defined by the scope of the appended claims.
θ．．．開孔角度θ. . . Opening angle
100．．．散熱元件100. . . Heat sink
110、900．．．微型熱交換管110, 900. . . Micro heat exchange tube
111．．．三角形凹孔111. . . Triangular recess
112、901．．．管壁112, 901. . . Wall
120．．．底部120. . . bottom
121．．．金屬層121. . . Metal layer
122．．．鑽石薄膜122. . . Diamond film
130．．．中間本體130. . . Intermediate body
140．．．上蓋140. . . Upper cover
150．．．管路150. . . Pipeline
160．．．加壓元件160. . . Pressurized component
S201．．．提供底部S201. . . Provide bottom
S202．．．形成中間本體和上蓋S202. . . Forming the middle body and the upper cover
S203．．．設置中間本體以及上蓋於底部上S203. . . Set the middle body and the upper cover on the bottom
300．．．鑄模300. . . Molding
310．．．凸狀結構310. . . Convex structure
902．．．圓形凹孔902. . . Round recess
903．．．通孔903. . . Through hole
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂，所附圖式之詳細說明如下：The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood.
第1圖顯示依照現有之微型熱交換管的剖面示意圖。Figure 1 shows a schematic cross-sectional view of a conventional micro heat exchange tube.
第2圖顯示依照本發明之一實施例之散熱元件的正面示意圖。Fig. 2 is a front elevational view showing a heat dissipating member in accordance with an embodiment of the present invention.
第3圖顯示依照本發明之一實施例之散熱元件的上視剖面圖。Figure 3 is a top cross-sectional view showing a heat dissipating member in accordance with an embodiment of the present invention.
第4圖顯示依照本發明之一實施例之散熱元件的部分立體圖。Figure 4 is a partial perspective view of a heat dissipating component in accordance with an embodiment of the present invention.
第5A圖至第5D圖顯示依照本發明之一實施例之散熱元件的製造剖面圖。5A to 5D are cross-sectional views showing the manufacture of a heat dissipating member in accordance with an embodiment of the present invention.
第6圖顯示依照本發明之一實施例之散熱元件的製造方法流程圖。Figure 6 is a flow chart showing a method of manufacturing a heat dissipating component in accordance with an embodiment of the present invention.
第7圖顯示依照本發明之一實施例之散熱元件的方塊示意圖。Figure 7 is a block diagram showing a heat dissipating component in accordance with an embodiment of the present invention.
第8圖顯示依照本發明之一實施例之工作流體於散熱元件中的熱通量圖。Figure 8 is a graph showing the heat flux of a working fluid in a heat dissipating component in accordance with an embodiment of the present invention.
第9A圖至第9C圖顯示依照本發明其他實施例之散熱元件的上視剖面圖。9A through 9C are top cross-sectional views showing heat dissipating members in accordance with other embodiments of the present invention.
θ．．．開孔角度θ. . . Opening angle
110．．．微型熱交換管110. . . Micro heat exchange tube
111．．．三角形凹孔111. . . Triangular recess
130．．．中間本體130. . . Intermediate body
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH109789A (en) * | 1996-03-28 | 1998-01-16 | Km Europ Metal Ag | Heat exchanger tube |
| TW200413511A (en) * | 2003-01-30 | 2004-08-01 | Adda Corp | Preparation method of diamond-aqueous nano fluid with high heat transfer coefficient |
| TW200634490A (en) * | 2005-03-16 | 2006-10-01 | Kinik Co | Heat-dissipating device with high efficiency of heat dissipation |
| TWI295725B (en) * | 2003-03-17 | 2008-04-11 | Cooligy Inc | Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device |
| TWM373489U (en) * | 2009-07-21 | 2010-02-01 | Nat Univ Chung Cheng | A temperature-controlled bio-molecular reaction microchip coated with a conductive substrate and equipped with a reaction chamber. |
-
2010
- 2010-02-12 TW TW99104733A patent/TWI408329B/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH109789A (en) * | 1996-03-28 | 1998-01-16 | Km Europ Metal Ag | Heat exchanger tube |
| TW200413511A (en) * | 2003-01-30 | 2004-08-01 | Adda Corp | Preparation method of diamond-aqueous nano fluid with high heat transfer coefficient |
| TWI295725B (en) * | 2003-03-17 | 2008-04-11 | Cooligy Inc | Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device |
| TW200634490A (en) * | 2005-03-16 | 2006-10-01 | Kinik Co | Heat-dissipating device with high efficiency of heat dissipation |
| TWM373489U (en) * | 2009-07-21 | 2010-02-01 | Nat Univ Chung Cheng | A temperature-controlled bio-molecular reaction microchip coated with a conductive substrate and equipped with a reaction chamber. |
Also Published As
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|---|---|
| TW201128158A (en) | 2011-08-16 |
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