TWI407864B - Holding device - Google Patents
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- TWI407864B TWI407864B TW99103033A TW99103033A TWI407864B TW I407864 B TWI407864 B TW I407864B TW 99103033 A TW99103033 A TW 99103033A TW 99103033 A TW99103033 A TW 99103033A TW I407864 B TWI407864 B TW I407864B
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Abstract
Description
本發明涉及印刷電路板製作技術，特別涉及一種承載治具。The invention relates to a printed circuit board manufacturing technology, in particular to a bearing fixture.
軟性印刷電路板（Flexible Printed Circuit Board，簡寫為FPC）具有體積小，重量輕，可做立體組裝及動態可撓曲等優點，被愈來愈廣泛應用於各種可攜式電子產品中，尤其係手機、數位相機、掌上電腦等輕薄且可攜式電子產品。參見文獻Takao Yamazaki, Yoshimichi Sogawa, Rieka Yoshino, Keiichiro Kata, Ichiro Hazeyama, and Sakae Kitajo, Real Chip Size Three-Dimensional Stacked Package, IEEE Transactions on Advanced Packaging, 2005, 28(3), 397-403。Flexible Printed Circuit Board (FPC) has the advantages of small size, light weight, three-dimensional assembly and dynamic flexibility. It is widely used in various portable electronic products, especially Lightweight and portable electronic products such as mobile phones, digital cameras, and handheld computers. See, for example, Takao Yamazaki, Yoshimichi Sogawa, Rieka Yoshino, Keiichiro Kata, Ichiro Hazeyama, and Sakae Kitajo, Real Chip Size Three-Dimensional Stacked Package, IEEE Transactions on Advanced Packaging, 2005, 28(3), 397-403.
目前，於FPC之製作過程中包括複數次貼合過程，以滿足最終產品之性能要求。如，於FPC上貼合補強板，以增強FPC上承載電子元件之能力。通常補強板之貼合係先於FPC及待貼合之補強板上相應位置分別鑽複數定位孔；然後依次將FPC與待貼合之補強板套設於預先設計之治具之複數定位柱，該複數定位柱與複數定位孔一一對應，從而將待貼合之補強板定位於FPC之預定位置；最後藉由熱壓之方式使補強板上之熱固化膠與FPC表面發生化學鍵接，從而將補強板貼合固定於FPC之預定位置。然，由於FPC之脹縮，FPC上複數定位孔之位置會發生變化，而複數定位柱固定於治具，從而預先設計之治具之複數定位柱不能全部穿過該複數定位孔導致治具無法使用。一種解決之辦法係將治具之定位柱之直徑設計得小於定位孔之孔徑，如此，複數定位柱可能可全部穿過面積較小或者脹縮比例較小之FPC，惟，由於補強板與FPC於治具上還可相對於定位柱移動，補強板與FPC之間對位精度亦因此而降低。At present, the FPC manufacturing process includes multiple bonding processes to meet the performance requirements of the final product. For example, a reinforcing plate is attached to the FPC to enhance the ability to carry electronic components on the FPC. Generally, the bonding of the reinforcing plates is respectively performed on the FPC and the corresponding position of the reinforcing plate to be attached, and then the plurality of positioning holes are respectively drilled; and then the FPC and the reinforcing plate to be attached are sequentially set on the plurality of positioning columns of the pre-designed jig. The plurality of positioning posts are in one-to-one correspondence with the plurality of positioning holes, so that the reinforcing plate to be attached is positioned at a predetermined position of the FPC; finally, the thermosetting glue on the reinforcing plate is chemically bonded to the surface of the FPC by means of hot pressing, thereby Fix the reinforcing plate to the predetermined position of the FPC. However, due to the expansion and contraction of the FPC, the position of the plurality of positioning holes on the FPC changes, and the plurality of positioning posts are fixed to the jig, so that the plurality of positioning posts of the pre-designed jig cannot pass through the plurality of positioning holes, thereby causing the jig to fail. use. One solution is to design the diameter of the positioning column of the fixture to be smaller than the aperture of the positioning hole. Thus, the plurality of positioning columns may all pass through the FPC with a small area or a small expansion ratio, but because of the reinforcing plate and the FPC. The fixture can also move relative to the positioning column, and the alignment accuracy between the reinforcing plate and the FPC is also reduced.
有鑑於此，提供一種承載治具，以承載待貼合之基板並提高貼合對位精度實屬必要。In view of the above, it is necessary to provide a carrying fixture to carry the substrate to be bonded and to improve the alignment alignment accuracy.
一種承載治具，用於承載待貼合之第一基板與第二基板。所述第一基板具有複數第一孔，所述第二基板具有與所述複數第一孔一一對應之複數第二孔。所述承載治具包括一第一板體、一第二板體以及複數定位柱。所述第一板體具有與所述複數第一孔之位置一一對應之複數容置孔。所述第二板體具有與所述複數容置孔一一對應之複數定位孔。所述複數定位柱與所述複數容置孔一一對應。每一定位柱均自與之對應之容置孔向與之對應之定位孔延伸，並突出於所述與之對應之定位孔以與所述第一基板之一第一孔與所述第二基板之一第二孔相配合。所述複數定位柱中，一定位柱定位於所述第一板體與之對應之容置孔或者所述第二板體與之對應之定位孔中，其餘之定位柱可移動地設置於所述第一板體與之對應之容置孔與所述第二板體與之對應之定位孔中。A bearing fixture is configured to carry a first substrate and a second substrate to be bonded. The first substrate has a plurality of first holes, and the second substrate has a plurality of second holes that are in one-to-one correspondence with the plurality of first holes. The bearing fixture includes a first plate body, a second plate body, and a plurality of positioning posts. The first plate body has a plurality of receiving holes that are in one-to-one correspondence with the positions of the plurality of first holes. The second plate body has a plurality of positioning holes corresponding to the plurality of receiving holes. The plurality of positioning posts are in one-to-one correspondence with the plurality of receiving holes. Each of the positioning posts extends from the corresponding receiving hole toward the corresponding positioning hole and protrudes from the corresponding positioning hole to form a first hole and the second of the first substrate One of the second holes of the substrate is mated. In the plurality of positioning posts, a positioning post is positioned in the corresponding receiving hole of the first plate body or the positioning hole corresponding to the second plate body, and the remaining positioning posts are movably disposed in the positioning hole The accommodating hole corresponding to the first plate body and the positioning hole corresponding to the second plate body.
與先前技術相比，本技術方案提供之承載治具之定位柱可移動之設置於第一板體之容置孔內，所述容置孔之孔徑大小可根據待貼合之第一基板之脹縮情況而設計，從而當待貼合之第一基板發生脹縮時，僅需移動定位柱調整該定位柱於第一板體之容置孔內之位置即可適應第一基板上每一第一孔發生之偏位之情況，尤其適用於包括複數塊未裁切之電路板單元之大面積FPC，不僅可提高貼合對位精度，還可提高貼合效率。Compared with the prior art, the positioning column of the supporting fixture provided by the technical solution is movably disposed in the receiving hole of the first board body, and the aperture of the receiving hole is sized according to the first substrate to be attached The expansion and contraction is designed so that when the first substrate to be fitted is expanded and contracted, only the positioning post needs to be moved to adjust the position of the positioning post in the receiving hole of the first plate body to adapt to each of the first substrate. The case where the first hole is displaced is particularly suitable for a large-area FPC including a plurality of uncut circuit board units, which not only improves the alignment alignment accuracy, but also improves the bonding efficiency.
以下將結合附圖及複數實施例對本技術方案提供之承載治具作進一步詳細說明。The bearing fixture provided by the technical solution will be further described in detail below with reference to the accompanying drawings and the embodiments.
請一併參閱圖1與圖2，本技術方案第一實施例提供一種承載治具10，用於定位待貼合之第一基板與第二基板。所述第一基板具有複數第一孔。所述第二基板具有與所述複數第一孔一一對應之複數第二孔。所述承載治具10包括一第一板體11、一第二板體12、複數定位柱13以及複數固定件14。Referring to FIG. 1 and FIG. 2 together, the first embodiment of the present invention provides a bearing fixture 10 for positioning a first substrate and a second substrate to be bonded. The first substrate has a plurality of first holes. The second substrate has a plurality of second holes that are in one-to-one correspondence with the plurality of first holes. The bearing fixture 10 includes a first plate body 11 , a second plate body 12 , a plurality of positioning posts 13 , and a plurality of fixing members 14 .
所述第一板體11可為長方形板體，其具有相對之第一表面110與第二表面111。所述第一表面110與第二表面111均近似為長方形面。所述第一板體11可採用導熱效率較高之鋼或鋁製成。所述第一板體11具有複數容置孔、複數第一固定孔112與複數第一導向孔113。所述複數容置孔與所述複數第一孔之位置一一對應。所述複數容置孔包括一第一基準孔與至少一第一調節孔，所述第一基準孔之孔徑小於所述第一調節孔之孔徑。每一容置孔均為自所述第二表面111向第一表面110開設之盲孔。每一容置孔均具有用於承載定位柱13之底壁114，所述底壁114為平行於第二表面111之光滑平面。所述容置孔之橫截面可為圓形。本實施例中，容置孔之數量為四個，且於所述第二表面111中心處成陣列式排布，該四個容置孔分別為第一容置孔115、第二容置孔116、第三容置孔117與第四容置孔118。第一容置孔115與第二容置孔116靠近第二表面111之一長邊，第三容置孔117與第四容置孔118靠近第二表面111之另一長邊。所述第一容置孔115為第一基準孔，第二容置孔116、第三容置孔117與第四容置孔118均為第一調節孔。所述第二容置孔116、第三容置孔117與第四容置孔118之孔徑相等，且均大於所述第一容置孔115之孔徑。所述複數第一固定孔112均貫穿第一表面110與第二表面111，且每一第一固定孔112均具有內螺紋。本實施例中，第一固定孔112之數量為四個，每一第一固定孔112均靠近所述第一板體11之一頂角。所述複數第一導向孔113亦均貫穿第一表面110與第二表面111。本實施例中，第一導向孔113之數量為兩個，一第一導向孔113靠近第二表面111之一短邊，且基本位於兩個第一固定孔112之間，另一第一導向孔113靠近第二表面111之另一短邊，且基本位於另兩個第一固定孔112之間。The first plate body 11 can be a rectangular plate body having opposite first and second surfaces 111 and 111. The first surface 110 and the second surface 111 are each approximately a rectangular surface. The first plate body 11 can be made of steel or aluminum having high heat conduction efficiency. The first plate body 11 has a plurality of receiving holes, a plurality of first fixing holes 112 and a plurality of first guiding holes 113. The plurality of accommodating holes are in one-to-one correspondence with the positions of the plurality of first holes. The plurality of receiving holes includes a first reference hole and at least one first adjusting hole, and the first reference hole has a smaller aperture than the first adjusting hole. Each of the accommodating holes is a blind hole opened from the second surface 111 toward the first surface 110. Each of the receiving holes has a bottom wall 114 for carrying the positioning post 13 , and the bottom wall 114 is a smooth plane parallel to the second surface 111 . The accommodating hole may have a circular cross section. In this embodiment, the number of the accommodating holes is four, and is arranged in an array at the center of the second surface 111. The four accommodating holes are respectively the first accommodating hole 115 and the second accommodating hole. 116. The third receiving hole 117 and the fourth receiving hole 118. The first accommodating hole 115 and the second accommodating hole 116 are adjacent to one long side of the second surface 111, and the third accommodating hole 117 and the fourth accommodating hole 118 are adjacent to the other long side of the second surface 111. The first receiving hole 115 is a first reference hole, and the second receiving hole 116, the third receiving hole 117 and the fourth receiving hole 118 are both first adjusting holes. The apertures of the second accommodating hole 116 and the third accommodating hole 117 are equal to each other and are larger than the aperture of the first accommodating hole 115. The plurality of first fixing holes 112 penetrate through the first surface 110 and the second surface 111, and each of the first fixing holes 112 has an internal thread. In this embodiment, the number of the first fixing holes 112 is four, and each of the first fixing holes 112 is adjacent to a top corner of the first plate body 11. The plurality of first guiding holes 113 also penetrate the first surface 110 and the second surface 111. In this embodiment, the number of the first guiding holes 113 is two, and one first guiding hole 113 is adjacent to one short side of the second surface 111 and substantially located between the two first fixing holes 112, and the other first guiding The hole 113 is adjacent to the other short side of the second surface 111 and is located substantially between the other two first fixing holes 112.
所述第二板體12與所述第一板體11相對設置。所述第二板體12具有相對之第三表面120與第四表面121。所述第三表面120靠近所述第一板體11並與第二表面111相對。所述第四表面121遠離所述第一板體11。所述第二板體12亦可採用導熱效率較高之鋼或鋁製成。所述第二板體12具有複數定位孔122、複數第二固定孔123與複數第二導向孔124。所述複數定位孔122與所述複數容置孔一一對應。具體地，所述複數定位孔122與複數容置孔之位置一一對應，從而亦與所述複數第一孔之位置一一對應。每一定位孔122均為貫穿所述第三表面120與第四表面121之通孔。本實施例中，與所述複數容置孔相對應之，定位孔122之數量亦為四個，且孔徑均相同，所述四個定位孔122於所述第四表面121中心處成陣列式排布。所述複數第二固定孔123均貫穿第三表面120與第四表面121，且每一第二固定孔123亦均具有內螺紋。本實施例中，與所述複數第一固定孔112相對應地，所述第二固定孔123亦為四個，每一第二固定孔123均靠近所述第二板體12之一頂角。所述複數第二導向孔124亦均貫穿第三表面120與第四表面121。本實施例中，與所述複數第一導向孔113相對應地，所述第二導向孔124亦為兩個，一第二導向孔124靠近所述第四表面121之一短邊，且基本位於兩個第二固定孔123之間，另一第二導向孔124靠近所述第四表面121之另一短邊，且基本位於另兩個第二固定孔123之間。The second plate body 12 is disposed opposite to the first plate body 11 . The second plate body 12 has a third surface 120 and a fourth surface 121 opposite to each other. The third surface 120 is adjacent to the first plate 11 and opposite to the second surface 111. The fourth surface 121 is away from the first plate body 11 . The second plate body 12 can also be made of steel or aluminum with high heat conductivity. The second plate body 12 has a plurality of positioning holes 122 , a plurality of second fixing holes 123 , and a plurality of second guiding holes 124 . The plurality of positioning holes 122 are in one-to-one correspondence with the plurality of receiving holes. Specifically, the plurality of positioning holes 122 are in one-to-one correspondence with the positions of the plurality of receiving holes, and are also in one-to-one correspondence with the positions of the plurality of first holes. Each of the positioning holes 122 is a through hole penetrating the third surface 120 and the fourth surface 121 . In this embodiment, the number of the positioning holes 122 is four, and the apertures are the same, and the four positioning holes 122 are arrayed at the center of the fourth surface 121. Arrange. The plurality of second fixing holes 123 penetrate through the third surface 120 and the fourth surface 121, and each of the second fixing holes 123 also has an internal thread. In this embodiment, corresponding to the plurality of first fixing holes 112, the second fixing holes 123 are also four, and each of the second fixing holes 123 is adjacent to a top corner of the second plate body 12. . The plurality of second guiding holes 124 also penetrate the third surface 120 and the fourth surface 121. In this embodiment, corresponding to the plurality of first guiding holes 113, the second guiding holes 124 are also two, and a second guiding hole 124 is adjacent to one of the short sides of the fourth surface 121, and is basically Located between the two second fixing holes 123, the other second guiding hole 124 is adjacent to the other short side of the fourth surface 121 and substantially located between the other two second fixing holes 123.
所述複數定位柱13與所述複數容置孔一一對應，每一定位柱13均包括相連接之容置部130與定位部131，所述容置部130容置於所述容置孔，所述定位部131穿過所述定位孔122。所述定位部131之直徑小於所述容置部130之直徑。所述容置部130與定位部131均大致為圓柱體形，所述容置部130遠離定位部131處具有倒角。所述定位部131之直徑小於定位孔122之孔徑、等於所述第一孔及所述第二孔之孔徑，從而可移動地穿過與之對應之定位孔122，並與所述第一基板之第一孔與所述第二基板之第二孔相配合，從而將所述第一基板與第二基板定位於第二板體12上。本實施例中，與所述複數容置孔相對應之，所述定位柱13亦為四個。定位柱13之容置部130之直徑恰等於作為所述第一基準孔之第一容置孔115之孔徑，且小於所述第二容置孔116、第三容置孔117與第四容置孔118之孔徑。從而實現所述四個定位柱中，與所述第一容置孔115相對應之定位柱13定位於所述第一板體11第一容置孔115，其餘之定位柱13可移動地設置於所述第一板體11與之對應之容置孔與所述第二板體12與之對應之定位孔122。The plurality of positioning posts 13 are in one-to-one correspondence with the plurality of receiving holes. Each of the positioning posts 13 includes a receiving portion 130 and a positioning portion 131. The receiving portion 130 is received in the receiving hole. The positioning portion 131 passes through the positioning hole 122. The diameter of the positioning portion 131 is smaller than the diameter of the receiving portion 130. The accommodating portion 130 and the positioning portion 131 are both substantially cylindrical, and the accommodating portion 130 has a chamfer away from the positioning portion 131. The positioning portion 131 has a diameter smaller than an aperture of the positioning hole 122, equal to an aperture of the first hole and the second hole, so as to movably pass through the positioning hole 122 corresponding thereto, and the first substrate The first hole cooperates with the second hole of the second substrate to position the first substrate and the second substrate on the second plate body 12. In this embodiment, corresponding to the plurality of accommodating holes, the positioning posts 13 are also four. The diameter of the receiving portion 130 of the positioning post 13 is exactly equal to the diameter of the first receiving hole 115 as the first reference hole, and is smaller than the second receiving hole 116, the third receiving hole 117 and the fourth receiving hole. The aperture of the aperture 118 is placed. Therefore, the positioning post 13 corresponding to the first receiving hole 115 is positioned in the first receiving hole 115 of the first plate body 11 , and the remaining positioning posts 13 are movably disposed. The accommodating hole corresponding to the first plate body 11 and the positioning hole 122 corresponding to the second plate body 12 are corresponding.
所述複數固定件14與所述複數第一固定孔112一一對應，用於與所述第一固定孔112與複數第二固定孔123相配合以將所述第一板體11與第二板體12固定於一起。所述複數固定件14之直徑與所述第一固定孔112及第二固定孔123相匹配，即，恰可穿過第一固定孔112及第二固定孔123。所述固定件14還具有與所述第一固定孔112及第二固定孔123之內螺紋相匹配之外螺紋。本實施例中，與所述複數第一固定孔112相對應地，所述複數固定件14亦為四個。The plurality of fixing members 14 are in one-to-one correspondence with the plurality of first fixing holes 112 for cooperating with the first fixing holes 112 and the plurality of second fixing holes 123 to the first plate body 11 and the second plate The plates 12 are fixed together. The diameters of the plurality of fixing members 14 are matched with the first fixing holes 112 and the second fixing holes 123, that is, just passing through the first fixing holes 112 and the second fixing holes 123. The fixing member 14 further has a thread that matches the internal threads of the first fixing hole 112 and the second fixing hole 123. In this embodiment, corresponding to the plurality of first fixing holes 112, the plurality of fixing members 14 are also four.
當然，作為第一調節孔之所述第二容置孔116、第三容置孔117與第四容置孔118之孔徑亦不一定要求相等，每一第一調節孔之孔徑均可根據所述第一基板之脹縮比例以及該第一調節孔所於之第一板體11之位置而定，如所述第一調節孔之孔徑與定位柱13之定位部131之直徑之間之差值等於所述第一基板之脹縮比例與該第一調節孔與第一基準孔之間距之乘積。如此，可提高對位調節之精度。Certainly, the apertures of the second receiving hole 116, the third receiving hole 117 and the fourth receiving hole 118 as the first adjusting hole are not necessarily required to be equal, and the aperture of each first adjusting hole can be determined according to the Determining the ratio of expansion and contraction of the first substrate and the position of the first plate 11 of the first adjustment hole, such as the difference between the diameter of the first adjustment hole and the diameter of the positioning portion 131 of the positioning post 13 The value is equal to the product of the expansion ratio of the first substrate and the distance between the first adjustment hole and the first reference hole. In this way, the accuracy of the alignment adjustment can be improved.
可理解，所述容置孔、定位孔122及定位柱13之數量並不限於為四個，且所述容置孔及定位孔122分佈方式亦不限於成陣列式排布，可根據待貼合之第一基板與第二基板之實際需要而作相應設計。It is to be understood that the number of the receiving holes, the positioning holes 122 and the positioning posts 13 is not limited to four, and the manner of distributing the receiving holes and the positioning holes 122 is not limited to being arranged in an array, and may be attached according to The first substrate and the second substrate are designed accordingly.
請一併參閱圖3至圖6，使用本技術方案第一實施例提供之承載治具10對第一基板與第二基板進行壓合時，可採用以下步驟：Referring to FIG. 3 to FIG. 6 , when the first substrate and the second substrate are pressed by the carrier jig 10 provided in the first embodiment of the present technical solution, the following steps may be adopted:
第一步，提供第一基板100、第二基板200、熱壓裝置300與如上所述之承載治具10。In the first step, the first substrate 100, the second substrate 200, the hot pressing device 300, and the carrying jig 10 as described above are provided.
所述第一基板100可包括複數電路板單元101，且第一基板100上開設有複數第一孔。所述第一孔之孔徑等於定位柱13之定位部131之直徑，以使得定位柱13之定位部131恰穿過所述第一孔102。本實施例中，所述第一基板100為包括兩個電路板單元101之軟性電路板，每一電路板單元101均開設有兩個第一孔102，從而所述第一基板100上一共開設有四個第一孔102。The first substrate 100 may include a plurality of circuit board units 101, and the first substrate 100 is provided with a plurality of first holes. The diameter of the first hole is equal to the diameter of the positioning portion 131 of the positioning post 13 such that the positioning portion 131 of the positioning post 13 just passes through the first hole 102. In this embodiment, the first substrate 100 is a flexible circuit board including two circuit board units 101. Each of the circuit board units 101 is provided with two first holes 102, so that the first substrate 100 is opened. There are four first holes 102.
所述第二基板200與所述複數電路板單元101一一對應，所述第二基板200上開設有複數第二孔201。所述第二孔201之孔徑等於定位柱13之定位部131之直徑，以使得定位柱13之定位部131恰穿過所述第二孔201。本實施例中，所述第二基板200為兩個，每一第二基板200均開設有兩個第二孔201。其可為具有熱固化膠之補強板。優選之，所述第二基板200之脹縮比例與所述第一基板100之脹縮比例相當。The second substrate 200 is in one-to-one correspondence with the plurality of circuit board units 101. The second substrate 200 is provided with a plurality of second holes 201. The diameter of the second hole 201 is equal to the diameter of the positioning portion 131 of the positioning post 13 such that the positioning portion 131 of the positioning post 13 just passes through the second hole 201. In this embodiment, the second substrate 200 is two, and each of the second substrates 200 is provided with two second holes 201. It can be a reinforcing plate with a heat curing glue. Preferably, the expansion ratio of the second substrate 200 is equivalent to the expansion ratio of the first substrate 100.
所述熱壓裝置300包括相對設置之加熱台301與壓塊302。所述加熱台301可為橫截面積大於第一板體11之方形平板，且其上延伸出複數導向柱303，所述複數導向柱303與所述第一板體11之複數第一導向孔113及第二板體12之複數第二導向孔124一一對應，用於與所述複數第一導向孔113及複數第二導向孔124相配合以將所述承載治具10定位於所述熱壓裝置300。與所述複數第一導向孔113相對應之，所述導向柱303為兩個。所述壓塊302用於對所述第一基板100、第二基板200施壓。所述壓塊302靠近所述加熱台301之表面具有與所述承載治具10之複數定位柱13相對應之孔或槽，以使得所述壓塊302可接觸到第二基板200並對第一基板100與第二基板200施壓，而不會被突出於第二基板200之定位柱13抵住。The hot pressing device 300 includes a heating table 301 and a pressing block 302 which are oppositely disposed. The heating stage 301 can be a square flat plate having a larger cross-sectional area than the first plate body 11 , and a plurality of guiding columns 303 extending from the plurality of guiding columns 303 and the plurality of first guiding holes of the first plate body 11 113 and the plurality of second guiding holes 124 of the second plate body 12 are in one-to-one correspondence, for cooperating with the plurality of first guiding holes 113 and the plurality of second guiding holes 124 to position the bearing fixture 10 in the The hot pressing device 300. Corresponding to the plurality of first guiding holes 113, the guiding posts 303 are two. The pressing block 302 is used to press the first substrate 100 and the second substrate 200. The pressing block 302 has a hole or a groove corresponding to the plurality of positioning posts 13 of the carrying fixture 10 near the surface of the heating table 301, so that the pressing block 302 can contact the second substrate 200 and A substrate 100 and the second substrate 200 are pressed without being attracted by the positioning posts 13 protruding from the second substrate 200.
第二步，將所述第一基板100、第二基板200藉由所述承載治具10定位。In the second step, the first substrate 100 and the second substrate 200 are positioned by the carrier fixture 10 .
可先使所述承載治具10之複數定位柱13之一一穿過將第一基板100之複數第一孔，將第一基板100置於第二板體12上方。若此時定位柱13擺放於容置孔之位置與所述第一基板100之第一孔之位置不對應，可移動定位柱13以使得定位柱13可穿過與之對應之第一孔。具體地，可先定住複數定位柱13中之一，使該定位柱13對準第一基板100上與之對應之第一孔，再調整其餘定位柱13之位置，使該剩餘之複數定位柱13一一對準第一基板100上其餘之複數第一孔。The first substrate 100 can be placed over the second plate body 12 by passing one of the plurality of positioning posts 13 of the carrier fixture 10 through a plurality of first holes of the first substrate 100. If the position of the positioning post 13 at the receiving hole does not correspond to the position of the first hole of the first substrate 100, the positioning post 13 can be moved so that the positioning post 13 can pass through the first hole corresponding thereto. . Specifically, one of the plurality of positioning posts 13 can be fixed, and the positioning post 13 is aligned with the first hole corresponding to the first substrate 100, and then the positions of the remaining positioning posts 13 are adjusted to make the remaining plurality of positioning posts. 13 is aligned with the remaining plurality of first holes on the first substrate 100.
再使所述承載治具10之複數定位柱13之一一穿過將第二基板200之複數第二孔，將第二基板200置於第一基板100上方。The second substrate 200 is placed over the first substrate 100 by passing one of the plurality of positioning posts 13 of the carrying fixture 10 through a plurality of second holes of the second substrate 200.
第三步，利用熱壓裝置300將定位於所述承載治具10之第一基板100與第二基板200壓合於一起。In the third step, the first substrate 100 and the second substrate 200 positioned on the bearing fixture 10 are pressed together by the hot pressing device 300.
具體地，可使熱壓裝置300之導向柱303依次穿過第一板體11之第一導向孔113以及第二板體12之第二導向孔124，將定位有第一基板100與第二基板200之所述承載治具10置於熱壓裝置300之加熱台301上並對所述承載治具10加熱，利用壓塊302對所述第一基板100與第二基板200施壓，從而將第一基板100與第二基板200壓合於一起。Specifically, the guiding column 303 of the hot pressing device 300 can be sequentially passed through the first guiding hole 113 of the first plate body 11 and the second guiding hole 124 of the second plate body 12, and the first substrate 100 and the second substrate are positioned. The bearing fixture 10 of the substrate 200 is placed on the heating stage 301 of the hot pressing device 300 and the carrying fixture 10 is heated, and the first substrate 100 and the second substrate 200 are pressed by the pressing block 302, thereby The first substrate 100 and the second substrate 200 are pressed together.
請一併參閱圖7與圖8，本技術方案第二實施例提供之承載治具20與第一實施例之承載治具10大致相同，其區別於於，所述第一板體之複數容置孔之孔徑均相等，且其孔徑均大於所述定位柱23之容置部230之直徑。所述第二板體22之複數定位孔包括一第二基準孔與至少一第二調節孔。所述第二基準孔之孔徑之孔徑恰等於定位柱之定位部之直徑以使得該第二基準孔恰可供定位柱23之定位部231穿過。所述複數第二調節孔之孔徑依據所述第一基板之脹縮比例以及該第二調節孔所於之第二板體22之位置而定，所述第二調節孔之孔徑與定位柱23之定位部231之直徑之間之差值等於所述第一基板之脹縮比例與該第二調節孔與第二基準孔之間距之乘積，即，所述定位柱23之定位部231於所述第二調節孔內可移動之最大值為所述第一基板之脹縮比例與該第二調節孔與基準孔之間距之乘積。所述第一基板之脹縮比例可利用專門之設備進行測量得到。例如，所述第二板體22具有四個定位孔，該四個定位孔分別為第一定位孔222、第二定位孔223、第三定位孔224與第四定位孔225。第一定位孔222與第二定位孔223靠近第二板體22之一條長邊，第三定位孔224與第四定位孔225靠近第二板體22之另一條長邊。若將第一定位孔222定為第二基準孔，則第二定位孔223、第三定位孔224與第四定位孔225均為第二調節孔。假設所述第一基板之脹縮比例為φ，第二定位孔223與第一定位孔222之間距為D1，第三定位孔224與第一定位孔222之間距為D2，第四定位孔225與第一定位孔222之間距為D3。該第一定位孔222之孔徑D0恰等於定位柱23之定位部231之直徑以使得該第一定位孔222恰可供定位柱23之定位部231穿過。第二定位孔223之孔徑為D0+D1*φ，第二定位孔223之孔徑為D0+D2*φ，第三定位孔224之孔徑為D0+D3*φ。從而實現所述四個定位柱23中，與所述第一定位孔222相對應之定位柱23定位於所述第二板體22之第一定位孔222，其餘之定位柱23可移動地設置於所述第一板體21與之對應之容置孔與所述第二板體22與之對應之定位孔。如此，於將第一基板定位於承載治具20時，存在第一定位孔222及與之對應之定位柱23作為基準，僅需找准第一基板上與該第一定位孔222及定位柱23對應之第一孔，再微調其餘之定位柱23即可快速對位，省去了將複數定位柱23與複數第一孔一一對應之步驟。此外，由於第二定位孔223、第三定位孔224與第四定位孔225之孔徑已根據所述第一基板上與之對應之第一孔可能發生之偏位作了相應之設計，對於其餘之定位柱23之微調亦於脹縮比例之範圍內，從而可進一步地提高對位精度。Referring to FIG. 7 and FIG. 8 , the bearing fixture 20 provided by the second embodiment of the present invention is substantially the same as the bearing fixture 10 of the first embodiment, and is different from the complex capacity of the first board. The apertures of the holes are equal, and the apertures thereof are all larger than the diameter of the receiving portion 230 of the positioning post 23. The plurality of positioning holes of the second plate body 22 includes a second reference hole and at least one second adjusting hole. The aperture of the aperture of the second reference hole is exactly equal to the diameter of the positioning portion of the positioning post such that the second reference hole is just available for the positioning portion 231 of the positioning post 23. The aperture of the plurality of second adjustment holes is determined according to the expansion ratio of the first substrate and the position of the second plate 22 of the second adjustment hole, and the aperture of the second adjustment hole and the positioning post 23 The difference between the diameters of the positioning portions 231 is equal to the product of the expansion ratio of the first substrate and the distance between the second adjustment hole and the second reference hole, that is, the positioning portion 231 of the positioning post 23 is The maximum value of the movable in the second adjustment hole is the product of the expansion ratio of the first substrate and the distance between the second adjustment hole and the reference hole. The expansion ratio of the first substrate can be measured by using a special device. For example, the second plate body 22 has four positioning holes, and the four positioning holes are a first positioning hole 222, a second positioning hole 223, a third positioning hole 224 and a fourth positioning hole 225, respectively. The first positioning hole 222 and the second positioning hole 223 are adjacent to one long side of the second board body 22, and the third positioning hole 224 and the fourth positioning hole 225 are adjacent to the other long side of the second board body 22. If the first positioning hole 222 is defined as the second reference hole, the second positioning hole 223, the third positioning hole 224 and the fourth positioning hole 225 are both second adjusting holes. It is assumed that the expansion ratio of the first substrate is φ, the distance between the second positioning hole 223 and the first positioning hole 222 is D1, and the distance between the third positioning hole 224 and the first positioning hole 222 is D2, and the fourth positioning hole 225 The distance from the first positioning hole 222 is D3. The diameter D0 of the first positioning hole 222 is exactly equal to the diameter of the positioning portion 231 of the positioning post 23 such that the first positioning hole 222 can pass through the positioning portion 231 of the positioning post 23. The aperture of the second positioning hole 223 is D0+D1*φ, the aperture of the second positioning hole 223 is D0+D2*φ, and the aperture of the third positioning hole 224 is D0+D3*φ. Therefore, the positioning post 23 corresponding to the first positioning hole 222 is positioned in the first positioning hole 222 of the second plate body 22, and the remaining positioning posts 23 are movably disposed. The accommodating hole corresponding to the first plate body 21 and the positioning hole corresponding to the second plate body 22 are corresponding. In this manner, when the first substrate is positioned on the bearing fixture 20, the first positioning hole 222 and the corresponding positioning post 23 are used as a reference, and only the first substrate and the first positioning hole 222 and the positioning column need to be aligned. 23 corresponding to the first hole, and then fine-tuning the remaining positioning posts 23 can be quickly aligned, eliminating the step of correspondingly matching the plurality of positioning posts 23 with the plurality of first holes. In addition, since the apertures of the second positioning hole 223, the third positioning hole 224, and the fourth positioning hole 225 have been designed according to the possible deviation of the first hole corresponding to the first substrate, The fine adjustment of the positioning post 23 is also within the range of the expansion and contraction ratio, so that the alignment accuracy can be further improved.
當然，作為第二調節孔之第二定位孔223、第三定位孔224與第四定位孔225之孔徑亦可相等，且均大於定位柱23之定位部231之直徑。Certainly, the apertures of the second positioning hole 223, the third positioning hole 224 and the fourth positioning hole 225 as the second adjustment holes may be equal, and both are larger than the diameter of the positioning portion 231 of the positioning post 23.
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
10、20‧‧‧承載治具10, 20‧‧‧bearing fixture
11、21‧‧‧第一板體11, 21‧‧‧ first board
12、22‧‧‧第二板體12, 22‧‧‧ second plate
13、23‧‧‧定位柱13, 23‧‧‧ positioning column
14‧‧‧固定件14‧‧‧Fixed parts
110‧‧‧第一表面110‧‧‧ first surface
111‧‧‧第二表面111‧‧‧ second surface
112‧‧‧第一固定孔112‧‧‧First fixing hole
113‧‧‧第一導向孔113‧‧‧First guide hole
114‧‧‧底壁114‧‧‧ bottom wall
115‧‧‧第一容置孔115‧‧‧First accommodating hole
116‧‧‧第二容置孔116‧‧‧Second accommodating hole
117‧‧‧第三容置孔117‧‧‧ third accommodating hole
118‧‧‧第四容置孔118‧‧‧4th hole
120‧‧‧第三表面120‧‧‧ third surface
121‧‧‧第四表面121‧‧‧Fourth surface
122‧‧‧定位孔122‧‧‧Positioning holes
222‧‧‧第一定位孔222‧‧‧First positioning hole
223‧‧‧第二定位孔223‧‧‧Second positioning hole
224‧‧‧第三定位孔224‧‧‧ third positioning hole
225‧‧‧第四定位孔225‧‧‧Four locating holes
123‧‧‧第二固定孔123‧‧‧Second fixing hole
124‧‧‧第二導向孔124‧‧‧Second guiding hole
130、230‧‧‧容置部130, 230‧‧‧ 容 部
131、231‧‧‧定位部131, 231‧‧ ‧ Positioning Department
100‧‧‧第一基板100‧‧‧First substrate
200‧‧‧第二基板200‧‧‧second substrate
101‧‧‧電路板單元101‧‧‧Circuit unit
102‧‧‧第一孔102‧‧‧ first hole
201‧‧‧第二孔201‧‧‧ second hole
300‧‧‧熱壓裝置300‧‧‧Hot pressure device
301‧‧‧加熱台301‧‧‧heating station
302‧‧‧壓塊302‧‧‧Clamps
303‧‧‧導向柱303‧‧‧ Guide column
圖1係本技術方案第一實施例提供之承載治具之分解示意圖。FIG. 1 is an exploded perspective view of a bearing fixture provided by a first embodiment of the present technical solution.
圖2係本技術方案第一實施例提供之承載治具之立體圖。2 is a perspective view of a bearing fixture provided by the first embodiment of the present technical solution.
圖3係使用本技術方案第一實施例提供之承載治具定位第一基板與第二基板之示意圖。FIG. 3 is a schematic diagram of positioning a first substrate and a second substrate by using a carrier fixture provided by the first embodiment of the present technical solution.
圖4係圖3沿IV-IV線之剖視圖。Figure 4 is a cross-sectional view taken along line IV-IV of Figure 3.
圖5係圖3沿V-V線之剖視圖。Figure 5 is a cross-sectional view taken along line V-V of Figure 3.
圖6係對定位於本技術方案第一實施例提供之承載治具之第一基板與第二基板進行壓合之示意圖。FIG. 6 is a schematic view showing the first substrate and the second substrate of the carrier fixture provided in the first embodiment of the present technical solution.
圖7係本技術方案第二實施例提供之承載治具之第一定位孔與第二定位孔與定位柱之配合剖面示意圖。FIG. 7 is a schematic cross-sectional view showing a first positioning hole and a second positioning hole and a positioning post of the bearing fixture provided by the second embodiment of the present technical solution.
圖8係本技術方案第二實施例提供之承載治具之第三定位孔與第四定位孔與定位柱之配合剖面示意圖。FIG. 8 is a schematic cross-sectional view showing a third positioning hole and a fourth positioning hole and a positioning post of the bearing fixture provided by the second embodiment of the present technical solution.
11‧‧‧第一板體 11‧‧‧ first board
12‧‧‧第二板體 12‧‧‧Second plate
13‧‧‧定位柱 13‧‧‧Positioning column
14‧‧‧固定件 14‧‧‧Fixed parts
122‧‧‧定位孔 122‧‧‧Positioning holes
123‧‧‧第二固定孔 123‧‧‧Second fixing hole
124‧‧‧第二導向孔 124‧‧‧Second guiding hole
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99103033A TWI407864B (en) | 2010-02-02 | 2010-02-02 | Holding device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99103033A TWI407864B (en) | 2010-02-02 | 2010-02-02 | Holding device |
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| Publication Number | Publication Date |
|---|---|
| TW201129274A TW201129274A (en) | 2011-08-16 |
| TWI407864B true TWI407864B (en) | 2013-09-01 |
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| TW99103033A TWI407864B (en) | 2010-02-02 | 2010-02-02 | Holding device |
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| CN112238686A (en) * | 2019-07-19 | 2021-01-19 | 苏州滨川精密工业有限公司 | High-efficient printing apparatus is used to keyboard backup pad |
| CN112238688A (en) * | 2019-07-19 | 2021-01-19 | 苏州滨川精密工业有限公司 | High-precision UV printing device for keyboard supporting plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI266575B (en) * | 2005-05-10 | 2006-11-11 | Oktek Corp | Carrying plate, manufacturing method thereof and method for using the carrying plate to perform the mounting |
| TWM332345U (en) * | 2007-10-12 | 2008-05-11 | Inventec Corp | A casing with a plurality of studs |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI266575B (en) * | 2005-05-10 | 2006-11-11 | Oktek Corp | Carrying plate, manufacturing method thereof and method for using the carrying plate to perform the mounting |
| TWM332345U (en) * | 2007-10-12 | 2008-05-11 | Inventec Corp | A casing with a plurality of studs |
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