TWI407862B

TWI407862B - Back plate assembly

Info

Publication number: TWI407862B
Application number: TW97128376A
Authority: TW
Inventors: Hong-Bo Xu
Original assignee: Hon Hai Prec Ind Co Ltd
Priority date: 2008-07-25
Filing date: 2008-07-25
Publication date: 2013-09-01
Also published as: TW201006330A

Abstract

A back plate assembly compatible with different type of motherboards includes a back plate and a plurality of fasteners extending through the back plate. The back plate defines sets of mounting holes therein corresponding to different types of motherboards. The fasteners are capable of sliding along one set of mounting holes of the back plate and engages with a corresponding type of motherboard. Each of the fasteners includes a baffling portion and an extending portion extending downwardly from the baffling portion. Each of the mounting holes defines a first hole and a second hole below the first hole. The fasteners are interferentially fitted in the one set of mounting holes. The baffling portions of the fasteners are received in the first holes of the mounting holes. The extending portions of the fasteners are received in the second holes of the mounting holes.

Description

背板組合 Backboard combination

本發明涉及一種散熱器用之背板組合，尤係一種可安裝於不同型號主機板之背板組合。 The invention relates to a backboard combination for a heat sink, in particular to a backboard combination which can be installed on different types of motherboards.

在電腦主機內安裝有電路板及各種不同之元件。以習知電腦主機而言，其主機板形式通常為775型號、AM2型號及K8型號。 A circuit board and various components are mounted in the host computer. In the case of a conventional computer host, the form of the motherboard is usually the 775 model, the AM2 model, and the K8 model.

通常775型號或AM2型號或K8型號之主機板上均設置有發熱電子元件，例如微處理晶片。為有效散發該微處理晶片產生之熱量，通常採用之方法係將一散熱器組合緊密地貼設於該微處理晶片之溢熱表面，以協助發熱電子元件散熱，保證發熱電子元件在適當之溫度下運作。此種散熱器組合通常包括一固定於主機板上之背板及裝設於背板上之一散熱器。 Generally, heat-emitting electronic components such as micro-processed wafers are provided on the motherboard of the 775 model or the AM2 model or the K8 model. In order to effectively dissipate the heat generated by the micro-processed wafer, a heat sink combination is closely attached to the heat-dissipating surface of the micro-processed wafer to assist heat dissipation of the heat-generating electronic component and ensure that the heat-generating electronic component is at an appropriate temperature. Under work. The heat sink assembly generally includes a backboard fixed to the motherboard and a heat sink mounted on the backplane.

然而，習知散熱器組合之背板僅僅適合於一種型號之主機板，亦即一旦廠家成批製造好散熱器，那麼該等散熱器組合就只能安裝於775型號或AM2型號或K8型號之主機板上，不能同時相容於幾種不同之主機板。 However, the backplane of the conventional heat sink combination is only suitable for one type of motherboard, that is, once the manufacturer manufactures the heat sink in batches, the heat sink combination can only be installed on the 775 model or the AM2 model or the K8 model. On the motherboard, it cannot be compatible with several different motherboards at the same time.

一種適配不同型號之主機板之背板組合，該背板組合包括一背板及與該背板配合之複數固定件，該背板上開設有間隔設置並分別對應不同型號主機板之複數安裝孔，每一安裝孔包括一第一孔及位於第一孔下方、孔徑較第一孔小之一第二孔，每一固定件與對應之安裝孔過盈配合，其包括容置於第一孔內之一擋止部及自擋止部延伸並穿設第二孔而與主機板配合之一連接部。 A backboard assembly for adapting different types of motherboards, the backplane assembly includes a backboard and a plurality of fixing members matched with the backboard, and the backplane is provided with a plurality of spacers and corresponding to different types of motherboards a hole, each mounting hole includes a first hole and a second hole below the first hole and having a smaller aperture than the first hole, and each fixing member has an interference fit with the corresponding mounting hole, and the mounting hole comprises the first hole One of the blocking portion and the self-stop portion extend through the second hole to engage with the motherboard.

相較於習知技術，該固定件穿過背板不同位置之安裝孔與主機板配合，從而將背板裝設於不同型號之主機板上。 Compared with the prior art, the fixing member is matched with the motherboard through the mounting holes at different positions of the backboard, so that the backboard is mounted on different models of the motherboard.

10‧‧‧背板 10‧‧‧ Backboard

11‧‧‧連接部 11‧‧‧Connecting Department

12‧‧‧延伸部 12‧‧‧Extension

13‧‧‧過渡部 13‧‧‧Transition Department

14‧‧‧安裝部 14‧‧‧Installation Department

15‧‧‧安裝孔 15‧‧‧Mounting holes

16‧‧‧加強肋 16‧‧‧Strengthened ribs

20‧‧‧第一主機板 20‧‧‧First motherboard

21‧‧‧電子元件 21‧‧‧Electronic components

23‧‧‧穿孔 23‧‧‧Perforation

30‧‧‧第二主機板 30‧‧‧Second motherboard

40‧‧‧第三主機板 40‧‧‧ Third motherboard

50‧‧‧固定件 50‧‧‧Fixed parts

51‧‧‧擋止部 51‧‧‧stops

53‧‧‧連接部 53‧‧‧Connecting Department

151‧‧‧第一孔 151‧‧‧ first hole

153‧‧‧第二孔 153‧‧‧ second hole

154‧‧‧稜面 154‧‧‧Face

155‧‧‧擋止面 155‧‧ ‧ stop surface

圖1係本發明之背板安裝於第一主機板上之立體組合圖。 1 is a perspective assembled view of a backboard of the present invention mounted on a first motherboard.

圖2係圖1之立體分解圖。 2 is an exploded perspective view of FIG. 1.

圖3係圖1中背板與第一主機板另一視角之立體分解圖。 3 is an exploded perspective view of the back panel and the first motherboard of FIG. 1 from another perspective.

圖4係圖1中之背板安裝於第二主機板上之立體組合圖。 4 is a perspective assembled view of the backplane of FIG. 1 mounted on a second motherboard.

圖5係圖1中之背板安裝於第三主機板上之立體組合圖。 FIG. 5 is a perspective assembled view of the backplane of FIG. 1 mounted on a third motherboard.

請參閱圖1至圖3，本發明背板組合包括抵靠於第一主機板20一側之一背板10及穿過背板10及第一主機板20之複數固定件50。其中該背板10可按照實際應用需要調整固定件50之位置而分別適用於不同規格之主機板，本發明之背板10可應用於第一主機板20、第二主機板30及第三主機板40，其中第一主機板20之型號為775，第二主機板30之型號為AM2，第三主機板之型號為K8，當然本發明背板10之應用不限於上述型號之主機板，亦可運用於其他型號之主機板上。 Referring to FIG. 1 to FIG. 3 , the backplane assembly of the present invention includes a backing plate 10 abutting against one side of the first motherboard 20 and a plurality of fixing members 50 passing through the backing plate 10 and the first motherboard 20 . The backplane 10 can be applied to different motherboards according to the actual application requirements. The backplane 10 of the present invention can be applied to the first motherboard 20, the second motherboard 30, and the third host. The board 40, wherein the model of the first motherboard 20 is 775, the model of the second motherboard 30 is AM2, and the third host The model of the board is K8. Of course, the application of the backboard 10 of the present invention is not limited to the motherboard of the above model, and can also be applied to motherboards of other models.

每一固定件50包括一擋止部51及自擋止部51中部垂直向下延伸之一中空連接部53。該擋止部51呈六稜柱狀，其尺寸較該連接部53之尺寸大。該連接部53為一中空之圓柱形螺管，其內表面攻設有螺紋。該擋止部51之中央位置處設有一與連接部53之螺管連通之通孔(圖未標)。該連接部53之自由端及連接部53與擋止部51之連接處均進行倒圓角設計，從而使固定件50方便安裝至背板10上。 Each of the fixing members 50 includes a stopping portion 51 and a hollow connecting portion 53 extending vertically downward from the central portion of the blocking portion 51. The stopper portion 51 has a hexagonal prism shape and is larger in size than the connection portion 53. The connecting portion 53 is a hollow cylindrical screw whose inner surface is tapped with a thread. A through hole (not shown) communicating with the solenoid of the connecting portion 53 is disposed at a central position of the stopping portion 51. The free end of the connecting portion 53 and the connection between the connecting portion 53 and the stopping portion 51 are rounded, so that the fixing member 50 is conveniently mounted to the backing plate 10.

該背板10由塑膠材料製成，且關於其橫向之中心線(圖未示)及縱向之中心線(圖未示)對稱設置。該背板10呈封閉之環狀設置，包括平行且間隔設置之二縱長連接部11、自每一連接部11相對兩端傾斜向外延伸之一延伸部12、自每一延伸部12之末端向內傾斜延伸之一過渡部13及分別連接同一側二過渡部13末端之一弧形安裝部14。該背板10之背面設置有複數加強肋16用以加強背板10之強度。每一延伸部12及過渡部13之連接處開設有一安裝孔15。每一過渡部13與每一安裝部14之連接處及每一安裝部14之中部亦開設有一安裝孔15。每一安裝孔15為沉頭孔，包括一孔徑較大、橫截面大致呈多邊形之第一孔151及位於第一孔151下方中部、孔徑較第一孔151小、橫截面呈圓形之第二孔153。該第一孔151與第二孔153之間形成有一擋止面155，用以限定固定件50。該第一孔151周緣之壁面由複數相互連接且呈一定角度設置之稜面154 組成，用於卡設固定件50之擋止部51，從而使固定件50裝設於安裝孔15後不會隨意轉動。該第一孔151之內部尺寸稍小於固定件50之擋止部51之外部尺寸，該第二孔153之內徑稍小於固定件50之連接部53之外徑，使得固定件50與安裝孔15過盈配合。該等安裝孔15之具體位置係根據第一、第二及第三主機板20、30、40之規格設計，從而使固定件50通過背板10之對應安裝孔15而將背板10安裝於不同之主機板上。 The backing plate 10 is made of a plastic material and is symmetrically disposed about a center line (not shown) of the lateral direction and a center line (not shown) of the longitudinal direction. The back plate 10 is disposed in a closed annular shape, and includes two longitudinally connected connecting portions 11 which are parallel and spaced apart, and an extending portion 12 extending obliquely outward from opposite ends of each connecting portion 11 , from each extending portion 12 One end of the end portion is inclined inwardly and one of the transition portions 13 and one of the ends of the same side two transition portion 13 are respectively connected to the arc-shaped mounting portion 14. The back surface of the back plate 10 is provided with a plurality of reinforcing ribs 16 for reinforcing the strength of the back plate 10. A mounting hole 15 is defined in the joint of each of the extending portion 12 and the transition portion 13. A mounting hole 15 is also formed in the joint between each of the transition portions 13 and each of the mounting portions 14 and the middle portion of each of the mounting portions 14. Each of the mounting holes 15 is a counterbore, and includes a first hole 151 having a large aperture and a substantially polygonal cross section, and a first portion below the first hole 151, a smaller aperture than the first hole 151, and a circular cross section. Two holes 153. A stopping surface 155 is formed between the first hole 151 and the second hole 153 for defining the fixing member 50. The wall surface of the periphery of the first hole 151 is a plurality of facets 154 which are connected to each other and are disposed at an angle. The composition is used to clamp the stopper portion 51 of the fixing member 50, so that the fixing member 50 is not arbitrarily rotated after being mounted on the mounting hole 15. The inner dimension of the first hole 151 is slightly smaller than the outer dimension of the blocking portion 51 of the fixing member 50. The inner diameter of the second hole 153 is slightly smaller than the outer diameter of the connecting portion 53 of the fixing member 50, so that the fixing member 50 and the mounting hole 15 interference fit. The specific positions of the mounting holes 15 are designed according to the specifications of the first, second and third motherboards 20, 30, 40, so that the fixing member 50 is mounted on the back plate 10 through the corresponding mounting holes 15 of the back plate 10. Different on the motherboard.

組裝時，將固定件50對準背板10每一延伸部12與過渡部13之連接處之安裝孔15，然後手動按壓背板10，使固定件50相對背板10運動至自固定件50穿設於安裝孔15。其中，固定件50之連接部53緊配合收容於安裝孔15之第二孔153中，固定件50之擋止部51緊配合收容於安裝孔15之第一孔151中並且與擋止面155相抵靠以起到限位之作用。背板組合組裝完成後，將該背板組合置於第一主機板20之背面，使得固定件50之連接部53穿過該第一主機板20之四穿孔23，再與穿過安裝在第一主機板20上之電子元件21之散熱器(圖未示)之螺釘(圖未示)配合，即該螺釘穿過散熱器後與固定件50之連接部53螺合。 During assembly, the fixing member 50 is aligned with the mounting hole 15 at the junction of each extending portion 12 of the backing plate 10 and the transition portion 13, and then the backing plate 10 is manually pressed to move the fixing member 50 relative to the backing plate 10 to the self-fixing member 50. It is worn through the mounting hole 15 . The connecting portion 53 of the fixing member 50 is tightly received in the second hole 153 of the mounting hole 15 . The blocking portion 51 of the fixing member 50 is tightly received in the first hole 151 of the mounting hole 15 and is opposite to the blocking surface 155 . Abut against each other to play a role in the limit. After the assembly of the backboard assembly is completed, the backboard assembly is placed on the back of the first motherboard 20, so that the connecting portion 53 of the fixing member 50 passes through the four through holes 23 of the first motherboard 20, and then is installed through the first A screw (not shown) of a heat sink (not shown) of the electronic component 21 on the motherboard 20 is engaged, that is, the screw is screwed into the connecting portion 53 of the fixing member 50 after passing through the heat sink.

請同時參閱圖4及圖5，當背板10需安裝在第二主機板30或第三主機板40上時，只需將螺母50預先裝設於過渡部13與安裝部14之連接處之安裝孔15或安裝部14中部之二安裝孔15中並使對應之螺釘(圖未示)與固定件50配合即可將背板10裝設於不同之主機板上。 Referring to FIG. 4 and FIG. 5 simultaneously, when the backboard 10 needs to be mounted on the second motherboard 30 or the third motherboard 40, the nut 50 only needs to be pre-installed at the junction of the transition portion 13 and the mounting portion 14. The mounting hole 15 or the two mounting holes 15 in the middle of the mounting portion 14 and the corresponding screws (not shown) are engaged with the fixing member 50 to mount the back plate 10 on different main boards.

綜上所述，本發明之背板組合通過固定件50安裝在背板10之不同位置可分別安裝於第一主機板20第二主機板30或第三主機板40上，進而固定安裝第一、第二及第三主機板20、30、40之散熱器。由於固定件50與背板10之安裝孔15為適當之過盈配合，加上固定件50與背板10之倒圓角之設計，使得固定件50既可以預設在背板10中，也可以根據需要手動將固定件50拆出再安裝至所需之安裝孔15中，以配合不同型號之主機板。 In summary, the backplane assembly of the present invention can be mounted on the second motherboard 30 or the third motherboard 40 of the first motherboard 20 by the fixing member 50 at different positions of the backplane 10, thereby being fixedly mounted first. The heat sinks of the second and third motherboards 20, 30, and 40. Due to the proper interference fit between the fixing member 50 and the mounting hole 15 of the backing plate 10, and the rounding of the fixing member 50 and the backing plate 10, the fixing member 50 can be preset in the backing plate 10 as well. The fixing member 50 can be manually removed and installed into the required mounting holes 15 as needed to match the different types of motherboards.

綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧背板 10‧‧‧ Backboard

11‧‧‧連接部 11‧‧‧Connecting Department

12‧‧‧延伸部 12‧‧‧Extension

13‧‧‧過渡部 13‧‧‧Transition Department

14‧‧‧安裝部 14‧‧‧Installation Department

15‧‧‧安裝孔 15‧‧‧Mounting holes

20‧‧‧第一主機板 20‧‧‧First motherboard

21‧‧‧電子元件 21‧‧‧Electronic components

23‧‧‧穿孔 23‧‧‧Perforation

50‧‧‧固定件 50‧‧‧Fixed parts

51‧‧‧擋止部 51‧‧‧stops

53‧‧‧連接部 53‧‧‧Connecting Department

151‧‧‧第一孔 151‧‧‧ first hole

153‧‧‧第二孔 153‧‧‧ second hole

154‧‧‧稜面 154‧‧‧Face

155‧‧‧擋止面 155‧‧ ‧ stop surface

Claims

一種適配不同型號之主機板之背板組合，該背板組合包括一背板及與該背板配合之複數固定件，其改良在於：該背板上開設有間隔設置並分別對應不同型號主機板之複數安裝孔，每一安裝孔包括一第一孔及位於第一孔下方、孔徑較第一孔小之一第二孔，每一固定件與對應之安裝孔過盈配合，其包括容置於第一孔內之一擋止部及自擋止部延伸並穿設第二孔而與主機板配合之一連接部，該安裝孔之第一孔周緣之壁面由複數相互連接且呈一定角度設置之稜面組成，用於卡設固定件之擋止部。 A backboard assembly for adapting different types of motherboards, the backplane assembly includes a backboard and a plurality of fixing members matched with the backboard, wherein the backplane is provided with a spacing arrangement and corresponding to different models of the host a plurality of mounting holes, each mounting hole includes a first hole and a second hole below the first hole and having a smaller aperture than the first hole, and each fixing member has an interference fit with the corresponding mounting hole, and includes a tolerance a connecting portion extending in the first hole and extending from the blocking portion and passing through the second hole to cooperate with the main board, wherein the wall surface of the first hole of the mounting hole is connected to each other by a plurality of The angled surface of the angle is used to clamp the stop of the fixing member.

如申請專利範圍第1項所述之背板組合，其中該擋止部之外徑較安裝孔之第一孔之內徑大。 The backboard assembly of claim 1, wherein the outer diameter of the blocking portion is larger than the inner diameter of the first hole of the mounting hole.

如申請專利範圍第1項所述之背板組合，其中該連接部之外徑較安裝孔之第二孔之內徑大。 The backboard assembly of claim 1, wherein the outer diameter of the connecting portion is larger than the inner diameter of the second hole of the mounting hole.

如申請專利範圍第1項所述之背板組合，其中該固定件之擋止部呈多邊形稜柱狀，用於與安裝孔之第一孔卡設，該固定件之連接部為一內空之螺管，其內表面攻設有螺紋。 The backplane assembly of claim 1, wherein the fixing portion has a polygonal prism shape for engaging with the first hole of the mounting hole, and the connecting portion of the fixing member is an inner space. The solenoid has a thread on its inner surface.

如申請專利範圍第1項所述之背板組合，其中該背板包括二間隔設置之二縱長連接部、自每一連接部相對兩端傾斜向外延伸之一延伸部、自每一延伸部之末端向內傾斜延伸之一過渡部及分別連接同一側二過渡部末端之一安裝部，該安裝孔分別設置於每一延伸部與過渡部之連接處、每一過渡部與每一安裝部之連接處及每一安裝部之中部。 The backplane assembly of claim 1, wherein the backboard comprises two spaced apart lengthwise connecting portions, one extending from the opposite ends of each connecting portion, and extending from each of the connecting portions. One end of the portion is inclined inwardly and one of the transition portions is respectively connected to one of the ends of the same side and two transition portions, and the mounting holes are respectively disposed at the joint of each of the extending portions and the transition portion, each transition portion and each A joint between the mounting portion and the middle of each mounting portion.

如申請專利範圍第5項所述之背板組合，其中該固定件穿過每一延伸部與過渡部之連接處之安裝孔從而將該背板固定於一第一主機板上。 The backplane assembly of claim 5, wherein the fixing member passes through a mounting hole at a joint of each of the extending portions and the transition portion to fix the backing plate to a first motherboard.

如申請專利範圍第5項所述之背板組合，其中該固定件穿過每一過渡部與每一安裝部之連接處之安裝孔從而將該背板固定於一第二主機板上。 The backplane assembly of claim 5, wherein the fixing member passes through a mounting hole at a joint of each of the transition portions and each mounting portion to fix the backboard to a second motherboard.

如申請專利範圍第5項所述之背板組合，其中該固定件穿過每一安裝部之中部從而將該背板固定於一第三主機板上。 The backplane assembly of claim 5, wherein the fixing member passes through the middle of each mounting portion to fix the backboard to a third motherboard.

如申請專利範圍第5項所述之背板組合，其中該背板之背面設置有複數加強肋用以加強背板之強度。 The backboard assembly of claim 5, wherein the back of the backboard is provided with a plurality of reinforcing ribs for reinforcing the strength of the backboard.