TWI404905B - Fixing jig and fixture module thereof - Google Patents
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- TWI404905B TWI404905B TW98138282A TW98138282A TWI404905B TW I404905 B TWI404905 B TW I404905B TW 98138282 A TW98138282 A TW 98138282A TW 98138282 A TW98138282 A TW 98138282A TW I404905 B TWI404905 B TW I404905B
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本發明係關於一種物件固定治具及其固定裝置組，特別是一種可以同時將至少一散熱器同時固定在主機板之至少一特定位置之物件固定治具及其固定裝置組。The invention relates to an object fixing jig and a fixing device group thereof, in particular to an object fixing jig and a fixing device group thereof which can simultaneously fix at least one heat sink to at least one specific position of the main board.
主機板上之晶片在運作時會產生的廢熱並使晶片之溫度升高，為了使晶片能在適當溫度下正常運作，通常在晶片上設置一散熱器，將晶片產生之熱傳導至散熱器上，達到使晶片降溫之目的。The waste heat generated by the wafer on the motherboard during operation causes the temperature of the wafer to rise. In order to enable the wafer to operate normally at an appropriate temperature, a heat sink is usually disposed on the wafer to conduct the heat generated by the wafer to the heat sink. Achieve the purpose of cooling the wafer.
散熱器之材質為導熱性佳之金屬(例如銅合金或鋁合金)，然而晶片或散熱器之接觸面間通常具有許多微小的空隙，此空隙會造成晶片與散熱器接觸不完整，降低散熱器的散熱效率，因此在習知技術中，會在晶片與散熱器間塗佈散熱膏(或稱導熱膏)，散熱膏可將空隙填滿以確保晶片與散熱器間能均勻接觸。The heat sink is made of a metal with good thermal conductivity (such as copper alloy or aluminum alloy). However, there are usually many tiny gaps between the contact faces of the wafer or the heat sink. This gap will cause the wafer to be in incomplete contact with the heat sink, reducing the heat sink. Heat dissipation efficiency, therefore, in the prior art, a thermal grease (or thermal paste) is applied between the wafer and the heat sink, and the thermal grease can fill the gap to ensure uniform contact between the wafer and the heat sink.
在習知技術中，在晶片與散熱器接合前，先在晶片上塗佈一層散熱膏，在散熱器上塗佈一層催化劑，在15秒內對晶片與散熱器施予壓力使兩者接合。若超過15秒，則催化劑易硬化而造成晶片與散熱器之接合不牢，極易產生日後脫落的缺點。然而，目前將散熱器置於晶片之步驟係以人工之方式完成，且主機板上之晶片數量通常不止一個，使用人工之方式將無法滿足在15秒內完成所有晶片與散熱器之接合，造成晶片與散熱器接合後之良率極低。In the prior art, before the wafer is bonded to the heat sink, a layer of thermal grease is applied to the wafer, a layer of catalyst is coated on the heat sink, and the wafer and the heat sink are pressurized in 15 seconds to join the two. If it exceeds 15 seconds, the catalyst is easily hardened, and the bonding between the wafer and the heat sink is not strong, and the defect of falling off in the future is extremely likely to occur. However, the current step of placing the heat sink on the wafer is done manually, and the number of wafers on the motherboard is usually more than one. Manually, it will not be able to complete the bonding of all the wafers to the heat sink in 15 seconds, resulting in The yield of the wafer after it is bonded to the heat sink is extremely low.
因此，有必要提供一種物件固定治具及其固定裝置組，以改善習知技術所存在之問題。Therefore, it is necessary to provide an object fixing jig and a fixing device group thereof to improve the problems of the prior art.
為改善先前技術所存在的問題，本發明之主要目的係在提供一種物件固定治具及其固定裝置組。In order to improve the problems of the prior art, the main object of the present invention is to provide an object fixing jig and a fixing device set thereof.
本發明首先提供一種固定裝置組，包括二固定裝置，各固定裝置包括固定裝置本體、定位元件及擋塊。其中固定裝置本體包括容置空間；定位元件係與固定裝置本體連結；以及擋塊包括凹槽，擋塊係設置在容置空間中，擋塊係可旋轉地與固定裝置本體連結。The invention firstly provides a fixing device set comprising two fixing devices, each fixing device comprising a fixing device body, a positioning component and a stopper. The fixing device body includes an accommodating space; the positioning component is coupled to the fixing device body; and the stopper includes a groove, the stopper is disposed in the accommodating space, and the dam is rotatably coupled to the fixing device body.
藉此，固定裝置組可呈支撐狀態或釋放狀態；當定位元件位於凹槽時，固定裝置組為支撐狀態；且當擋塊旋轉一角度且定位元件脫離凹槽時，固定裝置組為釋放狀態。Thereby, the fixing device group can be in a supporting state or a releasing state; when the positioning component is located in the groove, the fixing device group is in a supporting state; and when the stopper rotates at an angle and the positioning component is disengaged from the groove, the fixing device group is in a released state. .
在本發明之一實施例中，固定裝置本體更包括至少一第一穿孔；擋塊更包括一第二穿孔；且固定裝置更包括轉軸，係穿設至少一第一穿孔及第二穿孔，擋塊係可旋轉地與固定裝置本體連結。In an embodiment of the present invention, the fixing device body further includes at least one first through hole; the stopper further includes a second through hole; and the fixing device further includes a rotating shaft, and the at least one first through hole and the second through hole are disposed The block is rotatably coupled to the fixture body.
本發明再提供一種物件固定治具，用以將至少一物件同時固定在基板之至少一特定位置。物件固定治具包括治具本體及至少一固定裝置組。其中治具本體包括至少一開口，至少一開口之位置係相對應於至少一特定位置；至少一固定裝置組係設置於至少一開口處，至少一固定裝置組可呈支撐狀態或釋放狀態。The invention further provides an article fixing jig for simultaneously fixing at least one object at at least one specific position of the substrate. The object fixing jig includes a jig body and at least one fixing device group. The fixture body includes at least one opening, and at least one opening corresponds to at least one specific position; at least one fixing device group is disposed at at least one opening, and at least one fixing device group can be in a supporting state or a released state.
當至少一固定裝置組為支撐狀態時，至少一物件可置於至少一固定裝置組中；且當治具本體之至少一開口係對應至至少一特定位置時，則將至少一固定裝置組切換為釋放狀態，可使至少一物件脫離至少一固定裝置組並同時固定在基板之至少一特定位置上。At least one object may be placed in at least one fixture group when at least one fixture group is in a support state; and at least one fixture group is switched when at least one opening of the fixture body corresponds to at least one specific location In the released state, at least one item can be detached from at least one of the sets of fixtures and simultaneously secured to at least one particular location of the substrate.
在本發明之一實施例中，固定裝置組包括二固定裝置，各固定裝置包括固定裝置本體、定位元件及擋塊。其中固定裝置本體包括容置空間；定位元件係與固定裝置本體連結；以及擋塊包括凹槽，擋塊係設置在容置空間中，擋塊係可旋轉地與固定裝置本體連結。In an embodiment of the invention, the set of fixtures includes two fixtures, each fixture comprising a fixture body, a positioning element, and a stop. The fixing device body includes an accommodating space; the positioning component is coupled to the fixing device body; and the stopper includes a groove, the stopper is disposed in the accommodating space, and the dam is rotatably coupled to the fixing device body.
藉此，當定位元件位於凹槽時，至少一固定裝置組為支撐狀態，且擋塊之一端可支撐至少一物件；當擋塊旋轉一角度且定位元件脫離凹槽時，至少一固定裝置組為釋放狀態，且至少一物件係可脫離固定裝置。Thereby, when the positioning component is located in the groove, at least one fixing device group is in a supporting state, and one end of the blocking block can support at least one object; when the blocking block rotates at an angle and the positioning component is disengaged from the groove, at least one fixing device group To release the state, and at least one item can be detached from the fixture.
在本發明之一實施例中，固定裝置本體更包括至少一第一穿孔；擋塊更包括一第二穿孔；且固定裝置更包括轉軸，係穿設至少一第一穿孔及第二穿孔，擋塊係可旋轉地與固定裝置本體連結。In an embodiment of the present invention, the fixing device body further includes at least one first through hole; the stopper further includes a second through hole; and the fixing device further includes a rotating shaft, and the at least one first through hole and the second through hole are disposed The block is rotatably coupled to the fixture body.
為讓本發明之上述和其他目的、特徵和優點能更明顯易懂，下文特舉出較佳實施例，並配合所附圖式，作詳細說明如下。The above and other objects, features, and advantages of the present invention will become more apparent from the description of the appended claims.
以下請先參考圖1至圖3關於根據本發明之一實施例之固定裝置組。其中圖1為根據本發明之一實施例之固定裝置組之分解圖示意圖；圖2為根據本發明之一實施例之固定裝置組之固定裝置呈支撐狀態之示意圖；並且圖3為根據本發明之一實施例之固定裝置組之固定裝置呈釋放狀態之示意圖。Hereinafter, please refer to FIG. 1 to FIG. 3 with respect to a fixing device group according to an embodiment of the present invention. 1 is a schematic exploded view of a fixing device set according to an embodiment of the present invention; FIG. 2 is a schematic view showing a fixing device of a fixing device group in a supporting state according to an embodiment of the present invention; The fixture of the fixture set of one embodiment is in a schematic view of the released state.
如圖1所示，根據本發明之一實施例之固定裝置組10包括兩個固定裝置100，各個固定裝置100包括固定裝置本體110、定位元件120及擋塊130。其中，固定裝置本體110包括兩個第一穿孔111、容置空間112及轉軸140。定位元件120係與固定裝置本體110連結。擋塊130包括第二穿孔131及凹槽132。擋塊130係設置在容置空間112中，其中轉軸140係穿設兩個第一穿孔111及第二穿孔131，藉此，擋塊130係可旋轉地與固定裝置本體110連結，但本發明不以此連結方式為限。舉例來說，擋塊130之兩側可設有凸塊(圖未示)，固定裝置本體110內可設相對應之凹處(圖未示)，如此，擋塊130亦可以嵌合的方式與固定裝置本體110可旋轉地連結。因此，擋塊130與固定裝置本體110之連結方式，並不以設置第一穿孔110、轉軸140及第二穿孔131為限。As shown in FIG. 1, a fixture set 10 according to an embodiment of the present invention includes two fixtures 100, each fixture 100 including a fixture body 110, a positioning element 120, and a stop 130. The fixing device body 110 includes two first through holes 111 , an accommodating space 112 , and a rotating shaft 140 . The positioning element 120 is coupled to the fixture body 110. The stopper 130 includes a second through hole 131 and a groove 132. The stopper 130 is disposed in the accommodating space 112, wherein the rotating shaft 140 is configured to pass through the two first through holes 111 and the second through holes 131, whereby the stopper 130 is rotatably coupled to the fixing device body 110, but the present invention Not limited to this link. For example, the two sides of the stopper 130 may be provided with a protrusion (not shown), and a corresponding recess (not shown) may be disposed in the fixing device body 110. Thus, the stopper 130 may also be fitted. It is rotatably coupled to the fixture body 110. Therefore, the manner in which the stopper 130 and the fixture body 110 are coupled is not limited to the first through hole 110, the rotating shaft 140, and the second through hole 131.
在本發明之一實施例中，固定裝置組10之固定裝置100可呈支撐狀態或釋放狀態，以下請參考圖2及圖3關於根據本發明之一實施例之固定裝置組之固定裝置呈支撐狀態或釋放狀態之示意圖。In an embodiment of the present invention, the fixing device 100 of the fixing device group 10 can be in a supporting state or a releasing state. Please refer to FIG. 2 and FIG. 3 for supporting the fixing device of the fixing device group according to an embodiment of the present invention. Schematic diagram of the status or release status.
如圖2所示，當定位元件120位於凹槽132時，固定裝置100為支撐狀態。在本發明之一實施例中，定位元件120之一端係與固定裝置本體110螺旋接合，定位元件120之另一端之形狀係相對應於凹槽132。舉例來說，凹槽132之形狀係呈凹半圓形，定位元件120之另一端之形狀係呈凸半圓形，且定位元件120之另一端之直徑係實質上略小於凹槽132之直徑。藉此，定位元件120之一端係可與凹槽132可分離式地連結，但本發明不以此為限。As shown in FIG. 2, when the positioning member 120 is located in the recess 132, the fixture 100 is in a support state. In one embodiment of the invention, one end of the positioning element 120 is in helical engagement with the fixture body 110, and the other end of the positioning element 120 is shaped to correspond to the recess 132. For example, the shape of the groove 132 is a concave semicircle, and the other end of the positioning member 120 has a convex semicircular shape, and the other end of the positioning member 120 has a diameter substantially smaller than the diameter of the groove 132. . Thereby, one end of the positioning element 120 can be detachably coupled to the groove 132, but the invention is not limited thereto.
如圖3所示，當擋塊130旋轉一角度且定位元件120脫離凹槽132時，固定裝置100為釋放狀態。在本發明之一實施例中，擋塊130脫離凹槽132所旋轉之角度實質上係90度，但本發明不以此為限。As shown in FIG. 3, when the stopper 130 is rotated by an angle and the positioning member 120 is disengaged from the recess 132, the fixing device 100 is in a released state. In one embodiment of the present invention, the angle at which the stopper 130 is rotated away from the groove 132 is substantially 90 degrees, but the invention is not limited thereto.
接下來請一併參考圖4至圖7關於根據本發明之一實施例之物件固定治具。其中圖4及圖5為根據本發明之一實施例之物件固定治具之上視圖及下視圖；並且圖6及圖7為根據本發明之一實施例之物件固定治具之操作示意圖。Next, please refer to FIG. 4 to FIG. 7 together with respect to the article fixing jig according to an embodiment of the present invention. 4 and 5 are a top view and a bottom view of an article fixing jig according to an embodiment of the present invention; and FIGS. 6 and 7 are schematic views showing the operation of the article fixing jig according to an embodiment of the present invention.
如圖4及圖5所示，根據本發明之一實施例之物件固定治具1係用以將至少一物件30同時固定在如圖6及圖7所示之基板40之至少一特定位置41。其中在本發明之一實施例中，物件30係散熱器，基板40係主機板，特定位置41係設置發熱元件50(譬如各種晶片或中央處理器等等)之位置，但本發明不以此為限。關於如何藉由本發明之物件固定治具1將至少一物件30固定在基板40之至少一特定位置41之操作方式將於後述說明。As shown in FIG. 4 and FIG. 5, the object fixing jig 1 according to an embodiment of the present invention is used for simultaneously fixing at least one object 30 at at least one specific position 41 of the substrate 40 as shown in FIGS. 6 and 7. . In one embodiment of the present invention, the object 30 is a heat sink, the substrate 40 is a motherboard, and the specific position 41 is a position where the heat generating component 50 (such as various wafers or a central processing unit, etc.) is disposed, but the present invention does not Limited. An operation mode in which at least one object 30 is fixed to at least one specific position 41 of the substrate 40 by the article fixing jig 1 of the present invention will be described later.
如圖4及圖5所示，物件固定治具1包括治具本體20及至少一固定裝置組10。治具本體20包括複數開口21及複數支柱22。其中各開口21之位置係相對應於基板40之各特定位置41；且各固定裝置組10係設置於各開口21處。As shown in FIGS. 4 and 5, the article fixing jig 1 includes a jig body 20 and at least one fixing device group 10. The jig body 20 includes a plurality of openings 21 and a plurality of struts 22. The positions of the openings 21 are corresponding to the specific positions 41 of the substrate 40; and each fixing device group 10 is disposed at each opening 21.
如圖4及圖5所示，在本發明之一實施例中，治具本體20包括七個開口21，且物件固定治具1包括七個固定裝置組10，各固定裝置組10係設置於各開口21處，但本發明不以此為限。另須注意的是，治具本體20之開口21之位置、數量及尺寸可視基板40之發熱元件50之位置及數量而作不同設計，而不以圖4及圖5所示者為限。As shown in FIG. 4 and FIG. 5, in an embodiment of the present invention, the fixture body 20 includes seven openings 21, and the object fixing fixture 1 includes seven fixing device groups 10, and each fixing device group 10 is disposed on Each opening 21 is, but the invention is not limited thereto. It should be noted that the position, number and size of the openings 21 of the fixture body 20 may be differently designed depending on the position and number of the heating elements 50 of the substrate 40, and are not limited to those shown in FIGS. 4 and 5.
複數支柱22係可分離式地與基板40連結，在本發明之一實施例中，物件固定治具1係藉由各支柱22與基板40螺旋接合，但本發明不以此為限。The plurality of struts 22 are detachably coupled to the substrate 40. In one embodiment of the present invention, the article fixing jig 1 is spirally joined to the substrate 40 by the struts 22, but the invention is not limited thereto.
在本發明之一實施例中，固定裝置組10可藉由各個固定裝置100而呈支撐狀態及釋放狀態。當固定裝置組10為支撐狀態時，物件30可置於固定裝置組10中。當治具本體20之各開口21係對應至各特定位置41時，若將各固定裝置組10切換為釋放狀態，可使物件30脫離各固定裝置組10，以使各物件可同時固定在基板40之各特定位置41上。In an embodiment of the present invention, the fixture set 10 can be in a supported state and a released state by the respective fixtures 100. When the fixture set 10 is in the support state, the article 30 can be placed in the fixture set 10. When each opening 21 of the jig body 20 corresponds to each specific position 41, if each fixing device group 10 is switched to the released state, the object 30 can be detached from each fixing device group 10, so that the objects can be simultaneously fixed on the substrate. Each of the 40 specific locations is 41.
如圖6所示，物件30係穿過治具本體20之開口21而置於固定裝置組10內，當固定裝置組10係呈支撐狀態時，擋塊130之一端可支撐物件30，而不使物件30落下。在本發明之一實施例中，物件固定治具1及基板40係設置在施壓裝置60下。在本發明之一實施例中，施壓裝置60係壓床，但本發明不以此為限。As shown in FIG. 6, the object 30 is placed in the fixture set 10 through the opening 21 of the fixture body 20. When the fixture set 10 is in the support state, one end of the stopper 130 can support the article 30 without The object 30 is allowed to fall. In an embodiment of the present invention, the article fixing jig 1 and the substrate 40 are disposed under the pressing device 60. In an embodiment of the invention, the pressing device 60 is a press, but the invention is not limited thereto.
在本發明之一實施例中，在將物件30固定在發熱元件50前，物件30係先塗佈一層催化劑91，且基板40上之發熱元件50表面係先塗佈一層散熱膏92，但本發明不以此為限。In an embodiment of the present invention, before the object 30 is fixed to the heating element 50, the object 30 is first coated with a layer of catalyst 91, and the surface of the heating element 50 on the substrate 40 is first coated with a layer of thermal grease 92, but The invention is not limited to this.
如圖7所示，當各開口21之位置係相對應於各特定位置41時，施壓裝置60係對物件固定治具1之上方施以一外加壓力使各物件30往擋塊130移動並使擋塊130旋轉一角度後，可使凹槽132離開定位元件120，此時各固定裝置組10為釋放狀態，各物件30可脫離各固定裝置組10，且施壓裝置60可同時將各物件30緊密壓合以固定在各發熱元件50上。在本發明之一實施例中，擋塊130旋轉之角度實質上係90度，但本發明不以此為限。As shown in FIG. 7, when the positions of the openings 21 correspond to the specific positions 41, the pressing device 60 applies an applied pressure to the upper portion of the object fixing jig 1 to move the objects 30 toward the stopper 130. After the block 130 is rotated by an angle, the groove 132 can be separated from the positioning component 120. At this time, each of the fixing device groups 10 is in a released state, and the objects 30 can be separated from the fixing device groups 10, and the pressing device 60 can simultaneously The article 30 is tightly pressed to be fixed to each of the heat generating elements 50. In an embodiment of the invention, the angle of rotation of the stop 130 is substantially 90 degrees, but the invention is not limited thereto.
藉由本發明之物件固定治具1可將各物件30(譬如散熱器)同時壓下，且可於同一步驟中達到將各物件30於約15秒內與各發熱元件50固定結合的製程要求，避免在先前技術中，因各物件30與各發熱元件50因人工之固定時間太久而使催化劑硬化之缺失。且當固定裝置組10呈釋放狀態後，可輕易地將物件固定治具1向上取出，以進行下一次壓合製程，減少了大量的壓合工時。須注意的是，當使用不同催化劑或散熱膏時，會有不同的壓合時間，本發明不以將各物件30與各發熱元件50固定結合的時間在15秒內為限。By the article fixing fixture 1 of the present invention, each object 30 (such as a heat sink) can be simultaneously pressed, and in the same step, the process requirements for fixing the respective components 30 to the respective heating elements 50 in about 15 seconds can be achieved. In the prior art, the absence of hardening of the catalyst due to the artificial fixation time of each of the articles 30 and the respective heat generating elements 50 is avoided. And when the fixing device group 10 is in the released state, the article fixing jig 1 can be easily taken up for the next pressing process, and a large number of pressing working hours are reduced. It should be noted that when different catalysts or heat-dissipating pastes are used, there will be different pressing times. The present invention does not limit the time for fixing the respective articles 30 to the respective heating elements 50 within 15 seconds.
綜上所陳，本發明無論就目的、手段及功效，在在均顯示其迥異於習知技術之特徵，懇請 貴審查委員明察，早日賜准專利，俾嘉惠社會，實感德便。惟應注意的是，上述諸多實施例僅係為了便於說明而舉例而已，本發明所主張之權利範圍自應以申請專利範圍所述為準，而非僅限於上述實施例。To sum up, the present invention, regardless of its purpose, means and efficacy, shows its distinctive features of the prior art. You are requested to review the examination and express the patent as soon as possible. It should be noted that the various embodiments described above are merely illustrative for ease of explanation, and the scope of the invention is intended to be limited by the scope of the claims.
1．．．物件固定治具1. . . Object fixing fixture
10．．．固定裝置組10. . . Fixture set
100．．．固定裝置100. . . Fixtures
110．．．固定裝置本體110. . . Fixed device body
111．．．第一穿孔111. . . First perforation
112．．．容置空間112. . . Housing space
120．．．定位元件120. . . Positioning element
130．．．擋塊130. . . Stoppers
131．．．第二穿孔131. . . Second perforation
132．．．凹槽132. . . Groove
140．．．轉軸140. . . Rotating shaft
20．．．治具本體20. . . Fixture body
21．．．開口twenty one. . . Opening
22．．．支柱twenty two. . . pillar
30．．．物件30. . . object
40．．．基板40. . . Substrate
41．．．特定位置41. . . Specific location
50．．．發熱元件50. . . Heating element
60．．．施壓裝置60. . . Pressure device
91．．．催化劑91. . . catalyst
92．．．散熱膏92. . . Thermal grease
圖1係根據本發明之一實施例之固定裝置組之分解示意圖。1 is an exploded perspective view of a set of fixtures in accordance with an embodiment of the present invention.
圖2係根據本發明之一實施例之固定裝置組之固定裝置呈支撐狀態之示意圖。2 is a schematic view showing a state in which a fixing device of a fixing device group is in a supported state according to an embodiment of the present invention.
圖3係根據本發明之一實施例之固定裝置組之固定裝置呈釋放狀態之示意圖。3 is a schematic view showing the fixing device of the fixing device set in a released state according to an embodiment of the present invention.
圖4係根據本發明之一實施例之物件固定治具之上視圖。Figure 4 is a top plan view of an article securing fixture in accordance with an embodiment of the present invention.
圖5係根據本發明之一實施例之物件固定治具之下視圖。Figure 5 is a bottom plan view of an article securing jig in accordance with an embodiment of the present invention.
圖6及圖7係根據本發明之一實施例之物件固定治具之操作示意圖。6 and 7 are schematic views showing the operation of the article fixing jig according to an embodiment of the present invention.
1‧‧‧物件固定治具1‧‧‧ Object fixture
10‧‧‧固定裝置組10‧‧‧Fixed device group
100‧‧‧固定裝置100‧‧‧Fixed devices
120‧‧‧定位元件120‧‧‧ Positioning components
130‧‧‧擋塊130‧‧ ‧stop
20‧‧‧治具本體20‧‧‧ fixture body
21‧‧‧開口21‧‧‧ openings
22‧‧‧支柱22‧‧‧ pillar
30‧‧‧物件30‧‧‧ objects
40‧‧‧基板40‧‧‧Substrate
41‧‧‧特定位置41‧‧‧Specific location
50‧‧‧發熱元件50‧‧‧heating components
60‧‧‧施壓裝置60‧‧‧ Pressure device
91‧‧‧催化劑91‧‧‧ Catalyst
92‧‧‧散熱膏92‧‧‧ Thermal grease
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98138282A TWI404905B (en) | 2009-11-11 | 2009-11-11 | Fixing jig and fixture module thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98138282A TWI404905B (en) | 2009-11-11 | 2009-11-11 | Fixing jig and fixture module thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201116797A TW201116797A (en) | 2011-05-16 |
| TWI404905B true TWI404905B (en) | 2013-08-11 |
Family
ID=44934964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98138282A TWI404905B (en) | 2009-11-11 | 2009-11-11 | Fixing jig and fixture module thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI404905B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4879629A (en) * | 1988-10-31 | 1989-11-07 | Unisys Corporation | Liquid cooled multi-chip integrated circuit module incorporating a seamless compliant member for leakproof operation |
| US20050263264A1 (en) * | 2004-05-28 | 2005-12-01 | Hon Hai Precision Industry Co., Ltd. | Heat sink mounting device |
| US20060042783A1 (en) * | 2004-09-02 | 2006-03-02 | Inventec Corporation | Heat sink for electronic device |
| US7224587B2 (en) * | 2004-06-18 | 2007-05-29 | International Business Machines Corporation | Heat sink and chip sandwich system |
| CN101208788A (en) * | 2005-06-27 | 2008-06-25 | 德州仪器公司 | Semiconductor device having firmly secured heat spreader |
-
2009
- 2009-11-11 TW TW98138282A patent/TWI404905B/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4879629A (en) * | 1988-10-31 | 1989-11-07 | Unisys Corporation | Liquid cooled multi-chip integrated circuit module incorporating a seamless compliant member for leakproof operation |
| US20050263264A1 (en) * | 2004-05-28 | 2005-12-01 | Hon Hai Precision Industry Co., Ltd. | Heat sink mounting device |
| US7224587B2 (en) * | 2004-06-18 | 2007-05-29 | International Business Machines Corporation | Heat sink and chip sandwich system |
| US20060042783A1 (en) * | 2004-09-02 | 2006-03-02 | Inventec Corporation | Heat sink for electronic device |
| CN101208788A (en) * | 2005-06-27 | 2008-06-25 | 德州仪器公司 | Semiconductor device having firmly secured heat spreader |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201116797A (en) | 2011-05-16 |
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