TWI404268B - Chip card locking structure and circuit board subassembly of using the same - Google Patents
Chip card locking structure and circuit board subassembly of using the same Download PDFInfo
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- TWI404268B TWI404268B TW97124173A TW97124173A TWI404268B TW I404268 B TWI404268 B TW I404268B TW 97124173 A TW97124173 A TW 97124173A TW 97124173 A TW97124173 A TW 97124173A TW I404268 B TWI404268 B TW I404268B
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Abstract
Description
本發明係關於一種晶片卡卡持模組及應用其之電路板組件，尤其關於一種可組裝雙晶片卡之晶片卡卡持結構。 The present invention relates to a wafer card holding module and a circuit board assembly using the same, and more particularly to a wafer card holding structure capable of assembling a dual chip card.
攜帶式電子裝置中，如行動電話，一般安裝有晶片卡，如用戶識別卡(Subscriber Identity Model，SIM卡)。其存儲了用戶之資訊，可對用戶身份進行鑒別。然該種用戶識別卡之存儲容量不大，遠遠不能滿足用戶對攜帶式電子裝置之存儲資訊之需求。由此，習知之攜帶式電子裝置中另外安裝一擴充存儲卡，如TIF卡(Tagged Image File Format)，其可存儲多種軟體資訊，如影音檔等，大大增加了攜帶式電子裝置之存儲容量。 In a portable electronic device, such as a mobile phone, a chip card, such as a Subscriber Identity Model (SIM card), is generally installed. It stores the user's information and can identify the user's identity. However, the storage capacity of the user identification card is not large enough to meet the user's need for storage information of the portable electronic device. Therefore, the conventional portable electronic device is additionally provided with an expansion memory card, such as a Tagged Image File Format, which can store various software information, such as audio and video files, and greatly increases the storage capacity of the portable electronic device.
習知擴充存儲卡一般設置於電子裝置之印刷電路板之表面，如圖1所示，一電子裝置之印刷電路板10’上設置有一用戶識別卡12’及一擴充存儲卡14’。所述用戶識別卡12’由一用戶識別卡卡持架122’卡持於印刷電路板10’之表面，所述擴充存儲卡14’通過一存儲卡卡持架142’卡持於印刷電路板10’之表面，且該用戶識別卡卡12’及擴充存儲卡14’通過一電路(未圖示)相連通。 The conventional expansion memory card is generally disposed on the surface of the printed circuit board of the electronic device. As shown in FIG. 1, a printed circuit board 10' of an electronic device is provided with a subscriber identity card 12' and an expansion memory card 14'. The user identification card 12' is held by a user identification card holder 122' on the surface of the printed circuit board 10'. The extended memory card 14' is held on the printed circuit board by a memory card holder 142'. The surface of 10', and the subscriber identity card 12' and the expansion memory card 14' are connected by a circuit (not shown).
然該種零件佈設方式中，用戶識別卡12’與擴充存儲卡14’分別平鋪設置於印刷電路板10’上，佔用印刷電路板10’過大之表面尺寸，使得印刷電路板10’之佈設其他零件之空間尺寸少，造成其他零件佈設不便。若加大 印刷電路板10’之面積，則不能減少電子裝置之尺寸面積。 However, in the component layout manner, the user identification card 12' and the extended memory card 14' are laid flat on the printed circuit board 10', occupying an excessively large surface size of the printed circuit board 10', so that the printed circuit board 10' is laid. Other parts have a small space size, which makes the placement of other parts inconvenient. If you increase The area of the printed circuit board 10' does not reduce the size area of the electronic device.
鑒於上述內容，有必要提供一種能在電路板表面節省佈設尺寸之晶片卡卡持結構。 In view of the above, it is necessary to provide a wafer card holding structure capable of saving the layout size on the surface of the board.
另外，本發明有必要提供一種應用所述晶片卡持結構之電路板組件。 Additionally, it is desirable in the present invention to provide a circuit board assembly that utilizes the wafer holding structure.
一種晶片卡卡持結構，包括一第一晶片卡卡持架，一第二晶片卡卡持架，所述第一晶片卡卡持架包括一卡持部及一連接部，該連接部由該卡持部之一端朝卡持部之二相對表面方向延伸，從而使該第一晶片卡卡持架橫向呈T形，該卡持部以卡持第一晶片，所述第二晶片卡卡持架組裝於所述連接部上，該第二晶片卡持架以卡持第二晶片，一線性電路設置於所述第一晶片卡卡持架與第二晶片卡持架上以電連通第一晶片及第二晶片；該第一晶片卡卡持架平鋪固接至一電路板，該第二晶片卡持架垂直設置於該電路板之一側。 A wafer card holding structure includes a first wafer card holder and a second wafer card holder. The first wafer card holder includes a holding portion and a connecting portion. One end of the latching portion extends toward the opposite surface of the latching portion, so that the first wafer card holder is laterally T-shaped, the latching portion is for holding the first wafer, and the second wafer card is held The rack is assembled on the connecting portion, the second wafer holding frame is configured to hold the second wafer, and a linear circuit is disposed on the first wafer card holder and the second wafer holder for electrically connecting the first The first wafer card holder is tiled and fixed to a circuit board, and the second wafer holder is vertically disposed on one side of the circuit board.
一種電路板組件，其包括一電路板、一第一晶片卡卡持結構及一第二晶片卡卡持結構，所述第一晶片卡卡持架包括一卡持部及一連接部，所述卡持部固接於電路板上，該卡持部用以卡持一第一晶片卡於其內，所述連接部由該卡持部之一端朝卡持部之二相對表面方向延伸，從而使該第一晶片卡卡持架橫向呈T形，所述第二晶片卡卡持架組裝於所述連接部上，該第二晶片卡持架用以卡持一第二晶片卡，一線性電路設置於所述第一晶片卡卡持架與第二晶片卡持架上以電連通第一晶片卡及第二晶片卡，且該線性電路與電路板電連通，該第一晶片卡卡持架平鋪固接至該電路板，該第二晶片卡持架垂直設置於該電路板之一側。 A circuit board assembly includes a circuit board, a first wafer card holding structure and a second wafer card holding structure, the first wafer card holder comprising a holding portion and a connecting portion, The latching portion is fixed to the circuit board, and the latching portion is configured to hold a first wafer card therein, and the connecting portion extends from one end of the latching portion toward the opposite surface of the latching portion, thereby The first wafer card holder is laterally T-shaped, the second wafer card holder is assembled on the connecting portion, and the second wafer holder is used for holding a second wafer card, a linear a circuit is disposed on the first wafer card holder and the second wafer holder to electrically connect the first wafer card and the second wafer card, and the linear circuit is in electrical communication with the circuit board, the first wafer card is held The frame is fixed to the circuit board, and the second wafer holder is vertically disposed on one side of the circuit board.
相較於習知技術，本發明通過將第二晶片卡卡持架設置於第一晶片卡卡持 架之卡持板之一側且與該卡持板垂直設置，當所述卡持板平鋪安裝於印刷電路板上時，則第二晶片卡卡持架位於印刷電路板之一側，從而不會佔用印刷電路板之表面空間，如此可大大節省電路板表面之佈設尺寸。 Compared with the prior art, the present invention sets the second wafer card holder to the first wafer card holder. One side of the holding plate of the frame is disposed perpendicular to the holding plate, and when the holding plate is tiled on the printed circuit board, the second chip card holder is located on one side of the printed circuit board, thereby It does not occupy the surface space of the printed circuit board, which can greatly save the layout size of the circuit board surface.
10’‧‧‧印刷電路板 10’‧‧‧ Printed Circuit Board
14’‧‧‧擴充存儲卡 14’‧‧‧Expanded memory card
12’‧‧‧用戶識別卡 12’‧‧‧User Identification Card
142’‧‧‧存儲卡卡持架 142’‧‧‧ memory card holder
122’‧‧‧用戶識別卡卡持架 122’‧‧‧User Identification Card Holder
100‧‧‧晶片卡卡持結構 100‧‧‧ wafer card holding structure
20‧‧‧卡持架 20‧‧‧Cart holder
10‧‧‧第一晶片卡持架 10‧‧‧First wafer card holder
22‧‧‧底板 22‧‧‧floor
12‧‧‧卡持部 12‧‧‧Card Department
222‧‧‧卡槽 222‧‧‧ card slot
122‧‧‧主體板 122‧‧‧ body board
224‧‧‧卡鉤 224‧‧‧ hook
124‧‧‧彈性片 124‧‧‧Elastic film
24‧‧‧罩體 24‧‧‧ Cover
126‧‧‧夾持座 126‧‧‧Clamping seat
242‧‧‧卡榫 242‧‧‧Carmen
1262‧‧‧夾持板部 1262‧‧‧Clamping plate
244‧‧‧第一開口 244‧‧‧ first opening
1264‧‧‧夾持臂 1264‧‧‧Clamping arm
246‧‧‧第二開口 246‧‧‧ second opening
1266‧‧‧貫通孔 1266‧‧‧through holes
26‧‧‧電連接腳 26‧‧‧Electrical connection feet
1268‧‧‧凸柱 1268‧‧‧Studs
200‧‧‧印刷電路板 200‧‧‧Printed circuit board
14‧‧‧連接部 14‧‧‧Connecting Department
300‧‧‧第一晶片卡 300‧‧‧First chip card
142‧‧‧固接孔 142‧‧‧Fixed holes
400‧‧‧第二晶片卡 400‧‧‧second chip card
16‧‧‧線性電路 16‧‧‧linear circuits
圖1係習知SIM卡與TIF卡佈設於印刷電路板之結構示意圖。 FIG. 1 is a schematic structural view of a conventional SIM card and a TIF card disposed on a printed circuit board.
圖2係本發明較佳實施例晶片卡卡持結構安裝於印刷電路板上之整體示意圖。 2 is a schematic overall view of a wafer card holding structure mounted on a printed circuit board in accordance with a preferred embodiment of the present invention.
圖3係本發明較佳實施例晶片卡卡持結構之一視角分解示意圖。 3 is a perspective exploded view of a wafer card holding structure in accordance with a preferred embodiment of the present invention.
圖4係本發明較佳實施例晶片卡卡持結構之另一視角分解示意圖。 4 is another perspective exploded view of the wafer card holding structure of the preferred embodiment of the present invention.
圖5係本發明較佳實施例第二晶片卡從一方向安裝於晶片卡卡持結構之示意圖。 FIG. 5 is a schematic view showing the second wafer card mounted on the wafer card holding structure from one direction according to a preferred embodiment of the present invention.
圖6係本發明較佳實施例第二晶片卡從另一方向安裝於晶片卡卡持結構之示意圖。 6 is a schematic diagram of a second wafer card mounted on a wafer card holding structure from another direction in accordance with a preferred embodiment of the present invention.
請參閱圖2及圖3，本發明較佳實施例一晶片卡卡持結構100設置於一電子裝置之印刷電路板200上。 Referring to FIG. 2 and FIG. 3, a wafer card holding structure 100 is disposed on a printed circuit board 200 of an electronic device according to a preferred embodiment of the present invention.
所述晶片卡卡持結構100包括一第一晶片卡持架10及一第二晶片卡卡持架20。所述第一晶片卡持架10包括一卡持部12、一連接部14及線性電路16。所述卡持部12包括一主體板122、複數彈性片124及套設於該主體板122上之一夾持座126。所述主體板122為一長方形板，該主體板122上開設有複數切口1222。該主體板122之相對二側形成有側壁1224。所述彈性片124為金屬片材衝壓彎折形成。請一併參閱圖4，所述夾持座126為塑性材質製成，其包括一夾持板部1262及形成於夾持板部1262二側之夾持臂1264。所述 夾持板部1262開設有複數之貫通孔1266，且該夾持板部1262之相對二角處還形成有二凸柱1268，該二凸柱1268用於與印刷電路板200固接。所述夾持座126套裝主體板122上，夾持所述彈性片124於主體板122與夾持座126之間，彈性片124分別從所述主體板122之切口1222凸伸出，所述夾持板部1262之貫通孔1266與所述彈性片124之位置相對應。 The wafer card holding structure 100 includes a first wafer holder 10 and a second wafer card holder 20. The first wafer holder 10 includes a latching portion 12, a connecting portion 14 and a linear circuit 16. The holding portion 12 includes a main body plate 122 , a plurality of elastic pieces 124 , and a clamping seat 126 sleeved on the main body plate 122 . The main body plate 122 is a rectangular plate, and the main body plate 122 is provided with a plurality of slits 1222. Side walls 1224 are formed on opposite sides of the main body panel 122. The elastic piece 124 is formed by punching and bending a metal sheet. Referring to FIG. 4 together, the clamping seat 126 is made of a plastic material, and includes a clamping plate portion 1262 and a clamping arm 1264 formed on both sides of the clamping plate portion 1262. Said The clamping plate portion 1262 defines a plurality of through holes 1266, and the two opposite corners of the clamping plate portion 1262 are further formed with two protrusions 1268 for fixing to the printed circuit board 200. The clamping seat 126 is disposed on the main body plate 122, and the elastic piece 124 is sandwiched between the main body plate 122 and the clamping seat 126. The elastic piece 124 protrudes from the cutout 1222 of the main body plate 122, respectively. The through hole 1266 of the holding plate portion 1262 corresponds to the position of the elastic piece 124.
所述連接部14為一方形板，其形成於所述主體板122之一端且與主體板122形成T形結構，該連接部14上開設有二固接孔142，用於與所述第二晶片卡持架20固接。所述線性電路16設置於所述主體板122與連接部14上，其一端電連接對應之彈性片124，另一端分別部設於連接部14上。 The connecting portion 14 is a square plate formed at one end of the main body plate 122 and forming a T-shaped structure with the main body plate 122. The connecting portion 14 defines two fixing holes 142 for the second The wafer holder 20 is fixed. The linear circuit 16 is disposed on the main body plate 122 and the connecting portion 14 , and one end of the linear circuit 16 is electrically connected to the corresponding elastic piece 124 , and the other end is respectively disposed on the connecting portion 14 .
該第二晶片卡卡持架20包括一底板22、一封蓋該底板22之一罩體24及安裝於該底板22與罩體24之間之複數金屬片(未標示)。所述底板22為一方形板，其二側開設有卡槽222，該卡槽222用於與所述罩體24固接。該底板22還形成有二卡鉤224，該卡鉤224用於與所述連接部14上之固接孔142配合，以使底板22固接於連接部14上。所述罩體24為與所述底板22尺寸對應之方形封罩，其側壁開設有與底板22之卡槽222對應之卡榫242，該卡榫242與卡槽222卡固以使罩體24固接於底板22上。該罩體24之相鄰二側壁上還分別開設有一第一開口244及一第二開口246。該第一開口244與第二開口246可分別用於插取晶片。所述金屬片平行佈設於該底板22與罩體24之間，每一金屬片形成有複數電連接端子(未圖示)，該電連接端子位於該底板22與罩體24形成之空間內。每一金屬片之一端形成一電連接腳26，該電連接腳26由底板22上與第二開口246相對之一側壁伸出。將所述罩體24與底板22固接，且將該複數金屬片並排卡固於底板22與罩體24之間。 The second wafer card holder 20 includes a bottom plate 22, a cover body 24 covering the bottom plate 22, and a plurality of metal sheets (not labeled) mounted between the bottom plate 22 and the cover body 24. The bottom plate 22 is a square plate, and two sides thereof are provided with a card slot 222 for fixing the cover body 24 . The bottom plate 22 is further formed with two hooks 224 for engaging with the fixing holes 142 of the connecting portion 14 to fix the bottom plate 22 to the connecting portion 14. The cover body 24 is a square cover corresponding to the size of the bottom plate 22, and the side wall defines a latch 242 corresponding to the slot 222 of the bottom plate 22, and the latch 242 and the card slot 222 are locked to make the cover 24 It is fixed to the bottom plate 22. A first opening 244 and a second opening 246 are respectively defined in the adjacent two sidewalls of the cover body 24. The first opening 244 and the second opening 246 are respectively for inserting a wafer. The metal piece is disposed in parallel between the bottom plate 22 and the cover body 24, and each metal piece is formed with a plurality of electrical connection terminals (not shown), and the electrical connection terminals are located in a space formed by the bottom plate 22 and the cover body 24. One end of each of the metal sheets forms an electrical connecting leg 26 which projects from a side wall of the bottom plate 22 opposite the second opening 246. The cover body 24 is fixed to the bottom plate 22, and the plurality of metal pieces are stuck side by side between the bottom plate 22 and the cover body 24.
請參閱圖5，將所述第二晶片卡卡持架20組裝至第一晶片卡卡持架10上，所述第二晶片卡卡持架20之底板22之二卡鉤224與連接部14上之二固接孔142 相配合，且第二晶片卡卡持架20之電連接腳26與線性電路16於連接部14上之一端連通，則第二晶片卡卡持架20固接至第一晶片卡卡持架10上。 Referring to FIG. 5, the second wafer card holder 20 is assembled to the first wafer card holder 10. The second card 22 of the second wafer card holder 20 has two hooks 224 and a connecting portion 14. The upper two fixed holes 142 When the electrical connection leg 26 of the second wafer card holder 20 is in communication with the linear circuit 16 at one end of the connection portion 14, the second wafer card holder 20 is fixed to the first wafer card holder 10. on.
再將第一晶片卡卡持架20平鋪固接至印刷電路板200表面上，夾持座126之凸柱1268與印刷電路板200相固接(如焊接)，且印刷電路板200上之電連接體(未圖示)通過所述夾持座126之貫通孔1266與彈性片124電性連通，所述連接部14位於印刷電路板200之側邊且與印刷電路板200垂直，所述第二晶片卡卡持架20亦與印刷電路板200垂直，則晶片卡卡持結構100之組裝完成。 Then, the first wafer card holder 20 is tiled and fixed on the surface of the printed circuit board 200, and the protrusions 1268 of the holder 126 are fixedly connected to the printed circuit board 200 (such as soldering), and the printed circuit board 200 is An electrical connector (not shown) is electrically connected to the elastic piece 124 through the through hole 1266 of the holder 126, and the connecting portion 14 is located at a side of the printed circuit board 200 and perpendicular to the printed circuit board 200. The second wafer card holder 20 is also perpendicular to the printed circuit board 200, and the assembly of the wafer card holding structure 100 is completed.
使用該晶片卡卡持結構100時，提供一第一晶片卡300(如SIM卡)及一第二晶片卡400(如TIF卡)。將一第一晶片卡300置入所述第一晶片卡卡持架10內，將一第二晶片卡400從所述罩體24之第一開口244置入第二晶片卡卡持架20內，所述第二晶片卡400通過線性電路16電連通，如此可擴大電子裝置之存儲容量。所述第二晶片卡卡持架20垂直設置於印刷電路板200之一側，未有佔用印刷電路板200之表面空間，從而可大大節省電路板表面之可利用之尺寸。另外，此結構亦縮短了第一晶片卡300與第二晶片卡400之電連接線路，可方便電子元件佈設於印刷電路板200上。 When the wafer card holding structure 100 is used, a first wafer card 300 (such as a SIM card) and a second wafer card 400 (such as a TIF card) are provided. A first wafer card 300 is placed in the first wafer card holder 10, and a second wafer card 400 is inserted into the second wafer card holder 20 from the first opening 244 of the cover 24. The second wafer card 400 is electrically connected through the linear circuit 16, so that the storage capacity of the electronic device can be expanded. The second wafer card holder 20 is vertically disposed on one side of the printed circuit board 200, and does not occupy the surface space of the printed circuit board 200, thereby greatly reducing the available size of the circuit board surface. In addition, the structure also shortens the electrical connection lines of the first wafer card 300 and the second wafer card 400, and the electronic components can be conveniently disposed on the printed circuit board 200.
請參閱圖6，所述第二晶片卡400亦可從所述罩體24之第二開口246置入第二晶片卡卡持架20內，用戶可根據插取方便選擇插取方向。 Referring to FIG. 6, the second wafer card 400 can also be inserted into the second wafer card holder 20 from the second opening 246 of the cover body 24. The user can select the insertion direction according to the insertion convenience.
可以理解，所述導電之彈性片124可經嵌入式注塑成型形成於夾持座126上，然後夾持座126與主體板122配合。 It can be understood that the conductive elastic piece 124 can be formed on the clamping seat 126 by insert injection molding, and then the clamping seat 126 is engaged with the main body plate 122.
可以理解，所述金屬片與底板22及罩體24可經嵌入式注塑成型形成一整體。 It can be understood that the metal piece and the bottom plate 22 and the cover body 24 can be integrally formed by insert injection molding.
100‧‧‧晶片卡卡持結構 100‧‧‧ wafer card holding structure
14‧‧‧連接部 14‧‧‧Connecting Department
16‧‧‧線性電路 16‧‧‧linear circuits
126‧‧‧夾持座 126‧‧‧Clamping seat
244‧‧‧第一開口 244‧‧‧ first opening
246‧‧‧第二開口 246‧‧‧ second opening
200‧‧‧印刷電路板 200‧‧‧Printed circuit board
300‧‧‧第一晶片卡 300‧‧‧First chip card
Claims (14)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97124173A TWI404268B (en) | 2008-06-27 | 2008-06-27 | Chip card locking structure and circuit board subassembly of using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97124173A TWI404268B (en) | 2008-06-27 | 2008-06-27 | Chip card locking structure and circuit board subassembly of using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201001821A TW201001821A (en) | 2010-01-01 |
| TWI404268B true TWI404268B (en) | 2013-08-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97124173A TWI404268B (en) | 2008-06-27 | 2008-06-27 | Chip card locking structure and circuit board subassembly of using the same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI404268B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM331802U (en) * | 2007-08-03 | 2008-05-01 | Yuan jia rui | Memory card connector |
| TWM332963U (en) * | 2007-10-08 | 2008-05-21 | Hon Hai Prec Ind Co Ltd | Electronic card connector assembly |
-
2008
- 2008-06-27 TW TW97124173A patent/TWI404268B/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM331802U (en) * | 2007-08-03 | 2008-05-01 | Yuan jia rui | Memory card connector |
| TWM332963U (en) * | 2007-10-08 | 2008-05-21 | Hon Hai Prec Ind Co Ltd | Electronic card connector assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201001821A (en) | 2010-01-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |