TWI403389B - 耐水砂輪 - Google Patents
耐水砂輪 Download PDFInfo
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- TWI403389B TWI403389B TW99126427A TW99126427A TWI403389B TW I403389 B TWI403389 B TW I403389B TW 99126427 A TW99126427 A TW 99126427A TW 99126427 A TW99126427 A TW 99126427A TW I403389 B TWI403389 B TW I403389B
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- grinding wheel
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Description
本發明係關於耐水砂輪,尤指一種可藉由調整各種組成成分之比例,即可製成各種不同比重之耐水砂輪,以配合各類用途之實際需求。
按市售之各種砂輪,如台灣發明專利第I314497號「電鑄薄砂輪片」(095139492),係於金屬鍍覆相分散磨粒而構成之薄砂輪片磨粒層,薄砂輪片磨粒層係具有依序積層於該薄砂輪片磨粒層的層厚方向之第1至第5磨粒層,其中第1、第3、第5磨粒層之上述磨粒的含有量係設為比第2、第4磨粒層之上述磨粒的含有量多。上述第1、第3、第5磨粒層之上述磨粒的含有量在15至40vol%之範圍內,上述第2、第4磨粒層之上述磨粒的含有量在1至10vol%之範圍內。
如台灣新型專利第M363359號「砂輪結構」(098205092)之盤體具有兩表面,盤體圓周面為切割面;及凸紋,形成於該兩表面。其中,凸紋係網狀。盤體之材料係為金剛砂及結合劑之混合物。
亦即,由上述習知者,並無法得出如本發明之耐水砂輪之結構,由此,本發明者,基於從事各種砂輪之設計與製造之經驗,特針對前揭習知者之組成內容加以研究,乃發明本案。
本發明之目的,乃在提供一種可以依據需求而製成各種成分比例需求之耐水砂輪。
本發明之耐水砂輪之組成,係由碳化矽、多元醇樹脂、氯化腊與矽利康、聚亞甲基聚苯基異氰酸脂、硬脂酸鋅及乙基纖維素等依據比例構成,以製成不同比重之耐水砂輪。
如此,為使 貴審查員得以了解本發明,茲依附圖式解說如下:如圖一所示,為本發明耐水砂輪之組成成分圖,本發明之耐水砂輪,如果以製成之耐水砂輪之成分為100%,則各成分之比例,至少包含:碳化矽1,具有決定耐水砂輪之重量與密度之效果,因此,其可由55-63%之比例為之,重量則是700-1300公克之比例;多元醇樹脂2,具有讓成品之各成分得以結合成一體之作用,係由15-18%之比例構成,重量則是200-330公克之比例;氯化腊與矽利康3,讓耐水砂輪具備耐水性之效用,因此,係由1.2-1.7%之比例為之,重量則是18-28公克之比例;聚亞甲基聚苯基異氰酸脂4,則是由17-22%之比例為之,重量則是240-390公克之比例;硬脂酸鋅5,係由0.2-0.3%之比例為之,重量則是3-5公克之比例;乙基纖維素6,亦由0.2-0.3%之比例構成,重量則是3-5公克之比例。
是以,如依據前述之成分比例而言,茲舉二運用例解說,如可將碳化矽1以60%之比例為之;多元醇樹脂2,則由17%之比例構成;氯化腊與矽利康3,係由1.5%之比例為之;聚亞甲基聚苯基異氰酸脂4,則是由21%之比例為之;硬脂酸鋅5,係由0.25%之比例為之;乙基纖維素6,亦由0.25%之比例構成。第二運用例則是碳化矽1以63%之比例為之;多元醇樹脂2,則由16.3%之比例構成;氯化腊與矽利康3,係由1.3%之比例為之;聚亞甲基聚苯基異氰酸脂4,則是由18.9%之比例為之;硬脂酸鋅5,係由0.25%之比例為之;乙基纖維素6,亦由0.25%之比例構成。如此,即可藉由上述各成分比例自由調配,以製成不同比重之耐水砂輪,以配合各種用途需求。
1...碳化矽
2...多元醇樹脂
3...氯化腊與矽利康
4...聚亞甲基聚苯基異氰酸脂
5...硬脂酸鋅
6...乙基纖維素
圖1是本創作之成分圖。
圖2本創作之成品可實施例圖。
1...碳化矽
2...多元醇樹脂
3...氯化腊與矽利康
4...聚亞甲基聚苯基異氰酸脂
5...硬脂酸鋅
6...乙基纖維素
Claims (1)
- 一種耐水砂輪之組成,至少包含:碳化矽,係以55-63%重量百分比為之;多元醇樹脂,由15-18%重量百分比構成;氯化腊與矽利康,係由1.2-1.7%重量百分比為之;聚亞甲基聚苯基異氰酸脂,由17-22%重量百分比為之;硬脂酸鋅,由0.2-0.3%重量百分比為之;乙基纖維素,由0.2-0.3%重量百分比構成,如此得依據需求而調整各成分之比例者。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW99126427A TWI403389B (zh) | 2009-12-03 | 2009-12-03 | 耐水砂輪 |
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TW99126427A TWI403389B (zh) | 2009-12-03 | 2009-12-03 | 耐水砂輪 |
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TW201119799A TW201119799A (en) | 2011-06-16 |
TWI403389B true TWI403389B (zh) | 2013-08-01 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US9486896B2 (en) | 2012-06-28 | 2016-11-08 | Saint-Gobain Abrasives, Inc. | Abrasive article and coating |
US9844853B2 (en) | 2014-12-30 | 2017-12-19 | Saint-Gobain Abrasives, Inc./Saint-Gobain Abrasifs | Abrasive tools and methods for forming same |
AU2016381202B2 (en) | 2015-12-30 | 2019-03-14 | Saint-Gobain Abrasifs | Abrasive tools and methods for forming same |
Citations (6)
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US4618349A (en) * | 1982-05-10 | 1986-10-21 | Tokyo Shibaura Denki Kabushiki Kaisha | Grinding wheel manufacturing method |
TW273525B (zh) * | 1994-04-12 | 1996-04-01 | Norton Sa | |
US5711774A (en) * | 1996-10-09 | 1998-01-27 | Norton Company | Silicon carbide abrasive wheel |
TW445194B (en) * | 1998-10-13 | 2001-07-11 | Hitachi Chemical Co Ltd | Resinous grinding stone for semiconductor wafer grinding, the production method thereof, semiconductor wafer grinding method, semiconductor element and semiconductor device |
TWI248969B (en) * | 2000-11-10 | 2006-02-11 | 3M Innovative Properties Co | Methods of manufacturing a composite abrasive agglomerate, coated abrasive article, and three dimensional fixed abrasive article, products obtained therefrom, and method of polishing a workpiece |
TW200827100A (en) * | 2006-10-06 | 2008-07-01 | Nippon Electric Glass Co | Grinding wheel |
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2009
- 2009-12-03 TW TW99126427A patent/TWI403389B/zh not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4618349A (en) * | 1982-05-10 | 1986-10-21 | Tokyo Shibaura Denki Kabushiki Kaisha | Grinding wheel manufacturing method |
TW273525B (zh) * | 1994-04-12 | 1996-04-01 | Norton Sa | |
US5711774A (en) * | 1996-10-09 | 1998-01-27 | Norton Company | Silicon carbide abrasive wheel |
TW445194B (en) * | 1998-10-13 | 2001-07-11 | Hitachi Chemical Co Ltd | Resinous grinding stone for semiconductor wafer grinding, the production method thereof, semiconductor wafer grinding method, semiconductor element and semiconductor device |
TWI248969B (en) * | 2000-11-10 | 2006-02-11 | 3M Innovative Properties Co | Methods of manufacturing a composite abrasive agglomerate, coated abrasive article, and three dimensional fixed abrasive article, products obtained therefrom, and method of polishing a workpiece |
TW200827100A (en) * | 2006-10-06 | 2008-07-01 | Nippon Electric Glass Co | Grinding wheel |
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