TWI403234B - Installation substrate and method for manufacturing thin illumination device using the same - Google Patents
Installation substrate and method for manufacturing thin illumination device using the same Download PDFInfo
- Publication number
- TWI403234B TWI403234B TW099114023A TW99114023A TWI403234B TW I403234 B TWI403234 B TW I403234B TW 099114023 A TW099114023 A TW 099114023A TW 99114023 A TW99114023 A TW 99114023A TW I403234 B TWI403234 B TW I403234B
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive foil
- electrode portion
- resin
- light
- electrode
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Electroluminescent Light Sources (AREA)
Description
本發明係有關一種於薄導電箔的一主面設置有以電解鍍覆所形成的多個電極的安裝基板，及使用該安裝基板在導電箔上的安裝部安裝發光元件之薄型發光裝置的製造方法。The present invention relates to a mounting substrate in which a plurality of electrodes formed by electrolytic plating are provided on one main surface of a thin conductive foil, and a thin-type light-emitting device in which a light-emitting element is mounted on a mounting portion of the mounting substrate on a conductive foil method.
於第7圖顯示防止由發光元件所發出的光被吸收至基底基板內，而抑制發光損耗以謀求整體亮度之提升的發光裝置。Fig. 7 shows a light-emitting device that prevents light emitted from a light-emitting element from being absorbed into a base substrate and suppresses light-emitting loss to improve overall brightness.
該發光裝置係由發光元件100、基底基板200、基板電極部300、連接電極部400、光反射部500、孔部600及鍍覆層700所構成。發光元件100係三族氮化物系化合物半導體發光元件。基底基板200係以聚醯亞胺、玻璃環氧樹脂或BT樹脂等樹脂所形成的絕緣性基板，且由以下構件所製作：從該基板表面形成至背面的由銅箔膜所構成的一對基板電極部300、形成於發光元件100載置面的相反側的面之由銅箔膜所構成的光反射部500、朝基底基板200的厚度方向穿設於由一對基板電極部300所相對向的絕緣部的孔部600、形成於由該孔部600露出的光反射部500的露出面與孔部600的內周面之以金或銀所形成的鍍覆層700。又，設於基底基板200的背面，且由與基板電極部300導通的導電膜所構成的電極，係安裝於母板(motherboard)等裝置基板的連接電極部400。This light-emitting device is composed of a light-emitting element 100, a base substrate 200, a substrate electrode portion 300, a connection electrode portion 400, a light reflection portion 500, a hole portion 600, and a plating layer 700. The light-emitting element 100 is a group III nitride-based compound semiconductor light-emitting element. The base substrate 200 is an insulating substrate made of a resin such as polyimide, glass epoxy, or BT resin, and is formed of a pair of copper foil films formed on the surface of the substrate to the back surface. The substrate electrode portion 300 and the light reflecting portion 500 formed of a copper foil film on the surface on the opposite side of the mounting surface of the light emitting element 100 are bored in the thickness direction of the base substrate 200 so as to be opposed to the pair of substrate electrode portions 300. The hole portion 600 of the insulating portion to be formed, the plated layer 700 formed of gold or silver formed on the exposed surface of the light reflecting portion 500 exposed by the hole portion 600 and the inner peripheral surface of the hole portion 600. Further, an electrode formed of a conductive film that is provided on the back surface of the base substrate 200 and that is electrically connected to the substrate electrode portion 300 is attached to the connection electrode portion 400 of the device substrate such as a mother board.
專利文獻1：日本特開2005-175387號公報Patent Document 1: Japanese Laid-Open Patent Publication No. 2005-175387
上述的發光裝置係有如下的問題點。The above-described light-emitting device has the following problems.
例如在攜帶終端機器等小型化及薄型化的進展下，發光裝置的薄型化為一種市場要求。For example, in the progress of miniaturization and thinning of portable terminal devices, the thinning of the light-emitting device is a market requirement.
然而，如第7圖的發光裝置中，由於為發光元件100配置於基底基板200上的構造，故安裝後的厚度至少需要為發光元件100的厚度及基底基板200的厚度的總和以上。改良基底基板200的材料等雖然亦可推進薄型化，但有確保作為支持件的某種程度的強度的必要，且若考慮製造步驟的操作方便等，則更加大幅度的薄型化係存在有瓶頸。However, in the light-emitting device of FIG. 7, since the light-emitting element 100 is disposed on the base substrate 200, the thickness after mounting is required to be at least the sum of the thickness of the light-emitting element 100 and the thickness of the base substrate 200. Although the material and the like of the improved base substrate 200 can be promoted to be thinner, it is necessary to secure a certain degree of strength as a support member, and if the operation of the manufacturing step is convenient, the bottleneck of the thinner system is more severe. .
又，若使用基底基板200，則於其兩面需要基板電極300及連接電極部400，且為了連接兩電極則不可缺少通孔(through-hole)電極，而無法縮小每一單元(cell)的基板面積，亦增加了通孔鍍覆等製造步驟數。Further, when the base substrate 200 is used, the substrate electrode 300 and the connection electrode portion 400 are required on both surfaces thereof, and a through-hole electrode is indispensable for connecting the two electrodes, and the substrate of each cell cannot be reduced. The area also increases the number of manufacturing steps such as through-hole plating.
另一方面，以一併製造多個上述構成的發光裝置的製造方法而言，係有以下方法：於一片基板配置構成複數個裝置的導電圖形，於該導電圖形連接電路元件並以樹脂密封後，藉由切塊程序(dicing)切斷導電圖形及密封樹脂以分離成每個發光裝置。然而，這種方法會有因利用高速旋轉的裁切鋸切斷導電圖形而產生毛邊(burr)的疑慮。如此當產生了毛邊時，則不僅是外觀性遭受損害，並有阻礙安裝時的穩定性，或於安裝後產生短路的疑慮。On the other hand, in the method of manufacturing a plurality of light-emitting devices having the above-described configuration, a method is disclosed in which a conductive pattern constituting a plurality of devices is disposed on one substrate, and after the conductive patterns are connected to the circuit elements and sealed with a resin The conductive pattern and the sealing resin are cut by a dicing process to be separated into each of the light-emitting devices. However, this method has a problem that a burr is generated by cutting a conductive pattern with a cutting saw that rotates at a high speed. When the burrs are generated in this way, not only the appearance is damaged, but also the stability at the time of mounting or the short circuit after the installation is caused.
本發明為有鑑於前述之問題所開發者，本發明的目的係提供一種既抑制毛邊產生，且可一併製造多個發光裝置的安裝基板及使用該安裝基板的薄型發光裝置的製造方法。The present invention has been made in view of the above problems, and an object of the present invention is to provide a mounting substrate capable of suppressing generation of burrs and capable of manufacturing a plurality of light-emitting devices, and a method of manufacturing a thin-type light-emitting device using the same.
本發明的安裝基板係具備：單元，係於導電箔的頂面以行狀鄰接多個而排列，並具有以電解鍍覆形成的第一電極部及接近安裝部的第二電極部者；液狀樹脂，係附著於前述第一電極部及前述第二電極部之間的前述導電箔並補強前述導電箔；分離用槽孔，係貫通鄰接的行的前述第一電極部及前述第二電極部之間的前述導電箔而設置，而分離鄰接的前述行；絕緣用槽孔，係位於前述第一電極部及前述第二電極部之間，而與前述分離用槽孔平行設置，並貫通前述導電箔而設置，以使前述第一電極部及前述第二電極部電性分離；及充填樹脂，設於前述導電箔的底面並覆蓋前述絕緣用槽孔，並覆蓋對應前述液狀樹脂的位置並補強前述導電箔；並且藉由去除包含於同一行的前述單元彼此的邊界的前述導電箔，以分離包含於鄰接的一方的前述單元的前述導電箔及包含於鄰接的另一方的前述單元的前述導電箔。The mounting substrate of the present invention includes: a unit in which a top surface of the conductive foil is arranged in a row in a row, and has a first electrode portion formed by electrolytic plating and a second electrode portion close to the mounting portion; a resin that adheres to the conductive foil between the first electrode portion and the second electrode portion and that reinforces the conductive foil; and the separation hole that penetrates the first electrode portion and the second electrode portion of the adjacent row The conductive foil is disposed to separate the adjacent rows; the insulating slot is located between the first electrode portion and the second electrode portion, and is disposed in parallel with the separation slot and penetrates through the foregoing a conductive foil is provided to electrically separate the first electrode portion and the second electrode portion; and a filling resin is provided on a bottom surface of the conductive foil to cover the insulating groove and cover a position corresponding to the liquid resin And reinforcing the conductive foil; and removing the conductive foil of the unit included in the adjacent one by removing the conductive foil included in the boundary between the units in the same row; The conductive foil is contained in the unit adjacent to the other.
本發明的薄型發光裝置的製造方法係具備：於導電箔的頂面，以使由第一電極部及接近安裝部的第二電極部所構成的單元的區域露出之方式形成的鍍覆阻劑層的步驟；以前述鍍覆阻劑層作為遮罩，選擇性地於前述導電箔實施金屬鍍覆，以行狀地形成多個前述單元的步驟；去除前述鍍覆阻劑層，並使液狀樹脂附著於前述導電箔上除了前述第一及第二電極部與前述安裝部外之處的步驟；從底面選擇性地蝕刻前述導電箔，以設置貫通前述導電箔以使前述各單元的前述第一電極部及第二電極部電性分離的絕緣用槽孔、及貫通前述導電箔以使鄰接的前述行的單元分離的分離用槽孔，而形成安裝基板的步驟；形成充填樹脂之步驟，該充填樹脂係從前述導電箔的底面覆蓋前述絕緣用槽孔，並覆蓋對應前述液狀樹脂的位置，並且補強前述導電箔；藉由濕蝕刻去除將包含於同一行而鄰接的前述單元彼此予以連接的連接部分的前述導電箔的步驟；於前述安裝部固著發光元件，並以搭接線連接前述發光元件的電極及前述第一電極部的步驟；形成樹脂以使逐行地覆蓋包含於前述各單元的前述發光元件的步驟；以及於前述連結部分的前述導電箔被去除的部位，藉由切斷前述安裝基板及前述樹脂，而個別地分離前述單元的步驟。The method for producing a thin light-emitting device according to the present invention includes a plating resist formed on a top surface of the conductive foil so that a region of the first electrode portion and a second electrode portion close to the mounting portion are exposed. a step of forming a plurality of the foregoing units in a row in the form of a mask by selectively plating the conductive foil with the plating resist layer as a mask; removing the plating resist layer and allowing the liquid to form a step of adhering the resin to the conductive foil except for the first and second electrode portions and the mounting portion; selectively etching the conductive foil from the bottom surface to provide the conductive foil so as to provide the foregoing a step of insulating the slot in which the electrode portion and the second electrode portion are electrically separated, and a separation slot through which the conductive foil is inserted to separate the adjacent rows of the rows, thereby forming a mounting substrate; and forming a step of filling the resin. The filling resin covers the insulating slot from the bottom surface of the conductive foil, covers the position corresponding to the liquid resin, and reinforces the conductive foil; and removes by wet etching a step of electrically connecting the conductive foils of the connection portions of the adjacent cells connected to each other in the same row; fixing the light-emitting elements to the mounting portion, and connecting the electrodes of the light-emitting devices and the first electrode portion by a bonding wire a step of forming a resin to cover the light-emitting elements included in each of the units described above, and separately separating the portions of the connecting portion from which the conductive foil is removed by cutting the mounting substrate and the resin The steps of the aforementioned unit.
根據本發明的安裝基板，能得到以下的效果。According to the mounting substrate of the present invention, the following effects can be obtained.
根據本發明，以行狀設置由第一電極部及第二電極部所構成的單元於安裝基板，並去除於單元間的邊界部構成各電極部的導電箔。藉此，即使在各單元的邊界切斷安裝基板，於被切斷的區域僅會存在阻劑層(resist)等樹脂材料，不會有由金屬構成的導電箔在此。由此，由於不會因為切斷安裝基板而產生毛邊，故避免了起因於毛邊的各種問題。又，習知中為了提升作業效率，而使在分離時使用的裁切鑽的移動速度處於高速，而凸顯了毛邊的問題，然於本發明沒有毛邊的疑慮而可高速地進行分離步驟。According to the invention, the unit including the first electrode portion and the second electrode portion is provided in a row on the mounting substrate, and the conductive foil constituting each electrode portion is removed at a boundary portion between the cells. Thereby, even if the mounting substrate is cut at the boundary of each unit, only a resin material such as a resist layer exists in the cut region, and there is no conductive foil made of metal. Thereby, since the burrs are not generated by cutting the mounting substrate, various problems caused by the burrs are avoided. Further, in order to improve work efficiency, the moving speed of the cutting drill used at the time of separation is high in speed, and the problem of burrs is highlighted. However, in the present invention, the separation step can be performed at a high speed without the fear of burrs.
並且，在各單元的邊界導電箔受到去除的去除區域，係設有液狀樹脂及由焊接阻劑所構成的樹脂材料。從而，藉由該樹脂材料，以行狀配置的各單元係保持為一體的帶狀，故各單元直到最後亦不會散亂，而會呈一片板子的狀態而方便使用。Further, a liquid resin and a resin material composed of a solder resist are provided in a removal region where the conductive foil is removed at the boundary of each unit. Therefore, since the respective units of the resin material are arranged in a line shape in an integrated manner, the units are not scattered until the end, and are easily used in a state of one sheet.
再且，根據本發明，藉由以行狀配置上述單元於安裝基板，可得到以下的效果。Further, according to the present invention, the following effects can be obtained by arranging the above-described cells in a row on the mounting substrate.
第一點，由於導電基板係由導電箔及於該導電箔的表面選擇性形成的由電解鍍覆所形成的第一電極部及第二電極部所形成，故只要導電箔為18μm、而第一及第二電極部的鍍覆厚度為15至20μm，就可實現形成40μm以下的厚度之極度薄型的無支持基板的安裝基板。First, since the conductive substrate is formed of a conductive foil and a first electrode portion and a second electrode portion which are formed by electrolytic plating selectively formed on the surface of the conductive foil, the conductive foil is 18 μm. When the plating thickness of the first and second electrode portions is 15 to 20 μm, a mounting substrate having an extremely thin unsupported substrate having a thickness of 40 μm or less can be realized.
第二點，由於在安裝基板以行狀配設多個鄰接的第一電極部及第二電極部，故可在一行集聚多個單元，且與鄰接的行係以分離用槽孔使之分離，故亦可實現與鄰接的行之間的間隔極度窄化為習知的1/5的0.2mm。藉此每一片安裝基板的單元數可增加至習知的144.7%，可大幅度提升生產效率及成本。Secondly, since a plurality of adjacent first electrode portions and second electrode portions are arranged in a row on the mounting substrate, a plurality of cells can be collected in one row, and separated from the adjacent rows by the separation holes. Therefore, the interval between adjacent rows can be extremely narrowed to a conventional one-fifth of 0.2 mm. Thereby, the number of units of each mounting substrate can be increased to a conventional 144.7%, which can greatly improve production efficiency and cost.
第三點，作為安裝基板的初始材料的導電箔係留存直到最終製品、第一及第二電極部亦僅於必要的位置以電解鍍覆形成，故在製造步驟中幾乎沒有浪費而捨棄的原始材料，而可實現對環境友善的生產。Thirdly, the conductive foil as the starting material of the mounting substrate remains until the final product, the first and second electrode portions are formed by electrolytic plating only at the necessary positions, so that there is almost no waste and abandonment in the manufacturing step. Materials that enable environmentally friendly production.
第四點，安裝基板係以導電箔作為基底，而於製造步驟中容易因為來自外部的力而變形，故藉由將行區分為複數個區塊，而保留不設置行之共通的導電箔以進行安裝基板的補強。Fourthly, the mounting substrate is made of a conductive foil as a substrate, and is easily deformed by a force from the outside in the manufacturing step. Therefore, by dividing the row into a plurality of blocks, the conductive foil having no common line is left. Reinforce the mounting substrate.
第五點，由於在安裝部層積有鎳鍍覆層、金鍍覆層或銀鍍覆層，並且從相反的主面覆蓋有充填樹脂，故可確保使不存在支持基板的安裝部具有可載置發光元件的強度。Fifthly, since a nickel plating layer, a gold plating layer or a silver plating layer is laminated on the mounting portion, and the opposite main surface is covered with the filling resin, it is ensured that the mounting portion where the supporting substrate is not present is provided. The intensity of the light-emitting element is placed.
第六點，安裝基板係由導電箔、第一及第二電極部所一體形成者，故雖為極薄的材料卻可將來自於固定在安裝部的發光元件的發熱直接地擴散至全體導電箔，而可提升散熱性。Sixth, since the mounting substrate is integrally formed of the conductive foil and the first and second electrode portions, the heat generated from the light-emitting element fixed to the mounting portion can be directly diffused to the entire conductive body even though it is an extremely thin material. Foil for improved heat dissipation.
第七點，設於安裝部、第一及第二電極部的金或銀鍍覆層係可共用作為發光元件的反射層。Seventh, the gold or silver plating layer provided on the mounting portion, the first and second electrode portions may share a reflective layer as a light-emitting element.
根據本發明的製造方法，第一點，由於由薄導電箔開始製作安裝基板，故能以最小限度的材料來實現，並可將安裝基板的厚度形成為導至40μm以下，藉此實現薄型發光裝置的製造方法。According to the manufacturing method of the present invention, since the mounting substrate is prepared from the thin conductive foil, the first point can be realized with a minimum of material, and the thickness of the mounting substrate can be formed to be 40 μm or less, thereby achieving thin light emission. The method of manufacturing the device.
第二點，由於選擇性地在導電箔上以電解鍍覆形成第一電極部及第二電極部，並以最小限度的蝕刻做出絕緣用槽孔及分離用槽孔，故可在不浪費導電箔等原材料下實現最小的安裝基板及薄型發光裝置。Secondly, since the first electrode portion and the second electrode portion are selectively formed on the conductive foil by electrolytic plating, and the insulating hole and the separation hole are formed by minimal etching, no waste can be avoided. The smallest mounting substrate and thin light-emitting device are realized under raw materials such as conductive foil.
第三點，由於使用第二電極部、液狀樹脂及充填樹脂來補強難以抵禦變形的導電箔，故可實現使用無支持基板的安裝基板之薄型發光裝置的製造方法。Thirdly, since the second electrode portion, the liquid resin, and the filling resin are used to reinforce the conductive foil which is hard to resist deformation, a method of manufacturing a thin light-emitting device using a mounting substrate without a supporting substrate can be realized.
第四點，利用液狀樹脂及透明樹脂其樹脂彼此的和諧性進行發光元件的模鑄成形(mold)，而可在大部分為導電箔及電解鍍覆層之下，實現良好的樹脂封裝。Fourthly, the molding of the light-emitting element is carried out by the harmony of the resin of the liquid resin and the transparent resin, and a good resin package can be realized under most of the conductive foil and the electrolytic plating layer.
第五點，藉由行狀的多個排列配置的各單元，可大量地製造發光裝置，而由於以分離用槽分離鄰接的行，故可在一個方向將切塊程序維持為最小限度，而可防止因為切塊程序帶給封裝的不良影響。Fifthly, the light-emitting device can be manufactured in a large number by a plurality of rows arranged in a row, and since the adjacent rows are separated by the separation grooves, the dicing process can be kept to a minimum in one direction. Prevents the adverse effects of the package due to the dicing process.
第六點，在本發明中，可以電解鍍覆第一電極部及第二電極部的步驟、液狀樹脂的附著步驟、分離用槽孔及絕緣用槽孔的蝕刻步驟、充填樹脂的印刷步驟、以及導電金屬層的電解鍍覆步驟的極少的步驟數，來實現薄型發光裝置的製造方法。Sixth, in the present invention, the step of electrolytically plating the first electrode portion and the second electrode portion, the step of attaching the liquid resin, the etching step of the separation groove and the insulating groove, and the printing step of filling the resin And a method of manufacturing a thin light-emitting device by a very small number of steps in the electrolytic plating step of the conductive metal layer.
參照第1圖至第6圖，說明本發明之實施形態。Embodiments of the present invention will be described with reference to Figs. 1 to 6 .
首先，於第1圖顯示本發明的安裝基板。第1圖(A)係該安裝基板的俯視圖、第1圖(B)係表面的擴大圖、而第1圖(C)係背面的擴大圖。First, the mounting substrate of the present invention is shown in Fig. 1. Fig. 1(A) is a plan view of the mounting substrate, an enlarged view of the surface of Fig. 1(B), and an enlarged view of the back surface of Fig. 1(C).
本實施形態的安裝基板1係由導電箔10、第一電極部11、第二電極部12、液狀樹脂13、分離用槽孔14、絕緣用槽孔15及焊接阻劑層16所構成。The mounting substrate 1 of the present embodiment is composed of a conductive foil 10, a first electrode portion 11, a second electrode portion 12, a liquid resin 13, a separation slot 14, an insulating slot 15, and a solder resist layer 16.
以導電箔10而言係選擇可蝕刻並可電解鍍覆的金屬。本實施形態係採用由銅所構成的金屬箔。銅箔係選擇9、12、18或35μm之極薄的厚度者，由於該銅箔係成為薄型發光裝置的安裝基板，故較佳為盡可能的薄者。當銅箔太薄時，由於有在步驟中的製造裝置內的處理中及搬運時，因施力變形而產生皺折的情形，故在12至200μm間的範圍進行選擇。In the case of the conductive foil 10, a metal which can be etched and electrolytically plated is selected. In this embodiment, a metal foil made of copper is used. When the copper foil is selected to have an extremely thin thickness of 9, 12, 18 or 35 μm, since the copper foil is a mounting substrate of a thin light-emitting device, it is preferably as thin as possible. When the copper foil is too thin, wrinkles may occur due to the urging deformation during the processing in the manufacturing apparatus in the step and during transportation, so that it is selected in the range of 12 to 200 μm.
第一電極部11及第二電極部12係藉由銅的電解鍍覆選擇性地形成於導電箔10的表面，而形成15至20μm的範圍的厚度。第一電極部11及第二電極部12係相對向配置，第二電極部12係接近並配置於由導電箔10所成的安裝部17。由於安裝部17僅由導電箔10構成而難以抵禦變形，故較佳為復以第二電極部12包圍安裝部17將之設成畫框狀作為補強。The first electrode portion 11 and the second electrode portion 12 are selectively formed on the surface of the conductive foil 10 by electrolytic plating of copper to form a thickness in the range of 15 to 20 μm. The first electrode portion 11 and the second electrode portion 12 are disposed to face each other, and the second electrode portion 12 is disposed close to and disposed on the mounting portion 17 formed of the conductive foil 10. Since the mounting portion 17 is formed only of the conductive foil 10 and is difficult to resist deformation, it is preferable that the second electrode portion 12 surrounds the mounting portion 17 and is formed in a frame shape as reinforcement.
上述的安裝部17係固著發光元件等的區域，而為了製作薄型發光裝置，雖希望能盡可能的薄，但因為必需是能安裝發光元件的強度，故係以第二電極部12及後述之設於導電箔10背面的焊接阻劑層16做補強。The mounting portion 17 is fixed to a region such as a light-emitting element, and is preferably thin as possible in order to produce a thin light-emitting device. However, since the strength of the light-emitting device must be mounted, the second electrode portion 12 and later will be described. The solder resist layer 16 provided on the back surface of the conductive foil 10 is reinforced.
於本實施形態，係以第一電極部11及第二電極部12構成用以構成一個發光裝置的單元22。又，該單元22係行狀地配置多個於由分離用槽孔14所包夾的細長的區域。In the present embodiment, the first electrode portion 11 and the second electrode portion 12 constitute a unit 22 for constituting one light-emitting device. Further, the unit 22 is arranged in a plurality of rows in an elongated region sandwiched by the separation slots 14.
液狀樹脂13係附著於導電箔10表面的除了第一電極部11，及圍繞安裝部17的第二電極部12以外的區域。液狀樹脂13係選擇膠狀的聚矽氧(silicone)樹脂、丙烯酸系(acrylic)樹脂與環氧樹脂的混合物等之底塗層(undercoat)用的樹脂，藉由網版(screen)印刷附著於預定的塗佈區域，在150℃進行約4個小時左右的熱硬化。液狀樹脂13係形成為20至40μm，埋設於第一電極部11及第二電極部12之間以進行導電箔10的補強。並且，液狀樹脂13亦埋設於各單元22彼此之間，藉此配置為一行之多數個的各單元22係成為藉由液狀樹脂13被連結成為帶狀的狀態。The liquid resin 13 adheres to a region other than the first electrode portion 11 and the second electrode portion 12 surrounding the mounting portion 17 on the surface of the conductive foil 10. The liquid resin 13 is a resin for undercoat which is selected from a gel-like silicone resin, a mixture of an acrylic resin and an epoxy resin, and is attached by screen printing. Thermal hardening was carried out at 150 ° C for about 4 hours in a predetermined coating area. The liquid resin 13 is formed to be 20 to 40 μm, and is embedded between the first electrode portion 11 and the second electrode portion 12 to reinforce the conductive foil 10. In addition, the liquid resin 13 is also embedded in each of the cells 22, and a plurality of the cells 22 arranged in a row are connected to each other in a strip shape by the liquid resin 13.
分離用槽孔14係設於以行狀排列多個的各單元22的第一電極部11及第二電極部12所鄰接的行間，以逐行分離各單元22。分離用槽孔14係沿著行連續地延伸，並貫通導電箔10與形成鄰接的行的第一電極部11及第二電極部12的銅的電解鍍覆層及導電箔而形成。The separation slot 14 is provided between the rows in which the first electrode portion 11 and the second electrode portion 12 of each of the plurality of cells 22 are arranged in a row, and the cells 22 are separated row by row. The separation slot 14 is formed to continuously extend along the row, and is formed to penetrate the conductive foil 10 and the electrolytic plating layer and the conductive foil of copper forming the first electrode portion 11 and the second electrode portion 12 of the adjacent rows.
絕緣用槽孔15係位於導電箔10的相反主面的對應於第一電極部11及第二電極部12間之位置，且平行於用以分離導電箔10之分離用槽孔14而設置，並貫通導電箔10而設置。藉由該絕緣用槽孔15，將包含於各單元22的第一電極部11及第二電極部12予以電性分離。The insulating slot 15 is located at a position opposite to the first electrode portion 11 and the second electrode portion 12 on the opposite main surface of the conductive foil 10, and is disposed parallel to the separation slot 14 for separating the conductive foil 10. It is provided through the conductive foil 10. The first electrode portion 11 and the second electrode portion 12 included in each unit 22 are electrically separated by the insulating hole 15 .
焊接阻劑層16係覆蓋絕緣用槽孔15，並設於導電箔10的相反主面，且設置於對應液狀樹脂13及安裝部17的位置，而有補強導電箔10的功效。再且，與上述液狀樹脂13相同，包含於各行的單元22彼此之間亦埋設有焊接阻劑層16。從而，本形態係藉由液狀樹脂13及焊接阻劑層16將包含於各行的單元22彼此保持為帶狀。The solder resist layer 16 covers the insulating via hole 15 and is provided on the opposite main surface of the conductive foil 10, and is provided at a position corresponding to the liquid resin 13 and the mounting portion 17, and has the effect of reinforcing the conductive foil 10. Further, similarly to the liquid resin 13, the solder resist layer 16 is embedded in the cells 22 included in each row. Therefore, in the present embodiment, the cells 22 included in the respective rows are held in a strip shape by the liquid resin 13 and the solder resist layer 16.
接著，說明安裝基板的樣式。Next, the style of mounting the substrate will be described.
於第1圖(A)所示的安裝基板具體而言係切斷為100mm×68mm的大小。周邊係設有畫框狀的框部2，而區分為複數個區塊3，於各區塊3各單元22係以行狀鄰接而配置。區塊3間的橋接部4之兩端係連結於框部2，以防止由於不需要的力造成各單元22的變形。Specifically, the mounting substrate shown in Fig. 1(A) is cut to a size of 100 mm × 68 mm. A frame-like frame portion 2 is provided in the periphery, and is divided into a plurality of blocks 3, and each of the cells 22 in each block 3 is arranged adjacent to each other in a row. Both ends of the bridge portion 4 between the blocks 3 are coupled to the frame portion 2 to prevent deformation of each unit 22 due to an unnecessary force.
於各行係連續地排列有多個單元22，行間係以分離用槽孔14分離隔離。各行係在27mm的長度中排列有30個單元22，行係設有47行。橋接部4係形成為2.9mm的寬度，以補強上下的區塊3。於框部2的左右邊係設置有各兩個對位孔5，於右下角設有缺角6用以確認正反及上下方向。又，以鄰接於兩端的行的方式在框部2設有對應各單元22的周端的標記7，使用於切塊程序時的對位。這些係用於製造步驟中之與各單元22的對位，以實現極高精度的薄型發光裝置的製造。A plurality of cells 22 are successively arranged in each row, and the rows are separated and separated by the separation holes 14. Each line has 30 units 22 arranged in a length of 27 mm and 47 lines in the line. The bridge portion 4 is formed to have a width of 2.9 mm to reinforce the upper and lower blocks 3. Two alignment holes 5 are provided on the left and right sides of the frame portion 2, and a notch angle 6 is provided on the lower right corner to confirm the front and back directions. Further, the mark 7 corresponding to the peripheral end of each unit 22 is provided in the frame portion 2 so as to be adjacent to the rows at both ends, and is used for alignment in the dicing process. These are used in the manufacturing step to align with the respective units 22 to realize the manufacture of a thin-type light-emitting device of extremely high precision.
接著，於第1圖(B)顯示安裝基板1的表面擴大圖。各單元22的大小為極微小的0.8mm×1.60mm。於鄰接的分離用槽孔14間係在右側排列有第一電極部11，並在左側相對向地排列有第二電極部12，兩者係間隔0.36mm。Next, an enlarged view of the surface of the mounting substrate 1 is shown in FIG. 1(B). The size of each unit 22 is extremely small 0.8 mm x 1.60 mm. The first electrode portion 11 is arranged on the right side between the adjacent separation holes 14 and the second electrode portion 12 is arranged on the left side with a gap of 0.36 mm.
第一電極部11從分離用槽孔14算起係形成0.40mm左右的寬度。The first electrode portion 11 is formed to have a width of about 0.40 mm from the separation slot 14 .
第二電極部12係包圍安裝部17，以補強安裝部17的導電箔10。安裝部17係按照所載置的發光元件適當的設計，而形成0.40mm×0.40mm。且，第二電極部12從分離用槽孔14算起係形成0.84mm左右的寬度。The second electrode portion 12 surrounds the mounting portion 17 to reinforce the conductive foil 10 of the mounting portion 17. The mounting portion 17 is formed to have an appropriate design of the light-emitting elements to be placed, and is formed to be 0.40 mm × 0.40 mm. Further, the second electrode portion 12 is formed to have a width of about 0.84 mm from the separation groove 14.
本實施形態中，包含於一行的單元22彼此之間係被分離。具體而言，參照第1圖(B)，包含於單元22A的第一電極部11係與相鄰接的包含於單元22B的第一電極部11分離而沒有連接。並且，包含於單元22A的第二電極部12亦與相鄰接的包含於單元22B的第二電極部12分離。換句話說，在單元22A及單元22B之間，係不存在構成各單元的導電箔等金屬材料。藉此，即使於發光裝置的製造過程中在單點鏈線所示的部分進行基板的切斷，金屬材料也不會被切斷，而防止了伴隨切斷產生毛邊的狀況。In the present embodiment, the units 22 included in one row are separated from each other. Specifically, referring to FIG. 1(B), the first electrode portion 11 included in the unit 22A is separated from the first electrode portion 11 included in the unit 22B and is not connected. Further, the second electrode portion 12 included in the unit 22A is also separated from the adjacent second electrode portion 12 included in the unit 22B. In other words, between the unit 22A and the unit 22B, there is no metal material such as a conductive foil constituting each unit. Thereby, even if the substrate is cut at the portion indicated by the single-dot chain line in the manufacturing process of the light-emitting device, the metal material is not cut, and the occurrence of burrs accompanying the cutting is prevented.
再且，於各單元22彼此之間導電箔被去除的去除區域的寬度L1係例如為100μm至200μm左右。透過使此寬度L1較於切斷安裝基板1的步驟中所使用的裁切鋸的寬度要長，可更確實地防止毛邊的產生。Further, the width L1 of the removal region where the conductive foil is removed between the respective units 22 is, for example, about 100 μm to 200 μm. By making the width L1 longer than the width of the cutting saw used in the step of cutting the mounting substrate 1, the generation of the burrs can be more reliably prevented.
並且，於第1圖(C)顯示安裝基板1的背面擴大圖。於第一外部取出電極部24及第二外部取出電極部25之間係設有絕緣用槽孔15。絕緣用槽孔15係進行第一外部取出電極部24及第二外部取出電極部25的電性絕緣，由於在強度考量上希望盡量保留導電箔10，故將寬幅設成最小之0.15mm。於鄰接的分離用槽孔14之間以從兩側算起0.40mm的寬幅設有第一外部取出電極部24及第二外部取出電極部25，而包含絕緣用槽孔15的中央部分係由焊接阻劑層16所覆蓋。該焊接阻劑層16亦網版印刷於框部2及區塊3間的橋接部4，以增加安裝基板1的全體的機械性強度。又，焊接阻劑層16亦印刷於安裝部17的導電箔10的背側，以機械性地補強安裝部17並確保固著發光元件時的機械性強度。Further, an enlarged view of the back surface of the mounting substrate 1 is shown in Fig. 1(C). An insulating slot 15 is formed between the first outer extraction electrode portion 24 and the second outer extraction electrode portion 25. The insulating slot 15 electrically insulates the first external extraction electrode portion 24 and the second external extraction electrode portion 25. Since it is desirable to retain the conductive foil 10 as much as possible in terms of strength, the width is set to a minimum of 0.15 mm. The first outer extraction electrode portion 24 and the second outer extraction electrode portion 25 are provided between the adjacent separation slots 14 with a width of 0.40 mm from both sides, and the central portion including the insulating slot 15 is provided. Covered by the solder resist layer 16. The solder resist layer 16 is also screen printed on the bridge portion 4 between the frame portion 2 and the block 3 to increase the mechanical strength of the entire mounting substrate 1. Further, the solder resist layer 16 is also printed on the back side of the conductive foil 10 of the mounting portion 17, to mechanically reinforce the mounting portion 17 and secure the mechanical strength when the light-emitting element is fixed.
相同於第一電極部11及第二電極部12的情形，在安裝基板1的底面，於鄰接的單元22彼此的邊界，金屬材料係被去除。具體而言，包含於單元22A的第一外部取出電極部24係與包含於單元22B的第一外部取出電極部24分離。同樣的，包含於單元22A的第二外部取出電極部25係與包含於單元22B的第二外部取出電極部25分離。包含於單元22A的第一外部取出電極部24及第二外部取出電極部25，與包含於單元22B的第一外部取出電極部24及第二外部取出電極部25間所分離的距離，與上述L1相同即可。藉此，由於即使關於安裝基板1的底面側，在單元22彼此之間亦不存在構成各電極的金屬材料，故即使藉由切斷以分離單元22彼此，仍防止了伴隨此切斷的毛邊的產生。Similarly to the first electrode portion 11 and the second electrode portion 12, the metal material is removed at the boundary between the adjacent cells 22 on the bottom surface of the mounting substrate 1. Specifically, the first external extraction electrode portion 24 included in the unit 22A is separated from the first external extraction electrode portion 24 included in the unit 22B. Similarly, the second external extraction electrode portion 25 included in the unit 22A is separated from the second external extraction electrode portion 25 included in the unit 22B. The distance separating the first outer extraction electrode portion 24 and the second outer extraction electrode portion 25 included in the unit 22A from the first outer extraction electrode portion 24 and the second outer extraction electrode portion 25 included in the unit 22B, and the above L1 is the same. Thereby, even if the metal material constituting each electrode is not present between the cells 22 with respect to the bottom surface side of the mounting substrate 1, even if the separation unit 22 is separated by cutting, the burrs accompanying the cutting are prevented. The production.
也就是，即使於紙面上以單點鏈線表示的位置切斷安裝基板1，被切斷者也僅為液狀樹脂13及焊接阻劑層16，而不會切斷金屬材料。以此，即使以高速旋轉且沿著單點鏈線移動的裁切鋸進行高速的基板切斷，亦精度良好地控制切斷面而不會產生毛邊。That is, even if the mounting substrate 1 is cut at a position indicated by a single-dot chain line on the paper surface, only the liquid resin 13 and the solder resist layer 16 are cut, and the metal material is not cut. As a result, even if the cutting saw that moves at a high speed and moves along the single-dot chain line performs high-speed substrate cutting, the cut surface is accurately controlled without burrs.
本發明的安裝基板1的特徵係以蝕刻形成絕緣用槽孔15，而由於習知的印刷基板係於基板使用絕緣物，故係採用機械性的利用起槽機(router)製作槽孔的方法。這種情形，即使提高起槽機的鑽頭(drill)的精度，寬度亦以1.0mm為界限。由於本發明的安裝基板1係由極薄的導電箔10所形成，故可透過蝕刻處理，而可達成習知的一半(0.5mm)以下的0.2mm(200μm)的寬度。藉此，舉在100mm×100mm的安裝基板安裝1608LED(16mm×8mm的大小)的例子作為計算，則得到以下的結果。The mounting substrate 1 of the present invention is characterized in that the insulating slot 15 is formed by etching, and since the conventional printed circuit board uses an insulator for the substrate, a mechanical groove forming method is used. . In this case, even if the accuracy of the drill of the grooving machine is increased, the width is limited to 1.0 mm. Since the mounting substrate 1 of the present invention is formed of an extremely thin conductive foil 10, it can be transparently etched to achieve a width of 0.2 mm (200 μm) which is less than half (0.5 mm). Therefore, as an example of mounting a 1608 LED (a size of 16 mm × 8 mm) on a mounting board of 100 mm × 100 mm, the following results were obtained.
習知的情形中，行之間的間距(pitch)係1.6mm(單元之大小)+1.0mm(槽孔的寬度)而為2.6mm，在100mm只能容納38行。每行的單元數為125個，於是成為：In the conventional case, the pitch between the lines is 1.6 mm (the size of the unit) + 1.0 mm (the width of the slot) and is 2.6 mm, and can accommodate only 38 lines at 100 mm. The number of cells per line is 125, so it becomes:
38行×125個=4750個38 lines × 125 = 4750
，故每一片安裝基板的生產量為4750個。Therefore, the production capacity of each mounting substrate is 4,750.
相對於此，於本發明，行之間的間距為1.6mm(單元的大小)+0.2mm(槽孔的寬度)而為1.8mm，於100mm可容納55行。每行的單元數為125個，於是形成：On the other hand, in the present invention, the pitch between the rows is 1.6 mm (the size of the cell) + 0.2 mm (the width of the slot) and 1.8 mm, and the row can accommodate 55 rows at 100 mm. The number of cells per line is 125, thus forming:
55行×125個=6875個55 lines × 125 = 6875
，故每一片安裝基板的生產量為6875個。這與習知的情形單純以面積比做比較為144.7%，可實現增加44.7%的生產量。Therefore, the production capacity of each mounting substrate is 6,875. This is compared with the conventional situation, which is only 144.7% compared with the area ratio, which can increase the production volume by 44.7%.
接著，參照第2圖至第6圖，說明關於本發明的安裝基板及使用該安裝基板之薄型發光裝置的製造方法。Next, a mounting substrate of the present invention and a method of manufacturing a thin light-emitting device using the same will be described with reference to FIGS. 2 to 6 .
本發明的製造方法係由以下步驟所構成：以露出預定的第一電極部及接近安裝部的第二電極部之方式，以阻劑層覆蓋導電箔的步驟；以前述阻劑層作為遮罩選擇性地對前述導電箔實施金屬鍍覆，而以行狀形成鄰接多個單元而排列的前述第一及第二電極部的步驟；去除前述阻劑層並於前述導電箔上除了前述第一及第二電極部與前述安裝部之外處附著液狀樹脂的步驟；由附著前述液狀樹脂的相反面對前述導電箔進行選擇性地蝕刻，以設置電性分離前述各單元的前述第一電極部及前述第二電極部的絕緣用槽孔、及分離鄰接的前述行的單元的分離用槽孔而形成安裝基板的步驟；蝕刻並去除存在於各單元彼此之間的區域的導電箔的步驟；將發光元件固著於前述安裝部，並以搭接線(bonding wire)連接前述發光元件的電極及前述第一電極部的步驟；以樹脂覆蓋前述發光元件的步驟；以及藉由切斷基板及樹脂而將各單元分離為發光裝置的步驟。The manufacturing method of the present invention comprises the steps of: covering a conductive foil with a resist layer in such a manner as to expose a predetermined first electrode portion and a second electrode portion close to the mounting portion; and using the resist layer as a mask Selectively performing metal plating on the conductive foil to form the first and second electrode portions arranged adjacent to the plurality of cells in a row; removing the resist layer and disposing the first conductive layer on the conductive foil a step of attaching a liquid resin to the second electrode portion and the outside of the mounting portion; selectively etching the opposite conductive foil opposite to the liquid resin to provide the first electrode electrically separating the respective units And a step of forming a mounting substrate by separating the slot for the second electrode portion and the separation slot for the adjacent row of the cells; and etching and removing the conductive foil present in the region between the cells a step of fixing the light-emitting element to the mounting portion and connecting the electrode of the light-emitting element and the first electrode portion with a bonding wire; covering the foregoing with a resin The step of the light receiving element; and a step of cutting the substrate by the resin and is separated into each unit light emitting device.
於第一個步驟(第2圖(A)及(B))，以露出預定的第一電極部11及接近安裝部17的第二電極部12之方式以阻劑層覆蓋21導電箔10。In the first step (Fig. 2 (A) and (B)), the conductive foil 10 is covered with a resist layer so as to expose the predetermined first electrode portion 11 and the second electrode portion 12 close to the mounting portion 17.
首先，如第2圖(A)所示，備置作為導電箔10的厚度為18μm的銅箔，由於導電箔10極薄容易變形，故於其背面貼附有補強用的載體薄片(carrier sheet)20。載體薄片20係使用以聚酯系的薄膜或丙烯酸系薄膜作為基材的高耐熱性表面保護用薄膜。載體薄片20係透明且厚度在200μm左右，具有弱黏著性，並藉由壓接以黏貼於導電箔10。從而，由捲置有導電箔10的滾筒供給導電箔10，同樣地亦由捲置有載體薄片20的滾筒供給載體薄片20，而可藉由壓接滾筒貼合兩者。載體薄片20係保護導電箔10的變形直到於導電箔10塗佈了液狀樹脂13為止。導電箔10係可在貼附了載體薄片20後，裁切成預定的大小(例如100mm×100mm的大小)並進行批次(batch)處理，亦可保持為薄片狀連續地以下述步驟進行處理。First, as shown in FIG. 2(A), a copper foil having a thickness of 18 μm as the conductive foil 10 is provided, and since the conductive foil 10 is extremely thin and easily deformed, a carrier sheet for reinforcement is attached to the back surface. 20. As the carrier sheet 20, a film for high heat resistance surface protection using a polyester film or an acrylic film as a substrate is used. The carrier sheet 20 is transparent and has a thickness of about 200 μm, has a weak adhesive property, and is adhered to the conductive foil 10 by crimping. Therefore, the conductive foil 10 is supplied from the roller on which the conductive foil 10 is wound, and the carrier sheet 20 is also supplied from the roller on which the carrier sheet 20 is wound, and both of them can be bonded by a pressure roller. The carrier sheet 20 protects the conductive foil 10 from deformation until the conductive foil 10 is coated with the liquid resin 13. The conductive foil 10 can be cut into a predetermined size (for example, a size of 100 mm × 100 mm) after being attached to the carrier sheet 20, and subjected to batch processing, or can be kept in a sheet form and continuously processed in the following steps. .
接著，如第2圖(B)所示，於導電箔10的表面以阻劑層21覆蓋，進行曝光顯影而露出預定的第一電極部11及第二電極部12的導電箔10並留下其他的部分。阻劑層21係使用將光阻劑(photoresist)作成為薄膜狀的乾膜(dry film)，並貼附於導電箔10的表面。Next, as shown in FIG. 2(B), the surface of the conductive foil 10 is covered with a resist layer 21, and exposure and development are performed to expose the conductive foil 10 of the predetermined first electrode portion 11 and the second electrode portion 12 and left. Other parts. The resist layer 21 is a dry film in which a photoresist is formed into a film shape, and is attached to the surface of the conductive foil 10.
於第二個步驟(第2圖(C))中，係以阻劑層21作為遮罩而選擇性地對導電箔10實施金屬鍍覆，並以行狀地形成鄰接多個單元22而排列的第一及第二電極部11、12。In the second step (Fig. 2(C)), the conductive foil 10 is selectively metal plated with the resist layer 21 as a mask, and is arranged in a row to form a plurality of cells 22 adjacent to each other. First and second electrode portions 11, 12.
於本步驟，由於於導電箔10的背面係覆蓋有載體薄片20，故於銅的電解鍍覆槽中將導電箔10連接於陰極而配置，在所露出的導電箔10上選擇性地析出厚度為15至20μm的銅鍍覆層，而形成第一電極部11及第二電極部12。從而，導電箔10與第一電極部11及第二電極部12重疊的部分係成為約40μm的厚度，而可得到作為安裝基板的足夠的機械性強度。結束電解鍍覆時，則去除阻劑層21，使安裝部17、第一電極部11及第二電極部12之間的導電箔10露出。由於安裝部17係被第二電極部12以畫框狀所包圍或接近，故可保護安裝部17的導電箔10不致變形。In this step, since the back surface of the conductive foil 10 is covered with the carrier sheet 20, the conductive foil 10 is connected to the cathode in the electrolytic plating bath of copper, and the thickness is selectively deposited on the exposed conductive foil 10. The first electrode portion 11 and the second electrode portion 12 are formed of a copper plating layer of 15 to 20 μm. Therefore, the portion where the conductive foil 10 overlaps the first electrode portion 11 and the second electrode portion 12 has a thickness of about 40 μm, and sufficient mechanical strength as a mounting substrate can be obtained. When the electrolytic plating is completed, the resist layer 21 is removed, and the conductive foil 10 between the mounting portion 17, the first electrode portion 11, and the second electrode portion 12 is exposed. Since the mounting portion 17 is surrounded or approximated by the second electrode portion 12 in a frame shape, the conductive foil 10 of the mounting portion 17 can be protected from deformation.
構成各單元22的第一電極部11及第二電極部12係如前述以行狀鄰接多個而排列，行亦為多個分離而排列。由於在本步驟係尚未於鄰接的行的第一電極部11及第二電極部12形成分離用槽孔14，故為連結的狀態。The first electrode portion 11 and the second electrode portion 12 constituting each unit 22 are arranged in a row in a row, and are arranged in a plurality of rows. Since the separation holes 14 are not formed in the first electrode portion 11 and the second electrode portion 12 of the adjacent rows in this step, they are in a connected state.
於第3圖顯示本步驟的俯視圖。於第3圖中以陰影線標示的部分係表示阻劑層21，沒有任何印記的部分是導電箔10露出的部分。於該露出的導電箔10上選擇性地析出15至20μm厚的銅鍍覆層，形成第一電極部11及第二電極部12。A top view of this step is shown in FIG. The portion indicated by hatching in Fig. 3 indicates the resist layer 21, and the portion without any imprint is the exposed portion of the conductive foil 10. A copper plating layer having a thickness of 15 to 20 μm is selectively deposited on the exposed conductive foil 10 to form a first electrode portion 11 and a second electrode portion 12.
於第三個步驟(第2圖(D))，係除了第一及第二電極部11、12與安裝部17之外在導電箔10上附著液狀樹脂13。In the third step (Fig. 2(D)), the liquid resin 13 is attached to the conductive foil 10 in addition to the first and second electrode portions 11, 12 and the mounting portion 17.
於本步驟，於表面覆蓋新的阻劑層19，並進行曝光顯影而在安裝部17、第一電極部11及第二電極部12上留下阻劑層19，僅露出第一電極部11及第二電極部12之間的導電箔10。In this step, a new resist layer 19 is covered on the surface, and exposure development is performed to leave a resist layer 19 on the mounting portion 17, the first electrode portion 11, and the second electrode portion 12, and only the first electrode portion 11 is exposed. And the conductive foil 10 between the second electrode portions 12.
接著，藉由網版印刷將液狀樹脂13選擇性地附著於第一電極部11與第二電極部12之間的導電箔10。液狀樹脂13係選擇膠狀的聚矽氧樹脂、丙烯酸系樹脂與環氧樹脂的混合物等底塗層用的樹脂，藉由網版印刷選擇性地附著於預定的塗佈區域，以150℃進行約4個小時左右的熱硬化。液狀樹脂13係形成20至40μm，埋設於第一電極部11及第二電極部12之間以進行導電箔10的補強。Next, the liquid resin 13 is selectively attached to the conductive foil 10 between the first electrode portion 11 and the second electrode portion 12 by screen printing. The liquid resin 13 is a resin for a primer layer such as a gel-like polyoxyn resin, a mixture of an acrylic resin and an epoxy resin, and is selectively adhered to a predetermined coating region by screen printing at 150 ° C. It takes about 4 hours to heat harden. The liquid resin 13 is formed to have a thickness of 20 to 40 μm and is buried between the first electrode portion 11 and the second electrode portion 12 to reinforce the conductive foil 10.
結束了液狀樹脂13的補強後，則從導電箔10機械性的剝離載體薄片20，而成為安裝基板的原形的狀態。When the reinforcement of the liquid resin 13 is completed, the carrier sheet 20 is mechanically peeled off from the conductive foil 10 to form a state in which the mounting substrate is formed.
於第四個步驟(第2圖(E))，由附著有液狀樹脂13的 相反面選擇性地蝕刻導電箔10，以設置電性分離各單元22的第一及第二電極部11、12的絕緣用槽孔15、及分離鄰接的各行的單元的分離用槽孔14而形成安裝基板。In the fourth step (Fig. 2 (E)), by the liquid resin 13 attached thereto The conductive foil 10 is selectively etched on the opposite side to provide an insulating slot 15 for electrically separating the first and second electrode portions 11 and 12 of each unit 22, and a separating slot 14 for separating the adjacent rows of cells. A mounting substrate is formed.
於本步驟，導電箔10的設有第一電極部11及第二電極部12的表面側以保護膜34覆蓋，於背面側以新的阻劑層36覆蓋並進行曝光顯像，以露出預定的分離用槽孔14及絕緣用槽孔15之導電箔10的背面側。In this step, the surface side of the conductive foil 10 on which the first electrode portion 11 and the second electrode portion 12 are provided is covered with a protective film 34, covered with a new resist layer 36 on the back side and exposed for exposure to be exposed. The rear side of the conductive foil 10 of the separation slot 14 and the insulating slot 15 is provided.
接著，從導電箔10的背面側噴塗三氯化鐵等蝕刻液進行化學蝕刻，分離用槽孔14係以貫通導電箔10及其上的電解鍍覆層部分之方式進行蝕刻而形成，絕緣用槽孔15係以蝕刻導電箔10並蝕刻至液狀樹脂13為止之方式形成。任一者都是約40μm厚以下的銅箔的化學蝕刻故可極精密地進行蝕刻，可在分離用槽孔14形成0.2mm的寬度，並可在絕緣用槽孔15形成0.15mm的寬度。且，分離用槽孔14及絕緣用槽孔15係於本步驟同時地形成。Next, an etching solution such as ferric chloride is sprayed from the back side of the conductive foil 10 to perform chemical etching, and the separation hole 14 is formed by etching through the conductive foil 10 and the electrolytic plating layer portion thereon, and is used for insulation. The slot 15 is formed to etch the conductive foil 10 and etch it to the liquid resin 13. Any of the copper foils having a thickness of about 40 μm or less can be etched with extreme precision, and can be formed to have a width of 0.2 mm in the separation hole 14 and a width of 0.15 mm in the insulating hole 15 . Further, the separation slot 14 and the insulating slot 15 are formed simultaneously in this step.
於本步驟形成的分離用槽孔14係如第4圖(A)所示，形成於鄰接的行的第一電極部11及第二電極部12的中間位置，並蝕刻貫通導電箔10及該導電箔10上的電解鍍覆層部分而形成。The separation slot 14 formed in this step is formed at an intermediate position between the first electrode portion 11 and the second electrode portion 12 of the adjacent rows as shown in FIG. 4(A), and is etched through the conductive foil 10 and The electrolytic plating layer on the conductive foil 10 is partially formed.
又，絕緣用絕緣用槽孔15係如第4圖(B)所示，製作於第一電極部11側的液狀樹脂13之下。且，於本圖係包含下個步驟的構成元件。Moreover, the insulating insulating hole 15 is formed under the liquid resin 13 on the side of the first electrode portion 11 as shown in Fig. 4(B). Moreover, this figure contains the constituent elements of the next step.
於第五個步驟(第2圖(F))，係進行用以將薄型發光元件安裝於前個步驟所製作的安裝基板的加工。In the fifth step (Fig. 2(F)), a process for attaching the thin light-emitting device to the mounting substrate produced in the previous step is performed.
首先，於導電箔10的背面側以填埋絕緣用槽孔15的方式進行環氧樹脂系的焊接阻劑層16的網版印刷。焊接阻劑層16係以令導電箔10背面的第一電極部11及第二電極部12露出於各單元的兩側之方式，附著於絕緣用槽孔15及包含導電箔10的安裝部17的中央部分。焊接阻劑層16的任務第一是，在安裝基板的周圍及區塊間亦都被網版印刷，以增強安裝基板的機械性強度。第二，亦附著於對應安裝部17的導電箔10的背面而進行發光元件的固著時的安裝部17補強。第三，以包含絕緣用槽孔15之方式廣泛覆蓋各單元的導電箔10的作為外部電極而運作的第一電極部11及第二電極部12以外區域，以與液狀樹脂13共同補強各單元22的導電箔10。第四，分離作為露出的外部電極而運作的第一電極部11及第二電極部12間，以防止焊接橋接的形成。First, screen printing of the epoxy resin-based solder resist layer 16 is performed on the back surface side of the conductive foil 10 so as to fill the insulating via holes 15. The solder resist layer 16 is adhered to the insulating slot 15 and the mounting portion 17 including the conductive foil 10 such that the first electrode portion 11 and the second electrode portion 12 on the back surface of the conductive foil 10 are exposed on both sides of each unit. The central part. The first task of the solder resist layer 16 is to screen print around the mounting substrate and between the blocks to enhance the mechanical strength of the mounting substrate. Secondly, it is also attached to the back surface of the conductive foil 10 corresponding to the mounting portion 17, and the mounting portion 17 at the time of fixing the light-emitting element is reinforced. Third, the first electrode portion 11 and the second electrode portion 12 which operate as external electrodes of the conductive foil 10 of each unit are widely covered so as to cover the insulating via holes 15 to reinforce each other with the liquid resin 13 Conductive foil 10 of unit 22. Fourth, the first electrode portion 11 and the second electrode portion 12 that operate as the exposed external electrodes are separated to prevent the formation of the solder bridging.
接著，藉由電解鍍覆將導電性金屬層23附著於安裝基板1之露出的第一電極部11、安裝部17及第二電極部12。導電性金屬層23係為可進行搭接的高硬度多層金屬層。於此係例如鎳(Ni)-金(Au)層，或係Ni-Ag層。又，亦可為使用鈀(Pd)等的Ni-Pd層，或Ag-Pd層。Ni為硬度高的金屬層，Au層或Ag層係可與金屬細線28搭接。Next, the conductive metal layer 23 is adhered to the exposed first electrode portion 11, the mounting portion 17, and the second electrode portion 12 of the mounting substrate 1 by electrolytic plating. The conductive metal layer 23 is a high-hardness multilayer metal layer that can be overlapped. This is for example a nickel (Ni)-gold (Au) layer or a Ni-Ag layer. Further, a Ni-Pd layer such as palladium (Pd) or an Ag-Pd layer may be used. Ni is a metal layer having a high hardness, and the Au layer or the Ag layer may be overlapped with the fine metal wires 28.
在此，安裝基板1除了被液狀樹脂13及焊接阻劑層16所覆蓋的部分以外，在未形成新的遮罩之狀態進行電解鍍覆。於導電箔10的表面側的第-電極部11及第二電極部12及安裝部17鍍覆導電性金屬層23，並於導電箔10的背面側鍍覆於成為外部取出電極設在兩端的第一外部取出電極部24及第二外部取出電極部25。鎳層係形成約5μm，而金、銀或鈀層約形成0.2μm，利用鎳層的硬度兼而補強安裝部17。金、銀或鈀層除了可進行搭接，亦有作為發光元件的反射層的功效。Here, the mounting substrate 1 is electrolytically plated in a state where a new mask is not formed, except for the portion covered by the liquid resin 13 and the solder resist layer 16. The first electrode portion 11 and the second electrode portion 12 and the mounting portion 17 on the surface side of the conductive foil 10 are plated with the conductive metal layer 23, and are plated on the back side of the conductive foil 10 so that the external extraction electrode is provided at both ends. The first external extraction electrode portion 24 and the second external extraction electrode portion 25 are provided. The nickel layer was formed to be about 5 μm, and the gold, silver or palladium layer was formed to have a thickness of about 0.2 μm, and the mounting portion 17 was reinforced by the hardness of the nickel layer. In addition to the lap joint, the gold, silver or palladium layer also functions as a reflective layer of the light-emitting element.
並且，於本步驟，係進行經由導電箔的連結部通電的電解鍍覆處理。具體而言，如第4圖(A)所示，以行狀排列的各單元22係經由由導電箔構成的連結部(纏細的部分)連接。從而，於步驟中，係經由該連接部通電，而藉由電解鍍覆處理形成鍍覆膜。又，該連接部分係於後續的步驟去除。Further, in this step, electrolytic plating treatment is performed by energization of the connection portion of the conductive foil. Specifically, as shown in FIG. 4(A), each unit 22 arranged in a row is connected via a connecting portion (a thin portion) made of a conductive foil. Therefore, in the step, the plating film is formed by electrolytic plating treatment by energization through the connection portion. Again, the connection portion is removed in a subsequent step.
於第六個步驟中，參照第5圖，係藉由去除設於各單元22彼此間的金屬材料，防止於最終進行的分離步驟中產生毛邊。第5圖(A)係顯示安裝基板的頂面的平面圖，第5圖(B)係顯示安裝基板的底面的平面圖，而第5圖(C)至第5圖(E)係於第5圖(A)的C-C’線的剖面圖。In the sixth step, referring to Fig. 5, by removing the metal material provided between the respective units 22, burrs are prevented from occurring in the final separation step. Fig. 5(A) is a plan view showing the top surface of the mounting substrate, Fig. 5(B) is a plan view showing the bottom surface of the mounting substrate, and Figs. 5(C) to 5(E) are shown in Fig. 5. A cross-sectional view of the line C-C' of (A).
參照第5圖(A)，藉由上述的步驟於安裝基板1的頂面以行狀設置由第一電極部11及第二電極部12構成的單元22。由於於各單元22彼此間設有液狀樹脂13，故乍看之下各單元22雖似乎是互相分離，但在本步驟以前，行狀排列的單元22彼此係因為由液狀樹脂13所覆蓋的導電箔而仍為連接的狀態。示意此狀態的是第5圖(C)。Referring to Fig. 5(A), the unit 22 composed of the first electrode portion 11 and the second electrode portion 12 is provided in a row on the top surface of the mounting substrate 1 by the above-described steps. Since the liquid resins 13 are provided between the respective units 22, it seems that the respective units 22 are separated from each other at a glance, but before this step, the units 22 arranged in a row are covered by the liquid resin 13 The conductive foil is still in a connected state. This state is shown in Fig. 5 (C).
參照第5圖(B)，在安裝基板的底面，包含於鄰接的單元22的第一外部取出電極部24及第二外部取出電極部25係藉由導電箔相互連接。從而，當對保持此狀態於單元22彼此的邊界進行切斷處理時，則會因為切斷導電箔而產生毛邊。於本步驟，係透過蝕刻去除位於單元22彼此間的導電箔，藉以設置去除區域30。也就是，藉由預先去除配置於於之後的步驟進行切斷加工的領域的導電膜，以抑制毛邊的產生。Referring to Fig. 5(B), the first outer extraction electrode portion 24 and the second outer extraction electrode portion 25 included in the adjacent unit 22 are connected to each other by a conductive foil on the bottom surface of the mounting substrate. Therefore, when the boundary between the cells 22 is cut off while maintaining this state, burrs are generated by cutting the conductive foil. In this step, the conductive foils located between the cells 22 are removed by etching, thereby providing the removal region 30. That is, the conductive film in the field of the cutting process is removed by previously removing the step disposed in the subsequent step to suppress the generation of burrs.
參照第5圖(D)的剖面圖，於本步驟中，首先，以覆蓋包含於各單元22的第一外部取出電極部24的底面，並且使上述去除區域30的導電箔露出的方式形成阻劑32。實際上，構成設於導電箔10的底面的第一外部取出電極部24的鍍覆膜係被阻劑32選擇性地覆蓋。並且，透過由下方進行濕蝕刻，將去除區域30的導電箔10及鍍覆膜予以去除。該蝕刻係在到達液狀樹脂13為止連續的進行，以完全地去除存在於去除區域30的金屬材料。又，為了保護配置於導電箔10頂面的第一電極部11及第二電極部12不受本步驟的蝕刻，而以未圖示的保護膜保護第一電極部11及第二電極部12。本步驟結束後，阻劑32係被剝離。Referring to the cross-sectional view of Fig. 5(D), in this step, first, the bottom surface of the first external extraction electrode portion 24 included in each unit 22 is covered, and the conductive foil of the removal region 30 is exposed to form a resistance. Agent 32. Actually, the plating film constituting the first external extraction electrode portion 24 provided on the bottom surface of the conductive foil 10 is selectively covered by the resist 32. Then, the conductive foil 10 and the plating film in the removed region 30 are removed by wet etching from below. This etching is continuously performed until the liquid resin 13 is reached to completely remove the metal material present in the removal region 30. Moreover, in order to protect the first electrode portion 11 and the second electrode portion 12 disposed on the top surface of the conductive foil 10 from etching in this step, the first electrode portion 11 and the second electrode portion 12 are protected by a protective film (not shown). . After the end of this step, the resist 32 is peeled off.
參照第5圖(E)，接著，於導電箔10被去除的去除區域30埋設新的充填樹脂38。具體而言，藉由充填液狀或半固態的環氧樹脂或聚矽氧樹脂等於去除區域30後，進行加熱硬化，以形成充填樹脂38。Referring to Fig. 5(E), next, a new filling resin 38 is buried in the removal region 30 where the conductive foil 10 is removed. Specifically, by filling the liquid or semi-solid epoxy resin or polyoxyn resin with the removal region 30, heat curing is performed to form the filling resin 38.
透過以上步驟以製造多個以行狀配置了單元22的安裝基板。該安裝基板1係如參照第1圖(B)及第1圖(C)所說明，在各單元彼此間去除導電箔等金屬材料。因此即使為了使各單元22分離而切斷安裝基板1，亦不會切斷金屬材料，故可實現了防止毛邊產生的分離步驟。Through the above steps, a plurality of mounting substrates in which the cells 22 are arranged in a row are manufactured. The mounting substrate 1 is described with reference to FIGS. 1(B) and 1(C), and a metal material such as a conductive foil is removed between the respective units. Therefore, even if the mounting substrate 1 is cut in order to separate the respective units 22, the metal material is not cut, so that the separation step for preventing the occurrence of burrs can be achieved.
接著如第6圖(A)及(B)所示，進行薄型發光裝置的組裝。Next, as shown in Fig. 6 (A) and (B), the assembly of the thin type light-emitting device is performed.
於第七個步驟(第6圖(A))中，係於安裝部17固著發光元件26，並以搭接線連接發光元件26的電極與第一電極部11。In the seventh step (Fig. 6(A)), the light-emitting element 26 is fixed to the mounting portion 17, and the electrode of the light-emitting element 26 and the first electrode portion 11 are connected by a bonding wire.
於本步驟，發光元件26的陰極電極係以接著劑27固著於安裝部17上。發光元件26的固著係使用貼片機(chip mounter)。發光元件26實際所被固著者，係安裝部的導電性金屬層23。安裝部17係以被第二電極部12圍繞而形成，故將發光元件26安裝至該安裝部17內部時容易辨認位置。In this step, the cathode electrode of the light-emitting element 26 is fixed to the mounting portion 17 with an adhesive 27. The fixing of the light-emitting element 26 uses a chip mounter. The light-emitting element 26 is actually a fixer, and is a conductive metal layer 23 of the mounting portion. Since the mounting portion 17 is formed to be surrounded by the second electrode portion 12, it is easy to recognize the position when the light-emitting element 26 is mounted inside the mounting portion 17.
接著劑27係為銀(Ag)等導電性膠。發光元件26亦可藉由安裝部17的金(Au)鍍覆層與Au共晶而固著。The adhesive 27 is a conductive paste such as silver (Ag). The light-emitting element 26 can also be fixed by eutectic with Au by a gold (Au) plating layer of the mounting portion 17.
並且，透過使用金製的金屬細線28，以搭接器(bonder)一邊對第1電極部11的位置進行圖案辨識一邊進行超音波熱壓接，以連接發光元件26的陽極電極及第一電極部11的導電性金屬層23。此外，發光元件26的陰極電極係透過接著劑27直接地與第二電極部12連接。Further, by using a metal thin wire 28 made of gold, ultrasonic bonding is performed while patterning the position of the first electrode portion 11 by a bonder to connect the anode electrode and the first electrode of the light-emitting element 26. The conductive metal layer 23 of the portion 11. Further, the cathode electrode of the light-emitting element 26 is directly connected to the second electrode portion 12 through the adhesive 27 .
於第八個步驟(第6圖(B))，係以透明樹脂29覆蓋發光元件26。In the eighth step (Fig. 6(B)), the light-emitting element 26 is covered with a transparent resin 29.
於本步驟，係以透明樹脂29覆蓋發光元件26及金屬細線28。透明樹脂29係保護發光元件26及金屬細線28不接觸外部氣體，且亦有透出光的透鏡的作用。In this step, the light-emitting element 26 and the fine metal wires 28 are covered with a transparent resin 29. The transparent resin 29 protects the light-emitting element 26 and the fine metal wires 28 from contact with external air, and also functions as a lens that transmits light.
透明樹脂29係使用模鑄成形模具透過轉移成形(transfer mold)或射出成形(injection mold)形成。關於所成形的透明樹脂29，由於在安裝部17的第二電極部12的周邊係以液狀樹脂13包圍三邊，故因為同為樹脂的液狀樹脂13及透明樹脂29的特性而可保持良好的接著強度。是故被各別地分離後，由於透明樹脂29所具有的強度，儘管在薄型之下仍可維持發光裝置的形狀。The transparent resin 29 is formed by a transfer molding or an injection mold using a die-casting mold. Since the transparent resin 29 to be molded is surrounded by the liquid resin 13 on the periphery of the second electrode portion 12 of the mounting portion 17, the liquid resin 13 and the transparent resin 29 which are the same resin can be retained. Good adhesion strength. Therefore, the shape of the light-emitting device can be maintained even under the thin shape due to the strength of the transparent resin 29 after being separated separately.
模鑄成形模具係配置成與分離用槽孔14、第一電極部11及第二電極部12的一部份重疊，並僅於安裝基板1的表面側注入透明樹脂29而進行模鑄成形。此時因透明樹脂29與包圍安裝部17的第二電極部12的三邊的液狀樹脂13有優良的配適性，故可良好地進行接著並封裝發光元件26。The mold for molding is disposed so as to overlap a portion of the separation hole 14, the first electrode portion 11, and the second electrode portion 12, and the transparent resin 29 is injected only on the surface side of the mounting substrate 1 to perform molding. At this time, since the transparent resin 29 has excellent compatibility with the liquid resin 13 on the three sides of the second electrode portion 12 surrounding the mounting portion 17, the light-emitting element 26 can be satisfactorily packaged.
於第九個步驟(第6圖(C))，係依各單元22予以分割為個別的發光裝置。In the ninth step (Fig. 6(C)), each unit 22 is divided into individual light-emitting devices.
於本步驟中，由於多個單元22係以行狀排列，故各行的透明樹脂29係以分離用槽孔分隔，而顯現為連續的一條樹脂模鑄件。於是，鄰接於安裝基板的各行而排列的多個單元係藉由切塊程序分離為各別的已完成的發光裝置。透過對行進行正交的切塊程序，鄰接的單元22即可藉由分離用槽孔14各別地分離。In this step, since the plurality of cells 22 are arranged in a row, the transparent resin 29 of each row is separated by the separation slits, and appears as a continuous resin molding. Thus, a plurality of cells arranged adjacent to each row of the mounting substrate are separated into individual completed light-emitting devices by a dicing process. The adjacent cells 22 can be separately separated by the separation slots 14 by orthogonally dicing the rows.
於本步驟中，係同時分割透明樹脂29及附著有透明樹脂29的安裝基板1。參照第1圖(B)及第1圖(C)，安裝基板1係於單點鏈線所示的位置被切斷。如上所述，於安裝基板1被切斷的部分(單元22彼此之間的區域)，導電箔及鍍覆膜等金屬材料係被去除。從而，僅切斷安裝基板1由樹脂所構成的部分，故沒有因為本步驟的切斷而產生的毛邊。並且，可加快切斷透明樹脂29及安裝基板1的速度以提高生產力。In this step, the transparent resin 29 and the mounting substrate 1 to which the transparent resin 29 is attached are simultaneously divided. Referring to FIGS. 1(B) and 1(C), the mounting substrate 1 is cut at a position indicated by a single-dot chain line. As described above, in the portion where the mounting substrate 1 is cut (the region between the cells 22), the metal material such as the conductive foil and the plating film is removed. Therefore, only the portion of the mounting substrate 1 made of resin is cut, so that no burrs are generated due to the cutting of this step. Moreover, the speed at which the transparent resin 29 and the mounting substrate 1 are cut can be increased to increase productivity.
再且，參照第1圖(B)，分離單元22彼此間的寬度L1，係設定為較使用於本步驟的分離的裁切鋸的寬度要寬。從而，避開單元22中所含的電極而進行由裁切鋸所為之分離，故能以不產生毛邊之方式進行分離。Further, referring to Fig. 1(B), the width L1 between the separation units 22 is set to be wider than the width of the separate cutting saw used in this step. Therefore, the separation by the cutting saw is performed while avoiding the electrode included in the unit 22, so that separation can be performed without generating burrs.
1．．．安裝基板1. . . Mounting substrate
2．．．框部2. . . Frame
3．．．區塊3. . . Block
4．．．橋接部4. . . Bridge
5．．．對位孔5. . . Alignment hole
6．．．切角部6. . . Cut corner
7．．．標記7. . . mark
10．．．導電箔10. . . Conductive foil
11．．．第一電極部11. . . First electrode portion
12．．．第二電極部12. . . Second electrode portion
13．．．液狀樹脂13. . . Liquid resin
14．．．分離用槽孔14. . . Separation slot
15．．．絕緣用槽孔15. . . Slot for insulation
16．．．焊接阻劑層16. . . Solder resist layer
17．．．安裝部17. . . Installation department
19,21,36．．．阻劑層19, 21, 36. . . Resistive layer
20．．．載體薄片20. . . Carrier sheet
22,22A,22B．．．單元22, 22A, 22B. . . unit
23．．．導電性金屬層twenty three. . . Conductive metal layer
24．．．第一外部取出電極部twenty four. . . First external extraction electrode portion
25．．．第二外部取出電極部25. . . Second external extraction electrode portion
26．．．發光元件26. . . Light-emitting element
27．．．接著劑27. . . Follower
28．．．金屬細線28. . . Thin metal wire
29．．．透明樹脂29. . . Transparent resin
30．．．去除區域30. . . Removal area
32．．．阻劑32. . . Resistor
34．．．保護膜34. . . Protective film
38．．．充填樹脂38. . . Filling resin
100．．．發光元件100. . . Light-emitting element
200．．．基底基板200. . . Base substrate
300．．．基板電極300. . . Substrate electrode
400．．．連接電極部400. . . Connecting electrode
500．．．光反射部500. . . Light reflection unit
600．．．孔部600. . . Hole
700．．．鍍覆層700. . . Plating layer
L1．．．寬度L1. . . width
第1圖係本發明安裝基板的(A)俯視圖、(B)表面擴大圖、(C)背面擴大圖。Fig. 1 is a (A) plan view, (B) surface enlargement diagram, and (C) rear enlarged view of the mounting substrate of the present invention.
第2圖係使用於本發明的安裝基板的製造方法說明圖，而(A)至(F)係剖面圖。Fig. 2 is an explanatory view showing a method of manufacturing a mounting substrate used in the present invention, and (A) to (F) are cross-sectional views.
第3圖係說明本發明的製造方法的俯視圖。Fig. 3 is a plan view showing the manufacturing method of the present invention.
第4圖係本發明的製造方法的說明圖，(A)為俯視圖、而(B)為仰視圖。Fig. 4 is an explanatory view showing a manufacturing method of the present invention, wherein (A) is a plan view and (B) is a bottom view.
第5圖係本發明的製造方法的說明圖，(A)為俯視圖、(B)為仰視圖、而(C)至(E)為剖面圖。Fig. 5 is an explanatory view showing a manufacturing method of the present invention, wherein (A) is a plan view, (B) is a bottom view, and (C) to (E) are cross-sectional views.
第6圖係說明本發明的製造方法的剖面圖，(A)及(B為剖面圖)、而(C)為平面圖。Fig. 6 is a cross-sectional view showing the manufacturing method of the present invention, (A) and (B are cross-sectional views), and (C) is a plan view.
第7圖係說明習知的發光裝置的剖面圖。Figure 7 is a cross-sectional view showing a conventional light-emitting device.
1．．．安裝基板1. . . Mounting substrate
2．．．框部2. . . Frame
3．．．區塊3. . . Block
4．．．橋接部4. . . Bridge
5．．．對位孔5. . . Alignment hole
6．．．切角部6. . . Cut corner
14．．．分離用槽孔14. . . Separation slot
22．．．單元twenty two. . . unit
Claims (5)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009143835A JP5447928B2 (en) | 2009-06-17 | 2009-06-17 | Mounting substrate and method of manufacturing thin light emitting device using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201108889A TW201108889A (en) | 2011-03-01 |
| TWI403234B true TWI403234B (en) | 2013-07-21 |
Family
ID=43370036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099114023A TWI403234B (en) | 2009-06-17 | 2010-05-03 | Installation substrate and method for manufacturing thin illumination device using the same |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5447928B2 (en) |
| CN (1) | CN101930964B (en) |
| TW (1) | TWI403234B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013171912A (en) * | 2012-02-20 | 2013-09-02 | Stanley Electric Co Ltd | Light-emitting device |
| US9908796B2 (en) | 2012-10-23 | 2018-03-06 | Ecolab Usa Inc. | Use of oxidizing and non-oxidizing biocides for control of bacteria tolerant to stabilized-oxidant treatment |
| KR101509650B1 (en) | 2013-11-20 | 2015-04-07 | (주)포인트엔지니어링 | substrate for preventing burr generating |
| DE102015214219A1 (en) | 2015-07-28 | 2017-02-02 | Osram Opto Semiconductors Gmbh | Method for producing a component and a component |
| KR101819907B1 (en) | 2016-02-12 | 2018-01-22 | 주식회사 세미콘라이트 | Substrate for semiconductor light emitting device |
| EP3817520A4 (en) * | 2018-06-29 | 2022-04-06 | Kyocera Corporation | Wiring board |
| CN110277378B (en) * | 2019-04-25 | 2023-11-14 | 深圳市聚飞光电股份有限公司 | Aggregate substrate, light-emitting device and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005026318A (en) * | 2003-06-30 | 2005-01-27 | Ngk Spark Plug Co Ltd | Method for manufacturing wiring board and wiring board raw material |
| JP2009071199A (en) * | 2007-09-17 | 2009-04-02 | Element Denshi:Kk | Mounting substrate, and method for manufacturing thin light-emitting device using same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003037344A (en) * | 2001-07-25 | 2003-02-07 | Sanyo Electric Co Ltd | Circuit device and its manufacturing method |
| JP4255015B2 (en) * | 2003-12-15 | 2009-04-15 | シチズン電子株式会社 | Optical semiconductor package |
| JP4705614B2 (en) * | 2007-08-06 | 2011-06-22 | パナソニック株式会社 | Resin-sealed semiconductor device |
| JP2008153698A (en) * | 2008-03-07 | 2008-07-03 | Matsushita Electric Ind Co Ltd | Surface-mounting photoelectric conversion device |
-
2009
- 2009-06-17 JP JP2009143835A patent/JP5447928B2/en active Active
-
2010
- 2010-05-03 TW TW099114023A patent/TWI403234B/en not_active IP Right Cessation
- 2010-06-09 CN CN2010102011394A patent/CN101930964B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005026318A (en) * | 2003-06-30 | 2005-01-27 | Ngk Spark Plug Co Ltd | Method for manufacturing wiring board and wiring board raw material |
| JP2009071199A (en) * | 2007-09-17 | 2009-04-02 | Element Denshi:Kk | Mounting substrate, and method for manufacturing thin light-emitting device using same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5447928B2 (en) | 2014-03-19 |
| CN101930964A (en) | 2010-12-29 |
| CN101930964B (en) | 2012-08-08 |
| JP2011003626A (en) | 2011-01-06 |
| TW201108889A (en) | 2011-03-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI403234B (en) | Installation substrate and method for manufacturing thin illumination device using the same | |
| JP2002009196A (en) | Manufacturing method of semiconductor device | |
| JP2009055055A (en) | Method of manufacturing semiconductor device | |
| US20050212107A1 (en) | Circuit device and manufacturing method thereof | |
| JP2004119863A (en) | Circuit and its production | |
| CN205609512U (en) | Semiconductor package | |
| JP2004071898A (en) | Circuit device and its producing process | |
| JP2022120854A (en) | Substrate for semiconductor device and semiconductor device | |
| JP2004071899A (en) | Circuit device and its producing method | |
| JP2008053290A (en) | Optical semiconductor device and its manufacturing method | |
| JP2007317803A (en) | Light emitting device and its manufacturing method | |
| KR20040040348A (en) | Circuit device, circuit module, and manufacturing method of the circuit device | |
| JP2015185619A (en) | Substrate for semiconductor device, manufacturing method of substrate, semiconductor device and semiconductor device manufacturing method | |
| JP3963923B2 (en) | Manufacturing method of mounting substrate with reflector | |
| JP4118320B1 (en) | Mounting substrate and method of manufacturing thin light emitting device using the same | |
| JP2004207276A (en) | Circuit device and its manufacturing method | |
| JP2022168143A (en) | Semiconductor device substrate and semiconductor device | |
| JP2017188604A (en) | Lead frame and semiconductor device, and manufacturing method of lead frame and semiconductor device | |
| CN107658286B (en) | Substrate for mounting semiconductor element, semiconductor device, and method for manufacturing semiconductor device | |
| JP3600137B2 (en) | Circuit device manufacturing method | |
| JP7256303B2 (en) | Substrates for semiconductor devices and semiconductor devices | |
| JP2014022582A (en) | Semiconductor device manufacturing method and semiconductor device | |
| JP7145414B2 (en) | Lead frame and its manufacturing method, and semiconductor device and its manufacturing method | |
| JP6579667B2 (en) | Semiconductor device substrate manufacturing method and semiconductor device manufacturing method | |
| JP6579666B2 (en) | Semiconductor device substrate, method of manufacturing the substrate, and semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |