TWI402734B - Touch device integrated with capacitive and resistive sensing operation - Google Patents

Touch device integrated with capacitive and resistive sensing operation Download PDF

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TWI402734B
TWI402734B TW98106787A TW98106787A TWI402734B TW I402734 B TWI402734 B TW I402734B TW 98106787 A TW98106787 A TW 98106787A TW 98106787 A TW98106787 A TW 98106787A TW I402734 B TWI402734 B TW I402734B
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electrode pattern
substrate
touch
electrode
touch device
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TW201033876A (en
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Tpk Touch Solutions Inc
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Description

整合式觸控裝置Integrated touch device

本發明係關於一種觸控裝置之設計,特別是關於一種可操作於電容式觸控位置感測模式或電阻式觸控位置感測模式之整合式觸控裝置。The present invention relates to a touch device design, and more particularly to an integrated touch device operable in a capacitive touch position sensing mode or a resistive touch position sensing mode.

電阻式觸控面板由ITO(氧化銦錫)薄膜和ITO玻璃所組成,中間由複數個絕緣隔點所隔開,藉由一觸控物件(例如觸控筆)去觸壓ITO薄膜形成下壓凹陷,使其與下層的ITO玻璃接觸而產生電壓的變化,再將類比訊號轉為數位訊號,再經由微處理器之運算處理取得受觸壓點之操作位置。The resistive touch panel is composed of an ITO (Indium Tin Oxide) film and an ITO glass, and is separated by a plurality of insulating spacers, and a touch object (such as a stylus) is used to touch the ITO film to form a depression. The recess is brought into contact with the underlying ITO glass to generate a voltage change, and then the analog signal is converted into a digital signal, and then the operation position of the touched point is obtained by the microprocessor processing.

電容式觸控面板基本上是利用透明電極與導電體之間的電容耦合所產生之電容耦合變化,從所產生之誘導電流來檢測受觸壓點之操作位置。電容式觸控面板之結構中,最外層為一透明基材,第二層為ITO層,當一觸控物件(例如手指)接觸到透明基材之表面時,觸控物件就會與外側導電層上的電場產生電容耦合,而產生微小的電流的變化,再由微處理器計算出手指觸控之操作位置。The capacitive touch panel basically uses the capacitive coupling change generated by the capacitive coupling between the transparent electrode and the electrical conductor to detect the operating position of the contacted pressure point from the induced current generated. In the structure of the capacitive touch panel, the outermost layer is a transparent substrate, and the second layer is an ITO layer. When a touch object (such as a finger) contacts the surface of the transparent substrate, the touch object is electrically conductive with the outer side. The electric field on the layer creates a capacitive coupling that produces a small change in current, which is then calculated by the microprocessor.

然而,電阻式觸控板與電容式觸控板在操作上有其限制條件及缺點。其中電阻式觸控板具有價格較低之優點,但在觸控時需使上下兩導電層接觸,故需施加一定程度之觸壓力,較容易使導電層損壞,且其敏感度也較低。而電容式觸控板雖敏感度較高,但因其作用原理的關係,在觸控物件之選用上必須是一導電體,例如手指或是接有地線的觸頭,以便傳導電流,若是以一絕緣體作為觸控物件則觸控板無法進行感測。However, the resistive touch panel and the capacitive touch panel have limitations and disadvantages in operation. Among them, the resistive touch panel has the advantages of lower price, but the two upper and lower conductive layers need to be contacted during touch, so a certain degree of contact pressure needs to be applied, and the conductive layer is easily damaged, and the sensitivity thereof is also low. The capacitive touch panel has high sensitivity, but due to its action principle, the touch object must be selected as a conductor, such as a finger or a grounded contact, to conduct current. With an insulator as the touch object, the touchpad cannot be sensed.

本發明之目的是提供一種可感測使用者觸控操作方式而可對應操作於電容式或電阻式觸控位置感測模式之整合式觸控裝置,當使用者輕觸該整合式觸控裝置之觸控操作面時,整合式觸控裝置會操作於電容式觸控位置感測模式,而當使用者觸壓該整合式觸控裝置之觸控操作面、或以筆寫輸入操作該整合式觸控裝置之觸控操作面時,整合式觸控裝置會操作於電阻式觸控位置感測模式。An object of the present invention is to provide an integrated touch device capable of sensing a touch operation mode of a user and corresponding to a capacitive or resistive touch position sensing mode, when the user touches the integrated touch device When the touch operation surface is touched, the integrated touch device operates in the capacitive touch position sensing mode, and when the user touches the touch operation surface of the integrated touch device, or the pen write input operates the integration When the touch operation surface of the touch device is touched, the integrated touch device operates in the resistive touch position sensing mode.

本發明為解決習知技術之問題所採用之技術手段係在整合式觸控裝置之第一基材形成一第一電極圖型,而在一第二基材形成有一第二電極圖型。第一電極圖型與第二電極圖型各透過一第一掃描電路及一第二掃描電路連接於一微處理器。The technical means adopted by the present invention to solve the problems of the prior art is to form a first electrode pattern on the first substrate of the integrated touch device and a second electrode pattern on a second substrate. The first electrode pattern and the second electrode pattern are each connected to a microprocessor through a first scanning circuit and a second scanning circuit.

當使用者輕觸觸控裝置之觸控操作面時,該整合式觸控裝置操作於電容式觸控位置感測模式,該觸控物件與該第一電極圖型之間之電容耦合變化由該微處理器接收,據以計算出該觸控物件位在該第一基材之觸控操作面之至少一操作位置。When the user touches the touch operation surface of the touch device, the integrated touch device operates in the capacitive touch position sensing mode, and the capacitive coupling between the touch object and the first electrode pattern is changed by The microprocessor receives, according to the calculation, the touch object is located at at least one operating position of the touch operation surface of the first substrate.

當使用者觸壓該觸控裝置之觸控操作面、或以筆寫輸入操作該觸控裝置之觸控操作面時,位在該操作位置處之第一基材因受壓,使該第一電極圖型與該第二電極圖型接觸,該整合式觸控裝置操作於電阻式觸控位置感測模式,該微處理器即依據該第二電極圖型之電壓變化,計算出該觸控物件位在該第一基材之觸控操作面之至少一操作位置。When the user touches the touch operation surface of the touch device or operates the touch operation surface of the touch device with the pen input input, the first substrate located at the operation position is pressed to make the first An electrode pattern is in contact with the second electrode pattern, and the integrated touch device operates in a resistive touch position sensing mode, and the microprocessor calculates the touch according to a voltage change of the second electrode pattern. The control object is located at at least one operating position of the touch operation surface of the first substrate.

經由本發明所採用之技術手段,僅需搭配本發明之整合式觸控裝置與簡易之電路構造,配合簡易的掃描感測,即可兼具電容式及電阻式觸控板之觸控操作模式。故不需受限於習知電阻式觸控板或電容式觸控板之觸控物件限制,可使得使用者之觸控操作更為簡便,在不同之操作方式下較佳之觸控感應模式,並兼具兩種模式之觸控板之優點。According to the technical means adopted by the present invention, the integrated touch device of the present invention and the simple circuit structure can be matched with the simple scanning sensing, and the touch operation mode of the capacitive and resistive touch panels can be combined. . Therefore, there is no need to be limited by the touch object limitation of the conventional resistive touch panel or the capacitive touch panel, which makes the touch operation of the user easier, and the touch sensing mode is better in different operation modes. And the advantages of the two modes of the touchpad.

本發明之設計也特別適合應用在需要作筆寫輸入的觸控應用領域中,可有效解決一般電容式觸控板所存在之書寫操作不順暢、感應不良之問題。The design of the invention is also particularly suitable for application in the field of touch applications requiring writing input, and can effectively solve the problem that the writing operation of the general capacitive touch panel is not smooth and the sensing is poor.

本發明所採用的具體實施例,將藉由以下之實施例及附呈圖式作進一步之說明。The specific embodiments of the present invention will be further described by the following examples and the accompanying drawings.

參閱第1~2圖,其係顯示本發明第一實施例之系統方塊圖,第2圖係顯示第1圖中主要構件之立體分解圖。如圖所示,本發明之整合式觸控裝置100包括一第一基材1,其係為一絕緣薄層(film),例如PET薄膜,實施時可選用透明之材料。該第一基材1具有一第一電極結合面11及一觸控操作面12。第一基材1之第一電極結合面11形成有一第一電極圖型13,該第一電極圖型13包括有複數個條狀電極s11、s12、s13、s14、s15及s16,彼此之間互相平行且保持一分隔距離,並沿著第一軸向X延伸。第一電極圖型13主要為導電材料所組成,當該導電材料為ITO(氧化銦錫)時,可組成一層透明的導電層。1 to 2 are a block diagram showing a system according to a first embodiment of the present invention, and Fig. 2 is an exploded perspective view showing the main components in Fig. 1. As shown in the figure, the integrated touch device 100 of the present invention comprises a first substrate 1 which is an insulating film, such as a PET film, which may be made of a transparent material. The first substrate 1 has a first electrode bonding surface 11 and a touch operation surface 12 . The first electrode bonding surface 11 of the first substrate 1 is formed with a first electrode pattern 13, and the first electrode pattern 13 includes a plurality of strip electrodes s11, s12, s13, s14, s15 and s16 between Parallel to each other and maintaining a separation distance and extending along the first axial direction X. The first electrode pattern 13 is mainly composed of a conductive material, and when the conductive material is ITO (indium tin oxide), a transparent conductive layer can be formed.

各個條狀電極s11、s12、s13、s14、s15及s16係經由一第一掃描電路4連接至一微處理器3,以受到該微處理器3控制並供應各個條狀電極s11、s12、s13、s14、s15及s16一預定之驅動電壓,或經由第一掃描電路4掃描並感測各個條狀電極s11、s12、s13、s14、s15及s16之感應電容耦合變化,以將測得之掃描感測信號S1送往微處理器3進行處理。The strip electrodes s11, s12, s13, s14, s15 and s16 are connected to a microprocessor 3 via a first scanning circuit 4 to be controlled by the microprocessor 3 and supply respective strip electrodes s11, s12, s13 , s14, s15 and s16 a predetermined driving voltage, or scan and sense the sensing capacitance coupling change of each strip electrode s11, s12, s13, s14, s15 and s16 via the first scanning circuit 4, so as to scan the measured The sense signal S1 is sent to the microprocessor 3 for processing.

一第二基材2具有一相對應於該第一基材1之第一電極結合面11之第二電極結合面21,並與第一基材1之間之距離被定義為一預定間距d(如第4圖所示)。在第二基材2之第二電極結合面21上形成有一第二電極圖型22,該第二電極圖型22包括有複數個條狀電極s11’、s12’、s13’、s14’、s15’及s16’,彼此間互相平行且保持一分隔距離,並沿著第二軸向Y延伸。該第二基材2係相對應地對齊配置在第一基材1之相對位置,並使第二電極圖型22相對應於第一電極圖型13。A second substrate 2 has a second electrode bonding surface 21 corresponding to the first electrode bonding surface 11 of the first substrate 1, and a distance from the first substrate 1 is defined as a predetermined pitch d. (as shown in Figure 4). A second electrode pattern 22 is formed on the second electrode bonding surface 21 of the second substrate 2, and the second electrode pattern 22 includes a plurality of strip electrodes s11', s12', s13', s14', s15. 'and s16' are parallel to each other and maintain a separation distance and extend along the second axial direction Y. The second substrate 2 is correspondingly aligned with the first substrate 1 and the second electrode pattern 22 corresponds to the first electrode pattern 13.

各個條狀電極s11’、s12’、s13’、s14’、s15’及s16’經由一第二掃描電路5連接於微處理器3,以掃描感測各個條狀電極s11’、s12’、s13’、s14’、s15’及s16’之電壓變化,並將測得之掃描感測信號S2送往微處理器3進行處理。實施時,各個條狀電極s11’、s12’、s13’、s14’、s15’及s16’可單端或雙端連接於第二掃描電路5。The strip electrodes s11', s12', s13', s14', s15' and s16' are connected to the microprocessor 3 via a second scanning circuit 5 for scanning and sensing the strip electrodes s11', s12', s13 The voltage changes of ', s14', s15' and s16', and the measured scan sensing signal S2 is sent to the microprocessor 3 for processing. In practice, the respective strip electrodes s11', s12', s13', s14', s15' and s16' may be connected to the second scanning circuit 5 at one or both ends.

第一電極圖型13之各個條狀電極s11、s12、s13、s14、s15及s16係相互平行且彼此間隔地形成在第一基材1之第一電極結合面11。在第一電極圖型13與第二基材2之第二電極結合面21上未佈設條狀電極s11’、s12’、s13’、s14’、s15’及s16’之處,各別設置至少一絕緣隔點6。藉由各個絕緣隔點6,可避免第一電極圖型13與第二電極圖型22直接接觸。The respective strip electrodes s11, s12, s13, s14, s15, and s16 of the first electrode pattern 13 are formed in parallel with each other and spaced apart from each other on the first electrode joint surface 11 of the first substrate 1. Where the strip electrodes s11', s12', s13', s14', s15', and s16' are not disposed on the second electrode pattern 13 of the first electrode pattern 13 and the second substrate 2, respectively, at least An insulating spacer 6. By the respective insulating spacers 6, the direct contact between the first electrode pattern 13 and the second electrode pattern 22 can be avoided.

參閱第3圖,其係顯示第一基材1與第二基材2在結合後,第一電極圖型13及第二電極圖型22之相對位置關係。在本實施例中,第一電極圖型13及第二電極圖型22係以六個條狀電極為例,但條狀電極之數目不受此限制,亦可以佈設更多或較少條狀電極。本發明較佳實施例中,第一電極圖型13之各個條狀電極s11、s12、s13、s14、s15及s16係分別與第二電極圖型22之各個條狀電極s11’、s12’、s13’、s14’、s15’及s16’呈垂直交疊之對應關係。Referring to FIG. 3, the relative positional relationship between the first electrode pattern 13 and the second electrode pattern 22 after the first substrate 1 and the second substrate 2 are bonded is shown. In this embodiment, the first electrode pattern 13 and the second electrode pattern 22 are exemplified by six strip electrodes, but the number of strip electrodes is not limited thereto, and more or less strips may be disposed. electrode. In the preferred embodiment of the present invention, the strip electrodes s11, s12, s13, s14, s15, and s16 of the first electrode pattern 13 and the strip electrodes s11' and s12' of the second electrode pattern 22, respectively. S13', s14', s15' and s16' have a vertical overlap correspondence.

參閱第4圖所示,第一基材1與第二基材2之間設置有複數個絕緣隔點6,以使第一基材1與第二基材2結合後保持一預定間距d,以避免第一基材1之第一電極圖型13與第二基材2之第二電極圖型22直接接觸。Referring to FIG. 4 , a plurality of insulating spacers 6 are disposed between the first substrate 1 and the second substrate 2 to maintain a predetermined spacing d after the first substrate 1 and the second substrate 2 are combined. The first electrode pattern 13 of the first substrate 1 is prevented from coming into direct contact with the second electrode pattern 22 of the second substrate 2.

同時參閱第5圖及第6圖,第5圖係顯示本發明以手指操作之示意圖,第6圖係顯示第5圖中之觸控位置與對應之電容值表。如圖所示,本應用例用以說明本發明係用以感測一觸控物件7在整合式觸控裝置100上之觸控操作動作。Referring to FIG. 5 and FIG. 6 simultaneously, FIG. 5 is a schematic diagram showing the finger operation of the present invention, and FIG. 6 is a table showing the touch position and the corresponding capacitance value table in FIG. As shown in the figure, the present application is used to describe the touch operation of a touch object 7 on the integrated touch device 100.

首先在本應用例中將第一電極圖型13之條狀電極s13與第二電極圖型22之條狀電極s12’交疊之操作位置定義為操作位置P1。本應用例中用以操作整合式觸控裝置100之觸控物件7係可為例如手指、導電物或其它操作物件。First, in this application example, the operation position at which the strip electrode s13 of the first electrode pattern 13 and the strip electrode s12' of the second electrode pattern 22 overlap is defined as the operation position P1. The touch object 7 used to operate the integrated touch device 100 in this application example may be, for example, a finger, a conductive object, or other operating object.

當以觸控物件7輕觸至第一基材1之觸控操作面12之一受觸壓位置,但第一電極圖型13與第二電極圖型22之間並未接觸時(如第5圖所示之操作位置P1),此時整合式觸控裝置100會操作於電容式觸控位置感測模式,觸控物件7與第一電極圖型13之條狀電極s13之間由於電容耦合效應而感應一電容值C1(如第6圖所示)。第一掃描電路4藉由掃描感測第一基材1之各個條狀電極s11、s12、s13、s14、s15及s16而可感測觸控物件7與第一電極圖型13之條狀電極s13間之電容耦合變化,並送出第一感應信號S1至微處理器3。When the touch object 7 touches one of the touch operation surfaces 12 of the first substrate 1 to be touched, but the first electrode pattern 13 and the second electrode pattern 22 are not in contact with each other (eg, In the operation position P1) shown in FIG. 5, the integrated touch device 100 operates in the capacitive touch position sensing mode, and the capacitance between the touch object 7 and the strip electrode s13 of the first electrode pattern 13 is due to the capacitance. The coupling effect induces a capacitance value C1 (as shown in Figure 6). The first scanning circuit 4 can sense the strip electrodes of the touch object 7 and the first electrode pattern 13 by scanning and sensing the strip electrodes s11, s12, s13, s14, s15 and s16 of the first substrate 1 The capacitive coupling between s13 changes, and the first sensing signal S1 is sent to the microprocessor 3.

第7圖係顯示本發明第一實施例以觸控物件操作之示意圖。如圖所示,本實施例中之觸控物件7a係可為導電或非導電觸控物件(例如觸控筆或其它任何物件)。當觸控物件7a觸壓第一基材1之觸控操作面12時,位在操作位置處之第一基材1因受壓而使第一電極圖型13之條狀電極s13與第二電極圖型22之條狀電極s13’接觸(預定間距d=0)。此時,整合式觸控裝置100會操作於電阻式觸控位置感測模式,並施加一驅動電壓至條狀電極s13’,整合式觸控裝置100可依據第二電極圖型22之條狀電極s13’之電壓變化,計算出觸控物件7a位在第一基材1之觸控操作面12之操作位置。Figure 7 is a schematic view showing the operation of the touch object in the first embodiment of the present invention. As shown, the touch object 7a in this embodiment can be a conductive or non-conductive touch object (such as a stylus or any other object). When the touch object 7a touches the touch operation surface 12 of the first substrate 1, the strip substrate s13 and the second electrode pattern 13 of the first electrode pattern 13 are pressed by the first substrate 1 at the operation position. The strip electrodes s13' of the electrode pattern 22 are in contact (predetermined pitch d = 0). At this time, the integrated touch device 100 operates in the resistive touch position sensing mode and applies a driving voltage to the strip electrode s13 ′. The integrated touch device 100 can be in accordance with the strip of the second electrode pattern 22 . The voltage of the electrode s13' changes to calculate the operating position of the touch object 7a at the touch operation surface 12 of the first substrate 1.

參閱第8圖,其係顯示第二實施例之系統方塊圖。如圖所示,本實施例之主要元件與第一實施例相同,相同元件以相同之圖號標示。其主要不同之處在於本實施例之第一基材1a具有一第一電極結合面11a,在該第一電極結合面11a上結合有一第一電極圖型13a,其係為一平面連續結構之ITO透明導電層,在第一電極圖型13a之四個角落分別連接於第一掃描電路4,以分別提供一驅動電壓進而在第一電極圖型13a形成一電壓梯度。Referring to Figure 8, there is shown a block diagram of the system of the second embodiment. As shown in the figure, the main components of the present embodiment are the same as those of the first embodiment, and the same components are denoted by the same reference numerals. The main difference is that the first substrate 1a of the embodiment has a first electrode bonding surface 11a, and a first electrode pattern 13a is bonded to the first electrode bonding surface 11a, which is a planar continuous structure. The ITO transparent conductive layers are respectively connected to the first scanning circuit 4 at four corners of the first electrode pattern 13a to respectively provide a driving voltage to form a voltage gradient in the first electrode pattern 13a.

參閱第9圖及第10圖,其係顯示第二實施例之整合式觸控裝置100a上觸壓操作之電路示意圖及其等效電路圖。如第9圖所示,當在整合式觸控裝置100a上按壓一操作位置P2時,操作位置P2與各角落端分別產生一對應之電阻值R1、R2、R3及R4。如第9圖所示,由提供之驅動電壓Vs1、Vs2、Vs3、Vs4以及各個對應之電阻值R1、R2、R3及R4,分別可產生一對應之電流I1、I2、I3及I4,依據各電流I1、I2、I3及I4之比例即可計算出操作位置P2在該觸控板100a之所在位置。Referring to FIG. 9 and FIG. 10, it is a circuit diagram showing an operation of a touch operation on the integrated touch device 100a of the second embodiment and an equivalent circuit diagram thereof. As shown in FIG. 9, when an operation position P2 is pressed on the integrated touch device 100a, the operation position P2 and the corner ends respectively generate a corresponding resistance value R1, R2, R3, and R4. As shown in FIG. 9, a corresponding current I1, I2, I3, and I4 can be generated from the supplied driving voltages Vs1, Vs2, Vs3, and Vs4 and respective corresponding resistance values R1, R2, R3, and R4, respectively. The ratio of the currents I1, I2, I3, and I4 can calculate the position of the operating position P2 at the touch panel 100a.

參閱第11圖,其係顯示本發明第二實施例之整合式觸控裝置以觸控物件操作之示意圖。如圖所示,首先將本應用例中第一電極圖型13a與第二電極圖型22之條狀電極s13’交疊之位置定義為操作位置P3。而本應用例中用以操作整合式觸控裝置100a之觸控物件7a係可為導電或非導電觸控物件(例如觸控筆或其它任何物件)。Referring to FIG. 11 , it is a schematic diagram showing the operation of the touch object according to the second embodiment of the present invention. As shown in the figure, the position where the first electrode pattern 13a and the strip electrode s13' of the second electrode pattern 22 overlap in this application example is first defined as the operation position P3. The touch object 7a for operating the integrated touch device 100a in this application example can be a conductive or non-conductive touch object (such as a stylus or any other object).

同時參閱第8圖。當使用者以觸控物件7a以一預定觸壓方向I觸壓第一基材1a,位在操作位置p3處之第一基材1因受壓而使第一電極圖型13a與第二電極圖型22之條狀電極s13’接觸(預定間距d=0),此時整合式觸控裝置100a會操作於電阻式觸控位置感測模式,經由第一掃描電路4送出驅動電壓至第一電極圖型13之條狀電極,故驅動電壓由第一電極圖型13a施加至第二電極圖型22之條狀電極s13’上,並經由第二掃描電路5掃描感測後,輸出一掃描感測信號S2送至微處理器3。微處理器3依據第二電極圖型22之條狀電極s13’產生之電壓變化,計算出觸控物件7a位在第一基材1a之觸控位置。See also Figure 8. When the user touches the first substrate 1a with the touch object 7a in a predetermined contact direction I, the first substrate 1 at the operation position p3 is pressed to make the first electrode pattern 13a and the second electrode The strip electrode s13' of the pattern 22 is in contact (predetermined pitch d=0). At this time, the integrated touch device 100a operates in the resistive touch position sensing mode, and sends the driving voltage to the first through the first scanning circuit 4. The strip electrode of the electrode pattern 13 is applied to the strip electrode s13' of the second electrode pattern 22 by the first electrode pattern 13a, and after scanning and sensing via the second scanning circuit 5, a scan is output. The sensing signal S2 is sent to the microprocessor 3. The microprocessor 3 calculates the touch position of the touch object 7a on the first substrate 1a according to the voltage change generated by the strip electrode s13' of the second electrode pattern 22.

由以上之實施例可知,本發明所提供之整合式觸控裝置確具產業上之利用價值,故本發明業已符合於專利之要件。惟以上之敘述僅為本發明之較佳實施例說明,凡精於此項技藝者當可依據上述之說明而作其它種種之改良,惟這些改變仍屬於本發明之發明精神及以下所界定之專利範圍中。It can be seen from the above embodiments that the integrated touch device provided by the present invention has industrial utilization value, and thus the present invention has met the requirements of the patent. The above description is only for the preferred embodiment of the present invention, and those skilled in the art can make other various improvements according to the above description, but these changes still belong to the inventive spirit of the present invention and the following definitions. In the scope of patents.

100、100a...整合式觸控裝置100, 100a. . . Integrated touch device

1、1a...第一基材1, 1a. . . First substrate

11、11a...第一電極結合面11, 11a. . . First electrode junction

12、12a...觸控操作面12, 12a. . . Touch operation surface

13、13a...第一電極圖型13, 13a. . . First electrode pattern

2...第二基材2. . . Second substrate

21...第二電極結合面twenty one. . . Second electrode bonding surface

22...第二電極圖型twenty two. . . Second electrode pattern

3...微處理器3. . . microprocessor

4...第一掃描電路4. . . First scanning circuit

5...第二掃描電路5. . . Second scanning circuit

6...絕緣隔點6. . . Insulating spacer

7、7a...觸控物件7, 7a. . . Touch object

C1...電容值C1. . . Capacitance value

d...預定間距d. . . Predetermined spacing

P1、P2、P3...操作位置P1, P2, P3. . . Operating position

R1、R2、R3、R4...電阻值R1, R2, R3, R4. . . resistance

S1、S2...掃描感測信號S1, S2. . . Scanning sensing signal

V...驅動電壓V. . . Driving voltage

Vs1、Vs2、Vs3、Vs4...驅動電壓Vs1, Vs2, Vs3, Vs4. . . Driving voltage

s11、s12、s13、s14、s15、s16...條狀電極S11, s12, s13, s14, s15, s16. . . Strip electrode

s11’、s12’、s13’、s14’、s15’、s16’...條狀電極S11', s12', s13', s14', s15', s16'. . . Strip electrode

X...第一軸向X. . . First axial direction

Y...第二軸向Y. . . Second axial direction

I...觸壓方向I. . . Contact direction

第1圖係顯示本發明第一實施例之系統方塊圖;Figure 1 is a block diagram showing the system of the first embodiment of the present invention;

第2圖係顯示第1圖中主要構件之立體分解圖;Figure 2 is an exploded perspective view showing the main components of Figure 1;

第3圖係顯示第1圖中第一基材與第二基材在結合後,第一電極圖型及第二電極圖型之相對位置關係;3 is a view showing the relative positional relationship between the first electrode pattern and the second electrode pattern after the first substrate and the second substrate are bonded in FIG. 1;

第4圖係顯示第3圖之4-4斷面之剖視圖;Figure 4 is a cross-sectional view showing the section 4-4 of Figure 3;

第5圖係顯示本發明之整合式觸控裝置以手指操作之示意圖;Figure 5 is a schematic view showing the operation of the integrated touch device of the present invention with a finger;

第6圖係顯示第5圖中之觸控位置與對應之電容值表;Figure 6 shows the touch position and the corresponding capacitance value table in Figure 5;

第7圖係顯示本發明第一實施例以觸控物件操作之示意圖;Figure 7 is a schematic view showing the operation of the touch object in the first embodiment of the present invention;

第8圖係顯示第二實施例之系統方塊圖;Figure 8 is a block diagram showing the system of the second embodiment;

第9圖係顯示第二實施例之整合式觸控裝置上觸壓操作之電路示意圖;9 is a circuit diagram showing a touch operation on the integrated touch device of the second embodiment;

第10圖係顯示第9圖之等效電路圖;Figure 10 is an equivalent circuit diagram showing Figure 9;

第11圖係顯示本發明第二實施例之整合式觸控裝置以觸控物件操作之示意圖。11 is a schematic view showing the operation of the integrated touch device of the second embodiment of the present invention with a touch object.

100...整合式觸控裝置100. . . Integrated touch device

1...第一基材1. . . First substrate

11...第一電極結合面11. . . First electrode junction

13...第一電極圖型13. . . First electrode pattern

2...第二基材2. . . Second substrate

21...第二電極結合面twenty one. . . Second electrode bonding surface

22...第二電極圖型twenty two. . . Second electrode pattern

3...微處理器3. . . microprocessor

4...第一掃描電路4. . . First scanning circuit

5...第二掃描電路5. . . Second scanning circuit

S1...掃描感測信號S1. . . Scanning sensing signal

S2...掃描感測信號S2. . . Scanning sensing signal

s11、s12、s13、s14、s15、s16、s11’、s12’、s13’、s14’、s15’、s16’...條狀電極S11, s12, s13, s14, s15, s16, s11', s12', s13', s14', s15', s16'. . . Strip electrode

X...第一軸向X. . . First axial direction

Y...第二軸向Y. . . Second axial direction

Claims (7)

一種整合式觸控裝置,用以感測一觸控物件在該整合式觸控裝置上之觸控操作動作,該整合式觸控裝置包括:一第一基材,該第一基材具有一第一電極結合面及一觸控操作面;一第一電極圖型,形成在該第一基材之第一電極結合面;一第二基材,相對應地對齊配置在該第一基材之相對位置,該第二基材具有一相對應於該第一基材之第一電極結合面之第二電極結合面,該第一基材與第二基材之間保持一預定間距;一第二電極圖型,形成在該第二基材之第二電極結合面,並相對應於該第一電極圖型;一微處理器,電連接至該第一電極圖型與該第二電極圖型;當該觸控物件輕觸該第一基材之觸控操作面時,該整合式觸控裝置操作於電容式觸控位置感測模式,該觸控物件與該第一電極圖型之間之電容耦合變化由該微處理器接收,據以計算出該觸控物件位在該第一基材之觸控操作面之至少一操作位置;當該觸控物件觸壓或以筆寫輸入操作該第一基材之觸控操作面時,位在該操作位置處之第一基材因受壓,使該第一電極圖型與該第二電極圖型接觸,該整合式觸控裝置操作於電阻式觸控位置感測模式,該微處理器即依據該第二電極圖型之電壓變化,計算出該觸控物件位在該第一基材之觸控操作面之至少一操作位置。An integrated touch device for sensing a touch operation operation of a touch object on the integrated touch device, the integrated touch device comprising: a first substrate, the first substrate having a a first electrode bonding surface and a touch operation surface; a first electrode pattern formed on the first electrode bonding surface of the first substrate; and a second substrate disposed correspondingly on the first substrate The second substrate has a second electrode bonding surface corresponding to the first electrode bonding surface of the first substrate, and the first substrate and the second substrate are maintained at a predetermined interval; a second electrode pattern formed on the second electrode bonding surface of the second substrate and corresponding to the first electrode pattern; a microprocessor electrically connected to the first electrode pattern and the second electrode When the touch object touches the touch operation surface of the first substrate, the integrated touch device operates in a capacitive touch position sensing mode, and the touch object and the first electrode pattern The capacitive coupling change between the receivers is received by the microprocessor, and the touch object is calculated At least one operation position of the touch operation surface of the first substrate; when the touch object touches or touches the touch operation surface of the first substrate, the first base located at the operation position The first electrode pattern is in contact with the second electrode pattern, and the integrated touch device operates in a resistive touch position sensing mode, and the microprocessor is based on the second electrode pattern The voltage is changed to calculate that the touch object is located at at least one operation position of the touch operation surface of the first substrate. 如申請專利範圍第1項所述之整合式觸控裝置,其中該第一電極圖型與該第二電極圖型分別包括有複數個相互平行且彼此間隔之條狀電極。The integrated touch device of claim 1, wherein the first electrode pattern and the second electrode pattern respectively comprise a plurality of strip electrodes parallel to each other and spaced apart from each other. 如申請專利範圍第2項所述之整合式觸控裝置,其中該第一電極圖型之各個條狀電極分別經由一第一掃描電路連接至該微處理器,該第二電極圖型之各個條狀電極分別經由一第二掃描電路連接至該微處理器。The integrated touch device of claim 2, wherein each strip electrode of the first electrode pattern is respectively connected to the microprocessor via a first scan circuit, and each of the second electrode patterns The strip electrodes are respectively connected to the microprocessor via a second scanning circuit. 如申請專利範圍第2項所述之整合式觸控裝置,其中該第一電極圖型與該第二電極圖型之間係以複數個絕緣隔點予以隔開。The integrated touch device of claim 2, wherein the first electrode pattern and the second electrode pattern are separated by a plurality of insulating spacers. 如申請專利範圍第1項所述之整合式觸控裝置,其中該第一電極圖型係為一平面連續結構,而該第二電極圖型係包括有複數個相互平行且彼此間隔之條狀電極。The integrated touch device of claim 1, wherein the first electrode pattern is a planar continuous structure, and the second electrode pattern comprises a plurality of strips that are parallel to each other and spaced apart from each other. electrode. 如申請專利範圍第5項所述之整合式觸控裝置,其中該第一電極圖型經由一第一掃描電路連接至該微處理器,該第二電極圖型之各個條狀電極分別經由一第二掃描電路連接至該徹處理器。The integrated touch device of claim 5, wherein the first electrode pattern is connected to the microprocessor via a first scanning circuit, and each strip electrode of the second electrode pattern is respectively A second scan circuit is coupled to the processor. 如申請專利範圍第5項所述之整合式觸控裝置,其中該第一電極圖型與該第二電極圖型之間係以複數個絕緣隔點予以隔開。The integrated touch device of claim 5, wherein the first electrode pattern and the second electrode pattern are separated by a plurality of insulating spacers.
TW98106787A 2009-03-03 2009-03-03 Touch device integrated with capacitive and resistive sensing operation TWI402734B (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6943705B1 (en) * 2002-05-03 2005-09-13 Synaptics, Inc. Method and apparatus for providing an integrated membrane switch and capacitive sensor
TWM321553U (en) * 2007-02-16 2007-11-01 Young Fast Optoelectronics Co Touch control panel with dual sensing interfaces
US7379054B2 (en) * 2002-07-18 2008-05-27 Gigno Technology Co., Ltd. LCD and touch-control method thereof
TWM335736U (en) * 2007-11-02 2008-07-01 Young Fast Optoelectronics Co Improved structure of duplexing touch panel

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6943705B1 (en) * 2002-05-03 2005-09-13 Synaptics, Inc. Method and apparatus for providing an integrated membrane switch and capacitive sensor
US7379054B2 (en) * 2002-07-18 2008-05-27 Gigno Technology Co., Ltd. LCD and touch-control method thereof
TWM321553U (en) * 2007-02-16 2007-11-01 Young Fast Optoelectronics Co Touch control panel with dual sensing interfaces
TWM335736U (en) * 2007-11-02 2008-07-01 Young Fast Optoelectronics Co Improved structure of duplexing touch panel

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