TWI402461B

TWI402461B - Led lamp

Info

Publication number: TWI402461B
Application number: TW99121761A
Authority: TW
Inventors: Shao Han Chang
Original assignee: Hon Hai Prec Ind Co Ltd
Priority date: 2010-07-02
Filing date: 2010-07-02
Publication date: 2013-07-21
Also published as: TW201202608A

Description

LED照明燈具 LED lighting

本發明涉及一種LED照明燈具，特別涉及一種具有散熱結構的LED照明燈具。 The invention relates to an LED lighting fixture, in particular to an LED lighting fixture with a heat dissipation structure.

和傳統光源相比，發光二極體(LED)具有較高之發光效率(光源溫度較一般燈泡低)、低輻射、低耗電、壽命長、低電壓、啟動快速、環保、抗震抗壓、燈具可小型化等優點，以LED作為光源的照明裝置目前被廣泛應用於各種照明，如室內照明、室外照明、可攜式照明(如手電筒)、情境照明等應用中。LED在工作時會產生熱量，帶有這些熱量的空氣與周圍環境中的空氣之間的流通進行散熱，但此散熱方式效果有限，特別在LED長時間工作後，僅用此種散熱方式不能使產生的熱量及時疏散，使LED溫度升高，嚴重影響LED的發光效率及LED燈具的使用壽命。 Compared with traditional light sources, light-emitting diodes (LEDs) have higher luminous efficiency (light source temperature is lower than general bulbs), low radiation, low power consumption, long life, low voltage, fast start-up, environmental protection, anti-seismic compression, Lighting fixtures can be miniaturized. Lighting devices using LEDs as light sources are currently used in a variety of lighting applications, such as indoor lighting, outdoor lighting, portable lighting (such as flashlights), and ambient lighting. The LED generates heat during operation, and the heat between the air with the heat and the air in the surrounding environment dissipates heat, but the heat dissipation method has limited effect, especially after the LED is used for a long time, the heat dissipation method alone cannot be used. The generated heat is evacuated in time, which causes the LED temperature to rise, which seriously affects the luminous efficiency of the LED and the service life of the LED lamp.

為了解決LED燈具的散熱問題，現有技術中多採用在燈具殼體上增設散熱鰭片，此種方式雖然有效的增加了散熱面積，但是會增加LED燈具的體積和重量，另外過小的鰭片間距會引起灰塵雜質等在鰭片間隙內沉積，導致散熱能力降低。 In order to solve the problem of heat dissipation of LED lamps, in the prior art, heat-dissipating fins are added to the lamp housing. Although this method effectively increases the heat dissipation area, it increases the volume and weight of the LED lamps, and the fin spacing is too small. It can cause dust impurities and the like to deposit in the fin gap, resulting in a decrease in heat dissipation capability.

有鑒於此，本發明提供一種輕便且散熱良好的LED照明燈具。 In view of this, the present invention provides an LED lighting fixture that is lightweight and has good heat dissipation.

一種LED照明燈具，包括散熱殼體、LED基板、固定於散熱殼體上的燈罩以及電源連接器，所述LED照明燈具還包括一散熱底盤，所述LED基板固定在該散熱底盤上，所述LED基板產生的熱量傳導至該散熱底盤上；所述散熱殼體為兩端開口的空心殼體，散熱殼體一端與電源連接器連接，另一端與散熱底盤相固定；所述散熱殼體表面設置有凹陷部，該凹陷部的內頂面與散熱底盤底面接觸，該散熱底盤上的熱量通過凹陷部的內頂面傳導至散熱殼體上散發。 An LED lighting fixture includes a heat dissipation housing, an LED substrate, a lamp cover fixed to the heat dissipation housing, and a power connector, the LED lighting fixture further comprising a heat dissipation chassis, wherein the LED substrate is fixed On the heat dissipation chassis, the heat generated by the LED substrate is conducted to the heat dissipation chassis; the heat dissipation housing is a hollow housing that is open at both ends, and one end of the heat dissipation housing is connected to the power connector, and the other end is fixed to the heat dissipation chassis. The surface of the heat dissipation housing is provided with a recessed portion, and an inner top surface of the recessed portion is in contact with a bottom surface of the heat dissipation chassis, and heat on the heat dissipation chassis is conducted to the heat dissipation housing through the inner top surface of the recess portion.

本發明的LED照明燈具採用具有散熱性能的散熱殼體作為燈具外殼，通過在散熱殼體上設置凹陷部，使凹陷部的內頂面與散熱底盤的底面接觸，作為散熱底盤的熱接觸表面，增大了散熱底盤與散射殼體之間的接觸面積，加快散熱速度。 The LED lighting fixture of the invention adopts a heat dissipating housing having heat dissipation performance as a lamp housing, and the inner top surface of the recessed portion is in contact with the bottom surface of the heat dissipation chassis by providing a recessed portion on the heat dissipating housing, as a thermal contact surface of the heat dissipating chassis, The contact area between the heat dissipation chassis and the scattering shell is increased, and the heat dissipation speed is accelerated.

100‧‧‧LED照明燈具 100‧‧‧LED lighting

10‧‧‧燈罩 10‧‧‧shade

11‧‧‧外螺紋 11‧‧‧ external thread

20‧‧‧散熱殼體 20‧‧‧Solid housing

21‧‧‧第一端部 21‧‧‧ first end

22‧‧‧第二端部 22‧‧‧ second end

211‧‧‧內螺紋 211‧‧‧ internal thread

23‧‧‧凹陷部 23‧‧‧Depression

231‧‧‧內頂面 231‧‧‧ inside top

30‧‧‧電源連接器 30‧‧‧Power connector

40‧‧‧LED基板 40‧‧‧LED substrate

41‧‧‧發光二極體 41‧‧‧Lighting diode

50‧‧‧散熱底盤 50‧‧‧ Thermal chassis

51‧‧‧外螺紋 51‧‧‧ external thread

52‧‧‧凹部 52‧‧‧ recess

53‧‧‧通孔 53‧‧‧through hole

60‧‧‧石墨散熱片 60‧‧‧ graphite heat sink

70‧‧‧絕緣體 70‧‧‧Insulator

71‧‧‧穿孔 71‧‧‧Perforation

圖1係本發明中LED照明燈具的立體圖。 1 is a perspective view of an LED lighting fixture of the present invention.

圖2係本發明中LED照明燈具的***圖。 Figure 2 is an exploded view of the LED lighting fixture of the present invention.

圖3係本發明中LED照明燈具的縱向剖視圖。 Figure 3 is a longitudinal cross-sectional view of an LED lighting fixture of the present invention.

圖4係圖1中LED照明燈具的散熱殼體的示意圖。 4 is a schematic view of a heat dissipation housing of the LED lighting fixture of FIG. 1.

請參閱圖1，LED照明燈具100包括燈罩10、散熱殼體20、電源連接器30和驅動裝置(圖中未示出)。散熱殼體20為兩端開口的空心殼體，採用導熱性佳的散熱材料製成，如鋁合金等。燈罩10與電源連接器30分別固定在散熱殼體20的兩端。電源連接器30用來與電源相連接，電源連接器30為通用的電源介面，如螺口電源連接器或者卡口電源連接器等。 Referring to FIG. 1, the LED lighting fixture 100 includes a lampshade 10, a heat dissipation housing 20, a power connector 30, and a driving device (not shown). The heat dissipation housing 20 is a hollow housing that is open at both ends, and is made of a heat dissipation material with good thermal conductivity, such as an aluminum alloy. The lamp cover 10 and the power connector 30 are respectively fixed to both ends of the heat dissipation housing 20. The power connector 30 is used to connect to a power source, and the power connector 30 is a universal power interface such as a screw power connector or a bayonet power connector.

請參閱圖2和圖3，LED照明燈具100還包括LED基板40、散熱底盤50、石墨散熱片60和絕緣體70。所述LED基板40上安裝有多個發光二極體41。驅動裝置(圖中未示出)設置於散熱殼體20的內部，並與電源連接器30和LED 基板40電連接，所述驅動裝置通過電源連接器30從外接獲取電能以驅動發光二極體41發光。在本實施例中，散熱底盤50為圓盤狀，採用導熱性較好的鋁基材製成，在其他實施方式中也可以採用導熱陶瓷製造，形狀可以選擇方形、條形等其他形狀。散熱底盤50週邊側壁設置有外螺紋51，散熱底盤50上表面形成有一凹部52，所述LED基板40固定在凹部52內。散熱底盤50上設置有至少一通孔53，用於供驅動裝置與LED基板40之間的導線穿過。石墨散熱片60為設置於LED基板40與散熱底盤50上表面之間的導熱介質，用於將LED基板40工作時散發的熱量均勻地傳導至散熱底盤50。在其他即時方式中，LED基板40與散熱底盤50上表面之間的導熱介質也可採用其他材質做成的散熱片，如導熱膠帶、陶瓷導熱板等。LED基板40與凹部52的側壁之間的間隙內填充有導熱膠或其他導熱介質，用於加強將LED基板40工作時散發的熱量傳導至散熱底盤50的週邊側壁。 Referring to FIGS. 2 and 3 , the LED lighting fixture 100 further includes an LED substrate 40 , a heat dissipation chassis 50 , a graphite heat sink 60 , and an insulator 70 . A plurality of light emitting diodes 41 are mounted on the LED substrate 40. A driving device (not shown) is disposed inside the heat dissipation housing 20 and is connected to the power connector 30 and the LED The substrate 40 is electrically connected, and the driving device obtains electric energy from the external connection through the power connector 30 to drive the light emitting diode 41 to emit light. In the present embodiment, the heat dissipation chassis 50 is formed in a disk shape and is made of an aluminum substrate having a good thermal conductivity. In other embodiments, it may be made of a thermally conductive ceramic, and the shape may be selected from other shapes such as a square shape and a strip shape. The peripheral wall of the heat dissipation chassis 50 is provided with an external thread 51. The upper surface of the heat dissipation chassis 50 is formed with a recess 52, and the LED substrate 40 is fixed in the recess 52. The heat dissipation chassis 50 is provided with at least one through hole 53 for the passage of a wire between the driving device and the LED substrate 40. The graphite heat sink 60 is a heat conductive medium disposed between the LED substrate 40 and the upper surface of the heat dissipation chassis 50 for uniformly transferring heat radiated from the LED substrate 40 to the heat dissipation chassis 50. In other instant modes, the heat conducting medium between the LED substrate 40 and the upper surface of the heat dissipation chassis 50 may also be a heat sink made of other materials, such as a thermal conductive tape or a ceramic heat conducting plate. The gap between the LED substrate 40 and the sidewall of the recess 52 is filled with a thermal conductive paste or other heat conductive medium for enhancing the conduction of heat radiated from the operation of the LED substrate 40 to the peripheral side wall of the heat dissipation chassis 50.

請一併參考圖4，散熱殼體20包括相對設置的第一端部21與第二端部22，散熱殼體20在第一端部21的內表面設置有內螺紋211，散熱底盤50通過外螺紋51與第一端部21內表面的內螺紋211的螺合，固定在散熱殼體20的第一端部21。散熱底盤50與散熱殼體20通過螺紋的方式固定，可以進一步增大散熱底盤50與散熱殼體20之間的接觸面積，加快散熱速度。在外螺紋51與內螺紋211之間還可以填充導熱膠或者其他導熱介質，進一步改善間隙間的空氣熱阻。燈罩10側壁設置有外螺紋11，燈罩10亦通過螺紋鎖附的方式與內螺紋211螺合，固定在散熱殼體20的第一端部21。散熱殼體20的第二端部22與電源連接器30之間還設置有一絕緣體70，絕緣體70的一端固定於電源連接器30，另一端固定於散熱殼體20的第二端部22上。所述絕緣體上有穿孔71，用於供驅動裝置與電源連接器30之間的導線通過。 Referring to FIG. 4 together, the heat dissipation housing 20 includes a first end portion 21 and a second end portion 22 disposed opposite to each other. The heat dissipation housing 20 is provided with an internal thread 211 on the inner surface of the first end portion 21, and the heat dissipation chassis 50 passes through The external thread 51 is screwed to the internal thread 211 of the inner surface of the first end portion 21 and fixed to the first end portion 21 of the heat dissipation housing 20. The heat dissipation chassis 50 and the heat dissipation housing 20 are fixed by screws, so that the contact area between the heat dissipation chassis 50 and the heat dissipation housing 20 can be further increased, and the heat dissipation speed can be accelerated. A thermal conductive adhesive or other heat conductive medium may be filled between the external thread 51 and the internal thread 211 to further improve the air thermal resistance between the gaps. The side wall of the lamp cover 10 is provided with an external thread 11 , and the lamp cover 10 is also screwed to the internal thread 211 by screwing and fixed to the first end portion 21 of the heat dissipation housing 20 . An insulator 70 is further disposed between the second end portion 22 of the heat dissipation housing 20 and the power connector 30. One end of the insulator 70 is fixed to the power connector 30, and the other end is fixed to the second end portion 22 of the heat dissipation housing 20. The insulator has perforations 71 for the passage of wires between the drive unit and the power connector 30.

散熱殼體20的表面設置有凹陷部23，優選的，凹陷部23設置在靠近第一端部21處。所述凹陷部23的內頂面231與散熱底盤50的底面接觸，並支撐散熱底盤50。凹陷部23的內頂面231既作為散熱底盤50的熱接觸表面，增大散熱底盤50與散熱殼體20之間的接觸面積，加快散熱速度。在內頂面231與散熱底盤50底面之間也可以填充導熱膠或者其他導熱介質，進一步改善間隙間的空氣熱阻。 The surface of the heat dissipation housing 20 is provided with a recess 23, and preferably, the recess 23 is disposed near the first end Department 21. The inner top surface 231 of the recess 23 contacts the bottom surface of the heat dissipation chassis 50 and supports the heat dissipation chassis 50. The inner top surface 231 of the recessed portion 23 serves as a heat contact surface of the heat dissipation chassis 50, increasing the contact area between the heat dissipation chassis 50 and the heat dissipation housing 20, and accelerating the heat dissipation speed. A thermal conductive adhesive or other heat conductive medium may also be filled between the inner top surface 231 and the bottom surface of the heat dissipation chassis 50 to further improve the air thermal resistance between the gaps.

本技術領域的普通技術人員應當認識到，以上的實施方式僅是用來說明本發明，而並非用作為對本發明的限定，只要在本發明的實質精神範圍之內，對以上實施例所作的適當改變和變化都落在本發明要求保護的範圍之內。 It is to be understood by those skilled in the art that the above embodiments are only intended to illustrate the invention, and are not intended to limit the invention, as long as it is within the spirit of the invention Changes and modifications are intended to fall within the scope of the invention.

100‧‧‧LED照明燈具 100‧‧‧LED lighting

10‧‧‧燈罩 10‧‧‧shade

20‧‧‧散熱殼體 20‧‧‧Solid housing

30‧‧‧電源連接器 30‧‧‧Power connector

Claims

一種LED照明燈具，包括散熱殼體、LED基板、固定於散熱殼體上的燈罩以及電源連接器，其改良在於，還包括週邊側壁設置有外螺紋之散熱底盤，所述LED基板固定在該散熱底盤上，所述LED基板產生的熱量傳導至該散熱底盤上；所述散熱殼體為兩端開口的空心殼體，散熱殼體一端與電源連接器連接，另一端之內表面設置有與該外螺紋螺接之內螺紋，以將該散熱殼體與散熱底盤連接；所述散熱殼體表面設置有凹陷部，該凹陷部的內頂面與散熱底盤底面接觸，該散熱底盤上的熱量通過凹陷部的內頂面傳導至散熱殼體上散發。 An LED lighting fixture comprising a heat dissipation housing, an LED substrate, a lamp cover fixed to the heat dissipation housing, and a power connector, wherein the improvement further comprises: a heat dissipation chassis provided with external threads on the peripheral side wall, wherein the LED substrate is fixed in the heat dissipation On the chassis, heat generated by the LED substrate is transmitted to the heat dissipation chassis; the heat dissipation housing is a hollow housing that is open at both ends, and one end of the heat dissipation housing is connected to the power connector, and the inner surface of the other end is provided with The external thread is screwed into the internal thread to connect the heat dissipation housing to the heat dissipation chassis; the heat dissipation housing surface is provided with a recessed portion, and the inner top surface of the recess portion is in contact with the bottom surface of the heat dissipation chassis, and the heat on the heat dissipation chassis passes through The inner top surface of the recess is conducted to the heat dissipation housing for dissipation.

如申請專利範圍第1項所述之LED照明燈具，其中，散熱底盤上表面形成有一凹部，所述LED基板固定在該凹部內。 The LED lighting fixture of claim 1, wherein the upper surface of the heat dissipation chassis is formed with a recess, and the LED substrate is fixed in the recess.

如申請專利範圍第2項所述之LED照明燈具，其中，所述LED基板與凹部的側壁之間的間隙內填充有導熱介質。 The LED lighting fixture of claim 2, wherein the gap between the LED substrate and the sidewall of the recess is filled with a heat conductive medium.

如申請專利範圍第1項所述之LED照明燈具，其中，所述散熱底盤採用金屬材料或者陶瓷材料製造。 The LED lighting fixture of claim 1, wherein the heat dissipation chassis is made of a metal material or a ceramic material.

如申請專利範圍第1項所述之LED照明燈具，其中，所述LED基板與散熱底盤之間還設置有導熱介質。 The LED lighting fixture of claim 1, wherein a heat conducting medium is further disposed between the LED substrate and the heat dissipation chassis.

如申請專利範圍第5項所述之LED照明燈具，其中，所述導熱介質是石墨導熱片、導熱膠帶或者陶瓷導熱板中的一種。 The LED lighting fixture of claim 5, wherein the heat conductive medium is one of a graphite heat conductive sheet, a thermal conductive tape or a ceramic heat conducting plate.

如申請專利範圍第1項所述之LED照明燈具，其中，所述散熱殼體通過凹陷部的內頂面與散熱底盤的接觸支撐散熱底盤。 The LED lighting fixture of claim 1, wherein the heat dissipation housing supports the heat dissipation chassis by contacting the inner top surface of the recess with the heat dissipation chassis.