TWI400598B - Heat sink and method of manufacturing the same - Google Patents
Heat sink and method of manufacturing the same Download PDFInfo
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- TWI400598B TWI400598B TW97122108A TW97122108A TWI400598B TW I400598 B TWI400598 B TW I400598B TW 97122108 A TW97122108 A TW 97122108A TW 97122108 A TW97122108 A TW 97122108A TW I400598 B TWI400598 B TW I400598B
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- bottom plate
- heat
- mounting portion
- heat sink
- heat dissipating
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
本發明涉及一種散熱器及其製造方法，特別係指一種用於電子元件上之散熱器及其製造方法。 The present invention relates to a heat sink and a method of manufacturing the same, and more particularly to a heat sink for an electronic component and a method of manufacturing the same.
隨著資訊技術之飛速發展，電腦中央處理器之運算速度越來越快，其產生之熱量也越來越多，而過多之熱量若無法及時排出，將嚴重影響中央處理器運行時之穩定性。為此，業界通常在中央處理器頂面裝設一散熱器，利用散熱器來協助排出熱量，以確保中央處理器在適當溫度下正常工作。而隨著電子元件體積越來越小，其發熱也更加集中，散熱器之散熱性能也需要提升。 With the rapid development of information technology, the computing speed of computer central processing units is getting faster and faster, and the heat generated by them is increasing. If too much heat is not discharged in time, it will seriously affect the stability of the central processing unit. . To this end, the industry typically installs a heat sink on the top surface of the central processor that uses a heat sink to help dissipate heat to ensure that the central processor is operating at the proper temperature. As the electronic components become smaller and smaller, their heat generation is more concentrated, and the heat dissipation performance of the heat sink needs to be improved.
習知技術中散熱器往往採用一貼附於中央處理器上之基座以及複數焊接固定在基座上之散熱鰭片。由於焊接所使用之焊接材料會增加基座與散熱鰭片之間之熱傳阻抗，而影響散熱器整體性能。為克服該技術問題，習知技術中還採用模鍛之方式將散熱鰭片鑲嵌入基板之溝槽中。如圖6-7所示，一散熱器包括一基座3與複數散熱鰭片4。該基座之一表面上設有複數溝槽31以對應***散熱鰭片4。每一溝槽31內具有二直之側壁以接觸散熱鰭片4。每相鄰二溝槽31之間設有一狹縫 。當散熱鰭片4置入該基座3之溝槽31內時，複數擠壓模具之刀具41擠壓狹縫，使溝槽31之側壁產生塑性變形，向散熱鰭片4推擠，使得散熱鰭片4緊密鑲嵌於溝槽31內。 In the prior art, the heat sink often uses a pedestal attached to the central processing unit and a plurality of heat dissipating fins fixed to the pedestal. Since the solder material used for soldering increases the heat transfer impedance between the pedestal and the heat sink fins, it affects the overall performance of the heat sink. In order to overcome this technical problem, the conventional technique also uses a die forging method to insert the heat dissipation fins into the grooves of the substrate. As shown in FIG. 6-7, a heat sink includes a base 3 and a plurality of heat sink fins 4. A plurality of grooves 31 are formed on one surface of the base to correspondingly insert the heat dissipation fins 4. Each trench 31 has two straight sidewalls to contact the heat sink fins 4. a slit is provided between each adjacent two grooves 31 . When the heat dissipating fins 4 are placed in the grooves 31 of the susceptor 3, the knives 41 of the plurality of squeezing dies press the slits to plastically deform the side walls of the grooves 31, pushing the fins 4 to dissipate heat. The fins 4 are tightly embedded in the grooves 31.
但是，由於在溝槽31之側壁產生塑性變形之前散熱鰭片4與溝槽31之兩側壁是間隙配合，其位置不容易固定；並且由於刀具41自上而下對基座3衝壓，基座3靠近散熱鰭片4底部之部分變形量不足，使得溝槽31之側壁對散熱鰭片4容易松脫並產生空隙，減少了散熱鰭片4與基座3之接觸面積，降低了散熱器之導熱性能，影響整個散熱器之散熱效果。 However, since the heat dissipating fins 4 and the side walls of the grooves 31 are gap-fitted before the plastic deformation of the side walls of the grooves 31, the position thereof is not easily fixed; and since the cutter 41 punches the base 3 from the top to the bottom, the base 3 The amount of deformation near the bottom of the heat dissipating fin 4 is insufficient, so that the sidewall of the trench 31 is easy to loosen and form a gap for the heat dissipating fin 4, reducing the contact area between the heat dissipating fin 4 and the pedestal 3, and reducing the heat sink. Thermal conductivity affects the heat dissipation of the entire heat sink.
有鑒於此，有必要提供一種能夠防止熱管與基座組裝過程中產生溢錫之熱管及其製造方法。 In view of the above, it is necessary to provide a heat pipe capable of preventing the occurrence of overflow tin during the assembly of the heat pipe and the base and a method of manufacturing the same.
一種熱管，包括一吸熱段、放熱段以及連接吸熱段與放熱段之連接段，該吸熱段之外壁表面設有凹痕。與習知技術相比，本發明之熱管外壁具有凹痕，增加了熱管外壁之表面粗糙度，提升了熱管表面對錫膏之附著力，有效防止熱管與其他元件焊接過程中產生溢錫。 A heat pipe includes a heat absorption section, a heat release section, and a connection section connecting the heat absorption section and the heat release section, and the outer wall surface of the heat absorption section is provided with a dimple. Compared with the prior art, the outer wall of the heat pipe of the invention has a dimple, which increases the surface roughness of the outer wall of the heat pipe, improves the adhesion of the surface of the heat pipe to the solder paste, and effectively prevents the tin from being generated during the welding process of the heat pipe and other components.
一種熱管之製造方法，包括以下步驟：(1)提供一直熱管；(2)將該直熱管彎曲成U型狀熱管，使該熱管具有一吸熱段、一放熱段以及連接吸熱段、放熱段之連接段；(3)提供一內壁具有凸痕之模具，用該模具對彎曲後之熱 管之吸熱段進行整圓，使整圓後之吸熱段壓設有凹痕。 A method for manufacturing a heat pipe, comprising the steps of: (1) providing a heat pipe; (2) bending the heat pipe into a U-shaped heat pipe, wherein the heat pipe has a heat absorption section, a heat release section, and a heat absorption section and a heat release section. a connecting section; (3) providing a mold having a convex wall on the inner wall, and using the mold to heat the bending The endothermic section of the tube is rounded so that the endothermic section of the tube is pressed with a dent.
3‧‧‧基座 3‧‧‧Base
31‧‧‧溝槽 31‧‧‧ trench
4‧‧‧散熱鰭片 4‧‧‧Heat fins
41‧‧‧刀具 41‧‧‧Tools
10‧‧‧底板 10‧‧‧floor
13‧‧‧插孔 13‧‧‧ jack
20‧‧‧散熱體 20‧‧‧ Heat sink
22‧‧‧散熱部 22‧‧‧ Department of heat dissipation
24‧‧‧鉚合部 24‧‧‧ Riveting Department
26‧‧‧安裝部 26‧‧‧Installation Department
30‧‧‧刀具 30‧‧‧Tools
圖1係本發明散熱器之立體分解圖。 1 is an exploded perspective view of a heat sink of the present invention.
圖2係圖1散熱器之組裝圖。 Figure 2 is an assembled view of the heat sink of Figure 1.
圖3係圖2散熱器之III-III之截面圖，且刀具處於衝壓前之狀態。 Figure 3 is a cross-sectional view of the heat sink III-III of Figure 2 with the tool in a pre-punched state.
圖4係圖3刀具處於對散熱器衝壓中之狀態圖。 Figure 4 is a diagram showing the state of the tool of Figure 3 in the stamping of the heat sink.
圖5係圖3刀具處於對散熱器衝壓後之狀態圖。 Figure 5 is a diagram showing the state of the tool of Figure 3 after stamping the heat sink.
圖6係習知技術之散熱器模鍛前之正視圖。 Figure 6 is a front elevational view of a conventional heat sink prior to die forging.
圖7係習知技術之散熱器模鍛後之組裝圖。 Figure 7 is an assembled view of a conventional heat sink after swaging.
請參閱圖1與圖2，為本發明散熱器之較佳實施例。該散熱器包括一底板10與複數圓柱狀散熱體20。 Please refer to FIG. 1 and FIG. 2 for a preferred embodiment of the heat sink of the present invention. The heat sink includes a bottom plate 10 and a plurality of cylindrical heat sinks 20.
該底板10大致呈矩形狀設計，其底面為光滑平面以接觸電子元件之頂面以移除該電子元件之熱量。其上設置有複數均勻分佈之插孔13。每一插孔13為垂直貫穿於底板10之上下表面之圓形通孔，其具有相同之內徑。 The bottom plate 10 has a substantially rectangular design with a bottom surface that is smooth to contact the top surface of the electronic component to remove heat from the electronic component. A plurality of evenly distributed jacks 13 are disposed thereon. Each of the insertion holes 13 is a circular through hole penetrating vertically through the upper surface of the bottom plate 10, and has the same inner diameter.
每一散熱體20為一體成型，其整體呈圓柱狀，包括位於散熱體20一端較長之散熱部22、位於散熱體20另一端之較短之安裝部26以及連接散熱部22、安裝部26之鉚合部24。該散熱部22、鉚合部24及安裝部26為同軸之圓柱體。其中安裝部26之 外徑稍大於底板10之插孔13之內徑，以使安裝部26可以過盈配合地***底板10之插孔13中；散熱部22之外徑大於安裝部26之外徑，即大於插孔13之內徑；鉚合部24之外徑小於安裝部26之外徑。因此，散熱部22之外徑大於鉚合部24之外徑，使得散熱部22之底部形成一圓環面(圖未示)。安裝部26之底部為一光滑平面。安裝部26與鉚合部24總共之軸向長度與底板10之厚度相同。 Each of the heat dissipating bodies 20 is integrally formed and has a cylindrical shape as a whole, and includes a heat dissipating portion 22 at one end of the heat dissipating body 20, a short mounting portion 26 at the other end of the heat dissipating body 20, and a connecting heat dissipating portion 22 and a mounting portion 26 . Riveting portion 24. The heat radiating portion 22, the caulking portion 24, and the mounting portion 26 are coaxial cylinders. Wherein the mounting portion 26 The outer diameter is slightly larger than the inner diameter of the insertion hole 13 of the bottom plate 10, so that the mounting portion 26 can be inserted into the insertion hole 13 of the bottom plate 10 with an interference fit; the outer diameter of the heat dissipation portion 22 is larger than the outer diameter of the mounting portion 26, that is, greater than the insertion. The inner diameter of the hole 13; the outer diameter of the staking portion 24 is smaller than the outer diameter of the mounting portion 26. Therefore, the outer diameter of the heat dissipating portion 22 is larger than the outer diameter of the caulking portion 24, so that the bottom portion of the heat dissipating portion 22 forms a toroidal surface (not shown). The bottom of the mounting portion 26 is a smooth plane. The total axial length of the mounting portion 26 and the staking portion 24 is the same as the thickness of the bottom plate 10.
請參閱圖3至圖5，安裝時，藉由工具將該等散熱體20之安裝部26及鉚合部24***底板10之插孔13中。其中每一散熱體20之安裝部26係過盈配合地結合於底板10之插孔13之下半部分中，安裝部26之底面與底板10之底面平齊以共同接觸電子元件之頂面。每一散熱體20之散熱部22之底部環面與其所在對應之插孔13周緣之底板10之頂面相抵靠。此時，每一散熱體20之鉚合部24置於底板10之插孔13之上半部分，其外壁與插孔13之內壁相隔一定間隙。 Referring to FIGS. 3 to 5, the mounting portion 26 and the caulking portion 24 of the heat sink 20 are inserted into the insertion holes 13 of the bottom plate 10 by tools. The mounting portion 26 of each of the heat sinks 20 is coupled to the lower half of the socket 13 of the bottom plate 10 in an interference fit. The bottom surface of the mounting portion 26 is flush with the bottom surface of the bottom plate 10 to collectively contact the top surface of the electronic component. The bottom annular surface of the heat dissipating portion 22 of each of the heat radiating bodies 20 abuts against the top surface of the bottom plate 10 on the periphery of the corresponding insertion hole 13 of the heat dissipating body 20. At this time, the caulking portion 24 of each of the heat radiating bodies 20 is placed on the upper half of the insertion hole 13 of the bottom plate 10, and the outer wall thereof is spaced apart from the inner wall of the insertion hole 13 by a certain gap.
將散熱體20插置於底板10後，藉由一擠壓模具之刀具30衝壓在每一散熱體20之周緣處底板10之頂部，使得散熱體20周緣之底板10之上部分產生塑性變形，以使插孔13之內壁發生變形並緊緊擠壓散熱體20之鉚合部24。因此，鉚合部24與底板10之插孔13之間的空隙消失，散熱體20與底板10緊密接觸並固定在插孔13中。將所有散熱體10都完成衝壓過程，取出擠壓模具之刀具30後，整個散熱器製作完成。可以理解地，刀具30之數量可以與散熱體20之數量相同，從而一次衝壓同時 完成所有散熱體20之鉚接過程。 After the heat sink 20 is inserted into the bottom plate 10, the top of the bottom plate 10 is punched at the periphery of each heat sink 20 by a cutter 30 of a die, so that the upper portion of the bottom plate 10 of the periphery of the heat sink 20 is plastically deformed. The inner wall of the socket 13 is deformed and the rivet 24 of the heat sink 20 is tightly pressed. Therefore, the gap between the staking portion 24 and the insertion hole 13 of the bottom plate 10 disappears, and the heat sink 20 is in close contact with the bottom plate 10 and fixed in the insertion hole 13. All the heat sinks 10 are completed in the stamping process, and after the cutter 30 of the extrusion die is taken out, the entire heat sink is completed. It can be understood that the number of the cutters 30 can be the same as the number of the heat sinks 20, so that one punching at the same time The riveting process of all the heat sinks 20 is completed.
由於每一散熱體20下端之安裝部26首先過盈配合地固定在底板10上，再進行衝壓，因此散熱體20在衝壓前已經可以很好地定位；並且，衝壓後插孔13之內壁與鉚合部24之充分接觸，避免了底板10底部出現變形量不足而夾不緊散熱體10之問題。完成衝壓後插孔13之內壁變形而與散熱體20之鉚合部24完全接觸並將其卡掣，提高了散熱器之導熱效果之同時，使得散熱體20可以更牢固地安裝在底板10上。另外，本發明之散熱體20兩段式之設計相對完全採用過盈配合之習知技術，避免了因過盈配合距離太長造成裝配困難。 Since the mounting portion 26 of the lower end of each heat sink 20 is first fixed to the bottom plate 10 with an interference fit and then stamped, the heat sink 20 can be well positioned before punching; and, the inner wall of the socket 13 after punching The sufficient contact with the staking portion 24 avoids the problem that the amount of deformation at the bottom of the bottom plate 10 is insufficient and the heat sink 10 is not clamped. After the stamping, the inner wall of the socket 13 is deformed to completely contact the rivet portion 24 of the heat sink 20 and is jammed, thereby improving the heat conduction effect of the heat sink, so that the heat sink 20 can be more firmly mounted on the bottom plate 10 on. In addition, the two-stage design of the heat sink 20 of the present invention relatively completely adopts the conventional technique of interference fit, thereby avoiding assembly difficulties due to the interference fit distance being too long.
本發明提供一種散熱器之製造方法，主要步驟包括：(一)備置一底板10，在底板10上設有均勻分佈之插孔13，每一插孔13為垂直貫穿於底板10之上下表面之圓形通孔；(二)備置複數圓柱狀散熱體20，每一散熱體20包括同軸之一散熱部22、一鉚合部24及置於中部之安裝部26，其中安裝部26之外徑稍大於底板10之插孔13之內徑，散熱部22之外徑大於安裝部26之外徑，鉚合部24之外徑小於安裝部26之外徑；(三)將散熱體20之安裝部26過盈配合地***安裝底板10之插孔13中，其中散熱部22之底部環面與底板10之頂面相抵靠，安裝部26之底面與底板10之底面平齊；及(四)備置一擠壓模具之刀具30擠壓在每一散熱體20之周緣處底板10之頂面，使得散熱體20周緣之底板10之上部分產生 塑性變形，以使插孔13之內壁發生變形並緊緊擠壓散熱體20之鉚合部24。 The present invention provides a method for manufacturing a heat sink. The main steps include: (1) preparing a bottom plate 10, and providing a uniformly distributed jack 13 on the bottom plate 10, each of the jacks 13 extending perpendicularly through the upper surface of the bottom plate 10 a circular through hole; (2) a plurality of cylindrical heat radiating bodies 20 are provided, each of the heat radiating bodies 20 includes a coaxial heat radiating portion 22, a riveting portion 24, and a mounting portion 26 disposed at a middle portion, wherein the outer diameter of the mounting portion 26 Slightly larger than the inner diameter of the insertion hole 13 of the bottom plate 10, the outer diameter of the heat dissipation portion 22 is larger than the outer diameter of the mounting portion 26, and the outer diameter of the staking portion 24 is smaller than the outer diameter of the mounting portion 26; (3) the installation of the heat dissipation body 20 The portion 26 is inserted into the insertion hole 13 of the mounting base 10 with an interference fit, wherein the bottom annular surface of the heat dissipation portion 22 abuts against the top surface of the bottom plate 10, and the bottom surface of the mounting portion 26 is flush with the bottom surface of the bottom plate 10; and (4) A cutter 30 for squeezing a die is pressed against the top surface of the bottom plate 10 at the periphery of each heat sink 20, so that a portion above the bottom plate 10 of the periphery of the heat sink 20 is generated. The plastic deformation is such that the inner wall of the insertion hole 13 is deformed and the staking portion 24 of the heat sink 20 is tightly pressed.
在本實施例中，散熱體20安裝部26之過盈配合加上鉚合部24之鉚接這種兩段式之安裝可以將散熱體20很好地定位，將散熱體20牢牢地結合在底板10中，並且與底板10之間具有更大之接觸面積以提高散熱器之導熱效果。 In this embodiment, the interference fit of the mounting portion 26 of the heat sink 20 and the riveting of the riveting portion 24 can be used to position the heat sink 20 well, and the heat sink 20 is firmly coupled. There is a larger contact area between the bottom plate 10 and the bottom plate 10 to improve the heat conduction effect of the heat sink.
可以理解地，在其他實施例中，本發明散熱器之底板之插孔設置成矩形之通孔，散熱體則對應設置為截面為矩形之柱體，該散熱體包括兩端之矩形體之散熱部、安裝部以及連接散熱部、安裝部之鉚合部，該安裝部過盈配合收容於該插孔內，該鉚合部收容於插孔內且其截面尺寸對應小於安裝部之截面尺寸，該散熱部之截面尺寸對應大於安裝部之截面尺寸。 It can be understood that, in other embodiments, the jack of the bottom plate of the heat sink of the present invention is disposed as a rectangular through hole, and the heat dissipating body is correspondingly arranged as a column having a rectangular cross section, and the heat dissipating body includes a heat dissipation of a rectangular body at both ends. a portion, a mounting portion, and a riveting portion connecting the heat dissipating portion and the mounting portion, wherein the mounting portion is received in the jack by an interference fit, and the riveting portion is received in the jack and the cross-sectional dimension thereof is smaller than a cross-sectional dimension of the mounting portion. The cross-sectional dimension of the heat dissipating portion corresponds to a cross-sectional dimension of the mounting portion.
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
10‧‧‧底板 10‧‧‧floor
13‧‧‧插孔 13‧‧‧ jack
20‧‧‧散熱體 20‧‧‧ Heat sink
22‧‧‧散熱部 22‧‧‧ Department of heat dissipation
24‧‧‧鉚合部 24‧‧‧ Riveting Department
26‧‧‧安裝部 26‧‧‧Installation Department
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97122108A TWI400598B (en) | 2008-06-13 | 2008-06-13 | Heat sink and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97122108A TWI400598B (en) | 2008-06-13 | 2008-06-13 | Heat sink and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200951693A TW200951693A (en) | 2009-12-16 |
| TWI400598B true TWI400598B (en) | 2013-07-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97122108A TWI400598B (en) | 2008-06-13 | 2008-06-13 | Heat sink and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI400598B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050065581A1 (en) * | 2003-09-22 | 2005-03-24 | Coolhead Technologies, Inc. | Flexible heat exchangers for medical cooling and warming applications |
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2008
- 2008-06-13 TW TW97122108A patent/TWI400598B/en not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050065581A1 (en) * | 2003-09-22 | 2005-03-24 | Coolhead Technologies, Inc. | Flexible heat exchangers for medical cooling and warming applications |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200951693A (en) | 2009-12-16 |
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