TWI399166B

TWI399166B - Heat sink

Info

Publication number: TWI399166B
Application number: TW98110340A
Authority: TW
Inventors: Ping Yang Chuang
Original assignee: Hon Hai Prec Ind Co Ltd
Priority date: 2009-03-27
Filing date: 2009-03-27
Publication date: 2013-06-11
Also published as: TW201036530A

Description

散熱器 heat sink

本發明涉及一種投影儀調節裝置，尤指一種調節投影儀相對於螢幕的俯仰角的調節裝置。 The present invention relates to a projector adjusting device, and more particularly to an adjusting device for adjusting a pitch angle of a projector relative to a screen.

現今的電子設備，尤其是電腦，正呈現小型化趨勢。但這也帶來了散熱方面的困擾。例如，在為筆記型電腦及迷你型電腦的主要發熱元件(如中央處理器)散熱時，有兩種常見的方式。一種是使用傳統的風扇散熱器進行散熱。該方式成本低，但越來越難以滿足不斷變小的電子設備的散熱需求。另一種是利用熱導管將主要發熱元件產生的熱量傳遞至機箱散熱孔處而散出。熱導管能夠滿足小型電子設備的散熱需求，但價格卻非常昂貴。 Today's electronic devices, especially computers, are showing a trend toward miniaturization. But it also brings about heat dissipation. For example, there are two common ways to dissipate heat from the main heating elements of a notebook computer and a mini computer, such as a central processing unit. One is to use a traditional fan heat sink for heat dissipation. This approach is costly, but it is increasingly difficult to meet the cooling needs of ever-increasing electronic devices. The other is to use a heat pipe to transfer the heat generated by the main heating element to the heat dissipation hole of the chassis to dissipate. Heat pipes can meet the cooling needs of small electronic devices, but they are very expensive.

鑒於以上內容，有必要提供一種能夠滿足散熱需求且成本較低的散熱器。 In view of the above, it is necessary to provide a heat sink that can meet the heat dissipation requirements and has a lower cost.

一種散熱器，用於為一在機殼上設有開口的電子設備散熱，該散熱器包括一貼合於該電子設備內的發熱元件的基座、複數由該基座延伸出的散熱鰭片以及一產生風流的風扇，其改良在於：該機殼上於該開口所在區域向內形成一凹陷部，該散熱器還包括一收容於凹陷部內的殼體，該殼體內形成一熱交換空間，該基座為該殼體的一部分，該等散熱鰭片延伸至該熱交換空間，該散熱器的基座透過該電子設備的開口裝設於該電子設備，該殼體的位於該電子設備的機殼外的部分開設有入風口及出風口，該殼體包附於該散熱器的週邊而產生對風流的導向作用，使得該風流由該入風口進入該散熱器並由該出風口流出該散熱器。 A heat sink for dissipating heat to an electronic device having an opening in the casing, the heat sink comprising a base attached to the heat generating component in the electronic device, and a plurality of heat radiating fins extending from the base And a fan for generating a wind flow, wherein the improvement is that a recess is formed in the casing in the region where the opening is located, The heat sink further includes a housing received in the recess, the housing forming a heat exchange space, the base is a part of the housing, the heat dissipation fins extend to the heat exchange space, and the base of the heat sink The opening of the electronic device is installed in the electronic device, and a portion of the casing outside the casing of the electronic device is provided with an air inlet and an air outlet, and the casing is attached to the periphery of the heat sink to generate a wind flow The guiding action is such that the wind flow enters the heat sink from the air inlet and flows out of the heat sink from the air outlet.

一種散熱器，用於為一電子設備散熱，該散熱器包括用於吸收該電子設備內的發熱元件熱量的殼體、複數散熱鰭片，該殼體圍合形成一熱交換空間，該殼體開設有入風口及出風口，該殼體呈扁圓柱形，該入風口開設於該殼體頂部中央，該出風口環繞開設於該殼體側部，該等散熱鰭片延伸至該散熱空間，散熱器外的冷空氣在該殼體的導引下由該入風口進入並在該熱交換空間內進行熱交換後透過該出風口排出。 A heat sink for dissipating heat for an electronic device, the heat sink including a housing for absorbing heat of a heat generating component in the electronic device, and a plurality of heat radiating fins, the housing enclosing a heat exchange space, the housing The air inlet and the air outlet are opened, the casing has a flat cylindrical shape, and the air inlet is opened at the center of the top of the casing, and the air outlet is surrounded by the side of the casing, and the heat dissipation fins extend to the heat dissipation space. The cold air outside the radiator enters through the air inlet under the guidance of the casing and is exchanged through the air outlet after heat exchange in the heat exchange space.

本發明散熱器能夠滿足散熱需求且成本低廉。 The heat sink of the invention can meet the heat dissipation requirement and is low in cost.

10、10A、10B‧‧‧散熱裝置 10, 10A, 10B‧‧‧ heat sink

21、21A‧‧‧入風口 21, 21A‧‧‧ inlet

25B‧‧‧閥門 25B‧‧‧ Valve

31、31A‧‧‧散熱鰭片 31, 31A‧‧‧ Heat sink fins

50、50A、50B‧‧‧機殼 50, 50A, 50B‧‧‧ cases

60、60A‧‧‧電路板 60, 60A‧‧‧ circuit board

63、63A、63B‧‧‧電子元件 63, 63A, 63B‧‧‧ electronic components

20、20A、20B‧‧‧殼體 20, 20A, 20B‧‧‧ shell

23、23A‧‧‧出風口 23, 23A‧‧ vents

30、30A‧‧‧基座 30, 30A‧‧‧ Pedestal

40、40A‧‧‧風扇 40, 40A‧‧‧ fans

51‧‧‧凹陷部 51‧‧‧Depression

61、61A‧‧‧發熱元件 61, 61A‧‧‧ heating elements

圖1為本發明散熱器的第一較佳實施方式的立體圖。 1 is a perspective view of a first preferred embodiment of a heat sink of the present invention.

圖2為圖1中散熱器的使用狀態圖。 FIG. 2 is a view showing a state of use of the heat sink of FIG. 1. FIG.

圖3為本發明散熱器的第二較佳實施方式的立體圖。 3 is a perspective view of a second preferred embodiment of the heat sink of the present invention.

圖4為圖3中散熱器的使用狀態圖。 4 is a view showing a state of use of the heat sink of FIG. 3.

圖5為本發明散熱器的第三較佳實施方式的立體圖。 Figure 5 is a perspective view of a third preferred embodiment of the heat sink of the present invention.

圖6為圖5中散熱器的使用狀態圖。 Fig. 6 is a view showing a state of use of the heat sink of Fig. 5.

請參閱圖1及圖2，在本發明的第一較佳實施方式中，散熱器10用於為一電子設備內的熱源散熱。 Referring to FIG. 1 and FIG. 2, in the first preferred embodiment of the present invention, the heat sink 10 is used to dissipate heat from a heat source in an electronic device.

散熱器10包括一大體呈扁圓柱形的殼體20。殼體20由一頂部(未標號)、一底部(未標號)以及一連接於該頂部與底部之間的側部(未標號)所圍成，從而在殼體20內部形成一熱交換空間(未標號)。殼體20的頂部中央開設圓形開口，形成入風口21。殼體20的側部環繞地開設間隔排列的複數開口，形成出風口23。殼體20底部為一散熱器的基座30。基座30的內表面向該熱交換空間垂直延伸出複數散熱鰭片31。該等散熱鰭片31依次間隔設置並形成為一環狀鰭片組。每一散熱鰭片31的位於該環狀鰭片組外側的一端位於出風口23處。散熱器10在其入風口21內設置一渦流式風扇40，且風扇40被該環狀鰭片組的散熱鰭片31所環繞。 The heat sink 10 includes a housing 20 having a generally flat cylindrical shape. The housing 20 is surrounded by a top portion (not labeled), a bottom portion (not labeled), and a side portion (not labeled) connected between the top portion and the bottom portion to form a heat exchange space inside the casing 20 ( Not numbered). A circular opening is formed in the center of the top of the casing 20 to form an air inlet 21. The side portions of the casing 20 are circumferentially provided with a plurality of spaced-apart openings to form an air outlet 23. The bottom of the housing 20 is a base 30 of a heat sink. The inner surface of the susceptor 30 extends perpendicularly to the heat exchange space to form a plurality of heat dissipation fins 31. The heat dissipation fins 31 are sequentially spaced apart and formed into an annular fin group. One end of each of the heat dissipation fins 31 located outside the annular fin group is located at the air outlet 23 . The radiator 10 is provided with a vortex fan 40 in its air inlet 21, and the fan 40 is surrounded by the heat dissipation fins 31 of the annular fin group.

該電子設備包括一機殼50以及一裝設在機殼50內的電路板60。機殼50上開設一開口(未標號)。機殼50在其開口所在區域向內形成一凹陷部51。電路板60上設有一作為主要熱源的發熱元件61以及複數其他電子元件63。在本實施方式中，該電子設備為一桌上型電腦主機，電路板60為一主機板，發熱元件61為一中央處理器。 The electronic device includes a casing 50 and a circuit board 60 mounted in the casing 50. An opening (not labeled) is formed in the casing 50. The casing 50 forms a recess 51 inwardly in the region where the opening is located. The circuit board 60 is provided with a heat generating component 61 as a main heat source and a plurality of other electronic components 63. In this embodiment, the electronic device is a desktop computer host, the circuit board 60 is a motherboard, and the heating element 61 is a central processing unit.

組裝時，將散熱器10透過該電子設備的機殼50的開口安裝至該電子設備。其中，散熱器10的基座30貼合於發熱元件61，散熱器10的入風口21及出風口23均位於該電子設備的機殼50外，且散熱器10的殼體20足以將該電子設備的機殼50內的包括發熱元件61在內的熱源所發散出的熱量與機殼50外的冷空氣隔開。 At the time of assembly, the heat sink 10 is mounted to the electronic device through the opening of the casing 50 of the electronic device. Wherein, the base 30 of the heat sink 10 is attached to the heating element 61, The air inlet 21 and the air outlet 23 of the heat sink 10 are both located outside the casing 50 of the electronic device, and the casing 20 of the heat sink 10 is sufficient to heat the heat source including the heat generating component 61 in the casing 50 of the electronic device 10. The heat radiated is separated from the cold air outside the casing 50.

使用時，啟動風扇40。散熱器10的基座30將發熱元件61所產生的熱量傳遞至散熱鰭片31。風扇40使得機殼50外部的冷空氣由散熱器10的入風口21進入散熱器10，並在該熱交換空間內進行熱交換。由於殼體20包附於散熱器10的週邊而產生對風流的導向作用，使得風流進行熱交換後直接透過散熱器10的出風口23被排出至該電子設備的機殼50外。 When in use, the fan 40 is activated. The susceptor 30 of the heat sink 10 transfers the heat generated by the heat generating element 61 to the heat radiating fins 31. The fan 40 allows cold air outside the casing 50 to enter the radiator 10 from the air inlet 21 of the radiator 10, and performs heat exchange in the heat exchange space. Since the casing 20 is attached to the periphery of the radiator 10, a guiding effect on the wind flow is generated, so that the airflow is directly exchanged through the air outlet 23 of the radiator 10 to the outside of the casing 50 of the electronic device after heat exchange.

其中，機殼50的凹陷部51是為了使熱裝置10安裝至該電子設備後不致使整體厚度增加得太多，並保證整體的美觀。 The recessed portion 51 of the casing 50 is such that the overall thickness of the heat device 10 is not increased too much after the electronic device 10 is mounted to the electronic device, and the overall appearance is ensured.

另外，在其他實施方式中，可利用一葉片式風扇來替換渦流式風扇40的作用。 Additionally, in other embodiments, a vane fan can be utilized to replace the effect of the vortex fan 40.

請參閱圖3及圖4，在本發明的第二較佳實施方式中，散熱器10A用於為一電子設備內的熱源散熱。 Referring to FIG. 3 and FIG. 4, in the second preferred embodiment of the present invention, the heat sink 10A is used to dissipate heat from a heat source in an electronic device.

散熱器10A包括一大體呈斗笠狀的殼體20A。殼體20A由一頂部(未標號)、一底部(未標號)以及一連接於該頂部與底部之間的側部(未標號)所圍成，從而在殼體20A內部形成一熱交換空間(未標號)。殼體20A的頂部一側開設圓形開口，形成入風口21A。殼體20A的頂部的另一側開設扇形開口，形成出風口23A。殼體20A底部為一散熱器的基座30A。基座30A的內表面的位於出風口23A下方的區域向該熱交換空間內垂直延伸出複數散熱鰭片31A並延伸至出風口23A處。該等散熱鰭片31A沿散熱器10A的徑向設置並依次間隔排列以形成一扇狀鰭片組。散熱器10A在其入風口21A內設置一葉片式風扇40A。 The heat sink 10A includes a housing 20A that is generally in the shape of a bucket. The housing 20A is surrounded by a top portion (not labeled), a bottom portion (not labeled), and a side portion (not labeled) connected between the top portion and the bottom portion to form a heat exchange space inside the casing 20A ( Not numbered). A circular opening is formed in the top side of the casing 20A to form the air inlet 21A. The other side of the top of the casing 20A has a fan-shaped opening to form an air outlet 23A. The bottom of the housing 20A is a base 30A of a heat sink. base The area of the inner surface of the seat 30A below the air outlet 23A extends perpendicularly into the heat exchange space to a plurality of heat radiating fins 31A and extends to the air outlet 23A. The heat dissipation fins 31A are disposed along the radial direction of the heat sink 10A and are sequentially spaced to form a fan fin group. The radiator 10A is provided with a vane fan 40A in its air inlet 21A.

該電子設備包括一機殼50A以及一裝設在機殼50A內的電路板60A。機殼50A上開設一開口(未標號)。電路板60A上設有一作為主要熱源的發熱元件61發熱元件61A以及複數其他電子元件63A。 The electronic device includes a casing 50A and a circuit board 60A mounted in the casing 50A. An opening (not labeled) is formed in the casing 50A. The circuit board 60A is provided with a heat generating element 61 as a main heat source 61 and a plurality of other electronic components 63A.

組裝時，將散熱器10A透過該電子設備的機殼50A的開口安裝至該電子設備。其中，散熱器10A的基座30A貼合於發熱元件61A，散熱器10A的入風口21A及出風口23A均位於該電子設備的機殼50A外，且散熱器10的殼體20A足以將該電子設備的機殼50A內的包括發熱元件61A在內的熱源所發散出的熱量與機殼50A外的冷空氣隔開。 At the time of assembly, the heat sink 10A is attached to the electronic device through the opening of the casing 50A of the electronic device. The base 30A of the heat sink 10A is attached to the heat generating component 61A, and the air inlet 21A and the air outlet 23A of the heat sink 10A are located outside the casing 50A of the electronic device, and the casing 20A of the heat sink 10 is sufficient for the electronic device. The heat radiated from the heat source including the heat generating element 61A in the casing 50A of the apparatus is separated from the cold air outside the casing 50A.

使用時，啟動風扇40A。散熱器10A的基座30A將發熱元件61A所產生的熱量傳遞至散熱鰭片31A。風扇40A使得機殼50A外部的冷空氣由散熱器10A的入風口21A進入散熱器10A，並在該熱交換空間內進行熱交換。由於殼體20包附於散熱器10A的週邊而產生對風流的導向作用，使得風流進行熱交換後後直接透過散熱器10A的出風口23A被排出至該電子設備的機殼50A外。 When in use, the fan 40A is activated. The susceptor 30A of the heat sink 10A transfers the heat generated by the heat generating element 61A to the heat radiating fins 31A. The fan 40A allows cold air outside the casing 50A to enter the radiator 10A from the air inlet 21A of the radiator 10A, and performs heat exchange in the heat exchange space. Since the casing 20 is attached to the periphery of the radiator 10A to cause a guiding effect on the wind flow, the airflow is directly discharged through the air outlet 23A of the radiator 10A and then discharged to the outside of the casing 50A of the electronic device.

另外，在其他實施方式中，可利用一渦流式風扇來替換葉片式風扇40A的作用。 Additionally, in other embodiments, a vortex fan can be utilized to replace the function of the vane fan 40A.

由上述兩較佳實施方式可看出，本發明散熱器在裝設至電子設備時採用後，利用了熱直通方式進行散熱，即冷空氣不經過機殼50、50A內部而直接進入散熱器10、10A並直接由散熱器10、10A流出機殼50、50A外。本發明散熱器的散熱器10、10A的入風口21、21A及出風口23、23A均位於機殼50、50A外，避免了熱風駐留於電子設備內的問題，提高了散熱效率。 It can be seen from the above two preferred embodiments that the heat sink of the present invention is used for heat dissipation after being installed in an electronic device, that is, the cold air directly enters the heat sink 10 without passing through the inside of the casing 50, 50A. 10A and directly flow out of the casing 50, 50A by the radiators 10, 10A. The air inlets 21, 21A and the air outlets 23, 23A of the heat sinks 10, 10A of the heat sink of the present invention are all located outside the casing 50, 50A, thereby avoiding the problem that the hot air resides in the electronic equipment, and improving the heat dissipation efficiency.

請參閱圖5及圖6，為本發明散熱器的第三較佳實施方式。第三較佳實施方式與第二較佳實施方式的區別在於：在第三較佳實施方式中，散熱器10B的殼體20B的側面設置了複數閥門25B。閥門25B位於機殼50B內。閥門25B的開啟、關閉以及閥開啟程度可以被控制，例如閥門25B可以透過扭簧鉸鏈結構固定於殼體，閥門的開啟程度由風扇的風力直接控制。這樣便可利用進入散熱器10B的多餘冷空氣為電子設備內的其他電子元件63B散熱，且該多餘冷空氣由閥門25B流出的大小及方向皆可被控制。 Please refer to FIG. 5 and FIG. 6, which are a third preferred embodiment of the heat sink of the present invention. The third preferred embodiment differs from the second preferred embodiment in that, in the third preferred embodiment, the side surface of the casing 20B of the radiator 10B is provided with a plurality of valves 25B. Valve 25B is located within housing 50B. The opening, closing and valve opening degree of the valve 25B can be controlled. For example, the valve 25B can be fixed to the housing through the torsion spring hinge structure, and the degree of opening of the valve is directly controlled by the wind power of the fan. Thus, excess cold air entering the heat sink 10B can be used to dissipate heat from other electronic components 63B in the electronic device, and the size and direction of the excess cold air flowing out of the valve 25B can be controlled.

本發明散熱器為適用熱直通技術而設計，利用其散熱的熱交換率可達到50%以上，且成本低廉。本發明散熱器除適用於桌上型電腦散熱外，尤其還適用於筆記型電腦、精巧型電腦、液晶顯示器等薄小型的電子設備。 The heat sink of the invention is designed for the application of the hot through technology, and the heat exchange rate by using the heat dissipation can reach 50% or more, and the cost is low. The heat sink of the invention is suitable for heat dissipation of a desktop computer, and is particularly suitable for thin and small electronic devices such as a notebook computer, a compact computer, and a liquid crystal display.

綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10A‧‧‧散熱裝置 10A‧‧‧heat sink

21A‧‧‧入風口 21A‧‧‧ inlet

30A‧‧‧基座 30A‧‧‧Base

40A‧‧‧風扇 40A‧‧‧fan

20A‧‧‧殼體 20A‧‧‧shell

23A‧‧‧出風口 23A‧‧‧air outlet

31A‧‧‧散熱鰭片 31A‧‧‧Heat fins

Claims

一種散熱器，用於為一在機殼上設有開口的電子設備散熱，該散熱器包括一貼合於該電子設備內的發熱元件的基座、複數由該基座延伸出的散熱鰭片以及一產生風流的風扇，其改良在於：該機殼上於該開口所在區域向內形成一凹陷部，該散熱器還包括一收容於凹陷部內的殼體，該殼體內形成一熱交換空間，該基座為該殼體的一部分，該等散熱鰭片延伸至該熱交換空間，該散熱器的基座透過該電子設備的開口裝設於該電子設備，該殼體的位於該電子設備的機殼外的部分開設有入風口及出風口，該殼體包附於該散熱器的週邊而產生對風流的導向作用，使得該風流由該入風口進入該散熱器並由該出風口流出該散熱器。 A heat sink for dissipating heat to an electronic device having an opening in the casing, the heat sink comprising a base attached to the heat generating component in the electronic device, and a plurality of heat radiating fins extending from the base And a fan that generates a wind flow, wherein the casing has a recess formed inwardly in the region of the opening, the heat sink further includes a casing received in the recess, and a heat exchange space is formed in the casing. The susceptor is a part of the housing, the heat dissipation fins extend to the heat exchange space, and the pedestal of the heat sink is mounted on the electronic device through an opening of the electronic device, and the housing is located at the electronic device An air inlet and an air outlet are formed in a portion outside the casing, and the casing is attached to the periphery of the radiator to generate a guiding effect on the wind flow, so that the wind flow enters the radiator through the air inlet and flows out from the air outlet. heat sink.

如申請專利範圍第1項所述之散熱器，其中該殼體由一頂部、一底部以及一連接於該頂部與底部之間的側部所圍成，該底部形成該基座，該風扇位於該殼體內。 The heat sink of claim 1, wherein the housing is surrounded by a top portion, a bottom portion and a side portion connected between the top portion and the bottom portion, the bottom portion forming the base, the fan being located Inside the housing.

如申請專利範圍第2項所述之散熱器，其中該入風口開設於該殼體頂部，該出風口開設於該殼體側部。 The heat sink according to claim 2, wherein the air inlet is opened at a top of the casing, and the air outlet is opened at a side of the casing.

如申請專利範圍第3項所述之散熱器，其中該殼體大體呈扁圓柱形，該入風口為圓形且開設於該殼體頂部中央，該出風口呈環形且環繞開設於該殼體側部。 The heat sink of claim 3, wherein the housing is substantially in a flat cylindrical shape, the air inlet is circular and is disposed at a center of the top of the housing, and the air outlet is annular and surrounds the housing. Side.

如申請專利範圍第4項所述之散熱器，其中該等散熱鰭片間隔設置且排列成環狀並環繞該風扇，每一散熱鰭片的位於該環狀外側的一端位於該出風口處。 The heat sink of claim 4, wherein the heat dissipation fins are spaced apart and arranged in a ring shape and surround the fan, wherein each of the heat dissipation fins is located One end of the outer side of the ring is located at the air outlet.

如申請專利範圍第2項所述之散熱器，其中該入風口及該出風口均開設於該殼體頂部。 The heat sink of claim 2, wherein the air inlet and the air outlet are both located at the top of the housing.

如申請專利範圍第6項所述之散熱器，其中該等散熱鰭片由該基座的位於該出風口下方的區域延伸出並延伸至該出風口處。 The heat sink of claim 6, wherein the heat dissipation fins extend from a region of the base below the air outlet and extend to the air outlet.

如申請專利範圍第6或7項所述之散熱器，其中該殼體側部的位於該電子設備的機殼內的部分開設複數可使由該入風口進入的風流流出的閥門。 The heat sink according to claim 6 or 7, wherein the portion of the side of the casing that is located in the casing of the electronic device opens a plurality of valves that allow the airflow entering through the air inlet to flow out.

如申請專利範圍第8項所述之散熱器，其中每一閥門透過扭簧鉸鏈結構固定於該殼體，每一閥門的開啟程度由該風扇的風力直接控制。 The heat sink of claim 8, wherein each valve is fixed to the housing through a torsion spring hinge structure, and the degree of opening of each valve is directly controlled by the wind of the fan.