TWI398703B - Backlight module and method for manufacturing same - Google Patents
Backlight module and method for manufacturing same Download PDFInfo
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- TWI398703B TWI398703B TW97149722A TW97149722A TWI398703B TW I398703 B TWI398703 B TW I398703B TW 97149722 A TW97149722 A TW 97149722A TW 97149722 A TW97149722 A TW 97149722A TW I398703 B TWI398703 B TW I398703B
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Description
本發明係關於一種背光模組及其製造方法。The present invention relates to a backlight module and a method of fabricating the same.
液晶顯示裝置作為一種平面顯示裝置，因其具有輝度高、重量輕及耗電少等優點，而被廣泛應用於各種家用電器及辦公設備中。而因為液晶顯示裝置中之液晶本身不具有發光特性，通常需要為其提供一背光模組以實現顯示功能。As a flat display device, a liquid crystal display device is widely used in various home appliances and office equipment because of its advantages of high brightness, light weight, and low power consumption. Because the liquid crystal in the liquid crystal display device itself does not have the light emitting property, it is generally required to provide a backlight module to realize the display function.
請參閱圖1，係一種先前技術背光模組之立體分解圖。該背光模組12包括一背板13、一反射片14、一導光板15、一膠框16、複數光源17及一擴散片18。該背板13包括四側壁131及一與該四側壁131垂直連接之底板132。該導光板15包括一入光面151、一與該入光面151相鄰之出光面152及一與該出光面152相對之底面(未標示)。該背板13與該膠框16結合形成一收容空間(未標示)，該反射片14、該導光板15、該光源17及該擴散片18收容於該收容空間內。其中，該反射片14位於該底板132與該導光板15之底面之間。該光源17鄰近該導光板15之入光面151設置。該擴散片18鄰近該導光板13之出光面152設置。該導光板15之底面上分佈有網點(圖未示)，該網點用於擴散該光源17入射至該底面之光線，以使該導光板15均勻發光。Please refer to FIG. 1 , which is an exploded perspective view of a prior art backlight module. The backlight module 12 includes a back plate 13 , a reflective sheet 14 , a light guide plate 15 , a plastic frame 16 , a plurality of light sources 17 , and a diffusion sheet 18 . The back plate 13 includes four side walls 131 and a bottom plate 132 perpendicularly connected to the four side walls 131. The light guide plate 15 includes a light incident surface 151, a light exit surface 152 adjacent to the light incident surface 151, and a bottom surface (not labeled) opposite to the light exit surface 152. The backplane 13 and the plastic frame 16 are combined to form a receiving space (not shown). The reflective sheet 14, the light guide plate 15, the light source 17 and the diffusing film 18 are received in the receiving space. The reflective sheet 14 is located between the bottom plate 132 and the bottom surface of the light guide plate 15. The light source 17 is disposed adjacent to the light incident surface 151 of the light guide plate 15. The diffusion sheet 18 is disposed adjacent to the light exit surface 152 of the light guide plate 13. A dot (not shown) is disposed on the bottom surface of the light guide plate 15. The mesh is used to diffuse the light incident on the bottom surface of the light source 17 to uniformly illuminate the light guide plate 15.
惟，目前該背光模組12之背板13、膠框16及反射片14通常為相互分離之三部份，故組裝該背光模組12時需要較多之工序，導致該背光模組12之製造成本增加。組裝後之該背板13、膠框16及反射片14因為存在間隙導致該背光模組12之厚度較厚。該背板13通常係金屬材質，而因為金屬之重量通常較重且價格較高，所以造成採用該金屬背板13之該背光模組12之重量較重且其製造成本進一 步提高。The back panel 13 , the plastic frame 16 , and the reflective sheet 14 of the backlight module 12 are generally separated from each other. Therefore, more steps are required to assemble the backlight module 12 , resulting in the backlight module 12 . Manufacturing costs increase. The assembled back panel 13, the plastic frame 16 and the reflective sheet 14 have a thicker thickness of the backlight module 12 due to the presence of a gap. The back plate 13 is usually made of a metal material, and since the weight of the metal is generally heavy and the price is high, the backlight module 12 using the metal back plate 13 is heavy and the manufacturing cost thereof is high. Step up.
有鑑於此，提供一種製造成本較低、厚度較薄及重量較輕之背光模組實為必要。In view of this, it is necessary to provide a backlight module having a lower manufacturing cost, a thinner thickness, and a lighter weight.
有鑑於此，提供一種製造成本較低、厚度較薄及重量較輕之背光模組之製造方法實為必要。In view of this, it is necessary to provide a manufacturing method of a backlight module which is low in manufacturing cost, thin in thickness, and light in weight.
一種背光模組，其包括複數光學元件及一收容固定該複數光學元件之組合框架。該組合框架包括一背板及一反射層。該背板包括一底板。該底板設置有複數通孔。該反射層包覆該底板並填充該通孔。A backlight module includes a plurality of optical components and a combined frame for receiving and fixing the plurality of optical components. The composite frame includes a backing plate and a reflective layer. The backing plate includes a bottom plate. The bottom plate is provided with a plurality of through holes. The reflective layer covers the bottom plate and fills the through hole.
一種背光模組之製造方法，其包括如下步驟：步驟一：提供一設置有複數通孔之背板；步驟二：提供成型膠框與反射層之材料及模具，並將該背板放置於該模具內，注膠成型該膠框與該反射層，使該背板、該膠框與該反射層結合為一體，形成一收容空間；步驟三：提供光學元件，將該光學元件置於該容納空間內。A manufacturing method of a backlight module, comprising the following steps: Step 1: providing a back plate provided with a plurality of through holes; Step 2: providing a material and a mold for molding the plastic frame and the reflective layer, and placing the back plate on the In the mold, the plastic frame and the reflective layer are injection molded, so that the back plate, the plastic frame and the reflective layer are integrated to form a receiving space; and step 3: providing an optical component, and placing the optical component in the receiving Within the space.
相較於先前技術，本發明背光模組包括該組合框架，組裝該背光模組時，將該組合框架與其他光學元件進行組裝即可。故，組裝該背光模組所需之工序減少，使得該背光模組之製造成本降低。而該膠框及該反射層為同時注膠成型且與該背板結合為一體，故，組裝後之該背光模組之厚度較薄。該背板之底板設置有通孔，注膠成型該反射層所需之材料填滿該通孔。根據該背光模組尺寸之不同，相應合理之設計該通孔之大小，則該背板與其通孔內之材料能夠保證該背光模組之結構強度要求。而一般的，相同體積之反射層材料之重量輕於金屬之重量，且反射層材料之成本低於金屬鋁之成本，故，採用與該反射層結合為一體之背板之背光模組重量較輕，且該背光模組之製造成本進 一步降低。Compared with the prior art, the backlight module of the present invention includes the combined frame, and when the backlight module is assembled, the combined frame can be assembled with other optical components. Therefore, the process required for assembling the backlight module is reduced, so that the manufacturing cost of the backlight module is reduced. The plastic frame and the reflective layer are simultaneously injection molded and integrated with the back plate. Therefore, the assembled backlight module has a thin thickness. The bottom plate of the back plate is provided with a through hole, and a material required for molding the reflective layer fills the through hole. According to the size of the backlight module, the size of the through hole is correspondingly designed, and the material in the back plate and the through hole can ensure the structural strength requirement of the backlight module. Generally, the weight of the same volume of the reflective layer material is lighter than the weight of the metal, and the cost of the reflective layer material is lower than the cost of the metal aluminum. Therefore, the weight of the backlight module using the back plate combined with the reflective layer is relatively small. Light, and the manufacturing cost of the backlight module is One step lower.
請參閱圖2，係本發明背光模組第一實施方式之立體分解圖。該背光模組22包括一導光板26、一擴散片27、複數光源28及一組合框架29。該組合框架29不僅用於收容固定該導光板26、該擴散片27及該複數光源28，其還用於反射該光源28入射至其上之光線。2 is a perspective exploded view of a first embodiment of a backlight module of the present invention. The backlight module 22 includes a light guide plate 26 , a diffusion sheet 27 , a plurality of light sources 28 , and a combined frame 29 . The combination frame 29 is not only for housing and fixing the light guide plate 26, the diffusion sheet 27, and the plurality of light sources 28, but also for reflecting light incident on the light source 28.
該組合框架29包括一背板23、一膠框24及一反射層25。該背板23、該膠框24與該反射層25結合為一體，形成一收容空間(未標示)。該導光板26等光學元件收容於該收容空間。該導光板26設置於該反射層25表面，其包括一入光面261、一與該入光面261相鄰之出光面262及一與該出光面262相對之底面。該光源28鄰近該導光板26之入光面261設置。該擴散片27鄰近該導光板26之出光面262設置。The assembly frame 29 includes a back plate 23, a plastic frame 24 and a reflective layer 25. The back plate 23 and the plastic frame 24 are integrated with the reflective layer 25 to form a receiving space (not shown). The optical element such as the light guide plate 26 is housed in the accommodating space. The light guide plate 26 is disposed on the surface of the reflective layer 25 and includes a light incident surface 261, a light exit surface 262 adjacent to the light incident surface 261, and a bottom surface opposite to the light exit surface 262. The light source 28 is disposed adjacent to the light incident surface 261 of the light guide plate 26. The diffusion sheet 27 is disposed adjacent to the light exit surface 262 of the light guide plate 26.
請參閱圖3，係圖2所示背光模組22之背板23之立體結構示意圖。該背板23包括一底板231及與該底板231垂直連接之四側壁232。該底板231上設置有複數矩形通孔233。該背板23主要用於定位該導光板26，其通常由金屬材料製成以保證該背光模組22之結構強度。該背板23可為鋁背板。Please refer to FIG. 3 , which is a schematic perspective view of the back plate 23 of the backlight module 22 shown in FIG. 2 . The back plate 23 includes a bottom plate 231 and four side walls 232 perpendicularly connected to the bottom plate 231. The bottom plate 231 is provided with a plurality of rectangular through holes 233. The back plate 23 is mainly used for positioning the light guide plate 26, which is usually made of a metal material to ensure the structural strength of the backlight module 22. The backing plate 23 can be an aluminum backing plate.
請參閱圖4，係圖2所示背光模組22沿IV－IV剖面示意圖。該底板231包括一與該反射層25相接觸之內底面234。該四側壁232分別包括一與該底板231之內底面234相鄰之內表面235。該膠框24包覆該側壁232之內表面235。該反射層25包覆該底板231及該通孔233，並填滿該通孔233。該膠框24與該反射層25之材料相同，其均為白色之高反射率之聚碳酸酯(Polycarbonate,PC)，且該反射層25與該膠框24採用射出成型技術同時注膠成型。Referring to FIG. 4, a schematic diagram of the backlight module 22 shown in FIG. 2 along the IV-IV cross-section is shown. The bottom plate 231 includes an inner bottom surface 234 that is in contact with the reflective layer 25. The four side walls 232 each include an inner surface 235 adjacent to the inner bottom surface 234 of the bottom plate 231. The frame 24 covers the inner surface 235 of the side wall 232. The reflective layer 25 covers the bottom plate 231 and the through hole 233 and fills the through hole 233. The plastic frame 24 is made of the same material as the reflective layer 25, which is a white high-reflectivity polycarbonate (PC), and the reflective layer 25 and the plastic frame 24 are simultaneously injection molded by injection molding technology.
請參閱圖5與圖6，圖5係圖3所示背板23之立體分解圖，圖6係圖2所示背光模組22之組合示意圖。該背光模組22之製造方法包括如下步驟：Please refer to FIG. 5 and FIG. 6. FIG. 5 is an exploded perspective view of the backplane 23 shown in FIG. 3, and FIG. 6 is a schematic diagram of the combination of the backlight module 22 shown in FIG. The manufacturing method of the backlight module 22 includes the following steps:
步驟一：利用分段式加工方法製造該背板23；該背板23係由四第一L形材236及四第二L形材237利用鐳射焊接技術焊接而成。該四第一L形材236分別包括一第一側臂238及與一該第一側臂238垂直連接之第二側臂239。該第一側臂238及該第二側臂239均包括一與該導光板26平行之水平部份(未標示)及一自該水平部份之自由端之端末垂直延伸出來之豎直部份(未標示)。該四第二L形材237包括一第三側臂240及一與該第三側臂240垂直連接之第四側臂241。該第三側臂240及該第四側臂241均包括一與該導光板26平行之水平部份(未標示)及一自該水平部份之外側邊垂直延伸出來之豎直部份(未標示)。Step 1: The backing plate 23 is manufactured by a segmented processing method; the backing plate 23 is formed by welding four first L-shaped materials 236 and four second L-shaped materials 237 by laser welding. The four first L-shaped members 236 respectively include a first side arm 238 and a second side arm 239 perpendicularly connected to the first side arm 238. The first side arm 238 and the second side arm 239 each include a horizontal portion (not labeled) parallel to the light guide plate 26 and a vertical portion extending perpendicularly from the end of the free end of the horizontal portion. (not marked). The four second L-shaped members 237 include a third side arm 240 and a fourth side arm 241 vertically connected to the third side arm 240. The third side arm 240 and the fourth side arm 241 each include a horizontal portion (not labeled) parallel to the light guide plate 26 and a vertical portion extending perpendicularly from the outer side of the horizontal portion ( Not marked).
利用鐳射焊接技術接合時，首先，將該四第一L形材236分成兩組，每一組均包含兩第一L形材236，然後，將每一組之第一L形材236之第二側臂239相焊接固定。故，該四第一L形材236成為二T形材(未標示)。接著，將構成該二T形材之該第一L形材236之第一側臂238相焊接固定，故，該四第一L形材236經過焊接固定後成為一呈“十”字形材。最後，將該四第二L形材237之端部份別與構成該“十”字形材之該第一L形材236之端部焊接固定。如此，帶有該矩形通孔233之該背板23組裝完成。其中，該四第一L形材236之水平部份及該四第二L形材237之水平部份構成該底板231，其垂直部份構成該四側壁232。When joining by laser welding technology, first, the four first L-shaped materials 236 are divided into two groups, each group includes two first L-shaped materials 236, and then, the first L-shaped material 236 of each group is The two side arms 239 are welded and fixed. Therefore, the four first L-shaped members 236 become two T-shaped members (not shown). Next, the first side arm 238 of the first L-shaped material 236 constituting the two T-shaped members is welded and fixed, so that the four first L-shaped members 236 are welded and fixed to form a "ten" shape. Finally, the end portions of the four second L-shaped members 237 are welded and fixed to the end portions of the first L-shaped members 236 constituting the "ten" shaped material. Thus, the backing plate 23 with the rectangular through hole 233 is assembled. The horizontal portion of the four first L-shaped members 236 and the horizontal portion of the four second L-shaped members 237 constitute the bottom plate 231, and the vertical portions thereof constitute the four side walls 232.
步驟二：提供白色之高反射率之聚碳酸酯材料與模具，並將該背板23放置於該模具內，以模內成型之方式結合該背板23、該膠框 24與該反射層25。Step 2: providing a white high reflectivity polycarbonate material and a mold, and placing the back sheet 23 in the mold, and combining the back sheet 23 and the plastic frame in an in-mold forming manner 24 and the reflective layer 25.
要實現步驟二所述之內容，需要對現有技術中注膠成型該膠框14之模具進行改進，使該模具能夠同時注膠成型該膠框24及該反射層25。To implement the content described in the second step, it is necessary to improve the mold for molding the plastic frame 14 in the prior art, so that the mold can simultaneously insert and mold the plastic frame 24 and the reflective layer 25.
步驟三：提供該導光板26，將其放置於該反射層25上。Step 3: The light guide plate 26 is provided and placed on the reflective layer 25.
步驟四：提供該光源28，將該光源28鄰近該導光板26之入光面261放置。Step 4: The light source 28 is provided, and the light source 28 is placed adjacent to the light incident surface 261 of the light guide plate 26.
步驟五：提供該擴散片27，將該擴散片27放置於該導光板26之出光面262上。Step 5: The diffusion sheet 27 is provided, and the diffusion sheet 27 is placed on the light-emitting surface 262 of the light guide plate 26.
相較於先前技術，本發明背光模組22包括該組合框架29，組裝該背光模組22時，將該組合框架29與其他光學元件進行組裝即可。故，組裝該背光模組22所需之工序減少，使得該背光模組22之製造成本降低。而該膠框24及該反射層25為同時注膠成型且與該背板23結合為一體，故，組裝後之該背光模組22之厚度較薄。該背板23之底板231設置有通孔233，注膠成型該反射層25所需之材料聚碳酸酯填滿該通孔233。根據該背光模組22尺寸之不同，相應合理之設計該通孔233之大小，則該背板23與其通孔233內之聚碳酸酯材料能夠保證該背光模組22之結構強度要求。而一般的，相同體積之聚碳酸酯材料之重量輕於金屬鋁之重量，且聚碳酸酯材料之成本低於金屬鋁之成本，故，採用與該反射層25結合為一體之背板23之背光模組22重量較輕，且該背光模組22之製造成本進一步降低。Compared with the prior art, the backlight module 22 of the present invention includes the combined frame 29, and when the backlight module 22 is assembled, the combined frame 29 can be assembled with other optical components. Therefore, the process required for assembling the backlight module 22 is reduced, so that the manufacturing cost of the backlight module 22 is reduced. The plastic frame 24 and the reflective layer 25 are simultaneously injection molded and integrated with the back plate 23, so that the assembled backlight module 22 has a thin thickness. The bottom plate 231 of the back plate 23 is provided with a through hole 233 through which the material polycarbonate required for molding the reflective layer 25 fills. According to the size of the backlight module 22, the size of the through hole 233 is correspondingly designed, and the polycarbonate material in the back plate 23 and the through hole 233 can ensure the structural strength requirement of the backlight module 22. Generally, the weight of the same volume of polycarbonate material is lighter than the weight of the metal aluminum, and the cost of the polycarbonate material is lower than the cost of the metal aluminum. Therefore, the backing plate 23 integrated with the reflective layer 25 is used. The backlight module 22 is light in weight, and the manufacturing cost of the backlight module 22 is further reduced.
請參閱圖7，其係本發明背光模組之背板之第二實施方式結構示意圖。該背板43與第一實施方式之背板23之主要區別在於：組成該背板43之各部份之形狀與組成該背板23之各部份之形狀不同，而且將該背板43之各部份焊接於一起所形成之通孔433為圓形通孔。Please refer to FIG. 7 , which is a structural schematic diagram of a second embodiment of a backplane of a backlight module of the present invention. The main difference between the back plate 43 and the back plate 23 of the first embodiment is that the shapes of the portions constituting the back plate 43 are different from the shapes of the portions constituting the back plate 23, and the back plate 43 is The through holes 433 formed by welding the respective portions together are circular through holes.
本發明並不限於上述實施方式所述，其亦可具有其他變更設計。如該背板23之通孔233亦可以為三角形、橢圓形等規則形狀，或者係這些規則形狀之組合，還可以係不規則形狀。該背板23之底板231亦可包含一通孔、二通孔、三通孔、五通孔或數量更多之通孔。該背板23之通孔233亦可以為鏤刻而成。The present invention is not limited to the above embodiments, and may have other modifications. For example, the through hole 233 of the back plate 23 may have a regular shape such as a triangle or an ellipse, or a combination of these regular shapes, and may also have an irregular shape. The bottom plate 231 of the back plate 23 may also include a through hole, a two through hole, a three through hole, a five through hole or a plurality of through holes. The through hole 233 of the back plate 23 may also be engraved.
該背板23之各部份亦可以採用其他焊接方法或組裝方法。Other welding methods or assembly methods can also be used for each part of the backing plate 23.
該膠框24與該反射層25之材料亦可為白色之高反射率之聚對苯二甲酸乙酯(Polyethylene Terephthalate,PET)，或者其他類似物。The material of the plastic frame 24 and the reflective layer 25 may also be white high reflectivity polyethylene terephthalate (PET), or the like.
同樣，上面所述之變更設計亦同樣適用第二實施方式之背光模組。Similarly, the above-described modified design also applies to the backlight module of the second embodiment.
綜上所述，本發明確已符合發明之要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，本發明之範圍並不以上述實施方式為限，舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。In summary, the present invention has indeed met the requirements of the invention, and has filed a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are It should be covered by the following patent application.
22‧‧‧背光模組22‧‧‧Backlight module
23、43‧‧‧背板23, 43‧‧‧ Backplane
24‧‧‧膠框24‧‧‧ plastic frame
25‧‧‧反射層25‧‧‧reflective layer
26‧‧‧導光板26‧‧‧Light guide plate
27‧‧‧擴散片27‧‧‧Diffuser
28‧‧‧光源28‧‧‧Light source
29‧‧‧組合框架29‧‧‧Combined framework
261‧‧‧入光面261‧‧‧Into the glossy surface
262‧‧‧出光面262‧‧‧Glossy
231‧‧‧底板231‧‧‧floor
232‧‧‧側壁232‧‧‧ side wall
233、433‧‧‧通孔233, 433‧‧‧through holes
234‧‧‧內底面234‧‧‧ inside bottom
235‧‧‧內表面235‧‧‧ inner surface
236‧‧‧第一L形材236‧‧‧First L-shaped material
237‧‧‧第二L形材237‧‧‧Second L-shaped material
238‧‧‧第一側臂238‧‧‧First side arm
239‧‧‧第二側臂239‧‧‧ second side arm
240‧‧‧第三側臂240‧‧‧ third side arm
241‧‧‧第四側臂241‧‧‧fourth arm
圖1係一種先前技術背光模組之立體分解圖。1 is an exploded perspective view of a prior art backlight module.
圖2係本發明背光模組第一實施方式之立體分解圖。2 is an exploded perspective view of a first embodiment of a backlight module of the present invention.
圖3係圖2所示背光模組之背板之立體結構示意圖。3 is a perspective view showing the structure of the back panel of the backlight module shown in FIG. 2.
圖4係圖2所示背光模組沿IV－IV剖面示意圖。4 is a cross-sectional view of the backlight module shown in FIG. 2 taken along line IV-IV.
圖5係圖3所示背光模組之背板之立體分解圖。FIG. 5 is an exploded perspective view of the back panel of the backlight module shown in FIG. 3. FIG.
圖6係圖2所示背光模組之組合示意圖。FIG. 6 is a schematic diagram of a combination of the backlight modules shown in FIG. 2.
圖7係本發明背光模組之背板之第二實施方式結構示意圖。FIG. 7 is a schematic structural view of a second embodiment of a back sheet of a backlight module of the present invention.
23‧‧‧背板23‧‧‧ Backplane
236‧‧‧第一L形材236‧‧‧First L-shaped material
237‧‧‧第二L形材237‧‧‧Second L-shaped material
238‧‧‧第一側臂238‧‧‧First side arm
239‧‧‧第二側臂239‧‧‧ second side arm
240‧‧‧第三側臂240‧‧‧ third side arm
241‧‧‧第四側臂241‧‧‧fourth arm
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97149722A TWI398703B (en) | 2008-12-19 | 2008-12-19 | Backlight module and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97149722A TWI398703B (en) | 2008-12-19 | 2008-12-19 | Backlight module and method for manufacturing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201024855A TW201024855A (en) | 2010-07-01 |
| TWI398703B true TWI398703B (en) | 2013-06-11 |
Family
ID=44852328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97149722A TWI398703B (en) | 2008-12-19 | 2008-12-19 | Backlight module and method for manufacturing same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI398703B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI241436B (en) * | 2001-04-11 | 2005-10-11 | Hitachi Ltd | Liquid crystal display |
| TWM318305U (en) * | 2007-03-23 | 2007-09-01 | Jochu Technology Co Ltd | Bezel component |
| TWM333541U (en) * | 2007-12-28 | 2008-06-01 | Ind Tech Res Inst | Solar absorption application |
| TWM345258U (en) * | 2008-04-07 | 2008-11-21 | Chi Lin Technology Co Ltd | Base for direct type backlight module |
-
2008
- 2008-12-19 TW TW97149722A patent/TWI398703B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI241436B (en) * | 2001-04-11 | 2005-10-11 | Hitachi Ltd | Liquid crystal display |
| TWM318305U (en) * | 2007-03-23 | 2007-09-01 | Jochu Technology Co Ltd | Bezel component |
| TWM333541U (en) * | 2007-12-28 | 2008-06-01 | Ind Tech Res Inst | Solar absorption application |
| TWM345258U (en) * | 2008-04-07 | 2008-11-21 | Chi Lin Technology Co Ltd | Base for direct type backlight module |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201024855A (en) | 2010-07-01 |
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