TWI397353B - Printed circuit board and method for manufacturing the same - Google Patents
Printed circuit board and method for manufacturing the same Download PDFInfo
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- TWI397353B TWI397353B TW99113524A TW99113524A TWI397353B TW I397353 B TWI397353 B TW I397353B TW 99113524 A TW99113524 A TW 99113524A TW 99113524 A TW99113524 A TW 99113524A TW I397353 B TWI397353 B TW I397353B
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Description
本發明涉及電路板製作領域，尤其涉及一種製作具有低電阻率導電線路之電路板及其製作方法。 The invention relates to the field of circuit board manufacturing, in particular to a circuit board for manufacturing a conductive line with low resistivity and a manufacturing method thereof.
隨著科學技術之進步，印刷電路板因具有裝配密度高等優點而得到廣泛之應用。關於電路板之應用請參見文獻Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab, High density multilayer printed circuit board for HITAC M-880，IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425。 With the advancement of science and technology, printed circuit boards have been widely used due to their high assembly density. For application of the circuit board, please refer to the literature Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans On Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425.
先前技術中，導電線路通常採用金屬銅製作。金屬銅具有較小之電阻係數，通常可滿足電路板產品之一般需求。於一些要求具有更小之電阻率之電路板，通常採用金或者銀來製作整個導電線路。然而，採用上述金或銀等貴金屬，使得電路板生產成本提高，不能滿足降低電路板生產成本之要求。 In the prior art, the conductive lines were usually made of metallic copper. Metallic copper has a small resistivity and is usually sufficient for the general needs of circuit board products. For some boards that require a lower resistivity, gold or silver is typically used to make the entire conductive trace. However, the use of the above-mentioned precious metals such as gold or silver makes the production cost of the circuit board higher, and cannot meet the requirements for reducing the production cost of the circuit board.
有鑑於此，提供一種具有能夠有效之降低電路板之導電線路於工作時之電阻率之電路板及其製作方法實屬必要。 In view of the above, it is necessary to provide a circuit board having a resistivity capable of effectively reducing the conductive line of a circuit board during operation and a method of fabricating the same.
以下將以實施例說明一種電路板及其製作方法。 A circuit board and a method of fabricating the same will be described below by way of embodiments.
一種電路板包括第一絕緣層與第一導電線路。所述第一絕緣層具有相對之第一表面與第二表面。所述第一導電線路用於傳輸訊號，第一導電線路包括第一導線與第二導線，所述第一導線形成於所述第一絕緣層之第一表面，所述第二導線形成於第一導線之表面且包覆所述第一導線，所述第二導線之材料為銀。 A circuit board includes a first insulating layer and a first conductive line. The first insulating layer has opposite first and second surfaces. The first conductive line is for transmitting a signal, the first conductive line includes a first wire and a second wire, the first wire is formed on a first surface of the first insulating layer, and the second wire is formed on the first wire a surface of a wire and covering the first wire, the material of the second wire being silver.
一種電路板之製作方法，包括步驟：提供覆銅板，所述覆銅板包括第一絕緣層與第一銅箔層；於所述第一銅箔層內製作第一導線；於所述第一導線表面形成覆蓋第一導線之第二導線，第二導線之材料為銀，第一導線與第二導線共同形成第一導電線路，所述第一導電線路用於傳輸訊號。 A method of manufacturing a circuit board, comprising the steps of: providing a copper clad laminate, the copper clad laminate comprising a first insulating layer and a first copper foil layer; forming a first conductive wire in the first copper foil layer; and the first conductive wire The surface forms a second wire covering the first wire. The material of the second wire is silver. The first wire and the second wire together form a first conductive line, and the first conductive line is used for transmitting signals.
相較於先前技術，本技術方案提供之電路板，第一導電線路包括第一導線與覆蓋第一導線之第二導線，並且第二導線採用金屬銀製作，金屬銀之電阻率為1.64×10-8歐姆米，金屬銅之電阻率為1.77×10-8歐姆米，金屬銀之電阻小於金屬銅之電阻率。從而，當第一導電線路中通有上述預定頻率之交流電時，電子於第二導線中傳導，相對於全部採用銅製作第一導電線路，降低第一導電線路之電阻率。並且，由於第二導線之厚度較小，可節省金屬銀之用量，相比於用全部用金屬銀製作第一導電線路，降低生產成本。 Compared with the prior art, the circuit board provided by the technical solution, the first conductive line includes a first wire and a second wire covering the first wire, and the second wire is made of metal silver, and the resistivity of the metal silver is 1.64×10. -8 ohm meters, the resistivity of metallic copper is 1.77 × 10 -8 ohm meters, and the resistance of metallic silver is less than the resistivity of metallic copper. Therefore, when the alternating current of the predetermined frequency is passed through the first conductive line, the electrons are conducted in the second wire, and the first conductive line is made with respect to all of the copper, and the resistivity of the first conductive line is lowered. Moreover, since the thickness of the second wire is small, the amount of metal silver can be saved, and the production cost is reduced as compared with the case where the first conductive line is made entirely of metallic silver.
下面結合多個附圖及實施例對本技術方案提供之電路板及其製作方法作進一步說明。 The circuit board provided by the technical solution and the manufacturing method thereof will be further described below in conjunction with the various drawings and embodiments.
請一併參閱圖1及圖2，本技術方案第一實施例提供一種電路板100，電路板100包括第一絕緣層110、複數第一導電線路120與複數第二導電線路130。 Referring to FIG. 1 and FIG. 2 , the first embodiment of the present invention provides a circuit board 100 . The circuit board 100 includes a first insulating layer 110 , a plurality of first conductive lines 120 , and a plurality of second conductive lines 130 .
第一絕緣層110用於承載多條第一導電線路120與複數第二導電線路130。第一絕緣層110可由聚醯亞胺或者聚酯等材料製成。第一絕緣層110具有相對之第一表面111與第二表面112。複數第一導電線路120用於傳輸訊號，其形成於第一絕緣層110之第一表面111上。每一第一導電線路120包括第一導線121與覆蓋第一導線121之第二導線122。第一導線121採用金屬銅製作。本實施例中，第一導線121形狀與第一導電線路120之形狀相對應，其橫截面之形狀大致為長方形。第一導線121包括第一底面123、與第一底面123相對之第一頂面124、第一側面125及與第一側面125相對之第二側面126。第一側面125與第二側面126連接於第一底面123與第一頂面124之間。第一底面123與第一絕緣層110之第一表面111相接觸。 The first insulating layer 110 is configured to carry a plurality of first conductive lines 120 and a plurality of second conductive lines 130. The first insulating layer 110 may be made of a material such as polyimide or polyester. The first insulating layer 110 has a first surface 111 and a second surface 112 opposite to each other. The plurality of first conductive lines 120 are used to transmit signals formed on the first surface 111 of the first insulating layer 110. Each of the first conductive lines 120 includes a first wire 121 and a second wire 122 covering the first wire 121. The first wire 121 is made of metal copper. In this embodiment, the shape of the first wire 121 corresponds to the shape of the first conductive line 120, and the shape of the cross section is substantially rectangular. The first wire 121 includes a first bottom surface 123, a first top surface 124 opposite the first bottom surface 123, a first side surface 125, and a second side surface 126 opposite the first side surface 125. The first side surface 125 and the second side surface 126 are connected between the first bottom surface 123 and the first top surface 124. The first bottom surface 123 is in contact with the first surface 111 of the first insulating layer 110.
第二導線122採用金屬銀製成。第二導線122覆蓋第一導線121除與第一表面111接觸之表面其他表面，從而使得第二線路122亦與第一表面111接觸，第一線路121密封於第二線路122與第一絕緣層110之間。第二導線122大致呈“ㄇ”形，即倒“U”形，其具有相對之第一內表面127與第一外表面128。其中，第一內表面127與第一導線121之第一頂面124、第一側面125與第二側面126均相接觸。第二導線122之第一內表面127與第一外表面128相互平行，第一內表面127與第一外表面128之間之距離
定義為第二導線122之厚度。第二導線122之之厚度根據實際需要進行設定。具體如下：電路板中之導電線路於工作時，其中間通常流經有高頻率之電流，從而產生集膚效應。即電流或電壓以頻率較高之電子於導體中傳導時，會聚集於導體電線路之表層，而非平均分佈於整個導體之截面積中。頻率越高，集膚效應越顯著。集膚效應深度(δ)導體之電阻率(ρ)通有之交流電之角頻率(ω)相關。具體計算公式為：
其中，上述公式中之μ表示銅導體之絕對電磁率。對於確定之金屬銅而言，集膚深度與通過其之交流電之角頻率相關。本實施例中，第二導線122之厚度根據第一導電線路120中通過之交流電之角頻率進行確定，以使得第一導電線路120中通有該頻率之電流時，電子於第一頂面124、第一側面125與第二側面126上第二導線122中流動。由於角頻率與頻率之間可相互轉化。從而，根據第一導電線路120中通有之交流電之角頻率或者頻率與上述集膚深度之計算公式計算出之集膚深度即可設定為第二導線122之厚度。於第一導電線路120中通有之交流電之頻率為60赫茲時，集膚深度即第二導線之厚度設定為8.57毫米。當第一導電線路120通有之交流電之頻率為10000赫茲時，集膚深度為0.66毫米。當第一導電線路120通之交流電之頻率為1000萬赫茲時，集膚深度即第二導線之 厚度為21微米。 Wherein, μ in the above formula represents the absolute electromagnetic ratio of the copper conductor. For a defined metallic copper, the skin depth is related to the angular frequency of the alternating current passing therethrough. In this embodiment, the thickness of the second wire 122 is determined according to the angular frequency of the alternating current passing through the first conductive line 120, so that when the current of the frequency is passed through the first conductive line 120, the electron is on the first top surface 124. The first side 125 and the second side 126 flow in the second wire 122. Since the angular frequency and frequency can be converted to each other. Therefore, the skin depth calculated according to the angular frequency or frequency of the alternating current supplied in the first conductive line 120 and the calculation formula of the skin depth can be set as the thickness of the second wire 122. When the frequency of the alternating current passing through the first conductive line 120 is 60 Hz, the skin depth, that is, the thickness of the second wire is set to 8.57 mm. When the frequency of the alternating current supplied to the first conductive line 120 is 10,000 Hz, the skin depth is 0.66 mm. When the frequency of the alternating current of the first conductive line 120 is 10 million Hz, the skin depth is the second wire The thickness is 21 microns.
相鄰之第一導線121之間距應大於欲形成之第二導線122之厚度之兩倍，以確保形成之相鄰之兩第一導電線路120不相互接觸而發生短路。第一導線121之橫截面之形狀並不限於本實施例中說明之長方形，其亦可為半圓形或其他形狀。只要保證第二導線122覆蓋第一導線121除與第一表面111接觸之表面之其他表面即可。 The distance between the adjacent first wires 121 should be greater than twice the thickness of the second wires 122 to be formed to ensure that the adjacent two first conductive lines 120 are not in contact with each other to cause a short circuit. The shape of the cross section of the first wire 121 is not limited to the rectangular shape described in the embodiment, and may be semicircular or other shapes. It is only necessary to ensure that the second wire 122 covers the other surface of the first wire 121 except the surface in contact with the first surface 111.
複數第二導電線路130亦用於傳輸電訊號，其形成於第一絕緣層110之第二表面112上。每一第二導電線路130包括第三導線131與覆蓋第三導線131之第四導線132。第三導線131採用金屬銅製作。本實施例中，複數第三導線131之分佈形狀與第二導電線路130之形狀相對應，第三導線131橫截面之形狀大致為長方形。第三導線131包括相對之第二底面133、與第二底面133相對之第二頂面134、第三側面135及與第三側面135相對之第四側面136。第三側面135與第四側面136連接於第二底面133與第二頂面134之間。第二頂面134與第一絕緣層110之第二表面112相接觸。 The plurality of second conductive lines 130 are also used to transmit electrical signals formed on the second surface 112 of the first insulating layer 110. Each of the second conductive lines 130 includes a third wire 131 and a fourth wire 132 covering the third wire 131. The third wire 131 is made of metallic copper. In this embodiment, the distribution shape of the plurality of third wires 131 corresponds to the shape of the second conductive line 130, and the shape of the cross section of the third wire 131 is substantially rectangular. The third wire 131 includes a second bottom surface 133 opposite to the second bottom surface 133 opposite to the second bottom surface 133, a third side surface 135, and a fourth side surface 136 opposite to the third side surface 135. The third side 135 and the fourth side 136 are connected between the second bottom surface 133 and the second top surface 134. The second top surface 134 is in contact with the second surface 112 of the first insulating layer 110.
第四導線132採用金屬銀製成。第四導線132覆蓋第三導線131除與第二表面112接觸之其他表面，從而使得第四導線132亦與第二表面112接觸，第三導線131密封於第四導線132與第一絕緣層110之間。第四導線132大致呈“U”形，其具有相對之第二內表面137與第二外表面138。其中，第二內表面137與第三導線131之第二底面133、第三側面135與第四側面136均相接觸。第四導線132 之第二內表面137與第二外表面138之間之距離定義為第四導線132之厚度。第四導線132之厚度亦根據上述公式與通過之交流電之角頻率或者頻率進行設定。 The fourth wire 132 is made of metallic silver. The fourth wire 132 covers the other surface of the third wire 131 in contact with the second surface 112 such that the fourth wire 132 is also in contact with the second surface 112, and the third wire 131 is sealed to the fourth wire 132 and the first insulating layer 110. between. The fourth lead 132 is generally "U" shaped having an opposing second inner surface 137 and a second outer surface 138. The second inner surface 137 is in contact with the second bottom surface 133, the third side surface 135 and the fourth side surface 136 of the third wire 131. Fourth wire 132 The distance between the second inner surface 137 and the second outer surface 138 is defined as the thickness of the fourth wire 132. The thickness of the fourth wire 132 is also set according to the above formula and the angular frequency or frequency of the alternating current passed.
第二導線122與第四導線132之厚度亦可略大於於通有預定頻率交流電流之集膚深度。 The thickness of the second wire 122 and the fourth wire 132 may also be slightly larger than the skin depth of the alternating current with a predetermined frequency.
本實施例提供之電路板，第一導電線路120包括第一導線121與覆蓋第一導線121之第二導線122，並且第二導線122採用金屬銀製作，金屬銀之電阻率為1.64×10-8歐姆米，金屬銅之電阻率為1.77×10-8歐姆米，金屬銀之電阻小於金屬銅之電阻率，並且第二導線122之厚度與第一導電線路120於通有預定頻率之交流電時之集膚深度相等。從而，當第一導電線路120中通有上述預定頻率之交流電時，電子可於第二導線122中傳導，相對於全部採用銅製作第一導電線路，降低了第一導電線路120之電阻率。並且，由於第二導線122之厚度較小，可節省金屬銀之用量，相比於用全部用金屬銀製作第一導電線路，降低了生產成本。 In the circuit board provided in this embodiment, the first conductive line 120 includes a first conductive line 121 and a second conductive line 122 covering the first conductive line 121, and the second conductive line 122 is made of metallic silver, and the resistivity of the metallic silver is 1.64×10 − 8 ohm meters, the resistivity of the metal copper is 1.77×10 -8 ohm meters, the resistance of the metal silver is less than the resistivity of the metal copper, and the thickness of the second wire 122 and the first conductive line 120 are at an alternating current of a predetermined frequency. The skin depth is equal. Therefore, when the alternating current of the predetermined frequency is passed through the first conductive line 120, the electrons can be conducted in the second wire 122, and the first conductive line is made with respect to all of the copper, and the resistivity of the first conductive line 120 is lowered. Moreover, since the thickness of the second wire 122 is small, the amount of metallic silver can be saved, and the production cost is reduced as compared with the case where the first conductive wire is made entirely of metallic silver.
本實施例提供之電路板亦可為包括更多導電線路圖形與更多絕緣層之多層電路板。即可為由兩個或者兩個以上電路板100相互堆疊，並於相鄰之兩電路板100之間設置膠層之結構。 The circuit board provided in this embodiment may also be a multi-layer circuit board including more conductive line patterns and more insulating layers. That is, a structure in which two or more circuit boards 100 are stacked on each other and a glue layer is disposed between the adjacent two circuit boards 100.
本技術方案第二實施例以製作電路板100為例來說明一種電路板製作方法，所述電路板之製作方法包括如下步驟： 請參閱圖3，第一步，提供覆銅板10。 The second embodiment of the present technical solution is a circuit board 100 as an example to describe a method for fabricating a circuit board. The method for manufacturing the circuit board includes the following steps: Referring to FIG. 3, the first step is to provide a copper clad laminate 10.
本實施例中，覆銅板10為雙面覆銅板，即其包括第一銅箔層12、第二銅箔層13及位於第一銅箔層12與第二銅箔層13之間之第一絕緣層110。覆銅板10為經過裁切後之覆銅板10，其形狀與製作之電路板之形狀相對應。 In this embodiment, the copper clad laminate 10 is a double-sided copper clad laminate, that is, the first copper foil layer 12, the second copper foil layer 13, and the first between the first copper foil layer 12 and the second copper foil layer 13. Insulation layer 110. The copper clad laminate 10 is a cut copper clad laminate 10 having a shape corresponding to the shape of the fabricated circuit board.
當用於製作具有單面線路圖形之電路板時，覆銅板10為單面覆銅板，即其包括第一銅箔層12及第一絕緣層110。 When used to fabricate a circuit board having a single-sided wiring pattern, the copper clad laminate 10 is a single-sided copper clad laminate, that is, it includes a first copper foil layer 12 and a first insulating layer 110.
請一併參閱圖4，第二步，於第一銅箔層12內製作複數第一導線121，於第二銅箔層13內製作複數第三導線131。 Referring to FIG. 4 together, in the second step, a plurality of first wires 121 are formed in the first copper foil layer 12, and a plurality of third wires 131 are formed in the second copper foil layer 13.
於製作複數第一導線121與複數第三導線131之前，應根據電路板100中需要流經之交流電之頻率之大小，計算出第二導線122與第四導線132之厚度。以保證相鄰之第一導線121之間之距離應大於欲形成之第二導線122之厚度之兩倍，以防止後續形成第二導線122之後相鄰之第一導電線路120相互接觸而導致短路。同理，相鄰之第三導線131之間之距離應大於與形成之第四導線132之厚度之兩倍，以防止後續形成之第二導電線路130相互接觸而短路。 Before the plurality of first wires 121 and the plurality of third wires 131 are formed, the thicknesses of the second wires 122 and the fourth wires 132 should be calculated according to the frequency of the alternating current flowing through the circuit board 100. In order to ensure that the distance between the adjacent first wires 121 should be greater than twice the thickness of the second wires 122 to be formed, to prevent the adjacent first conductive lines 120 from contacting each other after the subsequent formation of the second wires 122, thereby causing a short circuit. . Similarly, the distance between the adjacent third wires 131 should be greater than twice the thickness of the formed fourth wires 132 to prevent the subsequently formed second conductive lines 130 from contacting each other and short-circuiting.
本實施例中，採用影像轉移工藝及蝕刻工藝製作複數第一導線121與多條第三導線131。具體為，首先，於第一銅箔層12與第二銅箔層13上分別形成光致抗蝕劑，然後對所述光致抗蝕劑進行曝光與顯影，使得與欲形成複數第一導線121相對應之區域光致抗蝕劑仍留於第一銅箔層12上，與欲形成多條第三導線131相對應之區域光致抗蝕 劑仍留於第二銅箔層13上。然後，對第一銅箔層12進行蝕刻，使得第一銅箔層12沒有光致抗蝕劑遮擋之部分被蝕刻去除，使得第一銅箔層12有光致抗蝕劑遮擋之部分沒有被蝕刻去除，從而得到複數第一導線121。並對第二銅箔層13進行蝕刻，使得第二銅箔層13沒有光致抗蝕劑遮擋之部分被蝕刻去除，使得第二銅箔層13有光致抗蝕劑遮擋之部分沒有被蝕刻去除，從而得到複數第三導線131。 In this embodiment, the plurality of first wires 121 and the plurality of third wires 131 are formed by using an image transfer process and an etching process. Specifically, first, a photoresist is formed on the first copper foil layer 12 and the second copper foil layer 13, and then the photoresist is exposed and developed to form a plurality of first wires. 121 corresponding area photoresist remains on the first copper foil layer 12, and the area corresponding to the plurality of third wires 131 is formed to be photoresist The agent remains on the second copper foil layer 13. Then, the first copper foil layer 12 is etched such that the portion of the first copper foil layer 12 that is not blocked by the photoresist is etched away, so that the portion of the first copper foil layer 12 that is blocked by the photoresist is not The etching is removed to obtain a plurality of first wires 121. The second copper foil layer 13 is etched such that the portion of the second copper foil layer 13 that is not blocked by the photoresist is etched away, so that the portion of the second copper foil layer 13 that is blocked by the photoresist is not etched. The removal is performed to obtain a plurality of third wires 131.
請一併參閱圖2與圖4，第三步，於每一第一導線121之表面上形成包覆該第一導線121之第二導線122，每一第一導線121與一第二導線122共同構成第一導電線路120，於每一第三導線131之表面上形成包覆第三導線131之第四導線132，每一第三導線131與一第四導線132共同構成第二導電線路130。 Referring to FIG. 2 and FIG. 4 together, in the third step, a second wire 122 covering the first wire 121 is formed on the surface of each first wire 121, and each of the first wire 121 and the second wire 122 is formed. The first conductive line 120 is formed on the surface of each of the third wires 131 to form a fourth wire 132 covering the third wire 131. Each of the third wires 131 and the fourth wire 132 together form a second conductive line 130. .
本實施例中，第二導線122與第四導線132藉由如下方式製作：首先，對第一絕緣層110、第一導線121與第三導線131進行預處理。即對第一絕緣層110、第一導線121與第三導線131依次進行脫脂、水洗、酸洗及水洗等處理，使得第一絕緣層110、第一導線121與第三導線131上黏附之髒污被去除。 In this embodiment, the second wire 122 and the fourth wire 132 are fabricated by first pretreating the first insulating layer 110, the first wire 121, and the third wire 131. That is, the first insulating layer 110, the first conductive line 121 and the third conductive line 131 are sequentially subjected to degreasing, water washing, pickling, water washing, etc., so that the first insulating layer 110, the first conductive line 121 and the third conductive line 131 adhere to the dirty The dirt is removed.
然後，對第一導線121與第三導線131之表面進行浸銀處理，以增加後續進行鍍銀時之附著度。 Then, the surfaces of the first wire 121 and the third wire 131 are immersed in silver to increase the adhesion of the subsequent silver plating.
本實施例中，採用之浸銀液中包括品質濃度為20克每升 之硝酸銀、質量濃度為220克每升之硫脲及濃度為0.1克每升之聚乙二醇。浸銀液之pH值為3至4。於常溫條件下，將第一導線121與第三導線131浸於上述浸銀液中持續0.5至1分鐘，使得浸銀液與第一導線121與第三導線131表面之銅發生反應，於第一導線121與第三導線131之表面形成一覆蓋第一導線121與第三導線131之含銀有機層。 In this embodiment, the immersion silver liquid used includes a mass concentration of 20 grams per liter. The silver nitrate has a mass concentration of 220 g per liter of thiourea and a concentration of 0.1 g per liter of polyethylene glycol. The pH of the immersion silver solution is 3 to 4. The first wire 121 and the third wire 131 are immersed in the immersion silver liquid for 0.5 to 1 minute under normal temperature conditions, so that the immersion silver liquid reacts with the copper of the surface of the first wire 121 and the third wire 131, A wire 121 and a surface of the third wire 131 form a silver-containing organic layer covering the first wire 121 and the third wire 131.
最後，於浸銀後第一導線121表面電鍍銀形成第二導線122，於浸銀後之第三導線131之表面電鍍形成第四導線132。 Finally, after the immersion silver, the surface of the first wire 121 is plated with silver to form a second wire 122, and the surface of the third wire 131 after immersion in silver is plated to form a fourth wire 132.
本實施例中，採用電鍍之方式形成第二導線122與第四導線132。進行電鍍時，採用之電鍍液中含有質量濃度為43克每升之亞硫酸銀(Ag2SO3)、質量濃度為440克每升之硫代硫酸鈉(Na2S2O3．5H2O)及質量含量為60克每升之電解質，如碳酸鉀或氫氧化鉀。為使得電鍍得到之銀具有較好之光澤度，於電鍍液中亦可加入光澤劑等。本實施例中，於進行電鍍銀時，電鍍液之pH值控制為8.5至9，反應溫度為20至35攝氏度，電鍍時電流密度為0.2至1安培每平方分米。採用之陽極為純度達於99.9%之銀板。電鍍之持續時間根據形成之第二導線122與第四導線132之厚度進行確定。 In this embodiment, the second wire 122 and the fourth wire 132 are formed by electroplating. When electroplating is carried out, the plating solution used contains 43 g of silver sulfite (Ag 2 SO 3 ) at a mass concentration of 440 g per liter of sodium thiosulfate (Na 2 S 2 O 3 .5H 2 ). O) and an electrolyte having a mass content of 60 grams per liter, such as potassium carbonate or potassium hydroxide. In order to make the silver obtained by electroplating have a good gloss, a brightener or the like may be added to the plating solution. In the present embodiment, when silver plating is performed, the pH of the plating solution is controlled to 8.5 to 9, the reaction temperature is 20 to 35 degrees Celsius, and the current density during plating is 0.2 to 1 ampere per square centimeter. The anode used was a silver plate with a purity of 99.9%. The duration of the plating is determined according to the thickness of the formed second wire 122 and fourth wire 132.
本實施例提供之電路板製作方法，能夠制得由銀層包覆之銅導線之導電線路，製得之電路板之導電線路中通有高頻率之交流電時，可減小導電線路之電阻，從而提升電路板之導電性能。 The circuit board manufacturing method provided in this embodiment can obtain the conductive line of the copper wire covered by the silver layer, and the resistance of the conductive line can be reduced when the high-frequency alternating current is passed through the conductive circuit of the obtained circuit board. Thereby improving the electrical conductivity of the board.
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
10‧‧‧覆銅板 10‧‧‧CCL
12‧‧‧第一銅箔層 12‧‧‧First copper foil layer
13‧‧‧第二銅箔層 13‧‧‧Second copper foil layer
100‧‧‧電路板 100‧‧‧ boards
110‧‧‧第一絕緣層 110‧‧‧First insulation
111‧‧‧第一表面 111‧‧‧ first surface
112‧‧‧第二表面 112‧‧‧ second surface
120‧‧‧第一導電線路 120‧‧‧First conductive line
121‧‧‧第一導線 121‧‧‧First wire
122‧‧‧第二導線 122‧‧‧Second wire
123‧‧‧第一底面 123‧‧‧ first bottom surface
124‧‧‧第一頂面 124‧‧‧First top surface
125‧‧‧第一側面 125‧‧‧ first side
126‧‧‧第二側面 126‧‧‧ second side
127‧‧‧第一內表面 127‧‧‧ first inner surface
128‧‧‧第一外表面 128‧‧‧First outer surface
130‧‧‧第二導電線路 130‧‧‧Second conductive line
131‧‧‧第三導線 131‧‧‧ Third wire
132‧‧‧第四導線 132‧‧‧fourth wire
133‧‧‧第二底面 133‧‧‧second bottom surface
134‧‧‧第二頂面 134‧‧‧second top surface
135‧‧‧第三側面 135‧‧‧ third side
136‧‧‧第四側面 136‧‧‧ fourth side
137‧‧‧第二內表面 137‧‧‧Second inner surface
138‧‧‧第二外表面 138‧‧‧Second outer surface
圖1係本技術方案第一實施例提供之電路板之示意圖。 1 is a schematic diagram of a circuit board provided by a first embodiment of the present technical solution.
圖2係圖1沿II-II線之剖面示意圖。 Figure 2 is a schematic cross-sectional view taken along line II-II of Figure 1.
圖3係本技術方案第二實施例提供之覆銅板之示意圖。 3 is a schematic view of a copper clad plate provided by a second embodiment of the present technical solution.
圖4係本技術方案第二實施例提供之覆銅板形成第一導線與第二導線之示意圖。 4 is a schematic view showing a first copper wire and a second wire formed by a copper clad plate provided by a second embodiment of the present technical solution.
100‧‧‧電路板 100‧‧‧ boards
110‧‧‧第一絕緣層 110‧‧‧First insulation
111‧‧‧第一表面 111‧‧‧ first surface
112‧‧‧第二表面 112‧‧‧ second surface
120‧‧‧第一導電線路 120‧‧‧First conductive line
121‧‧‧第一導線 121‧‧‧First wire
122‧‧‧第二導線 122‧‧‧Second wire
123‧‧‧第一底面 123‧‧‧ first bottom surface
124‧‧‧第一頂面 124‧‧‧First top surface
125‧‧‧第一側面 125‧‧‧ first side
126‧‧‧第二側面 126‧‧‧ second side
127‧‧‧第一內表面 127‧‧‧ first inner surface
128‧‧‧第一外表面 128‧‧‧First outer surface
130‧‧‧第二導電線路 130‧‧‧Second conductive line
131‧‧‧第三導線 131‧‧‧ Third wire
132‧‧‧第四導線 132‧‧‧fourth wire
133‧‧‧第二底面 133‧‧‧second bottom surface
134‧‧‧第二頂面 134‧‧‧second top surface
135‧‧‧第三側面 135‧‧‧ third side
136‧‧‧第四側面 136‧‧‧ fourth side
137‧‧‧第二內表面 137‧‧‧Second inner surface
138‧‧‧第二外表面 138‧‧‧Second outer surface
Claims (8)
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| TW99113524A TWI397353B (en) | 2010-04-28 | 2010-04-28 | Printed circuit board and method for manufacturing the same |
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| TW99113524A TWI397353B (en) | 2010-04-28 | 2010-04-28 | Printed circuit board and method for manufacturing the same |
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| TW201138568A TW201138568A (en) | 2011-11-01 |
| TWI397353B true TWI397353B (en) | 2013-05-21 |
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| TW200904319A (en) * | 2007-05-09 | 2009-01-16 | Toray Industries | Conductive substrate, the electromagnetic waves shielding substrate for plasma display and the manufacturing method of conductive substrate |
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| TW200904319A (en) * | 2007-05-09 | 2009-01-16 | Toray Industries | Conductive substrate, the electromagnetic waves shielding substrate for plasma display and the manufacturing method of conductive substrate |
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