TWI396432B - Image sensor module and method for manufacturing the same - Google Patents
Image sensor module and method for manufacturing the same Download PDFInfo
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本發明是有關於一種影像感測模組及其製作方法，且特別是有關於一種具有高結構強度的影像感測模組及其製作方法。The invention relates to an image sensing module and a manufacturing method thereof, and in particular to an image sensing module with high structural strength and a manufacturing method thereof.
隨著電子產品的模組微型化與低價化之趨勢，晶圓級模組(Wafer Level Module，WLM)技術之出現備受關注。晶圓級模組的技術主要是利用晶圓級的製造技術，而將電子產品的體積微型化並降低成本。其中，晶圓級模組的技術也可以應用於製作影像感測模組的鏡頭上，而使得鏡頭模組在體積上遠較傳統的鏡頭模組得以獲得縮減，進而可應用在電子裝置(如筆記型電腦、手機等)的相機模組上。With the trend of miniaturization and low price of electronic products, the emergence of Wafer Level Module (WLM) technology has attracted much attention. The technology of wafer level modules is mainly to use wafer level manufacturing technology to miniaturize the size of electronic products and reduce costs. Among them, the technology of the wafer level module can also be applied to the lens of the image sensing module, so that the lens module can be reduced in volume compared with the conventional lens module, and can be applied to electronic devices (such as On the camera module of a notebook computer, mobile phone, etc.).
圖1繪示習知一種採用晶圓級模組技術的影像感測模組的剖面圖。請參照圖1，習知的影像感測模組100具有一影像感測元件110、一分隔物120以及一透鏡元件130，其中分隔物120具有一通孔122，以使照射到透鏡元件130的光線可經由通孔122而照射到影像感測元件110。1 is a cross-sectional view of a conventional image sensing module using wafer level module technology. Referring to FIG. 1 , a conventional image sensing module 100 has an image sensing component 110 , a spacer 120 , and a lens component 130 . The spacer 120 has a through hole 122 for illuminating the lens component 130 . The image sensing element 110 can be illuminated via the via 122.
由於習知的影像感測元件110與分隔物120之間或是分隔物120與透鏡元件130之間的接合面積較小，因此，彼此之間容易有接著力不足的問題。也因此，在後續的加工製程或是搬運的過程中，容易因影像感測模組100受到撞擊而導致影像感測元件110與分隔物120(或是分隔物120與透鏡元件130)之間產生位移甚至是彼此分離，以致於降低影像感測模組100的成像品質或是損壞影像感測模組100。此外，習知的分隔物120通常是採用玻璃或是塑膠之類的透光材料，因此，在進行光學成像時，雜散光(flare)容易穿透分隔物120，以致於影像感測模組100在進行成像時雜訊的比例過大，從而降低成像品質。Since the joint area between the conventional image sensing element 110 and the spacer 120 or between the spacer 120 and the lens element 130 is small, there is a problem that the adhesion force is insufficient between each other. Therefore, during the subsequent processing or transportation process, the image sensing module 100 is easily damaged by the image sensing module 100 and the spacer 120 (or the spacer 120 and the lens component 130) is generated. The displacements are even separated from one another such that the imaging quality of the image sensing module 100 is reduced or the image sensing module 100 is damaged. In addition, the conventional separator 120 is usually made of a light-transmitting material such as glass or plastic. Therefore, when performing optical imaging, the flare easily penetrates the separator 120, so that the image sensing module 100 The proportion of noise is too large when imaging, which reduces the image quality.
本發明提供一種影像感測模組，具有較高的結構強度。The invention provides an image sensing module with high structural strength.
本發明提供一種影像感測模組的製作方法，可有效固定影像感測模組中的元件。The invention provides a method for manufacturing an image sensing module, which can effectively fix components in the image sensing module.
本發明提出一種影像感測模組，具有一集光區與一非集光區，影像感測模組包括一影像感測器、一第一遮光間隔物、一透鏡層以及一固定殼體。第一遮光間隔物配置於影像感測器上，並位於非集光區內，且第一遮光間隔物具有一第一通孔，第一通孔暴露出影像感測器之位於集光區中的部分。透鏡層配置於第一遮光間隔物上，並覆蓋第一通孔，透鏡層包括一透光基板與一第一透鏡，第一透鏡配置於透光基板上且位於集光區中。固定殼體連續性地包覆影像感測器、第一遮光間隔物與透鏡層的側壁，且固定殼體位於非集光區中，固定殼體的材質包括一熱固性材料。The present invention provides an image sensing module having a light collection area and a non-light collection area. The image sensing module includes an image sensor, a first light shielding spacer, a lens layer, and a fixed housing. The first light shielding spacer is disposed on the image sensor and located in the non-light collecting region, and the first light shielding spacer has a first through hole, and the first through hole exposes the image sensor in the light collecting region part. The lens layer is disposed on the first light shielding spacer and covers the first through hole. The lens layer includes a transparent substrate and a first lens. The first lens is disposed on the transparent substrate and located in the light collecting region. The fixed housing continuously covers the image sensor, the first light shielding spacer and the sidewall of the lens layer, and the fixed housing is located in the non-light collecting region, and the material of the fixing housing comprises a thermosetting material.
在本發明之一實施例中，固定殼體係共形地覆蓋影像感測器、第一遮光間隔物與透鏡層的側壁。In an embodiment of the invention, the fixed housing conformally covers the image sensor, the first light-shielding spacer and the sidewall of the lens layer.
在本發明之一實施例中，固定殼體為一單層結構或是一多層結構。In an embodiment of the invention, the fixed housing is a single layer structure or a multilayer structure.
在本發明之一實施例中，熱固性材料為一不透光材料。In one embodiment of the invention, the thermoset material is an opaque material.
在本發明之一實施例中，固定殼體包括一不透光材料層。In an embodiment of the invention, the stationary housing includes a layer of opaque material.
在本發明之一實施例中，固定殼體的厚度約大於10微米。In one embodiment of the invention, the fixed housing has a thickness greater than about 10 microns.
在本發明之一實施例中，透光基板具有相對的一第一表面與一第二表面，且第一表面朝向影像感測器，透鏡層更包括一第二透鏡，第一透鏡與第二透鏡分別配置於第一表面與第二表面上。In an embodiment of the invention, the transparent substrate has a first surface and a second surface, and the first surface faces the image sensor, and the lens layer further includes a second lens, the first lens and the second The lenses are disposed on the first surface and the second surface, respectively.
在本發明之一實施例中，第一透鏡為一凹透鏡或一凸透鏡。In an embodiment of the invention, the first lens is a concave lens or a convex lens.
在本發明之一實施例中，第一遮光間隔物的材質包括一不透光材料。In an embodiment of the invention, the material of the first light shielding spacer comprises an opaque material.
在本發明之一實施例中，影像感測模組更包括一第二遮光間隔物以及一透光蓋板，其中第二遮光間隔物配置於透光基板上，並位於非集光區中，且第二遮光間隔物具有一第二通孔，第二通孔暴露出透光基板之位於集光區中的部分，透光蓋板配置於第二遮光間隔物上，並覆蓋第二通孔，其中固定殼體更包覆第二遮光間隔物與透光蓋板的側壁。In an embodiment of the present invention, the image sensing module further includes a second light-shielding spacer and a transparent cover, wherein the second light-shielding spacer is disposed on the transparent substrate and located in the non-light-collecting region. The second light shielding spacer has a second through hole, the second through hole exposing a portion of the transparent substrate located in the light collecting region, and the transparent cover plate is disposed on the second light shielding spacer and covering the second through hole The fixed housing further covers the second light shielding spacer and the sidewall of the transparent cover.
在本發明之一實施例中，透光蓋板具有遠離透光基板的一第三表面，且固定殼體更覆蓋第三表面之位於非集光區的部分。In an embodiment of the invention, the transparent cover has a third surface away from the transparent substrate, and the fixed housing further covers a portion of the third surface that is not in the light collecting region.
在本發明之一實施例中，影像感測模組更包括一光圈結構，其配置於透光蓋板之遠離透光基板的一第三表面，且光圈結構具有一開口，開口暴露出透光基板之位於集光區的部分。In an embodiment of the present invention, the image sensing module further includes an aperture structure disposed on a third surface of the transparent cover plate remote from the transparent substrate, and the aperture structure has an opening, and the opening exposes the light transmission The portion of the substrate that is located in the collection region.
在本發明之一實施例中，影像感測模組更包括一黏著層，其配置於透光基板與第一遮光間隔物之間。In an embodiment of the invention, the image sensing module further includes an adhesive layer disposed between the transparent substrate and the first light shielding spacer.
本發明提出一種影像感測模組的製作方法如下所述，其中影像感測模組具有一集光區與一非集光區。首先，提供一影像感測器、一第一遮光間隔物以及一透鏡層。第一遮光間隔物配置於影像感測器上，並位於非集光區內，且第一遮光間隔物具有一第一通孔，第一通孔暴露出影像感測器之位於集光區中的部分，透鏡層配置於第一遮光間隔物上，並覆蓋第一通孔，透鏡層包括一透光基板與一第一透鏡，第一透鏡配置於透光基板上且位於集光區中。接著，於影像感測器、第一遮光間隔物與透鏡層的側壁上形成一固定殼體，且固定殼體位於非集光區中，固定殼體的材質包括一熱固性材料。The invention provides a method for fabricating an image sensing module as follows. The image sensing module has a collecting region and a non-collecting region. First, an image sensor, a first light-shielding spacer, and a lens layer are provided. The first light shielding spacer is disposed on the image sensor and located in the non-light collecting region, and the first light shielding spacer has a first through hole, and the first through hole exposes the image sensor in the light collecting region The lens layer is disposed on the first light-shielding spacer and covers the first through-hole. The lens layer includes a transparent substrate and a first lens. The first lens is disposed on the transparent substrate and located in the light collecting region. Then, a fixed housing is formed on the sidewalls of the image sensor, the first light shielding spacer and the lens layer, and the fixed housing is located in the non-light collecting region, and the material of the fixing housing comprises a thermosetting material.
在本發明之一實施例中，形成固定殼體的方法包括在影像感測器、第一遮光間隔物與透鏡層的側壁上噴塗熱固性材料，以及加熱固化熱固性材料。In one embodiment of the invention, a method of forming a fixed housing includes spraying a thermoset material over the sidewalls of the image sensor, the first light-shielding spacer and the lens layer, and heat curing the thermoset material.
在本發明之一實施例中，在噴塗熱固性材料時，熱固性材料係共形且連續地覆蓋影像感測器、第一遮光間隔物與透鏡層的側壁。In one embodiment of the invention, the thermosetting material conformally and continuously covers the image sensor, the first light-shielding spacer, and the sidewalls of the lens layer when the thermosetting material is sprayed.
在本發明之一實施例中，影像感測模組的製作方法更包括在噴塗熱固性材料之前，於透鏡層之遠離第一遮光間隔物的一表面上形成一保護層，且保護層至少位於集光區中，以及在噴塗熱固性材料之後，移除保護層。In an embodiment of the present invention, the method for fabricating the image sensing module further includes forming a protective layer on a surface of the lens layer away from the first light-shielding spacer before the thermosetting material is sprayed, and the protective layer is at least in the set In the light zone, and after spraying the thermoset material, the protective layer is removed.
在本發明之一實施例中，影像感測模組的製作方法更包括在形成固定殼體之前，提供一第二遮光間隔物以及一透光蓋板，其中第二遮光間隔物配置於透光基板上，並位於非集光區中，且第二遮光間隔物具有一第二通孔，第二通孔暴露出透光基板之位於集光區中的部分，透光蓋板配置於第二遮光間隔物上，並覆蓋第二通孔，其中，形成固定殼體的方法包括在影像感測器、第一遮光間隔物、透鏡層、第二遮光間隔物以及透光蓋板的側壁上噴塗熱固性材料。In an embodiment of the present invention, the method for fabricating the image sensing module further includes: providing a second light-shielding spacer and a transparent cover plate before forming the fixed housing, wherein the second light-shielding spacer is disposed in the light-transmitting On the substrate, and in the non-light collecting region, the second light shielding spacer has a second through hole, the second through hole exposes a portion of the transparent substrate located in the light collecting region, and the transparent cover plate is disposed in the second The light shielding spacer covers the second through hole, wherein the method of forming the fixed housing comprises spraying on the sidewalls of the image sensor, the first light shielding spacer, the lens layer, the second light shielding spacer and the transparent cover plate Thermoset material.
在本發明之一實施例中，形成固定殼體的方法包括於影像感測器、第一遮光間隔物與透鏡層的側壁上噴塗一不透光材料，以形成一不透光材料層，以及於影像感測器、第一遮光間隔物與透鏡層的側壁上噴塗熱固性材料，以形成一熱固性材料層，且熱固性材料層與不透光材料層重疊。In an embodiment of the invention, a method of forming a fixed housing includes spraying an opaque material on a sidewall of the image sensor, the first light-shielding spacer and the lens layer to form an opaque material layer, and A thermosetting material is sprayed on the sidewalls of the image sensor, the first light-shielding spacer and the lens layer to form a layer of thermosetting material, and the layer of thermosetting material overlaps with the layer of opaque material.
基於上述，由於本發明的固定殼體可有效地拘束固定其包覆的所有元件(如影像感測器、遮光間隔物、透鏡層與透光蓋板)，故可增加本發明之影像感測模組的結構強度，並可確保影像感測模組的成像品質。Based on the above, since the fixed case of the present invention can effectively restrain all the components of the cover (such as image sensor, light-shielding spacer, lens layer and transparent cover), the image sensing of the present invention can be increased. The structural strength of the module ensures the image quality of the image sensing module.
為讓本發明之上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
圖2A～圖2C繪示本發明一實施例之影像感測模組的製程剖面圖。圖3繪示本發明一實施例之影像感測模組的剖面圖。圖4繪示本發明另一實施例之影像感測模組的剖面圖。2A-2C are cross-sectional views showing processes of an image sensing module according to an embodiment of the invention. 3 is a cross-sectional view of an image sensing module in accordance with an embodiment of the present invention. 4 is a cross-sectional view of an image sensing module according to another embodiment of the present invention.
首先，請參照圖2A，提供一影像感測器210、一第一遮光間隔物220以及一透鏡層230，其中第一遮光間隔物220配置於影像感測器210上，第一遮光間隔物220的材質包括一不透光材料。第一遮光間隔物220具有一第一通孔222，第一通孔222可定義出一集光區A1，而第一遮光間隔物220配置於圍繞集光區A1的一非集光區A2中。第一通孔222暴露出影像感測器210之位於集光區A1中的部分。First, an image sensor 210, a first light-shielding spacer 220, and a lens layer 230 are disposed. The first light-shielding spacer 220 is disposed on the image sensor 210, and the first light-shielding spacer 220 is disposed. The material includes an opaque material. The first light-shielding spacer 220 has a first through hole 222. The first through hole 222 defines a light collecting area A1, and the first light blocking space 220 is disposed in a non-light collecting area A2 surrounding the light collecting area A1. . The first through hole 222 exposes a portion of the image sensor 210 located in the light collecting area A1.
透鏡層230配置於第一遮光間隔物220上，並覆蓋第一通孔222。在本實施例中，透鏡層230包括一透光基板232、一第一透鏡234與一第二透鏡236。透光基板232具有相對的一第一表面232a與一第二表面232b，且第一表面232a朝向影像感測器210。第一透鏡234與第二透鏡236分別配置於第一表面232a與第二表面232b上且位於集光區A1中。The lens layer 230 is disposed on the first light shielding spacer 220 and covers the first through hole 222 . In the embodiment, the lens layer 230 includes a transparent substrate 232, a first lens 234 and a second lens 236. The transparent substrate 232 has a first surface 232a and a second surface 232b opposite to each other, and the first surface 232a faces the image sensor 210. The first lens 234 and the second lens 236 are respectively disposed on the first surface 232a and the second surface 232b and located in the light collecting area A1.
在其他未繪示的實施例中，可視實際的需求而使透鏡層230的數量為單層或是多層，且各透鏡層230可以僅具有第一透鏡234或第二透鏡236，也可以同時具有第一透鏡234與第二透鏡236。各透鏡層230的第一透鏡234或第二透鏡236的數量可為一個或多個。In other embodiments, the number of the lens layers 230 may be a single layer or multiple layers, and each lens layer 230 may have only the first lens 234 or the second lens 236, or may have both The first lens 234 and the second lens 236. The number of the first lens 234 or the second lens 236 of each lens layer 230 may be one or more.
在本實施例中，第一透鏡234與第二透鏡236為凸透鏡，在其他實施例中，第一透鏡234與第二透鏡236至少其中之一可為凹透鏡。In this embodiment, the first lens 234 and the second lens 236 are convex lenses. In other embodiments, at least one of the first lens 234 and the second lens 236 may be a concave lens.
在本實施例中，為保護第二透鏡236免於受到外力撞擊或刮傷，可選擇性地提供一第二遮光間隔物240以及一透光蓋板250。第二遮光間隔物240配置於透光基板232上，並位於非集光區A2中，且第二遮光間隔物240具有一第二通孔242，第二通孔242暴露出透鏡層230之位於集光區A1中的部分。透光蓋板250配置於第二遮光間隔物240上，並覆蓋第二通孔242。In this embodiment, in order to protect the second lens 236 from external impact or scratch, a second light-shielding spacer 240 and a transparent cover 250 may be selectively provided. The second light shielding spacer 240 is disposed on the transparent substrate 232 and located in the non-light collecting area A2, and the second light shielding spacer 240 has a second through hole 242, and the second through hole 242 exposes the lens layer 230. A portion of the collection area A1. The transparent cover plate 250 is disposed on the second light shielding spacer 240 and covers the second through hole 242 .
此外，在本實施例中，為使透光基板232與第一遮光間隔物220可更加穩固地接合，可在透光基板232與第一遮光間隔物220之間配置一黏著層D1。同理，可在透光基板232與第二遮光間隔物240之間配置一黏著層D2，可在第二遮光間隔物240與透光蓋板250之間配置一黏著層D3，可在第一遮光間隔物220與影像感測器210之間配置一黏著層D4。黏著層D1、D2、D3、D4可為雙面膠或是紫外線固化膠等黏著性良好的膠體。In addition, in the embodiment, in order to make the transparent substrate 232 and the first light-shielding spacer 220 more stably joined, an adhesive layer D1 may be disposed between the transparent substrate 232 and the first light-shielding spacer 220. Similarly, an adhesive layer D2 can be disposed between the transparent substrate 232 and the second light-shielding spacer 240, and an adhesive layer D3 can be disposed between the second light-shielding spacer 240 and the transparent cover 250. An adhesive layer D4 is disposed between the light shielding spacer 220 and the image sensor 210. The adhesive layers D1, D2, D3, and D4 may be adhesives having good adhesion such as double-sided tape or ultraviolet-curable adhesive.
接著，在本實施例中，可於透光蓋板250之遠離第二遮光間隔物240的一表面252上以及影像感測器210之遠離第一遮光間隔物220的一表面212上分別形成二保護層262、264。Then, in the embodiment, a surface 252 of the transparent cover 250 away from the second light-shielding spacer 240 and a surface 212 of the image sensor 210 remote from the first light-shielding spacer 220 are respectively formed. Protective layers 262, 264.
之後，請參照圖2B，於影像感測器210、第一遮光間隔物220、透鏡層230、第二遮光間隔物240與透光蓋板250的側壁S上形成一固定殼體270，且固定殼體270位於非集光區A2中，固定殼體270的材質包括熱固性材料。在本實施例中，固定殼體270的厚度T約大於10微米(例如40～50微米)。固定殼體270的材質例如為可耐高溫(250℃以上)的材料。Then, referring to FIG. 2B, a fixed housing 270 is formed on the sidewall S of the image sensor 210, the first light-shielding spacer 220, the lens layer 230, the second light-shielding spacer 240, and the transparent cover 250, and is fixed. The housing 270 is located in the non-light collecting area A2, and the material of the fixed housing 270 includes a thermosetting material. In the present embodiment, the fixed housing 270 has a thickness T greater than about 10 microns (e.g., 40 to 50 microns). The material of the fixed case 270 is, for example, a material that can withstand high temperatures (250 ° C or higher).
然後，請參照圖2C，移除保護層262、264，以移除固定殼體270之位於保護層262、264上的部分，此時，已初步形成本實施例之影像感測模組200。此外，可選擇性地在影像感測器210的表面212上形成多個導電凸塊B，以使影像感測器210可藉由導電凸塊B而電性連接至其他的電子元件(例如線路板)。Then, referring to FIG. 2C, the protective layers 262, 264 are removed to remove the portions of the fixed housing 270 on the protective layers 262, 264. At this time, the image sensing module 200 of the present embodiment has been initially formed. In addition, a plurality of conductive bumps B can be selectively formed on the surface 212 of the image sensor 210 so that the image sensor 210 can be electrically connected to other electronic components (eg, lines by the conductive bumps B). board).
詳細而言，形成固定殼體270的方法例如為在影像感測器210、第一遮光間隔物220與透鏡層230、第二遮光間隔物240與透光蓋板250的側壁S上噴塗熱固性材料，之後，加熱固化熱固性材料。In detail, the method of forming the fixed housing 270 is, for example, spraying the thermosetting material on the image sensor 210, the first light-shielding spacer 220 and the lens layer 230, the second light-shielding spacer 240, and the sidewall S of the transparent cover 250. After that, the thermosetting material is cured by heating.
在噴塗熱固性材料時，熱固性材料係共形且連續地覆蓋影像感測器210、第一遮光間隔物220與透鏡層230、第二遮光間隔物240與透光蓋板250的側壁S以及影像感測器210之朝向第一遮光間隔物220的一表面214。When the thermosetting material is sprayed, the thermosetting material conformally and continuously covers the image sensor 210, the first light-shielding spacer 220 and the lens layer 230, the second light-shielding spacer 240 and the side wall S of the transparent cover 250, and the image sense. The surface of the detector 210 facing the first light-shielding spacer 220 is 214.
在加熱固化熱固性材料之後，固化的熱固性材料可有效地拘束固定其包覆的所有元件(影像感測器210、第一遮光間隔物220、透鏡層230、第二遮光間隔物240與透光蓋板250)而避免這些元件移位，進而增加本實施例之影像感測模組200的結構強度，並可確保影像感測模組200的成像品質。詳細而言，固定殼體270可抵抗施加在影像感測模組200上的側向力以及垂直拉力，故可確保固定殼體270所包覆的元件皆可穩固地接合。After heating and curing the thermosetting material, the cured thermosetting material can effectively restrain all the components of the coating (image sensor 210, first light-shielding spacer 220, lens layer 230, second light-shielding spacer 240, and transparent cover) The plate 250) avoids the displacement of these components, thereby increasing the structural strength of the image sensing module 200 of the present embodiment, and ensuring the image quality of the image sensing module 200. In detail, the fixed housing 270 can resist the lateral force and the vertical pulling force applied to the image sensing module 200, thereby ensuring that the components covered by the fixed housing 270 can be firmly engaged.
再者，由於本實施例之固定殼體270係直接形成在影像感測器210、第一遮光間隔物220、透鏡層230、第二遮光間隔物240與透光蓋板250的側壁S上，因此，無論前述元件(影像感測器210、第一遮光間隔物220與透鏡層230、第二遮光間隔物240與透光蓋板250)的外型為何，固定殼體270皆可有效地包覆前述元件。Furthermore, the fixed housing 270 of the present embodiment is directly formed on the sidewall S of the image sensor 210, the first light-shielding spacer 220, the lens layer 230, the second light-shielding spacer 240, and the transparent cover 250. Therefore, regardless of the appearance of the aforementioned components (the image sensor 210, the first light-shielding spacer 220 and the lens layer 230, the second light-shielding spacer 240, and the transparent cover 250), the fixed housing 270 can be effectively packaged. Over the aforementioned components.
另外，在本實施例中，固定殼體270可為一不透光材料層，因此，固定殼體270可有效遮蔽外界環境的光線，以避免雜散光的問題產生，進而提升影像感測模組200的成像品質。在本實施例中，熱固性材料可為一不透光材料。In addition, in the embodiment, the fixed housing 270 can be an opaque material layer. Therefore, the fixed housing 270 can effectively shield the external environment from light, thereby avoiding the problem of stray light, thereby improving the image sensing module. 200 image quality. In this embodiment, the thermosetting material may be an opaque material.
此外，由於本實施例之固定殼體270可耐高溫(250℃以上)，因此，本實施例之影像感測模組200可過錫爐而與其他的電子元件(如線路板)電性連接。In addition, since the fixed housing 270 of the embodiment can withstand high temperatures (above 250 ° C), the image sensing module 200 of the embodiment can be electrically connected to other electronic components (such as a circuit board) through a tin furnace. .
此外，為防止雜散光進入第二通孔242中，可在透光蓋板250的表面252上配置一光圈結構290，且光圈結構290具有一開口292，開口292暴露出透鏡層230之位於集光區A1的部分。In addition, in order to prevent stray light from entering the second through hole 242, an aperture structure 290 may be disposed on the surface 252 of the transparent cover plate 250, and the aperture structure 290 has an opening 292 exposing the lens layer 230 in the set. Part of the light zone A1.
在另一實施例中，保護層(未繪示)可暴露出透光蓋板250的部分表面252，因此，當移除保護層之後，固定殼體270可覆蓋部分表面252(如圖3所示)。如此一來，固定殼體270可藉由遮蔽部分透光蓋板250來阻擋雜散光進入第二通孔242中，而且，固定殼體270可藉由其覆蓋表面252的部分而更加穩固地固定透光蓋板250。In another embodiment, a protective layer (not shown) may expose a portion of the surface 252 of the transparent cover 250. Therefore, after the protective layer is removed, the fixed housing 270 may cover a portion of the surface 252 (as shown in FIG. 3). Show). In this way, the fixed housing 270 can block the stray light from entering the second through hole 242 by shielding the partial transparent cover plate 250, and the fixed housing 270 can be more firmly fixed by covering the portion of the surface 252. Light transmissive cover plate 250.
在又一實施例中，形成固定殼體270的方法可以是先在影像感測器210、第一遮光間隔物220、透鏡層230、第二遮光間隔物240與透光蓋板250的側壁S上噴塗一不透光材料，以形成一不透光材料層272(如圖4所示)。之後，在不透光材料層272上噴塗熱固性材料，以形成一熱固性材料層274，然後，加熱固化熱固性材料層274。換言之，本實施例之固定殼體270為一多層結構。在其他實施例中，亦可以是先形成熱固性材料層274，之後再形成不透光材料層272。In another embodiment, the method of forming the fixed housing 270 may be first in the image sensor 210, the first light-shielding spacer 220, the lens layer 230, the second light-shielding spacer 240, and the sidewall S of the transparent cover plate 250. An opaque material is sprayed thereon to form an opaque material layer 272 (shown in Figure 4). Thereafter, a thermosetting material is sprayed on the opaque material layer 272 to form a thermosetting material layer 274, and then the thermosetting material layer 274 is heated and cured. In other words, the fixed housing 270 of the present embodiment has a multi-layered structure. In other embodiments, the thermosetting material layer 274 may be formed first, and then the opaque material layer 272 may be formed.
當然，本發明並不限定固定殼體270只能具有不透光材料層272以及熱固性材料層274，舉例來說，固定殼體270可依實際需求而具有多層彼此顏色不同的材料層、多層彼此材質不同的材料層或是多層彼此強度不同的材料層。Of course, the present invention does not limit that the fixed housing 270 can only have the opaque material layer 272 and the thermosetting material layer 274. For example, the fixed housing 270 can have multiple layers of different color materials and multiple layers of each other according to actual needs. A layer of material with different materials or a layer of material with different strengths from each other.
綜上所述，由於本發明的固定殼體可有效地拘束固定其包覆的所有元件(如影像感測器、遮光間隔物、透鏡層與透光蓋板)，故可增加本發明之影像感測模組的結構強度，並可確保影像感測模組的成像品質。此外，由於本發明的固定殼體係直接形成在影像感測器、遮光間隔物、透鏡層與透光蓋板等元件的側壁上，因此，無論前述元件的外型為何，本發明的固定殼體皆可有效地包覆前述元件。再者，由於本發明的固定殼體可阻擋光線，因此，固定殼體可避免雜散光進入影像感測模組中，進而提升影像感測模組的成像品質。In summary, since the fixed casing of the present invention can effectively restrain all the components (such as image sensors, light-shielding spacers, lens layers and transparent cover plates) that are covered by the present invention, the image of the present invention can be increased. Sensing the structural strength of the module and ensuring the imaging quality of the image sensing module. In addition, since the fixed casing of the present invention is directly formed on the side walls of the image sensor, the light shielding spacer, the lens layer, and the transparent cover, etc., the fixed casing of the present invention regardless of the shape of the foregoing components Both of the above components can be effectively coated. Moreover, since the fixed casing of the present invention can block light, the fixed casing can prevent stray light from entering the image sensing module, thereby improving the imaging quality of the image sensing module.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
100、200．．．影像感測模組100, 200. . . Image sensing module
110．．．影像感測元件110. . . Image sensing component
120．．．分隔物120. . . Separator
122．．．通孔122. . . Through hole
130．．．透鏡元件130. . . Lens element
210‧‧‧影像感測器210‧‧‧Image Sensor
212、214、252‧‧‧表面212, 214, 252‧‧‧ surface
220‧‧‧第一遮光間隔物220‧‧‧First light-shielding spacer
222‧‧‧第一通孔222‧‧‧ first through hole
222a‧‧‧內壁222a‧‧‧ inner wall
230‧‧‧透鏡層230‧‧‧ lens layer
232‧‧‧透光基板232‧‧‧Transparent substrate
232a‧‧‧第一表面232a‧‧‧ first surface
232b‧‧‧第二表面232b‧‧‧second surface
234‧‧‧第一透鏡234‧‧‧First lens
236‧‧‧第二透鏡236‧‧‧second lens
240‧‧‧第二遮光間隔物240‧‧‧Second shade spacer
242‧‧‧第二通孔242‧‧‧Second through hole
250‧‧‧透光蓋板250‧‧‧Transparent cover
262、264‧‧‧保護層262, 264‧‧ ‧ protective layer
270‧‧‧固定殼體270‧‧‧Fixed housing
272‧‧‧不透光材料層272‧‧‧ opaque material layer
274‧‧‧熱固性材料層274‧‧‧The layer of thermosetting material
290‧‧‧光圈結構290‧‧‧ aperture structure
292‧‧‧開口292‧‧‧ openings
A1‧‧‧集光區A1‧‧‧Light collection area
A2‧‧‧非集光區A2‧‧‧ Non-light collection area
B‧‧‧導電凸塊B‧‧‧conductive bumps
D1、D2、D3、D4‧‧‧黏著層D1, D2, D3, D4‧‧‧ adhesive layer
S‧‧‧側壁S‧‧‧ side wall
T‧‧‧厚度T‧‧‧ thickness
圖1繪示習知一種採用晶圓級模組技術的影像感測模組的剖面圖。1 is a cross-sectional view of a conventional image sensing module using wafer level module technology.
圖2A～圖2C繪示本發明一實施例之影像感測模組的製程剖面圖。2A-2C are cross-sectional views showing processes of an image sensing module according to an embodiment of the invention.
圖3繪示本發明一實施例之影像感測模組的剖面圖。3 is a cross-sectional view of an image sensing module in accordance with an embodiment of the present invention.
圖4繪示本發明另一實施例之影像感測模組的剖面圖。4 is a cross-sectional view of an image sensing module according to another embodiment of the present invention.
200．．．影像感測模組200. . . Image sensing module
210．．．影像感測器210. . . Image sensor
212、214、252．．．表面212, 214, 252. . . surface
220．．．第一遮光間隔物220. . . First light shielding spacer
222．．．第一通孔222. . . First through hole
222a．．．內壁222a. . . Inner wall
230．．．透鏡層230. . . Lens layer
232．．．透光基板232. . . Light transmissive substrate
240．．．第二遮光間隔物240. . . Second light shielding spacer
242．．．第二通孔242. . . Second through hole
250．．．透光蓋板250. . . Transparent cover
270．．．固定殼體270. . . Fixed housing
290．．．光圈結構290. . . Aperture structure
292．．．開口292. . . Opening
A1．．．集光區A1. . . Light collection area
A2．．．非集光區A2. . . Non-collecting zone
B．．．導電凸塊B. . . Conductive bump
S．．．側壁S. . . Side wall
Claims (4)
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| TW99111957A TWI396432B (en) | 2010-04-16 | 2010-04-16 | Image sensor module and method for manufacturing the same |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200601823A (en) * | 2004-05-31 | 2006-01-01 | Canon Kk | Imaging device and electronic apparatus |
| US7227236B1 (en) * | 2005-04-26 | 2007-06-05 | Amkor Technology, Inc. | Image sensor package and its manufacturing method |
| US20090095893A1 (en) * | 2007-07-02 | 2009-04-16 | Avi Strum | Imager module packaging |
| US20100053318A1 (en) * | 2008-08-28 | 2010-03-04 | Hironori Sasaki | Camera module and method of producing the same |
| US20100128350A1 (en) * | 2008-11-25 | 2010-05-27 | Stmicroelectronics (Research & Development) Limited | Imaging assembly |
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2010
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200601823A (en) * | 2004-05-31 | 2006-01-01 | Canon Kk | Imaging device and electronic apparatus |
| US7227236B1 (en) * | 2005-04-26 | 2007-06-05 | Amkor Technology, Inc. | Image sensor package and its manufacturing method |
| US20090095893A1 (en) * | 2007-07-02 | 2009-04-16 | Avi Strum | Imager module packaging |
| US20100053318A1 (en) * | 2008-08-28 | 2010-03-04 | Hironori Sasaki | Camera module and method of producing the same |
| US20100128350A1 (en) * | 2008-11-25 | 2010-05-27 | Stmicroelectronics (Research & Development) Limited | Imaging assembly |
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