TWI383734B - Fixing mechanism for fixing a heat-dissipating device and related thermal module - Google Patents
Fixing mechanism for fixing a heat-dissipating device and related thermal module Download PDFInfo
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- TWI383734B TWI383734B TW099110934A TW99110934A TWI383734B TW I383734 B TWI383734 B TW I383734B TW 099110934 A TW099110934 A TW 099110934A TW 99110934 A TW99110934 A TW 99110934A TW I383734 B TWI383734 B TW I383734B
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
- F04D25/02—Units comprising pumps and their driving means
- F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D25/0606—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump
- F04D25/0613—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump the electric motor being of the inside-out type, i.e. the rotor is arranged radially outside a central stator
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/60—Mounting; Assembling; Disassembling
- F04D29/601—Mounting; Assembling; Disassembling specially adapted for elastic fluid pumps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
本發明係有關於一種用來固定散熱裝置之固定機構，尤指一種用來避免散熱裝置因其所產生之震動而脫離初始位置的固定機構及其相關散熱模組。The invention relates to a fixing mechanism for fixing a heat dissipating device, in particular to a fixing mechanism for preventing the heat dissipating device from coming off the initial position due to the vibration generated by the heat dissipating device and the related heat dissipating module.
在一般的電腦裝置中，由於受限於內部機構空間不足與電腦外型大小之結構限制，電腦裝置內部之電子元件通常以較簡易之方式固定於基座上以節省成本與提高組裝效率。舉例來說，傳統散熱模組的風扇固定方式係利用螺絲將風扇直接鎖附於散熱鰭片組上。螺絲之尺寸略大於兩相鄰散熱鰭片間之距離，螺絲旋入兩相鄰散熱鰭片間時藉由散熱鰭片之表面粗糙度以將風扇固定於散熱鰭片組上。然而，風扇的震動會經由螺絲傳遞至散熱鰭片組，在長期運轉下螺絲與散熱鰭片之間的鎖附力會衰退，舉例來說，螺絲的螺牙會因震動而崩壞，或散熱鰭片組上之螺紋會因震動而磨損，使得風扇無法持續穩固設置於散熱鰭片組上，而會沿著散熱鰭片組之鰭片排列方向相對於散熱鰭片組移動。故如何設計出具有較佳定位效果，易於組裝，且成本低廉之一散熱裝置固定機構即為機構設計產業所需努力之重要課題。In a typical computer device, the electronic components inside the computer device are usually fixed to the pedestal in a relatively simple manner due to the limitation of the internal mechanism space and the structural limitation of the size of the computer, thereby saving cost and improving assembly efficiency. For example, the fan fixing method of the conventional heat dissipation module uses a screw to directly lock the fan to the heat dissipation fin set. The size of the screw is slightly larger than the distance between two adjacent heat radiating fins. When the screw is screwed between two adjacent heat radiating fins, the surface roughness of the heat radiating fin is used to fix the fan on the heat radiating fin group. However, the vibration of the fan is transmitted to the heat sink fin group via the screw, and the locking force between the screw and the heat sink fin may be degraded under long-term operation. For example, the screw thread may collapse due to vibration, or heat dissipation. The threads on the fin set wear due to vibration, so that the fan cannot be stably placed on the heat sink fin set, and moves along the fin arrangement of the heat sink fin group relative to the heat sink fin set. Therefore, how to design a fixing device with better positioning effect, easy assembly, and low cost is an important task for the design industry.
本發明係提供一種用來避免散熱裝置因其所產生之震動而脫離初始位置的固定機構及其相關散熱模組，以解決上述之問題。The present invention provides a fixing mechanism for preventing the heat sink from coming off the initial position due to the vibration generated by the heat sink and its associated heat dissipating module to solve the above problems.
本發明之申請專利範圍係揭露一種用來固定一散熱裝置之固定機構，其包含有複數個散熱鰭片，其上係形成有一溝槽，以及一定位裝置，其係設置於該複數個散熱鰭片上。該定位裝置包含有一支撐部，其一第一側係用來支撐該散熱裝置，一第一限位部，其係連接於該支撐部之一第二側且卡合於該溝槽內，以避免該支撐部沿著一第一方向相對於該複數個散熱鰭片移動，以及一第二限位部，其係連接於該支撐部之該第二側且止抵於該複數個散熱鰭片，以避免該支撐部沿著相異於該第一方向之一第二方向相對於該複數個散熱鰭片移動。The invention claims a fixing mechanism for fixing a heat dissipating device, which comprises a plurality of heat dissipating fins, a groove is formed thereon, and a positioning device is disposed on the plurality of heat dissipating fins. Chip. The positioning device includes a supporting portion, a first side thereof is used for supporting the heat dissipating device, and a first limiting portion is connected to the second side of the supporting portion and is engaged in the groove to Preventing the support portion from moving relative to the plurality of heat dissipation fins along a first direction, and a second limiting portion connected to the second side of the support portion and stopping against the plurality of heat dissipation fins In order to prevent the support portion from moving relative to the plurality of heat dissipation fins in a second direction different from the first direction.
本發明之申請專利範圍另揭露該支撐部之該第一側上係形成有一定位孔，該固定機構另包含有一定位元件，其係穿設於該散熱裝置且固定於該定位孔，藉以固定該散熱裝置於該支撐部上。The invention further discloses that the first side of the supporting portion is formed with a positioning hole, and the fixing mechanism further comprises a positioning component which is disposed through the heat dissipating device and is fixed to the positioning hole, thereby fixing the fixing hole The heat sink is on the support portion.
本發明之申請專利範圍另揭露該第一限位部之厚度實質上係相同於該溝槽之寬度，藉以將該定位裝置緊密固定於該複數個散熱鰭片上。The scope of the invention further discloses that the thickness of the first limiting portion is substantially the same as the width of the groove, so that the positioning device is tightly fixed on the plurality of heat dissipation fins.
本發明之申請專利範圍另揭露該第一限位部係包含有一導角結構，其係用來引導該第一限位部卡合於該溝槽內。According to the patent application of the present invention, the first limiting portion includes a guiding structure for guiding the first limiting portion to be engaged in the groove.
本發明之申請專利範圍另揭露該導角結構係實質上介於3度至5度之間。The scope of the patent application of the present invention further discloses that the lead angle structure is substantially between 3 and 5 degrees.
本發明之申請專利範圍另揭露該定位裝置係由彈性材質所組成。The scope of the patent application of the present invention further discloses that the positioning device is composed of an elastic material.
本發明之申請專利範圍另揭露該定位裝置係安裝於該散熱裝置與該複數個散熱鰭片之間，以使該散熱裝置與該複數個散熱鰭片間保持一間距。The scope of the present invention further discloses that the positioning device is installed between the heat dissipation device and the plurality of heat dissipation fins to maintain a distance between the heat dissipation device and the plurality of heat dissipation fins.
本發明之申請專利範圍另揭露該第二限位部包含有兩側牆，其係分別止抵於該複數個散熱鰭片之兩散熱鰭片之外側。According to the patent application of the present invention, the second limiting portion includes two side walls respectively blocking the outer sides of the two heat dissipating fins of the plurality of heat dissipating fins.
本發明之申請專利範圍另揭露該第二限位部係為一側牆，其係被夾持於該複數個散熱鰭片之兩散熱鰭片之間。According to the patent application of the present invention, the second limiting portion is a side wall that is sandwiched between the two heat dissipating fins of the plurality of heat dissipating fins.
本發明之申請專利範圍另揭露一種散熱模組，其包含有一散熱裝置，以及一固定機構，其係用來固定該散熱裝置。該固定機構包含有複數個散熱鰭片，其上係形成有一溝槽，以及一定位裝置，其係設置於該複數個散熱鰭片上。該定位裝置包含有一支撐部，其一第一側係用來支撐該散熱裝置，一第一限位部，其係連接於該支撐部之一第二側且卡合於該溝槽內，以避免該支撐部沿著一第一方向相對於該複數個散熱鰭片移動，以及一第二限位部，其係連接於該支撐部之該第二側且止抵於該複數個散熱鰭片，以避免該支撐部沿著相異於該第一方向之一第二方向相對於該複數個散熱鰭片移動。The patent application scope of the present invention further discloses a heat dissipation module including a heat dissipation device and a fixing mechanism for fixing the heat dissipation device. The fixing mechanism comprises a plurality of heat dissipating fins, a groove is formed thereon, and a positioning device is disposed on the plurality of heat dissipating fins. The positioning device includes a supporting portion, a first side thereof is used for supporting the heat dissipating device, and a first limiting portion is connected to the second side of the supporting portion and is engaged in the groove to Preventing the support portion from moving relative to the plurality of heat dissipation fins along a first direction, and a second limiting portion connected to the second side of the support portion and stopping against the plurality of heat dissipation fins In order to prevent the support portion from moving relative to the plurality of heat dissipation fins in a second direction different from the first direction.
請參閱第1圖與第2圖，第1圖為本發明較佳實施例一散熱模組10之元件***示意圖，第2圖為本發明較佳實施例散熱模組10之組立圖。散熱模組10係可應用於電腦系統內部，藉以散除電子元件所產生之熱量，散熱模組10包含有一散熱裝置12，其係可為一風扇裝置，如軸流式風扇或離心式風扇等，以及一固定機構14，其係用來將散熱裝置12固定於一預設位置，以使散熱裝置12可穩定且高效率地進行散熱。固定機構14包含有複數個散熱鰭片16，其上係形成有至少一溝槽161，以及至少一定位裝置18，其係設置於複數個散熱鰭片16上。其中固定機構14另可包含有至少一定位元件20，其係用來將散熱裝置12安裝於定位裝置18上，以使散熱裝置12可固定於複數個散熱鰭片16上，其中定位元件20係可為一鎖固元件，如螺絲等。如第2圖所示，溝槽161可形成於複數個散熱鰭片16上之任意位置，意即使用者可選擇性地將定位裝置18安裝於任意的溝槽161上，以使散熱裝置12可於任意角度安裝於複數個散熱鰭片16上。舉例來說，如第2圖所示，散熱裝置12之四側邊係未對齊複數個散熱鰭片16之四側邊，然散熱裝置12與複數個散熱鰭片16之相對位置關係可不限於上述實施例所述，端視設計需求而定。此外，定位裝置18係可安裝於散熱裝置12與複數個散熱鰭片16之間，以使散熱裝置12與複數個散熱鰭片16間保持一間距，而形成較佳熱對流之散熱效果。定位裝置18之設置數量、定位裝置18與散熱裝置12以及複數個散熱鰭片16之相對位置關係可不限於上述實施例所述，舉例來說，定位裝置18亦可設置於複數個散熱鰭片16之外側，端視實際需求而定。Please refer to FIG. 1 and FIG. 2 . FIG. 1 is a schematic diagram of component explosion of a heat dissipation module 10 according to a preferred embodiment of the present invention. FIG. 2 is a block diagram of a heat dissipation module 10 according to a preferred embodiment of the present invention. The heat dissipation module 10 can be applied to the inside of the computer system to dissipate heat generated by the electronic component. The heat dissipation module 10 includes a heat dissipation device 12, which can be a fan device, such as an axial fan or a centrifugal fan. And a fixing mechanism 14 for fixing the heat sink 12 to a predetermined position, so that the heat sink 12 can dissipate heat stably and efficiently. The fixing mechanism 14 includes a plurality of heat dissipation fins 16 on which at least one groove 161 is formed, and at least one positioning device 18 is disposed on the plurality of heat dissipation fins 16. The fixing mechanism 14 may further include at least one positioning component 20 for mounting the heat sink 12 on the positioning device 18, so that the heat sink 12 can be fixed on the plurality of heat dissipation fins 16, wherein the positioning component 20 is Can be a locking component, such as screws. As shown in FIG. 2, the trench 161 can be formed at any position on the plurality of heat dissipation fins 16, that is, the user can selectively mount the positioning device 18 on any of the trenches 161 to make the heat sink 12 It can be mounted on a plurality of heat dissipation fins 16 at any angle. For example, as shown in FIG. 2, the four sides of the heat dissipating device 12 are not aligned with the four sides of the plurality of heat dissipating fins 16, and the relative positional relationship between the heat dissipating device 12 and the plurality of heat dissipating fins 16 is not limited to the above. As described in the embodiments, depending on the design requirements. In addition, the positioning device 18 can be installed between the heat dissipation device 12 and the plurality of heat dissipation fins 16 to maintain a distance between the heat dissipation device 12 and the plurality of heat dissipation fins 16 to form a heat dissipation effect of better heat convection. The relative positional relationship between the positioning device 18 and the positioning device 18 and the heat dissipation device 12 and the plurality of heat dissipation fins 16 is not limited to the above embodiment. For example, the positioning device 18 may be disposed on the plurality of heat dissipation fins 16 . On the outside, depending on actual needs.
請參閱第1圖至第4圖，第3圖與第4圖分別為本發明較佳實施例定位裝置18於不同視角之元件示意圖。定位裝置18包含有一支撐部22，其一第一側221係用來支撐散熱裝置12。支撐部22之第一側221上係可形成有一定位孔223，定位元件20係可穿設於散熱裝置12且固定於定位孔223內，藉以將散熱裝置12固定於支撐部22上。定位裝置18另包含有一第一限位部24，其係連接於支撐部22之一第二側225且卡合於溝槽161內，以避免支撐部22沿著一第一方向D1相對於複數個散熱鰭片16移動；定位裝置18另包含有一第二限位部26，其係連接於支撐部22之第二側225且止抵於複數個散熱鰭片16，以避免支撐部22沿著相異於第一方向D1之一第二方向D2相對於複數個散熱鰭片16移動，其中第一方向D1與第二方向D2係可實質上互相垂直。定位裝置18係可由彈性材質所組成，其不但可用來將散熱裝置12固定於複數個散熱鰭片16上，還可有效地吸收散熱裝置12運轉時所產生之震動以避免自複數個散熱鰭片16鬆脫。Please refer to FIG. 1 to FIG. 4 . FIG. 3 and FIG. 4 are respectively schematic diagrams of components of the positioning device 18 at different viewing angles according to a preferred embodiment of the present invention. The positioning device 18 includes a support portion 22 with a first side 221 for supporting the heat sink 12. A positioning hole 223 can be formed on the first side 221 of the support portion 22, and the positioning member 20 can be disposed in the heat dissipation device 12 and fixed in the positioning hole 223, thereby fixing the heat dissipation device 12 to the support portion 22. The positioning device 18 further includes a first limiting portion 24 connected to the second side 225 of the supporting portion 22 and engaged in the groove 161 to prevent the supporting portion 22 from being opposite to the plurality in the first direction D1. The heat dissipating fins 16 are moved; the positioning device 18 further includes a second limiting portion 26 connected to the second side 225 of the supporting portion 22 and stopping against the plurality of heat dissipating fins 16 to prevent the supporting portion 22 from following The second direction D2 is different from the plurality of heat dissipation fins 16 in a manner different from the first direction D1, wherein the first direction D1 and the second direction D2 are substantially perpendicular to each other. The positioning device 18 can be composed of an elastic material, which can be used not only to fix the heat dissipating device 12 on the plurality of heat dissipating fins 16, but also effectively absorb the vibration generated when the heat dissipating device 12 is in operation to avoid a plurality of heat dissipating fins. 16 loose.
如第1圖至第4圖所示，第一限位部24之厚度實質上係可相同於溝槽161之寬度，以使定位裝置18可緊密固定於複數個散熱鰭片16上。為了便於將第一限位部24卡合於溝槽161內，第一限位部24係可形成有一導角結構241，由於其可由彈性材質所組成，故導角結構241可於第一限位部24被擠壓進溝槽161而產生彈性變形時用來引導第一限位部24更順暢地卡合於溝槽161內。一般來說，導角結構241係實質上較佳地介於3度至5度之間。除此之外，此較佳實施例中第二限位部26可包含有兩側牆261，其係分別止抵於複數個散熱鰭片16中之兩散熱鰭片之外側，用以限制支撐部22沿著第二方向D2相對於複數個散熱鰭片16移動。然而第二限位部26之結構可不限於上述實施例所述，舉例來說，請參閱第5圖，第5圖為本發明另一實施例之散熱模組之示意圖。第二限位部26亦可為被夾持於複數個散熱鰭片16中之兩散熱鰭片間之一側牆。凡可用以限制支撐部22沿著第二方向D2相對於複數個散熱鰭片16移動之結構皆屬於本發明第二限位部26之範疇。As shown in FIGS. 1 to 4 , the thickness of the first limiting portion 24 can be substantially the same as the width of the groove 161 , so that the positioning device 18 can be tightly fixed to the plurality of heat dissipation fins 16 . In order to facilitate the engagement of the first limiting portion 24 in the groove 161, the first limiting portion 24 can be formed with a guiding structure 241. Since it can be composed of an elastic material, the guiding structure 241 can be at the first limit. When the seat portion 24 is pressed into the groove 161 to be elastically deformed, it is used to guide the first stopper portion 24 to more smoothly engage in the groove 161. In general, the lead structure 241 is substantially preferably between 3 and 5 degrees. In addition, in the preferred embodiment, the second limiting portion 26 can include two side walls 261 respectively stopping against the outer sides of the two of the plurality of heat dissipating fins 16 for limiting the support. The portion 22 moves relative to the plurality of heat dissipation fins 16 along the second direction D2. However, the structure of the second limiting portion 26 is not limited to the above embodiment. For example, please refer to FIG. 5, which is a schematic diagram of a heat dissipation module according to another embodiment of the present invention. The second limiting portion 26 may also be a side wall sandwiched between the two heat dissipation fins of the plurality of heat dissipation fins 16 . Any structure that can be used to limit the movement of the support portion 22 relative to the plurality of heat dissipation fins 16 along the second direction D2 belongs to the category of the second limit portion 26 of the present invention.
綜上所述，固定機構14係包含具有溝槽161之複數個散熱鰭片16，使用者首先將定位裝置18之第一限位部24緊密卡合於溝槽161內，且將定位裝置18之第二限位部26止抵於複數個散熱鰭片16，以使第一限位部24與第二限位部26分別限制支撐部22沿著第一方 向D1與第二方向D2相對於複數個散熱鰭片16移動，其中第一方向D1與第二方向D2係可實質上互相垂直，故可提供雙軸定位之效果，故定位裝置18之限位功能可有效地改善先前技術之散熱裝置因其所產生之震動而相對於散熱鰭片組移動之缺點。此外，再藉由定位元件20穿設散熱裝置12且固定於支撐部22之第一側221上之定位孔223內，以使散熱裝置12固定於定位裝置18上，故散熱裝置12可透過定位裝置18與定位元件20被三軸定位於複數個散熱鰭片16上。此外，定位裝置18係可由彈性材質所組成，其不但可用來將第一限位部22順暢地卡合於溝槽161內，還可吸收散熱裝置12所產生之震動以避免其鎖附力下降，以使散熱裝置12可經由定位裝置18以快速而穩定之方式安裝於複數個散熱鰭片16上。In summary, the fixing mechanism 14 includes a plurality of heat dissipating fins 16 having a groove 161. The user firstly fits the first limiting portion 24 of the positioning device 18 into the groove 161, and the positioning device 18 is mounted. The second limiting portion 26 stops against the plurality of heat dissipation fins 16 such that the first limiting portion 24 and the second limiting portion 26 respectively limit the supporting portion 22 along the first side. Moving to D1 and the second direction D2 relative to the plurality of heat dissipation fins 16, wherein the first direction D1 and the second direction D2 are substantially perpendicular to each other, so that the effect of the two-axis positioning can be provided, so the position of the positioning device 18 is limited. The function can effectively improve the disadvantage that the prior art heat sink moves relative to the heat sink fin set due to the vibration generated thereby. In addition, the heat dissipating device 12 is disposed in the positioning hole 223 of the first side 221 of the supporting portion 22 to fix the heat sink 12 to the positioning device 18, so that the heat sink 12 can be positioned through the positioning device 20 The device 18 and the positioning element 20 are three-axisly positioned on the plurality of fins 16. In addition, the positioning device 18 can be composed of an elastic material, which can be used not only to smoothly engage the first limiting portion 22 in the groove 161, but also absorb the vibration generated by the heat sink 12 to prevent the locking force from falling. So that the heat sink 12 can be mounted on the plurality of heat sink fins 16 via the positioning device 18 in a fast and stable manner.
相較於先前技術，本發明之固定機構及其相關散熱模組係具有成本低廉，組裝容易等優點，且可將散熱裝置穩定地安裝於複數個散熱鰭片上，以防止散熱裝置因其運轉時所產生之震動而自散熱鰭片上鬆脫。Compared with the prior art, the fixing mechanism and the related heat dissipating module of the invention have the advantages of low cost, easy assembly, and the like, and the heat dissipating device can be stably mounted on the plurality of heat dissipating fins to prevent the heat dissipating device from being operated The generated vibration is released from the fins.
以上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.
10‧‧‧散熱模組10‧‧‧ Thermal Module
12‧‧‧散熱裝置12‧‧‧ Heat sink
14‧‧‧固定機構14‧‧‧Fixed institutions
16‧‧‧散熱鰭片16‧‧‧Heat fins
161‧‧‧溝槽161‧‧‧ trench
18‧‧‧定位裝置18‧‧‧ Positioning device
20‧‧‧定位元件20‧‧‧ Positioning components
22‧‧‧支撐部22‧‧‧Support
221‧‧‧第一側221‧‧‧ first side
223‧‧‧定位孔223‧‧‧Positioning holes
225‧‧‧第二側225‧‧‧ second side
24‧‧‧第一限位部24‧‧‧First Limitation
241‧‧‧導角結構241‧‧‧Guide structure
26‧‧‧第二限位部26‧‧‧ Second Limit Department
261‧‧‧側牆261‧‧‧ Side wall
D1‧‧‧第一方向D1‧‧‧ first direction
D2‧‧‧第二方向D2‧‧‧ second direction
第1圖為本發明較佳實施例散熱模組之元件***示意圖。FIG. 1 is a schematic view showing the explosion of components of a heat dissipation module according to a preferred embodiment of the present invention.
第2圖為本發明較佳實施例散熱模組之組立圖。FIG. 2 is a block diagram of a heat dissipation module according to a preferred embodiment of the present invention.
第3圖與第4圖分別為本發明較佳實施例定位裝置於不同視角之元件示意圖。3 and 4 are respectively schematic views of components of the positioning device at different viewing angles according to a preferred embodiment of the present invention.
第5圖為本發明另一實施例之散熱模組之示意圖。FIG. 5 is a schematic diagram of a heat dissipation module according to another embodiment of the present invention.
10‧‧‧散熱模組10‧‧‧ Thermal Module
12‧‧‧散熱裝置12‧‧‧ Heat sink
14‧‧‧固定機構14‧‧‧Fixed institutions
16‧‧‧散熱鰭片16‧‧‧Heat fins
161‧‧‧溝槽161‧‧‧ trench
18‧‧‧定位裝置18‧‧‧ Positioning device
20‧‧‧定位元件20‧‧‧ Positioning components
D1‧‧‧第一方向D1‧‧‧ first direction
D2‧‧‧第二方向D2‧‧‧ second direction
Claims (19)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099110934A TWI383734B (en) | 2010-04-08 | 2010-04-08 | Fixing mechanism for fixing a heat-dissipating device and related thermal module |
| US12/941,997 US20110247784A1 (en) | 2010-04-08 | 2010-11-08 | Fixing mechanism for fixing a heat-dissipating device and related thermal module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099110934A TWI383734B (en) | 2010-04-08 | 2010-04-08 | Fixing mechanism for fixing a heat-dissipating device and related thermal module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201136504A TW201136504A (en) | 2011-10-16 |
| TWI383734B true TWI383734B (en) | 2013-01-21 |
Family
ID=44760085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099110934A TWI383734B (en) | 2010-04-08 | 2010-04-08 | Fixing mechanism for fixing a heat-dissipating device and related thermal module |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20110247784A1 (en) |
| TW (1) | TWI383734B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1400403A (en) * | 2001-07-31 | 2003-03-05 | 惠普公司 | Fastener-holder assembly |
| TWI276390B (en) * | 2003-12-01 | 2007-03-11 | Intel Corp | Integrated heat sink assembly |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5973921A (en) * | 1997-11-03 | 1999-10-26 | Lin; Yu-Chen | Fixation structure for the fan of the CPU heat dissipating device |
| US6816373B2 (en) * | 2002-10-04 | 2004-11-09 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipation device |
| US7289330B2 (en) * | 2005-11-10 | 2007-10-30 | Fu Shun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink assembly having a fan mounting device |
| US7537429B2 (en) * | 2006-04-06 | 2009-05-26 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Fan fastener for fastening a fan to a heat sink and method of using the same |
| US7789126B2 (en) * | 2006-09-29 | 2010-09-07 | Intel Corporation | Fan attachment apparatus for fan component assemblies |
| TWM342540U (en) * | 2008-04-01 | 2008-10-11 | Tai Sol Electronics Co Ltd | Heat sink module |
| TWM358216U (en) * | 2008-12-01 | 2009-06-01 | Asia Vital Components Co Ltd | Structure of fan frame and heat dissipating module thereof |
-
2010
- 2010-04-08 TW TW099110934A patent/TWI383734B/en not_active IP Right Cessation
- 2010-11-08 US US12/941,997 patent/US20110247784A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1400403A (en) * | 2001-07-31 | 2003-03-05 | 惠普公司 | Fastener-holder assembly |
| TWI276390B (en) * | 2003-12-01 | 2007-03-11 | Intel Corp | Integrated heat sink assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| US20110247784A1 (en) | 2011-10-13 |
| TW201136504A (en) | 2011-10-16 |
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