TWI381777B - Electronic component and manufacture the same - Google Patents
Electronic component and manufacture the same Download PDFInfo
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- TWI381777B TWI381777B TW95149213A TW95149213A TWI381777B TW I381777 B TWI381777 B TW I381777B TW 95149213 A TW95149213 A TW 95149213A TW 95149213 A TW95149213 A TW 95149213A TW I381777 B TWI381777 B TW I381777B
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Description
本發明涉及一種電子元件，尤其涉及一種安裝於電路板上之小型電子元件及其製造方法。 The present invention relates to an electronic component, and more particularly to a small electronic component mounted on a circuit board and a method of fabricating the same.
為滿足電子元件小型化之發展趨勢，以往常用於積體電路之封裝結構亦被應用到非積體電路之電子元件中，如電容、電感、共模扼流圈等。美國第6,593,840號專利揭示了這樣一種電子元件，其包括一絕緣本體，該絕緣本體設置有兩個側壁、電子元件收容空間及位於側壁上之引腳槽。引腳槽設置有固持裝置，該固持裝置包括至少一凸塊用以減小端子收容槽之橫截面積。該電子元件還包括位於絕緣本體收容空間中之電子組件，電子組件分別包括複數引線，其中各引線延伸至一引腳槽中。各引腳槽分別收容一引腳端子，其中引腳端子包括U形夾持部，這種結構設置使得夾持部將引腳端子緊緊固定在各端子槽中並與引線形成電性連接。 In order to meet the trend of miniaturization of electronic components, the package structure conventionally used for integrated circuits has also been applied to electronic components of non-integrated circuits, such as capacitors, inductors, and common mode chokes. U.S. Patent No. 6,593,840 discloses an electronic component comprising an insulative body provided with two side walls, an electronic component receiving space and a pin slot on the side wall. The pin slot is provided with a holding device, and the holding device includes at least one bump for reducing the cross-sectional area of the terminal receiving groove. The electronic component further includes electronic components located in the accommodating space of the insulative housing. The electronic components respectively include a plurality of leads, wherein the leads extend into a pin slot. Each of the lead slots respectively receives a pin terminal, wherein the pin terminal includes a U-shaped clamping portion, and the structure is configured such that the clamping portion tightly fixes the pin terminal in each terminal slot and is electrically connected with the lead wire.
然，此種電子元件之結構複雜，在製造過程中相對成本較高、生產效率低，並且由於各電子組件之引線非常細小，在其組裝時與引腳端子干涉連接，故容易產生斷裂，不能確保產品質量。 However, the structure of such an electronic component is complicated, the relative cost is high in the manufacturing process, the production efficiency is low, and since the leads of the electronic components are very small, they are interfered with the pin terminals during assembly, so that breakage is likely to occur, and Ensure product quality.
另外，在前述美國第6,593,840號專利之背景技術(如該專利之圖3、4所示)中亦揭示了一種結構類似之電子元件，該電子元件包括由側壁及頂壁圍成一收容空間之本體部，複數引腳端子分別注塑成型於兩側壁上，安裝於收 容空間之電子組件具有複數引線，各引線分別纏繞於延伸出側壁底面之相應之引腳端子上，然後經過浸錫焊接以使引腳端子與電子組件之引線形成電性連接。 In addition, in the background art of the aforementioned U.S. Patent No. 6,593,840 (as shown in Figures 3 and 4 of the patent), a similar structural electronic component is disclosed, which comprises a side wall and a top wall enclosing a receiving space. The main body portion, the plurality of pin terminals are respectively injection molded on the two side walls, and are mounted on the receiving body The electronic component of the space has a plurality of leads, each of which is wound around a corresponding pin terminal extending from the bottom surface of the sidewall, and then immersed and soldered to electrically connect the pin terminal to the lead of the electronic component.
然，以上這種電子元件於製造過程中，由於引線需要浸錫焊接到引腳端子上，相應增加製造成本，並且於大量生產時，不能確保產品質量，產品生產優良率低，因此有必要設計一種電子元件克服以上缺點。 However, in the manufacturing process of the above electronic components, since the leads need to be immersed and soldered to the pin terminals, the manufacturing cost is increased correspondingly, and in mass production, the product quality cannot be ensured, and the product production rate is low, so it is necessary to design An electronic component overcomes the above disadvantages.
有鑒於上述內容，有必要提供一種製造成本低、生產效率高、產品生產優良率良好之電子元件及其製造方法。 In view of the above, it is necessary to provide an electronic component having a low manufacturing cost, high production efficiency, and excellent product production rate and a method of manufacturing the same.
本發明之電子元件包括絕緣本體、至少一電子組件以及複數引腳端子，該絕緣本體包括至少一側壁及一收容空間，側壁具有一底面，電子組件收容於所述絕緣本體收容空間內，各電子組件分別具有複數引線，引腳端子分別固定於所述側壁上。各引腳端子包括位於絕緣本體外之焊接部、固定於絕緣本體側壁上之固持部及由固持部延伸出側壁之連接部，其中連接部包括與側壁之底面平行且朝向同一方向的安裝面，前述電子組件之引線與所述安裝面相連。 The electronic component of the present invention includes an insulative housing, at least one electronic component, and a plurality of pin terminals. The insulative housing includes at least one sidewall and a receiving space. The sidewall has a bottom surface, and the electronic component is received in the insulative housing receiving space. The components respectively have a plurality of leads, and the pin terminals are respectively fixed to the side walls. Each of the pin terminals includes a soldering portion outside the insulating body, a holding portion fixed to the sidewall of the insulating body, and a connecting portion extending from the retaining portion to the side wall, wherein the connecting portion includes a mounting surface parallel to the bottom surface of the sidewall and facing in the same direction. Lead wires of the aforementioned electronic component are connected to the mounting surface.
本發明之電子元件之製造方法，包括提供一個絕緣本體，其包括至少一個側壁及一收容空間，側壁具有一底面，複數引腳端子一體成型於所述側壁上，該引腳端子包括位於所述絕緣本體外之焊接部、固定於所述側壁之固持部及由固持部延伸出側壁之連接部，該連接部包括與所述側壁之底面平行且朝向同一方向的安裝面；提供電 子組件，其包括複數引線，將所述電子組件安裝於所述絕緣本體收容空間內，並將各引線分別與相應引腳端子連接部之安裝面進行搭接；將所述電子組件之引線與所述引腳端子進行熱熔焊接。 The manufacturing method of the electronic component of the present invention comprises: providing an insulative housing comprising at least one sidewall and a receiving space, the sidewall having a bottom surface, the plurality of pin terminals being integrally formed on the sidewall, the pin terminal being included a welded portion external to the insulating body, a holding portion fixed to the side wall, and a connecting portion extending from the retaining portion to the side wall, the connecting portion including a mounting surface parallel to the bottom surface of the side wall and facing in the same direction; providing electricity a sub-assembly comprising a plurality of leads, the electronic component being mounted in the insulative housing receiving space, and each lead is respectively overlapped with a mounting surface of the corresponding pin terminal connecting portion; and the lead of the electronic component is The pin terminals are hot melt welded.
相較於先前技術，本發明電子元件之引腳端子之連接部與絕緣本體之側壁平行，能夠增加引線與引腳端子之接觸面積，因而可以採用熱熔焊接方式使電子組件之引線與引腳端子建立電性連接，而不需要錫焊，能大幅降低生產成本，並提高生產效率及產品生產優良率。 Compared with the prior art, the connecting portion of the pin terminal of the electronic component of the present invention is parallel to the sidewall of the insulating body, and the contact area between the lead and the pin terminal can be increased, so that the lead and the lead of the electronic component can be hot-melt welded. The terminals are electrically connected without soldering, which can greatly reduce production costs and increase production efficiency and product production rate.
請一併參閱第一圖及第二圖，本創作電子元件100係一種小型片狀共模扼流圈模組，當然這種結構亦可以應用於其他電子元件中，該電子元件100包括複數引腳端子2分別固定於絕緣本體1長度方向相對兩側壁11上；絕緣本體1亦包括寬度方向相對之兩側壁12、一頂壁13及其與側壁11圍成之收容槽14；複數電子組件3(請參閱第四圖)安裝於絕緣本體1之收容槽14內，各電子組件3具有一圓環狀磁芯31及纏繞於磁芯31上之線圈32。 Please refer to the first figure and the second figure together. The electronic component 100 is a small chip common mode choke module. Of course, this structure can also be applied to other electronic components. The electronic component 100 includes multiple references. The foot terminals 2 are respectively fixed on the opposite side walls 11 of the insulative housing 1; the insulative housing 1 also includes two sidewalls 12 opposite to each other in the width direction, a top wall 13 and a receiving slot 14 defined by the side wall 11; the plurality of electronic components 3 (Please refer to the fourth figure), the electronic component 3 has an annular core 31 and a coil 32 wound around the core 31.
請一併參閱第二圖及第三圖，引腳端子2設有用以與電路板(未圖示)電性連接之直角形焊接部21、固定於絕緣本體1側壁11之固持部22以及與電子組件3線圈32電性連接之連接部23，該連接部23與固持部22垂直且延伸出側壁11之底面110之外並與之平行，固持部22可以與底面110緊貼(請參閱第二圖)，當然，固持部22也可以繼續延伸一段距離使得連接部23與底面110形成一定距離之空隙( 請參閱第五圖)，從而給電子組件3之引線320於引腳端子2上繞製提供空間。連接部23具有與焊接部21、固持部22寬度相同之主體部231及由主體部231一側垂直延伸之焊接臺232。當引腳端子2固定於絕緣本體1上時，各引腳端子2焊接臺232位於該引腳端子2與相鄰引腳端子2形成之空隙位置處，當然，該焊接臺232還可以繼續延伸只要其不與相鄰端子2之連接部23相接觸即可，由此電子組件3線圈32之複數引線320可以很方便之與各引腳端子2搭接。 Referring to the second and third figures, the pin terminal 2 is provided with a right-angled soldering portion 21 for electrically connecting to a circuit board (not shown), a holding portion 22 fixed to the side wall 11 of the insulative housing 1, and The connecting portion 23 of the electronic component 3 is electrically connected to the coil portion 32. The connecting portion 23 is perpendicular to the holding portion 22 and extends beyond and parallel with the bottom surface 110 of the side wall 11. The holding portion 22 can be closely attached to the bottom surface 110 (see the 2)), of course, the holding portion 22 can also continue to extend a distance such that the connecting portion 23 forms a certain distance from the bottom surface 110 ( Please refer to the fifth figure) to provide space for the lead 320 of the electronic component 3 to be wound on the pin terminal 2. The connecting portion 23 has a main body portion 231 having the same width as the welded portion 21 and the holding portion 22, and a soldering station 232 extending perpendicularly from the side of the main body portion 231. When the pin terminal 2 is fixed on the insulative housing 1, the soldering station 232 of each pin terminal 2 is located at a gap position formed by the pin terminal 2 and the adjacent pin terminal 2. Of course, the soldering station 232 can continue to extend. As long as it does not come into contact with the connecting portion 23 of the adjacent terminal 2, the plurality of leads 320 of the coil 32 of the electronic component 3 can be easily overlapped with the respective pin terminals 2.
請參閱第四圖，於製造過程中，首先將從料帶衝壓成型之引腳端子2通過注塑成型或其他成型方式固定於絕緣本體1上；然後將製造好之電子組件3安裝到絕緣本體1之凹槽14中，此時也可以將粘膠等固定物質(未圖示)填充到電子組件3周圍之空隙中以將電子組件3固定；同時，將各線圈32之所有引線320放置到相應之引腳端子2空隙中，以使引線320與引腳端子2之連接部23撘接，亦可以先將引線320在固持部22進行繞製後與連接部23搭接(請參閱第五圖)此時也可以借助於粘膠將引線320準確定位；最後將該組裝好之電子元件100送到焊接設備進行熱熔焊接，電子組件3之引線320熱熔焊接到引腳端子2之焊接臺232上。 Referring to the fourth figure, in the manufacturing process, the lead terminal 2 which is stamped and formed by the tape is first fixed to the insulating body 1 by injection molding or other molding; then the manufactured electronic component 3 is mounted to the insulating body 1 In the groove 14, at this time, a fixing substance (not shown) such as adhesive may be filled in the space around the electronic component 3 to fix the electronic component 3; at the same time, all the leads 320 of each coil 32 are placed correspondingly. In the gap between the pin terminals 2, the lead wire 320 and the connection portion 23 of the pin terminal 2 are connected to each other, and the lead wire 320 may be wound on the holding portion 22 and then overlapped with the connecting portion 23 (refer to the fifth figure). At this time, the lead 320 can also be accurately positioned by means of the adhesive; finally, the assembled electronic component 100 is sent to the welding device for hot-melt welding, and the lead 320 of the electronic component 3 is hot-melted to the soldering station of the pin terminal 2. 232.
於本創作中採用之熱熔焊接係一種放熱熔接，它利用放熱反應時產生超高熱來完成熔接之一種方法。熱熔焊接反應速度非常快，僅幾秒就可以完成焊接，產生熱量極高可以有效之傳導至熔接部位，使其熔為一體，形成分 子結合，它無須其他任何熱能。將熱熔焊接應用於電子元件之製造上，不需要使用焊錫膏，並且焊點之電氣及機械性能良好、產品生產優良率良好，適應於大規模自動化生產，成本低。 The hot-melt welding used in this creation is an exothermic fusion method which utilizes an exothermic reaction to produce ultra-high heat to complete the fusion. The hot melt welding reaction speed is very fast, and the welding can be completed in only a few seconds, and the heat generated is extremely high, which can be effectively transmitted to the welded portion, and melted into one body to form a minute. Sub-combination, it does not require any other heat. The application of hot-melt welding to the manufacture of electronic components does not require the use of solder paste, and the electrical and mechanical properties of the solder joints are good, the product production rate is good, and it is suitable for large-scale automated production with low cost.
綜上所述，本創作確已符合發明專利之要件，爰依法提出申請專利。惟，以上所述者僅係本發明之較佳實施方式，本發明之範圍並不以上述實施方式為限，舉凡熟習本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下專利申請範圍內。 In summary, this creation has indeed met the requirements of the invention patent, and applied for a patent in accordance with the law. However, the above-mentioned embodiments are merely preferred embodiments of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art will be able to make equivalent modifications or variations in accordance with the spirit of the present invention. It should be covered by the following patent applications.
100‧‧‧電子元件 100‧‧‧Electronic components
1‧‧‧絕緣本體 1‧‧‧Insulating body
11‧‧‧側壁 11‧‧‧ side wall
12‧‧‧側壁 12‧‧‧ side wall
13‧‧‧頂壁 13‧‧‧ top wall
14‧‧‧收容槽 14‧‧‧ housing trough
110‧‧‧底面 110‧‧‧ bottom
2‧‧‧引腳端子 2‧‧‧ pin terminal
21‧‧‧焊接部 21‧‧‧Weld Department
22‧‧‧固持部 22‧‧‧ Holding Department
23‧‧‧連接部 23‧‧‧Connecting Department
231‧‧‧主體部 231‧‧‧ Main body
232‧‧‧焊接臺 232‧‧‧welding station
3‧‧‧電子組件 3‧‧‧Electronic components
31‧‧‧圓環狀磁芯 31‧‧‧Ring core
32‧‧‧線圈 32‧‧‧ coil
320‧‧‧引線 320‧‧‧ lead
第一圖係本創作電子元件之立體圖。 The first picture is a perspective view of the electronic components of the present creation.
第二圖係本創作電子元件之另一立體圖。 The second figure is another perspective view of the electronic component of the present invention.
第三圖係本創作電子元件之引腳端子之放大立體圖。 The third figure is an enlarged perspective view of the pin terminals of the electronic component of the present invention.
第四圖係本創作電子元件之元件平面組裝圖。 The fourth figure is a plan view of the components of the electronic component of the present invention.
第五圖係本創作電子元件之第二實施例，圖中為簡潔僅示意出一電子組件之引線纏繞並焊接於引腳端子上。 The fifth figure is a second embodiment of the present electronic component. The figure shows only the lead of an electronic component wound and soldered to the pin terminal.
100‧‧‧電子元件 100‧‧‧Electronic components
1‧‧‧絕緣本體 1‧‧‧Insulating body
11‧‧‧側壁 11‧‧‧ side wall
110‧‧‧底面 110‧‧‧ bottom
12‧‧‧側壁 12‧‧‧ side wall
13‧‧‧頂壁 13‧‧‧ top wall
14‧‧‧收容槽 14‧‧‧ housing trough
2‧‧‧引腳端子 2‧‧‧ pin terminal
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95149213A TWI381777B (en) | 2006-12-27 | 2006-12-27 | Electronic component and manufacture the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95149213A TWI381777B (en) | 2006-12-27 | 2006-12-27 | Electronic component and manufacture the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200828358A TW200828358A (en) | 2008-07-01 |
| TWI381777B true TWI381777B (en) | 2013-01-01 |
Family
ID=44817642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95149213A TWI381777B (en) | 2006-12-27 | 2006-12-27 | Electronic component and manufacture the same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI381777B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6297721B1 (en) * | 1995-08-10 | 2001-10-02 | Halo Electronics, Inc. | Electronic surface mount package |
-
2006
- 2006-12-27 TW TW95149213A patent/TWI381777B/en not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6297721B1 (en) * | 1995-08-10 | 2001-10-02 | Halo Electronics, Inc. | Electronic surface mount package |
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| Publication number | Publication date |
|---|---|
| TW200828358A (en) | 2008-07-01 |
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