1380160 :六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種伺服器，更詳而言之，係關於一 種實現主機板熱插拔的伺服器。 【先前技術】 隨著電子科技的發展，伺服器已成為業界廣為使用的 資訊處理系統。伺務器中通常包括有主機板、電源供應器、 各式磁碟機、…等，而主機板是伺務器最核心的部分。 胃由於對伺務器功能需求的日益增加及體積日益小型 化，在同一機箱内安裝多個主機板的需求越來越多，而且 每一主機板本身的體積也越來越小，一方面要求實現主機 板的熱插拔，另一方面要求在有限的空間内在主機板上佈 設更多的零件，使得伺務器的設計和製造成本居高不下。 因而，如何設計一種伺服器，以實現於主機板上的熱 插拔，且又滿足在有限的空間内在主機板上佈設更多的零 鲁件，進而降低設計和製造的成本，實為相關領域之業者目 前亟待解決之課題。 【發明内容】 鑒於上述習知技術之缺點，本發明之一目的在於提一 種伺服器，以實現於主機板上的熱插拔，並且降低設計和 製造成本。 為達上述目的及其他相關目的，本發明提供一種伺服 器，係包括：機箱，具有底板；硬碟陣列，可抽取地設於 該機箱的前端；多個主機板模組，可抽取地設於該機箱的 3 111618 1380160 後端，各該主機板模組具有：主機板，設有至少一第一連 接埠；承載盤，以承載該主機板；擴展架，固接於該承載 盤的一端；以及擴展卡，承載於該擴展架上，該擴展卡通 過第一電纜線與該第一連接埠電性連接，且該擴展卡於背 離該主機板的一端設有金手指；電源模組，與該些主機板 模組並排設置於該機箱的後端；以及轉接板，設於該機箱 内的該硬碟陣列與該些主機板模組之間，且平行於該機箱 的底板設置，該轉接板通過第二電纜線分別電性連接該硬 碟陣列與該電源模組，且該轉接板靠近該些主機板模組的 一端具有與該些金手指對應的多個第二連接埠，以供該些 金手指分別插置於該些第二連接埠中。 於本發明的一實施例中，該伺服器可包括風扇模組， 設於機箱内的該硬碟陣列與該轉接板之間，該風扇模組包 括多個風扇，該些風扇係對應於該些主機板模組的位置而 設置。該主機板模組可包括中央處理器、多個内存條以及 導風板，該中央處理器和該些内存條並排設置在該主機板 上該些風扇的出風側，該導風板的底部固定在該擴展卡 上，該導風板的後端卡設於該些内存條中相對靠近該中央 處理器的二者之間，其中最靠近該中央處理器的内存條與 該導風板共同形成導風面。1380160: VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a server, and more particularly to a server for implementing hot swapping of a motherboard. [Prior Art] With the development of electronic technology, the server has become an information processing system widely used in the industry. The server usually includes a motherboard, a power supply, various drives, etc., and the motherboard is the core part of the server. Due to the increasing demand for server functions and the increasing size of the stomach, there is an increasing demand for installing multiple motherboards in the same chassis, and the size of each motherboard itself is getting smaller and smaller. The hot plugging of the motherboard is required, and on the other hand, it is required to lay more parts on the motherboard in a limited space, so that the design and manufacturing cost of the server is high. Therefore, how to design a server to achieve hot plugging on the motherboard, and to meet more space in the limited space on the motherboard, thereby reducing the cost of design and manufacturing, is actually related fields The current issue of the industry is urgently needed. SUMMARY OF THE INVENTION In view of the above disadvantages of the prior art, it is an object of the present invention to provide a server for implementing hot swapping on a motherboard and reducing design and manufacturing costs. To achieve the above and other related objects, the present invention provides a server, comprising: a chassis having a bottom plate; a hard disk array detachably disposed at a front end of the chassis; and a plurality of motherboard modules detachably disposed at The rear panel of the 3111618 1380160 of the chassis, the motherboard module has: a motherboard, at least one first connection port; a carrier disk to carry the motherboard; an extension frame fixed to one end of the carrier disk; And the expansion card is carried on the extension frame, the expansion card is electrically connected to the first connection port through the first cable, and the expansion card is provided with a gold finger at an end facing away from the motherboard; the power module, and The motherboard modules are disposed side by side at the rear end of the chassis; and the adapter board is disposed between the hard disk array in the chassis and the motherboard modules, and is disposed parallel to the bottom plate of the chassis. The adapter board is electrically connected to the power module by the second cable, and the second end of the adapter board adjacent to the motherboard module has a plurality of second ports corresponding to the gold fingers. For these The plurality of fingers are interposed in the second port. In an embodiment of the invention, the server may include a fan module disposed between the hard disk array in the chassis and the adapter plate, the fan module including a plurality of fans, wherein the fans correspond to The positions of the motherboard modules are set. The motherboard module can include a central processing unit, a plurality of memory modules, and a wind deflector. The central processing unit and the memory modules are disposed side by side on the air outlet side of the fan on the motherboard, and the bottom of the air guiding plate Fixed on the expansion card, the rear end of the air deflector is disposed between the memory modules relatively close to the central processing unit, wherein the memory module closest to the central processing unit is shared with the air guiding plate Form the wind guiding surface.
另外，該導風板的前端可具有延伸部，該延伸部延伸 至靠近於該風扇模組出風面的位置，並向該些内存條的方 向背折’相應地’該擴展架的前端可具有開口’該導風板 的延伸部及該擴展卡的金手指外露於該開口。 F 4 111618 1380160 . 於本發明的另一實施例中，該擴展卡的邊緣可具有第 二穿孔，用以將該擴展卡螺接於該擴展架上，且該導風板 的底部可具有第一穿孔，對應於該擴展卡的第二穿孔設 置，從而可藉由依序穿過該第一和第二穿孔的螺絲鎖固該 導風板於該擴展卡上。該承載盤的前端及該擴展架的後端 均可設置折邊，該承載盤與該擴展架通過該些折邊鉚接在 一起。各該主機板模組可包括電池架，用以承載該主機板 模組使用的電池，該電池架具有至少二支撐腳，由該電池 ® 架底面向下延伸，該二支撐腳分別可固定於該主機板和該 擴展卡上，俾令該電池架的底部分別隔開與該主機板與該 擴展卡。 再者，該主機板及該擴展卡的邊緣分別可具有第四穿 子L，以將該主機板與擴展卡分別螺接於該承載盤與擴展架 上，該電池架的該二支撐腳分別可具有對應於該些第四穿 孔的第三穿孔，從而可藉由依序穿過該些第三和第四穿孔 φ 的螺絲鎖固該電池架於該主機板與擴展卡上。該伺服器可 包括兩固定架，該些固定架分別可固定於該機箱的兩側壁 上，用以固定該轉接板。該機箱的後端可具有多個隔板， 該些隔板可與該機箱的兩側壁平行，以將該機箱分割成多 個容置空間，各該隔板上可形成有軌道，用以分別引導該 些主機板模組和該電源模組進入該機箱的容置空間中。 如上所述，本發明之伺服器，具有分別可抽取式地設 於機箱的前、後兩端的硬碟陣列和主機板模組，以便於對 其實現熱插拔。該主機板模組具有用以承載主機板之承載 5 111618 1380160 盤、用以㈣具有金手指的擴展卡 性連接該主機板與擴展卡的電麗線，該電二二及用以電 主機板的訊號受到傳遞路徑長度的影塑而失見^可以避免該 之主機板料㈣展奴金手 /、故本發明 聯擊，以降低冇η 所插设之飼務器取得 克服了習知技術中之種種缺头而I月月匕有效 【實施方式】種種缺失而具两度產業利用價值。 以下藉由特定的具體實例說明本發明之實施孰 =技;之人士可由本說明書所揭示之内容輕易一 二之，、他優點與功效。本發明亦可藉由其他不同的具體 貫例加以施行或應用’本說明書中的各項細節亦可基於不 同觀點與應用’在不恃離本發明之精神下進行各種修飾與 變更。 /' 請參閱第1及2圖，係為本發明之一實施例之词服器 内部結構之局部分解圖。如圖所示，本實施例之伺服器1 係至少由機箱11、硬碟陣歹,Μ2、多個主機板模组13、電 源模組15、以及轉接板16所構成，構成元件的組成及連 接關係將於下詳述。應說明的是，本發明伺服器内部結構 及配件數量並不以圖中所繪示者為限。 於本實施例中，該機箱Η係至少由底板lu和兩侧 壁Π3環繞而成。該硬碟陣列12包括一硬碟架，該硬碟架 a又置於έ亥機箱1 1的前端，且可以插接多個硬碟，俾令該些 硬碟可抽取地設於該硬碟陣列12中，即該些硬碟均可從機 箱11的前端進行插拔，以作為該伺服器1内部資料存取之^ s 6 111618 1380160 用，若所需存取的資料量龐A ’則可選擇增加所插接的硬 碟數量。 此外，該機箱U的後端具有兩個平行設置的隔板 112’以將該機箱11分割成多個容置空間，但應說明的是， 於該機箱11中所設置的隔板112數量，並不以兩個為限， 仍可依情況適度增減所設置的隔板112數量。如圖所示， 各該隔板112 設有轨道，以引導各該主機板模组i3與電 源模組15於第1圖雙箭頭！^的指向方向上進出入 Π的後端，俾使該電源模組15與主機板模組13於該機箱 "的後端並排設置’以於該機箱u的後端上實現該主機 板模組13與電源模組][5的熱插拔。In addition, the front end of the air deflector may have an extension portion extending to a position close to the air outlet surface of the fan module, and folded back toward the memory strips 'correspondingly' An extension having an opening 'the wind deflector and a gold finger of the expansion card are exposed to the opening. F 4 111618 1380160. In another embodiment of the present invention, the edge of the expansion card may have a second through hole for screwing the expansion card to the extension frame, and the bottom of the air deflector may have a first A perforation corresponding to the second perforation of the expansion card, so that the air deflector can be locked to the expansion card by sequentially passing through the screws of the first and second perforations. The front end of the carrier tray and the rear end of the extension frame may be provided with a flange, and the carrier tray and the extension frame are riveted together by the flanges. Each of the motherboard modules may include a battery holder for carrying a battery used by the motherboard module. The battery holder has at least two supporting legs extending downward from a bottom surface of the battery® frame, and the two supporting legs are respectively fixed to the battery On the motherboard and the expansion card, the bottom of the battery holder is separated from the motherboard and the expansion card. In addition, the edge of the motherboard and the expansion card may respectively have a fourth wearing member L, so that the motherboard and the expansion card are respectively screwed onto the carrier and the extension frame, and the two supporting legs of the battery holder are respectively There may be a third through hole corresponding to the fourth through holes, so that the battery frame can be locked on the motherboard and the expansion card by screws passing through the third and fourth through holes φ in sequence. The server may include two fixing brackets respectively fixed to the two side walls of the chassis for fixing the adapter plate. The rear end of the chassis may have a plurality of partitions, and the partitions may be parallel to the two side walls of the chassis to divide the chassis into a plurality of accommodating spaces, and each of the partitions may be formed with a track for respectively The motherboard modules and the power module are guided into the accommodating space of the chassis. As described above, the server of the present invention has a hard disk array and a motherboard module which are respectively detachably provided at the front and rear ends of the chassis to facilitate hot swapping. The motherboard module has a 5 111618 1380160 disk for carrying the motherboard, and (4) an extension card with a golden finger to connect the motherboard and the expansion card, the electric circuit board and the electric motherboard The signal is lost due to the length of the transmission path ^ can avoid the host sheet (4) exhibitor gold hand /, so the invention of the joint, to reduce the 冇 所 inserted in the server to overcome the conventional technology All kinds of heads are missing and I month is effective. [Implementation] There are two kinds of industrial use value. The following description of the implementation of the present invention by way of specific specific examples can be easily made by the disclosure of the present specification, its advantages and effects. The present invention may be embodied or applied in various other specific embodiments. The details of the present invention may be varied and modified without departing from the spirit and scope of the invention. Referring to Figures 1 and 2, there is shown a partial exploded view of the internal structure of the word processor of one embodiment of the present invention. As shown in the figure, the server 1 of the present embodiment is composed of at least a chassis 11, a hard disk array, a cymbal 2, a plurality of motherboard modules 13, a power module 15, and an adapter plate 16, and constitutes a component. And the connection relationship will be detailed below. It should be noted that the number of internal structures and accessories of the server of the present invention is not limited to those shown in the drawings. In this embodiment, the chassis is formed by at least a bottom plate lu and two side wall sills 3. The hard disk array 12 includes a hard disk shelf, and the hard disk shelf a is further disposed at the front end of the chassis 1 1 and can be connected to the plurality of hard disks so that the hard disks are detachably disposed on the hard disk. In the array 12, the hard disks can be inserted and removed from the front end of the chassis 11 to be used as the internal data access of the server 1 for the data access of the server 1 if the amount of data to be accessed is A' You can choose to increase the number of hard disks that are plugged in. In addition, the rear end of the chassis U has two parallel partitions 112 ′ to divide the chassis 11 into a plurality of accommodating spaces, but it should be noted that the number of the partitions 112 disposed in the chassis 11 is It is not limited to two, and the number of partitions 112 provided may be appropriately increased or decreased depending on the situation. As shown in the figure, each of the partitions 112 is provided with a rail to guide the main board module i3 and the power module 15 in the first figure double arrow! The pointing end of the ^ in the direction of the entrance and exit, so that the power module 15 and the motherboard module 13 are arranged side by side at the rear end of the chassis "to achieve the motherboard model on the back end of the chassis u Group 13 with power module] [5 hot swap.
於本實施财’各該主機板模組13均具有主機板 13卜擴展卡132、承載盤133、以及擴展架134。該主機 板13]設有第-連接埠1314,用以提供與該擴展卡132的 電性連接。财載盤133具有承載面，用以承載該主機板 13卜該擴展架134係鉚接於該承載盤133的一端，使唁承 載盤U3與擴展架134'结合成為—體，但不以此為限了亦 可選用螺接、銷接等固定方式結合兩者。該擴展卡则 承載於該擴展架134上’並通過第_電财Μ與該主機板 =的第-連接埠⑶4電性連接，俾藉由該第一電麟μ 連繫該主機板η丨與該擴展卡132，該擴展卡132於背離 邊主機板m的-端設有金手指1322。最佳的，該主機板 上具有多個第—連接埠1314,用以完成該主機板⑶ 所有凡件能擴展卡132之_電性義，這樣主機板 111618 7 1380160 上各元件的佈局及走線就不再受主機板空間的限制，以在 有限的主機板空間内佈設更多的零件，而有效節約伺務器 的設計和製造成本。 另言之，由於電纜線的導電性能較易掌握，即其訊號 的傳遞不至於受到傳遞路徑長度的影響而過度失真，舉例 而言，若使用電纜線傳遞主機板北橋晶片中的SATA訊號 將不會受到傳遞路徑長度的影響而過度失真，即電纜線所 傳遞的訊號將能滿足主機板上對於元件的佈局和信號有關 線長、線寬、線距、阻抗、時序、電磁干擾等的要求。由 於電纜線的佈設無需佔用過多的主機板空間，因而不會受 到主機板的體積越來越小及其上的電子元件越來越密集的 限制，故本實施例之伺服器因為使用了第一電纜線，而降 低整體的設計和製造成本。 各該主機板模組13可通過其擴展卡132的金手指 1322與該伺服器1電性連接，故各該主機板模組13可於 該機箱11的後端進行熱插拔，以實現主機板的熱插拔而滿 足所有客戶的要求。所述的轉接板16設於該機箱11内的 該硬碟陣列12與該些主機板模組13之間，且平行於該機 箱11的底板111設置，該轉接板16通過第二電纜線191 電性連接該硬碟陣列12，且該轉接板16靠近該些主機板 模組13的一端具有與各該擴展卡132的金手指1322對應 的多個第二連接埠161，以供該些金手指1322分別插置於 該些第二連接埠161中，進而通過轉接板16使主機板模組 13與硬碟陣列12之間建立對應和連接關係。而該轉接板丨s 8 111618 丄〕δυ丄ου :6,過第三電境線192與該電源模組I5電性連接，以使 八电原模，·且15此對轉接板16供電，進而通過轉接板 刀別對该硬碟陣歹,U2及主機板模組13供電。於本實施例 λ 一第一連接埠161係為金手指插槽，但不以此為限。 —^本實施财’該伺服器1更包括兩岐架18,該兩 固疋架18係分別鎖固於該機箱11的兩側壁113上，或者 一體成形於該機箱U的兩侧壁113上，用以固定該轉接板 16 ’相應地，各該固定架18上具有例如螺孔的固定機制， 用以鎖固5亥轉接板16，但不以此為限。 此外，忒主機板模組13還包括並排設置在該主機板 ⑶上的中央處理器nu、多個内存條⑶2。於該主機板 模組13運作時，該中央處理器13ιι會產生高熱，因而需 對其吹風以逸散熱量’以避免該中央處理 ΐ3ιι因為過熱 而U又’甚至影響工作效能。因此，該伺服器1在該硬碟 =列12與主機板模組13之間設有出風側朝向該中央處理 益1311的風扇模組17。該風扇模組17包括多個風扇Η卜 各該風扇171係對應於該些主機板模組13而設置，以對該 中央處理器1311吹風散熱。 為使该風扇I组17所產生的散熱風流能有效地流向 該令央處理器1311 ’該主機板模组13還設置有導風板 135。該導風板135的底部係固定在該擴展卡132上，該導 風板135的後端卡設於該些内存條1312中相對靠近該中央 處理器1311的二者之間，其中最靠近該中央處理器1311 的内存條1312與該導風板135共同形成導風面，以引導該 ΠΙ618 9 ι^δυιοο 羽拉、、a 17的大部分氣體流向該巾央處理器⑶卜俾 匕該風扇模組17對該中央處理器1311的散熱效果。 ^所示，該導風板135的—端係通過兩内存條i3i2 ==成前述卡設的目的’另一端係藉由螺絲而鎖附 二幾，上’因而該導風板135的設置毋需額外於 ⑶上形成穿孔，故該導㈣135的設置並不會 呈^朝^機板131上的電路佈局。另外，該導風板135 二==風扇模組17延伸的延伸部1351，該延伸部i35i 條1319 额扇额17 “面驗置，並向該些内存 分氣法至的f向彎折，用以引導該風扇模組17所產生的部 二;=板131之適當處散熱。具體地，該導風板 係此引導該風扇模組17所產生 ==流至該中央處理器131;、上:藉二= 氣产'因的散熱’俾解決該風扇模組17所提供的 為風阻的緣故大都流向内存條1312而益法有效對 的問題。另外，該導風板135的咖 ^求而加以調整，並不以財所綠製者為限。 展架134的一側具有開口1341，以供該導風板 135之延伸部η5ι向外 條咖的方向延伸^地組17及内存 及該擴展卡丨32的全狩132 /f板135的延伸部1351 的孟乎丸1322係外露於該開口 1341。 穿孔S’如第2圖所示，該擴展卡132的邊緣具有第二 相庫扯’心將該擴展卡132螺接於該擴展帛134上， 相應地，轉風板135的底部具有第—穿孔⑽，該第-⑴ U1618 1380160 牙孔1352對應於該擴展卡132的第二穿孔設置，從 而可藉由依序穿過該第一穿孔1352和第二穿孔1323的螺 絲鎖固該導風板135於該擴展卡132上。於本實施例令，、 違承载盤133的前端及該擴展架】34㈣端均設有折邊， 俾，過該些折邊而將該承載盤133與該擴展架134鉚接成 為-體’並通過該些折邊而避免該承載盤133與該擴展架Each of the motherboard modules 13 has a motherboard 13 , an expansion card 132 , a carrier 133 , and an extension 134 . The motherboard 13] is provided with a first port 1314 for providing an electrical connection with the card 132. The loading tray 133 has a carrying surface for carrying the main board 13 and the end of the carrying tray 133 is riveted to the end of the carrying tray 133, so that the carrying tray U3 and the extension 134' are combined, but this is not It is also possible to use a combination of screwing, pinning, etc. in combination. The expansion card is carried on the extension frame 134 and electrically connected to the first connection port (3) 4 of the motherboard through the first battery, and the motherboard is connected to the motherboard through the first circuit. With the expansion card 132, the expansion card 132 is provided with a gold finger 1322 at the end facing away from the side motherboard m. Preferably, the motherboard has a plurality of first ports 1314 for accomplishing the electrical meaning of all the components of the motherboard (3), so that the layout and components of the components on the motherboard 111618 7 1380160 The line is no longer limited by the board space, allowing more parts to be placed in a limited main board space, effectively saving the design and manufacturing costs of the server. In addition, since the electrical conductivity of the cable is easy to grasp, that is, the transmission of the signal is not excessively distorted by the length of the transmission path. For example, if the cable is used to transmit the SATA signal in the north bridge of the motherboard, the SATA signal will not be transmitted. It will be over-distorted by the length of the transmission path, that is, the signal transmitted by the cable will meet the requirements of the layout and signal related line length, line width, line spacing, impedance, timing, electromagnetic interference, etc. on the motherboard. Since the cable line is disposed without occupying too much space of the motherboard, it is not limited by the smaller and smaller size of the motherboard, and the server of the embodiment is used first. Cable lines reduce overall design and manufacturing costs. Each of the motherboard modules 13 can be electrically connected to the server 1 through the gold finger 1322 of the expansion card 132. Therefore, the motherboard module 13 can be hot-swapped at the rear end of the chassis 11 to implement the host. The board is hot swapped to meet the requirements of all customers. The adapter plate 16 is disposed between the hard disk array 12 in the chassis 11 and the motherboard modules 13 and is disposed parallel to the bottom plate 111 of the chassis 11. The adapter plate 16 passes through the second cable. The wire 191 is electrically connected to the hard disk array 12, and one end of the adapter plate 16 adjacent to the motherboard modules 13 has a plurality of second ports 161 corresponding to the gold fingers 1322 of the expansion cards 132 for The gold fingers 1322 are respectively inserted into the second connecting ports 161, and then the adapter board 16 is used to establish a corresponding and connected relationship between the motherboard module 13 and the hard disk array 12. The adapter board 丨s 8 111618 丄]δυ丄ου :6, and the third power line 192 is electrically connected to the power module I5, so that the eight power modules, and 15 of the power supply board 16 Then, the hard disk array, the U2 and the motherboard module 13 are powered by the adapter plate cutter. In the embodiment, the first connection port 161 is a gold finger slot, but is not limited thereto. The server 1 further includes two trusses 18, which are respectively locked on the two side walls 113 of the chassis 11, or integrally formed on the two side walls 113 of the chassis U. Correspondingly, the fixing plate 18 has a fixing mechanism such as a screw hole for locking the 5th adapter plate 16, but not limited thereto. In addition, the motherboard module 13 further includes a central processing unit nu and a plurality of memory modules (3) 2 disposed side by side on the motherboard (3). When the motherboard module 13 is in operation, the central processing unit 13 generates high heat, so that it needs to be blown to dissipate heat to prevent the central processing unit from being overheated and even affecting the work efficiency. Therefore, the server 1 is provided between the hard disk = column 12 and the motherboard module 13 with a fan module 17 whose wind side faces the central processing benefit 1311. The fan module 17 includes a plurality of fans. Each of the fans 171 is disposed corresponding to the motherboard modules 13 to blow heat to the central processing unit 1311. In order to enable the heat dissipation airflow generated by the fan group 17 to flow efficiently to the central processor 1311', the motherboard module 13 is further provided with a wind deflector 135. The bottom of the air deflector 135 is fixed on the expansion card 132. The rear end of the air deflector 135 is disposed between the memory modules 1312 and the central processor 1311. The memory module 1312 of the central processing unit 1311 and the air deflector 135 form a wind guiding surface to guide the ΠΙ618 9 ι δ υ ι ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο The heat dissipation effect of the module 17 on the central processing unit 1311. ^, the end of the air deflector 135 is passed through the two memory modules i3i2 == for the purpose of the aforementioned carding. The other end is locked by two screws, and thus the setting of the air deflector 135 It is necessary to additionally form a perforation on (3), so the arrangement of the guide (four) 135 does not appear as a circuit layout on the board 131. In addition, the air deflector 135==the extension portion 1351 of the fan module 17 extending, and the fan portion 1319 of the extension portion i35i is “faced” and is bent toward the f direction of the memory separation method. For guiding the fan module 17 to generate a portion 2; = the appropriate heat dissipation of the plate 131. Specifically, the air deflector guides the fan module 17 to generate a == flow to the central processing unit 131; Above: borrowing two = gas production 'heat dissipation' 俾 solves the problem that the fan module 17 provides wind resistance mostly to the memory module 1312 and the effective method is effective. In addition, the wind deflector 135 The adjustment is not limited to the financial system. The display 134 has an opening 1341 on one side thereof for extending the extension η5ι of the wind deflector 135 outwardly in the direction of the bar, and the memory and the memory The Mengkemao 1322 of the extension portion 1351 of the full-hook 132/f plate 135 of the extension cassette 32 is exposed to the opening 1341. The perforation S' is as shown in Fig. 2, and the edge of the expansion card 132 has a second phase 'The core is screwed to the expansion cassette 134, and correspondingly, the bottom of the air deflector 135 has a first through hole (10), the first - (1) The U1618 1380160 tooth hole 1352 corresponds to the second perforation of the expansion card 132, so that the air deflector 135 can be locked to the expansion card 132 by screws passing through the first through hole 1352 and the second through hole 1323 in sequence. In the embodiment, the front end of the carrier tray 133 and the extension end 34 (four) end are provided with a flange, and the flange 134 is riveted into the body 134 by the flanges. Avoiding the carrier tray 133 and the extension frame by the folding edges
134党力發生魅曲，以增加該承載盤133與該擴展架134 整體的結構強度。The 134 party force has a charm to increase the structural strength of the carrier 133 and the extension 134 as a whole.
於本貝細例中，各該主機板模組13可包括電池架 =用以承载έ亥主機板模組13運作所需的電池2，該電 池木136具有至少二支撐腳1361，該些支撐腳⑶1係由 該電池架U6底面向下延伸，並分別固定於該主機板ΐ3ι =擴展卡U2上，俾令該電池架136的底部分別隔開該 幾板131與該擴展卡132，以免妨礙該主機板⑶和該 擴展卡132上相對於該電池架136位置的電路佈局。A >其中，該主機板131及該擴展卡132㈣緣分別具有 弟四穿孔1313、132卜分別用以將該主機板131與擴展卡 出螺接於該承載盤133與擴展架134上，該電池架j36 的5亥些支撐腳1361具有對應於該些第四穿孔1313、1321 的第三穿孔1361卜從而可藉由依序穿過該些第三穿孔 WU和第四穿孔1313、1321的螺絲，將該電池架⑶的 兩端分別鎖固於該主機板131與擴展卡132上，但不以此 為限’於其它實施例中’亦可選用其它的鎖固機制作為替 代。因此，該電池架136的設置毋需在該主機板ΐ3ι上增 111618 1380160 設穿孔，以避免佔用該主機板131固有的電路佈局空間。 綜上所述，本發明之伺服器，具有分別可抽取式地設 於機箱的前、後兩端的硬碟陣列和主機板模組，以便於對 其實現熱插拔。該主機板模組具有用以承載主機板之承載 盤、用以承載具有金手指的擴展卡之擴展架、以及用以電 性連接該主機板與擴展卡的電纜線，該電纜線可以避免該 主機板的訊號受到傳遞路徑長度的影響而失真，故本發明 之主機板能通過擴展卡之金手指及其所插設之伺務器取得 聯繫，以降低伺務器的設計和製造成本，即本發明能有效 克服了習知技術中之種種缺失而具高度產業利用價值。 上述實施例僅例示性說明本創作之原理及其功效，而 非用於限制本發明。任何熟習此項技藝之人士均可在不違 背本發明之精神及範疇下，對上述實施態樣進行修飾與改 變。因此，舉凡所屬技術領域中具有通常知識者在未脫離 本發明所揭示之精神與技術思想下所完成之一切等效修飾 或改變’仍應由後述之申請專利範圍所涵盖。 【圖式簡單說明】 以下圖式均為簡化之圖式，而僅以示意方式說明本發 明之基本構想，圖式中僅顯示與本發明之伺服器有關元件 而非按照實際實施時之元件數目、形狀及尺寸繪製，其實 際實施時各元件之型態、數量及比例可依情況調整變更。 第1圖為本發明之一實施例之伺服器内部結構之局部 分解圖；以及 第2圖為第1圖所示伺服器之主機板模組之局部分聲s] 111618 1380160 圖。 【主要元件符號說明】In the example of the present invention, each of the motherboard modules 13 may include a battery rack = a battery 2 for carrying the operation of the motherboard module 13 , and the battery 136 has at least two supporting legs 1361 . The foot (3) 1 is extended downward from the bottom surface of the battery holder U6, and is respectively fixed on the main board ΐ3ι = the expansion card U2, so that the bottom of the battery holder 136 is separated from the expansion board 132 and the expansion card 132, so as not to hinder The motherboard (3) and the circuit layout of the expansion card 132 relative to the position of the battery holder 136. A > wherein the motherboard board 131 and the expansion card 132 (four) edge respectively have a fourth through hole 1313, 132 for respectively screwing the motherboard 131 and the expansion card to the carrier tray 133 and the extension frame 134. The support pins 1361 of the battery holder j36 have third through holes 1361 corresponding to the fourth through holes 1313 and 1321 so as to be able to pass through the screws of the third through holes WU and the fourth through holes 1313 and 1321 in sequence. The two ends of the battery holder (3) are respectively locked on the motherboard 131 and the expansion card 132. However, other locking mechanisms may be used instead of the other embodiments. Therefore, the arrangement of the battery holder 136 is not required to be provided with a hole in the main board ΐ3ι to avoid occupying the circuit layout space inherent to the main board 131. In summary, the server of the present invention has a hard disk array and a motherboard module which are respectively detachably disposed at the front and rear ends of the chassis, so as to facilitate hot swapping. The motherboard module has a carrier tray for carrying a motherboard, an extension bracket for carrying an expansion card with a gold finger, and a cable for electrically connecting the motherboard and the expansion card, the cable can avoid the cable The signal of the motherboard is distorted by the length of the transmission path, so the motherboard of the present invention can be contacted by the gold finger of the expansion card and the server it is inserted to reduce the design and manufacturing cost of the server, that is, The invention can effectively overcome the various defects in the prior art and has high industrial utilization value. The above embodiments are merely illustrative of the principles of the present invention and its effects, and are not intended to limit the invention. Modifications and alterations of the above-described embodiments can be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, all equivalent modifications or changes made by those of ordinary skill in the art without departing from the spirit and scope of the invention will be covered by the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS The following drawings are simplified diagrams, and only the basic concept of the invention is illustrated in a schematic manner, only the number of components related to the server of the present invention is shown, rather than the number of components in actual implementation. Drawing, shape and size, the actual type of implementation of each component type, quantity and proportion can be adjusted according to the situation. 1 is a partially exploded view of the internal structure of a server according to an embodiment of the present invention; and FIG. 2 is a partial partial sound s] 111618 1380160 of the motherboard module of the server shown in FIG. 1. [Main component symbol description]
1 伺服器 11 機箱 111 底板 112 隔板 113 側壁 12 硬碟陣列 121 導引部 13 主機板模組 131 主機板 1311 中央處理器 1312 内存條 1313 第四穿孔 1314 第一連接埠 132 擴展卡 1321 第四穿孔 1322 金手指 1323 第二穿孔 133 承載盤 134 擴展架 1341 開口 135 導風板 1351 延伸部 第一穿孔 電池架 支撐腳 第三穿孔 第一電纜線 電源模組 轉接板 第二連接埠 風扇模組 風扇 固定架 第二電纜線 第三電纜線 電池1 Server 11 Chassis 111 Backplane 112 Separator 113 Sidewall 12 Hard Disk Array 121 Guide 13 Motherboard Module 131 Motherboard 1311 Central Processing Unit 1312 Memory Module 1313 Fourth Perforation 1314 First Connection 埠 132 Expansion Card 1321 Fourth Perforation 1322 Gold finger 1323 Second perforation 133 Carrier disk 134 Expansion frame 1341 Opening 135 Air guide plate 1351 Extension first perforated battery holder Support foot Third perforation First cable Power module Adapter plate Second connection 埠 Fan module Fan holder second cable third cable battery
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