TWI379373B - Substrate processing apparatus and manufacturing method for a semiconductor device - Google Patents

Substrate processing apparatus and manufacturing method for a semiconductor device Download PDF

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Publication number
TWI379373B
TWI379373B TW096143938A TW96143938A TWI379373B TW I379373 B TWI379373 B TW I379373B TW 096143938 A TW096143938 A TW 096143938A TW 96143938 A TW96143938 A TW 96143938A TW I379373 B TWI379373 B TW I379373B
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Taiwan
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opening
storage container
loading
box
substrate
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TW096143938A
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Chinese (zh)
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TW200832592A (en
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Yukinori Aburatani
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Hitachi Int Electric Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

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1379373 九、發明說明 【發明所屬之技術領域】 本發明是有關基板處理裝置及半導體裝置的製造方法 〇 例如，關於有效利用於在製作半導體積體電路裝置（ 以下稱爲1C )的半導體晶圓（以下稱爲晶圓）中形成絕緣 膜、金屬膜、半導體膜等的薄膜或擴散雜質之批次式縱形 擴散· CVD裝置者。 【先前技術】 在基板處理裝置之一例的批次式縱形擴散· CVD裝置 (以下稱爲批次式CVD裝置）中，是複數片的晶圓被收 納於收納容器的狀態下處理。 就以往的收納容器而言，有開放卡匣（open cassette )、及 FOUP( front opening unified pod，以下稱爲箱） 。開放卡匣是形成大略立方體的箱形狀，對向之一對的面 會被開口。箱是形成大略立方體的箱形狀，一個的面會被 開口，且在該開口面可裝脫自如地裝著門。 箱是在密閉晶圓的狀態下搬送。因此，即使在箱周圍 的環境中存在粒子等，箱内的晶圓還是可維持清浄度。因 此，設置有批次式CVD裝置的無塵室内不必將清浄度設 定太高。其結果，可降低無塵室的清浄度維持所要的成本 於是’在最近的批次式CVD裝置中，將箱採用於收 1379373 納容器。 使用箱的批次式CVD裝置是在晶圓搬入箱内或晶圓 從箱内搬出的晶圓授受埠具備箱開閉裝置（以下稱爲開箱 器（Pot Opener))及測繪（mapping)裝置（例如參照專 利文獻1 )。 開箱器可裝著或卸下門來開閉箱的晶圓出入口。測繪 裝置是藉由檢測出箱内的晶圓，來檢測出晶圓是否分別被 保持於各晶圓保持溝（槽）。 〔專利文獻1〕特開2003-7801號公報 【發明內容】 (發明所欲解決的課題） 以往的批次式CVD裝置中，是在從裝置外部（框體 外部）將箱搬入至批次式CVD裝置的框體内或從框體内 搬出箱的搬入搬出部中，無法著脫箱的門。 在搬入搬出部中爲了裝著或卸下箱的門，可考量在搬 入搬出部設置退避可能的開箱器之構成。亦即，從框體外 將箱搬入至框體内’或從框體内將箱搬出至框體外時，藉 由使開箱器從搬入搬出部退避，可確保使箱搬入或搬出的 通路。 然而，在此構成中，爲了使開箱器從搬入搬出部退避 ，會有批次式CVD裝置形成複雜的問題點。 本發明的目的是在於提供一種在將箱搬出入至框體内 外的搬入搬出部中’可裝著或卸下箱的門，且可使構造形 -5- 1379373 成簡單之基板處理裝置及半導體裝置的製造方法。 (用以解決課題的手段） 用以解決上述課題的手段是如其次般。 • 亦即，一種基板處理裝置，其特徵係具備： . 收納容器，其係收納複數的基板，基板出入口會藉由 蓋體來阻塞； # 搬入搬出部，其係於框體内與外之間進行該收納容器 的搬入搬出； 載置部，其係於該搬入搬出部載置上述收納容器； 保管室，其係鄰接於上述搬入搬出部而設置，保管上 述收納容器； 開閉裝置，其係進行載置於該載置部之上述收納容器 的上述基板出入口的開閉； 搬送裝置，其係具有保持上述收納容器下面的保持機 ® 構，經由上述開閉裝置的上方，在上述保管室内與外之間 ’搬送藉由該保持機構來保持的上述收納容器；及 昇降機構，其係於上述開閉裝置進行上述收納容器的 . 開閉時之上述載置部的高度位置、與上述搬送裝置進行上 述收納容器的授受的高度位置之間，進行上述載置部的昇 降。 〔發明的效果〕 若根據上述手段，則藉由設置昇降機構，搬送裝置可 -6- 1379373 經由開閉裝置的上方來從載置裝置使收納容器搬送至框體 内，因此可順暢交接的同時，可不用使開閉裝置退避，移 動收納容器，且在搬入搬出部中可開閉收納容器的蓋體。 【實施方式】 以下，按照圖面來説明本發明之一實施形態。 在本實施形態中，本發明的基板處理裝置爲批次式 CVD裝置亦即批次式縱形擴散· CVD裝置，如圖1及圖2 所示般構成。 並且，在本實施形態中，收納基板亦即晶圓1的收納 容器爲使用箱2。 箱2是形成大略立方體的箱形狀，如圖3所示，在箱 2的一個側壁開設有晶圓出入口 3。在晶圓出入口 3作爲 予以閉塞的蓋體之門4會被安裝成可裝著或卸下。在箱2 的下面埋設有複數個的定位孔5。 如圖1、圖2及圖3所示，本實施形態的批次式CVD 裝置10是具備作爲框體的一部份之主框體11。 主框體11的正面壁11a是構成區劃主框體11内外的 區劃壁。在該正面壁11a的中間高度開設有使主框體u 内外連通的箱搬入搬出口 12。箱搬入搬出口 12是供以搬 入箱2，或搬出箱2。前遮擋板（front shutter ) 13是在於 開啓或關閉箱搬入搬出口 12。 在主框體11的正面壁（區劃壁）11a的外側設置有裝 載痒14。裝載埠14是位於箱搬入搬出口 12的大略正下方 1379373 。裝載埠14是構成搬入搬出部。裝載埠14會將所 的箱2對準於箱搬入搬出口 ！2。裝載埠14是2個 置。 箱2是在裝載埠14上藉由位於批次式CVD裝 框體外）的工程内搬送裝置（亦稱爲工程間搬送裝 搬入，或從裝載埠14上搬出。 就工程内搬送裝置而言，有圖1所示之床走行 搬送車（以下稱爲AGV ) 9、圖8所示之頂棚走行 搬送裝置（後述）等，皆可適用。 在正面壁1 1 a的前面側設有作爲前框體的箱 14A。匣14A是形成可圍繞裝載埠14及該上方空 匣1 4 A的頂棚壁開設有頂棚開口 1 4B，在箱1 4的 開設有正面開口 1 4C。亦即，裝載埠1 4可經由正 14C來受取箱2，且亦可經由頂棚開口 14B來受取。 另外，匣14A與主框體1 1是構成批次式CVD 框體。 如圖1所示，在匣14A内設置有後述的控制器 在裝載堤14設置有箱升降機（pod elevator) 升降機15是構成在高度與箱搬入搬出口 12的高度 箱2昇降的機構。 箱升降機15是具備：昇降驅動裝置16、及藉 驅動裝置16來昇降的軸（shaft) 17。水平設置於_ 端的保持台（收納容器載置部）18與作爲收納容器 段（亦稱爲收納容器定位具）的複數個支承運： 被載置 並列設 置外（ 置）來 型構内 型構内 (box) 間。在 正面壁 面開口 裝置的 77 -15。箱 之間使 由昇降 & 17上 定位手 動銷（ -8 - 1379373 kinematic pin) 19是被連結於箱升降機15。複數根的運 動銷19是突設於保持台18上面，分別嵌入形成於箱2下 面的各定位孔5，藉此來將箱2定位於保持台18。箱升降 機15是藉由保持台18來由下支撐箱2，且在使支承運動 銷1 9嵌入箱2的定位孔5之狀態下令箱2昇降。 亦即，保持台18是構成保持箱2下面的保持部，且 構成箱載置部。 在主框體11的正面壁11a的内側設置有構成預載（ Load Lock )室20的密閉框體21。密閉框體21是對應於 裝載埠（Load Port) 14的高度。預載室20是構成可維持 充塡惰性氣體例如氮氣的箱蓋體開閉室。 如圖1所示，在密閉框體21分別連接氮氣體供給線 路21A的一端及排氣線路21B的一端。氮氣體供給線路 21A的另一端是連接至氮氣體供給裝置21A’排氣線路21B 的另一端是連接至排氣裝置21B’。氮氣體供給線路21A 是對預載室20内供給氮氣體。排氣線路21B是將預載室 2〇内予以排氣。 另外，控制器77是在於控制氮氣體供給裝置2 1A，及 排氣裝置2 1 B ’。 在主框體11的正面壁11a，門出入口 22會被開設於 預載室20上部所對向的部位。門出入口 22是形成對應於 裝載埠14所載置之箱2的晶圓出入口 3的大小（比晶圓 出入口 3更大）。 在預載室20内設置有作爲收納容器蓋體開閉部（亦 -9 - 1379373 稱爲開閉裝置）的開箱器23。開箱器23是在於開啓或關 閉被載置於裝載埠14之箱2的晶圓出入口 3及正面壁11a 的門出入口 2 2。 開箱器23是具備移動台25及閉合器26。移動台25 • 是可對門出入口 22移動於前後（垂直方向）及上下（平 . 行方向）。作爲蓋體保持部的閉合器26是藉由移動台25 來移動。閉合器26可保持門4，且可阻塞門出入口 22。 • 亦即，移動台25會使保持門4之狀態的閉合器26移 動於前後及上下，藉此開箱器23可開啓或關閉箱2的晶 圓出入口 3及門出入口 22。 在對向於密閉框體21的門出入口 22的部位，設置有 作爲基板狀態檢測裝置的測繪裝置27。 測繪裝置27是具備：驅動源的線性促動器28、夾具 (holder) 29、及複數的檢測元件30。夾具29可藉由線 性促動器2 8來對箱2的晶圓出入口 3移動於前後方向。 ^ 複數的檢測元件30是被保持於夾具29。 測繪裝置2 7是藉由各檢測元件3 0來分別檢測出箱2 内的晶圓1。藉此，測繪裝置27可檢測出是否晶圓1分別 . 被各1片保持於箱2内的複數個槽。 在主框體11内的前側領域形成有箱保管室lib。在箱 保管室lib内設置有旋轉式箱架31。旋轉式箱架31是配 置於箱保管室lib内的前後方向大略中央部中的上部空間 。旋轉式箱架31是構成在框體内保管收納容器的保管架 -10- 1379373 旋轉式箱架31是具備支柱32及複數片的架板 柱32是垂直立設，在水平面内間歇旋轉。複數片 33是在支柱32的上中下段的各位置被放射狀支撐 片的架板33可分別載置複數個的箱2。 在架板33的上面突設有複數個的支承運動銷 承運動銷34可嵌入箱2的定位孔5。 在箱保管室lib内設置有箱搬送裝置35。箱搬 35是構成在裝載埠14與旋轉式箱架31之間經由箱 出口 12來搬送箱2的搬送裝置。 箱搬送裝置35是藉由作爲收納容器昇降機構 降機35a、及作爲收納容器搬送機構的箱搬送機構 構成。箱搬送機構35b是具有保持箱的下面之保持 稱爲保持機構）。 箱搬送裝置35是藉由箱升降機35a與箱搬送機 的連續動作，在保持台18與旋轉式箱架31和後述 器42的載置台43之間搬送箱2。 如圖2所示，在主框體11内的前後方向大略 中的下部，副框體40繪被構築於後端。 在副框體40的正面壁40a，一對的晶圓搬入 41、41會在垂直方向排列成上下二段而開設，在上 晶圓搬入搬出口 4 1、4 1分別設置有開箱器42、42 搬入搬出口 41可對副框體40内搬入晶圓1，從副fl 搬出。 開箱器42是具備：載置箱2的載置台43、及 33。支 的架板 。複數 34，支 送裝置 搬入搬 的箱升 35b來 部（亦 構35b 的開箱 中央部 搬出口 下段的 。晶圓 ΐ體40 著脫箱 -11 - 1379373 2的門4之著脫機構44。藉由著脫機構44來安裝或卸下 被載置於載置台43的箱2的門4,藉此開箱器42可開閉 箱2的晶圓出入口 3。 副框體40是構成預備室45，預備室45是從設置有箱 搬送裝置35及旋轉式箱架31的保管室llb來隔絶流體。 在預備室45的前側領域設置有晶圓移載機構46。晶 圓移載機構46是具備晶圓移載裝置46a、晶圓移載裝置升 降機4 6b及鑷子46c。鑷子46c是構成晶圓1的載置部。 晶圓移載裝置46a是使保持晶圓1的鑷子46c在水平面内 旋轉乃至直進。晶圓移載裝置升降機46b是設置於預備室 45内的前方領域右端部。晶圓移載裝置升降機46b是使晶 圓移載裝置46a昇降。 晶圓移載機構46是藉由晶圓移載裝置升降機46b及 晶圓移載裝置46a的連續動作來使鑷子46c所保持的晶圓 1從箱2搬送至載舟（boat)(基板保持具）47，將搬送 的晶圓I裝塡（charging)至載舟47。 並且，晶圓移載機構46是以鑷子46c來保持載舟47 的晶圓1，藉此自載舟47卸下（（1丨8£：1^1^1^)，從載舟 47搬送至箱2，而回到箱2。 控制器77是在於控制裝載埠1 4、箱升降機1 5、開箱 器23、測繪裝置27 '旋轉式箱架3 1、箱搬送裝置35 '開 箱器42、晶圓移載機構46等之批次式CVD裝置内的所有 動作。 在預備室45的後側領域設置有用以使載舟47昇降的 -12- 1379373 載舟升降機48。 在作爲連結至載舟升降機48的昇降台的連結具之手 臂49水平安裝有加封蓋（sealcap ) 50。加封蓋50是垂直 支撐載舟47,可閉塞後述之處理爐51的下端部。 • 載舟47是具備複數根的保持構件。載舟47是在使複 . 數片（例如5 0片〜1 2 5片程度）的晶圓1中心一致整列於 垂直方向的狀態下，分別保持於水平。 • 雖圖示省略，但實際在與晶圓移載裝置升降機46b側 及載舟升降機48側呈相反側的預備室45的左側端部設置 有清潔氣體供給單元（以下稱爲清潔單元）。清潔單元是 藉由供給風扇及防塵過濾器所構成。清潔單元是在於供給 清浄化後的環境或惰性氣體的清潔空氣（清潔氣體）。 並且，在晶圓移載裝置46a與清潔單元之間設置有刻 槽對準裝置。刻槽對準裝置是構成使晶圓的圓周方向的位 置整合之基板整合裝置。 ® 從清潔單元吹出的清潔空氣是流通至刻槽對準裝置、 晶圓移載裝置4 6a及載舟47之後，藉由未圖示的管（duct ' )來吸入。被吸入的清潔空氣是被排氣至主框體11的外 . 部，或被循環至清潔單元的吸入側亦即一次側（供給側） 再度藉由清潔單元來吹出至預備室45内。 在副框體40上設置有圖4所示的處理爐51。 如圖4所示，處理爐5 1是具有作爲加熱機構的加熱 器52。 加熱器52爲圓筒形狀，被支撐於作爲保持板的加熱 -13- 1379373 器基座53，垂直安裝。 在加熱器5 2的内側，與加熱器5 2同心圓狀地配設有 作爲反應管的製程管（process tube) 54。製程管54是由 作爲外部反應管的外管55、及設於其内側之作爲内部反應 管的內管56所構成。 外管55是例如由石英（Si02 )或碳化矽（SiC )等 的耐熱性材料所形成。外管55是内徑比內管56的外徑更 大，形成上端閉塞下端開口的圓筒形狀。外管55是與內 管56同心圓狀地設置。 內管5 6是例如由石英或碳化矽等的耐熱性材料所形 成。內管56是形成上端及下端開口的圓筒形狀。內管56 的筒中空部是形成處理室57。處理室57可收容使晶圓1 以水平姿勢多段整列於垂直方向而保持的載舟47。 外管5 5與內管5 6的間隙是形成筒狀空間5 8。 在外管55的下方，與外管55同心圓狀地配設有岐管 (manifold ) 59。岐管5 9是例如由不鏽鋼所形成。岐管 59是形成上端及下端開口的圓筒形狀。岐管59是卡合於 外管55及內管56，支撐該等。 岐管59會被加熱器基座53所支撐，藉此製程管54 會形成垂直安裝的狀態。 製程管54及岐管59是形成反應容器。 另外，在岐管59與外管55之間設有作爲密封構件的 0型環59a。 在加封蓋50連接作爲氣體導入部的噴嘴60，噴嘴60 -14- 1379373 是連通至處理室57内》在噴嘴60連接氣體供給管61 氣體供給管61是在與噴嘴60的連接側呈相反的 上流側），經由MFC (質量流控制器）62來連接氣 給源63。MFC62是構成氣體流量控制器。氣體供給: 是在於供給處理氣體、惰性氣體等的所望氣體。 在MFC62是藉由電氣配線C來電性連接氣體流 制部 64，氣體流量控制部64會以所望的時序來 MFC 62，而使供給的氣體流量能夠形成所望的量。 在岐管59設有將處理室57内的環境予以排氣的 管65。排氣管65是配置於筒狀空間58的下端部，連 筒狀空間5 8。 排氣管65是在與岐管59的連接側呈相反的側（ 側），經由壓力感側器66及壓力調整裝置67來連接 裝置68。壓力感側器66是構成壓力檢測器。排氣裝 是藉由真空泵等來構成。壓力感側器66、壓力調整 67及排氣裝置68是將處理室57内予以排氣，而使其 能夠形成所定的壓力（真空度）。 在壓力調整裝置67及壓力感側器66是藉由電氣 B來電性連接壓力控制部69。壓力控制部69是根據 感側器66所檢測出的壓力來以所望的時序控制壓力 裝置67，而使處理室57内的壓力能夠形成所望的壓；^ 加封蓋50是從垂直方向下側來抵接於岐管59下 加封蓋50是構成可將岐管59的下端開口予以氣密地 之爐口蓋體。 側（ 體供 泵63 量控 控制 排氣 通至 下流 排氣 置68 裝置 壓力 配線 壓力 調整 I ° 端。 閉塞 -15- 1379373 加封蓋50是例如由不鏽鋼等的金屬所構成，形成圓 盤狀。在加封蓋50的上面設有作爲密封構件的〇型環 5 0a。Ο型環50a是與岐管59的下端抵接》 加封蓋50是在與處理室57相反的側設置有使載舟旋 • 轉的旋轉機構70。旋轉機構70的旋轉軸71是貫通加封蓋 . 50,而連接至載舟47。旋轉軸71是藉由使載舟47旋轉來 令晶圓1旋轉。 # 在旋轉機構70及載舟升降機48是藉由電氣配線A來 電性連接驅動控制部72。驅動控制部72是以所望的時序 來控制旋轉機構70及載舟升降機48，而使能夠進行所望 的動作。 載舟47是例如由石英或碳化矽等的耐熱性材料所形 成。載舟47是使複數片的晶圓1整列成水平姿勢且彼此 中心一致的狀態，而來保持成多段。 另外，在載舟47的下部，複數片的隔熱板73會以水 ^ 平姿勢來配置成多段。隔熱板7 3是例如使用石英或碳化 矽等的耐熱性材料，形成圓板形狀。隔熱板73是構成隔 熱構件。複數片的隔熱板73是使來自加熱器52的熱難以 . 傳至岐管5 9側。 在製程管54内設置有温度感側器74。温度感側器74 是構成温度檢測器。在加熱器52及温度感側器74是藉由 電氣配線D來電性連接温度控制部75。 温度控制部75是根據温度感側器74所檢測出的温度 資訊來整合往加熱器52的通電狀況，藉此以所望的時序 -16- 1379373 來控制加熱器52，而使處理室57内的温度能夠形成所望 的温度分布。 氣體流量控制部64、壓力控制部69、驅動控制部72 及温度控制部75亦構成操作部及輸出入部，電性連接至 控制批次式CVD裝置全體的主控制部76。 氣體流量控制部64、壓力控制部69、驅動控制部72 、温度控制部75及主控制部76是構成控制器77。 其次，針對使用以上構成的批次式CVD裝置時來説 明本發明之一實施形態的1C製造方法。 另外，在以下的説明中，構成批次式CVD裝置的各 部之作動是藉由控制器77來控制。 如圖1〜圖3所示，當工程内搬送裝置經由正面開口 14C或頂棚開口 14B，搬入至裝載埠14時，箱2是被載置 於保持台1 8。 此時，保持台18的支承運動銷19會被嵌入箱2的下 面的定位孔5，藉此箱2會形成定位於保持台1 8的狀態。 其次，如圖5(a)所示，在裝載埠14中’箱2會被 移動於開箱器23的方向，而門4會被保持於開箱器23的 閉合器26。 —旦閉合器26保持門4’則會藉由移動台25的後退 來使門4從晶圓出入口 3卸下（脫裝）。 然後，如圖5(b)所示’閉合器26是在預載室20内 藉由移動台25的下降來從晶圓出入口 3的位置脫離。 —旦晶圓出入口 3被開放’則如圖5 ( b )所示’測繪 -17- 1379373 裝置27的夾具29會藉由線性促動器28來***至晶圓出 入口 3。測繪裝置27的檢測元件30是在於測繪箱2内的 晶圓1。 一旦所定的測繪完了，則測繪裝置27的夾具29會藉 由線性促動器28來使從晶圓出入口 3回復到原來的待機 位置。 一旦夾具29回復到待機位置，則閉合器26會藉由移 動台25的上昇來移動至晶圓出入口 3的位置。 然後，如圖5 ( a )所示，閉合器26會藉由移動台25 的前進來將門4安裝於晶圓出入口 3(裝著）。 當藉由該測繪裝置27所讀取的測繪資訊、與有關該 箱（讀取對象的箱）2所預先提供的測繪資訊不同時，所 被發現不同的箱2會從裝載埠14藉由工程内搬送裝置、 例如圖1所示的AGV 9來立即搬送至晶圓編成工程或之前 的工程等。 藉此，與將箱2搬入至主框體11内、特別是載置台 43或旋轉式箱架3 1後回到搬入搬出部之後返送的情況時 相較之下，可大幅度減少步驟。進而可抑止往載舟47之 晶圓載置時間的増大及晶圓處理開始待機時間的増大。 當藉由前述的測繪裝置27所讀取的測繪資訊、與有 關該箱2所預先提供的測繪資訊一致時，如圖6所示，藉 由保持台18來支撐的箱2會利用箱升降機15來從裝載埠 14上昇至相搬入搬出口 12的闻度。 具體而言，保持台18是上昇至比密閉框體21更上方 -18 - 1379373 ’亦即可藉由箱搬送機構35b來將箱2從下側拾取的高度 〇 —旦箱2上昇至箱搬入搬出口 12的高度，則箱搬入 搬出口 12會由前遮擋板13來開放》 接著’箱搬送機構35b會潛入箱搬入搬出口 12，如圖 6所示’被保持台18所支撐的箱2是藉由箱搬送裝置35 的箱搬送機構3 5 b來從下側拾取。亦即，在保持台1 8與 箱搬送機構之間交接箱2。 藉由箱搬送機構35b來拾取的箱2是從箱搬入搬出口 12來搬入至主框體11内。亦即’箱2是藉由箱搬送機構 來經由開箱器23或密閉框體21的上方來從主框體Η外 搬入内。另外’亦可跨越開箱器23或密閉框體21來從主 框體1 1外搬入内。 如圖1及圖2所示，被搬入的箱2是藉由箱搬送裝置 35來自動地搬送至旋轉式箱架31所指定的架板33而交接 〇 此時’架板33的支承運動銷34會被嵌入箱2的下面 的定位孔5 ’藉此箱2會形成被定位保持於架板3 3的狀態 〇 箱2是暫時被保管於架板33。 然後，箱2是藉由箱搬送裝置35來從架板33搬送至 —方的開箱器42，而移載至載置台43。 此時，開箱器42的晶圓搬入搬出口 41會藉由著脫機 構44來關閉，在預備室45中流通充滿清潔空氣。 -19- 1379373 在預備室45充滿作爲清潔空氣的氮氣。在此狀態下 ’預備室45的氧濃度是例如20ppm以下，遠比主框體11 的内部（大氣環境）的氧濃度更低。 另外’藉由搬送機構35b來從箱搬入搬出口 12搬入 至主框體11内的箱2’亦有時會直接被搬送至設置於晶圓 搬入搬出口 41的開箱器42。 被載置於載置台43的箱2是開口側端面會被推壓至 正面壁40a的晶圓搬入搬出口 41開口緣邊部。接著，門4 會藉由著脫機構44來卸下，箱2會開放於晶圓出入口 3。 此時，因爲在裝載埠1 4中已經被測繪，所以有關箱2 内的晶.圓1群之測繪可省略。 —旦箱2藉由開箱器42而開放，則晶圓移載裝置46a 會利用鑷子46c經由晶圓出入口 3來從箱2拾取晶圓1。 —旦藉由鑷子46c來拾取晶圓1，則晶圓移載裝置46a會 將晶圓1搬送至刻槽對準裝置（未圖示）。刻槽對準裝置 是在於對準晶圓1位置。位置對準後，晶圓移載裝置4 6 會藉由鑷子46c來從刻槽對準裝置拾取晶圓1，搬送至載 舟 47。晶圓移載裝置 46會將搬送的晶圓1裝塡（ charging )至載舟 47。 將晶圓1交接至載舟47後的晶圓移載裝置46a會回 到箱2，將其次的晶圓1裝塡至載舟47。 在該一方（上段或下段）的開箱器42之利用晶圓移 載機構46來將晶圓1裝塡至載舟47的作業中，另一方（ 下段或上段）的開箱器42是藉由箱搬送裝置35來從旋轉 -20- 1379373 式箱架31搬送移載別的箱2。在該另一方的開箱器42中 是同時進行開箱器42之箱2的開放作業。 —旦被預先指定的片數的晶圓1被裝塡於載舟47，則 藉由爐口遮檔板（shutter)(未圖不）所被關閉的處理爐 51的下端部會藉由爐口遮擋板來開放。 接著，保持晶圓1群的載舟47是加封蓋50會藉由載 舟升降機48來上昇，藉此往處理爐51内搬入（載舟載入 )°1379373 IX. The present invention relates to a substrate processing apparatus and a method of manufacturing a semiconductor device, for example, a semiconductor wafer (for example, 1C) which is effectively used in manufacturing a semiconductor integrated circuit device (hereinafter referred to as 1C) Hereinafter, a batch type vertical diffusion/CVD apparatus which forms a film of an insulating film, a metal film, a semiconductor film, or the like, or a diffusion impurity, is referred to as a wafer. [Prior Art] In a batch type vertical diffusion/CVD apparatus (hereinafter referred to as a batch type CVD apparatus) which is an example of a substrate processing apparatus, a plurality of wafers are processed in a state of being received in a storage container. In the conventional storage container, there are an open cassette and a FOUP (front opening unified pod). The open cassette is a box shape that forms a roughly cubic shape, and the opposite side faces are opened. The box is in the shape of a box forming a roughly cubic shape, and one of the faces is opened, and the door can be detachably attached to the open face. The box is transported in a state in which the wafer is sealed. Therefore, even if particles or the like are present in the environment around the tank, the wafer in the tank can maintain the cleanliness. Therefore, the clean room provided with the batch type CVD apparatus does not have to set the cleanness too high. As a result, the cost of maintaining the cleanliness of the clean room can be reduced. Thus, in the recent batch type CVD apparatus, the tank was used to receive a 1379373 纳 container. The batch type CVD apparatus using the box is a wafer transfer device (hereinafter referred to as a "Pot Opener") and a mapping device (hereinafter referred to as a "pot opener") and a wafer transfer device in which the wafer is carried into the case or the wafer is carried out from the case. For example, refer to Patent Document 1). The unpacker can be loaded or unloaded to open and close the wafer entry and exit. The surveying device detects whether the wafers are held in the respective wafer holding grooves (grooves) by detecting the wafers in the tank. [Patent Document 1] JP-A-2003-7801 SUMMARY OF THE INVENTION (Problems to be Solved by the Invention) In a conventional batch type CVD apparatus, a case is carried out from the outside of the apparatus (outside the casing) to the batch type. In the casing of the CVD apparatus or the loading/unloading section of the unloading box from the casing, the door of the unboxing cannot be removed. In the loading/unloading unit, in order to attach or detach the door of the box, it is possible to consider a configuration in which the unpacking device is provided in the loading/unloading unit. In other words, when the box is carried into the casing from the outside of the casing or when the casing is carried out of the casing, the unpacking device is retracted from the loading and unloading portion, thereby ensuring the passage for loading or unloading the casing. However, in this configuration, in order to evacuate the unpacker from the loading/unloading portion, the batch type CVD apparatus may have a complicated problem. An object of the present invention is to provide a door that can be loaded or unloaded in a loading/unloading unit that carries a box into and out of a casing, and that can form a simple substrate processing apparatus and semiconductor. The method of manufacturing the device. (Means for Solving the Problem) The means for solving the above problems are as follows. A substrate processing apparatus characterized by: a storage container that accommodates a plurality of substrates, and the substrate entrance and exit is blocked by a lid; #Loading and unloading, which is between the inside and the outside of the casing The loading and unloading of the storage container is performed; the mounting portion is mounted on the loading and unloading portion; the storage chamber is provided adjacent to the loading/unloading portion, and the storage container is stored; and the opening and closing device is performed Opening and closing of the substrate inlet and outlet of the storage container placed in the mounting portion; and a conveying device having a holder structure for holding the lower surface of the storage container, and passing between the storage chamber and the outside through the opening and closing device The transport container that is held by the holding mechanism, and the elevating mechanism that is used by the opening and closing device to perform the opening and closing of the storage container, the height position of the mounting portion, and the storage device to perform the storage container The lifting and lowering of the mounting portion is performed between the height positions of the receiving and receiving. [Effects of the Invention] According to the above-described means, by providing the elevating mechanism, the transport device can transport the storage container from the mounting device to the casing via the upper side of the opening and closing device, and can smoothly transfer the container. The storage container can be moved without retracting the opening and closing device, and the lid of the storage container can be opened and closed in the loading/unloading portion. [Embodiment] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the present embodiment, the substrate processing apparatus of the present invention is a batch type CVD apparatus, that is, a batch type vertical diffusion/CVD apparatus, and is configured as shown in Figs. 1 and 2 . Further, in the present embodiment, the storage container, that is, the storage container of the wafer 1, is the use case 2. The case 2 is in the shape of a box forming a substantially cubic shape, and as shown in Fig. 3, a wafer inlet and outlet 3 is opened on one side wall of the case 2. The door 4, which is the cover to be closed, is mounted to be detachable or detachable at the wafer entrance 3. A plurality of positioning holes 5 are embedded in the lower surface of the case 2. As shown in Fig. 1, Fig. 2, and Fig. 3, the batch type CVD apparatus 10 of the present embodiment is provided with a main casing 11 as a part of a casing. The front wall 11a of the main frame body 11 is a partition wall constituting the inside and outside of the main frame body 11. A tank loading/unloading port 12 that communicates the inside and the outside of the main casing u is provided at an intermediate height of the front wall 11a. The box loading/unloading port 12 is for carrying in the box 2 or moving out of the box 2. The front shutter 13 is for opening or closing the tank loading/unloading port 12. An itch 14 is mounted on the outer side of the front wall (section wall) 11a of the main casing 11. The loading magazine 14 is located directly below the box loading and unloading port 12 1379373. The loading cassette 14 is a loading/unloading unit. The loading cassette 14 will align the box 2 with the box into the loading and unloading port! 2. The loading cassette 14 is set to 2. The case 2 is carried by the in-house transfer device (also referred to as an inter-lab transfer device on the loading cassette 14), or is carried out from the loading cassette 14. For the in-project transfer device, The bed traveling transport vehicle (hereinafter referred to as AGV) 9 and the overhead transport transport device (described later) shown in Fig. 8 are applicable. The front side of the front wall 1 1 a is provided as a front frame. The box 14A of the body 14A is formed with a ceiling opening 14B which is formed around the ceiling wall of the loading cassette 14 and the upper space 14A, and a front opening 14C is opened in the box 14. The loading port 1 is also installed. 4, the box 2 can be taken up by the positive 14C, and can also be taken through the ceiling opening 14B. In addition, the crucible 14A and the main frame 1 1 constitute a batch type CVD frame. As shown in Fig. 1, it is set in the crucible 14A. A controller to be described later is provided with a pod elevator in the loading bank 14. The elevator 15 is a mechanism for raising and lowering the height of the tank 2 at the height of the tank loading/unloading port 12. The box elevator 15 is provided with a lifting and lowering device 16, and The shaft 16 of the drive unit 16 is raised and lowered. The level is set at _ The holding table (storage container placing portion) 18 and the plurality of supporting containers as the storage container segments (also referred to as storage container positioning devices) are arranged side by side to be placed in a side frame. In the front wall opening device, between 77 and -15. The positioning manual pin (-8 - 1379373 kinematic pin) 19 is attached to the box lift 15 by a lifting & 17 . The plurality of moving pins 19 are protruded from The top of the holding table 18 is respectively embedded in each positioning hole 5 formed under the box 2, thereby positioning the box 2 on the holding table 18. The box elevator 15 is supported by the holding table 18 from the lower supporting box 2, and is supported The movement pin 19 is inserted into the positioning hole 5 of the tank 2 to lower the tank 2. That is, the holding table 18 is a holding portion constituting the lower surface of the holding box 2, and constitutes a box placing portion. The front wall 11a of the main casing 11 The inside of the casing is provided with a sealed casing 21 constituting a load lock chamber 20. The sealed casing 21 is at a height corresponding to a load port 14. The preload chamber 20 is configured to maintain a charge-filled inert gas such as nitrogen. The lid of the lid is opened and closed. As shown in Figure 1, it is dense. The closed frame body 21 is connected to one end of the nitrogen gas supply line 21A and one end of the exhaust gas line 21B. The other end of the nitrogen gas supply line 21A is connected to the nitrogen gas supply device 21A'. The other end of the exhaust line 21B is connected to the exhaust gas. The apparatus 21B'. The nitrogen gas supply line 21A supplies a nitrogen gas to the preload chamber 20. The exhaust line 21B exhausts the preload chamber 2, and the controller 77 controls the nitrogen gas supply unit 2 1A. , and the exhaust unit 2 1 B '. In the front wall 11a of the main casing 11, the door entrance 22 is opened at a portion opposed to the upper portion of the preload chamber 20. The door entrance/exit 22 is formed to have a size (greater than the wafer entrance/exit 3) corresponding to the wafer inlet/outlet 3 of the tank 2 placed on the loading cassette 14. The preloading chamber 20 is provided with an unpacker 23 as a storage container lid opening and closing portion (also referred to as an opening and closing device -9 - 1379373). The unpacker 23 is a door entrance/exit 2 2 for opening or closing the wafer inlet and outlet 3 and the front wall 11a of the tank 2 placed on the loading cassette 14. The unpacker 23 is provided with a moving table 25 and a closer 26. Moving table 25 • It is possible to move the door entrance 22 to the front and rear (vertical direction) and up and down (flat direction). The closer 26 as the cover holding portion is moved by the moving table 25. The closure 26 holds the door 4 and blocks the doorway inlet 22. • That is, the mobile station 25 moves the closer 26 holding the state of the door 4 to the front, rear, and up and down, whereby the unpacker 23 can open or close the crystal entrance 3 and the door entrance 22 of the case 2. A surveying device 27 as a substrate state detecting means is provided at a portion facing the door entrance/exit 22 of the sealed casing 21. The surveying device 27 is a linear actuator 28 including a drive source, a holder 29, and a plurality of detecting elements 30. The jig 29 can move the wafer inlet and outlet 3 of the tank 2 in the front-rear direction by the linear actuator 28. The plurality of detecting elements 30 are held by the jig 29. The surveying device 27 detects the wafer 1 in the tank 2 by each detecting element 30. Thereby, the surveying device 27 can detect whether or not the wafer 1 is held in a plurality of slots in the tank 2 by one sheet. A tank storage compartment lib is formed in the front side area in the main casing 11. A rotary case 31 is provided in the box storage compartment lib. The rotary box frame 31 is an upper space that is disposed in the center portion of the box storage chamber lib in the front-rear direction. The rotary case 31 is a storage rack that houses the storage container in the casing. -10- 1379373 The rotary frame 31 is a frame plate 32 having a support 32 and a plurality of frames. The column 32 is vertically erected and intermittently rotated in a horizontal plane. The plurality of pieces 33 are placed on the shelf 33 which is radially supported at each position of the upper, middle, and lower stages of the support 32, and a plurality of cases 2 can be placed. A plurality of supporting motion pinning motion pins 34 projecting from the upper surface of the frame plate 33 can be inserted into the positioning holes 5 of the case 2. A tank transport device 35 is provided in the tank storage compartment lib. The tank transport 35 is a transport device that transports the tank 2 between the loading cassette 14 and the rotary box frame 31 via the tank outlet 12. The tank conveying device 35 is constituted by a storage container elevating mechanism lowering machine 35a and a tank conveying mechanism as a storage container conveying mechanism. The tank transport mechanism 35b is a hold having a lower surface of the cage, which is called a holding mechanism. The tank transporting device 35 transports the tank 2 between the holding table 18 and the rotating frame 31 and the mounting table 43 of the later-described device 42 by the continuous operation of the tank elevator 35a and the tank conveyor. As shown in Fig. 2, in the lower portion of the main frame body 11 in the front-rear direction, the sub-frame 40 is formed at the rear end. In the front wall 40a of the sub-frame 40, the pair of wafer loadings 41 and 41 are arranged in the vertical direction in the vertical direction, and the upper wafer loading/unloading ports 4 1 and 4 1 are respectively provided with the unpacker 42. 42. The loading/unloading port 41 can carry the wafer 1 into the sub-frame 40 and carry it out from the sub-fl. The unpacker 42 is provided with mounting stages 43 and 33 for mounting the box 2. Support plate. In the plural 34, the box for loading and unloading of the feeding device is lifted 35b (the lower portion of the central portion of the unpacking box 35b is also removed. The wafer cassette 40 is taken off the door 44 of the door 4 of the box -11 - 1379373 2 . The door 4 of the case 2 placed on the mounting table 43 is attached or detached by the detaching mechanism 44, whereby the unpacker 42 can open and close the wafer inlet and outlet 3 of the case 2. The sub-frame 40 constitutes a preparation room 45. The preparation chamber 45 isolates the fluid from the storage chamber 11b in which the tank conveyance device 35 and the rotary magazine 31 are provided. The wafer transfer mechanism 46 is provided in the front side of the preliminary chamber 45. The wafer transfer mechanism 46 is provided. The wafer transfer device 46a, the wafer transfer device lifter 46b, and the die 46c. The die 46c is a mounting portion that constitutes the wafer 1. The wafer transfer device 46a rotates the die 46c holding the wafer 1 in a horizontal plane. The wafer transfer device lifter 46b is disposed at the right end of the front field in the preparation chamber 45. The wafer transfer device lifter 46b moves the wafer transfer device 46a up and down. The wafer transfer mechanism 46 is formed by crystal Continuous operation of the circular transfer device lift 46b and the wafer transfer device 46a to make the dice 4 The wafer 1 held by 6c is transported from the tank 2 to a boat (substrate holder) 47, and the transported wafer I is slid to the carrying boat 47. Further, the wafer transfer mechanism 46 is The dice 46c holds the wafer 1 of the boat 47, and thereby the self-loading boat 47 is unloaded ((1丨8£:1^1^1^), and is transported from the carrying boat 47 to the tank 2, and returns to the tank 2. The controller 77 is controlled by the loading cassette 14 , the box elevator 15 , the box opener 23 , the surveying device 27 'the rotary box frame 3 1 , the box conveying device 35 ' the box opener 42 , the wafer transfer mechanism 46 , and the like. All the operations in the batch CVD apparatus. A -12-1379373 boat lift 48 is provided in the rear side of the preparation chamber 45 to lift and lower the carrier 47. The coupling is used as a lifting platform connected to the boat lift 48. The arm 49 is horizontally mounted with a seal cap 50. The cover 50 is a vertical support carrier 47 that can close the lower end portion of the processing furnace 51 to be described later. • The carrying boat 47 is a holding member having a plurality of loads. In the state in which the centers of the wafers 1 (for example, 50 to 152) are aligned in the vertical direction, they are kept horizontal. Although not shown in the drawings, a cleaning gas supply unit (hereinafter referred to as a cleaning unit) is actually provided at the left end portion of the preliminary chamber 45 on the side opposite to the side of the wafer transfer device elevator 46b and the boat elevator 48. It is constituted by a supply fan and a dust filter. The cleaning unit is a clean air (cleaning gas) for supplying a cleaned environment or an inert gas. Further, an engraving is provided between the wafer transfer device 46a and the cleaning unit. Slot alignment device. The groove alignment device is a substrate integration device that constitutes a position for integrating the circumferential direction of the wafer. ® The clean air blown from the cleaning unit flows into the groove alignment device, the wafer transfer device 46a, and the boat 47, and is sucked by a duct (not shown). The cleaned air to be sucked is exhausted to the outside of the main casing 11, or is circulated to the suction side of the cleaning unit, that is, the primary side (supply side) is again blown out into the preliminary chamber 45 by the cleaning unit. The treatment furnace 51 shown in Fig. 4 is provided on the sub-frame 40. As shown in Fig. 4, the treatment furnace 51 has a heater 52 as a heating means. The heater 52 has a cylindrical shape and is supported by a heating base 13- 1379 373 as a holding plate, and is vertically mounted. Inside the heater 52, a process tube 54 as a reaction tube is disposed concentrically with the heater 52. The process pipe 54 is composed of an outer pipe 55 as an external reaction pipe and an inner pipe 56 as an inner reaction pipe provided inside. The outer tube 55 is formed of, for example, a heat resistant material such as quartz (SiO 2 ) or tantalum carbide (SiC). The outer tube 55 has a larger inner diameter than the outer diameter of the inner tube 56, and has a cylindrical shape in which the upper end closes the lower end opening. The outer tube 55 is disposed concentrically with the inner tube 56. The inner tube 56 is formed of, for example, a heat resistant material such as quartz or tantalum carbide. The inner tube 56 has a cylindrical shape that forms an upper end and a lower end opening. The hollow portion of the inner tube 56 is formed into a processing chamber 57. The processing chamber 57 can accommodate the carrying boat 47 that holds the wafer 1 in a plurality of stages in a horizontal posture and is vertically aligned. The gap between the outer tube 5 5 and the inner tube 56 is a cylindrical space 58. Below the outer tube 55, a manifold 59 is disposed concentrically with the outer tube 55. The manifold 5 9 is formed, for example, of stainless steel. The manifold 59 is a cylindrical shape that forms an upper end and a lower end opening. The manifold 59 is engaged with the outer tube 55 and the inner tube 56 to support the same. The manifold 59 is supported by the heater base 53, whereby the process tube 54 is in a vertically mounted state. The process tube 54 and the manifold 59 form a reaction vessel. Further, an O-ring 59a as a sealing member is provided between the manifold 59 and the outer tube 55. The nozzle 60 is connected to the nozzle 60 as a gas introduction portion, and the nozzle 60 - 14 - 1379373 is connected to the inside of the processing chamber 57. The gas supply pipe 61 is connected to the nozzle 60. The gas supply pipe 61 is opposite to the connection side with the nozzle 60. On the upstream side), the gas supply source 63 is connected via an MFC (mass flow controller) 62. The MFC 62 is a gas flow controller. Gas supply: It is a gas that is supplied with a processing gas, an inert gas, or the like. The MFC 62 is electrically connected to the gas flow unit 64 via the electric wiring C. The gas flow rate control unit 64 causes the MFC 62 at a desired timing to form a desired amount of gas flow. The manifold 59 is provided with a tube 65 for exhausting the environment in the processing chamber 57. The exhaust pipe 65 is disposed at a lower end portion of the cylindrical space 58, and is connected to the cylindrical space 58. The exhaust pipe 65 is on the side (side) opposite to the connection side of the manifold 59, and is connected to the device 68 via the pressure sensor 66 and the pressure adjusting device 67. The pressure sensing side 66 is a pressure detector. The exhaust device is constituted by a vacuum pump or the like. The pressure sensor side 66, the pressure adjustment 67, and the exhaust unit 68 exhaust the inside of the processing chamber 57 to form a predetermined pressure (degree of vacuum). The pressure adjusting device 67 and the pressure sensing device 66 are electrically connected to the pressure control unit 69 by electric B. The pressure control unit 69 controls the pressure device 67 at a desired timing based on the pressure detected by the sensor 66, so that the pressure in the processing chamber 57 can form a desired pressure; and the cover 50 is from the lower side in the vertical direction. Abutment of the manifold 59 with the cover 50 is a mouthpiece cover that allows the lower end opening of the manifold 59 to be hermetically sealed. The side (body supply pump 63 controls the exhaust gas to the downflow exhaust device 68. The device pressure wiring pressure is adjusted to the I ° end. The occlusion -15-1379373 is a metal plate made of, for example, stainless steel, and is formed in a disk shape. A 〇-shaped ring 50a as a sealing member is provided on the upper surface of the sealing cover 50. The Ο-shaped ring 50a abuts against the lower end of the manifold 59. The sealing cover 50 is provided on the side opposite to the processing chamber 57 to allow the boat to be rotated. • Rotating mechanism 70. The rotating shaft 71 of the rotating mechanism 70 is connected to the carrying boat 47 through the sealing cover 50. The rotating shaft 71 rotates the wafer 1 by rotating the carrying boat 47. #在旋转机构70 and the boat lift 48 are electrically connected to the drive control unit 72 by the electric wiring A. The drive control unit 72 controls the rotation mechanism 70 and the boat lift 48 at a desired timing to enable the desired operation. 47 is formed of, for example, a heat-resistant material such as quartz or tantalum carbide. The carrier 47 is in a state in which the plurality of wafers 1 are arranged in a horizontal posture and are aligned with each other, and are held in a plurality of stages. Lower part The heat plate 73 is arranged in a plurality of stages in a water level posture. The heat insulating plate 73 is formed of a heat-resistant material such as quartz or tantalum carbide to form a disk shape. The heat insulating plate 73 is a heat insulating member. The heat shield 73 is configured to make heat from the heater 52 difficult to pass to the side of the manifold 5. The temperature sensor 74 is disposed in the process tube 54. The temperature sensor 74 is a temperature detector. The temperature sensor side 74 is electrically connected to the temperature control unit 75 via the electric wiring D. The temperature control unit 75 integrates the energization state of the heater 52 based on the temperature information detected by the temperature sensor 74. The expected timing -1679373 is used to control the heater 52, so that the temperature in the processing chamber 57 can form a desired temperature distribution. The gas flow rate control unit 64, the pressure control unit 69, the drive control unit 72, and the temperature control unit 75 also constitute The operation unit and the input/output unit are electrically connected to the main control unit 76 that controls the entire batch CVD apparatus. The gas flow rate control unit 64, the pressure control unit 69, the drive control unit 72, the temperature control unit 75, and the main control unit 76 are configured. Controller 77. Its In the following, a 1C manufacturing method according to an embodiment of the present invention will be described with reference to a batch CVD apparatus having the above configuration. In the following description, the operation of each unit constituting the batch CVD apparatus is performed by the controller 77. As shown in Fig. 1 to Fig. 3, when the in-project conveying device is carried into the loading cassette 14 via the front opening 14C or the ceiling opening 14B, the box 2 is placed on the holding table 18. At this time, the holding table The support moving pin 19 of 18 is inserted into the positioning hole 5 of the lower side of the case 2, whereby the case 2 is formed in a state of being positioned at the holding stage 18. Next, as shown in Fig. 5(a), in the loading magazine 14, the box 2 is moved in the direction of the unpacker 23, and the door 4 is held in the closer 26 of the unpacker 23. Once the shutter 26 holds the door 4', the door 4 is detached (disassembled) from the wafer entry and exit 3 by the retraction of the moving table 25. Then, as shown in Fig. 5 (b), the closer 26 is detached from the position of the wafer inlet and outlet 3 by the lowering of the moving table 25 in the preload chamber 20. Once the wafer entry and exit 3 is opened, the fixture 29 of the device 27 is inserted into the wafer inlet and outlet 3 by the linear actuator 28 as shown in Fig. 5(b). The detecting element 30 of the mapping device 27 is the wafer 1 in the mapping box 2. Once the predetermined survey is completed, the clamp 29 of the surveying device 27 is returned from the wafer access 3 to the original standby position by the linear actuator 28. Once the clamp 29 is returned to the standby position, the closer 26 is moved to the position of the wafer entrance 3 by the rise of the moving table 25. Then, as shown in Fig. 5(a), the closer 26 mounts the door 4 to the wafer inlet/outlet 3 (mounted) by the advancement of the moving table 25. When the mapping information read by the mapping device 27 is different from the mapping information previously provided in the box (the box to be read) 2, the different containers 2 are found to be loaded from the magazine 14 by engineering. The internal transfer device, for example, the AGV 9 shown in Fig. 1, is immediately transferred to the wafer splicing project or the previous project. Thereby, the step can be greatly reduced as compared with the case where the tank 2 is carried into the main casing 11, particularly the mounting table 43 or the rotary frame 3, and then returned to the loading/unloading portion. Further, it is possible to suppress the increase in the wafer mounting time to the boat 47 and the increase in the wafer processing start standby time. When the mapping information read by the aforementioned mapping device 27 coincides with the mapping information previously provided by the box 2, as shown in FIG. 6, the box 2 supported by the holding table 18 utilizes the box elevator 15 The degree of increase from the loading raft 14 to the phase loading and unloading port 12. Specifically, the holding table 18 is raised above the sealing frame 21 by -18 - 1379373 ', and the height of the box 2 picked up from the lower side by the tank conveying mechanism 35b can be raised to the tank. When the height of the outlet 12 is reached, the tank loading/unloading port 12 is opened by the front shutter 13" Next, the tank transporting mechanism 35b is submerged into the tank loading/unloading port 12, as shown in Fig. 6 'the box 2 supported by the holding table 18 It is picked up from the lower side by the tank conveyance mechanism 35b of the tank conveyance device 35. That is, the tank 2 is transferred between the holding table 18 and the tank transport mechanism. The tank 2 picked up by the tank transport mechanism 35b is carried into the main casing 11 from the tank loading/unloading port 12. In other words, the box 2 is carried into the inside of the main casing through the box opening mechanism 23 or the upper portion of the sealing frame 21 by the box conveying mechanism. Further, it may be carried in from the outside of the main casing 1 1 across the unpacker 23 or the sealed casing 21. As shown in FIG. 1 and FIG. 2, the carried in the box 2 is automatically conveyed to the frame 33 designated by the rotary case 31 by the box conveying device 35, and is transferred to the support pin of the frame plate 33 at this time. 34 will be inserted into the positioning hole 5' of the lower side of the case 2, whereby the case 2 will be positioned and held in the state of the shelf 3, and the case 2 will be temporarily stored in the shelf 33. Then, the tank 2 is transported from the shelf 33 to the square unpacker 42 by the tank transport device 35, and transferred to the mounting table 43. At this time, the wafer loading/unloading port 41 of the unpacker 42 is closed by the offline structure 44, and the cleaning chamber is filled with the clean air. -19- 1379373 The preliminary chamber 45 is filled with nitrogen as clean air. In this state, the oxygen concentration of the preliminary chamber 45 is, for example, 20 ppm or less, which is much lower than the oxygen concentration inside the main casing 11 (atmospheric environment). Further, the case 2' carried into the main casing 11 from the tank loading/unloading port 12 by the conveying mechanism 35b may be directly conveyed to the unpacker 42 provided in the wafer loading/unloading port 41. The case 2 placed on the mounting table 43 is an opening edge portion of the wafer loading/unloading port 41 where the opening side end surface is pressed to the front wall 40a. Then, the door 4 is detached by the detaching mechanism 44, and the box 2 is opened to the wafer inlet and outlet 3. At this time, since it has been mapped in the loading cassette 14, the mapping of the group 1 of the crystal circle in the box 2 can be omitted. Once the cassette 2 is opened by the unpacker 42, the wafer transfer unit 46a picks up the wafer 1 from the cassette 2 via the wafer inlet/outlet 3 using the dice 46c. Once the wafer 1 is picked up by the die 46c, the wafer transfer device 46a transports the wafer 1 to the groove alignment device (not shown). The groove alignment device is positioned to align the wafer 1. After the alignment, the wafer transfer device 46 picks up the wafer 1 from the groove alignment device by the die 46c and transports it to the boat 47. The wafer transfer device 46 charges the transferred wafer 1 to the carrying boat 47. The wafer transfer device 46a after the wafer 1 is transferred to the carrying boat 47 is returned to the tank 2, and the next wafer 1 is attached to the carrying boat 47. In the operation of the unpacker 42 of the one (upper or lower stage) by the wafer transfer mechanism 46 to mount the wafer 1 to the carrying boat 47, the opener 42 of the other (lower or upper stage) is borrowed. The other transport box 2 is transported from the rotary -20- 1379373 type magazine rack 31 by the tank transport device 35. In the other unpacker 42 of the other side, the opening operation of the box 2 of the unpacker 42 is simultaneously performed. Once the pre-specified number of wafers 1 are mounted on the carrying boat 47, the lower end portion of the processing furnace 51 that is closed by the furnace shutter (not shown) will be driven by the furnace. The mouth is closed to open. Next, the carrier boat 47 holding the wafer group 1 is lifted by the boat lifter 48, and is carried in the processing furnace 51 (loading the boat).

在此，說明有關利用處理爐51在晶圓1上藉由CVD 法來形成薄膜的方法。 另外，在以下的説明中，構成處理爐51的各部之動 作是藉由控制器77來控制。 一旦複數片的晶圓1被裝塡（wafer charge)於載舟 47，則如圖4所示，保持複數片的晶圓1之載舟47會藉 由載舟升降機48來舉起，搬入至處理室57(載舟載入） 在此狀態下，加封蓋50是形成隔著〇型環50a來密 封岐管5 9的下端之狀態。 處理室57内是藉由排氣裝置68來排氣，而使能夠形 成所望的壓力（真空度）。此時，處理室57内的壓力是 以壓力感側器6 6來測定，根據該被測定的壓力，回饋控 制壓力調整裝置67。 又，處理室57内是藉由加熱器52來加熱，而使能夠 形成所望的温度。此時，以處理室5 7内能夠形成所望的 -21 - 1379373 温度分布之方式，根據温度感側器74所檢測出的温度資 訊，回饋控制往加熱器52的通電狀況。 接著’藉由旋轉機構70來旋轉載舟47，藉此旋轉晶 圓1。 • 其次，從氣體供給源63供給且以MFC62來控制成所 . 望的流量之氣體會流動於氣體供給管61而由噴嘴60來導 入至處理室57内。 Φ 所被導入的氣體會上昇於處理室57内，從內管56的 上端開口流出至筒狀空間58而由排氣管65排出。 氣體是在通過處理室57内時與晶圓1的表面接觸。 此時，在晶圓1的表面上藉由熱 CVD反應來堆積（ deposition )薄膜。 一旦經過所被預先設定的處理時間，則會從氣體供給 源63經由氣體供給管61來供給惰性氣體，處理室57内 會被置換成惰性氣體，且處理室57内的壓力會被恢復成 籲常壓。 然後，加封蓋50會藉由載舟升降機48而下降，岐管 * 59的下端會被開口，且處理完成晶圓1會在保持於載舟 . 47的狀態下從岐管59的下端搬出至製程管54的外部（載 舟卸載）。 載舟卸載的處理完成晶圓1會藉由晶圓移載裝置46a 來從載舟47取出（wafer discharge )，回到預先被搬送至 開箱器42的空箱2。 —旦所定片數的處理完成晶圓1被收納，則門4會藉 -22- 1379373 由開箱器42來裝著於箱2的晶圓出入口 3。 將晶圓出入口 3閉塞的箱2會藉由箱搬送裝置35來 自動地搬送至旋轉式箱架31所指定的架板33而交接^ 箱2會暫時地被保管。然後，一旦前遮擋板13開啓 - ，則箱搬送裝置35會將箱2從架板33搬送至箱搬入搬出 . 口 12，在箱升降機15的保持台18上潛入箱搬入搬出口 1 2而交接。 # 另外，收納處理完成晶圓1的箱2有時會從開箱器42 藉由箱搬送裝置35來直接地搬送至箱搬入搬出口 12。 —旦在保持台1 8上交接箱2，則前遮擋板1 3會關閉 。並且，箱升降機15的軸17會藉由昇降驅動裝置16來 下降至裝載埠14上。 下降至裝載埠14上的箱2會藉由工程内搬送裝置、 例如圖1所示的AGV 9來搬送至所定的工程。 ^ 若根據上述實施形態，則可取得其次的效果。 . 丨）在箱會藉由工程内搬送裝置來搬入的裝載埠設置測繪 _ 裝置’藉此可立即從裝載埠返送被發現藉由測繪裝置所讀 取的實際測繪資訊與所預先提供的測繪資訊不同之箱。因 • 此，相較於在框體内的開箱器設置測繪裝置的以往情況時 . ’可省略將箱搬入框體内後回到裝載埠後返送的費時費工 ’該部份可縮短從晶圓處理開始時期被發現不同的時間點 延遲。 2)在抓住收納容器的上部時，收納容器搬送部的操作（ handling)部需要昇降機能（伸縮機能）及夾持（grip) -23- 1379373 機能（水平方向伸縮機能）。爲了使收納容器搬送部的操 作部具有各種的機能，收納容器搬送部本身需要強度，因 此收納容器搬送部會大型化。並且，因爲構造會形成複雜 ，所以成本高或容易發生不良情況。而且，在夾持不當時 ，使收納容器落下的情況亦多。甚至，夾持所造成之 收納容器搬送時間的長期化、操作部的大型化所造成之保 管架的大型化、需要上抓取的空間等所造成之裝置高度 變高等、缺點多。 該點，藉由在裝載埠的上方設置箱搬入搬出口，且設 置使由下保持箱的保持台昇降於裝載埠與箱搬入搬出口之 間的箱升降機，可利用箱搬送裝置來由下側拾取箱，因此 相較於抓住箱的上部來進行操作時，可使操作構造形成簡 單且小型。因此，可謀求CVD裝置的小型輕量化、單純 化、高速化、安全化及空間的活用化。 3) 藉由在利用箱升降機來昇降的保持台設置支承運動銷 ，可將保持台作爲有關各處的箱載置部的搬送基準。因此 ，可謀求搬送基準的統一化。 4) 藉由分成箱升降機及箱搬送裝置，可與裝載埠之箱的 昇降動作同時，使箱搬送裝置作動至箱交接位置之前待機 。亦即，可同時並行處理，因此可使總搬送時間縮短。 5) 由於箱升降機可使保持台上昇至藉由箱搬送裝置來從 下側拾取箱的高度，因此與操作箱的上部時比較之下，可 安全地交接箱。 6) 由於可在使用惰性氣體來清浄化位於裝載埠的箱内的 -24- 1379373 晶圓之預載室内進行測繪，因此可防止汚染及自然氧化膜 形成。 圖7是表示本發明的第二實施形態之批次式CVD裝 置的側面剖面圖。 本實施形態與上述實施形態主要相異的點是開箱器只 設置於裝載捧的點。 亦即’如圖7所示，裝載埠14是設置於形成預備室 45的副框體40的正面壁（區劃壁）40a，在該正面壁40a 設置有開箱器83。在形成開箱器83的預載室80之密閉框 體81的背面壁81a開設有晶圓搬入搬出口 91，且設置有 開閉該晶圓搬入搬出口 91的門機構92。 設置於預備室45内的晶圓移載機構46是構成基板搬 送裝置。當門機構92開放晶圓搬入搬出口 9 1時，晶圓移 載機構46是在箱2與載舟47之間搬送晶圓1。 載舟升降機48是將載舟47搬入至鄰接於預備室45 的處理爐51的處理室57，或將載舟47從處理室51搬出 〇 在鄰接於預備室45的頂棚面之保管室lib設置有保 管架31A及箱搬送裝置35。 在主框體11的正面壁11a中面向於保管室lib的部 位開設有箱搬入搬出口 12。前遮擋板13是在於開啓或關 閉箱搬入搬出口 1 2。 與第一實施形態的開箱器42同様，在預載室80設置 有測繪裝置8 4。測繪裝置8 4可對門.出入口 8 2移動於前後 -25- 1379373 (垂直方向）及上下（平行方向）。 其次，說明以上構成的開箱器的作用。 另外，控制器77是在於控制以下的作動。 如圖7所示，工程内搬送裝置經由正面開口 14C或頂 棚開口 HB’搬入裝載埠14時，箱2是被載置於箱升降 機15的保持台18。 此時，突設於保持台18的支承運動銷19會被嵌入箱 2的下面的定位孔5，藉此箱2是形成被定位於保持台18 的狀態。 其次，在裝載埠14中’箱2會被移動於開箱器83的 方向。開箱器83的閉合器86會保持門4。 一旦保持門4，則閉合器86會藉由移動台85的後退 來將門4從晶圓出入口 3及門出入口 82卸下。然後，閉 合器86會藉由移動台85來下降於預載室80内，藉此自 晶圓出入口 3及門出入口 82的位置脫離。 —旦晶圓出入口 3被開放，則測繪裝置84的檢測元 件會被***至晶圓出入口 3(參照圖5(b))。測繪裝置 8 4會藉由檢測元件來測繪箱2内的晶圓1。 一旦所定的測繪完了，則測繪裝置84會使檢測元件 從晶圓出入口 3恢復至原本的待機位置。 然後，閉合器86會隨著移動台85的上昇來移動至晶 圓出入口 3的位置。然後，閉合器86會藉由移動台85的 前進來將門4安裝於晶圓出入口 3及門出入D 82。 當藉由該測繪裝置所讀取的實際測繪資訊、與有關該 -26- 1379373 箱2所預先提供的測繪資訊不同時，所被發現不同的箱2 會從裝載埠14藉由工程内搬送裝置、例如圖1所示的 AGV 9來立即搬送至晶圓編成工程或之前的工程等。 當藉由前述的測繪裝置所讀取的實際測繪資訊、與有 • 關該箱2所預先提供的測繪資訊一致時，箱升降機15會 . 使藉由保持台18所支撐的箱2從裝載埠14上昇至箱搬入 搬出口 12的高度》 ® —旦箱2被上昇至箱搬入搬出口 12的高度，則前遮 擋板13會開放箱搬入搬出口 12。 接著，箱搬送裝置35的箱搬送機構35b會拾取藉由 保持台1 8所支撐的箱2。 箱搬送機構35b會將拾取後的箱2從箱搬入搬出口 12 搬入至主框體1 1内。 箱搬送裝置35會將搬入後的箱2搬送至保管架31A ’自動地交接至所被指定的架板33A。 ^ 箱2會暫時地被保管於架板33。 然後，以和前述相反的程序’箱搬送裝置35及箱升 ' 降機15會將箱2從保管架31A搬送至裝載埠14〇 - 此時’在預備室45中有清潔空氣流通充滿著。 其次’在裝載埠14中，箱2會被移動於開箱器83的 方向。開箱器83的閉合器86是在保持門4。 —旦保持門4，則閉合器86會藉由移動台85的後退 來將門4從晶圓出入口 3卸下。然後，閉合器86會藉由 移動台85來下降於預載室80内’從晶圓出入口 3及門出 -27- 1379373 入口 82的位置脫離。 一旦晶圓出入口 3被開放，則晶圓搬入搬 藉由門機構92來開放。 此時’箱内的晶圓的測繪已經完成，所以1 一旦晶圓出入口 3及晶圓搬入搬出口 91 晶圓移載裝置46a會藉由鑷子46c來將晶圓1 晶圓出入口 3或門出入口 82及晶圓搬入搬出匚 晶圓移載裝置46a會將拾取後的晶圓1搬送至 置。刻槽對準裝置是在於使晶圓1對準刻槽。 ，晶圓移載裝置46a會將晶圓1從刻槽對準裝 46c拾取。晶圓移載裝置46a會將拾取後的晶丨 載舟47，裝塡（charging)至載舟47。 將晶圓1交接至載舟47的晶圓移載裝置 箱2，將其次的晶圓1裝填至載舟47。 另外，亦可不在保管架31A進行暫時保管 ，晶圓移載裝置46a藉由鑷子46c來將晶圓1 搬送。亦即，測繪完了，測繪裝置的檢測元件 入口 3回復到原來的待機位置後或測繪中使晶 口 91開放。晶圓移載裝置46a是在晶圓搬入據 入鑷子46c來從箱2拾取晶圓1。 由於以後的步驟是與上述實施形態同樣， 明。 若利用本實施形態，則只要將開箱器設置 可，因此可寄與空間效率提升（台面面積縮小 出口 91會 可省略。 被開放，則 從箱2經由 ]91拾取。 刻槽對準裝 刻槽對準後 置藉由鑷子 B 1搬送至 4 6a會回至!J 箱2的步驟 從箱2直接 會從晶圓出 圓搬入搬出 [出口 91插 因此省略説 於裝載埠即 化）、生產 -28- 1379373 能力提升（可減少箱的移動範圍）。 圖8是表示本發明的第三實施形態之批次式cvd裝 置的側面剖面圖。 本實施形態與上述第二實施形態相異的點是構成可抓 住相的上部來操作的點、設置—即使在箱内晶圓搬送中還 是可接受來自頂棚走行型構内搬送裝置（以下稱爲OHT) 的箱之箱平台機構的點。 亦即’如圖8所示’抓住箱的上部來操作的箱搬送裝 置（以下稱爲抓取式箱搬送裝置）1〇〇是在鄰接於預備室 45的頂棚面之保管室lib中與保管架31A —起設置。 抓取式箱搬送裝置100是具備：箱升降機1〇1、藉由 箱升降機101來昇降的箱搬送機構1〇2、’及藉由箱搬送機 構102來移動的夾持部103。夾持部103可伸縮由上來夾 持突設於箱2的上面之帽簷部6。Here, a method of forming a thin film on the wafer 1 by the CVD method using the processing furnace 51 will be described. Further, in the following description, the operations of the respective units constituting the processing furnace 51 are controlled by the controller 77. Once the wafer 1 of a plurality of wafers is loaded onto the carrier 47, as shown in FIG. 4, the carrier 47 holding the plurality of wafers 1 is lifted by the boat lift 48 and moved into Processing chamber 57 (loading of the loading boat) In this state, the sealing cover 50 is in a state in which the lower end of the manifold 59 is sealed via the 〇-shaped ring 50a. The inside of the processing chamber 57 is exhausted by the exhaust unit 68 to form a desired pressure (degree of vacuum). At this time, the pressure in the processing chamber 57 is measured by the pressure sensor side unit 66, and the pressure control means 67 is fed back based on the measured pressure. Further, the inside of the processing chamber 57 is heated by the heater 52 to form a desired temperature. At this time, the energization state to the heater 52 is feedback-controlled based on the temperature information detected by the temperature sensor 74 in such a manner that the desired temperature distribution of -21 - 1379373 can be formed in the processing chamber 57. Then, the carrier 47 is rotated by the rotating mechanism 70, whereby the crystal 1 is rotated. • Next, the gas supplied from the gas supply source 63 and controlled by the MFC 62 to flow at the desired flow rate flows into the gas supply pipe 61 and is introduced into the processing chamber 57 by the nozzle 60. The gas introduced by Φ rises in the processing chamber 57, flows out from the upper end opening of the inner tube 56 to the cylindrical space 58, and is discharged by the exhaust pipe 65. The gas is in contact with the surface of the wafer 1 while passing through the processing chamber 57. At this time, a film is deposited on the surface of the wafer 1 by a thermal CVD reaction. Once the predetermined processing time has elapsed, the inert gas is supplied from the gas supply source 63 via the gas supply pipe 61, the inside of the processing chamber 57 is replaced with an inert gas, and the pressure in the processing chamber 57 is restored to Atmospheric pressure. Then, the cap 50 is lowered by the boat lifter 48, the lower end of the manifold * 59 is opened, and the processed wafer 1 is carried out from the lower end of the manifold 59 while being held in the carrying boat 47. The outside of the process tube 54 (loading the boat unloading). The wafer 1 for carrying out the unloading of the boat is taken out from the carrying boat 47 by the wafer transfer device 46a, and returned to the empty tank 2 previously transported to the unpacker 42. Once the wafer 1 has been stored for the predetermined number of wafers, the gate 4 is loaded into the wafer inlet and outlet 3 of the tank 2 by the unpacker 42 by -22-1379373. The box 2 that closes the wafer inlet and outlet 3 is automatically transported to the shelf 33 designated by the rotary box frame 31 by the tank transport device 35, and the delivery box 2 is temporarily stored. Then, when the front shutter 13 is opened, the tank transport device 35 transports the tank 2 from the shelf 33 to the tank for loading and unloading. The port 12 is submerged into the tank loading/unloading port 1 2 on the holding table 18 of the box elevator 15 and handed over. . # Further, the tank 2 storing the processed wafer 1 may be directly transported from the unpacker 42 to the tank loading/unloading port 12 by the tank conveying device 35. Once the transfer box 2 is transferred on the holding station 18, the front shutter 13 will be closed. Also, the shaft 17 of the box elevator 15 is lowered onto the loading magazine 14 by the elevation drive unit 16. The box 2 that has been lowered onto the magazine 14 is transported to the designated project by an in-house transport device, such as the AGV 9 shown in FIG. ^ According to the above embodiment, the second effect can be obtained.丨) In the container, the loading and unloading device is moved by the in-house conveying device to set up the mapping device _ device, so that the actual mapping information read by the mapping device and the pre-provided mapping information can be immediately returned from the loading device. Different boxes. Because this is the same as the previous situation of setting up the surveying device in the box opener in the frame. 'It can omit the time-consuming labor required to return the box into the frame and return it to the loading frame.' The wafer processing start period was found to be delayed at different time points. 2) When grasping the upper part of the storage container, the operation (handling) of the storage container conveying unit requires an elevator function (stretching function) and a grip -23- 1379373 function (horizontal direction stretching function). In order to provide various functions to the operation portion of the container transport unit, the storage container transport unit itself needs strength, and the storage container transport unit is increased in size. Moreover, since the structure is complicated, the cost is high or a defect is likely to occur. Moreover, there are many cases where the storage container is dropped when the clamping is not proper. In addition, there are many disadvantages such as the long-term transportation time of the storage container caused by the clamping, the increase in the size of the pipe holder caused by the increase in the size of the operation portion, the height of the device required to be grasped, and the like. At this point, by providing a tank loading/unloading port above the loading weir, and providing a box elevator that moves the holding table of the lower holding tank between the loading magazine and the tank loading/unloading port, the box conveying device can be used to lower the side. By picking up the box, the operation structure can be made simple and small, as compared to grasping the upper portion of the box. Therefore, it is possible to reduce the size, weight, simplicity, speed, safety, and space utilization of the CVD apparatus. 3) By providing a support movement pin in the holding table that is lifted and lowered by the box elevator, the holding table can be used as a transport standard for the box mounting portion in each place. Therefore, it is possible to unify the transportation standard. 4) By dividing into the box elevator and the box transporting device, it is possible to wait for the tank transporting device to move to the tank transfer position at the same time as the lifting operation of the loading box. That is, it can be processed in parallel at the same time, so that the total transfer time can be shortened. 5) Since the box elevator can raise the holding table to the height of the box picked up from the lower side by the box conveying device, the box can be safely handed over in comparison with the upper portion of the operation box. 6) Contamination and natural oxide film formation can be prevented by using an inert gas to clean and purify the pre-loading chamber of the -24-1379373 wafer in the cassette. Fig. 7 is a side sectional view showing a batch type CVD apparatus according to a second embodiment of the present invention. The point that the present embodiment differs from the above embodiment mainly is that the unpacker is provided only at the point of the loading grip. That is, as shown in Fig. 7, the loading cassette 14 is a front wall (section wall) 40a provided in the sub-frame 40 forming the preliminary chamber 45, and the box opening 83 is provided in the front wall 40a. A wafer loading/unloading port 91 is opened in the rear wall 81a of the sealing frame 81 of the preloading chamber 80 forming the unpacker 83, and a door mechanism 92 for opening and closing the wafer loading/unloading port 91 is provided. The wafer transfer mechanism 46 provided in the preliminary chamber 45 constitutes a substrate transfer device. When the door mechanism 92 opens the wafer loading/unloading port 9 1 , the wafer transfer mechanism 46 transports the wafer 1 between the tank 2 and the carrying boat 47 . The boat lifter 48 is a processing chamber 57 that carries the carrying boat 47 to the processing furnace 51 adjacent to the preliminary chamber 45, or carries the carrying boat 47 out of the processing chamber 51, and is disposed in the storage compartment lib of the ceiling surface adjacent to the preliminary chamber 45. There are a storage rack 31A and a tank transport device 35. A box loading/unloading port 12 is opened in a portion of the front wall 11a of the main casing 11 facing the storage compartment lib. The front shielding plate 13 is for opening or closing the container loading/unloading port 1 2 . In the same manner as the unpacker 42 of the first embodiment, a surveying device 84 is provided in the preload chamber 80. The surveying device 84 can move the door. The entrance 8 2 moves in front and rear -25-1379373 (vertical direction) and up and down (parallel direction). Next, the action of the above-described opener can be explained. In addition, the controller 77 is controlled by the following operations. As shown in Fig. 7, when the in-project conveying device carries the loading cassette 14 through the front opening 14C or the ceiling opening HB', the box 2 is placed on the holding table 18 of the box elevator 15. At this time, the supporting movement pin 19 protruding from the holding table 18 is inserted into the positioning hole 5 of the lower side of the case 2, whereby the case 2 is formed in a state of being positioned on the holding table 18. Next, in the loading cassette 14, the box 2 is moved in the direction of the unpacker 83. The closer 86 of the unpacker 83 holds the door 4. Once the door 4 is held, the closer 86 will be removed from the wafer access 3 and the doorway 82 by the retraction of the mobile station 85. Then, the shutter 86 is lowered into the preload chamber 80 by the moving table 85, thereby being separated from the position of the wafer entrance 3 and the door entrance 82. Once the wafer inlet and outlet 3 is opened, the detecting elements of the mapping device 84 are inserted into the wafer inlet and outlet 3 (refer to Fig. 5(b)). The surveying device 84 will map the wafer 1 in the tank 2 by means of the detecting element. Once the predetermined survey is completed, the surveying device 84 restores the detecting element from the wafer access 3 to the original standby position. Then, the closer 86 moves to the position of the wafer entrance and exit 3 as the moving table 85 rises. Then, the closer 86 mounts the door 4 to the wafer entrance 3 and the door D 82 by the advancement of the mobile station 85. When the actual mapping information read by the mapping device is different from the mapping information pre-provided by the -26-1379373 box 2, the different containers 2 are found to be loaded from the loading cassette 14 by the in-house conveying device. For example, the AGV 9 shown in Fig. 1 is immediately transferred to a wafer or a previous project. When the actual mapping information read by the aforementioned mapping device coincides with the mapping information previously provided by the box 2, the box elevator 15 will cause the box 2 supported by the holding table 18 to be loaded from the magazine. 14 Ascending to the height of the tank loading/unloading port 12" When the tank 2 is raised to the height of the tank loading/unloading port 12, the front shutter 13 opens the tank loading/unloading port 12. Next, the tank transport mechanism 35b of the tank transport device 35 picks up the tank 2 supported by the holding table 18. The tank transport mechanism 35b carries the picked-up box 2 from the tank loading/unloading port 12 into the main casing 1 1 . The tank transporting device 35 transports the carried in tank 2 to the storage rack 31A' and automatically transfers it to the designated shelf 33A. ^ The box 2 is temporarily stored in the shelf 33. Then, in the procedure opposite to the above, the box transporting device 35 and the box lifter 15 transport the tank 2 from the storage rack 31A to the loading cassette 14 - at this time, the clean air is filled in the preliminary chamber 45. Next, in the loading cassette 14, the box 2 is moved in the direction of the unpacker 83. The closer 86 of the unpacker 83 is at the holding door 4. Once the door 4 is held, the closer 86 will be removed from the wafer entry and exit 3 by the retraction of the mobile station 85. Then, the closer 86 is lowered by the moving table 85 in the preload chamber 80 to be detached from the wafer inlet 3 and the door -27-1379373 inlet 82. Once the wafer entrance 3 is opened, the wafer loading and unloading is opened by the door mechanism 92. At this time, the mapping of the wafer in the box has been completed, so once the wafer inlet and outlet 3 and the wafer loading and unloading port 91, the wafer transfer device 46a will use the die 46c to transfer the wafer 1 wafer entrance 3 or the door entrance and exit. 82 and wafer loading/unloading The wafer transfer device 46a transports the picked wafer 1 to the wafer. The groove alignment device consists in aligning the wafer 1 with the groove. The wafer transfer device 46a picks up the wafer 1 from the groove alignment package 46c. The wafer transfer device 46a will pick up the picked wafer carrier 47 to the carrying boat 47. The wafer 1 is transferred to the wafer transfer device case 2 of the boat 47, and the next wafer 1 is loaded to the carrier boat 47. Further, the wafer holder 1 may be temporarily stored without being stored in the storage rack 31A, and the wafer transfer device 46a may transport the wafer 1 by the die 46c. That is, after the surveying is completed, the detecting element inlet 3 of the surveying device returns to the original standby position or the crystal port 91 is opened during the mapping. The wafer transfer device 46a picks up the wafer 1 from the cassette 2 by loading the wafer 46c into the wafer. The subsequent steps are the same as those of the above embodiment. According to this embodiment, since the opener can be installed, the space efficiency can be improved (the mesa area reduction outlet 91 can be omitted. When it is opened, it can be picked up from the case 2 via the 91). The groove alignment is carried out by the tweezers B 1 being transferred to the 4 6a, and the step of the J case 2 is directly carried out from the wafer 2 from the case 2 [the outlet 91 is inserted, so the description is omitted.) -28- 1379373 Capacity improvement (can reduce the range of movement of the box). Fig. 8 is a side cross-sectional view showing a batch type cvd device according to a third embodiment of the present invention. The present embodiment differs from the above-described second embodiment in that it constitutes a point at which the upper portion of the phase can be grasped, and it is provided that it is acceptable to transport the device from the ceiling during the wafer transport in the box (hereinafter referred to as OHT) The point of the box box platform mechanism. In other words, as shown in Fig. 8, the box transporting device (hereinafter referred to as the grab box transporting device) 1 that is operated by grasping the upper portion of the tank is in the storage compartment lib adjacent to the ceiling surface of the preliminary chamber 45. The storage rack 31A is provided together. The grab box transporting apparatus 100 includes a tank lifter 1〇, a tank transport mechanism 1〇2, ′ which is lifted and lowered by the tank lifter 101, and a gripping unit 103 that is moved by the tank transport mechanism 102. The grip portion 103 is telescopically held by the cap portion 6 projecting from the upper surface of the case 2.

箱平台機構105是具備：將開設於裝載埠14正上的 開口部106予以開閉之滑板107。箱平台機構1〇5是在開 口部1 06開啓的狀態下，使箱2經由頂棚開口 1 4B及開口 部106來從OHT 110載置於裝載埠14的保持台H 另一方面，當滑板107關閉開口部106時，ΟΗΤ1 10 是使箱2載置於滑板107 (―時爲保管架的任務）。 然後，從滑板1〇7來使箱2載置於裝載埠14的保持 台18時，在箱搬送機構1〇2舉起箱2的狀態下，箱平台 機構105會使滑板107滑動來開啓開口部1〇6。接著，箱 搬送機構102會操作箱2’通過操作後的開口部106來載 -29- 1379373 置於裝載埠14的保持台18。 其次，說明以上構成的抓取式箱搬送裝置100及箱平 台機構105的箱操作步驟》 另外，測繪箱内的晶圓之測繪步驟等的其他步驟是與 • 前述第二實施形態同樣，因此該等的步驟説明省略。 . 如圖8所示，OHT110是經由頂棚開口 14B及開口部 106，將箱2直接供給至裝載埠14上。 # 此時，保持台18的支承運動銷19會被嵌入箱2的下 面的定位孔5，藉此箱2是形成被定位於保持台1 8的狀態 〇 在裝載埠1 4中，測繪裝置是在於測繪箱内的晶圓（ 參照第一實施形態及第二實施形態）^ 在該測繪步驟中，當藉由測繪裝置所讀取的實際測繪 資訊、與有關該箱2所預先提供的測繪資訊不同時，所被 發現不同的箱2會從裝載埠14藉由OHT1 10來立即搬送 ^ 至晶圓編成工程或之前的工程等。 當藉由測繪裝置所讀取的實際測繪資訊、與有關該箱 2所預先提供的測繪資訊一致時，前遮擋板13會開放箱搬 . 入搬出口 12,箱升降機101會使箱搬送機構丨〇2下降至箱 搬入搬出口 12的對向位置。 接著’箱搬送機構102會使夾持部1〇3潛入箱搬入搬 出口 12，而使移動於箱2的正上。 其次，箱搬送機構102會使夾持部1〇3下降。夾持部 103會伸長至下方，而從上夾持箱2的帽蒼部6。 -30- 1379373 —旦夾持相2的帽簷部6’則夾持部i〇3會縮短至上 方而吊起箱2，且箱升降機1〇1會使箱搬送機構1〇2上昇 至與箱搬入搬出口 12對應的高度。 箱搬送機構102會將吊起後的箱2從箱搬入搬出口 12 - 搬入至主框體11的箱保管室lib内。 . 抓取式箱搬送裝置100會將所被搬入的箱2搬送至保 管架31A，自動交接至所被指定的架板33A。 # 箱2會暫時被保管。 然後’以和前述相反的程序，抓取式箱搬送裝置100 會從保管架31A將箱2搬送至裝載埠14。 例如，在測繪步驟中當別的箱2藉由〇 Η T 1 1 0搬送而 來時’箱平台機構105會藉由滑板107來從ΟΗΤ110接受 該箱2，以滑板107暫時保管。 亦即，如圖8假像線所示，箱平台機構1 〇 5是使滑板 107滑動來關閉開口部106，而藉由滑板107來接受 ® OHTHO的箱2。亦即，滑板107是一時發揮保管架的任 務。 然後，從滑板107移動箱2至裝載埠14的保持台18 . 時’在箱搬送機構1〇2從滑板107舉起箱2的狀態下，箱 平台機構105會使滑板107滑動而開啓開口部106。接著 ’箱搬送機構102會使舉起後的箱2通過開口部106來載 置於裝載埠14的保持台18。 若根據本實施形態，則除了前述第二實施形態的效果 以外’還可取得其次的效果。 -31 - 1379373 在測繪步驟中當箱藉由OHT搬送而來時，箱平台機 構會藉由該滑板來從ΟΗΤ接受該箱，藉此可暫時保管。 圖9是表示本發明的第四實施形態之批次式CVD裝 置的側面剖面圖。 本實施形態與上述第一實施形態相異的點是具備抓住 箱2的帽簷部6來搬送的箱搬送裝置（以下稱爲抓取式箱 搬送裝置）200的點。 亦即’如圖9所示，抓取式箱搬送裝置200是設置於 箱保管室lib。抓取式箱搬送裝置200是可在抓住帽簷部 6的狀態下’經由箱搬入搬出口 12，在保持台18與箱保 管室lib内之間搬送箱2。 抓取式箱搬送裝置200是具備：箱升降機201、藉由 箱升降機201來昇降的箱搬送機構202、及藉由箱搬送機 構202來移動的夾持部203。就夾持部203而言，有伸縮 於水平方向來抓住帽簷部6的型態、及未具備伸縮於水平 方向的機構，形成大略]的字型，僅鉤於帽簷部的鉤型態 、以及具備伸縮於鉛直方向的機構的型態。 抓取式箱搬送裝置200是藉由控制器77來控制。 其次’數例説明以上構成的抓取式箱搬送裝置的運用 方法》 在以下的説明中，控制器77是在於控制抓取式箱搬 送裝置200、箱升降機15、前遮擋板13等的作動。 圖1〇是表示運用方法的第一例。 如圖10(a)所示，箱升降機15是藉由昇降驅動裝置 -32- 1379373 16來使軸17伸長，使支撐箱2的保持台18上昇至箱2的 底面比基準高度204更高的位置。與前述的箱升降機15 的動作同時，箱升降機201會以夾持部2 03的高度能夠形 成與帽簷部6的高度同高度之方式來使箱搬送機構202、 夾持部203昇降。 另外，基準高度2 04是箱搬入搬入口 12(參照圖9) 的下端的高度，至少密閉框體21的上端的高度位置以上 的高度位置。比預載室20的上端的高度位置更高的高度 位置。 前遮擋板13係開放箱搬入搬出口 12 (參照圖9)。 如圖10(b)所示，箱搬送機構202會伸長，從箱保 管室lib内經由箱搬入搬出口 12，水平移動至位於主框體 11外的夾持部2 03，藉此使夾持部203換在帽簷部6之下 〇 如圖10(c)所示’一旦箱升降機201使箱搬送機構 2 02上昇，則夾持部203會從保持台18上吊起箱2。 如圖10(d)所示，抓取式箱搬送裝置2〇〇會使箱搬 送機構202縮短’而令箱2搬入至箱保管室llb内。 另一方面’箱升降機15會藉由昇降驅動裝置16來使 軸17縮短’而令保持台18下降至裝載埠14上。 然後’抓取式箱搬送裝置200會將箱2搬送至旋轉式 箱架31，交接至予以指定的架板33» 若根據該第一例，則夾持部2 0 3只要鉤到帽簷部6即 可。因此’夾持部203不需要伸縮於水平方向及錯直方向 -33- 1379373 的機構，其構造及作動形成簡單。其結果，可謀求低成本 化、省空間化或運用時間的縮短化。 圖11是表示運用方法的第二例。 如圖11 (a)所示，箱升降機15是藉由昇降驅動裝置 16來使軸17伸長，使支撐箱2的保持台18上昇至箱的底 面比基準高度2〇4更下的位置，亦即帽簷部6比基準高度 204更上的位置。 與前述的箱升降機15的動作同時，箱升降機20 1是 以夾持部2 0 3的高度能夠形成與帽簷部6的高度同高度之 方式來使箱搬送機構202、夾持部203昇降。 前遮擋板13係開放箱搬入搬出口 12(參照圖9)。 如圖1 1 ( b )所示，箱搬送機構202會伸長，從箱保 管室Ub内經由箱搬入搬出口 12，水平移動至位於主框體 11外的夾持部203，藉此使夾持部203換至帽簷部6之下 〇 如圖11 (c)所示，一但箱升降機201使箱搬送機構 202上昇，則夾持部203會從保持台18上吊起箱2。 如圖1 1 ( d )所示，抓取式箱搬送裝置200會使箱搬 送機構202縮短，令箱2搬入至箱保管室lib内。 另一方面，箱升降機15會藉由昇降驅動裝置16來使 軸17縮短，而令保持台18下降至裝載埠14上。 然後，抓取式箱搬送裝置200會將箱2搬送至旋轉式 箱架3 1，交接至予以指定的架板33。 相較於第一例，雖需要藉由箱升降機201來使箱2昇 -34- 1379373 降於保持台18與箱搬入搬出口 12的高度之間的動作及動 作時間的點較差，但在此第二例中，同樣只要夾持部203 鉤到帽簷部6即可。因此，夾持部203不需要伸縮於水平 方向及鉛直方向的機構，其構造及作動形成簡單。其結果 ，可謀求低成本化、省空間化或運用時間的縮短化。 圖12及圖13是表示運用方法的第三例。 如圖12(a)所示，箱升降機15會藉由昇降驅動裝置 16來使軸17伸長，令支撐箱2的保持台18上昇至帽簷部 6形成基準高度20 4正下的位置。與前述箱升降機15的動 作同時，箱升降機201會以夾持部203的高度能夠形成對 向於箱搬入搬出口 12的高度之方式來使箱搬送機構202、 夾持部203昇降。 前遮擋板13係開放箱搬入搬出口 12(參照圖9)。 如圖12(b)所示，一旦箱搬送機構202潛入箱搬入 搬出口 12，則夾持部203會位於帽簷部6的正上方。 如圖12(c)所示，一旦箱升降機20丨使箱搬送機構 202下降’則夾持部203會下降至帽簷部6。夾持部203 是伸長於水平方向。 如圖12 ( d )所示，夾持部203是縮短於水平方向， 換至帽簷部6之下。 如圖13(a)所示，一旦箱升降機201使箱搬送機構 2 02上昇，則夾持部2 〇3會從保持台18之上吊起箱2。箱 升降機201是使箱搬送機構202至少上昇至箱2的底面比 基準高度更上的高度。 -35- 1379373 如圖13(b)所示，抓取式箱搬送裝置200會使箱搬 送機構202縮短，而令箱2搬入至箱保管室lib内。 另一方面，箱升降機15會藉由昇降驅動裝置16來使 軸17縮短，而令保持台18下降至裝載璋14上。 然後，抓取式箱搬送裝置200會將箱2搬送至旋轉式 箱架31，交接至予以指定的架板33。 若根據此第三例，則相較於第一例、第二例，雖需要 藉由箱升降機201來使箱2昇降於保持台18與箱搬入搬 出口 12的商度之間的動作及動作時間、及需要在夾持部 2 03水平方向伸縮的機構的點較差，但因爲夾持部2〇3不 需要伸縮於鉛直方向的機構，其構造及作動形成簡單。其 結果，可謀求低成本化、省空間化或運用時間的縮短化。 第四實施形態是具備位於裝載埠的箱升降機及抓取式 箱搬送裝置’因此在裝載埠之保持台的昇降動作中，抓取 式箱搬送裝置可進行將其他的箱搬送至旋轉式箱架或副框 體的開箱器等其他的動作。因此，可提升抓取式箱搬送裝 置的操業率。 並且’藉由分成箱升降機及抓取式箱搬送裝置，可與 裝載埠之箱的上昇動作同時，使抓取式箱搬送裝置作動至 箱交接位置前’而使待機。亦即，可同時並行處理，因此 可使總搬送時間縮短。 同樣’藉由同時實施抓取式箱搬送裝置的上昇與箱升 降機的下降，箱的交接時間亦可縮短。 另外，第四實施形態的運用方法可適用於前述第一實 -36- 1379373 施形態及第二實施形態。適用時，可取得與前述第一實施 形態及第二實施形態同様的效果。 圖14是表示開箱器的較佳實施例的側面剖面圖。 圖15是其分解立體圖。 如圖14所示，在密閉框體21的上面壁連接氮氣體供 給線路21A的一端，在密閉框體21的下面壁連接排氣線 路21B的一端。氮氣體供給線路21A是將氮氣體21C從 吹出口往下吹出至預載室20内。排氣線路21B是對預載 室20内進行排氣。 如圖14及圖15所示，在預載室20内的上端部，格 柵（Louver) 21D會被鋪設於與氮氣體供給線路21A的吹 出口對向的位置。格柵21D是構成使從氮氣體供給線路 21A的吹出口吹出的氮氣體21C的流向偏向的偏向具。格 柵21D是朝門出入口 22傾斜》藉由此傾斜，格柵21D可 使氮氣體流朝門出入口 22偏向。 其次，說明以上構成的開箱器的作用及效果。 由於氮氣體供給線路21A會被連接至預載室20的上 端，排氣線路21B會被配置於下端，因此預載室20内的 氮氣體流是形成下流。下流的氮氣體2 1 C可有效地排出預 載室20内的塵埃及有機物等的異物。亦即，下流的氮氣 體21C可防範異物附著於晶圓1，或侵入箱2。就預載室 20内的異物而言，有發自預載室20内所設置的移動台25 、閉合器26、及測繪裝置27的塵埃及有機物等。 格柵21D會使氮氣體21C偏向門出入口 22，引導至 -37- 1379373 箱2内。往該箱2内之氮氣體21C的流動是在於防止來自 預載室20内下部之對流所造成異物的巻入。 例如，可實施其次的運用方法。 藉由工程内搬送裝置來從裝載埠14搬出箱2時，利 • 用格柵21D來引導氮氣體21C至箱2内，藉此利用氮氣體 . 21C來強制性清靜（置換）箱2内的環境（空氣及異物等 )。然後’在箱2的晶圓出入口 3藉由開箱器23來裝著 • 門4。 若根據此運用方法，則可在箱2内更封入氮氣體21C ’因此可防止箱2内的汚染及自然氧化膜形成。 例如，即使副框體40内未形成氮氣體環境，還是可 在箱2内封入氮氣體21C。 並且’在晶圓出入口 3裝著門4以前對箱2内的晶圓 1實施測繪時，可在測繪完成箱2封入氮氣體2 1 C的狀態 下，送至其次工程。 ® 另外，此開箱器的較佳實施例亦可適用於第一實施形 態〜第四實施形態。適用時可取得前述的效果。 ' 圖16是表示箱升降機的較佳實施例的立體圖。 . 圖17是表示其作用狀態的立體圖。 如圖16所示，在箱升降機15設置有罩蓋3 00。罩蓋 3〇〇是具備：水平配置的頂板301、及垂直配置，上端邊 被固定於頂板301的前端邊之前板302。頂板301是被固 定於昇降驅動裝置16的軸17。前板302是形成可被覆裝 載埠14的橫寬、及比軸17的衝程更大的高度（參照圖17 -38- 1379373 昇降驅動裝置16、軸17可爲1個，但最好是所定的 間隔設置2個以上。藉此，可在載置箱的狀態下使頂板 301安定地昇降。 在頂板301中，三角形的逃逸孔303會被開設於裝載 埠14上的保持台18所對向的部位。在逃逸孔3 03的三角 形頂點分別突設有運動銷19«因此，頂板301是構成保持 箱2下面的保持部，且構成箱載置部。 另外，亦可將頂板301表現成保持部，罩蓋300表現 成固定於保持部者。 又，罩蓋300並非一定要固定於保持部者。例如，亦 可在罩蓋3 00設驅動裝置，按照保持部、昇降機構的作動 來進行昇降。 其次，說明以上構成的箱升降機的作用及效果》 雖箱2的圖示省略，但實際從圖16的狀態來移行至 圖17的狀態時，頂板301會從保持台18上拾取箱2。此 時，頂板301的運動銷19是在箱2下面的定位孔5分別 嵌合於保持台1 8的運動銷1 9的外側。 另外，在通常的待機時，頂板301是位於比保持台18 更下方’對門出入口 22，保持台18會迴避前後時的干渉 〇 從圖17的狀態移行至圖16的狀態時，頂板301會將 箱2交接至保持台18上。 被覆箱升降機15的罩蓋300是在於抑止來自箱升降 -39- 1379373 機15的粒子飛散。特別是藉由頂板301來使箱2上昇至 箱搬入搬出口 12附近的狀態，由於昇降驅動裝置16及軸 17等會從裝置正面由正面開口 14C露出，因此會使粒子 飛散至裝置外。但，藉由罩蓋3 00，可抑止如此的粒子飛 • 散。 - 被覆箱升降機15的罩蓋300可抑止因爲昇降驅動裝 置16及軸17露出於作業空間所造成作業者的危險。 ® 例如，可藉由罩蓋300來阻止作業者以手動來將箱2 從匣14A的正面開口 14C(參照圖1)裝載至裝載埠14時 之對昇降驅動裝置16及軸17的接觸。 圖18是表示箱升降機的更佳實施例的立體圖。 圖19是表示其作用狀態的立體圖。 本實施例與上述實施例相異的點是罩蓋300具有一對 的側板304、304的點。一對的側板304、304是分別直角 固定於前板302的左右兩端邊。亦即，除了有開箱器23 ^ @側以外，設於三側面。 若根據本實施例，則罩蓋3 00不僅箱升降機15的前 方，也覆蓋左右側方，因此可更提升粒子飛散防止效果及 . 安全性確保效果。 另外，設置圖16〜圖19所示的箱升降機之實施例亦 可適用於第一實施形態〜第四實施形態。適用時可取得前 述的效果。 另外，本發明並非限於上述實施形態，只要不脫離其 主旨範圍，亦可實施各種變更。 -40- 1379373 例如，若考量箱保管室的密閉性或防止粒子飛散至裝 置外等，則最好是設置前遮擋板13，或箱搬入搬出口 12 形成小開口尺寸。但，亦可無前遮擋板13。 又，亦可使箱搬入搬出口 12擴大成最大限度，實質 將比開箱器23及密閉框體21更上方的區劃壁幾乎全部開 □。 例如，至箱搬送裝置35存取可能的高度位置爲止藉 由箱升降機15來使保持台18(頂板301)預先上昇，在 該位置從OHT接受箱，使保持台18下降不進行門4的開 閉動作，藉由箱搬送裝置35來從保持台18接受箱。 一旦如此運用，則OHT的下降範圍少爲保持台18上 昇的部份即可。又，由於保持台18從OHT接受箱後，不 必使箱搬送裝置35上昇至存取可能的高度位置，因此該 部份可縮短搬送時間。 例如，抓取式箱搬送裝置亦可採用於第一實施形態及 第二實施形態。 第三實施形態的第二區劃壁及箱平台機構亦可採用於 第一實施形態及第二實施形態。 測繪裝置亦可將第一實施形態適用於第二實施形態、 第三實施形態及第四實施形態，或將第二實施形態、第三 實施形態及第四實施形態適用於第一實施形態。 在上述實施形態中雖是針對適用於批次式CVD裝置 時來敘述，但本發明並非限於此，亦可適用於擴散裝置或 退火裝置及氧化裝置等的基板處理裝置全部。 -41 - 1379373 基板並非限於晶圓，亦可爲光罩或印刷配線基板、液 晶面板、光碟及磁碟等。 附記理想的實施態樣。 (1) 一種基板處理裝置，其特徵係具備： 收納容器，其係收納複數的基板，基板出入口會藉由 蓋體來阻塞； 搬入搬出部，其係於框體内與外之間進行該收納容器 的搬入搬出； 載置部，其係於該搬入搬出部載置上述收納容器； 保管室，其係鄰接於上述搬入搬出部而設置，保管上 述收納容器； 開閉裝置，其係進行載置於該載置部之上述收納容器 的上述基板出入口的開閉； 搬送裝置，其係具有保持上述收納容器下面的保持機 構，經由上述開閉裝置的上方，在上述保管室内與外之間 ，搬送藉由該保持機構來保持的上述收納容器；及 昇降機構，其係於上述開閉裝置進行上述收納容器的 開閉時之上述載置部的高度位置、與上述搬送裝置進行上 述收納容器的授受的高度位置之間，進行上述載置部的昇 降。. (2) —種基板處理裝置，其特徵係具備： 收納容器，其係收納複數的基板，基板出入口會藉由 蓋體來阻塞； 搬入搬出部，其係於框體内與外之間進行該收納容器 -42 - 1379373 的搬入搬出； 載置部，其係於該搬入搬出部載置上述收納容器： 保管室，其係鄰接於上述搬入搬出部而設置，保管上 述收納容器； 開閉裝置，其係設於上述保管室，進行載置於該載置 部之上述收納容器的上述基板出入口的開閉； 搬送裝置，其係經由上述開閉裝置的上方，在上述保 管室内與外之間，搬送上述收納容器； 昇降機構，其係於上述開閉裝置進行上述收納容器的 開閉時之上述載置部的高度位置、與上述搬送裝置進行上 述收納容器的授受的高度位置之間，進行上述載置部的昇 降；及 控制器，其係於上述保管室内與外之間在上述昇降機 構使上述載置部上昇至可搬送上述收納容器的高度位置之 狀態下，控制上述昇降機構及上述搬送裝置，而使能夠在 上述搬送裝置與上述載置部之間進行上述收納容器的授受 〇 (3) —種基板處理裝置，其特徵係具備： 收納容器，其係收納複數的基板，基板出入口會藉由 蓋體來阻塞； 搬入搬出部，其係於框體内與外之間進行該收納容器 的搬入搬出； 載置部，其係於該搬入搬出部載置上述收納容器； 開閉裝置，其係進行載置於該載置部之上述收納容器 -43- 1379373 的上述基板出入口的開閉； 保管架，其係設於上述框體内，保管上述收納容器； 搬送裝置，其係設於上述框體内，經由上述開閉裝置 的上方，在上述載置部與上述保管架之間’搬送上述收納 容器；及 昇降機構，其係使上述載置部上昇至上述搬送裝置可 存取的位置。 (4) 如上述（1)之基板處理裝置，其中，具備上述收納 容器開閉時之包圍上述基板出入口及上述開閉裝置的開閉 室，該開閉室可在内部充塡惰性氣體。 (5) 如上述（1)之基板處理裝置，其中，在上述開閉室 具備基板狀態檢測裝置。 (6) 如上述（4)之基板處理裝置，其中，具備：對上述 開閉室供給惰性氣體的氣體供給線路、及將上述開閉室予 以排氣的排氣線路， 上述氣體供給線路係設置於與上述開閉裝置之卸下上 述蓋體時的退避方向呈相反的側，上述排氣線路係設置於 與上述開閉裝置之卸下上述蓋體時的退避方向相同的側。 (7) 如上述（6)之基板處理裝置，其中，上述開閉室係 於上述氣體供給線路與上述基板出入口之間具備格柵（偏 向具）。 (8) —種半導體裝置的製造方法，係使用上述（1)的基 板處理裝置的製造方法，其特徵係具有： 將上述收納容器搬入上述搬入搬出部，在上述載置部 -44- 1379373 載置上述收納容器之步驟； 上述開閉裝置會從載置於上述載置部的上述收納容器 的上述基板出入口卸下上述蓋體之步驟； 上述開閉裝置會在載置於上述載置部的上述收納容器 的上述基板出入口安裝上述蓋體之步驟； 在上述蓋體卸下安裝時之上述載置部的高度位置、與 上述搬送裝置進行上述收納容器的授受的高度位置之間， 上述昇降機構會使上述載置部上昇之步驟； 上述搬送裝置會經由上述開閉裝置的上方來將上述保 持機構所保持的上述收納容器搬入至上述保管室内之步驟 :及 在處理室内處理上述基板之步驟。 (9) 一種基板處理裝置，其特徵係具備： 收納容器，其係收納複數的基板，基板出入口會藉由 蓋體來阻塞； 搬入搬出部，其係於框體内與外之間進行該收納容器 的搬入搬出； 載置部，其係於該搬入搬出部載置上述收納容器； 保管室，其係鄰接於上述搬入搬出部而設置，保管上 述收納容器： 開閉裝置，其係進行載置於上述載置部之上述收納容 器的上述基板出入口的開閉； 區劃壁，其係區劃上述保管室之内與外； 開口，其係設於比上述開閉裝置更上方的上述區劃壁 -45 - 1379373 ，在上述保管室之内與外之間進行上述收納容器的搬入搬 出； 搬送裝置，其係設於上述保管室内，經由上述開口來 從上述載置部搬送上述收納容器；及 昇降機構，其係使上述載置部上昇至上述搬送裝置可 存取於上述載置部所載置的上述收納容器之位置。 (1〇)如上述（9)之基板處理裝置，其中，具備在上述 載置部上方對向於該載置部而設置的第二區劃壁、及設於 該第二區劃壁的第二開口、及進行該第二開口的開閉之第 二開閉裝置。 (11) 如上述（10)之基板處理裝置，其中，上述第二開 閉裝置的上面’係於閉塞上述第二開口時形成可載置上述 收納容器。 (12) 如上述（9)之基板處理裝置，其中，具備進行上 述開口的開閉之第二開閉裝置。 (13) 如上述（1)之基板處理裝置，其中，具備： 預備室’其係設置有在上述開閉裝置卸下上述收納容 器的上述蓋體時’在上述收納容器與基板保持具之間搬送 上述基板的基板搬送裝置； 處理室’其係鄰接於該預備室而設置，處理被保持於 上述基板保持具的上述基板；及 保管室，其係鄰接於上述預備室而設置，設置有上述 保管架及上述搬送裝置。 (14) —種半導體裝置的製造方法，其特徵係具有： •46- 1379373 將收納容器搬入搬入搬出部，在載置部載置該收納容 器之步驟； 上述開閉裝置會從被載置於上述載置部的上述收納容 器的基板出入口來卸下蓋體之步驟： 基板狀態檢測裝置會檢測出上述收納容器内的基板配 列狀態之步驟； 從上述蓋體卸下安裝時之上述載置部的高度至上述開 閉裝置上方的高度、亦即在上述載置部與上述搬送裝置之 間進行上述收納容器的授受的高度，使上述載置部上昇之 步驟； 上述搬送裝置會保持上述收納容器，而從上述載置部 來搬送至保管架之步驟；及 在處理室内處理上述基板之步驟。 (15)—種基板處理裝置，其特徵係具備： 收納容器，其係收納複數的基板，基板出入口會藉由 蓋體來阻塞； 搬入搬出部，其係於框體内與外之間進行該收納容器 的搬入搬出； 載置部，其係於該搬入搬出部載置上述收納容器； 開閉裝置，其係進行載置於上述載置部之上述收納容 器的上述基板出入口的開閉； 昇降機構，其係於上述開閉裝置之可開閉上述收納容 器的高度位置、與跨越上述開閉裝置的上方而可搬送上述 收納容器的高度位置之間，進行上述載置部的昇降；及 -47 - 1379373 搬送裝置，其係於與可搬送上述收納容器的高度之上 述載置部之間，進行上述收納容器的授受。 (16)—種基扳處理裝置，其特徵係具備： 收納容器，其係收納複數的基板，基板出入口會藉由 • 蓋體來阻塞； . 搬入搬出部，其係於框體内與外之間進行該收納容器 的搬入搬出； # 載置部，其係於該搬入搬出部載置上述收納容器； 開閉裝置，其係進行載置於該載置部之上述收納容器 的上述基板出入口的開閉； 開閉室，其係包圍上述開閉裝置；及 昇降機構，其係於上述開閉裝置之可開閉上述收納容 器的高度位置、與上述載置部所載置的上述收納容器的至 少一部份形成比上述開閉室的上端更高的高度位置之間， 進行上述載置部的昇降。 ® (17)如上述（16)之基板處理裝置，其中，具備覆蓋上 述載置部的下部之罩蓋，該罩蓋係按照上述昇降機構的作 ' 動來進行昇降。 • ( 18)如上述（17)之基板處理裝置，其中，上述罩蓋係 配置於上述載置部的前側。 (19) 如上述（17)之基板處理裝置，其中，上述罩蓋係 除了有上述開閉裝置的側以外，設於三側面。 (20) —種基板處理裝置，其特徵係具備： 收納容器，其係收納複數的基板，基板出入口會藉由 -48- 1379373 蓋體來阻塞； 搬入搬出部，其係於框體内與外之間進行該收納容器 的搬入搬出； 載置部’其係於該搬入搬出部載置上述收納容器； 昇降機構’其係設於該載置部的下方，進行該載置部 的昇降；及 罩蓋’其係設成可覆蓋上述載置部的下部，按照上述 昇降機構的作動來進行昇降。 (21)—種基板處理裝置，其特徵係具備： 收納容器，其係收納複數的基板，基板出入口會藉由 蓋體來阻塞； 搬入搬出部，其係於框體内與外之間進行該收納容器 的搬入搬出： 載置部，其係於該搬入搬出部載置上述收納容器； 保管室，其係設於上述框體内，保管上述收納容器； 開閉裝置，其係進行載置於該載置部之上述收納容器 的上述基板出入口的開閉； 搬送裝置，其係具有保持上述收納容器下面的保持機 構，經由上述開閉裝置的上方，在上述保管室内與外之間 ，搬送該保持機構所保持的上述收納容器； 昇降機構，其係於上述開閉裝置進行上述收納容器的 開閉時之上述載置部的高度位置、與上述搬送裝置進行上 述收納容器的授受的高度位置之間，進行上述載置部的昇 降；及 -49- 1379373 控制器，其係於一面藉由上述保持機構來保持上述收 納容器下面，一面由上述昇降機構使上述載置部上昇至可 搬送上述收納容器的高度位置之狀態下，控制上述昇降機 構及上述搬送裝置’而使能夠在上述搬送裝置與上述載置 部之間進行上述收納容器的授受。 (22) —種半導體裝置的製造方法，係使用上述（16)的 基板處理裝置的製造方法，其特徵係具有： 將上述收納容器搬入上述搬入搬出口，在上述載置部 載置上述收納容器之步驟； 在上述蓋體卸下安裝時之上述載置部的高度位置、與 上述載置部所載置的上述收納容器的至少一部份形成比上 述開閉室上端更高的高度位置之間，上述昇降機構會使上 述載置部上昇或下降之步驟；及 在處理室内處理上述基板之步驟。 (23) 如上述（16)之基板處理裝置，其中，具備控制器 ’其係於上述昇降機構使上述載置部上昇至可搬送上述收 納容器的高度之狀態下，控制上述昇降機構及上述搬送裝 置，而使能夠在上述搬送裝置與上述載置部之間進行上述 收納容器的授受。 (24) —種半導體裝置的製造方法，係使用上述（16)的 基板處理裝置的製造方法，其特徵係具有： 將上述收納容器搬入上述搬入搬出部，在上述載置部 載置上述收納容器之步驟； 上述昇降機構會使上述載置部上昇或下降之步驟：及 -50- 1379373 在處理室内處理上述基板之步驟。 【圖式簡單說明】 圖1是表示本發明的第一實施形態之批次式CVD裝 置的部份省略立體圖。 圖2是側面剖面圖。 圖3是表示主要部的側面剖面圖。 圖4是表示反應爐的縱剖面圖。 圖5是用以說明開箱器的作用之各部份省略側面剖面 圖，（a)是表示門的卸下前，（b)是表示測繪時。 圖6是表示箱搬入時之部份省略側面剖面圖。 圖7是表示本發明的第二實施形態之批次式CVD裝 置的側面剖面圖。 圖8是表示本發明的第三實施形態之批次式CVD裝 置的側面剖面圖。 圖9是表示本發明的第四實施形態之批次式CVD裝 置的側面剖面圖。 圖10是表示其運用方法的第一例的各側面圖。 圖11是表示其運用方法的第二例的各側面圖。 圖12是表示其運用方法的第三例的各側面圖。 圖13是表示接續第三例的各側面圖》 圖1 4是表示開箱器的較佳實施例的側面剖面圖。 圖15是其分解立體圖。 圖16是表示箱升降機的較佳實施例的立體圖。 -51 - 1379373 圖1 7是表示其作用狀態的立體圖。 圖18是表示箱升降機的較佳實施例的立體圖。 圖1 9是表示其作用狀態的立體圖。 ' 【主要元件符號說明】 - 1 :晶圓（基板） 2 :箱（收納容器） # 3 :晶圓出入口 4 ··門（蓋體） 5 :定位孔 6 :帽簷部 10 :批次式CVD裝置（基板處理裝置） 1 1 :主框體 11a:正面壁（區劃壁） 1 1 b :箱保管室 ® 12:箱搬入搬出口（收納容器搬入搬出口） 1 3 :前遮擋板（開閉體） ' 14:裝載埠（收納容器搬入搬出部） ， 1 4 A :箱 1 4 B :頂棚開口 14C :正面開口 15:箱升降機（收納容器載置部昇降機構部） 1 6 :昇降驅動裝置 17 :軸 -52- 1379373 18:保持台（收納容器載置部） 1 9 :支承運動銷 20 :預載室 2 1 :密閉框體（區劃壁） • 21A:氮氣體供給線路 . 2 1 B :排氣線路 21A’：氮氣體供給裝置 # 2 1 B，：排氣裝置 22 :門出入口（開口部） 2 3 :開箱器（收納容器蓋體開閉部） 25 :移動台 2 6 :閉合器 2 7 :測繪裝置（基板狀態檢出部） 2 8 :線性促動器 29 :夾具 ® 3 0 :檢測元件 31:旋轉式箱架（保管架） 32 :支柱 . 33 :架板 34 :支承運動銷 35:箱搬送裝置（收納容器搬送部） 35a:箱升降機（收納容器昇降機構） 35b:箱搬送機構（收納容器搬送機構） 40 :副框體 -53- 1379373 40a:正面壁（區劃壁） 4 1 :晶圓搬入搬出口 42 :開箱器（收納容器蓋體開閉部） 43 :載置台 * 44 :著脫機構 • 45 :預備室 46 :晶圓移載機構 _ 46a :晶圓移載裝置 46b :晶圓移載裝置升降機 4 6 c :攝子 47 :載舟（基板保持具） 48 :載舟升降機 49 :臂 5 0 :加封蓋 5 1 :處理爐 ^ 5 2 :加熱器 5 3 :加熱器基座 54 :製程管 . 55 :外管 56 :內管 57 :處理室 5 8 :筒狀空間 59 :岐管 60 :噴嘴 -54- 1379373 氣體供給管The box platform mechanism 105 is provided with a slide plate 107 that opens and closes the opening 106 that is opened directly above the loading cassette 14. In the state in which the opening portion 106 is opened, the box platform mechanism 1 is placed on the holding table H of the loading cassette 14 from the OHT 110 via the ceiling opening 14B and the opening portion 106. On the other hand, the slider 107 is used. When the opening 106 is closed, the ΟΗΤ1 10 is placed on the slide 107 ("the task of the storage rack"). Then, when the box 2 is placed on the holding table 18 of the loading cassette 14 from the slider 1〇7, the box platform mechanism 105 slides the slider 107 to open the opening in a state where the box conveying mechanism 1〇2 lifts the box 2. Department 1〇6. Next, the tank transport mechanism 102 operates the tank 2' to be placed on the holding table 18 of the loading cassette 14 by the operation of the opening portion 106 to carry -29-1379373. Next, the above-described operation steps of the grab box transport apparatus 100 and the box platform mechanism 105 will be described. In addition, the other steps of the mapping procedure of the wafer in the survey box are the same as in the second embodiment. The description of the steps is omitted. .  As shown in Fig. 8, the OHT 110 directly feeds the tank 2 to the loading cassette 14 via the ceiling opening 14B and the opening 106. # At this time, the supporting movement pin 19 of the holding table 18 is inserted into the positioning hole 5 of the lower side of the box 2, whereby the box 2 is formed in a state of being positioned in the holding table 18, in the loading cassette 14, the mapping device is a wafer in the surveying box (refer to the first embodiment and the second embodiment). ^ In the mapping step, the actual mapping information read by the mapping device and the mapping information previously provided by the box 2 At the same time, the box 2 that is found to be different will be immediately transferred from the loading cassette 14 by the OHT1 10 to the wafer or the previous project. When the actual mapping information read by the mapping device is consistent with the mapping information previously provided by the box 2, the front shutter 13 will open the box.  When the container 12 is moved in, the box lifter 101 lowers the tank transport mechanism 丨〇2 to the opposite position of the tank loading/unloading port 12. Next, the box transport mechanism 102 causes the grip portion 1〇3 to be submerged into the tank loading/unloading port 12, and is moved to the upper side of the tank 2. Next, the tank transport mechanism 102 lowers the grip portion 1〇3. The grip portion 103 is extended to the lower side, and the cap portion 6 of the case 2 is clamped from above. -30- 1379373 Once the brim portion 6' of the phase 2 is clamped, the grip portion i〇3 is shortened to the upper side and the box 2 is lifted, and the box lifter 1〇1 causes the tank transport mechanism 1〇2 to rise to the box The height corresponding to the loading and unloading port 12. The tank transport mechanism 102 carries the hoisted box 2 from the tank into the carry-out port 12 - into the tank storage room lib of the main casing 11. .  The grab box transport apparatus 100 transports the carried box 2 to the shelf 31A and automatically delivers it to the designated shelf 33A. #箱2 will be temporarily kept. Then, in the opposite procedure to the above, the grab box transport apparatus 100 transports the tank 2 from the storage rack 31A to the loading cassette 14. For example, when the other box 2 is transported by the Η T 1 10 0 in the mapping step, the box platform mechanism 105 receives the box 2 from the cassette 110 by the slide 107, and temporarily stores it with the slide 107. That is, as shown in the imaginary line of Fig. 8, the box platform mechanism 1 〇 5 is a case 2 for sliding the slider 107 to close the opening portion 106, and accepting the ® OHTHO by the slider 107. That is, the slide 107 is a task for temporarily playing the storage rack. Then, the tank 2 is moved from the slide 107 to the holding table 18 on which the crucible 14 is loaded.  When the tank transport mechanism 1〇2 lifts the tank 2 from the slide 107, the box deck mechanism 105 slides the slide plate 107 to open the opening 106. Next, the box transport mechanism 102 causes the lifted box 2 to be placed on the holding table 18 of the loading cassette 14 through the opening 106. According to the present embodiment, in addition to the effects of the second embodiment described above, the second effect can be obtained. -31 - 1379373 When the box is transported by OHT during the mapping step, the box platform mechanism accepts the box from the raft by means of the slide, thereby temporarily storing it. Fig. 9 is a side cross-sectional view showing a batch type CVD apparatus according to a fourth embodiment of the present invention. The present embodiment differs from the above-described first embodiment in that it includes a box transport device (hereinafter referred to as a grab box transport device) 200 that transports the brim portion 6 of the case 2 and transports it. That is, as shown in Fig. 9, the grab box transporting apparatus 200 is installed in the tank storage compartment lib. In the grip box transporting device 200, the tank 2 can be transported through the tank in the state in which the hatch portion 6 is grasped, and the tank 2 is transported between the holding table 18 and the tank holding chamber lib. The grab box transport apparatus 200 includes a box lifter 201, a tank transport mechanism 202 that is lifted and lowered by the tank lifter 201, and a gripping unit 203 that is moved by the tank transport mechanism 202. The grip portion 203 has a shape in which the cap portion 6 is stretched and contracted in the horizontal direction, and a mechanism that does not have a telescopic direction in the horizontal direction, and a substantially U-shaped shape is formed, and only the hook type of the brim portion is hooked. And a type of mechanism that is stretched in the vertical direction. The grab box transport device 200 is controlled by a controller 77. Next, the operation of the above-described grab-type box conveying device will be described in a few examples. In the following description, the controller 77 is operated to control the gripping box conveying device 200, the box elevator 15, the front shutter 13, and the like. Fig. 1A is a first example showing an operation method. As shown in Fig. 10(a), the box elevator 15 is extended by the lifting and lowering device -32-1379373 16 to raise the holding table 18 of the support box 2 to the bottom surface of the box 2 higher than the reference height 204. position. Simultaneously with the operation of the above-described box elevator 15, the tank elevator 201 raises and lowers the tank transport mechanism 202 and the grip portion 203 so that the height of the grip portion 203 can be formed at the same height as the height of the brim portion 6. Further, the reference height 024 is the height of the lower end of the tank loading/unloading port 12 (see Fig. 9), and at least the height position of the upper end of the casing 21 is equal to or higher than the height position. A height position higher than the height position of the upper end of the preload chamber 20. The front shielding plate 13 is an open box loading/unloading port 12 (see Fig. 9). As shown in Fig. 10 (b), the tank transport mechanism 202 is extended, and is carried into the carry-out port 12 from the tank storage chamber lib via the tank, and is horizontally moved to the nip portion 203 located outside the main casing 11, thereby holding the nip. The portion 203 is replaced by the lower portion of the brim portion 6. As shown in Fig. 10(c), "once the box elevator 201 raises the tank transport mechanism 022, the grip portion 203 lifts the tank 2 from the holding table 18. As shown in Fig. 10 (d), the grab box transporting device 2 will shorten the tank transport mechanism 202 and carry the tank 2 into the tank storage chamber 11b. On the other hand, the box elevator 15 will shorten the shaft 17 by the elevation drive unit 16 to lower the holding table 18 onto the loading magazine 14. Then, the grab box transport apparatus 200 transports the tank 2 to the rotary rack 31 and delivers it to the designated rack plate 33. According to the first example, the grip portion 2 0 3 is hooked to the brim portion 6 Just fine. Therefore, the holding portion 203 does not need a mechanism that expands and contracts in the horizontal direction and the misalignment direction -33 - 1379373, and its construction and actuation are simple. As a result, cost reduction, space saving, and shortening of operation time can be achieved. Fig. 11 is a view showing a second example of the operation method. As shown in Fig. 11 (a), the box elevator 15 is extended by the elevation drive unit 16, so that the holding table 18 of the support box 2 is raised to a position lower than the reference height 2〇4. That is, the brim portion 6 is higher than the reference height 204. Simultaneously with the operation of the above-described box elevator 15, the tank elevator 20 1 raises and lowers the tank transport mechanism 202 and the grip portion 203 so that the height of the grip portion 203 can be equal to the height of the brim portion 6. The front shielding plate 13 is an open box loading/unloading port 12 (see Fig. 9). As shown in Fig. 11 (b), the tank transport mechanism 202 is extended, and the inside of the tank storage chamber Ub is carried into the carry-out port 12 via the tank, and is horizontally moved to the nip portion 203 located outside the main casing 11, thereby holding the nip. The portion 203 is changed to the lower portion of the brim portion 6. As shown in Fig. 11(c), when the box elevator 201 raises the tank transport mechanism 202, the grip portion 203 lifts the tank 2 from the holding table 18. As shown in Fig. 11 (d), the grab box transporting device 200 shortens the tank transport mechanism 202 and causes the tank 2 to be carried into the tank storage compartment lib. On the other hand, the box elevator 15 will shorten the shaft 17 by the elevation drive unit 16, and the holding table 18 will be lowered onto the loading magazine 14. Then, the grab box transporting device 200 transports the tank 2 to the rotary box frame 3 1, and delivers it to the designated rack plate 33. Compared with the first example, it is necessary to lower the movement of the tank 2 liter -34 - 1379373 by the tank elevator 201 between the height of the holding table 18 and the height of the tank loading/unloading port 12, but it is hereby In the second example, as long as the grip portion 203 is hooked to the brim portion 6. Therefore, the holding portion 203 does not need to be stretched in the horizontal direction and the vertical direction, and its construction and actuation are simple. As a result, cost reduction, space saving, and shortening of operation time can be achieved. 12 and 13 show a third example of the operation method. As shown in Fig. 12(a), the box elevator 15 extends the shaft 17 by the elevation drive unit 16, so that the holding table 18 of the support box 2 rises to a position where the brim portion 6 forms a reference height 2020. Simultaneously with the operation of the tank elevator 15, the tank elevator 201 raises and lowers the tank transport mechanism 202 and the gripping portion 203 so that the height of the grip portion 203 can be set to the height of the tank loading/unloading port 12. The front shielding plate 13 is an open box loading/unloading port 12 (see Fig. 9). As shown in Fig. 12 (b), once the tank transport mechanism 202 is submerged into the tank loading/unloading port 12, the grip portion 203 is positioned directly above the brim portion 6. As shown in Fig. 12(c), once the tank elevator 20 is lowered by the tank transport mechanism 202, the grip portion 203 is lowered to the brim portion 6. The clamping portion 203 is elongated in the horizontal direction. As shown in Fig. 12 (d), the grip portion 203 is shortened in the horizontal direction and is changed to the underside of the brim portion 6. As shown in Fig. 13 (a), once the tank elevator 201 raises the tank transport mechanism 022, the grip portion 2 〇3 lifts the tank 2 from above the holding table 18. The box elevator 201 is such that the tank transport mechanism 202 rises at least to a height above the bottom surface of the tank 2 from the reference height. -35- 1379373 As shown in Fig. 13 (b), the grab box transport apparatus 200 shortens the tank transport mechanism 202 and causes the tank 2 to be carried into the tank storage compartment lib. On the other hand, the box elevator 15 will shorten the shaft 17 by the elevation drive unit 16, and the holding table 18 will be lowered onto the loading magazine 14. Then, the grab box transporting device 200 transports the tank 2 to the rotary box frame 31 and delivers it to the designated rack plate 33. According to the third example, compared with the first example and the second example, it is necessary to move and move the tank 2 between the holding table 18 and the tank loading/unloading port 12 by the tank elevator 201. The time and the point of the mechanism that needs to be stretched in the horizontal direction of the nip portion 203 are inferior. However, since the nip portion 2〇3 does not need to be stretched and contracted in the vertical direction, the structure and actuation are simplified. As a result, cost reduction, space saving, and shortening of operation time can be achieved. According to the fourth embodiment, the box elevator and the grab box transporting device are provided in the loading cassette. Therefore, in the lifting operation of the holding table of the loading cassette, the grab box conveying device can carry the other box to the rotary box frame. Or other operations such as the box opener of the sub-frame. Therefore, the operating rate of the gripping box transporting device can be improved. Further, by dividing the box elevator and the grab box conveying device, the gripping box conveying device can be moved to the front of the box transfer position while the loading operation of the loading box is performed, and standby is performed. That is, it can be processed in parallel at the same time, so that the total transfer time can be shortened. Similarly, by simultaneously implementing the rise of the gripper box transport device and the lowering of the tank lifter, the transfer time of the tank can also be shortened. Further, the operation method of the fourth embodiment can be applied to the first embodiment of the first embodiment and the second embodiment. When applicable, the same effects as those of the first embodiment and the second embodiment described above can be obtained. Figure 14 is a side cross-sectional view showing a preferred embodiment of the unpacker. Fig. 15 is an exploded perspective view thereof. As shown in Fig. 14, one end of the nitrogen gas supply line 21A is connected to the upper surface of the sealed casing 21, and one end of the exhaust line 21B is connected to the lower wall of the sealed casing 21. The nitrogen gas supply line 21A blows the nitrogen gas 21C downward from the air outlet into the preload chamber 20. The exhaust line 21B exhausts the inside of the preload chamber 20. As shown in Figs. 14 and 15, in the upper end portion of the preload chamber 20, the Louver 21D is placed at a position facing the air outlet of the nitrogen gas supply line 21A. The grid 21D is a deflector that deflects the flow of the nitrogen gas 21C that is blown out from the outlet of the nitrogen gas supply line 21A. The grid 21D is inclined toward the door entrance 22 by which the grid 21D deflects the flow of nitrogen gas toward the door inlet and outlet 22. Next, the action and effect of the above-described unpacker will be described. Since the nitrogen gas supply line 21A is connected to the upper end of the preload chamber 20, the exhaust line 21B is disposed at the lower end, so that the nitrogen gas flow in the preload chamber 20 forms a downflow. The downstream nitrogen gas 2 1 C can effectively discharge foreign matter such as dust and organic matter in the pre-load chamber 20. That is, the downstream nitrogen gas 21C prevents foreign matter from adhering to the wafer 1 or intruding into the tank 2. The foreign matter in the preloading chamber 20 is provided with the moving table 25 provided in the preloading chamber 20, the closer 26, and the dust and organic matter of the surveying device 27. The grid 21D biases the nitrogen gas 21C toward the door inlet and outlet 22 and leads to the -37-1379373 tank 2. The flow of the nitrogen gas 21C into the tank 2 is to prevent the intrusion of foreign matter from the convection from the inside and the lower portion of the preload chamber 20. For example, the second method of operation can be implemented. When the tank 2 is carried out from the loading cassette 14 by the in-project conveying device, the nitrogen gas 21C is guided into the tank 2 by the grill 21D, whereby the nitrogen gas is used.  At 21C, it is mandatory to quiet (replace) the environment (air, foreign matter, etc.) in the tank 2. Then, the door 4 is mounted by the unpacker 23 at the wafer inlet and outlet 3 of the tank 2. According to this operation method, the nitrogen gas 21C can be further enclosed in the tank 2, so that contamination inside the tank 2 and formation of a natural oxide film can be prevented. For example, even if a nitrogen gas atmosphere is not formed in the sub-frame 40, the nitrogen gas 21C can be sealed in the tank 2. Further, when the wafer 1 in the tank 2 is subjected to mapping before the wafer door 3 is mounted with the door 4, it can be sent to the next stage in a state where the nitrogen gas 2 1 C is sealed in the surveying completion box 2. Further, the preferred embodiment of the unpacker can also be applied to the first to fourth embodiments. The aforementioned effects can be obtained when applicable. Figure 16 is a perspective view showing a preferred embodiment of the box elevator. .  Fig. 17 is a perspective view showing an operation state thereof. As shown in FIG. 16, the box lifter 15 is provided with a cover 300. The cover 3A includes a top plate 301 disposed horizontally and a vertical arrangement, and the upper end side is fixed to the front plate 302 of the front end side of the top plate 301. The top plate 301 is a shaft 17 that is fixed to the elevation drive unit 16. The front plate 302 is formed to cover the width of the loadable magazine 14 and the stroke of the shaft 17 (refer to FIG. 17 - 38-1379373. The lift drive 16 and the shaft 17 may be one, but preferably the predetermined one. Two or more intervals are provided. Thereby, the top plate 301 can be stably raised and lowered in a state in which the box is placed. In the top plate 301, the triangular escape holes 303 are opposed to the holding table 18 on the loading cassette 14. The moving pin 19 is protruded from the apex of the triangle of the escape hole 303. Thus, the top plate 301 is a holding portion constituting the lower surface of the holding case 2, and constitutes a box mounting portion. Further, the top plate 301 can also be represented as a holding portion. The cover 300 is shown as being fixed to the holding portion. Further, the cover 300 is not necessarily fixed to the holding portion. For example, a driving device may be provided in the cover 300, and the lifting portion and the lifting mechanism may be moved up and down. Next, the operation and effect of the box elevator configured as described above will be described. Although the illustration of the tank 2 is omitted, the top plate 301 picks up the tank 2 from the holding table 18 when actually moving from the state of FIG. 16 to the state of FIG. At this time, the movement pin 19 of the top plate 301 The positioning holes 5 under the case 2 are respectively fitted to the outside of the movement pin 19 of the holding table 18. Further, in the normal standby state, the top plate 301 is located below the holding table 18 'the door entrance 22, the holding table 18 The top plate 301 will transfer the box 2 to the holding table 18 when the heading 301 is moved from the state of Fig. 17 to the state of Fig. 16. The cover 300 of the box elevator 15 is to prevent the lifting from the box-39- 1379373 The particles of the machine 15 are scattered. In particular, the top plate 301 is used to raise the tank 2 to the vicinity of the tank loading/unloading port 12, and the lifting/lowering device 16 and the shaft 17 are exposed from the front surface of the apparatus by the front opening 14C. The particles are scattered outside the device. However, such a particle flying can be suppressed by the cover 300. - The cover 300 of the covered box lift 15 can prevent the lifting drive device 16 and the shaft 17 from being exposed to the working space. Hazard of the person. For example, the cover 300 can be used to prevent the operator from manually loading the box 2 from the front opening 14C of the raft 14A (refer to FIG. 1) to the loading and lowering device 16 and the shaft 17 s contact. 18 is a perspective view showing a preferred embodiment of the box elevator. Fig. 19 is a perspective view showing the operation state of the box elevator. The point that the present embodiment differs from the above embodiment is that the cover 300 has a pair of side plates 304, 304. The pair of side plates 304, 304 are respectively fixed at right angles to the left and right end sides of the front plate 302. That is, they are provided on the three sides except for the opening of the box 23@@. If according to this embodiment, the cover 3 00 Not only the front of the box elevator 15 but also the left and right sides are covered, so that the particle scattering prevention effect and the effect can be further enhanced.  Security ensures results. Further, the embodiment in which the box elevator shown in Figs. 16 to 19 is provided is also applicable to the first to fourth embodiments. The above effects can be obtained when applicable. The present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. -40- 1379373 For example, if the airtightness of the storage compartment is prevented or the particles are prevented from scattering to the outside of the apparatus, it is preferable to provide the front shutter 13 or the tank loading/unloading port 12 to form a small opening size. However, there is no front shield 13 as well. Further, the tank loading/unloading port 12 can be enlarged to the maximum extent, and substantially the partition wall above the unpacking device 23 and the sealed casing 21 can be almost completely opened. For example, the holding table 18 (top plate 301) is raised in advance by the tank elevator 15 until the tank conveyance device 35 accesses the possible height position, and the box is taken from the OHT at this position, and the holding table 18 is lowered without opening and closing the door 4. The operation is carried out by the tank transporting device 35 from the holding table 18. Once so used, the drop in the OHT range is less than the portion that holds the rise of the stage 18. Further, since the holding table 18 is received from the OHT receiving box, the box conveying device 35 does not have to be raised to a position where the access is possible, so that the portion can shorten the carrying time. For example, the grasping box conveying device can also be applied to the first embodiment and the second embodiment. The second partition wall and the box platform mechanism of the third embodiment can also be applied to the first embodiment and the second embodiment. The first embodiment can be applied to the second embodiment, the third embodiment, and the fourth embodiment, or the second embodiment, the third embodiment, and the fourth embodiment can be applied to the first embodiment. In the above embodiment, the above description is applied to a batch type CVD apparatus. However, the present invention is not limited thereto, and may be applied to all of the substrate processing apparatuses such as the diffusion apparatus, the annealing apparatus, and the oxidation apparatus. -41 - 1379373 The substrate is not limited to wafers, but may be a photomask or printed wiring substrate, a liquid crystal panel, a compact disc, or a magnetic disk. The ideal implementation of the note. (1) A substrate processing apparatus comprising: a storage container that accommodates a plurality of substrates, wherein the substrate inlet and outlet are blocked by a lid; and the loading/unloading portion is housed between the inside and the outside of the housing. The storage unit carries the storage container on the loading/unloading unit; the storage chamber is provided adjacent to the loading/unloading unit, and stores the storage container; and the opening and closing device is placed on the storage unit. Opening and closing of the substrate inlet and outlet of the storage container of the mounting portion; the conveying device having a holding mechanism for holding the lower surface of the storage container, and transporting between the storage room and the outside through the upper side of the opening and closing device The storage container that is held by the holding mechanism; and the elevating mechanism is between a height position of the mounting portion when the opening and closing device opens and closes the storage container, and a height position between the transfer device and the storage container The lifting and lowering of the mounting portion is performed. .  (2) A substrate processing apparatus characterized by comprising: a storage container that houses a plurality of substrates, wherein the substrate entrance and exit are blocked by a lid; and the loading/unloading unit is disposed between the inside and the outside of the casing The storage container-42 - 1379373 is carried in and out; the mounting portion is placed on the loading/unloading portion; the storage chamber is provided adjacent to the loading/unloading portion, and the storage container is stored; and the opening and closing device is The storage compartment is installed to open and close the substrate inlet and outlet of the storage container placed in the placement unit, and the conveyance device conveys the storage between the storage compartment and the outside via the upper side of the opening and closing device The elevating mechanism is configured to elevate and lower the mounting portion between the height position of the mounting portion when the opening and closing device opens and closes the storage container and the height position at which the transfer device performs the transfer and reception of the storage container. And a controller for raising the loading portion to the transportable portion between the storage chamber and the outside of the lifting mechanism In the state of the height position of the storage container, the lifting mechanism and the conveying device are controlled, and the storage container is provided between the conveying device and the placing portion. The storage container includes a plurality of substrates, wherein the substrate entrance and exit are blocked by a lid, and the loading/unloading unit carries the storage container into and out of the casing and the outside; and the placing unit The storage container is placed on the loading/unloading unit; the opening and closing device opens and closes the substrate inlet and outlet of the storage container-43-379793, which is placed on the mounting portion; and the storage rack is attached to the housing The storage container is stored in the housing, and the storage container is transported between the mounting portion and the storage rack via the upper portion of the opening and closing device; and the lifting mechanism is configured to The placing portion is raised to a position accessible by the conveying device. (4) The substrate processing apparatus according to the above aspect (1), comprising: an opening and closing chamber that surrounds the substrate inlet and outlet and the opening and closing device when the storage container is opened and closed, and the opening and closing chamber is filled with an inert gas. (5) The substrate processing apparatus according to (1) above, wherein the opening and closing chamber includes a substrate state detecting device. (6) The substrate processing apparatus according to the above (4), further comprising: a gas supply line that supplies an inert gas to the opening and closing chamber; and an exhaust line that exhausts the opening and closing chamber, wherein the gas supply line is provided in The retracting direction of the opening and closing device when the lid body is detached is opposite to the side, and the exhausting passage is provided on the same side as the retracting direction of the opening and closing device when the lid body is detached. (7) The substrate processing apparatus according to the above (6), wherein the opening and closing chamber is provided with a grid (bias) between the gas supply line and the substrate inlet and outlet. (8) A method of manufacturing a semiconductor device according to (1), wherein the storage container is carried into the loading/unloading unit, and the loading unit is -44- 1379373 a step of disposing the storage container; the opening and closing device detaching the cover from the substrate inlet and outlet of the storage container placed in the mounting portion; and the opening and closing device is placed in the storage portion a step of attaching the lid to the substrate inlet and outlet of the container; and between the height position of the mounting portion when the lid is removed and attached, and the height position between the transfer device and the storage container The step of raising the mounting portion; the transporting device carries the step of loading the storage container held by the holding mechanism into the storage chamber via the upper side of the opening and closing device; and processing the substrate in the processing chamber. (9) A substrate processing apparatus comprising: a storage container that accommodates a plurality of substrates, wherein the substrate entrance and exit are blocked by a lid; and the loading/unloading unit is attached between the housing and the outside. The storage unit carries the storage container on the loading/unloading unit, and the storage chamber is provided adjacent to the loading/unloading unit, and stores the storage container: the opening and closing device is placed on the loading and unloading device Opening and closing of the substrate inlet and outlet of the storage container of the mounting portion; the partition wall partitioning the inside and the outside of the storage chamber; and the opening being disposed at the partition wall -45 - 1379373 above the opening and closing device, The storage container is carried in and out between the inside and the outside of the storage chamber, and the conveying device is disposed in the storage chamber, and the storage container is conveyed from the mounting portion via the opening; and the lifting mechanism is configured to The placing portion is raised to a position at which the conveying device can access the storage container placed on the placing portion. (1) The substrate processing apparatus according to the above (9), further comprising: a second partition wall provided to the mounting portion above the mounting portion; and a second opening provided in the second partition wall And a second opening and closing device that opens and closes the second opening. (11) The substrate processing apparatus according to (10) above, wherein the upper surface of the second opening and closing device is configured to be capable of placing the storage container when the second opening is closed. (12) The substrate processing apparatus according to the above (9), further comprising: a second opening and closing device that opens and closes the opening. (13) The substrate processing apparatus according to the above aspect (1), further comprising: a preparation chamber that is provided between the storage container and the substrate holder when the cover device that detaches the storage container is opened by the opening and closing device The substrate transfer device of the substrate; the processing chamber is provided adjacent to the preliminary chamber, and the substrate held by the substrate holder is processed; and the storage chamber is provided adjacent to the preliminary chamber, and the storage is provided The rack and the above conveying device. (14) A method of manufacturing a semiconductor device, comprising: 46- 1379373: a step of loading a storage container into a loading/unloading unit and placing the storage container on the placing unit; and the opening and closing device is placed on the loading device a step of removing the cover from the substrate inlet and outlet of the storage container of the mounting portion: a step of detecting the state of the substrate in the storage container by the substrate state detecting device; and removing the mounting portion at the time of mounting from the cover a height to the upper side of the opening and closing device, that is, a height at which the storage container is transferred between the placing portion and the conveying device, and the placing portion is raised; the conveying device holds the storage container a step of transporting from the loading unit to the storage rack; and a step of processing the substrate in the processing chamber. (15) A substrate processing apparatus, comprising: a storage container that houses a plurality of substrates, wherein the substrate entrance and exit are blocked by a lid; and the loading/unloading unit is disposed between the inside and the outside of the casing. The loading and unloading of the storage container; the mounting portion that mounts the storage container on the loading/unloading portion; and the opening and closing device that opens and closes the substrate inlet and outlet of the storage container placed in the mounting portion; And the height of the storage container that can be opened and closed by the opening and closing device and the height position at which the storage container can be transported over the opening and closing device, and the mounting portion is lifted and lowered; and the -47 - 1379373 conveying device And the storage container is conveyed between the mounting portion at a height that can convey the storage container. (16) A seeding card processing apparatus, comprising: a storage container that houses a plurality of substrates, and the substrate entrance and exit is blocked by a cover;  The loading/unloading unit performs loading and unloading of the storage container between the inside and the outside of the casing; # placing portion on which the storage container is placed; and the opening and closing device being placed on the loading/unloading device Opening and closing of the substrate inlet and outlet of the storage container of the mounting portion; opening and closing chamber surrounding the opening and closing device; and lifting mechanism for opening and closing the storage container at a height position of the opening and closing device and the mounting portion At least a portion of the storage container placed thereon is formed at a height position higher than an upper end of the opening and closing chamber, and the mounting portion is raised and lowered. (17) The substrate processing apparatus according to the above (16), further comprising: a cover covering a lower portion of the mounting portion, wherein the cover is lifted and lowered in accordance with the movement of the lifting mechanism. (18) The substrate processing apparatus according to the above (17), wherein the cover is disposed on a front side of the placing portion. (19) The substrate processing apparatus according to the above (17), wherein the cover is provided on three sides except for the side of the opening and closing device. (20) A substrate processing apparatus comprising: a storage container that houses a plurality of substrates; the substrate entrance and exit is blocked by a cover of -48-1379373; and the loading/unloading unit is attached to the inside and outside of the casing The storage container is carried in and out; the mounting portion is mounted on the loading and unloading portion; the lifting mechanism is disposed below the mounting portion to move the loading portion up and down; and The cover ' is provided so as to cover the lower portion of the placing portion, and is lifted and lowered in accordance with the operation of the lifting mechanism. (21) A substrate processing apparatus characterized by comprising: a storage container that accommodates a plurality of substrates, wherein the substrate entrance and exit are blocked by a lid; and the loading/unloading unit is disposed between the inside and the outside of the casing Loading and unloading of the storage container: the placing unit is configured to mount the storage container in the loading/unloading unit; the storage chamber is disposed in the casing to store the storage container; and the opening and closing device is placed on the storage container Opening and closing of the substrate inlet and outlet of the storage container of the mounting portion; the conveying device having a holding mechanism for holding the lower surface of the storage container, and transporting the holding mechanism between the storage chamber and the outside via the upper side of the opening and closing device And the elevating mechanism is configured to be between the height position of the mounting portion when the opening and closing device opens and closes the storage container, and the height position between the transfer device and the storage container. Lifting and lowering; and -49- 1379373 controller, which is maintained on the one side by the above holding mechanism The elevating mechanism and the transfer device are controlled to be between the transfer device and the mount portion while the loading portion is raised to a position where the storage container can be transported by the elevating mechanism. The receiving and receiving of the storage container is performed. (22) A method of manufacturing a substrate processing apparatus according to (16), wherein the storage container is carried in the loading/unloading port, and the storage container is placed on the mounting portion a step of: a height position of the mounting portion when the cover is detachably mounted, and at least a portion of the storage container placed on the mounting portion is formed at a higher height position than an upper end of the opening and closing chamber And the step of raising or lowering the loading portion by the lifting mechanism; and the step of processing the substrate in the processing chamber. (23) The substrate processing apparatus according to the above (16), wherein the controller (the controller) controls the elevating mechanism and the transport in a state where the elevating mechanism raises the mounting portion to a height at which the storage container can be transported The apparatus allows the storage container to be transferred between the transfer device and the placement unit. (24) A method of manufacturing a substrate processing apparatus according to (16), wherein the storage container is carried in the loading/unloading unit, and the storage container is placed on the placing unit The step of raising or lowering the loading portion by the lifting mechanism: and the step of processing the substrate in the processing chamber from -50 to 1379373. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partially omitted perspective view showing a batch type CVD apparatus according to a first embodiment of the present invention. Figure 2 is a side cross-sectional view. Fig. 3 is a side cross-sectional view showing the main part. Fig. 4 is a longitudinal sectional view showing a reaction furnace. Fig. 5 is a side cross-sectional view for explaining the operation of the unpacker, wherein (a) shows the front of the door, and (b) shows the time of the drawing. Fig. 6 is a partially omitted side sectional view showing the case when the case is carried in. Fig. 7 is a side sectional view showing a batch type CVD apparatus according to a second embodiment of the present invention. Fig. 8 is a side cross-sectional view showing a batch type CVD apparatus according to a third embodiment of the present invention. Fig. 9 is a side cross-sectional view showing a batch type CVD apparatus according to a fourth embodiment of the present invention. Fig. 10 is a side view showing each of the first examples of the operation method. Fig. 11 is a side view showing a second example of the operation method. Fig. 12 is a side view showing a third example of the operation method. Figure 13 is a side elevational view showing a third embodiment of the present invention. Figure 14 is a side cross-sectional view showing a preferred embodiment of the unpacker. Fig. 15 is an exploded perspective view thereof. Figure 16 is a perspective view showing a preferred embodiment of the box elevator. -51 - 1379373 Fig. 17 is a perspective view showing the state of action. Figure 18 is a perspective view showing a preferred embodiment of the box elevator. Fig. 19 is a perspective view showing the state of action thereof. ' [Main component symbol description] - 1 : Wafer (substrate) 2 : Box (storage container) # 3 : Wafer inlet and outlet 4 · · Door (cover) 5 : Positioning hole 6 : Cap portion 10 : Batch CVD Device (substrate processing device) 1 1 : Main frame body 11a: front wall (division wall) 1 1 b : box storage room® 12: box loading/unloading port (containment container loading/unloading port) 1 3 : front shielding plate (opening and closing body) ) 14: Loading 埠 (containment container loading/unloading unit), 1 4 A : box 1 4 B : ceiling opening 14C : front opening 15 : box elevator (receiving container mounting unit lifting mechanism unit) 1 6 : lifting drive unit 17 : Shaft-52- 1379373 18: Holder (storage container mounting unit) 1 9 : Supporting motion pin 20: Preload chamber 2 1 : Sealed frame (division wall) • 21A: Nitrogen gas supply line.  2 1 B : Exhaust line 21A': Nitrogen supply device # 2 1 B, Exhaust device 22: Door entrance (opening) 2 3 : Unpacking device (opening and closing of storage container cover) 25 : Mobile station 2 6 : Closer 2 7 : Mapping device (substrate state detecting portion) 2 8 : Linear actuator 29 : Fixture ® 3 0 : Detection element 31 : Rotating frame (reservoir) 32 : Pillar .  33: shelf plate 34: support movement pin 35: box conveyance device (storage container conveyance unit) 35a: box elevator (storage container lifting mechanism) 35b: box conveyance mechanism (storage container conveyance mechanism) 40: sub-frame -53- 1379373 40a: Front wall (division wall) 4 1 : Wafer loading and unloading port 42 : Unpacking device (opening and closing part of storage container cover) 43 : Mounting table * 44 : Lifting mechanism • 45 : Preparation room 46 : Wafer transfer Mechanism _ 46a : Wafer transfer device 46b : Wafer transfer device lift 4 6 c : Photograph 47 : Carrier boat (substrate holder) 48 : Carrier lift 49 : Arm 5 0 : Seal cover 5 1 : Treatment furnace ^ 5 2 : Heater 5 3 : Heater base 54 : Process tube .  55: outer tube 56: inner tube 57: processing chamber 5 8 : cylindrical space 59: manifold 60: nozzle -54- 1379373 gas supply tube

MFC 氣體供給源 氣體流量控制部 排氣管 壓力感側器 壓力調整裝置 真空排氣裝置 壓力控制部 旋轉機構 旋轉軸 驅動控制部 隔熱板 温度感側器 温度控制部 主控制部 控制器 :保管架 :架板 預載室、 密閉框體 :背面壁 門出入口 開箱器 -55 1379373 84 :測繪裝置 85 :移動台 86 :閉合器、 91:晶圓搬入搬出口 92 :門機構 1〇〇:抓取式箱搬送裝置 1 〇 1 :箱升降機MFC gas supply source gas flow control unit exhaust pipe pressure sensor side pressure regulator vacuum exhaust unit pressure control unit rotary mechanism rotary shaft drive control unit heat shield temperature sensor side temperature control unit main control unit controller: storage rack : Shelf preloading chamber, hermetic frame: rear wall door entrance and exit box opener - 55 1379373 84 : Surveying device 85: mobile station 86: closer, 91: wafer loading and unloading port 92: door mechanism 1〇〇: grasping Pick-up box transport device 1 〇1: box lift

102 :箱搬送機構 1 〇 3 :夾持部 1 〇 5 :箱平台機構 1 0 6 :開口部 1 〇 7 :滑板 110:頂棚走行型構内搬送裝置（OHT ) 200 :抓取式箱搬送裝置 201 :箱升降機102 : tank conveying mechanism 1 〇 3 : gripping portion 1 〇 5 : box platform mechanism 1 0 6 : opening portion 1 〇 7 : slide plate 110 : ceiling traveling type internal conveying device (OHT ) 200 : gripping box conveying device 201 : Box lift

202 :箱搬送機構 2 0 3 :夾持部 204 :基準高度 300 :罩蓋 3 0 1 :頂板、 3 02 :前板 3 03 :逃逸孔 3 0 4 :側板 -56-202 : tank conveying mechanism 2 0 3 : gripping portion 204 : reference height 300 : cover 3 0 1 : top plate, 3 02 : front plate 3 03 : escape hole 3 0 4 : side plate - 56-

Claims (1)

1379373 第096143938號專利申請案中文申請專利範圍修正本 民國101年5月30;日修正 十、申請專利範圍 1. 一種基板處理裝置，其特徵係具備： 收納容器，其係收納複數的基板，基板出入口會藉由 蓋體來阻塞； 搬入搬出部，其係於框體内與外之間進行該收納容器 的搬入搬出； 載置部，其係於該搬入搬出部載置上述收納容器； 保管室，其係鄰接於上述搬入搬出部而設置，保管上 述收納容器； 開閉裝置，其係進行載置於該載置部之上述收納容器 的上述基板出入口的開閉； 開口，其係設在區劃上述保管室内外的區劃壁之上述 開閉裝置上方，在上述保管室的内外間進行上述收納容器 的搬入搬出； 搬送裝置’其係具有保持上述收納容器下面的保持機 構，經由上述開口，在上述保管室内與外之間，一面藉由 該保持機構來保持的上述收納容器的下面，一面搬送上述 收容容器；及 昇降機構，其係於上述開閉裝置進行上述收納容器的 開閉時之上述載置部的高度位置、與上述搬送裝置進行上 述收納容器的授受的高度位置之間，進行上述載置部的昇 降〇 1379373 .Ί·'? : •七： 卜年项％修正替接I ' ...... 2.如申請專利範圍第1項之基板處理裝置，其中， 具備上述收納容器開閉時之包圍上述基板出入口及上述開 閉裝置的開閉室，該開閉室可在内部充塡惰性氣體。 3·如申請專利範圍第2項之基板處理裝置，其中， 在上述開閉室具備基板狀態檢測裝置。 4. 如申請專利範圍第2項之基板處理裝置，其中， 具備：對上述開閉室供給惰性氣體的氣體供給線路、及將 上述開閉室予以排氣的排氣線路， 上述氣體供給線路係設置於與上述開閉裝置之卸下上 述蓋體時的退避方向呈相反的側，上述排氣線路係設置於 與上述開閉裝置之卸下上述蓋體時的退避方向相同的側。 5. 如申請專利範圍第4項之基板處理裝置，其中， 上述開閉室係於上述氣體供給線路與上述基板出入口之間 具備格柵。 6. —種半導體裝置的製造方法，係使用申請專利範 圍第1項的基板處理裝置之半導體裝置的製造方法，其特 徵係具有： 將上述收納容器搬入上述搬入搬出部，在上述載置部 載置上述收納容器之步驟； 上述開閉裝置會從載置於上述載置部的上述收納容器 的上述基板出入口卸下上述蓋體之步驟； 上述開閉裝置會在載置於上述載置部的上述收納容器 的上述基板出入口安裝上述蓋體之步驟； 在上述蓋體卸下安裝時之上述載置部的高度位置、與 -2- 1379373 _ π ,. 、:·, Λ‘.:ρ丨；··叫年3月?&日修正替換頁 %> • 上述搬送裝置進行上述收納容器的授受的高度位置之間， 上述昇降機構會使上述載置部上昇之步驟； 上述搬送裝置會經由上述開口來將上述保持機構所予 以保持下面的上述收納容器搬入至上述保管室内之步驟： 及 在處理室内處理上述基板之步驟。 7.—種基板處理裝置，其特徵係具備： 收納容器，其係收納複數的基板，基板出入口會藉由 蓋體來阻塞； 搬入搬出部，其係於框體内與外之間進行該收納容器 的搬入搬出； 載置部，其係於該搬入搬出部載置上述收納容器； 保管室，其係鄰接於上述搬入搬出部而設置，保管上 述收納容器： 開閉裝置，其係進行載置於上述載置部之上述收納容 器的上述基板出入口的開閉； 區劃壁，其係區劃上述保管室之内與外； ' 開口，其係設於比上述開閉裝置更上方的上述區劃壁 ^ ’在上述保管室之内與外之間進行上述收納容器的搬入搬 出； 搬送裝置，其係設於上述保管室内，經由上述開口來 從上述載置部搬送上述收納容器；及 昇降機構，其係使上述收納容器上昇至上述搬送裝置 可存取於上述載置部所載置的上述收納容器之位置。 -3- 13793731379373 Patent Application No. 096143938 Patent Application Revision of the Chinese Patent Application No. May 30, 2011; Japanese Patent Application No. PCT Application No. PCT Application No. PCT Application No. The entrance and exit are blocked by the lid; the loading and unloading unit is carried out between the inside and the outside of the casing, and the storage container is carried in and out; and the placing unit is placed on the loading and unloading unit to store the storage container; And the storage container is disposed adjacent to the loading/unloading unit, and the opening and closing device opens and closes the substrate inlet and outlet of the storage container placed in the mounting portion; and the opening is provided in the storage area. The loading and unloading of the storage container is performed between the inside and the outside of the storage compartment in the upper and lower opening and closing devices of the indoor and outdoor partition walls. The conveying device has a holding mechanism for holding the lower surface of the storage container, and is in the storage compartment through the opening. Between the outside, on the underside of the storage container held by the holding mechanism, And the elevating mechanism is configured to be between the height position of the mounting portion when the opening and closing device opens and closes the storage container, and the height position between the transfer device and the storage container. The lifting device of the mounting portion 1937373. Ί·'? : • 7: 年 项 % 修正 修正 2. 2. 2. 2. 2. 2. 2. 2. 2. 2. 2. 2. 2. 2. 2. 2. 2. 2. 2. 2. When the container is opened and closed, the substrate inlet and outlet and the opening and closing chamber of the opening and closing device are surrounded, and the opening and closing chamber can be filled with an inert gas. 3. The substrate processing apparatus according to claim 2, wherein the opening and closing chamber includes a substrate state detecting device. 4. The substrate processing apparatus according to claim 2, further comprising: a gas supply line for supplying an inert gas to the opening and closing chamber; and an exhaust line for exhausting the opening and closing chamber, wherein the gas supply line is provided The side of the opening and closing device is opposite to the retracting direction when the cover body is removed, and the exhaust line is provided on the same side as the retracting direction of the opening and closing device when the cover is removed. 5. The substrate processing apparatus according to claim 4, wherein the opening and closing chamber is provided with a grid between the gas supply line and the substrate inlet and outlet. A method of manufacturing a semiconductor device using the substrate processing apparatus according to the first aspect of the invention, characterized in that the storage container is carried into the loading/unloading unit, and the loading unit carries a step of disposing the storage container; the opening and closing device detaching the cover from the substrate inlet and outlet of the storage container placed in the mounting portion; and the opening and closing device is placed in the storage portion a step of attaching the cover body to the substrate inlet and outlet of the container; and a height position of the mounting portion when the cover body is detachably mounted, and -2- 1379373 _ π , . , :·, Λ'.:ρ丨; - "Annual March" & Day Correction Replacement Page %> • The above-described elevating mechanism raises the placement portion between the height positions at which the transfer device performs the transfer and reception of the storage container; the transfer device passes the above Opening the container to hold the storage container held by the holding mechanism into the storage chamber: and processing in the processing chamber The step of the substrate. 7. A substrate processing apparatus, comprising: a storage container that houses a plurality of substrates, wherein the substrate entrance and exit are blocked by a lid; and the loading/unloading portion is housed between the inside and the outside of the housing. The storage unit carries the storage container on the loading/unloading unit, and the storage chamber is provided adjacent to the loading/unloading unit, and stores the storage container: the opening and closing device is placed on the loading and unloading device Opening and closing of the substrate inlet and outlet of the storage container of the mounting portion; the partition wall partitioning the inside and the outside of the storage chamber; and the opening is provided in the partition wall above the opening and closing device The storage container is carried in and out between the inside and the outside of the storage compartment; the conveying device is disposed in the storage chamber, and the storage container is conveyed from the placement portion via the opening; and the lifting mechanism is configured to receive the storage The container is raised to a position at which the transfer device can access the storage container placed on the mounting portion. -3- 1379373 8. 如申請專利範圍第7項之基板處理裝置，其中， 具備在上述載置部上方對向於該載置部而設置的第二區劃 壁、及設於該第二區劃壁的第二開口、及進行該第二開口 的開閉之第二開閉裝置。 9. 如申請專利範圍第8項之基板處理裝置，其中， 上述第二開閉裝置的上面，係於閉塞上述第二開口時形成 可載置上述收納容器。 10. 如申請專利範圍第7項之基板處理裝置，其中， 具備進行上述開口的開閉之第二開閉裝置》 11. 如申請專利範圍第1項之基板處理裝置，其中， 具備： 預備室，其係設置有在上述開閉裝置卸下上述收納容 器的上述蓋體時，在上述收納容器與基板保持具之間搬送 上述基板的基板搬送裝置； 處理室，其係鄰接於該預備室而設置，處理被保持於 上述基板保持具的上述基板；及 保管室，其係鄰接於上述預備室而設置，設置有上述 保管架及上述搬送裝置》 12. —種基板處理裝置，其特徵係具備： 收納容器，其係收納複數的基板，基板出入口會藉由 蓋體來阻塞； 搬入搬出部，其係於框體内與外之間進行該收納容器 的搬入搬出： 載置部’其係於該搬入搬出部載置上述收納容器； -4- 1379373 崎修正替換a 開閉裝置’其係進行載置於該載置 的上述基板出入口的開閉； 開閉室’其係包圍上述開閉裝置； 昇降機構，其係於上述開閉裝置之 器的高度位置、與上述載置部所載置的 少一部份形成比上述開閉室的上端更高 進行上述載置部的昇降。 1 3 ·如申請專利範圍第1 2項之基 ，具備覆蓋上述載置部的下部之罩蓋， 昇降機構的作動來進行昇降。 14.如申請專利範圍第13項之基 ，上述罩蓋係配置於上述載置部的前側 1 5 .如申請專利範圍第1 3項之基 ，上述罩蓋係除了有上述開閉裝置的側 部之上述收納容器 可開閉 上述收 的高度 板處理 該罩蓋 上述收納容 納容器的至 位置之間， 裝置，其中 係按照上述 板處理裝置，其中 板處理 以外， 裝置，其中 設於三側面 16. —種半導體裝置的製造方法，係使用申請專利範 圍第12項的基板處理裝置之半導體裝置的製造方法，其 特徵係具有： 將上述收納容器搬入上述搬入搬出部，在上述載置部 載置上述收納容器之步驟； 在上述蓋體卸下安裝時之上述載置部的高度位置、與 上述載置部所載置的上述收納容器的至少一部份形成比上 述開閉室上端更高的高度位置之間，上述昇降機構會使上 述載置部上昇或下降之步驟：及 1379373 W年巧;吒修正替換頁 在處理室内處理上述基板之步驟。 -6 -8. The substrate processing apparatus according to claim 7, further comprising: a second partition wall provided to the mounting portion above the mounting portion; and a second opening provided in the second partition wall And a second opening and closing device that opens and closes the second opening. 9. The substrate processing apparatus according to claim 8, wherein the upper surface of the second opening and closing device is configured to mount the storage container when the second opening is closed. 10. The substrate processing apparatus according to claim 7, wherein the substrate processing apparatus of the first aspect of the invention is provided with a substrate processing apparatus according to the first aspect of the invention, wherein: Provided is a substrate transfer device that transports the substrate between the storage container and the substrate holder when the cover device is detached from the storage container; and the processing chamber is disposed adjacent to the preparation chamber, and is disposed. The substrate held by the substrate holder; and a storage chamber provided adjacent to the preliminary chamber, and the storage rack and the transfer device are provided. 12. The substrate processing apparatus includes: a storage container The substrate is stored in a plurality of substrates, and the substrate entrance and exit are blocked by the lid. The loading and unloading portion carries the storage container in and out of the casing and the outside: the loading portion is attached to the loading and unloading The storage container is placed on the part; -4- 1379373 Saki correction replacement a opening and closing device 'the substrate is placed on the substrate Opening and closing of the entrance and exit; the opening and closing chamber is configured to surround the opening and closing device; and the lifting mechanism is formed at a height position of the opening and closing device and a portion of the mounting portion is formed to be more than an upper end of the opening and closing chamber The lifting and lowering of the mounting portion is performed at a high level. 1 3 . The base of the first part of the patent application is provided with a cover covering the lower portion of the mounting portion, and the lifting mechanism is actuated to move up and down. 14. The cover according to claim 13 wherein the cover is disposed on the front side of the mounting portion 15. The cover is in addition to the side of the opening and closing device. The storage container is configured to open and close the height plate for processing the cover to the position of the storage container, wherein the device is in accordance with the above-mentioned plate processing device, wherein the device is disposed on the three sides 16. A method of manufacturing a semiconductor device according to the invention of claim 12, wherein the storage container is carried into the loading/unloading unit, and the storage unit is placed on the mounting unit. a step of arranging the cover body at a height position of the mounting portion and at least a portion of the storage container placed on the mounting portion at a height position higher than an upper end of the opening and closing chamber Between the above-mentioned lifting mechanism, the step of raising or lowering the above-mentioned placing portion: and 1937373 W, the 替换 correction replacement page is Substrate processing step of processing said chamber. -6 -
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