1378581 六、發明說明： 【發明所屬之技術領域】 本發明係一種發光二極體（LED)散熱基板的製作方 法，尤其是一種能夠於導熱鋁基板上以網板印刷的方式將 絕緣膠僅設置於非封裝區域的發光二極體散熱基板，而令 LED與導熱鋁基板之間並無絕緣膠的阻隔，而使LED能夠 迅速地將熱移除。 【先前技術】 隨著發光二極體（LED)產業的發展，為了因應市場需 求’在一封裝體中，LED的數量已經大幅提升，且led的 發光功率也逐漸在改善，然而，這樣的改變所帶來的卻是 熱量的累積。當熱量無法有效地從LED封裝體中散逸，所 以L E D晶粒溫度過高，則勢必會導致「光衰」現象，即光 在傳輸中的訊號減弱’因此造成LED使用壽命的減損。 因此，在LED封裝體中，位於|_ED晶圓底部皆會結 合有一散熱基板，並藉此結合至—散熱模組，使得LED發 出的熱能夠經由散熱基板而傳遞至散熱模組，避免熱量累 積於LED封裝體中。 既有的散熱基板係在一導熱基板本體上全面塗佈絕緣 膠’再將一銅箔層與該導熱基板本體壓合，而在壓合的過 程中’絕緣膠受壓後會使得銅箔層與導熱基板本體之間形 成一絕緣膠層，因此當LED要放置在製作完成的散熱基板 上時’該LED並非直接與導熱基板本體接觸，而是其之間 勢必會至少有一絕緣膠層的存在，因此阻礙了 LED將熱傳 遞至導熱基板本體的途徑，使得散熱基板無法達到良好的 1378581 散熱功效。 再者，當該導熱基板本體係由鋁所製成時，由於鋁很 容易氧化，所以表面通常會形成一氧化鋁層，即使在焊接 之前除去該氧化鋁層’但焊接時產生的高溫仍然會使得鋁 表面迅速形成氧化鋁層，因此鋁基板無法以焊接的方式與 散熱模組結合。所以既有的散熱基板，可參考本國專利證 書第194556號之發明專利案以及本國專利公告第丨228947 號之發明專利案等，皆係於其底部塗佈錫膏，藉由錫膏使 得銘基板與散熱模組得以接合。然而，錫膏内部仍然含有 树脂絕緣膠等成分，因此導熱的效果仍然不如直接焊接金 屬錫來的理想。所以既有散熱基板由於不能直接焊錫，因 此導致散熱基板無法有效發揮散熱的效果，故led的使用 壽命仍然無法增加。 而既有欲將鋁與錫焊接的方法通常有兩種，其中一種 是將鋁的焊接面以砂紙磨光，再以烙鐵沾有焊錫，於焊接 面上用力摩擦，以磨去氧化層，使得錫附著於焊接面上， 之後移除鐵，即可進行焊接；然而此種的焊接方式並不能 確保紹表面元王無氧化層的存在，所以紹和錫之間無法完 全接合’而有脫落的可能。 另外一種方式是在鋁的焊接面上施以硝酸汞溶液，而 形成鋁汞合金，因此錫可焊接在鋁汞合金上，但焊接強度 並不向’尚須經由額外的加工，而且汞的導熱係數並不高， 因此無法適用於散熱基板的製作。 【發明内容】 本發明人有鑒於既有散熱基板在LED和導熱基板本體 1378581 之間尚有絕緣膠的存在，使得熱量無法迅速地由led傳遞 - 至散熱基板，因此仍會造成LED的損耗，而減低使用壽命， 因此本發明人藉由其豐富的知識背景以及多年的研究之 後’發明出此發光二極體（LED)散熱基板及其製作方法。 - 本發明之目的在於提供一種讓LED能夠直接設置於金 屬導熱基板上，而使LED能夠迅速地將熱移除的發光二極 體散熱基板。 為達上述目的，本發明發光二極體（LED)散熱基板的 • 製作方法，其係包括： 提供一導熱鋁基板； 在该導熱铭基板的表面進行防腐餘處理； 於該導熱鋁基板依照預先決定的線路封裝區域圖案以 網印方式施以絕緣膠，使得封裝區域無絕緣膠存在； 再將銅猪於1 50〜200°c的溫度下進行壓合，使得銅箔 與絕緣膠接合’而使銅荡和導熱鋁基板之間於封裝區域處 形成空隙； ® 依照該預先決定的線路圖案在該銅箔上將未與絕緣膠 接合的部分银刻且移除，以形成線路與電鍍導線，並露出 °玄導熱紹基板的頂面’而形成一待處理基板； 將該待處理基板經過電鍍前處理後，沉浸於一化學鎳 鍍液中，以無電解電鍍的方式在該待處理基板暴露於外的 金屬表面形成一化學鎳層，而獲得一無電解電鍍基板； 再於該無電解電鍍基板頂面之化學鎳層上形成金屬 層，該金屬層至少包括一層以噴錫而形成的錫層或以電鍍 而形成的金層或銀層； 1378581 去除電鍍導線後施加防焊油墨於需要防焊之金屬層表 面，即獲得該發光二極體（LED)散熱基板。 較佳的是，該防腐蝕處理係以鉻酸鹽（c「3+)皮膜戈氟 化鹽皮膜進行皮膜處理，以形成一皮膜層。較佳的是\嗦 皮膜層的厚度為0.1〜1微来（"m)。 較佳的S於該導熱銘基板頂面所施缘勝為環 氧酚醛樹脂（phenyl novo丨ac ep〇xy)。該環氧酚醛樹脂屬於 低膨脹係數的絕緣膠，其厚度約為4〇〜6〇微米^阳卜 、 較佳的是，該銅结係在150〜2〇〇〇c的溫度下進行壓合 約30〜50分鐘。 更佳的是，進行無電解電鍍時，係將該待處理基板先 以鋅置換處理後，再沉浸於一化學鎳鍍液中，使得該導熱 土板於暴露出來的表面形成一化學鎳層；同時以觸鑛的 方式使4 n線路與電鍵導線表面形成—化學錄層。 車乂佳的尺，該金屬層尚包括在形成錫層、金層或銀層 J在該化學鎳層上電鍍一銅層。該金屬層尚包括在形成 層、if , 承銀層之前’並於電鍍該銅層之後在該銅層上 ^ 鎳層，再使該錫層、金層或銀層形成於該鎳層上。1378581 VI. Description of the Invention: [Technical Field] The present invention relates to a method for fabricating a light-emitting diode (LED) heat-dissipating substrate, and more particularly to an insulating rubber capable of being screen-printed on a thermally conductive aluminum substrate. The light-emitting diode of the non-packaged area dissipates the substrate, so that there is no barrier between the LED and the thermally conductive aluminum substrate, so that the LED can quickly remove heat. [Prior Art] With the development of the LED industry, in order to meet market demand, the number of LEDs has been greatly improved in a package, and the luminous power of LED is gradually improving. However, such a change What is brought is the accumulation of heat. When the heat cannot be effectively dissipated from the LED package, the L E D grain temperature is too high, which will inevitably lead to the "light decay" phenomenon, that is, the signal of the light is weakened during transmission, thus causing the LED service life to be degraded. Therefore, in the LED package, a heat dissipation substrate is coupled to the bottom of the |_ED wafer, and is coupled to the heat dissipation module, so that the heat generated by the LED can be transmitted to the heat dissipation module via the heat dissipation substrate to avoid heat accumulation. In the LED package. The existing heat dissipating substrate is integrally coated with an insulating rubber on a heat conducting substrate body and then a copper foil layer is pressed against the heat conducting substrate body, and during the pressing process, the insulating rubber is pressed to make the copper foil layer Forming an insulating layer between the body of the heat-conducting substrate, so when the LED is to be placed on the finished heat-dissipating substrate, the LED is not directly in contact with the body of the heat-conducting substrate, but there is bound to be at least one layer of insulating layer between them. Therefore, the way in which the LED transfers heat to the heat-conducting substrate body is hindered, so that the heat-dissipating substrate cannot achieve a good heat dissipation effect of 1378581. Furthermore, when the thermally conductive substrate is made of aluminum, since aluminum is easily oxidized, an aluminum oxide layer is usually formed on the surface, and the aluminum oxide layer is removed even before soldering, but the high temperature generated during soldering still occurs. The aluminum surface is rapidly formed into an aluminum oxide layer, so the aluminum substrate cannot be bonded to the heat dissipation module by soldering. Therefore, the existing heat-dissipating substrate can be referred to the invention patent case of the National Patent Certificate No. 194556 and the invention patent case of the National Patent Publication No. 228947, etc., all of which are coated with a solder paste at the bottom thereof, and the solder substrate is made of a solder paste. Engaged with the thermal module. However, the inside of the solder paste still contains components such as resin insulating glue, so the heat conduction effect is still not as good as that of direct soldering of metal tin. Therefore, since the heat-dissipating substrate cannot be directly soldered, the heat-dissipating substrate cannot effectively exert the heat-dissipating effect, so the life of the LED cannot be increased. There are two methods for soldering aluminum and tin. One of them is to polish the welded surface of aluminum with sandpaper, then solder with soldering iron, and rub it on the welding surface to remove the oxide layer. The tin adheres to the welding surface, and then the iron is removed, and the welding can be performed; however, the welding method does not ensure the existence of the oxide layer of the surface element, so the joint between the Shao and the tin cannot be completely joined. may. Another way is to apply a solution of mercury nitrate on the welded surface of aluminum to form aluminum amalgam, so tin can be soldered on aluminum amalgam, but the welding strength is not 'additional processing, and the thermal conductivity of mercury The coefficient is not high, so it cannot be applied to the fabrication of a heat-dissipating substrate. SUMMARY OF THE INVENTION The present inventors have in view of the existence of an insulating paste between the LED and the heat-conducting substrate body 137881, so that heat cannot be quickly transferred from the led-to the heat-dissipating substrate, and thus the LED loss is still caused. The inventors have invented the light-emitting diode (LED) heat-dissipating substrate and its manufacturing method by virtue of its rich knowledge background and years of research. - It is an object of the present invention to provide a light-emitting diode heat-dissipating substrate which allows an LED to be directly disposed on a metal heat-conductive substrate to enable the LED to quickly remove heat. In order to achieve the above object, the method for fabricating a light-emitting diode (LED) heat-dissipating substrate of the present invention comprises: providing a heat-conducting aluminum substrate; performing an anti-corrosion treatment on a surface of the heat-conducting substrate; The determined pattern of the circuit package area is screen-printed with insulating glue so that there is no insulating glue in the package area; then the copper pig is pressed at a temperature of 150 to 200 ° C to bond the copper foil to the insulating glue. Forming a void between the copper splatter and the thermally conductive aluminum substrate at the package area; ® etching and removing portions of the copper foil that are not bonded to the insulating paste on the copper foil according to the predetermined circuit pattern to form a line and a plating wire, And exposing the top surface of the substrate to form a substrate to be processed; after the substrate to be processed is subjected to pre-plating treatment, immersed in an electroless nickel plating solution, and exposed to the substrate to be processed by electroless plating Forming a chemical nickel layer on the outer metal surface to obtain an electroless plated substrate; forming a metal layer on the chemical nickel layer on the top surface of the electroless plated substrate, the metal Included at least one layer of tin formed by spraying tin or a layer of gold or silver formed by electroplating; 1378581 After removing the plated wire, applying a solder resist ink to the surface of the metal layer requiring soldering prevention, that is, obtaining the light emitting diode (LED) ) heat sink substrate. Preferably, the anti-corrosion treatment is performed by a chromate (c"3+) film fluorofluoride film to form a film layer. Preferably, the thickness of the film layer is 0.1 to 1 Micro-("m). The preferred S is applied to the top surface of the thermal conductive substrate as epoxy novolac resin (phenyl novo丨ac ep〇xy). The epoxy phenolic resin belongs to the low expansion coefficient of insulating rubber. The thickness of the copper is about 4 〇 6 6 μm ^ 阳, preferably, the copper knot is pressed at a temperature of 150 〜 2 〇〇〇 c for 30 to 50 minutes. More preferably, no In electrolytic plating, the substrate to be treated is first treated with zinc, and then immersed in an electroless nickel plating solution, so that the thermal conductive soil plate forms an electroless nickel layer on the exposed surface; The 4 n line and the surface of the key conductor form a chemical recording layer. The ruthenium of the rut, the metal layer further includes a copper layer formed on the chemical nickel layer by forming a tin layer, a gold layer or a silver layer. Including forming a layer, if, a silver layer, and after plating the copper layer, a nickel layer on the copper layer, The tin layer, gold layer or silver layer is then formed on the nickel layer.
較佳的B K ’施加該防焊油墨係以網板印刷的方式將防 焊油墨網印於 ;§哀錫層、金層或銀層之表面，以露出無施以 絕緣膠之位署 的金屬層以及用於打線之接點的金屬層。The preferred BK 'application of the solder resist ink is to screen the solder resist ink in a screen printing manner; § the surface of the tin layer, the gold layer or the silver layer to expose the metal without the insulating glue The layer and the metal layer used to bond the wires.
本發日月Α BB 向關於一種發光二極體（LED)散熱基板，其係 由上述方法所製成者。The present invention relates to a light-emitting diode (LED) heat-dissipating substrate which is manufactured by the above method.
本發明Y 關於一種發光二極體（led)散熱基板’其係 1378581 一導熱鋁基板，該導熱鋁基板之頂面依照預先決定的 線路封裝區域圖案以網印方式形成絕緣膠層； 複數銅箔層，其係分別壓合於該絕緣膠層的頂部； 複數化學鎳層，其係分別形成在該導熱鋁基板之表面 以及該等銅馆層非與絕緣膠層接觸之表面；以及 複數金屬層，其係形成在該導熱鋁基板之頂部的化學 鎳層之表面，各金屬層至少包括一層錫層、金層或銀層； 以及 一防焊油墨層，其係設置於該金屬層需要防焊之表 面。 較佳的是，各金屬層尚包括一電鍍銅層，其係設置於 該化學鎳層與該錫層、金層或銀層之間。 更佳的是，各金屬層尚包括一電鍍鎳層，其係設置於 δ玄電鑛銅層與該錫層、金層或銀層之間。 較佳的是，該導熱鋁基板與絕熱膠層之間具有一皮膜 層。更佳的是，該皮膜層係由鉻酸鹽（C「3+)皮膜或氟化鹽 皮膜所組成’該皮膜層的厚度為0.U微米（//m)。。 較佳的是，該絕緣膠層為具有低膨脹係數特性的環氧 酚醛樹脂。 本發明之LED和導熱鋁基板之間僅有化學鎳層和金屬 層，因此沒有非金屬的絕緣膠阻礙，使得LED能夠順利且 迅速地將熱傳遞至導熱鋁基板，而且本發明之導熱鋁基板 底部能夠直接與散熱模組以焊錫的方式焊接，因此散熱效 果極佳，故能避免LED產生光衰，而增加LED的壽命。 【實施方式】 1378581 在此所述的「無電解電鍍」又稱為「化學鍍」，因此 「無電解電鍍鎳」與「化學鎳」之用語可以互換使用。其 係在不通電的情況下，利用氧化還原反應於工件上形成均 勻鍍層的方法。其十無電解電鍍包括置換鍍（如離子交換或 電荷交換沉積）、觸鍍、實質上的化學鍍，此為所屬技術領 域中具有通常知識者所知悉的技術，但目前並無使用於改 善紹基板的焊接特性方面。 在此所述的「電鍍前處理」在一般的情況下係指在電 鍍之前所進行的處理，而於本發明中係在無電解電鍍之前 所進行的處理，而處理方式相同，包括酸洗以移除工件表 面的皮膜、氧化層或鏽層等以增加鍍層附著力、除油以去 除工件表面的油脂以避免鍍層脫落。 請參看第一圖所示，本發明發光二極體（LED)散熱基 板的製作方法，其係包括以下步驟： 土 提供基板步驟（a) ’請附加參看第二a圖所示，其係提 供一導熱鋁基板（10); 防腐蝕處理步驟（b)，請附加參看第二B圖所示，係在 該導熱鋁基板（10)的表面以鉻酸鹽（c「3 + )或氟化鹽進行防腐 蝕處理，即皮膜處理，而在該導熱鋁基板（1〇)的表面形成 厚度約為0_卜1微米（/ym)的皮膜層（20); 網印絕緣膠步驟（〇,請附加參看第二c圖所示，其係 於該導熱铭基板（10)之頂面（12)的皮膜層（2Q)上以網板_ 的方式以預先決定的線路封裝區域圖案施加絕緣膠以形 成複數絕緣膠層（30)，其厚度約為4〇〜6〇微米（//m)，由於 環氧酚醛樹脂（phenyl novo丨ac epoxy)具有耐高溫和膨脹係 1378581 數小的優點，故本發明中較佳的絕緣膠為環氧齡齡樹脂； 壓合步驟（d) ’凊附加參看第一 D圖所示，其係將銅$ (40)在1 50〜200°C的溫度下進行壓合約30〜50分鐘，使得 銅箔（40)與絕緣膠（30)接合，再請附加參看第二E圖所示， • 壓合後，銅箔（40)和導熱紹基板（1 0)之間形成空隙（41 )，即 未塗佈絕緣膠的區域； 線路和電鑛導線姓刻步驟（e)’請附加參看第二ρ圖所 示’其係依照該預先決定的線路圖案在銅箔上蝕刻出線路 • 和電鍍導線（4〇') ’同時將未與絕緣膠層（30)接合的部分也 蝕刻移除，以露出該導熱鋁基板（1〇)的頂面（12)(此時仍覆 蓋有皮膜層（20))，而形成一待處理基板（i〇a); 無電解電鍍步驟（f)，請附加參看第二G圖所示，將該 待處理基板（1〇a)經過電鐘前處理後，去除未被絕緣膠（3〇) 覆蓋之部分的皮膜層（20)，再將其沉浸於一化學鎳鍍液中， 於該待處理基板（1〇a)暴露於外的金屬表面以無電解電鍍的 方式，並同時以觸鍍的方式，將該待處理基板（1〇a)以及線 •路與電鍵導線上形成一厚度約為3〜5微米（//m)的化學錄層 (50)，而獲得一無電解電鍍基板（1〇b); 基板底部貼附耐尚溫膠帶步驟（g)，其係為了避免該導 熱鋁基板（1 0)底部進行後續形成金屬層之處理，故在該導 熱銘基板（10)底部貼附有耐高溫膠帶（51); 電鍍銅層步驟（h) ’請附加參看第二η圖所示，其係於 该無電解電鍍基板（1〇b)頂面（12)之化學鎳層（5〇)上電鍍一 電鍍銅層（60)，該電鍍銅層（6〇)之厚度約為1〇〜15微米 ("m); 1378581 電鍍鎳層步驟⑴，請附加參看第一 _ ，有第一丨圖所示，其係在 遠電鍍銅層（60)上係電鍍鎳， 叩小成—電鍍鎳層（70)，其 厚度約為3~5微米（"m); 喷錫、電鍍金或電鍍銀步驟⑴，請附加參看第二」圖 =不，其係再於該f㈣層⑽）上噴錫或電鑛金或銀而形 成錫層或金層或銀層（8〇)。； 去除錢導線步驟⑻，請附加參看第二^所示且 係以餘刻的方式去除之前在無電解電鑛步驟中所使用的導 線，例如部分移除該化學錦層（5〇)、電鑛銅層（6〇)、電鑛 鎳層（70)以及錫層或金層或銀層（8〇)，之後，將該導熱紹 基板（10)底部的耐高溫膠帶（51)移除； 防焊處理步驟⑴，請附加參看第二L圖所示，其係於 該等金屬層狀結構表面以網板印刷的方式網印防焊油墨， 而形成一防焊油墨層(9〇)，並露出之後要封裝LED的位置 以及之後要用於打線的接點，最後獲得一發光二極體散熱 基板（1 0 c)。 μ附加參看第三及四圖所示’本發明在製作時係一整 片包括複數發光二極體散熱基板（1Gc)的板體，故在製程中 或製程後必須切割該板體至想要的形狀，以形成複數個獨 立的發光二極體散熱基板。The invention relates to a light-emitting diode (LED) heat-dissipating substrate, which is a 1837581 heat-conducting aluminum substrate, and the top surface of the heat-conductive aluminum substrate is screen-printed to form an insulating layer according to a predetermined pattern of the circuit package region; a layer respectively pressed onto the top of the insulating adhesive layer; a plurality of chemical nickel layers respectively formed on a surface of the thermally conductive aluminum substrate and a surface of the copper pavilion layer not in contact with the insulating adhesive layer; and a plurality of metal layers Forming a surface of a chemical nickel layer on top of the thermally conductive aluminum substrate, each metal layer comprising at least one tin layer, a gold layer or a silver layer; and a solder resist ink layer disposed on the metal layer to be solder resisted The surface. Preferably, each of the metal layers further includes an electroplated copper layer disposed between the electroless nickel layer and the tin, gold or silver layer. More preferably, each of the metal layers further includes an electroplated nickel layer disposed between the δXuandian copper layer and the tin layer, the gold layer or the silver layer. Preferably, the thermally conductive aluminum substrate and the insulating layer have a film layer. More preferably, the film layer is composed of a chromate (C"3+) film or a fluoride film. The thickness of the film layer is 0. U micrometer (//m). Preferably, The insulating rubber layer is an epoxy phenolic resin having a low expansion coefficient. The chemical nickel layer and the metal layer are only between the LED and the thermally conductive aluminum substrate of the invention, so that there is no non-metallic insulating rubber hindering, so that the LED can be smoothly and quickly The heat is transferred to the heat-conducting aluminum substrate, and the bottom of the heat-conducting aluminum substrate of the present invention can be directly soldered to the heat-dissipating module, so that the heat-dissipating effect is excellent, thereby avoiding the light decay of the LED and increasing the life of the LED. Embodiments 1378581 The "electroless plating" described herein is also referred to as "electroless plating", so the terms "electroless nickel plating" and "chemical nickel" are used interchangeably. It is a method of forming a uniform plating layer on a workpiece by a redox reaction without being energized. The ten electroless plating includes displacement plating (such as ion exchange or charge exchange deposition), contact plating, and substantial electroless plating, which are known to those skilled in the art, but are not currently used for improvement. The welding characteristics of the substrate. The "pre-plating treatment" as used herein refers to the treatment performed prior to electroplating in the general case, and the treatment performed prior to electroless plating in the present invention, and the treatment is the same, including pickling. Remove the coating, oxide layer or rust layer on the surface of the workpiece to increase the adhesion of the coating and remove the oil to remove the grease on the surface of the workpiece to prevent the coating from falling off. Referring to the first figure, a method for fabricating a light-emitting diode (LED) heat-dissipating substrate according to the present invention includes the following steps: a step of providing a substrate for soil (a) 'please refer to the second figure a, which is provided A thermally conductive aluminum substrate (10); an anti-corrosion treatment step (b), please additionally refer to the second B-picture, on the surface of the thermally conductive aluminum substrate (10) with chromate (c "3 + ) or fluorinated The salt is subjected to an anti-corrosion treatment, that is, a film treatment, and a film layer (20) having a thickness of about 0 _ 1 μm (/ym) is formed on the surface of the thermally conductive aluminum substrate (1 ;); a screen printing insulating rubber step (〇, Please refer to the second c-picture, which is applied on the film layer (2Q) of the top surface (12) of the thermal conductive substrate (10) by means of the stencil_ to apply the insulating glue in a predetermined pattern of the circuit package area. To form a plurality of insulating adhesive layers (30) having a thickness of about 4 〇 6 6 μm (//m), since the phenyl novo 丨 epoxy has the advantages of high temperature resistance and a small number of expanded layers of 1378581, Therefore, the preferred insulating glue in the present invention is an epoxy age-old resin; the pressing step (d) '凊Additional reference to the first D-picture As shown, the copper $ (40) is pressed at a temperature of 150 to 200 ° C for 30 to 50 minutes, so that the copper foil (40) is bonded to the insulating glue (30), and then please refer to the second E. As shown in the figure, • After pressing, a gap (41) is formed between the copper foil (40) and the heat-conducting substrate (10), that is, the area where the insulating rubber is not applied; the circuit and the electric wire are surnamed step (e) 'Please refer to the second ρ diagram for 'the line is etched on the copper foil according to the predetermined circuit pattern. ・ and the plating wire (4〇')' and the portion not bonded to the insulating layer (30). Also etched away to expose the top surface (12) of the thermally conductive aluminum substrate (which is still covered with the film layer (20)) to form a substrate to be processed (i〇a); electroless plating step (f), please additionally refer to the second G diagram, after the substrate to be processed (1〇a) is subjected to an electric clock pretreatment, the film layer (20) of the portion not covered by the insulating glue (3〇) is removed, Then immersing it in an electroless nickel plating solution, the surface of the substrate to be treated (1〇a) exposed to the outer surface is electrolessly plated, and simultaneously plated Forming a chemical recording layer (50) having a thickness of about 3 to 5 micrometers (//m) on the substrate to be processed (1〇a) and the wire and the electric wire, thereby obtaining an electroless plated substrate ( 1〇b); a step (g) of the heat-resistant aluminum substrate (10) is attached to the bottom of the substrate, so that the bottom of the thermally conductive aluminum substrate (10) is subsequently formed on the bottom of the thermally conductive aluminum substrate (10). Attached with high temperature resistant tape (51); Electroplated copper layer step (h) 'Please refer to the second n diagram, which is attached to the chemical nickel layer of the top surface (12) of the electroless plated substrate (1〇b) 5〇) plating an electroplated copper layer (60), the thickness of the electroplated copper layer (6〇) is about 1〇15μm ("m); 1378581 electroplating nickel layer step (1), please refer to the first _, As shown in the first figure, it is electroplated with nickel on the far-plated copper layer (60), and the nickel-plated layer (70) is about 3 to 5 microns thick ("m); , electroplating gold or electroplating silver step (1), please refer to the second figure = no, which is then sprayed with tin or electric gold or silver on the f (four) layer (10) to form a tin layer or a gold layer or a silver layer (8 〇 )Remove the money wire step (8), please refer to the second ^ and add the wire used in the electroless electrolysis step, such as partially removing the chemical layer (5〇), electricity a mineralized copper layer (6〇), an electroplated nickel layer (70), and a tin layer or a gold layer or a silver layer (8〇), after which the high temperature resistant tape (51) at the bottom of the heat conducting substrate (10) is removed; The solder resist processing step (1), please refer to the second L diagram, which is screen printed on the surface of the metal layer structure to screen the solder resist ink to form a solder resist ink layer (9〇). The position of the LED to be packaged and the contact point to be used for the wire bonding are then exposed, and finally a light-emitting diode heat-dissipating substrate (10c) is obtained. μ Additional Referring to the third and fourth figures, the present invention is a whole plate including a plurality of light-emitting diode heat-dissipating substrates (1Gc), so the plate must be cut during or after the process. The shape is formed to form a plurality of independent light-emitting diode heat sink substrates.
由於本發明之導熱銘基板（1〇)可由銘或銅所製成，因 此本發月人針對無電解電鑛步驟⑴依照不同材質的導熱鋁 基板（1 0)提供兩種不同的實施方式，然而於所屬技術領域 中具有通常知識者可能還可利用其他設備或者經過稍微佟 飾後亦可達成目的的無電解電鑛步驟⑴，皆屬於本發明Z 10 1378581 範疇。 當該導熱鋁基板（10)進行無電解電鍍時，可使用一裝 設有整流器的不繡鋼槽，為了防止鎳鍍液鍍在不鏽鋼槽的 槽壁，因此以一正極接在不鏽鋼鍍槽上，負極則接在一個 和不鏽鋼槽絕緣的極棒上，且該極棒設置在鎳鍍液中。之 後將該鋁基板沉浸於該鎳鍍液中，以鋅置換處理後，該鋁 基板上暴露出的鋁金屬部分會形成一化學鎳層；同時以觸 鍍的方式，亦即將鋁基板上暴露出的銅金屬與極棒接觸約 3〜5秒即可在銅金屬表面形成一化學錄層。 第二L圖所示，本發明之發光二極體（LED)散熱基板 (10c)，其係包括： 一導熱銘基板（10)，其頂面（12)以預先決定的線路封 裝區域圖案間隔形成複數由絡酸鹽（Cr3+)皮膜或氣化鹽皮 膜所組成之皮膜層（20)，該皮膜層（2〇)的厚度約為ο; — ] 微米且於該皮膜層上利用網板印刷塗佈有複數絕緣勝層 (30)，該絕緣膠層（30)為環氧酚醛樹脂，且其厚度約為 40~60微米； 複數銅箱（40)層，其係分別壓合於該絕緣膠層（3〇)的 頂面（12); 複數化學鎳層（5 〇 )，其係分別形成在該導熱鋁基板（1 〇) 之表面以及該等銅箔（40)層上； 複數金屬詹’各金屬層包括形成在該導熱紹基板⑽ 頂面之化學鎳層(50)上之一電鍍銅層(6〇)、形成在該等電 鐘銅層（60)於該化學鎳層（5_向之表面的電㈣層 及形成在該電鍍鎳層（70)於該電鍍銅層（6〇)對向之表面的 1378581 錫層、金層或銀層（80); 一防焊油墨層（90)，其係局部塗佈在該金屬層表面以 及在β亥化學錦層（50)於s亥導熱銘基板（1〇)對向之表面。 • 本發明依照客戶所要求的圖案，預先決定要塗佈絕緣 膠的位置，並以網版印刷將絕緣膠塗佈在該導熱鋁基板（1 〇) 上（即在要封裝的區域不施加絕緣膠），故能避免在L E D和 該導熱鋁基板（10)之間仍有絕緣膠的存在，LED和導熱紹 基板（10)之間雖然有一化學鎳層（50)和金屬層，但其亦為 鲁 金屬’因此沒有絕緣膠（含有非金屬的樹脂）的阻礙，所以 LED勢必能夠迅速地將熱傳遞至導熱鋁基板（1 0)，以避免 LED產生光衰，故能增加LED的壽命。 特別的是’由於本發明利用無電解電錄的方式在導熱 紹基板（10)表面形成化學鎳，因此當導熱鋁基板（10)之底 部欲與一散熱模組接合時，能夠直接利用該導熱鋁基板〇) 底部的化學鎳層（50)以焊錫的方式固定在該散熱模組上， 因為化學鎳以及錫焊料皆為金屬，因此散熱效果極佳，所 •以本發明能夠有效率地讓導熱鋁基板（彳〇)上的熱量傳遞至 散熱模組’而避免在導熱鋁基板和散熱模組之間產生一非 金屬界面’而且導熱效率能大於既有導熱基板本體的3〇0/。 ，以上’故能達到快速散逸熱量的目的。 【圖式簡單說明】 第一圖係本發明之流程圖。 第二A至L圖係本發明流程之剖面示意圖，且此流程 圖僅為使所屬技術領域中具有通常知識者能夠了解本發明 之内谷所做的示意圖，故所示之尺寸、厚度等皆非依照實 12 1378581 際比例繪製，故並無意限制本發明的尺寸和厚度。 第三圖係本發明具有複數led散熱基板之板體的立體 圖。 第四圖係本發明單一 LED散熱基板的立體圖。 【主要元件符號說明】 (a) 提供基板步驟 (b) 防腐蝕處理 (c) 網印絕緣膠步驟Since the heat-conducting substrate (1〇) of the present invention can be made of Ming or copper, the present invention provides two different embodiments for the electroless metallurgy step (1) according to different materials of the heat-conducting aluminum substrate (10). However, it is within the scope of the present invention Z 10 1378581 to have an electroless orthopedic step (1) which may be used by a person skilled in the art to make use of other equipment or to achieve the purpose after a slight finish. When the thermally conductive aluminum substrate (10) is subjected to electroless plating, a stainless steel groove provided with a rectifier may be used. In order to prevent the nickel plating solution from being plated on the groove wall of the stainless steel tank, a positive electrode is connected to the stainless steel plating tank. The negative electrode is connected to a rod insulated from the stainless steel tank, and the rod is disposed in the nickel plating solution. Then, the aluminum substrate is immersed in the nickel plating solution, and after the zinc replacement treatment, the exposed aluminum metal portion of the aluminum substrate forms a chemical nickel layer; and at the same time, the aluminum substrate is exposed by touch plating. The copper metal contacts the rod for about 3 to 5 seconds to form a chemical recording layer on the copper metal surface. As shown in the second L diagram, the light emitting diode (LED) heat dissipating substrate (10c) of the present invention comprises: a heat conducting substrate (10) whose top surface (12) is spaced by a predetermined pattern of the circuit package area Forming a plurality of film layers (20) consisting of a complex acid salt (Cr3+) film or a vaporized salt film, the film layer (2〇) having a thickness of about ο; — μm and being screen printed on the film layer Coated with a plurality of insulating layers (30), the insulating layer (30) is an epoxy phenolic resin, and has a thickness of about 40 to 60 microns; a plurality of copper boxes (40) are respectively pressed against the insulation a top surface (12) of the adhesive layer (3); a plurality of chemical nickel layers (5 〇) formed on the surface of the thermally conductive aluminum substrate (1 〇) and the copper foil (40) layer; Each of the metal layers of Zhan's includes an electroplated copper layer (6〇) formed on the chemical nickel layer (50) on the top surface of the thermally conductive substrate (10), and a copper layer (60) formed on the electroless nickel layer (60) 5_ an electric (four) layer to the surface and a 1378581 tin, gold or silver layer formed on the surface of the electroplated nickel layer (70) opposite to the electroplated copper layer (6〇) a solder resist ink layer (90) partially coated on the surface of the metal layer and on the surface opposite to the surface layer of the thermal conductive substrate (1). The pattern required by the customer, predetermine the position where the insulating glue is to be applied, and apply the insulating adhesive on the thermally conductive aluminum substrate (1 〇) by screen printing (ie, no insulating glue is applied in the area to be packaged), It can avoid the existence of insulating glue between the LED and the thermally conductive aluminum substrate (10). Although there is a chemical nickel layer (50) and a metal layer between the LED and the heat conducting substrate (10), it is also a Lu metal. Therefore, there is no obstruction of the insulating glue (containing non-metal resin), so the LED is bound to be able to quickly transfer heat to the thermally conductive aluminum substrate (10) to avoid LED light decay, thereby increasing the life of the LED. In particular, ' Since the present invention forms electroless nickel on the surface of the heat-conducting substrate (10) by means of electroless recording, when the bottom of the thermally conductive aluminum substrate (10) is to be joined to a heat-dissipating module, the thermally conductive aluminum substrate can be directly utilized. The bottom of the chemical nickel layer (50) is soldered It is fixed on the heat dissipating module, because the chemical nickel and the tin solder are all metal, so the heat dissipating effect is excellent, and the invention can efficiently transfer the heat on the heat conducting aluminum substrate to the heat dissipating module. 'Whether to avoid a non-metallic interface between the thermally conductive aluminum substrate and the heat dissipation module' and the thermal conductivity can be greater than the 3〇0/ of the existing thermally conductive substrate body. , above, it can achieve the purpose of quickly dissipating heat. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a flow chart of the present invention. The second A to L drawings are schematic cross-sectional views of the flow of the present invention, and the flowcharts are only schematic diagrams for those skilled in the art to understand the inner valley of the present invention, so that the dimensions, thicknesses, and the like are shown. It is not drawn according to the actual ratio of 12 1378581, and is not intended to limit the size and thickness of the present invention. The third figure is a perspective view of a plate body having a plurality of LED heat dissipation substrates of the present invention. The fourth figure is a perspective view of a single LED heat sink substrate of the present invention. [Main component symbol description] (a) Substrate step (b) Anti-corrosion treatment (c) Screen printing adhesive step
(d) 壓合步驟 (e) 線路和電鍍導線蝕刻步驟 (f) 無電解電鑛步驟 (g) 基板底部貼附耐高溫膠帶步驟 (h) 電鍍銅層步驟 ⑴電鑛錄層步驟 ⑴噴錫、電鍍金或電鍍銀步驟 (k)去除電鑛導線步驟 (丨）防焊處理步驟 (1〇)導熱鋁基板 （10a)待處理基板 (10b)無電解電鍍基板（1〇c)發光二極體散熱基板 (12)頂面 (20)皮膜層 (30)絕緣膠層 （40)銅箔 (4W mi層 （50)化學錄層 (51)耐高溫膠帶 （60)電鍍銅層 (7〇)電鏡鎳'層 （80)錫層或金層或銀層 (90)防焊油墨層 13(d) Press-fit step (e) Line and plating wire etching step (f) Electroless electro-minening step (g) Attaching high-temperature tape to the bottom of the substrate Step (h) Plating copper layer Step (1) Electro-mineral layer step (1) Spray tin , electroplating gold or electroplating silver step (k) removal of electric ore wire step (丨) anti-welding process step (1〇) thermally conductive aluminum substrate (10a) substrate to be processed (10b) electroless plating substrate (1〇c) light emitting diode Body heat sink substrate (12) top surface (20) film layer (30) insulating glue layer (40) copper foil (4W mi layer (50) chemical recording layer (51) high temperature resistant tape (60) electroplated copper layer (7〇) Electron microscopy nickel layer (80) tin layer or gold layer or silver layer (90) solder resist ink layer 13