TWI374200B - Verfahren und vorrichtung zum behandeln von ebenem gut in durchlaufanlagen - Google Patents

Verfahren und vorrichtung zum behandeln von ebenem gut in durchlaufanlagen Download PDF

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TWI374200B
TWI374200B TW093133723A TW93133723A TWI374200B TW I374200 B TWI374200 B TW I374200B TW 093133723 A TW093133723 A TW 093133723A TW 93133723 A TW93133723 A TW 93133723A TW I374200 B TWI374200 B TW I374200B
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Taiwan
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electrolyte
flat
flow
transport
angle
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TW093133723A
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Chinese (zh)
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TW200519236A (en
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Thomas Kosikowski
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Hoellmueller Maschbau H
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • C25D7/0685Spraying of electrolyte
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08Electroplating with moving electrolyte e.g. jet electroplating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • C25D7/0621In horizontal cells
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0085Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0085Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736Methods for applying liquids, e.g. spraying
    • H05K2203/0746Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1509Horizontally held PCB

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Rollers For Roller Conveyors For Transfer (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Description

JU 九、發明說明: 【發明所屬之技術領域】 本發明關於在「通過設備/連續設備XDurehlaufanlage) 將平物水平運送以作處理的方法與裝置。本發明宜用 於將電路板與導體膜(Leiter驗英·⑶nd—r —或㈣) 作濕化學式及電解質式的處理。舉例而言,這些處理,在 電路板技術的場合,係關於表面的清洗與刻姓、將鑽孔屑 (Μ—1)從孔除去,將孔鍵成貫通接點 (chkontaktierung)、將導電層及構造作電解而補強(加粗 加厚)、该導電路(Leiterbahn)、顯影、定影(Strippen)(除去 未感光之光敏漆部分)及刻飯,以及將表面氧化及還原、以 八他耘序電路板與導體膜被「運送滾子」及「接觸滾 子」運送通過該「通過設備」。在此很重要的m 即使在該平坦物的小孔中也要有密集的物質交換作用。這 :係藉著使電解質流過表面而達成。在細小電路板的場 &這些孔的尺寸日益做成越來越小。它們可小到25爪以 尺寸或更小,因而需要用電解質更強力流過,以達到所需 之物質交換。 在運送導體膜時(當其厚度在5〇m/z範圍或更小時具有 向度可撓性)’則難度更高:該表面被電解質流過,會使它 從輸送路徑偏轉出來.如此,表面會在導引元件上磨損, 在最嚴重的情形完全造成運送堵塞的情事,但是導體膜用 電解流過的作業乃是必需者,俾當要在相同的「通過設備」 中生產電路板時,其孔中可作良好的物質交換。 1374200 【先月!]技術】 路板ΐ=ΓΜ1°° 44 2°9Α1提到具有孔與盲孔的電 路板電解質處理的方法,該案也可用於濕化學處理程Γ t平坦物通過喷嘴運送過去。這些喷嘴將喷流方向週=性 地改變。喷嘴距平坦物的表面的距離可彼小,俾能= 用喷流的㈣,喷嘴距平坦物距離要相lmm。這 5mm的距離本身很有問題。-方面,當離所要用濕化學; 式作處理的平坦物距離很小時,(特別是對於導體膜的情扪 會造成失敗的邊緣’另方面,在榷轉時,該管描出一圓形 軌跡’其距平坦物距離各不相同。在該平坦物作電解質處 理時,該可樞轉的喷嘴板係位在該「電解質電池」(它由電 極與平坦物形成)之外。因此電極須作絕緣以避免短路, 特別是當要處理導體膜之時’當導體膜很薄時,則不再能 確保運送安全。特別是如果樞轉方向逆著運送方向延伸 時,則電解質流往往會把平坦物從輸送路徑偏轉掉。由於 喷嘴官成本高,因此也只能沿輸送路徑做少許喷嘴管。 文獻DE 197 17 5 12 C3提到將具有孔的電路板作處理 的方法。具有孔或喷嘴的電解質喷灑管設在電解質電池 外電解質經陽極中的孔流到表面並流入平坦物的孔中。 這種電解質流很容易使導體膜從輸送路徑偏轉出來。因此 該方法只適用於處理電路板。 在文獻DE 197 18 769 A1中提到一種通過設備,可將 平坦物水平運送以作濕化學刻蝕。在運送滚子之間,噴嘴 桿(Diisenstock )交替地設在平坦物的兩側。從噴嘴流出 1374200 的電解質朝向平坦物的各面。由於電解質如此在導體膜的 單側机過,會使該導體膜從輸送路徑偏轉出來。因此這種 方式只能處理電路板。 舉例而言,當把〇.2mm厚的電路板作濕化學方式或電 解方式處理時,物質交換發生在貫通孔中以及在較表側的 盲孔中。文獻DE 195 19 21 1 A1提到的電路板的濕化學處 理的裝置與方法係將平坦物在「通過設備」中在槽液面下 方水平運送者。電解質從垂直於運送方向設置的噴嘴管流 出,匕們會積滯在「運送滾子上」。喷嘴管與運送滾子沿 運送方向交錯地設置的平坦物上側及下側。如此,受到該 沿表面流過的電解質的影響,在喷嘴管的區域在平坦物的 兩側產生不同的靜壓力及動態壓力,如此,依柏努力原理, 電解質會從較大靜壓力的那一側穿過貫通孔朝向較低壓力 的那邊的方向流過去。於低靜壓力所在之處,電解質以較 大速度沿平坦物表面流過,此速度比起該平坦物之對立側 上的流速更高。這點在貫通孔中造成極佳的物質交換。因 此該前案適用於處理電路板,今日,越來越多的具有很小 的貫通孔與盲扎的電路板與多層物(Multilayer)要處理,它 們更需要密集的物質交換。在盲孔的場合,柏努力原理對 物質交換幫不上大忙,因為平坦物的兩面的壓力差發揮不 了作用。因此這種前案對於盲孔的處理近乎無能為力。 【發明内容】 本發明的目的在提供一種方法與裝置,利用它們在一 通過設備中’不論是具有貫通孔及盲孔的電路板,或者具 丄j/πζυυ 有孔的最薄導體膜,部台 暝都月^夠文全的運送,而不需將設備改 裝。:外’該貫穿孔與盲孔要能有密集的物質交換。 ㈣目的U之道係利用中請專利範圍第卜第1〇項 的方法以及申請專利範圍第u〜21項的裝置實現。 ,本發月中,將平坦物運送經過該通過設備的作業, =利用「運送滚子(以及如有必要時,還利用接觸滚子)達 道所要處理的平坦物」係指電路板與極高度可換性的 -膜依本發明,該二種不同種類的平坦物係利用不同 電解質流處理,而不須為此將通過設備改裝。 、導體膜被電解質流所流過,該電解質流斜斜地朝向運 2方向在兩侧流向該平坦物。這些電解質流呈鏡像對稱在 2坦物上側及下側流到其表面,使得由液流所引起的衝力 上、下的作用相反故互相抵消’如此該平坦物停留在運 送表面。藉著選擇電解質流朝運送方向可幫助薄的導體膜 =全地運送。整體上如上即使是很薄的導體膜也能安全地 運送。 ▲較厚的導體膜與電路板,其盲孔大部分也都很細小。 二些盲孔的物質交換可依本發明利用—種電解 =質:喷壤管沿近乎垂直的流動方向流到平坦物表面, - '嘴Μ樣地橫過平坦物的運送方向設備,這些在上側 之角度呈鏡像對稱的電解質流沿著運送方向係與平坦物的 下側上的電解質流稍微錯開而不交會 並不正好會合。如此,在貫通孔中也造=: 父換作用’由於垂直的電解質流(特別是當體積流很 8 ^2〇〇 大及/或流速很大時)該平坦物還是會從輸送路徑偏移開 來,因此只有在生產具有盲孔的較厚導體膜,或電路板之 時 一卽流間(Drossel 才將此電解質流啟動。也可換用 英·· choke)或其他改變電解質流的手段,以配合該平坦物 的需求。纟薄導體膜的場合,實際上不會有盲孔。這種界 限約在10 0以m的厚膚。方舲厘;τ _ 幻厣度在此厚度以下,不須使電解質垂 直流過’或只需小量之體積流垂直通過。 特別是這種近乎垂直流到平坦物上的第二股電解質流 的體積流可以改變,且可利用電解質循環回路中的可調整 的系、節流閥、滯積盤⑻織⑻“)、翻蓋片(KIappe)作 調整以配合平坦物的厚度。 不發明,在貫通 柏努力原理達成,在μ液面下# /工 ' …乐利用 解質嘴壤管,重…逆物附近兩側有電 向運送方… 質從該喷麗管斜斜地 同产速、心 /σ表面流過’在平坦兩側之電解質的不 同Γ小的靜麼力,使電解質流經電路板中的 可纟薄導體膜的場合,這種電解質流的壓力差 平:::平坦物從輸送路徑偏轉出來。因Λ,依本發明, 成::側的局部壓力差局部受限制 :二::在上側與下側交替地垂直於運送方向二 泛地二::::::如此,電解質流所造成之廣 送路徑偏轉開,這種從電解質=2使平坦不會從輪 向對運送平面呈鏡對稱喷向運送方 J电鮮買另外還有助於導體膜 1^/4200 運送如此就連薄的導體膜也可安全確實地留在輸送路徑 中。在平坦物兩側電解質令有局部地上下交替的靜壓差, 因此這種壓力雖在整體卜, 上上下互相抵消’而不會造成偏 但在各局部,因為仍有交替的靜壓差因此柏努力原理 的應用仍適用於此。因此在同樣的通過設備中,隨著要處 的較厚的平坦物(它們要一如導體膜作處理)厚度增加, 則這種優點對於其貫穿孔中的物質交換而言,越具有重大 意義。 本發明在以下利用示意性(但非照比例)的圖式第1 〜第4圖詳細說明。 【實施方式】 第1圖中’所要處理的平坦物⑴被具有軸⑷之受驅動 運送;袞子」(2)沿運送方向⑴運送。連薄的及很薄的平 坦物也越來越多地都要作濕化學及/或電解質方式處理。在 電路板技術中,此導電料厚度d為5Gp或更小。如果 此導體膜的核心部例如由聚酿胺構成,則它會具有特別高 度的可撓性且其表面特別容易受損。這點使得要將它作運 运以通過濕化學式通過設備的作業變得極為困難。導體膜 會受到電解質流衝擊從輸送路徑偏轉出來。並導致運堵滞 不前。依本發明該導體膜的安全運送係利用運送平 中的平坦物(1)的導引杜道# _ 牛導成。這點係利用一樣大的第一電 解質流⑻達成,該第—電解質流⑻在運送平面(⑺的上側 ⑹與下側⑺呈鏡像對稱的方式朝向平坦物的表面。這此電 解質流⑻的方向朝向運送方向⑺。制第—賴質流⑻ 1374200 從兩側以角度α準確設定地斜斜流向平坦物,即使是薄的 導體膜也可在運送平面(17)中導進。此第一電解質流(8)從 電解質噴灑管(10)流出’該電解質喷灑管對運送面上下對 稱成對地設置,且具有電解質開口(9),位於其中成列地設 置。舉例而言,這些開口(9)可為孔或喷嘴。電解質喷灑管 (10)在運送平面(17)兩側垂直於運送方向至少延伸過該平坦 物的整個寬度範圍。電解質作循環,利用泵(圖未示)經過 電解質噴灑管(10)送到充以電解質的工作容器(圖未示)並由 該處送回一系窪池(Pumpensumpf)。 在平坦物兩側受到電解質流(8)引起的二股力量的互向 反向相抵消。這種電解質流以α角度向運送方向流動,有 助於平坦物運送。而該電解質流的流動方向對運送方向成 一角度α在5°〜60。範圍,且宜為15。(相對於平坦物的 表面)。 運送滾子(2)支承在上側(6)的方式,使它能頂逆著作用 力(F)而配合平坦物(U)的厚度,該力量ρ宜由彈簧力或重 量產生。這些力篁也可設計成可調整者。一般,隨著電路 板厚度增加,需要的力量也增加。為了 一目了然起見,第 1圖及第2圖中,運送滾子(2)沿運送方向(3)用大距離表示。 運送滾子(2)與電解質噴灑管(10)也可用其他順序設置》 第2圖中的設置有利於具有盲孔的電路板的處理。此 平坦物再被具有軸(4)之受驅動的運送滾子運送。第二電 解質流(11)由一列的第二組開口(12)從電解質喷灑管(1〇)流 出,並造成密集的物質交換(即使在盲孔中亦然)^開口(12) 11 1374200 穿過内電解質喷灑管(13)與外電解質喷灑管(1〇)的壁。此第 二電解質流(Π)的出口角度召與出口角度α大不同。出口 角度/5在60°〜90。的範圍,且宜為8〇。,當出口角度 β小於90°時,第二電解質流(11)也朝平坦物(u)的運送 方向。此第二電解質流(1 1)可一如第一電解質流,由同 樣的電解質喷灑管(10)供應,這種廉價的實施例適用於處 理具有盲孔的電路板,這些電路板由於較厚,不會被第二 電解質流(11)由輸送路徑偏轉出來。即使第二電解質流 在平坦物(1)上側(6)與下側(7)的位置沿運送方向略錯開, 如第2圖所示,情形亦復如此。這種上下互錯開的方式, 還可使電解質流另外可流動穿過貫通孔,@盲孔中仍一樣 可作物質交換,但對於很敏感易受損的導體膜而言,此第 -電解質流⑴)卻顯得有妨礙。當液流很強時,導體膜的 :达安全性受影響’而當液流弱_,則在相關之通過設備 ^要處理的電路板的盲孔中的物質交換就太差。因此這二 流⑻⑴)宜從二個電解質錢管經由二個可互相 二1=「電解質循環系統」作供應。該二電解質喷 二方向(3)前後相隨設在平坦物兩側。為了縮 短叹備長度或提高在設備中 種「管中管」-槿- 時間,故宜選用一 式 _ 、。匕”需很小的空間以建入設備中,圖 式中的所不之圓形管可視為「管 也可將矩形管互相套合」了 、’。的例子。 出的實施例做為R樣可用銑切、魅合或押 外電解晳!·、。凡牛中的二個電解質循環系統。 卜電解質噴m管⑽與内電解質錢管⑽内的電解質 12 13742〇〇 ^⑻⑴)可互相獨立地作調整。這 速的調整。特別是當導體膜很薄時,,、為體積&及流 5〇 Am。則第二電解質流 $如厚度小於或等於 最薄的導體膜與電路板在同一通=備實方式可使 備改裝。 處理且無需將設 "解質液⑻⑴)所需的密集度係利用控制工程⑲ (匕們作用於圖中未示的電解質泵與閥)調整。 a 在電路板的場合,例如厚度16職或更大者則在通 過時’液流穿過孔的期間(特別是當孔直徑很小時,例如 〇·2_)即使第二電解質流也啟動,仍嫌太少,沿運送方向 看,電解質噴灌管的數目須增加,俾有較長的處理時間以 供孔中作物質交換。為了避免這種設備工程上的額外成 本’故依本發明另—實施例,第—電解質流⑻係設計成使 平坦物中的貫通孔在該設備的較長距離範圍中被電解質流 過,而不必將電解質喷灑管的數目增加,這點達成之道係 利用柏努力定律。由於在平坦物(1)的上側與下側(乃的 電解質壓力不同,故孔被電解質流過。電解質從較大靜壓 力那一側經這些孔流到較小靜壓力那一側◦在這種平坦物 兩側有壓力差的情形,薄的導體膜也會從輸送路徑偏移出 來’其結果會使導體膜在設備中積滞不前,因此依本發明, 在平坦物的上側(6)與下側在相反側調整成交替的位置有壓 力差因此作用到導體膜上的力量的垂直的分量互相抵消。 此外’該平坦物還受其幫助在運送平面中導進。 第 圖顯示局部壓力差的產生方式。電解質喷灑管(它 1374200 側具有内噴灑管或不具有内噴灑管)成對地設在運送平面 (⑺兩側。這些噴麗管内有相隔的開口。在上側(6)的電解 質噴灑管⑽的第-組開口⑺和下側⑺的第一組開口 (9)各 錯開了-段距離,ϋ一段錯開距離為同一側開口互相間隔 距離的一半。如此’在平坦物兩侧沿著平坦物⑴表面產生 :交替的受噴灑的區域’其電解質的速度不同,利用這種 從電解質喷灑官(1〇)的開口(9)迅速流出的電解質,可使得 在平坦物表面在開口(9)附近的區域(14)具有高的動壓力及 小的靜壓力。在開π (9)之間流過較小。因此在處理的區域 具有低的動壓力及高的靜壓力。這些區域垂直於運送方向 交替。由於在平坦物兩側電解質喷灑管(1〇)的開口(9)係交 錯者,因此該交替的壓力區域也係交錯者。因此在平坦物 兩側該第一t解質流⑻的區域中局部的高靜壓和一個對側 的低靜壓抗’造成局部的壓力$ ^這種局部的壓力差在 一較大的運送路徑中造成電解質流從貫穿孔流過,因此造 成時間較長的有效物質交換。這種在各地利用柏努力定律 的做法,可配合第二種電解質流(11)組合使用,它們特別 是在盲孔的場合特別有效。為此,也可使用一内管(13) ^ 平坦物係利用受驅動的運送滾子(2)作運送,該運送滾子(4) 用軸(4)支承住。 第4圖的側視圖顯示使用本發明的一電解質式通過設 備。舉例而言,它係用於將貫穿接點加粗及/或用電解構成 導電路的圓形。在此電解程序,在孔中及盲孔中的物質交 換也決定程序的經濟性。較大的物質交換作用,可使之能JU IX. INSTRUCTION DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a method and apparatus for transporting a level horizontally for processing by "device/continuous equipment XDurehlaufanlage." The present invention is preferably used for a circuit board and a conductor film ( Leiter test (3) nd-r - or (d)) for wet chemical and electrolyte treatment. For example, these treatments, in the case of circuit board technology, are related to the surface cleaning and engraving, drilling debris (Μ 1) Removal from the hole, the hole is made into a through-contact, the conductive layer and the structure are electrolyzed to reinforce (bold thickening), the conductive circuit (Leiterbahn), development, and fixing (Strippen) The lacquer part) and the engraving, as well as the surface oxidation and reduction, are transported through the "passing device" by the "transport roller" and the "contact roller". It is important here that m has a dense substance exchange even in the small holes of the flat. This is achieved by flowing electrolyte through the surface. In the field of small boards, the size of these holes is increasingly getting smaller and smaller. They can be as small as 25 claws or smaller in size and therefore require more electrolyte flow through the electrolyte to achieve the desired exchange of material. It is more difficult to transport the conductor film (when its thickness is in the range of 5 μm/z or less), and the difficulty is higher: the surface is flowed by the electrolyte, which deflects it from the conveying path. The surface will wear on the guiding element, and in the most serious case, the transportation jam will be completely caused, but the operation of the electrolytic flow of the conductor film is necessary, and when the circuit board is produced in the same "passing device" It can be used for good material exchange in its pores. 1374200 [First Month!] Technology] Road board ΐ = ΓΜ 1 ° ° 44 2 ° 9 Α 1 refers to the method of electrolyte treatment of circuit boards with holes and blind holes, the case can also be used for wet chemical treatment process Γ flats are transported through the nozzles . These nozzles change the jet direction circumferentially. The distance between the nozzle and the surface of the flat object may be small, and the energy of the nozzle is (4), and the distance between the nozzle and the flat object is 1 mm. This 5mm distance itself is very problematic. - Aspects, when the distance from the flat chemical to be treated is small, (especially for the case of the conductor film will cause the edge of failure). On the other hand, when the twist is turned, the tube traces a circular trajectory. 'The distance from the flat object is different. When the flat is used for electrolyte treatment, the pivotable nozzle plate is outside the "electrolyte battery" (which is formed by the electrode and the flat). Insulation to avoid short circuits, especially when the conductor film is to be processed. 'When the conductor film is thin, transport safety is no longer guaranteed. Especially if the pivoting direction is extended against the transport direction, the electrolyte flow tends to be flat. The object is deflected from the conveying path. Due to the high cost of the nozzle, only a few nozzle tubes can be made along the conveying path. Document DE 197 17 5 12 C3 mentions a method for processing a circuit board with holes. The electrolyte spray tube is disposed outside the electrolyte battery and flows through the pores in the anode to the surface and into the pores of the flat material. This electrolyte flow easily deflects the conductor film from the transport path. The method is therefore only suitable for the processing of circuit boards. It is mentioned in the document DE 197 18 769 A1 that a flat material can be transported horizontally for wet chemical etching by means of a device. Between the transport rollers, the nozzle rods (Diisenstock) are alternated. It is located on both sides of the flat object. The electrolyte flowing out of the nozzle 1374200 faces each side of the flat object. Since the electrolyte passes through the single side of the conductor film, the conductor film is deflected from the conveying path. It is possible to handle circuit boards. For example, when a 2 mm thick circuit board is treated wet or chemically, material exchange takes place in the through-holes and in the blind holes on the opposite side. Document DE 195 19 21 1 The apparatus and method for wet chemical treatment of the circuit board mentioned in A1 is to transport the flat material horizontally below the liquid level in the "passing device". The electrolyte flows out from the nozzle tube which is arranged perpendicular to the conveying direction, and we will accumulate On the "transport roller", the nozzle tube and the upper and lower sides of the flat material which are alternately arranged in the transport direction by the transport roller. Thus, the influence of the electrolyte flowing along the surface is affected. In the area of the nozzle tube, different static pressure and dynamic pressure are generated on both sides of the flat object. Thus, according to the principle of the Ebony, the electrolyte will pass through the through hole from the side of the larger static pressure toward the lower pressure side. The direction flows past. At low static pressure, the electrolyte flows along the surface of the flat surface at a higher speed, which is higher than the flow velocity on the opposite side of the flat. This is excellent in the through hole. The material exchange is therefore applicable to the processing of circuit boards. Today, more and more circuit boards and multilayers with small through-holes and blinds are processed, which require dense material exchange. In the case of blind holes, the principle of the cypress effort does not help the material exchange, because the pressure difference between the two sides of the flat can not play a role. Therefore, this kind of predecessor is almost powerless for the treatment of blind holes. SUMMARY OF THE INVENTION It is an object of the present invention to provide a method and apparatus for utilizing a device board, whether it has a through-hole and a blind via, or a thinnest conductor film having a hole of 丄j/πζυυ. Taiwan and Taiwan are fully transported without the need to modify the equipment. : Outer The through hole and the blind hole should have a dense substance exchange. (4) The purpose of U is to use the method of the patent scope of the first paragraph and the equipment of the scope of patent application No. u~21. In the middle of the month, the flat goods are transported through the passing equipment. = "Using the transport roller (and, if necessary, the contact roller) to reach the flat object to be processed" means the circuit board and the pole. Highly replaceable - Membrane According to the invention, the two different kinds of flats are treated with different electrolyte streams without having to be modified by means of equipment. The conductor film flows through the electrolyte flow, and the electrolyte flow obliquely flows toward the flat object on both sides in the direction of the transport. These electrolyte flows are mirror symmetrical to the upper and lower sides of the 2nd body, so that the upper and lower forces caused by the flow are opposite to each other and cancel each other'. Thus the flat remains on the transport surface. By selecting the electrolyte flow toward the transport direction, a thin conductor film can be assisted = all-round transport. As a whole, even a very thin conductor film can be safely transported. ▲ Thicker conductor film and circuit board, most of the blind holes are also very small. The material exchange of two blind holes can be utilized according to the invention - electrolysis = quality: the spray pipe flows to the surface of the flat object in a nearly vertical flow direction, - 'the mouth is traversing the transport direction of the flat object, these are The angle of the upper side of the mirror symmetrical electrolyte flow is slightly staggered along the direction of transport along the electrolyte flow on the underside of the flat, but does not coincide. In this way, it is also made in the through-hole:: parental action 'The flattened material will still be offset from the conveying path due to the vertical electrolyte flow (especially when the volume flow is very large and the flow rate is large) Therefore, it is only possible to produce a thick conductor film with blind holes, or a turbulent flow between the boards (Drossel starts this electrolyte flow. It can also be replaced with English choke) or other means of changing the electrolyte flow. To match the needs of the flat. In the case of a thin conductor film, there is actually no blind hole. This limit is about 10 to m thick.舲 舲 厣 厣 厣 在 ; ; ; ; τ τ 厣 厣 厣 厣 厣 厣 厣 厣 厣 厣 厣 厣 厣 厣 厣 厣 厣 厣 厣 厣 厣 厣 厣In particular, the volumetric flow of the second electrolyte stream flowing substantially perpendicularly to the flat material can be varied, and the adjustable system in the electrolyte circuit, the throttle valve, the stagnation disc (8) woven (8) "), the flip cover can be utilized. The sheet (KIappe) is adjusted to match the thickness of the flat object. It is not invented, and the principle of the cypress is achieved. Under the μ liquid surface, the machine is used to solve the problem. To the transport side... from the spray tube obliquely with the speed of production, the heart / σ surface through the 'different static force of the electrolyte on both sides of the flat, so that the electrolyte flows through the circuit board can be thin In the case of a conductor film, the pressure difference of the electrolyte flow is flat::: the flat object is deflected from the conveying path. Because of this, according to the invention, the local pressure difference on the side of the :: is locally limited: two: on the upper side and the lower side The sides are alternately perpendicular to the direction of the transport. Two:::::: Thus, the wide-feed path caused by the electrolyte flow is deflected. This kind of electrolyte = 2 makes the flat mirror-symmetrical spray from the wheel to the transport plane. Buying a new supply to the carrier J also contributes to the conductor film 1^/4200 The thin conductor film can be safely and reliably left in the transport path. The electrolyte on both sides of the flat material has a static pressure difference that alternates locally and locally, so that the pressure cancels each other up and down. It does not cause partial but partial, because there are still alternating static pressure differences, so the application of the principle of the cypress effort still applies to this. Therefore, in the same passing equipment, along with the thicker flats (they must As the thickness of the conductor film is increased, this advantage is of greater significance for the exchange of substances in the through-holes. The present invention utilizes the schematic (but not proportional) patterns 1 to 1 below. 4. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [Embodiment] In Fig. 1, the flat object (1) to be processed is transported by the shaft (4); the rafter (2) is transported in the transport direction (1). Thinner and thinner flats are increasingly being treated as wet chemical and/or electrolyte. In circuit board technology, this conductive material has a thickness d of 5 Gp or less. If the core portion of the conductor film is composed, for example, of polyamine, it will have a particularly high degree of flexibility and its surface is particularly susceptible to damage. This makes it extremely difficult to transport it to pass the wet chemical through the equipment. The conductor film is deflected from the transport path by the impact of the electrolyte flow. And caused the traffic to stagnate. According to the invention, the safe transport of the conductor film is guided by a guide channel that transports the flattened flat (1). This is achieved by using the same large first electrolyte stream (8) which faces the surface of the flat object in a mirror symmetrical manner on the transport plane (the upper side (6) and the lower side (7) of the transport plane. The direction of the electrolyte flow (8) Towards the transport direction (7). The first-to-the-half flow (8) 1374200 is obliquely directed to the flat object at an angle α from both sides, and even a thin conductor film can be guided in the transport plane (17). The flow (8) flows out of the electrolyte spray pipe (10). The electrolyte spray pipe is disposed symmetrically in pairs on the conveying surface, and has electrolyte openings (9) disposed therein in a row. For example, the openings ( 9) may be a hole or a nozzle. The electrolyte spray pipe (10) extends at least across the entire width of the flat on the sides of the transport plane (17) perpendicular to the transport direction. The electrolyte is circulated and is pumped (not shown). The electrolyte spray pipe (10) is sent to a working container filled with electrolyte (not shown) and returned to the pumpingumpf by the place. The two forces caused by the electrolyte flow (8) on both sides of the flat object are mutually The reverse phase cancels. This electrolyte flow flows in the transport direction at an angle α, which facilitates the transport of the flat material, and the flow direction of the electrolyte flow is at an angle α to the transport direction in the range of 5° to 60°, and is preferably 15. (relative to the surface of the flat). The transport roller (2) is supported on the upper side (6) so that it can reverse the force (F) and match the thickness of the flat (U). Force or weight is generated. These forces can also be designed to be adjustable. Generally, as the thickness of the board increases, the required power increases. For the sake of clarity, in Figures 1 and 2, the transport roller (2) ) is indicated by a large distance along the transport direction (3). The transport roller (2) and the electrolyte spray pipe (10) can also be arranged in other orders. The arrangement in Figure 2 facilitates the handling of circuit boards with blind holes. The object is then transported by a driven roller having a shaft (4). The second electrolyte stream (11) flows out of the electrolyte spray tube (1) from a second set of openings (12) and creates a dense substance. Exchange (even in blind holes) ^ Opening (12) 11 1374200 passes through the wall of the inner electrolyte spray pipe (13) and the outer electrolyte spray pipe (1〇). The exit angle of this second electrolyte flow (Π) is different from the outlet angle α. The exit angle /5 is 60. The range of ° to 90. is preferably 8 〇. When the outlet angle β is less than 90°, the second electrolyte flow (11) is also directed toward the flat material (u). This second electrolyte flow (1 1) Like the first electrolyte stream, supplied by the same electrolyte spray tube (10), this inexpensive embodiment is suitable for processing circuit boards with blind holes that are not thicker and will not be flowed by the second electrolyte. (11) Deflected by the conveying path. Even if the second electrolyte flow is slightly shifted in the conveying direction at the upper side (6) and the lower side (7) of the flat object (1), as shown in Fig. 2, the same is true. This way of staggering up and down, the electrolyte flow can also flow through the through hole, and the same can be used for material exchange in the blind hole, but for the very sensitive and vulnerable conductor film, the first electrolyte flow (1)) but it seems to be a hindrance. When the flow is strong, the safety of the conductor film is affected, and when the flow is weak, the material exchange in the blind hole of the relevant board to be processed by the device is too poor. Therefore, the second stream (8) (1) should be supplied from two electrolyte tubes via two mutually interchangeable ones. The two electrolyte spray directions (3) are provided on both sides of the flat object. In order to shorten the length of the sigh or to increase the "tube-in-tube"-槿-time in the equipment, it is advisable to use the formula _, . “匕” requires a small amount of space to be built into the equipment. The circular tube in the drawing can be regarded as “the tube can also fit the rectangular tubes together”. example of. The example shown as R can be milled, charmed or baked out! ·,. Two electrolyte circulation systems in cattle. The electrolyte spray tube (10) and the electrolyte 12 13742 〇〇 ^ (8) (1) in the inner electrolyte tube (10) can be adjusted independently of each other. This speed adjustment. Especially when the conductor film is very thin, it is volume & and flow 5 〇 Am. Then, the second electrolyte flow can be modified if the thickness of the thinner conductor film is the same as that of the circuit board. The concentration required for processing and without the "solution solution (8)(1)) is adjusted using control engineering 19 (we act on electrolyte pumps and valves not shown). a In the case of a circuit board, for example, a thickness of 16 or more is passed during the passage of the liquid flow (especially when the hole diameter is small, for example, 〇·2_) even if the second electrolyte flow is started, Too little, in the direction of transport, the number of electrolyte sprinkler pipes must be increased, and there is a longer processing time for material exchange in the holes. In order to avoid the extra cost of such equipment engineering, in accordance with another embodiment of the invention, the first electrolyte stream (8) is designed such that the through holes in the flat are flowed through the electrolyte over a longer distance of the apparatus. It is not necessary to increase the number of electrolyte spray tubes, which is achieved by using the law of cypress effort. Since the electrolyte pressure is different between the upper side and the lower side of the flat object (1), the pores are flowed by the electrolyte. The electrolyte flows from the side of the larger static pressure through the pores to the side of the smaller static pressure. In the case of a pressure difference on both sides of the flat object, the thin conductor film is also offset from the transport path. As a result, the conductor film is stagnant in the device, so according to the present invention, on the upper side of the flat object (6) The vertical component with the lower side adjusted to the opposite side on the opposite side has a pressure difference so that the vertical component of the force acting on the conductor film cancels each other. Furthermore, the flat is also guided by the help in the transport plane. The way the pressure difference is generated. The electrolyte spray tube (which has an inner spray tube on the 1374200 side or no inner spray tube) is placed in pairs on the transport plane ((7). These spray tubes have spaced openings. On the upper side (6 The first set of openings (7) of the electrolyte spray tube (10) and the first set of openings (9) of the lower side (7) are each shifted by a segment distance, and a staggered distance is half the distance between the same side openings. Thus Both sides The surface of the flat object (1) is generated: the alternately sprayed area 'the speed of the electrolyte is different, and the electrolyte which rapidly flows out from the opening (9) of the electrolyte sprayer can make the surface of the flat object open ( 9) The nearby area (14) has a high dynamic pressure and a small static pressure. The flow between the openings π (9) is small. Therefore, the treated area has low dynamic pressure and high static pressure. Alternating perpendicular to the direction of transport. Since the openings (9) of the electrolyte spray tubes (1) on both sides of the flat are interlaced, the alternating pressure regions are also interlaced. Therefore, the first t on both sides of the flat The local high static pressure in the region of the thawing stream (8) and the low static pressure resistance of the opposite side cause local pressures. This local pressure difference causes electrolyte flow to flow through the through holes in a larger transport path. Therefore, it results in a long-term exchange of effective substances. This method of using the principle of cypress efforts in various places can be combined with the second electrolyte flow (11), which is particularly effective in the case of blind holes. Can use one Tube (13) ^ The flat object is transported by the driven transport roller (2), which is supported by the shaft (4). The side view of Fig. 4 shows the use of an electrolyte type of the present invention. By means of the device, for example, it is used to round the joints and/or to form a circular shape of the conducting circuit by electrolysis. In this electrolysis procedure, the exchange of substances in the holes and in the blind holes also determines the economics of the program. Larger material exchange, which can make it

Claims (1)

!374200 101年〇3月/f日修正替換頁 十、申請專利範圍: 1 一 t在濕化學式及/或電解式通過設傷中在電解質中 將平坦物作運送與處理的方法,㈣以㈣㈣中 該平坦物宜為導體膜及電路板,其特徵在: 該平坦物在運送平面中通過電解質流(8),該電解質流 係呈鏡像對稱方式從電解f噴流#!374200 101 〇 March/f-day correction replacement page X. Patent application scope: 1 A method for transporting and processing flat objects in electrolytes in wet chemical and/or electrolytic type through injury, (4) to (4) (4) The flat material is preferably a conductor film and a circuit board, characterized in that: the flat object passes through a electrolyte flow (8) in a transport plane, and the electrolyte flow system is sprayed from the electrolysis f in a mirror symmetrical manner. 口(θ9)流到平坦物的上側及下側,且其作_該平坦物上: 力篁上、下近乎相抵消,其中電解質的流出方向的朝向可 幫助將平坦物沿運送方向行進者,該電解質流(8)從具有個 別開口(9)的成對設置的電解質喷灑管流出,該開口在平坦 物上下側互相錯帛,故在該i、下側的表面交替地產生互 相反向的局部區域’它們交替地有小的電解質的靜壓力及 大的靜壓,該小與大的靜壓造成在平坦物的貫通孔被電解 質流過,且同時與電解質流相關的力量在平坦物上下側互 相抵/肖如此即使薄導體膜也可在輸送路徑上安全地運送。 2.如申請專利範圍第1項之方法,其中:The mouth (θ9) flows to the upper side and the lower side of the flat object, and it acts on the flat object: the upper and lower sides of the force are nearly offset, wherein the direction of the outflow direction of the electrolyte can help the flat object to travel in the conveying direction, The electrolyte stream (8) flows out from a pair of electrolyte spray tubes having individual openings (9) which are offset from each other on the upper and lower sides of the flat object, so that the surfaces on the i and the lower side alternately reverse each other. The localized areas 'they alternately have a small static pressure of the electrolyte and a large static pressure, which causes the through holes in the flat to flow through the electrolyte, and at the same time the force associated with the electrolyte flow is in the flat The upper and lower sides are mutually abutting/shallow so that even a thin conductor film can be safely transported on the transport path. 2. The method of claim 1, wherein: 該兩側的電解質喷灑管(10)設有至少各另—列開口 (1 2)’電解盧由s亥開口向平坦物的方向以一角度召流出,此 角度石與該第一列開口(9)的角度α不同,且此電解流(丨i) 與第一列的第一種電解質(8)互不相干地在流出的電解 質量與流速方面作改變,且可配合平坦物的需求。 3.如申請專利範圍第2項之方法,其中: 該第一及第二電解質流的體積流與流速可互相獨立地 將其密集度作調整並配合平坦物的需求。 1374200 101年03月/>日修正替換頁 4·如申凊專利範圍第1或第2項之方法,其中: …該在平坦物兩側第一種電解質流(8)有助於該平坦物運 运’该電解質流以-角度α相對於運送平面從 管流出,此角度在5。〜60。範圍中,且宜為15。。質t麗 5’如申請專利範圍第i或第2項之方法,其中: 該平坦物係受-電解質流⑻利用在其兩端面幫助該平 坦物作運送,該電解質流相對於運送平 電解質喷㈣來,該角度一範圍,且=该 6. 如申清專利範圍第1或第2項之方法,其中: 該平坦物沿運送路徑的處理時間用以下 ”不佔空間的「雙重管」的設置,使第_及第二電解二 流從一結構元件流出。 7. 如申請專利範圍第1或第2項之方法,其中: 該平坦物利用運送滾子及/或接觸滾子運送'。 8. 如申請專利範圍第1或第2項之方法,其中: 在作電解質處料,較平坦㈣轉觸滾子、接觸輪、 或*而子夹作電接觸。 9·如申請專利範圍第1或第2項之方法,皇中. 成。該平坦物的電解質處理係利用可溶或不可溶的陽極達 解質在濕化學式或電解質式通過設備將平坦物在電 ==理的裝置,其t該平坦物作水平運送,該平2 ㈣別疋導體膜與電路板’此裝置特別用於實施申請專利 ^ 1項的方法’其特徵在··有電解質喷灑管⑽,鱼平 20 U74200 ιοί年〇3月/y日修正替換頁 坦物的運送方向成橫向且係成對設置,並且在運送平面⑽ 與下側各有一列開口⑼,其中這些開口的朝向使該二組電 解噴壤管⑽的電解質流呈鏡像對稱沿運送方向呈一角度 二流出,使該兩側⑹⑺的電解質流(8)以相同的衝力作用到 平坦物而反向互相抵消。 U.如申請專利範圍第10項之裝置,其中: 該電解質喷灑管中有-列的第二組開;;⑽,其中第二The electrolyte spraying tubes (10) on the two sides are provided with at least each other column opening (1 2). The electrolysis luke is emitted from the opening of the shai toward the flat object at an angle, and the angle stone and the first column opening (9) The angle α is different, and the electrolysis flow (丨i) is incompatible with the first electrolyte (8) of the first column in terms of the amount and flow rate of the discharged electrolyte, and can be matched with the demand for the flat material. . 3. The method of claim 2, wherein: the volumetric flow and the flow rate of the first and second electrolyte streams are independently independent of each other and adjusted to meet the requirements of the flat product. 1374200 March 101/> Day Correction Replacement Page 4 The method of claim 1 or 2, wherein: the first electrolyte flow (8) on both sides of the flattening contributes to the flatness The transport of the electrolyte 'flows out of the tube at an angle α with respect to the transport plane, at an angle of 5. ~60. In the range, it should be 15. . The method of claim 1 or 2, wherein: the flat material is subjected to an electrolyte flow (8) for assisting the flat material on both end faces thereof, the electrolyte flow being sprayed relative to the flat electrolyte spray (4) The angle is a range, and = 6. The method of claim 1 or 2, wherein: the processing time of the flat along the transport path is as follows: "double tube" which does not occupy space Provided to cause the first and second electrolysis streams to flow out of a structural element. 7. The method of claim 1 or 2, wherein: the flat material is transported by a transport roller and/or a contact roller. 8. The method of claim 1 or 2, wherein: in the electrolyte material, the flat (four) touch roller, the contact wheel, or * and the sub-clip makes electrical contact. 9. If you apply for the first or second method of patent scope, Huang Zhong. Cheng. The electrolyte treatment of the flat is carried out by using a soluble or insoluble anode to disintegrate the wet matter in a wet chemical or electrolyte type device, and the flat material is transported horizontally, the flat 2 (4) Do not pick up the conductor film and circuit board 'This device is especially used to implement the method of the patent application ^1'. It is characterized by an electrolyte spray pipe (10), and fish flat 20 U74200 ιοί 〇 March / y day correction replacement page The transport directions of the objects are laterally and arranged in pairs, and there is a row of openings (9) on the transport plane (10) and the lower side, wherein the orientation of the openings is such that the electrolyte flows of the two sets of electrolysis spray tubes (10) are mirror symmetrical along the transport direction. An angle two flows out so that the electrolyte flows (8) on the both sides (6) (7) act on the flat objects with the same impulse and reverse each other out. U. The device of claim 10, wherein: the electrolyte spray tube has a second group of - columns; (10), wherein the second 電解質流(1 υ的流出角^與第—電解質流⑻的流出角度 α不同。 12_如申請專利範圍第1〇項之裝置,其甲: 在電解質噴麗管中的第一組開口⑼互相隔-距離,這 些開口在上側(6)與τ側⑺互相錯開了同側之開口之間的一 ^距離,以在表面產生具有交替的電解質的小靜壓力與大 靜壓力的區域(14)(15)。 13. 如申請專利範圍第1〇項之裝置,其中: 該第-電解質流⑻相對於平坦物表面的角“在5。 〜60°範圍,且宜為15。。 14. 如申請專利範圍第1〇項之裝置,其中: 該第二電解質流⑼相對於平坦物表面的角度3在7〇。 〜90°範圍,且宜為80。 》 15·如申請專利範圍第1〇項之震置,其中 」形式’該列第一組 第二組開口(12),該 該電解質喷灑管(1〇)做成「管中管 開口(9)設在外管中,而該内管(13)具有 第二組開口(12)同時通過外管的壁。 21 1374200 _ 101年03月日修正替換頁 16. 如申請專利範圍第10項之裝置,其中: 具有個別影響電解質流(8)(11)的手段,呈泵、閥、翻蓋 片、移動器、積滯移動器的形式。 17. 如申請專利範圍第10項之裝置,其中: 有運送好及/或接觸滾子以將平坦物運送。 18_如申請專利範圍第10項之裝置,其中: 有接觸滚子、接觸輪或端子夾以與平坦物作導電接觸。 19. 如申請專利範圍第10項之裝置,其中:The electrolyte flow (the outflow angle of 1 ^ is different from the outflow angle α of the first-electrolyte flow (8). 12_ The device of the first aspect of the patent application, A: The first group of openings (9) in the electrolyte spray tube Separate-distance, these openings are offset from each other by the distance between the upper side (6) and the τ side (7) of the same side opening to create a region of small static pressure and large static pressure with alternating electrolyte on the surface (14) (15) 13. The device of claim 1, wherein: the angle of the first electrolyte flow (8) relative to the surface of the flat object is "in the range of 5. to 60 degrees, and is preferably 15%. The device of claim 1 , wherein: the angle 3 of the second electrolyte stream (9) with respect to the surface of the flat object is 7 〇. The range of ~90°, and preferably 80. 》15·If the patent application is the first 〇 The shock of the item, wherein the "form" is the first group of the second group of openings (12), and the electrolyte spray pipe (1〇) is made "the tube-in-tube opening (9) is disposed in the outer tube, and the inside The tube (13) has a second set of openings (12) while passing through the wall of the outer tube. 21 1374200 _ 101 Correction replacement page of March. 16. The device of claim 10, wherein: the means for individually affecting the electrolyte flow (8) (11) is a pump, a valve, a flip cover, a mover, and a stagnation mover. 17. The device of claim 10, wherein: the container is transported and/or contacted to transport the flat material. 18_ The device of claim 10, wherein: there is a contact roller, The contact wheel or terminal clip is in conductive contact with the flat. 19. The device of claim 10, wherein: 在電解質通過設備中有可溶或不可溶的^陽極。 20. 如申請專利範圍第10項之裝置,其中: 有一對第一電解質喷灑管以喷灑第一種電解質流(8), 具有一對與該第一電解質喷灑管分開設置的第二電解質流 喷灑管以喷灑第二種電解質流。 十一、圖式: 如次頁 22There is a soluble or insoluble anode in the electrolyte passing device. 20. The device of claim 10, wherein: a pair of first electrolyte spray tubes to spray a first electrolyte stream (8) having a pair of second disposed separately from the first electrolyte spray tube The electrolyte flows through the spray tube to spray a second electrolyte stream. XI. Schema: as the next page 22
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